TW202419873A - Testing mechanism, testing apparatus, and processing machine - Google Patents

Abstract

A testing mechanism includes a tester and a first sensing unit. The tester is arranged on the machine and has at least one testing member for testing the electronic component. The first sensing unit has a first sensing area on the machine around the testing member. The first sensing area is arranged with at least one first pressure senser for detecting the downward pressure at the compression path. When the pressing member and the first contacting member are driven to press the electronic component and the first pressure sensor along the compression path by a pressing device under a predetermined downward pressure, the downward pressure detected by the first pressure sensor is compared with the predetermined downward pressure in order to know if the downward pressure on the electronic component meets the requirement or not.

Description

Testing institutions, testing equipment and operating machines

The present invention provides a testing mechanism which can detect the actual pressure borne by an electronic component and whether the pressure is uniform.

Nowadays, electronic component testing equipment is equipped with a testing mechanism and a crimping mechanism. The testing mechanism is equipped with a tester with a test piece (such as a probe) to perform testing operations on electronic components. Since electronic components have many contacts, the tester must also be equipped with the same number of probes. Since the probe has a spring inside, the crimping mechanism is equipped with a crimper, which can preset the pressure to crimp the electronic component and compress the spring of the probe so that the contact of the electronic component and the probe of the tester are in electrical contact. However, the excessive or insufficient pressure under the crimper will affect the test quality. For example, if the pressure is too much, the crimper will damage the electronic component and reduce the yield rate. For example, if the pressure is insufficient, the crimper cannot accurately crimp the electronic components, which affects the test quality. Therefore, it is very important to clearly detect the actual pressure of the crimper.

Furthermore, in a normal testing state, the tester can only hold a single electronic component at a time. If the previous electronic component is left in the tester and the staff does not immediately know that the tester has a placement abnormality, when the crimper moves the next electronic component into the tester, it will be damaged, thereby reducing the yield of the electronic component and increasing costs.

The first object of the present invention is to provide a testing mechanism, comprising a tester and a first detection unit, wherein the tester is provided with an electrically connected circuit board and at least one test piece for testing electronic components, and the first detection unit is provided with a first detection area around the test piece, and the first detection area is provided with at least one first pressure sensor, and the first pressure sensor is used to sense the pressure in the pressure-bearing path; When the press-fitting component and the first bonding component are pressed against the electronic component and the first pressure sensor respectively along the pressure-bearing path with the preset downward pressure, the first pressure sensor senses the downward pressure of the first bonding component and analyzes the downward pressure with the preset downward pressure to determine the downward pressure finally applied by the press-fitting component to the electronic component, so as to detect the actual downward pressure borne by the electronic component and ensure the pressure test quality.

The second object of the present invention is to provide a testing mechanism, wherein a first detection unit is configured with a plurality of first pressure sensors in a first detection area, and the plurality of first pressure sensors are configured in a polygonal sensing point configuration. By analyzing the pressure sensed by the first pressure sensors at each sensing point, it is possible to detect whether the electronic component is uniformly stressed, thereby improving the pressure test quality.

The third object of the present invention is to provide a testing mechanism, wherein before the electronic component is placed in the tester, the first pressure sensor of the first detection unit can withstand the preset downward pressure of the first bonding component of a crimper to sense the actual downward pressure of the crimper, so as to detect in advance whether the crimper has an abnormal preset downward pressure due to factors such as insufficient air pressure or actuation jam of the crimping component, so as to quickly eliminate the abnormality and thereby ensure the quality of the pressure test.

The fourth object of the present invention is to provide a testing mechanism, wherein a first detection unit senses the downward pressure of a first bonding component of a crimper with a first pressure sensor. If the reaction force of the electronic component in the tester pushes the crimping component of the crimper, causing the downward pressure sensed by the first pressure sensor to be abnormal, it is possible to immediately detect whether an overpressure or an abnormal state of stacked electronic components occurs inside the tester, so as to quickly eliminate the abnormality, thereby improving the yield of the electronic components and the smoothness of the operation.

