CN113522796A

CN113522796A - Substrate detection system and detection method

Info

Publication number: CN113522796A
Application number: CN202110758541.0A
Authority: CN
Inventors: 罗时帅; 钱根; 柳洪哲; 朱文兵; 钱曙光; 汪炉生; 陶磊; 蒋朝伟; 赵读伟; 金元元
Original assignee: Rongcheer Industrial Technology Suzhou Co ltd
Current assignee: Rongcheer Industrial Technology Suzhou Co ltd
Priority date: 2021-07-05
Filing date: 2021-07-05
Publication date: 2021-10-22

Abstract

The invention discloses a substrate detection system and a detection method, which comprises the following steps: a detection mechanism; the turntable mechanism comprises a turntable and a plurality of positioning tools for positioning the substrate, and the plurality of positioning tools are distributed on the turntable along the circumferential direction of the turntable; the conveying mechanism is configured to convey the substrate to be detected to the turntable mechanism, receive the qualified substrate after detection and convey the qualified substrate away from the turntable mechanism; the conveying mechanism comprises a feeding conveying mechanism for moving the base plate from the conveying mechanism to the turntable mechanism, a discharging conveying mechanism for moving the base plate from the turntable mechanism to the conveying mechanism, and a retest switching mechanism positioned between the feeding conveying mechanism and the discharging conveying mechanism, wherein the retest switching mechanism can drive the base plate to move back and forth between the feeding conveying mechanism and the discharging conveying mechanism. The invention can realize automatic carrying, detection and retest of the substrate, reduces the manual labor and effectively improves the detection efficiency.

Description

Substrate detection system and detection method

Technical Field

The invention relates to the technical field of substrate electrical detection, in particular to a substrate detection system and a substrate detection method.

Background

After the key substrate is processed, LCR (capacitance, inductance, resistance) and OS (short circuit and open circuit) detection needs to be performed on a circuit of the key substrate to ensure that a product is qualified for delivery. The existing detection work is mainly finished manually, the amount of manual labor is large, and the detection efficiency is low.

Accordingly, there is a need for improvements in the art that overcome the deficiencies in the prior art.

Disclosure of Invention

The present invention is directed to a substrate inspection system and a substrate inspection method to solve the above problems.

The purpose of the invention is realized by the following technical scheme: a substrate detection system, comprising: a detection mechanism for detecting the substrate; the rotary table mechanism comprises a plurality of rotary tables and positioning tools for positioning the substrate, the positioning tools are distributed on the rotary tables along the circumferential direction of the rotary tables, and the rotary tables are configured to rotate the positioning tools to or away from the detection mechanism; the conveying mechanism is configured to convey the substrate to be detected to the turntable mechanism, receive the qualified substrate after detection and convey the qualified substrate away from the turntable mechanism; and the carrying mechanism comprises a loading carrying mechanism for moving the substrate from the conveying mechanism to the turntable mechanism, an unloading carrying mechanism for moving the substrate from the turntable mechanism to the conveying mechanism, and a retest switching mechanism positioned between the loading carrying mechanism and the unloading carrying mechanism, wherein the retest switching mechanism can drive the substrate to move back and forth between the loading carrying mechanism and the unloading carrying mechanism.

Further, the conveying mechanism comprises a material tray for storing the substrate, and a feeding mechanism, a material taking mechanism, a caching mechanism, a discharging mechanism and a discharging mechanism which are sequentially arranged side by side; the feeding mechanism is used for stacking the material discs and conveying the material discs to the material taking mechanism, the material taking mechanism is used for receiving the material discs and supplying the carrying mechanism to take out the base plates, the caching mechanism is used for receiving the empty material discs input by the material taking mechanism, the discharging mechanism is used for receiving the empty material discs and supplying the carrying mechanism to put the base plates, and the discharging mechanism is used for receiving and stacking the material discs filled with the base plates after detection.

Further, the substrate detection system also comprises a defective product collection mechanism for receiving the unqualified substrate after detection.

Further, the loading and carrying mechanism and the unloading and carrying mechanism are identical in structure, the loading and carrying mechanism comprises a mechanical arm, a suction nozzle assembly for taking and placing the substrate, and a buffer assembly arranged between the mechanical arm and the suction nozzle assembly, and the buffer assembly is configured to provide a reaction force for buffering when the suction nozzle assembly is in contact with the substrate.

Further, the carrying mechanism further comprises a second camera assembly, and the feeding carrying mechanism and the discharging carrying mechanism are positioned through the second camera assembly.

Further, the defective product collecting mechanism comprises a third mounting frame, a drawing plate which is matched with the third mounting frame in a sliding mode, and a defective product containing plate which is fixed to the drawing plate and used for containing the substrate, wherein a handle is mounted on the drawing plate, so that the drawing plate is drawn towards the outside of the substrate detection system.

Further, the detection mechanism comprises a conduction detection mechanism and an electrical performance detection mechanism which are positioned at the turntable, and the turntable drives the substrate to sequentially pass through the conduction detection mechanism and the electrical performance detection mechanism.

Furthermore, the positioning tool is concavely formed with a containing groove for containing and positioning the substrate, and a third suction nozzle in contact with the substrate is arranged at the bottom of the containing groove.

In addition, the invention also provides a detection method, which comprises the following steps:

s1, the carrying mechanism feeds the substrate to a positioning tool of the turntable mechanism;

s2, the turntable mechanism drives the substrate to move to a detection mechanism for detection;

and S3, if the substrate is qualified, the carrying mechanism discharges the substrate to the conveying mechanism, if the substrate is unqualified, the turntable mechanism moves the substrate to the detection mechanism for secondary detection, if the substrate is unqualified for secondary detection, the carrying mechanism moves the substrate to another positioning tool for third detection, and if the substrate is unqualified for third detection, the carrying mechanism moves the substrate to a defective product collection mechanism.

Further, in step S3, when the substrate is not qualified in the first inspection, the carrying mechanism removes the substrate and replaces the substrate with the positioning tool.

