JP2015105834A - Electronic component inspection device, electronic component inspection method, and program for inspection method - Google Patents

Electronic component inspection device, electronic component inspection method, and program for inspection method Download PDF

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JP2015105834A
JP2015105834A JP2013246645A JP2013246645A JP2015105834A JP 2015105834 A JP2015105834 A JP 2015105834A JP 2013246645 A JP2013246645 A JP 2013246645A JP 2013246645 A JP2013246645 A JP 2013246645A JP 2015105834 A JP2015105834 A JP 2015105834A
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electronic component
inspection
holding
connection
signal
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良徳 藤澤
Yoshitoku Fujisawa
良徳 藤澤
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東京エレクトロン株式会社
Tokyo Electron Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/001Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/001Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
    • G01R31/002Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit

Abstract

PROBLEM TO BE SOLVED: To hold a plurality of electronic components in a weight-reduced holding member and transport those electronic components at high speed.SOLUTION: Provided is an electronic component inspection device or an electronic component inspection method for inspecting an electronic component, to which an inspection signal has been inputted, on the basis of an output signal outputted from the electronic component, the electronic component inspection device being characterized by having a holding member for holding the electronic component, an upper connection member for inputting an inspection signal to the electronic component, and a lower connection member for detecting the output signal outputted from the electronic component, the holding member being disposed between the upper connection member and the lower connection member while holding the electronic component therein during inspection.

Description

本発明は、電子部品検査装置及び電子部品の検査方法に関する。   The present invention relates to an electronic component inspection apparatus and an electronic component inspection method.
電子部品の検査装置には、検査信号の入力に従い電子部品から出力される出力信号に基づいて、電子部品を検査するものがある。電子部品の検査装置には、例えば電子部品の出力端子と電気的に接続されている検査部材(インサートなど)から出力される信号を検出して、電子部品を検査するものがある。   Some electronic component inspection apparatuses inspect electronic components based on output signals output from the electronic components in response to input of inspection signals. Some electronic component inspection devices inspect electronic components by detecting signals output from inspection members (such as inserts) electrically connected to output terminals of the electronic components.
特許文献1には、検査の稼働率を向上するために、予め被試験電子部品(電子部品)の端子と電気的に接続されたインサートを用いて被試験電子部品を搬入し、その後搬入した被試験電子部品を試験(検査)する電子部品試験装置(検査装置)に関する技術を開示している。   In Patent Document 1, in order to improve the operation rate of inspection, an electronic component to be tested is carried in using an insert electrically connected to a terminal of the electronic component to be tested (electronic component) in advance, and then loaded. A technology relating to an electronic component test apparatus (inspection apparatus) for testing (inspecting) a test electronic component is disclosed.
国際公開第2010/004844号パンフレットInternational Publication No. 2010/004844 Pamphlet
しかしながら、特許文献1に開示されている技術では、複数のインサートを備える搬送手段(例えばトレイ)を必要とするため、搬送手段が大型化し、電子部品を高速に搬送することが困難である。また、特許文献1に開示されている技術では、検査のために複数のインサートと複数の電子部品とを電気的に接続させた状態で搬送するため、電子部品の電気的接続部分が擦れて傷つくことがある。   However, since the technique disclosed in Patent Document 1 requires a conveying means (for example, a tray) having a plurality of inserts, the conveying means becomes large and it is difficult to convey electronic components at high speed. Further, in the technique disclosed in Patent Document 1, since a plurality of inserts and a plurality of electronic components are transported in an electrically connected state for inspection, the electrical connection portions of the electronic components are rubbed and damaged. Sometimes.
更に、特許文献1に開示されている技術では、複数の電子部品を同時に検査する場合に、複数のインサートを必要とするため、検査装置のコストが増加する場合があった。   Furthermore, in the technique disclosed in Patent Document 1, when a plurality of electronic components are inspected at the same time, a plurality of inserts are required, which may increase the cost of the inspection apparatus.
本発明は、上記の事情に鑑み、軽量化された保持部材に複数の電子部品を保持し、高速に搬送することができる電子部品検査装置、又は、電子部品の検査方法若しくはその検査方法のプログラムを提供することを目的とする。   In view of the above circumstances, the present invention is an electronic component inspection apparatus capable of holding a plurality of electronic components on a lightweight holding member and transporting the electronic components at high speed, or an electronic component inspection method or a program for the inspection method The purpose is to provide.
本発明の一の態様によれば、
検査信号を入力された電子部品から出力される出力信号に基づいて、前記電子部品を検査する電子部品の検査装置であって、
前記電子部品を保持する保持部材と、
前記電子部品に前記検査信号を入力する上部接続部材と、
前記電子部品から出力された前記出力信号を検出する下部接続部材と
を有し、
前記保持部材は、検査時に、前記電子部品を保持した状態で前記上部接続部材と前記下部接続部材との間に配置される、
ことを特徴とする電子部品の検査装置が提供される。
According to one aspect of the invention,
An electronic component inspection apparatus for inspecting the electronic component based on an output signal output from the electronic component to which an inspection signal is input,
A holding member for holding the electronic component;
An upper connecting member for inputting the inspection signal to the electronic component;
A lower connecting member that detects the output signal output from the electronic component;
The holding member is disposed between the upper connecting member and the lower connecting member in a state where the electronic component is held during inspection.
An electronic component inspection apparatus is provided.
前記下部接続部材により検出された出力信号を折り返し、前記検査信号を入力した前記上部接続部材から出力するリターン信号経路、を更に有してもよい。   There may be further provided a return signal path for returning the output signal detected by the lower connecting member and outputting from the upper connecting member to which the inspection signal is input.
前記保持部材は、複数の桟部材から構成される格子状に並べられた複数の載置部を有し、前記複数の載置部には、前記複数の電子部品が夫々載置されてもよい。   The holding member may include a plurality of placement units arranged in a lattice shape including a plurality of crosspiece members, and the plurality of electronic components may be placed on the plurality of placement units, respectively. .
前記複数の載置部のそれぞれは、略四角形状の開口を有し、前記開口の四隅に支持片を備え、前記支持片は、前記電子部品を支持してもよい。   Each of the plurality of placement units may have a substantially rectangular opening, and may include support pieces at four corners of the opening, and the support piece may support the electronic component.
前記保持部材は、前記載置部の外側に貫通口を有し、前記保持部材の貫通口に前記リターン信号経路を貫通させてもよい。   The holding member may have a through hole on the outer side of the mounting portion, and the return signal path may be passed through the through hole of the holding member.
前記検査部は、入力した前記検査信号と検出した前記出力信号とを比較することによって、前記電子部品の動作が正常か、又は、異常か若しくは異常の予兆があるかを検査してもよい。   The inspection unit may inspect whether the operation of the electronic component is normal, abnormal, or a sign of abnormality by comparing the input inspection signal with the detected output signal.
前記上部接続部材は、前記下部接続部材の位置を検出する撮像部を更に有し、前記下部接続部材は、前記撮像部が撮像した結果に基づいて配置され、前記保持部材は、配置された前記下部接続部材の位置に応じて、該下部接続部材の所望の位置に載置されてもよい。   The upper connecting member further includes an imaging unit that detects a position of the lower connecting member, the lower connecting member is arranged based on a result of imaging by the imaging unit, and the holding member is arranged Depending on the position of the lower connecting member, the lower connecting member may be placed at a desired position.
前記下部接続部材は、プローバーのチャックステージに固定され、前記保持部材が前記下部接続部材に載置される際、前記複数の載置部の開口を通して前記複数の電子部品と前記チャックステージに固定された下部接続部材とが電気的に接触してもよい。   The lower connection member is fixed to a chuck stage of a prober, and when the holding member is mounted on the lower connection member, the lower connection member is fixed to the plurality of electronic components and the chuck stage through openings of the plurality of mounting portions. The lower connecting member may be in electrical contact.
前記下部接続部材は、前記プローバーにより前記チャックステージと位置合わせした状態で該チャックステージに固定されてもよい。   The lower connecting member may be fixed to the chuck stage while being aligned with the chuck stage by the prober.
本発明の他の態様によれば、
検査信号を入力された電子部品から出力される出力信号に基づいて、前記電子部品を検査する電子部品の検査方法であって、
格子状に並べられた複数の載置部を有する保持部材を用いて、複数の前記電子部品を複数の前記載置部で保持する保持ステップと、
前記電子部品を保持した前記保持部材を下部接続部材に電気的に接続して配置する配置ステップと、
上部接続部材を用いて、前記保持部材の上方から前記電子部品に前記検査信号を入力する信号入力ステップと、
前記保持部材を配置された前記下部接続部材を用いて、前記電子部品から出力された前記出力信号を検出する信号検出ステップと、
前記保持部材を貫通して前記下部接続部材に電気的に接続される前記上部接続部材の接続部を用いて、前記下部接続部材が検出した前記出力信号を伝送する信号伝送ステップと、
伝送した前記出力信号に基づいて、前記電子部品を検査する検査ステップと
を含む、ことを特徴とする電子部品の検査方法が提供される。
According to another aspect of the invention,
An inspection method for an electronic component for inspecting the electronic component based on an output signal output from the electronic component to which an inspection signal is input,
Using a holding member having a plurality of placement units arranged in a lattice shape, a holding step of holding a plurality of the electronic components by a plurality of the placement units,
An arrangement step of arranging the holding member holding the electronic component in electrical connection with a lower connection member;
A signal input step of inputting the inspection signal to the electronic component from above the holding member using an upper connecting member;
A signal detection step of detecting the output signal output from the electronic component using the lower connecting member in which the holding member is disposed;
A signal transmission step of transmitting the output signal detected by the lower connection member using a connection portion of the upper connection member that penetrates the holding member and is electrically connected to the lower connection member;
There is provided an inspection method for an electronic component, comprising: an inspection step for inspecting the electronic component based on the transmitted output signal.
また、前記検査方法をコンピュータに実行させるためのプログラムであってもよい。   Moreover, the program for making a computer perform the said inspection method may be sufficient.
本発明に係る電子部品検査装置、又は、電子部品の検査方法若しくはその検査方法のプログラムによれば、軽量化された保持部材に複数の電子部品を保持し、高速に搬送することができる。   According to the electronic component inspection apparatus, the electronic component inspection method, or the program of the inspection method according to the present invention, a plurality of electronic components can be held on the holding member reduced in weight and can be conveyed at high speed.
