JPH0513524A - Method for inspecting semiconductor element - Google Patents

Abstract

PURPOSE:To provide a semiconductor element inspecting method which can easily and efficiently perform environmental tests on a semiconductor element while the element is maintained in the state of a semiconductor wafer. CONSTITUTION:An inspecting jig 1 is provided with a tray 3 for supporting a semiconductor wafer 2 on which a large number of semiconductor elements (semiconductor chips) are formed. On the tray 3, a lid body 5 on which probes 4 are arranged in corresponding to the electrode pads of all semiconductor elements formed on the wafer 2. An electrode terminal 6 on which electrode terminals electrically connected to each probe 4 are arranged is provided at a prescribed part, for example, on the side of the lid body 5. The lid body 5 is provided with spacers 7 and clamping mechanisms 8. The tray 3 is carried into an oven for environmental tests, with the lid body 5 being fixed to the tray 3 by means of the clamping mechanisms 8.

Description

Detailed Description of the Invention

[Object of the Invention]

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device inspection method.

[0003]

2. Description of the Related Art Generally, a large number of semiconductor elements are simultaneously formed on a semiconductor wafer by a precision photo transfer technique or the like, and then cut into semiconductor elements (semiconductor chips) along scribe lines.

In the manufacturing process of such a semiconductor element, conventionally, a so-called wafer prober and a tester have been used to inspect the electrical characteristics of the semiconductor element in a state of a semiconductor wafer (before cutting), and a so-called handler and tester are used. Inspection of electrical characteristics of semiconductor elements after packaging is performed.

In addition, for example, in an environmental test for inspecting a change in electrical characteristics for a long time (for example, several tens of hours) under a high temperature environment or a low temperature environment, for example, using a tray having a large number of IC sockets arranged, This is done only for the semiconductor element after the IC terminal is inserted into the socket and packaged. This is because the environmental test requires a long time as described above, and therefore it is practically impossible to perform the environmental test in the state of the semiconductor wafer before cutting into chips using a wafer prober or the like in terms of throughput. is there. That is, when performing an environmental test on a semiconductor device after packaging, the environmental test is performed on several thousand to tens of thousands of semiconductor devices at the same time using the above-mentioned tray, etc. When an environmental test is performed, it takes, for example, several tens of hours to perform an environmental test on one semiconductor wafer (for example, several tens to hundreds of semiconductor elements are formed) with one wafer prober. This is because, in order to simultaneously perform the above semiconductor device, several tens to several hundreds of wafer probers are required, which is difficult in reality.

[0006]

However, as is well known, in recent years, for example, a mounting method such as directly attaching a semiconductor element (chip) to a substrate without packaging (eg, T
(AB, etc.) has been developed, and in such a case, since the semiconductor element is not packaged, terminals that can be inserted into the sockets are not used and the above-described environmental test cannot be performed. In addition, for example, when a semiconductor element (semiconductor chip) is mounted on a substrate and then an environmental test is performed, if the semiconductor element fails, it is not possible to easily replace only the semiconductor element, resulting in failure of the entire substrate, resulting in a reduction in manufacturing cost. It is not preferable from the viewpoint.

The present invention has been made in response to such a conventional situation, and a method of inspecting a semiconductor element capable of easily and efficiently performing an environmental test of a semiconductor element in a state of a semiconductor wafer. Is to provide.

[Structure of Invention]

[0009]

That is, a method of inspecting a semiconductor device according to the present invention corresponds to a wafer support on which a semiconductor wafer is provided and electrode pads of a plurality of semiconductor devices formed on the semiconductor wafer. The inspection jig provided with a lid in which a probe is arranged and an electrode terminal for electrically connecting the probe and an electrical measuring device is used, and the inspection jig provided on the wafer support is used. The lid is fixed on the support so that each of the electrode pads of the semiconductor wafer and the probe come into contact with each other, and in this state, the inspection jig is placed under a predetermined inspection environment to A method of inspecting a semiconductor device, characterized in that electrical characteristics of the semiconductor device are measured through a terminal and the probe.

[0010]

[Operation] According to the semiconductor element inspection method of the present invention having the above-described structure, it is possible to easily and efficiently carry out the environmental test of the semiconductor element in the state of the semiconductor wafer, which could not be conventionally performed. ..