The fifth object of the present invention is to provide a testing mechanism, wherein a plurality of test pieces of a tester are located in an area surrounded by a plurality of first pressure sensors of a first detection unit, and by analyzing the changes in sensing data of the first pressure sensors at different sensing points, the positions of the test pieces of the tester and whether the reaction force of each test piece on the electronic component is abnormal due to elastic fatigue can be inferred, so as to facilitate replacement of the test pieces and ensure the quality of pressure testing.

The sixth object of the present invention is to provide a testing device, comprising the testing mechanism and the crimping mechanism of the present invention, wherein the testing mechanism of the present invention comprises a tester and a first detection unit, wherein the tester is used to test electronic components, and the first detection unit is used to detect the actual downward pressure borne by the electronic components; the crimping mechanism is provided with at least one crimper, and the crimper is provided with a crimping component and a first bonding component, and one of the crimper and the tester is displaced toward the other along the crimping axis, the crimping component is used to crimp the electronic components of the tester, and the first bonding component is used to crimp the first pressure sensor of the first detection unit; thereby, the first detection unit detects whether the actual downward pressure borne by the electronic components is abnormal, thereby improving the quality of the pressure test.

The seventh object of the present invention is to provide a testing device, wherein the crimping device of the crimping mechanism is provided with a base and a floating unit, the body of the floating unit is provided with an air chamber, the air chamber is for the first block of the base to be placed in, so that the base can float and displace along the crimping axis, the second block of the base protrudes out of the body, and is provided with a crimping component and a first bonding component at the bottom, and a second bonding component is provided on the bottom surface of the first block of the base, the testing mechanism is provided with a second detection unit in the body of the floating unit, the second detection unit is provided with a second detection area at the position of the body relative to the second bonding component, and at least one second pressure sensor is provided in the second detection area to pre-detect the downward pressure of the crimping component at the floating unit, so that the testing mechanism can perform multiple downward pressure detections, thereby improving the quality of pressure testing.

The eighth object of the present invention is to provide a work machine, comprising a machine, a feeding device, a receiving device, a testing device of the present invention, a conveying device and a central control device. The feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic component to be tested; the receiving device is arranged on the machine and is provided with at least one receiving device for accommodating at least one tested electronic component; the testing device of the present invention is arranged on the machine and is provided with a testing mechanism and a crimping mechanism for testing electronic components and detecting the actual pressure borne by the electronic components; the conveying device is arranged on the machine and is provided with at least one conveyor for conveying electronic components ; the central control device controls and integrates the actions of each device to perform automated operations.

In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:

1 and 2 , the first embodiment of the testing device 10 of the present invention includes a testing mechanism and a crimping mechanism.

The testing mechanism is provided with at least one tester and a first detection unit.

At least one tester is provided with at least one test piece for testing electronic components; further, the tester is provided with an electrically connected circuit board and a test piece, or the tester is provided with an electrically connected circuit board and a test socket with the test piece; in this embodiment, the tester is equipped with a test socket 111 on the machine, and a receiving portion 112 is provided inside the test socket 111. The receiving portion 112 is provided for assembling a plurality of test pieces as probes 113. One end of the probe 113 is provided for electrically contacting the contact of the electronic component (not shown), and the other end is electrically connected to the circuit board 114.

The first detection unit is provided with a first detection area and at least one first pressure sensor. The first detection area is provided in the peripheral area of the test piece and is located in the pressure-bearing path. The at least one first pressure sensor is arranged in the first detection area to sense the pressure in the pressure-bearing path and detect the actual pressure borne by the electronic component.

Furthermore, the surrounding area of the test piece can be equipped with different devices (such as a machine, a test socket or a connection board, etc.) according to the working requirements, that is, the surfaces of different devices can be used as the first detection area. The first detection area can be the table of the machine, the top of the test socket or the top of the connection board, etc. For example, the assembly height of the test socket of a test piece is lower than the machine, and the machine table in the surrounding area of the test piece can be used as the first detection area, which is not limited to this embodiment.

