CN113539872B

CN113539872B - Semiconductor element translation type testing, coding and taping integrated machine

Info

Publication number: CN113539872B
Application number: CN202110714277.0A
Authority: CN
Inventors: 单忠频; 薛克瑞; 周圣军; 缪来虎; 胡红坡; 陈树钊; 康茂
Original assignee: Guangdong Gede Intelligent Equipment Co ltd
Current assignee: Guangdong Gede Intelligent Equipment Co ltd
Priority date: 2021-06-25
Filing date: 2021-06-25
Publication date: 2022-02-22
Anticipated expiration: 2041-06-25
Also published as: CN113539872A

Abstract

The invention discloses a translational testing, coding and taping integrated machine for semiconductor elements, which comprises a workbench, a feeding transition testing jig, a long-time testing area and a discharging transition testing jig, wherein the feeding transition testing jig, the long-time testing area and the discharging transition testing jig are sequentially arranged on the workbench from left to right; the feeding transition test fixture is connected with the long-time test fixture through a feeding opening clamping manipulator, the discharging transition test fixture is connected with the discharging opening clamping manipulator, an element carrying device is arranged on the upper stream of the discharging transition test fixture, and a marking device and a braid packaging device are sequentially arranged on the lower stream of the discharging transition test fixture. The semiconductor element translation type testing, coding and taping integrated machine provided by the invention can be used for fully automatically completing the loading assembly, quality detection, marking and taping packaging of semiconductor elements, so that one-stop production post-processing of semiconductor devices is realized, and the detection and packaging efficiency and intellectualization are greatly improved.

Description

Semiconductor element translation type testing, coding and taping integrated machine

Technical Field

The invention relates to the field of semiconductor performance detection equipment, in particular to a translation type testing, coding and taping integrated machine for a semiconductor element.

Background

In the production and manufacture of semiconductors, in order to ensure the performance reliability of semiconductor elements of certain models, the semiconductor elements of such models need to be subjected to short-time test and long-time test, the semiconductor elements can be packaged after being qualified after the short-time test and the long-time test, because the semiconductor elements need to be placed on a special test fixture for long-time test, the semiconductor elements are in good contact with connecting probes of the test fixture in the long-time test process, the test fixture generally adopts a press-buckling mode, the test fixture of the press-buckling type needs to take and place the semiconductor elements manually, the production efficiency is low, and the process of manually taking and placing the semiconductor elements also has certain influence on the quality of the semiconductor elements. And the efficiency of subsequent marking and packaging of the semiconductor element is also influenced.

It is seen that improvements and enhancements to the prior art are needed.

Disclosure of Invention

In view of the defects of the prior art, the invention aims to provide a translational testing, coding and taping integrated machine for a semiconductor element, which aims to complete the feeding assembly, quality detection, marking and taping packaging of the semiconductor element fully automatically, realize one-stop production post-processing of the semiconductor element, and greatly improve the efficiency and intellectualization of detection and packaging.

In order to achieve the purpose, the invention adopts the following technical scheme:

a translational testing, coding and taping integrated machine for semiconductor elements comprises a workbench, a feeding transition testing jig, a long-time testing area and a discharging transition testing jig, wherein the feeding transition testing jig, the long-time testing area and the discharging transition testing jig are sequentially arranged on the workbench from left to right; the feeding transition test fixture and the long-time test fixture are connected through a feeding unclamping manipulator, the discharging transition test fixture and the long-time test fixture are connected through a discharging unclamping manipulator, an element carrying device is arranged at the upstream of the feeding transition test fixture and used for carrying semiconductor elements on a material tray to the feeding transition test fixture for testing, and a marking device and a braid packaging device are sequentially arranged at the downstream of the discharging transition test fixture; the blanking transition test fixture is connected with the marking device through a marking transfer manipulator, and the marking device is connected with the braid packaging device through a packaging transfer manipulator; each long-time test fixture comprises a test base, a test circuit element and an automatic clamp device, wherein the test circuit element and the automatic clamp device are arranged on the test base, and the automatic clamp device can be opened by the feeding and clamping manipulator and the discharging and clamping manipulator to complete the transfer of the semiconductor element.

The automatic clamping device comprises two clamping jaws symmetrically arranged on the testing base, each clamping jaw comprises a clamping part, a connecting part and a bent part, the clamping parts, the connecting parts and the bent parts are sequentially connected from top to bottom, the connecting parts are rotatably connected with the testing base, and elastic members used for driving the clamping parts of the two clamping jaws to be close to each other are arranged on the testing base.

The material loading is opened and is pressed from both sides manipulator includes that the x axle slides the module, set up the first frame on the x axle slides the module, set up the y axle on first frame and slide the module, set up the second frame on the y axle slides the module, set up and open on the second frame and press from both sides the subassembly and the z axle slides the module, set up the suction means on the z axle slides the module.

The opening and clamping assembly comprises an opening and clamping mounting plate arranged on the second rack, a z-axis sliding plate connected with the opening and clamping mounting plate in a sliding mode, and an unlocking cylinder used for driving the z-axis sliding plate to move up and down, wherein two L-shaped supporting arms corresponding to the positions of the clamping jaws are arranged on the z-axis sliding plate, the bottom of each L-shaped supporting arm is provided with an unlocking device, the unlocking device comprises an unlocking support with a lower cavity, and a supporting shaft and a plurality of pressing wheels which are horizontally arranged in the lower cavity are rotatably sleeved on the supporting shaft.

The suction mechanism comprises a suction mounting seat, a shaft sleeve vertically arranged on the suction mounting seat, and a guide seat arranged at the bottom of the shaft sleeve, wherein a non-circular axial through hole is arranged on the shaft sleeve, an inner shaft matched with the axial through hole in shape is inserted into the axial through hole, the bottom of the inner shaft extends out of the axial through hole downwards and is connected with a sucker mounting seat, a sucker is arranged at the bottom of the sucker mounting seat, a buffer spring is sleeved on the inner shaft and is located between the sucker mounting seat and the guide seat, a limiting clamp spring is arranged at the top of the inner shaft, an axial channel is arranged on the inner shaft, the bottom of the axial channel is communicated with the sucker, and the top of the axial channel is connected with an air faucet.

The component carrying device comprises a first cart, a second cart, a taking manipulator and a tray y-axis conveying mechanism, wherein the taking manipulator and the tray y-axis conveying mechanism are arranged on a workbench, the tray y-axis conveying mechanism is provided with a tray feeding station, a taking station and a tray recovery station, a taking jacking mechanism is arranged below the taking station, a first tray z-axis lifting mechanism is arranged below the tray feeding station, a second tray z-axis lifting mechanism is arranged below the tray recovery station, the first tray z-axis lifting mechanism is connected with the first tray x-axis conveying mechanism, the second tray z-axis lifting mechanism is connected with the second tray x-axis conveying mechanism, the taking manipulator is used for carrying semiconductor components on the taking station to a test fixture to realize quality test, a plurality of trays filled with the semiconductor components are placed on the first cart, and the first tray x-axis conveying mechanism is used for carrying all trays on the first cart to the first tray z-axis conveying mechanism at one time A lifting mechanism; and the second material tray x-axis conveying mechanism is used for conveying the empty material trays on the second material tray z-axis lifting mechanism to the second cart at one time.

The first cart comprises a movable frame and two limiting top plates symmetrically arranged at the top of the frame; each limiting top plate is provided with a limiting side plate, a material tray storage cavity for stacking material trays is arranged between the two limiting side plates, and the limiting top plate is used for bearing the material trays; the two limit top plates are arranged separately to form a lifting avoiding channel.

