TW202015285A - Electronic component crimp device and test handler using the same capable of effectively reducing the component configuration and assembly operations of the crimp tool - Google Patents
Electronic component crimp device and test handler using the same capable of effectively reducing the component configuration and assembly operations of the crimp tool Download PDFInfo
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Abstract
Description
本發明係提供一種可縮減元件而節省成本,並提升組裝便利性之電子元件壓接裝置。The present invention provides an electronic component crimping device that can reduce components, save costs, and improve ease of assembly.
在現今,電子元件(例如具錫球之IC)概分為邏輯IC、記憶體IC等不同類型,然不論何種類型之電子元件皆必須於測試設備上進行測試作業,以淘汰不良品;請參閱第1~3圖,係為電子元件測試設備之測試裝置10及壓接裝置20的示意圖,該測試裝置10係設有電性連接之電路板11及複數個測試座12,並以複數個測試座12承置及測試複數個電子元件13,該壓接裝置20係位於測試裝置10之上方,並設置一作Y-Z方向位移之移動臂21,移動臂21之底部裝配有複數個壓接器22,以移載及下壓待測之電子元件13,其中,該壓接器22包含承座221、封板222及作動部件223,該承座221之內部係設有承置部2211,以承置一可彈性變形之膜片224,該膜片224係貼接該作動部件223,並與封板222之間設有一容納氣體之腔室,腔室之一側連通一注入氣體之注入口2221,於將氣體注入腔室後,可使膜片224向下凸伸變形,並頂推該作動部件223作Z方向向下位移,使承座221與作動部件223之間具有緩衝浮動空間,另於該作動部件223之底部裝配一可移載及下壓電子元件之壓移件225;於使用時,該壓接裝置20之移動臂21係帶動複數個壓接器22及電子元件13作Y-Z方向位移至測試裝置10之上方,並令壓接器22之壓移件225將電子元件13移入測試座12內,且以一下壓力下壓電子元件13,使電子元件13之接點131電性接觸測試座12之探針121而執行測試作業,由於測試座12之複數支探針121會對電子元件13產生一反作用力,此一反作用力經由電子元件13而頂推該壓移件225及作動部件223作Z方向向上位移,作動部件223則頂壓膜片224而作Z方向向上浮動位移;惟此一壓接裝置20之作動部件223於多次作Z方向向上頂壓膜片224時,該作動部件223之頂面邊角即不斷頂撐磨損膜片224之同一部位A,導致膜片224之該部位A於長期承受作動部件223之邊角頂撐下而產生疲勞破損,以致必須更換新的膜片224,進而增加使用成本;尤其當膜片224破損時,腔室內之氣體即由膜片224破損之該部位A外洩,因而影響壓接具22之壓移件225的下壓力值,以致壓接具22無法以預設下壓力下壓電子元件13執行測試作業,進而影響測試品質;再者,於更換膜片時,工作人員必需將整組壓接器22拆卸,方可更換膜片224,亦增加作業不便及降低生產效能。Nowadays, electronic components (such as ICs with solder balls) are divided into different types such as logic IC and memory IC. However, no matter what type of electronic component must be tested on the test equipment to eliminate defective products; please Refer to Figures 1 to 3, which are schematic diagrams of the
本發明之目的一,係提供一種電子元件壓接裝置,其係設置一由移動臂驅動位移之壓接器,該壓接器係設有一具氣室之本體,該氣室並由一通氣道注入氣體,另於本體之下方裝配一壓接具,該壓接具第一端之承壓部件係裝配於本體之氣室內,並令第二端之壓接部件位於本體之下方,該壓接部件之底部則設有至少一壓接電子元件之接合件,另於本體之氣室與壓接具之承壓部件間係設置至少一防洩件,於壓接具之接合件承受電子元件之反作用力時,該壓接具係以承壓部件頂壓氣室內之氣體,使壓接具及電子元件向上浮動位移,藉此有效縮減該壓接具之元件配置及組裝作業,達到節省成本及提高生產效能之實用效益。The first object of the present invention is to provide a crimping device for electronic components, which is provided with a crimping device driven and displaced by a moving arm, the crimping device is provided with a body with an air chamber, and the air chamber is injected through an air passage Gas, another crimping tool is assembled under the body, the pressure-bearing component at the first end of the crimping tool is assembled in the gas chamber of the body, and the crimping component at the second end is located below the body, the crimping component At the bottom, there is at least one joint for crimping electronic components. At least one anti-leakage member is provided between the air chamber of the body and the pressure-bearing part of the crimping tool. The joint of the crimping tool bears the reaction of the electronic component When the force is applied, the crimping tool presses the gas in the pressure chamber with the pressure-bearing component, so that the crimping tool and the electronic component float upwardly displaced, thereby effectively reducing the component configuration and assembly work of the crimping tool, saving costs and improving production Practical benefits of efficiency.
