TW202015285A - Electronic component crimp device and test handler using the same capable of effectively reducing the component configuration and assembly operations of the crimp tool - Google Patents

Electronic component crimp device and test handler using the same capable of effectively reducing the component configuration and assembly operations of the crimp tool Download PDF

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TW202015285A
TW202015285A TW107135409A TW107135409A TW202015285A TW 202015285 A TW202015285 A TW 202015285A TW 107135409 A TW107135409 A TW 107135409A TW 107135409 A TW107135409 A TW 107135409A TW 202015285 A TW202015285 A TW 202015285A
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Taiwan
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crimping
electronic component
component
crimp
gas chamber
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TW107135409A
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Chinese (zh)
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蔡志欣
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鴻勁精密股份有限公司
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Publication of TW202015285A publication Critical patent/TW202015285A/en

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Abstract

An electronic component crimp device is provided with a crimp unit driven by a moving arm for displacement. The crimp unit is provided with a main body having a gas chamber. The gas chamber is injected with gas through a ventilation channel, and a crimp tool is assembled below the main body. A pressure-bearing component of a first end of a crimp tool is assembled in the gas chamber of the main body, and a crimp component of a second end is disposed below the main body. The bottom of the crimp component is provided with at least one joint member for crimping an electronic component, and at least one anti-leakage member is arranged between the gas chamber of the main body and the pressure-bearing component of the crimp tool. When the joint member of the crimp tool receives the reaction force of the electronic component, the pressure-bearing component of the crimp tool is provided to forwardly press the gas in the gas chamber so as to cause the crimp tool and the electronic component to float and displace upwardly, thereby effectively reducing the component configuration and assembly operations of the crimp tool, and achieving the practical benefits of saving costs and improving production efficiency.

Description

電子元件壓接裝置及其應用之測試分類設備Electronic component crimping device and its applied test classification equipment

本發明係提供一種可縮減元件而節省成本,並提升組裝便利性之電子元件壓接裝置。The present invention provides an electronic component crimping device that can reduce components, save costs, and improve ease of assembly.

