JP2007040926A - Prober - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a prober capable of measuring one chip semiconductor device to make a large current flow as a high voltage is impressed, at high through put. <P>SOLUTION: This prober with a terminal of each tester connected to an electrode of the one chip semiconductor device 5, in order to inspect the semiconductor device, is provided with probes 43, 44 arranged to correspond to the electrode of the semiconductor device, connected to the terminal of the each tester, and for connecting the electrode electrically to the terminal of the tester by contacting with the electrode, a chuck stage 20 for holding the plurality of one chip semiconductor devices, and moving and rotation mechanisms 15-18 for moving and rotating the chuck stages. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a prober used to inspect a semiconductor device with a tester, and more particularly to a prober used to inspect a one-chip semiconductor device.

  The semiconductor manufacturing process has a large number of processes, and various inspections are performed in various manufacturing processes in order to guarantee quality and improve yield. For example, when a plurality of chips of a semiconductor device (device) are formed on a semiconductor wafer, the device electrodes of each chip are connected to a tester, power and test signals are supplied from the tester, and signals output from the device are output. Wafer level inspection is performed in which a tester is used to electrically inspect whether the device operates normally.

  After wafer level inspection, the wafer is affixed to the frame and cut into individual chips with a dicer. For each chip that has been cut, only chips that have been confirmed to operate normally are packaged in the next assembly process, and defective chips are excluded from the assembly process. Further, the packaged final product is subjected to shipping inspection.

  In wafer level inspection, a wafer is held by a prober, a probe connected to a terminal of a tester is brought into contact with an electrode of each chip of the wafer, and a power and a test signal for electrical inspection are supplied to each chip from the tester. An output signal from each chip is detected to determine whether it operates normally. The wafer level inspection is described in Patent Documents 1 and 2, for example.

  Semiconductor devices (devices) such as power transistors, IGBTs (Insulated Gate Bipolar Transistors), LEDs, semiconductor lasers, etc., operate as one device is formed on one chip and a high voltage is applied during operation to allow a large current to flow. It is necessary to apply a high voltage and flow a large current also when measuring characteristics. In such a device, an electrode is generally formed on the upper surface of the wafer, and the back surface of the wafer also functions as an electrode. For example, in the IGBT, the back surface of the wafer functions as a collector. FIG. 1 is a diagram schematically showing the configuration of an IGBT chip. As shown in the figure, an IGBT is formed on the wafer 1, an electrode 2 connected to the gate G of the IGBT and an electrode 3 connected to the emitter E are formed on the front surface of the wafer 1, and the collector C of the IGBT is the back surface of the wafer 1. Corresponding to

  When performing wafer level inspection of a device in which the back surface of the wafer as described above functions as an electrode and applies a high voltage to pass a large current, if the wafer is warped, the wafer is attracted to the chuck stage of the prober and held. In this case, the back surface of the wafer may not be in contact with the conductive surface of the chuck stage, resulting in a problem that measurement cannot be performed.

  In addition, since a number of devices are formed adjacent to each other on the wafer, when measuring a certain device, there is a problem that the presence of other adjacent devices affects the measurement and an accurate measurement cannot be performed. This is a problem particularly when a large current is passed or when measuring AC characteristics.

  In view of this, with respect to the devices as described above, after a wafer is diced and divided into chips, a one-chip device is inspected. As an apparatus for this purpose, for example, a chip sorter or a chip handler is known.

Japanese Patent Laid-Open No. 10-150081 JP 2002-170855 A

  Semiconductor devices such as power transistors, IGBTs, LEDs, and semiconductor lasers have been increasingly increased in voltage and current. For example, in-vehicle devices have been mainly used for control systems until now, but recently, electric vehicles and hybrid cars that use motors for driving have been developed, and semiconductor devices that can drive large currents at high voltages are required. Yes. For example, an IGBT having a driving current of 100 A or more is required.

  When measurement is performed with a chip sorter, a chip handler, or the like, a manipulator type probe head is used, and a spring pin that urges the probe with a spring is brought into contact with the chip electrode to pass a current. However, the spring pin has a structure in which the probe and the cylindrical guide cylinder on which the probe slides are in point contact, so that a very large current cannot flow, the limit is 30 to 100 A, and the above-mentioned demand of 100 A or more is required. There is a problem that cannot be satisfied.

