^36770 五 發明說明（ 本發明係關於—種半導μ件測試方法 於半導體元件製程巾轉後對半導體元件 = 並據以有效提昇其測試效率的測試方法設計。了的象式 為維持半導體元件一定的產品良率，在其封裝的製程 中’各重要的製程步驟之後均會設下測試站’監控其產制 過程，以及時發現問題並篩選不良品，避免損失擴^= 此，測試作業在半導體元件封裝是不可或缺的重要流程。 在+導體元件構裝製程中諸項測試作業中，對於該元 輕所作功能性的檢測尤為重要，目元 式方式，主要係將若干數量的待測半 中，移送至測試機台側邊，透過測試機 上再由収碩對該待測半成品每，半導體元件 试，直到該待測物各半導體元件完成測 臂將該完成測試之物件移置承載E原位置’再由 臂取出另-待測物移送測試區進行測 二== 述步觀覆進行，直到待測物完成測試為止。 則 别揭m法雖提供—種應料封膠後半導體 測試=法’然而’該測試方法係以每次移入-待測物，待 測^元成後移出’再接續進行下一待測物測試之操作方式 後於機械手臂移送待測物峨 佳測試效率。置狀恶’氣法讓該測試設傷發揮其最 為此，本發明之主要目的在於：提供一種創新的半導 度適用中 536770 五、發明說明（^) 體件貝Μ方法，藉以縮短測試組件等待待 的空閒時間，而能以更有效率的方式來完成測試作;^ ::成前揭目的，本發明所採取的半導體元件測試方 ^ 4存放於承餘的待測物移至具雙暫存區輸送執 L ’：、:持第二暫存區暫置待測物、第-暫存區空閒的 二；：將暫存於輸送執道上的待測物移至具雙測試區 ^並配合取置移送組件維持雙測試區時時有待 測=狀態:讓測試組件的測試頭以連續方式對待測物進 订一，之後，將完成測試的待測物經輸送軌道第-暫存 區轉达口承載E，並令待測物週期性移置輸送執 雙暫存區、雙測試區以及特定的輸送模式配送； ::計，使其可以縮減測試組件等待的空閒時間，有效 地提升其測試效率，進而提供—種更具 體元件測試方法。 ~ 和注之牛¥ 盆他目為Γ Μ查委M能進—步瞭解本發明具體之設計及 ，、他目的，鉍附以圖式詳細說明如后： (一）圖式部份： 第 第 第 圖 圖 圖 弟四圖 第五圖 第六圖 第七圖 係本發明使狀職設備俯視平面示意圖 係本發明之操作示意圖（_)。 係本發明之操作示意圖（二）。 係本發明之操作示意圖（三）。 係本發明之操作示意圖（四）。 係本發明之操作示意圖（五）。 係本發明之操作示意圖（六）。 A7 五、發明說明（ 第八圖 (二） (10 (11 (12 (13 (14 (15 (2 0 (21 (23 :係本發明之操作示意圖 圖號部份： )測試設備 )承載E ^ 1 )第一暫存區 （ )取匣組件 （ 1)第一測試區 （ )取置移送組件 )待測物 < )第一待測物 （ )第三待測物 r 七 12)輪送執道 1 2 2)第二暫存區 14)測試組件 1 4 2)第二測試 0 )半導體元件 2)第二待測物 4)第四待測物 (請先閱讀背面之注意事項再填寫本頁) 本發明半導體元件測試方 中封膠後所進行的測試，其設計=用於半導體元件製程 Wf(10)，該測試設備（10)至少包括·一 =存置複數待測物的承載…U、'组用以輸送 具有雙暫存區（121) (122)的輸送軌道 )、-組裝設於輸送軌道（12)側端用以取置移 動承載E ( 1 1 )且可升降移動及推出、接收待測物的取 匣組件（1 3 )、一組具有雙測試區（丄4丄）（工$ 2 )的測σ式組件（1 4 )以及一組裝設於測試組件（1 4 ) 與輸达軌道（1 2)間且可三度空間移動的取置移送組件 (15)，前述待測物係於一載體上設有至少一個待測的 半導體元件，該待測半導體元件的I/O接點朝下，前述測 AW--------1---------^ 私紙茫度iiF中國國家標格⑽χ 297公 536770 五、發明說明 4組件（1 4 )巾具有-可移動的測試頭及f腦相關組件 (圖未示），其中測試頭並可於其二測試區（1 4 1 )( 1 4 2 )間移動，本發明測試方法包括下列步驟： 將待測物（2 0 )移至輸送軌道（丄2 )的步驟，係 利用取S組件（1 3)自承載® (1 1)中推出待測物（ 2 0 )移置輸达執逞（工2)上，透過輸送軌道（工2) 輪运至第二暫存區（122)，並維持第二暫存區（12 2 )暫置有待測物（2 〇 )、第_暫存區（丄 閒 的狀態； Ί 將輸送執道（12)第二暫存區（122)上的待測 （2 0 )移至測試組件（丄4 )的步驟，係利用取置移 达組件（1 5 )自輸送軌道（12)第二暫存區（1 )將待測物（2 0 )分別移置定位於測試組件（丄 二個測試區（141) (142)上'，維持第 二列 試區U4D (142)置有待測物（2〇)的狀離.則 線 /對置放於測試區（141) (142)中的待測物進 =測的步驟’係利用測試組件（14)中可移動測試頭 依序對應抵接待測物各半導體元件的i/q接點，並配 2件j 1 4 )中的電腦對該半導體㈣進行檢測，判斷 忒半導體元件之功能正常與否；以及 將已完成測試的待測物移回承難（Η)的步驟， 二TwT!件（15)自測試組件（14)測試區 置輸送軌道（⑴的第一暫存區（121」=: ^國國家標準 536770 A7 五 發明說明（t Β7 轉送至承載昆（1 1 )原位置，而完成 取Ε組件（1 3 其測試作業。 以下再以實際的操作情形進一步說明本發明的測試方 :::請配合參閱第二圖至第七圖所示，首先係 :取一組承載…1)自準備區移動至輪送 ，列物（9 側端處，復自承載£ (1 1 )中將第-待 利物（2 1)移置輸送軌道（12)上，如第二圖所干， $過輸送執道（12)輸送至第二暫存區（122)，復 取置移送組件（1 5)將該第—待測物（2 1 )移置测 T二(二4)的第二測試區（“2)上，由測試组件 (1 4 )的測試頭依序對該第—制物（2 ι )各 于檢測，前述第一待測物（21)被移置測試紐件 二\4)第二測試區（142)的同時，因輸送執道（1 :弟-暫存區（⑴）空閒’取£組件（13)即自 ㈣以11)將第二待測物（22)移置輸送執道（1 2)上輸送至第二暫存區（122)，如第 因測試組件（14)第一測試區（141)空閒，故即由 取置移送組件（1 5)將該第二待測物（2 2) 測試區（14 1)，並於移送的同時，因輪送執 )第二暫存區022)空閒，如第四圖所示，取匿组件 (1 3 )再自承載£ ( 1 1 )將第三待測物（2 3 )移置 輸送軌道（12)上輸送至第二暫存區（122)暫時等 4寺0 ' 其次，第二測試區（i 4 2 )的第—待测物（ 衣紙張尺㈣用中國國家標準(CNSM4規格（210 X 297公 釐） 536770 A7 B7 五、發明說明（ 先完成測試’測試頭接續移至 二待測物（2 ?)、仓一， 丄4 1 )對第 由取置移送组件（ΓΓ同時，第一待測物（21) 暫存區（121)，如移置輸送軌道（12)第一 … 件（13)轉送至承_(11)原位置，另 )，如第丄H )私至弟一曰存區（122 2圖所不，將第三待測物（23)移置第 f )，同時，取®組件（1 3 )另自承載厘（ 1)中取出第四待測物（24)移置輸送執 職至第二暫存區（122)，如第七圖所示。