CN108802595B

CN108802595B - Carrier for electronic component testing device

Info

Publication number: CN108802595B
Application number: CN201810365312.0A
Authority: CN
Inventors: 筬部明浩; 伊藤明彦
Original assignee: Advantest Corp
Current assignee: Advantest Corp
Priority date: 2017-04-28
Filing date: 2018-04-20
Publication date: 2021-10-15
Anticipated expiration: 2038-04-20
Also published as: KR102341037B1; TW201841811A; CN108802595A; TWI734002B; JP2018189391A; KR20180121360A; JP6823534B2

Abstract

Provided is a carrier for an electronic component testing device, which can sufficiently apply tension to a sheet on which an electronic component to be tested is placed, and which can ensure the positional accuracy of the electronic component to be tested on the sheet. A device carrier for holding an IC device having a plurality of terminals protruding from a bottom surface thereof in an IC socket provided in an electronic component testing apparatus, comprising: a film which constitutes the bottom of the core and on which the IC device is mounted so that a plurality of terminals protrude toward the IC socket side; and a core body provided on a test tray to be transported in the electronic component testing apparatus and having an outer peripheral portion of the film fixed thereto by a plurality of caulking, the caulking member including a body portion protruding from the core body and a head portion provided at a distal end of the body portion and having a diameter larger than that of the body portion, the film including an opening into which the body portion is fitted, and a slit formed in a region of an edge portion of the opening on an inner peripheral side of the film than a center of the opening and not formed in a region of the edge portion of the opening on an outer peripheral side of the film than the center of the opening.

Description

Carrier for electronic component testing device

Technical Field

The present invention relates to a carrier for an electronic component testing apparatus.

Background

As a carrier for an electronic component testing apparatus that carries an electronic component to be tested such as a BGA (Ball Grid Array) type IC package to an electronic component socket for quality inspection or the like, there is known a carrier in which a through hole that exposes a contact portion (terminal) of the electronic component to be tested in a direction of the contact terminal of the electronic component socket is formed in a seating portion on which the electronic component to be tested is seated, and an outer peripheral portion of the seating portion is fixed to a carrier body by a rivet having a head portion and a trunk portion (for example, refer to patent document 1). In the carrier for the electronic component testing apparatus described in patent document 1, the seating portion is formed of a film-like sheet material such as polyimide, and the film-like sheet material is stretched and provided in a lower portion of the carrier body.

Prior art documents

Patent document

Patent document 1: japanese patent application laid-open No. 2010-156546

Disclosure of Invention

Problems to be solved by the invention

In the carrier for an electronic component testing apparatus described in patent document 1, it is necessary to ensure the flatness of the film-like sheet and the positional accuracy of the through-holes by applying sufficient tension to the film-like sheet, thereby ensuring the positional accuracy of the electronic component to be tested on the film-like sheet.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a carrier for an electronic component testing apparatus, which can sufficiently apply tension to a sheet on which an electronic component to be tested is placed, and can ensure positional accuracy of the electronic component to be tested on the sheet.

Means for solving the problems

[1] The carrier for an electronic component testing device according to the present invention is a carrier for an electronic component testing device that holds an electronic component to be tested, which has a plurality of terminals protruding from a bottom surface, on a socket provided in the electronic component testing device, and includes a sheet that constitutes a bottom portion of the carrier and on which the electronic component to be tested is placed so that the plurality of terminals protrude toward the socket, and a body portion that is provided on a tray to be conveyed in the electronic component testing device and to which an outer peripheral portion of the sheet is fixed by a plurality of rivets that include a body portion protruding from the body portion and a head portion that is provided at a distal end of the body portion and has a diameter larger than that of the body portion, the sheet includes an opening into which the body portion is fitted, and a slit that is formed in a region of an edge portion of the opening that is closer to an inner peripheral side of the sheet than a center of the opening and that is not formed in a region of the opening that is closer to an inner peripheral side of the sheet than the center of the opening The edge portion of the sheet member is located on the outer peripheral side of the sheet member with respect to the center of the opening.

[2] In the above invention, the body portion may include: a semicircular trunk outer periphery side portion formed in a region on the outer periphery side of the sheet with respect to the center of the trunk; and a semicircular trunk inner peripheral side portion formed in a region closer to an inner peripheral side of the sheet than a center of the trunk and having a smaller diameter than the trunk outer peripheral side portion, wherein the opening includes: an opening outer peripheral side portion formed in a semicircular shape in a region on an outer peripheral side of the sheet with respect to a center of the opening and into which the body outer peripheral side portion is fitted; and an opening inner peripheral side portion that is formed in a semicircular shape having a smaller diameter than the opening outer peripheral side portion in a region closer to the inner peripheral side of the sheet than a center of the opening and into which the body inner peripheral side portion is fitted, wherein the slit is formed in an edge portion of the opening inner peripheral side portion and not formed in an edge portion of the opening outer peripheral side portion.

[3] In the above invention, the body portion may include: a semicircular trunk outer periphery side portion formed in a region on the outer periphery side of the sheet with respect to the center of the trunk; and a semicircular trunk inner peripheral portion formed in a region closer to an inner peripheral side of the sheet than a center of the trunk and having a larger diameter than the trunk outer peripheral portion, wherein the opening includes: an opening outer peripheral portion formed in a semicircular shape in a region on the outer peripheral side of the sheet with respect to the center of the opening, and into which the body outer peripheral portion is fitted; and an opening inner peripheral side portion formed in a semicircular shape in a region of the opening on an inner peripheral side of the sheet with respect to a center of the opening and into which the body inner peripheral side portion is fitted, wherein the slit is formed at a boundary portion between an edge portion of the opening inner peripheral side portion and an edge portion of the opening outer peripheral side portion, is formed at the edge portion of the opening inner peripheral side portion, and is not formed at the edge portion of the opening outer peripheral side portion.

[4] In the above invention, the outer peripheral portion may be fixed to the body portion by the plurality of caulking pieces in a state where tension is applied to the sheet.

[5] In the above invention, the inclined surface may be formed on the bottom surface of the body so as to be inclined from an inner peripheral side to an outer peripheral side of the bottom surface toward a high-level side, and the plurality of caulking pieces may be formed on the inclined surface.

Effects of the invention

According to the present invention, since the edge portion of the sheet on the outer peripheral side of the opening can be firmly fixed to the body portion of the rivet, a sufficient tensile force can be applied to the sheet, and the positional accuracy of the electronic component to be tested on the sheet can be ensured.

Drawings

Fig. 1 is a schematic cross-sectional view showing an electronic component testing apparatus using a device carrier according to an embodiment of the present invention.

Fig. 2 is a perspective view showing the electronic component testing apparatus of fig. 1.

