JP6823534B2 - Carrier for electronic component testing equipment - Google Patents

Description

The present invention relates to a carrier for an electronic component test apparatus.

A seating area on which the electronic component under test is seated as a carrier for the electronic component test device that transports the electronic component under test such as a BGA (Ball Grid Array) type IC package onto the socket for the electronic component for quality inspection. A through hole is formed to expose the contact portion (terminal) of the electronic component to be tested in the direction of the contact terminal of the electronic component socket, and the outer peripheral portion of the seating portion is a carrier by a rivet having a head and a body. Those fixed to the main body are known (see, for example, Patent Document 1). In the carrier for the electronic component testing apparatus described in Patent Document 1, the seating portion is made of a film-like sheet such as polyimide, and this film-like sheet is stretched under the carrier body.

JP-A-2010-156546

In the carrier for the electronic component testing apparatus described in Patent Document 1, the flatness of the film-like sheet and the position accuracy of the through holes are ensured by applying sufficient tension to the film-like sheet, and the film-like sheet. It is necessary to ensure the positional accuracy of the above electronic component under test.

The problem to be solved by the present invention is to provide a carrier for an electronic component test apparatus capable of sufficiently applying tension to a sheet on which an electronic component under test is placed and ensuring the position accuracy of the electronic component under test on the sheet. It is to be.

[1] The carrier for an electronic component test device according to the present invention is for an electronic component test device that holds an electronic component under test in which a plurality of terminals protrude from the bottom surface on a socket provided in the electronic component test device. A sheet that is a carrier, constitutes the bottom of the carrier, and on which the electronic component to be tested is placed so that the plurality of terminals project toward the socket side, and a tray that is conveyed in the electronic component test apparatus. The sheet is provided with a main body portion in which the outer peripheral portion of the sheet is fixed by a plurality of caulking, and the caulking is provided from a body portion protruding from the main body portion and the body portion provided at the tip of the body portion. The sheet is formed in an opening into which the body portion fits and a region on the inner peripheral side of the sheet from the center of the opening at the edge of the opening. A slit that is not formed in the region on the outer peripheral side of the sheet from the center of the opening at the edge of the sheet is provided.

[2] In the above invention, the body portion is a semicircular body portion outer peripheral side portion formed in a region on the outer peripheral side of the seat from the center of the body portion, and the sheet from the center of the body portion. A semicircular inner peripheral side portion having a diameter smaller than that of the outer peripheral side portion of the body portion is provided, and the opening is a region on the outer peripheral side of the sheet with respect to the center of the opening. The outer peripheral side portion of the opening, which is formed in a semicircular shape and into which the outer peripheral side portion of the body portion fits, and the region on the inner peripheral side of the sheet from the center of the opening, and a half diameter smaller than the outer peripheral side portion of the opening. It is formed in a circular shape and includes an opening inner peripheral side portion into which the inner peripheral side portion of the body portion fits. The slit is formed at the edge portion of the opening inner peripheral side portion, and the edge portion of the opening outer peripheral side portion. It may be configured so that it is not formed in.

[3] In the above invention, the body portion is a semicircular body portion outer peripheral side portion formed in a region on the outer peripheral side of the seat with respect to the center of the body portion, and the sheet with respect to the center of the body portion. It is formed in the region on the inner peripheral side of the body, and includes a semicircular inner peripheral side portion having a diameter larger than the outer peripheral side portion of the body portion, and the opening is on the outer peripheral side of the sheet with respect to the center of the opening. It is formed in a semicircular shape in the region, and is formed in a semicircular shape in the outer peripheral side portion of the opening into which the outer peripheral side portion of the body portion fits, and in the region on the inner peripheral side of the sheet from the center of the opening in the opening. The slit includes an opening inner peripheral side portion into which the inner peripheral side portion of the body portion fits, and the slit is a boundary portion between the edge portion of the opening inner peripheral side portion and the edge portion of the opening outer peripheral side portion, and the inside of the opening. It may be configured so as to be formed on the edge portion of the peripheral side portion and not formed on the edge portion of the opening outer peripheral side portion.

[4] In the above invention, the sheet may be configured such that the outer peripheral portion is fixed to the main body portion by the plurality of caulking in a state where tension is applied.

[5] In the above invention, the slope is formed on the bottom surface of the main body portion so as to incline toward a higher position from the inner peripheral side to the outer peripheral side of the bottom surface, and the plurality of caulkings are formed on the slope. It may be configured in.

According to the present invention, since the edge portion of the outer peripheral side portion of the opening of the sheet can be reliably applied to the body portion of the caulking, sufficient tension can be applied to the sheet, and the position accuracy of the electronic component under test on the sheet can be obtained. Can be secured.

FIG. 1 is a schematic cross-sectional view showing an electronic component test apparatus using the device carrier according to the embodiment of the present invention. FIG. 2 is a perspective view showing the electronic component testing apparatus of FIG. FIG. 3 is a conceptual diagram for explaining the transfer of trays in the electronic component testing apparatus of FIGS. 1 and 2. FIG. 4 is an exploded perspective view showing an IC stocker used in the above-mentioned electronic component testing apparatus. FIG. 5 is a perspective view showing a customer tray used in the above-mentioned electronic component testing apparatus. FIG. 6 is a perspective view showing a test tray. FIG. 7 is an exploded perspective view showing a part of the test tray in an enlarged manner. FIG. 8 is a perspective view showing the core from the bottom side. FIG. 9 is a bottom view showing the core. FIG. 10 is a plan view showing the core. FIG. 11 is a front view showing the core. FIG. 12 is a side view showing the core. FIG. 13 is a cross-sectional view taken along the line 13-13 of FIG. FIG. 14 is an enlarged cross-sectional view showing a part of FIG. 13. FIG. 15 is a cross-sectional view taken along the line 15-15 of FIG. FIG. 16 is a cross-sectional view showing a modified example of the configuration of the body portion and the opening shown in FIG. FIG. 17 is an enlarged plan view showing the four corners of the bottom of the device carrier. FIG. 18 is a cross-sectional view showing a state in which the IC device is being tested (inspected). FIG. 19 is a cross-sectional view showing a state in which the IC device is being tested (inspected). FIG. 20 is a perspective view for explaining a method of attaching the film to the core body. FIG. 21 is a cross-sectional view for explaining a method of attaching the film to the core body. FIG. 22 is a perspective view for explaining a method of attaching the film to the core body. FIG. 23 is a perspective view for explaining a method of attaching the film having the opening of the configuration shown in FIG. 16 to the core main body having the body portion of the configuration shown in FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an electronic component test apparatus using the device carrier according to the embodiment of the present invention. FIG. 2 is a perspective view showing the electronic component testing apparatus of FIG. FIG. 3 is a conceptual diagram for explaining the transfer of trays in the electronic component testing apparatus of FIGS. 1 and 2.

