JP3227968B2 - Multiple simultaneous contact mechanism of TSOP IC - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mechanism for simultaneously contacting a large number of TSOP type ICs with an IC socket. An apparatus using the multiple simultaneous contact mechanism of the TSOP IC includes, for example, an auto handler.

[0002]

2. Description of the Related Art A TSOP type IC includes an IC 11 with a lead frame 11A shown in FIG. 7A and an IC 1 without a lead frame shown in FIG. 7A. Regarding the contact mechanism of an IC with a lead frame, the applicant has
It is disclosed in the specification of 4-88172. Further, a multi-contact mechanism of an IC with a lead frame at high and low temperatures is disclosed by the present applicant in the specification of Japanese Utility Model Application No. 5-27844.

In the above-mentioned two specifications, a guide pin is provided in an IC socket, and a hole 11 provided in a lead frame 11A is provided.
A guide pin is inserted in B, and the leads of the IC 11 and the contacts of the IC socket are aligned. As described above, an IC with a lead frame facilitates the electrical testing process of the IC. That is, an IC with a lead frame is an IC
After the electrical test, the lead frame 11A is removed and shipped as a product.

On the other hand, after the lead frame 11A is removed, there is a case where an IC is subjected to an electrical test and a process of shipping the IC as a product is selected. TSO without lead frame
Although the transfer or contact mechanism of the P-type IC is not easy, the following two contact mechanisms are considered.

Next, the structure of a first contact mechanism according to the prior art will be described with reference to FIG. 8 is a TSOP type I.
Reference numerals C and 6 denote adsorbers, 7 denotes an alignment stage, 8 denotes a storage stage, 13 denotes an IC socket, and 14 denotes a pressing plate.

In FIG. 8A, the IC 1 is housed in the recess 7A of the alignment stage 7, and the IC 1
C1 is correctly positioned. Absorber 6 is arranged on alignment stage 7. The suction device 6 has a suction pad 6A made of rubber at the tip, and the suction device 6 is connected to a vacuum pump (not shown). That is, the suction pad 6 is switched by switching the pneumatic circuit connected to the vacuum pump.
The inside of A becomes negative pressure and comes into contact with IC1, and the adsorber 6
1 is adsorbed. The suction device 6 includes a driving device and a spring 6 for protecting the IC 1 when the IC 1 is suctioned.
B elastically holds.

From the state shown in FIG. 8A, the suction device 6 is lowered by a driving device (not shown). When the suction device 6 sucks the IC 1 in the alignment stage 7, the suction device 6 moves up. The suction device 6 moves onto the IC socket 13 while holding the IC 1. The adsorber 6 descends and the IC socket 1
After desorbing the IC 1 on 3, the adsorber 6 rises.

The IC socket 13 is provided with upright taper guides 13A for guiding the four corners of the IC 1. That is, when the adsorber 6 detaches the IC1, the IC1 is guided by the taper guide 13A, and the lead of the IC1 and the IC socket 1 are moved.
The third contact 13B is positioned. IC socket 13
The pressing plate 14 is arranged on the upper side. A convex portion 14A is formed on the lower surface of the pressing plate 14, and when the pressing plate 14 descends,
The protrusion 14A presses the lead of the IC 1 against the contact 13B of the IC socket 13.

FIG. 8A shows a state in which the pressing plate 14 is lowered and the IC 1 is pressed against the IC socket 13. In the state of FIG. 8A, the IC 1 is subjected to an electrical test by an IC tester connected to the IC socket 13. When the electrical test is completed, press plate 1
4 rises.

[0010] In FIG. 8 C, the IC 1 having been measured is replaced with the adsorber 6.
And move to the accommodation stage 8. The adsorber 6 detaches the IC 1 from / to the concave portion 8A provided in the accommodation stage 8.
In FIG. 8, a series of operations from FIG. 8A to FIG.
Convey C1 and measure.

Next, the configuration of a second contact mechanism according to the prior art will be described with reference to FIGS. 9 and 10. FIG. Reference numeral 9 in FIG. 9 denotes a carrier formed of a synthetic resin material. TSO in carrier 9
A recess 9A into which the P-type IC 1 is inserted is formed, and two leaf springs 9B for elastically holding the IC 1 from the side are provided in the recess 9A.