Fig. 3 is a conceptual diagram for explaining the transfer of the tray in the electronic component testing apparatus of fig. 1 and 2.

Fig. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus.

Fig. 5 is a perspective view showing a dedicated tray used in the electronic component testing apparatus.

Fig. 6 is a perspective view showing a test tray.

Fig. 7 is an exploded perspective view showing a part of the test tray in an enlarged manner.

Fig. 8 is a perspective view showing the core from the bottom side.

Fig. 9 is a bottom view showing the core.

Fig. 10 is a plan view showing the core.

Fig. 11 is a front view showing the core.

Fig. 12 is a side view showing the core.

Fig. 13 is a cross-sectional view of 13-13 of fig. 9.

Fig. 14 is an enlarged sectional view of a part of fig. 13.

Fig. 15 is a cross-sectional view of 15-15 of fig. 14.

Fig. 16 is a sectional view showing a modified example of the structure of the body portion and the opening shown in fig. 15.

Fig. 17 is an enlarged plan view showing four corners of the bottom of the device carrier.

Fig. 18 is a cross-sectional view showing a state in which an IC device is being tested (inspected).

Fig. 19 is a cross-sectional view showing a state in which an IC device is being tested (inspected).

Fig. 20 is a perspective view for explaining a method of attaching the film to the core body.

Fig. 21 is a sectional view for explaining a method of attaching the film to the core body.

Fig. 22 is a perspective view for explaining a method of attaching the film to the core body.

Fig. 23 is a perspective view for explaining a method of attaching a film having an opening of the structure shown in fig. 16 to a core body having a body of the structure shown in fig. 16.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings. Fig. 1 is a schematic cross-sectional view showing an electronic component testing apparatus using a device carrier according to an embodiment of the present invention. Fig. 2 is a perspective view showing the electronic component testing apparatus of fig. 1. Fig. 3 is a conceptual diagram for explaining the transfer of the tray in the electronic component testing apparatus of fig. 1 and 2.

The electronic component testing apparatus shown in fig. 1 and 2 applies a high-temperature or low-temperature thermal stress to the IC device, and tests (checks) whether the IC device is operating properly in this state by using the test head 5 and the tester 6. The electronic component testing apparatus classifies the IC devices based on the test results.

In the electronic component testing apparatus, a large number of IC devices to be tested are mounted on the dedicated tray KST (see fig. 5). Then, the test tray TST (see fig. 6) is circulated in the handler 1 of the electronic component testing apparatus. The IC devices are loaded from the dedicated tray KST to the test tray TST instead and tested. Further, the IC device is denoted by symbol IC in the drawings.

As shown in fig. 1, a space 8 is provided below the handler 1, and the test head 5 is disposed in the space 8. An IC socket 50 is provided on the test head 5, and the IC socket 50 is connected to the tester 6 via a cable 7.

In this electronic component testing apparatus, the IC device mounted on the test tray TST is brought into contact with and electrically connected to the IC socket 50 on the test head 5, an electric signal or the like is applied to the IC device in this state, and the IC device is tested (inspected) based on a signal output from the tester 6. When the type of the IC device is replaced, the IC socket 50 and a core 730 described later are replaced with components suitable for the shape, the pin count, and the like of the IC device.

As shown in fig. 2 and 3, the handler 1 includes a storage unit 200, a loading unit 300, a testing unit 100, and a discharge unit 400. The storage unit 200 stores the IC devices before and after the test. The loading unit 300 transfers the IC devices transferred from the stocker 200 to the test unit 100. The test section 100 is configured such that the IC socket 50 of the test head 5 faces the inside thereof. The unloading section 400 sorts the IC devices subjected to the test in the test section 100.

Fig. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus. Fig. 5 is a perspective view showing a dedicated tray used in the electronic component testing apparatus. As shown in fig. 4, the storage section 200 includes a pre-test stocker 201 and a test completion stocker 202. The pre-test stocker 201 stores the dedicated tray KST in which the IC devices before the test are stored. The test completion stocker 202 stores the dedicated tray KST containing the IC devices classified according to the test results. The pre-test stocker 201 and the test completion stocker 202 include: a frame-shaped tray support frame 203; and a lifter 204 which enters from a lower portion of the tray support frame 203 and ascends and descends toward an upper portion. A plurality of special pallets KST are stacked in the pallet support frame 203. The special pallets KST stacked together are moved up and down by the elevator 204. As shown in fig. 5, the dedicated tray KST includes a plurality of concave storage portions for storing the IC devices. The plurality of receiving portions are arranged in a plurality of rows and columns (for example, 14 rows and 13 columns). The pre-test stocker 201 and the test completion stocker 202 have the same structure.

As shown in fig. 2 and 3, the pre-test stocker 201 includes two stockers STK-B and two empty pallet stockers STK-E. Two hoppers STK-B are adjacent to each other and beside the two hoppers STK-B, two empty tray hoppers STK-E are adjacent to each other. The empty pallet stocker STK-E is stacked with the empty dedicated pallet KST transferred to the discharging unit 400.

A test completion stocker 202 is provided beside the pre-test stocker 201. The test completion stocker 202 has 8 stockers STK-1, STK-2, …, and STK-8. The test completion stocker 202 is configured to sort the IC devices subjected to the test into 8 types at most according to the test results and store the types. For example, in the test completion stocker 202, the IC devices that have been tested can be classified into non-defective products and defective products, as well as non-defective products having a high operating speed, non-defective products having a medium operating speed, non-defective products having a low operating speed, or non-defective products requiring re-testing and non-defective products requiring no re-testing.

As shown in fig. 2, the tray transfer arm 205 is provided between the storage unit 200 and the apparatus base 101. The tray transfer arm 205 transfers the dedicated tray KST from the lower side of the apparatus base 101 to the loading unit 300. Here, the device base 101 is formed with a pair of windows 370. The pair of windows 370 is disposed so that the dedicated pallet KST conveyed from the lower side of the apparatus base 101 to the loading unit 300 by the pallet transfer arm 205 faces the upper surface of the apparatus base 101.

The loading unit 300 includes a device transfer apparatus 310. The device transfer apparatus 310 includes two rails 311, a movable arm 312, and a movable head 320. Two rails 311 are mounted on the device base 101. The movable arm 312 reciprocates between the test pallet TST and the dedicated pallet KST along two rails 311. The moving direction of the movable arm 312 is referred to as the Y direction. The movable head 320 is supported by the movable arm 312 and moves in the X direction. A plurality of suction pads, not shown, are attached to the movable head 320 in a downward direction.

