CN110931398A

CN110931398A - Packaging equipment

Info

Publication number: CN110931398A
Application number: CN201911320925.3A
Authority: CN
Inventors: 刘子玉; 陈勇伶
Original assignee: Shenzhen Yihe Technology Co Ltd
Current assignee: Shenzhen Yihe Technology Co Ltd
Priority date: 2019-12-19
Filing date: 2019-12-19
Publication date: 2020-03-27

Abstract

The invention relates to the technical field of wafer packaging, and particularly discloses packaging equipment.A first feeding device automatically supplies a material box bearing a plurality of frames, and a second feeding device automatically supplies a plurality of stacked frames; the first feeding unit of the double-layer material rolling device is used for transferring the frame transferred by the feeding device; the pneumatic dispensing device carries out pneumatic dispensing on the frame borne by the first feeding unit; the electric gluing device carries out electric gluing on the frame carried by the first feeding unit; the wafer expanding device is used for carrying out wafer expanding treatment on the wafer assembly, the bonding head device is used for bonding the wafer assembly subjected to the wafer expanding treatment by the wafer expanding device on the frame subjected to the glue dispensing, and the second feeding unit is used for moving the frame bonded with the wafer assembly; the automatic bonding and packaging of the wafer element and the frame are realized, and the packaging efficiency of the wafer element and the frame is improved; two dispensing processing modes of pneumatic dispensing and electric gluing and two feeding modes of material box feeding and material part feeding are adopted, so that the compatibility of the packaging equipment is improved.

Description

Packaging equipment

Technical Field

The invention relates to the technical field of wafer packaging, and particularly discloses packaging equipment.

Background

In the packaging process of the wafer element, the wafer element needs to be mounted on the frame, and the mounting efficiency of the wafer element and the frame in the prior art is low, so that the requirement of actual capacity cannot be met. In addition, in the prior art, the dispensing processing mode on the frame is single, the feeding mode of the frame is single, the actual requirements of most manufacturers cannot be met, and the use is extremely inconvenient.

Disclosure of Invention

In order to overcome the defects in the prior art, the invention aims to provide packaging equipment, which realizes the automatic bonding and packaging of a wafer element and a frame and improves the packaging efficiency of the wafer element and the frame; two dispensing processing modes of pneumatic dispensing and electric gluing and two feeding modes of material box feeding and material part feeding are adopted, so that the compatibility of the packaging equipment is improved.

In order to achieve the purpose, the packaging equipment comprises a first feeding device, a second feeding device, a double-layer material rolling device, a pneumatic dispensing device, an electric gluing device, a crystal expanding device and a bonding head device, wherein the first feeding device is arranged on the first feeding device; the first feeding device is used for automatically supplying a material box bearing a plurality of frames, and the second feeding device is used for automatically supplying a plurality of stacked frames; the double-layer material rolling device is provided with a first feeding unit and a second feeding unit, and the first feeding unit is used for transferring the frame transferred by the feeding device; the pneumatic dispensing device carries out pneumatic dispensing on the frame borne by the first feeding unit; the electric gluing device carries out electric gluing on the frame carried by the first feeding unit; the wafer expanding device is used for expanding the wafer assembly, the bonding head device is used for bonding the wafer assembly subjected to the wafer expanding processing on the frame subjected to the dispensing, and the second feeding unit is used for moving the frame bonded with the wafer assembly.

The first feeding device comprises a first support, a bracket arranged on the first support in a lifting mode, a first driving piece used for driving the first support to lift up and down, a pushing bar moving horizontally and a second driving piece used for driving the pushing bar to move; the bracket is provided with a plurality of supporting plates which are used for bearing the material box and are arranged in parallel; the quantity of pushing strips is a plurality of, and the layer board sets up with pushing away the strip crisscross, pushes away the strip and is used for removing the magazine that the layer board bore.