Compared with the prior art, the invention has the following beneficial effects: the invention can realize automatic carrying and detection of the substrate and accurate retest after detection, reduces manual labor and effectively improves detection efficiency.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the substrate inspection system of the present invention.

Fig. 2 is a schematic structural view of fig. 1 with the chassis removed.

Fig. 3 is a schematic structural diagram of the feeding mechanism in the invention.

Fig. 4 is a schematic view of the structure of fig. 3 with the tray.

Fig. 5 is a schematic view of the material taking mechanism of the present invention.

Fig. 6 is a schematic view of the structure of fig. 5 with the tray.

Fig. 7 is a schematic structural diagram of a cache mechanism according to the present invention.

Fig. 8 is a schematic view of the structure of fig. 7 with the tray.

FIG. 9 is a schematic view of the structure of the carrying mechanism of the present invention.

Fig. 10 is a schematic structural view of the material loading and conveying mechanism in fig. 9.

Fig. 11 is a schematic structural view of the removal robot of fig. 10.

Fig. 12 is a schematic view of a portion of the detail of the cushioning assembly of fig. 10.

Fig. 13 is a schematic structural diagram of the retest switch mechanism in fig. 9.

Fig. 14 is a schematic view of the construction of a defective product collecting mechanism in the present invention.

Fig. 15 is a schematic structural view of the turntable mechanism and the detection mechanism in the present invention.

Fig. 16 is a schematic view of the installation of the positioning tool and the substrate in the present invention.

Fig. 17 is an exploded top view of the positioning tool and substrate of fig. 16.

Fig. 18 is an exploded bottom view of the positioning tool and substrate of fig. 16.

Fig. 19 is a schematic structural view of the conduction detecting mechanism of the present invention.

Fig. 20 is a schematic structural diagram of the conduction detecting assembly in fig. 19.

Fig. 21 is a partial enlarged view of fig. 20 at a.

Figure 22 is a schematic partial cross-sectional view of the first test head of figure 20.

Figure 23 is an exploded view of the first test head of figure 20.

Fig. 24 is a schematic view of the pressing assembly of fig. 19.

Figure 25 is a schematic diagram of the construction of the hold-down assembly of figure 19.

Fig. 26 is a schematic view of the structure of the electrical performance detection mechanism of the present invention.

Figure 27 is a schematic diagram of the second test head of figure 26.

Fig. 28 is an exploded schematic view of fig. 27.

Detailed Description

Referring to fig. 1, 2, 17 and 18, a substrate inspecting system according to a preferred embodiment of the present invention includes a conveying mechanism 100, a conveying mechanism 200, a defective product collecting mechanism 300, a turntable mechanism 400 and an inspecting mechanism 500, wherein the conveying mechanism 100 is used for conveying a substrate 600 to be inspected to the conveying mechanism 200 and receiving a qualified substrate 600 after inspection and conveying the qualified substrate away from the conveying mechanism 200, the defective product collecting mechanism 300 is used for receiving a unqualified substrate 600 after inspection, and the conveying mechanism 200 is received among the conveying mechanism 100, the turntable mechanism 400 and the defective product collecting mechanism 300 to convey the substrate 600 to be inspected to the turntable mechanism 400 or convey the substrate 600 after inspection to the conveying mechanism 100 or the defective product collecting mechanism 300.

Further, the inspection system further includes a housing 700, and the conveying mechanism 100, the carrying mechanism 200, the defective product collecting mechanism 300, the turntable mechanism 400, and the inspection mechanism 500 are all housed in the housing 700.

Further, the conveying mechanism 100 includes a plurality of trays 101 for storing the substrates 600, and a feeding mechanism 102, a taking mechanism 103, a buffer mechanism 104, a discharging mechanism 105 and a discharging mechanism 106, which are arranged side by side in sequence. The substrate 600 includes a substrate main body 61, a button 62 disposed on the substrate main body 61, and a flexible board 63 connected to the substrate main body 61, a connecting portion 631 is disposed on an end surface of the flexible board 63 away from the substrate main body 61, the connecting portion 631 and the button 62 are disposed in a back-to-back manner, and the connecting portion 631 has a plurality of pins.

Referring to fig. 3 and 4, the feeding mechanism 102 includes a feeding line 111, a feeding lift plate 112, a first lift assembly 113, and a first lift assembly 114. The feeding conveying line 111 is arranged along the X-axis direction and is used for conveying the charging tray 101; the charging tray 101 provided with the substrate 600 to be detected is stacked on the feeding jacking plate 112, and the first jacking assembly 113 is connected below the feeding jacking plate 112 and can push the feeding jacking plate 112 to descend or ascend along the Z-axis direction so as to enable the charging tray 101 to be in contact with or not in contact with the feeding conveying line 111; the first lifting assembly 114 is located at a side of the loading lifting plate 112, and can be close to or far from the tray 101 along the Y-axis direction to hold other trays 101 except for the bottommost layer.

The first jacking assembly 113 includes a first jacking cylinder 1131 and a jacking link (not shown) connected between the first jacking cylinder 1131 and the loading jacking plate 112, and the first jacking cylinder 1131 can drive the loading jacking plate 112 to ascend or descend. The first lifting assembly 114 includes a first lifting cylinder 1141 and a first lifting plate 1142 connected to the first lifting cylinder 1141, and the first lifting cylinder 1141 can drive the first lifting plate 1142 to extend to the bottom of the tray 101 along the Y-axis direction. In this embodiment, the number of the first lifting assemblies 114 is two, and the first lifting assemblies are respectively disposed on two opposite sides of the tray 101.

In order to facilitate the first lifting plate 1142 to extend into and out of the bottom of the charging tray 101, the side of the charging tray 101 is inwards provided with an avoiding groove 101a, the upper end of the avoiding groove 101a is of an opening structure, and the first lifting plate 1142 can extend into the bottom of the charging tray 101 from the avoiding groove 101 a. Preferably, in order to improve the stability of stacking the tray 101, the feeding mechanism 102 further includes a plurality of limiting posts 115 surrounding the outer edge of the tray 101 to abut against the tilted tray 101.