  Therefore, it is conceivable to use a stylus (probe) used in a prober or the like, which itself has a spring property. However, the stylus is a thin member, and the current that can be flown is limited. In addition, since the contact area between the stylus and the tip electrode is small, the current that can be flowed is also limited. Therefore, it is conceivable to increase the total current that can be supplied by increasing the number of probes. However, chip sorters, chip handlers, etc. have insufficient positioning accuracy of the device and the area of the chip electrode is limited, so the number of styluses cannot be increased so much and the current cannot be increased sufficiently. There's a problem.

  Furthermore, the chip sorter and the chip handler fix the device supplied one by one, move it to the measurement position of the electrode position, measure and align the position of the chip electrode, then move to the measurement position and move the stylus Is measured after contacting the chip electrode. Therefore, since it is necessary to move between the measurement positions of the electrode positions for each device, it takes a long time to measure one device, and the throughput is low. was there.

  The present invention solves such a problem, and an object of the present invention is to realize a prober capable of measuring a one-chip semiconductor device (device) that applies a high voltage and applies a large current with a high throughput.

  In order to achieve the above object, the prober of the present invention is configured such that the chuck stage holds a plurality of one-chip semiconductor devices (devices).

  That is, the prober of the present invention is a prober for connecting a terminal of each tester to an electrode of the semiconductor device in order to inspect the one-chip semiconductor device (device) with a tester. A plurality of probes arranged in correspondence with the electrodes and connected to the terminals of the tester to electrically connect the electrodes to the terminals of the tester by contacting the electrodes, and a plurality of one-chip semiconductor devices It is characterized by comprising a chuck stage to be held, and a moving and rotating mechanism for moving and rotating the chuck stage.

  According to the prober of the present invention, the chuck stage holds a plurality of one-chip devices. Therefore, after measuring the chip electrode positions of all the held devices and sequentially measuring them, one chuck Since it is not necessary to move between the measurement positions of the electrode positions for each device, the throughput is improved.

  In order to perform highly accurate alignment, it is necessary to provide an alignment imaging device that detects the positions of the electrodes of a plurality of devices held on the chuck stage with high accuracy, and a probe alignment imaging device that detects the position of the probe.

  The probe can increase the current that can be flowed by providing a plurality of styluses (probes) that themselves have a spring property. However, by enabling particularly accurate alignment, the number of styluses can be increased to increase the current. It can flow.

  When measuring a device having electrodes on the surface, the chuck stage includes a plurality of conductive surfaces insulated from each other, and holds the back surface of each device in contact with each conductive surface.

  With such a configuration, each device is insulated from other held devices, and a high current is applied by applying a high voltage and an AC characteristic can be measured accurately.

  In addition, the probe includes a pin that contacts the conductive surface of the chuck stage to connect the electrode and tester corresponding to the back of the device. Since the conductive surface of the chuck stage can have a large area, the number of pins can be increased so that a large current flows as a whole. Therefore, the pin can be realized by a spring pin. Of course, it is also possible to realize with a stylus (probe) having a spring property as described above.

  The chuck stage includes a suction mechanism that sucks a plurality of devices. It is desirable that the adsorption mechanism can adsorb a plurality of devices independently. However, as the number of devices to be held increases, the adsorption mechanism becomes complicated, so two or more devices may be adsorbed simultaneously. Good. When the suction mechanism is a vacuum suction mechanism, it is necessary that all of the plurality of devices sucked by each suction mechanism are held on the chuck stage. A dummy chip may be held when an empty portion is generated due to the relationship between the number of semiconductor devices to be measured and the number of holding portions. Further, the holding portion of the chuck stage may be divided into a plurality of groups, and the devices of each group may be sucked in common and sucked independently for each group.

  In addition, the chuck stage preferably includes a suction state detection unit that detects whether a plurality of devices are sucked. For example, the adsorption state detecting means is provided with a plurality of pins on the holding surface of the chuck stage, and when the device is correctly adsorbed to the chuck stage, the pins come into contact with the back surface of the device, and the plurality of pins are connected via the back surface of the device. It is configured to conduct, and the adsorption state can be confirmed by detecting conduction between pins. Further, when using the vacuum suction mechanism, it is possible to detect whether the device is correctly sucked on the chuck stage by detecting the negative pressure in the vacuum path.

  The chuck stage preferably includes positioning means for defining holding positions of a plurality of devices. As described above, an alignment imaging device and a probe alignment imaging device are provided to enable accurate alignment. However, in order to facilitate the position measurement of the chip electrode by the alignment imaging device, the device has a certain error range. It is desirable to be positioned and arranged within. Since the end face of the chip of the device cut by the dicer has a certain degree of positional accuracy, the positioning means may make the holding part of the surface of the chuck stage slightly lower than the periphery and use the wall as a reference position or the chuck stage. This can be realized by providing a positioning member on the surface of the chip and bringing the end face of the chip into contact therewith.