The device transfer apparatus 310 moves the movable head 320, which has the plurality of IC devices adsorbed by the plurality of adsorption pads, from the dedicated pallet KST to the precisor (preciser) 360. Thereby, the IC device is transferred from the dedicated pallet KST to the finisher 360. Then, in the aligner 360, the device transfer apparatus 310 corrects the positional relationship of the IC devices with respect to each other by the movable arm 312 and the movable head 320. Thereafter, the device transfer apparatus 310 transfers the IC devices to the test tray TST stopped at the loading unit 300. Thus, the IC devices are replacement-loaded from the dedicated tray KST to the test tray TST.

As shown in fig. 2 and 3, the test unit 100 includes a heat retaining chamber 110, a test chamber 120, and an annealing chamber 130. In the heat-retaining chamber 110, a target high-temperature or low-temperature thermal stress is applied to the IC devices mounted on the test tray TST. In the test chamber 120, the IC devices to which the thermal stress is applied in the heat-insulating chamber 110 are pressed against the test head 5. In the annealing chamber 130, thermal stress is removed from the IC devices that were tested in the test chamber 120.

When a high temperature is applied to the IC devices in the heat-retaining chamber 110, the IC devices are cooled to room temperature by air blowing in the heat-removing chamber 130. On the other hand, when a low temperature is applied to the IC devices in the heat retention chamber 110, the IC devices are heated by warm air, a heater, or the like in the heat evacuation chamber 130 to a temperature at which condensation does not occur.

As shown in fig. 2, the heat-retaining chamber 110 and the evacuation chamber 130 protrude upward from the test chamber 120. As conceptually shown in fig. 3, the heat-retaining chamber 110 is provided with a vertical transport device, and while the preceding test tray TST is present in the test chamber 120, the plurality of test trays TST in the succeeding row are on standby in a state of being supported by the vertical transport device. The IC devices mounted on the plurality of test trays TST in the subsequent row are subjected to high-temperature or low-temperature thermal stress during standby.

A test head 5 is disposed in the center of the test chamber 120. The test tray TST is transferred onto the test head 5. At the center of the test chamber 120, the terminals HB (see fig. 16 and 17) of the IC devices mounted on the test tray TST are brought into contact with the terminals 51 (see fig. 16 and 17) of the IC sockets 50 on the test head 5, thereby testing the IC devices. The test tray TST loaded with the IC devices whose tests have been completed is transferred to the annealing chamber 130. In the annealing chamber 130, the IC devices that ended the test were heat-removed to room temperature. The test tray TST loaded with the heat-removed IC devices is carried out to the unloading section 400.

An entrance for carrying the test tray TST from the device base 101 into the incubation chamber 110 is formed at the upper portion of the incubation chamber 110. On the other hand, an outlet for carrying out the test tray TST from the annealing chamber 130 to the device base 101 is formed at an upper portion of the annealing chamber 130.

As shown in fig. 2, a tray transfer device 102 is provided on a device base 101. The tray transfer device 102 transfers the test tray TST from the device base 101 to the soak chamber 110, and transfers the test tray TST from the annealing chamber 130 to the device base 101. The tray conveying device 102 is constituted by, for example, a rotary roller.

After the test tray TST is carried out from the annealing chamber 130 to the device base 101 by the tray transfer device 102, all the IC devices mounted on the test tray TST are replaced and loaded on the dedicated tray KST corresponding to the test result by the device transfer device 410 (described later). Thereafter, the test tray TST is transferred to the soak chamber 110 through the unloading unit 400 and the loading unit 300.

As shown in fig. 2, two device-handling apparatuses 410 are provided in the unloading section 400. The device transfer apparatus 410 has the same structure as the device transfer apparatus 310 provided in the loading unit 300. The two device transfer apparatuses 410 exchange and load the IC devices subjected to the test from the test tray TST present in the apparatus base 101 to the dedicated tray KST corresponding to the test result.

Two pairs of windows 470 are formed in the device base 101. The two pairs of window parts 470 are configured such that the dedicated pallet KST transferred to the discharging part 400 faces the upper surface of the apparatus base 101. A not-shown elevating platform is provided below the two pairs of window portions 470 and the window portion 370. The elevating table lowers the dedicated tray KST on which the IC devices subjected to the test are mounted, and transfers the tray KST to the tray transfer arm 205.

Fig. 6 is a perspective view showing the test tray TST. As shown in the figure, the test tray TST is provided with a frame 700 and a plurality of device carriers 710. The frame 700 includes a rectangular outer frame 701 and an inner frame 702 provided in a lattice shape in the outer frame 701. The frame 700 includes rectangular openings 703 divided into a plurality of rows and a plurality of columns by an outer frame 701 and an inner frame 702.

A plurality of device carriers 710 are arranged in rows and columns. Each device carrier 710 is disposed corresponding to each opening 703 of the frame 700. The device carrier 710 is provided with a main body 720 and a plurality (e.g., 4 as shown) of cores 730. The main body 720 is a rectangular plate-shaped resin molded body, and rectangular openings 721 the same number as the number of the core portions 730 (4 in the present embodiment) are formed in a plurality of rows and columns (2 rows and 2 columns in the present embodiment).

The plurality of bodies 720 are arranged in a plurality of rows and columns at the lower side of the frame 700. The outermost main body 720 is disposed so that its outer peripheral portion overlaps with the outer frame 701 or the inner frame 702, and the plurality of openings 721 overlap with the openings 703 of the frame 700. On the other hand, the other main body 720 is disposed so that its outer peripheral portion overlaps the inner frame 702 and the plurality of openings 721 overlap the openings 703 of the frame 700. The plurality of bodies 720 are fixed to an intersection of the outer frame 701 and the inner frame 702 of the frame 700 and an intersection of the inner frames 702.

Fig. 7 is an exploded perspective view showing a part of the test tray TST in an enlarged manner. As shown in this figure, the core 730 is removably mounted to the body 720. The core 730 is configured corresponding to each opening 721, and is mounted with respect to the main body 720 in such a manner as to be capable of fine movement (floating) in a plane (XY plane in the drawing). The core 730 includes a core body 740 and a film 750. The core main body 740 is a resin molded body formed with a rectangular opening (through hole) 741. A plurality of claw portions 742 and a plurality of guide portions 743 are formed on the outer peripheral portion of the core main body 740. The main body 720 is formed with an engagement portion, not shown, with which the claw portion 742 is engaged, and a guide groove 722 into which the guide portion 743 is inserted. The claw portions 742 engage with the engagement portions, whereby the core main body 740 is supported by the main body 720. When the core main body 740 is attached to the main body 720, the claw portions 742 can be engaged with the engagement portions by inserting the guide portions 743 into the guide grooves 722 and pressing the core main body 740 into the openings 721. On the other hand, the core main body 740 can be removed from the main body 720 by releasing the engagement between the claw portions 742 and the engagement portions.