FIG. 9A shows a state before the IC 1 is mounted on the carrier 9, and FIG. 9A shows a state where the IC 1 is mounted on the carrier 9 and the IC 1 is elastically held by a leaf spring 9B. Note that four notches 9C are provided on the side surface of the carrier 9. In the second contact mechanism shown in FIG. 9, the IC 1 is mounted on the carrier 9 before the electric test. Second
In the contact mechanism (1), the IC 1 with a carrier is transported.

Reference numeral 15 in FIG. 10 denotes an IC socket.
The socket 15 is provided with a tapered guide 15A for guiding the notch 9C shown in FIG. In FIG. 10A,
The IC 1 with a carrier is provided by a transport mechanism (not shown).
It moves on the socket 15. Note that the carrier 9 in FIG. 10A is a state where the carrier 9 in FIG.

When the carrier 9 descends from the state shown in FIG. 10A, the taper guide 15A enters the notch 9C of the carrier 9, and the contact 15B between the lead of the IC 1 and the IC socket 15.
Are positioned, and the state shown in FIG. In FIG. 10A, a pressing plate (not shown) is arranged on the IC socket 15. When the pressing plate is lowered, the lead of the IC 1 is pressed against the contact 15B of the IC socket 15.

[0015]

In the first contact mechanism,
Since the ICs 1 are conveyed one by one by the suction device 6, the efficiency is low. A plurality of IC sockets 15 shown in FIG.
When many ICs are measured at the same time, if the ICs 1 are sequentially moved by the adsorber 6, the IC 1 cannot be measured during the moving time, so that there is a problem that the processing capacity is poor. In the second contact mechanism, it is necessary to mount the IC 1 on the carrier 9 in advance, and there is a problem that the mounting or removing operation is troublesome.

According to the present invention, a recess is formed vertically and horizontally in an IC container, and a TS is provided in a carrier which is finely movable with the recess.
A large number of TSOP type ICs which accommodate OP type ICs, and in which individual ICs are aligned with the leads of the ICs and the contacts of the IC sockets by positioning pins erected on the IC sockets, and press the ICs into the IC sockets by pressing plates. It is intended to provide an individual simultaneous contact mechanism.

[0017]

In order to achieve this object, according to the present invention, an inclined portion 2A for guiding a TSOP type IC 1 at four corners is formed, and a concave portion 2B for accommodating the TSOP type IC 1 is formed. A hole 2C is provided in the recess 2B so as to escape the lead of the TSOP type IC1, a reference hole 2D is provided in a first corner, and a fine adjustment hole 2E is provided in a second corner diagonally opposite to the first corner. A carrier 2 having a reference square hole 2F at a third corner and a recess 3A for accommodating the carrier 2 are formed vertically and horizontally, and the recess 3A
A reference pin 3B that enters the reference hole 2D is erected at the first corner of
A fine adjustment hole 2E is formed in a second corner diagonally opposite to the first corner of the recess 3A.
The IC container 3 having the guide pins 3C to enter therein, the guide prism 4A to enter the reference square hole 2F, and the guide prism 4B to enter the hole 2C.
And a plurality of I's arranged at positions corresponding to the recesses 3A.
A C socket 4 and a plurality of pressing plates 5 which are formed with a convex portion 5A which comes into contact with the lead of the TSOP type IC 1 and are arranged at positions corresponding to the concave portions 3A, are provided with a large number of TSOP type ICs 1 in the IC container 3. When the IC container 3 is lowered in the individually accommodated state, the carrier 2 is guided by the guide prism 4A and the guide prism 4B, so that the carrier 2 moves slightly and the TSO
The lead of the P-type IC 1 and the contact 4C of the IC socket 4 are aligned with each other, and the pressing plate 5 descends to make the TSOP-type IC.
One lead is pressed against the contact 4C of the IC socket 4.

[0018]

According to the above construction, the reference pin 3B and the guide pin 3C provided in the concave portion 3A of the IC container 3 are inserted into the reference hole 2D and the fine adjustment hole 2E of the carrier 2, and the carrier 2 is mounted on the carrier 2.
It is held movably in the C container 3. I in IC container 3
When the IC container 3 descends in a state where a large number of C1s are accommodated, the carrier 2 becomes the guide prisms 4A and 4 of the IC socket 4.
Carrier 2 moves minutely by being guided by
The leads of C1 and the contacts 4C of the IC socket 4 are individually aligned. Further, the pressing plate 5 presses the lead of the IC 1 against the contact 4C of the IC socket 4 to ensure the contact. As described above, according to the present invention, a large number of ICs are reliably brought into contact at the same time, so that the processing capability of the ICs is improved.