The electronic component test apparatus shown in FIGS. 1 and 2 applies high-temperature or low-temperature thermal stress to the IC device, and uses the test head 5 and the tester 6 to check whether the IC device operates properly in this state. Test (inspect). Then, this electronic component test apparatus classifies IC devices based on the test results.

In the electronic component test apparatus, a large number of IC devices to be tested are mounted on the customer tray KST (see FIG. 5). Further, the test tray TST (see FIG. 6) is circulated in the handler 1 of the electronic component device. The IC device is transferred from the customer tray KST to the test tray TST and tested. The IC device is indicated by a code IC in the figure.

As shown in FIG. 1, a space 8 is provided below the handler 1, and a test head 5 is arranged in this space 8. An IC socket 50 is provided on the test head 5, and the IC socket 50 is connected to the tester 6 through a cable 7.

In this electronic component test apparatus, the IC device mounted on the test tray TST and the IC socket 50 on the test head 5 are contacted and electrically connected, and an electric signal or the like is given to the IC device in such a state. , The IC device is tested (inspected) based on the signal output from the tester 6. When exchanging the types of IC devices, the IC socket 50 and the core 730 described later are exchanged with ones that match the shape and number of pins of the IC device.

As shown in FIGS. 2 and 3, the handler 1 includes a storage unit 200, a loader unit 300, a test unit 100, and an unloader unit 400. The storage unit 200 stores the IC device before and after the test. The loader unit 300 transfers the IC device transferred from the storage unit 200 to the test unit 100. The test unit 100 is configured so that the IC socket 50 of the test head 5 faces the inside. The unloader unit 400 classifies the tested IC devices tested by the test unit 100.

FIG. 4 is an exploded perspective view showing an IC stocker used in the above-mentioned electronic component testing apparatus. FIG. 5 is a perspective view showing a customer tray used in the above-mentioned electronic component testing apparatus. As shown in FIG. 4, the storage unit 200 includes a pre-test stocker 201 and a tested stocker 202. The pre-test stocker 201 stores the customer tray KST containing the pre-test IC device. The tested stocker 202 stores a customer tray KST containing IC devices classified according to the test results. The pre-test stocker 201 and the tested stocker 202 include a frame-shaped tray support frame 203 and an elevator 204 that enters from the lower part of the tray support frame 203 and moves up and down toward the upper part. A plurality of customer trays KST are stacked on the tray support frame 203. The stacked customer tray KST is moved up and down by the elevator 204. As shown in FIG. 5, the customer tray KST includes a plurality of concave accommodating portions for accommodating IC devices. The plurality of accommodating portions are arranged in a plurality of rows and a plurality of columns (for example, 14 rows and 13 columns). The pre-test stocker 201 and the tested stocker 202 have the same structure.

As shown in FIGS. 2 and 3, the pre-test stocker 201 is provided with two stockers STK-B and two empty tray stockers STK-E. The two stockers STK-B are adjacent to each other, and next to these two stockers STK-B, two empty tray stockers STK-E are adjacent to each other. In the empty tray stocker STK-E, empty customer trays KST to be transferred to the unloader unit 400 are stacked.

A tested stocker 202 is provided next to the pre-test stocker 201. The tested stocker 202 is provided with eight stockers STK-1, STK-2, ..., STK-8. The tested stocker 202 is configured so that the tested IC devices can be sorted and stored in a maximum of eight categories according to the test results. For example, a tested IC device can be classified into a non-defective product and a defective product in the tested stocker 202, as well as a non-defective product having a high operating speed, a non-defective product having a medium operating speed, and a non-defective product having a low operating speed. It can be sorted into defective products that require retesting and defective products that do not require retesting.

As shown in FIG. 2, a tray transfer arm 205 is provided between the storage unit 200 and the device base 101. The tray transfer arm 205 transfers the customer tray KST from the lower side of the device base 101 to the loader unit 300. Here, a pair of window portions 370 are formed on the device base 101. The pair of window portions 370 are arranged so that the customer tray KST transferred from the lower side of the device base 101 to the loader unit 300 by the tray transfer arm 205 faces the upper surface of the device base 101.

The loader unit 300 includes a device transfer device 310. The device transfer device 310 includes two rails 311 and a movable arm 312 and a movable head 320. The two rails 311 are erected on the device base 101. The movable arm 312 reciprocates between the test tray TST and the customer tray KST along the two rails 311. The moving direction of the movable arm 312 is referred to as the Y direction. The movable head 320 is supported by the movable arm 312 and moves in the X direction. A plurality of suction pads (not shown) are mounted downward on the movable head 320.

The device transfer device 310 moves the movable head 320, which has a plurality of IC devices sucked by the plurality of suction pads, from the customer tray KST to the precisioner 360. As a result, the IC device is transferred from the customer tray KST to the precisionor 360. Then, the device transfer device 310 corrects the mutual positional relationship of the IC devices by the movable arm 312 and the movable head 320 in the precisionor 360. After that, the device transfer device 310 transfers the IC device to the test tray TST stopped at the loader unit 300. As a result, the IC device is transshipped from the customer tray KST to the test tray TST.

As shown in FIGS. 2 and 3, the test unit 100 includes a soak chamber 110, a test chamber 120, and an unsoak chamber 130. The soak chamber 110 applies a target high or low temperature thermal stress to the IC device mounted on the test tray TST. The test chamber 120 presses the heat-stressed IC device in the soak chamber 110 against the test head 5. The unsoak chamber 130 removes thermal stress from the IC device tested in the test chamber 120.

When a high temperature is applied to the IC device in the soak chamber 110, the IC device is cooled to room temperature by blowing air in the unsoak chamber 130. On the other hand, when a low temperature is applied to the IC device in the soak chamber 110, the IC device is heated in the unsoak chamber 130 to a temperature at which dew condensation does not occur by warm air or a heater.

As shown in FIG. 2, the soak chamber 110 and the unsoak chamber 130 project upward from the test chamber 120. Further, as conceptually shown in FIG. 3, the soak chamber 110 is provided with a vertical transfer device, and while the preceding test tray TST exists in the test chamber 120, a plurality of subsequent test tray TSTs are provided. Stands by while being supported by the vertical transfer device. The IC devices mounted on the plurality of test trays TSTs that follow are subjected to high-temperature or low-temperature thermal stress during standby.