12) ’ 月〕述取置移送組件（丄5 )將第三待測物 置：二測試區（…）後，接續將第一測試區夕 /成測試的第二待_ ( 2 2 )移置輸送執道（ ^ 9存區（121) ’如第八圖所示’再經輸送軌道（ =合取匡組件（1 3 )轉送至承載s ( 1 1 )原位 ’另一方面，取置移送組件（1 5 )再移至第二暫存區 122) ’將第四待測物（24)移置第一測試區（工 4 1 )，同時，取匣組件（1 3 )另自承載匣（工)中 ，出下一個待測物（20)移置輸送軌道（12)，並輸 =至第二暫存區（122)，如此，週而復始持續進行半 導體凡件的測試作業，直至該承載E ( 1 1 )中各待測物 (2 0 )完成測試後，由取匣組件（丄3 )將該承載匣（ 1 1 )移開再接續下一承載匣（丄丄）内待測物 的測試作業。^ 36770 Fifth invention description (This invention is about a semiconducting μ-piece test method for semiconductor devices after semiconductor device manufacturing process is changed = and the test method is designed to effectively improve its test efficiency. The image type is to maintain semiconductor devices A certain product yield, in its packaging process, 'a test station will be set up after each important process step' to monitor its production process, timely detection of problems and screening of defective products to avoid loss expansion ^ = this, test operations It is an indispensable and important process in the packaging of semiconductor components. Among the various test operations in the + conductor component assembly process, the functional testing of the element is particularly important. The elementary method is mainly to set a certain number of In the middle, transfer to the side of the test machine, and then test the semi-finished product and semiconductor components through the test machine until the semiconductor components of the test object complete the measuring arm. E's original position 'is then taken out by the arm-the object to be tested is transferred to the test area for measurement 2 == step by step, until the object to be tested is completed. Although the test method provides a kind of semi-conductor test after sealing = method, however, the test method is to move in each time-the object to be tested, move out after the test is completed, and then proceed to the next test of the object to be tested. After the operation mode, the Ejia test efficiency is transferred to the robot by the robotic arm. The test method is used to make the best use of this test. The main purpose of the present invention is to provide an innovative semiconductivity. Description of the invention (^) The body component method can shorten the waiting time of the test component to complete the test in a more efficient manner; ^ :: before the purpose of the disclosure, the semiconductor device test adopted by the present invention Fang ^ 4 The object to be tested stored in the remaining balance is moved to a dual temporary storage area. L ':,: Hold the second temporary storage area to temporarily test the object, and the second-temporary storage area is free; The test object on the conveying lane is moved to the dual test area ^ and cooperates with the placement and transfer module to maintain the dual test area at all times = state: state the test head of the test component to order the test object in a continuous manner, and then , Will pass the test track through The zone transfer port carries E, and causes the object to be tested periodically to be transported, and the dual temporary storage area, the dual test area, and the specific transport mode are distributed; :: plan, so that it can reduce the idle time waiting for the test component, effectively Improve