本發明之目的二,係提供一種電子元件壓接裝置,其壓接器之壓接具作Z方向向上浮動位移時,係以承壓部件壓縮氣室內之氣體,使得壓接器毋須配置膜片,而可摒除需拆卸整組壓接器及更換破損膜片之作業,達到提升作業便利性及生產效能之實用效益。The second objective of the present invention is to provide a crimping device for electronic components. When the crimping tool of the crimper is floated upward in the Z direction, the gas in the gas chamber is compressed by the pressure-bearing member, so that the crimper does not need to be equipped with a diaphragm , And can eliminate the need to disassemble the entire set of crimping device and replace the broken diaphragm, to achieve the practical benefits of improving the convenience of operation and production efficiency.
本發明之目的三,係提供一種應用電子元件壓接裝置之測試分類設備,其包含機台、供料裝置、收料裝置、測試裝置、輸送裝置、本發明壓接裝置及中央控制裝置,該供料裝置係配置於機台,並設有至少一容納待測電子元件之供料承置器,該收料裝置係配置於機台,並設有至少一容納已測電子元件之收料承置器,該測試裝置係配置於機台,並設有至少一對電子元件執行測試作業之測試器,該輸送裝置係配置於機台,並設有至少一移載電子元件之移料器,本發明之壓接裝置係配置於機台,並設有至少一由移動臂驅動位移之壓接器,該壓接器係壓接電子元件,並節省成本及提高生產效能,該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。The third object of the present invention is to provide a test classification device using an electronic component crimping device, which includes a machine, a feeding device, a receiving device, a testing device, a conveying device, a crimping device of the present invention, and a central control device. The feeding device is arranged on the machine, and is provided with at least one feeding holder for accommodating the electronic component to be tested. The feeding device is arranged on the machine and is provided with at least one feeding holder for accommodating the tested electronic component. The tester is configured on the machine, and is equipped with at least one pair of electronic components to perform the test operation of the tester, the conveying device is configured on the machine, and is equipped with at least one feeder for transferring electronic components, The crimping device of the present invention is configured on a machine, and is provided with at least one crimping device driven and displaced by a moving arm. The crimping device crimps electronic components, saves cost and improves production efficiency. The central control device is It is used to control and integrate the actions of various devices to perform automated operations, so as to achieve the practical benefits of improving operating efficiency.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to make your examination committee understand the present invention further, here is a preferred embodiment and accompanying drawings, detailed as follows:
請參閱第4圖,本發明壓接裝置30包含移動臂31及壓接器32,該移動臂31係作至少一方向位移,於本實施例中,該移動臂31係作Y-Z方向位移;該壓接器32係裝配於移動臂31,並設有一具氣室3211之本體321,該氣室3211並由至少一通氣道3212注入氣體,於本實施例中,該本體321係裝配於移動臂31之底部,並於氣室3211之上方設有通氣道3212,該通氣道3212之一端連通輸氣裝置(圖未示出)之輸氣管,而另一端則連通本體321之氣室3211,以將氣體注入於氣室3211,使氣室3211具有氣體壓力,又該壓接器32係於本體321之下方裝配一壓接具322,該壓接具322係於第一端設有承壓部件3221,該承壓部件3221並置入於本體321之氣室3211,於第二端則設有壓接部件3222,該壓接部件3222係凸伸出本體321,更進一步,該壓接具322係以壓接部件3222下壓電子元件,亦或於壓接部件3222之底部裝配至少一下壓電子元件之接合件,又壓接器32係於壓接部件3222或接合件裝配至少一可溫控電子元件之溫控件(圖未示出),於本實施例中,係於壓接具322之壓接部件3222底部裝配一接合件3223,利用該接合件3223下壓電子元件,另於該本體321之氣室3211與壓接具322之承壓部件3221間係設有至少一防洩件323,更進一步,該防洩件323可裝配於氣室3211之內壁面或承壓部件3221之外環面,於本實施例中,係於該本體321之氣室3211內壁面裝配一為O形環之防洩件323,以防止氣室3211內之氣體外洩。Referring to FIG. 4, the
請參閱第5圖,該電子元件測試設備之測試裝置40係設置電性連接之電路板41及測試座42,該測試座42並設有相對應電子元件43之接點431數量的探針421,以承置及測試複數個電子元件43;由於該壓接裝置30之壓接器32的接合件3223已拾取待測之電子元件43,該壓接裝置30係以移動臂31帶動壓接器32及電子元件43作Y方向位移至測試裝置40之測試座42上方,並帶動壓接器32及電子元件43作Z方向向下位移,將電子元件43移入測試座42內,令電子元件43之複數個接點431接觸測試座42之複數支探針421 ,由於測試座42之探針421內具有彈簧,該壓接裝置30必須以壓接具322之接合件3223對電子元件43施以一預設之下壓力,使電子元件43之接點431確實接觸該測試座42之探針421而進行測試作業。Please refer to FIG. 5, the
請參閱第6圖,該移動臂31持續帶動壓接器32作Z方向向下位移,令壓接具322之接合件3223對電子元件43施以一下壓力,使電子元件43之接點431下壓測試座42之探針421,該測試座42之探針421即對電子元件43之接點431產生一反作用力,此一反作用力經由電子元件43及接合件3223傳導至壓接具322,令壓接具322作Z方向向上位移,該壓接具322即以承壓部件3221直接壓縮本體321之氣室3211內的氣體,而使電子元件43作浮動位移,由於該壓接具322之承壓部件3221係直接壓縮氣室3211內的氣體,並以防洩件323防止氣室3211內的氣體外洩,使得壓接器32毋須配置膜片及費時更換損壞之膜片,進而有效節省成本及提高生產效能。Please refer to FIG. 6, the moving
請參閱第4、7圖,係本發明壓接裝置30應用於測試分類設備之配置圖,該測試分類設備係於機台50上配置有本發明壓接裝置30、測試裝置40、供料裝置60、收料裝置70、輸送裝置80及中央控制裝置(圖未示出);該供料裝置60係裝配於機台50,並設有至少一為供料盤之供料承置器61,用以容納至少一待測之電子元件;該收料裝置70係裝配於機台50,並設有至少一為收料盤之收料承置器71,用以容納至少一已測之電子元件;該測試裝置40係裝配於機台50,並設有至少一測試器,以對電子元件執行測試作業,於本實施例中,該測試器係具有電性連接之電路板41及測試座42,以對電子元件執行測試作業;該輸送裝置80係裝配於機台50,並設置至少一移載電子元件之移料器,於本實施例中,係設有一作X-Y-Z方向位移之第一移料器81 ,以於供料裝置60之供料承置器61取出待測之電子元件,並分別依序移載至第一入料載台82及第二入料載台83,第一入料載台82及第二入料載台83將待測之電子元件載送至測試裝置40之側方,該壓接裝置30係裝配於機台50,並設置至少一由移動臂31驅動位移之壓接器32,以壓接電子元件,於本實施例中,該壓接裝置30係設有二移動臂31、31A,以分別驅動二壓接器32、32A作Y-Z方向位移,二壓接器32、32A分別於第一、二入料載台82、83取出待測之電子元件,並依序移入且下壓於測試裝置40之測試座42而執行測試作業,以及將測試座42內之已測電子元件移出至輸送裝置80之第一出料載台84及第二出料載台85,第一、二出料載台84、85則載出已測之電子元件,該輸送裝置80另設有一作X-Y-Z方向位移之第二移料器86 ,以依序於第一、二出料載台84、85上取出已測之電子元件,並依據測試結果,將已測之電子元件輸送至收料裝置70之收料承置器71處而分類收置;該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。Please refer to Figures 4 and 7 for the configuration diagram of the
[習知]10:測試裝置
11:電路板
12:測試座
121:探針
13:電子元件
131:接點
20:壓接裝置
21:移動臂
22:壓接器
221:承座
2211:承置部
222:封板
2221:注入口
223:作動部件
224:膜片
225:壓移件
A:部位
[本發明]
30:壓接裝置
31、31A:移動臂
32、32A:壓接器
321:本體
3211:氣室
3212:通氣道
322:壓接具
3221:承壓部件
3222:壓接部件
3223:接合件
323:防洩件
40:測試裝置
41:電路板
42:測試座
421:探針
43:電子元件
431:接點
