TW202129289A - The crimping mechanism for electronic component and the application thereof in the crimping device and in the testing classification equipment - Google Patents

The crimping mechanism for electronic component and the application thereof in the crimping device and in the testing classification equipment Download PDF

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TW202129289A
TW202129289A TW109101354A TW109101354A TW202129289A TW 202129289 A TW202129289 A TW 202129289A TW 109101354 A TW109101354 A TW 109101354A TW 109101354 A TW109101354 A TW 109101354A TW 202129289 A TW202129289 A TW 202129289A
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crimping
electronic component
piece
unit
supporting tool
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TW109101354A
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Chinese (zh)
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TWI761752B (en
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蔡志欣
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鴻勁精密股份有限公司
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Abstract

The crimping mechanism for electronic component is assembled on a transfer arm for moving along at least one direction. The crimping mechanism includes a carrier, a crimping driving unit, and a crimping member. The carrier which has the crimping member and the crimping driving unit assembled thereon is assembled on the transfer arm. The crimping driving unit has a driving source for driving and applying a pressure on the crimping member. Therefore, the transfer arm drives the carrier to move along a first moving travel to abut against the machine base, and the crimping member is driven by the crimping driving unit to move independently along a second moving travel, so that the crimping mechanism can accurately press on the electronic component with the preset pressure, thereby achieving the practical benefit of improving the quality of testing.

Description

電子元件壓接機構及其應用之壓接裝置、測試分類設備Electronic component crimping mechanism and its application crimping device, test classification equipment

本發明係提供一種於移載臂帶動承具抵置機台限位,利用壓接驅動單元驅動壓接件獨立作動以預設下壓力精確壓抵電子元件執行測試作業,進而提高測試品質之電子元件壓接機構。The present invention provides an electronic device that drives a carrier to abut against a machine limit by a transfer arm, uses a crimping drive unit to drive the crimping piece to act independently, and precisely presses an electronic component with a preset downward pressure to perform a test operation, thereby improving the quality of the test. Component crimping mechanism.

在現今,電子元件之類型繁多,例如邏輯IC、RF射頻IC等,不論何種類型之電子元件,皆必須於測試設備進行測試作業,以淘汰出不良品,但不同電子元件會因表面材質或錫球數量等因素,而承受不同之測試下壓力,例如邏輯IC之表面可承受較大之測試下壓力,RF射頻IC之表面則無法承受較大之測試下壓力,因此如何避免測試下壓力壓損電子元件相當重要。Nowadays, there are many types of electronic components, such as logic ICs, RF radio frequency ICs, etc. No matter what type of electronic components, they must be tested in test equipment to eliminate defective products. However, different electronic components may vary depending on the surface material Factors such as the number of solder balls can withstand different test pressures. For example, the surface of logic ICs can withstand higher test pressures, while the surface of RF ICs cannot withstand higher test pressures. Therefore, how to avoid test pressures Damage to electronic components is very important.

請參閱第1、2圖,電子元件測試設備係於機台11配置測試裝置12及壓接裝置13,測試裝置12係設有電性連接之電路板121及測試座122,並以測試座122承置且測試電子元件(如RF射頻IC),壓接裝置13係以馬達131驅動皮帶輪組132,皮帶輪組132傳動導螺桿133旋轉,導螺桿133帶動移載臂134作Z方向向下位移,移載臂134裝配壓接器135,壓接器135係以一具吸嘴之壓接治具1351,而供取放及壓接電子元件14;於執行測試作業時,壓接裝置13係以壓接器135將電子元件14移載至測試裝置12上方,並以馬達131經皮帶輪組132及導螺桿133而帶動移載臂134及壓接器135作Z方向向下位移,使壓接器135將電子元件14移入測試座122,然為使電子元件14之錫球確實接觸測試座122之探針,壓接裝置13之馬達131會持續驅動壓接器135作Z方向向下位移,令壓接器135之壓接治具1351以一下壓力下壓電子元件14,使電子元件14之錫球與測試座122之探針確實接觸而執行測試作業。Please refer to Figures 1 and 2. The electronic component testing equipment is equipped with a testing device 12 and a crimping device 13 on the machine 11. The testing device 12 is provided with a circuit board 121 and a test base 122 that are electrically connected, and the test base 122 To hold and test electronic components (such as RF IC), the crimping device 13 drives the pulley set 132 with a motor 131, the pulley set 132 drives the lead screw 133 to rotate, and the lead screw 133 drives the transfer arm 134 to move downward in the Z direction. The transfer arm 134 is equipped with a crimping device 135. The crimping device 135 is a crimping jig 1351 with a suction nozzle for picking, placing and crimping the electronic components 14; when performing a test operation, the crimping device 13 is The crimper 135 transfers the electronic component 14 to the top of the testing device 12, and drives the transfer arm 134 and the crimper 135 to move downward in the Z direction by the motor 131 through the pulley set 132 and the lead screw 133, so that the crimper 135 moves the electronic component 14 into the test socket 122, but in order to make the solder ball of the electronic component 14 really contact the probe of the test socket 122, the motor 131 of the crimping device 13 will continue to drive the crimper 135 to move downward in the Z direction, so that The crimping jig 1351 of the crimping device 135 presses down the electronic component 14 with a single pressure, so that the solder ball of the electronic component 14 and the probe of the test base 122 are in contact with each other to perform the test operation.

惟,壓接裝置13之馬達131的轉動精度並無法作精密微調,若待測電子元件為邏輯IC,其表面尚可承受馬達131經壓接器135所施予之較大下壓力,但若待測電子元件為RF射頻IC時,其表面並無法承受重壓,於馬達131驅動壓接器135以較大之下壓力壓接RF射頻IC時,易發生RF射頻IC之表面壓損破裂的狀況,進而影響測試品質。又當壓接裝置13之壓接器135將電子元件14移入測試座122後,馬達131再經由導螺桿133剛性帶動壓接器135作Z方向下壓電子元件14,此時電子元件14會突然承受一瞬間較大的下壓力,而此一瞬間較大的下壓力易使電子元件14發生裂損的問題。However, the rotation accuracy of the motor 131 of the crimping device 13 cannot be fine-tuned. If the electronic component to be tested is a logic IC, its surface can still withstand the large down force exerted by the motor 131 through the crimping device 135, but if When the electronic component to be tested is an RF radio frequency IC, its surface cannot bear heavy pressure. When the motor 131 drives the crimping device 135 to crimp the RF radio frequency IC with a large pressure, the surface pressure loss of the RF radio frequency IC is likely to occur. Status, which in turn affects the quality of the test. After the crimper 135 of the crimping device 13 moves the electronic component 14 into the test base 122, the motor 131 rigidly drives the crimper 135 via the lead screw 133 to press the electronic component 14 down in the Z direction. At this time, the electronic component 14 will suddenly Withstand a large down force for an instant, and the large down force at this instant is likely to cause the electronic component 14 to crack.

本發明之目的一,係提供一種電子元件壓接機構,其係裝配於移載臂而作至少一方向位移,壓接機構包含承具、壓接驅動單元及壓接件,承具係裝配於移載臂,壓接件係裝配於承具,壓接驅動單元係裝配於承具,並設有驅動源,以供驅動且施予壓力於壓接件,藉以移載臂帶動承具依第一位移行程而抵置於機台,壓接機構利用壓接驅動單元之驅動源驅動壓接件獨立作動依第二位移行程而以預設下壓力精確壓抵電子元件執行測試作業,達到提高測試品質之實用效益。The first object of the present invention is to provide a crimping mechanism for electronic components, which is assembled on a transfer arm for displacement in at least one direction. The crimping mechanism includes a bearing, a crimping drive unit, and a crimping piece. For the transfer arm, the crimping piece is assembled on the bearing, and the crimping drive unit is assembled on the bearing, and is provided with a drive source for driving and applying pressure on the crimping piece, so that the transfer arm drives the bearing according to the A displacement stroke is placed on the machine table, and the crimping mechanism uses the driving source of the crimping drive unit to drive the crimping piece to act independently. According to the second displacement stroke, the electronic component is accurately pressed against the electronic component with a preset downward pressure to perform the test operation to achieve improved testing. The practical benefits of quality.

