JPS63215974A - Handling apparatus - Google Patents
Handling apparatusInfo
- Publication number
- JPS63215974A JPS63215974A JP5061487A JP5061487A JPS63215974A JP S63215974 A JPS63215974 A JP S63215974A JP 5061487 A JP5061487 A JP 5061487A JP 5061487 A JP5061487 A JP 5061487A JP S63215974 A JPS63215974 A JP S63215974A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- contact
- stage
- section
- measured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 37
- 238000005259 measurement Methods 0.000 claims abstract description 15
- 230000002950 deficient Effects 0.000 abstract description 8
- 238000001514 detection method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
c厘業上の利用分野〕
本発明に半導体装置の電気的測定・分類用ハンドリング
装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a handling device for electrical measurement and classification of semiconductor devices.
従来の半導体装置の電気的測定・分類のためのハンドリ
ング装置においては、測定部において接触子の位置検出
用検出器により接触子の位置を検出し、測定部とa別の
位置検出部において半導体装置の位置検出用検出器によ
り被測定物である半導体装置の位11を検出し、位置の
検出をおこなった半導体装ftを測定部に搬送し、位置
を検出した接触子に蝦送してきた半導体装置の位111
1合せこみ電気的測定を行い、測定結果により測定をお
こなった半導体装置の分類・収容をお仁なっていた。In a conventional handling device for electrical measurement and classification of semiconductor devices, the position of the contact is detected in the measuring section by a detector for detecting the position of the contact, and the position of the semiconductor device is detected in the measuring section and a separate position detecting section. The position of the semiconductor device, which is the object to be measured, is detected by the position detection detector, the semiconductor device whose position has been detected is transported to the measurement section, and the semiconductor device whose position has been detected is transferred to the contactor. Place 111
He carried out integrated electrical measurements and classified and stored the semiconductor devices that were measured based on the measurement results.
上述した従来のハンドリング装置においては、測定部と
は別の位置検出部で半導体装置の位置検出用検出器によ
り被測定物である半導体装置の位1tを検出し、測定部
へ搬送し、接触子の位置検出用検出器により位itを検
出した接触子に位′liを合せ、接触させ、電気的測定
をおこなっていたので。In the above-mentioned conventional handling device, a position detecting section separate from the measuring section detects the position of the semiconductor device, which is the object to be measured, using a detector for detecting the position of the semiconductor device, transports it to the measuring section, and transfers it to the measuring section. Electrical measurements were made by aligning the position 'li with the contact whose position it was detected by the position detection detector and bringing it into contact.
位置合せをおこなりた半導体装置と接触子の位置に位置
ずれ(誤差)′t−生じるという欠点があった。There is a drawback that a positional deviation (error) 't- occurs between the aligned semiconductor device and the contactor.
上記問題点に対し本発明では、被測定半導体装置の位置
と、この半導体装置の電極端子と接触をとるための接触
子の位置とを同一の位rt@出器で検出して両者の位t
ft合せ込むのである。In order to solve the above problems, the present invention detects the position of the semiconductor device under test and the position of the contactor for making contact with the electrode terminal of this semiconductor device using the same digitizer, and
ft is added.
次に1本発明について図面を参照して説明する。 Next, one embodiment of the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例の概略斜視図である。FIG. 1 is a schematic perspective view of an embodiment of the present invention.
第1丙において1本発明のハンドリング袋#ハ。In No. 1 C, 1 Handling bag of the present invention #c.