its testing efficiency, and then provide a more specific component test method. ~ Hezhuzhiniu Potted head Γ Μ 查 委 M can further-to understand the specific design of the present invention, and his purpose, bismuth is attached with a picture The detailed description of the formula is as follows: (1) Schematic part: Figure 1st Figure 4th Figure 5th Figure 6th Figure 7th Figure is a schematic plan view of a top view of a state-of-the-art equipment according to the present invention. ) Is the operation schematic diagram of the present invention (two). Is the operation schematic diagram of the present invention (three). Is the operation schematic diagram of the present invention (four). Is the operation schematic diagram of the present invention (five). Is the operation schematic diagram of the present invention (six) ). A7 V. Description of the invention (eighth figure (b)) (10 (11 (12 (13 (14 (15 (2 0 (21 (23: is the part of the operation diagram of the present invention drawing number:) test equipment) bearing E) ^ 1) The first temporary storage area () the pick-up assembly (1) the first test area () the pick-up and transfer assembly) the test object <) the first test object () the third test object r 7 12) carousel 1 2 2) The second temporary storage area 14) The test component 1 4 2) The second test 0) The semiconductor device 2) The second test object 4) The fourth test object (Please read the precautions on the back before filling (This page) The test performed after sealing in the semiconductor device tester of the present invention is designed = for the semiconductor device manufacturing process Wf (10), and the test equipment (10) includes at least · a = bearing of a plurality of objects to be tested ... U, 'group is used for conveying the conveying track with double temporary storage area (121) (122)),-assembled on the side of the conveying track (12) for picking up the moving load E (1 1), which can be moved up and down and Push out and receive the test box assembly (1 3), a set of sigma-type assemblies (1 4) with dual test areas (丄 4 丄) (work $ 2), and an assembly set in the test assembly (1 4 ) And lose A three-degree space-movable pick-and-place component (15) between the tracks (12), the aforementioned object to be tested is provided with at least one semiconductor element to be tested on a carrier, and the I / O connection of the semiconductor element to be tested is Point down, the aforementioned test AW -------- 1 --------- ^ Private paper iiF Chinese national standard ⑽χ 297 公 536536770 V. Description of the invention 4 components (1 4) towel It has a movable test head and f brain related components (not shown), wherein the test head can be moved between the two test areas (1 4 1) (1 4 2). The test method of the present invention includes the following steps: The step of moving the test object (2 0) to the conveying track (丄 2) is to use the S component (1 3) to push the test object (2 0) out of the load bearing (1 1) and transfer it to the execution position ( 2), through the transport track (Work 2) to the second temporary storage area (122), and maintain the second temporary