In the present embodiment, the first detection unit uses the machine table of the surrounding area of the test socket 111 with the probe 113 as the first detection area 121, and at least one first pressure sensor includes a plurality of first pressure sensors 122, 123, and 124; further, the plurality of first pressure sensors 122, 123, and 124 of the first detection unit are arranged in a polygonal sensing point configuration, such as an equilateral triangle or a quadrilateral; in the present embodiment, the plurality of first pressure sensors 122, 123, and 124 are arranged in the first detection area 121 and in an equilateral triangle sensing point configuration around the test socket 111 with the probe 113.

Furthermore, the height of the first pressure-bearing surface of the plurality of first pressure sensors 122, 123, 124 of the first detection unit is higher than the height of the first end of the test piece; that is, the height of the first pressure-bearing surface of the plurality of first pressure sensors 122, 123, 124 is higher than the height of the first end of the probe 113 (the first end is for electrically contacting the electronic component).

The crimping mechanism is provided with at least one crimping device, and the crimping device is provided with at least one crimping component and at least one first bonding component. One of the crimping device and the tester is displaced toward the other along the crimping axis. The crimping component is used for crimping electronic components, and the first bonding component is located on the periphery of the crimping component for crimping the first pressure sensor of the first detection unit.

In this embodiment, the crimper is provided with a base 131, and the top surface of the base 131 is connected to a movable arm 132 that can be displaced in at least one direction (for example, displacement in the Y-Z direction). The movable arm 132 drives the base 131 to move along the crimping axis A (for example, the Z-direction crimping axis) toward the test seat 111. The bottom of the base 131 is provided with a crimping component 133 with a suction nozzle for transferring and crimping the electronic components in the test seat 111. In addition, a first bonding component 134 is provided at the bottom of the base 131 and around the crimping component 133. The first bonding component 134 is opposite to the plurality of first pressure sensors 122, 123, 124 of the first detection unit for crimping the plurality of first pressure sensors 122, 123, 124.

Depending on the work requirements, the crimper may not have a nozzle and may simply be used to crimp electronic components.

According to the working requirements, the crimper further includes a temperature control unit (not shown in the figure), which can be inside the crimping component 133 or the base 131, or at least one temperature control unit can be set above the base 131 to control the temperature of the electronic components; further, the temperature control unit can be a heating element, a cooling chip or a seat with fluid.

Please refer to Figures 3 and 4. The moving arm 132 drives the base 131 and the crimping component 133 to move downward along the crimping axis A, so that the crimping component 133 presses the electronic component 14 in the test seat 111 with a preset lower pressure, so that the contact 141 of the electronic component 14 contacts the probe 113 of the test seat 111 to perform the test operation. Since the crimping component 133 and the first bonding component 134 are both located at the bottom of the base 131, they can be displaced synchronously, so that the first bonding component 134 presses the first pressure sensors 122 and 123 located in the first detection area 121 of the pressure-bearing path. , 124, after the plurality of first pressure sensors 122, 123, 124 are subjected to pressure, the plurality of sensing data are transmitted to a processor (not shown). In the state where the plurality of first pressure sensors 122, 123, 124 and the electronic component 14 are subjected to the same preset lower pressure of the base 131, the sensing data of the plurality of first pressure sensors 122, 123, 124 can be used to An analysis is made to detect the final pressure exerted by the crimping component 133 on the electronic component 14, that is, to detect the actual pressure exerted by the electronic component 14; therefore, when the crimping component 133 presses the electronic component 14, the first detection unit can use a plurality of first pressure sensors 122, 123, 124 to detect the actual pressure exerted by the electronic component 14, thereby improving the test quality.

Based on the above, the plurality of first pressure sensors 122, 123, 124 are arranged at sensing points in an equilateral triangle. If the pressure value sensed by one first pressure sensor 122 is significantly different from the pressure values sensed by the other two first pressure sensors 123, 124, it can be inferred that the crimping component 133 is tilted and biased toward the electronic component 14. Thus, the first detection unit can be used to instantly detect that the electronic component 14 is unevenly pressurized, so that the staff can quickly eliminate the abnormality, thereby improving the test quality.