When the feeding mechanism 102 works, the first jacking cylinder 1131 drives the feeding jacking plate 112 to rise by a certain height, so that the first lifting plate 1142 corresponds to the material tray 101 on the layer above the bottommost material tray 101; then the first lifting cylinder 1141 drives the first lifting plate 1142 to extend to the bottom of the upper tray 101, meanwhile, the first jacking cylinder 1131 drives the feeding lifting plate 112 to descend, the tray 101 at the bottommost layer descends along with the descending plate synchronously and is placed on the feeding conveying line 111, and the feeding conveying line 111 conveys the tray 101 to the material taking mechanism 103; then, the first lifting cylinder 1131 ascends to support the stacked tray 101, and the first lifting cylinder 1141 resets to wait for the next loading.

Referring to fig. 5 and 6, the material taking mechanism 103 includes a material taking conveying line 121, a material taking lifting plate 122, a second lifting assembly 123, and a first blocking assembly 124. The material taking conveying line 121 is identical to and level with the feeding conveying line 111 in conveying direction, and the material taking conveying line 121 is used for receiving the material tray 101 conveyed by the feeding conveying line 111; the second jacking assembly 123 is connected below the material taking jacking plate 122 and can push the material taking jacking plate 122 to descend or ascend along the Z-axis direction so as to enable the material tray 101 to be in contact with or not in contact with the material taking conveying line 121; the first blocking assembly 124 is located at an end of the material taking conveying line 121 far away from the loading mechanism 102 to prevent the material tray 101 on the material taking conveying line 121 from flowing out.

The second jacking assembly 123 is similar to the first jacking assembly 113 in structure, and is not described herein again. The first blocking assembly 124 includes a first blocking cylinder 1241 and a first blocking block 1242 connected to the first blocking cylinder 1241, and the first blocking cylinder 1241 may drive the first blocking block 1242 to ascend or descend along the Z-axis direction to block the tray 101 or circulate the tray 101.

Preferably, in order to improve the stability of the tray 101 after rising, in this embodiment, the material taking mechanism 103 further includes a tray pressing plate 125 fixed above the material taking conveying line 121, and the tray pressing plate 125 is an annular structure and corresponds to the edge of the tray 101. When the second jacking assembly 123 drives the tray 101 to be separated from the material taking conveying line 121, the tray 101 is held between the material taking jacking plate 122 and the tray pressing plate 125.

When the material taking mechanism 103 works, the first blocking cylinder 1241 drives the first blocking block 1242 to ascend, the material taking conveying line 121 receives the material tray 101 conveyed by the feeding conveying line 111, and conveys the material tray 101 to the first blocking block 1242 and is blocked; the second jacking assembly 123 drives the material taking jacking plate 122 to ascend so as to drive the material tray 101 to ascend synchronously therewith and abut against the material tray pressing plate 125; the carrying mechanism 200 can carry the substrate 600 on the tray 101 from the material taking mechanism 103 to the turntable mechanism 400.

Referring to fig. 7 and 8, the buffer mechanism 104 is used for receiving the tray 101 which is empty after the substrate 600 is taken out by the taking mechanism 103, and conveying the tray 101 to the discharging mechanism 105. The buffer mechanism 104 includes a buffer conveying line 131, a buffer lifting plate 132, a third lifting unit 133, a second lifting unit 134, and a second blocking unit 135.

The buffer conveying line 131 is in the same conveying direction as the material taking conveying line 121 and is level with the material taking conveying line 121, and the buffer conveying line 131 is used for receiving the material trays 101 conveyed from the material taking conveying line 121. The buffer lifting plate 132 is stacked with a plurality of empty trays 101. The third jacking assembly 133 is connected below the buffer jacking plate 132 and can push the buffer jacking plate 132 to descend or ascend along the Z-axis direction, so that the tray 101 is in contact with or not in contact with the material taking conveying line 121. The second lifting assembly 134 is located at the side of the buffer lifting plate 132, and can be close to or far from the tray 101 along the Y-axis direction to support other trays 101 except for the bottommost layer; the second blocking member 135 is located at an end of the buffer conveying line 131 far from the material taking mechanism 103 to prevent the material tray 101 on the buffer conveying line 131 from flowing out. The third lifting assembly 133 is similar to the first lifting assembly 113 in structure, the second lifting assembly 134 is similar to the first lifting assembly 114 in structure, and the second blocking assembly 135 is similar to the first blocking assembly 124 in structure, and the structure thereof is not repeated herein.

When the caching mechanism 104 receives the tray 101, the third jacking component 133 is located below the caching conveyor line 131, the second jacking component 134 supports the empty tray 101, and the tray 101 is conveyed from the material taking conveyor line 121 to the caching conveyor line 131 and is blocked by the second blocking component 135; then the third jacking component 133 drives the buffer jacking plate 132 to ascend so as to drive the tray 101 to abut against the bottom layer of the stacked tray 101, so as to support the stacked tray 101; the second lifting assembly 134 is then moved away from the tray 101 to release the tray 101 for receiving. When the caching mechanism 104 needs to convey the tray 101 to the discharging mechanism 105, the operation process is similar to that of the feeding mechanism 102, and the detailed description is omitted here. By arranging the buffer mechanism 104, when the carrying mechanism 200 takes materials from the material tray 101 at the material taking mechanism 103, the buffer mechanism 104 can convey the empty material tray 101 to the discharging mechanism 105, so that the carrying mechanism 200 can place the detected qualified products into the discharging mechanism 105, thereby realizing the continuous conveying of the material tray 101 and improving the conveying efficiency.

The discharging mechanism 105 has the same structure as the material taking mechanism 103, and is configured to receive the empty tray 101 flowing out from the buffer mechanism 104, and the conveying mechanism 200 can convey the qualified substrates 600 after detection onto the tray 101 of the discharging mechanism 105. The blanking mechanism 106 has the same structure as the loading mechanism 102, and is configured to receive the tray 101 containing the acceptable substrates 600 and stack the tray 101.