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 1, the inspection jig 1 is formed in a rectangular plate shape, for example, as a support for supporting a semiconductor wafer 2 on which a large number of semiconductor elements (semiconductor chips) to be inspected are formed. The semiconductor wafer 2 is configured to be placed at a predetermined position on the tray 3.

Further, on the tray 3, a plate-like member having a size substantially the same as that of the tray 3 is formed, and probes (search probes) corresponding to the electrode pads of all the semiconductor elements formed on the semiconductor wafer 2 are formed. The lid 5 on which the needles 4 are arranged is the tray 3
It is placed so as to cover the top. An electrode terminal 6 in which electrode terminals electrically connected to the respective probes 4 are arranged is provided at a predetermined portion of the lid body 5, for example, on a lateral side, and an external electrical terminal is provided through the electrode terminal 6. The measuring device (for example, a tester described later) and each probe 4 are electrically connected.

Further, the lid 5 is provided with a clamp mechanism 8 which is configured to be rotatable around a fulcrum 8a as shown by an arrow in the figure by the action of a spacer 7 and a spring (not shown) and which elastically holds the tray 3. ing. The spacer 7 holds the lid 5 and the tray 3 so that the distance between them does not become less than a predetermined distance, and the clamp mechanism 8 detachably holds the lid 5 and the tray 3 integrally at a predetermined pressure. It is configured as follows.

That is, when performing an inspection with a probe device or the like in the related art, there is a variation in the height of the needle tip, so that there is a certain distance and a certain pressure from the position where the needle tip of the probe contacts the electrode pad. By applying so-called overdrive that presses the probe and the electrode pad, the probe and the electrode pad are surely brought into electrical contact with each other. In this embodiment, by pressing the clamp mechanism 8 to overdrive and limiting the amount of overdrive by the spacer 7, each probe 4 and the semiconductor wafer are in the same state as in the above overdriving state. It is configured to make contact with the second electrode pad.

The spacer 7 and the clamp mechanism 8 can be modified in various ways. For example, they are provided not on the lid 5 side but on the tray 3 side, or are constructed separately from the lid 5 and tray 3. You can also do it. Further, as the fixing method, for example, a mechanical clamp mechanism, a screw fixing mechanism, or the like can be used. However, since it is necessary to fix the lid body 5 and the tray 3 in a state where they are accurately positioned, there is a degree of freedom that the relative position between the lid body 5 and the tray 3 can be moved to some extent before fixing. And, after being fixed, these relative positions must be immovable. Also,
In the present embodiment, all the semiconductor elements formed on the semiconductor wafer 2 are electrically inspected.
The lid 5 having the probes 4 corresponding to the electrode pads of all the semiconductor elements formed on the substrate is used. However, for example, when some semiconductor elements on the semiconductor wafer 2 may be electrically inspected, the inspection is performed. You may use what provided the probe 4 only with respect to the semiconductor element to implement.

The tray 3 and the lid 5 are brought into contact with each other in a state where each probe 4 provided on the lid 5 is accurately positioned so as to surely come into contact with each electrode pad on the semiconductor wafer 2, and a clamp mechanism is provided. It is conveyed in a state of being fixed by 8, and accommodated in, for example, an oven or the like, and an environmental test is performed.

FIG. 2 shows the construction of an automatic inspection apparatus for automatically performing an electrical inspection of semiconductor elements on a semiconductor wafer 2 using the inspection jig 1. As shown in the figure, the automatic inspection device 10 includes a wafer housing portion 11, a tray housing portion 12, and a lid housing portion 13, which each house a plurality of semiconductor wafers 2, trays 3, and lid bodies 5, for example, in a shelf shape. Each of these accommodating parts is provided with a wafer transfer mechanism 14, a tray transfer mechanism 15, and a lid transfer mechanism 16 for loading and unloading the semiconductor wafer 2, the tray 3, and the lid 5 into and from the respective accommodating parts. ing.

A tray 3 is provided on the side of each of the above-mentioned transfer mechanisms.
For example, a belt transport mechanism 17 is provided as a transport mechanism capable of sequentially transporting a plurality of the like.
A position recognizing unit 18 for recognizing the positions of the semiconductor wafer 2 and the lid 5 and the like along the transport path of, for example, image analysis or the like.
A clamp assembly mechanism section 19 for assembling the tray 3 and the lid body 5; and an assembly transport mechanism 20 for transporting the assembled tray 3, lid body 5 and semiconductor wafer 2 (assembly).
A large number of this assembly can be housed, for example, in the shape of a shelf, and an oven 21 for an environmental test is provided, which is capable of maintaining the inside thereof in a predetermined environment, for example, a predetermined temperature.

