TWI597504B - Electronic components conveying device and its application test classification equipment - Google Patents

Description

Electronic component conveying device and test classification device thereof

The invention provides a probe for offsetting the probe by applying a topping force to the electronic component by using the abutting unit located under the electronic component when the suction member of the working tool and the probe crimping the electronic component on the carrier. The protruding elastic force of the head enables the suction member to accurately adsorb the electronic component with the preset suction force, and clamps the electronic component with the clamp to increase the contact area, so that the working tool smoothly moves the electronic component, thereby improving the electronic component conveying device for the moving operation efficiency.

Nowadays, the types of electronic components are diversified, for example, large-sized and flat-shaped electronic components, or small-sized electronic components having glass photosensitive elements, etc., refer to FIG. 1 , which is a flat electronic component 10 . The first surface 11 of the electronic component 10 is a flat surface, and a plurality of solder balls 13 are disposed on one side of the second surface 12. Since the first surface 11 of the electronic component 10 is not provided with other components, it can be placed on the carrier. a table (not shown) is pressed to perform a preset operation, and the second surface 12 of the electronic component 10 is attached to the suction member of the feeder (not shown) because of having a large area. The test operation is performed with the solder balls 13 on the second side 12 electrically contacting the probes of the shifter.

However, whether it is a flat electronic component or an electronic component having a glass photosensitive component, after the production is completed, a test process is performed on the electronic component testing device to eliminate defective electronic components; see Figures 2 and 3, the electronic The device 20 of the component testing device is provided with a carrier 21 having a receiving slot 211, and the electronic component 10 is mounted by the receiving slot 211. The first surface 11 of the electronic component 10 is placed downwardly in the receiving slot. 211, while the second surface 12 and the solder ball 13 are oriented upward for the material transfer device 22 of the conveying device 20 to take the material. The material moving device 22 drives the carrier 222 to move in the YZ direction. Shelf A nozzle 223 for absorbing and discharging electronic components is disposed under the 222. The first probe 224 is disposed on one side of the nozzle 223, and the number of the first probes 224 is corresponding to the number of the solder balls 13 of the electronic component 10. And a first probe head 2241 protruding outwardly from the first end for electrically contacting the solder ball 13 of the electronic component 10, and the second end of the first probe 224 is electrically connected to a circuit board 225 The circuit board 225 is electrically connected to the second end of the plurality of second probes 226. The first end of the second probe 226 also has a second probe head 2261 that can be elastically protruded outward to electrically contact the test. The other circuit board on the device (not shown); in use, the loader 22 drives the carrier 222, the suction nozzle 223, the first probe 224, and the like to be displaced downward in the Z direction by the driving member 221, The nozzle 223 is attracted to the second surface 12 of the electronic component 10, and electrically contacts the solder ball 13 of the electronic component 10 with the first probe head 2241 of the first probe 224, since the second surface 12 of the electronic component 10 has a larger area, and the adsorption contact area of the suction nozzle 223 can be increased, so that the suction nozzle 223 sucks up the electronic component 10 with a large adsorption force, and overcomes The downwardly projecting elastic force of the first probe head 2241 of the probe 224 causes the electronic component 10 to compress the first probe head 2241 of the first probe 224 so that the nozzle 223 of the shifter 22 does adsorb the electronic component 10 The driving member 221 drives the carrier 222, the suction nozzle 223 and the first probe 224 to move upward in the Z direction, so that the suction nozzle 223 takes out the electronic component 10 on the stage 21 and transfers it to the next mechanism. At the office.