A test head 5 is arranged in the center of the test chamber 120. The test tray TST is transferred onto the test head 5. In the center of the test chamber 120, the terminal HB of the IC device mounted on the test tray TST (see FIGS. 16 and 17) and the terminal 51 of the IC socket 50 on the test head 5 (see FIGS. 16 and 17) are located. It is contacted and the IC device is tested. The test tray TST on which the IC device that has been tested is mounted is transferred to the unsoak chamber 130. In the unsoak chamber 130, the IC device that has been tested is cooled to room temperature. The test tray TST on which the heat-removed IC device is mounted is carried out to the unloader unit 400.

An inlet for carrying the test tray TST from the apparatus base 101 into the soak chamber 110 is formed in the upper part of the soak chamber 110. On the other hand, an outlet for carrying out the test tray TST from the unsoak chamber 130 to the apparatus base 101 is formed in the upper part of the unsoak chamber 130.

As shown in FIG. 2, the device base 101 is provided with a tray transfer device 102. The tray transfer device 102 carries the test tray TST from the device base 101 into the soak chamber 110, and carries out the test tray TST from the unsoak chamber 130 to the device base 101. The tray transfer device 102 is composed of, for example, a rotating roller or the like.

After the test tray TST is carried out from the unsoak chamber 130 to the device base 101 by the tray transfer device 102, all the IC devices mounted on the test tray TST are tested by the device transfer device 410 (described later). It is transshipped to the customer tray KST according to the above. After that, the test tray TST is transferred to the soak chamber 110 via the unloader unit 400 and the loader unit 300.

As shown in FIG. 2, the unloader unit 400 is provided with two device transfer devices 410. The device transfer device 410 has the same structure as the device transfer device 310 provided in the loader unit 300. The two device transfer devices 410 transship the tested IC devices from the test tray TST existing in the device base 101 to the customer tray KST according to the test result.

Two pairs of window portions 470 are formed on the device base 101. The two pairs of window portions 470 are arranged so that the customer tray KST transferred to the unloader portion 400 faces the upper surface of the device base 101. An elevating table (not shown) is provided below the two pairs of window portions 470 and the above-mentioned window portion 370. This elevating table lowers the customer tray KST on which the tested IC device is mounted and delivers it to the tray transfer arm 205.

FIG. 6 is a perspective view showing the test tray TST. As shown in this figure, the test tray TST includes a frame 700 and a plurality of device carriers 710. The frame 700 includes a rectangular outer frame 701 and an inner frame 702 provided in a grid pattern in the outer frame 701. The frame 700 includes a rectangular opening 703 divided into a plurality of rows and a plurality of columns by an outer frame 701 and an inner frame 702.

The plurality of device carriers 710 are arranged in a plurality of rows and a plurality of columns. Each device carrier 710 is provided corresponding to each opening 703 of the frame 700. The device carrier 710 includes a body 720 and a plurality of (eg, four as shown) cores 730. The body 720 is a rectangular plate-shaped resin molded body, and has the same number of rectangular openings 721 as the number of cores 730 (4 in the present embodiment) in a plurality of rows and a plurality of columns (2 rows and 2 columns in the present embodiment). It is formed.

The plurality of bodies 720 are arranged in a plurality of rows and a plurality of columns under the frame 700. The outer peripheral portion of the body 720 located on the outermost circumference overlaps the outer frame 701 or the inner frame 702, and a plurality of openings 721 are arranged so as to overlap the openings 703 of the frame 700. On the other hand, the outer peripheral portion of the other body 720 is arranged so as to overlap the inner frame 702 and the plurality of openings 721 to overlap the openings 703 of the frame 700. These plurality of bodies 720 are fixed to the intersection of the outer frame 701 and the inner frame 702 and the intersection of the inner frames 702 in the frame 700.

FIG. 7 is an enlarged perspective view showing a part of the test tray TST. As shown in this figure, the core 730 is detachably attached to the body 720. The core 730 is arranged corresponding to each opening 721, and is attached to the body 720 so as to be finely movable (floating) in a plane (in the XY plane in the drawing). The core 730 includes a core body 740 and a film 750. The core body 740 is a resin molded body having a rectangular opening (through hole) 741 formed therein. A plurality of claw portions 742 and a plurality of guide portions 743 are formed on the outer peripheral portion of the core main body 740. The body 720 is formed with an engaging portion (not shown) with which the claw portion 742 engages and a guide groove 722 into which the guide portion 743 is inserted. The core body 740 is supported by the body 720 by engaging the claw portion 742 with the engaging portion. When the core body 740 is attached to the body 720, the claw portion 742 can be engaged with the engaging portion by inserting the guide portion 743 into the guide groove 722 and pushing the core body 740 into the opening 721. On the other hand, the core main body 740 can be removed from the body 720 by disengaging the claw portion 742 and the engaging portion.

Here, the engagement between the claw portion 742 and the engaging portion and the fitting between the guide portion 743 and the guide groove 722 do not fix the core main body 740 and the body 720, but the core main body 740 and the body 720. Allows fine movement (floating) in a relative plane. As a result, as will be described later, it is possible to perform relative positioning between the core 730 and the IC socket 50.

The film 750 is a resin molded body formed in the form of a rectangular thin film. By fixing the outer peripheral portion of the film 750 to the bottom portion of the core main body 740, the film 750 constitutes the bottom portion of the core 730. An IC device is placed on the film 750.

FIG. 8 is a perspective view showing the core 730 from the bottom side. FIG. 9 is a bottom view showing the core 730. FIG. 10 is a plan view showing the core 730. FIG. 11 is a front view showing the core 730. FIG. 12 is a side view showing the core 730. FIG. 13 is a cross-sectional view taken along the line 13-13 of FIG. FIG. 14 is an enlarged cross-sectional view showing a part of FIG. 13. As shown in these figures, the core body 740 includes a rectangular annular frame portion 744 in which the above-mentioned opening 741 is formed, a pair of positioning plates 745, 746, and a pair of lever accommodating portions 747, 748.

A plurality of caulking 749s are provided on the bottom surface (lower end surface) of the frame portion 744. The caulking 749 is provided at the four corners of the bottom surface of the frame portion 744 and each side of the bottom surface of the frame portion 744. A plurality of (for example, two as shown) caulking 749s are provided on each side of the bottom surface of the frame portion 744. On the other hand, a plurality of openings 751 are formed in the outer peripheral portion 750A of the film 750 corresponding to the position of the caulking 749. Each caulking 749 includes a body portion 7491 having a circular cross section (see FIG. 14) and a head portion 7492 having a circular cross section. The body portion 7491 projects downward from the bottom surface of the frame portion 744 and is inserted through the opening 751 of the film 750. The head 7492 has a larger diameter than the body portion 7491 and the opening 751, and extends radially from the tip (lower end) of the body portion 7491. The outer peripheral portion 750A of the film 750 is sandwiched between the head portion 7492 and the bottom surface of the frame portion 744. The details of the structure of the outer peripheral portion 750A of the film 750, the bottom surface of the frame portion 744, and the caulking 749 will be described later.