在現今,電子元件(例如具錫球之IC)概分為邏輯IC、記憶體IC等不同類型,然不論何種類型之電子元件皆必須於測試設備上進行測試作業,以淘汰不良品;請參閱第1~3圖,係為電子元件測試設備之測試裝置10及壓接裝置20的示意圖,該測試裝置10係設有電性連接之電路板11及複數個測試座12,並以複數個測試座12承置及測試複數個電子元件13,該壓接裝置20係位於測試裝置10之上方,並設置一作Y-Z方向位移之移動臂21,移動臂21之底部裝配有複數個壓接器22,以移載及下壓待測之電子元件13,其中,該壓接器22包含承座221、封板222及作動部件223,該承座221之內部係設有承置部2211,以承置一可彈性變形之膜片224,該膜片224係貼接該作動部件223,並與封板222之間設有一容納氣體之腔室,腔室之一側連通一注入氣體之注入口2221,於將氣體注入腔室後,可使膜片224向下凸伸變形,並頂推該作動部件223作Z方向向下位移,使承座221與作動部件223之間具有緩衝浮動空間,另於該作動部件223之底部裝配一可移載及下壓電子元件之壓移件225;於使用時,該壓接裝置20之移動臂21係帶動複數個壓接器22及電子元件13作Y-Z方向位移至測試裝置10之上方,並令壓接器22之壓移件225將電子元件13移入測試座12內,且以一下壓力下壓電子元件13,使電子元件13之接點131電性接觸測試座12之探針121而執行測試作業,由於測試座12之複數支探針121會對電子元件13產生一反作用力,此一反作用力經由電子元件13而頂推該壓移件225及作動部件223作Z方向向上位移,作動部件223則頂壓膜片224而作Z方向向上浮動位移;惟此一壓接裝置20之作動部件223於多次作Z方向向上頂壓膜片224時,該作動部件223之頂面邊角即不斷頂撐磨損膜片224之同一部位A,導致膜片224之該部位A於長期承受作動部件223之邊角頂撐下而產生疲勞破損,以致必須更換新的膜片224,進而增加使用成本;尤其當膜片224破損時,腔室內之氣體即由膜片224破損之該部位A外洩,因而影響壓接具22之壓移件225的下壓力值,以致壓接具22無法以預設下壓力下壓電子元件13執行測試作業,進而影響測試品質;再者,於更換膜片時,工作人員必需將整組壓接器22拆卸,方可更換膜片224,亦增加作業不便及降低生產效能。Nowadays, electronic components (such as ICs with solder balls) are divided into different types such as logic IC and memory IC. However, no matter what type of electronic component must be tested on the test equipment to eliminate defective products; please Refer to Figures 1 to 3, which are schematic diagrams of the test device 10 and the crimping device 20 of the electronic component test equipment. The test device 10 is provided with an electrically connected circuit board 11 and a plurality of test sockets 12, and a plurality of The test base 12 supports and tests a plurality of electronic components 13. The crimping device 20 is located above the test device 10 and is provided with a movable arm 21 for displacement in the Y-Z direction. The bottom of the movable arm 21 is equipped with a plurality of crimps The device 22 is used to transfer and press down the electronic component 13 to be tested, wherein the crimper 22 includes a socket 221, a sealing plate 222 and an actuating component 223, and a receiving portion 2211 is provided inside the socket 221, To support an elastically deformable diaphragm 224, the diaphragm 224 is attached to the actuating member 223, and a chamber containing gas is provided between the sealing plate 222, and one side of the chamber communicates with an injection gas injection The inlet 2221, after the gas is injected into the chamber, can make the diaphragm 224 project downward and deform, and push the actuating member 223 downward in the Z direction, so that there is a buffer floating space between the bearing 221 and the actuating member 223 In addition, at the bottom of the actuating part 223, a pressing member 225 capable of carrying and pressing electronic components is assembled; in use, the moving arm 21 of the pressing device 20 drives a plurality of pressing units 22 and electronic components 13 Move the Y-Z direction to the top of the test device 10, and make the pressure-shifting member 225 of the crimper 22 move the electronic component 13 into the test seat 12, and press the electronic component 13 under a pressure to connect the electronic component 13 Point 131 electrically contacts the probe 121 of the test base 12 to perform the test operation. Since the plurality of probes 121 of the test base 12 will generate a reaction force on the electronic component 13, this reaction force pushes the pressure through the electronic component 13 The moving part 225 and the actuating part 223 move upward in the Z direction, and the actuating part 223 presses the diaphragm 224 to move upward in the Z direction; however, the actuating part 223 of this crimping device 20 presses upward in the Z direction multiple times. When the diaphragm 224, the top surface corner of the actuating member 223 is continuously supporting the same part A of the diaphragm 224, resulting in fatigue of the part A of the diaphragm 224 under the long-term bearing of the actuating member 223 Damaged, so that a new diaphragm 224 must be replaced, thereby increasing the cost of use; especially when the diaphragm 224 is damaged, the gas in the chamber is leaked from the part A where the diaphragm 224 is damaged, thus affecting the pressure transfer of the crimping tool 22 The down pressure value of the piece 225, so that the crimping tool 22 cannot press the electronic component 13 with the preset down pressure to perform the test operation, which affects the test quality; moreover, when changing the diaphragm, the staff must replace the entire set of crimpers 22 Demolition can replace the membrane 224, which also increases the inconvenience of operation and reduces the production efficiency.