  Since semiconductor devices such as power transistors, IGBTs, LEDs, and semiconductor lasers, especially semiconductor devices for vehicles, are used under severe usage conditions, the chuck stage is equipped with a chuck stage so that inspection under such conditions is possible. It is desirable to provide heating means for raising the temperature of the held devices and / or cooling means for lowering the temperature of the held devices.

  According to the present invention, a one-chip semiconductor device (device) that applies a high voltage to flow a large current can be measured with high throughput.

  FIG. 2 is a diagram showing an overall configuration of a prober for measuring the IGBT device according to the embodiment of the present invention. As shown in FIG. 2, the prober according to the present invention includes a casing composed of a bottom plate 11, side plates 12, 13, and a top plate 14, a three-axis and rotational movement mechanism provided on the bottom plate 11, and a rotational movement mechanism. The chuck stage 20 provided on the probe, the probe alignment imaging device 60 for detecting the position of the probe provided on the rotational movement mechanism, the probe unit 40 provided on the top 14, and the semiconductor provided on the top 14. And an imaging device for alignment 50 that detects the position of the chip electrode of the device (device) with high accuracy. The rotational movement mechanism includes a first moving table 16 that moves in the first direction with respect to the base 15, a second moving table 17 that moves in the second direction with respect to the first moving table 16, and a second moving table 17. And a moving rotating cylinder 18 that moves and rotates in a third direction (vertical direction). The chuck stage 20 is disposed on the movable rotating cylinder 18 and can rotate in three axial directions.

  The alignment imaging device 50 images the surface of the one-chip semiconductor device 5 held on the chuck stage 20 and detects the position of the chip electrode. The alignment imaging device 50 includes a microscope and a high-resolution imaging device in order to detect the position of the chip electrode with high accuracy, and processes the obtained image to detect the position of the chip electrode.

  The probe matching imaging device 60 images the stylus (probe) provided in the probe unit 40 and detects the tip position of the stylus. As will be described later, the stylus is composed of a large number of, for example, 100 needles provided close to each other, and each needle is a thin conductive needle having its own spring property.

  When the probe unit 40 (probe card) is replaced, the probe alignment imaging device 60 is moved under the stylus to photograph the stylus and detect the tip position of the stylus. This operation may be basically performed when the probe card is replaced, but is appropriately performed because a failure such as deformation of the stylus may occur during the inspection.

  When the device 5 is held on the chuck stage 20, each device 5 is moved below the alignment imaging device 50 to detect the position of the chip electrode of the device 5. Then, after the chuck stage 20 is rotated and moved in the X-axis and Y-axis directions so that the tip electrode of the device 5 coincides with the probe tip position detected as described above, it rises in the Z-axis direction. The probe is brought into contact with the tip electrode.

  The above configuration is the same as the basic configuration of a conventional prober, and the features of the prober of the present invention are the portions described below. In other words, the present invention is not limited to the basic configuration of the above embodiment, and can be applied to a prober having any basic configuration.

  3A and 3B are diagrams illustrating the configuration of the chuck stage 20 and the probe unit 40 of the prober according to the embodiment of the present invention. FIG. 3A is a cross-sectional view, and FIG. 3B is a top view of the chuck stage 20.

  As shown in FIG. 3, the chuck stage 20 is provided so as to cover the stage base 26 fixed to the movable rotating cylinder 18, the first intermediate member 25 provided on the stage base 26, and the first intermediate member 25. A second intermediate member 23 and a stage member 21 provided on the second intermediate member 23. The stage member 21 is made of ceramic, and is provided with five conductive portions 22 as shown in FIG. Since the five conductive portions 22 are separated by the ceramic material, they are insulated from each other. A one-chip device 5 to be measured is placed in the center of each conductive portion 22. A portion where the device 5 is placed is provided with a plurality of holes 31, for example, four holes, so as to penetrate the conductive portion 22 and the stage member 21. The plurality of holes 31 extend through the second intermediate member 23 to the cavity 34 in the first intermediate member 25. A heater 24 is provided on the upper surface portion of the first intermediate member 25 in contact with the second intermediate member 23, and a plurality of holes are provided so as to avoid the heater 24.

