CN111863642B - Automatic pressing system for soft solder packaging chip of carrier core plate - Google Patents
Automatic pressing system for soft solder packaging chip of carrier core plate Download PDFInfo
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- CN111863642B CN111863642B CN202010770268.9A CN202010770268A CN111863642B CN 111863642 B CN111863642 B CN 111863642B CN 202010770268 A CN202010770268 A CN 202010770268A CN 111863642 B CN111863642 B CN 111863642B
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- 238000003825 pressing Methods 0.000 title claims abstract description 91
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 42
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 112
- 230000001681 protective effect Effects 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 14
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- 238000004519 manufacturing process Methods 0.000 description 6
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
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- 239000000377 silicon dioxide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
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- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an automatic pressing system for a soft solder packaging chip of a carrier core plate, and belongs to the field of chips. The automatic pressing system for the soft solder packaging chip of the carrier core plate comprises a driving mechanism, a feeding mechanism and a pressing mechanism, wherein the output end of the driving mechanism is fixedly connected with a connecting rod, and the driving mechanism can drive the connecting rod to move axially back and forth and rotate. The feeding mechanism can push the carrier core plate to move axially back and forth by matching the driving mechanism with the feeding mechanism, the driving mechanism can drive the pressing mechanism to move to press the carrier core plate by matching the driving mechanism with the pressing mechanism, and the carrier core plate can be pressed when a chip is packaged, so that the flatness of the carrier core plate is ensured, the chip solder is prevented from generating deviation or bubbles, and the yield of the chip is improved.
Description
Technical Field
The invention belongs to the technical field of chips, and particularly relates to an automatic pressing system for a soft solder packaging chip of a carrier core plate.
Background
With the development of science and technology, more and more electronic devices are widely applied to daily life and work of people, bring great convenience to daily life and work of people, and become an indispensable important tool for people at present.
The main component of an electronic device that implements various functions is a chip. The whole chip manufacturing process includes several links, such as chip design, wafer manufacturing, package manufacturing, cost testing, etc., wherein the wafer manufacturing process is particularly complex.
The method comprises the steps of manufacturing a wafer, coating a film on the wafer, photoetching, developing and etching the wafer, wherein chemical substances sensitive to ultraviolet light are used in the process, the chemical substances become soft when meeting the ultraviolet light, and the appearance of a chip can be obtained by controlling the position of a light shield. The silicon wafer is coated with a photoresist so that it dissolves in the presence of ultraviolet light, which may be done with a first shade so that the portion directed directly by the ultraviolet light is dissolved, which is then washed away with a solvent. The remaining part is then shaped like a shade, which is what we want, and this results in the desired silicon dioxide layer. The wafer is implanted with ions to produce P, N semiconductor, and the exposed area on the wafer is set inside chemical ion mixture liquid. This process will change the electrical mode of the doped regions so that each transistor can be turned on, off, or carry data, a simple chip can use only one layer, but a complex chip usually has many layers, this process is repeated continuously at this time, and the different layers can be connected through an open window, similar to the fabrication principle of the PCB board of the layers. More complex chips may require multiple silicon dioxide layers, which are realized by repeating the above processes, to form a three-dimensional structure, and then after the wafer test is performed through the above processes, lattice-shaped grains are formed on the wafer, and each grain is tested for electrical characteristics by a probing method. The number of dies owned by each chip is typically large, and organizing a one-time pin test pattern is a very complex process. And finally, packaging, testing and packaging.
During this final packaging process, a packaging device is required to package the chip pairs. The chip is placed by the carrier plate acting carrier during packaging, a plurality of chip carrying areas for placing the chip are formed in the strip-shaped chip carrying plate, the chip carrying plate can be pushed to move forwards through the feeding mechanism, then the mechanical arm grabs the chip onto the chip carrying plate for packaging, the strip-shaped chip carrying plate is easy to shake or uneven due to high temperature in the process, inconvenience can be brought to the solder if the chip carrying plate is uneven or shakes when the solder chip is placed, deviation or bubbles occur to the solder of the chip, and defective products are generated.