本發明之目的二,係提供一種電子元件壓接機構,其承具更包含 防脫單元,防脫單元係設有至少一防脫件,以防止壓接件任意脫離承具,並使壓接件作一緩衝位移,而有效避免壓損電子元件,達到提高電子元件良率之實用效益。The second objective of the present invention is to provide a crimping mechanism for electronic components, the supporting tool further includes Anti-drop unit, the anti-drop unit is equipped with at least one anti-drop component to prevent the crimping piece from arbitrarily detaching from the support, and to make the crimping piece a buffer displacement, which effectively avoids the pressure loss of the electronic component and improves the yield rate of the electronic component The practical benefits.

本發明之目的三,係提供一種電子元件壓接機構,其防脫單元係裝配於承具下方,並供穿伸出壓接件,於更換壓接件時,僅需拆卸防脫件,即可迅速取出壓接件,達到提高更換作業便利性之實用效益。The third objective of the present invention is to provide a crimping mechanism for electronic components. The anti-dropping unit is assembled under the supporting tool, and the crimping piece is passed through and protruding. When the crimping piece is replaced, only the anti-dropping piece needs to be disassembled, that is, The crimping parts can be quickly taken out to achieve the practical benefit of improving the convenience of replacement operations.

本發明之目的四,係提供一種電子元件壓接機構,其承具包含第一座體及第二座體,第一座體係連接移載臂,並供裝配壓接驅動單元,第二座體連接第一座體,並供裝配壓接件,於更換不同數量或尺寸之壓接件時,僅需拆卸第二座體,即可同步取下複數個壓接件,進而有效縮減裝拆作業時間,達到提高生產效能之實用效益。The fourth object of the present invention is to provide a crimping mechanism for electronic components, the supporting tool includes a first seat body and a second seat body, the first seat system is connected to the transfer arm, and the crimping drive unit is assembled, and the second seat body Connect the first base body and provide for assembling crimping parts. When replacing crimping parts of different numbers or sizes, only the second base body needs to be disassembled, and multiple crimping parts can be removed simultaneously, thereby effectively reducing assembly and disassembly operations. Time to achieve the practical benefit of improving production efficiency.

本發明之目的五,係提供一種電子元件壓接機構,其壓接驅動單元之驅動源連接一調壓單元,調壓單元可供調整控制該壓接驅動單元施予壓接件之壓力值,以使壓接件保持預設下壓力精確下壓電子元件,達到提升壓測品質之實用效益。The fifth object of the present invention is to provide a crimping mechanism for electronic components, the drive source of the crimping drive unit is connected to a pressure regulating unit, and the pressure regulating unit can be used to adjust and control the pressure value applied by the crimping drive unit to the crimping part. In order to make the crimping parts maintain the preset pressure and accurately push down the electronic components, the practical benefit of improving the quality of pressure measurement is achieved.

本發明之目的六,係提供一種壓接裝置,包含載送機構及本發明之壓接機構,載送機構係設有載送動力源以及由載送動力源驅動位移之移載臂 ,本發明壓接機構包含承具、壓接驅動單元及壓接件,並以承具裝配於移載臂,藉以移載臂帶動承具依第一位移行程而抵置於機台,壓接機構利用壓接驅動單元之驅動源驅動壓接件獨立作動依第二位移行程而以預設下壓力精確壓抵電子元件執行測試作業,達到提高測試品質之實用效益。The sixth object of the present invention is to provide a crimping device comprising a carrying mechanism and the crimping mechanism of the present invention. The carrying mechanism is provided with a carrying power source and a transfer arm driven by the carrying power source to move. , The crimping mechanism of the present invention includes a bearing tool, a crimping drive unit and a crimping piece, and the bearing tool is assembled on the transfer arm, whereby the transfer arm drives the bearing tool to abut against the machine table according to the first displacement stroke, and press The mechanism utilizes the drive source of the crimping drive unit to drive the crimping piece to independently actuate according to the second displacement stroke and accurately press the electronic component with a preset downward pressure to perform the test operation, achieving the practical benefit of improving the test quality.

本發明之目的七,係提供一種測試分類設備,包含機台、供料裝置、收料裝置、測試裝置、壓接裝置、輸送裝置及中央控制裝置,供料裝置係配置於機台,並設有至少一供料承置器,以供容納待測電子元件,收料裝置係配置於機台,並設有至少一收料承置器,以供容納已測電子元件,測試裝置係配置於機台,並設有至少一測試器,以供對電子元件執行測試作業,壓接裝置係配置於機台,並包含載送機構及本發明之壓接機構,以供下壓電子元件,輸送裝置係配置於機台,並設有至少一移料器,以供移載電子元件,中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。The seventh objective of the present invention is to provide a test sorting equipment, including a machine, a feeding device, a receiving device, a testing device, a crimping device, a conveying device, and a central control device. The feeding device is arranged on the machine and equipped with There is at least one feeding holder for accommodating the electronic components to be tested, the receiving device is arranged on the machine, and at least one receiving holder is provided for accommodating the tested electronic components, and the testing device is arranged on The machine is equipped with at least one tester for performing test operations on electronic components. The crimping device is arranged on the machine and includes a carrying mechanism and the crimping mechanism of the present invention for pressing down and transporting electronic components. The device is arranged on the machine and is equipped with at least one material shifter for transferring electronic components. The central control device is used to control and integrate the actions of each device to perform automated operations and achieve practical benefits of enhancing operational performance.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to enable your reviewer to have a better understanding of the present invention, a preferred embodiment is given with the accompanying drawings. The details are as follows:

請參閱第3、4、5圖,本發明壓接機構20之第一實施例,包含承具21、壓接件22及壓接驅動單元23,以供壓接電子元件。Please refer to FIGS. 3, 4, and 5, the first embodiment of the crimping mechanism 20 of the present invention includes a supporting tool 21, a crimping member 22, and a crimping drive unit 23 for crimping electronic components.

該承具21係裝配於一移載臂(圖未示出),並設有至少一容置部211 ,於本實施例中,承具21係設有複數個沿壓接軸向A開設之容置部211,容置部211之一端相通承具21的底面,承具21係於頂面設有概呈凹型之第一連接部212,第一連接部212可視作業需求而呈平面或其他形狀,承具21之底面則為第二連接部213,又承具21可以鎖固方式或扣接方式裝配於移載臂,於本實施例中,承具21係於側面設置扣接件214,而供扣接移載臂,並以第一連接部212連接移載臂,另承具21係設有至少一定位部215,以供套接於機台(圖未示出)之承接部(如孔或桿),定位部215可為定位桿或定位孔,定位部215可設於承具21之底面或側面,於本實施例中,承具21係於第二連接部213設置複數個為定位孔之定位部215,以供套接於機台之定位桿,若機台包含具定位桿之連接塊,承具21之定位部215亦可套接於連接塊之定位桿,均可使承具21抵置於機台而限位。The supporting tool 21 is assembled on a transfer arm (not shown in the figure), and is provided with at least one accommodating portion 211 In this embodiment, the supporting tool 21 is provided with a plurality of accommodating portions 211 opened along the crimping axis A, one end of the accommodating portion 211 is connected to the bottom surface of the supporting tool 21, and the supporting tool 21 is provided on the top surface with The first connecting portion 212 is generally concave. The first connecting portion 212 may be flat or other shapes depending on the operation requirements. The bottom surface of the support 21 is the second connecting portion 213, and the support 21 can be locked or buckled Assembled on the transfer arm. In this embodiment, the supporting tool 21 is provided with a buckle 214 on the side surface for buckling the transfer arm, and the first connecting portion 212 is connected to the transfer arm, and the supporting tool 21 is attached There is at least one positioning portion 215 for socketing on the receiving portion (such as a hole or rod) of the machine table (not shown). The positioning portion 215 can be a positioning rod or a positioning hole, and the positioning portion 215 can be provided on the support 21 In the present embodiment, the supporting tool 21 is provided with a plurality of positioning parts 215 as positioning holes on the second connecting part 213, so as to be sleeved on the positioning rod of the machine. If the machine includes a positioning rod For the connecting block, the positioning part 215 of the bearing 21 can also be sleeved on the positioning rod of the connecting block, so that the bearing 21 can be pressed against the machine to limit the position.