  The cavities 34 corresponding to the respective conductive portions 22 are connected to the vacuum ports 36 via the vacuum paths 35 provided in the first intermediate member 25 and the second intermediate member 23. Each of the vacuum ports 36 is connected to a vacuum mechanism, and by operating the corresponding vacuum mechanism, the inside of the cavity 34 and the plurality of holes 31 of the corresponding conductive portion 22 can be evacuated. Thereby, the one-chip device 5 placed on the surface of the conductive portion 22 can be vacuum-sucked.

  A plurality of conductive spring pins 32 are provided in the plurality of holes 31 so as not to contact the inner walls of the holes. The plurality of spring pins 32 are arranged such that one end is slightly higher than the surface of the conductive portion 22, and the other end is connected to the contact detection circuit 33. The contact detection circuit 33 detects whether the plurality of spring pins 32 are in a conductive state with each other. When the one-chip device 5 is vacuum-sucked with sufficient force, the plurality of spring pins 32 come into contact with the back surface of the one-chip device 5 and are connected via the resistance component on the back surface of the one-chip device 5. It becomes a state. On the other hand, when the one-chip device 5 is not present or is not vacuum-adsorbed with a sufficient force, the plurality of spring pins 32 are not in contact with the back surface of the one-chip device 5, so that the plurality of spring pins 32 are insulated. It is. The contact detection circuit 33 determines whether the resistance of the closed circuit formed by the plurality of spring pins 32 is a predetermined value or less. When the resistance of the closed circuit is less than or equal to a predetermined value, it is determined that the one-chip device 5 is vacuum-sucked with a sufficient force, and the back surface of the one-chip device 5 is sufficiently in contact with the conductive portion 22. . On the contrary, when the resistance of the closed circuit is equal to or greater than a predetermined value, it is determined that there is no one-chip device 5 or that the vacuum suction is not performed with a sufficient force. As described above, since the back surface of the IGBT operates as a collector, it is necessary that the back surface of the one-chip device 5 is sufficiently in contact with the conductive portion 22 in order to perform the measurement. Since the measurement cannot be performed when the value is greater than or equal to a predetermined value, measures such as removal from the measurement or resetting so that the resistance of the closed circuit is equal to or lower than the predetermined value are performed.

  When inspecting a device that requires an operation inspection at a high temperature, the stage member 21 is heated by the heater 24 and the held device 5 is overheated for the inspection. Further, in the case of performing inspection at a low temperature, a cooling mechanism is provided instead of the heater 63. It is also possible to provide both the heater 24 and the cooling mechanism.

  The probe unit 40 includes a ring member 42 provided with two sets of styluses (probes) 43 that are in contact with the chip electrodes on the surface of the one-chip device 5, and four springs that are in contact with the surface of the conductive unit 22. A pin 44, a guard 41 to which the ring member 42 and the four spring pins 44 are fixed, a probe card 45 to which the guard 41 is attached, and an attachment member 46 to which the probe card 45 is detachably attached are attached. The member 46 is attached to the top plate 14. Three conductive lines of the probe card 45 are provided, one end of the conductive line is connected to a test head of the tester, and the other end of the two conductive lines is two sets of styluses via a ring member 42 and a guard. Connected to (probe) 43, the other end of one conductive wire is connected to four spring pins 44 in common. The probe card 45 is replaced according to the device to be inspected.

  Each set of styluses 43 is formed by arranging a large number of styluses that are widely used in wafer probers or the like and have a spring property so that their tips come into contact with the chip electrodes. The stylus 43 must be in contact with the tip electrode, and the arrangement of the tip portion is determined in consideration of the tip electrode shape and alignment error. For example, even if a single stylus can only flow a current of 3A, a large current of 300A can flow in total by providing 100 styluses.

  The four spring pins 44 are in contact with the surface of the conductive portion 22 of the stage member 21. 44 'of FIG. 3 shows the position of the surface of the electroconductive part 22 which the spring pin 44 contacts. As described above, the back surface of the device 5 is in contact with the surface of the conductive portion 22, and the back surface of the device 5, that is, the collector is in a state of being connected to the test head via the four spring pins 44. Can be done. As described above, the spring pin cannot pass a very large current, but by using the four spring pins 44, a current that is four times larger can be passed. Since the area of the portion of the conductive portion 22 where the device 5 is not placed is large, the number of spring pins 44 can be further increased. When a larger current needs to flow, the number of spring pins 44 is further increased.

