JP2018189391A - Carrier for electronic component tester - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier for electronic component testers with which it is possible to add sufficient tension to a sheet on which an electronic component to be tested is mounted and secure the positional accuracy of the electronic component to be tested that is mounted on the sheet.SOLUTION: There is provided a device carrier for holding an IC device, with a plurality of terminals projecting from the bottom, on an IC socket provided in an electronic component tester, comprising: a film 750 on which the IC device is mounted in such a way that the plurality of terminals project to the IC socket side; and a core body, with the outer circumference of the film 750 secured by a plurality of crimps. The film 750 includes an opening 751 in which a barrel portion 7491 fits, and a slit 7513 formed in an area at the edge of the opening 751 that is on the inner circumferential side of the film 750 from the center of the opening 751 and not formed in an area at the edge of the opening 751 that is on the outer circumferential side of the film 750 from the center of the opening 751.SELECTED DRAWING: Figure 15

Description

  The present invention relates to a carrier for an electronic component testing apparatus.

  A seating portion on which the electronic device under test is seated as a carrier for an electronic device testing apparatus that transports the electronic device under test such as a BGA (Ball Grid Array) type IC package onto the electronic component socket for quality inspection. In addition, a through hole for exposing the contact portion (terminal) of the electronic component under test in the direction of the contact terminal of the electronic component socket is formed, and the outer peripheral portion of this seating portion is a carrier by a rivet having a head portion and a trunk portion. The thing fixed to the main body is known (for example, refer patent document 1). In the carrier for an electronic component testing apparatus described in Patent Document 1, the seating portion is constituted by a film-like sheet such as polyimide, and this film-like sheet is stretched under the carrier body.

JP 2010-156546 A

  In the carrier for an electronic component testing apparatus described in Patent Document 1, the film-like sheet is ensured in flatness and through hole positional accuracy by sufficiently applying tension to the film-like sheet. It is necessary to ensure the positional accuracy of the above electronic components to be tested.

  The problem to be solved by the present invention is to provide a carrier for an electronic component testing apparatus that can sufficiently apply tension to a sheet on which the electronic component under test is placed and can ensure the positional accuracy of the electronic component under test on the sheet. It is to be.

[1] A carrier for an electronic component testing apparatus according to the present invention is an electronic component testing apparatus for holding an electronic device under test in which a plurality of terminals protrude from a bottom surface on a socket provided in the electronic component testing apparatus. A carrier that constitutes a bottom of the carrier, the electronic component to be tested is placed on the plurality of terminals so that the terminals protrude toward the socket, and a tray that is conveyed in the electronic component testing apparatus And a body part fixed by a plurality of caulkings, the caulking from the body part protruding from the body part and the body part provided at the tip of the body part A large-diameter head, and the sheet is formed in an opening in which the body part is fitted, and in an area on the inner peripheral side of the sheet from the center of the opening at an edge of the opening, Of the opening at the edge of Than heart and a slit is not formed on the outer peripheral side region of the seat.

[2] In the above invention, the body part is a semicircular body part outer peripheral side portion formed in a region on the outer peripheral side of the sheet from the center of the body part, and the sheet is more than the center of the body part. A semicircular trunk inner peripheral portion having a smaller diameter than the outer peripheral portion of the barrel portion, and the opening is a region on the outer peripheral side of the sheet from the center of the opening. Formed in a semicircular shape, and the outer peripheral side portion of the opening into which the outer peripheral side portion of the body portion is fitted, and the region on the inner peripheral side of the sheet with respect to the center of the opening, has a semi-diameter smaller than the outer peripheral portion of the opening. An opening inner peripheral side portion that is formed in a circular shape and engages with the inner peripheral portion of the body portion, and the slit is formed at an edge portion of the inner peripheral portion of the opening, and an edge portion of the outer peripheral portion of the opening It may be configured not to be formed.

[3] In the above invention, the body part is a semicircular body part outer peripheral side portion formed in a region on the outer peripheral side of the sheet from the center of the body part, and the sheet is more than the center of the body part. A semicircular trunk inner peripheral portion having a larger diameter than the outer peripheral portion of the barrel portion, and the opening is closer to the outer peripheral side of the sheet than the center of the opening. Formed in a semi-circular shape in the region, formed in a semi-circular shape in the region on the inner peripheral side of the sheet from the center of the opening in the opening, and the outer peripheral side portion of the opening to which the outer peripheral side portion of the body is fitted, An opening inner peripheral side portion into which the body inner peripheral side portion is fitted, and the slit is a boundary portion between an edge of the opening inner peripheral side portion and an edge of the opening outer peripheral side portion; So that it is not formed on the edge of the outer peripheral side of the opening. It may be made.

[4] In the above invention, the sheet may be configured such that the outer peripheral portion is fixed to the main body portion by the plurality of crimps in a state where tension is applied.

[5] In the above invention, the inclined surface is formed on the bottom surface of the main body so as to be inclined from the inner peripheral side to the outer peripheral side of the bottom surface, and the plurality of crimps are formed on the inclined surface. May be configured.

  According to the present invention, since the edge of the outer peripheral side portion of the opening of the sheet can be reliably applied to the caulking body, sufficient tension can be applied to the sheet, and the positional accuracy of the electronic component under test on the sheet Can be secured.

FIG. 1 is a schematic cross-sectional view showing an electronic component testing apparatus using a device carrier according to an embodiment of the present invention. FIG. 2 is a perspective view showing the electronic component testing apparatus of FIG. FIG. 3 is a conceptual diagram for explaining transfer of the tray in the electronic component testing apparatus of FIGS. 1 and 2. FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus. FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus. FIG. 6 is a perspective view showing the test tray. FIG. 7 is an exploded perspective view showing an enlarged part of the test tray. FIG. 8 is a perspective view showing the core from the bottom side. FIG. 9 is a bottom view showing the core. FIG. 10 is a plan view showing the core. FIG. 11 is a front view showing the core. FIG. 12 is a side view showing the core. 13 is a cross-sectional view taken along line 13-13 of FIG. FIG. 14 is an enlarged cross-sectional view showing a part of FIG. 15 is a cross-sectional view taken along line 15-15 of FIG. FIG. 16 is a cross-sectional view showing a modification of the configuration of the body and the opening shown in FIG. FIG. 17 is an enlarged plan view showing the four corners of the bottom of the device carrier. FIG. 18 is a cross-sectional view showing a state in which an IC device is being tested (inspected). FIG. 19 is a cross-sectional view showing a state in which an IC device is being tested (inspected). FIG. 20 is a perspective view for explaining a method of attaching the film to the core body. FIG. 21 is a cross-sectional view for explaining a method of attaching the film to the core body. FIG. 22 is a perspective view for explaining a method of attaching the film to the core body. FIG. 23 is a perspective view for explaining a method of attaching a film having an opening having the configuration shown in FIG. 16 to a core body having a trunk having the configuration shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an electronic component testing apparatus using a device carrier according to an embodiment of the present invention. FIG. 2 is a perspective view showing the electronic component testing apparatus of FIG. FIG. 3 is a conceptual diagram for explaining transfer of the tray in the electronic component testing apparatus of FIGS. 1 and 2.

