TW201614246A - Temperature control device of crimping device of test equipment and temperature control method thereof - Google Patents

Temperature control device of crimping device of test equipment and temperature control method thereof

Info

Publication number
TW201614246A
TW201614246A TW103134598A TW103134598A TW201614246A TW 201614246 A TW201614246 A TW 201614246A TW 103134598 A TW103134598 A TW 103134598A TW 103134598 A TW103134598 A TW 103134598A TW 201614246 A TW201614246 A TW 201614246A
Authority
TW
Taiwan
Prior art keywords
heat
temperature control
pressing
crimping
testing
Prior art date
Application number
TW103134598A
Other languages
Chinese (zh)
Other versions
TWI506286B (en
Inventor
zhi-wei Xie
Original Assignee
Hon Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Tech Inc filed Critical Hon Tech Inc
Priority to TW103134598A priority Critical patent/TWI506286B/zh
Application granted granted Critical
Publication of TWI506286B publication Critical patent/TWI506286B/zh
Publication of TW201614246A publication Critical patent/TW201614246A/en

Links

Abstract

This disclosure relates to a temperature control device of a crimping device of test equipment and an associated temperature control method. The crimping device includes a lower pressing lever driven by a driving source to lift and lower. The front end of the lower pressing lever is provided with a pressing jig set. The pressing jig set comprises an upper plate installed to the lower pressing lever by connection and a pressing block installed under the upper plate. The temperature control device of the crimping device installs heating plates and a temperature sensor on the pressing block and connects a plate-like uniform plate on top of thepressing block. On top of the uniform plate are several heat-dissipation fins and heat-dissipation fans. When the pressing block of the pressing jig set presses an electronic element for testing, the electronic element can be heated to the testing temperature using heating fins. When electronic element exceeds the testing temperature, heat-uniforming plates, heat-dissipation fins, and heat-dissipation fans can also be used to instantly dissipate the heat of the electronic element to maintain within the predetermined testing temperature range to conduct testing and ensure the yield rate of products.
TW103134598A 2014-10-03 2014-10-03 TWI506286B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103134598A TWI506286B (en) 2014-10-03 2014-10-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103134598A TWI506286B (en) 2014-10-03 2014-10-03

Publications (2)

Publication Number Publication Date
TWI506286B TWI506286B (en) 2015-11-01
TW201614246A true TW201614246A (en) 2016-04-16

Family

ID=55220065

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103134598A TWI506286B (en) 2014-10-03 2014-10-03

Country Status (1)

Country Link
TW (1) TWI506286B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613448B (en) * 2017-04-06 2018-02-01 致茂電子股份有限公司 Device for pressing electronic component with different downward forces
TWI632843B (en) * 2017-12-01 2018-08-11 微星科技股份有限公司 Profile and identity recognizing device
TWI634336B (en) * 2017-08-29 2018-09-01 京元電子股份有限公司 Floating temperature sensor and semiconductor element test module using the same
TWI682270B (en) * 2018-07-24 2020-01-11 致茂電子股份有限公司 High/low-temperature testing apparatus and method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641842B (en) * 2017-08-14 2018-11-21 鴻勁精密股份有限公司 Crimp of electronic component crimping mechanism and test classification device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6034978A (en) * 1999-05-12 2000-03-07 Cymer, Inc. Gas discharge laser with gas temperature control
TWI247399B (en) * 2004-06-01 2006-01-11 Via Tech Inc Package and temperature-control method of electronic device with active temperature control
CN201152650Y (en) * 2007-12-18 2008-11-19 华南理工大学 Cold-hot transformation apparatus having solid multi-lattice
TWI368651B (en) * 2008-10-24 2012-07-21 Quanta Comp Inc Temperature variation apparatus
TWM376907U (en) * 2009-09-29 2010-03-21 Shen-Quan Zheng LED lamp with ceramic thermoelectric heat-dissipation substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613448B (en) * 2017-04-06 2018-02-01 致茂電子股份有限公司 Device for pressing electronic component with different downward forces
TWI634336B (en) * 2017-08-29 2018-09-01 京元電子股份有限公司 Floating temperature sensor and semiconductor element test module using the same
TWI632843B (en) * 2017-12-01 2018-08-11 微星科技股份有限公司 Profile and identity recognizing device
TWI682270B (en) * 2018-07-24 2020-01-11 致茂電子股份有限公司 High/low-temperature testing apparatus and method

Also Published As

Publication number Publication date
TWI506286B (en) 2015-11-01

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