本実施形態に係る電子部品検査装置の検査プロセスを説明する説明図である。It is explanatory drawing explaining the inspection process of the electronic component inspection apparatus which concerns on this embodiment. 他の検査装置の検査プロセスを説明する説明図である。It is explanatory drawing explaining the inspection process of another test | inspection apparatus. 本実施形態に係る電子部品検査装置が検査する電子部品の一例を説明する説明図である。It is explanatory drawing explaining an example of the electronic component which the electronic component inspection apparatus which concerns on this embodiment inspects. 本実施形態に係る電子部品検査装置が検査する電子部品の他の例を説明する平面図である。It is a top view explaining the other example of the electronic component which the electronic component inspection apparatus which concerns on this embodiment inspects. 本実施形態に係る電子部品検査装置が検査する電子部品の他の例を説明する要部の平面図である。It is a top view of the principal part explaining the other example of the electronic component which the electronic component inspection apparatus which concerns on this embodiment inspects. 本実施形態に係る電子部品検査装置の概要を説明する概略構成図である。It is a schematic block diagram explaining the outline | summary of the electronic component inspection apparatus which concerns on this embodiment. 本実施形態に係る保持部材の配置の一例を示した図である。It is the figure which showed an example of arrangement | positioning of the holding member which concerns on this embodiment. 本実施形態に係る保持部材の配置の一例を示した図である。It is the figure which showed an example of arrangement | positioning of the holding member which concerns on this embodiment. 本実施形態に係る電子部品検査装置の構成の一例を示した図である。It is the figure which showed an example of the structure of the electronic component inspection apparatus which concerns on this embodiment. 本実施形態に係る電子部品検査装置の構成の他の例を示した図である。It is the figure which showed the other example of the structure of the electronic component inspection apparatus which concerns on this embodiment. 本実施形態に係る電子部品検査装置の保持部材の一例を説明する説明図である。It is explanatory drawing explaining an example of the holding member of the electronic component inspection apparatus which concerns on this embodiment. 本実施形態に係る電子部品検査装置の保持部材の他の例を説明する説明図である。It is explanatory drawing explaining the other example of the holding member of the electronic component inspection apparatus which concerns on this embodiment. 本実施形態に係る電子部品検査装置の接続部の一例を説明する平面図である。It is a top view explaining an example of the connection part of the electronic component inspection apparatus which concerns on this embodiment. 本実施形態に係る電子部品検査装置の配線部の一例を説明する説明図である。It is explanatory drawing explaining an example of the wiring part of the electronic component inspection apparatus which concerns on this embodiment. 本実施形態に係る電子部品検査装置と信号の流れを説明するための図である。It is a figure for demonstrating the electronic component inspection apparatus which concerns on this embodiment, and the flow of a signal. 本実施形態に係る電子部品検査装置と信号の流れを説明するための図である。It is a figure for demonstrating the electronic component inspection apparatus which concerns on this embodiment, and the flow of a signal.
添付の図面を参照しながら、限定的でない例示の実施形態に係る電子部品検査装置を用いて、本発明を説明する。本実施形態にかかる電子部品検査装置は、以下に説明する電子部品検査装置以外でも、電子部品に信号を入力して、電子部品から出力される信号に基づいて電子部品の動作状態(正常、又は、異常若しくは異常の予兆など)を検査するもの(装置、機器、ユニット、システムなど)であれば、いずれのものにも用いることができる。   The present invention will be described using an electronic component inspection apparatus according to a non-limiting exemplary embodiment with reference to the accompanying drawings. The electronic component inspection apparatus according to the present embodiment is not limited to the electronic component inspection apparatus described below. The electronic component inspection apparatus inputs a signal to the electronic component and operates the electronic component based on the signal output from the electronic component (normal or Any device can be used as long as it is a device (device, apparatus, unit, system, etc.) for inspecting abnormality or a sign of abnormality.
なお、以後の説明において、添付の全図面の記載の同一又は対応する装置、部品又は部材には、同一又は対応する参照符号を付し、重複する説明を省略する。また、図面は、特に説明しない限り、装置、部品若しくは部材間の限定的な関係を示すことを目的としない。したがって、具体的な相関関係は、以下の限定的でない実施形態に照らし、当業者により決定することができる。   In the following description, the same or corresponding devices, parts, or members described in all the attached drawings are denoted by the same or corresponding reference numerals, and redundant description is omitted. Also, the drawings are not intended to show a limited relationship between devices, parts or members unless specifically described. Accordingly, specific correlations can be determined by one skilled in the art in light of the following non-limiting embodiments.
[検査プロセス]
まず、図1を用いて、本実施形態に係る電子部品検査装置を用いた検査プロセスを説明する。また、比較のため、図2を用いて、検査プロセスの他の例を説明する。ここで、図1は、本実施形態に係る電子部品検査装置を用いた検査プロセスを説明する説明図である。図2は、他の検査装置の検査プロセスを説明する説明図である。
[Inspection process]
First, an inspection process using the electronic component inspection apparatus according to the present embodiment will be described with reference to FIG. For comparison, another example of the inspection process will be described with reference to FIG. Here, FIG. 1 is an explanatory diagram for explaining an inspection process using the electronic component inspection apparatus according to the present embodiment. FIG. 2 is an explanatory diagram for explaining an inspection process of another inspection apparatus.
図1に示すように、検査プロセスでは、先ず検査の前に、ステップStp1−1において、検査対象となる電子部品(図中のPKG)が製造されている。図3乃至図5に、検査される電子部品の例を示す。ここで、図3(a)、図4(a)及び図5(a)は、電子部品の側面図である。図3(b)、図4(b)及び図5(b)は、電子部品の底面図である。なお、図3乃至図5に示す電子部品は一例であり、本実施形態に係る電子部品検査装置の検査プロセスに用いることができる電子部品は図3、図4又は図5に示すものに限定されるものではない。   As shown in FIG. 1, in the inspection process, first, before the inspection, in step Stp1-1, an electronic component (PKG in the drawing) to be inspected is manufactured. 3 to 5 show examples of electronic components to be inspected. Here, FIG. 3A, FIG. 4A and FIG. 5A are side views of the electronic component. 3 (b), 4 (b) and 5 (b) are bottom views of the electronic component. Note that the electronic components shown in FIGS. 3 to 5 are examples, and the electronic components that can be used in the inspection process of the electronic component inspection apparatus according to the present embodiment are limited to those shown in FIGS. It is not something.
図3乃至図5の電子部品PKGは、電子部品PKGの底面側に電気信号を出力する端子(以下、「接続端子」という)を備える。図3(b)に示すように、電子部品PKGは、略平板形状の接続端子TMaをその底面の外縁に備えてもよい。図4(b)に示すように、電子部品PKGは、略半球形状の接続端子TMbをその底面に備えてもよい。図5(b)に示すように、電子部品PKGは、略直方体の接続端子TMcをその底面の外周に備えてもよい。   The electronic component PKG of FIGS. 3 to 5 includes a terminal (hereinafter referred to as “connection terminal”) that outputs an electrical signal on the bottom surface side of the electronic component PKG. As shown in FIG. 3B, the electronic component PKG may include a substantially flat connection terminal TMa on the outer edge of the bottom surface. As shown in FIG. 4B, the electronic component PKG may include a substantially hemispherical connection terminal TMb on the bottom surface. As shown in FIG. 5B, the electronic component PKG may include a substantially rectangular parallelepiped connection terminal TMc on the outer periphery of its bottom surface.
以上の電子部品PKGを製造後、図1に示した検査プロセスは、ステップStp1−2Aにおいて、電子部品PKGを搬送する。ここで、検査プロセスは、図6の右図に示されるように、本実施形態に係る保持部材10を用いて複数の電子部品PKGを同時に保持し、その保持部材10をプローバー101内のチャックステージ40に搬入する。   After manufacturing the above electronic component PKG, the inspection process shown in FIG. 1 transports the electronic component PKG in step Stp1-2A. Here, in the inspection process, as shown in the right diagram of FIG. 6, a plurality of electronic components PKG are simultaneously held using the holding member 10 according to this embodiment, and the holding member 10 is held in the chuck stage in the prober 101. Carry in 40.
このとき、検査プロセスは、図6の右側の全体概略図及び左側のチャックステージ40上の拡大図に示されるように、搬入した複数の電子部品PKGを保持部材10に保持した状態で、本実施形態に係る上部接続部材20と下部接続部材30との間に配置する。   At this time, the inspection process is performed in a state where a plurality of electronic components PKG loaded are held by the holding member 10 as shown in the entire schematic diagram on the right side of FIG. 6 and the enlarged view on the left chuck stage 40. It arrange | positions between the upper connection member 20 and the lower connection member 30 which concern on a form.
また、検査プロセスは、図1のステップStp1−2Bにおいて、下部接続部材30を検査する位置に配置する。具体的には、図6に示されるように、検査プロセスは、上記ステップStp1−2Aの前に下部接続部材30をチャックステージ40に位置合わせ後、チャックステージ40に固定し、その後、下部接続部材30上に保持部材10を載置する。すなわち、検査プロセスは、下部接続部材30上に保持部材10を載置し、保持部材10が保持している電子部品PKGを下部接続部材30に電気的に接続する。   Further, in the inspection process, the lower connection member 30 is disposed at a position to be inspected in Step Stp1-2B in FIG. Specifically, as shown in FIG. 6, the inspection process is performed by aligning the lower connecting member 30 with the chuck stage 40 before the step Stp1-2A, and then fixing the lower connecting member 30 to the chuck stage 40, and thereafter lower connecting member. The holding member 10 is placed on 30. That is, in the inspection process, the holding member 10 is placed on the lower connection member 30, and the electronic component PKG held by the holding member 10 is electrically connected to the lower connection member 30.
次いで、検査プロセスは、図1のステップStp1−3において、電子部品PKGを検査する。具体的には、図6の右側の全体概略図に示されるように、検査プロセスは、チャックステージ40を支持する支持部41をコンタクト方向に上昇させる。   Next, the inspection process inspects the electronic component PKG in step Stp1-3 of FIG. Specifically, as shown in the overall schematic diagram on the right side of FIG. 6, the inspection process raises the support portion 41 that supports the chuck stage 40 in the contact direction.
チャックステージ40を支持する支持部41をコンタクト方向に上昇させることで、保持部材10が保持している電子部品PKG、下部接続部材30及び上部接続部材20を電気的に接続させることができる。   By raising the support portion 41 that supports the chuck stage 40 in the contact direction, the electronic component PKG, the lower connection member 30, and the upper connection member 20 held by the holding member 10 can be electrically connected.