Furthermore, the first feeding device further comprises a left blocking piece, a right blocking piece, a front blocking piece and a rear blocking piece, the left blocking piece is arranged on the first support, the front blocking piece and the rear blocking piece respectively slide along the length direction of the left blocking piece, two ends of the right blocking piece respectively slide along the length direction of the front blocking piece and the length direction of the rear blocking piece, one end, far away from the left blocking piece, of the front blocking piece slides along the length direction of the right blocking piece, one end, far away from the right blocking piece, of the rear blocking piece and two ends of the right blocking piece are respectively provided with a blocking plate, the blocking plates extend along the moving direction of the bracket, and the.

The baffle is movably provided with a plurality of rolling bearings and a plurality of first springs used for driving the rolling bearings respectively, the rolling bearings are arranged in a row along the length direction of the baffle, and the first springs drive the rolling bearings to abut against the outer side of the material box or the outer side of the frame.

Further, the packaging equipment further comprises a material moving manipulator, wherein the material moving manipulator is used for moving the frame of the first feeding device or the second feeding device to the first moving unit; the material moving manipulator comprises a first mechanical arm, a first plate, a strip body, a limiting part and a plurality of suction nozzles, wherein the first mechanical arm is movably arranged, the first plate is arranged at the tail end of the first mechanical arm, the strip body is arranged on the first plate in a sliding mode, the limiting part is used for limiting the strip body on the first plate, the suction nozzles are arranged on the strip body, the first plate is provided with a first air hole and a plurality of second air holes which are respectively communicated with the first air hole, and the second air holes are respectively communicated with the suction nozzles.

The double-layer rolling device comprises a fixed plate, two supporting plates arranged on the fixed plate in a sliding mode, a third driving piece used for driving the two supporting plates to be close to or far away from each other, two carrier plates arranged on the two supporting plates in a lifting mode respectively, and a fourth driving piece used for driving the two carrier plates to lift up and down, wherein the two carrier plates are both rotatably provided with a first annular belt and a second annular belt, the carrier plates are provided with a fifth driving piece used for driving the first annular belts of the two carrier plates to rotate and a sixth driving piece used for driving the second annular belts of the two carrier plates to rotate, linear portions used for bearing and transferring a frame are formed in the annular belts, the linear portions of the first annular belts of the two carrier plates form a first transferring unit, and the linear portions of the.

Furthermore, the fixing plate is provided with a supporting arm, the supporting arm is provided with a positioning column and a magnet piece, the magnet piece is used for sucking the magnetic conduction plate, the magnetic conduction plate is provided with a positioning hole for accommodating the positioning column, and the magnetic conduction plate is positioned between the two support plates; the support plate is provided with a pressing strip used for pressing and holding the frame on the support plate.

The crystal expansion device comprises a second support, a material carrying platform, a seventh driving piece, an expansion crystal piece, an eighth driving piece, a crystal expansion pressing plate and a clamping unit, wherein the material carrying platform is rotatably arranged on the second support, the seventh driving piece is used for driving the material carrying platform to rotate, the crystal expansion piece is arranged on the second support in a lifting mode, the eighth driving piece is used for driving the crystal expansion piece, the crystal expansion pressing plate is rotatably arranged on the crystal expansion piece and used in cooperation with the material carrying platform, the clamping unit is used for clamping the material carrying platform, the material carrying platform is used for carrying a wafer assembly, and the crystal expansion pressing plate is used for carrying out crystal.

Furthermore, the material loading platform is provided with an annular protruding rib and a first annular groove, the first driving piece comprises a third annular belt which is sleeved on the outer side of the material loading platform and located in the first annular groove, the second support is rotatably provided with a plurality of rotating wheels, the rotating wheels are provided with second annular grooves surrounding the rotating axes of the rotating wheels, and the annular protruding rib extends into the second annular grooves of the rotating wheels.

Wherein, nation head device includes the third support, rotate the carrier that sets up with the third support, a ninth driving piece for driving the carrier pivoted, go up and down to set up in the slide of carrier, rotate the setting with the slide and go up and down to set up in the slide of third support, a tenth driving piece for driving the slide and go up and down, set up in the shell fragment spare of slide, with shell fragment spare complex cantilever, the middle part of cantilever sets up in the shell fragment spare, the one end of cantilever spare is equipped with the piece of picking that is used for picking up the wafer spare after expanding crystal device and handling, the slide is provided with the dynamometer, the other end of cantilever spare acts on the dynamometer.