The positioning plate 745 is provided at the upper end of the first side wall 7441 of the frame portion 744. The other positioning plate 746 is provided at the upper end of the second side wall 7442 of the frame portion 744. The first side wall 7441 and the second side wall 7442 face each other. The positioning plate 745 projects from the upper end of the first side wall 7441 to the opposite side of the opening 741, and the other positioning plate 746 projects from the upper end of the second side wall 7442 to the opposite side of the opening 741. A pair of guide portions 743 are provided on the upper surfaces of the positioning plates 745 and 746, respectively.

Claws 742 are provided at one end and the other end of the positioning plates 745 and 746 in the longitudinal direction, respectively. That is, the four claw portions 742 are arranged diagonally of the opening 741. The pair of diagonally arranged claw portions 742 are arranged in opposite directions to each other. On the other hand, the claw portions 742 adjacent to each other are arranged in different directions by 90 °.

The positioning plates 745 and 746 are rectangular plates, the direction along the first side wall 7441 and the second side wall 7442 is the longitudinal direction, and the positioning plates 745 and 746 are orthogonal to the first side wall 7441 and the second side wall 7442. The direction is the width direction. A positioning hole 7451 is formed in the central portion of the positioning plate 745 in the longitudinal direction, and a positioning hole 7461 is formed in the central portion of the positioning plate 746 in the longitudinal direction. The positioning hole 7451 is a circular through hole. On the other hand, the positioning hole 7461 is an oval-shaped through hole. The longitudinal direction of the positioning hole 7461 coincides with the width direction of the positioning plate 746. The core 730 is positioned with respect to the IC socket 50 by inserting the positioning pin 55 described later into the positioning hole 7451 and inserting the positioning pin 56 described later into the positioning hole 7461.

The lever accommodating portion 747 is provided on the third side wall 7443 of the frame portion 744. The other lever accommodating portion 748 is provided on the fourth side wall 7444 of the frame portion 744. The third side wall 7443 and the fourth side wall 7444 face each other. The lower portion of the lever accommodating portion 747 is provided so as to project from the third side wall 7443 to the opposite side of the opening 741, and the upper portion of the lever accommodating portion 747 is provided so as to project upward from the third side wall 7443. There is. The lever accommodating portion 747 is configured in a rectangular box shape, and accommodates the lever 760 inside. The lower portion of the other lever accommodating portion 748 is provided so as to project from the fourth side wall 7444 to the opposite side of the opening 741, and the upper portion of the lever accommodating portion 748 projects upward from the upper end of the fourth side wall 7444. It is provided in. The lever accommodating portion 748 is configured in a rectangular box shape, and accommodates the lever 761 inside. The lever 760 and the lever 761 have the same structure and are arranged symmetrically.

An opening 7443A is formed in the central portion of the third side wall in the width direction. Further, an opening 747A is formed in the lateral central portion of the lower portion of the lever accommodating portion 747. On the other hand, an opening 7444A is formed in the central portion of the fourth side surface in the width direction. Further, an opening 748A is formed in the lateral central portion of the lower portion of the lever accommodating portion 748. The lever 760 accommodated in the lever accommodating portion 747 is configured to be able to advance and retreat to the opening 741 through the opening 7443A. The lever 760 retracts from the opening 741 into the lever accommodating portion 747 by receiving an external force through the opening 747A, while it advances into the opening 741 through the opening 7443A by removing the external force. On the other hand, the lever 761 housed in the lever accommodating portion 748 is configured to be able to advance and retreat to the opening 741 through the opening 7444A. The lever 761 retracts from the opening 741 into the lever accommodating portion 748 by receiving an external force through the opening 748A, while moving forward into the opening 741 through the opening 7444A by removing the external force. The pair of levers 760 and 761 advanced into the opening 741 are pressed against the outer peripheral portion of the IC device on the film 750 by the urging force of the spring. As a result, the IC device on the film 750 is pressed by the pair of levers 760 and 761.

A rectangular opening 752 is formed in the central portion of the film 750. Here, an optical sensor (not shown) is provided at a predetermined position of the electronic component test apparatus, and the core 730 stops at the position of the light beam of the optical sensor or passes through the position of the light beam of the optical sensor. .. This optical sensor includes a light emitting unit and a light receiving unit that face each other in the vertical direction, and emits light rays at a timing when the opening 752 is located between the light emitting unit and the light receiving unit. When the IC device is present on the film 750, the light beam is blocked by the IC device, so that the IC device is detected. On the other hand, when the IC device does not exist on the film 750, the light beam emitted from the light emitting portion passes through the opening 752 and is received by the light receiving element, so that the IC device is not detected.

A large number of small holes 753 are formed between the opening 752 of the film 750 and the outer peripheral portion 750A. These numerous small holes 753 are provided corresponding to the numerous ball-shaped terminals HB provided on the bottom surface of the IC device. The diameter of the small hole 753 is set to be larger than the diameter of the terminal HB. As a result, the terminal HB protrudes from the film 750 toward the IC socket 50 side through the small hole 753. In this embodiment, since a large number of terminal HBs of the IC device are arranged in a rectangular ring in a plurality of rows, a large number of small holes 753 are arranged in a rectangular ring in a plurality of rows. However, the arrangement of the terminal HB and the small hole 753 of the IC device is not limited to the arrangement of the present embodiment, and can be changed as appropriate.

As shown in FIG. 14, a flat surface portion 7445 on the inner peripheral side and a slope portion 7446 on the outer peripheral side are formed on the bottom surface of the frame portion 744. A portion of the film 750 between the opening 751 and the small hole 753 is in contact with the flat surface portion 7445. The slope portion 7446 is inclined upward from the flat surface portion 7445 to the outer peripheral side of the frame portion 744. A caulking 749 is formed on the slope portion 7446. Specifically, in addition to the body portion 7491 of the caulking 749 projecting downward from the slope portion 7446, the head portion 7492 of the caulking 749 is formed so as to fit within the slope portion 7446 without entering the flat surface portion 7445. Has been done.