このとき、チャックステージ40は導電性部材であり、チャックステージ40に載置された際にチャックステージ40と接触する下部接続部材30の底部は絶縁性部材である。   At this time, the chuck stage 40 is a conductive member, and the bottom portion of the lower connection member 30 that contacts the chuck stage 40 when placed on the chuck stage 40 is an insulating member.
チャックステージ40に載置された下部接続部材30は、チャックステージ40から電気的に浮いた状態になっている。   The lower connection member 30 placed on the chuck stage 40 is in an electrically floating state from the chuck stage 40.
なお、検査内容により下部接続部材30の底部を導電性部材とし、下部接続部材30とチャックステージ40とが電気的に接続される構造であっても良い。   The bottom connection member 30 may be a conductive member depending on the inspection content, and the lower connection member 30 and the chuck stage 40 may be electrically connected.
この状態で、検査プロセスは、テスター60を用いて複数の電子部品PKGを検査する。検査後、検査プロセスは、支持部41をリリース方向に降下させることで、電子部品PKG、下部接続部材30及び上部接続部材20の電気的な接続を切断させる。   In this state, the inspection process uses the tester 60 to inspect a plurality of electronic components PKG. After the inspection, the inspection process lowers the support portion 41 in the release direction, thereby disconnecting the electrical connection between the electronic component PKG, the lower connection member 30, and the upper connection member 20.
プローバー101は、電子部品PKGの動作を確認する検査において、電気を流すために電子部品PKGにプローブ(例えば、図7の31tを参照)を当接し、テスター60と接続する。テスター60は、電子部品PKGから出力された出力信号に基づき検査を実行する。   In the inspection for confirming the operation of the electronic component PKG, the prober 101 contacts the electronic component PKG with a probe (see, for example, 31t in FIG. 7) and connects to the tester 60 in order to pass electricity. The tester 60 performs an inspection based on the output signal output from the electronic component PKG.
プローバー101は、支持部41の位置合わせ機構を用いてチャックステージ40の回転及びxy平面上の移動により数ミクロンの単位での位置合わせを行うことができる。よって、チャックステージ40と下部接続部材30との位置合わせを一度行えば、保持部材10上の複数の電気部品PKGの位置合わせはプローバー101のステッピング機能を利用して正確かつ高速に行うことができる。   The prober 101 can perform alignment in units of several microns by rotating the chuck stage 40 and moving it on the xy plane using the alignment mechanism of the support portion 41. Therefore, once the alignment between the chuck stage 40 and the lower connection member 30 is performed, the alignment of the plurality of electrical components PKG on the holding member 10 can be performed accurately and at high speed using the stepping function of the prober 101. .
その後、検査プロセスは、図1のステップStp1−4において、検査後の電子部品PKGを保持している保持部材10を保管する。具体的には、図6に示されるように、検査プロセスは、保管部80で複数の保持部材10(電子部品)を積層して保管してもよい。   Thereafter, the inspection process stores the holding member 10 holding the electronic component PKG after the inspection in Step Stp1-4 of FIG. Specifically, as shown in FIG. 6, in the inspection process, a plurality of holding members 10 (electronic components) may be stacked and stored in the storage unit 80.
なお、検査プロセスは、検査後の複数の電子部品を保持している保持部材を用いて、複数の電子部品を一度に後工程に搬送するプロセスを含んでもよい。また、検査プロセスは、検査した検査結果に基づいて、所定の手順に従って、電子部品を仕分けしてもよい。更に、検査プロセスは、検査した検査結果に基づいて、検査プロセスを中止若しくは中断してもよい。   Note that the inspection process may include a process of transporting a plurality of electronic components to a subsequent process at once using a holding member that holds the plurality of electronic components after inspection. In the inspection process, electronic components may be sorted according to a predetermined procedure based on the inspection result. Further, the inspection process may stop or interrupt the inspection process based on the inspected inspection result.
一方、図2に示す他の検査プロセスでは、ステップStp2−1で製造した電子部品を先ず搬送用トレイに載置して、電子部品を搬送する(ステップStp2−2)。次に、他の検査プロセスでは、ステップStp2−3において、検査の直前に検査用トレイ(例えば複数のインサート)に複数の電子部品をそれぞれ配置する。このとき、他の検査プロセスでは、複数の電子部品の接続端子と検査用トレイ(複数のインサート)を電気的にそれぞれ接続させた状態で搬送するため、電子部品の電気的接続部分が擦れて傷つくことがある。また、複数のインサートを備える搬送手段(例えばトレイ)を必要とするため、搬送手段が大型化し、電子部品PKGを高速に搬送することが困難である。他の検査プロセスでは、本実施形態に係る検査プロセス(図1)と比較して電子部品PKGの搬送時間が長いため、結果として電子部品PKGの検査に要するトータルの時間が増加する。   On the other hand, in the other inspection process shown in FIG. 2, the electronic component manufactured in Step Stp2-1 is first placed on the transport tray and transported (Step Stp2-2). Next, in another inspection process, in Step Stp2-3, a plurality of electronic components are respectively arranged on an inspection tray (for example, a plurality of inserts) immediately before the inspection. At this time, in another inspection process, since the connection terminals of a plurality of electronic components and the inspection trays (a plurality of inserts) are transported in an electrically connected state, the electrical connection portions of the electronic components are rubbed and damaged. Sometimes. In addition, since a transport unit (for example, a tray) including a plurality of inserts is required, the transport unit becomes large, and it is difficult to transport the electronic component PKG at high speed. In other inspection processes, the transport time of the electronic component PKG is longer than that in the inspection process according to the present embodiment (FIG. 1). As a result, the total time required for the inspection of the electronic component PKG increases.
次いで、他の検査プロセスでは、ステップStp2−4において、電子部品を検査する。ここで、他の検査プロセスでは、例えば複数のインサートに電気的に接続された複数の電子部品をテストステージにそれぞれ配置する。このため、他の検査プロセスでは、本実施形態に係る検査プロセス(図1)と比較して、電子部品毎に位置決めが必要になり、位置決めに要する時間が増加する。   Next, in another inspection process, in step Stp2-4, the electronic component is inspected. Here, in another inspection process, for example, a plurality of electronic components electrically connected to a plurality of inserts are respectively arranged on the test stage. For this reason, in another inspection process, as compared with the inspection process according to the present embodiment (FIG. 1), positioning is required for each electronic component, and the time required for positioning increases.
また、他の検査プロセスは、ステップStp2−5及びステップStp2−6において、ステップStp2−3及びステップStp2−2の逆の手順を実施して、検査後の複数の電子部品を搬送用トレイに置き替え、その後、後工程にそれぞれ搬送する。   Also, in other inspection processes, in steps Stp2-5 and Step Stp2-6, the reverse procedure of Steps Stp2-3 and Step Stp2-2 is performed, and a plurality of electronic components after inspection are placed on the transport tray. Then, it is transported to the subsequent process.
以上のとおり、本実施形態に係る検査プロセス(図1)は、他の検査プロセス(図2)と比較して、電子部品PKGを高速に搬送することができる。すなわち、本実施形態に係る検査プロセス(図1)は、保持部材10と下部接続部材30とを分割し、軽量化された保持部材10に複数の電子部品PKGを保持して搬送するため、電子部品PKGを高速に搬送することができる。   As described above, the inspection process (FIG. 1) according to the present embodiment can transport the electronic component PKG at a higher speed than other inspection processes (FIG. 2). That is, the inspection process according to the present embodiment (FIG. 1) divides the holding member 10 and the lower connecting member 30 and holds and transports a plurality of electronic components PKG to the holding member 10 reduced in weight. The component PKG can be conveyed at high speed.
また、本実施形態に係る検査プロセス(図1)は、高価な複数のインサートを必要としないため、検査プロセスのコスト(検査装置の製造コスト)を削減することができる。更に、本実施形態に係る検査プロセス(図1)は、軽量な保持部材を用いて、複数の電子部品を搬入し、且つ、検査時に複数の電子部品を保持することができるので、搬送手段を小型化及び簡略化することができ、電子部品PKGの搬送時間を短縮できるため、結果として電子部品PKGの検査に要するトータルの時間を短縮することができ、単位時間当たりの電子部品の検査処理数を増やすことができる。   In addition, since the inspection process according to the present embodiment (FIG. 1) does not require a plurality of expensive inserts, the cost of the inspection process (the manufacturing cost of the inspection apparatus) can be reduced. Furthermore, since the inspection process (FIG. 1) according to the present embodiment can carry in a plurality of electronic components using a lightweight holding member and can hold a plurality of electronic components at the time of inspection, It can be downsized and simplified, and the transport time of the electronic component PKG can be shortened. As a result, the total time required for the inspection of the electronic component PKG can be shortened, and the number of electronic component inspection processes per unit time. Can be increased.
[電子部品検査装置の概要]
(構成の概要)
次に、本実施形態に係る電子部品検査装置の概要を説明する。ここでは、本実施形態に係る電子部品検査装置100を用いたパッケージテスト(パッケージ化された半導体デバイスの検査)を説明する。図6に示されるように、本実施形態に係る電子部品検査装置100は、プローバー101とテスター60とから構成される。
[Outline of electronic component inspection equipment]
(Configuration overview)
Next, an outline of the electronic component inspection apparatus according to the present embodiment will be described. Here, a package test (inspection of a packaged semiconductor device) using the electronic component inspection apparatus 100 according to the present embodiment will be described. As shown in FIG. 6, the electronic component inspection apparatus 100 according to this embodiment includes a prober 101 and a tester 60.
プローバー101は、保持部材10、上部接続部材20、下部接続部材30、チャックステージ40、撮像部50、搬送部70、保管部80及び制御部90を更に備える。   The prober 101 further includes a holding member 10, an upper connecting member 20, a lower connecting member 30, a chuck stage 40, an imaging unit 50, a transport unit 70, a storage unit 80, and a control unit 90.
保持部材10は、電子部品PKGを保持する。上部接続部材20は、電子部品PKGに検査信号を入力する。下部接続部材30は、電子部品PKGから出力された出力信号を検出する。   The holding member 10 holds the electronic component PKG. The upper connecting member 20 inputs an inspection signal to the electronic component PKG. The lower connecting member 30 detects an output signal output from the electronic component PKG.
チャックステージ40は、吸着又は機械的構造により固定する手段及び昇降手段(支持部41)を備える。撮像部50は、チャックステージ40に配置する下部接続部材30の位置を検出する。撮像部50を用いてチャックステージ40と下部接続部材30とを位置合わせした後、下部接続部材30は、チャックステージ40に固定される。   The chuck stage 40 includes a means for fixing by suction or a mechanical structure and a lifting / lowering means (support portion 41). The imaging unit 50 detects the position of the lower connection member 30 disposed on the chuck stage 40. After the chuck stage 40 and the lower connection member 30 are aligned using the imaging unit 50, the lower connection member 30 is fixed to the chuck stage 40.
