TWI769847B - Operating mechanism having stacking sensing unit, operating apparatus, and operating machine using the same - Google Patents
Operating mechanism having stacking sensing unit, operating apparatus, and operating machine using the same Download PDFInfo
- Publication number
- TWI769847B TWI769847B TW110120255A TW110120255A TWI769847B TW I769847 B TWI769847 B TW I769847B TW 110120255 A TW110120255 A TW 110120255A TW 110120255 A TW110120255 A TW 110120255A TW I769847 B TWI769847 B TW I769847B
- Authority
- TW
- Taiwan
- Prior art keywords
- detection unit
- carrier
- working
- stacking detection
- channel
- Prior art date
Links
Images
Landscapes
- Measurement Of Radiation (AREA)
Abstract
Description
本發明提供一種即時檢知承置器是否異常疊料之疊料檢知單元。The present invention provides a stacking detection unit for instantly detecting whether a holder is abnormally stacked.
在現今,電子元件測試裝置以壓接器將電子元件移入測試器而執行測試作業,若測試器內殘留上一電子元件,當壓接器將下一電子元件移入測試器時,勢必壓損下一電子元件;因此,測試裝置設置取像器以取像測試器是否異常疊料。In today's electronic component testing device, the crimper moves the electronic component into the tester to perform the test operation. If there is an electronic component left in the tester, when the crimper moves the next electronic component into the tester, the pressure loss is bound to drop. An electronic component; therefore, the test device is provided with an imager to take the image of whether the tester is abnormally stacked.
請參閱圖1,測試裝置於機台11設置一具探針之測試座12,以供承置及測試電子元件,另於測試座12之上方設置壓接器13,壓接器13作Y-Z方向位移,並具有吸嘴131,利用吸嘴131於載台14與測試座12間移載電子元件,另於測試座12上方之機架15裝配一取像器16,於初始執行測試作業或重新開機時
,取像器16取像測試座12內是否殘留電子元件。
Please refer to FIG. 1 , the test device is provided with a
惟,取像器16固設於機架15,於取像檢查時,必須控制壓接器13離開測試座12之正上方,方可供取像器16取像測試座12,取像完畢後,再控制壓接器13將下一電子元件移入測試座12,由於此一檢知作動時序繁瑣耗時,工作人員僅於初始執行測試作業或重新開機時,方才以取像器16取像測試座12內是否殘留電子元件,以致測試作業過程中,若測試座12殘留有上一電子元件,工作人員因無法立即得知測試座12發生異常疊料狀況,當壓接器13將下一電子元件移入測試座12時,即會壓損下一電子元件,並降低電子元件之良率。However, the
本發明之目的一,提供一種具疊料檢知單元之工作機構,包含承載具、作動具及疊料檢知單元,承載具作至少一方向位移,並設有至少一容置部,作動具之桿體穿置於承載具之容置部,並以作業部件對電子元件執行預設作業,疊料檢知單元於承載具設有至少一可投射光束之檢知器,並於承載具或作動具相對應檢知器之位置設有至少一通道,以供通過檢知器投射之光束;藉以作動具於承置器執行預設作業時而由預設位置反向位移至過當位置,檢知器於投射至通道之光束呈遮斷狀態而可迅速檢知承置器異常疊料,以利即時排除異常,並提高電子元件良率。The first object of the present invention is to provide a working mechanism with a stacking detection unit, including a carrier, an actuating tool, and a stacking detection unit. The carrier is displaced in at least one direction, and is provided with at least one accommodating portion for the actuating tool. The rod body is passed through the accommodating part of the carrier, and the operation parts are used to perform preset operations on the electronic components. The position of the actuator corresponding to the detector is provided with at least one channel for the light beam projected by the detector, so that the actuator is reversely displaced from the preset position to the excessive position when the receiver performs the preset operation, and the detection is performed. When the light beam projected to the channel is blocked, the detector can quickly detect the abnormal stacking of the holder, so as to eliminate the abnormality immediately and improve the yield of electronic components.