The first tray x-axis conveying mechanism comprises a fixed support, an x-axis conveying module arranged on the fixed support, a moving support arranged on the x-axis conveying module, a tray device capable of moving up and down relative to the moving support, and a tray cylinder in driving connection with the tray device, and the x-axis sliding mechanism is used for driving the moving support to move left and right; the first material tray z-axis lifting mechanism comprises a z-axis conveying module and a C-shaped bracket arranged on the z-axis sliding mechanism, the z-axis sliding mechanism is used for driving the C-shaped bracket to move up and down, two symmetrical and parallel support arms are arranged on the inner side of the C-shaped bracket, a guide strip is arranged on the upper surface of each support arm, a plurality of positioning bulges are arranged on the upper surface of each support arm, and positioning holes matched with the positioning bulges are formed in the bottom of the material tray; the charging tray y-axis conveying mechanism comprises two symmetrical conveying clamping blocks and a clamping cylinder for driving the two conveying clamping blocks to get close to or get away from each other, each clamping cylinder is installed on one y-axis conveying module, the two y-axis conveying modules are parallel to each other and are arranged separately, and the charging tray feeding station, the material taking station and the charging tray recycling station are located between the two y-axis conveying modules; get material climbing mechanism and include fixed platform, the layer board that can reciprocate relatively fixed platform, set up on fixed platform and be used for driving the jacking cylinder that the layer board reciprocated, the layer board is located between two y axle conveying modules.

The feeding transition test fixture and the discharging transition test fixture comprise a test base, a test circuit element arranged on the test base, an automatic clamp device, a supporting seat arranged beside the test base and swing rods arranged on two sides of the supporting seat, wherein the inner side surfaces of the two swing rods are in pivot connection with the supporting seat, one end parts of the two swing rods are fixedly connected with each other through swing shafts, and the other end parts of the swing rods are provided with rotatable pinch rollers.

The marking device comprises a marking platform, a parallel double-acting air claw transversely arranged on the marking platform, and a laser marker arranged above the marking platform, wherein the parallel double-acting air claw is provided with two marking alignment blocks symmetrically arranged, and the parallel double-acting air claw is used for driving the two marking alignment blocks to be close to or away from each other.

Has the advantages that:

the semiconductor element translation type testing, coding and taping integrated machine provided by the invention has the following advantages:

1. the semiconductor element can be packaged and delivered only after being qualified after two short-time tests and one long-time test, and the delivery performance quality of the semiconductor element is greatly ensured through multiple detection procedures;

2. by the mutual matching of the component carrying device and various manipulators, the automatic assembly test and the transfer after test of the semiconductor component are completed automatically in a translation mode, the carrying labor force is saved, and the problems caused by manual carrying of the semiconductor component are eliminated;

3. the automatic clamping device has an automatic clamping function, the feeding and unclamping manipulator and the discharging and unclamping manipulator can both open the automatic clamping device to finish the transfer of the semiconductor element, so that the semiconductor element is ensured to be in good contact with a connecting probe of the long-time test fixture in the long-time test process, and the test reliability is high;

4. when the loading and unclamping manipulator carries out loading on all test stations on the workbench one by one to realize long-time test, a semiconductor element on the first test station just completes the long-time test, the unloading and unclamping manipulator transfers the semiconductor element which completes the detection according to the sequence of the test stations, the loading and unclamping manipulator transfers the semiconductor element on one test station, and the loading and unclamping manipulator immediately installs a semiconductor element to be detected on the long-time test station to be operated, so that regular and compact test arrangement of loading and unloading is formed, the time for loading each long-time test station is greatly reduced, and the production efficiency is improved;

5. the element carrying device, the testing device, the marking device and the braid packaging device are sequentially combined, so that one-stop production post-processing of the semiconductor device is realized, and the efficiency and the intellectualization of detection and packaging are greatly improved.

Drawings

Fig. 1 is a perspective view of a semiconductor element translation type testing, coding and taping integrated machine.

Fig. 2 is a partially enlarged view of the region L in fig. 1.

Fig. 3 is a partially enlarged view of the region L in fig. 2.

Fig. 4 is a perspective view of the first cart.

Fig. 5 is a perspective view of the first tray x-axis transport mechanism and the first tray z-axis lifting mechanism.

Fig. 6 is a perspective view of the component handling apparatus.

Fig. 7 is a partially enlarged view of the region L in fig. 6.

Fig. 8 is a perspective view of a reclaiming robot.

Fig. 9 is a perspective view of the feeding transition test fixture.

Fig. 10 is a perspective view of the long-time test fixture.

Fig. 11 is a schematic structural diagram of a long-time testing fixture.

FIG. 12 is a schematic diagram of a long-time test area on a work bench.

Fig. 13 is a perspective view of the suction mechanism.

Fig. 14 is a schematic view of the internal structure of the suction mechanism.

Fig. 15 is a schematic structural diagram of components of the feeding and unclamping robot.

Fig. 16 is a perspective view of a rotatable suction mechanism.

Fig. 17 is a schematic view of the internal structure of the rotatable sucking means.

Fig. 18 is a perspective view of a rotatable suction mechanism.

Fig. 19 is a schematic diagram of the open clamp assembly and the suction mechanism moving to above the long test fixture.

Fig. 20 is a schematic structural view of an alignment stage.

Fig. 21 is a perspective view of the braid packing device.

Detailed Description

The invention provides a translational testing, coding and taping integrated machine for a semiconductor element, which is further described in detail below by referring to the attached drawings and embodiments in order to make the purpose, technical scheme and effect of the invention clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the scope of the invention.

Herein, the extending direction of the x-axis is the left-right direction, the extending direction of the y-axis is the front-back direction, and the extending direction of the z-axis is the up-down direction.

Referring to fig. 1-12, the present invention provides a semiconductor device translation type testing, coding and taping integrated machine, which comprises a workbench 1, a feeding transition testing jig 21, a long-time testing area 11 and a discharging transition testing jig 22, wherein the feeding transition testing jig 21, the long-time testing area 11 and the discharging transition testing jig 22 are sequentially arranged on the workbench 1 from left to right, and a plurality of long-time testing jigs 3 are arranged on the long-time testing area 11 in a rectangular array manner; the feeding transition test fixture 21 is connected with the long-time test fixture 3 through a feeding unclamping manipulator 4, the blanking transition test fixture 22 is connected with the long-time test fixture 3 through a blanking unclamping manipulator 5, an element carrying device 8 is arranged at the upstream of the feeding transition test fixture 21, the element carrying device 8 is used for carrying semiconductor elements on a material tray to the feeding transition test fixture 21 for testing, and a marking device 62 and a braid packaging device 72 are sequentially arranged at the downstream of the blanking transition test fixture 22; unloading transition test tool 22 and marking device 62 link up through marking transfer manipulator 61, and marking device 62 and braid packing device 72 link up through packing transfer manipulator 71, every long-time test tool 3 includes test base 31, sets up test circuit component and automatic folder 33 on test base 31, material loading is opened and is pressed from both sides manipulator 4 and unloading is opened and is pressed from both sides manipulator 5 homoenergetic and make automatic folder open the completion and shift semiconductor element. It should be noted that only a part of the long-time testing jig 3 is schematically shown on the table 1 in fig. 1 and 12.