Further, as shown in fig. 9, the conveying mechanism 200 includes a loading conveying mechanism 201 and a unloading conveying mechanism 202, the loading conveying mechanism 201 is used for conveying the substrate 600 in the loading tray 101 of the material taking mechanism 103 to the turntable mechanism 400, and the unloading conveying mechanism 202 is used for conveying the qualified substrate 600 after detection to the loading tray 101 of the material discharging mechanism 105 or conveying the unqualified substrate 600 after detection to the defective product collecting mechanism 300. The structure of the feeding and conveying mechanism 201 is the same as that of the discharging and conveying mechanism 202.

Referring to fig. 10 to 12, the material handling mechanism 201 includes, as an example: a manipulator 203; the suction nozzle assembly 204 is used for picking and placing the substrate 600; and a buffer assembly 205 installed between the robot arm 203 and the nozzle assembly 204; wherein the buffer assembly 205 is configured to provide a reaction force for buffering when the nozzle assembly 204 is in contact with the substrate 600.

The robot 203 is a multi-axis robot that can move in the direction of axis X, Y, Z. the robot 203 is prior art in this field and the structure thereof will not be described herein.

The buffer assembly 205 includes a first mounting bracket 211 fixedly mounted on the robot 203, a first connecting member 212 movably mounted on the first mounting bracket 211, and a first elastic member 213 abutting against the first connecting member 212. The first connector 212 is fixedly connected to the nozzle assembly 204. The first elastic member 213 may compress and cushion the substrate 600 when the nozzle assembly 204 is in contact with the substrate 600, and reset the first connector 212 when the nozzle assembly 204 is out of contact with the substrate 600.

The first mounting bracket 211 comprises a first mounting plate 2111 arranged along the direction vertical to the Z axis, the first mounting plate 2111 is provided with a mounting hole 2112, a second connecting piece 214 capable of moving along the Z axis is movably arranged in the mounting hole 2112 in a penetrating manner, and the second connecting piece 214 is fixedly connected with the first connecting piece 212. The second connecting element 214 is embodied as a contour screw, and the cap portion 2141 of the second connecting element 214 contacts with the upper end surface of the first mounting plate 2111 to support the second connecting element 214 and prevent it from being separated from the first mounting plate 2111 due to gravity. The first elastic member 213 is disposed outside the second connecting member 214, and both ends of the first elastic member are respectively in contact with the first mounting plate 2111 and the first connecting member 212. When the substrate 600 needs to be picked and placed, the robot 203 drives the suction nozzle assembly 204 to move to a position above the substrate 600, and to approach and contact the substrate 600 along the Z-axis direction, and when the suction nozzle assembly 204 contacts the substrate 600, the first connecting member 212 is pressed to be away from the substrate 600 along the Z-axis direction, and meanwhile, the first elastic member 213 is compressed by the first connecting member 212, so that the substrate 600 is buffered.

Further, in the present embodiment, the buffer assembly 205 further includes a guide rail assembly 215 received between the first mounting bracket 211 and the first connector 212 to guide the first connector 212 to move along the Z-axis direction relative to the first mounting bracket 211. Specifically, the first mounting bracket 211 includes a second mounting plate 2113 fixedly connected to the first mounting plate 2111, the first mounting plate 2111 and the second mounting plate 2113 are perpendicular to each other, and the rail assembly 215 includes a rail 2151 arranged along the Z-axis direction and a slider 2152 slidably coupled thereto, wherein the rail 2151 is fixed to the first connecting member 212, and the slider 2152 is fixed to the second mounting plate 2113. In this embodiment, the two second mounting plates 2113 are disposed opposite to each other, a mounting space for accommodating the first connecting member 212 and the first mounting plate 2111 is formed between the second mounting plates 2113, and a set of rail assemblies 215 is disposed between each of the two second mounting plates 2113 and the first connecting member 212.

Further, the nozzle assembly 204 includes a connection plate 221 connected to the first connection member 212, a first nozzle 222 installed on the connection plate 221, and a second nozzle 223 installed on the first nozzle 222, the first nozzle 222 and the second nozzle 223 being independent of each other, the first nozzle 222 being used for sucking the substrate body 61, and the first nozzle 222 including a plurality of first nozzles 2221 corresponding to the substrate body 61. The second suction head 223 is used to suck the flexible board 63, and the second suction head 223 includes a plurality of second suction nozzles 2231 corresponding to the flexible board 63. Preferably, the portions of the first suction nozzle 2221 and the second suction nozzle 2231, which contact the substrate 600, are made of a silicone material to avoid damaging the substrate 600.

Further, the loading and transporting mechanism 201 further includes a first camera assembly 231, and the first camera assembly 231 is used for positioning the substrate 600 to ensure that the robot 203 moves to an accurate pick-and-place position. The first camera module 231 includes a second mounting frame 2311 fixedly connected to the first mounting frame 211, a first camera 2312 mounted on the second mounting frame 2311, a lens of the first camera 2312 facing the substrate 600, and a first light source 2313 positioned below the first camera 2312 and concentrically arranged with the first camera 2312. By providing the first camera assembly 231, it can accurately recognize the substrate 600 to ensure that the robot 203 accurately carries the substrate 600.

Preferably, as shown in fig. 9 and 13, the conveying mechanism 200 further includes a retest switching mechanism 206 located between the loading conveying mechanism 201 and the unloading conveying mechanism 202, and the retest switching mechanism 206 can drive the substrate 600 to move back and forth between the loading conveying mechanism 201 and the unloading conveying mechanism 202. When the detection mechanism 500 detects that the substrate 600 is abnormal, the blanking conveying mechanism 202 puts the substrate 600 into the retest switching mechanism 206, the retest switching mechanism 206 moves the substrate 600 to the loading conveying mechanism 201, and the loading conveying mechanism 201 puts the substrate onto the same positioning tool 42 of the turntable mechanism 400 again for retest; when the detection mechanism 500 detects the substrate 600 again, the unloading conveying mechanism 202 puts the substrate 600 into the retest switching mechanism 206, the retest switching mechanism 206 moves the substrate 600 to the unloading conveying mechanism 201, and the unloading conveying mechanism 201 puts the substrate onto another positioning tool 42 for retest.