  The electronic component testing apparatus shown in FIGS. 1 and 2 applies a high or low temperature thermal stress to the IC device, and uses the test head 5 and the tester 6 to determine whether the IC device operates properly in this state. Test (inspect). The electronic component testing apparatus classifies IC devices based on the test results.

  In the electronic component testing apparatus, a large number of IC devices to be tested are mounted on a customer tray KST (see FIG. 5). Further, a test tray TST (see FIG. 6) is circulated in the handler 1 of the electronic component device. The IC device is transferred from the customer tray KST to the test tray TST and tested. The IC device is indicated by a symbol IC in the drawing.

  As shown in FIG. 1, a space 8 is provided below the handler 1, and a test head 5 is arranged in this space 8. An IC socket 50 is provided on the test head 5, and the IC socket 50 is connected to the tester 6 through the cable 7.

  In this electronic component testing apparatus, the IC device mounted on the test tray TST and the IC socket 50 on the test head 5 are in contact and electrically connected, and an electric signal or the like is given to the IC device in this state. The IC device is tested (inspected) based on the signal output from the tester 6. When changing the type of IC device, the IC socket 50 and a core 730 to be described later are replaced with ones suitable for the shape and the number of pins of the IC device.

  As shown in FIGS. 2 and 3, the handler 1 includes a storage unit 200, a loader unit 300, a test unit 100, and an unloader unit 400. The storage unit 200 stores IC devices before and after testing. The loader unit 300 transfers the IC device transferred from the storage unit 200 to the test unit 100. The test unit 100 is configured such that the IC socket 50 of the test head 5 faces inside. The unloader unit 400 classifies the tested IC devices that have been tested by the test unit 100.

  FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus. FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus. As shown in FIG. 4, the storage unit 200 includes a pre-test stocker 201 and a tested stocker 202. The pre-test stocker 201 stores a customer tray KST containing an IC device before the test. The tested stocker 202 stores a customer tray KST containing IC devices classified according to the test result. The pre-test stocker 201 and the tested stocker 202 include a frame-shaped tray support frame 203 and an elevator 204 that enters from the lower portion of the tray support frame 203 and moves up and down. A plurality of customer trays KST are stacked on the tray support frame 203. The stacked customer trays KST are moved up and down by the elevator 204. As shown in FIG. 5, the customer tray KST includes a plurality of concave storage units that store IC devices. The plurality of accommodating portions are arranged in a plurality of rows and a plurality of columns (for example, 14 rows and 13 columns). Note that the pre-test stocker 201 and the tested stocker 202 have the same structure.

  As shown in FIGS. 2 and 3, the pre-test stocker 201 is provided with two stockers STK-B and two empty tray stockers STK-E. Two stockers STK-B are adjacent to each other, and two empty tray stockers STK-E are adjacent to each other next to these two stockers STK-B. In the empty tray stocker STK-E, empty customer trays KST to be transferred to the unloader unit 400 are stacked.

  Next to the pre-test stocker 201, a tested stocker 202 is provided. This tested stocker 202 is provided with eight stockers STK-1, STK-2,..., STK-8. The tested stocker 202 is configured so that the tested IC devices can be sorted and stored in up to eight categories according to the test results. For example, a tested IC device can be classified into a non-defective product and a defective product in the tested stocker 202, a good product with a high operation speed, a good product with a medium operation speed, and a good product with a low operation speed. Or can be classified into defective products that require retesting and defective products that do not require retesting.

  As shown in FIG. 2, a tray transfer arm 205 is provided between the storage unit 200 and the apparatus base 101. The tray transfer arm 205 transfers the customer tray KST from the lower side of the apparatus base 101 to the loader unit 300. Here, a pair of window portions 370 are formed on the device base 101. The pair of windows 370 are arranged so that the customer tray KST transferred to the loader unit 300 from the lower side of the apparatus base 101 by the tray transfer arm 205 faces the upper surface of the apparatus base 101.

  The loader unit 300 includes a device transfer device 310. The device transport apparatus 310 includes two rails 311, a movable arm 312, and a movable head 320. The two rails 311 are installed on the apparatus base 101. The movable arm 312 reciprocates between the test tray TST and the customer tray KST along the two rails 311. The moving direction of the movable arm 312 is referred to as the Y direction. The movable head 320 is supported by the movable arm 312 and moves in the X direction. A plurality of suction pads (not shown) are mounted on the movable head 320 downward.

  The device transport apparatus 310 moves the movable head 320 that has attracted a plurality of IC devices with a plurality of suction pads from the customer tray KST to a precursor 360. As a result, the IC device is transferred from the customer tray KST to the precursor 360. The device transport apparatus 310 corrects the mutual positional relationship of the IC devices by the movable arm 312 and the movable head 320 in the precursor 360. Thereafter, the device transport apparatus 310 transports the IC device to the test tray TST stopped by the loader unit 300. As a result, the IC devices are transferred from the customer tray KST to the test tray TST.

  As shown in FIGS. 2 and 3, the test unit 100 includes a soak chamber 110, a test chamber 120, and an unsoak chamber 130. The soak chamber 110 applies a desired high or low temperature thermal stress to the IC device mounted on the test tray TST. The test chamber 120 presses the IC device to which the thermal stress is applied in the soak chamber 110 against the test head 5. The unsoak chamber 130 removes thermal stress from the IC devices tested in the test chamber 120.

  When a high temperature is applied to the IC device in the soak chamber 110, the IC device is cooled to room temperature by blowing air in the unsoak chamber 130. On the other hand, when a low temperature is applied to the IC device in the soak chamber 110, the IC device is heated in the unsoak chamber 130 to a temperature at which condensation does not occur with warm air or a heater.

  As shown in FIG. 2, the soak chamber 110 and the unsoak chamber 130 protrude upward from the test chamber 120. As conceptually shown in FIG. 3, the soak chamber 110 is provided with a vertical transfer device, and while the preceding test tray TST exists in the test chamber 120, a plurality of subsequent test trays TST are provided. Is in a state of being supported by the vertical transfer device. The IC devices mounted on the plurality of subsequent test trays TST are subjected to high or low temperature heat stress during standby.