Here, a horizontal plane 7492A is formed on the head 7492 of the caulking 749. The height position of the horizontal plane 7402A is set higher than that of the flat surface portion 7445. Further, the film 750 includes an outer peripheral portion 750A that is inclined by abutting on the slope portion 7446, and a flat surface portion 750B inside the outer peripheral portion 750A. The outer peripheral portion of the upper surface of the flat surface portion 750B comes into contact with the flat surface portion 7445. Therefore, the height of the lower surface of the flat surface portion 750B is set to a position lower by the sum of the thickness of the film 750 with respect to the flat surface portion 7445. Therefore, the height of the lowest portion (lowest point) of the caulking 749 is set higher than the height of the lowest portion (lowest point) of the film 750.

Here, at a position on the outer peripheral side of the film 750 with respect to the center of the opening 751, tension is applied to the film 750 by applying the edge portion of the opening 751 to the body portion 7491. The relative positions of the body portion 7491 and the opening 751 are set so that such a state is formed, and the shapes and dimensions of the body portion 7491 and the opening 751 are set.

FIG. 15 is a cross-sectional view taken along the line 15-15 of FIG. As shown in this figure, the body portion 7491 is formed on the outer peripheral side portion 7491A of the body portion formed in the region on the outer peripheral side of the film 750 from the center (axis center) and the region on the inner peripheral side of the film 750 from the center. It includes a formed body inner peripheral side portion 7491B. The cross-sectional shape of the outer peripheral side portion 7491A of the body portion is a semicircular shape having a radius R1, and the cross-sectional shape of the inner peripheral side portion 7491B of the body portion is a semicircular shape having a radius R2 (<R1). The outer peripheral side portion 7491A of the body portion and the inner peripheral side portion 7491B of the body portion share the center of the circle, and a step portion is formed at the boundary portion between them.

The opening 751 includes an opening outer peripheral side portion 7511 formed in a region on the outer peripheral side of the film 750 with respect to the center, and an opening inner peripheral side portion 7512 formed in a region on the inner peripheral side of the film 750 with respect to the center. The outer peripheral side portion 7511 of the opening has a semicircular shape with a radius r1, and the inner peripheral side portion 7512 of the opening has a semicircular shape with a radius r2 (<r1). The outer peripheral side portion 7511 of the opening and the inner peripheral side portion 7512 of the opening share the center of a circle, and a step portion is formed at the boundary between them.

The radius R1 of the outer peripheral side portion 7491A of the body portion is slightly larger than the radius r1 of the outer peripheral side portion 7511 of the opening, and the radius R2 of the inner peripheral side portion 7491B of the body portion is slightly larger than the radius r2 of the inner peripheral side portion 7512 of the opening. It has become. Therefore, the edge portion of the opening outer peripheral side portion 7511 and the peripheral surface of the body portion outer peripheral side portion 7491A come into contact with each other, and the edge portion of the opening inner peripheral side portion 7512 and the peripheral surface of the body portion inner peripheral side portion 7491B come into contact with each other.

Here, a plurality of slits 7513 are formed at the edge of the opening inner peripheral side portion 7512. The plurality of slits 7513 are arranged at predetermined intervals (for example, at intervals of 45 ° as shown) in the circumferential direction of the slits 7513. The length of the slit 7513 is not particularly limited, but is preferably greater than or equal to the difference (r1-r2) between the radius r1 of the opening outer peripheral side portion 7511 and the radius r2 of the opening inner peripheral side portion 7512.

Since a plurality of slits 7513 are formed at the edge of the opening inner peripheral side portion 7512, the rigidity of the edge portion of the opening inner peripheral side portion 7512 becomes lower than the rigidity of the edge portion of the opening outer peripheral side portion 7511. There is. As a result, the edge portion of the opening inner peripheral side portion 7512 is greatly bent as compared with the edge portion of the opening outer peripheral side portion 7511, and the edge portion of the opening outer peripheral side portion 7511 comes into contact with the peripheral surface of the body portion outer peripheral side portion 7491A. The pressure becomes larger than the contact pressure between the edge portion of the opening inner peripheral side portion 7512 and the peripheral surface of the body portion inner peripheral side portion 7491A. Therefore, on the outer peripheral side of the film 750 with respect to the center of the body portion 7491, the edge portion of the opening 751 is in a state of being applied to the body portion 7491, so that tension is applied to the film 750.

FIG. 16 is a cross-sectional view showing a modified example of the configuration of the body portion 7491 and the opening 751 shown in FIG. As shown in this figure, the body portion 7491 is formed in the outer peripheral side portion 7491A of the body portion formed in the region on the outer peripheral side of the film 750 with respect to the center, and the body portion 7491 formed in the region on the inner peripheral side of the film 750 with respect to the center. A portion 7491B on the inner peripheral side of the portion is provided. The cross-sectional shape of the outer peripheral side portion 7491A of the body portion is a semicircular shape having a radius R1, and the cross-sectional shape of the inner peripheral side portion 7491B of the body portion is a semicircular shape having a radius R2 (> R1). The outer peripheral side portion 7491A of the body portion and the inner peripheral side portion 7491B of the body portion share the center of the circle, and a step portion is formed at the boundary portion between them.

The opening 751 is a perfect circle, and the opening outer peripheral side portion 7511 formed in the outer peripheral side region of the film 750 from the center and the opening inner peripheral side portion formed in the inner peripheral side region of the film 750 from the center. It is equipped with 7512. The outer peripheral side portion 7511 of the opening and the inner peripheral side portion 7512 of the opening have a semicircular shape with a radius r1 (= r2), and are divided into an inner peripheral side and an outer peripheral side of the film 750 with a pair of slits 7513 as boundaries.

The radius R1 of the outer peripheral side portion 7491A of the body portion is slightly larger than the radius r1 of the outer peripheral side portion 7511 of the opening, and the radius R2 of the inner peripheral side portion 7491B of the body portion is slightly larger than the radius r2 of the inner peripheral side portion 7512 of the opening. It has become. Therefore, the edge portion of the opening outer peripheral side portion 7511 and the peripheral surface of the body portion outer peripheral side portion 7491A come into contact with each other, and the edge portion of the opening inner peripheral side portion 7512 and the peripheral surface of the body portion inner peripheral side portion 7491B come into contact with each other.

Here, in addition to the slits 7513 described above being formed at both ends of the edge portion of the opening inner peripheral side portion 7512, the slit 7513 is formed at the central portion of the edge portion of the opening inner peripheral side portion 7512. These plurality of slits 7513 are arranged at predetermined intervals (for example, 90 ° intervals as shown) in the circumferential direction of the opening 751. The length of the slit 7513 is not particularly limited, but is preferably the same as the difference (r1-r2) between the radius r1 of the opening outer peripheral side portion 7511 and the radius r2 of the opening inner peripheral side portion 7512.