該壓接件22係裝配於承具21,以供壓接電子元件,於本實施例中,壓接件22包含第一桿段221、第二桿段222及壓接部223,第一桿段221係位於承具21之容置部211,並於外環面套置複數個環墊224,環墊224與容置部211間之磨擦係數可視作業需求,例如以環墊224防洩,例如壓接件22受外力頂推時,環墊224不影響壓接件22位移,並於壓接件22未承受外力時,環墊224可輔助壓接件22定位,而防止壓接件22脫離容置部211;承具21之第二桿段222連接第一桿段221,壓接部223連接第二桿段222,以供壓接電子元件,第二桿段222及壓接部223穿伸出承具21之容置部211,若承具21之容置部211的長度較長,第二桿段222位於容置部211內亦無不可;又壓接件22可視作業需求,而於第二桿段222之外環面設有至少一凸片225。The crimping element 22 is assembled on the support 21 for crimping electronic components. In this embodiment, the crimping element 22 includes a first rod section 221, a second rod section 222, and a crimping portion 223. The first rod The section 221 is located in the accommodating part 211 of the bearing 21, and a plurality of ring pads 224 are sleeved on the outer ring surface. The friction coefficient between the ring pad 224 and the accommodating part 211 can be determined according to operational requirements. For example, the ring pad 224 is used to prevent leakage. For example, when the crimping member 22 is pushed by an external force, the ring pad 224 does not affect the displacement of the crimping member 22, and when the crimping member 22 is not subjected to external force, the ring pad 224 can assist the crimping member 22 in positioning and prevent the crimping member 22 Separated from the accommodating portion 211; the second rod section 222 of the support 21 is connected to the first rod section 221, and the crimping portion 223 is connected to the second rod section 222 for crimping electronic components, the second rod section 222 and the crimping portion 223 Pass through the accommodating part 211 of the supporting tool 21. If the length of the accommodating part 211 of the supporting tool 21 is longer, it is okay for the second rod section 222 to be located in the accommodating part 211; and the crimping member 22 may depend on the operation requirements. At least one protruding piece 225 is provided on the outer ring surface of the second rod segment 222.

該壓接驅動單元23係配置於承具21,並設有驅動源,以供驅動且施予壓力於壓接件22,以於移載臂帶動承具21依第一位移行程而抵置於機台,壓接驅動單元23之驅動源驅動壓接件22獨立作動依第二位移行程而以預設下壓力精確壓抵電子元件執行測試作業;更進一步,驅動源可包含至少一供輸送流體之流道,該流道連通承具21之容置部211,以供輸入或輸出流體;或者驅動源可包含至少一供輸送流體之流道及彈性件,或者驅動源可為壓電元件,前述驅動源設計均可驅動壓接件22對電子元件施以預設之下壓力,而不受限於本實施例 ;於本實施例中,驅動源包含流道231及流體輸送管232,流道231係設於承具21之內部,其一端相通容置部211,另一端則連接流體輸送管232,以供輸入或輸出可為氣體之流體,由於流道231相通容置部211,當流體輸送管232經流道231而抽吸容置部211內的氣體時,可使流道231及容置部211呈負壓狀態,而以吸力驅動壓接件22沿壓接軸向A向上位移位於第一位置(即未壓接位置),反之,當流體輸送管232輸入氣體至流道231及容置部211時,可使容置部211形成一氣室,而以氣體壓力推動壓接件22沿壓接軸向A向下位移位於第二位置(即壓接位置),使壓接件22以預設下壓力壓接電子元件,由於壓接件22具有環墊224,而可利用環墊224防止容置部221內的氣體外洩。The crimping drive unit 23 is disposed on the supporting tool 21 and is provided with a driving source for driving and applying pressure to the crimping member 22 to drive the supporting tool 21 against the carrier 21 according to the first displacement stroke by the transfer arm In the machine, the drive source of the crimping drive unit 23 drives the crimping piece 22 independently according to the second displacement stroke to accurately press the electronic components with a preset downward pressure to perform the test operation; further, the drive source may include at least one fluid for conveying The flow channel is connected to the accommodating portion 211 of the support 21 for input or output of fluid; or the driving source may include at least one flow channel for conveying fluid and an elastic member, or the driving source may be a piezoelectric element, The aforementioned driving source design can drive the crimping element 22 to exert a predetermined lower pressure on the electronic component, and is not limited to this embodiment. In this embodiment, the driving source includes a flow channel 231 and a fluid delivery tube 232, the flow channel 231 is set inside the bearing 21, one end of which communicates with the accommodating portion 211, and the other end is connected to the fluid delivery tube 232 for The input or output of the fluid can be gas. Since the flow channel 231 communicates with the accommodating portion 211, when the fluid conveying pipe 232 passes through the flow channel 231 and sucks the gas in the accommodating portion 211, the flow channel 231 and the accommodating portion 211 can be made In a negative pressure state, the crimping member 22 is driven by suction to move upward along the crimping axis A to the first position (that is, the uncrimped position). On the contrary, when the fluid conveying pipe 232 inputs gas to the flow channel 231 and the accommodating part At 211, the accommodating portion 211 can be made to form a gas chamber, and the crimping piece 22 is pushed to move downward along the crimping axis A to the second position (ie crimping position) under the gas pressure, so that the crimping piece 22 is preset The electronic components are crimped under pressure. Since the crimping member 22 has a ring pad 224, the ring pad 224 can be used to prevent the gas in the accommodating portion 221 from leaking.

然,壓接驅動單元23亦可設置複數個流道231,以相通承具21之容置部211,而推動壓接件22於容置部211內沿壓接軸向A作向上位移或向下位移,例如一流道利用流體推動壓接件22於容置部211內作向上位移,另一流道利用流體推動壓接件22於容置部211內作向下位移,亦無不可。Of course, the crimping drive unit 23 can also be provided with a plurality of flow passages 231 to communicate with the accommodating portion 211 of the supporting tool 21, and to push the crimping element 22 to move upwardly or in a direction along the crimping axis A in the accommodating portion 211 Downward displacement, for example, a flow channel uses fluid to push the crimping member 22 to move upward in the accommodating portion 211, and another flow channel uses fluid to push the crimping member 22 to move downward in the accommodating portion 211.