Disclosure of Invention
The invention aims to solve the problems, and provides an automatic pressing system for a soft solder of a chip carrier plate to package a chip, which can press the chip carrier plate when the chip is packaged, so that the flatness of the chip carrier plate is ensured, the deviation or bubbles of the solder of the chip are avoided, and the yield of the chip is improved.
In order to realize the purpose, the invention adopts the technical scheme that: an automated clamping system for a die-carrier board soft solder package chip, comprising:
the output end of the driving mechanism is fixedly connected with a connecting rod, and the driving mechanism can drive the connecting rod to axially move back and forth and rotate;
the feeding mechanism is used for pushing the core carrying plate to move back and forth in the axial direction, the feeding mechanism is arranged on the connecting rod, and the driving mechanism drives the feeding mechanism to move through the connecting rod;
the pressing mechanism is used for pressing the core carrying plate when soft solder is used for packaging the chip, the pressing mechanism is installed on the connecting rod, the driving mechanism drives the pressing mechanism to press the core carrying plate through the connecting rod, the pressing mechanism is matched with the feeding mechanism for use, and the driving mechanism drives the feeding mechanism to push the core carrying plate to move back and forth in the axial direction through the connecting rod, and the pressing mechanism is lifted up.
Preferably, the box is placed to still including frame and carrier plate, the carrier plate is placed the box and is installed at the top of frame, carrier plate slidable sets up the inner chamber of placing the box at the carrier plate, actuating mechanism includes mount pad, first slide rail, first slider, connecting rod, motor, first gear and second gear, the mount pad is installed in the frame, first slide rail is installed on the mount pad, first slider slidable installs on first slide rail, the bottom and the mount pad fixed connection of cylinder, the output and the first slider fixed connection of cylinder, the one end and the first slider of connecting rod rotate to be connected, the second gear cover is established on the connecting rod, the motor is installed on first slider, the output of motor and the fixed connection of first gear, first gear and the meshing of second gear.
Preferably, the driving mechanism further comprises a protective cover, the protective cover is fixed to the first sliding block, and the motor, the first gear and the second gear are located in an inner cavity of the protective cover.
Preferably, feed mechanism includes swinging boom, fixed block and plectrum, the one end and the connecting rod fixed connection of swinging boom, the other end and the fixed block fixed connection of swinging boom, the plectrum is installed on the fixed block, the top that the case was placed to the carrier core board has been seted up and has been dialled the hole, the bottom in dialling the hole is run through to the bottom of plectrum, the plectrum is used for stirring the carrier core board motion.
Preferably, the pressing mechanism comprises a rotating block, a pressing block, a pulley, a lever arm, a connecting plate, a second sliding block, a second sliding rail, a return spring and a pressing plate a, the rotating block is fixedly connected to the connecting rod, the pressing block is fixedly connected to the rotating block and used for adjusting the height of the pulley, one end of the lever arm is rotatably connected to the pulley, the top of the pulley is in contact with the pressing block, the other end of the lever arm is fixedly connected to the connecting plate, the middle of the lever arm is rotatably connected to the frame through a rotating shaft, the top of the return spring is fixedly connected to the bottom of the lever arm, the lever arm is located at the bottom of the pulley, the return spring is used for returning the lever arm, one end of the connecting plate is fixedly connected to the second sliding block, the second sliding block is slidably arranged on the second sliding rail, and, the pressing plate a is detachably mounted on the second sliding block and used for pressing the core carrying plate.
Preferably, pressure strip a includes swing arm, connecting block, bolt, pressure strip b and spread groove, the connecting block passes through bolt demountable installation in the one end of swing arm, pressure strip b fixed connection is on the connecting block, the other end at the swing arm is seted up to the spread groove, fixedly connected with backup pad on the second slider, the equal fixedly connected with threaded rod in both sides at backup pad top, the threaded rod passes the spread groove, threaded connection has the nut on the threaded rod, the nut is used for compressing tightly the swing arm, with swing arm fixed connection on the second slider.
Preferably, the carrier plate placing box is provided with a movable hole matched with the compression plate b.