Has the advantages that: the first feeding device automatically supplies a material box bearing a plurality of frames, and the second feeding device automatically supplies a plurality of stacked frames; a first feeding unit of the double-layer material rolling device transfers the frame transferred by the feeding device; the pneumatic dispensing device carries out pneumatic dispensing on the frame borne by the first feeding unit; the electric gluing device carries out electric gluing on the frame carried by the first feeding unit; the wafer expansion device carries out wafer expansion processing on the wafer assembly, the bonding head device bonds the wafer assembly subjected to the wafer expansion processing by the wafer expansion device on the frame subjected to the dispensing, and the second feeding unit moves the frame bonded with the wafer assembly; the automatic bonding and packaging of the wafer element and the frame are realized, and the packaging efficiency of the wafer element and the frame is improved; two dispensing processing modes of pneumatic dispensing and electric gluing and two feeding modes of material box feeding and material part feeding are adopted, so that the compatibility of the packaging equipment is improved.

Drawings

Fig. 1 is a perspective view of the present invention.

Fig. 2 is a perspective view of a first supply device of the present invention.

Fig. 3 is an exploded view of the shield plate, the rolling bearing, and the first spring according to the present invention.

Fig. 4 is a perspective view of the first plate, the strip and the nozzle of the present invention.

Fig. 5 is a perspective view of the double layer roll feeder of the present invention.

Fig. 6 is an exploded view of the double roll apparatus of the present invention.

FIG. 7 is a perspective view of the crystal expanding device of the present invention.

Fig. 8 is a perspective view of the material loading platform and the rotating wheel of the invention.

FIG. 9 is a perspective view of the upper device of the present invention.

FIG. 10 is an exploded view of the upper assembly of the present invention.

The reference numerals include:

1-first feeding device 2-second feeding device 3-double-layer material rolling device

4-pneumatic glue dispensing device 5-electric glue sticking device 6-crystal expanding device

7-bonding head device 8-first support 9-push bar

11-supporting plate 12-left blocking piece 13-right blocking piece

14-front stop 15-rear stop 16-stop

17-rolling bearing 18-first spring 19-material moving manipulator

21-first plate 22-strip 23-suction nozzle

24-first air hole 25-second air hole 26-fixing plate

27-supporting plate 28-carrier plate 29-first annular belt

31-second ring belt 32-supporting arm 33-positioning column

34-magnet piece 35-magnetic conduction plate 36-pressing strip

37-second support 38-material loading platform 39-crystal expansion piece

41-wafer expanding pressure plate 42-clamping unit 43-annular convex rib

44-first ring groove 45-rotating wheel 46-second ring groove

47-third support 48-carrier 49-slide

51-sliding plate 52-spring piece 53-cantilever

54 — picking member.

Detailed Description

The present invention will be further described with reference to the following examples and the accompanying drawings.

Referring to fig. 1, the packaging equipment of the present invention includes a first feeding device 1, a second feeding device 2, a double-layer material rolling device 3, a pneumatic glue dispensing device 4, an electric glue sticking device 5, a crystal expanding device 6 and a bonding head device 7; the first magazine 1 is used for automatically supplying cartridges carrying a plurality of frames, and the second magazine 2 is used for automatically supplying a plurality of frames in a stack. Of course, the manufacturer may choose to use only the first supply device 1 or only the second supply device 2, depending on the actual requirements.

The double-layer rolling device 3 is provided with a first feeding unit and a second feeding unit, the first feeding unit is positioned above the second feeding unit, and the first feeding unit is used for transferring a frame transferred by the feeding device; the pneumatic glue dispensing device 4 carries out pneumatic glue dispensing on the frame borne by the first feeding unit; the electric gluing device 5 carries out electric gluing on the frame carried by the first feeding unit; similarly, the manufacturer may choose to use only the pneumatic glue dispensing device 4 or only the electric glue dispensing device 5.