Here, the engagement of the claw portions 742 with the engagement portions and the fitting of the guide portions 743 with the guide grooves 722 do not fix the core main body 740 and the main body 720, but allow relative fine movement (floating) of the core main body 740 and the main body 720 in a plane. This enables relative positioning of core 730 and IC socket 50, as will be described later.

The film 750 is a rectangular film-shaped resin molded body. The outer peripheral portion of the film 750 is fixed to the bottom of the core main body 740, whereby the film 750 constitutes the bottom of the core 730. An IC device is mounted on the film 750.

Fig. 8 is a perspective view showing the core 730 from the bottom side. Fig. 9 is a bottom view showing the core 730. Fig. 10 is a plan view showing the core 730. Fig. 11 is a front view showing the core 730. Fig. 12 is a side view showing the core 730. Fig. 13 is a cross-sectional view of fig. 9 taken at 13-13. Fig. 14 is an enlarged sectional view of a part of fig. 13. As shown in these figures, the core main body 740 includes: a rectangular annular frame portion 744 on which the opening 741 is formed; a pair of

positioning plates

745, 746; and a pair of

lever receiving portions

747, 748.

A plurality of caulking pieces 749 are provided on the bottom surface (lower end surface) of the frame portion 744. The caulking pieces 749 are provided at the 4 corners of the bottom surface of the frame portion 744 and at the sides of the bottom surface of the frame portion 744. A plurality of (e.g., two as shown in the figure) caulking pieces 749 are provided on each side of the bottom surface of the frame portion 744. On the other hand, a plurality of openings 751 are provided in the outer peripheral portion 750A of the film 750 at positions corresponding to the positions of the caulking pieces 749. Each rivet 749 includes a body portion 7491 (see fig. 14) having a circular cross-sectional shape and a head portion 7492 having a circular cross-sectional shape. The body portion 7491 protrudes downward from the bottom surface of the frame portion 744, and is inserted through the opening 751 of the film 750. The head portion 7492 has a larger diameter than the body portion 7491 and the opening 751, and is expanded in the radial direction from the tip (lower end) of the body portion 7491. The outer peripheral portion 750A of the film 750 is sandwiched between the head portion 7492 and the bottom surface of the frame portion 744. The details of the structure of the outer peripheral portion 750A of the film 750, the bottom surface of the frame portion 744, and the caulking member 749 will be described later.

The positioning plate 745 is disposed at an upper end of the first side wall 7441 of the frame portion 744. Another positioning plate 746 is disposed at an upper end of the second side wall 7442 of the frame portion 744. The first side wall 7441 and the second side wall 7442 are opposite to each other. The positioning plate 745 extends from the upper end of the first side wall 7441 to the opposite side of the opening 741, and the other positioning plate 746 extends from the upper end of the second side wall 7442 to the opposite side of the opening 741. A pair of guide portions 743 are provided on the upper surfaces of

positioning plates

745 and 746, respectively.

Claw portions 742 are provided at one end and the other end of

positioning plates

745 and 746 in the longitudinal direction, respectively. That is, 4 claws 742 are arranged on the diagonal line of the opening 741. The pair of claw portions 742 arranged diagonally are arranged in opposite directions to each other. On the other hand, the claws 742 adjacent to each other are arranged in orientations different by 90 °.

The

positioning plates

745 and 746 are rectangular plates, and the direction along the first side wall 7441 and the second side wall 7442 is defined as the longitudinal direction, and the direction perpendicular to the first side wall 7441 and the second side wall 7442 is defined as the width direction. A positioning hole 7451 is formed at the longitudinal center of the positioning plate 745, and a positioning hole 7461 is formed at the longitudinal center of the positioning plate 746. The positioning hole 7451 is a circular through hole. On the other hand, the positioning hole 7461 is an oblong through-hole. The length direction of the positioning hole 7461 is the same as the width direction of the positioning plate 746. The core 730 is positioned with respect to the IC socket 50 by inserting a positioning pin 55 described later into the positioning hole 7451 and inserting a positioning pin 56 described later into the positioning hole 7461.

The lever receiving portion 747 is provided on the third side wall 7443 of the frame portion 744. The other lever receiving portion 748 is provided on the fourth side wall 7444 of the bezel 744. The third side wall 7443 and the fourth side wall 7444 are opposite to each other. The lower portion of the lever housing 747 protrudes from the third side wall 7443 toward the opposite side of the opening 741, and the upper portion of the lever housing 747 protrudes upward from the third side wall 7443. The rod housing 747 is formed in a rectangular box shape and houses a rod 760 therein. The other lever housing portion 748 is provided with a lower portion protruding from the fourth side wall 7444 to the opposite side of the opening 741, and an upper portion protruding upward from the upper end of the fourth side wall 7444. The rod receiving portion 748 is formed in a rectangular box shape, and receives a rod 761 therein. Rod 760 is identical in structure to rod 761 and is configured to be left-right symmetric.

An opening 7443A is formed in the center of the third side wall 7443 in the width direction. An opening 747A is formed in the lateral center of the lower portion of the rod storage 747. On the other hand, an opening 7444A is formed in the center portion in the width direction of the fourth side wall 7444. An opening 748A is formed in a central portion in the lateral direction of a lower portion of the lever housing portion 748. The rod 760 accommodated in the rod accommodating section 747 is configured to be able to advance and retreat with respect to the opening 741 through the opening 7443A. The rod 760 moves backward from the opening 741 into the rod housing 747 by receiving an external force through the opening 747A, and moves forward into the opening 741 through the opening 7443A by releasing the external force. On the other hand, the rod 761 accommodated in the rod accommodating portion 748 is configured to be able to advance and retreat with respect to the opening 741 through the opening 7444A. The rod 761 is retracted from the opening 741 into the rod receiving portion 748 by receiving an external force through the opening 748A, and is advanced into the opening 741 through the opening 7444A by releasing the external force. The pair of

rods

760 and 761 advanced into the opening 741 is pressed against the outer peripheral portion of the IC device on the film 750 by the biasing force of the spring. Thereby, the IC device on the film 750 is pressed by the pair of

bars

760 and 761.

A rectangular opening 752 is formed in the center of the film 750. Here, an optical sensor, not shown, is provided at a predetermined position of the electronic component testing apparatus, and the core 730 stops at a position of a light beam of the optical sensor or passes through the position of the light beam of the optical sensor. The photosensor includes a light emitting portion and a light receiving portion which face each other in the vertical direction, and emits light when the opening 752 is positioned between the light emitting portion and the light receiving portion. In the case where an IC device is present on the film 750, the IC device is detected because light is blocked by the IC device. On the other hand, in the case where no IC device is present on the film 750, the light emitted from the light emitting section passes through the opening 752 and is received by the light receiving element, so that the IC device is not detected.