  A test head 5 is arranged in the center of the test chamber 120. A test tray TST is transferred onto the test head 5. In the center of the test chamber 120, there are terminals HB (see FIGS. 16 and 17) of the IC device mounted on the test tray TST and terminals 51 (see FIGS. 16 and 17) of the IC socket 50 on the test head 5. The contact is made and the IC device is tested. The test tray TST on which the IC device that has been tested is mounted is transferred to the unsoak chamber 130. In the unsoak chamber 130, the IC device for which the test has been completed is removed to room temperature. The test tray TST on which the heat-removed IC device is mounted is carried out to the unloader unit 400.

  In the upper part of the soak chamber 110, an inlet for carrying the test tray TST from the apparatus base 101 to the soak chamber 110 is formed. On the other hand, an outlet for unloading the test tray TST from the unsoak chamber 130 to the apparatus base 101 is formed in the upper part of the unsoak chamber 130.

  As shown in FIG. 2, the apparatus base 101 is provided with a tray transport device 102. The tray transfer apparatus 102 carries the test tray TST from the apparatus base 101 to the soak chamber 110 and carries the test tray TST from the unsoak chamber 130 to the apparatus base 101. The tray transport device 102 is constituted by, for example, a rotating roller.

  After the test tray TST is carried out from the unsoak chamber 130 to the apparatus base 101 by the tray transport apparatus 102, all IC devices mounted on the test tray TST are tested by the device transport apparatus 410 (described later). It is transshipped to the customer tray KST corresponding to. Thereafter, the test tray TST is transferred to the soak chamber 110 via the unloader unit 400 and the loader unit 300.

  As shown in FIG. 2, the unloader unit 400 is provided with two device transfer apparatuses 410. The device transport apparatus 410 has the same structure as the device transport apparatus 310 provided in the loader unit 300. The two device transfer apparatuses 410 transfer the tested IC devices from the test tray TST present on the apparatus base 101 to the customer tray KST corresponding to the test result.

  Two pairs of window portions 470 are formed on the device base 101. The two pairs of windows 470 are arranged such that the customer tray KST transferred to the unloader 400 faces the upper surface of the apparatus base 101. A lifting table (not shown) is provided below the two pairs of window portions 470 and the window portion 370 described above. This lifting table lowers the customer tray KST on which the tested IC device is mounted and transfers it to the tray transfer arm 205.

  FIG. 6 is a perspective view showing the test tray TST. As shown in this figure, the test tray TST includes a frame 700 and a plurality of device carriers 710. The frame 700 includes a rectangular outer frame 701 and an inner frame 702 provided in a lattice shape in the outer frame 701. The frame 700 includes a rectangular opening 703 divided into a plurality of rows and a plurality of columns by an outer frame 701 and an inner frame 702.

  The plurality of device carriers 710 are arranged in a plurality of rows and a plurality of columns. Each device carrier 710 is provided corresponding to each opening 703 of the frame 700. The device carrier 710 includes a body 720 and a plurality of (for example, four as shown) cores 730. The body 720 is a rectangular plate-shaped resin molded body, and rectangular openings 721 of the same number (four in this embodiment) as the number of cores 730 are arranged in a plurality of rows and a plurality of columns (in this embodiment, two rows and two columns). Is formed.

  The plurality of bodies 720 are arranged in a plurality of rows and a plurality of columns below the frame 700. The body 720 located at the outermost periphery is arranged so that the outer peripheral portion thereof overlaps with the outer frame 701 or the inner frame 702 and the plurality of openings 721 overlap with the openings 703 of the frame 700. On the other hand, the other body 720 is arranged so that the outer peripheral portion thereof overlaps with the inner frame 702 and the plurality of openings 721 overlap with the openings 703 of the frame 700. The plurality of bodies 720 are fixed to the intersection of the outer frame 701 and the inner frame 702 and the intersection of the inner frames 702 in the frame 700.

  FIG. 7 is an exploded perspective view showing a part of the test tray TST in an enlarged manner. As shown in this figure, the core 730 is detachably attached to the body 720. The core 730 is arranged corresponding to each opening 721, and is attached to the body 720 so that it can be finely moved (moved) in a plane (in the XY plane in the figure). The core 730 includes a core body 740 and a film 750. The core body 740 is a resin molded body in which a rectangular opening (through hole) 741 is formed. A plurality of claw portions 742 and a plurality of guide portions 743 are formed on the outer peripheral portion of the core body 740. The body 720 is formed with an engagement portion (not shown) that engages with the claw portion 742 and a guide groove 722 into which the guide portion 743 is inserted. The core body 740 is supported by the body 720 by the claw portion 742 engaging with the engaging portion. When the core main body 740 is attached to the body 720, the claw portion 742 can be engaged with the engaging portion by inserting the guide portion 743 into the guide groove 722 and pushing the core main body 740 into the opening 721. On the other hand, the core main body 740 can be detached from the body 720 by releasing the engagement between the claw portion 742 and the engaging portion.

  Here, the engagement between the claw portion 742 and the engagement portion and the fitting between the guide portion 743 and the guide groove 722 do not fix the core body 740 and the body 720, and the core body 740 and the body 720 are not fixed. Allow fine movement (free movement) in a relative plane. Thereby, as will be described later, the core 730 and the IC socket 50 can be relatively positioned.

  The film 750 is a resin molded body formed in a rectangular thin film shape. The outer periphery of the film 750 is fixed to the bottom of the core body 740, so that the film 750 constitutes the bottom of the core 730. An IC device is placed on the film 750.

  FIG. 8 is a perspective view showing the core 730 from the bottom side. FIG. 9 is a bottom view showing the core 730. FIG. 10 is a plan view showing the core 730. FIG. 11 is a front view showing the core 730. FIG. 12 is a side view showing the core 730. 13 is a cross-sectional view taken along line 13-13 of FIG. FIG. 14 is an enlarged cross-sectional view showing a part of FIG. As shown in these drawings, the core main body 740 includes a rectangular annular frame portion 744 in which the above-described opening 741 is formed, a pair of positioning plates 745 and 746, and a pair of lever accommodating portions 747 and 748.

