TW202419873A - Testing mechanism, testing apparatus, and processing machine - Google Patents
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本發明提供一種可檢知電子元件承受之實際下壓力及是否均勻受壓的測試機構。The present invention provides a testing mechanism which can detect the actual pressure borne by an electronic component and whether the pressure is uniform.
在現今,電子元件測試裝置設有測試機構及壓接機構,測試機構設有一具測試件(如探針)之測試器,以對電子元件執行測試作業;由於電子元件之接點繁多,測試器也必須配置相同數量之探針,因探針之內部具有彈簧,壓接機構設有壓接器,而可以預設下壓力壓接電子元件,且壓縮探針之彈簧,以期使電子元件之接點與測試器之探針確實電性接觸;但壓接器之下壓力的過與不及將影響測試品質,例如下壓力過當,壓接器會壓損電子元件而降低良率 ,例如下壓力不足,壓接器無法確實壓接電子元件而影響測試品質;因此,如何明確檢知壓接器之實際下壓力相當重要。 Nowadays, electronic component testing equipment is equipped with a testing mechanism and a crimping mechanism. The testing mechanism is equipped with a tester with a test piece (such as a probe) to perform testing operations on electronic components. Since electronic components have many contacts, the tester must also be equipped with the same number of probes. Since the probe has a spring inside, the crimping mechanism is equipped with a crimper, which can preset the pressure to crimp the electronic component and compress the spring of the probe so that the contact of the electronic component and the probe of the tester are in electrical contact. However, the excessive or insufficient pressure under the crimper will affect the test quality. For example, if the pressure is too much, the crimper will damage the electronic component and reduce the yield rate. For example, if the pressure is insufficient, the crimper cannot accurately crimp the electronic components, which affects the test quality. Therefore, it is very important to clearly detect the actual pressure of the crimper.
再者,測試器於正常測試狀態,其一次僅供承置單一電子元件,若測試器內殘留有上一個電子元件,工作人員卻未即時得知測試器發生承置異常,當壓接器將下一個電子元件移入測試器時,即會壓損電子元件,以致降低電子元件良率及增加成本。Furthermore, in a normal testing state, the tester can only hold a single electronic component at a time. If the previous electronic component is left in the tester and the staff does not immediately know that the tester has a placement abnormality, when the crimper moves the next electronic component into the tester, it will be damaged, thereby reducing the yield of the electronic component and increasing costs.
本發明之目的一,提供一種測試機構,包含測試器及第一檢知單元,測試器設有電性連接之電路板及至少一測試件,以供測試電子元件,第一檢知單元於測試件之周側設有第一檢知區域,第一檢知區域供配置至少一第一壓力感測器,第一壓力感測器以於承壓路徑感測下壓力;於一壓接器以預設下壓力令壓接部件及第一貼接部件沿承壓路徑分別壓接電子元件及第一壓力感測器時,第一壓力感測器感測第一貼接部件之下壓力,並將該下壓力與預設下壓力作一分析,而可判斷壓接部件最終施予電子元件之下壓力,以供檢知電子元件所承受之實際下壓力,進而確保壓測品質。The first object of the present invention is to provide a testing mechanism, comprising a tester and a first detection unit, wherein the tester is provided with an electrically connected circuit board and at least one test piece for testing electronic components, and the first detection unit is provided with a first detection area around the test piece, and the first detection area is provided with at least one first pressure sensor, and the first pressure sensor is used to sense the pressure in the pressure-bearing path; When the press-fitting component and the first bonding component are pressed against the electronic component and the first pressure sensor respectively along the pressure-bearing path with the preset downward pressure, the first pressure sensor senses the downward pressure of the first bonding component and analyzes the downward pressure with the preset downward pressure to determine the downward pressure finally applied by the press-fitting component to the electronic component, so as to detect the actual downward pressure borne by the electronic component and ensure the pressure test quality.