As described above, the plurality of first pressure sensors 122, 123, 124 are arranged at sensing points in an equilateral triangle. In the pre-test operation, a probe 113 is inserted into different pinhole positions (e.g., at the first pinhole position) of the test base 111, and the plurality of first pressure sensors 122, 123, 124 are used to withstand the downward pressure of the first bonding component 134 of the base 131. The plurality of downward pressures sensed by the plurality of first pressure sensors 122, 123, 124 are The pressure value is used to record the position of the probe 113. When the probe 113 is inserted into different pinhole positions, the pressure values sensed by the plurality of first pressure sensors 122, 123, 124 will also change accordingly. Therefore, by utilizing the change of the plurality of lower pressure values sensed by the plurality of first pressure sensors 122, 123, 124, it is possible to detect whether elastic fatigue occurs in the probe at different positions, so that the staff can quickly replace the probe or the entire test seat, thereby ensuring the pressure test quality.

Please refer to Figures 5, 6, and 7. The difference between the second embodiment of the test device 10 of the present invention and the first embodiment is that the crimping device of the crimping mechanism includes a base 131 and a floating unit. The floating unit is arranged above the base 131 and is provided with a body 15 having a receiving space 151. The receiving space 151 is connected to a fluid supply source (not shown) through a flow channel 152 for conveying a fluid that may be a gas. The top end of the body 15 is connected to a moving arm 132, and the moving arm 132 can drive the body 15 and the base 131 to move along the crimping axis A. One end of the base 131 is provided with a first block 1311, and the other end is provided with a second block 1312. The first block 1311 is placed in the body 15. The first block 1311 is provided with a connecting portion 1313 along the pressing axis A of the main body 15, and the connecting portion 1313 extends through the through hole 154 of the main body 15, and is connected to the second block 1312 disposed outside the main body 15, so that the base 131 can make a floating displacement on the main body 15; in addition, a pressing component 133 is provided at the bottom of the second block 1312 of the base 131 for pressing electronic components, and a first bonding component 134 is provided at the bottom of the second block 1312 and around the pressing component 133 for pressing a plurality of first pressure sensors 122, 123, 124 in the first detection area 121.

In the pre-processing of testing electronic components, the testing device 10 can move the arm 132 to drive the body 15 and the base 131 to move downward along the crimping axis A. The crimping component 133 and the first bonding component 134 are both arranged at the bottom of the base 131 and can move synchronously. The crimping mechanism also provides the base 131 with a preset downward pressure by the air pressure of the air chamber 153 to crimp the electronic components. However, since no electronic components are placed inside the test seat 111, the base 131 The pressing component 133 does not press the electronic components and will not bear the reaction force of the probe 113. The first bonding component 134 of the base 131 can press the first pressure sensors 122, 123, and 124 located in the first detection area 121 of the pressure-bearing path with a preset downward pressure. After the first pressure sensors 122, 123, and 124 are pressed, the plurality of sensing data are transmitted to the processor (not shown) for pre-detection of downward pressure. , that is, to detect the actual downward pressure of the crimping component 133 located on the periphery and displaced synchronously; therefore, the test device 10 can detect the actual downward pressure of the crimping component 133 in advance during the pre-operation. If it does not meet the requirements of the test operation, the downward pressure of the crimping component 133 can be adjusted before the test to ensure the test quality and prevent damage to electronic components to save costs.

After the electronic component 14 is placed in the test seat 111, the moving arm 132 drives the body 15 and the base 131 to move downward along the pressing axis A. The floating unit uses the air pressure of the air chamber 153 to provide the base 131 with a preset downward pressure, so that the pressing component 133 of the base 131 presses the electronic component 14 in the test seat 111 with the preset downward pressure, and the first bonding component 134 presses the multiple first pressure sensors 122, 123 in the first detection area 121. , 124; however, when the electronic component 14 is pressed against the plurality of probes 113 of the test seat 111, it will be subjected to the reaction force of the plurality of probes 113. The electronic component 14 pushes the base 131 upward with the reaction force it has borne. At this time, after being pressed, the plurality of first pressure sensors 122, 123, 124 transmit the plurality of sensing data to the processor for analysis. Since the preset downward pressure is the sum of the plurality of downward pressures sensed by the plurality of first pressure sensors 122, 123, 124 plus the plurality of downward pressures sensed by the plurality of first pressure sensors 122, 123, 124, the plurality of sensing data is transmitted to the processor for analysis. The reaction force of the probes 113 is the pressure on the electronic component 14. In other words, the first pressure sensors 122, 123, and 124 can be used to detect the actual pressure on the electronic component 14. The test device 10 of the present invention can detect the actual pressure on the electronic component 14 without damaging the electronic component 14. When the electronic component 14 is under pressure, the first detection unit can detect the actual pressure on the electronic component 14, thereby improving the test quality.