However, please refer to Figures 1 and 4, because the second surface 12 of the flat electronic component 10 can provide a larger adsorption contact area of the nozzle, so that the nozzle can overcome the plural of the first probe with a large adsorption force. The total protruding force of the first probe head is supported, but the volume of the electronic component is increasingly small and thin, such as the electronic component 30 having a glass photosensitive element, and the first surface 31 of the electronic component 30 has a glass material and The photosensitive element 32 is not pressed, and the second surface 33 is provided with a plurality of solder balls 34 on both sides. Since the electronic component 30 is small in size, the double-row plurality of solder balls 34 occupy the area of the second surface 33, which is not only The second surface 33 of the reduced electronic component 30 can provide an area for suction of the nozzle, and must also reduce the diameter of the nozzle. The nozzle can only be used for a small area of the adsorption contact electronic component 30, so that the suction force of the nozzle is limited, because the number of the first probes of the feeder is corresponding to the number of the solder balls 34 of the electronic component 30, The shifter is equipped with a large number of first probes, and a large number of first probe heads generate a large total protruding force, so that the small suction force of the nozzle cannot overcome the multiple probes generated by the first probe. The total protruding force, when the nozzle of the feeder is sucking upward to extract the electronic component 30, the electronic component 30 on the nozzle is likely to be driven by the larger total protruding force of the first probe. The top drop causes the nozzle of the feeder to fail to smoothly absorb the missing of the transfer electronic component; and since the first surface 31 of the electronic component 30 has the photosensitive element 32 of glass material, when the plurality of first probes of the shifter will The electronic component 30 on the nozzle is behind the top, and the photosensitive component 32 of the dropped electronic component 30 is damaged by the collision, resulting in an increase in cost and a loss of yield; and further, when the plurality of shifters are first The probe drops the electronic component 30 on the nozzle downward , The feeder will drive the shift actuator according to the preset timing will be no suction nozzle of an electronic component to the next apparatus, thereby affecting the subsequent operation.

An object of the present invention is to provide an electronic component conveying device, comprising a bearing mechanism and an operating mechanism, the carrier mechanism is provided with a carrier having at least one movable seat, and the electronic component is mounted by the movable seat, and the carrier is mounted on the carrier. Providing at least one topping unit capable of applying an abutting force to the electronic component, the working mechanism is provided with at least one working tool having a suction member and a probe, and the working tool is provided with at least one clamping electronic component The fixture can use the top abutting unit to apply a topping force to the electronic component through the movable seat when the suction member of the working tool and the probe are crimped to the electronic component on the carrier to offset the convexity of the probe head of the probe. Stretching force, the electronic component compresses the probe head, so that the suction member reliably adsorbs the electronic component with a preset suction force, and clamps the outer surface of the electronic component with the clamp to increase the contact area, so that the work tool smoothly moves the electronic component to the preset position. And to prevent falling, to achieve the practical benefits of improving the efficiency of the moving operation.

A second object of the present invention is to provide an electronic component conveying device, wherein when the suction member and the probe of the working tool are crimped to the electronic component on the carrier, the supporting mechanism can use the top abutting unit to apply the topping function to the electronic component. Force and offset probe The protruding elastic force of the probe head eliminates the suction resistance of the suction member, so that the suction member does adsorb the electronic component, thereby preventing the electronic component from being damaged by the probe, thereby achieving the practical benefit of reducing the cost and improving the yield.

The third object of the present invention is to provide an electronic component conveying device, wherein when the suction member and the probe of the working tool are crimped to the electronic component on the carrier, the supporting mechanism can use the topping unit to apply the topping function to the electronic component. Force, and offset the protruding elastic force of the probe head of the probe, so that the suction member does not attract the electronic component to prevent falling, so that the work tool smoothly moves the electronic component to the next device and performs a preset operation, thereby achieving smooth lifting operation. Practical benefits of sex.

A fourth object of the present invention is to provide a test classification device for applying an electronic component conveying device, which comprises a machine table, a feeding device, a receiving device, a testing device, a conveying device and a central control device, wherein the feeding device is configured on the machine And a supply device for accommodating the electronic component to be tested, the receiving device is disposed on the machine table, and is provided with at least one receiving device for accommodating the tested electronic component, the test The device is disposed on the machine, and is provided with a test device for performing a test operation by at least one pair of electronic components. The conveying device is disposed on the machine table, and is provided with a bearing mechanism and an operating mechanism for smoothly transferring electronic components. The central control unit is used to control and integrate the operation of each device to perform automated operations to achieve practical benefits of improving operational efficiency.