本發明之目的二,提供一種測試機構,其第一檢知單元於第一檢知區域配置複數個第一壓力感測器,複數個第一壓力感測器呈多邊形感測點位配置,利用各感測點位之第一壓力感測器所感測之下壓力作一分析,而可檢知電子元件是否均勻受力,進而提高壓測品質。The second object of the present invention is to provide a testing mechanism, wherein a first detection unit is configured with a plurality of first pressure sensors in a first detection area, and the plurality of first pressure sensors are configured in a polygonal sensing point configuration. By analyzing the pressure sensed by the first pressure sensors at each sensing point, it is possible to detect whether the electronic component is uniformly stressed, thereby improving the pressure test quality.
本發明之目的三,提供一種測試機構,其於測試器尚未置入電子元件時,第一檢知單元之第一壓力感測器可承受一壓接器之第一貼接部件的預設下壓力,以感測壓接器之實際下壓力,藉以預先檢知壓接器是否因氣壓不足或壓接部件作動卡住等因素而發生預設下壓力異常,以利迅速排除異常,進而確保壓測品質。The third object of the present invention is to provide a testing mechanism, wherein before the electronic component is placed in the tester, the first pressure sensor of the first detection unit can withstand the preset downward pressure of the first bonding component of a crimper to sense the actual downward pressure of the crimper, so as to detect in advance whether the crimper has an abnormal preset downward pressure due to factors such as insufficient air pressure or actuation jam of the crimping component, so as to quickly eliminate the abnormality and thereby ensure the quality of the pressure test.
本發明之目的四,提供一種測試機構,其第一檢知單元以第一壓力感測器感測一壓接器之第一貼接部件的下壓力,若測試器內之電子元件的反作用力頂推壓接器之壓接部件,而使第一壓力感測器所感測之下壓力異常,可即時檢知測試器之內部是否發生過壓或疊置電子元件之異常狀態,以利迅速排除異常,進而提高電子元件良率及作業順暢性。The fourth object of the present invention is to provide a testing mechanism, wherein a first detection unit senses the downward pressure of a first bonding component of a crimper with a first pressure sensor. If the reaction force of the electronic component in the tester pushes the crimping component of the crimper, causing the downward pressure sensed by the first pressure sensor to be abnormal, it is possible to immediately detect whether an overpressure or an abnormal state of stacked electronic components occurs inside the tester, so as to quickly eliminate the abnormality, thereby improving the yield of the electronic components and the smoothness of the operation.
本發明之目的五,提供一種測試機構,其測試器之複數支測試件位於第一檢知單元之複數個第一壓力感測器所圍構之區域內,利用不同感測點位之第一壓力感測器的感測資料變化作一分析,而可反推得知測試器之各測試件的位置,以及各測試件作用於電子元件之反作用力是否因彈性疲勞而異常,以利更換測試件,進而確保壓測品質。The fifth object of the present invention is to provide a testing mechanism, wherein a plurality of test pieces of a tester are located in an area surrounded by a plurality of first pressure sensors of a first detection unit, and by analyzing the changes in sensing data of the first pressure sensors at different sensing points, the positions of the test pieces of the tester and whether the reaction force of each test piece on the electronic component is abnormal due to elastic fatigue can be inferred, so as to facilitate replacement of the test pieces and ensure the quality of pressure testing.
