JPH0755879A - Ic testing device - Google Patents
Ic testing deviceInfo
- Publication number
- JPH0755879A JPH0755879A JP5204370A JP20437093A JPH0755879A JP H0755879 A JPH0755879 A JP H0755879A JP 5204370 A JP5204370 A JP 5204370A JP 20437093 A JP20437093 A JP 20437093A JP H0755879 A JPH0755879 A JP H0755879A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- contact
- regulator
- air
- sent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はIC試験装置に係り, 特
に, フラットパッケージICのリード (ピン) を測定治具
に載せて試験する際の, 測定治具の接触子とピンとのコ
ンタクト機構に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC tester, and more particularly to a contact mechanism between a contact of a measuring jig and a pin when a lead (pin) of a flat package IC is placed on a measuring jig for testing. .
【０００２】ICの特性試験においては，ICのリードと測
定治具の接触子間のコンタクトをとるために, 接触子を
一定量たわませてその反力で接触圧力を得ることにより
コンタクトをとっている。このため，コンタクト時に接
触子のたわみ量が少ないと接触不良を起こしたり, 反対
にたわみ量が多過ぎるとICのリードに負荷がかかりリー
ド変形を起こす原因となる。そのため，コンタクト時に
一定のたわみ量に制御することが求められている。In the IC characteristic test, in order to make contact between the lead of the IC and the contact of the measuring jig, the contact is deflected by a certain amount and the contact force is obtained by the reaction force of the contact. ing. For this reason, if the deflection of the contact at the time of contact is small, poor contact may occur, and on the contrary, if the deflection is too large, the leads of the IC may be overloaded and lead deformation may occur. Therefore, it is required to control the amount of deflection at the time of contact.
【０００３】[0003]
【従来の技術】図５は従来例によるコンタクト方法の説
明図である。従来のコンタクト方式においては，コンタ
クトさせるためのエアシリンダ 1に一定圧力の圧縮空気
を送り, 測定治具 3上に載せられたIC 5を押圧して接触
圧を得ている。2. Description of the Related Art FIG. 5 is an illustration of a conventional contact method. In the conventional contact method, compressed air with a constant pressure is sent to the air cylinder 1 for making contact, and the IC 5 mounted on the measuring jig 3 is pressed to obtain the contact pressure.
【０００４】この際，測定治具 3の接触子のたわみ量の
制御は, クランパ 2の厚さや, 測定治具 3の高さや，ス
トッパ 4の高さを調整して行われる。また，汎用装置で
は，測定治具やクランパ等の寸法を一定にして, これら
の交換により品種の切替えを行っているが, ICのリード
のピッチの微細化, 多ピン化にともない各々のリードの
剛性が低下し，接触圧力の許容範囲が狭くなり, 測定治
具やクランパ等に要求される寸法精度は厳しくなってき
ている。At this time, the deflection amount of the contact of the measuring jig 3 is controlled by adjusting the thickness of the clamper 2, the height of the measuring jig 3 and the height of the stopper 4. In a general-purpose device, the dimensions of the measuring jig and clamper are kept constant and the types are switched by exchanging these, but with the miniaturization of the IC lead pitch and the increase in pin count, each lead As the rigidity decreases and the allowable range of contact pressure becomes narrower, the dimensional accuracy required for measuring jigs and clampers is becoming stricter.
【０００５】このため，測定治具やクランパ等寸法のば
らつきにより, 接触子のたわみ量が少ないと接触不良を
起こしたり, 反対にたわみ量が多過ぎてICのリードに負
荷がかかりリード変形を起こす等の障害につながること
があった。Therefore, due to variations in the dimensions of measuring jigs and clampers, contact deflection may occur if the deflection amount of the contact is small, or conversely, the deflection amount may be too large and the lead of the IC may be loaded and lead deformation may occur. It may have led to obstacles such as.
【０００６】[0006]
【発明が解決しようとする課題】近年半導体装置の微細
化にともない, 従来例では上記のコンタクトストローク
に起因する障害が発生しやすくなった。In recent years, with the miniaturization of semiconductor devices, in the conventional example, the trouble caused by the above contact stroke is likely to occur.
【０００７】本発明は測定治具やクランパ等の寸法精度
に依存しないで, 測定治具の接触子が常に適切なたわみ
量を得られるようにすることを目的とする。An object of the present invention is to ensure that the contact of the measuring jig can always obtain an appropriate amount of deflection without depending on the dimensional accuracy of the measuring jig or clamper.