Preferably, the top of the carrier plate placing box is provided with solder holes, and the solder holes are used for soft solder packaging equipment to insert soft solder packaging chips into the carrier plate placing box.
Preferably, the other end of the connecting rod is mounted on the frame through a bearing.
Preferably, the number of the pressing mechanisms is two.
The invention has the beneficial effects that: the feeding mechanism can push the carrier core plate to move axially back and forth by matching the driving mechanism with the feeding mechanism, the driving mechanism can drive the pressing mechanism to move to press the carrier core plate by matching the driving mechanism with the pressing mechanism, and the carrier core plate can be pressed when a chip is packaged, so that the flatness of the carrier core plate is ensured, the chip solder is prevented from generating deviation or bubbles, and the yield of the chip is improved.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic perspective view of another embodiment of the present invention.
FIG. 3 is an enlarged view of A in FIG. 2 according to the present invention.
Fig. 4 is a schematic view of the connection structure of the feeding mechanism and the pressing mechanism of the present invention.
Fig. 5 is another perspective view schematically showing the connecting structure of the feeding mechanism and the pressing mechanism according to the present invention.
Fig. 6 is a schematic perspective view of the pressing plate a of the present invention.
Fig. 7 is a schematic view of the connection structure of the feeding mechanism and the pressing mechanism of the present invention.
Fig. 8 is a schematic structural view of an embodiment of the pressing mechanism of the present invention having two pressing plates a.
Fig. 9 is a schematic structural view of the carrier core board of the present invention.
The text labels in the figures are represented as: 1. a frame; 2. a mounting seat; 3. a first slide rail; 4. a first slider; 5. a cylinder; 6. a connecting rod; 7. a motor; 8. a protective cover; 9. a first gear; 10. a second gear; 11. a carrier board placing box; 12. a rotating arm; 13. a fixed block; 14. a shifting sheet; 15. poking holes; 16. rotating the block; 17. briquetting; 18. a pulley; 19. a lever arm; 20. a connecting plate; 21. a second slider; 22. a second slide rail; 23. a support plate; 24. a threaded rod; 25. a nut; 26. swinging arms; 27. connecting blocks; 28. a bolt; 29. a pressing plate b; 30. connecting grooves; 31. a solder hole; 32. a movable hole; 33. a carrier board; 34. a return spring.
Detailed Description
The following detailed description of the present invention is given for the purpose of better understanding technical solutions of the present invention by those skilled in the art, and the present description is only exemplary and explanatory and should not be construed as limiting the scope of the present invention in any way.
In order to prevent the chip carrier board from shaking during chip packaging, the present embodiment provides an automated pressing system for soft solder package chip on the chip carrier board, as shown in fig. 1 to 7, including:
the output end of the driving mechanism is fixedly connected with a connecting rod 6, and the driving mechanism can drive the connecting rod 6 to do axial front-back movement and rotary movement.
The feeding mechanism is used for pushing the carrier plate 33 to move back and forth in the axial direction, the feeding mechanism is installed on the connecting rod 6, and the driving mechanism drives the feeding mechanism to move through the connecting rod 6.
The pressing mechanism is used for pressing the carrier core plate 33 when soft solder is used for packaging the chip, the carrier core plate 33 is as shown in fig. 9, the pressing mechanism is installed on the connecting rod 6, the driving mechanism drives the pressing mechanism to press the carrier core plate 33 through the connecting rod 6, the pressing mechanism is matched with the feeding mechanism for use, and the driving mechanism drives the feeding mechanism to push the carrier core plate 33 to move back and forth in the axial direction through the connecting rod 6, and the pressing mechanism is lifted. The feeding mechanism can push the carrier core plate 33 to move back and forth in the axial direction by matching the driving mechanism with the feeding mechanism, the driving mechanism can drive the pressing mechanism to move to press the carrier core plate 33 by matching the driving mechanism with the pressing mechanism, and the carrier core plate 33 can be pressed when a chip is packaged, so that the flatness of the carrier core plate 33 is ensured, the chip solder is prevented from generating deviation or bubbles, and the yield of the chip is improved.
