TWI827473B - Processing machine of electronic component - Google Patents

Abstract

The processing machine of electronic component has a receiving device, a carrying device, a transportation device, a testing device, and a control device. The receiving device has a receiving member and a moving member. The receiving member is adapted for receiving electronic components, and the moving member is adapted for moving the electronic components on the receiving member. The first and the second tables of the carrying device are adapted for carrying the electronic component between the receiving device and the transportation device. The second table has a dodging hole to enable to pick up the electronic component when the first and the second tables are aligned vertically. The transportation device has a pick-up member, a correction plate, and a guiding unit so as to adjust the horizontal position of the pick-up member in order to carry the electronic component between the transportation device and the testing device. The testing device is adapted for testing the electronic component. The floating unit of the pressing mechanism makes the pressing member conducting heat and is able to adjust the height position.

Description

Electronic component working machine

The invention provides an electronic component working machine that can improve working efficiency.

Nowadays, electronic component testing equipment uses a feed tray to hold multiple electronic components, and a feeder moves the electronic components in the feed tray to the trough of a carrier. A single carrier moves between the feed tray and the tester. The electronic components are carried between them, and then the electronic components on the carrier are moved by the press down device and pressed into the bearing groove of the tester to perform the testing operation. However, there are often a large number of electronic components to be tested in a batch. If a single carrier is used to transport them back and forth, it is quite time-consuming and reduces production capacity. In addition, due to the precision of electronic components, if the position of the carrier trough of the carrier or tester is shifted due to factors such as thermal expansion, contraction or displacement error, the material transfer device will not be able to accurately position the carrier trough or tester. Picking and placing electronic components in the trough not only affects the smoothness of the operation, but also makes the contacts of the electronic components unable to contact the probes of the tester and is mistakenly judged as defective, thus affecting the quality of the operation. Furthermore, some electronic components will have differences in thickness and size during production. When the press is pressed with the preset pressing force to press the electronic components of normal thickness and size, it will not cause over-voltage. Once pressed, When the device is used to crimp thicker electronic components, the problem of overvoltage damage to the electronic components will occur.

The first object of the present invention is to provide an electronic component working machine, which is equipped with a material loading device, a carrying device, a material moving device, a testing device and a central control device on the machine platform; the material loading device is equipped with a material loading device and a material moving device. The loader is used to hold electronic components, and the loader is used to move electronic components in the loader; The carrier device uses a carrier drive unit to drive the first and second carrier stages to carry electronic components between the loading device and the material transfer device, and a clearance hole is provided on the second carrier platform to facilitate stacking under the second carrier platform. The first carrier moves in or out electronic components; the transfer device is equipped with a picker, a positioning plate and a guide unit, which can finely adjust the position of the picker to transfer electronic components between the carrying device and the test device; the test device It is equipped with a tester and a joint mechanism. The tester is used to test electronic components. The joint mechanism is equipped with a joint and a floating unit. The cavity of the floating unit is used to accommodate the heat transfer medium and the connecting part of the joint, and to prevent The leakage piece connects the carrier and the connecting part to close the chamber, so that the joint part of the connector protrudes from the leakage prevention piece and can be floated and finely adjusted in height to facilitate the crimping of the electronic components of the tester; the central control device controls And integrate the actions of various devices to perform automated operations.

The second object of the present invention is to provide an electronic component working machine in which the first carrier platform and the second carrier platform of the carrier device can be arranged in an overlapping manner in the same operating area, so that the material transfer device can pick and place two batches of electronic components. It effectively shortens the movement sequence of the carrier, and can feed or receive twice the electronic components at one time, thus improving the carrying efficiency.

The third object of the present invention is to provide an electronic component working machine, in which the carrying driving unit of the carrying device can drive the first carrier and the second carrier to respectively carry a plurality of electronic components and are arranged side by side on one side of the test device, so that it can be provided at one time Two batches of multiple electronic components to be tested are provided for picking up materials. Similarly, the empty first stage and the second stage can be arranged side by side on the other side of the test device to accommodate two batches of multiple electronic components at one time. Test electronic components, thereby shortening operation time and increasing material supply and receiving productivity.

The fourth object of the present invention is to provide an electronic component working machine. When the picker of the material transfer device is applied to a stage or tester that is deformed due to thermal expansion and contraction, the guide unit can be used to install the guide unit on the stage or tester. The guiding force of the two guide parts guides and pushes against the first guide part of the pickup, and is matched with the alignment plate The elastic piece allows the picker to move and fine-tune its position to facilitate accurate picking and placing of electronic components on the stage or tester, thereby improving the efficiency of material transfer.

The fifth object of the present invention is to provide an electronic component operating machine in which a temperature-conducting medium is filled between the holder of the floating unit of the testing device and the connecting part of the connector, and the temperature-conducting medium directly covers and adheres to the surface of the connecting part to facilitate The temperature of the carrier is quickly transferred to the connector. When the connector is crimping electronic components, it ensures that the electronic components perform testing operations in a test environment that simulates the temperature of the future application site, thus shortening the temperature conduction time and improving test quality.