  A plurality of crimps 749 are provided on the bottom surface (lower end surface) of the frame portion 744. The caulking 749 is provided at the four corners of the bottom surface of the frame portion 744 and each side of the bottom surface of the frame portion 744. A plurality of (for example, two as shown) crimps 749 are provided on each side of the bottom surface of the frame portion 744. On the other hand, a plurality of openings 751 are formed in the outer peripheral portion 750A of the film 750 corresponding to the position of the caulking 749. Each caulking 749 includes a trunk portion 7491 (see FIG. 14) having a circular cross-sectional shape and a head portion 7492 having a circular cross-sectional shape. The trunk portion 7491 protrudes downward from the bottom surface of the frame portion 744 and is inserted through the opening 751 of the film 750. The head portion 7492 has a larger diameter than the body portion 7491 and the opening 751, and extends in the radial direction from the tip (lower end) of the body portion 7491. The outer peripheral portion 750 </ b> A of the film 750 is sandwiched between the head portion 7492 and the bottom surface of the frame portion 744. Details of the structure of the outer peripheral portion 750A of the film 750, the bottom surface of the frame portion 744, and the caulking 749 will be described later.

  The positioning plate 745 is provided at the upper end of the first side wall 7441 of the frame portion 744. The other positioning plate 746 is provided at the upper end of the second side wall 7442 of the frame portion 744. The first side wall 7441 and the second side wall 7442 are opposed to each other. The positioning plate 745 projects from the upper end of the first side wall 7441 to the opposite side of the opening 741, and the other positioning plate 746 projects from the upper end of the second side wall 7442 to the opposite side of the opening 741. A pair of guide portions 743 are provided on the upper surfaces of the positioning plates 745 and 746, respectively.

  Claw portions 742 are respectively provided at one end and the other end of the positioning plates 745 and 746 in the longitudinal direction. That is, the four claw portions 742 are arranged on the diagonal line of the opening 741. The pair of claw portions 742 arranged diagonally are arranged in directions opposite to each other. On the other hand, the claw portions 742 adjacent to each other are arranged in a direction different by 90 °.

  The positioning plates 745 and 746 are rectangular plate bodies, and the direction along the first side wall 7441 and the second side wall 7442 is a longitudinal direction, and is orthogonal to the first side wall 7441 and the second side wall 7442. The direction is the width direction. A positioning hole 7451 is formed in the central portion of the positioning plate 745 in the longitudinal direction, and a positioning hole 7461 is formed in the central portion of the positioning plate 746 in the longitudinal direction. The positioning hole 7451 is a circular through hole. On the other hand, the positioning hole 7461 is an oval through hole. The longitudinal direction of the positioning hole 7461 coincides with the width direction of the positioning plate 746. A positioning pin 55 (described later) is inserted into the positioning hole 7451 and a positioning pin 56 (described later) is inserted into the positioning hole 7461, whereby the core 730 is positioned with respect to the IC socket 50.

  The lever accommodating portion 747 is provided on the third side wall 7443 of the frame portion 744. The other lever accommodating portion 748 is provided on the fourth side wall 7444 of the frame portion 744. The third side wall 7443 and the fourth side wall 7444 are opposed to each other. The lower portion of the lever accommodating portion 747 is provided so as to protrude from the third side wall 7443 to the opposite side of the opening 741, and the upper portion of the lever accommodating portion 747 is provided so as to protrude upward from the third side wall 7443. Yes. The lever accommodating portion 747 is configured in a rectangular box shape, and accommodates the lever 760 therein. The lower portion of the other lever accommodating portion 748 is provided so as to protrude from the fourth side wall 7444 to the opposite side of the opening 741, and the upper portion of the lever accommodating portion 748 protrudes upward from the upper end of the fourth side wall 7444. Is provided. The lever accommodating portion 748 is configured in a rectangular box shape, and accommodates the lever 761 therein. The lever 760 and the lever 761 have the same structure and are arranged symmetrically.

  An opening 7443A is formed at the center in the width direction of the third side wall. In addition, an opening 747A is formed in the central portion in the horizontal direction below the lever housing portion 747. On the other hand, an opening 7444A is formed at the center in the width direction of the fourth side surface. In addition, an opening 748A is formed in the central portion in the horizontal direction at the lower portion of the lever housing portion 748. The lever 760 accommodated in the lever accommodating portion 747 is configured to be able to advance and retract to the opening 741 through the opening 7443A. The lever 760 is retracted from the opening 741 into the lever accommodating portion 747 by receiving an external force through the opening 747A, and is advanced into the opening 741 through the opening 7443A by removing the external force. On the other hand, the lever 761 accommodated in the lever accommodating portion 748 is configured to be able to advance and retract to the opening 741 through the opening 7444A. When the lever 761 receives an external force through the opening 748A, the lever 761 moves backward from the opening 741 into the lever accommodating portion 748, and when the external force is removed, the lever 761 advances through the opening 7444A into the opening 741. The pair of levers 760 and 761 that have advanced into the opening 741 are pressed against the outer peripheral portion of the IC device on the film 750 by the biasing force of the spring. As a result, the IC device on the film 750 is pressed by the pair of levers 760 and 761.

  A rectangular opening 752 is formed at the center of the film 750. Here, an optical sensor (not shown) is provided at a predetermined position of the electronic component testing apparatus, and the core 730 stops at the position of the light beam of the optical sensor or passes through the position of the light beam of the optical sensor. . This optical sensor includes a light emitting unit and a light receiving unit that are vertically opposed to each other, and emits light at a timing at which the opening 752 is positioned between the light emitting unit and the light receiving unit. When the IC device is present on the film 750, the light is blocked by the IC device, so that the IC device is detected. On the other hand, when the IC device does not exist on the film 750, the light emitted from the light emitting portion passes through the opening 752 and is received by the light receiving element, so that the IC device is not detected.

  A large number of small holes 753 are formed between the opening 752 of the film 750 and the outer peripheral portion 750A. These many small holes 753 are provided corresponding to many ball-shaped terminals HB provided on the bottom surface of the IC device. The diameter of the small hole 753 is set larger than the diameter of the terminal HB. Thereby, the terminal HB protrudes from the film 750 to the IC socket 50 side through the small hole 753. In the present embodiment, since a large number of terminals HB of the IC device are arranged in a plurality of rows in a rectangular ring shape, a large number of small holes 753 are arranged in a plurality of rows in a rectangular ring shape. However, the arrangement of the terminals HB and the small holes 753 of the IC device is not limited to the arrangement of the present embodiment, and can be changed as appropriate.

  As shown in FIG. 14, an inner peripheral plane portion 7445 and an outer peripheral inclined surface portion 7446 are formed on the bottom surface of the frame portion 744. A portion between the opening 751 of the film 750 and the small hole 753 is in contact with the flat portion 7445. The inclined surface portion 7446 is inclined upward from the flat surface portion 7445 to the outer peripheral side of the frame portion 744. A caulking 749 is formed on the slope portion 7446. Specifically, in addition to the body portion 7491 of the caulking 749 projecting downward from the inclined surface portion 7446, the head portion 7492 of the caulking 749 is formed so as to fit within the inclined surface portion 7446 without entering the flat surface portion 7445. Has been.