The working process of the translational testing, coding and taping integrated machine for the semiconductor elements is briefly provided, in order to facilitate a control system to form a control execution logic, N long-time testing jigs 3 are arranged, the long-time testing jigs 3 are arranged in a rectangular array mode, each long-time testing jig 3 represents a testing station, all the long-time testing jigs 3 are marked with long-time testing station numbers one by one in a line-by-line and left-to-right mode, namely the number of the first long-time testing station is 1, the number of the last long-time testing station is N, the time length of long-time testing required by each semiconductor element is t1, and it needs to be explained that the time length of long-time testing is within the range of 30 minutes to one hour, namely 30min < t1 < 1 h. Before the detection is prepared, all long-time test fixtures 3 on the workbench 1 are in a state to be operated; the working steps are as follows:

s001, the component carrying device 8 carries the semiconductor component 101 on the tray 10 to the feeding transition test fixture 21 for testing, the feeding transition test fixture 21 carries out a first short-time test on the semiconductor component 101, and the time length of the first short-time test is 5-10S;

s002: the loading and unclamping mechanical arm 4 starts to transfer the semiconductor element 101, and if the first short-time test result of the semiconductor element 101 is unqualified, the loading and unclamping mechanical arm 4 transfers the semiconductor element 101 to an unqualified collection tray 12; if the first short-time test result of the semiconductor element 101 is qualified, the loading and unclamping manipulator 4 firstly absorbs the semiconductor element 101 on the loading transition test fixture 21 and then transfers the semiconductor element to the upper part of the long-time test fixture 3 of the No. 1 long-time test station, the loading and unclamping manipulator 4 enables the automatic clamp device 33 to be in an open state by pressing the automatic clamp device 33, then the semiconductor element 101 is placed on the long-time test fixture 3, the loading and unclamping manipulator 4 cancels the pressing of the automatic clamp device 33, the automatic clamp device 33 resets to be in a closed state, the semiconductor element 101 is automatically clamped, and the semiconductor element 101 is ensured to be in good electrical connection contact with the test circuit element;

s003: repeating the working mode of the step S002 by the feeding and clamping-opening mechanical arm 4, sequentially transferring the semiconductor elements to the corresponding long-time test jig 3 according to the serial number sequence of the test stations to realize the long-time performance test until the last test station starts to perform the long-time performance test, wherein the time length t2 from the start of the feeding and clamping-opening mechanical arm 4 to the current working time is t2 which is more than or equal to t 1; at the moment, the semiconductor element on the No. 1 test station has finished long-time performance test;

s004: the blanking clamp-opening mechanical arm 5 unloads the semiconductor element on the No. 1 long-time testing station, and if the long-time testing result of the semiconductor element is unqualified, the blanking clamp-opening mechanical arm 5 transfers the semiconductor element 101 to an unqualified collecting tray 12; if the long-time test result of the semiconductor element 101 is qualified, the blanking clamp opening manipulator 5 transfers the semiconductor element 101 to the blanking transition test fixture 22, and the blanking transition test fixture 22 performs a second short-time test on the semiconductor element 101, wherein the time length of the second short-time test is 5-10 s;

s005, the feeding and unclamping manipulator 4 carries out feeding test on the long-time test fixture 3 on the No. 1 test station again;

s006, the blanking unclamping manipulator 5 and the loading unclamping manipulator 4 circularly repeat the working modes of S004 and S005, namely the blanking unclamping manipulator 5 sequentially unloads and transfers the semiconductor elements on the next long-time test station according to the serial number sequence of the test stations, and the long-time test station blanked by the blanking unclamping manipulator 5 is in a waiting working state; then the feeding and clamping manipulator 4 immediately carries out feeding test on the long-time test fixture 3 on the long-time test station. And S007, if the second short-time test result of the semiconductor element is qualified, transferring the semiconductor element to a marking device 62 by the marking transfer manipulator 61, and engraving the number information by the marking device 62 in a laser mode. And if the semiconductor element fails in the second short-time test result, transferring the semiconductor element to a failed collecting tray by the marking transfer manipulator 61, transferring the semiconductor element on the marking device 62 to the braid packaging device 72 by the packaging transfer manipulator 71, and braiding and packaging the semiconductor element by the braid packaging device 72S 008.

Compared with the prior art, the semiconductor element translation type testing, coding and taping integrated machine provided by the invention has the following advantages:

1. the semiconductor element can be packaged and delivered after passing the test of two short-time tests and one long-time test, the quality of delivery performance of the semiconductor element is greatly ensured by a plurality of detection procedures,

2. by the mutual matching of the component carrying device 8 and various manipulators, the automatic assembly test and the transfer after test of the semiconductor component are automatically completed in a translation mode, the carrying labor force is saved, and the problems caused by manual carrying of the semiconductor component are eliminated;

3. the automatic clamping device 33 has an automatic clamping function, the feeding and unclamping manipulator 4 and the discharging and unclamping manipulator 5 can open the automatic clamping device to complete the transfer of the semiconductor element, so that the semiconductor element is ensured to be in good contact with the connecting probe 325 of the long-time test fixture 3 in the long-time test process, and the test reliability is high;

4. when the feeding and clamping opening mechanical arm 4 carries out feeding on all the test stations on the workbench 1 one by one to realize long-time test, the semiconductor element on the first test station just completes the long-time test, the discharging and clamping opening mechanical arm 5 transfers the semiconductor element completing the detection according to the sequence of the test stations, the feeding and clamping opening mechanical arm 4 transfers the semiconductor element on one test station, and the feeding and clamping opening mechanical arm 4 immediately installs a semiconductor element to be detected on the long-time test station to be operated, so that regular and compact test feeding and discharging arrangement is formed, the feeding time of each long-time test station is greatly reduced, and the production efficiency is improved.

5. The component carrying device 8, the testing device, the marking device 62 and the braid packaging device 72 are sequentially combined, so that one-stop production post-processing of the semiconductor device is realized, and the detection and packaging efficiency and the intellectualization are greatly improved.

Specifically, referring to fig. 10 and 11, the automatic clamp 33 includes two clamping jaws 331 symmetrically disposed on the testing base 31, each clamping jaw 331 includes a clamping part 3311, a connecting part 3312, and a bent foot part 3313 sequentially connected from top to bottom, the connecting part 3312 is rotatably connected to the testing base 31, and the testing base 31 is mounted with an elastic member 34 for driving the clamping parts 3311 of the two clamping jaws 331 to approach each other. The clamping portion 3311, the connecting portion 3312 and the leg portion 3313 of the clamping jaw 331 are integrally formed, and the leg portion 3313 is bent outward to be protruded into an L-shape.

Further, the elastic members 34 are two and are adapted to the two clamping jaws 331, the elastic members 34 are preferably springs, one end of each spring is mounted on the testing base 31, and the other end of each spring is mounted on the inner side surface of the corresponding bent foot portion 3313, in a natural state, due to the elastic force of the springs, the springs push the bent foot portions 3313 of the clamping jaws 331 away from the testing base 31, and the clamping portions 3311 of the clamping jaws 331 are close to the center of the testing base 31, that is, in a natural state, the two clamping jaws 331 of the automatic clamping device 33 are in a closed clamping state. The open clamping assembly 45 can overcome the spring force by pressing the bent leg portion 3313 of the clamping jaw 331, and move toward the direction close to the testing base 31, while the clamping portion 3311 of the clamping jaw 331 moves toward the direction away from the testing base 31, so that the automatic clamping device is switched from the closed clamping state to the open state, thereby preventing the automatic clamping device 33 from interfering with the semiconductor device 101 mounted on the long-time testing fixture 3. When the clamp opening assembly 45 cancels the pressing of the clamping jaw 331, the clamping part 3311 and the bent foot part 3313 of the clamping jaw 331 are driven to reset by the elastic force of the spring, and the elastic force of the spring is converted into the clamping force of the clamping jaw 331, so that the clamping parts 3311 of the two clamping jaws 331 clamp the semiconductor device 101 together, and the good contact between the device and the connection probe 325 of the long-time test fixture 3 in the long-time test process is ensured.

In order to increase the clamping friction force and to rigidly contact the clamping part 3311 of the clamping jaw 331 with the semiconductor device, the inner side surfaces of the two clamping parts 3311 are provided with rubber blocks 332, the clamping part 3311 is provided with a T-shaped groove transversely arranged, the end of each rubber block is a clamping plane, the other end of each rubber block is a connector adaptive to the T-shaped groove, and the rubber blocks 332 and the clamping parts 3311 are inseparable.

Specifically, referring to fig. 12, the feeding and unclamping manipulator 4 includes an x-axis sliding module 41, a first frame 40 disposed on the x-axis sliding module 41, a y-axis sliding module 42 disposed on the first frame 40, a second frame 43 disposed on the y-axis sliding module 42, an unclamping assembly 45 and a z-axis sliding module 44 disposed on the second frame 43, and a suction mechanism 46 disposed on the z-axis sliding module 44. Under the mutual cooperation of the x-axis sliding module 41, the y-axis sliding module 42 and the z-axis sliding module 44, the clamp opening assembly 45 and the suction mechanism 46 flexibly move in a horizontal and moving manner, and are smooth and reliable.