壓接機構20更包含調壓單元24,調壓單元24係連接該壓接驅動單元23,以調整壓接驅動單元23施予壓接件22之壓力值,而控制壓接件22之下壓力 ,使壓接件22精確下壓電子元件;於本實施例中,調壓單元24係設有壓力控制器241連接該壓接驅動單元23之流體輸送管232,以供微調輸入/輸出流體的流量,而控制流道231的壓力值,更進一步,可使流道231內的壓力值於作業中保持一定壓力值,亦即當流道231內之實際壓力值低於預設壓力值,調壓單元24之壓力控制器241控制流體輸送管232補充輸入氣體,使流道231內之實際壓力值保持於預設壓力值,反之,當流道231內之實際壓力值高於預設壓力值,壓力控制器241則控制流體輸送管232輸出氣體洩壓,使流道231內之實際壓力值保持於預設壓力值,進而確保壓接件22以預設下壓力壓抵電子元件。The crimping mechanism 20 further includes a pressure regulating unit 24. The pressure regulating unit 24 is connected to the crimping drive unit 23 to adjust the pressure applied by the crimping drive unit 23 to the crimping element 22, and to control the pressure under the crimping element 22 , So that the crimping piece 22 accurately presses down the electronic components; in this embodiment, the pressure regulating unit 24 is provided with a pressure controller 241 connected to the fluid delivery pipe 232 of the crimping drive unit 23 for fine adjustment of the input/output fluid Flow, and control the pressure value of the flow passage 231, further, the pressure value in the flow passage 231 can be maintained at a certain pressure value during operation, that is, when the actual pressure value in the flow passage 231 is lower than the preset pressure value, adjust The pressure controller 241 of the pressure unit 24 controls the fluid delivery pipe 232 to supplement the input gas so that the actual pressure value in the flow channel 231 is maintained at the preset pressure value. Conversely, when the actual pressure value in the flow channel 231 is higher than the preset pressure value , The pressure controller 241 controls the fluid delivery pipe 232 to output gas to relieve pressure, so that the actual pressure value in the flow channel 231 is maintained at a preset pressure value, thereby ensuring that the crimping element 22 is pressed against the electronic component with the preset pressure.

該承具21更包含防脫單元25,防脫單元25係設有至少一防脫件 251,以防止壓接件22任意脫離承具21,更進一步,防脫件可為彈簧或擋止件,例如防脫件可為彈簧,其一端固接於承具21,另一端牽掣壓接件22,而防止壓接件22脫離承具21,例如防脫件為擋止件,擋止件可為L型架或外罩,可擋止壓接件22脫離承具21;再者,承具21之定位部215亦可開設於防脫件,以供套接於機台之定位桿,而同樣地可使承具21抵置於機台而限位;於本實施例中,防脫單元25之防脫件251係為擋止件,並裝配於承具21之第二連接部213,防脫件251係於相對第二連接部213之一面設有凹槽2511,凹槽2511之深度尺寸大於壓接件22之凸片225的厚度尺寸,除可供凸片225跨置於凹槽2511上,並使凸片225與承具21之第二連接部213間具有一緩衝空間,以供凸片225可朝向第二連接部213作浮動位移,而避免壓損電子元件,進而提高電子元件良率;又防脫件251於凹槽2511之底面開設通孔2512,以供穿伸出壓接件22之第二桿段222及壓接部223,更進一步,通孔2512之形狀可卡掣壓接件22之第二桿段222,而防止壓接件22任意自轉,於本實施例中,壓接件22之第二桿段222係概呈四邊形柱,防脫件251之通孔2512則相對開設呈四邊形孔,以卡掣壓接件22之第二桿段222,而防止壓接件22任意自轉,進而提高壓接件22移載電子元件之精確度。The bearing 21 further includes an anti-drop unit 25, and the anti-drop unit 25 is provided with at least one anti-drop element 251, to prevent the crimping member 22 from escaping from the support 21 at will. Furthermore, the anti-dropping member can be a spring or a stopper. For example, the anti-dropping member can be a spring. The connecting piece 22 prevents the crimping piece 22 from escaping from the supporting tool 21. For example, the anti-dropping piece is a stopper, and the stopping piece can be an L-shaped frame or an outer cover, which can prevent the crimping piece 22 from escaping from the supporting tool 21; The positioning portion 215 of the supporting tool 21 can also be provided on the anti-dropping member for sleeved on the positioning rod of the machine table, and similarly, the supporting tool 21 can be placed against the machine table to limit the position; in this embodiment, the anti-dropping The anti-dropping member 251 of the release unit 25 is a stopper and is assembled to the second connecting portion 213 of the bearing 21. The anti-dropping member 251 is provided with a groove 2511 on a surface opposite to the second connecting portion 213. The groove 2511 The depth dimension is greater than the thickness dimension of the protruding piece 225 of the crimping element 22, except that the protruding piece 225 can span the groove 2511, and there is a buffer space between the protruding piece 225 and the second connecting portion 213 of the support 21 , So that the protruding piece 225 can move towards the second connecting portion 213 for floating displacement, so as to avoid pressure damage to the electronic component, thereby improving the yield of the electronic component; and the anti-dropping member 251 is provided with a through hole 2512 on the bottom surface of the groove 2511 for penetration Extend the second rod section 222 and the crimping portion 223 of the crimping member 22, and further, the shape of the through hole 2512 can lock the second rod section 222 of the crimping member 22, and prevent the crimping member 22 from rotating freely. In this embodiment, the second rod section 222 of the crimping member 22 is generally a quadrilateral column, and the through hole 2512 of the anti-dropping member 251 is relatively opened in a quadrilateral hole to lock the second rod section 222 of the crimping member 22. This prevents the crimping piece 22 from rotating freely, thereby improving the accuracy of the crimping piece 22 for transferring electronic components.

再者,欲單獨更換壓接件22時,僅需將防脫件251卸下,即可取出壓接件22,進而提升更換作業之便利性。Furthermore, when the crimping piece 22 is to be replaced separately, only the anti-dropping piece 251 needs to be removed, and the crimping piece 22 can be taken out, thereby improving the convenience of the replacement operation.

然,壓接機構20之壓接件22可視作業需求而作壓接電子元件或壓接及移載電子元件,當壓接件22應用於執行壓接及移載電子元件之作業,壓接機構20更包含拾取單元26,拾取單元26係於壓接件22設有第一抽氣道261,以供壓接件22吸放電子元件,於本實施例中,拾取單元26係於壓接件22之內部設有第一抽氣道261,第一抽氣道261之一端相通於容置部211且位於二環墊224間的區域空間,另一端則相通壓接部223,以於壓接部223之端面形成一吸嘴262,拾取單元26並於承具21之內部設有第二抽氣道263,第二抽氣道263之一端係相通容置部211且位於二環墊224間的區域空間,而相通至第一抽氣道261,另一端可直接連通抽氣設備(圖未示出),亦或經由承具21之第一連接部212而連通抽氣設備,於本實施例中,拾取單元26係於承具21之第一連接部212設有腔室264,腔室264係相通第二抽氣道263,以及腔室264開設有第三抽氣道265,第三抽氣道265連接抽氣設備,使得第二抽氣道263通連抽氣設備,另於腔室264頂面之外周圍設有防洩環圈266,以於承具21之第一連接部212裝配於移載臂時,可防止腔室264內的氣體外洩;因此,抽氣設備可經由第三抽氣道265、腔室264、第二抽氣道263及第一抽氣道261而使吸嘴262吸取或釋放電子元件。However, the crimping element 22 of the crimping mechanism 20 can be used for crimping electronic components or crimping and transferring electronic components according to the operation requirements. When the crimping element 22 is used to perform the operations of crimping and transferring electronic components, the crimping mechanism 20 further includes a pick-up unit 26. The pick-up unit 26 is attached to the crimping piece 22 and is provided with a first air suction channel 261 for the crimping piece 22 to suck and release electronic components. In this embodiment, the picking unit 26 is attached to the crimping piece 22 There is a first air extraction channel 261 inside. One end of the first air extraction channel 261 communicates with the accommodating portion 211 and is located in the area space between the two ring pads 224, and the other end communicates with the crimping portion 223 so as to be connected to the crimping portion 223 A suction nozzle 262 is formed on the end surface. The pick-up unit 26 is provided with a second air suction channel 263 inside the supporting tool 21. It is connected to the first air extraction passage 261, and the other end can be directly connected to the air extraction device (not shown in the figure), or it can be connected to the air extraction device through the first connection portion 212 of the support 21. In this embodiment, the pickup unit 26 The first connecting portion 212 attached to the support 21 is provided with a chamber 264, the chamber 264 communicates with the second air extraction channel 263, and the chamber 264 is provided with a third air extraction channel 265, which is connected to air extraction equipment, The second air extraction channel 263 is connected with air extraction equipment, and an anti-leakage ring 266 is provided around the top surface of the chamber 264 to prevent the first connection part 212 of the support 21 from being assembled on the transfer arm The gas in the chamber 264 leaks out; therefore, the suction device can make the suction nozzle 262 suck or release electronic components through the third suction passage 265, the chamber 264, the second suction passage 263, and the first suction passage 261.