本發明之目的二,提供一種作業裝置,包含至少一承置器及本發明工作機構,至少一承置器以供承置電子元件,本發明工作機構包含承載具、作動具及疊料檢知單元,承載具載送作動具及疊料檢知單元作至少一方向位移 ,作動具於承載具上作Z方向位移,並於承置器執行預設作業,疊料檢知單元以供檢知承置器是否異常疊料,以利即時排除異常,並提高電子元件良率。 The second objective of the present invention is to provide a working device, which includes at least one holder and a working mechanism of the present invention, at least one holder for holding electronic components, and the working mechanism of the present invention includes a carrier, an actuating tool, and a stacking detector. The unit, the carrier carrying actuating tool and the stacking detection unit are displaced in at least one direction , the actuator is displaced in the Z direction on the carrier, and the preset operation is performed on the holder, and the stacking detection unit is used to detect whether the holder is abnormally stacked, so as to facilitate immediate elimination of abnormalities and improve the quality of electronic components. Rate.
本發明之目的三,提供一種作業機,包含機台、至少一作業裝置及中央控制裝置,至少一作業裝置配置於機台,並設有至少一承置器及本發明工作機構,至少一承置器以供承置電子元件,本發明工作機構包含承載具、作動具及疊料檢知單元,以於承置器執行預設作業,並檢知承置器是否異常疊料 ,以利即時排除異常,而提高電子元件良率;中央控制裝置以控制及整合各裝置作動而執行自動化作業。 The third object of the present invention is to provide a working machine, comprising a machine base, at least one working device and a central control device, at least one working device is arranged on the machine base, and is provided with at least one holder and the working mechanism of the present invention, at least one support The setter is used for holding electronic components. The working mechanism of the present invention includes a supporter, an actuating tool and a stacking detection unit, so as to perform a preset operation on the setter and detect whether the setter is abnormally stacked. , in order to eliminate abnormalities in real time and improve the yield of electronic components; the central control device controls and integrates the actions of each device to perform automatic operations.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to make your examiners further understand the present invention, hereby give a preferred embodiment and cooperate with the drawings, the details are as follows:
請參閱圖2、3,本發明工作機構20之第一實施例包含承載具21、作動具22及疊料檢知單元。Please refer to FIGS. 2 and 3 , the first embodiment of the
承載具21作至少一方向位移,並設有至少一容置部;更進一步,容置部平行作業軸線L或沿作業軸線L設置,承載具21可為移料器之承載具、浮動器之承載具或打印器之承載具等,承載具21包含至少一板件,並於至少一板件設有容置部,於本實施例,承載具21為移料器之承載具,包含第一板件211及第二板件212,承載具21之至少一容置部包含於第一板件211設有至少一第一容置部,至少一第一容置部包含複數個平行於作業軸線L之第一容置部2111,第一容置部2111呈Z方向配置,其兩端相通第一板件211之頂面及底面,第二板件212裝配於第一板件211之頂面,並連接一移動臂213,移動臂213帶動承載具21作至少一方向位移,即帶動第一板件211及第二板件212作X-Y-Z方向位移。The