  When performing the inspection, first, the chuck stage 20 is moved to the chip transfer position, and the five devices 5 are placed on the five conductive portions 22. A vacuum mechanism connected to the vacuum port 36 is operated in a state where the five devices 5 are placed, and the five devices 5 are sucked. At this time, it is determined whether the resistance of the closed circuit formed by the plurality of spring pins 32 provided corresponding to each conductive portion 22 is equal to or less than a predetermined value. If it is above the specified value, reset it.

  Next, in a state where the five devices 5 are attracted, each device 5 moves so as to be positioned under the imaging device 50 for alignment, and the position of the chip electrode of the device 5 is detected. It is assumed that the position of the stylus 43 has been measured in advance.

  First, the chuck stage 20 is moved (aligned) so that the tip electrode of the device 5 to be inspected is located immediately below the stylus 43, the chuck stage 20 is raised, and the stylus 43 becomes the tip electrode of the device 5. Make contact. At this time, the four spring pins 44 also contact the surface of the conductive portion 22. In this state, voltage is applied to the stylus 43 and the spring pin 44 to perform measurement.

  After the inspection of the first device 5 is completed, the other devices 5 are also inspected by performing alignment and contact with the stylus 43 based on the position detection result of the chip electrode.

  In the prober according to the embodiment of the present invention, the conductive portion 22 that is in contact with each device is insulated from the conductive portion 22 that is in contact with other devices by a ceramic member. Measurement can be performed. Moreover, since the stylus 43 is composed of a plurality of styluses, a large current can flow as a whole. In the present invention, as in a conventional wafer prober, alignment is performed based on the positions of the tip electrode and the stylus 43 detected by the alignment imaging device 50 and the probe alignment imaging device 60, so that accurate alignment is possible. It is possible to arrange a large number of styluses corresponding to the area of the chip electrode, and it is possible to flow a very large current as a whole.

  Further, since the alignment and inspection of each device are continuously performed after the positions of the chip electrodes of the five devices 5 placed on the chuck stage 20 are collectively detected, detection of the chip electrode position for each device, The throughput is improved as compared with the alignment and inspection.

  In addition, since the chuck stage 20 includes a heating mechanism and a cooling mechanism, the inspection can be performed under a wide range of usage environment conditions required for the device.

  As mentioned above, although the Example of this invention was described, it cannot be overemphasized that various modifications are possible. Hereinafter, some of the modified examples will be described.

  FIG. 4A is a view showing a modified example of the chuck stage 20. The chuck stage 20 shown in FIG. 3 is provided with a conductive portion 22 in a portion where a ceramic stage member 21 is dug. In other words, the surface positions of the stage member 21 and the conductive portion 22 are the same. In contrast, in the modification of FIG. 4A, the surface of the ceramic stage member 21 is a flat surface, and the conductive portion 22 is formed thereon.

  When the position of the chip electrode of the device 5 is detected by the alignment imaging apparatus 50, an image including the chip electrode is processed to detect the chip electrode. Therefore, it is necessary to process an image in a range where the chip electrode is located, and in order to increase the processing speed and accuracy, it is desirable to make the image range to be processed as small as possible. Therefore, it is desired to reduce the position error of the chip electrode. Although the device 5 is cut by a dicer, since the cutting position is determined by image processing even when cutting by the dicer, the position of the edge of the device has considerable positional accuracy with respect to the chip electrode.

  Therefore, in the modification shown in FIG. 4B, a placement portion 23 in which the conductive portion 22 is dug is provided, and the device 5 is placed on the placement portion 23 as illustrated. Since the device 5 is placed in contact with two orthogonal walls of the placement portion 23, an error in the placement position of the device 5, that is, the position of the chip electrode can be reduced.

  In the modification shown in FIG. 4B, the conductive portion 22 is dug and the placement portion 23 is provided, but a member that defines the edge position of the device 5 may be attached on the conductive portion 22. Is possible.

  In the above embodiment, each device 5 is adsorbed independently. Therefore, it is also possible to perform inspection by placing four or less devices on the chuck stage. However, in order to attract each device 5 independently, it is necessary to provide a plurality of (here, five) independent cavities, vacuum paths, and vacuum mechanisms corresponding to the conductive portions 22 as shown in FIG. There is a problem that the apparatus becomes complicated. As the number of devices that can be held increases, the throughput improves. However, in the configuration of the embodiment, the apparatus becomes complicated, so the number of conductive portions 22, that is, the number of devices that can be held, cannot be made too large. .