請參閱第6圖,本發明之壓接機構20可應用於壓接裝置30,壓接裝置30包含載送機構及本發明之壓接機構20,載送機構包含載送動力源31以及由載送動力源31驅動位移之移載臂32,載送動力源31可視作業需求而驅動移載臂32作Z方向或Z-Y方向或X-Y-Z方向位移,於本實施例中,壓接裝置30係裝配於機台40,載送動力源31係驅動移載臂32作Z-Y方向位移;壓接機構20之承具21係以第一連接部212連接移載臂32,並以扣接件214扣接移載臂32定位,使得壓接機構20可由移載臂32帶動作Z-Y方向位移,以供壓接及移載電子元件;機台40係設有定位桿41,以供嵌合承具21之定位部215;另於機台40配置有測試裝置50,測試裝置50係設有至少一測試器,以供測試電子元件,於本實施例中,測試器包含電性連接之電路板51及具探針之測試座52,測試座52係供承置及測試電子元件。Referring to Figure 6, the crimping mechanism 20 of the present invention can be applied to a crimping device 30. The crimping device 30 includes a carrier mechanism and the crimping mechanism 20 of the present invention. The carrier mechanism includes a carrier power source 31 and a carrier The transfer arm 32 is driven by the power source 31 for displacement, and the transfer arm 32 can be driven by the transfer arm 32 to move in the Z direction or ZY direction or XYZ direction according to the operation requirements. In this embodiment, the crimping device 30 is assembled in The machine 40, the carrying power source 31 drives the transfer arm 32 to move in the ZY direction; the bearing 21 of the crimping mechanism 20 is connected to the transfer arm 32 by the first connecting portion 212, and is buckled and moved by the buckle 214 The carrier arm 32 is positioned so that the crimping mechanism 20 can be moved in the ZY direction by the transfer arm 32 for crimping and transferring electronic components; the machine 40 is equipped with a positioning rod 41 for the positioning of the mating support 21 Section 215; in addition to the machine 40 is equipped with a test device 50, the test device 50 is provided with at least one tester for testing electronic components, in this embodiment, the tester includes an electrically connected circuit board 51 and a probe The test socket 52 of the needle, the test socket 52 is for holding and testing electronic components.

請參閱第4、7、8圖,由於拾取單元26之第三抽氣道265連接抽氣設備,第三抽氣道265可經由腔室264、第二抽氣道263及第一抽氣道261,而使吸嘴262吸取待測試之電子元件61,載送動力源31經移載臂32帶動壓接機構20及電子元件61作Y方向位移至測試裝置50之上方,並令承具21之定位部215對位於機台40之定位桿41,移載臂32再帶動壓接機構20及電子元件61依第一位移行程作Z方向向下位移,令承具21之定位部215套接於機台40之定位桿41,使承具21抵置於機台40上而限位,因此,承具21並不會壓接於待測之電子元件61;當承具21抵置於機台40時,壓接件22已將電子元件61移入測試裝置50之測試座52,由於壓接驅動單元23之流體輸送管232經流道231而抽吸容置部211內的氣體,使流道231及容置部211呈負壓狀態,而以吸力驅動壓接件22沿壓接軸向A向上位移,使得壓接件22保持位於第一位置,尚未下壓電子元件61,此時,電子元件61之接點(如錫球)僅貼接測試座52之探針。Please refer to Figures 4, 7, and 8, since the third air extraction channel 265 of the pick-up unit 26 is connected to an air extraction device, the third air extraction channel 265 can pass through the chamber 264, the second air extraction channel 263, and the first air extraction channel 261. The suction nozzle 262 sucks the electronic component 61 to be tested, and the carrying power source 31 drives the crimping mechanism 20 and the electronic component 61 through the transfer arm 32 to move to the top of the testing device 50 in the Y direction, and makes the positioning part 215 of the support 21 For the positioning rod 41 located on the machine table 40, the transfer arm 32 then drives the crimping mechanism 20 and the electronic component 61 to move downward in the Z direction according to the first displacement stroke, so that the positioning part 215 of the supporting tool 21 is sleeved on the machine table 40 The positioning rod 41 makes the supporting tool 21 abut against the machine table 40 to limit the position. Therefore, the supporting tool 21 is not crimped to the electronic component 61 to be tested; when the supporting tool 21 is placed against the machine table 40, The crimping piece 22 has moved the electronic component 61 into the test seat 52 of the testing device 50. Since the fluid conveying pipe 232 of the crimping drive unit 23 passes through the flow channel 231, the gas in the containing portion 211 is sucked to make the flow channel 231 and the containment part 211 The placement portion 211 is in a negative pressure state, and the crimping piece 22 is driven to move upward along the crimping axis A by suction, so that the crimping piece 22 remains in the first position, and the electronic component 61 has not been pressed down yet. The contact (such as a solder ball) is only attached to the probe of the test socket 52.

請參閱第9、10圖,壓接驅動單元23係以流體輸送管232輸送氣體至流道231,流道231之氣體流入於壓接件22上方之容置部211的氣室,而以氣體壓力逐漸推動壓接件22獨立作動沿壓接軸向A且依第二位移行程作Z方向向下位移而位於第二位置(即壓接位置),壓接件22之第二桿段222係沿防脫件251之通孔2512位移,而壓接件22之凸片225則於防脫件251之凹槽2511內位移,使得壓接件22以預設下壓力作漸進式下壓電子元件61,使電子元件61之接點確實接觸測試座52之探針而執行測試作業;因此,壓接件22並非由移載臂32驅動位移下壓電子元件61,而可避免壓接件22產生瞬間較大之下壓力而壓損電子元件61,壓接件22並可承受電子元件61之反作用力而壓縮氣體作Z方向向上位移而緩衝,進而提高電子元件61之測試良率。Please refer to Figures 9 and 10, the crimping drive unit 23 uses a fluid delivery tube 232 to transport gas to the flow channel 231. The pressure gradually pushes the crimping element 22 to move independently along the crimping axis A and downwardly in the Z direction according to the second displacement stroke to be located at the second position (ie, crimping position). The second rod section 222 of the crimping element 22 is Displaces along the through hole 2512 of the anti-dropping element 251, and the protrusion 225 of the crimping element 22 is displaced in the groove 2511 of the anti-dropping element 251, so that the crimping element 22 is used to progressively press down the electronic component with a preset downward force. 61. Make the contact of the electronic component 61 really contact the probe of the test socket 52 to perform the test operation; therefore, the crimping piece 22 is not driven by the transfer arm 32 to move and press the electronic component 61, but the crimping piece 22 can be avoided The electronic component 61 is damaged by the instantaneous high pressure. The crimping piece 22 can bear the reaction force of the electronic component 61 and the compressed gas moves upward in the Z direction to buffer, thereby improving the test yield of the electronic component 61.