委品供給部1.創定部2、製品分類収容部3とを含んで
いる。まず、製品供給部1の製品セット台に被測定物で
ある半導体装lf5を収容してろるパレット11t−セ
ットし、製品分類収容部3の良品収容セット台に空のパ
レット30をセットし、製品分類収容部3の不良品収容
セット台に空のパレット31をセットする。測定部2の
位置検出器22が測定部2の接触子21の位置(X 、
Y 、θ方向)を検出する。製品セット台にセットし
であるパレッ)11より収容されている半導体装tit
5金製品供給部1の製品供給ユニット(ロボットハンド
)12が散層して、測定部2の位置合せステージ23に
搬送し乗せ1位置合せステージ23に吸漕し固定する。Commission supply department 1. It includes a creation section 2 and a product classification storage section 3. First, a rolling pallet 11t containing a semiconductor device lf5, which is an object to be measured, is set on the product setting table of the product supply section 1, an empty pallet 30 is set on the good product storage set table of the product classification storage section 3, and the product An empty pallet 31 is set on the defective product storage set table of the classification storage section 3. The position detector 22 of the measuring section 2 detects the position (X,
Y, θ directions). Semiconductor devices contained in pallets (11) set on a product setting table
The product supply unit (robot hand) 12 of the 5-metal product supply section 1 is dispersed, conveyed to the alignment stage 23 of the measurement section 2, and fixed on the 1 alignment stage 23 by suction.
被測定物である半導体装置5を乗せ固定している位置合
せステージ23を測定部2のmd子21の真下まで上昇
させ、測定部2の位置検出器22により半導体装置5の
位it (X 、 Y 、θ方向)tl−検出し、半導
体装置5の乗っている位置合せステージ23をX、Y、
θ方向に移動させ、接触子21の位置に半導体装置5の
位置合せ1位置合せステージ23i更に上昇させ%接触
子21に半導体装置5の電極パッドt−接触させ、テス
タ(図示せず)により電気的測定を行う。電気的測定を
終えると、半導体装1It5の乗った位置合せステージ
23は下降し当初の位置で停止する。製品分類収容部3
の製品分類ユニット(ロボットハンド)32が位置合せ
ステージ23上の電気的測定の終えた半導体gR5を散
層し%電気的測定の結果により、良品でおれば良品収容
セット台にセットされたパレット30に搬送・収容し、
不良品であれば不良品収容セット台にセットされたパレ
ット31に搬送・収容する。The positioning stage 23 on which the semiconductor device 5 as the object to be measured is placed and fixed is raised to just below the MD element 21 of the measuring section 2, and the position detector 22 of the measuring section 2 determines the position of the semiconductor device 5 (X, (Y, θ directions) tl-detection, and aligns the alignment stage 23 on which the semiconductor device 5 is mounted in the X, Y,
The semiconductor device 5 is moved in the θ direction to align the semiconductor device 5 to the position of the contact 21.The alignment stage 23i is further raised to bring the contact 21 into contact with the electrode pad t of the semiconductor device 5. Perform targeted measurements. When the electrical measurement is completed, the alignment stage 23 on which the semiconductor device 1It5 is placed is lowered and stopped at the initial position. Product classification storage section 3
The product classification unit (robot hand) 32 scatters the semiconductor gR5 that has been electrically measured on the alignment stage 23, and if it is a non-defective product based on the result of the electrical measurement, the pallet 30 is set on the non-defective product storage set table. transported and housed in
If the product is defective, it is transported and stored on a pallet 31 set on a defective product storage set table.
前述の実施例では接触子に被測定物でおる半導体装置の
位置を合せたが、逆に半導体装置に接触子の位置を合せ
てもよい。In the above-described embodiment, the semiconductor device, which is the object to be measured, is aligned with the contact, but the contact may be aligned with the semiconductor device.
以上説明したように本発明は、測定部において同一の位
置検出器で被測定物でおる半導体装置と接触子の位置を
検出し、位[11を合せこむことにより1位を精度がよ
いという効果がある。As explained above, the present invention has the effect of detecting the positions of the semiconductor device and the contactor of the object to be measured using the same position detector in the measuring section, and by combining the position [11], the first position can be determined with high accuracy. There is.
第1図は本発明の一実施例の概略を示す@視図である。
l・・・・・・製品供給部、11・・・・・・パレット
、12・・・・・・ロボットハンド、2・・・・・・測
定部、21・・・・・・接触子、22・・・・・・位置
検出器、23・・・・・・位置合せステージ、3・・・
・・・製品分類収容部、30・・・・・・良品用パレッ
ト、31・・・・・・不良品用パレット、32・・・・
・・ロボットハンド、5・・・・・・半導体装置。FIG. 1 is a diagram schematically showing an embodiment of the present invention. 1...Product supply section, 11...Pallet, 12...Robot hand, 2...Measurement section, 21...Contact piece, 22...Position detector, 23...Positioning stage, 3...