In this embodiment, as shown in fig. 15 and fig. 19, the unclamping assembly 45 includes an unclamping mounting plate 451 disposed on the second frame 43, a z-axis sliding plate 452 slidably connected to the unclamping mounting plate 451, and an unlocking cylinder 453 for driving the z-axis sliding plate 452 to move up and down, two L-shaped arms 454 are disposed on the z-axis sliding plate 452 corresponding to the positions of the clamping jaws 331, an unlocking device 455 is disposed at the bottom of each L-shaped arm 454, in fact, an output end of the unlocking cylinder 453 is disposed downward and is drivingly connected to the z-axis sliding plate 452, a vertically extending guide rail is disposed on the unclamping mounting plate 451 for smooth movement of the z-axis sliding plate 452, and the z-axis sliding plate 452 is slidably connected to the guide rail through a slider. When the automatic clamp is to be opened, the unlocking cylinder 453 drives the z-axis sliding plate 452 to move downward, the unlocking device 455 on the L-shaped arm 454 presses the bent leg portions 3313 of the clamping jaws 331, overcomes the elastic force of the elastic member 34, swings the clamping jaws 331, and further separates the clamping portions 3311 of the two clamping jaws 331 to open outward, so that the automatic clamp is switched from a closed clamping state to an open state.

Further, as shown in fig. 15 and 19, the unlocking device 455 comprises an unlocking support 4551 having a lower cavity, a fulcrum 4552 horizontally disposed in the lower cavity, and a plurality of pressing wheels 4553 rotatably fitted over the fulcrum 4552. When the pressing wheel 4553 presses the foot bending part 3313 of the clamping jaw 331 downwards, the clamping jaw 331 swings, so that the contact point of the pressing wheel 4553 and the foot bending part 3313 changes along with the swinging, friction force is generated, the friction force can be converted into the rotation driving force of the pressing wheel 4553 at the moment, the pressing effect of the pressing wheel 4553 is reduced due to the influence of the friction force, and the two clamping jaws 331 are ensured to be opened more smoothly and reliably.

Preferably, as shown in fig. 15, an in-place trigger block 456 is arranged on the z-axis sliding plate 452, a first sensor bracket 457 is arranged on the opening clamp mounting plate 451, a photoelectric switch 458 is arranged on the first sensor bracket 457 in an upward vertical direction, and the in-place trigger block 456 is used for triggering the photoelectric switch 458. When the automatic clamp on the long-time test fixture is opened, the unlocking cylinder 453 drives the z-axis sliding plate 452 to move downwards, the z-axis sliding plate 452 drives the in-place trigger block 456 to move downwards together, the in-place trigger block 456 gradually approaches the photoelectric switch 458, when the in-place trigger block 456 blocks the light path of the photoelectric switch 458, the photoelectric switch 458 feeds a feedback system to the control system, the control system controls the unlocking cylinder to stop working, the unlocking device 455 is moved in place, the automatic clamp is switched from a closed clamp state to an open state, the control system further controls the z-axis sliding module 44 and the suction mechanism 46 to move, and the semiconductor workpiece is placed smoothly.

In this embodiment, as shown in fig. 13 and fig. 14, the suction mechanism 46 includes a suction mounting seat 461 disposed on the z-axis sliding module 44, a shaft sleeve 462 vertically disposed on the suction mounting seat 461, and a guide seat 463 disposed at the bottom of the shaft sleeve 462, the shaft sleeve 462 is provided with an axial through hole 464 with a non-circular cross section, an inner shaft 465 is inserted into the axial through hole 464, the bottom of the inner shaft 465 extends downward out of the axial through hole 464 and is connected with a suction cup mounting seat 466, the bottom of the suction cup mounting seat 466 is provided with a suction cup 467, the inner shaft 465 is sleeved with a buffer spring 468, the buffer spring 468 is located between the suction cup mounting seat 466 and the guide seat 463, the top of the inner shaft 465 is provided with a limit clamp spring 469, the limit clamp spring 469 limits the maximum downward extending distance of the inner shaft 465 so as to prevent the inner shaft 465 from sliding off the shaft sleeve 462, the inner shaft 465 is provided with an axial passage, the bottom of axial passageway and sucking disc 467 intercommunication, the top of axial passageway is connected with air cock 460, and this air cock 460 passes through the trachea to be connected with vacuum generator, and control system is through opening or closing of control vacuum generator for sucking disc 467 has the negative pressure and inhales the ability of expecting and unloading.

The inner shaft 465 is inserted into the axial through hole 464 of the shaft sleeve 462 to form clearance fit, so that the inner shaft 465 can move along the vertical direction; because the axial through hole 464 and the inner shaft 465 have non-circular cross sections, the inner shaft 465 does not rotate relative to the sleeve 462. When the semiconductor device is actually sucked, the z-axis sliding module 44 drives the sucking mechanism 46 to move downward, the suction cup 467 presses downward against the top surface of the semiconductor device, a certain rigid impact force is generated when the suction cup 467 contacts with the semiconductor device, and at this time, the buffer spring 468 buffers and absorbs a part of the rigid impact force, so as to prevent the rigid impact force from damaging the semiconductor device and the inner shaft 465. In addition, in order to ensure that the suction cup 467 of the suction mechanism 46 is in close contact with the top surface of the semiconductor device to form a good hermetic seal, the suction cup 467 needs to apply a downward pressing force to the semiconductor device, when the suction cup 467 is tightly attached to the semiconductor device, the suction mount 461 and the shaft sleeve 462 continue to move downward relative to the inner shaft 465 because the semiconductor device blocks the suction cup 467 from continuing to move downward, so that the buffer spring 468 will gradually compress, and at this time, the thrust of the buffer spring 468 pushes the suction cup mount 466 and the suction cup 467 to press the top surface of the semiconductor device, and a negative pressure is formed in the axial channel of the inner shaft 465, so that the semiconductor device can be successfully sucked.

Similarly, when the semiconductor device is actually mounted on the long-term test fixture 3, the z-axis sliding module 44 drives the suction mechanism 46 to move downward, so that a certain rigid impact force is generated when the semiconductor device contacts the long-term test fixture 3, and at this time, the buffer spring 468 buffers and absorbs a part of the rigid impact force, thereby preventing the rigid impact force from damaging the semiconductor device and the test circuit device. In addition, when the semiconductor device is loaded into the long-time testing jig 3, the suction cup 467 of the semiconductor device stops moving downwards continuously, and the suction mounting seat 461 and the shaft sleeve 462 move downwards continuously relative to the inner shaft 465, so that the spring is gradually compressed, and the thrust of the buffer spring 468 pushes the semiconductor device to press the long-time testing jig, thereby ensuring that the electrode of the semiconductor device is effectively electrically connected with the testing circuit device, and the automatic clamp clamps the semiconductor device, so as to ensure that the semiconductor device is well contacted with the connecting probe 325 of the testing jig in the long-time testing process, and the testing process is reliable.

Preferably, the suction cup mounting seat 466 is in an inverted U shape, that is, two stabilizing pressing arms 4661 are formed on two sides of the suction cup 467, and the bottoms of the two stabilizing pressing arms 4662 are also provided with rubber pads 4662, so that when the suction cup 467 sucks the semiconductor device, the two stabilizing pressing arms 4661 are jointly abutted against the top surface of the semiconductor device 101, on one hand, the semiconductor device 101 is pressed better, and on the other hand, after the semiconductor device 101 is sucked up, the semiconductor device is in a horizontal state, and cannot be inclined, thereby facilitating subsequent mounting. When the semiconductor element is installed on the long-time test fixture 3, the two stable pressing arms also provide uniform pressing force for the semiconductor element, and the semiconductor element is ensured to be in good contact with the test fixture.

For convenience of processing, as shown in fig. 18, the axial through hole 464 is a kidney-shaped through hole, and the cross section of the inner shaft 465 is a hollow square.