[study]

10‧‧‧Electronic components

11‧‧‧ first side

12‧‧‧ second side

13‧‧‧ solder balls

20‧‧‧Conveyor

21‧‧‧ stage

211‧‧‧ accommodating slots

22‧‧‧Transfer

221‧‧‧ drive parts

222‧‧‧ Shelf

223‧‧ ‧ nozzle

224‧‧‧First probe

2241‧‧‧First probe head

225‧‧‧ circuit board

226‧‧‧second probe

2261‧‧‧Second probe head

30‧‧‧Electronic components

31‧‧‧ first side

32‧‧‧Photosensitive elements

33‧‧‧ second side

34‧‧‧ solder balls

〔this invention〕

40‧‧‧Conveyor

41‧‧‧Loading mechanism

411‧‧‧Carrier

4111‧‧‧ accommodating slots

4112‧‧‧Resistance

4113‧‧‧ fluid passage

412‧‧‧First drive

413‧‧‧ activity seat

4131‧‧‧Holding Department

4132‧‧‧Interposed space

4133‧‧‧Card Department

414‧‧‧Flexible parts

42‧‧‧ operating agencies

421‧‧‧Working tools

422‧‧‧second drive

423‧‧‧Sucker

424‧‧‧First probe

4241‧‧‧First probe head

425‧‧‧ boards

4261‧‧‧Second probe head

428‧‧‧ third drive

41B‧‧‧Second feed bearing mechanism

42B‧‧‧Second operating agency

44‧‧‧First receiving platform

46‧‧‧Second shifter

50‧‧‧ machine

61‧‧‧Feeder

71‧‧‧Receipt receiver

81‧‧‧Circuit board

426‧‧‧Second probe

427‧‧‧ fixture

41A‧‧‧First Feed Carrier

42A‧‧‧First operating agency

43‧‧‧First shifter

45‧‧‧Second receiving platform

60‧‧‧Feeding device

70‧‧‧Receiving device

80‧‧‧Testing device

82‧‧‧ test seat

Figure 1: Schematic diagram of a conventional flat electronic component.

Figure 2: Schematic diagram of the use of a conventional electronic component transport device (1).

Figure 3: Schematic diagram of the use of a conventional electronic component transport device (2).

Fig. 4 is a schematic view showing an electronic component having a glass photosensitive member.

Fig. 5 is a view showing a first embodiment of the electronic component conveying device of the present invention.

Figure 6 is a schematic view (1) of a first embodiment of the delivery device of the present invention.

Figure 7: Schematic diagram (II) of the first embodiment of the delivery device of the present invention.

Figure 8: A schematic view (3) of the first embodiment of the delivery device of the present invention.

Figure 9 is a schematic view showing a second embodiment of the electronic component conveying device of the present invention.

Figure 10: A schematic view (I) of a second embodiment of the delivery device of the present invention.

Figure 11: Schematic diagram (II) of the second embodiment of the delivery device of the present invention.

Figure 12: Schematic diagram of the delivery device of the present invention applied to a test classification device.

In order to provide a further understanding of the present invention by the review of the present invention, a preferred embodiment and the accompanying drawings are described in detail below: Referring to Figure 5, a first embodiment of the delivery device 40 of the present invention includes The carrying mechanism 41 and the working mechanism 42 are provided with a carrier having at least one movable seat, and at least one electronic component is mounted by the movable seat. Further, the carrying device can be fixed or movable. In this embodiment, the carrier 411 is a movable stage, and is displaced by the first driver 412 in the X direction. The carrier 411 is recessed with at least one receiving slot 4111 for at least one Z. The movable seat 413 of the directional displacement is provided with at least one receiving portion 4131 for receiving electronic components, and at least one insertion space 4132 is provided on at least one side of the receiving portion 4131, and the carrier is provided The 411 is provided with at least one abutting unit capable of applying a topping force to the electronic component, and the topping force may be an elastic force of the elastic member or a fluid thrust of the fluid, and the fluid may be a gas or a liquid, in the embodiment. The top abutting unit is attached to the carrier 411 At least one elastic member 414 is disposed in the accommodating groove 4111. The first end of the elastic member 414 is connected to the accommodating groove 4111 at the top, and the second end is connected to the movable seat 413 at the top, so that the elastic member 414 is elastically movable. The seat 413 is provided with a topping force, and the movable seat 413 is elastically displaced in the Z direction inside the receiving groove 4111; the working mechanism 42 is provided with at least one working tool, and the working tool is provided with at least one pick-and-place electronic device. a suction member of the component, and a probe provided with at least one elastically stretchable probe head, and electrically connecting the contact of the electronic component, and the probe head is subjected to the top when the probe electrically contacts the electronic component The top of the abutting unit is pressed against the force, and further, the working tool can be fixed or movable. The suction member can be telescopically displaced or has a deformable nozzle pad, and the suction member can be simply moved. a transfer member for carrying an electronic component, or a pressure-moving member having a transfer and depression electronic component. In the embodiment, the work tool 421 is The second driver 422 is displaced in the YZ direction, and the working tool 421 is provided with a suction member 423 which can be used for the Z-direction telescopic displacement, and the suction member 423 is a pressure-moving member for transferring and pressing the electronic component, and the suction member is A plurality of first probes 424 are disposed on two sides of the 423, and a spring (not shown) is disposed inside the tube of the first probe 424, and a first probe protruding from the spring is provided at the first end. The first probe head 4241 is used to electrically contact the contact of the electronic component (such as a solder ball), and the second end of the first probe 424 is electrically connected to a circuit board 425. The circuit board 425 Reconnecting a plurality of second probes 426, the second probe heads 4261 of the second probes 426 are electrically connected to the tester (not shown), and the top of the support mechanism 41 is coupled to the unit The top abutting force is equal to or greater than the total protruding force of the probe head of the probe. In this embodiment, the top abutting force of the abutting unit is equal to the plurality of first probe heads 4241 of the working tool 421. The total protruding force is such that when the first probe head 4241 of the plurality of first probes 424 is electrically crimped to the electronic component, the plurality of first probe heads 42 41 is further contracted by the top abutting force of the abutting unit, and the work tool 421 is provided with at least one clamp for holding the electronic component. In the embodiment, the work tool 421 is corresponding to the carrier 411. The position of the insertion space 4132 is provided with two clamps 427, which are driven by the third actuator 428 for X-direction displacement opening and closing, and can be inserted into the carrier 411 when the working tool 421 is displaced in the Z direction. The space 4132 is clamped to the outer peripheral surface of the electronic component to increase the contact area for the transfer operation.