In the automatic inspection apparatus 10 having the above structure, first,
The tray 3 is taken out from the tray accommodating section 12 by the tray transfer mechanism 15, and the tray 3 is transferred to the belt transfer mechanism 17.
Place it in the specified position above.

Next, the semiconductor wafer 2 in the wafer housing 11 is taken out by the wafer transfer mechanism 14 and rough positioning is performed by, for example, detecting the position of the orientation flat of the semiconductor wafer 2, and the semiconductor wafer 2 Is placed at a predetermined position on the tray 3.

Thereafter, the position recognizing section 18 recognizes the accurate position of the semiconductor wafer 2 (electrode pad) on the tray 3 by taking an image with a CCD camera or the like, and then the belt conveying mechanism 17 is moved to a predetermined distance. Move this tray 3
Then, the semiconductor wafer 2 is transferred to the clamp assembly mechanism section 19.

At the same time as the above operation, the lid transport mechanism 1
The lid body 5 in the lid body accommodating portion 13 is taken out by 6, and the position recognizing portion 18 similarly recognizes the accurate position of the lid body 5 (probe 4). Transport to 19.

Based on the position recognition result, the lid assembly 5 is placed on the tray 3 in the clamp assembly mechanism section 19 so that the probe 4 can accurately contact each electrode pad on the semiconductor wafer 2, The clamp mechanism 8 of No. 5 is hung on the tray 3 and the semiconductor wafer 2 is sandwiched between
And Tray 3 are fixed.

Thereafter, the belt transfer mechanism 17 is moved by a predetermined distance, the assembly including the lid 5, the tray 3 and the semiconductor wafer 2 is carried out from the clamp assembly mechanism section 19, and the assembly transfer mechanism 20 carries out the assembly. Is placed in the oven 21. The oven 21 is configured so that a plurality of, for example, dozens of assemblies can be housed in a shelf shape, and a plurality of the ovens 21 are arranged. In addition, an electric connection mechanism (not shown) is provided inside the oven 21 corresponding to the electrode terminal 6 provided on the lid 5, and the tester is connected via this electric connection mechanism, the electrode terminal 6 and the probe 4. 22 and the electrode pad of the semiconductor element formed on the semiconductor wafer 2 are electrically connected.

When a predetermined number of assemblies are arranged in each oven 21, the opening / closing mechanism (not shown) of the oven 21 is closed, the inside is set to a predetermined environment, for example, a predetermined temperature, and each semiconductor is set by the tester 22. Electrical inspection of each semiconductor element of the wafer 2 is sequentially performed.

As described above, according to this embodiment, it is possible to easily and efficiently carry out an environmental test on each semiconductor element in the state of the semiconductor wafer 2, which could not be practically performed conventionally. it can. Therefore, for example, even when the semiconductor element after cutting is directly mounted on the substrate by TAB or the like without packaging, the environmental test of each semiconductor element can be performed before mounting on the substrate. It is possible to improve the production efficiency compared to.

[0028]

As described above, according to the semiconductor element inspection method of the present invention, the environmental test of the semiconductor element in the state of the semiconductor wafer can be carried out easily and efficiently.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of an inspection jig used in a method according to an embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of an automatic inspection device used in a method according to an embodiment of the present invention.

[Explanation of symbols]

 1 Inspection Jig 2 Semiconductor Wafer 3 Tray 4 Probe (Probe) 5 Lid 6 Electrode Terminal 7 Spacer 8 Clamping Mechanism 8a Support Point

Claims (1)

Claim: What is claimed is: 1. A wafer support on which a semiconductor wafer is provided, and a lid on which a probe corresponding to each electrode pad of a plurality of semiconductor elements formed on the semiconductor wafer is arranged. Using each of the electrode pads of the semiconductor wafer provided on the wafer support, using an inspection jig including an electrode terminal for electrically connecting the probe and an electrical measuring device, The lid is fixed on the support so that the probe contacts with the probe, and the inspection jig is placed in a predetermined inspection environment in this state, and the semiconductor is provided via the electrode terminal and the probe. A method for inspecting a semiconductor device, which comprises measuring the electrical characteristics of the device.