  Here, a horizontal surface 7492A is formed on the head portion 7492 of the caulking 749. The height position of the horizontal plane 7402A is set to a position higher than the plane portion 7445. The film 750 includes an outer peripheral portion 750A that is inclined by coming into contact with the inclined surface portion 7446, and a flat surface portion 750B inside the outer peripheral portion 750A. The outer peripheral portion of the upper surface of the flat portion 750B comes into contact with the flat portion 7445. Therefore, the height of the lower surface of the plane portion 750B is set to a position that is lower than the plane portion 7445 by the sum of the thickness of the film 750. Therefore, the height of the lowest part (lowest point) of the crimp 749 is set at a position higher than the height of the lowest part (lowest point) of the film 750.

  Here, at the position on the outer peripheral side of the film 750 with respect to the center of the opening 751, the edge of the opening 751 is applied to the trunk portion 7491, whereby tension is applied to the film 750. The relative position between the body portion 7491 and the opening 751 is set so that this state is formed, and the shapes and dimensions of the body portion 7491 and the opening 751 are set.

  15 is a cross-sectional view taken along line 15-15 of FIG. As shown in this figure, the trunk portion 7491 has a trunk portion outer peripheral side portion 7491A formed in a region on the outer peripheral side of the film 750 from the center (axial center), and a region on the inner peripheral side of the film 750 from the center. And a formed body inner peripheral side portion 7491B. The cross-sectional shape of the trunk portion outer peripheral side portion 7491A is a semicircular shape having a radius R1, and the cross-sectional shape of the trunk portion inner peripheral side portion 7491B is a semicircular shape having a radius R2 (<R1). The trunk portion outer peripheral side portion 7491A and the trunk portion inner peripheral side portion 7491B share the center of a circle, and a step portion is formed at the boundary between these.

  The opening 751 includes an opening outer peripheral side portion 7511 formed in a region on the outer peripheral side of the film 750 from the center, and an opening inner peripheral side portion 7512 formed in a region on the inner peripheral side of the film 750 from the center. The opening outer peripheral side portion 7511 has a semicircular shape with a radius r1, and the opening inner peripheral side portion 7512 has a semicircular shape with a radius r2 (<r1). The opening outer peripheral side portion 7511 and the opening inner peripheral side portion 7512 share the center of a circle, and a step portion is formed at the boundary between them.

  The radius R1 of the body outer peripheral part 7491A is slightly larger than the radius r1 of the opening outer peripheral part 7511, and the radius R2 of the body inner peripheral part 7491B is slightly larger than the radius r2 of the opening inner peripheral part 7512. It has become. For this reason, the edge of the opening outer peripheral side portion 7511 and the peripheral surface of the trunk outer peripheral side portion 7491A abut, and the edge of the opening inner peripheral side portion 7512 contacts the peripheral surface of the trunk inner peripheral side portion 7491B.

  Here, a plurality of slits 7513 are formed at the edge of the opening inner peripheral side portion 7512. The plurality of slits 7513 are arranged at a predetermined interval (for example, an interval of 45 ° as shown) in the circumferential direction of the slit 7513. The length of the slit 7513 is not particularly limited, but is preferably not less than the difference (r1−r2) between the radius r1 of the opening outer periphery side portion 7511 and the radius r2 of the opening inner periphery side portion 7512.

  Since a plurality of slits 7513 are formed at the edge of the opening inner peripheral portion 7512, the rigidity of the edge of the opening inner peripheral portion 7512 is lower than the rigidity of the edge of the opening outer peripheral portion 7511. Yes. As a result, the edge of the opening inner peripheral portion 7512 is greatly deflected compared to the edge of the opening outer peripheral portion 7511, and the edge of the opening outer peripheral portion 7511 and the peripheral surface of the trunk outer peripheral portion 7491A contact each other. The pressure becomes larger than the contact pressure between the edge of the opening inner peripheral portion 7512 and the peripheral surface of the trunk inner peripheral portion 7491A. Accordingly, the edge of the opening 751 is in a state of being applied to the body portion 7491 on the outer peripheral side of the film 750 from the center of the body portion 7491, so that tension is applied to the film 750.

  FIG. 16 is a cross-sectional view showing a modified example of the configuration of the trunk portion 7491 and the opening 751 shown in FIG. As shown in this figure, the trunk portion 7491 has a trunk portion outer peripheral side portion 7491A formed in a region on the outer peripheral side of the film 750 from the center and a barrel portion formed in a region on the inner peripheral side of the film 750 from the center. Part inner peripheral side portion 7491B. The cross-sectional shape of the trunk portion outer peripheral side portion 7491A is a semicircular shape with a radius R1, and the cross-sectional shape of the trunk portion inner peripheral side portion 7491B is a semicircular shape with a radius R2 (> R1). The trunk portion outer peripheral side portion 7491A and the trunk portion inner peripheral side portion 7491B share the center of a circle, and a step portion is formed at the boundary between these.

  The opening 751 is a perfect circle, and the opening outer peripheral side portion 7511 formed in the outer peripheral side region of the film 750 from the center, and the opening inner peripheral side portion formed in the inner peripheral side region of the film 750 from the center 7512. The opening outer peripheral side portion 7511 and the opening inner peripheral side portion 7512 have a semicircular shape with a radius r1 (= r2), and are divided into an inner peripheral side and an outer peripheral side of the film 750 with a pair of slits 7513 as a boundary.

  The radius R1 of the body outer peripheral part 7491A is slightly larger than the radius r1 of the opening outer peripheral part 7511, and the radius R2 of the body inner peripheral part 7491B is slightly larger than the radius r2 of the opening inner peripheral part 7512. It has become. For this reason, the edge of the opening outer peripheral side portion 7511 and the peripheral surface of the trunk outer peripheral side portion 7491A abut, and the edge of the opening inner peripheral side portion 7512 contacts the peripheral surface of the trunk inner peripheral side portion 7491B.

  Here, in addition to the above-described slits 7513 being formed at both ends of the edge of the opening inner peripheral portion 7512, a slit 7513 is formed at the center of the edge of the opening inner peripheral portion 7512. The plurality of slits 7513 are arranged at a predetermined interval (for example, an interval of 90 ° as shown) in the circumferential direction of the opening 751. The length of the slit 7513 is not particularly limited, but is preferably equal to the difference (r1−r2) between the radius r1 of the opening outer periphery side portion 7511 and the radius r2 of the opening inner periphery side portion 7512.