依據上述壓接機構20,若測試座52內殘留有上一電子元件,當壓接件22下壓電子元件61時,可承受二電子元件之反作用力,並壓縮氣體作Z方向向上位移而緩衝,以避免壓損電子元件61及殘留之電子元件,調壓單元24之壓力控制器241則感測到流道231內之壓力值改變,即控制流體輸送管232輸出適當氣體而洩壓,達到節省電子元件成本之實用效益。According to the above-mentioned crimping mechanism 20, if there is an electronic component remaining in the test base 52, when the crimping piece 22 presses the electronic component 61, it can bear the reaction force of the two electronic components, and the compressed gas will move upward in the Z direction to buffer In order to avoid the pressure loss of the electronic components 61 and the remaining electronic components, the pressure controller 241 of the pressure regulating unit 24 senses the change of the pressure value in the flow channel 231, that is, controls the fluid delivery pipe 232 to output appropriate gas to release the pressure to achieve Practical benefits of saving the cost of electronic components.

請參閱第11圖,欲更換壓接件22時,由於防脫件251係裝配於承具21之第二連接部213,並以通孔2512供穿伸出壓接件22之第二桿段222及壓接部223,於更換時,僅需拆卸防脫件251,即可迅速由承具21之下方取出壓接件22,並不會牽動到流體輸送管232或其他管路,而可簡易且便利地取下壓接件22,新的壓接件相同地可由承具21下方裝入於容置部211,達到提高更換作業便利性之實用效益。Please refer to Figure 11, when the crimping element 22 is to be replaced, the anti-dropping element 251 is assembled on the second connecting portion 213 of the bearing 21, and the second rod section of the crimping element 22 is penetrated by a through hole 2512. 222 and crimping part 223, when replacing, only need to disassemble the anti-falling part 251, and then the crimping part 22 can be quickly taken out from under the bearing 21 without affecting the fluid conveying pipe 232 or other pipelines. The crimping element 22 can be removed simply and conveniently, and the new crimping element can be installed in the accommodating portion 211 under the support 21 in the same way, so as to achieve the practical benefit of improving the convenience of replacement operation.

請參閱第12、13、14圖,本發明壓接機構20之第二實施例與第一實施例之差異在於承具21包含第一座體216及第二座體217,第一座體216係連接移載臂(圖未示出),第二座體217連接第一座體216,壓接驅動單元23及拾取單元26之其他局部(如腔室264及第三抽氣道265)則配置於第一座體216,承具21之容置部211、壓接件22、防脫單元25及拾取單元26的局部(如第二抽氣道263)係配置於第二座體217;當更換壓接件22之數量時,僅需拆卸第二座體217,即可迅速同時卸下壓接件22及防脫單元25,進而有效縮減裝拆作業時間,達到提高生產效能之實用效益。Please refer to Figures 12, 13, and 14, the difference between the second embodiment of the crimping mechanism 20 of the present invention and the first embodiment is that the support 21 includes a first seat body 216 and a second seat body 217, and the first seat body 216 It is connected to the transfer arm (not shown in the figure), the second base body 217 is connected to the first base body 216, and the other parts of the crimping drive unit 23 and the pick-up unit 26 (such as the chamber 264 and the third air extraction channel 265) are configured In the first seat body 216, the accommodating portion 211 of the support 21, the crimping member 22, the anti-drop unit 25, and the part of the pickup unit 26 (such as the second air suction channel 263) are arranged on the second seat body 217; For the number of crimping parts 22, only the second base body 217 needs to be disassembled, and the crimping parts 22 and the anti-falling unit 25 can be quickly removed at the same time, thereby effectively reducing the assembly and disassembly operation time and achieving the practical benefit of improving production efficiency.

請參閱第3~5、15圖,係本發明壓接機構20應用於電子元件測試分類設備之示意圖,測試分類設備係於機台40上配置有供料裝置70、收料裝置80、測試裝置50、壓接裝置30、本發明壓接機構20、輸送裝置90及中央控制裝置(圖未示出);供料裝置70係裝配於機台40,並設有至少一供料承置器71,以容納至少一待測之電子元件;收料裝置80係裝配於機台40,並設有至少一收料承置器81,以容納至少一已測之電子元件;測試裝置50係裝配於機台40,並設有至少一測試器,以對電子元件執行測試作業,於本實施例中,測試器係設有電性連接之電路板51及測試座52,以對電子元件執行測試作業;壓接裝置30係裝配於機台40,並包含載送機構及本發明之壓接機構20,載送機構係設有載送動力源以及由載送動力源驅動位移之移載臂32,壓接機構20係裝配於移載臂32,以供下壓及移載電子元件;輸送裝置90係裝配於機台40,並設有至少一移料器,以移載電子元件,於本實施例中,輸送裝置90係設有第一移料器91,以於供料裝置70之供料承置器71取出待測之電子元件,並移載至入料載台92,入料載台92將待測之電子元件載送至測試裝置50之側方,壓接裝置30係以移載臂32帶動壓接機構20作Y-Z方向位移,使壓接機構20於入料載台92取出待測之電子元件,並移載至測試裝置50,移載臂32帶動壓接機構20之承具21抵置於機台40上,壓接機構20係以壓接件22將電子元件移入測試座52,並利用壓接驅動單元23驅動壓接件22位移而以預設下壓力精確壓抵電子元件執行測試作業,移載臂32再帶動壓接機構20將測試座52之已測電子元件移載至出料載台93,出料載台93載出已測之電子元件,輸送裝置90係設有第二移料器94於出料載台93取出已測之電子元件,並依據測試結果,將已測之電子元件輸送至收料裝置80之收料承置器81處而分類收置;該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。Please refer to Figures 3 to 5 and 15, which is a schematic diagram of the crimping mechanism 20 of the present invention applied to electronic component testing and classification equipment. The testing and classification equipment is equipped with a feeding device 70, a receiving device 80, and a testing device on the machine 40 50. The crimping device 30, the crimping mechanism 20 of the present invention, the conveying device 90 and the central control device (not shown in the figure); the feeding device 70 is assembled on the machine 40 and is provided with at least one feeding holder 71 , To accommodate at least one electronic component to be tested; the receiving device 80 is assembled on the machine 40, and is provided with at least one receiving holder 81 to accommodate at least one electronic component that has been tested; the testing device 50 is assembled in The machine 40 is provided with at least one tester to perform test operations on the electronic components. In this embodiment, the tester is provided with an electrically connected circuit board 51 and a test socket 52 to perform test operations on the electronic components The crimping device 30 is assembled on the machine table 40 and includes a carrying mechanism and the crimping mechanism 20 of the present invention. The carrying mechanism is provided with a carrying power source and a displacement arm 32 driven by the carrying power source. The crimping mechanism 20 is mounted on the transfer arm 32 for pressing down and transferring electronic components; the conveying device 90 is mounted on the machine table 40, and is provided with at least one material shifter to transfer electronic components. In this embodiment In the example, the conveying device 90 is provided with a first shifter 91 to take out the electronic components to be tested from the feeding holder 71 of the feeding device 70 and transfer them to the feeding stage 92, the feeding stage 92 The electronic components to be tested are carried to the side of the testing device 50. The crimping device 30 drives the crimping mechanism 20 to move in the YZ direction with the transfer arm 32, so that the crimping mechanism 20 is taken out from the loading stage 92 to be ready The electronic components to be tested are transferred to the testing device 50. The transfer arm 32 drives the support 21 of the crimping mechanism 20 to be placed on the machine table 40. The crimping mechanism 20 uses the crimping piece 22 to move the electronic components into the test base. 52, and use the crimping drive unit 23 to drive the crimping piece 22 to move to accurately press the electronic components with a preset downward pressure to perform the test operation. The transfer arm 32 then drives the crimping mechanism 20 to move the tested electronic components of the test base 52 Loaded to the discharging stage 93, the discharging stage 93 carries the tested electronic components, and the conveying device 90 is equipped with a second shifter 94 to take out the tested electronic components from the discharging stage 93, and according to the test results , The tested electronic components are transported to the receiving holder 81 of the receiving device 80 for sorting and storing; the central control device is used to control and integrate the actions of each device to perform automated operations and achieve improved operating performance Practical benefits.