Please refer to FIGS. 6 and 7. Since the photosensitive element 32 of the electronic component 30 has an incompressible property, the electronic component 30 must be placed on the mounting portion 4131 of the movable seat 413 which is directed downward and attached to the carrier 411. The second surface 33 of the electronic component 30 and the solder ball 34 are oriented upward, so that the suction member 423 of the working mechanism 42 and the first probe 424 are respectively pressed into contact; therefore, after the carrier 411 is mounted on the electronic component 30, That is, the first driver 412 drives the carrier 411 to be displaced in the X direction to the preset feeding position. The second driver 422 of the working mechanism 42 drives the working tool 421, the suction member 423 and the first probe 424 to be displaced in the Y direction. The carrier 411 to the carrying mechanism 41 Above, the suction member 423 corresponds to the second surface 33 of the electronic component 30, and the first probe 424 corresponds to the solder ball 34 of the electronic component 30, and then the second driver 422 drives the work tool 421, the suction member 423, and the first The probe 424 is displaced downward in the Z direction, and the suction member 423 is pressure-bonded to the second surface 33 of the electronic component 30, and the electronic component 30 is electrically crimped by the first probe head 4241 of the first probe 424. The solder ball 34, and the two clamps 427 on the work tool 421 are moved into the insertion space 4132 of the movable seat 413, and are located on both sides of the electronic component 30, due to the first probe head of the plurality of first probes 424 The 4241 has a large downward elastic force. In order to prevent the first probe head 4241 from falling over the electronic component 30 on the suction member 423, the suction member 423 and the first probe 424 are pressed by the downward pressing force. When the electronic component 30 is pressed and the movable seat 413 is pressed downward for the Z direction, the movable seat 413 compresses the elastic member 414. After the elastic member 414 receives a downward pressing force, it will act as an upward topping. The force is transmitted to the electronic component 30 via the movable seat 413, and the upward topping force counteracts the plurality of The total protruding force of the probe head 4241 compresses the first probe head 4241, and eliminates the resistance of the suction member 423 to the electronic component 30 (ie, the protruding elasticity of the first probe head 4241), so that the suction member 423 The predetermined suction force does adsorb the electronic component 30, and the second driver 428 drives the two clamps 427 to be clamped on the outer peripheral surface of the electronic component 30 to increase the contact area.

Referring to FIG. 8, the second driver 422 of the operating mechanism 42 drives the work tool 421, the suction member 423, the first probe 424, and the electronic component 30 to be displaced upward in the Z direction, since the electronic component 30 is not subject to the first The convex force of the probe head 4241 is affected, so that the work tool 421 can positively adsorb the electronic component 30 by using the suction member 423, and clamp the electronic component 30 with the two clamps 427 to take out the electronic component 30 on the movable seat 413 of the carrier 411. Not only can the electronic component 30 be prevented from falling and being damaged, but the cost and the yield can be improved, and the work tool 421 can be more smoothly transferred to the next device (such as a test device, not shown). Ensure the smoothness of subsequent operations.