Please refer to Figure 8. The difference between the third embodiment of the test device 10 of the present invention and the second embodiment is that the crimping device of the crimping mechanism is provided with a second bonding component 1314 on the bottom surface of the first block 1311 of the base 131. The testing mechanism further includes a second detection unit. The second detection unit is provided with a second detection area 155 in the area of the second bonding component 1314 of the main body 15 relative to the base 131. The second detection area 155 is configured with at least one second pressure sensor to detect the downward pressure. In this embodiment, the second detection area 155 is configured with a plurality of second pressure sensors 156, 157, and 158. The plurality of second pressure sensors 156, 157, and 158 can be configured in a polygonal sensing point arrangement in the second detection area 155, such as an equilateral triangle or a quadrangle. In this embodiment, the plurality of second pressure sensors 156, 157, and 158 are configured in a polygonal sensing point arrangement in the second detection area 155. 7. 158 are arranged at sensing points in a regular triangle in the second detection area 155; when the base 131 drives the crimping component 133 to move downward along the crimping axis A, the second bonding component 1314 can be used to crimp a plurality of second pressure sensors 156, 157, 158. After the plurality of second pressure sensors 156, 157, 158 are compressed, a plurality of sensing data are transmitted to a processor, and the pressure under the crimping component 133 can also be detected; therefore, the second detection unit can be used in conjunction with the first detection unit, so that the test device 10 can detect the actual pressure under the crimping component 133 in different areas, thereby improving the detection performance.

Please refer to Figures 1 to 4 and Figure 9. The electronic component processing machine includes a machine 20, a feeding device 30, a receiving device 40, a testing device 10, a conveying device 50 and a central control device (not shown); the feeding device 30 is mounted on the machine 20 and is provided with at least one feeder to accommodate at least one electronic component to be tested; the receiving device 40 is mounted on the machine 20 and is provided with at least one receiving device to accommodate at least one electronic component that has been tested. ; The testing device 10 is arranged on the machine 20 and is provided with the testing mechanism and the crimping mechanism of the present invention. The testing mechanism of the present invention includes at least one tester and at least one first detection unit. At least one tester is provided with at least one test piece for testing electronic components. At least one first detection unit is provided with a first detection area around the test piece of the tester. The first detection area is provided with at least one first pressure sensor for detecting the lower pressure. The crimping mechanism is provided with at least one crimping device, and the crimping device is provided with a crimping component and a first pasting component. One of the crimping device and the tester is displaced toward the other along the crimping axis. The crimping component is used to crimp the electronic components of the tester. The first pasting component is located around the crimping component to crimp the first pressure sensor of the first detection unit. In this embodiment, the tester is provided with an electrically connected circuit board 114 and a test seat 111 with a test piece (such as a probe 113). The test seat 111 is used to hold and test Electronic components; the conveying device 50 is mounted on the machine 20 and is provided with at least one conveyor to convey the electronic components. In this embodiment, the conveying device 50 is provided with a first conveyor 51 to take out the electronic components to be tested from the feeder of the feeding device 30 and transfer them to the second conveyor 52. The second conveyor 52 transfers the electronic components to be tested to the side of the testing device 10. The crimping mechanism of the testing device 10 uses the moving arm 132 to drive the crimping component 133 to take out the electronic components to be tested from the second conveyor 52. , and move it into the test seat 111 to perform the test operation. The test mechanism detects the actual downward pressure on the electronic component with the first detection unit to improve the test quality. The crimping mechanism moves the tested electronic component into the third conveyor 53 and loads it out. A fourth conveyor 54 takes out the tested electronic component from the third conveyor 53 and transports the tested electronic component to the receiver of the receiving device 40 for classification and storage according to the test results. The central control device (not shown) is used to control and integrate the actions of each device to perform automated operations and achieve practical benefits of improving operation efficiency.