A large number of small holes 753 are formed between the opening 752 of the film 750 and the outer peripheral portion 750A. The large number of small holes 753 are provided so as to correspond to the large number of spherical terminals HB provided on the bottom surface of the IC device. The diameter of the small hole 753 is set larger than the diameter of the terminal HB. Thus, the terminal HB protrudes from the film 750 to the IC socket 50 side through the small hole 753. In this embodiment, since the terminals HB of the IC device are arranged in a plurality of rows in a rectangular ring shape, the holes 753 are arranged in a plurality of rows in a rectangular ring shape. However, the arrangement of the terminals HB and the holes 753 of the IC device is not limited to that of the present embodiment, and may be appropriately modified.

As shown in fig. 14, an inner peripheral planar portion 7445 and an outer peripheral inclined surface portion 7446 are formed on the bottom surface of the frame portion 744. The portion between the opening 751 and the small hole 753 of the film 750 abuts against the flat surface portion 7445. The inclined surface portion 7446 is inclined upward from the flat surface portion 7445 to the outer peripheral side of the frame portion 744. A rivet 749 is formed on the inclined surface portion 7446. Specifically, the body portion 7491 of the rivet 749 protrudes downward from the inclined surface portion 7446, and the head portion 7492 of the rivet 749 is formed so as to converge within the inclined surface portion 7446 without entering the planar portion 7445.

Here, a horizontal surface 7492A is formed on the head portion 7492 of the rivet 749. The height position of the horizontal surface 7492A is set higher than the plane portion 7445. The film 750 includes an outer peripheral portion 750A inclined by coming into contact with the inclined surface portion 7446 and a flat surface portion 750B inside the outer peripheral portion 750A. The outer peripheral portion of the upper surface of the planar portion 750B abuts the planar portion 7445. Therefore, the height of the lower surface of the planar portion 750B is set to a position lower than the planar portion 7445 by the thickness of the thin film 750. Therefore, the height of the lowest portion (lowest point) of the rivet 749 is set to be higher than the height of the lowest portion (lowest point) of the film 750.

Here, at a position closer to the outer peripheral side of the film 750 than the center of the opening 751, the edge of the opening 751 is caught on the body 7491, and tension is applied to the film 750. In this state, the relative position between the body portion 7491 and the opening 751, and the shape and size of the body portion 7491 and the opening 751 are set.

Fig. 15 is a cross-sectional view of 15-15 of fig. 14. As shown in the figure, the body portion 7491 includes: a body outer peripheral portion 7491A formed in a region on the outer peripheral side of the film 750 with respect to the center (axial center); and a body inner peripheral portion 7491B formed in a region on the inner peripheral side of the film 750 with respect to the center. The sectional shape of the body outer peripheral side portion 7491A is a semicircle having a radius R1, and the sectional shape of the body inner peripheral side portion 7491B is a semicircle having a radius R2 (< R1). The body outer peripheral portion 7491A and the body inner peripheral portion 7491B share the center of a circle, and a step portion is formed at the boundary therebetween.

The opening 751 includes: an opening outer peripheral portion 7511 formed in a region on the outer peripheral side of the film 750 with respect to the center; and an open inner peripheral portion 7512 formed in a region closer to the inner peripheral side of the film 750 than the center. The opening outer peripheral side portion 7511 is a semicircular shape having a radius of r1, and the opening inner peripheral side portion 7512 is a semicircular shape having a radius of r2 (< r 1). The opening outer peripheral portion 7511 and the opening inner peripheral portion 7512 share the center of a circle, and a step portion is formed at the boundary therebetween.

The radius R1 of the body outer peripheral side portion 7491A is slightly larger than the radius R1 of the opening outer peripheral side portion 7511, and the radius R2 of the body inner peripheral side portion 7491B is slightly larger than the radius R2 of the opening inner peripheral side portion 7512. Therefore, the edge of the opening outer peripheral portion 7511 abuts the peripheral surface of the body outer peripheral portion 7491A, and the edge of the opening inner peripheral portion 7512 abuts the peripheral surface of the body inner peripheral portion 7491B.

Here, a plurality of slits 7513 are formed in an edge portion of the opening inner peripheral portion 7512. The plurality of slits 7513 are arranged at predetermined intervals (for example, at intervals of 45 ° as shown in the figure) in the circumferential direction of the opening inner peripheral side portion 7512. The length of the slit 7513 is not particularly limited, and is preferably equal to or greater than the difference (r1 to r2) between the radius r1 of the opening outer peripheral portion 7511 and the radius r2 of the opening inner peripheral portion 7512.

By forming a plurality of slits 7513 in the edge portion of the opening inner peripheral portion 7512, the rigidity of the edge portion of the opening inner peripheral portion 7512 becomes lower than the rigidity of the edge portion of the opening outer peripheral portion 7511. Thus, the edge of the opening inner peripheral side portion 7512 is more deflected than the edge of the opening outer peripheral side portion 7511, and the contact pressure between the edge of the opening outer peripheral side portion 7511 and the peripheral surface of the body outer peripheral side portion 7491A becomes larger than the contact pressure between the edge of the opening inner peripheral side portion 7512 and the peripheral surface of the body inner peripheral side portion 7491A. Therefore, the edge of the opening 751 is caught by the body 7491 at the outer peripheral side of the film 750 with respect to the center of the body 7491, and the film 750 is thus tensioned.

Fig. 16 is a sectional view showing a modified example of the structure of the body portion 7491 and the opening 751 shown in fig. 15. As shown in the figure, the body portion 7491 includes: a body outer peripheral portion 7491A formed in a region on the outer peripheral side of the film 750 with respect to the center; and a body inner peripheral portion 7491B formed in a region on the inner peripheral side of the film 750 with respect to the center. The sectional shape of the body outer peripheral side portion 7491A is a semicircle with a radius R1, and the sectional shape of the body inner peripheral side portion 7491B is a semicircle with a radius R2 (> R1). The body outer peripheral portion 7491A and the body inner peripheral portion 7491B share the center of a circle, and a step portion is formed at the boundary therebetween.

The opening 751 is a perfect circle and includes: an opening outer peripheral portion 7511 formed in a region on the outer peripheral side of the film 750 with respect to the center; and an open inner peripheral portion 7512 formed in a region closer to the inner peripheral side of the film 750 than the center. The opening outer peripheral portion 7511 and the opening inner peripheral portion 7512 are semicircular with a radius r1 (r 2), and are divided into an inner peripheral side and an outer peripheral side of the film 750, with a pair of slits 7513 therebetween.