本發明之目的一,係提供一種電子元件壓接裝置,其係設置一由移動臂驅動位移之壓接器,該壓接器係設有一具氣室之本體,該氣室並由一通氣道注入氣體,另於本體之下方裝配一壓接具,該壓接具第一端之承壓部件係裝配於本體之氣室內,並令第二端之壓接部件位於本體之下方,該壓接部件之底部則設有至少一壓接電子元件之接合件,另於本體之氣室與壓接具之承壓部件間係設置至少一防洩件,於壓接具之接合件承受電子元件之反作用力時,該壓接具係以承壓部件頂壓氣室內之氣體,使壓接具及電子元件向上浮動位移,藉此有效縮減該壓接具之元件配置及組裝作業,達到節省成本及提高生產效能之實用效益。The first object of the present invention is to provide a crimping device for electronic components, which is provided with a crimping device driven and displaced by a moving arm, the crimping device is provided with a body with an air chamber, and the air chamber is injected through an air passage Gas, another crimping tool is assembled under the body, the pressure-bearing component at the first end of the crimping tool is assembled in the gas chamber of the body, and the crimping component at the second end is located below the body, the crimping component At the bottom, there is at least one joint for crimping electronic components. At least one anti-leakage member is provided between the air chamber of the body and the pressure-bearing part of the crimping tool. The joint of the crimping tool bears the reaction of the electronic component When the force is applied, the crimping tool presses the gas in the pressure chamber with the pressure-bearing component, so that the crimping tool and the electronic component float upwardly displaced, thereby effectively reducing the component configuration and assembly work of the crimping tool, saving costs and improving production Practical benefits of efficiency.

本發明之目的二,係提供一種電子元件壓接裝置,其壓接器之壓接具作Z方向向上浮動位移時,係以承壓部件壓縮氣室內之氣體,使得壓接器毋須配置膜片,而可摒除需拆卸整組壓接器及更換破損膜片之作業,達到提升作業便利性及生產效能之實用效益。The second objective of the present invention is to provide a crimping device for electronic components. When the crimping tool of the crimper is floated upward in the Z direction, the gas in the gas chamber is compressed by the pressure-bearing member, so that the crimper does not need to be equipped with a diaphragm , And can eliminate the need to disassemble the entire set of crimping device and replace the broken diaphragm, to achieve the practical benefits of improving the convenience of operation and production efficiency.

本發明之目的三,係提供一種應用電子元件壓接裝置之測試分類設備,其包含機台、供料裝置、收料裝置、測試裝置、輸送裝置、本發明壓接裝置及中央控制裝置,該供料裝置係配置於機台,並設有至少一容納待測電子元件之供料承置器,該收料裝置係配置於機台,並設有至少一容納已測電子元件之收料承置器,該測試裝置係配置於機台,並設有至少一對電子元件執行測試作業之測試器,該輸送裝置係配置於機台,並設有至少一移載電子元件之移料器,本發明之壓接裝置係配置於機台,並設有至少一由移動臂驅動位移之壓接器,該壓接器係壓接電子元件,並節省成本及提高生產效能,該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。The third object of the present invention is to provide a test classification device using an electronic component crimping device, which includes a machine, a feeding device, a receiving device, a testing device, a conveying device, a crimping device of the present invention, and a central control device. The feeding device is arranged on the machine, and is provided with at least one feeding holder for accommodating the electronic component to be tested. The feeding device is arranged on the machine and is provided with at least one feeding holder for accommodating the tested electronic component. The tester is configured on the machine, and is equipped with at least one pair of electronic components to perform the test operation of the tester, the conveying device is configured on the machine, and is equipped with at least one feeder for transferring electronic components, The crimping device of the present invention is configured on a machine, and is provided with at least one crimping device driven and displaced by a moving arm. The crimping device crimps electronic components, saves cost and improves production efficiency. The central control device is It is used to control and integrate the actions of various devices to perform automated operations, so as to achieve the practical benefits of improving operating efficiency.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to make your examination committee understand the present invention further, here is a preferred embodiment and accompanying drawings, detailed as follows:

請參閱第4圖,本發明壓接裝置30包含移動臂31及壓接器32,該移動臂31係作至少一方向位移,於本實施例中,該移動臂31係作Y-Z方向位移;該壓接器32係裝配於移動臂31,並設有一具氣室3211之本體321,該氣室3211並由至少一通氣道3212注入氣體,於本實施例中,該本體321係裝配於移動臂31之底部,並於氣室3211之上方設有通氣道3212,該通氣道3212之一端連通輸氣裝置(圖未示出)之輸氣管,而另一端則連通本體321之氣室3211,以將氣體注入於氣室3211,使氣室3211具有氣體壓力,又該壓接器32係於本體321之下方裝配一壓接具322,該壓接具322係於第一端設有承壓部件3221,該承壓部件3221並置入於本體321之氣室3211,於第二端則設有壓接部件3222,該壓接部件3222係凸伸出本體321,更進一步,該壓接具322係以壓接部件3222下壓電子元件,亦或於壓接部件3222之底部裝配至少一下壓電子元件之接合件,又壓接器32係於壓接部件3222或接合件裝配至少一可溫控電子元件之溫控件(圖未示出),於本實施例中,係於壓接具322之壓接部件3222底部裝配一接合件3223,利用該接合件3223下壓電子元件,另於該本體321之氣室3211與壓接具322之承壓部件3221間係設有至少一防洩件323,更進一步,該防洩件323可裝配於氣室3211之內壁面或承壓部件3221之外環面,於本實施例中,係於該本體321之氣室3211內壁面裝配一為O形環之防洩件323,以防止氣室3211內之氣體外洩。Referring to FIG. 4, the crimping device 30 of the present invention includes a moving arm 31 and a crimper 32. The moving arm 31 is displaced in at least one direction. In this embodiment, the moving arm 31 is displaced in the Y-Z direction The crimper 32 is assembled on the moving arm 31, and is provided with a body 321 with a gas chamber 3211, the gas chamber 3211 is injected with gas from at least one air passage 3212, in this embodiment, the body 321 is assembled on the move At the bottom of the arm 31, and above the air chamber 3211, there is an air passage 3212. One end of the air passage 3212 is connected to the air pipe of the air delivery device (not shown), and the other end is connected to the air chamber 3211 of the body 321. To inject gas into the gas chamber 3211, so that the gas chamber 3211 has a gas pressure, and the crimper 32 is equipped with a crimping tool 322 under the body 321, and the crimping tool 322 is provided with a pressure bearing at the first end A component 3221, the pressure-bearing component 3221 is placed in the air chamber 3211 of the body 321, and a crimping component 3222 is provided at the second end. The crimping component 3222 protrudes from the body 321. Further, the crimping tool 322 is to press down the electronic component with the crimping part 3222, or to assemble at least the junction of the electronic component at the bottom of the crimping part 3222, and the crimper 32 is to assemble the crimping part 3222 or the junction with at least one temperature The temperature control of the electronic component (not shown), in this embodiment, is attached to the bottom of the crimping component 3222 of the crimping tool 322 with a jointing member 3223, and the jointing member 3223 is used to press down the electronic component. At least one leakage prevention member 323 is provided between the gas chamber 3211 of the body 321 and the pressure bearing member 3221 of the crimping tool 322. Furthermore, the leakage prevention member 323 can be assembled on the inner wall surface of the gas chamber 3211 or the pressure bearing member 3221 The outer ring surface, in this embodiment, is equipped with an O-ring anti-leakage member 323 on the inner wall surface of the air chamber 3211 of the body 321 to prevent the gas in the air chamber 3211 from leaking out.