10: Test device 111: Test seat 112: Accommodation part 113: Probe 114: Circuit board 121: First detection area 122, 123, 124: First pressure sensor 131: Base 1311: First block 1312: Second block 1313: Connecting part 1314: Second bonding part 132: Moving arm 133: Pressing part 134: First bonding part A: Pressing axis 14: Electronic component 141: Contact 15: Body 151: Accommodation space 152: Flow channel 153: Air chamber 154: Through hole 155: Second detection area 156, 157, 158: Second pressure sensor 20: Machine 30: Feeding device 40: Receiving device 50: Conveying device 51: First conveyor 52: Second conveyor 53: Third conveyor 54: Fourth conveyor

Figure 1: Schematic diagram of the first embodiment of the test device of the present invention. Figure 2: A top view of the first detection unit of the test mechanism. Figures 3 to 4: Schematic diagrams of the use of the first embodiment of the test mechanism. Figure 5: Schematic diagram of the second embodiment of the test device of the present invention. Figures 6 to 7: Schematic diagrams of the use of the second embodiment of the test mechanism. Figure 8: Schematic diagram of the third embodiment of the test device of the present invention. Figure 9: Schematic diagram of the test device of the present invention applied to a work machine.

111: Test socket

112: Accommodation section

113: Probe

121: First detection area

122, 123, 124: First pressure sensor

Claims (10)

A testing mechanism, comprising: At least one tester: provided with at least one test piece for testing electronic components; A first detection unit: provided with a first detection area and at least one first pressure sensor, the first detection area is provided in the peripheral area of the test piece and is located in the pressure-bearing path, at least one first pressure sensor is arranged in the first detection area to sense the pressure in the pressure-bearing path, and detect the actual pressure borne by the electronic component. The tester as described in claim 1 includes an electrically connected circuit board and a test socket with the test piece, and the first detection unit is provided with the first detection area on the test socket or on the machine in the peripheral area of the test piece for configuring the first pressure sensor. In the testing mechanism as described in claim 1, the height of the first pressure-bearing surface of the first pressure sensor of the first detection unit is higher than the height of the first end of the test piece. In the testing mechanism as described in any one of claims 1 to 3, at least one first pressure sensor of the first detection unit includes a plurality of first pressure sensors. In the testing mechanism described in claim 4, the plurality of first pressure sensors of the first detection unit are arranged in a polygonal sensing point configuration. A testing device, comprising: At least one testing mechanism as described in claim 1: provided with at least one tester and a first detection unit for testing electronic components and detecting pressure; A crimping mechanism: provided with at least one crimping device, the crimping device provided with at least one crimping component and at least one first bonding component, one of the crimping device and the tester is displaced toward the other along the crimping axis, the crimping component is provided for crimping electronic components, and the first bonding component is located on the periphery of the crimping component for crimping the first pressure sensor of the first detection unit. In the test device as described in claim 6, the pressurizer of the pressurizing mechanism includes a base, the pressurizing component and the first bonding component. The base is provided with the pressurizing component at the bottom, and the first bonding component is provided around the pressurizing component and at a position opposite to the first pressure sensor. As described in claim 6, the crimping device of the crimping mechanism includes a base and a floating unit, wherein the floating unit is provided with a main body with an air chamber above the base for accommodating the base capable of floating displacement, the second block of the base protrudes out of the main body, and the crimping component and the first bonding component are provided at the bottom. As described in claim 8, the press fitter is provided with a second bonding component on the first block of the base, and the testing mechanism further includes a second detection unit, which is provided with a second detection area in the area of the body opposite to the second bonding component of the base, and the second detection area is configured with at least one second pressure sensor to detect the downward pressure. A work machine, comprising: a machine; a feeding device: arranged on the machine and provided with at least one feeder for accommodating at least one electronic component to be tested; a receiving device: arranged on the machine and provided with at least one receiver for accommodating at least one electronic component that has been tested; at least one test device as described in claim 6: arranged on the machine; a conveying device: arranged on the machine and provided with at least one conveyor for conveying electronic components; a central control device: for controlling and integrating the actions of various devices to perform automated operations.

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