搬送部70は、チャックステージ40上に配置された下部接続部材30に保持部材10を搬送する。ここで、搬送部70は、本実施形態では、保持部材10が複数の電子部品を保持している状態で、保持部材10の一部を例えば挟んで、保持部材10を移動(搬送)する。   The conveyance unit 70 conveys the holding member 10 to the lower connection member 30 disposed on the chuck stage 40. Here, in this embodiment, the conveyance unit 70 moves (conveys) the holding member 10 with, for example, a portion of the holding member 10 sandwiched between the holding member 10 and a plurality of electronic components.
制御部90は、電子部品検査装置100の各部を制御する。制御部90は、撮像部50が撮像した結果に基づいて下部接続部材30とチャックステージ40とのアライメントを取り、位置合わせを制御する。また、制御部90は、支持部41の昇降等、プローバー101の全体を制御する。   The control unit 90 controls each unit of the electronic component inspection apparatus 100. The control unit 90 aligns the lower connecting member 30 and the chuck stage 40 based on the result captured by the imaging unit 50 and controls the alignment. The control unit 90 controls the entire prober 101 such as raising and lowering the support unit 41.
制御部90は、(例えば内部メモリに)予め記憶されているプログラム(制御プログラム、アプリケーション等)を用いて、電子部品検査装置100の動作を制御することができる。また、制御部90は、電子部品検査装置100の外部から入力された情報等に基づいて、電子部品検査装置100の動作を制御してもよい。なお、制御部90は、公知の技術のCPU(Central Processing Unit)及びメモリ等を含む演算処理装置で構成してもよい。   The control unit 90 can control the operation of the electronic component inspection apparatus 100 using a program (control program, application, etc.) stored in advance (for example, in an internal memory). The control unit 90 may control the operation of the electronic component inspection apparatus 100 based on information input from the outside of the electronic component inspection apparatus 100 or the like. The control unit 90 may be configured by an arithmetic processing unit including a CPU (Central Processing Unit) of a known technology, a memory, and the like.
テスター60は、検出した出力信号に基づいて、電子部品を検査する。
(動作の概要)
本実施形態に係る電子部品検査装置100は、検査時に、先ず、撮像部50が撮像した結果に基づいて、上部接続部材20に対面するチャックステージ40の上の所定の位置に下部接続部材30を配置する。このとき、電子部品検査装置100は、配置した下部接続部材30をチャックステージ40の吸着又は機械的構造により固定する手段で固定する。これにより、チャックステージ40と下部接続部材30との位置合わせを一度行えば、保持部材10上の複数の電気部品PKGの位置合わせはプローバー101のステッピング機能を利用して正確かつ高速に行うことができる。
The tester 60 inspects the electronic component based on the detected output signal.
(Overview of operation)
At the time of inspection, the electronic component inspection apparatus 100 according to the present embodiment first places the lower connection member 30 at a predetermined position on the chuck stage 40 that faces the upper connection member 20 based on the result captured by the imaging unit 50. Deploy. At this time, the electronic component inspection apparatus 100 fixes the arranged lower connecting member 30 by means of fixing the chuck stage 40 by suction or a mechanical structure. Thus, once the chuck stage 40 and the lower connecting member 30 are aligned, the plurality of electrical components PKG on the holding member 10 can be aligned accurately and at high speed using the stepping function of the prober 101. it can.
次に、電子部品検査装置100は、搬送部70を用いて保持部材10を搬送し、下部接続部材30に載置する。次いで、電子部品検査装置100は、昇降手段を用いてチャックステージ40を上昇させて、電子部品PKGと下部接続部材30と上部接続部材20とを電気的に接続する。   Next, the electronic component inspection apparatus 100 transports the holding member 10 using the transport unit 70 and places it on the lower connection member 30. Next, the electronic component inspection apparatus 100 raises the chuck stage 40 using the lifting means to electrically connect the electronic component PKG, the lower connection member 30, and the upper connection member 20.
その後、電子部品検査装置100は、上部接続部材20を用いて検査信号を電子部品PKGに入力し、下部接続部材30を用いて出力信号を検出する。   Thereafter, the electronic component inspection apparatus 100 inputs an inspection signal to the electronic component PKG using the upper connection member 20 and detects an output signal using the lower connection member 30.
また、電子部品検査装置100は、テスター60を用いて、検出した出力信号に基づいて、電子部品を検査する。ここで、電子部品検査装置100は、チャックステージ40を複数回昇降させることによって、上部接続部材20を用いて、保持部材10に保持された複数の電子部品のうちのいずれかを順次検査する方法であってもよい。   In addition, the electronic component inspection apparatus 100 uses the tester 60 to inspect the electronic component based on the detected output signal. Here, the electronic component inspection apparatus 100 sequentially inspects any one of the plurality of electronic components held by the holding member 10 by using the upper connection member 20 by moving the chuck stage 40 up and down a plurality of times. It may be.
また、本実施形態に係る電子部品検査装置100は、検査後に、例えば搬送部70を用いて、検査後の複数の電子部品を保持している保持部材10を搬出する。その後、電子部品検査装置100は、保管部80を用いて、搬出した保持部材10を保管する。   Moreover, the electronic component inspection apparatus 100 according to the present embodiment unloads the holding member 10 holding a plurality of electronic components after the inspection using, for example, the conveyance unit 70 after the inspection. Thereafter, the electronic component inspection apparatus 100 stores the carried holding member 10 using the storage unit 80.
以上により、電子部品検査装置100は、検査信号を電子部品に入力し、電子部品が出力した信号を検出することによって、複数の電子部品を順次検査することができる。   As described above, the electronic component inspection apparatus 100 can sequentially inspect a plurality of electronic components by inputting an inspection signal to the electronic component and detecting a signal output from the electronic component.
[電子部品検査装置の配置及び構成の詳細]
次に、本実施形態に係る電子部品検査装置の配置及び構成の詳細について、図7〜図10を参酌しながら説明する。
[Details of arrangement and configuration of electronic component inspection device]
Next, details of the arrangement and configuration of the electronic component inspection apparatus according to the present embodiment will be described with reference to FIGS.
図7及び図8は、下部接続部材30と上部接続部材20との間の保持部材10の配置を示した図である。図9及び図10は、本実施形態に係る電子部品検査装置100の構成の一例を示した図である。
(配置の詳細)
図7に示されるように、搬送部70は、複数の電子部品PKGを保持した保持部材10を搬送し、チャックステージ40に固定された下部接続部材30上に配置する。その結果、図8に示されるように、下部接続部材30の接続部31の接続ピン31t(プローブピン)を、電子部品PKGの接続端子(例えば図3のTMa乃至図5のTMcを参照)に電気的に接続する。
7 and 8 are views showing the arrangement of the holding member 10 between the lower connecting member 30 and the upper connecting member 20. 9 and 10 are diagrams showing an example of the configuration of the electronic component inspection apparatus 100 according to the present embodiment.
(Details of arrangement)
As shown in FIG. 7, the transport unit 70 transports the holding member 10 that holds a plurality of electronic components PKG and arranges it on the lower connection member 30 fixed to the chuck stage 40. As a result, as shown in FIG. 8, the connection pin 31t (probe pin) of the connection portion 31 of the lower connection member 30 is used as a connection terminal of the electronic component PKG (see, for example, TMa in FIG. 3 to TMc in FIG. 5). Connect electrically.
本実施形態では、保持部材10と下部接続部材30とを分割し、軽量化された保持部材10に複数の電子部品PKGを保持して搬送する。これにより、保持部材10を高速で搬送できる。また、保持部材10は、多数の電子部品PKGを同時に搬送できる。また、保持部材10に保持された各電子部品PKGは、自身の重さでずれない状態で搬送され、下部接続部材30上に載置される。電子部品PKGの接続端子は、図7に示されるように、保持部材10の開口12により搬送中に保持部材10等に触れることなく運ばれる。そして、図8に示されるように、電子部品PKGは、下部接続部材30上に載置されたときにはじめて接続ピン31tと接触するため、電子部品PKGの接続端子を傷つけることなく電子部品PKGを搬送することができる。   In the present embodiment, the holding member 10 and the lower connection member 30 are divided, and the plurality of electronic components PKG are held and transported to the holding member 10 that has been reduced in weight. Thereby, the holding member 10 can be conveyed at high speed. Further, the holding member 10 can simultaneously convey a large number of electronic components PKG. Further, each electronic component PKG held by the holding member 10 is transported in a state where it is not displaced by its own weight, and is placed on the lower connection member 30. As shown in FIG. 7, the connection terminal of the electronic component PKG is carried by the opening 12 of the holding member 10 without touching the holding member 10 or the like during conveyance. Then, as shown in FIG. 8, since the electronic component PKG contacts the connection pin 31t only when it is placed on the lower connection member 30, the electronic component PKG is not damaged without damaging the connection terminal of the electronic component PKG. Can be transported.
次に、図8の状態から支持部41をコンタクト方向に上昇させ、保持部材10及び下部接続部材30を上部接続部材20にコンタクトさせる。これにより、図9に示されるように、本実施形態に係る電子部品検査装置100の状態となり、電子部品PKGの検査が可能になる。   Next, the support part 41 is raised in the contact direction from the state of FIG. 8, and the holding member 10 and the lower connection member 30 are brought into contact with the upper connection member 20. As a result, as shown in FIG. 9, the electronic component inspection apparatus 100 according to the present embodiment is brought into a state, and the electronic component PKG can be inspected.