The retest switch mechanism 206 includes a first driving member 241 and a retest accommodation plate 242 mounted on the first driving member 241, and the retest accommodation plate 242 is recessed with an accommodation cavity (not shown) for accommodating the substrate 600. In this embodiment, the first driving member 241 is embodied as a rodless cylinder, and the reciprocating accommodating plate 242 is mounted on the sliding portion of the first driving member 241. The first driving member 241 and the retest accommodation plate 242 may be provided in plurality as needed to improve the conveying efficiency.

Preferably, the carrying mechanism 200 further includes a second camera assembly 207, the structure of the second camera assembly 207 is the same as that of the first camera assembly 231, and the lens of the second camera assembly 207 faces the nozzle assembly 204. The second camera assemblies 207 are two in number and are respectively located at the feeding and carrying mechanism 201 and the discharging and carrying mechanism 202. After the loading and carrying mechanism 201 absorbs the substrate 600 from the material taking mechanism 103, the loading and carrying mechanism 201 moves the substrate 600 to a position above the second camera assembly 207 for secondary positioning, so as to improve the position accuracy of the substrate 600 placed in the turntable mechanism 400; after the substrate 600 is taken out from the turntable mechanism 400 by the blanking conveying mechanism 202, the blanking conveying mechanism 202 moves the substrate 600 to a position above the second camera assembly 207 for secondary positioning, so as to improve the position accuracy of the substrate 600 placed in the placing mechanism 105 or the retesting switching mechanism 206.

Further, referring to fig. 14, the defective item collecting mechanism 300 includes a third mounting block 31, a pull-out plate 32 slidably coupled to the third mounting block 31, and a defective item containing plate 33 fixed to the pull-out plate 32 for containing the substrate 600, wherein the defective item containing plate 33 is recessed with a containing cavity (not shown) for containing the substrate 600. The pull plate 32 is mounted with a handle 34, and the operator can grip the handle 34 to pull the pull plate 32 out of the cabinet 700 for the operator to take out the base plate 600. One or more defective product collecting mechanisms 300 can be arranged according to the requirement, the application is not limited herein, the defective product collecting mechanism 300 can be arranged at the discharging and carrying mechanism 202 and/or the feeding and carrying mechanism 201, and when the defective product collecting mechanism 300 is positioned at the discharging and carrying mechanism 202, the discharging and carrying mechanism 202 can directly move the detected unqualified substrate 600 to the defective product collecting mechanism 300; when the substrate is located at the loading and transporting mechanism 201, the unloading and transporting mechanism 202 can move the substrate 600 to the retest switching mechanism 206, and then the loading and transporting mechanism 201 can move the substrate from the retest switching mechanism 206 to the defective product collecting mechanism 300.

Further, referring to fig. 15, the turntable mechanism 400 includes a turntable 41 and a plurality of positioning tools 42 for positioning the substrate 600, the positioning tools 42 are distributed on the turntable 41 along the circumferential direction of the turntable 41, and the turntable 41 is configured to rotate the positioning tools 42 to or away from the detection mechanism 500. The dial 41 may be driven using a cam divider to make the angle of each rotation of the dial 41 uniform.

Referring to fig. 16 to 18, the positioning tool 42 includes a tool main body 421, and an accommodating groove 421a is formed in the tool main body 421 in a concave manner along the Z-axis direction to accommodate the substrate main body 61. A plurality of positioning blocks 422 are fixed in the accommodating groove 421a, the positioning blocks 422 abut against the edge of the substrate main body 61 to limit and position the substrate main body 61, and the flexible plate 63 is disposed on the end face of the tool main body 421. In this embodiment, one surface of the substrate main body 61, on which the button 62 is disposed, faces the bottom of the accommodating groove 421a, and the height of the button 62 is lower than the height of the end surface of the substrate main body 61 facing the accommodating groove 421a, so as to prevent the button 62 from contacting the accommodating groove 421 a. The bottom of the containing groove 421a is provided with a first through hole 421b, and the first through hole 421b corresponds to the button 62, so that the detecting mechanism 500 extends into the first through hole 421b and presses the button 62.

Preferably, a vacuum channel (not shown) is formed in the tool main body 421, one end of the vacuum channel is used for externally connecting the air pipe 423, the other end of the vacuum channel extends to the bottom of the accommodating groove 421a, a third suction nozzle 424 communicated with the vacuum channel can be arranged at the bottom of the accommodating groove, and the third suction nozzle 424 is in contact with the substrate 600. The third suction nozzle 424 sucks the substrate main body 61 by connecting a vacuum device (not shown) to the air pipe 423, and further fixes the substrate main body 61 placed in the containing groove 421a, so as to prevent the substrate 600 on the positioning tool 42 from being separated or deviated when the positioning tool 42 is moved.

Further, referring to fig. 15, the detection mechanism 500 includes a conduction detection mechanism 501 and an electrical performance detection mechanism 502 to detect the OS and the LCR of the substrate 600, respectively.

Referring to fig. 19, the conduction detection mechanism 501 includes: a conduction detection unit 503 for detecting a circuit of the substrate 600; a pressing component 504 for pressing the button 62 to detect the short circuit and the open circuit of the circuit in cooperation with the conduction detection component 503; and a pressing assembly 505 for pressing the substrate 600 onto the positioning tool 42 to prevent the substrate 600 from moving when the pressing assembly 504 presses the button 62.

Further, the conduction detection mechanism 501 further comprises a first bracket 506, and the conduction detection assembly 503 and the pressing assembly 505 are both mounted on the first bracket 506 and located above the positioning tool 42.

Referring to fig. 20 to 23, the conduction detecting assembly 503 includes a second driving member 52 and a first testing head 53 in driving connection with the second driving member, the first testing head 53 corresponds to the connection portion 631 of the substrate 600, and the second driving member 52 can drive the first testing head 53 to move along the Z-axis direction to contact or release the pins on the connection portion 631. In the present embodiment, the second driving member 52 is embodied as a slide cylinder.