請參閱第5圖,該電子元件測試設備之測試裝置40係設置電性連接之電路板41及測試座42,該測試座42並設有相對應電子元件43之接點431數量的探針421,以承置及測試複數個電子元件43;由於該壓接裝置30之壓接器32的接合件3223已拾取待測之電子元件43,該壓接裝置30係以移動臂31帶動壓接器32及電子元件43作Y方向位移至測試裝置40之測試座42上方,並帶動壓接器32及電子元件43作Z方向向下位移,將電子元件43移入測試座42內,令電子元件43之複數個接點431接觸測試座42之複數支探針421 ,由於測試座42之探針421內具有彈簧,該壓接裝置30必須以壓接具322之接合件3223對電子元件43施以一預設之下壓力,使電子元件43之接點431確實接觸該測試座42之探針421而進行測試作業。Please refer to FIG. 5, the test device 40 of the electronic component testing equipment is provided with a circuit board 41 and a test socket 42 which are electrically connected, and the test socket 42 is provided with a number of probes 421 corresponding to the number of contacts 431 of the electronic component 43 To hold and test a plurality of electronic components 43; since the joint 3232 of the crimper 32 of the crimping device 30 has picked up the electronic component 43 to be tested, the crimping device 30 is driven by the movable arm 31 to drive the crimper 32 and the electronic component 43 are moved in the Y direction to the test base 42 of the test device 40, and the crimper 32 and the electronic component 43 are moved downward in the Z direction, and the electronic component 43 is moved into the test base 42 to make the electronic component 43 The plurality of contacts 431 contact the plurality of probes 421 of the test socket 42. Since the probe 421 of the test socket 42 has a spring in it, the crimping device 30 must apply the connection piece 3223 of the crimping tool 322 to the electronic component 43 A predetermined pressure allows the contact 431 of the electronic component 43 to actually contact the probe 421 of the test base 42 to perform the test operation.

請參閱第6圖,該移動臂31持續帶動壓接器32作Z方向向下位移,令壓接具322之接合件3223對電子元件43施以一下壓力,使電子元件43之接點431下壓測試座42之探針421,該測試座42之探針421即對電子元件43之接點431產生一反作用力,此一反作用力經由電子元件43及接合件3223傳導至壓接具322,令壓接具322作Z方向向上位移,該壓接具322即以承壓部件3221直接壓縮本體321之氣室3211內的氣體,而使電子元件43作浮動位移,由於該壓接具322之承壓部件3221係直接壓縮氣室3211內的氣體,並以防洩件323防止氣室3211內的氣體外洩,使得壓接器32毋須配置膜片及費時更換損壞之膜片,進而有效節省成本及提高生產效能。Please refer to FIG. 6, the moving arm 31 continuously drives the crimper 32 to move downward in the Z direction, so that the joint 3232 of the crimping tool 322 exerts a little pressure on the electronic component 43 to make the contact of the electronic component 43 under 431 The probe 421 of the pressure test socket 42 generates a reaction force to the contact 431 of the electronic component 43, and the reaction force is transmitted to the crimping tool 322 through the electronic component 43 and the joint member 3223. The crimping tool 322 is displaced upward in the Z direction. The crimping tool 322 directly compresses the gas in the gas chamber 3211 of the main body 321 with the pressure-bearing member 3221, and causes the electronic component 43 to make a floating displacement because of the crimping tool 322. The pressure-bearing part 3221 directly compresses the gas in the gas chamber 3211, and prevents the gas in the gas chamber 3211 from leaking with the anti-leakage member 323, so that the crimper 32 does not need to configure the diaphragm and time-consuming replacement of the damaged diaphragm, thereby effectively saving Cost and improve production efficiency.