10:Machine

20: Material loading device

211:First disk drive

212: Second disk setter

22: Top tray

23:Switcher

24: Feeder

251:The first material mover

252:Second material mover

253: The third material mover

254: The fourth material mover

261:First transporter

262:Second transporter

30, 30A: Carrying device

31: First carrier drive source

32: Second carrier drive source

33:First carrier

331:First groove

332:First guide pin

34: Second stage

341:Second groove

342: giving way hole

343: Second guide pin

40, 40A: Material transfer device

41: base body

411:Acquisition Department

412:Through hole

42: Pickup pieces

421: Air suction channel

422:convex plate

423:Guide hole

43:School position board

431: First connection part

432: Second connection part

433A:The first shrapnel

433B:Second shrapnel

433C: The third shrapnel

434A:First space

434B:Second space

434C:The third space

435A:First rib

435B:Second rib

435C:Third rib

44:Seal the board

451: Material transfer drive source

452:Transfer arm

50, 50A: Test device

511:Circuit board

512:Test seat

5121:Acquisition Department

5122:Third guide pin

52:joint parts

521:Connection Department

522: Adhering part

53:First plate

531:Plate body

532:convex part

533:First piercing

534: Straight section

535: Guide slope

536: Bearing hole

54:Carrying seat

541: Chamber

55:Second plate

551:rod body

552:Block

56:Thermal medium

57: Anti-leak parts

571:The first undertaking department

572:Second Undertaking Department

573: Bending part

58:Spring

591:Rack

592: Engage drive source

593:joint arm

594: Thermostat

61, 61A: Preheating plate

Figure 1: Configuration diagram of the working machine of the present invention.

Figure 2 to Figure 3: Schematic diagram of the material loading device of the present invention.

Figures 4 to 6: Schematic diagrams of the carrying device of the present invention.

Figures 7 to 11: Schematic diagrams of the material transfer device of the present invention.

Figures 12 to 15: Schematic diagrams of the testing device of the present invention.

In order to enable your review committee to have a further understanding of the present invention, a preferred embodiment is cited and illustrated in detail below: Please refer to Figures 1 to 15. The electronic component working machine of the present invention includes a machine 10, a material loading The device 20, the carrying device 30, the material transfer device 40, the testing device 50 and the central control device (not shown) are used to control and integrate the actions of each device to perform automated operations.

The loading device 20 (please refer to Figures 1 to 3) is assembled on the machine 10, and is provided with at least one loading device and at least one loading device. The loading device is used for holding electronic components, and the loading device is used for placing electronic components. Loader moving electronics element. Depending on the job requirements, the loader can be configured in a fixed position or in an unspecified position. The loading device 20 further includes a transfer mechanism. The transfer mechanism is provided with at least one transfer device for transferring electronic components. The at least one transfer device includes a first transfer device and a second transfer device. The first transfer device is used for loading materials. The electronic components are moved between the transporter and the transporter, and the second transporter transports the electronic components between the transporter and the carrying device 30 . The loading device 20 further includes at least one tray setter, at least one top tray and at least one exchanger. At least one tray setter can hold at least one tray, and at least one top tray can hold at least one tray. For material trays, the exchanger can transfer the material trays between the material loader and the tray setter.

In this embodiment, the material loading device 20 is configured with a plurality of first tray loaders 211 in a first row and a plurality of second tray loaders 212 in a second row under the machine 10. According to the operation requirements, a plurality of first tray loaders 211 are arranged in the second row. The first tray holder 211 and the second tray holder 212 can be filled with trays in advance or in an empty state. A plurality of tray tops 22 are respectively arranged below the plurality of first tray holders 211 and can be moved in a third direction ( (such as the Z direction) displacement to lift the material tray of a first tray 211 to the second tray 212, and an exchanger 23 that can move in the first and third directions (such as the X-Z direction) to The second tray 212 clamps and takes out a tray of electronic components to be tested. A plurality of trays 24 that can move in the third direction are used to hold the tray. The trays 24 move downward in the Z direction. At this time, the exchanger 23 can move in the X-Z direction to place a material tray above the feeder 24, and the feeder 24 carries a tray of electronic components to be tested and can move upward in the Z direction to supply materials. The material loading device 20 is disposed above the machine platform 10 and is equipped with a first material conveyor 251, a second material conveyor 252, a third material conveyor 253, and a fourth material conveyor 251 that can move in the first, second, and third directions (such as the X-Y-Z direction). The material mover 254 is equipped with a first transfer device 261 and a second transfer device 262 that can move in the second direction (such as the Y direction). The first loader 251 moves in the X-Y-Z direction to take out the electronic component to be tested from the tray of the loader 24, and moves it into the first transporter 261. The first transporter 261 moves in the Y direction to carry the electronic component to be tested to the carrier. On the side of the device 30 , the second transfer device 252 moves in the X-Y-Z direction to take out the electronic components to be tested on the first transfer device 261 , and transfers them to the first working area of the machine 10 , and is located above the carrying device 30 .