Further, as shown in fig. 13 and 14, a collar 471 is sleeved on the top of the inner shaft 465 and located above the snap spring, a triggering surrounding edge 472 is disposed on the top of the collar 471, a second sensor support 473 is disposed on the absorbing mounting seat 461, a correlation type photoelectric sensor 474 is disposed on the second sensor support 473, and the triggering surrounding edge 472 is used for blocking a light path of the correlation type photoelectric sensor 474. When the suction cup mount 466 and the suction cup 467 press the semiconductor element 101, the suction mount 461 and the shaft sleeve 462 move downward relative to the inner shaft 465 to drive the opposite type photoelectric sensor 474 on the second sensor support 473 to move downward, so that the triggering surrounding edge 472 extends into a position between the emitting end and the receiving end of the opposite type photoelectric sensor 474 to block the light path transmission of the emitting end and the receiving end, and the opposite type photoelectric sensor 474 feeds back a signal to the control system, which indicates that the suction mount 461 moves in place and the z-axis sliding module 44 stops working.

Preferably, as shown in fig. 10 and 11, the long-time testing jig 3 is detachably connected to the workbench 1, a mounting hole and a socket are preset in each testing station of the workbench 1, a circuit control board is arranged inside the workbench 1, the socket is arranged on the circuit control board, the testing base 31 includes a base body 311 and a support column 312 arranged at a corner of the bottom of the base body 311, the support column 312 is installed in a manner of being adapted to the mounting hole on the workbench 1, a circuit element mounting cavity is arranged in the middle of the base body 311, and the testing circuit element includes a testing circuit board 321 arranged in the circuit element mounting cavity, an element positioning seat 322 arranged at the top of the testing circuit board 321, and a plug 323 arranged at the bottom of the testing circuit board 321; the plug 323 is inserted into the socket to realize electrical connection, the middle part of the element positioning seat 322 is recessed downwards to form a positioning groove 324 for embedding the semiconductor element, a plurality of connecting probes 325 which are vertically upward and electrically connected with the test circuit board 321 are arranged in the positioning groove 324, when the semiconductor element 101 is installed in the positioning groove 324, the electrodes of the semiconductor element are electrically connected with the connecting probes 325, and thus, long-time testing is started.

In this embodiment, the structure of the feeding unclamping manipulator 4 is the same as that of the discharging unclamping manipulator 5, and the working principle is also the same, so that the detailed structure of the discharging unclamping manipulator 5 is not described herein again.

Specifically, the component handling device 8 includes a first cart 81, a second cart 82, a pick-up manipulator 83 and a tray y-axis conveying mechanism 84, which are arranged on the workbench 1, the tray y-axis conveying mechanism 84 includes a tray feeding station 851, a pick-up station 852 and a tray recovery station 853, a pick-up jacking mechanism 86 is arranged below the pick-up station 852, a first tray z-axis lifting mechanism 87 is arranged below the tray feeding station 851, a second tray z-axis lifting mechanism 88 is arranged below the tray recovery station 853, the first tray z-axis lifting mechanism 87 is connected with the first tray x-axis conveying mechanism 89, the second tray z-axis lifting mechanism 88 is connected with the second tray x-axis conveying mechanism 890, the pick-up manipulator 83 is used for conveying the semiconductor components on the pick-up station 852 to the testing fixture to realize quality testing, a plurality of trays 10 filled with the semiconductor components are stacked on the first cart 81, the first tray x-axis conveying mechanism 89 is used for conveying all trays on the first cart 81 to the first tray z-axis lifting mechanism 87 at one time; the second tray x-axis conveying mechanism 890 is used for conveying the empty trays on the second tray z-axis lifting mechanism 88 onto the second cart 82 at one time.

The component carrying device 8 provided by the invention completely replaces manual taking of semiconductor components transferred on the material trays, the first cart 81 is skillfully connected with the first material tray x-axis conveying mechanism 89, the whole material tray is carried to the second material tray z-axis lifting mechanism 88 at one time by utilizing the first material tray x-axis conveying mechanism 89, then the second material tray z-axis lifting mechanism 88 sends the material trays to the material tray feeding station 851 in order, the problem of labor and time consumed by manual taking of the material trays from the cart is solved, and the automation degree is high; the tray is translated to a material taking station 852 by the tray y-axis conveying mechanism 84, the semiconductor elements 101 on the tray are automatically obtained through the material taking manipulator 83 and are conveyed to the material transition testing jig for automatic detection, manual conveying labor force is saved, and the problem caused by manual conveying of the semiconductor elements is solved. When the material trays on the material taking station 852 become empty trays, the tray y-axis conveying mechanism 84 translates the material trays to the tray recovery station 853, and after the material trays are stacked and collected by the second tray z-axis lifting mechanism 88, the second tray x-axis conveying mechanism 890 uniformly conveys all the empty trays to the second cart 82 so that the empty trays can be conveyed back to the automatic semiconductor production line to load semiconductor elements, and the labor and time consumed by manually stacking the empty trays are saved. After the trays on the first cart 81 are transferred by the first tray x-axis transfer mechanism 89, the first cart 81 can be pushed back to the automatic semiconductor production line to load full trays, so that the full trays can be continuously provided for the automatic feeding testing spindle.

In this embodiment, charging tray 10 is under the projection on the horizontal plane, and the charging tray is the rectangle structure, is equipped with a plurality of component storage chamber 102 of arranging with the rectangle array mode on the charging tray, and the edge of the upper surface of charging tray is equipped with location arch 103, and the edge of the bottom of charging tray is equipped with the locating hole with the protruding looks adaptation of location, through setting up like this for two charging trays 10 can vertically align the pile up neatly and stack up and place, ensure that whole buttress charging tray can not take place the skew and incline when moving along x axle and z axle, and stability is high.

Specifically, the first cart 81 comprises a movable frame 811 and two limiting top plates 812 symmetrically arranged at the top of the frame 811; each limit top plate 812 is provided with a limit side plate 813, a material tray storage cavity 814 for stacking material supply trays is arranged between the two limit side plates 813, the material trays are stacked in the material tray storage cavity 814 in a stacking mode, and all the material trays are supported by the limit top plate 812; one end of the tray storage cavity 814 forms a tray output port, the other end forms a tray alignment port, one end of the side plate close to the tray alignment port is provided with an alignment vertical plate 815, the side surface of the tray is tightly attached to the alignment vertical plate 815 to facilitate the determination of the position of the tray, the two limit top plates 812 are separately arranged to form a lifting and avoiding channel 816, the first tray x-axis conveying mechanism 89 penetrates through the lifting and avoiding channel 816 to lift the whole tray, and then drives the whole tray to move along the x-axis to penetrate through the tray output port to move away from the first cart 81. It should be understood that the tray storage cavity 814 of fig. 4 does not depict a full stack of trays, only a portion of the trays are schematically depicted, and that the semiconductor components placed on the trays are not depicted.

Further, referring to fig. 2 and 3, a guiding and positioning mechanism is disposed outside the workbench 1, the guiding and positioning mechanism includes a guide frame 801 shaped like a Chinese character 'ba', two sets of cart positioning brackets 802 symmetrically disposed on the guide frame 801, a cart positioning cylinder 803 disposed on the cart positioning bracket 802, and a positioning bolt 804 disposed on an end of a piston rod of the cart positioning cylinder 803, a plurality of guiding rollers 805 are disposed on an upper surface of the guide frame 801, two positioning rollers 806 are disposed on a frame 811 of the first cart 81, and a positioning socket 807 is formed between the two positioning rollers 806. In fact, the inner side of the guiding frame 801 is a trolley parking area, when the first trolley 81 enters the trolley parking area, the side surface of the frame 811 of the first trolley 81 contacts with the guiding roller 805 to prevent the guiding frame 801 from colliding and wearing with the frame 811, when the first trolley 81 is displaced until the positioning pin 804 is opposite to the positioning socket 807, it is indicated that the first trolley 81 is parked in place, two sets of the trolley positioning cylinders 803 drive the positioning pin 804 to be inserted into the corresponding positioning socket 807, so as to accurately position the discharging position of the first trolley 81, on one hand, avoid affecting the conveying distance of the first tray x-axis conveying mechanism 89, and on the other hand, prevent the first trolley 81 from moving by itself when the tray is moved away from the first trolley 81, affecting the conveying effect.