作動具22設有桿體221及作業部件,桿體221裝配於承載具21之容置部,作業部件設於桿體221,以供對電子元件執行預設作業;更進一步,作動具22可為移料具或壓接具等,作業部件可為吸嘴或壓接治具等;於本實施例,作動具22為移料具,其桿體221穿置於承載具21之第一容置部2111,以供於第一容置部2111內作Z方向位移,桿體221以靠近第一板件211頂面之一端作為第一端2211,並以靠近第一板件211底面之另一端作為第二端2212,桿體221之第一端2211位於第一容置部2111內,並未凸伸出第一容置部2111,桿體221之第二端2212則凸伸出第一容置部2111,並設有一為吸嘴222之作業部件,吸嘴222以供取放電子元件。The actuating
疊料檢知單元於承載具21設有至少一可投射光束之檢知器,並於承載具21或作動具22相對應檢知器之位置設有至少一通道,以供通過檢知器投射之光束,作動具22於承置器(圖未示出)執行預設作業時而由預設位置反向位移至過當位置,檢知器於投射至通道之光束呈遮斷狀態而可迅速檢知承置器異常疊料,以利即時排除異常,並提高電子元件良率。The stack detection unit is provided with at least one detector capable of projecting light beams on the
依作業需求,疊料檢知單元之通道可為槽道、一空間區域或通孔
;舉例通道可為槽道,並設於承載具21之第一板件211頂面或第二板件212之底面;舉例通道可為一空間區域,檢知器配置於承載具21之頂面,承載具21頂面相對於檢知器之光束路徑的空間區域即構成通道,亦無不可。疊料檢知單元之通道可設於作動具22,舉例於作動具22相對應檢知器之位置開設一為通孔之通道,亦無不可。
According to the operation requirements, the channel of the stack detection unit can be a channel, a space area or a through hole
For example, the channel can be a channel, and is arranged on the top surface of the
依作業需求,檢知器可為對照式感測器或反射式感測器,檢知器可裝配於承載具21之外周面或內部,或者裝配於通道內;舉例承載具21開設呈槽道之通道,通道相交容置部,檢知器可裝配於承載具21之外周面或通道內,均可對通道投射光束,以感測作動具22是否過當位移,而檢知承置器是否殘留電子元件,亦無不可。According to operational requirements, the detector can be a contrast sensor or a reflective sensor. The detector can be mounted on the outer surface or inside of the
依作業需求,疊料檢知單元可設置至少一架體裝配於承載具21,以供架置檢知器,更佳者,架體可裝配於一調整器(圖未示出)而作至少一方向位移,以供調整檢知器之位置。According to operational requirements, the stacking detection unit can be provided with at least one frame mounted on the
於本實施例,疊料檢知單元於承載具21之第一板件211頂面設有通道2112,通道2112為呈X方向配置之槽道,並相交於第一容置部2111;檢知器為對照式感測器,包含投光元件231及受光元件232,更佳者,疊料檢知單元於承載具21之第一板件211兩側分別裝配第一架體233及第二架體234,第一架體233供裝配投光元件231,第二架體234供裝配受光元件232,投光元件231及受光元件232作相對應配置於通道2112之二側,投光元件231對承載具21上之通道2112投射光束,受光元件232接收投光元件21121所投射之光束,若光束被遮斷
,受光元件232無法接收到光束,表示承置器異常疊料,反之,若光束未遮斷,受光元件232接收到光束,表示承置器正常空置。
In this embodiment, the stack detection unit is provided with a
請參閱圖4、5,本發明工作機構20應用於作業裝置,作業裝置包含至少一承置器及本發明工作機構20,至少一承置器以供承置電子元件,本發明工作機構20包含承載具21、作動具22及疊料檢知單元,承載具21載送作動具22及疊料檢知單元作至少一方向位移,作動具22於承置器執行預設作業,疊料檢知單元以供檢知承置器是否異常疊料,以利即時排除異常,並提高電子元件良率。Please refer to FIGS. 4 and 5 , the
更進一步,作業裝置可為測試裝置、供料裝置、收料裝置、預溫裝置或輸送裝置,承置器可為測試座、供料承置器、收料承置器、預溫承置器或載台等,均可承置電子元件。Further, the working device can be a testing device, a feeding device, a receiving device, a pre-heating device or a conveying device, and the holder can be a test seat, a feeding device, a receiving device, and a pre-warming device. Or a stage, etc., can hold electronic components.