本發明之目的六,提供一種測試裝置,包含本發明測試機構及壓接機構,本發明測試機構包含測試器及第一檢知單元,測試器以供測試電子元件,第一檢知單元以供檢知電子元件承受之實際下壓力;壓接機構設有至少一壓接器,壓接器設有壓接部件及第一貼接部件,壓接器與測試器之其中一者沿壓接軸向朝另一者位移,壓接部件以供壓接測試器之電子元件,第一貼接部件以供壓接第一檢知單元之第一壓力感測器;藉以使第一檢知單元檢知電子元件承受之實際下壓力是否異常,進而提高壓測品質。The sixth object of the present invention is to provide a testing device, comprising the testing mechanism and the crimping mechanism of the present invention, wherein the testing mechanism of the present invention comprises a tester and a first detection unit, wherein the tester is used to test electronic components, and the first detection unit is used to detect the actual downward pressure borne by the electronic components; the crimping mechanism is provided with at least one crimper, and the crimper is provided with a crimping component and a first bonding component, and one of the crimper and the tester is displaced toward the other along the crimping axis, the crimping component is used to crimp the electronic components of the tester, and the first bonding component is used to crimp the first pressure sensor of the first detection unit; thereby, the first detection unit detects whether the actual downward pressure borne by the electronic components is abnormal, thereby improving the quality of the pressure test.
本發明之目的七,提供一種測試裝置,其壓接機構之壓接器設有基座及浮動單元,浮動單元之本體設有氣室,氣室供置入基座之第一塊部,使基座可沿壓接軸向作浮動位移,基座之第二塊部凸伸出本體,並於底部設有壓接部件及第一貼接部件,另於基座之第一塊部底面設有第二貼接部件,測試機構於浮動單元之本體內設有第二檢知單元,第二檢知單元於本體相對第二貼接部件之位置設有第二檢知區域,第二檢知區域設置至少一第二壓力感測器,以於浮動單元處預先檢知壓接部件的下壓力,使測試機構可作多重檢知下壓力,進而提高壓測品質。The seventh object of the present invention is to provide a testing device, wherein the crimping device of the crimping mechanism is provided with a base and a floating unit, the body of the floating unit is provided with an air chamber, the air chamber is for the first block of the base to be placed in, so that the base can float and displace along the crimping axis, the second block of the base protrudes out of the body, and is provided with a crimping component and a first bonding component at the bottom, and a second bonding component is provided on the bottom surface of the first block of the base, the testing mechanism is provided with a second detection unit in the body of the floating unit, the second detection unit is provided with a second detection area at the position of the body relative to the second bonding component, and at least one second pressure sensor is provided in the second detection area to pre-detect the downward pressure of the crimping component at the floating unit, so that the testing mechanism can perform multiple downward pressure detections, thereby improving the quality of pressure testing.
本發明之目的八,提供一種作業機,包含機台、供料裝置、收料裝置、本發明測試裝置、輸送裝置及中央控制裝置,供料裝置配置於機台,並設有至少一供料器,以供容置至少一待測電子元件;收料裝置配置於機台,並設有至少一收料器,以供容置至少一已測電子元件;本發明之測試裝置配置於機台,並設有測試機構及壓接機構,以供測試電子元件及檢知電子元件承受之實際下壓力;輸送裝置配置於機台,並設有至少一輸送器,以供輸送電子元件 ;中央控制裝置以控制及整合各裝置作動而執行自動化作業。 The eighth object of the present invention is to provide a work machine, comprising a machine, a feeding device, a receiving device, a testing device of the present invention, a conveying device and a central control device. The feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic component to be tested; the receiving device is arranged on the machine and is provided with at least one receiving device for accommodating at least one tested electronic component; the testing device of the present invention is arranged on the machine and is provided with a testing mechanism and a crimping mechanism for testing electronic components and detecting the actual pressure borne by the electronic components; the conveying device is arranged on the machine and is provided with at least one conveyor for conveying electronic components ; the central control device controls and integrates the actions of each device to perform automated operations.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:
請參閱圖1、2,本發明測試裝置10之第一實施例包含測試機構及壓接機構。1 and 2 , the first embodiment of the
測試機構設有至少一測試器及第一檢知單元。The testing mechanism is provided with at least one tester and a first detection unit.