Here, in addition to the above-described slits 7513 formed at both ends of the edge portion of the opening inner peripheral portion 7512, the slits 7513 are also formed at the central portion of the edge portion of the opening inner peripheral portion 7512. The plurality of slits 7513 are arranged at predetermined intervals (for example, at intervals of 90 ° as shown in the figure) in the circumferential direction of the opening 751. The length of the slit 7513 is not particularly limited, and is preferably equal to the difference (R2 to R1) between the radius R1 of the opening outer peripheral portion 7511 and the radius R2 of the opening inner peripheral portion 7512.

By forming a plurality of slits 7513 in the center and both ends of the edge of the opening inner peripheral portion 7512, the rigidity of the edge of the opening inner peripheral portion 7512 is lower than the rigidity of the edge of the opening outer peripheral portion 7511. Thus, the edge of the opening inner peripheral portion 7512 is deflected more than the edge of the opening outer peripheral portion 7511, and the contact pressure between the edge of the opening outer peripheral portion 7511 and the peripheral surface of the body outer peripheral portion 7491A becomes larger than the contact pressure between the edge of the opening inner peripheral portion 7512 and the peripheral surface of the body inner peripheral portion 7491B. Therefore, the edge of the opening 751 is caught by the body 7491 at the outer peripheral side of the film 750 with respect to the center of the body 7491, and the film 750 is thus tensioned.

Fig. 17 is an enlarged plan view showing four corners of the bottom of the device carrier 710. As shown in the figure, slits 754 are formed at the four corners of the film 750. Extension lines of a boundary line between the outer peripheral portion 750A and the planar portion 750B of the pair of films 750 are present at four corners of the outer peripheral portion of the film 750, and the four corners of the outer peripheral portion of the film 750 are divided into rectangles by the pair of extension lines, one of the extension lines overlaps the opening 751, and the other extension line does not overlap the opening 751. A slit 754 is formed on the extension line not overlapping with the opening 751.

Here, when the outer peripheral portion 750A of the film 750 to which tension is applied is tilted, if the slits 754 are not formed at the four corners of the outer peripheral portion 750A of the film 750, wrinkles are generated at the four corners of the outer peripheral portion 750A of the film 750. In contrast, in the present embodiment, slits 754 are formed at the four corners of the outer peripheral portion 750A of the film 750, whereby wrinkles can be prevented from occurring at the four corners of the outer peripheral portion 750A of the film 750.

Fig. 18 and 19 are cross-sectional views showing a state in which an IC device is being tested (inspected). As shown in fig. 18, a pair of positioning pins 55 and 56 are provided on the test head 5 so as to be positioned across a pair of opposite sides of the rectangular IC socket 50. One positioning pin 55 is fitted into the positioning hole 7451 of the core body 740, and the other positioning pin 56 is fitted into the other positioning hole 7461. Thereby, the relative positions of the core body 740 and the IC socket 50 are determined so that the terminals HB of the IC device are brought into contact with the terminals 51 of the IC socket 50.

As shown in fig. 19, the pair of

rods

760 and 761 which have advanced into the opening 741 are pressed against the outer peripheral portion of the IC device on the film 750 by the biasing force of a spring, not shown. Thereby, the IC device on the film 750 is pressed by the pair of

bars

760 and 761.

As shown in fig. 18 and 19, the pusher 121 is provided to be able to be raised and lowered above the IC socket 50. The pusher 121 is attached to a Z-axis driving device (e.g., a fluid cylinder) not shown. In the test of the IC device, the Z-axis drive apparatus presses the IC device against the IC socket 50 by the pusher 121.

The IC socket 50 has a structure in which a plurality of terminals 51 are embedded in an insulating sheet-like base material. The terminal 51 is made of a conductive elastic member. Examples of the conductive elastic member constituting the terminal 51 include a member in which a conductive filler is added to a synthetic rubber, a member in which a conductive filler is added to a synthetic resin such as polyester, and the like. The number and arrangement of the plurality of terminals 51 are set in a manner corresponding to the number and arrangement of the plurality of terminals HB of the IC device.

The test of the IC device is performed by the tester 6 in a state where the terminal HB of the IC device is electrically contacted to the terminal 51 of the IC socket 50. The test results of the IC devices are stored at addresses determined by, for example, the identification numbers attached to the test tray TST and the numbers of the IC devices assigned within the test tray TST.

Here, since the lowest portion (lowest point) of the rivet 749 is set at a position higher than the lowest portion (lowest point) of the film 750, the lowest portion of the rivet 749 is located at a position higher than the top end (lower end) of the terminal HB of the IC device. Thereby, a gap between the rivet 749 and the upper surface of the IC socket 50 can be secured regardless of the height of the protrusion of the terminal HB from the bottom surface of the IC device.

Fig. 20 is a perspective view for explaining a method of mounting the film 750 to the core body 740. Fig. 21 is a sectional view for explaining a method of mounting the film 750 to the core body 740. Fig. 22 is a perspective view for explaining a method of mounting the film 750 to the core body 740. As shown in these figures, the outer peripheral portion 750A of the film 750 is fixed to the inclined surface 7446 of the core main body 740 by heat caulking.

First, as shown in fig. 20 and 22, a film 750 and a core main body 740 are prepared. A plurality of openings 751 are formed in the outer periphery of the film 750. An opening outer peripheral side portion 7511 and an opening inner peripheral side portion 7512 are formed in each opening 751. Further, a plurality of slits 7513 are formed in the edge portion of the opening inner peripheral portion 7512. On the other hand, a plurality of bosses 749B are formed on the inclined surface portion 7446 of the core body 740. The positions of the plurality of bosses 749B correspond to the positions of the plurality of openings 751. An opening 749H is formed in the axial center of each boss 749B. Further, a body outer peripheral portion 7491A and a body inner peripheral portion 7491B are formed on the respective bosses 749B.

Next, the film 750 is disposed on the bottom of the core body 740. At this time, the plurality of bosses 749B are aligned with the plurality of openings 751, and all of the bosses 749B are inserted into the openings 751.

Next, as shown in fig. 21, a rivet 749 having a body portion 7491 and a head portion 7492 having a larger diameter than the body portion 7491 is formed, and the outer peripheral portion 750A of the film 750 is sandwiched between the rivet 749 and the inclined surface portion 7446 of the core main body 740, whereby the outer peripheral portion 750A of the film 750 is fixed to the inclined surface portion 7446 of the core main body 740. In this step, the boss 749B is pressed from the distal end side to the proximal end side by using a resin thermal caulking apparatus not shown to be thermally deformed, thereby forming the caulking member 749. At this time, since the opening 749H is formed in the axial center of the boss 749B, thermal deformation of the boss 749B in the radial outward direction is promoted as compared with a solid boss.