於本實施例,作業裝置為輸送裝置,輸送裝置設有一為載台31之承置器,載台31具有二承槽311供承置二電子元件;工作機構20以作動具22之吸嘴222吸附下一電子元件32,並以移動臂213帶動承載具21、疊料檢知單元及下一電子元件32作X-Y方向位移至載台31之上方,且依預設作業高度帶動下一電子元件32作Z方向向下位移,若載台31之一承槽311內殘留上一電子元件33,作動具22會受到二個電子元件32、33的過大反作用力頂推而於承載具21之第一容置部2111內作Z方向反向過當位移,由於此一過當位移量已超出預設位移量,使得作動具22之桿體221的第一端2211由預設位置向上位移至過當位置,由於第一容置部2111相交於通道2112,使得桿體221之第一端2211位於通道2112,並遮斷檢知器之投光元件231朝通道2112投射之光束,檢知器之受光元件232因光束被遮斷而未接收到光束,檢知器於光束呈遮斷狀態而可迅速檢知載台31異常疊料,即會發出一訊號至處理器(圖未示出),處理器會判斷作動具22之吸嘴222過壓下一電子元件32,以告知工作人員即時排除異常,以避免後續電子元件受損。In this embodiment, the working device is a conveying device, and the conveying device is provided with a holder which is a
請參閱圖6、7,本發明工作機構20之第二實施例與第一實施例差異在於承載具24為浮動器之承載具,包含第一板件241及第二板件242,承載具24之至少一容置部包含第一容置部及第二容置部,即第一板件241設有一沿作業軸線L之第一容置部2411,第一容置部2411呈Z方向配置,其兩端相通第一板件241之頂面及底面,第二板件242裝配於第一板件241之頂面,並設有一相通第一容置部2411的第二容置部2421,第二板件242之頂面連接一移動臂243,移動臂243帶動第一板件241及第二板件242作Y-Z方向位移。Please refer to FIGS. 6 and 7 , the difference between the second embodiment of the
作動具25為壓接具,並設有桿體251及作業部件,其桿體251穿置於承載具24之第一容置部2411及第二板件242之第二容置部2421,並可作Z方向位移,桿體251以靠近第二板件242頂面之一端作為第一端2511,並以靠近第一板件241底面之另一端作為第二端2512,桿體251之第二端2512供裝配一為下壓治具252之作業部件,下壓治具252以供壓接及取放電子元件。The
疊料檢知單元於承載具24之第二板件242的底面設有至少一相交於第二容置部2421之通道2422,通道2422為呈X方向配置之槽道,疊料檢知單元另於作動具25之桿體251相對於通道2422的位置設有至少一讓位部2513,讓位部2513可為環槽或通孔,以供通過光束;於本實施例,作動具25之桿體251於相對通道2422的位置凹設有一為環槽之讓位部2513,檢知器為對照式感測器,包含投光元件231及受光元件232,投光元件231及受光元件232分別裝配於承載具24之第二板件242的通道2422兩端,投光元件231對通道2422投射光束,光束通過桿體251之讓位部2513,以供受光元件232接收投光元件231所投射之光束,表示承置器正常空置,反之,若光束被作動具25之桿體251遮斷,受光元件232無法接收到光束,表示承置器異常疊料。The stacking detection unit is provided with at least one
請參閱圖8、9,本發明作業機構20之第二實施例應用於一為測試裝置之作業裝置,測試裝置設有一為測試座34之承置器,測試座34具有探針,以供承置及測試電子元件;工作機構20以作動具25之下壓治具252吸附下一電子元件32,並以承載具24之移動臂243帶動疊料檢知單元及下一電子元件32作Y方向位移至測試座34之上方,且依預設作業高度帶動下一電子元件32作Z方向位移,若測試座34內殘留上一電子元件33,作動具25之下壓治具252會受到二個電子元件32、33的過大反作用力頂推而於承載具24之第一容置部2411及第二容置部2421內作Z方向反向過當位移,由於此一過當位移量已超出預設位移量,使得作動具25之桿體251的讓位部2513由預設位置向上位移至過當位置,即桿體251的讓位部2513偏離通道2422,並以其他部位之桿身相對於通道2422,由於其他桿身之直徑尺寸大於讓位部2513之直徑尺寸,使得其他桿身遮斷檢知器之投光元件231朝通道2422投射之光束,檢知器之受光元件232因光束被遮斷而未接收到光束,檢知器於光束呈遮斷狀態而可迅速檢知測試座34異常疊料,即會發出一訊號至處理器(圖未示出),處理器會判別作動具25之下壓治具252過壓下一電子元件32,以告知工作人員即時排除異常,以避免後續電子元件受損。Referring to FIGS. 8 and 9 , the second embodiment of the
請參閱圖6~10,本發明作業機包含機台30、具至少一本發明工作機構20之作業裝置及中央控制裝置(圖未示出);至少一作業裝置配置於機台30