The first test head 53 includes a first pin mold mounting plate 531, a first pin mold 532, a first pin mold cover plate 533, a first transfer plate 534, and a plurality of first probes 535. First needle mould mounting panel 531 is fixed on second driving piece 52, first needle mould 532 is fixed on first needle mould mounting panel 531, first needle mould apron 533 is fixed at first needle mould 532 up end, first adapter plate 534 is fixed between first needle mould mounting panel 531 and first needle mould 532, first probe 535 is worn to establish in first needle mould 532 along the Z axle direction, the up end of first needle mould 532 is passed and is fixed on first needle mould apron 533 to the one end of first probe 535, the other end pass first needle mould 532 down the terminal surface and with pin one-to-one. The first probe 535 is electrically connected to the first transfer board 534 to be connected to an external test instrument (not shown).

The lower end of the first needle mold 532 is provided with a first sinking groove 532a facing inwards, the first testing head 53 further comprises a first floating block 536 and a second elastic member 537 accommodated in the first sinking groove 532a, and two ends of the second elastic member 537 are respectively connected with the first floating block 536 and the first needle mold 532. The lower end surface of the first slider 536 is projected by the second resilient member 537 with respect to the lower end surface of the first needle mold 532, and the second resilient member 537 is compressed by an external force to move in a direction away from the flexible board 63. The first slider 536 has a first avoiding hole 536a corresponding to the connecting portion 631 of the flexible board 63 to avoid the connecting portion 631 and the first probe 535.

When the conduction detection assembly 503 works, the second driving member 52 drives the first test head 53 to move towards the connection portion 631 of the flexible board 63, at this time, the first slider 536 first contacts with the positioning fixture 42 and gradually moves towards the first pin mold 532 under the action of the second elastic member 537, the first probe 535 contacts with the pin of the connection portion 631 along with the compression of the second elastic member 537, and the first slider 536 can effectively buffer the first probe 535.

Further, referring to fig. 24, the pressing assembly 504 is disposed below the turntable 41, and includes a third driving member 54 and a pressing head 55 in transmission connection therewith, the pressing head 55 corresponds to the button 62 of the substrate 600, and the third driving member 54 can drive the pressing head 55 to move along the Z-axis direction to press or release the button 62. In this embodiment, the third drive 54 is preferably a servo slide to improve the accuracy of the stroke.

The pressing head 55 is a column structure adapted to the first through hole 421b, and the third driving member 54 can drive the pressing head 55 to extend into the first through hole 421b to press the button 62. Preferably, the pressing head 55 is provided with a pressure sensor 551, the pressure sensor 551 can sense the pressure of the pressing head 55 pressing the button 62, and when the set value is reached, the pressure sensor 551 sends a signal to drive the third driving member 54 to stop, so as to avoid the button 62 being damaged by too much pressing force of the button 62 and the button 62 not being fully triggered by too little pressing force.

Further, referring to fig. 25, the pressing assembly 505 includes a fourth driving member 56 and a pressing head 57 drivingly connected thereto, and the fourth driving member 56 can drive the pressing head 57 to move closer to or away from the substrate 600 to press or release the substrate 600 onto or from the positioning tool 42. In the present embodiment, the fourth driving member 56 is embodied as a slide cylinder.

The pressing head 57 includes a mounting block 571 fixedly mounted on the fourth driving member 56 and a first abutting portion 572 fixedly mounted on the mounting block 571. The first abutting portion 572 is a column-shaped structure, protrudes from the lower end surface of the mounting block 571, and corresponds to the pressing head 55, and the first abutting portion 572 abuts against a surface of the substrate 600 away from the button 62, so as to limit the movement of the substrate 600 when the pressing head 55 presses the button 62. Preferably, the pressing head 57 further includes a second floating block 573 floatingly disposed on the mounting block 571, a lower end surface of the second floating block 573 protrudes relative to a lower end surface of the mounting block 571, and the specific structure and function of the second floating block 573 are similar to those of the first floating block 536, and will not be described herein again. When the pressing assembly 505 operates, the fourth driving member 56 drives the first abutting portion 572 to move towards the substrate 600, the second floating block 573 contacts with the substrate 600 and gradually moves towards the mounting block 571 to buffer the first abutting portion 572, and the first abutting portion 572 contacts with the upper end face of the substrate 600 to press the substrate 600.

Further, referring to fig. 19, the conduction check mechanism 501 further includes a first multi-axis adjustment unit 507, the first multi-axis adjustment unit 507 is disposed on the first support 506, and the conduction check unit 503 is mounted on the first multi-axis adjustment unit 507 so as to adjust the position of the conduction check unit 503 to ensure that the first test head 53 completely corresponds to the connection portion 631 of the substrate 600. In this embodiment, the first multi-axis adjustment assembly 507 is specifically an electric sliding table, which can translate in the X-axis and Y-axis directions and rotate around the Z-axis, and the electric sliding table is a common knowledge in the art and is not described herein again.

Further, referring to fig. 15, the conduction detection mechanism 501 further includes a first positioning mechanism, the first positioning mechanism includes a third camera component 581, the third camera component 581 is disposed at the upstream of the conduction detection component 503, the third camera component 581 is used for shooting the substrate 600 to be detected and acquiring an image thereof, and the detection device can perform calculation to correspondingly adjust the first multi-axis adjustment component 507 according to the position of the substrate 600 to ensure that the first test head 53 completely corresponds to the substrate 600.

Since there may be a deviation in the position accuracy of the first multi-axis adjustment assembly 507 after a plurality of movements, it is preferable that the first positioning mechanism further includes a fourth camera assembly 582 for calibrating the first multi-axis adjustment assembly 507. A fourth camera assembly 582 is disposed under the turntable 41, the fourth camera assembly 582 is configured to capture the first test head 53 and obtain an image thereof, and the detection system may perform a calculation to adjust the first multi-axis adjustment assembly 507 according to the position of the first test head 53. In order to ensure that the fourth camera assembly 582 can smoothly shoot the first test head 53, a second avoiding hole (not shown) is formed in the turntable 41, and the second avoiding hole is located between two adjacent positioning tools 42.