Here, the relative position of the opening 751 and the body 7491, the diameters of the opening 751 and the body 7491, the conditions of thermal caulking, and the like are set so that the film 750 is tensioned by the edge of the opening 751 being caught by the body 7491 at a position on the outer peripheral side of the film 750 with respect to the center of the opening 751.

In addition, the size of the boss 749B, the conditions for thermal caulking, and the like are set so that the height of the horizontal surface 7492A of the caulking member 749 is higher than the height of the upper surface of the planar portion 750B of the film 750 in a state where the core 730 is oriented with the film 750 upward.

Fig. 23 is a perspective view for explaining a method of attaching the film 750 having the opening 751 of the structure shown in fig. 16 to the core main body 740 having the body 7491 of the structure shown in fig. 16. As shown in the figure, when an opening 751 is formed in the outer periphery of a film 750, a plurality of slits 7513 are formed in the edge of the opening 751. A pair of slits 7513 are formed on an extension line bisecting the opening 751 into the center line of the inner peripheral side and the outer peripheral side of the film 750, and the remaining one slit 7513 is formed at an edge portion on the inner peripheral side of the center of the opening 751 at an interval of 90 ° with respect to the pair of slits 7513. On the other hand, when a plurality of bosses 749B are formed in the inclined surface portion 7446 of the core body 740, a trunk outer circumference side portion 7491A and a trunk inner circumference side portion 7491B are formed in each boss 749B.

The plurality of bosses 749B are aligned with the plurality of openings 751, all of the bosses 749B are inserted into the openings 751, and the bosses 749B are pressed from the distal end side to the proximal end side by a resin thermal caulking apparatus, not shown, to be thermally deformed, thereby forming the caulking member 749. Here, the relative position of the opening 751 and the body 7491, the diameters of the opening 751 and the body 7491, the conditions of heat caulking, and the like are set so that the film 750 is tensioned by the edge of the opening 751 being caught by the body 7491 at a position on the outer peripheral side of the film 750 with respect to the center of the opening 751.

As described above, in the device carrier 710 of the present embodiment, the slit 7513 is formed in the edge portion of the opening 751 of the film 750 to which the body 7491 of the rivet 749 is fitted. Here, the slit 7513 is formed in a region (opening inner peripheral side portion 7512) of the edge portion of the opening 751 on the inner peripheral side of the film 750 with respect to the center of the opening 751, but is not formed in a region (opening outer peripheral side portion 7511) of the edge portion of the opening 751 on the outer peripheral side of the film with respect to the center of the opening 751. Accordingly, the rigidity of the edge portion of the opening inner peripheral portion 7512 becomes lower than the rigidity of the edge portion of the opening outer peripheral portion 7511, and therefore, the edge portion of the opening inner peripheral portion 7512 is more greatly deflected than the edge portion of the opening outer peripheral portion 7511, and the opening 751 is caught on the body 7491 at the outer peripheral side of the film 750 with respect to the center of the body 7491. Therefore, sufficient tension can be applied to the thin film 750, and the positional accuracy of the IC device on the thin film 750 can be ensured.

In the device carrier 710 according to the present embodiment, the body portion 7491 of the caulking member 749 includes: a semicircular trunk outer peripheral side portion 7491A formed in a region on the outer peripheral side of the film 750 with respect to the center of the trunk 7491; and a semicircular trunk inner peripheral side portion 7491B formed in a region on the inner peripheral side of the film 750 with respect to the center of the trunk 7491. The torso inner peripheral portion 7491B is smaller in diameter than the torso outer peripheral portion 7491A. On the other hand, the opening 751 of the film 750 includes: an opening outer peripheral side part 7511 formed in a semicircular shape in a region on the outer peripheral side of the film 751 with respect to the center of the opening 751 and into which the body outer peripheral side part 7491A is fitted; and an opening inner peripheral side portion 7512 formed in a semicircular shape in a region closer to the inner peripheral side of the film 750 than the center of the opening 751 and into which the body inner peripheral side portion 7491B is fitted. The opening inner peripheral side portion 7512 is smaller in diameter than the opening outer peripheral side portion 7511. The slit 7513 is formed at the edge of the opening inner peripheral portion 7512, but is not formed at the edge of the opening outer peripheral portion 7511. According to this configuration, the edge of the opening inner peripheral side portion 7512 is deflected more greatly than the edge of the opening outer peripheral side portion 7511, and thus the contact pressure between the edge of the opening outer peripheral side portion 7511 and the peripheral surface of the body outer peripheral side portion 7491A becomes larger than the contact pressure between the edge of the opening inner peripheral side portion 7512 and the peripheral surface of the body inner peripheral side portion 7491B. Therefore, by forming the opening 751 so as to be caught by the body portion 7491 on the outer peripheral side of the film 750 with respect to the center of the body portion 7491, it is possible to provide sufficient tension to the film 750.

In the modification shown in fig. 16, the body portion of the rivet 749 includes: a semicircular trunk outer peripheral side portion 7491A formed in a region on the outer peripheral side of the film 750 with respect to the center of the trunk 7491; and a semicircular trunk inner peripheral side portion 7491B formed in a region on the inner peripheral side of the film 750 with respect to the center of the trunk 7491. The opening inner peripheral side portion 7512 is larger in diameter than the opening outer peripheral side portion 7511. On the other hand, the opening 751 of the film 750 includes: an opening outer peripheral portion 7511 formed in a semicircular shape in a region on the outer peripheral side of the film 750 with respect to the center of the opening 751 and into which the body outer peripheral portion 7491A is fitted; and an opening inner peripheral side portion 7512 formed in a semicircular shape in a region closer to the inner peripheral side of the film 750 than the center of the opening 751 and into which the body inner peripheral side portion 7491B is fitted. The slit 7513 is formed at a boundary portion between an edge of the opening inner peripheral portion 7512 and an edge of the opening outer peripheral portion 7511, and is formed at an edge of the opening inner peripheral portion 7512, but is not formed at an edge of the opening outer peripheral portion 7511. According to this configuration, the edge of the opening inner peripheral side portion 7512 is deflected more greatly than the edge of the opening outer peripheral side portion 7511, and thus the contact pressure between the edge of the opening outer peripheral side portion 7511 and the peripheral surface of the body outer peripheral side portion 7491A becomes larger than the contact pressure between the edge of the opening inner peripheral side portion 7512 and the peripheral surface of the body inner peripheral side portion 7491B. Therefore, by forming the opening 751 so as to be caught by the body portion 7491 on the outer peripheral side of the film 750 with respect to the center of the body portion 7491, it is possible to provide sufficient tension to the film 750.