請參閱第4、7圖,係本發明壓接裝置30應用於測試分類設備之配置圖,該測試分類設備係於機台50上配置有本發明壓接裝置30、測試裝置40、供料裝置60、收料裝置70、輸送裝置80及中央控制裝置(圖未示出);該供料裝置60係裝配於機台50,並設有至少一為供料盤之供料承置器61,用以容納至少一待測之電子元件;該收料裝置70係裝配於機台50,並設有至少一為收料盤之收料承置器71,用以容納至少一已測之電子元件;該測試裝置40係裝配於機台50,並設有至少一測試器,以對電子元件執行測試作業,於本實施例中,該測試器係具有電性連接之電路板41及測試座42,以對電子元件執行測試作業;該輸送裝置80係裝配於機台50,並設置至少一移載電子元件之移料器,於本實施例中,係設有一作X-Y-Z方向位移之第一移料器81 ,以於供料裝置60之供料承置器61取出待測之電子元件,並分別依序移載至第一入料載台82及第二入料載台83,第一入料載台82及第二入料載台83將待測之電子元件載送至測試裝置40之側方,該壓接裝置30係裝配於機台50,並設置至少一由移動臂31驅動位移之壓接器32,以壓接電子元件,於本實施例中,該壓接裝置30係設有二移動臂31、31A,以分別驅動二壓接器32、32A作Y-Z方向位移,二壓接器32、32A分別於第一、二入料載台82、83取出待測之電子元件,並依序移入且下壓於測試裝置40之測試座42而執行測試作業,以及將測試座42內之已測電子元件移出至輸送裝置80之第一出料載台84及第二出料載台85,第一、二出料載台84、85則載出已測之電子元件,該輸送裝置80另設有一作X-Y-Z方向位移之第二移料器86 ,以依序於第一、二出料載台84、85上取出已測之電子元件,並依據測試結果,將已測之電子元件輸送至收料裝置70之收料承置器71處而分類收置;該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。Please refer to Figures 4 and 7 for the configuration diagram of the crimping device 30 of the present invention applied to the test sorting equipment. The test sorting equipment is equipped on the machine 50 with the crimping device 30 of the present invention, the testing device 40, and the feeding device 60. Receiving device 70, conveying device 80 and central control device (not shown); the feeding device 60 is assembled on the machine 50, and is provided with at least one feeding holder 61 for the feeding tray, It is used to accommodate at least one electronic component to be tested; the receiving device 70 is assembled on the machine 50, and is provided with at least one receiving holder 71 which is a receiving tray, to accommodate at least one measured electronic component The test device 40 is assembled on the machine 50 and is equipped with at least one tester to perform test operations on electronic components. In this embodiment, the tester is provided with an electrically connected circuit board 41 and a test base 42 In order to perform testing operations on electronic components; the conveying device 80 is equipped on the machine 50, and is provided with at least one feeder that transfers electronic components. In this embodiment, there is an X-Y-Z direction displacement The first feeder 81 is used to take out the electronic components to be tested from the feeder 61 of the feeder 60 and transfer them to the first feeder 82 and the second feeder 83 in sequence, respectively. , The first feed carrier 82 and the second feed carrier 83 carry the electronic components to be tested to the side of the test device 40, the crimping device 30 is assembled on the machine 50, and at least one is provided by the mobile The arm 31 drives a displacement crimper 32 to crimp electronic components. In this embodiment, the crimping device 30 is provided with two movable arms 31 and 31A to drive the two crimpers 32 and 32A as Y- Displacement in Z direction, the two crimpers 32, 32A take out the electronic components to be tested on the first and second loading stages 82, 83 respectively, and then move in and press down on the test seat 42 of the test device 40 in order to perform the test operation , And the measured electronic components in the test base 42 are moved out to the first discharge carrier 84 and the second discharge carrier 85 of the conveyor 80, and the first and second discharge carriers 84 and 85 carry the measured For the electronic components, the conveying device 80 is also provided with a second material shifter 86 for X-Y-Z direction displacement, in order to take out the measured electronic components on the first and second discharge stages 84, 85 in sequence. According to the test results, the measured electronic components are sent to the receiving device 71 of the receiving device 70 for classification and storage; the central control device is used to control and integrate the actions of each device to perform automated operations to achieve Practical benefits to improve operational efficiency.

