JPS63246686A - Tester for semiconductor device - Google Patents

Abstract

PURPOSE:To enable alteration of specimens and simultaneous alteration of frequency of measurement in a short time, by moving a board capable of positioning and housing a plurality of semiconductor devices vertically, longitudinally and horizontally to be connected to a contact. CONSTITUTION:A table 14 holding a board 13 in which a semiconductor device 12 is housed is moved longitudinally and horizontally to position the board 13. Thereafter, with the lifting of the board 13, an external lead 12a of the semiconductor device 12 is brought into contact with an upper contact 11 to measure electric characteristic thereof. After the end of measurement, the board 13 is lowered, pitch moved sideways and lifted again to bring the external lead 12a into contact with the upper contact 11. Then, a test is conducted. This operation is performed sequentially to measure semiconductor devices 12 on the board 13 electrically.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of industrial application] The present invention relates to a test device for measuring the electrical characteristics of a semiconductor device.

[Conventional technology]

A conventional semiconductor device testing apparatus will be explained with reference to FIG. Figure 3 shows the flat package test GR! In Figure 1, +11 is a conductive pallet that is used to transfer ICs between devices and stores a large number of ICs, (21 is a baren), an XY table that holds ill 'i and performs pinch feeding; (31 is a transfer rail A for transferring ICs at a fixed pitch, +41 is a transfer suction head A for transferring ICs from the barrel l-(1) to the transfer rail A131, 151 is an IC socket, +61 is I(4-
Workpiece C socket (positioning tool for positioning workpiece C before inserting it into 51, fil is workpiece Cfe transport rail A (3
) to the positioning tool (61, and from the positioning tool +61 to the machine C socket (5), and then from the IC socket (5) to the transport rail B described later. +81 is the machine C1 IC socket 5) An IC presser cover that presses down the lead of engineering C to obtain contact pressure after insertion into the IC, 1
9) is a transport rail B that transports the ICs after measurement to a classification sorter (not shown).

Pick up the IC from the pallet (1) containing the IC6 with suction head A.
It is picked up at (4) and placed on the transport rail A (3). Conveyance rail A (31 performs pitch feeding, and pallet 1) is transferred to the XY table (21 performs pitch movement and transfers to a new I
Place C on transport rail A (3). Repeat this. The conveyor rail A (3) repeats pitch feeding. The IC has been sent to the end of the transport rail A131.

It is placed in the positioning tool (6) and positioned by the suction head B171. The IC which has been placed in position ff1P is further placed into the socket C (5) by the suction head B (7).

After the suction head B171 cuts off the workpiece C and rises.

The IC presser lid (81) presses the IC presser C into contact with the leads of the IC presser C and the contacts.The test starts here.

When the test is completed, the presser foot 181 opens. Then, the suction head Bf71 descends to suction the IC and places it on the transport rail B (9). Repeat these actions.

[Problem that the invention seeks to solve] Current semiconductor Wit is multi-packaged (D/P).

ZIP, SoJ, F30p, QIP, P
As LCCs and the like are becoming more advanced, conventional test equipment such as the one described above, which handles and tests semiconductor devices, is comprised of many parts and EA structures, as shown in FIG. Therefore, when changing the type of semiconductor device, it is necessary to change many parts, which requires a lot of time for two changes, and it also costs money to prepare a dedicated machine for each type.

There were problems with factory space, equipment management, design and development period, etc.

Additionally, as semiconductor devices are now becoming more and more pin-multiple, handling individual ICs as in the conventional test equipment described above can lead to damage such as bending of external leads. Ta.

This invention was made in order to solve the above-mentioned problems, and aims to provide a testing device for semiconductor devices that can reduce the number of simultaneous measurements to one type in a short time, and that is less likely to cause lead bending. shall be.

[Means to solve all problems]

A test device for a semiconductor device according to the present invention is a test device for a semiconductor device.

A board capable of positioning and storing a plurality of semiconductor devices, and a board 61 for holding this board and placing the board on top.
It is equipped with a holding table that can be moved back and forth and left and right, and a contactor that is located above the board and comes into contact with the external leads of the semiconductor device to perform measurements.

[Effect]

In this invention, a board with constant external dimensions is handled rather than a single semiconductor device, so no matter what type of semiconductor device is housed,
There is no need to change the feeding mechanism part, the holding table, which is used to make money, and the number of simultaneous measurements can be increased by simply changing the number and shape of the contacts.In addition, handling of individual semiconductor devices is easy. Since there is no bending, damage such as lead bending can be reduced.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a perspective view, and FIG. 2 is an enlarged sectional view taken along line 1--1 in FIG. In the figure, (IIJ is a contact that is brought into contact with the external lead (12aJ) of the semiconductor device (12) to measure the electrical characteristics; (12J is the external lead (12aJ)
and a mold part (12b),
(13) is made of an insulating material and has a groove for positioning and housing the semiconductor device (12) (13a), and this block (13a) is made of conductive plates (13bJ) attached in large numbers at a constant pitch. The board (14) is an XYZ table that holds the board (13) and consists of a unit that moves up and down and a unit that moves back and forth and left and right.

Next, the operation will be explained. After positioning the board (13) by moving the table (14) held on the board C13)', which houses the semiconductor device (12), back and forth, left and right, the board (13) is raised and the semiconductor device is placed! 1 (12) of the external lead (12a) is brought into contact with the upper contactor (11),
Measures the electrical characteristics of semiconductor devices. Board after measurement (1
3), move the board (13) horizontally, and raise the board (13) again to connect the external board (12a).
The test is carried out by touching the upper contactor (11).

This operation is performed one after another to perform electrical measurements on each semiconductor 3fffit (12) on the board (13).

〔Effect of the invention〕

As described above, according to the present invention, since semiconductor devices are not handled, it is possible to change one type of product by simply changing the contacts, and there is no damage such as bending of leads, and since the object to be handled is large, the mechanism can be changed. It has the effect of being simple, requiring less JAIl, and being inexpensive.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is an enlarged sectional view of the plate taken along the line d in FIG. 1, and FIG. 3 is a conventional test V
It is a schematic diagram showing Itit. (IIJ is a contact, (12) is a semiconductor device. (12aJ is an external lead, (13) is a board. (14) is a holding stand. Note that the same line number in each figure indicates the same or equivalent part.

Claims (1)

[Claims] (1) A board capable of positioning and storing a plurality of semiconductor devices, a holding stand capable of holding the board and moving the board up and down, back and forth, left and right, and a board located above the board. A contact element is provided that makes contact with an external lead of a semiconductor device to perform a measurement, and the external lead of the semiconductor device on the board is brought into contact with the contact element by moving and raising the board to a predetermined position by the holding table. 1. A test device for a semiconductor device, characterized in that it performs electrical measurements by