In the device carrier 710 according to the present embodiment, the outer peripheral portion 750A of the film 750 is fixed to the bottom surface of the frame portion 744 by the caulking member 749 in a state where the film 750 is tensioned. This ensures positioning accuracy of the pinhole 753 of the film 750 in the plane and in the height direction. In particular, in the device carrier 710 according to the present embodiment, the inclined surface portion 7446 is formed on the bottom surface of the frame portion 744 so as to be inclined from the inner peripheral side to the outer peripheral side of the bottom surface toward the high-order side, and a plurality of caulking pieces 749 are formed on the inclined surface portion 7446. Thus, by tilting outer peripheral portion 750A of film 750 at an angle of less than 90 ° with respect to planar portion 750B and by causing opening 751 of outer peripheral portion 750A to be caught by body portion 7491 of rivet 749, it is possible to fix outer peripheral portion 750A of film 750 to the bottom surface of frame portion 744 by rivet 749 in a state where tension is applied to film 750. Therefore, as compared with a case where the inclination angle of the outer peripheral portion 750A of the film 750 with respect to the planar portion 750B is set to 90 ° or more, or a step portion is formed between the outer peripheral portion 750A of the film 750 and the planar portion 750B, it is possible to easily apply tension to the film 750 and secure the positional accuracy of the film 750.

The embodiments described above are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above-described embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

For example, in the above-described embodiment, the inclined surface portion 7446 is formed at the bottom of the core main body 740, and the rivet 749 is formed on the inclined surface portion 7446, whereby the lowermost point of the rivet 749 is set to a position higher than the lowermost point of the film 750, but this is not essential. The bottom of the core body 740 may be formed to be horizontal, and the lowermost point of the rivet 749 may be set to a position lower than the lowermost point of the film 750.

Further, although the sheet constituting the bottom of the core 730 is constituted by the film 750, the sheet may be constituted by a thin metal. Further, the core 730 is mounted to the test tray TST via the body 720, but the core 730 may be directly mounted to the test tray TST. In this case, the core 730 may be mounted in such a manner that the core 730 can be slightly moved (floated) in a plane with respect to the test tray TST.

Description of the symbols

1 processor

5 test head

6 tester

7 electric cable

50 IC socket

51 terminal

55 positioning pin

100 test part

101 device base

102 pallet carrying device

110 heat preservation chamber

120 test chamber

121 pusher

130 move back greenhouse

200 storage part

201 test front stocker

202 test completion stocker

203 tray supporting frame

204 elevator

205 pallet transfer arm

300 part of loading

310 device handling device

311 track

312 Movable arm

320 movable head

360 precision device

370 window part

400 discharge part

410 device handling apparatus

470 window part

TST test tray

700 frame

701 outer frame

702 inner frame

703 opening

710 device carrier

720 main body

721 opening

722 guide groove

730 core

740 core body

741 opening

742 claw part

743 guide

744 Frames

7441 first side wall

7442 second side wall

7443 third side wall

7443A opening

7444 fourth side wall

7444A opening

7445 planar part

7446 bevel portion

7447 planar portion

7448 height difference part

745. 746 locating plate

7451. 7461 locating hole

747. 748 rod receiving portion

747A, 748A openings

749 riveting piece

749B boss

7491 torso part

7491A body part outer periphery side part

7491B torso inner peripheral portion

7492 head

7492A horizontal plane

750 film

751 opening

7511 opening outer peripheral side part

7512 inner peripheral side part of opening

7513 slit

752 opening

753 Small hole

754 slit

760. 761 rod

Claims

1. A carrier for an electronic component testing device, which holds electronic components to be tested, the terminals of which protrude from a bottom surface, in a socket provided in the electronic component testing device, the carrier comprising:

a sheet that constitutes a bottom portion of the carrier and on which the electronic component to be tested is placed so that the plurality of terminals protrude toward one side of the socket; and

a main body part which is arranged on a tray conveyed in the electronic component testing device and is fixed with the periphery of the sheet by a plurality of riveting pieces,

the rivet includes a body portion protruding from the body portion, and a head portion provided at a distal end of the body portion and having a diameter larger than that of the body portion,

the sheet material is provided with an opening into which the body portion is fitted, and a slit that is formed in a region of an edge of the opening on the inner peripheral side of the sheet material with respect to the center of the opening and is not formed in a region of the edge of the opening on the outer peripheral side of the sheet material with respect to the center of the opening.

2. The carrier for an electronic parts testing apparatus according to claim 1,

the trunk section includes: a semicircular trunk outer periphery side portion formed in a region on the outer periphery side of the sheet with respect to the center of the trunk; and a semicircular trunk inner peripheral side portion formed in a region closer to the inner peripheral side of the sheet than the center of the trunk and having a smaller diameter than the trunk outer peripheral side portion,

the opening is provided with: an opening outer peripheral side portion formed in a semicircular shape in a region on an outer peripheral side of the sheet with respect to a center of the opening, and into which the body outer peripheral side portion is fitted; and an opening inner peripheral side portion formed in a semicircular shape having a smaller diameter than the opening outer peripheral side portion in a region closer to the inner peripheral side of the sheet than a center of the opening and into which the body inner peripheral side portion is fitted,

the slit is formed at an edge of the opening inner peripheral side portion and is not formed at an edge of the opening outer peripheral side portion.

3. The carrier for an electronic parts testing apparatus according to claim 1,

the trunk section includes: a semicircular trunk outer periphery side portion formed in a region on the outer periphery side of the sheet with respect to the center of the trunk; and a semicircular trunk inner peripheral side portion formed in a region closer to the inner peripheral side of the sheet than the center of the trunk and having a larger diameter than the trunk outer peripheral side portion,

the opening is provided with: an opening outer peripheral side portion formed in a semicircular shape in a region on an outer peripheral side of the sheet with respect to a center of the opening, and into which the body outer peripheral side portion is fitted; and an opening inner peripheral side portion formed in a semicircular shape in a region of the opening on an inner peripheral side of the sheet with respect to a center of the opening, and into which the body inner peripheral side portion is fitted,

the slit is formed at a boundary portion between an edge portion of the opening inner peripheral side portion and an edge portion of the opening outer peripheral side portion, and is formed at the edge portion of the opening inner peripheral side portion, but is not formed at the edge portion of the opening outer peripheral side portion.

4. The carrier for an electronic parts testing apparatus according to any one of claims 1 to 3,

the outer peripheral portion is fixed to the body portion by the plurality of caulking pieces in a state where tension is applied to the sheet.

5. The carrier for an electronic parts testing apparatus according to any one of claims 1 to 3,

the inclined surface is formed on the bottom surface of the main body part in a manner of inclining from the inner peripheral side to the outer peripheral side of the bottom surface to the high position side,

the riveting pieces are formed on the inclined surface.