  FIG. 5 is a view showing a modification in which 52 conductive portions 22 are provided on the stage member 21. In this modification, the stage member 21 is divided into four regions A, B, C, and D, and 13 conductive portions 22 are provided in each region, and are placed on the conductive portions 22 in each region. Thirteen devices are adsorbed in common. In other words, the cavity and the vacuum path provided corresponding to the conductive portion 22 are commonly connected to each region, and are brought into a vacuum state by the same vacuum mechanism. Therefore, it cannot be adsorbed unless the device is placed on all of the 13 conductive portions 22 in each region. When the number of devices to be inspected is smaller than the number of conductive portions in the region, for example, a dummy device may be placed and sucked.

  Further, in the above embodiment, the resistance value of the closed circuit formed by the plurality of spring pins 32 is detected to detect the suction state of the device. For example, the negative pressure in the vacuum path when the vacuum mechanism is operated is detected. It is also possible to detect the adsorption state of the device by measuring. In this case, it is not necessary to provide the plurality of spring pins 32 and the contact detection circuit 33.

  For example, the stage member 21 may be detachable as long as the plurality of spring pins 32 and the contact detection circuit 33 are not provided. In this case, when the stage member 21 is placed on the second intermediate member 23, the vacuum hole of the stage member 21 and the vacuum hole of the second intermediate member 23 need to be connected. In addition, the conductive portion 22 performs positioning of the device as shown in FIG. 4B, and guide members that prevent the placed device from moving (the placement portion 23 in FIG. 4B). Side wall).

  By making the stage member 21 detachable, it is possible to place a plurality of devices just by placing the stage member 21 on which a plurality of devices are placed outside the prober, compared to the case where the devices are placed one by one. Throughput is improved.

  The present invention can be applied to any prober that inspects a chip-like semiconductor device.

It is a figure which shows electrode arrangement | positioning of IGBT formed in the wafer. It is a figure which shows the whole structure of the prober of the Example of this invention. It is a figure which shows the structure of the chuck | zipper stage and probe card | curd part of the prober of an Example. It is a figure which shows the modification of a chuck | zipper stage. It is a figure which shows the modification of a chuck | zipper stage.

Explanation of symbols

5 Device 20 Chuck stage 21 Stage member 22 Conductive part 43 Contact needle 44 Spring pin

Claims (15)

A prober for connecting a terminal of each tester to an electrode of the semiconductor device in order to inspect the one-chip semiconductor device with a tester,
A probe which is arranged corresponding to the electrode of the one-chip semiconductor device and is connected to the terminal of the tester and electrically connects the electrode to the terminal of the tester by contacting the electrode;
A chuck stage for holding a plurality of the one-chip semiconductor devices;
A prober comprising: a moving rotation mechanism for moving and rotating the chuck stage.   2. The prober according to claim 1, wherein the probe includes at least one pair of styluses that contact an electrode on a surface of the semiconductor device, and each set of the stylus includes a plurality of styluses that contact the same electrode. . The one-chip semiconductor device is a semiconductor device having electrodes on the front surface and electrodes on the back surface,
The prober according to claim 1, wherein the chuck stage includes a plurality of conductive surfaces insulated from each other, and holds the back surface of each semiconductor device in contact with each conductive surface.   The prober according to claim 3, wherein the probe includes a pair of pins that contact the conductive surface of the chuck stage.   The prober according to claim 4, wherein the pin is a spring pin.   The prober according to claim 1, wherein the chuck stage includes a suction mechanism that sucks the plurality of semiconductor devices.   The prober according to claim 6, wherein the adsorption mechanism is capable of independently adsorbing the plurality of semiconductor devices.   The prober according to claim 6, wherein the adsorption mechanism adsorbs two or more semiconductor devices simultaneously.   The prober according to claim 6, wherein the chuck stage includes an adsorption state detection unit that detects whether the plurality of semiconductor devices are adsorbed.   The prober according to any one of claims 1 to 9, wherein the chuck stage includes positioning means for defining holding positions of the plurality of semiconductor devices.   11. The prober according to claim 1, wherein the chuck stage includes a heating unit that raises the temperature of the plurality of held semiconductor devices.   12. The prober according to claim 1, wherein the chuck stage includes a cooling unit that lowers the temperature of the plurality of held semiconductor devices.   The prober according to any one of claims 1 to 12, further comprising an alignment imaging device that detects positions of electrodes of the plurality of semiconductor devices held on the chuck stage.   The prober according to any one of claims 1 to 13, wherein the prober includes an imaging device for probe alignment that detects a position of the probe.   The prober according to any one of claims 1 to 14, wherein the moving and rotating mechanism includes a mechanism that independently moves the chuck stage in three axial directions.

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