The wafer expanding device 6 is used for automatically expanding the wafer assembly, the bonding head device 7 is used for bonding the wafer assembly subjected to the wafer expanding processing by the wafer expanding device 6 on the frame subjected to the dispensing, and the second feeding unit is used for moving the frame bonded with the wafer assembly, so that the frame packaged with the wafer assembly is output to a required preset position.

The automatic bonding and packaging of the wafer element and the frame are realized, and the packaging efficiency of the wafer element and the frame is improved; two dispensing processing modes of pneumatic dispensing and electric gluing and two feeding modes of material box feeding and material part feeding are adopted, so that the compatibility of the packaging equipment is improved.

Referring to fig. 1 to 3, the first feeding device 1 includes a first support 8, a bracket disposed on the first support 8 in a lifting manner, a first driving member for driving the first support 8 to ascend and descend vertically, a pushing bar 9 moving horizontally, and a second driving member for driving the pushing bar 9 to move.

The bracket is provided with a plurality of supporting plates 11 which are used for bearing the material box and are arranged in parallel, the supporting plates 11 are arranged in parallel to the horizontal plane, the number of the pushing strips 9 is multiple, the supporting plates 11 and the pushing strips 9 are arranged in a staggered mode, namely, one supporting plate 11 is arranged between any two adjacent pushing strips 9, one pushing strip 9 is arranged between any two adjacent supporting plates 11, and the pushing strips 9 are used for moving the material box borne by the supporting plates 11.

The first feeding device 1 further comprises a left blocking piece 12, a right blocking piece 13, a front blocking piece 14 and a rear blocking piece 15, the left blocking piece 12 is fixedly arranged on the first support 8, the front blocking piece 14 and the rear blocking piece 15 respectively slide along the length direction of the left blocking piece 12, two ends of the right blocking piece 13 respectively slide along the length direction of the front blocking piece 14 and the length direction of the rear blocking piece 15, one end, far away from the left blocking piece 12, of the front blocking piece 14 slides along the length direction of the right blocking piece 13, one end, far away from the right blocking piece 13, of the front blocking piece 14, one end, far away from the right blocking piece 13, of the rear blocking piece 15 and two ends of the right blocking piece 13 are respectively provided with a blocking piece 16, the blocking pieces 16 extend along the moving direction of the bracket, and the blocking pieces 16 are.

In the process of lifting the material box or the frame up and down, the plurality of baffles 16 are used for stopping and limiting the material box or the frame to abut against the outer side of the material box or the outer side of the frame, so that the material box or the frame is prevented from being inclined in the lifting process, the frame is ensured to accurately enter the material box, and the material box is ensured to be accurately pressed on the plurality of supporting plates 11 of the bracket.

The baffle 16 is movably provided with a plurality of rolling bearings 17 and a plurality of first springs 18 which are respectively used for driving the plurality of rolling bearings 17, the plurality of rolling bearings 17 are arranged in a row along the length direction of the baffle 16, and the first springs 18 drive the rolling bearings 17 to abut against the outer side of the material box or the outer side of the frame. The outer ring of the rolling bearing 17 protrudes out of the outer surface of the baffle 16 and is abutted against the material box or the frame, and in the lifting process of the material box or the frame, the deviation of the material box or the frame caused by processing errors is buffered by using the movable rolling bearing 17, and meanwhile, the sliding friction between the baffle 16 and the material box (or the frame) is converted into rolling friction, so that the abrasion and the friction noise are reduced.

Referring to fig. 1 to 4, the packaging apparatus further includes a material transfer robot 19, and the material transfer robot 19 is configured to transfer the frame of the first feeding device 1 or the second feeding device 2 to the first transfer unit; the material moving manipulator 19 comprises a first mechanical arm movably arranged, a first plate 21 arranged at the tail end of the first mechanical arm, a strip body 22 arranged on the first plate 21 in a sliding mode, a limiting part used for limiting the strip body 22 on the first plate 21, and a plurality of suction nozzles 23 arranged on the strip body 22, wherein the first plate 21 is provided with a first air hole 24 and a plurality of second air holes 25 respectively communicated with the first air hole 24, and the second air holes 25 are respectively communicated with the suction nozzles 23.