[習知] 11:機台 12:測試裝置 121:電路板 122:測試座 13:壓接裝置 131:馬達 132:皮帶輪組 133:導螺桿 134:移載臂 135:壓接器 1351:壓接治具 14:電子元件 [本發明] 20:壓接機構 21:承具 211:容置部 212:第一連接部 213:第二連接部 214:扣接件 215:定位部 216:第一座體 217:第二座體 22:壓接件 221:第一桿段 222:第二桿段 223:壓接部 224:環墊 225:凸片 23:壓接驅動單元 231:流道 232:流體輸送管 A:壓接軸向 24:調壓單元 241:壓力控制器 25:防脫單元 251:防脫件 2511:凹槽 2512:通孔 26:拾取單元 261:第一抽氣道 262:吸嘴 263:第二抽氣道 264:腔室 265:第三抽氣道 266:防洩環圈 30:壓接裝置 31:載送動力源 32:移載臂 40:機台 41:定位桿 50:測試裝置 51:電路板 52:測試座 61:電子元件 70:供料裝置 71:供料承置器 80:收料裝置 81:收料承置器 90:輸送裝置 91:第一移料器 92:入料載台 93:出料載台 94:第二移料器[Learning] 11: Machine 12: Test device 121: circuit board 122: Test Block 13: crimping device 131: Motor 132: Pulley 133: Lead screw 134: Transfer Arm 135: Crimper 1351: Crimp Fixture 14: Electronic components [this invention] 20: crimping mechanism 21: Bearing 211: Containment Department 212: first connection part 213: The second connecting part 214: Fastener 215: Positioning Department 216: First Block 217: Second Block 22: crimping parts 221: first stroke 222: second par 223: crimping part 224: Ring Pad 225: Tab 23: Crimp drive unit 231: Runner 232: fluid delivery pipe A: Crimp axial 24: Pressure regulating unit 241: Pressure Controller 25: Anti-drop unit 251: Anti-dropping parts 2511: Groove 2512: Through hole 26: Pickup unit 261: First Exhaust Channel 262: Nozzle 263: The Second Exhaust Channel 264: Chamber 265: The Third Exhaust Channel 266: Anti-leakage ring 30: crimping device 31: Carrying power source 32: transfer arm 40: Machine 41: positioning rod 50: Test device 51: circuit board 52: Test Block 61: Electronic components 70: Feeding device 71: Feeder 80: Receiving device 81: Receiving holder 90: Conveying device 91: The first shifter 92: Feeding stage 93: discharge stage 94: Second shifter

第1圖:習知測試裝置及壓接機構之使用示意圖(一)。 第2圖:習知測試裝置及壓接機構之使用示意圖(二)。 第3圖:本發明壓接機構第一實施例之組裝剖視圖(一)。 第4圖:本發明壓接機構第一實施例之組裝剖視圖(二)。 第5圖:本發明壓接機構第一實施例之局部剖視圖。 第6圖:本發明壓接機構第一實施例裝配於移載臂之示意圖。 第7圖:本發明壓接機構第一實施例之使用示意圖(一)。 第8圖:係第7圖之局部放大示意圖。 第9圖:本發明壓接機構第一實施例之使用示意圖(二)。 第10圖:係第9圖之局部放大示意圖。 第11圖:本發明壓接機構更換壓接件之使用示意圖。 第12圖:本發明壓接機構第二實施例之分解剖視圖(一)。 第13圖:本發明壓接機構第二實施例之分解剖視圖(二)。 第14圖:本發明壓接機構第二實施例之組裝剖視圖。 第15圖:本發明壓接機構應用於測試分類設備之示意圖。Figure 1: Schematic diagram of the use of the conventional testing device and crimping mechanism (1). Figure 2: Schematic diagram of the use of the conventional testing device and crimping mechanism (2). Figure 3: An assembled cross-sectional view of the first embodiment of the crimping mechanism of the present invention (1). Figure 4: An assembled cross-sectional view of the first embodiment of the crimping mechanism of the present invention (2). Figure 5: A partial cross-sectional view of the first embodiment of the crimping mechanism of the present invention. Figure 6: A schematic diagram of the first embodiment of the crimping mechanism of the present invention assembled on the transfer arm. Figure 7: A schematic diagram of the use of the first embodiment of the crimping mechanism of the present invention (1). Figure 8: is a partial enlarged schematic diagram of Figure 7. Figure 9: A schematic diagram of the use of the first embodiment of the crimping mechanism of the present invention (2). Figure 10: is a partial enlarged schematic diagram of Figure 9. Figure 11: A schematic diagram of the use of the crimping mechanism of the present invention for replacing crimping parts. Figure 12: Anatomical view of the second embodiment of the crimping mechanism of the present invention (1). Figure 13: Anatomical view of the second embodiment of the crimping mechanism of the present invention (2). Figure 14: An assembled cross-sectional view of the second embodiment of the crimping mechanism of the present invention. Figure 15: A schematic diagram of the application of the crimping mechanism of the present invention to test classification equipment.

22:壓接件22: crimping parts

231:流道231: Runner

232:流體輸送管232: fluid delivery pipe

24:調壓單元24: Pressure regulating unit

241:壓力控制器241: Pressure Controller

32:移載臂32: transfer arm

52:測試座52: Test Block

61:電子元件61: Electronic components

Claims (18)