The carrying device 30 (please refer to Figures 1, 4-6) is configured on the machine 10 and includes a carrying driving unit, a first carrying platform and a second carrying platform. The carrying driving unit is used to drive the first and second carrying platforms for the third step. Displacement in two directions, the first and second stages are respectively provided with first and second grooves for holding electronic components, and a relief hole is provided on one side of the second groove of the second carrier. Relative to the first receiving groove, electronic components are moved in or out. Furthermore, the carrier driving unit is provided with at least one carrier drive source. The carrier drive source can be a linear motor, a pressure cylinder, or a motor and at least one carrier transmission group. The carrier transmission group can be a pulley group or a screw screw seat group.

In this embodiment, the operating machine is equipped with carrying devices 30 and 30A of the same design on both sides of the testing device 50. The carrying device 30 is used as an illustration. At least one carrying driving source of the carrying driving unit includes two carrying devices in the Y direction. The first carrying driving source 31 and the second carrying driving source 32 are configured. The first carrying driving source 31 and the second carrying driving source 32 respectively include a motor and a pulley set driven by the motor. The first carrier 33 is provided with a plurality of rows of first receiving grooves 331 for receiving a plurality of electronic components, and is driven by the first carrying driving source 31 to perform displacement in the Y direction. The second stage 34 is provided with a plurality of rows of second receiving grooves 341 and a plurality of rows of relief holes 342. The plurality of rows of second receiving grooves 341 are used to receive a plurality of electronic components. The plurality of rows of second receiving grooves 341 and a plurality of rows of first receiving grooves are The receiving grooves 331 are misaligned with each other, and the plurality of rows of relief holes 342 are located on one side of the plurality of rows of the second receiving grooves 341 . The inner diameter of each relief hole 342 is larger than the inner diameter of the first receiving groove 331 . The height is higher than the first stage 33 and has a height difference. The second stage 34 is driven by the second carrying driving source 32 to move in the Y direction.

The first carrier 33 and the second carrier 34 are located in the first working area of the machine 10 at the same time, and the second carrier 34 overlaps above the first carrier 33 along the Z direction, so that the plurality of rows of relief holes 342 are relative to In addition to the plurality of rows of first receiving grooves 331 and the second conveying device 252 of the loading device 20, in addition to directly moving the electronic components to be tested into the second receiving grooves 341 of the second carrier stage 34 located above, they can also pass through the relief holes 342. Moving the electronic component to be tested into the first receiving groove 331 of the first carrier 33 located below not only facilitates the loading of the electronic component, but also improves the carrying capacity; the second A carrying driving source 31 and a second carrying driving source 32 respectively drive the first carrying stage 33 and the second carrying stage 34 to move in the Y direction to carry a plurality of electronic components to be tested to the second operating area of the machine 10 and arrange them side by side. It is located below the two transfer devices 40 and can supply twice the number of electronic components to be tested at one time.

The material transfer device 40 (please refer to Figures 1, 5, 7~11) is configured on the machine 10 and includes a picker, a calibration board and a guide unit. The picker is used for moving between the carrying device 30 and the testing device 50. loaded electronic components. The calibration plate is used to elastically connect the pickup. Furthermore, the calibration plate is provided with a first connection part and at least one elastic piece. The first connection part is used for assembling the pickup, and the elastic piece is used for elastic displacement of the first connection part and the pickup. The guide unit is arranged on the pickup and is guided and pushed by a guiding force, so that the pickup can affect the elastic deformation of the calibration plate and thereby displace and finely adjust the position. Furthermore, the guide unit is provided with a first guide component on the pickup. The first guide component is guided and pushed by a guiding force, which can cause the pickup to deform the spring piece and shift the fine-tuning position.

Based on the above, the pickup is provided with a base body and a pickup piece. The base body is used to hold the second connection part of the calibration board. The pickup part is used to transfer electronic components and connect to the first connection part of the calibration board. The guide unit is provided with a first guide part. Furthermore, a plurality of layers of elastic pieces in annular shape and gradually increasing in size from the inside to the outside are provided between the first connection part and the second connection part of the calibration board. A plurality of layers of space are formed between the plurality of layers of elastic pieces. The space uses a plurality of layers of ribs arranged in the first direction or in the second direction to connect the first connecting part, the plurality of layers of elastic pieces and the second connecting part respectively. The first direction and the second direction are not parallel.

Depending on the operation requirements, the guide unit is provided with a second guide component on one or each of the first and second stages 33 and 34 of the carrier device 30 or the tester of the test device 50, so that the first guide unit The component bears the guiding force of the second guiding component and is pushed against it, thereby enabling the pickup to move and fine-tune its position. Furthermore, the first guide component and the second guide component may be guide pins or guide holes that cooperate with each other.