,並設有至少一承置器及本發明之工作機構20,至少一承置器以供承置電子元件,本發明工作機構20包含承載具、作動具及疊料檢知單元,以供於承置器執行預設作業,並檢知承置器是否異常疊料,以利即時排除異常,並提高電子元件良率;中央控制裝置以控制及整合各裝置作動而執行自動化作業。
Please refer to FIGS. 6-10 , the working machine of the present invention includes a machine table 30 , a working device having at least one
於本實施例,作業機為電子元件測試作業機,包含機台30、供料裝置40、收料裝置50、具本發明工作機構20之測試裝置60、輸送裝置70及中央控制裝置(圖未示出);然依作業需求,測試作業機可配置預溫盤(圖未示出),以供預溫待測之電子元件。供料裝置40配置於機台30,並設有至少一供料承置器41,以供容置複數個待測之電子元件;收料裝置50配置於機台30,並設有至少一收料承置器51,以供容置複數個已測之電子元件。In this embodiment, the working machine is an electronic component testing machine, including a machine table 30, a
測試裝置60配置於機台30,包含至少一承置器及至少一本發明工作機構20,承置器為具探針之測試座61,測試座61電性連接一電路板62,並供承置及測試電子元件;本發明工作機構20(請參閱圖6~10),包含承載具24、作動具25及疊料檢知單元。更佳者,測試裝置60設有測試室63,以供測試座61於測試室63執行測試作業;更進一步,測試室63設置至少一輸送管(圖未示出),以供輸送乾燥空氣。The
另於工作機構20之作動具25或承載具24設有溫控機構(圖未示出)
,溫控機構設有至少一溫控件,以供溫控電子元件,使電子元件於模擬日後使用環境溫度下執行測試作業;更進一步,溫控件可為加熱件、致冷晶片或具流體之座體。然依作業需求,於熱測作業時,測試室63內可配置鼓風機,以供吹送熱風,使測試室63之內部升溫,亦無不可。
In addition, a temperature control mechanism (not shown) is provided on the
輸送裝置70配置於機台30,設有至少一移料器,於本實施例,輸送裝置70以第一移料器71作X-Y-Z方向位移,於供料裝置40之供料承置器41取出待測之電子元件,並移入第一載台72,第一載台72承載待測之電子元件位移至測試裝置60之測試座61側方,測試裝置60之工作機構20以移動臂243帶動承載具24、下壓治具252及疊料檢知單元等作Y-Z方向位移,令下壓治具252於第一載台72取出待測之電子元件,並移入測試座61,若測試座61殘留上一電子元件,下壓治具252受到二個電子元件之過當反作用力頂推而向上位移,令桿體251之讓位部2513偏離承載具24之通道2422,以其他桿身遮斷檢知器之投光元件231朝通道2422投射之光束,受光元件232因光束被遮斷而未接收到光束,檢知器於光束呈遮斷狀態而可迅速檢知測試座61異常疊料,即會發出一訊號至處理器(圖未示出),處理器會判別作動具25之下壓治具252過壓下一電子元件,以告知工作人員即時排除異常,以避免後續電子元件受損;反之,若測試座61並無殘留電子元件,作動具25之讓位部2513保持相對於承載具24之通道2422,以供投光元件231朝通道2422投射之光束,受光元件232接收光束,檢知器可迅速檢知測試座61正常空置;當測試座61正常空置,下壓治具252將待測之電子元件移入測試座61而執行測試作業;於測試完畢,下壓治具252將已測之電子元件由測試座61移載至第二載台73,第二載台73載出已測之電子元件,輸送裝置70以第二移料器74作X-Y-Z方向位移,於第二載台73取出已測之電子元件,依據測試結果,將複數個已測之電子元件輸送至收料裝置50之收料承置器51而分類收置;中央控制裝置(圖未示出)用以控制及整合各裝置作動,以執行自動化作業,進而提升作業效能。The conveying
輸送裝置依作業需求,可僅配置單一載台以供載送待測電子元件及已測電子元件,亦無不可。又依作業需求,載台可位移至測試座之側方或上方。According to the operation requirements, the conveying device can only be configured with a single carrier for carrying the electronic components to be tested and the electronic components that have been tested. In addition, the stage can be moved to the side or the top of the test seat according to the needs of the operation.