By forming a plurality of slits 7513 at the center and both ends of the edge portion of the opening inner peripheral side portion 7512, the rigidity of the edge portion of the opening inner peripheral side portion 7512 becomes the rigidity of the edge portion of the opening outer peripheral side portion 7511. Is lower than. As a result, the edge portion of the opening inner peripheral side portion 7512 is greatly bent as compared with the edge portion of the opening outer peripheral side portion 7512, and the edge portion of the opening outer peripheral side portion 7511 comes into contact with the peripheral surface of the body portion outer peripheral side portion 7491A. The pressure becomes larger than the contact pressure between the edge portion of the opening inner peripheral side portion 7512 and the peripheral surface of the body portion inner peripheral side portion 7491A. Therefore, on the outer peripheral side of the film 750 with respect to the center of the body portion 7491, the edge portion of the opening 751 is in a state of being applied to the body portion 7491, so that tension is applied to the film 750.

FIG. 17 is an enlarged plan view showing the four corners of the bottom of the device carrier 710. As shown in this figure, slits 754 are formed at each of the four corners of the film 750. Each of the four corners of the outer peripheral portion of the film 750 has a pair of extension lines of the boundary line between the outer peripheral portion 750A and the flat surface portion 750B of the film 750, and the four corners of the outer peripheral portion of the film 750 are each rectangular with the pair of the extension lines. When partitioned in shape, one extension line overlaps the opening 751 and the other extension line does not overlap the opening 751. A slit 754 is formed on an extension line that does not overlap with the opening 751.

Here, when the outer peripheral portion 750A of the film 750 to which tension is applied is tilted, if slits 754 are not formed at the four corners of the outer peripheral portion 750A of the film 750, wrinkles occur at the four corners of the outer peripheral portion 750A of the film 750. .. On the other hand, in the present embodiment, by forming slits 754 at the four corners of the outer peripheral portion 750A of the film 750, it is possible to prevent wrinkles from occurring at the four corners of the outer peripheral portion 750A of the film 750.

18 and 19 are cross-sectional views showing a state in which the IC device is being tested (inspected). As shown in FIG. 18, a pair of positioning pins 55, 56 are provided on the test head 5 so as to sandwich a pair of opposite sides of the rectangular IC socket 50. One positioning pin 55 fits into the positioning hole 7451 of the core body 740, and the other positioning pin 56 fits into the other positioning hole 7461. As a result, the relative position between the core body 740 and the IC socket 50 is determined so that the terminal HB of the IC device and the terminal 51 of the IC socket 50 come into contact with each other.

As shown in FIG. 19, the pair of levers 760 and 761 advanced into the opening 741 are pressed against the outer peripheral portion of the IC device on the film 750 by the urging force of a spring (not shown). As a result, the IC device on the film 750 is pressed by the pair of levers 760 and 761.

As shown in FIGS. 18 and 19, the pusher 121 is provided above the IC socket 50 so as to be able to move up and down. The pusher 121 is attached to a Z-axis drive device (for example, a fluid cylinder) (not shown). When testing the IC device, the Z-axis drive device presses the IC device against the IC socket 50 by the pusher 121.

The IC socket 50 has a configuration in which a plurality of terminals 51 are embedded in an insulating sheet-shaped base material. The terminal 51 is made of a conductive elastic member. Examples of the conductive elastic member constituting the terminal 51 include a synthetic rubber to which a conductive filler is added, a synthetic resin such as polyester to which a conductive filler is added, and the like. The number and arrangement of the plurality of terminals 51 are set according to the number and arrangement of the plurality of terminals HB of the IC device.

The test of the IC device is performed by the tester 6 in a state where the terminal HB of the IC device and the terminal 51 of the IC socket 50 are in electrical contact with each other. The test result of the IC device is stored in an address determined by, for example, an identification number assigned to the test tray TST and an IC device number assigned in the test tray TST.

Here, since the lowest part (lowest point) of the caulking 749 is set at a position higher than the lowest part (lowest point) of the film 750, the lowest part of the caulking 749 is the IC device. It is located higher than the tip (lower end) of the terminal HB. As a result, the clearance between the caulking 749 and the upper surface of the IC socket 50 can be secured regardless of the height of the terminal HB protruding from the bottom surface of the IC device.

FIG. 20 is a perspective view for explaining a method of attaching the film 750 to the core body 740. FIG. 21 is a cross-sectional view for explaining a method of attaching the film 750 to the core body 740. FIG. 22 is a perspective view for explaining a method of attaching the film 750 to the core body 740. As shown in these figures, the outer peripheral portion 750A of the film 750 is fixed to the slope portion 7446 of the core main body 740 by thermal caulking.

First, as shown in FIGS. 20 and 22, a film 750 and a core body 740 are prepared. A plurality of openings 751 are formed on the outer peripheral portion of the film 750. In each opening 751, an outer peripheral side portion 7511 of the opening and an inner peripheral side portion 7512 of the opening are formed. Further, a plurality of slits 7513 are formed at the edge of the opening inner peripheral side portion 7512. On the other hand, a plurality of bosses 749B are formed on the slope portion 7446 of the core main body 740. The positions of the plurality of bosses 749B correspond to the positions of the plurality of openings 751. An opening 749H is formed at the axis of each boss 749B. Further, each boss 749B is formed with a body portion outer peripheral side portion 7491A and a body portion inner peripheral side portion 7491B.

Next, the film 750 is placed at the bottom of the core body 740. At this time, the positions of the plurality of bosses 749B and the plurality of openings 751 are aligned, and all the bosses 749B are inserted into the openings 751.

Next, as shown in FIG. 21, a caulking 749 having a body portion 7491 and a head portion 7492 having a diameter larger than that of the body portion 7491 is formed, and the film 750 is formed by the caulking 749 and the slope portion 7446 of the core main body 740. By sandwiching the outer peripheral portion 750A of the film 750, the outer peripheral portion 750A of the film 750 is fixed to the slope portion 7446 of the core main body 740. In this step, the caulking 749 is formed by pressurizing the boss 749B from the tip end side to the base end side and thermally deforming it using a resin heat caulking device (not shown). At this time, since the opening 749H is formed in the axial center of the boss 749B, the thermal deformation spreading in the outer diameter direction of the boss 749B is promoted as compared with the solid boss.

Here, at a position on the outer peripheral side of the film 750 with respect to the center of the opening 751, the opening 751 and the body portion 7491 are arranged so that tension is applied to the film 750 by applying the edge portion of the opening 751 to the body portion 7491. The relative position of the film, the diameter of the opening 751 and the body portion 7491, the conditions for thermal caulking, and the like are set.