一種電子元件壓接機構,其裝配於移載臂而作至少一方向位移,該壓接機構包含: 承具:係裝配於該移載臂; 壓接件:係裝配於該承具,以供壓接電子元件; 壓接驅動單元:係裝配於該承具,並設有至少一驅動源,以於該移載臂帶動該 承具抵置於機台,該壓接驅動單元之該驅動源驅動該壓接件以 預設下壓力壓抵電子元件。A crimping mechanism for electronic components, which is assembled on a transfer arm for displacement in at least one direction. The crimping mechanism includes: Bearing: to be assembled on the transfer arm; Crimping part: It is assembled on the supporting tool for crimping electronic components; Crimping drive unit: It is assembled on the supporting tool and is provided with at least one drive source to drive the transfer arm The supporting tool is placed against the machine table, and the driving source of the crimping drive unit drives the crimping piece to The preset pressure is pressed against the electronic components. 依申請專利範圍請求項1所述之電子元件壓接機構,其中,該承具係設有至少一容置部,該壓接件係裝配於該容置部。According to the electronic component crimping mechanism described in claim 1, wherein the supporting tool is provided with at least one accommodating part, and the crimping element is assembled in the accommodating part. 依申請專利範圍請求項1所述之電子元件壓接機構,其中,該承具包含第一座體及第二座體,該第一座體係連接該移載臂,並供裝配該壓接驅動單元,該第二座體係設有至少一容置部,以供裝配該壓接件。According to the electronic component crimping mechanism described in claim 1, wherein the supporting tool includes a first base and a second base, and the first base system is connected to the transfer arm and is provided for assembling the crimping drive Unit, the second seat system is provided with at least one accommodating part for assembling the crimping part. 依申請專利範圍請求項2或請求項3所述之電子元件壓接機構, 其中,該壓接驅動單元之該驅動源包含至少一供輸送流體之流道,該流道係連通該承具之該容置部,以供輸送該流體。According to the electronic component crimping mechanism described in claim 2 or claim 3 of the scope of patent application, Wherein, the driving source of the crimping driving unit includes at least one fluid passage for conveying fluid, and the fluid passage is connected to the accommodating portion of the supporting tool for conveying the fluid. 依申請專利範圍請求項4所述之電子元件壓接機構,更包含調壓單元,該調壓單元係連接該壓接驅動單元,以供調整該壓接驅動單元施予該壓接件之壓力值。The electronic component crimping mechanism described in claim 4 of the scope of patent application further includes a pressure regulating unit connected to the crimping drive unit for adjusting the pressure applied to the crimping piece by the crimping drive unit value. 依申請專利範圍請求項5所述之電子元件壓接機構,其中,該調壓單元係設有至少一壓力控制器。According to the electronic component crimping mechanism described in claim 5 of the scope of patent application, the pressure regulating unit is provided with at least one pressure controller. 依申請專利範圍請求項1至3中任一項所述之電子元件壓接機構,其中,該壓接驅動單元之該驅動源係為壓電元件。According to the electronic component crimping mechanism according to any one of claims 1 to 3 in the scope of patent application, the driving source of the crimping driving unit is a piezoelectric element. 依申請專利範圍請求項1至3中任一項所述之電子元件壓接機構,更包含拾取單元,該拾取單元係於該壓接件設有第一抽氣道,以供該壓接件吸放電子元件。The electronic component crimping mechanism described in any one of claims 1 to 3 in the scope of the patent application further includes a pick-up unit, and the pick-up unit is provided with a first air suction channel on the crimping piece for sucking the crimping piece Put electronic components. 依申請專利範圍請求項8所述之電子元件壓接機構,其中,該拾取單元包含該第一抽氣道及第二抽氣道,該第一抽氣道係位於該壓接件,該第二抽氣道係位於該承具,並連通該第一抽氣道。According to the electronic component crimping mechanism described in claim 8, wherein the pick-up unit includes the first air extraction channel and the second air extraction channel, the first air extraction channel is located at the crimping part, and the second air extraction channel It is located on the supporting tool and communicates with the first air suction channel. 依申請專利範圍請求項9所述之電子元件壓接機構,其中,該拾取單元係於該承具頂面之第一連接部設有腔室,該腔室連通該第二抽氣道及至少一第三抽氣道。According to the electronic component crimping mechanism according to claim 9, wherein the pick-up unit is provided with a cavity on the first connecting portion of the top surface of the supporting device, and the cavity is connected to the second air extraction passage and at least one The third airway. 依申請專利範圍請求項1至3中任一項所述之電子元件壓接機構,該承具更包含防脫單元,該防脫單元係設有至少一防脫件,以防止該壓接件任意脫離該承具。According to the electronic component crimping mechanism described in any one of claims 1 to 3 in the scope of the patent application, the supporting tool further includes an anti-drop unit, and the anti-drop unit is provided with at least one anti-drop member to prevent the crimping piece Get out of the bearing arbitrarily. 依申請專利範圍請求項11所述之電子元件壓接機構,其中,該壓接件係設有至少一凸片,該防脫單元之該防脫件係為擋止件,並裝配於該承具,以擋止該壓接件之該凸片。According to the electronic component crimping mechanism described in claim 11, wherein the crimping piece is provided with at least one protruding piece, and the anti-dropping piece of the anti-dropping unit is a stop piece and is assembled on the bearing Tool to stop the protruding piece of the crimping piece. 依申請專利範圍請求項12所述之電子元件壓接機構,其中,該防脫單元之該防脫件係於相對該承具之一面設有凹槽,該凹槽開設通孔,以供穿伸該壓接件,該凹槽供擋止該壓接件之該凸片。According to the electronic component crimping mechanism described in claim 12 of the scope of patent application, wherein the anti-dropping member of the anti-dropping unit is provided with a groove on a surface opposite to the supporting tool, and the groove is provided with a through hole for passing through The crimping piece is stretched out, and the groove is used to stop the protruding piece of the crimping piece. 依申請專利範圍請求項13所述之電子元件壓接機構,其中,該防脫件之該凹槽的深度尺寸大於該壓接件之該凸片的厚度尺寸。According to the electronic component crimping mechanism described in claim 13, wherein the depth dimension of the groove of the anti-dropping member is greater than the thickness dimension of the protruding piece of the crimping member. 依申請專利範圍請求項13所述之電子元件壓接機構,其中,該壓接件與該防脫件之該通孔係作多邊形相互配合。According to the electronic component crimping mechanism described in claim 13 of the scope of patent application, the through hole of the crimping piece and the anti-dropping piece is matched with each other in a polygonal shape. 依申請專利範圍請求項11所述之電子元件壓接機構,其中,該壓接件係設有至少一凸片,該防脫單元之該防脫件係為彈簧,以連接該承具及該壓接件之該凸片。According to the electronic component crimping mechanism described in claim 11, the crimping piece is provided with at least one protruding piece, and the anti-dropping piece of the anti-dropping unit is a spring to connect the support and the The lug of the crimping piece. 一種壓接裝置,包含: 載送機構:係設有載送動力源以及由該載送動力源驅動位移之移載臂; 至少一依申請專利範圍請求項1至16中任一項所述之電子元件壓接機構:包含承具、壓接驅動單元及壓接件,並以該承具裝配於該移載臂,以於該移載臂帶動該承具抵置於機台,該壓接驅動單元之該驅動源驅動該壓接件以預設下壓力壓抵電子元件。A crimping device, including: Carrying mechanism: equipped with a carrying power source and a transfer arm driven by the carrying power source to move; At least one electronic component crimping mechanism according to any one of claims 1 to 16 in the scope of the patent application: including a supporting tool, a crimping drive unit, and a crimping piece, and the supporting tool is assembled on the transfer arm to The transfer arm drives the supporting tool to abut against the machine table, and the driving source of the crimping drive unit drives the crimping piece to press against the electronic component with a preset downward force. 一種測試分類設備,包含: 機台; 供料裝置:係配置於該機台,並設有至少一供料承置器,以供容納待測 電子元件; 收料裝置:係配置於該機台,並設有至少一收料承置器,以供容納已測 電子元件; 測試裝置:係配置於該機台,並設有至少一測試器,以供對電子元件執 行測試作業; 壓接裝置:係配置於該機台,並包含載送機構,以及至少一依申請專利範圍 請求項1至16中任一項所述之電子元件壓接機構; 輸送裝置:係配置於該機台,並設有至少一移料器,以供移載電子元件;中央控制裝置:係用以控制及整合各裝置作動,以執行自動化作業。A test classification device, including: Machine; Feeding device: It is configured on the machine and is provided with at least one feeding holder for accommodating the to-be-tested Electronic component; Receiving device: It is configured on the machine and is equipped with at least one receiving holder to accommodate the tested Electronic component; Test device: It is configured on the machine and is equipped with at least one tester for performing electronic components Run test assignments; Crimping device: It is configured on the machine and includes a carrying mechanism, and at least one according to the scope of patent application The electronic component crimping mechanism according to any one of claims 1 to 16; Conveying device: It is configured on the machine and is equipped with at least one material shifter for transferring electronic components; Central control device: It is used to control and integrate the actions of various devices to perform automated operations.
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CN117706340A (en) * 2024-02-18 2024-03-15 深圳市森美协尔科技有限公司 Fork arm assembly and wafer probe station

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CN105984723B (en) * 2014-11-27 2018-01-16 鸿劲科技股份有限公司 The vapour-pressure type inspection mechanism of electronic component apparatus for work, method and its application equipment
TWI635551B (en) * 2017-08-14 2018-09-11 鴻勁精密股份有限公司 Electronic component crimping unit and test equipment for its application
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TWI794985B (en) * 2021-09-16 2023-03-01 鴻勁精密股份有限公司 Connecting mechanism, testing device, and processing machine
CN117706340A (en) * 2024-02-18 2024-03-15 深圳市森美协尔科技有限公司 Fork arm assembly and wafer probe station
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