[習知]
11:機台
12:測試座
13:壓接器
131:吸嘴
14:載台
15:機架
16:取像器
[本發明]
20:工作機構
21:承載具
211:第一板件
2111:第一容置部
2112:通道
212:第二板件
213:移動臂
22:作動具
221:桿體
2211:第一端
2212:第二端
222:吸嘴
231:投光元件
232:受光元件
233:第一架體
234:第二架體
24:承載具
241:第一板件
2411:第一容置部
242:第二板件
2421:第二容置部
2422:通道
243:移動臂
25:作動具
251:桿體
2511:第一端
2512:第二端
2513:讓位部
252:下壓治具
L:作業軸線
30:機台
31:載台
311:承槽
32、33:電子元件
34:測試座
40:供料裝置
41:供料承置器
50:收料裝置
51:收料承置器
60:測試裝置
61:測試座
62:電路板
63:測試室
70:輸送裝置
71:第一移料器
72:第一載台
73:第二載台
74:第二移料器
[acquaintance]
11: Machine
12: Test seat
13: Crimper
131: Nozzle
14: Carrier
15: Rack
16: Imagefinder
[this invention]
20: Work Organization
21: Carrier
211: The first board
2111: The first container
2112: Channel
212: Second board
213: Moving Arm
22: Actuator
221: Rod body
2211: First End
2212: Second End
222: nozzle
231: light-emitting element
232: light receiving element
233: The first frame
234: Second Frame
24: Carrier
241: The first board
2411: The first container
242: Second plate
2421: Second Receptacle
2422: channel
243: Moving Arm
25: Actuator
251: Rod body
2511: First End
2512: Second end
2513: Give way
252: Press down jig
L: Working axis
30: Machine
31: Carrier
311:
圖1:習知取像器之使用示意圖。 圖2:本發明工作機構第一實施例之前視剖面圖。 圖3:本發明工作機構第一實施例之局部俯視圖。 圖4:本發明工作機構第一實施例應用於作業裝置之使用示意圖。 圖5:係圖4之局部放大示意圖。 圖6:本發明工作機構第二實施例之前視剖面圖。 圖7:本發明工作機構第二實施例之局部俯視圖。 圖8:本發明工作機構第二實施例應用於作業裝置之使用示意圖。 圖9:係圖8之局部放大示意圖。 圖10:本發明作業機之配置圖。 Figure 1: Schematic diagram of the use of a conventional imagefinder. Figure 2: A front sectional view of the first embodiment of the working mechanism of the present invention. Figure 3: A partial top view of the first embodiment of the working mechanism of the present invention. FIG. 4 is a schematic diagram of the use of the first embodiment of the working mechanism of the present invention applied to a working device. FIG. 5 is a partial enlarged schematic view of FIG. 4 . Figure 6: A front sectional view of the second embodiment of the working mechanism of the present invention. Figure 7: A partial top view of the second embodiment of the working mechanism of the present invention. FIG. 8 is a schematic diagram of the use of the second embodiment of the working mechanism of the present invention applied to a working device. FIG. 9 is a partial enlarged schematic view of FIG. 8 . Figure 10: The configuration diagram of the working machine of the present invention.