The driving mechanism, the feeding mechanism and the pressing mechanism have the following specific structures:
in the embodiment, the device also comprises a frame 1 and a core carrying plate placing box 11, wherein the core carrying plate placing box 11 is arranged at the top of the frame 1, the core carrying plate 33 is arranged in the inner cavity of the core carrying plate placing box 11 in a sliding way, wherein, actuating mechanism includes mount pad 2, first slide rail 3, first slider 4, connecting rod 6, motor 7, first gear 9 and second gear 10, mount pad 2 installs in frame 1, first slide rail 3 installs on mount pad 2, first slider 4 slidable installs on first slide rail 3, the bottom and the mount pad 2 fixed connection of cylinder 5, the output and the first slider 4 fixed connection of cylinder 5, the one end and the first slider 4 of connecting rod 6 rotate to be connected, second gear 10 cover is established on connecting rod 6, motor 7 installs on first slider 4, the output of motor 7 and the fixed connection of first gear 9, first gear 9 meshes with second gear 10. The driving mechanism further comprises a protective cover 8, the protective cover 8 is fixed with the first sliding block 4, and the motor 7, the first gear 9 and the second gear 10 are located in an inner cavity of the protective cover 8. When the device is used, the cylinder 5 is opened, the output end of the cylinder 5 drives the first sliding block 4 to slide on the first sliding rail 3, the first sliding block 4 drives the connecting rod 6 thereon, the motor 7 and the protective cover 8 move together, the connecting rod 6 can be pushed to do axial motion, the connecting rod 6 can drive the feeding mechanism and the pressing mechanism to do axial motion same as that of the connecting rod 6, in order to enable the connecting rod 6 to rotate, and further drive the feeding mechanism and the pressing mechanism to do rotating motion, the motor 7 is opened, the output end of the motor 7 drives the first gear 9 to rotate, the first gear 9 is meshed with the second gear 10, the second gear 10 drives the connecting rod 6 to rotate, and the connecting rod 6 can drive the feeding mechanism and the pressing mechanism to do rotating motion.
In addition, in this embodiment, the feeding mechanism includes a rotating arm 12, a fixed block 13 and a shifting piece 14, one end of the rotating arm 12 is fixedly connected with the connecting rod 6, the other end of the rotating arm 12 is fixedly connected with the fixed block 13, the shifting piece 14 is installed on the fixed block 13, a shifting hole 15 is formed in the top of the core carrying board placing box 11, the bottom of the shifting piece 14 penetrates through the bottom of the shifting hole 15, and the shifting piece 14 is used for shifting the core carrying board 33 to move. When the carrier core plate 33 is pushed forward in use, the connecting rod 6 drives the rotating arm 12 to rotate, the rotating arm 12 drives the fixed block 13 and the shifting piece 14 to rotate, so that the bottom of the shifting piece 14 rotates to the opening of the carrier core plate 33, then the connecting rod 6 drives the rotating arm 12 to move axially (forward), so that the rotating arm 12 drives the fixed block 13 and the shifting piece 14 to move axially (forward), the shifting piece 14 pulls the carrier core plate 33 to move forward, then the connecting rod 6 drives the rotating arm 12 to rotate, the rotating arm 12 drives the fixed block 13 and the shifting piece 14 to rotate, so that the bottom of the shifting piece 14 rotates out of the opening of the carrier core plate 33, then the connecting rod 6 drives the rotating arm 12 to move axially (backward), so that the rotating arm 12 drives the fixed block 13 and the shifting piece 14 to move axially (backward), the connecting rod 6 drives the rotating arm 12 to rotate, so that the bottom of the shifting, the above-mentioned steps are repeated in this way, so that the carrier plate 33 can continuously move forward intermittently.