[習知]10:測試裝置 11:電路板 12:測試座 121:探針 13:電子元件 131:接點 20:壓接裝置 21:移動臂 22:壓接器 221:承座 2211:承置部 222:封板 2221:注入口 223:作動部件 224:膜片 225:壓移件 A:部位 [本發明] 30:壓接裝置 31、31A:移動臂 32、32A:壓接器 321:本體 3211:氣室 3212:通氣道 322:壓接具 3221:承壓部件 3222:壓接部件 3223:接合件 323:防洩件 40:測試裝置 41:電路板 42:測試座 421:探針 43:電子元件 431:接點 50:機台 60:供料裝置 61:供料承置器 70:收料裝置 71:收料承置器 80:輸送裝置 81:第一移料器 82:第一入料載台 83:第二入料載台 84:第一出料載台 85:第二出料載台 86:第二移料器[Xizhi] 10: Test device 11: Circuit board 12: Test socket 121: Probe 13: Electronic components 131: Contact 20: Crimping device 21: Moving arm 22: crimper 221: Bearing 2211: Bearing Department 222: Sealing plate 2221: Injection port 223: Actuating parts 224: diaphragm 225: Pressure shifter A: Parts [this invention] 30: Crimping device 31, 31A: Moving arm 32, 32A: crimper 321: Ontology 3211: Air chamber 3212: Airway 322: Crimping tool 3221: Pressure-bearing parts 3222: Crimping parts 3223: Joint 323: Anti-leakage parts 40: Test device 41: Circuit board 42: Test socket 421: Probe 43: Electronic components 431: Contact 50: Machine 60: Feeding device 61: feed holder 70: Receiving device 71: Receiver 80: Conveyor 81: The first feeder 82: The first loading table 83: Second loading stage 84: First discharge stage 85: Second discharge stage 86: Second material shifter

第1圖:習知電子元件測試裝置及壓接裝置之示意圖。 第2圖:習知壓接裝置之示意圖。 第3圖:習知壓接裝置下壓電子元件之使用示意圖。 第4圖:本發明壓接裝置之示意圖。 第5圖:本發明壓接裝置之使用示意圖(一)。 第6圖:本發明壓接裝置之使用示意圖(二)。 第7圖:本發明壓接裝置應用於測試分類設備之配置圖。Figure 1: Schematic diagram of the conventional electronic component testing device and crimping device. Figure 2: Schematic diagram of the conventional crimping device. Figure 3: Schematic diagram of the use of a conventional crimping device to press electronic components. Figure 4: Schematic diagram of the crimping device of the present invention. Figure 5: Schematic diagram of the use of the crimping device of the present invention (1). Figure 6: Schematic diagram of the use of the crimping device of the present invention (2). Figure 7: Configuration diagram of the crimping device of the present invention applied to test classification equipment.

30:壓接裝置 30: crimping device

31:移動臂 31: Moving arm

32:壓接器 32: crimper

321:本體 321: Ontology

3211:氣室 3211: Air chamber

3212:通氣道 3212: Airway

322:壓接具 322: Crimping tool

3221:承壓部件 3221: Pressure-bearing parts

3222:壓接部件 3222: Crimp parts

3223:接合件 3223: Joint

323:防洩件 323: Anti-leakage parts

Claims (10)