...Product classification storage section, 30...Pallet for good products, 31...Pallet for defective products, 32...
...Robot hand, 5...Semiconductor device.
Claims (1)
と、このステージに載置された半導体装置の電極端子と
接触をとるための接触子とを有する測定部と、前記測定
部に半導体装置を供給する製品供給部と、前記測定部で
測定の終つた半導体装置を分類収容する製品分類収容部
とを有するハンドリング装置において、前記測定部には
さらに、前記接触子の位置と前記ステージ上の半導体装
置の位置とを検出し両者の位置を合せ込む一つの位置検
出器を備えていることを特徴とするハンドリング装置。A measuring section having an alignment stage on which a semiconductor device as an object to be measured is placed, a contactor for making contact with an electrode terminal of the semiconductor device placed on the stage, and a semiconductor device placed on the measuring section. In the handling device, the handling device has a product supply section and a product classification storage section that sorts and stores semiconductor devices that have been measured in the measurement section, and the measurement section further includes information on the position of the contact and the semiconductor devices on the stage. 1. A handling device comprising a single position detector that detects the position of the device and aligns the two positions.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5061487A JPS63215974A (en) | 1987-03-04 | 1987-03-04 | Handling apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5061487A JPS63215974A (en) | 1987-03-04 | 1987-03-04 | Handling apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63215974A true JPS63215974A (en) | 1988-09-08 |
Family
ID=12863851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5061487A Pending JPS63215974A (en) | 1987-03-04 | 1987-03-04 | Handling apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63215974A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01302800A (en) * | 1989-04-20 | 1989-12-06 | Japan Electron Control Syst Co Ltd | Coordinate data forming equipment in electronic parts automatic mounting machine |
JPH02272371A (en) * | 1989-04-13 | 1990-11-07 | Tokyo Electron Ltd | Semiconductor checking device |
JPH02281165A (en) * | 1989-04-21 | 1990-11-16 | Tokyo Electron Ltd | Semiconductor inspection apparatus |
JPH03152480A (en) * | 1989-11-09 | 1991-06-28 | Japan Synthetic Rubber Co Ltd | Testing apparatus for electronic part |
JPH04343077A (en) * | 1991-05-21 | 1992-11-30 | Mitsubishi Electric Corp | Method and apparatus for forming and sorting storage of semiconductor product |
CN107817408A (en) * | 2017-09-27 | 2018-03-20 | 深圳市长盈精密技术股份有限公司 | A kind of electrical measurement mechanism |
-
1987
- 1987-03-04 JP JP5061487A patent/JPS63215974A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02272371A (en) * | 1989-04-13 | 1990-11-07 | Tokyo Electron Ltd | Semiconductor checking device |
JPH01302800A (en) * | 1989-04-20 | 1989-12-06 | Japan Electron Control Syst Co Ltd | Coordinate data forming equipment in electronic parts automatic mounting machine |
JPH0257360B2 (en) * | 1989-04-20 | 1990-12-04 | Japan Electronic Control Syst | |
JPH02281165A (en) * | 1989-04-21 | 1990-11-16 | Tokyo Electron Ltd | Semiconductor inspection apparatus |
JPH03152480A (en) * | 1989-11-09 | 1991-06-28 | Japan Synthetic Rubber Co Ltd | Testing apparatus for electronic part |
JPH04343077A (en) * | 1991-05-21 | 1992-11-30 | Mitsubishi Electric Corp | Method and apparatus for forming and sorting storage of semiconductor product |
CN107817408A (en) * | 2017-09-27 | 2018-03-20 | 深圳市长盈精密技术股份有限公司 | A kind of electrical measurement mechanism |
CN107817408B (en) * | 2017-09-27 | 2020-10-27 | 深圳市长盈精密技术股份有限公司 | Electric measuring mechanism |
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