至少一測試器設有至少一測試件,以供測試電子元件;更進一步,測試器設有電性連接之電路板及測試件,或者測試器設有電性連接之電路板及具測試件之測試座;於本實施例,測試器於機台配置測試座111,測試座111之內部設有容置部112,容置部112供裝配複數支為探針113之測試件,探針113之一端以供電性接觸電子元件(圖未示出)之接點,另一端電性連結電路板114。At least one tester is provided with at least one test piece for testing electronic components; further, the tester is provided with an electrically connected circuit board and a test piece, or the tester is provided with an electrically connected circuit board and a test socket with the test piece; in this embodiment, the tester is equipped with a
第一檢知單元設有第一檢知區域及至少一第一壓力感測器,第一檢知區域設於測試件之周側區域,且位於承壓路徑,至少一第一壓力感測器配置於第一檢知區域,以供於承壓路徑感測下壓力,而檢知電子元件所承受之實際下壓力。The first detection unit is provided with a first detection area and at least one first pressure sensor. The first detection area is provided in the peripheral area of the test piece and is located in the pressure-bearing path. The at least one first pressure sensor is arranged in the first detection area to sense the pressure in the pressure-bearing path and detect the actual pressure borne by the electronic component.
更進一步,測試件之周側區域依作業需求,可配置不同器件(例如機台、測試座或連接板等),亦即不同器件之表面均可作為第一檢知區域,第一檢知區域可為機台之台面、測試座之頂面或連接板之頂面等,例如一具測試件之測試座的裝配高度低於機台,而可將測試件之周側區域的機台台面作為第一檢知區域,不受限於本實施例。Furthermore, the surrounding area of the test piece can be equipped with different devices (such as a machine, a test socket or a connection board, etc.) according to the working requirements, that is, the surfaces of different devices can be used as the first detection area. The first detection area can be the table of the machine, the top of the test socket or the top of the connection board, etc. For example, the assembly height of the test socket of a test piece is lower than the machine, and the machine table in the surrounding area of the test piece can be used as the first detection area, which is not limited to this embodiment.
於本實施例,第一檢知單元以具探針113之測試座111周側區域的機台台面作為第一檢知區域121,至少一第一壓力感測器包含複數個第一壓力感測器122、123、124;更進一步,第一檢知單元之複數個第一壓力感測器122、123、124呈多邊形感測點位配置,例如呈正三角形或四角形;於本實施例,複數個第一壓力感測器122、123、124於第一檢知區域121且圍繞具探針113之測試座111作呈正三角形感測點位配置。In the present embodiment, the first detection unit uses the machine table of the surrounding area of the
又,第一檢知單元之複數個第一壓力感測器122、123、124的第一承壓面高度高於測試件的第一端高度;亦即複數個第一壓力感測器122、123
、124的第一承壓面高度高於探針113的第一端高度(第一端以供電性接觸電子元件)。
Furthermore, the height of the first pressure-bearing surface of the plurality of
壓接機構設有至少一壓接器,壓接器設有至少一壓接部件及至少一第一貼接部件,壓接器與測試器之其中一者沿壓接軸向朝另一者位移,壓接部件以供壓接電子元件,第一貼接部件位於壓接部件之周側,以供壓接第一檢知單元之第一壓力感測器。The crimping mechanism is provided with at least one crimping device, and the crimping device is provided with at least one crimping component and at least one first bonding component. One of the crimping device and the tester is displaced toward the other along the crimping axis. The crimping component is used for crimping electronic components, and the first bonding component is located on the periphery of the crimping component for crimping the first pressure sensor of the first detection unit.
於本實施例,壓接器設有一基座131,基座131之頂面連接一可作至少一方向位移(例如Y-Z方向位移)之移動臂132,移動臂132帶動基座131沿壓接軸向A(例如Z方向壓接軸向)朝向測試座111位移,基座131之底部設有一具吸嘴之壓接部件133,以供移載及壓接測試座111內之電子元件,另於基座131之底部且位於壓接部件133之周側設有第一貼接部件134,第一貼接部件134相對於第一檢知單元之複數個第一壓力感測器122、123、124,以供壓接複數個第一壓力感測器122、123、124。In this embodiment, the crimper is provided with a
依作業需求,壓接器可不具有吸嘴,以單純執行壓接電子元件之作業,亦無不可。Depending on the work requirements, the crimper may not have a nozzle and may simply be used to crimp electronic components.