According to the operation requirements, the material transfer device further includes a material transfer drive unit. The material transfer drive unit is provided with a transfer arm that can move in at least one direction. The transfer arm is used to drive the pickup to move.

In this embodiment, the operating machine is equipped with two material transfer devices 40 and 40A of the same design on both sides of the test device 50. The material transfer device 40 is used as an explanation. The base 41 of the picker is opened from the top to the bottom. A plurality of receiving parts 411. The receiving part 411 is provided with a through hole 412. The through hole 412 is used to accommodate a pickup part 42 that is a suction nozzle. An air extraction channel 421 is provided inside the pickup part 42, and the first end of the air extraction channel 421 is connected. The second end of the air extraction device (not shown) is a suction part for sucking or releasing electronic components. A convex plate 422 is provided on the outer ring surface of the pickup part 42 . The calibration plate 43 is made of elastic material and is provided with a first connecting part 431, a second connecting part 432 and a plurality of layers of first elastic pieces 433A, second elastic pieces 433B, ... third elastic pieces 433C. The calibration plate 43 is connected by a second connection part. The portion 432 straddles and is fixed on the receiving portion 411 of the base 41. There are a plurality of layers of first connecting portions 432, 432, and the first connecting portion 431, which are in an annular shape and gradually increase in size from the inside to the outside. The elastic pieces 433A, the second elastic pieces 433B,... the third elastic pieces 433C, and the plurality of layers of the first elastic pieces 433A, the second elastic pieces 433B,... the third elastic pieces 433C form a plurality of layers of first spaces 434A, second spaces 434B,... The three spaces 434C include a plurality of layers of first space 434A, a second space 434B, ... and a third space 434C arranged in a plurality of layers in the X direction or in a plurality of layers of first ribs 435A, second ribs 435B, ... arranged in the Y direction. The three ribs 435C are respectively connected to the first connecting part 431, the second connecting part 432 and a plurality of layers of first elastic pieces 433A, second elastic pieces 433B, ... third elastic pieces 433C. The first connecting part 431 of the calibration plate 43 is connected to the fixed pickup. The convex plate 422 of the component 42, and then the calibration plate 43 uses a plurality of layers of first elastic pieces 433A, second elastic pieces 433B,... third elastic pieces 433C to provide the pick-up piece 42 with fine-tuning displacement in the X-Y direction. Better yet, the calibration plate 43 can provide The pick-up part 42 is capable of fine-tuning displacement in the X-Y-Z direction and fine-tuning the tilt angle. The material transfer device further includes at least a sealing plate 44. The sealing plate 44 is assembled on the base 41 of the picker for limiting the positioning plate 43. The guide unit is provided with two guide holes 423 on the protruding plate 422 of the pickup part 42 and a first guide member arranged in the Z direction, and is provided with two first guide members on the circumference of the first receiving groove 331 of the first carrier 33 . The first guide pin 332 is a second guide member arranged in the Z direction, and the second receiving groove 341 of the second stage 34 is provided with two second guide pins 343 arranged on the peripheral side of the Z direction. guide components, and testing on the test device 50 The test seat (described later) is provided with two second guide parts that are guide pins and are arranged in the Z direction. The material transfer drive unit is provided with a material transfer drive source 451 for driving the material transfer arm 452 to move in the X-Z direction. The material transfer arm 452 is used to assemble the base 41 of the picker, so that the material transfer drive source 451 can drive the picker to move in the X-Z direction. Displacement.

The first and second stages 33 and 34 are displaced and juxtaposed in the second operating area, and carry a plurality of electronic components to be tested in the second batch, respectively located below the two material transfer devices 40. Each material transfer device 40 is driven by a material transfer source. 451 drives the material transfer arm 452 and the pick-up part 42 to move downward in the Z direction. Since the first and second stages 33 and 34 will be thermally expanded and deformed due to the increase in temperature during the thermal measurement operation, the first and second bearing grooves 331 and 34 will be deformed due to thermal expansion. The position of 341 is slightly shifted. Taking the first stage 33 as an example, when the pickup part 42 of the material transfer device 40 is displaced toward the first stage 33, the pickup part 42 uses the guide hole 423 of the guide unit to contact the first stage. The first guide pin 332 on the platform 33 will push against the guide hole 423 with a guide force (such as a lateral component force) during the process of gradually inserting into the guide hole 423. The guide hole 423 is provided in the convex plate 422 of the pickup part 42, and the convex plate 422 is connected to the first connecting part 431 of the calibration plate 43, so that this guiding force affects the calibration plate through the convex plate 422 and the first connecting part 431. The first elastic piece 433A, the second elastic piece 433B, and the third elastic piece 433C of 43 are elastically deformed along the pushing direction of the guiding force, so that the pickup part 42 performs passive horizontal floating displacement fine-tuning position, and the displacement of the pickup part 42 is An offset of the groove 331 allows the pickup 42 to compensate for the offset. After the first guide pin 332 of the first stage 33 is inserted into the guide hole 423 of the pickup 42, the pickup 42 can be The center correction aligns the center of the first receiving groove 331 of the first carrier 33 , thereby allowing the pickup 42 to accurately pick out the electronic component from the first receiving groove 331 of the first carrier 33 . The material moving driving source 451 drives the material moving arm 452, the pickup part 42 and the electronic component to move upward in the Z direction, and the guide hole 423 on the pickup part 42 is separated from the limit of the first guide pin 332 on the first stage 33. , without the guiding force of the first guide pin 332 pushing against the guide hole 423, the first elastic piece 433A, the second elastic piece 433B, and the third elastic piece 433C of the alignment plate 43 can use the reset elastic force to drive the pickup. Part 42 performs horizontal displacement reset. Therefore, the pickup 42 can be used with the calibration plate 43 and the first guide component to adjust the position of the displacement finely, so as to facilitate the accurate picking and placing of electronic components by the operator (such as a carrier, a pre-warming tray or a tester, etc.), thereby improving the material transfer efficiency.