[0019]

FIG. 1 shows the structure of a contact mechanism according to the present invention.
An example will be described. FIG. 1A is a plan view, and FIG.
A is an exploded sectional view of FIG. 1A. 1 is a carrier, 3 is an IC container, and 4 is an IC socket.

In FIG. 1, the carrier 2 is a TSOP type IC.
An inclined portion 2A that guides 1 at four corners is formed. A recess 2B for accommodating the IC 1 is provided at the center of the carrier 2.
Is formed, and a hole 2C is provided in the concave portion 2B so as to escape the lead of the IC1. In the first corner of the carrier 2, a reference hole 2
D is provided, and a fine adjustment hole 2E is provided at a second corner diagonally opposite to the first corner. The fine adjustment hole 2E is a diagonally elongated hole. At the third corner of the carrier 2, a reference square hole 2F is provided.

The IC container 3 has a recess 3A for accommodating the carrier 2 formed vertically and horizontally. In FIG. 1, the recess 3 </ b> A is enlarged by only one portion to facilitate the description of the configuration.
At a first corner of the concave portion 3A of the carrier 2, a reference pin 3B which stands in a reference hole 2D is provided upright. At a second corner diagonally opposite to the first corner of the recess 3A, a guide pin 3C is provided to enter the fine adjustment hole 2E.

The guide prism 4A that enters the reference square hole 2F of the carrier 2 and the guide prism 4B that enters the hole 2C of the carrier 2 are integrated into an IC.
The socket 4 stands upright. Further, a plurality of IC sockets 4 are arranged at positions corresponding to the recesses 3A of the IC container 3.

Next, the operation of FIG. 1 will be described with reference to FIGS. In FIG. 2A, the IC 1 is moved onto the carrier 2 with the adsorber 6 adsorbing the IC. Next, the adsorber 6 is connected to the IC 1
When IC is detached, IC1 falls, is guided by inclined portion 2A, and IC1 is accommodated in concave portion 2B to be in the state shown in FIG.
When the ICs 1 are sequentially housed in the plurality of carriers 2, the IC housing 3 descends toward the IC socket 4.

FIG. 3A shows the same state as FIG. 2A, and FIG. 3A shows the state where the IC container 3 is joined to the IC socket 4 from the state of FIG. In FIG. 3A, the carrier 2 is slightly moved by being guided by the guide prism 4A and the guide prism 4B, and the lead of the IC 1 and the IC socket 4 are moved.
Contact 4C is aligned.

Reference numeral 5 in FIG. 4 denotes a pressing plate, and a comb-shaped convex portion 5A corresponding to the lead of the IC 1 is formed on the bottom of the pressing plate 5. Further, a plurality of pressing plates 5 are arranged at positions corresponding to the concave portions 3A of the IC container 3. When the state of FIG. 3A is completed, the plurality of pressing plates 5 descend integrally.
FIG. 4A is a state diagram before the pressing plate 5 descends, and FIG. 4A is a state in which the pressing plate 5 descends, and the protrusion 5A connects the lead of the IC 1 to the IC.
It is pressed against the contact 4C of the socket 4 to ensure the contact. In FIG. 4A, a large number of ICs 1 are electrically tested at the same time.

FIG. 5 is an external view of the IC container 3.
The container 3 can accommodate eight ICs 1 vertically and horizontally. Also, IC
At the center of the container 3, a reference hole 3D is formed.
Two elliptical guide holes 3E are formed on the same straight line as the center of D. The reference hole 3D is guided by a reference pin 20A of the measurement substrate 20, which will be described later.

In FIG. 5, the IC container 3 is an IC carrier 10
Are arranged vertically and horizontally. That is, if this IC carrier 10 is used, 32 ICs 1 can be carried simultaneously.
In FIG. 5, the IC container 3 is held in the recess 10A so as to be freely movable in the IC carrier 10 in the horizontal direction, and the upper surface of the IC container 3 is covered with the lid 10C. Rollers 10B are rotatably held at the four corners of the IC transporter to facilitate transfer of the IC transporter.