  By forming a plurality of slits 7513 at the center and both ends of the edge of the opening inner peripheral portion 7512, the rigidity of the edge of the opening inner peripheral portion 7512 is the same as the rigidity of the edge of the opening outer peripheral portion 7511. Is lower than. As a result, the edge of the opening inner peripheral portion 7512 is greatly bent as compared with the edge of the opening outer peripheral portion 7512, and the edge of the opening outer peripheral portion 7511 contacts the peripheral surface of the trunk outer peripheral portion 7491A. The pressure becomes larger than the contact pressure between the edge of the opening inner peripheral portion 7512 and the peripheral surface of the trunk inner peripheral portion 7491A. Accordingly, the edge of the opening 751 is in a state of being applied to the body portion 7491 on the outer peripheral side of the film 750 from the center of the body portion 7491, so that tension is applied to the film 750.

  FIG. 17 is an enlarged plan view showing the four corners of the bottom of the device carrier 710. As shown in this figure, slits 754 are formed at the four corners of the film 750, respectively. Each of the four corners of the outer peripheral portion of the film 750 has a pair of extended lines of the boundary line between the outer peripheral portion 750A and the flat portion 750B of the film 750, and each of the four corners of the outer peripheral portion of the film 750 is rectangular by the pair of extension lines. When partitioned into shapes, one extension line overlaps the opening 751, and the other extension line does not overlap the opening 751. A slit 754 is formed on an extension line that does not overlap the opening 751.

  Here, when the outer peripheral portion 750A of the film 750 to which the tension is applied is inclined, if the slits 754 are not formed at the four corners of the outer peripheral portion 750A of the film 750, wrinkles are generated at the four corners of the outer peripheral portion 750A of the film 750. . On the other hand, in this embodiment, by forming the slits 754 at the four corners of the outer peripheral portion 750A of the film 750, it is possible to prevent wrinkles from occurring at the four corners of the outer peripheral portion 750A of the film 750.

  18 and 19 are cross-sectional views showing a state in which the IC device is being tested (inspected). As shown in FIG. 18, a pair of positioning pins 55 and 56 are provided on the test head 5 so as to sandwich a pair of opposite sides of the rectangular IC socket 50. One positioning pin 55 is fitted into the positioning hole 7451 of the core body 740, and the other positioning pin 56 is fitted into the other positioning hole 7461. Thereby, the relative position of the core body 740 and the IC socket 50 is determined so that the terminal HB of the IC device and the terminal 51 of the IC socket 50 are in contact with each other.

  As shown in FIG. 19, the pair of levers 760 and 761 that have advanced into the opening 741 are pressed against the outer peripheral portion of the IC device on the film 750 by a biasing force by a spring (not shown). As a result, the IC device on the film 750 is pressed by the pair of levers 760 and 761.

  As shown in FIGS. 18 and 19, a pusher 121 is provided above the IC socket 50 so as to be lifted and lowered. The pusher 121 is attached to a Z-axis drive device (not shown) (for example, a fluid cylinder). When testing the IC device, the Z-axis driving device presses the IC device against the IC socket 50 by the pusher 121.

  The IC socket 50 has a configuration in which a plurality of terminals 51 are embedded in an insulating sheet-like base material. The terminal 51 is configured by a conductive elastic member. Examples of the conductive elastic member constituting the terminal 51 include those obtained by adding a conductive filler to synthetic rubber and those obtained by adding a conductive filler to a synthetic resin such as polyester. The number and arrangement of the plurality of terminals 51 are set corresponding to the number and arrangement of the plurality of terminals HB of the IC device.

  The test of the IC device is executed by the tester 6 in a state where the terminal HB of the IC device and the terminal 51 of the IC socket 50 are in electrical contact. The test result of the IC device is stored at an address determined by, for example, an identification number assigned to the test tray TST and an IC device number assigned in the test tray TST.

  Here, since the lowest part (lowest point) of the crimping 749 is set at a position higher than the lowest part (lowest point) of the film 750, the lowest part of the crimping 749 is the IC device. It is located at a position higher than the tip (lower end) of the terminal HB. Thereby, the clearance between the caulking 749 and the upper surface of the IC socket 50 can be secured regardless of the protruding height of the terminal HB from the bottom surface of the IC device.

  FIG. 20 is a perspective view for explaining a method of attaching the film 750 to the core body 740. FIG. 21 is a cross-sectional view for explaining a method of attaching the film 750 to the core body 740. FIG. 22 is a perspective view for explaining a method of attaching the film 750 to the core body 740. As shown in these drawings, the outer peripheral portion 750A of the film 750 is fixed to the inclined surface portion 7446 of the core body 740 by heat caulking.

  First, as shown in FIGS. 20 and 22, a film 750 and a core body 740 are prepared. A plurality of openings 751 are formed in the outer peripheral portion of the film 750. Each opening 751 is formed with an opening outer peripheral side portion 7511 and an opening inner peripheral side portion 7512. In addition, a plurality of slits 7513 are formed at the edge of the opening inner peripheral portion 7512. On the other hand, a plurality of bosses 749B are formed on the slope portion 7446 of the core body 740. The positions of the plurality of bosses 749B correspond to the positions of the plurality of openings 751. An opening 749H is formed in the axial center of each boss 749B. Each boss 749B is formed with a barrel outer peripheral portion 7491A and a barrel inner peripheral portion 7491B.

  Next, the film 750 is disposed on the bottom of the core body 740. At this time, the positions of the plurality of bosses 749B and the plurality of openings 751 are aligned, and all the bosses 749B are inserted into the openings 751.

  Next, as shown in FIG. 21, a caulking 749 having a trunk portion 7491 and a head portion 7492 having a diameter larger than that of the trunk portion 7491 is formed, and the film 750 is formed by the caulking 749 and the slope portion 7446 of the core body 740. The outer peripheral portion 750 </ b> A of the film 750 is fixed to the inclined surface portion 7446 of the core body 740 by sandwiching the outer peripheral portion 750 </ b> A. In this step, the caulking 749 is formed by pressurizing the boss 749B from the distal end side to the proximal end side and thermally deforming it using a resin thermal caulking apparatus (not shown). At this time, since the opening 749H is formed in the axial center of the boss 749B, thermal deformation spreading in the outer diameter direction of the boss 749B is promoted as compared with the solid boss.

  Here, at the position on the outer peripheral side of the film 750 with respect to the center of the opening 751, the opening 751 and the body 7491 are arranged so that tension is applied to the film 750 by the edge of the opening 751 being applied to the body 7491. The relative position, the diameter of the opening 751 and the body 7491, the condition of heat caulking, and the like are set.