In order to match with the intermittent continuously forward-moving core carrying plate 33 and facilitate the compression of the core carrying plate 33, in the embodiment, the compression mechanism comprises a rotating block 16, a pressing block 17, a pulley 18, a lever arm 19, a connecting plate 20, a second sliding block 21, a second sliding rail 22, a return spring 34 and a compression plate a, the lever arm 19 has a lever effect, the rotating block 16 is fixedly connected to the connecting rod 6, the pressing block 17 is fixedly connected to the rotating block 16, the pressing block 17 is used for adjusting the height of the pulley 18, one end of the lever arm 19 is rotatably connected to the pulley 18, the top of the pulley 18 is in contact with the pressing block 17, the other end of the lever arm 19 is fixedly connected to the connecting plate 20, the middle of the lever arm 19 is rotatably connected to the frame 1 through a rotating shaft, the top of the return spring 34 is fixedly connected to the bottom of the lever arm 19, one end of the connecting plate 20 is fixedly connected with the second slider 21, the second slider 21 is slidably disposed on the second slide rail 22, the second slide rail 22 is fixedly connected to the rack 1, the pressing plate a is detachably mounted on the second slider 21, and the pressing plate a is used for pressing the carrier core plate 33. When the core carrying plate 33 is pulled by the shifting piece 14 to move forwards in use, the connecting rod 6 drives the rotating arm 12 to rotate at the moment, the rotating arm 12 drives the fixed block 13 and the shifting piece 14 to rotate, so that the bottom of the shifting piece 14 rotates to the opening of the core carrying plate 33, synchronously, the connecting rod 6 drives the rotating block 16 and the pressing block 17 to rotate, the pressing block 17 rotates to press the pulley 18 downwards, the pulley 18 enables one end of the lever arm 19 to descend, meanwhile, the return spring 34 is compressed by the one end, the other end of the lever arm 19 ascends, the lever arm 19 drives the connecting plate 20 to ascend, the connecting plate 20 drives the second sliding block 21 to slide and ascend on the second sliding rail 22, the second sliding rail 22 drives the pressing plate a to ascend, the bottom of the pressing plate a is separated from the core carrying plate 33, the feeding mechanism can further facilitate the forward movement of the core carrying plate 33, after the forward movement is finished, the connecting, at this time, the pressing block 17 rises, the return spring 34 extends, the return spring 34 pushes the lower end of the lever arm 19 to return, the dead weight of the second sliding block 21 drives the pressing plate a to descend, and the higher end of the lever arm 19 also descends, so that the pressing plate a presses the carrier plate 33. And then the purpose of pressing the carrier plate 33 by the pressing mechanism in cooperation with the feeding mechanism is achieved. The carrier core plate 33 is pressed while the solder is applied, so that the use is very quick and stable. The flatness of the carrier plate 33 is ensured, deviation or bubbles of chip solder are avoided, and the yield of the chip is improved.
The present invention further provides a specific structure of the pressing plate a in the embodiment, as shown in fig. 6, the pressing plate a includes a swing arm 26, a connection block 27, a bolt 28, a pressing plate b29 and a connection slot 30, the connection block 27 is detachably mounted at one end of the swing arm 26 through the bolt 28, a user can unscrew the bolt 28 to separate the connection block 27 and the swing arm 26, the pressing plate b29 is fixedly connected to the connection block 27, the connection slot 30 is disposed at the other end of the swing arm 26, the second slider 21 is fixedly connected to the support plate 23, both sides of the top of the support plate 23 are fixedly connected to threaded rods 24, the threaded rods 24 pass through the connection slot 30, the threaded rods 24 are threadedly connected to nuts 25, the nuts 25 are used for pressing the swing arm 26, and the swing arm 26 is. When the swing arm device is installed, the threaded rod 24 penetrates through the connecting groove 30, the nut 25 is screwed on the threaded rod 24, the nut 25 compresses the fixed swing arm 26, the swing arm 26 is fixed on the supporting plate 23, the swing arm 26 is connected with the second sliding block 21, the second sliding block 21 can drive the swing arm 26 to move, and the swing arm 26 can drive the compression plate b29 to compress the core carrying plate 33. In this embodiment, the carrier board placing box 11 is provided with a movable hole 32 adapted to the pressing plate b29, so that the swing arm 26 can move on the carrier board placing box 11 conveniently, the top of the carrier board placing box 11 is provided with a solder hole 31, and the solder hole 31 is used for inserting soft solder packaging equipment into the carrier board placing box 11 to package a soft solder chip. In other embodiments, the pressing plates a may be provided in two, respectively on two sides of the solder holes 31, as shown in fig. 8, to enhance the effect of pressing the carrier board 33.