依作業需求,壓接器更包含溫控單元(圖未示出),溫控單元可於壓接部件133或基座131之內部,或者於基座131之上方設置至少一溫控件,以供溫控電子元件;更進一步,溫控件可為加熱件、致冷晶片或具流體之座體。According to the working requirements, the crimper further includes a temperature control unit (not shown in the figure), which can be inside the
請參閱圖3、4,移動臂132帶動基座131及壓接部件133沿壓接軸向A向下位移,令壓接部件133以預設下壓力壓接測試座111內之電子元件14,使電子元件14之接點141接觸測試座111之探針113而執行測試作業,由於壓接部件133與第一貼接部件134相同設於基座131之底部而可同步位移,使第一貼接部件134壓接位於承壓路徑之第一檢知區域121的複數個第一壓力感測器122、123
、124,複數個第一壓力感測器122、123、124受壓後,將複數個感測資料傳輸至一處理器(圖未示出),在複數個第一壓力感測器122、123、124與電子元件14承受基座131之同一預設下壓力的狀態下,而可由複數個第一壓力感測器122、123、124的感測資料作一分析,以檢知壓接部件133最終施予電子元件14之下壓力,亦即檢知電子元件14所承受之實際下壓力;因此,第一檢知單元可於壓接部件133壓接電子元件14時,利用複數個第一壓力感測器122、123、124檢知電子元件14最終承受之實際下壓力,進而提高測試品質。
Please refer to Figures 3 and 4. The moving
承上述,複數個第一壓力感測器122、123、124呈正三角形感測點位配置,若其一第一壓力感測器122所感測之下壓力值與其他二個第一壓力感測器123、124所感測之下壓力值具有較大差異,可推斷壓接部件133傾斜偏壓於電子元件14;藉以,利用第一檢知單元可即時檢知電子元件14受壓不均,以利工作人員迅速排除異常,進而提高測試品質。Based on the above, the plurality of
承上述,複數個第一壓力感測器122、123、124呈正三角形感測點位配置,於測試前置作業,將一探針113插置於測試座111之不同針孔位置(例如於第一針孔位置),並搭配複數個第一壓力感測器122、123、124承受基座131之第一貼接部件134的下壓力,藉由複數個第一壓力感測器122、123、124所感測之複數個下壓力值,以記錄探針113之位置,當探針113插置於不同針孔位置時,複數個第一壓力感測器122、123、124所感測到之複數個壓力值也會隨之改變,因此,利用複數個第一壓力感測器122、123、124感測之複數個下壓力值的變化,可檢知不同位置之探針是否發生彈性疲勞,以利工作人員迅速更換探針或整個測試座,進而確保壓測品質。As described above, the plurality of
請參閱圖5、6、7,本發明測試裝置10之第二實施例與第一實施例之差異在於壓接機構之壓接器包含基座131及浮動單元,浮動單元配置於基座131之上方,並設有一具容置空間151之本體15,其容置空間151以流道152連通一流體供應源(圖未示出),以供輸送可為氣體之流體;又本體15之頂端連結移動臂132,而可由移動臂132帶動本體15及基座131沿壓接軸向A位移,基座131之一端設有第一塊部1311,另一端設有第二塊部1312,第一塊部1311置入於本體15之容置空間151,並與容置空間151之頂面間形成一氣室153,第一塊部1311沿壓接軸向A設有連接部1313,連接部1313穿伸出本體15之通孔154,而連接設於本體15外部之第二塊部1312,使得基座131可於本體15作一浮動位移;另於基座131之第二塊部1312之底部設有壓接部件133,以供壓接電子元件,第二塊部1312之底部且位於壓接部件133之周側設有第一貼接部件134,以供壓接第一檢知區域121之複數個第一壓力感測器122、123、124。Please refer to Figures 5, 6, and 7. The difference between the second embodiment of the