The testing device 50 (please refer to Figures 1, 12-15) is configured on the machine 10 and includes a tester and a joining mechanism. The tester is used to test electronic components, and the material transfer device 40 is used to move in or out electronic components and the joining mechanism. It is equipped with a connector and a floating unit. The connector is used for attaching electronic components. The floating unit is equipped with a carrier, a thermal conductive medium and a leak-proof piece. The carrier is used to accommodate the thermal conductive medium and the connector. The thermal conductive medium covers the sticker. The connector is connected to conduct the temperature of the carrier to the connector, and the anti-leakage component connects the carrier and the connector to prevent leakage of the temperature-conducting medium.

Furthermore, one end of the connector has a connecting part, and the other end has a bonding part. The bonding part is used for bonding electronic components. The carrier of the floating unit is provided with a cavity, and the cavity is used to accommodate the temperature-conducting medium and the connector. The connecting part is covered with the thermal conductive medium and attached to the connecting part; the anti-leakage piece connects the connecting part of the carrier and the adapter to close the chamber; the adhering part of the adapter protrudes out of the anti-leakage piece for the pressure tester Electronic component; it can quickly conduct the temperature of the carrier to the joint and enable the joint to float.

In addition to being used for crimping electronic components, the splicing mechanism can also be equipped with an air extraction channel to transfer electronic components, or transfer and crimp electronic components, depending on the operation requirements.

In this embodiment, the operating machine is equipped with two test devices 50 and 50A of the same design on the side of the material transfer device 40. The test device 50 is used as an illustration. The tester includes an electrically connected circuit board 511 and a test socket 512. , the test socket 512 is provided with a receiving portion 5121 with a probe to receive and test electronic components. The coupling mechanism is arranged above the tester and is provided with a coupling and a floating unit. The coupling is provided with a T-shaped coupling piece 52, one end of which has a larger diameter and horizontally arranged connecting portion 521, and the other end has a larger The adhering portion 522 has a small diameter and is arranged in a vertical pole (eg, Z direction). The adhering portion 522 is used for crimping electronic components. The adapter further includes a first plate member 53. The first plate member 53 is provided with a protrusion arranged in the Z direction on the top surface of the plate body 531. 532, and a first through hole 533 penetrating the top surface and the bottom surface is opened in the first plate member 53 for passing through the adhering portion 522 of the joint member 52, so that the first plate member 53 is assembled on the connecting portion 521 of the joint member 52. below.

The carrier 54 of the floating unit is provided with a plurality of chambers 541. The bottom surface of the chambers 541 has an opening for inserting the connecting portion 521 of the joint 52. There is an appropriate distance between the inner wall of the chamber 541 and the peripheral side of the connecting portion 521. . The floating unit further includes a second plate 55. The second plate 55 is arranged below the carrier 54, and has a through hole at an opening position opposite to the chamber 541 for the connecting member 52 and the first plate 53 to operate. Directional displacement. The temperature-conducting medium 56 can be liquid, paste, powder, granular or compressible solid, and has non-conductive properties; in this embodiment, the temperature-conducting medium 56 is a non-conductive liquid, and can conduct temperature and conduct electricity. The temperature medium 56 is filled in the cavity 541 of the carrier 54, and is distributed and covered on the surface of the connecting portion 521 of the joint 52, that is, the thermal medium 56 directly contacts the cavity 541 of the carrier 54 and the connecting portion 521 of the joint 52. It is an intermediary conductor. The leakage prevention part 57 is provided with a first receiving part 571 and a second receiving part 572 for respectively connecting the adapter and the carrier 54. A bending part 573 is formed between the first receiving part 571 and the second receiving part 572; in this article In the embodiment, the leakage prevention member 57 is a deformable elastic diaphragm, and the first receiving portion 571 is used to pass through the adhering portion 522 of the joint member 52 , the connecting portion 521 of the joint member 52 and the convex portion of the first plate member 53 532 clamps and connects the first receiving portion 571 of the leakage prevention component 57 in position, and the second receiving portion 572 of the leakage prevention component 57 is disposed on the bottom surface of the carrier 54 , and the carrier 54 and the second plate 55 clamp the leakage prevention component 57 The second receiving portion 572 is positioned so that the anti-leakage member 57 seals the temperature-conducting medium 56 in the cavity 541 of the carrier 54 to prevent leakage, and the connecting portion 521 of the joint member 52 is located inside the cavity 541 for jointing. The piece 52 can make floating displacement in the Z direction. In addition, a generally U-shaped bending portion 573 is formed between the first receiving portion 571 and the second receiving portion 572 of the leakage prevention component 57. The position of the bending portion 573 is relative to the distance between the chamber 541 and the connecting portion 521. The bent portion 573 can hold the heat conductive medium 56 and can expand and deform according to the actual holding state.