According to the actual size of the frame, the strip body 22 can be slid along the first plate 21, so that the strip body 22 with the suction nozzle 23 moves, and the position of the suction nozzle 23 relative to the frame is changed, and the suction nozzle 23 can be ensured to accurately suck the frame. The first air hole 24 and the second air hole 25 are arranged on the first plate 21, so that the first air hole 24 is communicated with an external air suction pump, the second air hole 25 is communicated with the suction nozzle 23 through an air pipe, the air path structure is simplified, and the mounting efficiency or the dismounting efficiency of the suction nozzle 23 is improved.

Referring to fig. 1 to 6, the double-layer rolling device 3 includes a fixing plate 26, two supporting plates 27 slidably disposed on the fixing plate 26, a third driving member for driving the two supporting plates 27 to approach or separate from each other, two carrier plates 28 respectively disposed on the two supporting plates 27 in a lifting manner, and a fourth driving member for driving the two carrier plates 28 in a lifting manner, wherein the fixing plate 26 is disposed horizontally, and both the supporting plates 27 and the carrier plates 28 are disposed vertically.

A first endless belt 29 and a second endless belt 31 are rotatably disposed on each of the two carrier plates 28, the carrier plates 28 are provided with a fifth driving member for driving the first endless belt 29 of the two carrier plates 28 to rotate and a sixth driving member for driving the second endless belt 31 of the two carrier plates 28 to rotate, the endless belts are formed with linear portions for carrying and transferring the frames, the linear portions of the first endless belts 29 of the two carrier plates 28 form a first transfer unit, and the linear portions of the second endless belts 31 of the two carrier plates 28 form a second transfer unit.

After the suction nozzle 23 of the material transferring manipulator 19 sucks the frame, the first manipulator moves the frame sucked by the suction nozzle 23 to the linear part of the first endless belt 29, and then the fifth driving member drives the first endless belt 29 to rotate, and the rotating first endless belt 29 drives the frame carried by the linear part to move.

In this embodiment, pneumatic adhesive deposite device 4, electronic viscose device 5 all dispose some glue platforms, some glue platforms have the automatic double-deck anchor clamps that open and shut that are used for the centre gripping frame, the automatic double-deck anchor clamps that open and shut are roughly the same with the structure of double-deck material device 3 that rolls, the encapsulation equipment still disposes the individual layer and rolls the material device, the individual layer rolls the material device and roughly the same with the structure of double-deck gyro wheel device 3, the individual layer gyro wheel device only disposes two first clitells 29, the individual layer gyro wheel device lower extreme is equipped with elevating system, elevating system drive individual layer rolls the material device and reciprocates in order to.

The frame of first feedway 1, second feedway 2 is carried to the upper girdle band of the automatic double-deck anchor clamps that open and shut, pneumatic adhesive deposite device 4, electronic mucilage binding device 5 carries out the point to the frame of the automatic double-deck anchor clamps that open and shut and handles, elevating system drive individual layer rolls the material device and goes up and down, make the frame after the automatic double-deck anchor clamps that open and shut point to carry to individual layer roller device, then fix the wafer spare after expanding brilliant processing of crystal device 6 on the frame of individual layer roller device, elevating system drive individual layer roller device descends, make the frame after the solid brilliant get into the lower floor girdle band of the automatic double-deck anchor clamps that opens and shuts, the lower floor girdle band of the automatic double-deck anchor clamps that open and shut inputs in the.

The upper and lower layers of annular belts of the automatic opening and closing double-layer clamp are not affected each other during rolling transmission, and the operation efficiency is greatly improved. Meanwhile, the frame automatically returns to the original position after undergoing feeding, dispensing, die bonding and material receiving operations, single-side in and out of the frame is achieved, and compared with the flow process of the frame from left to right in the prior art, the material receiving mechanism is omitted, the length of a production line is shortened, and the use cost of equipment is reduced.