In conclusion, the feeding mechanism can push the carrier core plate 33 to move back and forth in the axial direction by matching the driving mechanism with the feeding mechanism, the driving mechanism can drive the pressing mechanism to move so as to press the carrier core plate 33 by matching the driving mechanism with the pressing mechanism, the carrier core plate 33 can be pressed when a chip is packaged, the flatness of the carrier core plate 33 is ensured, deviation or bubbles of a chip solder are avoided, and the yield of the chip is improved.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts of the present invention. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes may be made without departing from the principle of the present invention, and the technical features described above may be combined in a suitable manner; such modifications, variations, combinations, or adaptations of the invention using its spirit and scope, as defined by the claims, may be directed to other uses and embodiments.
Claims (7)
1. An automated clamping system for a die-carrier soft solder package chip, comprising:
the output end of the driving mechanism is fixedly connected with a connecting rod (6), and the driving mechanism can drive the connecting rod (6) to axially move back and forth and rotate;
the feeding mechanism is used for pushing the core carrying plate to move back and forth in the axial direction, the feeding mechanism is arranged on the connecting rod (6), and the driving mechanism drives the feeding mechanism to move through the connecting rod (6);
the pressing mechanism is used for pressing the core carrying plate when soft solder is used for packaging the chip, the pressing mechanism is arranged on the connecting rod (6), the driving mechanism drives the pressing mechanism to press the core carrying plate through the connecting rod (6), the pressing mechanism is matched with the feeding mechanism for use, and the pressing mechanism is lifted when the driving mechanism drives the feeding mechanism to push the core carrying plate to move back and forth in the axial direction through the connecting rod (6);
the core carrying plate placing box comprises a rack (1) and a core carrying plate placing box (11), wherein the core carrying plate placing box (11) is installed at the top of the rack (1), the core carrying plate is slidably arranged in an inner cavity of the core carrying plate placing box (11), the driving mechanism comprises an installation seat (2), a first sliding rail (3), a first sliding block (4), a connecting rod (6), a motor (7), a first gear (9) and a second gear (10), the installation seat (2) is installed on the rack (1), the first sliding rail (3) is installed on the installation seat (2), the first sliding block (4) is slidably installed on the first sliding rail (3), the core carrying plate placing box further comprises an air cylinder (5), the bottom of the air cylinder (5) is fixedly connected with the installation seat (2), the output end of the air cylinder (5) is fixedly connected with the first sliding block (4), one end of the connecting rod (6) is rotatably connected with the first sliding block (4), the second gear (10) is sleeved on the connecting rod (6), the motor (7) is installed on the first sliding block (4), the output end of the motor (7) is fixedly connected with the first gear (9), and the first gear (9) is meshed with the second gear (10);
the feeding mechanism comprises a rotating arm (12), a fixed block (13) and a shifting piece (14), one end of the rotating arm (12) is fixedly connected with the connecting rod (6), the other end of the rotating arm (12) is fixedly connected with the fixed block (13), the shifting piece (14) is installed on the fixed block (13), a shifting hole (15) is formed in the top of the carrier plate placing box (11), the bottom of the shifting piece (14) penetrates through the bottom of the shifting hole (15), and the shifting piece (14) is used for shifting the carrier plate to move;
the pressing mechanism comprises a rotating block (16), a pressing block (17), a pulley (18), a lever arm (19), a connecting plate (20), a second sliding block (21), a second sliding rail (22), a reset spring (34) and a pressing plate a, wherein the rotating block (16) is fixedly connected onto the connecting rod (6), the pressing block (17) is fixedly connected onto the rotating block (16), the pressing block (17) is used for adjusting the height of the pulley (18), one end of the lever arm (19) is rotatably connected with the pulley (18), the top of the pulley (18) is in contact with the pressing block (17), the other end of the lever arm (19) is fixedly connected with the connecting plate (20), the middle part of the lever arm (19) is rotatably connected with the rack (1) through a rotating shaft, the top of the reset spring (34) is fixedly connected with the bottom of the lever arm (19), and the lever arm (19) is located at the bottom of the pulley (18, the reset spring (34) is used for resetting the lever arm (19), one end of the connecting plate (20) is fixedly connected with the second sliding block (21), the second sliding block (21) is slidably arranged on the second sliding rail (22), the second sliding rail (22) is fixedly connected with the rack (1), the pressing plate a is detachably arranged on the second sliding block (21), and the pressing plate a is used for pressing the carrier plate.