測試裝置10於測試電子元件之前置作業,可以移動臂132帶動本體15及基座131沿壓接軸向A向下位移,壓接部件133與第一貼接部件134相同設於基座131之底部而可同步位移,壓接機構並以氣室153之氣壓提供基座131一預設下壓力,以供壓接電子元件;然由於測試座111之內部並未置入電子元件,使得基座131之壓接部件133未壓接電子元件,亦不會承受探針113之反作用力,基座131之第一貼接部件134可以預設下壓力壓接位於承壓路徑之第一檢知區域121的複數個第一壓力感測器122、123、124,複數個第一壓力感測器122、123、124受壓後,將複數個感測資料傳輸至處理器(圖未示出),以供預先檢知下壓力
,亦即檢知位於周側且同步位移之壓接部件133的實際下壓力;因此,測試裝置10可於前置作業預先檢知壓接部件133之實際下壓力,若不符合測試作業之需求
,即可於測試前先作一調整壓接部件133之下壓力,以確保測試品質,並防止壓損電子元件而節省成本。
In the pre-processing of testing electronic components, the
於測試座111置入電子元件14後,移動臂132帶動本體15及基座131沿壓接軸向A向下位移,浮動單元以氣室153之氣壓提供基座131一預設下壓力,令基座131之壓接部件133以預設下壓力壓接測試座111內之電子元件14,以及使第一貼接部件134壓接第一檢知區域121之複數個第一壓力感測器122、123
、124;然電子元件14壓接測試座111之複數個探針113時,會承受複數個探針113之反作用力,電子元件14以所承受之反作用力頂推基座131向上浮動位移,此時,複數個第一壓力感測器122、123、124於受壓後,將複數個感測資料傳輸至處理器作一分析,由於預設下壓力為複數個第一壓力感測器122、123、124感測之複數個下壓力總合加上複數個探針113之反作用力,複數個探針113之反作用力即為電子元件14所承受之下壓力,易言之,即可利用複數個第一壓力感測器122、123、124檢知電子元件14所承受之實際下壓力;藉以本發明之測試裝置10可在不損傷電子元件14之要件下,於電子元件14承受下壓力時,以第一檢知單元確實檢知電子元件14最終承受之實際下壓力,進而提高測試品質。
After the
請參閱圖8,本發明測試裝置10之第三實施例與第二實施例之差異在於壓接機構之壓接器於基座131之第一塊部1311底面設有第二貼接部件1314
,測試機構更包含第二檢知單元,第二檢知單元於本體15相對基座131之第二貼接部件1314的區域設有第二檢知區域155,第二檢知區域155配置至少一第二壓力感測器,以檢知下壓力,於本實施例,第二檢知區域155配置複數個第二壓力感測器156、157、158,複數個第二壓力感測器156、157、158於第二檢知區域155可呈多邊形感測點位配置,例如呈正三角形或四角形,於本實施例,複數個第二壓力感測器156、157、158於第二檢知區域155呈正三角形感測點位配置;於基座131帶動壓接部件133沿壓接軸向A向下位移時,可利用第二貼接部件1314壓接複數個第二壓力感測器156、157、158,複數個第二壓力感測器156、157、158受壓後,將複數個感測資料傳輸至一處理器,亦可檢知壓接部件133之下壓力;因此,第二檢知單元可搭配第一檢知單元,使測試裝置10於不同區域檢知壓接部件133之實際下壓力,進而提高檢知效能。
Please refer to Figure 8. The difference between the third embodiment of the
請參閱圖1~4及圖9,電子元件作業機包含機台20、供料裝置30、收料裝置40、測試裝置10、輸送裝置50及中央控制裝置(圖未示出);供料裝置30裝配於機台20,並設有至少一供料器,以容納至少一待測之電子元件;收料裝置40裝配於機台20,並設有至少一收料器,以容納至少一已測之電子元件
;測試裝置10配置於機台20,並設有本發明測試機構及壓接機構,本發明測試機構包含至少一測試器及至少一第一檢知單元,至少一測試器設有至少一測試件,以供測試電子元件,至少一第一檢知單元於測試器之測試件周側區域設有第一檢知區域,第一檢知區域供配置至少一第一壓力感測器,以供檢知下壓力
;壓接機構設有至少一壓接器,壓接器設有壓接部件及第一貼接部件,壓接器與測試器之其中一者沿壓接軸向朝另一者位移,壓接部件以供壓接測試器之電子元件,第一貼接部件位於壓接部件之周側,以供壓接第一檢知單元之第一壓力感測器,於本實施例,測試器設有電性連接之電路板114及具測試件(如探針113)之測試座111,測試座111以供承置及測試電子元件;輸送裝置50裝配於機台20,並設有至少一輸送器,以輸送電子元件,於本實施例,輸送裝置50設有第一輸送器51,以於供料裝置30之供料器取出待測之電子元件,並移載至第二輸送器52,第二輸送器52將待測電子元件移載至測試裝置10之側方,測試裝置10之壓接機構以移動臂132帶動壓接部件133於第二輸送器52取出待測電子元件