The fixing plate 26 is provided with a supporting arm 32, the supporting arm 32 is provided with a positioning column 33 and a magnet piece 34, the magnet piece 34 is used for sucking a magnetic conduction plate 35, the magnetic conduction plate 35 is provided with a positioning hole for accommodating the positioning column 33, and the magnetic conduction plate 35 is positioned between the two support plates 28; the carrier plate 28 is provided with a bead 36, the bead 36 being used to hold the frame against the carrier plate 11. After the first endless belt 29 moves the frame carried by the linear portion to the magnetic conduction plate 35, the fourth driving member drives the two carrier plates 28 to descend until the pressing bar 36 presses the frame on the magnetic conduction plate 35, and then the pneumatic glue dispensing device 4 or the electric glue dispensing device 5 can perform glue dispensing on the frame clamped by the pressing bar 36 and the magnetic conduction plate 35. Preferably, the number of the pressing strips 36 is multiple, the pressing strips 36 are arranged in a row along the length direction of the carrier plate 28, and the pressing strips 36 respectively press different positions of the frame carried by the magnetic conduction plate 35.

Referring to fig. 1 to 8, the wafer expanding device 6 includes a second support 37, a material loading platform 38 rotatably disposed on the second support 37, a seventh driving member for driving the material loading platform 38 to rotate, a wafer expanding member 39 disposed on the second support 37 in a lifting manner, an eighth driving member for driving the wafer expanding member 39 to lift up and down, a wafer expanding pressing plate 41 rotatably disposed on the wafer expanding member 39 and used in cooperation with the material loading platform 38, and a clamping unit 42 for clamping the material loading platform 38, wherein the material loading platform 38 is used for loading wafer components, and the wafer expanding pressing plate 41 is used for carrying out a wafer expanding process on the wafer components loaded on the material loading platform 38.

When the wafer assembly carried by the carrier table 38 needs to be subjected to wafer expansion, the clamping unit 42 clamps the carrier table 38 to prevent the carrier table 38 from rotating relative to the second support 37, and then the eighth driving member drives the wafer expansion member 39 to move towards the direction close to the carrier table 38, and the wafer assembly carried by the carrier table 38 is subjected to wafer expansion by using the wafer expansion pressing plate 41 of the wafer expansion member 39. When the wafer assembly needs to be rotated, the clamping unit 42 releases the rotating table, and the seventh driving member drives the loading platform 38 to rotate so as to change the angle of the wafer assembly.

The material loading platform 38 is provided with an annular rib 43 and a first annular groove 44, the annular rib 43 and the first annular groove 44 are arranged around the central axis of the material loading platform 38, and the first driving part comprises a third annular belt sleeved outside the material loading platform 38 and located in the first annular groove 44 and a motor for driving the third annular belt to rotate. In practical use, the motor drives the third endless belt to rotate, and the rotating third endless belt drives the material loading platform 38 to rotate relative to the second support 37.

The second bracket 37 is rotatably provided with a plurality of rotating wheels 45, the plurality of rotating wheels 45 are arranged around the material loading platform 38, the rotating wheels 45 are provided with second annular grooves 46 around the rotating axes of the rotating wheels 45, and the annular ribs 43 extend into the second annular grooves 46 of the plurality of rotating wheels 45. Through the arrangement of the turning wheel 45, on one hand, the loading platform 38 and the second bracket 37 are arranged in a rotating way, and on the other hand, the abrasion required by the relative rotation between the loading platform 38 and the second bracket 37 is reduced.