以上に説明したように、本実施形態では、保持部材10と下部接続部材30とを分け、保持部材10はマザーボードや金属部分を有しない構造とする。また、保持部材10は複数の開口12(貫通口)を有する枠構造である。これにより、保持部材10は軽量化され、電子部品PKGの高速搬送が可能になる。また、電子部品PKGと保持部材10との接触部を極力少なくし、搬送時の摩擦による電子部品PKGの損傷を防止する。
(構成の詳細)
本実施形態に係る電子部品検査装置100の構成について説明する。電子部品検査装置100は、電子部品PKGを保持する保持部材10と、電子部品PKGに検査信号を入力する上部接続部材20と、電子部品PKGから出力された出力信号を検出する下部接続部材30とを有する。電子部品検査装置100は、下部接続部材30を支持するチャックステージ40に固定されている。上部接続部材20は、接続部21とプレート20bとを有する。保持部材10は、枠構造を有するトレイ状の部材である。図9では、電子部品PKGを保持する桟部材10aが示されている。桟部材10aの中央は開口している。下部接続部材30は、接続部(ソケットベース)31とプレート30bとプレート支持部材30cとを有する。下部接続部材30は、チャック機構を用いてチャックステージ40に吸着されるか、又は機械的に固定される。
As described above, in the present embodiment, the holding member 10 and the lower connecting member 30 are separated, and the holding member 10 has a structure having no mother board or metal part. The holding member 10 has a frame structure having a plurality of openings 12 (through holes). Thereby, the holding member 10 is reduced in weight, and the electronic component PKG can be conveyed at high speed. Further, the contact portion between the electronic component PKG and the holding member 10 is reduced as much as possible to prevent damage to the electronic component PKG due to friction during conveyance.
(Configuration details)
A configuration of the electronic component inspection apparatus 100 according to the present embodiment will be described. The electronic component inspection apparatus 100 includes a holding member 10 that holds the electronic component PKG, an upper connection member 20 that inputs an inspection signal to the electronic component PKG, and a lower connection member 30 that detects an output signal output from the electronic component PKG. Have The electronic component inspection apparatus 100 is fixed to the chuck stage 40 that supports the lower connection member 30. The upper connecting member 20 includes a connecting portion 21 and a plate 20b. The holding member 10 is a tray-like member having a frame structure. FIG. 9 shows a crosspiece member 10a that holds the electronic component PKG. The center of the crosspiece member 10a is opened. The lower connection member 30 includes a connection portion (socket base) 31, a plate 30b, and a plate support member 30c. The lower connecting member 30 is attracted to the chuck stage 40 using a chuck mechanism or is mechanically fixed.
本実施形態に係る電子部品検査装置100には、下部接続部材30により検出された出力信号を折り返して、検査信号を入力した上部接続部材20から出力するリターン信号経路22Tが設けられている。   The electronic component inspection apparatus 100 according to the present embodiment is provided with a return signal path 22T that returns an output signal detected by the lower connection member 30 and outputs the output signal from the upper connection member 20 to which the inspection signal is input.
本実施形態に係る電子部品検査装置100は、上部接続部材20を用いて、検査信号(光信号Lt)を電子部品PKGの検知部PKGiに入光する。また、電子部品検査装置100は、下部接続部材30を用いて、検査信号が入光された電子部品PKGから出力される出力信号を検出する。更に、電子部品検査装置100は、下部接続部材30が検出した出力信号をリターン信号経路22Tを介して上部接続部材20に伝送する。なお、電子部品検査装置100は、上部接続部材20を用いて、電子部品PKGの上面から電気信号を入力する若しくは検出する構成であってもよい。   The electronic component inspection apparatus 100 according to the present embodiment uses the upper connection member 20 to input an inspection signal (optical signal Lt) to the detection unit PKGi of the electronic component PKG. In addition, the electronic component inspection apparatus 100 uses the lower connection member 30 to detect an output signal output from the electronic component PKG that has received the inspection signal. Furthermore, the electronic component inspection apparatus 100 transmits the output signal detected by the lower connection member 30 to the upper connection member 20 via the return signal path 22T. The electronic component inspection apparatus 100 may be configured to input or detect an electrical signal from the upper surface of the electronic component PKG using the upper connecting member 20.
具体的には、電子部品検査装置100は、本実施形態では、電子部品PKGの上方から検査信号(光信号Lt)を入力する。また、電子部品検査装置100は、下部接続部材30の接続部31の接続ピン31tを、電子部品PKGの接続端子(例えば図3のTMa乃至図5のTMc)に電気的に接続することによって、電子部品PKGの下方から出力信号を検出する。リターン信号経路22Tは、保持部材10の貫通口(開口)を貫通し、下部接続部材30に電気的に接続することによって、下部接続部材30が検出した出力信号を折り返し、検査信号を入力した上部接続部材20から出力する。   Specifically, in this embodiment, the electronic component inspection apparatus 100 inputs an inspection signal (optical signal Lt) from above the electronic component PKG. Further, the electronic component inspection apparatus 100 electrically connects the connection pin 31t of the connection portion 31 of the lower connection member 30 to a connection terminal (for example, TMa in FIG. 3 to TMc in FIG. 5) of the electronic component PKG. An output signal is detected from below the electronic component PKG. The return signal path 22T passes through the through-hole (opening) of the holding member 10 and is electrically connected to the lower connection member 30, thereby returning the output signal detected by the lower connection member 30 and inputting the inspection signal. Output from the connecting member 20.
これにより、本実施形態に係る電子部品検査装置100は、入力した検査信号と検出した出力信号とを比較することによって、電子部品PKGを検査する。電子部品検査装置100は、検出した出力信号に基づいて、例えば電子部品PKGの動作が正常か、又は、異常か若しくは異常の予兆があるかを検査する。   Thereby, the electronic component inspection apparatus 100 according to the present embodiment inspects the electronic component PKG by comparing the input inspection signal with the detected output signal. The electronic component inspection apparatus 100 inspects, for example, whether the operation of the electronic component PKG is normal, abnormal, or a sign of abnormality based on the detected output signal.
また、本実施形態に係る電子部品検査装置100は、検査時(図1のStp1−3)に、電子部品PKGを保持した保持部材10を上部接続部材20と下部接続部材30との間に配置する。更に、本実施形態に係る電子部品検査装置100は、検査時(図1のStp1−3)に、保持部材10に保持された電子部品PKGを下部接続部材30に電気的に接続する。すなわち、本実施形態に係る電子部品検査装置100は、保持部材10を用いて複数の電子部品を同時にテストステージに搬入することができ、且つ、保持部材10を用いて検査時に複数の電子部品を保持することができる。また、本実施形態に係る電子部品検査装置100は、検査時に、保持部材10に保持された複数の電子部品を同時に下部接続部材30に電気的に接続することができる。   Further, in the electronic component inspection apparatus 100 according to the present embodiment, the holding member 10 holding the electronic component PKG is disposed between the upper connection member 20 and the lower connection member 30 at the time of inspection (Stp1-3 in FIG. 1). To do. Furthermore, the electronic component inspection apparatus 100 according to the present embodiment electrically connects the electronic component PKG held by the holding member 10 to the lower connection member 30 at the time of inspection (Step 1-3 in FIG. 1). That is, the electronic component inspection apparatus 100 according to the present embodiment can simultaneously carry a plurality of electronic components to the test stage using the holding member 10, and use the holding member 10 to carry a plurality of electronic components at the time of inspection. Can be held. Moreover, the electronic component inspection apparatus 100 according to the present embodiment can electrically connect a plurality of electronic components held by the holding member 10 to the lower connection member 30 at the time of inspection.
また、本実施形態に係る電子部品検査装置100によれば、テスター60側から検査対象の電子部品PKGに入力した信号に対して該電子部品PKGから出力した信号をテスター60側に戻すことができる。つまり、電子部品検査装置100では、電子部品PKGとテスター60との間で検査信号を入出力する場合に、テスター60側から信号の入力及び出力を行うことを可能とする。これによれば、例えば検査対象が光撮像装置である場合において、テスター60側から光撮像装置に入力した光信号に対して光撮像装置から出力した信号をテスター60側に戻すことができる。これにより、テスター60で信号処理し、検査結果を出すことができる。   Moreover, according to the electronic component inspection apparatus 100 according to the present embodiment, the signal output from the electronic component PKG can be returned to the tester 60 side in response to the signal input from the tester 60 side to the electronic component PKG to be inspected. . That is, in the electronic component inspection apparatus 100, when an inspection signal is input / output between the electronic component PKG and the tester 60, it is possible to input and output signals from the tester 60 side. According to this, for example, when the inspection target is an optical imaging device, the signal output from the optical imaging device can be returned to the tester 60 side with respect to the optical signal input to the optical imaging device from the tester 60 side. As a result, the tester 60 can perform signal processing and output the inspection result.
図6に示したチャックステージ40は、金属から形成されているため、チャックステージ40に電気信号や光信号を通す機能を構造上持たせることはできない。そこで、本実施形態では、電子部品検査装置100に、テスター60側から電子部品PKGに入力した光信号に対して電子部品PKGから出力した信号をテスター60側に戻すリターン信号経路22Tを設け、既存のプローバー101を用いてテスター60と接続することができる。これにより、既存のプローバー100とテスター60とを使用して電子部品PKGを検査することができる。   Since the chuck stage 40 shown in FIG. 6 is made of metal, the chuck stage 40 cannot have a function of passing an electric signal or an optical signal structurally. Therefore, in this embodiment, the electronic component inspection apparatus 100 is provided with a return signal path 22T that returns a signal output from the electronic component PKG to the tester 60 side in response to an optical signal input from the tester 60 side to the electronic component PKG. The prober 101 can be used to connect to the tester 60. Thereby, the electronic component PKG can be inspected using the existing prober 100 and the tester 60.
これにより本実施形態に係る電子部品検査装置100は、電子部品PKGとして例えばイメージセンサを検査する場合に、光Ltを入力された光電変換素子(PKGi)が変換した画素信号(電気信号)を検査することによって、イメージセンサの各画素の動作を検査することができる。また、本実施形態に係る電子部品検査装置100は、例えばCMOSセンサやPOPのような同一面に入出力端子が備わらない構造の電子部品でも、本実施形態を用いることによって入出力端子に接続する経路を制限されることなく、電子部品を検査することができる。   Thereby, the electronic component inspection apparatus 100 according to the present embodiment inspects, for example, an image sensor as the electronic component PKG, inspects a pixel signal (electric signal) converted by the photoelectric conversion element (PKGi) to which the light Lt is input. Thus, the operation of each pixel of the image sensor can be inspected. Further, the electronic component inspection apparatus 100 according to the present embodiment can be connected to the input / output terminals by using the present embodiment even for an electronic component having a structure in which the input / output terminals are not provided on the same surface, such as a CMOS sensor or a POP. The electronic component can be inspected without being restricted in the route to be performed.