storage area (12 2) temporarily to be tested (2 0), _ temporary storage Area (the idle state; Ί) the step of moving the to-be-tested (2 0) on the second temporary storage area (122) of the conveying track (12) to the test component (丄 4), using the take-to-remove component ( 1 5) Second temporary storage area (1) ) Relocate the test object (2 0) to the test component (on the two test areas (141) (142) ', and maintain the second row of test areas U4D (142) with the test object (20)). The line / pair is placed in the test area (141) (142). The step of measuring the test object is to use the movable test head in the test component (14) to sequentially receive the test object. I / q contact of the semiconductor element, and the computer in 2 pieces of j 1 4) tests the semiconductor to determine whether the function of the semiconductor element is normal or not; and returns the test object that has completed the test to the difficulty (Η) steps, two TwT! Pieces (15) self-test components (14) test area for the transport track (⑴'s first temporary storage area (121) =: ^ national standard 536770 A7 five invention description (t Β7 transfer To the original position of the load-bearing kun (1 1), and complete the test operation of taking the E component (1 3). The following will further explain the test party of the present invention with actual operating situations :: Please refer to the second to seventh figures, first: take a set of bearers ... 1) move from the preparation area to the rotation, the list (9 At the side end, the self-supporting £ (1 1) will move the-to-be-interest (2 1) on the conveying track (12), as shown in the second figure, $ through the conveying track (12) conveying Go to the second temporary storage area (122), and relocate and transfer the component (1 5) to the second test area ("2) of the second test object (2 1) and test T two (two 4), The test head of the test component (1 4) sequentially detects the first product (2 ι), the aforementioned first test object (21) is relocated to the test button 2 \ 4) the second test area ( 142) At the same time, the second test object (22) was moved to the transport lane (1 because the transport lane (1: brother-temporary storage area (⑴) was free), and the component (13) was automatically set to 11). 2) It is transported to the second temporary storage area (122). If the first test area (141) of the first test component (14) is idle, the second test object (1 5) 2 2) Test area (14 1), and at the same time as transfer, due to rotation) Second The storage area 022) is idle. As shown in the fourth figure, the hiding component (1 3) is then self-supported. (1 1) transfers the third object to be tested (2 3) on the conveying track (12) to the second Temporary storage area (122) waits for 4 temples 0 '. Secondly, the second test area (i 4 2) is the first item to be tested (Chinese national standard for clothing paper size (CNSM4 specification (210 X 297 mm)) 536770 A7 B7 V. Description of the Invention (Complete the test first, the test head is successively moved to the second test object (2?), The warehouse one, 丄 4 1) and the first