Next, an embodiment in which the contact mechanism according to the present invention is incorporated in an apparatus will be described with reference to FIG. Reference numeral 20 in FIG. 6 denotes a measurement board on which eight IC sockets 4 shown in FIG. 1 are mounted. As shown in FIG. 5, since four IC containers 3 are mounted on the IC carrier 10, four measurement substrates 20 are also arranged in the apparatus. Similarly, four pressing units 21 each having eight pressing plates 5 are arranged in the apparatus.

In FIG. 6, the IC transporter 10 containing the IC 1 is transported into the thermostatic bath 22 and held by the elevating mechanism 23. Next, the elevating mechanism 23 is lowered, and the IC container 3 is positioned with respect to the measurement substrate 20 by the reference pins 20A. Further, when the elevating mechanism 23 is lowered, the state shown in FIGS. 2 to 3 is established, and the leads of the IC 1 and the contacts 4C of the IC socket 4 are positioned. Next, when the pressing mechanism 24 lowers the pressing unit 21, the pressing plate 5 presses the IC 1 to ensure the contact of the IC 1.

[0030]

According to the present invention, a recess is formed vertically and horizontally in an IC container, and a carrier held movably with the recess is T-shaped.
The SOP type IC is accommodated, and the individual ICs are positioned with the positioning pins erected on the IC socket so that the leads of the IC and the contacts of the IC socket are aligned. Are transported collectively, so that the processing time can be reduced.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an embodiment of a contact mechanism according to the present invention.

FIG. 2 is an operation explanatory diagram of FIG. 1;

FIG. 3 is a state change diagram of FIG. 2;

FIG. 4 is a state change diagram of FIG. 3;

FIG. 5 is an external view of the IC container 3;

FIG. 6 is a diagram showing an embodiment in which the contact mechanism according to the present invention is incorporated in an apparatus.

FIG. 7 is an external view of a TSOP type IC.

FIG. 8 is a configuration diagram of a first contact mechanism according to the related art.

FIG. 9 is an external view of a carrier 9 used in a second contact mechanism according to the related art.

FIG. 10 is a configuration diagram of a second contact mechanism according to the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC 2 Carrier 2A Inclined part 2B Depression 2C hole 2D Reference hole 2E Fine adjustment hole 2F Reference square hole 3 IC container 3A Depression 3B Reference pin 3C Guide pin 4 IC socket 4A Guide prism 4B Guide prism 4C Contact 5 Press plate 5A Convex part

Continuation of the front page (56) References JP-A-7-209377 (JP, A) JP-A-5-36869 (JP, A) JP-A-3-104137 (JP, A) JP-A-6-47881 (JP) , U) Japanese Utility Model Application Hei 5-73948 (JP, U) Japanese Utility Model Application Hei 5-69949 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 33/76 501 G01R 31/26 H01L 21/66

Claims (1)

(57) [Claims] An inclined portion (2A) for guiding a TSOP type IC (1) at four corners is formed, and a first concave portion (2B) for accommodating the TSOP type IC (1) is formed. A hole (2C) is provided in the first concave portion (2B) so as to escape the lead of the IC (1), a reference hole (2D) is provided in the first corner, and a second hole diagonally opposite to the first corner is provided. A carrier (2) having a fine adjustment hole (2E) at the corner of the carrier and a reference square hole (2F) at the third corner, and a second recess (3A) for accommodating the carrier (2) are formed vertically and horizontally. A reference pin (3B) is inserted into the first corner of the second recess (3A) to enter the reference hole (2D), and the second pin is diagonally opposite to the first corner of the second recess (3A). The IC container (3) that has a guide pin (3C) that stands in the fine adjustment hole (2E) in the corner of the first guide prism (4A) and the hole (2C) that enters the reference square hole (2F) A plurality of IC sockets (4), which are provided with second guide prisms (4B) to be inserted therein and arranged at positions corresponding to the second recesses (3A), and a TSOP type IC (1) lead. And a plurality of pressing plates (5) formed at positions corresponding to the second concave portions (3A), and a TSOP type IC (1) is provided in the IC container (3). When the IC container (3) descends with a large number of
(2) is guided by the first guiding prism (4A) and the second guiding prism (4B), so that the carrier (2) moves a little and moves to TSOP.
Type IC (1) lead and IC socket (4) contact (4C)
Are aligned, and the pressing plate (5) descends to press the leads of the TSOP type IC (1) against the contacts (4C) of the IC socket (4). Contact mechanism.