Please refer to FIG. 9 , which is the second embodiment of the conveying device 40 of the present invention. For example, the second embodiment has the same working mechanism 42 as the first embodiment, and the difference is that the supporting mechanism 41 is disposed between the receiving groove 4111 of the carrier 411 and the movable seat 413. In the present embodiment, the receiving portion 4112 of the carrier 411 is convexly provided with a resisting portion 4112, and a latching portion 4133 is protruded from the outer surface of the movable seat 413 for card The receiving portion 41 is formed with a gas chamber, and the receiving portion 41 of the supporting mechanism 41 is provided with at least one fluid passage in the carrier 411 for inputting fluid to the receiving groove 4111. The fluid thrust exerts a topping force on the electronic component on the movable seat 413. In the embodiment, the abutting unit is provided with at least one fluid passage 4113 connected to the receiving groove 4111. The passage 4113 inputs the fluid of the gas into the accommodating groove 4111, and uses the gas thrust to form a topping force pushing the movable seat 413 upward for the electronic component to be mounted.

Referring to FIGS. 10 and 11 , after the electronic component 30 is mounted on the mounting portion 4131 of the movable seat 413 on the carrier 411 , the working mechanism 42 drives the working tool 421 , the suction member 423 and the first probe with the second driver 422 . The needle 424 is displaced downward in the Z direction, and the suction member 423 is pressure-bonded to the second surface 33 of the electronic component 30, and is pressed against the electrical contact electronic component 30 by the first probe head 4241 of the first probe 424. The solder ball 34, and the two clamps 427 on the work tool 421 are moved into the insertion space 4132 of the movable seat 413, and are located on both sides of the electronic component 30, in order to avoid a large protrusion of the first probe head 4241. The elastic force pushes up the electronic component 30 on the suction member 423, and presses the suction member 423 and the first probe 424 against the electronic component 30 with a downward pressing force, and presses the movable seat 413 downward to shift the Z direction downward. The top abutting unit can conduct the upper topping force generated by the gas in the receiving groove 4111 to the electronic component 30 via the movable seat 413, and offset the downward direction of the first probe head 4241 by the upward topping force. The elastic force is convex, and the first probe head 4241 is compressed, and the resistance of the suction member 423 to the electronic component 30 is eliminated. So that the suction of the suction member 423 to a predetermined suction the electronic component 30 does, then the third driver 428 to drive The second clamp 427 is clamped on the outer peripheral surface of the electronic component 30 to increase the contact area; therefore, the second driver 422 of the working mechanism 42 drives the work tool 421, the suction member 423, the first probe 424, and the electronic component 30 to perform the Z direction. Upwardly, the work tool 421 can positively adsorb the electronic component 30 by using the suction member 423, and clamp the electronic component 30 with the two clamps 427 to take out the electronic component 30 on the movable seat 413 of the carrier 411, thereby preventing the electronic component 30 from falling. The damage is reduced, the cost is reduced, and the yield is improved, so that the work tool 421 is more smoothly transferred to the next device, and the smoothness of subsequent operations can be ensured.