component to be moved (ΓΓ, the first test object (21) Temporary storage area (121), such as the transfer of the transport track (12), the first ... The piece (13) is transferred to the original position of __ (11), and the other), such as the first 丄 H) private storage area (122 2 As shown in the figure, the third test object (23) is shifted to f), and at the same time, the ® component (1 3) is taken out of the load bearing (1) and the fourth test object (24) is shifted and transferred Go to the second temporary storage area (122), as shown in the seventh figure. 12) 'Move the transfer module (丄 5) to place the third object to be tested: After the two test areas (...), continue to the first The second stand of the test area Xi / cheng test _ (2 2) relocation Send off road (^ 9 storage area (121) 'as shown in the eighth figure' and then transfer to the bearing s (1 1) in situ via the conveying track (= Concord assembly (1 3) ') On the other hand, take Transfer the component (1 5) to the second temporary storage area 122) 'Move the fourth object to be tested (24) to the first test area (work 4 1), and at the same time, take the cassette component (1 3) and carry it by itself In the box (work), the next object to be measured (20) is shifted to the transport track (12), and is output to the second temporary storage area (122). In this way, the test operation of semiconductor components is continued until the After each test object (2 0) in the bearing E (1 1) is tested, the loading box assembly (丄 3) removes the loading box (1 1) and then continues the test in the next loading box (待). Test operations.
(CNS)A4 規格（210 X 297 公釐） 536770 A7 B7 五、發明說明（^ ) 經由前述說明·當可歸納本發明之特點在於： 本發明利用雙測試區以及雙暫存區之設計，配合特定 的輸送模式設計，使其測試組件的測試頭以連續式對待測 物進行測試作業·減少測試頭等待的間置時間，而以更有 效率的配送方式完成半導體元件的測試作業。 斤述本發明藉其創新的測試方法設計，確 供一種較習用半導！#元A、、日丨& $ 丨％」敌 件’則s式更具有產聿利用姓 因此，本發明符合發明 ㈣用f生之方法， 申請。 辑利之法定要件，t依法具文提出 n ϋ _ in.—Jmwi, (請先閲讀背面之注意事項再填寫本頁) -n n n n 訂---------^Jlk (210 X 297 公釐） ί、纸張尺度適用中國國家標準^^(CNS) A4 specification (210 X 297 mm) 536770 A7 B7 V. Description of the invention (^) According to the foregoing description, the features of the present invention can be summarized as follows: The present invention uses the design of dual test areas and dual temporary storage areas to cooperate The specific conveying mode design enables the test head of the test component to perform the test operation of the object to be tested in a continuous manner. The waiting time of the test head is reduced, and the semiconductor device test operation is completed by a more efficient distribution method. Describe the invention with its innovative test method design, to provide a more conventional semiconducting! # 元 A 、、 日 丨 & $ 丨% "enemy" then the s-type has more production and utilization of surnames. Therefore, the present invention is consistent with the invention and uses the method of birth. The statutory requirements for the collection of profits, according to the law, n n _ in.—Jmwi, (Please read the notes on the back before filling this page) -nnnn Order --------- ^ Jlk (210 X 297 public (Centimeter) ί, paper standards apply Chinese national standards ^^