Depending on the operation requirements, the joint mechanism further includes a joint drive unit and a guiding unit. The guide unit is provided with a first guide component and a second guide component that cooperate with each other between the carrier 54 and the adapter. Guide the adapter. Furthermore, the first guide component and the second guide component are guide pins and guide holes that cooperate with each other. The guide hole has a straight section and a guide inclined surface, and the guide pin has a rod body and a stopper. According to the operation requirements, the guide unit is provided with at least one elastic member between the first plate member 53 and the second plate member 55 . In this embodiment, the guide unit is provided with a plurality of first guide components that are guide holes on the plate body 531 of the first plate member 53. The guide holes have a straight line penetrating from the bottom surface of the plate body 531 to the top surface. The segment portion 534 is provided with a guide inclined surface 535 whose size is tapered from the bottom surface of the plate body 531 toward the straight segment portion 534. In addition, the plate body 531 is provided with a bearing hole 536 recessed from the top surface toward the bottom surface. The bearing holes 536 communicate with each other and guide the segment portion 534. The straight section 534 of the front hole, and the diameter of the receiving hole 536 is larger than the diameter of the straight section 534, so that the receiving hole 536 and the straight section 534 form a first-class hole. One is an elastic member of the spring 58 , one end of which is inserted into the socket 536 , and the other end is against the bottom surface of the second plate member 55 . The guide unit is assembled with a plurality of second guide components that are guide pins on the second plate 55. One end of the guide pin's rod 551 has a thread, and the other end is formed with a beveled stop 552. The guide pin's rod The body 551 passes through the straight section 534 of the guide hole and the bearing hole 536, and passes through the spring 58, so that the rod body 551 is locked in the second plate 55 and assembled and positioned. The first plate 53 is pushed by the spring 58. Then, it moves downward in the Z direction, and the guide inclined surface 535 is pressed against the stopper 552 of the guide pin to guide the limiting joint 52 . The joint driving unit is provided with a joint arm that can move in at least one direction, and the joint arm is used to drive the joint to move. In this embodiment, the joint drive unit is provided with a frame 591, a joint drive source 592 and a joint arm 593. The frame 591 is disposed on the machine 10 for assembling the joint drive source 592. The joint drive source 592 includes a motor, a pulley set and a screw. The screw seat group, the motor drives a pulley group arranged in the Y direction, the pulley group drives the screw screw seat group, the screw seat of the screw screw seat group drives the engagement arm 593 to move in the Z direction, and the engagement arm 593 drives the adapter and the floating unit to move in the Z direction The direction displacement allows the coupling member 52 of the coupling to press down the electronic component. Depending on the operating requirements, the joint mechanism further includes at least one temperature controller for temperature control electronic components. Furthermore, the thermostat can be a heating element, a cooling chip or a fluid-containing base. In this embodiment, the coupling mechanism is between the coupling arm 593 and the floating A thermostat 594 is disposed between the carriers 54 of the moving unit. The thermostat 594 is a heating element for the temperature control electronic components to perform thermal testing operations by simulating the ambient temperature of the future use location.