21:承載具 21: Carrier
2111:第一容置部 2111: The first container
2112:通道 2112: Channel
221:桿體 221: Rod body
2211:第一端 2211: First End
231:投光元件 231: light-emitting element
Claims (17)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110120255A TWI769847B (en) | 2021-06-03 | 2021-06-03 | Operating mechanism having stacking sensing unit, operating apparatus, and operating machine using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110120255A TWI769847B (en) | 2021-06-03 | 2021-06-03 | Operating mechanism having stacking sensing unit, operating apparatus, and operating machine using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI769847B true TWI769847B (en) | 2022-07-01 |
TW202248104A TW202248104A (en) | 2022-12-16 |
Family
ID=83439559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110120255A TWI769847B (en) | 2021-06-03 | 2021-06-03 | Operating mechanism having stacking sensing unit, operating apparatus, and operating machine using the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI769847B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201634939A (en) * | 2015-03-26 | 2016-10-01 | Seiko Epson Corp | Electronic component transfer device, electronic component inspection device, positioning device for electronic component transfer device and positioning method for electronic component transfer device |
CN110850273A (en) * | 2019-11-15 | 2020-02-28 | 广东利扬芯片测试股份有限公司 | Material overlapping prevention IC test equipment and test method thereof |
TW202106593A (en) * | 2019-08-02 | 2021-02-16 | 鴻勁精密股份有限公司 | Electronic component transfer mechanism and operation classification apparatus applying the same with which the working staff can be aware of the transfer status in real time thereby improving the efficiency of the transfer operation |
-
2021
- 2021-06-03 TW TW110120255A patent/TWI769847B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201634939A (en) * | 2015-03-26 | 2016-10-01 | Seiko Epson Corp | Electronic component transfer device, electronic component inspection device, positioning device for electronic component transfer device and positioning method for electronic component transfer device |
TW202106593A (en) * | 2019-08-02 | 2021-02-16 | 鴻勁精密股份有限公司 | Electronic component transfer mechanism and operation classification apparatus applying the same with which the working staff can be aware of the transfer status in real time thereby improving the efficiency of the transfer operation |
CN110850273A (en) * | 2019-11-15 | 2020-02-28 | 广东利扬芯片测试股份有限公司 | Material overlapping prevention IC test equipment and test method thereof |
Also Published As
Publication number | Publication date |
---|---|
TW202248104A (en) | 2022-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4327335B2 (en) | Contact arm and electronic component testing apparatus using the same | |
TW201418126A (en) | Electronic component processing machine | |
JP2012013699A (en) | Sensor module, tissue treatment apparatus and operation method of tissue treatment apparatus | |
TWI769847B (en) | Operating mechanism having stacking sensing unit, operating apparatus, and operating machine using the same | |
CN115184777A (en) | SOA-containing EML chip full-automatic testing machine and testing method | |
CN113654585B (en) | Automation device for calibrating pressure sensor and acceleration sensor | |
TW202204923A (en) | Detection unit for connecting apparatus and handler having the same | |
CN219324478U (en) | Feeding system and chip test sorting machine | |
US7676908B2 (en) | Pressing member and electronic device handling apparatus | |
TW202146900A (en) | Pressing mechanism, operating apparatus, and operating equipment having the same | |
TW202217321A (en) | Position shifter for electronic component support and operating apparatus using the same | |
KR102107908B1 (en) | Apparatus for transferring diagnostic strips | |
TWI769698B (en) | Image taking apparatus and handler using the same | |
TWI767736B (en) | Correction apparatus, correction method, and handler using the same | |
TWI777740B (en) | Correction apparatus, correction method, and handler using the same | |
TWI775471B (en) | Correction apparatus, correction method, and handler using the same | |
TWI853486B (en) | Appearance inspection apparatus and processing machine | |
JP2010175288A (en) | Apparatus for inspecting electronic device and implement for holding electronic device | |
TWI625294B (en) | Electronic component conveying device and electronic component inspection device | |
TWI769664B (en) | Testing apparatus and testing equipment using the same | |
TW202311756A (en) | Sensing mechanism of supporter, processing device having the same, and processing machine having the same | |
TWI791270B (en) | Correction apparatus, correction method, and handler using the same | |
TW202437848A (en) | Processing device of electronic component and processing machine | |
TWI775470B (en) | Flipping apparatus and handler using the same | |
TWI849765B (en) | Transportation device and processing machine |