Further, the first tray x-axis conveying mechanism 89 comprises a fixed support 891, an x-axis conveying module 892 arranged on the fixed support 891, a moving support 893 arranged on the x-axis conveying module 892, a tray 894 capable of moving up and down relative to the moving support 893, and a tray cylinder 895 in driving connection with the tray 894, wherein the x-axis sliding mechanism is used for driving the moving support 893 to move left and right. In operation, the x-axis transport module 892 drives the moving rack 893 and the tray 894 to move toward the first cart 81, the tray cylinder 895 drives the tray 894 to move vertically upward, the tray 894 moves through the lift escape channel 816 to lift a full stack of trays, and the x-axis transport module 892 moves the full stack of trays toward the z-axis lift mechanism 87 for the first tray.

Further, two guide rods 896 are provided on the bottom surface of the tray 894, a sliding sleeve 897 is fixedly provided on the movable bracket 893, the position of the sliding sleeve 897 corresponds to the position of the guide rods 896, and the two guide rods 896 are slidably inserted into the sliding sleeve 897 respectively. Through the guide effect of sliding sleeve 897 and guide bar 896, can guarantee that the direction of motion of tray ware 894 is correct, can also avoid tray cylinder 895's piston rod to receive the shearing force, prevent that the piston rod from warping because of the shearing force.

Specifically, referring to fig. 5-7, the first tray z-axis lifting mechanism 87 includes a z-axis transfer module 871 and a C-shaped bracket 872 arranged on the z-axis transfer module 871, the z-axis transfer module 871 is used for driving the C-shaped bracket 872 to move up and down, two symmetrical and parallel support arms 873 are arranged on the inner side of the C-shaped bracket 872, a guide strip 874 is arranged on the upper surface of the support arm 873, a plurality of positioning protrusions 103 are arranged on the upper surface of the support arm 873, and the positioning protrusions on the support arm 873 are in fit connection with the positioning holes on the tray. In fact, before the first tray x-axis conveying mechanism 89 conveys the whole stack of trays to the first tray z-axis lifting mechanism 87, the z-axis sliding mechanism drives the C-shaped bracket 872 to move downwards to a preset height (i.e. the height of the C-shaped bracket 872 is lower than that of the tray 894), then the x-axis conveying module 892 drives the whole stack of trays to move towards the C-shaped bracket 872, the tray located at the bottommost layer slides into between the two guide bars 874, and then the z-axis sliding mechanism drives the C-shaped bracket 872 to move upwards, first the positioning protrusions 103 on the two support arms 873 are embedded into the positioning holes on the trays 10 to position the trays, the support arms 873 move upwards to lift the whole stack of trays to move upwards, because the positioning sensor 15 is arranged on the worktable 1, the tray located at the topmost layer will be exposed out of the table top of the worktable 1 and enter the tray feeding station 851, when the topmost tray will trigger the positioning sensor 15, the in-place sensor feeds back signals to the control system, the z-axis conveying module 871 stops moving, the lifting of the whole stack of trays is stopped, then the control system controls the tray y-axis conveying module 843 to clamp the tray at the top, in order to enable the bottom of the tray at the top to be separated from the tray at the lower layer, the z-axis conveying module 871 automatically drives the trays on the C-shaped bracket 872 and the C-shaped bracket 872 to descend for a certain distance, and the tray y-axis conveying mechanism 84 drives the tray at the top to move horizontally to the material taking station 852 along the y-axis direction. It should be noted that, when the material taking station 852 has a material tray, the material tray feeding station 851 has a material tray and is in a waiting state, and the z-axis conveying module 871 stops moving.

Preferably, referring to fig. 6 and 7, the tray y-axis conveying mechanism 84 includes two symmetrical conveying clamping blocks 841 and a clamping cylinder 842 for driving the two conveying clamping blocks 841 to approach or separate from each other, each clamping cylinder 842 is installed on a y-axis conveying module 843, the two y-axis conveying modules 843 are parallel to each other and are separately arranged, and the tray feeding station 851, the material taking station 852 and the tray recycling station 853 are located between the two y-axis conveying modules 843. When a material tray needs to be provided for the material taking station 852, the two y-axis conveying modules 843 drive the corresponding clamping blocks 841 to move to the left side and the right side of the material tray feeding station 851 respectively, then the clamping cylinder 842 drives the two clamping blocks 841 to clamp the material tray together, then the two y-axis conveying modules 843 drive the material tray to translate to the upper part of the material taking station 852, the material taking jacking mechanism 86 supports the material tray, and finally the clamping cylinder 842 drives the two clamping blocks 841 to withdraw from clamping the material tray; when the semiconductor elements on the material tray on the material taking station 852 are taken away by the material taking manipulator 83, the material tray is changed into an empty material tray, the two y-axis conveying modules 843 drive the corresponding conveying clamping blocks 841 to move to the left side and the right side of the material taking station 852 respectively, then the clamping cylinder 842 drives the two conveying clamping blocks 841 to clamp the empty material tray together, then the two y-axis conveying modules 843 drive the material tray to translate to the position above the material tray recovery station 853, and the empty material tray is recovered under the coordination of the second material tray z-axis lifting mechanism 88.

Further, referring to fig. 6 and 7, the material taking jacking mechanism 86 includes a fixed platform 861, a supporting plate 862 capable of moving up and down relative to the fixed platform 861, and a jacking cylinder (not visible in the figure) disposed on the fixed platform 861 and used for driving the supporting plate 862 to move up and down, wherein the supporting plate 862 is located between the two y-axis sliding mechanisms. In order to ensure that the tray is accurately positioned on the material taking station 852 and cannot tilt, the supporting plate 862 is provided with a positioning protrusion 103 matched with a positioning hole on the tray, and the tray is placed on the supporting plate 862. When the tray y-axis conveying mechanism 84 clamps the tray and moves to the position above the supporting plate 862, the jacking cylinder drives the supporting plate 862 to move upwards, and the positioning protrusions on the supporting plate 862 are embedded into the positioning holes at the bottom of the tray, so that the picking manipulator 83 carries out the carrying test work of the semiconductor element. When the material tray on the material taking station 852 becomes an empty material tray, the lifting cylinder drives the supporting plate 862 to move downwards to reset after the empty material tray is clamped by the material tray y-axis conveying mechanism 84, and the material tray is waiting for being fed.

It should be noted that the structures and the connection modes of the second cart 82, the second tray x-axis conveying mechanism 890 and the second tray z-axis lifting mechanism 88 are the same as those of the first cart 81, the first tray x-axis conveying mechanism 89 and the first tray z-axis lifting mechanism 87, and the detailed structures of the second cart 82, the second tray x-axis conveying mechanism 890 and the second tray z-axis lifting mechanism 88 are not further described herein. It can be understood that the recycling process of the empty trays is opposite to the conveying process of the trays filled with the semiconductor elements, after a certain number of empty trays are stacked and collected by the second tray z-axis lifting mechanism 88, the second tray z-axis lifting mechanism 88 places the whole stack of empty trays on the second tray x-axis conveying mechanism 890, and the second tray x-axis conveying mechanism 890 conveys all the empty trays to the second cart 82 at one time, so that the recycling work of the empty trays is automatically completed, and the workers can conveniently and subsequently convey the empty trays to a finished product workshop to load the semiconductor element finished products.