Further, with the core 730 in a posture in which the film 750 faces upward, the dimensions and heat of the boss 749B are set so that the height of the horizontal plane 7492A of the caulking 799 is higher than the height of the upper surface of the flat surface portion 750B of the film 750. Set caulking conditions, etc.

FIG. 23 is a perspective view for explaining a method of attaching the film 750 having the opening 751 having the configuration shown in FIG. 16 to the core main body 740 having the body portion 7491 having the configuration shown in FIG. As shown in this figure, when the opening 751 is formed on the outer peripheral portion of the film 750, a plurality of slits 7513 are formed on the edge portion of the opening 751. A pair of slits 7513 are formed on an extension of the center line that divides the opening 751 into the inner peripheral side and the outer peripheral side of the film 750, and the remaining one slit 7513 is on the inner peripheral side of the center of the opening 751. It is formed at an interval of 90 ° with respect to a pair of slits 7513 at the edge portion. On the other hand, when forming a plurality of bosses 749B on the slope portion 7446 of the core main body 740, each boss 749B forms a body portion outer peripheral side portion 7491A and a body portion inner peripheral side portion 7491B.

Align the positions of the plurality of bosses 749B and the plurality of openings 751, insert all the bosses 749B into the openings 751, and pressurize the bosses 749B from the tip side to the base end side using a resin heat caulking device (not shown) to heat. By deforming, a caulking 749 is formed. Here, at a position on the outer peripheral side of the film 750 with respect to the center of the opening 751, the opening 751 and the body portion 7491 are arranged so that tension is applied to the film 750 by applying the edge portion of the opening 751 to the body portion 7491. The relative position of the film, the diameter of the opening 751 and the body 7491, the conditions for thermal caulking, and the like are set.

As described above, in the device carrier 710 according to the present embodiment, a slit 7513 is formed at the edge of the opening 751 of the film 750 into which the body portion 7491 of the caulking 749 fits. Here, the slit 7513 is formed in a region on the inner peripheral side of the film 750 (the inner peripheral side portion 7512 of the opening) with respect to the center of the opening 751 at the edge of the opening 751, and is the center of the opening 751 at the edge of the opening 751. It is not formed in the outer peripheral side region of the film (the opening outer peripheral side portion 7511). As a result, the rigidity of the edge portion of the opening inner peripheral side portion 7512 is lower than the rigidity of the edge portion of the opening outer peripheral side portion 7511, so that the edge portion of the opening inner peripheral side portion 7512 is the opening outer peripheral side portion. It bends more than the edge of the 7511, and the opening 751 is applied to the body 7491 on the outer peripheral side of the film 750 with respect to the center of the body 7491. Therefore, sufficient tension can be applied to the film 750, and the position accuracy of the IC device on the film 750 can be ensured.

Further, in the device carrier 710 according to the present embodiment, the body portion 7491 of the caulking 749 has a semicircular body portion 7491A formed in a region on the outer peripheral side of the film 750 with respect to the center of the body portion 7491. A semicircular body portion inner peripheral side portion 7491B formed in a region on the inner peripheral side of the film 750 with respect to the center of the body portion 7491 is provided. The inner peripheral side portion 7491B of the body portion has a smaller diameter than the outer peripheral side portion 7491A of the body portion. On the other hand, the opening 751 of the film 750 is formed in a semicircular shape in the region on the outer peripheral side of the film 751 from the center of the opening 751, and the outer peripheral side portion 7511 of the opening and the opening 751 into which the outer peripheral side portion 7491A of the body is fitted. The film 750 is formed in a semicircular shape in the region on the inner peripheral side of the film 750 from the center, and includes an opening inner peripheral side portion 7512 into which the inner peripheral side portion 7491B of the body portion fits. The inner peripheral side portion 7512 of the opening has a smaller diameter than the outer peripheral side portion 7511 of the opening. The slit 7513 is formed at the edge of the opening inner peripheral side portion 7512, and is not formed at the edge portion of the opening outer peripheral side portion 7511. According to such a configuration, the edge portion of the opening inner peripheral side portion 7512 is greatly bent as compared with the edge portion of the opening outer peripheral side portion 7511, so that the edge portion of the opening outer peripheral side portion 7511 and the body portion outer peripheral side portion 7491A The contact pressure with the peripheral surface of the opening becomes larger than the contact pressure between the edge portion of the opening inner peripheral side portion 7512 and the peripheral surface of the body portion inner peripheral side portion 7491A. Therefore, it is possible to apply a sufficient tension to the film 750 by setting the opening 751 on the body 7491 on the outer peripheral side of the film 750 with respect to the center of the body 7491.

Further, in the modified example shown in FIG. 16, the body portion of the caulking 749 is a semicircular body portion outer peripheral side portion 7491A formed in a region on the outer peripheral side of the film 750 with respect to the center of the body portion 7491, and the body portion 7491. It is provided with a semicircular body portion inner peripheral side portion 7491B formed in a region on the inner peripheral side of the film 750 with respect to the center of the film. The inner peripheral side portion 7512 of the opening has a larger diameter than the outer peripheral side portion 7511 of the opening. On the other hand, the opening 751 of the film 750 is formed in a semicircular shape in the region on the outer peripheral side of the film 751 from the center of the opening 751, and the outer peripheral side portion 7511 of the opening and the opening 751 into which the outer peripheral side portion 7491A of the body is fitted. The film 750 is formed in a semicircular shape in a region on the inner peripheral side of the film 750 with respect to the center, and includes an opening inner peripheral side portion 7512 into which the inner peripheral side portion 7491B of the body portion fits. The slit 7513 is formed at the boundary between the edge of the opening inner peripheral side portion 7512 and the edge of the opening outer peripheral side portion 7511 and the edge portion of the opening inner peripheral side portion 7512, and is formed on the opening outer peripheral side portion 7511. It is not formed on the edge. According to such a configuration, the edge portion of the opening inner peripheral side portion 7512 is greatly bent as compared with the edge portion of the opening outer peripheral side portion 7511, so that the edge portion of the opening outer peripheral side portion 7511 and the body portion outer peripheral side portion 7491A The contact pressure with the peripheral surface of the opening becomes larger than the contact pressure between the edge portion of the opening inner peripheral side portion 7512 and the peripheral surface of the body portion inner peripheral side portion 7491A. Therefore, it is possible to apply a sufficient tension to the film 750 by setting the opening 751 on the body 7491 on the outer peripheral side of the film 750 with respect to the center of the body 7491.