Referring to Figures 5 and 12, the transport device 40 of the present invention is applied to an electronic component test and sorting device, which includes a machine table 50, a feeding device 60, a receiving device 70, a testing device 80, a conveying device 40, and a center. a control device (not shown), the feeding device 60 is mounted on the machine table 50, and is provided with at least one feeding device 61 for accommodating at least one electronic component to be tested; the receiving device 70 is The device is mounted on the machine 50 and is provided with at least one receiving device 71 for accommodating at least one tested electronic component. The testing device 80 is mounted on the machine 50 and is provided with at least one tester for Performing a test operation on the electronic component, in the embodiment, the tester has an electrically connected circuit board 81 and a test socket 82; the transport device 40 is mounted on the machine 50, and is provided with a carrying mechanism 41 and The working mechanism 42 is used for smoothly transferring electronic components. In the present embodiment, the first feeder 43 of the conveying device 40 is taken out from the feeding device 60 to take out the electronic components to be tested, and is respectively transported to the same structure as the supporting mechanism. 41 first feed bearing mechanism 41A and second feed bearing The mechanism 41B, the first feeding carrier mechanism 41A and the second feeding carrier mechanism 41B carry the electronic components to be tested to the testing device 80, and the conveying device 40 is provided with the first operation of the same structure as the working mechanism 42 The mechanism 42A and the second working mechanism 42B, the first working mechanism 42A and the second working mechanism 42B respectively transfer the electronic components to be tested on the first feeding carrier 41A and the second feeding carrier 41B to the testing device 80. Performing a test operation, and transferring the tested electronic components at the test device 80 to the first receiving stage 44 and the second receiving stage 45, the first receiving stage 44 and the second receiving stage The stage 45 carries the measured electronic components, and the second shifter 46 of the transport device 40 is attached to the first receiving stage 44 and the second receiving stage 45 to take out the measured electronic components, and As a result of the test, the measured electronic components are transported to the receiving device 70 for sorting and storage. The central control device is used to control and integrate the operations of the devices to perform automated operations, thereby achieving practical benefits of improving operational efficiency.

40‧‧‧Conveyor

41‧‧‧Loading mechanism

411‧‧‧Carrier

4111‧‧‧ accommodating slots

412‧‧‧First drive

413‧‧‧ activity seat

4131‧‧‧Holding Department

4132‧‧‧Interposed space

414‧‧‧Flexible parts

42‧‧‧ operating agencies

421‧‧‧Working tools

422‧‧‧second drive

423‧‧‧Sucker

424‧‧‧First probe

4241‧‧‧First probe head

425‧‧‧ boards

426‧‧‧Second probe

4261‧‧‧Second probe head

427‧‧‧ fixture

428‧‧‧ third drive

Claims (10)

An electronic component conveying device comprising: a supporting mechanism: a carrier with at least one movable seat, and at least one electronic component is mounted by the movable seat, and at least one electronic component is provided on the carrying component A top abutting unit for applying a top force; the working mechanism is provided with at least one work tool, the work tool is provided with at least one sucking member for picking up the electronic component, and at least one elastic telescopic probe head is provided a probe electrically connected to the contact of the electronic component, and when the probe electrically contacts the electronic component, the probe head is retracted by the topping force of the abutting unit, and The work tool is provided with at least one jig for holding the electronic component. The electronic component conveying device according to claim 1, wherein the carrier of the bearing mechanism or the working tool of the working mechanism is fixed or movable. The electronic component conveying device of claim 1, wherein the carrier of the carrier mechanism is provided with at least one accommodating groove for accommodating the movable seat having at least one receiving portion, the at least one The mounting portion houses at least one of the electronic components. The electronic component transport device of claim 3, wherein the movable seat of the support mechanism is provided with at least one insertion space on at least one side of the receiving portion for moving into the clamp. The electronic component conveying device of claim 3, wherein the abutting unit is configured to assemble at least one elastic member between the receiving groove of the carrier and the movable seat, and form a top with the elastic force of the elastic member. Pushing the pushing force of the electronic component on the movable seat. The electronic component conveying device of claim 3, wherein the abutting unit is provided with at least one fluid passage connecting the receiving groove to input fluid to the receiving groove, The fluid thrust of the fluid forms an urging force that pushes the electronic component on the movable seat. The electronic component conveying device of claim 1, wherein the abutting force of the abutting unit is an elastic force or a fluid thrust. The electronic component conveying device according to claim 1, wherein the abutting force of the abutting unit is equal to or greater than a total protruding force of the probe head of the probe to compress the probe head. The electronic component conveying device according to claim 1, wherein the working tool is provided with at least one first probe on a side of the suction member, and the first end of the first probe is provided with a first The probe head is electrically connected to a circuit board, and the circuit board is electrically connected to the at least one second probe. A test classification device for applying an electronic component conveying device, comprising: a machine table; a feeding device: disposed on the machine table, and provided with at least one feeding device for accommodating electronic components to be tested; and a receiving device: Disposed on the machine, and provided with at least one receiving device for accommodating the tested electronic components; testing device: a tester disposed on the machine and provided with at least one pair of electronic components to perform a test operation; At least one electronic component conveying device according to claim 1 is disposed on the machine to transfer electronic components; and the central control device is used to control and integrate the devices to perform automated operations.