2. An automated clamping system for a chip-carrier-board soft solder package chip as claimed in claim 1, characterized in that said drive mechanism further comprises a protective cover (8), said protective cover (8) being fixed to said first slide (4), said motor (7), said first gear (9) and said second gear (10) being located in an inner cavity of said protective cover (8).
3. The automated pressing system for the soft solder package chip of the chip carrier board according to claim 2, wherein the pressing plate a comprises a swing arm (26), a connecting block (27), a bolt (28), a pressing plate b (29) and a connecting slot (30), the connecting block (27) is detachably mounted at one end of the swing arm (26) through the bolt (28), the pressing plate b (29) is fixedly connected to the connecting block (27), the connecting slot (30) is arranged at the other end of the swing arm (26), the second slider (21) is fixedly connected with a supporting plate (23), both sides of the top of the supporting plate (23) are fixedly connected with a threaded rod (24), the threaded rod (24) passes through the connecting slot (30), the threaded rod (24) is in threaded connection with a nut (25), and the nut (25) is used for pressing the swing arm (26), the swing arm (26) is fixedly connected to the second slide block (21).
4. An automated clamping system for a chip-carrier soft solder package chip as claimed in claim 3, wherein said chip-carrier placing box (11) is provided with a movable hole (32) adapted to said clamping plate b (29).
5. The automated clamping system for a chip-on-chip solder package as claimed in claim 4, wherein the top of the chip-on-chip placement box (11) is opened with solder holes (31), the solder holes (31) being used for inserting the chip-on-chip solder package into the chip-on-chip placement box (11) by a solder packaging device.
6. An automated clamping system for a chip-on-chip soft solder package as claimed in claim 1, characterized in that the other end of the tie-bar (6) is bearing mounted to the frame (1).
7. The automated clamping system for a chip-in-chip solder package as recited in claim 1, wherein said clamping mechanism is two in number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010770268.9A CN111863642B (en) | 2020-08-04 | 2020-08-04 | Automatic pressing system for soft solder packaging chip of carrier core plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010770268.9A CN111863642B (en) | 2020-08-04 | 2020-08-04 | Automatic pressing system for soft solder packaging chip of carrier core plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111863642A CN111863642A (en) | 2020-10-30 |
| CN111863642B true CN111863642B (en) | 2021-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010770268.9A Active CN111863642B (en) | 2020-08-04 | 2020-08-04 | Automatic pressing system for soft solder packaging chip of carrier core plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115872096B (en) * | 2022-11-23 | 2023-11-28 | 苏州锐杰微科技集团有限公司 | Full-automatic feeding equipment and feeding method for chip packaging production line |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104637830A (en) * | 2014-12-31 | 2015-05-20 | 吴华 | Soft solder die bonder of microelectronic chip |
| CN110931398A (en) * | 2019-12-19 | 2020-03-27 | 深圳市意沨科技有限公司 | Packaging equipment |
| CN210668303U (en) * | 2019-12-18 | 2020-06-02 | 江苏创源电子有限公司 | Packaging device |
-
2020
- 2020-08-04 CN CN202010770268.9A patent/CN111863642B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104637830A (en) * | 2014-12-31 | 2015-05-20 | 吴华 | Soft solder die bonder of microelectronic chip |
| CN210668303U (en) * | 2019-12-18 | 2020-06-02 | 江苏创源电子有限公司 | Packaging device |
| CN110931398A (en) * | 2019-12-19 | 2020-03-27 | 深圳市意沨科技有限公司 | Packaging equipment |
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| CN111863642A (en) | 2020-10-30 |
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