Further, in the device carrier 710 according to the present embodiment, the outer peripheral portion 750A of the film 750 is fixed to the bottom surface of the frame portion 744 by caulking 794 in a state where tension is applied to the film 750. As a result, the positioning accuracy of the small holes 753 of the film 750 in the plane and in the height direction can be ensured. In particular, in the device carrier 710 according to the present embodiment, the slope portion 7446 is formed on the bottom surface of the frame portion 744 so as to incline toward a higher position from the inner peripheral side to the outer peripheral side of the bottom surface. A plurality of caulking 749s are formed. As a result, the outer peripheral portion 750A of the film 750 is fixed to the bottom surface of the frame portion 744 by caulking 794 with tension applied to the film 750, and the outer peripheral portion 750A of the film 750 is less than 90 ° with respect to the flat surface portion 750B. This can be achieved by inclining at an angle and applying the opening 751 of the outer peripheral portion 750A to the body portion 7491 of the caulking 749. Therefore, as compared with the case where the inclination angle of the outer peripheral portion 750A of the film 750 with respect to the flat portion 750B is 90 ° or more, or a step portion is formed between the outer peripheral portion 750A and the flat portion 750B of the film 750, the film It is possible to easily apply tension to the 750 and secure the positional accuracy of the film 750.

It should be noted that the embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, in the above-described embodiment, the lowest point of the caulking 749 is higher than the lowest point of the film 750 by forming the slope portion 7446 at the bottom of the core main body 740 and forming the caulking 749 on the slope portion 7446. I set it to position, but this is not required. The bottom of the core body 740 may be formed horizontally, or the lowest point of the caulking 749 may be set lower than the lowest point of the film 750.

Further, although the sheet forming the bottom of the core 730 is made of the film 750, this sheet may be made of a thin metal. Further, although the core 730 is mounted on the test tray TST via the body 720, the core 730 may be mounted directly on the test tray TST. In such a case, the core 730 may be mounted on the test tray TST so as to be finely movable (floating) in a plane.

1 Handler 5 Test head 6 Tester 7 Cable 50 IC socket 51 Terminal 55 Positioning pin 100 Test unit 101 Equipment base 102 Tray transfer device 110 Soak chamber 120 Test chamber 121 Pusher 130 Unsoak chamber 200 Storage unit 201 Pre-test stocker 202 Tested Stocker 203 Tray support frame 204 Elevator 205 Tray transfer arm 300 Loader part 310 Device transfer device 311 Rail 312 Movable arm 320 Movable head 360 Preciser 370 Window part 400 Unloader part 410 Device transfer device 470 Window part TST test tray 700 Frame 701 Outer frame 702 Inner frame 703 Opening 710 Device carrier 720 Body 721 Opening 722 Guide groove 730 Core 740 Core body 741 Opening 742 Claw part 743 Guide part 744 Frame part
7441 First side wall
7442 Second side wall
7443 Third side wall
7443A opening
7444 4th side wall
7444A opening
7445 Plane part
7446 Slope
7447 flat surface
7448 Steps 745, 746 Positioning plate
7451, 7461 Positioning holes 747, 748 Lever housing
747A, 748A Opening 749 Caulking 749B Boss
7491 Body
7491A Body outer circumference side part
7491B Inner circumference of the body
7492 head
7492A Horizontal 750 Film 751 Aperture
7511 Outer peripheral side of the opening
7512 Inner circumference of the opening
7513 Slit 752 Opening 753 Small hole 754 Slit 760, 761 Lever

Claims (5)

A carrier for an electronic component testing device that holds an electronic component under test with a plurality of terminals protruding from the bottom surface on a socket provided in the electronic component testing device.
A sheet that constitutes the bottom of the carrier and on which the electronic component under test is placed so that the plurality of terminals project toward the socket.
It is provided on a tray that is transported in an electronic component testing device, and is provided with a main body portion in which the outer peripheral portion of the sheet is fixed by a plurality of caulking.
The caulking is
The body protruding from the main body and
It is provided at the tip of the body and has a head having a diameter larger than that of the body.
The sheet is
With the opening to which the body fits
A slit formed in a region on the inner peripheral side of the sheet from the center of the opening at the edge of the opening and not formed in a region on the outer peripheral side of the sheet from the center of the opening at the edge of the opening. Carrier for electronic component testing equipment with and. The carrier for the electronic component testing apparatus according to claim 1.
The body is
A semicircular body portion on the outer peripheral side formed in a region on the outer peripheral side of the sheet from the center of the body portion,
It is provided with a semicircular inner peripheral side portion of the body, which is formed in a region on the inner peripheral side of the seat from the center of the body portion and has a smaller diameter than the outer peripheral side portion of the body portion.
The opening is
A semicircular portion formed in a region on the outer peripheral side of the sheet from the center of the opening, and a portion on the outer peripheral side of the opening into which the outer peripheral side portion of the body portion fits.
A semicircular portion having a diameter smaller than that of the outer peripheral side portion of the opening is provided in a region on the inner peripheral side of the sheet from the center of the opening, and an inner peripheral side portion of the opening into which the inner peripheral side portion of the body portion fits. ,
A carrier for an electronic component testing apparatus in which the slit is formed at the edge of the inner peripheral side portion of the opening and is not formed at the edge of the outer peripheral side portion of the opening. The carrier for the electronic component testing apparatus according to claim 1.
The body is
A semicircular body portion on the outer peripheral side formed in a region on the outer peripheral side of the sheet from the center of the body portion,
It is formed in a region on the inner peripheral side of the seat from the center of the body portion, and includes a semicircular inner peripheral side portion having a diameter larger than the outer peripheral side portion of the body portion.
The opening is
A semicircular portion formed in a region on the outer peripheral side of the sheet from the center of the opening, and a portion on the outer peripheral side of the opening into which the outer peripheral side portion of the body portion fits.
The opening is provided with a semicircular portion formed in a region on the inner peripheral side of the sheet with respect to the center of the opening, and an inner peripheral side portion of the opening into which the inner peripheral side portion of the body portion fits.
The slit is formed at the boundary between the edge of the inner peripheral side portion of the opening and the edge of the outer peripheral side portion of the opening, and the edge portion of the outer peripheral side portion of the opening. A carrier for electronic component testing equipment that is not formed in. The carrier for the electronic component test apparatus according to any one of claims 1 to 3.
The sheet is a carrier for an electronic component testing apparatus in which the outer peripheral portion is fixed to the main body portion by the plurality of caulking while tension is applied. The carrier for the electronic component test apparatus according to any one of claims 1 to 4.
A slope is formed on the bottom surface of the main body so as to incline toward a higher position from the inner peripheral side to the outer peripheral side of the bottom surface.
A carrier for an electronic component testing apparatus in which the plurality of caulkings are formed on the slope.