Specifically, referring to fig. 8, the pickup manipulator 83 includes an x-axis material taking module 831 disposed on the workbench 1, a first material taking rack 834 disposed on the x-axis material taking module 831, a y-axis material taking module 832 disposed on the first material taking rack, a second material taking rack 835 disposed on the y-axis material taking module 832, a z-axis material taking module 833 disposed on the second material taking rack 835, a component identification camera 852, and a suction mechanism 46 disposed on the z-axis material taking module 833; the x-axis material taking module 831 is suspended on the workbench 1 through the third material taking rack 836, the y-axis material taking module 832 drives the second material taking rack 835 to move back and forth, the z-axis material taking module 833 drives the rotatable suction mechanism 851 to move up and down, and the x-axis material taking module 831 drives the first material taking rack 834 to move left and right. The component recognition camera 852 and the rotatable suction mechanism 851 can flexibly perform horizontal movement and vertical movement under the coordination of the x-axis material taking module 831, the y-axis material taking module 832 and the z-axis material taking module 833, automatically complete the automatic assembly test of the semiconductor component, save the carrying labor force and eliminate the problems caused by manually carrying the semiconductor component.

In practical application, referring to fig. 16-18, a rotatable suction mechanism 851 adds a rotation function on the basis of the structure of the suction mechanism 46, the rotatable suction mechanism 851 includes a suction mounting base 461, a driving motor 8511 mounted on the suction mounting base 461, a shaft sleeve 462 vertically and rotatably disposed on the suction mounting base 461, a guide base 463 disposed at the bottom of the shaft sleeve 462, the shaft sleeve 462 may be provided with an axial through hole 464 with a non-circular cross section relative to the shaft sleeve 462, an inner shaft 465 adapted to the axial through hole 464 in shape is inserted into the axial through hole 464, the bottom of the inner shaft 465 extends downward from the axial through hole 464 and is connected with a suction cup mounting base 466, the bottom of the suction cup mounting base 466 is provided with a suction cup 467, the inner shaft 465 is sleeved with a buffer spring 468, a main shaft of the driving motor is sleeved with a first synchronous pulley 8512, the shaft sleeve 462 is sleeved with a second synchronous pulley 8513, the first synchronous pulley and the second synchronous pulley are connected through a synchronous belt 8514, the shaft sleeve 462 is rotatably connected with the suction mounting seat 461, and the inner shaft 465 is inserted into the axial through hole 464 of the shaft sleeve 462 to form clearance fit, so that the inner shaft 465 can move in the vertical direction; because the cross-section of the axial through-hole 464 and the inner shaft 465 is non-circular, the inner shaft 465 does not rotate relative to the sleeve 462, i.e., the inner shaft 465 rotates synchronously with the sleeve 462. When the semiconductor component is placed to have an angle deviation, the driving motor drives the shaft sleeve 462 to rotate through the transmission assembly, and the inner shaft 465 rotates along with the shaft sleeve 462; therefore, the semiconductor element can be horizontally rotated to a proper angle, the angle offset of the semiconductor element is corrected, and the semiconductor element can be smoothly installed on the test fixture. Meanwhile, the semiconductor element may be subjected to an appearance quality comparison analysis, and when the semiconductor element is defective in appearance quality, the semiconductor element is determined to be a defective product, and the pick-up robot 83 automatically conveys the semiconductor element to a defective product collecting tray on the table 1. Of course, when the semiconductor device is turned in the reverse direction, the driving motor drives the shaft sleeve 462 to rotate through the transmission assembly, and the inner shaft 465 rotates together with the shaft sleeve 462.

In fact, material loading transition test fixture 21 and unloading transition test fixture 22 add automatic function of opening and press from both sides on long-time test fixture's structure basis, material loading transition test fixture 21 is the same with unloading transition test fixture 22's structure, material loading transition test fixture 21 and unloading transition test fixture 22 all include test base 31, set up test circuit element, automatic folder ware on test base 31, set up at supporting seat 232 on one side of test base 31 and set up the pendulum rod 233 in supporting seat 232 both sides, and the medial surface and the supporting seat 232 pivot of two pendulum rods 233 are connected, and the one end of two pendulum rods 233 passes through pendulum shaft 234 rigid coupling, two another tip of pendulum rod 233 is equipped with rotatable pinch roller 4553. In fact, the output end of the unclamping cylinder 231 is arranged upward, when the clamping jaws 331 are to be opened, the unclamping cylinder 231 is driven to move upward through the swing shaft 234, so as to drive the swing rod 233 to swing toward the axis of the supporting seat 232, the pressing wheel 4553 on the swing rod 233 presses the bent foot portions 3313 of the clamping jaws 331 to overcome the elastic force of the elastic member 34, so that the clamping jaws 331 swing, and then the clamping portions 3311 of the two clamping jaws 331 are separated from each other to be opened outward, and the automatic clamping device is switched from the closed clamping state to the open state. The pinch roller 4553 can select the bearing setting for use, when pinch roller 4553 pushes down the curved foot portion 3313 of clamping jaw 331, because clamping jaw 331 can take place the swing, so pinch roller 4553 can follow with the contact point of curved foot portion 3313 and change to produce frictional force, frictional force can turn into pinch roller 4553's rotation drive power this moment, reduce the effect of exerting pressure that frictional force influences pinch roller 4553, ensure that two clamping jaws 331 open more smoothly and reliably.

Preferably, the workbench 1 is provided with a plurality of parallel loading transition test jigs 21 and a plurality of parallel unloading transition test jigs 22, so as to improve the short-time test efficiency and the element transfer efficiency. And a frequency probe 25 is also arranged on part of the feeding transition test fixture 21 and the discharging transition test fixture 22, the frequency probe 25 is used for detecting the operating frequency performance of some semiconductor elements, and the frequency probe is not in direct contact with the semiconductor elements.

The part taking manipulator 83 has the same structure as the marking transfer manipulator 61, and the part taking manipulator 83 has the same structure as the packaging transfer manipulator 71, so that the specific structures of the marking transfer manipulator 61 and the packaging transfer manipulator 71 are not described again.

Specifically, referring to fig. 1 and 20, the marking device 62 includes a marking platform 621, a parallel double-acting pneumatic claw 622 transversely disposed on the marking platform 621, and a laser marker 623 disposed above the marking platform, wherein the marking platform 621 is provided with a component placement area 624, the marking platform is provided with an alignment sensor 625 for sensing a semiconductor component, the parallel double-acting pneumatic claw 622 is provided with two symmetrically disposed marking alignment blocks 626, and the parallel double-acting pneumatic claw 626 is used for driving the two marking alignment blocks 626 to approach or separate from each other. During actual operation, the marking transfer manipulator 61 places the semiconductor element 101 in the element placing area 624, and when the semiconductor element 101 falls to the element placing area 624, deviation may occur due to vibration, so that marking information is inclined, after the semiconductor element is placed in the element placing area 624, the alignment sensor senses the semiconductor element, and a feedback signal is given to the control system, so that the two marking alignment blocks 626 are driven by the parallel double-acting pneumatic claw 626 to be close to each other, the position of the semiconductor element is corrected, and the accurate carving position of the laser marker is ensured.

Further, referring to fig. 21, the braid packaging device 72 includes a carrier tape detecting device 721, a tape supplying assembly 722, a carrier tape 723 disposed on the tape supplying assembly 722, a tape collecting assembly 724, a tape pressing assembly 725, and a cover film disc assembly 726; in operation, the tape supply assembly 722 conveys the carrier tape 723 to the tape pressing assembly, the cover film disc assembly 726 conveys the cover film to the tape pressing assembly 725, the packaging transfer manipulator 71 transfers the semiconductor elements qualified in the test to the carrier tape 723, the carrier tape inspection device 721 photographs the devices in the carrier tape, identifies the placement position and the appearance inspection, after the inspection, the carrier tape 723 moves below the tape pressing device 725, the tape pressing device 725 heat-seals the cover film on the carrier tape, and finally the carrier tape is rolled up through the tape collecting assembly 724 to complete the tape weaving and packaging.