図10に示すように、電子部品検査装置100は、上部接続部材20から検査信号(不図示)を電子部品PKGの上面に入力してもよい。図10の例では、上部接続部材20のリターン信号経路22Tを用いて、電子部品PKGの上面からも電子部品PKGから出力される出力信号を検出する。すなわち、この電子部品検査装置100においても、テスター60側から電子部品PKGに入力した光信号に対して電子部品PKGから出力した信号をリターン信号経路22Tを介してテスター60側に戻すことができる。これにより、既存のプローバー100とテスター60とを使用して電子部品PKGを検査することができる。なお、図10の電子部品検査装置100の他の部分は、図9と同様のため、説明を省略する。   As shown in FIG. 10, the electronic component inspection apparatus 100 may input an inspection signal (not shown) from the upper connection member 20 to the upper surface of the electronic component PKG. In the example of FIG. 10, the output signal output from the electronic component PKG is detected also from the upper surface of the electronic component PKG using the return signal path 22T of the upper connecting member 20. That is, in this electronic component inspection apparatus 100, the signal output from the electronic component PKG can be returned to the tester 60 side via the return signal path 22T in response to the optical signal input from the tester 60 side to the electronic component PKG. Thereby, the electronic component PKG can be inspected using the existing prober 100 and the tester 60. The other parts of the electronic component inspection apparatus 100 shown in FIG. 10 are the same as those shown in FIG.
[保持部材の例]
次に、図11及び図12を用いて、本実施形態に係る電子部品検査装置100の保持部材10の例を説明する。ここで、図11(a)、図11(b)、図12(a)及び図12(b)は、保持部材10の例を示す。
[Example of holding member]
Next, an example of the holding member 10 of the electronic component inspection apparatus 100 according to the present embodiment will be described with reference to FIGS. 11 and 12. Here, FIG. 11A, FIG. 11B, FIG. 12A, and FIG. 12B show examples of the holding member 10.
なお、本実施形態に係る保持部材10は、図11及び図12に示すものに限定されるものではない。すなわち、本実施形態に係る保持部材10は、保持する電子部品の仕様(形状、大きさ、重さなど)に応じて、適宜変更されうる。また、図11では、9枚の電子部品を3行及び3列で保持可能な保持部材10の例を示しているが、本実施形態に係る保持部材で保持可能な電子部品の枚数は限定されない。すなわち、本実施形態に係る保持部材は、16枚の電子部品を4行及び4列で、又は、12枚の電子部品を4行及び3列などで保持するものであってもよい。   Note that the holding member 10 according to the present embodiment is not limited to those shown in FIGS. 11 and 12. That is, the holding member 10 according to the present embodiment can be appropriately changed according to the specifications (shape, size, weight, etc.) of the electronic component to be held. FIG. 11 shows an example of the holding member 10 that can hold nine electronic components in three rows and three columns, but the number of electronic components that can be held by the holding member according to the present embodiment is not limited. . That is, the holding member according to the present embodiment may hold 16 electronic components in 4 rows and 4 columns, or 12 electronic components in 4 rows and 3 columns.
図11(a)に示すように、保持部材10は、複数の桟部材10aから構成される格子状に並べられた複数の載置部11Pを有する。ここで、複数の載置部11Pは、複数の電子部品を夫々載置されるものである。載置部11Pは、本実施形態では角部を有しない略四角形状又は円形又は楕円の開口12を有する。また、載置部11Pは、開口12の四隅に支持片12sを備える。すなわち、保持部材10は、支持片12sで電子部品PKGの四隅を支持することによって、電子部品PKGを保持する。なお、開口12の形状(複数の桟部材10aの配置)は、保持する電子部品に応じて、適宜変更されうる。   As shown to Fig.11 (a), the holding member 10 has the some mounting part 11P arranged in the grid | lattice shape comprised from the some crosspiece member 10a. Here, the plurality of placement units 11P are for placing a plurality of electronic components, respectively. In this embodiment, the mounting portion 11P has a substantially rectangular, circular, or elliptical opening 12 that does not have a corner portion. In addition, the mounting portion 11 </ b> P includes support pieces 12 s at the four corners of the opening 12. That is, the holding member 10 holds the electronic component PKG by supporting the four corners of the electronic component PKG with the support pieces 12s. The shape of the opening 12 (arrangement of the plurality of crosspiece members 10a) can be appropriately changed according to the electronic component to be held.
保持部材10は、図11(a)に示すように、複数の桟部材10aの長手方向に対して垂直方向に、載置部11Pに隣接して複数の貫通口13を備える。貫通口13には、上部接続部材20のリターン信号経路22Tが挿入される。すなわち、上部接続部材20のリターン信号経路22Tは、保持部材10の貫通口13を貫通して、下部接続部材30に電気的に接続される。   As shown in FIG. 11A, the holding member 10 includes a plurality of through holes 13 adjacent to the placement portion 11P in a direction perpendicular to the longitudinal direction of the plurality of crosspiece members 10a. A return signal path 22T of the upper connecting member 20 is inserted into the through-hole 13. That is, the return signal path 22T of the upper connection member 20 passes through the through-hole 13 of the holding member 10 and is electrically connected to the lower connection member 30.
なお、貫通口13の形状及び数は、上部接続部材20のリターン信号経路22Tに応じて、適宜変更されうる。図11(b)に示すように、保持部材10は、例えば複数の桟部材10aの長手方向に対して垂直方向に、載置部11Pに隣接して複数の貫通口13を備え、更に複数の桟部材10aに開口部14を備えてもよい。ここで、保持部材10のその他の部分は、図11(a)の場合と同様のため、説明を省略する。   The shape and number of the through holes 13 can be changed as appropriate according to the return signal path 22T of the upper connecting member 20. As shown in FIG. 11B, the holding member 10 includes, for example, a plurality of through-holes 13 adjacent to the placement portion 11P in a direction perpendicular to the longitudinal direction of the plurality of crosspiece members 10a, and further includes a plurality of through-holes 13. You may provide the opening part 14 in the crosspiece member 10a. Here, since the other part of the holding member 10 is the same as that of the case of Fig.11 (a), description is abbreviate | omitted.
図12(a)に示すように、保持部材10は、載置部11Pの開口12の四隅に扇状の支持片12scを備える。すなわち、保持部材10は、支持片12scで電子部品を支持することによって、電子部品を保持する。なお、保持部材10のその他の部分は、図11(a)の場合と同様のため、説明を省略する。   As shown in FIG. 12A, the holding member 10 includes fan-shaped support pieces 12sc at the four corners of the opening 12 of the placement portion 11P. That is, the holding member 10 holds the electronic component by supporting the electronic component with the support piece 12sc. The other parts of the holding member 10 are the same as in FIG.
図12(b)に示すように、保持部材10は、載置部11Pの開口12の四隅に扇状の支持片12scを備え、更に四辺に支持片12sdを更に備えてもよい。なお、保持部材10のその他の部分は、図12(a)の場合と同様のため、説明を省略する。   As illustrated in FIG. 12B, the holding member 10 may include fan-shaped support pieces 12sc at the four corners of the opening 12 of the placement portion 11P, and may further include support pieces 12sd on the four sides. The other parts of the holding member 10 are the same as in the case of FIG.
[下部接続部材の例]
図13及び図14を用いて、本実施形態に係る電子部品検査装置100の下部接続部材30の例を説明する。ここで、図13は、本実施形態に係る下部接続部材30の接続部31の一例を説明する平面図である。図14は、本実施形態に係る下部接続部材30の配線部30bの一例を説明する平面図である。また、図13及び図14は、前述の図11(a)の2つの開口を有する保持部材10に対応する下部接続部材30の一例である。
[Example of lower connection member]
An example of the lower connection member 30 of the electronic component inspection apparatus 100 according to the present embodiment will be described with reference to FIGS. 13 and 14. Here, FIG. 13 is a plan view for explaining an example of the connecting portion 31 of the lower connecting member 30 according to the present embodiment. FIG. 14 is a plan view for explaining an example of the wiring portion 30b of the lower connecting member 30 according to the present embodiment. FIGS. 13 and 14 show an example of the lower connecting member 30 corresponding to the holding member 10 having the two openings shown in FIG.
図13に示すように、下部接続部材30の接続部31は、複数の接続ピン31tを備える。ここで、複数の接続ピン31tは、図13及び図14に示すように電子部品PKG(の接続端子)に電気的に接続され、電子部品PKGの出力信号を検出する。すなわち、複数の接続ピン31tは、電子部品PKGの接続端子に電気的に接続する位置に選択的に配置されている。下部接続部材30の接続部31は、例えば電子部品の接続端子(図3のTMa乃至図5のTMc)の配置に応じて、複数の接続ピン31tを抜き差しされる構成であってもよい。   As illustrated in FIG. 13, the connection portion 31 of the lower connection member 30 includes a plurality of connection pins 31 t. Here, the plurality of connection pins 31t are electrically connected to the electronic component PKG (connection terminal thereof) as shown in FIGS. 13 and 14, and detect the output signal of the electronic component PKG. That is, the plurality of connection pins 31t are selectively arranged at positions where they are electrically connected to the connection terminals of the electronic component PKG. The connection part 31 of the lower connection member 30 may be configured such that a plurality of connection pins 31t are inserted and removed in accordance with, for example, the arrangement of connection terminals (TMa in FIG. 3 to TMc in FIG. 5) of electronic components.
なお、本実施形態に係る下部接続部材30の接続部31は、図13に示すものに限定されるものではない。すなわち、本実施形態に係る下部接続部材30の接続部31は、保持する電子部品PKGの仕様(形状、接続端子の配置など)及び上部接続部材20の仕様(リターン信号経路22Tの配置など)に応じて、適宜変更されうる。   In addition, the connection part 31 of the lower connection member 30 which concerns on this embodiment is not limited to what is shown in FIG. That is, the connection portion 31 of the lower connection member 30 according to the present embodiment conforms to the specifications (shape, arrangement of connection terminals, etc.) of the electronic component PKG to be held and the specifications of the upper connection member 20 (arrangement of the return signal path 22T, etc.). It can be changed as appropriate.
図14に示すように、下部接続部材30の配線部30bは、複数の配線30b1を備える。ここで、複数の配線30b1は、接続部31の複数の接続ピン31tと上部接続部材20のリターン信号経路22Tとを電気的に接続するものである。   As shown in FIG. 14, the wiring part 30b of the lower connecting member 30 includes a plurality of wirings 30b1. Here, the plurality of wirings 30b1 electrically connect the plurality of connection pins 31t of the connection portion 31 and the return signal path 22T of the upper connection member 20.
なお、本実施形態に係る下部接続部材30の配線部30bは、図14に示すものに限定されるものではない。すなわち、本実施形態に係る下部接続部材30の配線部30bは、保持する電子部品の仕様(形状、接続端子の配置など)及び上部接続部材20の仕様(リターン信号経路22Tの配置など)に応じて、適宜変更されうる。   Note that the wiring portion 30b of the lower connection member 30 according to the present embodiment is not limited to that shown in FIG. In other words, the wiring portion 30b of the lower connection member 30 according to the present embodiment corresponds to the specifications of the electronic components to be held (shape, connection terminal arrangement, etc.) and the specifications of the upper connection member 20 (return signal path 22T arrangement, etc.) And may be changed as appropriate.