一種電子元件壓接裝置,其係設置至少一由移動臂驅動位移之      壓接器,該壓接器包含:      本 體:係裝配於該移動臂,並設有至少一具氣體之氣室;      壓接具:係於第一端設有置入於該氣室內之承壓部件,以壓縮          該氣室內之氣體,於第二端則設有壓接電子元件之壓            接部件;      防洩件:係裝配於該本體的氣室及該壓接具的承壓部件之間,          以防止該氣室之氣體外洩。An electronic component crimping device, which is provided with at least one crimping device driven and displaced by a moving arm, the crimping device includes:       body: it is mounted on the moving arm and is provided with at least one gas chamber;       crimping With: the first end is provided with a pressure-bearing part placed in the gas chamber to compress the gas in the gas chamber, and the second end is provided with a crimping part for crimping electronic components; Between the gas chamber of the body and the pressure-bearing part of the crimping tool,           to prevent the gas of the gas chamber from leaking out. 依申請專利範圍第1項所述之電子元件壓接裝置,其中,該本                體之氣室係連通至少一注入氣體之通氣道。According to the electronic component crimping device described in item 1 of the scope of patent application, the gas chamber of the body is connected to at least one vent channel for injecting gas. 依申請專利範圍第1項所述之電子元件壓接裝置,其中,該壓                接具係於該壓接部件之底部裝配至少一壓接電子元件之接合件                。The electronic component crimping device as described in item 1 of the scope of the patent application, wherein the crimping device is to assemble at least one crimping electronic component joint on the bottom of the crimping component. 依申請專利範圍第3項所述之電子元件壓接裝置,其中,該壓接具係於該接合件裝配至少一溫控電子元件之溫控件。The electronic component crimping device according to item 3 of the patent application scope, wherein the crimping tool is equipped with at least one temperature control of a temperature-controlled electronic component on the joint. 依申請專利範圍第1項所述之電子元件壓接裝置,其中,該壓          接具係於該壓接部件裝配至少一溫控電子元件之溫控件。The crimping device for electronic components according to item 1 of the scope of the patent application, wherein the crimping device is a temperature control that assembles at least one temperature-controlled electronic component on the crimping component. 依申請專利範圍第1項所述之電子元件壓接裝置,其中,該防洩件係為O形環。According to the electronic component crimping device described in item 1 of the scope of the patent application, wherein the leakage preventing member is an O-ring. 依申請專利範圍第1項所述之電子元件壓接裝置,其中,該防洩件係裝配於該本體之氣室的內壁面。The electronic component crimping device according to item 1 of the scope of the patent application, wherein the leakage prevention member is assembled on the inner wall surface of the air chamber of the body. 依申請專利範圍第1項所述之電子元件壓接裝置,其中,該防洩件係裝配於該壓接具之承壓部件的外環面。The crimping device for electronic components according to item 1 of the scope of the patent application, wherein the leakage prevention member is assembled on the outer ring surface of the pressure-bearing part of the crimping tool. 依申請專利範圍第1項所述之電子元件壓接裝置,其中,該接合件係為單純壓接電子元件之壓接件,或為壓接及移載電子元件之壓移件。The electronic component crimping device according to item 1 of the patent application scope, wherein the joint is a crimping component that simply crimps the electronic component, or a crimping component that crimps and transfers the electronic component. 一種應用電子元件壓接裝置之測試分類設備,包含:    機台;    供料裝置:係配置於該機台,並設有至少一供料承置器,以         容納至少一待測之電子元件;    收料裝置:係配置於該機台,並設有至少一收料承置器,以         容納至少一已測之電子元件;    測試裝置:係配置於該機台,並設有至少一測試器,以對電         子元件執行測試作業;    輸送裝置:係配置於該機台,並設有至少一移料器,以移載         電子元件;    至少一依申請專利範圍第1項所述之電子元件壓接裝置:係配         置於該機台,以壓接電子元件;    中央控制裝置:係用以控制及整合各裝置作動,以執行自動化         作業。A test classification device using an electronic component crimping device, including:     machine;     feeding device: it is configured on the machine and is provided with at least one feeding holder to accommodate at least one electronic component to be tested;    Material device: It is configured on the machine and is equipped with at least one receiving receiver to accommodate at least one tested electronic component;     Test device: It is arranged on the machine and is equipped with at least one tester, Perform test operations on electronic components;     Conveying device: It is equipped on the machine and equipped with at least one material shifter to transfer electronic components;     At least one electronic component crimping device according to item 1 of the scope of patent application: It is arranged on the machine to crimp electronic components;    Central control device: It is used to control and integrate the operation of each device to perform automated operations.
TW107135409A 2018-10-08 2018-10-08 Electronic component crimp device and test handler using the same capable of effectively reducing the component configuration and assembly operations of the crimp tool TW202015285A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112372589A (en) * 2020-11-23 2021-02-19 湖州宏跃电子器件厂 Processing machine table for processing electronic element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112372589A (en) * 2020-11-23 2021-02-19 湖州宏跃电子器件厂 Processing machine table for processing electronic element

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