Further, referring to fig. 26, the electrical performance detecting mechanism 502 includes an electrical performance detecting assembly 508, which includes a fifth driving member 50 and a second testing head 51 in transmission connection therewith, wherein the fifth driving member 50 can drive the second testing head 51 to contact with or release from the substrate main body 61 to detect the LCR of the substrate main body 61. In the present embodiment, the fifth driving unit 50 employs a slide cylinder, which drives the second test head 51 to move toward or away from the positioning tool 42 along the Z-axis direction.

Referring to fig. 27 and 28, the second test head 51 includes a second pin mold mounting plate 511, a second pin mold 512, a second interposer 513, and a plurality of second probes 514. The second needle pattern mounting plate 511 is fixedly mounted on the fifth driving member 50. The second pin die 512 is fixedly installed on the second pin die installation plate 511. The second adapter plate 513 is used for connecting with an external LCR tester, and the second adapter plate 513 is installed on the second pin mold 512 and is located between the second pin mold installation plate 511 and the second pin mold 512. A second probe 514 is mounted on the second pin die 512 and electrically connected to the second interposer 513.

The second pin mold 512 is recessed with a second sinking groove 512a from a lower end surface thereof, and the second test head 51 further includes a first floating structure floatingly disposed in the second sinking groove 512a, the first floating structure being configured to buffer the second probe 514 when the second probe 514 contacts the substrate main body 61.

The first floating structure includes a third elastic member 515 and a third slider 516. The thickness of the third slider 516 is the same as the depth of the second sinker 512a, and the third slider 516 is movable in the Z-axis direction with respect to the second pin die 512. The third elastic member 515 is connected between the third slider 516 and the groove bottom of the second sinking groove 512a, and causes the third slider 516 to protrude toward the substrate 600 with respect to the second pin die 512. When the fifth driving element 50 drives the second test head 51 to approach the positioning fixture 42, the third slider 516 may contact the positioning fixture 42 first, and under the compression action of the third elastic element 515, the third slider 516 moves away from the positioning fixture 42 to buffer the second probe 514.

The third slider 516 has a second through hole 516a corresponding to the second probe 514, and the second probe 514 can pass through the second through hole 516a and contact the substrate main body 61. The inner diameter of the second through hole 516a is larger than or equal to the maximum outer diameter of the second probe 514, ensuring that the second probe 514 is not affected when the third slider 516 moves.

In order to avoid that the third slider 516 presses the substrate main body 61 after the second test head 51 is pressed down to the right position, it is preferable that a second abutting portion 5161 is convexly arranged on an end surface of the third slider 516 facing the positioning tool 42, the second abutting portion 5161 is used for contacting with the end surface of the positioning tool 42, and the second abutting portion 5161 and the third slider 516 cooperate to form an avoiding space avoiding the substrate 600. Specifically, the height of the second abutting portion 5161 is greater than the height from the end surface of the positioning tool 42 to the highest point of the substrate 600, so that when the second abutting portion 5161 contacts with the end surface of the positioning tool 42, the end surface of the third floating block 516 does not contact with the substrate 600. In this embodiment, the second abutting portions 5161 are distributed intermittently, and the number of the second abutting portions is two, and the second abutting portions are respectively located on two sides of the third slider 516. Indeed, in other embodiments, the second supporting portions 5161 may be continuously distributed on the periphery of the substrate body 61.

Preferably, the second pin die 512 is provided with a third sinking groove 512b inwards from the lower end surface thereof, the second testing head 51 further comprises a second floating structure which is arranged in the third sinking groove 512b in a floating manner, the second floating structure corresponds to the flexible board 63, the second floating structure can flatten the flexible board 63 when the second probe 514 contacts the substrate main body 61, and the flexible board 63 is effectively buffered, so that the flexible board 63 is prevented from being damaged.

The second floating structure includes a fourth elastic member 517 and a fourth slider 518. The thickness of the fourth slider 518 is the same as the depth of the third sinker 512b, and the fourth slider 518 is movable in the Z-axis direction with respect to the second pin die 512. The fourth elastic member 517 is connected between the fourth slider 518 and the bottom of the third recess 512b, and causes the fourth slider 518 to protrude toward the flexible board 63 with respect to the second pin die 512. When the fifth driving member 50 drives the second test head 51 to approach the positioning tool 42, the fourth slider 518 may contact the flexible plate 63 first to flatten the flexible plate 63, and at the same time, under the compression action of the fourth elastic member 517, the fourth slider 518 moves away from the positioning tool 42 to buffer the flexible plate 63.

Further, referring to fig. 26, the electrical performance detection mechanism 502 further includes a second multi-axis adjustment assembly 509, and the electrical performance detection assembly 508 is mounted on the second multi-axis adjustment assembly 509 so as to adjust the position of the electrical performance detection assembly 508 to ensure that the second test head 51 completely corresponds to the substrate main body 61. The second multi-axis adjustment assembly 509 is identical in structure to the first multi-axis adjustment assembly 507.

Further, referring to fig. 15, the electrical performance detection mechanism 502 further includes a second positioning mechanism, the second positioning mechanism includes a fifth camera assembly 591, the fifth camera assembly 591 is disposed upstream of the electrical performance detection assembly 508, and the fifth camera assembly 591 and the third camera assembly 581 are identical in structure, so as to adjust the second multi-axis adjustment assembly 509 according to the position of the substrate 600, and ensure that the second test head 51 completely corresponds to the substrate 600. In addition, the second positioning mechanism further includes a sixth camera assembly 592 for calibrating the second multi-axis adjustment assembly 509, the sixth camera assembly 592 is disposed below the turntable 41 and corresponds to the second test head 51. Sixth camera assembly 592 and fourth camera assembly 582 are identical in construction to provide corresponding adjustment of second multi-axis adjustment assembly 509 based on the position of second test head 51.

s1, the carrying mechanism 200 feeds the substrate 600 to the positioning tool 42 of the turntable mechanism 400;

s2, the turntable mechanism 400 drives the substrate 600 to move to the detection mechanism 500 for detection;

s3, if the substrate 600 is detected to be qualified, the transporting mechanism 200 discharges the substrate 600 to the transporting mechanism 100, if the substrate 600 is detected to be unqualified, the turntable mechanism 400 moves the substrate 600 to the detecting mechanism 500 for secondary detection, if the substrate 600 is detected to be unqualified for the secondary detection, the transporting mechanism 200 moves the substrate 600 to another positioning tool 42 for the third detection, and if the substrate 600 is detected to be unqualified for the third detection, the transporting mechanism 200 moves the substrate 600 to the defective product collecting mechanism 300.