本実施形態に係る下部接続部材30は、接続部31と配線部30bとを積層して構成される。また、下部接続部材30は、検査時に、チャックステージ40の所定の位置に配置される。ここで、電子部品検査装置100は、下部接続部材30の位置を撮像することによって、下部接続部材30の位置決めを実施してもよい。また、電子部品検査装置100は、下部接続部材30を吸着(例えば負圧チャック)又はガイド等の機械的構造(例えばレール機構、ピン嵌合)などを用いて、所定の位置に配置してもよい。   The lower connection member 30 according to the present embodiment is configured by stacking a connection portion 31 and a wiring portion 30b. The lower connecting member 30 is disposed at a predetermined position of the chuck stage 40 at the time of inspection. Here, the electronic component inspection apparatus 100 may position the lower connection member 30 by imaging the position of the lower connection member 30. Further, the electronic component inspection apparatus 100 may arrange the lower connection member 30 at a predetermined position by using a mechanical structure (for example, a rail mechanism or pin fitting) such as suction (for example, a negative pressure chuck) or a guide. Good.
[信号の流れ]
最後に、本実施形態に係る電子部品検査装置100と信号の流れを、図15及び図16を参照しながら説明する。図15及び図16は、本実施形態に係る電子部品検査装置100と信号の流れの一例を説明するための図である。
[Signal flow]
Finally, the electronic component inspection apparatus 100 according to the present embodiment and a signal flow will be described with reference to FIGS. 15 and 16. 15 and 16 are diagrams for explaining an example of the signal flow with the electronic component inspection apparatus 100 according to the present embodiment.
従来の電子部品検査装置では、電子部品の入力信号ピンと出力信号ピンとは、電子部品の片面に配置され、電子部品を収容する試験用のソケットにより信号ピンに接続する場合には、電子部品の片面のみ接触し、電子部品検査装置と電気的に接続することで、入出力信号が、電子部品を介して電子部品検査装置に供給されるようになっている。プローバーを利用した検査の場合、電子部品の信号端子面を上向きに配置することで、上部接続部材20を容易に電気的に接続できる。   In the conventional electronic component inspection apparatus, the input signal pin and the output signal pin of the electronic component are arranged on one side of the electronic component, and when connected to the signal pin by a test socket that accommodates the electronic component, one side of the electronic component The input / output signal is supplied to the electronic component inspection apparatus via the electronic component by contacting only and electrically connecting with the electronic component inspection apparatus. In the case of inspection using a prober, the upper connection member 20 can be easily electrically connected by arranging the signal terminal surface of the electronic component upward.
一方、本実施形態に係る電子部品検査装置100の検査対象の電子部品には、CIS(CMOS Image Sensor)やCCDデバイスのような光信号を受光するものがあり、光信号の入力面と信号端子面(電子部品の接続端子がある面(電子部品の裏面))とが対向面にある。プローバー101のチャックステージ40には信号を通すことができないため、信号端子面側からチャックステージ40側に信号を取り出して検査することはできず、光信号入力面から出力信号を取り出して検査するための方法が必要になる。   On the other hand, some electronic components to be inspected by the electronic component inspection apparatus 100 according to the present embodiment receive an optical signal such as a CIS (CMOS Image Sensor) or a CCD device. The surface (the surface with the connection terminal of the electronic component (the back surface of the electronic component)) is on the opposite surface. Since a signal cannot be passed through the chuck stage 40 of the prober 101, a signal cannot be extracted from the signal terminal surface side to the chuck stage 40 side for inspection, and an output signal is extracted from the optical signal input surface for inspection. This method is necessary.
そこで、本実施形態に係る電子部品検査装置100では、下部接続部材30により検出された出力信号を折り返し、検査信号を入力した上部接続部材20から出力するリターン信号経路22Tが設けられている。これにより、本実施形態に係る電子部品検査装置100は、双方向の信号のやり取りが可能である。   Therefore, the electronic component inspection apparatus 100 according to the present embodiment is provided with a return signal path 22T that returns the output signal detected by the lower connection member 30 and outputs the output signal from the upper connection member 20 to which the inspection signal is input. Thereby, the electronic component inspection apparatus 100 according to the present embodiment can exchange bidirectional signals.
図15及び図16を参照しながら、テスター60側から電子部品検査装置100に入力された信号とリターン信号経路22Tを用いてテスター60側に出力される信号の説明を行う。   With reference to FIGS. 15 and 16, a signal input to the electronic component inspection apparatus 100 from the tester 60 side and a signal output to the tester 60 side using the return signal path 22T will be described.
図15(a)は、発光素子110から電子部品検査装置100に入力された光信号に対して、リターン信号経路22Tを用いて折り返した信号が、信号ラインSOを通ってテスター60側に出力される様子が図示されている。   In FIG. 15A, a signal that is turned back using the return signal path 22T with respect to the optical signal input from the light emitting element 110 to the electronic component inspection apparatus 100 is output to the tester 60 side through the signal line SO. The situation is illustrated.
図15(b)は、発光素子110から電子部品検査装置100に入力された光信号及びテスター60側から信号ラインSIを通り入力された信号に対して、リターン信号経路22Tを用いて折り返した信号が、信号ラインSOを通ってテスター60側に出力される様子が図示されている。   FIG. 15B shows a signal that is returned by using the return signal path 22T with respect to the optical signal input from the light emitting element 110 to the electronic component inspection apparatus 100 and the signal input from the tester 60 through the signal line SI. Is shown to be output to the tester 60 side through the signal line SO.
図16は、テスター60側から信号ラインSIを通り入力された信号に対して、リターン信号経路22T等を用いて折り返した信号が、信号ラインSOを通ってテスター60側に信号側に出力される様子が図示されている。図16では、電子部品PKGの両面に信号を入出力可能な接続端子が示され、電子部品PKGの両面において信号の入力及び出力が可能である。   In FIG. 16, a signal that is turned back using a return signal path 22T or the like with respect to a signal input from the tester 60 side through the signal line SI is output to the signal side through the signal line SO to the tester 60 side. The situation is illustrated. In FIG. 16, connection terminals capable of inputting and outputting signals are shown on both sides of the electronic component PKG, and signals can be input and output on both sides of the electronic component PKG.
なお、ここでは、説明を容易にするために、一方向からの信号を図示したが、時間軸で入力と出力が切り替わる双方向の信号、若しくは、複数の入力ピンと出力ピンが混在している状態であってもよい。   Here, for ease of explanation, a signal from one direction is shown, but a bidirectional signal in which input and output are switched on the time axis, or a state in which a plurality of input pins and output pins are mixed. It may be.
以上のとおり、本実施形態に係る電子部品検査装置100では、保持部材10と下部接続部材30とを分けることで、保持部材10を軽量化できる。これにより、複数の電子部品PKGを保持部材10に保持したまま、高速搬送が可能になる。これにより、電子部品PKGの搬送時間を短縮できる。また、ブローバー101のステッピング動作により複数の電子部品の位置合わせの時間を短縮できる。この結果、単位時間当たりの電子部品の検査処理数を増やすことができる。   As described above, in the electronic component inspection apparatus 100 according to this embodiment, the holding member 10 can be reduced in weight by separating the holding member 10 and the lower connection member 30. Thereby, high-speed conveyance is enabled while holding the plurality of electronic components PKG on the holding member 10. Thereby, the conveyance time of the electronic component PKG can be shortened. In addition, the stepping operation of the blow bar 101 can shorten the time for aligning a plurality of electronic components. As a result, the number of electronic component inspection processes per unit time can be increased.
また、本発明一実施形態に係る電子部品の検査装置又は電子部品の検査方法によれば、電子部品を保持する保持部材を用いて、複数の電子部品を搬入し、且つ、検査時に複数の電子部品を保持することができるので、高価な複数のインサートを必要としない。このため、本発明一実施形態に係る電子部品の検査装置又は電子部品の検査方法によれば、検査装置の製造コストを削減することができる。また、本発明一実施形態に係る電子部品の検査装置又は電子部品の検査方法によれば、保持部材に高精度の加工を必要とせず、保持部材のコストを大幅に削減することができる。更に、本発明一実施形態に係る電子部品の検査装置又は電子部品の検査方法によれば、軽量な保持部材を用いて、複数の電子部品を搬入し、且つ、検査時に複数の電子部品を保持することができるので、搬送手段を小型化及び簡略化することができる。   Moreover, according to the electronic component inspection apparatus or electronic component inspection method according to an embodiment of the present invention, a plurality of electronic components are carried in using a holding member that holds the electronic components, and a plurality of electronic components are inspected. Since parts can be held, expensive inserts are not required. Therefore, according to the electronic component inspection apparatus or the electronic component inspection method according to the embodiment of the present invention, the manufacturing cost of the inspection apparatus can be reduced. In addition, according to the electronic component inspection apparatus or the electronic component inspection method according to an embodiment of the present invention, the holding member does not require high-precision processing, and the cost of the holding member can be significantly reduced. Furthermore, according to the electronic component inspection apparatus or the electronic component inspection method according to an embodiment of the present invention, a plurality of electronic components are carried in using a lightweight holding member, and the plurality of electronic components are held during inspection. Therefore, the conveying means can be reduced in size and simplified.
更に、本実施形態に係る電子部品の検査装置又は電子部品の検査方法によれば、電子部品の形状及び接続端子の数などに応じて、保持部材(の載置部)及び下部接続部材(の接続部)を容易に変更することができるので、装置の汎用性を向上することができる。具体的には、本発明一実施形態に係る電子部品の検査装置又は電子部品の検査方法によれば、電子部品の種類に応じて保持部材を容易に変更することができ、且つ、電子部品の種類に応じて下部接続部材30の接続ピン31tを容易に変更することができる。これにより、本実施形態に係る電子部品の検査装置又は電子部品の検査方法によれば、異なる種類の電子部品を検査する場合においても、装置及び方法を容易に共有化することができる。   Furthermore, according to the electronic component inspection apparatus or the electronic component inspection method according to the present embodiment, the holding member (mounting portion) and the lower connection member ( Since the connection portion can be easily changed, the versatility of the apparatus can be improved. Specifically, according to the electronic component inspection apparatus or the electronic component inspection method according to an embodiment of the present invention, the holding member can be easily changed according to the type of the electronic component, and the electronic component The connection pin 31t of the lower connection member 30 can be easily changed according to the type. Thereby, according to the electronic component inspection apparatus or the electronic component inspection method according to the present embodiment, the apparatus and method can be easily shared even when different types of electronic components are inspected.