,並移入測試座111而執行測試作業,測試機構以第一檢知單元檢知電子元件承受之實際下壓力,以提高測試品質,壓接機構將已測電子元件移入第三輸送器53而載出,一第四輸送器54於第三輸送器53取出已測電子元件,並依據測試結果,將已測電子元件輸送至收料裝置40之收料器處而分類收置;中央控制裝置(圖未示出)用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。
Please refer to Figures 1 to 4 and Figure 9. The electronic component processing machine includes a
10:測試裝置
111:測試座
112:容置部
113:探針
114:電路板
121:第一檢知區域
122、123、124:第一壓力感測器
131:基座
1311:第一塊部
1312:第二塊部
1313:連接部
1314:第二貼接部件
132:移動臂
133:壓接部件
134:第一貼接部件
A:壓接軸向
14:電子元件
141:接點
15:本體
151:容置空間
152:流道
153:氣室
154:通孔
155:第二檢知區域
156、157、158:第二壓力感測器
20:機台
30:供料裝置
40:收料裝置
50:輸送裝置
51:第一輸送器
52:第二輸送器
53:第三輸送器
54:第四輸送器
10: Test device
111: Test seat
112: Accommodation part
113: Probe
114: Circuit board
121:
圖1:本發明測試裝置第一實施例之示意圖。 圖2:測試機構之第一檢知單元的俯視圖。 圖3至圖4:測試機構第一實施例之使用示意圖。 圖5:本發明測試裝置第二實施例之示意圖。 圖6至圖7:測試機構第二實施例之使用示意圖。 圖8:本發明測試裝置第三實施例之示意圖。 圖9:本發明測試裝置應用於作業機之示意圖。 Figure 1: Schematic diagram of the first embodiment of the test device of the present invention. Figure 2: A top view of the first detection unit of the test mechanism. Figures 3 to 4: Schematic diagrams of the use of the first embodiment of the test mechanism. Figure 5: Schematic diagram of the second embodiment of the test device of the present invention. Figures 6 to 7: Schematic diagrams of the use of the second embodiment of the test mechanism. Figure 8: Schematic diagram of the third embodiment of the test device of the present invention. Figure 9: Schematic diagram of the test device of the present invention applied to a work machine.
111:測試座 111: Test socket
112:容置部 112: Accommodation section
113:探針 113: Probe
121:第一檢知區域 121: First detection area
122、123、124:第一壓力感測器 122, 123, 124: First pressure sensor
Claims (10)
Publications (1)
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TW202419873A true TW202419873A (en) | 2024-05-16 |
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