Referring to fig. 1 to 10, the bond head device 7 includes a third bracket 47, a carrier 48 rotatably disposed with the third bracket 47, a ninth driving member for driving the carrier 48 to rotate, a slide seat 49 disposed on the carrier 48 in a lifting manner, a slide plate 51 rotatably disposed with the slide seat 49 and disposed on the third bracket 47 in a lifting manner, a tenth driving member for driving the slide plate 51 to lift, a spring piece 52 disposed on the slide seat 49, and a cantilever 53 engaged with the spring piece 52, wherein the spring piece 52 is substantially flat, a middle portion of the cantilever 53 is mounted on the spring piece 52, one end of the cantilever 53 is provided with a pickup member 54 for picking up a wafer piece after the wafer expansion processing of the wafer expansion device 6, the slide seat 49 is provided with a load cell, and the other end of the cantilever 53 acts on the load cell.

In practical use, the ninth driving member drives the carrier 48 to rotate, the rotating carrier 48 drives the picking member 54 to rotate via the cantilever 53, so as to change the angle between the picking member 54 and the wafer expanded by the wafer expanding device 6, then the tenth driving member drives the sliding plate 51 to slide up and down, the sliding plate 51 drives the sliding base 49 to move up and down, the sliding base 49 moves up and down to drive the picking member 54 to move up and down via the cantilever 53, so that the picking member 54 picks up the wafer expanded.

When the picking piece 54 picks up the wafer, the wafer is acted on the dynamometer through the picking piece 54 and the cantilever 53, the dynamometer displays the acting force applied to the wafer by the picking piece 54, according to the acting force displayed by the dynamometer, the lifting stroke of the tenth driving piece driving sliding plate 51 and the sliding seat 49 is further regulated and controlled, the wafer is prevented from being damaged due to the fact that the picking piece 54 excessively descends, the accurate moving stroke of the picking piece 54 is ensured, and the poor installation between the wafer and the frame caused by the inaccurate stroke of the picking piece 54 is avoided.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the invention.

Claims

1. A packaging apparatus, characterized by: the automatic die bonding machine comprises a first feeding device, a second feeding device, a double-layer material rolling device, a pneumatic dispensing device, an electric gluing device, a die expanding device and a bonding head device; the first feeding device is used for automatically supplying a material box bearing a plurality of frames, and the second feeding device is used for automatically supplying a plurality of stacked frames; the double-layer material rolling device is provided with a first feeding unit and a second feeding unit, and the first feeding unit is used for transferring the frame transferred by the feeding device; the pneumatic dispensing device carries out pneumatic dispensing on the frame borne by the first feeding unit; the electric gluing device carries out electric gluing on the frame carried by the first feeding unit; the wafer expanding device is used for expanding the wafer assembly, the bonding head device is used for bonding the wafer assembly subjected to the wafer expanding processing on the frame subjected to the dispensing, and the second feeding unit is used for moving the frame bonded with the wafer assembly.

2. The encapsulation apparatus of claim 1, wherein: the first feeding device comprises a first support, a bracket arranged on the first support in a lifting mode, a first driving piece used for driving the first support to lift up and down, a pushing bar moving horizontally and a second driving piece used for driving the pushing bar to move; the bracket is provided with a plurality of supporting plates which are used for bearing the material box and are arranged in parallel; the quantity of pushing strips is a plurality of, and the layer board sets up with pushing away the strip crisscross, pushes away the strip and is used for removing the magazine that the layer board bore.

3. The encapsulation apparatus of claim 2, wherein: the first feeding device further comprises a left blocking piece, a right blocking piece, a front blocking piece and a rear blocking piece, the left blocking piece is arranged on the first support, the front blocking piece and the rear blocking piece respectively slide along the length direction of the left blocking piece, two ends of the right blocking piece respectively slide along the length direction of the front blocking piece and the length direction of the rear blocking piece, one end, far away from the left blocking piece, of the front blocking piece slides along the length direction of the right blocking piece, one end, far away from the right blocking piece, of the rear blocking piece and two ends of the right blocking piece are respectively provided with a baffle, the baffles extend along the moving direction of the bracket, and the baffles are used for blocking the outer side of the material box or the outer side of.