なお、本実施形態にかかる電子部品検査装置100の各機能は、上記の検査方法をコンピュータに実行させるためのプログラムを制御部90が実行することにより実現されてもよい。プログラムは、コンピュータによって読み取り可能な記録媒体に格納されてもよい。なお、記録媒体には、フレキシブルディスク(FD)、CD−ROM(Compact Disk−ROM)、CD−R(CD Recordable)、DVD(Digital Versatile Disk)及びその他コンピュータ読み取り可能な媒体、並びに、フラッシュメモリ、RAM、ROM等の半導体メモリ、メモリカード、HDD(Hard Disc Drive)及びその他コンピュータ読み取り可能なものを用いることができる。また、上記プログラムを電子部品検査装置100にインストールすることにより、電子部品検査装置100の各機能を実行可能にしてもよい。   In addition, each function of the electronic component inspection apparatus 100 according to the present embodiment may be realized by the control unit 90 executing a program for causing a computer to execute the above inspection method. The program may be stored in a computer-readable recording medium. The recording medium includes a flexible disk (FD), a CD-ROM (Compact Disk-ROM), a CD-R (CD Recordable), a DVD (Digital Versatile Disk) and other computer-readable media, a flash memory, Semiconductor memories such as RAM and ROM, memory cards, HDDs (Hard Disc Drives), and other computer-readable devices can be used. In addition, by installing the program in the electronic component inspection apparatus 100, each function of the electronic component inspection apparatus 100 may be executable.
以上、本実施形態を参照しながら、本発明を説明したが、本発明は上記の実施形態に限定されることなく、添付の特許請求の範囲に照らし、種々に変更又は変形することが可能である。   The present invention has been described above with reference to the present embodiment, but the present invention is not limited to the above-described embodiment, and various changes or modifications can be made in light of the appended claims. is there.
例えば、本発明に係る電子部品検査装置は、搬送する電子部品のサイズや形状に合わせて保持部材の載置部の形状を変更することにより、汎用性を持たせることができる。具体的には、異なる形状の電子機器を搬送する場合、保持部材の枠のサイズや形状を電子機器の形状に合わせて変えて作製するだけでよく、汎用性が高い。保持部材は枠構造であるため、保持部材の枠のサイズや形状を変更しても、上記説明したように保持部材を下部接続部材に載置したときに電子機器を下部接続部材の接続ピンと接触させ、電気的接続をとることができる。   For example, the electronic component inspection apparatus according to the present invention can have versatility by changing the shape of the mounting portion of the holding member in accordance with the size and shape of the electronic component to be conveyed. Specifically, when transporting electronic devices having different shapes, it is only necessary to change the size and shape of the frame of the holding member in accordance with the shape of the electronic device, and the versatility is high. Since the holding member has a frame structure, even if the frame size or shape of the holding member is changed, the electronic device contacts the connection pin of the lower connection member when the holding member is placed on the lower connection member as described above. And electrical connection can be made.
10:保持部材
10a:桟部材
11P:載置部
12:開口
12s,12sc,12sd:支持片
13、14:貫通口
20:上部接続部材
22T:接続部
30:下部接続部材
31:接続部
31t:接続ピン
30b:配線部
30b1:配線
40:チャックステージ
50:撮像部
60:テスター
70:搬送部
80:保管部
90:制御部
100:電子部品検査装置
101:プローバー
PKG:電子部品
TMa,TMb,TMc:接続端子
10: Holding member 10a: Cross member 11P: Placement part 12: Opening 12s, 12sc, 12sd: Support piece 13, 14: Through port 20: Upper connection member 22T: Connection part 30: Lower connection member 31: Connection part 31t: Connection pin 30b: Wiring unit 30b1: Wiring 40: Chuck stage 50: Imaging unit 60: Tester 70: Transfer unit 80: Storage unit 90: Control unit 100: Electronic component inspection device 101: Prober PKG: Electronic components TMa, TMb, TMc :Connecting terminal

Claims (10)

  1. 検査信号を入力された電子部品から出力される出力信号に基づいて、前記電子部品を検査する電子部品の検査装置であって、
    前記電子部品を保持する保持部材と、
    前記電子部品に前記検査信号を入力する上部接続部材と、
    前記電子部品から出力された前記出力信号を検出する下部接続部材と
    を有し、
    前記保持部材は、検査時に、前記電子部品を保持した状態で前記上部接続部材と前記下部接続部材との間に配置される、
    ことを特徴とする電子部品の検査装置。
    An electronic component inspection apparatus for inspecting the electronic component based on an output signal output from the electronic component to which an inspection signal is input,
    A holding member for holding the electronic component;
    An upper connecting member for inputting the inspection signal to the electronic component;
    A lower connecting member that detects the output signal output from the electronic component;
    The holding member is disposed between the upper connecting member and the lower connecting member in a state where the electronic component is held during inspection.
    An electronic component inspection apparatus.
  2. 前記下部接続部材により検出された出力信号を折り返し、前記検査信号を入力した前記上部接続部材から出力するリターン信号経路、
    を更に有することを特徴とする請求項1に記載の電子部品の検査装置。
    A return signal path for turning back the output signal detected by the lower connecting member and outputting the inspection signal from the upper connecting member;
    The electronic component inspection apparatus according to claim 1, further comprising:
  3. 前記保持部材は、複数の桟部材から構成される格子状に並べられた複数の載置部を有し、
    前記複数の載置部には、前記複数の電子部品が夫々載置される、
    ことを特徴とする、請求項1又は2に記載の電子部品の検査装置。
    The holding member has a plurality of placement portions arranged in a lattice shape composed of a plurality of crosspiece members,
    The plurality of electronic parts are respectively mounted on the plurality of mounting portions.
    The electronic component inspection apparatus according to claim 1, wherein the electronic component inspection apparatus is an electronic component inspection apparatus.
  4. 前記複数の載置部のそれぞれは、略四角形状の開口を有し、前記開口の四隅に支持片を備え、
    前記支持片は、前記電子部品を支持する、
    ことを特徴とする、請求項3に記載の電子部品の検査装置。
    Each of the plurality of placement portions has a substantially rectangular opening, and includes support pieces at four corners of the opening,
    The support piece supports the electronic component;
    The electronic component inspection apparatus according to claim 3, wherein
  5. 前記保持部材は、前記載置部の外側に貫通口を有し、
    前記保持部材の貫通口に前記リターン信号経路を貫通させる、
    請求項3又は4に記載の電子部品の検査装置。
    The holding member has a through-hole on the outside of the mounting portion,
    Passing the return signal path through the through hole of the holding member;
    The electronic component inspection apparatus according to claim 3 or 4.
  6. 入力した前記検査信号と検出した前記出力信号とを比較することによって、前記電子部品の動作が正常か、又は、異常か若しくは異常の予兆があるかを検査するテスターを更に備える、
    ことを特徴とする、請求項4又は5に記載の電子部品の検査装置。
    A tester for testing whether the operation of the electronic component is normal, abnormal, or a sign of abnormality by comparing the input inspection signal and the detected output signal;
    The electronic component inspection apparatus according to claim 4, wherein the electronic component inspection apparatus is an electronic component inspection apparatus.
  7. 前記下部接続部材は、プローバーのチャックステージに固定され、
    前記保持部材が前記下部接続部材に載置される際、前記複数の載置部の開口を通して前記複数の電子部品と前記チャックステージに固定された下部接続部材とが電気的に接触する、
    ことを特徴とする、請求項4乃至請求項6のいずれか一項に記載の電子部品の検査装置。
    The lower connecting member is fixed to a chuck stage of a prober,
    When the holding member is placed on the lower connecting member, the plurality of electronic components and the lower connecting member fixed to the chuck stage are in electrical contact through the openings of the plurality of placing portions.
    The electronic component inspection apparatus according to claim 4, wherein the electronic component inspection apparatus is an electronic component inspection apparatus.
  8. 前記下部接続部材は、前記プローバーにより前記チャックステージと位置合わせした状態で該チャックステージに固定される、
    ことを特徴とする、請求項7に記載の電子部品の検査装置。
    The lower connecting member is fixed to the chuck stage in a state aligned with the chuck stage by the prober.
    The electronic component inspection apparatus according to claim 7, wherein:
  9. 検査信号を入力された電子部品から出力される出力信号に基づいて、前記電子部品を検査する電子部品の検査方法であって、
    格子状に並べられた複数の載置部を有する保持部材を用いて、複数の前記電子部品を複数の前記載置部で保持する保持ステップと、
    前記電子部品を保持した前記保持部材を下部接続部材に電気的に接続して配置する配置ステップと、
    上部接続部材を用いて、前記保持部材の上方から前記電子部品に前記検査信号を入力する信号入力ステップと、
    前記保持部材を配置された前記下部接続部材を用いて、前記電子部品から出力された前記出力信号を検出する信号検出ステップと、
    前記保持部材を貫通して前記下部接続部材に電気的に接続される前記上部接続部材の接続部を用いて、前記下部接続部材が検出した前記出力信号を伝送する信号伝送ステップと、
    伝送した前記出力信号に基づいて、前記電子部品を検査する検査ステップと
    を含む、ことを特徴とする電子部品の検査方法。
    An inspection method for an electronic component for inspecting the electronic component based on an output signal output from the electronic component to which an inspection signal is input,
    Using a holding member having a plurality of placement units arranged in a lattice shape, a holding step of holding a plurality of the electronic components by a plurality of the placement units,
    An arrangement step of arranging the holding member holding the electronic component in electrical connection with a lower connection member;
    A signal input step of inputting the inspection signal to the electronic component from above the holding member using an upper connecting member;
    A signal detection step of detecting the output signal output from the electronic component using the lower connecting member in which the holding member is disposed;
    A signal transmission step of transmitting the output signal detected by the lower connection member using a connection portion of the upper connection member that penetrates the holding member and is electrically connected to the lower connection member;
    An inspection step of inspecting the electronic component based on the transmitted output signal.
  10. 請求項9に記載の電子部品の検査方法をコンピュータに実行させるためのプログラム。   A program for causing a computer to execute the electronic component inspection method according to claim 9.
JP2013246645A 2013-11-28 2013-11-28 Electronic component inspection device, electronic component inspection method, and program for inspection method Pending JP2015105834A (en)

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