After the material transfer device 40 takes out the electronic components to be tested on the first stage 33, if the operating machine is equipped with a pre-warming plate, a second guide component can be provided on the pre-warming plate to facilitate the material transfer device 40 to transfer the electronic components to be tested. The electronic components are first placed on the pre-warming tray to pre-warm them. If not, the electronic components to be tested can be transferred by the transfer device 40 to the testing device 50 . In this embodiment, the operating machine is configured with a plurality of pre-warming trays 61 and 61A having second guide components (not shown) on both sides of the testing device 50. Taking the pre-warming tray 61 as an example, the pre-warming tray 61 The second guiding component can guide the pick-up part 42 of the material transfer device 40 to accurately move into the electronic component to be tested. After the electronic component to be tested is preheated in the pre-warming tray 61, the material transfer device 40 will move the electronic component to be tested in the pre-warming tray 61. The electronic components are transferred to the test device 50; however, the guide unit of the transfer device 40 is provided with second guide components, which may be third guide pins 5122, on both sides of the receiving portion 5121 of the test seat 512. If the position of the receiving portion 5121 is slightly shifted due to thermal expansion and deformation of the test seat 512 due to heating, the material transfer device 40 will use the third guide pin 5122 on the test seat 512 to align the guide hole 423 on the pick-up piece 42 Apply a guiding force to push it, and use the first elastic piece 433A, the second elastic piece 433B, and the third elastic piece 433C of the calibration plate 43 to make the pick-up part 42 perform passive horizontal floating displacement and fine-adjust the position at the third position of the test seat 512 The three guide pins 5122 are embedded in the guide holes 423 on the pick-up part 42, thereby allowing the pick-up part 42 to accurately move the electronic component to be tested into the receiving part 5121 of the test seat 512.

After the pick-up part 42 leaves the test seat 512 of the test device 50, the joint mechanism uses the joint drive source 592 to drive the joint arm 593 to drive the joint, the floating unit and the temperature controller 594 to move downward in the Z direction. The connecting portion 522 presses the electronic component in the test seat 512 with a preset lower pressure to perform the test operation; because the temperature-conducting medium 56 fills the entire cavity 541 of the carrier 54 and contacts the connecting portion 521 of the carrier 54 and the joint 52, When the thermal conductive medium 56 covers the connecting portion 521 of the contact joint 52 , the heat transfer area of the thermal conductive medium 56 can be greatly increased to improve the temperature control effect, so that the temperature of the thermostat 594 can quickly pass through the carrier 54 And the heat conduction medium 56 is transmitted to the joint 52, and the joint 52 allows the electronic component to perform thermal testing operations at a simulated ambient temperature of the future use site. When the electronic component presses down the plurality of probes of the test seat 512, it will bear the reaction force of the plurality of probes and push the joint 52 with the reaction force. Since the cavity 541 of the carrier 54 contains fluid and is non-conductive, The liquid temperature-conducting medium 56 and the joint part 52 are connected to the elastically deformable leak-proof part 57. The bending part 573 of the leak-proof part 57 is used to deform as the joint part 52 is pulled up, so that the joint part 52 passively moves in the Z direction. Floating upward, the connecting portion 521 of the joint 52 pushes the temperature-conducting medium 56 to flow around and gives way. The temperature-conducting medium 56 flows into the bending portion 573 of the leak-proof member 57, and the supporting bending portion 573 expands, deforms and expands. The increased accommodation space allows the joint member 52 to float and move smoothly to fine-tune the height position, thereby preventing pressure damage to the electronic components and improving the test yield. However, when the joint member 52 drives the first plate member 53 to float upward in the Z direction, the first plate member 53 compresses the spring 58 so that the straight section 534 of the guide hole of the first plate member 53 moves along the rod 551 of the guide pin. displacement, and the guide inclined surface 535 of the guide hole is separated from the stopper 552 of the guide pin, so that the joint part 52 can be appropriately slightly tilted according to the slope of the top surface of the electronic component, so that the joint part 522 of the joint part 52 can be fully Fits the top surface of electronic components and presses them evenly to improve test quality. After the test is completed, the joint driving source 592 of the joint mechanism drives the joint arm 593 to drive the joint member 52, the floating unit and the electronic components to move upward in the Z direction. In the state where there is no external force to push the joint member 52, the return elastic force of the spring 58 is used to push the joint member 52. Pushing the first plate member 53 drives the joint member 52 to move downward in the Z direction. The joint member 52 is guided by the guide slope 535 of the guide hole of the first plate member 53 along the slope of the stop portion 552 of the guide pin, so that the guide member 52 is guided downward. The guide inclined surface 535 of the hole and the stop portion 552 of the guide pin fit together to guide and limit the joint 52 .

After the test is completed, the material transfer device 40A takes out the tested electronic components from the testing device 50 and transfers them to the pre-warming tray 61A for recovery, and then transfers the tested electronic components in the pre-warming tray 61A to the carrying device 30A. 30A carries the measured electronic components to the side of the transfer mechanism, so that the third transporter 253 of the transfer mechanism moves the measured electronic components of the carrying device 30A to the second transporter 262, and the second transporter 262 carries the tested electronic components. The electronic components are tested to the bottom of the fourth loader 254, so that the fourth loader 254 can take out the measured electronic components, and move them to the loader 24 for sorting and storage according to the test results.