In step S3, when the substrate 600 fails the first inspection, the conveyance mechanism 200 removes the substrate 600 and replaces the same positioning tool 42.

The above is only one embodiment of the present invention, and any other modifications based on the concept of the present invention are considered as the protection scope of the present invention.

Claims

1. A substrate detection system, characterized by: the method comprises the following steps:

a detection mechanism (500) for detecting the substrate (600);

the turntable mechanism (400) comprises a turntable (41) and positioning tools (42) for positioning the substrate (600), the positioning tools (42) are distributed on the turntable (41) along the circumferential direction of the turntable (41), and the turntable (41) is configured to rotate the positioning tools (42) to or away from the detection mechanism (500);

a transport mechanism (100) configured to transport the substrate (600) to be inspected to the carousel mechanism (400) and to receive the qualified substrate (600) after inspection and to transport it away from the carousel mechanism (400); and

the carrying mechanism (200) comprises a loading carrying mechanism (201) for moving the substrate (600) from the conveying mechanism (100) to the turntable mechanism (400), a blanking carrying mechanism (202) for moving the substrate (600) from the turntable mechanism (400) to the conveying mechanism (100), and a retest switching mechanism (206) positioned between the loading carrying mechanism (201) and the blanking carrying mechanism (202), wherein the retest switching mechanism (206) can drive the substrate (600) to move back and forth between the loading carrying mechanism (201) and the blanking carrying mechanism (202).

2. The substrate inspection system of claim 1, wherein: the conveying mechanism (100) comprises a material tray (101) for storing the substrate (600), and a feeding mechanism (102), a taking mechanism (103), a caching mechanism (104), a discharging mechanism (105) and a discharging mechanism (106) which are sequentially arranged side by side;

wherein, feed mechanism (102) are used for piling up charging tray (101), and will charging tray (101) are carried extremely extracting mechanism (103), extracting mechanism (103) are used for receiving charging tray (101) and supply handling mechanism (200) take out base plate (600), buffer memory mechanism (104) are used for receiving the vacant of extracting mechanism (103) input charging tray (101), drop feed mechanism (105) are used for receiving vacant charging tray (101) and supply handling mechanism (200) are put into base plate (600), unloading mechanism (106) are used for receiving and pile up and fill with after the detection charging tray (101) of base plate (600).

3. The substrate inspection system of claim 1, wherein: the substrate detection system further comprises a defective product collection mechanism (300) for receiving the substrate (600) that is defective after detection.

4. The substrate inspection system of claim 1, wherein: the feeding and carrying mechanism (201) and the blanking and carrying mechanism (202) are identical in structure, the feeding and carrying mechanism (201) comprises a mechanical arm (203), a suction nozzle assembly (204) for taking and placing the substrate (600), and a buffer assembly (205) installed between the mechanical arm (203) and the suction nozzle assembly (204), and the buffer assembly (205) is configured to provide reaction force for buffering when the suction nozzle assembly (204) is in contact with the substrate (600).

5. The substrate inspection system of claim 1, wherein: the conveying mechanism (200) further comprises a second camera assembly (207), and the feeding conveying mechanism (201) and the discharging conveying mechanism (202) are positioned through the second camera assembly (207).

6. The substrate inspection system of claim 3, wherein: the defective product collecting mechanism (300) comprises a third mounting frame (31), a drawing plate (32) matched and connected with the third mounting frame (31) in a sliding mode, and a defective product containing plate (33) fixed to the drawing plate (32) and used for containing the substrate (600), wherein a handle (34) is installed on the drawing plate (32) so that the drawing plate (32) can be drawn and pulled towards the outside of the substrate detection system.

7. The substrate inspection system of claim 1, wherein: detection mechanism (500) are including being located carousel (41) department switch on detection mechanism (501) and electric properties detection mechanism (502), carousel (41) drive base plate (600) pass through in proper order switch on detection mechanism (501) with electric properties detection mechanism (502).

8. The substrate inspection system of claim 1, wherein: concave down shaping of location frock (42) has and accepts and fixes a position storage tank (421a) of base plate (600), the tank bottom of storage tank (421a) be equipped with third suction nozzle (424) that base plate (600) contacted.

9. A method of detection, characterized by: the method comprises the following steps:

s1, the conveying mechanism (200) loads the substrate (600) to the positioning tool (42) of the turntable mechanism (400);

s2, the turntable mechanism (400) drives the substrate (600) to move to the detection mechanism (500) for detection;

s3, if the substrate (600) is detected to be qualified, the carrying mechanism (200) feeds the substrate (600) to the conveying mechanism (100), if the substrate (600) is detected to be unqualified, the turntable mechanism (400) moves the substrate (600) to the detection mechanism (500) for secondary detection, if the substrate (600) is detected to be unqualified for the secondary detection, the carrying mechanism (200) moves the substrate (600) to another positioning tool (42) for the third detection, and if the substrate (600) is detected to be unqualified for the third time, the carrying mechanism (200) moves the substrate (600) to the unqualified product collection mechanism (300).

10. The detection method according to claim 9, characterized in that: in step S3, when the substrate (600) fails the first inspection, the conveyance mechanism (200) removes the substrate (600) and replaces it with the same positioning tool (42).