  In addition, with the core 730 in a posture in which the film 750 faces upward, the dimensions and heat of the boss 749B are set so that the height of the horizontal plane 7492A of the caulking 749 is higher than the height of the upper surface of the plane portion 750B of the film 750. Set the caulking conditions.

  FIG. 23 is a perspective view for explaining a method of attaching the film 750 having the opening 751 having the configuration shown in FIG. 16 to the core main body 740 having the trunk portion 7491 having the configuration shown in FIG. As shown in this figure, when the opening 751 is formed on the outer periphery of the film 750, a plurality of slits 7513 are formed at the edge of the opening 751. A pair of slits 7513 are formed on an extension of the center line that bisects the opening 751 into the inner peripheral side and the outer peripheral side of the film 750, and the remaining one slit 7513 is located on the inner peripheral side from the center of the opening 751. The edge portions are formed at 90 ° intervals with respect to the pair of slits 7513. On the other hand, when the plurality of bosses 749B are formed on the inclined surface portion 7446 of the core body 740, a body outer peripheral side portion 7491A and a body inner peripheral side portion 7491B are formed on each boss 749B.

  The positions of the plurality of bosses 749B and the plurality of openings 751 are aligned, all the bosses 749B are inserted into the openings 751, and the boss 749B is pressurized from the distal end side to the proximal end side by using a resin heat caulking device (not shown) to heat The crimp 749 is formed by deforming. Here, at the position on the outer peripheral side of the film 750 with respect to the center of the opening 751, the opening 751 and the body 7491 are arranged so that tension is applied to the film 750 by the edge of the opening 751 being applied to the body 7491. The relative position, the diameter of the opening 751 and the body 7491, the condition of heat caulking, and the like are set.

  As described above, in the device carrier 710 according to this embodiment, the slit 7513 is formed at the edge of the opening 751 of the film 750 into which the body portion 7491 of the caulking 749 is fitted. Here, the slit 7513 is formed in a region on the inner peripheral side of the film 750 (opening inner peripheral side portion 7512) with respect to the center of the opening 751 at the edge of the opening 751, and the center of the opening 751 at the edge of the opening 751. It is not formed in the outer peripheral side region (opening outer peripheral side portion 7511) of the film. As a result, the rigidity of the edge portion of the opening inner peripheral side portion 7512 is lower than the rigidity of the edge portion of the outer opening main side portion 7511, so that the edge portion of the opening inner peripheral side portion 7512 becomes the opening outer periphery side portion. Compared with the edge part of 7511, it bends greatly and the opening 751 will be in the state which covered the trunk | drum part 7491 in the outer peripheral side of the film 750 rather than the center of the trunk | drum 7491. Therefore, sufficient tension can be applied to the film 750, and the positional accuracy of the IC device on the film 750 can be ensured.

  Further, in the device carrier 710 according to the present embodiment, the barrel portion 7491 of the caulking 749 has a semicircular trunk portion outer peripheral side portion 7491A formed in a region on the outer peripheral side of the film 750 from the center of the trunk portion 7491, and A semicircular trunk inner peripheral portion 7491B formed in a region on the inner peripheral side of the film 750 from the center of the trunk portion 7491. The trunk portion inner peripheral side portion 7491B has a smaller diameter than the trunk portion outer peripheral side portion 7491A. On the other hand, the opening 751 of the film 750 is formed in a semicircular shape in a region on the outer peripheral side of the film 751 with respect to the center of the opening 751, and the outer peripheral side portion 7511 of the body portion outer peripheral side portion 7491A is fitted, A semicircular shape is formed in a region on the inner peripheral side of the film 750 from the center, and an opening inner peripheral side portion 7512 into which the barrel inner peripheral side portion 7491B is fitted is provided. The opening inner peripheral side portion 7512 has a smaller diameter than the opening outer peripheral side portion 7511. The slit 7513 is formed at the edge of the opening inner peripheral portion 7512 and is not formed at the edge of the opening outer peripheral portion 7511. According to such a configuration, the edge portion of the opening outer peripheral side portion 7512 is largely bent as compared with the edge portion of the opening outer peripheral side portion 7511, whereby the edge portion of the opening outer peripheral side portion 7511 and the body outer peripheral side portion 7491A. The contact pressure with the peripheral surface becomes larger than the contact pressure between the edge of the opening inner peripheral portion 7512 and the peripheral surface of the trunk inner peripheral portion 7491A. Accordingly, it is possible to realize a state where the opening 751 is applied to the body portion 7491 on the outer peripheral side of the film 750 from the center of the body portion 7491 and sufficient tension is applied to the film 750.

  Further, in the modification shown in FIG. 16, the body portion of the caulking 749 has a semicircular body portion outer peripheral portion 7491 </ b> A formed in a region on the outer peripheral side of the film 750 with respect to the center of the body portion 7491, and a body portion 7491. And a semicircular body inner peripheral side portion 7491B formed in a region on the inner peripheral side of the film 750 from the center. The opening inner peripheral side portion 7512 has a larger diameter than the opening outer peripheral side portion 7511. On the other hand, the opening 751 of the film 750 is formed in a semicircular shape in a region on the outer peripheral side of the film 751 with respect to the center of the opening 751, and the outer peripheral side portion 7511 of the body portion outer peripheral side portion 7491A is fitted, A semicircular shape is formed in a region on the inner peripheral side of the film 750 from the center, and an opening inner peripheral side portion 7512 into which the barrel inner peripheral side portion 7491B is fitted is provided. The slit 7513 is formed at the boundary between the edge of the opening inner peripheral portion 7512 and the edge of the opening outer peripheral portion 7511 and the edge of the opening inner peripheral portion 7512. It is not formed on the edge. According to such a configuration, the edge portion of the opening outer peripheral side portion 7512 is largely bent as compared with the edge portion of the opening outer peripheral side portion 7511, whereby the edge portion of the opening outer peripheral side portion 7511 and the body outer peripheral side portion 7491A. The contact pressure with the peripheral surface becomes larger than the contact pressure between the edge of the opening inner peripheral portion 7512 and the peripheral surface of the trunk inner peripheral portion 7491A. Accordingly, it is possible to realize a state where the opening 751 is applied to the body portion 7491 on the outer peripheral side of the film 750 from the center of the body portion 7491 and sufficient tension is applied to the film 750.