10:Machine

20: Material loading device

24: Feeder

251:The first material mover

252:Second material mover

253: The third material mover

254: The fourth material mover

261:First transporter

262:Second transporter

30, 30A: Carrying device

33:First carrier

34: Second stage

40, 40A: Material transfer device

452:Transfer arm

50, 50A: Test device

591:Rack

592: Engage drive source

61, 61A: Preheating plate

Claims (12)

An electronic component working machine, including: machine; Material loading device: It is configured on the machine and is equipped with at least one material loading device and at least one material moving device. The loading device is For holding electronic components, the loader moves in at least one direction to move the electronic components on the loader; Carrier device: It is configured on the machine and is provided with a carrier drive unit, a first carrier platform and a second carrier platform. The driving unit is used to drive the displacement of the first and second carriers. The first and second carriers are respectively provided with first and second grooves for holding electronic components. The second groove of the second carrier is A relief hole is provided on one side, opposite to the first receiving groove, for moving in or out electronic components; Material transfer device: It is configured on the machine and is equipped with a picker, a calibration board and a guide unit. The picker is used for When electronic components are transferred to the carrying device, the school positioning plate is used to elastically connect the picker. The guide unit is provided on the picker and is guided and pushed by a guiding force so that the picker can pull the school. The position plate elastically deforms and shifts to fine-tune its position; Test device: It is configured on the machine and is equipped with a tester and a joint mechanism. The tester is used to test electronics. components, and for the moving device to move in or out electronic components. The joining mechanism is provided with an adapter and a floating unit. The adapter is used for attaching electronic components. The floating unit is provided with a carrier. , Thermal conductive media and leak-proof parts, the carrier is used to accommodate the thermal conductive medium and the connector, the thermal conductive medium covers and adheres to the connector, and can conduct the temperature of the carrier to the connector, The anti-leakage component connects the carrier and the adapter to prevent the heat-conducting medium from leaking; Central control device: controls and integrates the actions of various devices to perform automated operations. As claimed in claim 1, the electronic component working machine further includes a transfer mechanism. , the transfer mechanism is provided with at least one transfer device for transferring electronic components. The at least one transfer device includes a first transfer device and a second transfer device. The first transfer device is between the loader and the transfer device. Moving electronic components between devices , the second material mover moves electronic components between the transporter and the carrying device. The electronic component working machine of claim 1, wherein the material loading device further includes at least one tray setter, at least one top tray and at least one exchanger, and the at least one tray setter can hold at least one material tray, The at least one top tray can hold the material tray of the at least one tray setter, and the exchanger can transfer the material tray between the stocker and the tray setter. As for the electronic component operating machine described in claim 1, the positioning plate of the material transfer device is provided with a first connection part and at least one elastic piece. The first connection part is used to assemble the picker, and the elastic piece is used for the third A connecting part and the pickup are elastically displaced, and the guide unit is provided with a first guide component on the pickup. The first guide component is guided and pushed by the guide force, so that the pickup can be displaced. Fine-tune the position. The electronic component working machine as described in claim 4, wherein the pick-up device is provided with a base and a pick-up piece , the base is used to hold the second connection part of the school position board, the pick-up piece is used to transfer electronic components and connect the first connection part of the school position board, and the guide unit is provided with the First guide component. As claimed in claim 5, the electronic component operating machine has a plurality of layers of ring-shaped rings with gradually increasing sizes from the inside to the outside between the first connection part and the second connection part of the calibration board. A plurality of layers of elastic pieces form a plurality of spaces between the plurality of layers of elastic pieces. The plurality of layers of space respectively connect the first connecting part, a plurality of layers of the elastic pieces and the second connecting part with a plurality of layers of ribs arranged in different directions. As claimed in claim 4, the electronic component operating machine has a second guide component provided in the guide unit on one of the first and second stages or the tester, so as to guide the first The guide member applies the guide force. As claimed in claim 1 of the electronic component working machine, the material transfer device further includes a material transfer drive unit, the material transfer driving unit is provided with a material transfer arm that can move in at least one direction to drive the pickup to move. As in the electronic component working machine of claim 1, the test device further includes a joint drive unit, and the joint drive unit is provided with a joint arm that can move in at least one direction to drive the jointer to move. As claimed in claim 1, the electronic component operating machine has a connecting part at one end of the jointing mechanism of the testing device and a bonding part at the other end, and the carrier is provided with a chamber for accommodating the temperature-conducting medium. And the connecting part of the adapter, the thermal conductive medium covers and attaches to the connecting part, the leakage prevention piece connects the carrier and the connecting part of the adapter to close the chamber, the attached part of the adapter A portion protrudes out of the anti-leakage component for attaching electronic components. As claimed in claim 1 of the electronic component operating machine, the leakage prevention part of the testing device is provided with a first receiving part and a second receiving part for connecting the adapter and the carrier respectively, and the first receiving part and A bending part is provided between the second receiving parts. The electronic component operating machine as claimed in claim 1, wherein the testing device further includes a guidance unit , The guide unit is provided with a first guide component and a second guide component that cooperate with each other between the carrier and the adapter, and can guide the adapter.

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