It should be noted that the x-axis sliding module, the y-axis sliding module, the z-axis sliding module, the x-axis material taking module, the y-axis material taking module, the z-axis material taking module, the x-axis conveying module, the y-axis conveying module and the z-axis conveying module can be linear modules, screw rod mechanisms and the like, and the main effect is that the output end of linear motion is provided and can be directly purchased from the market.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other suitable relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

It should be understood that equivalents and modifications of the technical solution and inventive concept thereof may occur to those skilled in the art, and all such modifications and alterations should fall within the protective scope of the present invention.

Claims

1. A semiconductor element translation type testing, coding and taping integrated machine is characterized by comprising a workbench, a feeding transition testing jig, a long-time testing area and a discharging transition testing jig, wherein the feeding transition testing jig, the long-time testing area and the discharging transition testing jig are sequentially arranged on the workbench from left to right; the feeding transition test fixture and the long-time test fixture are connected through a feeding unclamping manipulator, the discharging transition test fixture and the long-time test fixture are connected through a discharging unclamping manipulator, an element carrying device is arranged at the upstream of the feeding transition test fixture and used for carrying semiconductor elements on a material tray to the feeding transition test fixture for testing, and a marking device and a braid packaging device are sequentially arranged at the downstream of the discharging transition test fixture; the blanking transition test fixture is connected with the marking device through a marking transfer manipulator, and the marking device is connected with the braid packaging device through a packaging transfer manipulator; each long-time test fixture comprises a test base, a test circuit element and an automatic clamp device, wherein the test circuit element and the automatic clamp device are arranged on the test base; the long-time test duration is 30min-1 h; the feeding transition test fixture is used for carrying out a first short-time test on the semiconductor element, and the time length of the first short-time test is 5-10 s; the blanking transition test fixture is used for carrying out second short-time test on the semiconductor element, and the time length of the second short-time test is 5-10 s.

2. The integrated semiconductor device translation-type testing, coding and taping machine as claimed in claim 1, wherein the automatic clamp comprises two clamping jaws symmetrically arranged on the testing base, each clamping jaw comprises a clamping part, a connecting part and a bent part which are sequentially connected from top to bottom, the connecting part is rotatably connected with the testing base, and the testing base is provided with an elastic member for driving the clamping parts of the two clamping jaws to approach each other.

3. The semiconductor element translation type testing, coding and taping all-in-one machine of claim 2, wherein the feeding and unclamping manipulator comprises an x-axis sliding module, a first rack arranged on the x-axis sliding module, a y-axis sliding module arranged on the first rack, a second rack arranged on the y-axis sliding module, an unclamping assembly and a z-axis sliding module arranged on the second rack, and an absorbing mechanism arranged on the z-axis sliding module.

4. The integrated machine for testing, coding and taping of the semiconductor element in the translational manner according to claim 3, wherein the unclamping assembly comprises an unclamping mounting plate arranged on the second frame, a z-axis sliding plate connected with the unclamping mounting plate in a sliding manner, and an unlocking cylinder for driving the z-axis sliding plate to move up and down, two L-shaped support arms corresponding to the positions of the clamping jaws are arranged on the z-axis sliding plate, an unlocking device is arranged at the bottom of each L-shaped support arm, the unlocking device comprises an unlocking support with a lower concave cavity, a support shaft horizontally arranged in the lower concave cavity, and a plurality of pressing wheels rotatably sleeved on the support shaft.

5. The integrated machine of claim 3, wherein the suction mechanism comprises a suction mounting base, a shaft sleeve vertically arranged on the suction mounting base, and a guide base arranged at the bottom of the shaft sleeve, wherein an axial through hole with a non-circular cross section is arranged on the shaft sleeve, an inner shaft matched with the axial through hole in shape is inserted into the axial through hole, the bottom of the inner shaft extends downwards out of the axial through hole and is connected with the suction cup mounting base, a suction cup is arranged at the bottom of the suction cup mounting base, a buffer spring is sleeved on the inner shaft and is positioned between the suction cup mounting base and the guide base, a limit snap spring is arranged at the top of the inner shaft, an axial channel is arranged on the inner shaft, the bottom end of the axial channel is communicated with the suction cup, and the top end of the axial channel is connected with an air tap.

6. The integrated machine of claim 1, wherein the component handling device comprises a first cart, a second cart, a pick-up manipulator and a tray y-axis conveying mechanism, the pick-up manipulator and the tray y-axis conveying mechanism are arranged on the worktable, the tray y-axis conveying mechanism comprises a tray feeding station, a pick-up station and a tray recovery station, a pick-up jacking mechanism is arranged below the pick-up station, a first tray z-axis lifting mechanism is arranged below the tray feeding station, a second tray z-axis lifting mechanism is arranged below the tray recovery station, the first tray z-axis lifting mechanism is connected with the first tray x-axis conveying mechanism, the second tray z-axis lifting mechanism is connected with the second tray x-axis conveying mechanism, and the pick-up manipulator is used for conveying the semiconductor components on the pick-up station to the testing jig to realize quality testing, a plurality of material trays filled with semiconductor elements are stacked on the first cart, and the first material tray x-axis conveying mechanism is used for conveying all the material trays on the first cart to the first material tray z-axis lifting mechanism at one time; and the second material tray x-axis conveying mechanism is used for conveying the empty material trays on the second material tray z-axis lifting mechanism to the second cart at one time.

7. The semiconductor element translation type testing, coding and taping all-in-one machine as claimed in claim 6, wherein the first cart comprises a movable frame and two limiting top plates symmetrically arranged at the top of the frame; each limiting top plate is provided with a limiting side plate, a material tray storage cavity for stacking material trays is arranged between the two limiting side plates, and the limiting top plate is used for bearing the material trays; the two limit top plates are arranged separately to form a lifting avoiding channel.

8. The integrated machine for testing, coding and taping of semiconductor elements in a translational manner according to claim 7, wherein the first tray x-axis conveying mechanism comprises a fixed support, an x-axis conveying module arranged on the fixed support, a moving support arranged on the x-axis conveying module, a tray device capable of moving up and down relative to the moving support, and a tray cylinder in driving connection with the tray device, and the x-axis sliding mechanism is used for driving the moving support to move left and right; the first material tray z-axis lifting mechanism comprises a z-axis conveying module and a C-shaped bracket arranged on the z-axis sliding mechanism, the z-axis sliding mechanism is used for driving the C-shaped bracket to move up and down, two symmetrical and parallel support arms are arranged on the inner side of the C-shaped bracket, a guide strip is arranged on the upper surface of each support arm, a plurality of positioning bulges are arranged on the upper surface of each support arm, and positioning holes matched with the positioning bulges are formed in the bottom of the material tray; the charging tray y-axis conveying mechanism comprises two symmetrical conveying clamping blocks and a clamping cylinder for driving the two conveying clamping blocks to get close to or get away from each other, each clamping cylinder is installed on one y-axis conveying module, the two y-axis conveying modules are parallel to each other and are arranged separately, and the charging tray feeding station, the material taking station and the charging tray recycling station are located between the two y-axis conveying modules; get material climbing mechanism and include fixed platform, the layer board that can reciprocate relatively fixed platform, set up on fixed platform and be used for driving the jacking cylinder that the layer board reciprocated, the layer board is located between two y axle conveying modules.

9. The integrated testing, coding and taping machine of claim 2, wherein the feeding transition testing jig and the discharging transition testing jig each comprise a testing base, a testing circuit element arranged on the testing base, an automatic clamp, a supporting seat arranged beside the testing base and swing rods arranged on two sides of the supporting seat, inner side surfaces of the two swing rods are connected with the supporting seat through a pivot, one end parts of the two swing rods are fixedly connected through a swing shaft, and the other end parts of the two swing rods are provided with rotatable pinch rollers.

10. The semiconductor element translation type testing, coding and taping integrated machine according to claim 1, wherein the marking device comprises a marking platform, a parallel double-acting pneumatic claw transversely arranged on the marking platform, and a laser marker arranged above the marking platform, wherein two marking aligning blocks symmetrically arranged are arranged on the parallel double-acting pneumatic claw, and the parallel double-acting pneumatic claw is used for driving the two marking aligning blocks to be close to or far away from each other.