4. The encapsulation apparatus of claim 3, wherein: the baffle is movably provided with a plurality of rolling bearings and a plurality of first springs used for driving the rolling bearings respectively, the rolling bearings are arranged in a row along the length direction of the baffle, and the first springs drive the rolling bearings to abut against the outer side of the material box or the outer side of the frame.

5. The encapsulation apparatus of claim 1, wherein: the packaging equipment further comprises a material moving manipulator, wherein the material moving manipulator is used for moving the frame of the first feeding device or the second feeding device to the first moving unit; the material moving manipulator comprises a first mechanical arm, a first plate, a strip body, a limiting part and a plurality of suction nozzles, wherein the first mechanical arm is movably arranged, the first plate is arranged at the tail end of the first mechanical arm, the strip body is arranged on the first plate in a sliding mode, the limiting part is used for limiting the strip body on the first plate, the suction nozzles are arranged on the strip body, the first plate is provided with a first air hole and a plurality of second air holes which are respectively communicated with the first air hole, and the second air holes are respectively communicated with the suction nozzles.

6. The encapsulation apparatus of claim 1, wherein: the double-layer material rolling device comprises a fixed plate, two supporting plates arranged on the fixed plate in a sliding mode, a third driving piece used for driving the two supporting plates to be close to or far away from the two supporting plates and respectively arranged on the two supporting plates of the two supporting plates in a lifting mode, a fourth driving piece used for driving the two supporting plates to lift, a first annular belt and a second annular belt are arranged on the two supporting plates in a rotating mode, a fifth driving piece used for driving the first annular belts of the two supporting plates to rotate and a sixth driving piece used for driving the second annular belts of the two supporting plates to rotate are arranged on the supporting plates, linear portions used for bearing and transferring a frame are formed in the annular belts, a first transferring unit is formed in the linear portions of the first annular belts of the two supporting.

7. The encapsulation apparatus of claim 6, wherein: the fixed plate is provided with a supporting arm, the supporting arm is provided with a positioning column and a magnet piece, the magnet piece is used for sucking the magnetic conduction plate, the magnetic conduction plate is provided with a positioning hole for accommodating the positioning column, and the magnetic conduction plate is positioned between the two support plates; the support plate is provided with a pressing strip used for pressing and holding the frame on the support plate.

8. The encapsulation apparatus of claim 1, wherein: the crystal expansion device comprises a second support, a material carrying platform, a seventh driving piece, an expansion crystal piece, an eighth driving piece, a crystal expansion pressing plate and a clamping unit, wherein the material carrying platform is rotatably arranged on the second support, the seventh driving piece is used for driving the material carrying platform to rotate, the expansion crystal piece is arranged on the second support in a lifting mode, the eighth driving piece is used for driving the crystal expansion piece, the crystal expansion pressing plate is rotatably arranged on the crystal expansion piece and used in cooperation with the material carrying platform, the clamping unit is used for clamping the material carrying platform, the material carrying platform is used for bearing wafer assemblies, and the crystal expansion pressing plate is used for carrying out.

9. The encapsulation apparatus of claim 8, wherein: the material carrying platform is provided with an annular protruding rib and a first annular groove, the first driving piece comprises a third annular groove which is sleeved on the outer side of the material carrying platform and located in the first annular groove, the second support is rotatably provided with a plurality of rotating wheels, the rotating wheels are provided with second annular grooves around the rotating axes of the rotating wheels, and the annular protruding rib extends into the second annular grooves of the rotating wheels.

10. The encapsulation apparatus of claim 1, wherein: nation head device includes the third support, rotate the carrier that sets up with the third support, a ninth driving piece for driving the carrier pivoted, go up and down to set up in the slide of carrier, rotate the setting with the slide and go up and down to set up in the slide of third support, a tenth driving piece for driving the slide and go up and down, set up in the shell fragment spare of slide, with shell fragment spare complex cantilever, the middle part of cantilever sets up in the shell fragment spare, the one end of cantilever spare is equipped with the piece of picking that is used for picking up the piece of expanding after the brilliant device expands brilliant processing, the slide is provided with the dynamometer, the other end of cantilever spare acts on the dynamometer.