  In the device carrier 710 according to this embodiment, the outer peripheral portion 750 </ b> A of the film 750 is fixed to the bottom surface of the frame portion 744 with the caulking 749 in a state where tension is applied to the film 750. Thereby, the positioning accuracy in the plane and height direction of the small hole 753 of the film 750 can be ensured. In particular, in the device carrier 710 according to the present embodiment, the inclined surface portion 7446 is formed on the bottom surface of the frame portion 744 so as to incline from the inner peripheral side to the outer peripheral side of the bottom surface, and the inclined surface portion 7446 A plurality of crimps 749 are formed. Thus, the outer peripheral portion 750A of the film 750 is fixed to the bottom surface of the frame portion 744 by the caulking 749 in a state where tension is applied to the film 750, and the outer peripheral portion 750A of the film 750 is less than 90 ° with respect to the flat portion 750B. This can be realized by inclining at an angle and applying the opening 751 of the outer peripheral portion 750A to the trunk portion 7491 of the caulking 749. Therefore, the film is more inclined than the case where the inclination angle of the outer peripheral portion 750A of the film 750 with respect to the flat portion 750B is 90 ° or more, or the step portion is formed between the outer peripheral portion 750A and the flat portion 750B of the film 750. Giving tension to 750 and ensuring the positional accuracy of the film 750 can be easily realized.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment includes all design changes and equivalents belonging to the technical scope of the present invention.

  For example, in the above-described embodiment, the bottom portion of the core body 740 is formed with the slope portion 7446 and the crimp portion 749 is formed on the slope portion 7446, whereby the bottom point of the crimp 749 is higher than the bottom point of the film 750. Although set to position, this is not required. The bottom of the core body 740 may be formed horizontally, and the lowest point of the crimp 749 may be set at a position lower than the lowest point of the film 750.

  Moreover, although the sheet | seat which comprises the bottom part of the core 730 was comprised with the film 750, you may comprise this sheet | seat with a thin metal. Furthermore, although the core 730 is mounted on the test tray TST via the body 720, the core 730 may be mounted directly on the test tray TST. In such a case, the core 730 may be attached to the test tray TST so that it can be finely moved (moved) in a plane.

DESCRIPTION OF SYMBOLS 1 Handler 5 Test head 6 Tester 7 Cable 50 IC socket 51 Terminal 55 Positioning pin 100 Test part 101 Apparatus base 102 Tray conveyance apparatus 110 Soak chamber 120 Test chamber 121 Pusher 130 Unsoak chamber 200 Storage part 201 Pre-test stocker 202 Tested Stocker 203 Tray support frame 204 Elevator 205 Tray transfer arm 300 Loader unit 310 Device conveying device 311 Rail 312 Movable arm 320 Movable head 360 Preciseer 370 Window portion 400 Unloader portion 410 Device conveying device 470 Window portion TST Test tray 700 Frame 701 Outer frame 702 Inner frame 703 Opening 710 Device carrier 720 Body 721 Opening 722 Guide groove 730 Core 740 Core body 7 41 Opening 742 Claw part 743 Guide part 744 Frame part
7441 first sidewall
7442 Second side wall
7443 third side wall
7443A opening
7444 4th side wall
7444A opening
7445 plane part
7446 slope
7447 plane part
7448 Stepped portion 745, 746 Positioning plate
7451, 7461 Positioning hole 747, 748 Lever receiving part
747A, 748A Opening 749 Caulking 749B Boss
7491 trunk
7491A Body part outer peripheral side part
7491B Inner circumference side part of trunk
7492 head
7492A horizontal plane 750 film 751 opening
7511 Opening outer periphery side part
7512 Opening inner peripheral part
7513 Slit 752 Opening 753 Small hole 754 Slit 760, 761 Lever

Claims (5)

A carrier for an electronic component test apparatus that holds an electronic device under test in which a plurality of terminals protrude from the bottom surface on a socket provided in the electronic component test apparatus,
A sheet on which the bottom of the carrier is configured, and the electronic device under test is placed so that the plurality of terminals protrude toward the socket;
A main body portion provided on a tray conveyed in an electronic component testing apparatus, wherein the outer peripheral portion of the sheet is fixed by a plurality of crimps;
The caulking is
A trunk protruding from the main body,
A head having a diameter larger than that of the body provided at a front end of the body,
The sheet is
An opening into which the barrel is fitted;
A slit that is formed in a region on the inner peripheral side of the sheet from the center of the opening at the edge of the opening and is not formed in a region on the outer peripheral side of the sheet from the center of the opening at the edge of the opening. A carrier for an electronic component testing apparatus comprising: A carrier for an electronic device test apparatus according to claim 1,
The trunk is
A semicircular body outer peripheral portion formed in a region on the outer peripheral side of the sheet from the center of the body,
Formed in a region on the inner periphery side of the sheet from the center of the body portion, and comprises a semicircular body inner periphery side portion having a smaller diameter than the outer periphery side portion of the body portion,
The opening is
An opening outer peripheral side portion that is formed in a semicircular shape in a region on the outer peripheral side of the sheet from the center of the opening, and into which the body outer peripheral side portion is fitted,
An opening inner peripheral side portion formed in a semicircular shape having a smaller diameter than the opening outer peripheral side portion in the region on the inner peripheral side of the sheet with respect to the center of the opening, and fitted to the inner peripheral side portion of the trunk portion. ,
The slit is a carrier for an electronic component testing device that is formed at an edge of the inner peripheral portion of the opening and is not formed at an edge of the outer peripheral portion of the opening. A carrier for an electronic device test apparatus according to claim 1,
The trunk is
A semicircular body outer peripheral portion formed in a region on the outer peripheral side of the sheet from the center of the body,
Formed in a region on the inner periphery side of the sheet from the center of the body portion, and comprises a semicircular body inner periphery side portion having a larger diameter than the body outer periphery side portion, and
The opening is
An opening outer peripheral side portion that is formed in a semicircular shape in a region on the outer peripheral side of the sheet from the center of the opening, and into which the body outer peripheral side portion is fitted,
A semicircular shape in the inner peripheral side region of the sheet with respect to the center of the opening in the opening, the inner peripheral side portion of the opening to which the inner peripheral side portion of the body is fitted, and
The slit is formed at a boundary between an edge of the opening inner peripheral portion and an edge of the opening outer peripheral portion, and an edge of the opening inner peripheral portion, and an edge of the opening outer peripheral portion A carrier for electronic component testing equipment that is not formed. A carrier for an electronic component testing apparatus according to any one of claims 1 to 3,
The sheet is a carrier for an electronic component testing apparatus in which the outer peripheral portion is fixed to the main body portion by the plurality of crimps in a state where tension is applied. A carrier for an electronic device test apparatus according to any one of claims 1 to 4,
An inclined surface is formed on the bottom surface of the main body portion so as to be inclined from the inner peripheral side to the outer peripheral side of the bottom surface,
A carrier for an electronic component testing apparatus, wherein the plurality of crimps are formed on the slope.