50:機台
60:供料裝置
61:供料承置器
70:收料裝置
71:收料承置器
80:輸送裝置
81:第一移料器
82:第一入料載台
83:第二入料載台
84:第一出料載台
85:第二出料載台
86:第二移料器[Xizhi] 10: Test device
11: Circuit board
12: Test socket
121: Probe
13: Electronic components
131: Contact
20: Crimping device
21: Moving arm
22: crimper
221: Bearing
2211: Bearing Department
222: Sealing plate
2221: Injection port
223: Actuating parts
224: diaphragm
225: Pressure shifter
A: Parts
[this invention]
30:
第1圖:習知電子元件測試裝置及壓接裝置之示意圖。 第2圖:習知壓接裝置之示意圖。 第3圖:習知壓接裝置下壓電子元件之使用示意圖。 第4圖:本發明壓接裝置之示意圖。 第5圖:本發明壓接裝置之使用示意圖(一)。 第6圖:本發明壓接裝置之使用示意圖(二)。 第7圖:本發明壓接裝置應用於測試分類設備之配置圖。Figure 1: Schematic diagram of the conventional electronic component testing device and crimping device. Figure 2: Schematic diagram of the conventional crimping device. Figure 3: Schematic diagram of the use of a conventional crimping device to press electronic components. Figure 4: Schematic diagram of the crimping device of the present invention. Figure 5: Schematic diagram of the use of the crimping device of the present invention (1). Figure 6: Schematic diagram of the use of the crimping device of the present invention (2). Figure 7: Configuration diagram of the crimping device of the present invention applied to test classification equipment.
30:壓接裝置 30: crimping device
31:移動臂 31: Moving arm
32:壓接器 32: crimper
321:本體 321: Ontology
3211:氣室 3211: Air chamber
3212:通氣道 3212: Airway
322:壓接具 322: Crimping tool
3221:承壓部件 3221: Pressure-bearing parts
3222:壓接部件 3222: Crimp parts
3223:接合件 3223: Joint
323:防洩件 323: Anti-leakage parts
Claims (10)
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TW107135409A TW202015285A (en) | 2018-10-08 | 2018-10-08 | Electronic component crimp device and test handler using the same capable of effectively reducing the component configuration and assembly operations of the crimp tool |
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TW107135409A TW202015285A (en) | 2018-10-08 | 2018-10-08 | Electronic component crimp device and test handler using the same capable of effectively reducing the component configuration and assembly operations of the crimp tool |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112372589A (en) * | 2020-11-23 | 2021-02-19 | 湖州宏跃电子器件厂 | Processing machine table for processing electronic element |
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2018
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112372589A (en) * | 2020-11-23 | 2021-02-19 | 湖州宏跃电子器件厂 | Processing machine table for processing electronic element |
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