【０００８】[0008]
【課題を解決するための手段】上記課題の解決は（図１
参照），リードを測定治具 3の接触子上に載せたICを押
圧するエアシリンダ 1と, 該エアシリンダに供給する圧
気圧を電気信号に応じて変化させるレギュレータ 7と，
該圧気圧を検出する圧力センサ 8と，該圧力センサから
の検出値を電気信号に変え該レギュレータに帰還して該
圧気圧を設定値に保つ手段とを有するコンタクト機構を
具備するＩＣ試験装置により達成される。[Means for Solving the Problems]
), An air cylinder 1 that presses the IC whose lead is placed on the contact of the measurement jig 3, a regulator 7 that changes the pressure and pressure supplied to the air cylinder according to an electric signal,
According to an IC test apparatus having a contact mechanism having a pressure sensor 8 for detecting the pressure and pressure, and means for converting the detection value from the pressure sensor into an electric signal and returning to the regulator to maintain the pressure and pressure at a set value. To be achieved.
【０００９】[0009]
【作用】図１は本発明の原理説明図である。図におい
て，装置の構成はICを押圧するエアシリンダ 1と, エア
シリンダに送る空気圧を電気信号に応じて変化させ，か
つ圧力センサ 8を内蔵するレギュレータ 7と，エアシリ
ンダとレギュレータ間に挿入され, エアシリンダを駆動
する圧縮空気の供給を断続する電磁弁 6と，レギュレー
タをコントロールする制御部 9とからなる。FIG. 1 is a diagram for explaining the principle of the present invention. In the figure, the configuration of the device consists of an air cylinder 1 that presses the IC, a regulator 7 that changes the air pressure sent to the air cylinder according to an electric signal, and a pressure sensor 8 that is built-in, and is inserted between the air cylinder and the regulator. It consists of a solenoid valve 6 that connects and disconnects the supply of compressed air that drives the air cylinder, and a control unit 9 that controls the regulator.
【００１０】制御部は圧力センサで検出した空気圧と設
定圧との差を監視し，空気圧が設定圧になるようにレギ
ュレータを介して変化させる。また，常に空気圧を検出
し,レギュレータに帰還をかけることにより，空気圧を
一定に保ち, エアシリンダの推力も一定に保たれる。The control unit monitors the difference between the air pressure detected by the pressure sensor and the set pressure, and changes the air pressure via the regulator so that the air pressure becomes the set pressure. Also, by constantly detecting the air pressure and feeding it back to the regulator, the air pressure is kept constant and the thrust of the air cylinder is also kept constant.
【００１１】したがって，本発明ではシリンダに送る圧
縮空気の圧力を変動させ，シリンダの推力を変えること
により測定治具の接触子のたわみ量を調整するため，測
定治具やクランパの寸法誤差に影響されることなく，一
定推力により一定のたわみ量でコンタクトすることがで
きる。Therefore, in the present invention, the pressure of the compressed air sent to the cylinder is changed and the thrust of the cylinder is changed to adjust the deflection amount of the contact of the measuring jig, which affects the dimensional error of the measuring jig and the clamper. Without contact, contact can be made with a constant amount of deflection by a constant thrust.
【００１２】[0012]
【実施例】図２は本発明の実施例の説明図である。図に
おいて，まず操作パネル10よりICの品種データを入力す
ると, そのデータのもとに最適なたわみ量になるように
コンタクト圧を装置制御部11が計算し，算出された空気
圧になるように圧力制御部 9が電気制御圧力レギュレー
タ 7を介して空気圧を調整し，エアシリンダ 1の推力を
変化させる。FIG. 2 is an explanatory view of an embodiment of the present invention. In the figure, first, when IC type data is input from the operation panel 10, the device control unit 11 calculates the contact pressure so that the optimum deflection amount is obtained based on the data, and the pressure is adjusted so that it becomes the calculated air pressure. The control unit 9 adjusts the air pressure via the electrically controlled pressure regulator 7 and changes the thrust of the air cylinder 1.
【００１３】ここで，各部の動作は以下のようである。
レギュレータ 7に送られてきた圧縮空気圧を圧力センサ
8が検出し，圧力制御部 9へ圧力値を電圧に変換して送
る。Here, the operation of each part is as follows.
The compressed air pressure sent to the regulator 7 is detected by the pressure sensor.
8 detects and converts the pressure value into voltage and sends it to the pressure control unit 9.
【００１４】一方, 操作パネル10で設定した適正圧 (後
記のようにＩＣの品種により決まる) を装置制御部11が
設定し，電圧に換算した適正圧を圧力制御部 9に送る。
圧力制御部 9は圧力センサ 8が検出し圧力と装置制御部
11から受け取った適正圧とを比較し，双方が等しくなる
ようにレギュレータ 7に信号を送り, 出力空気圧を制御
する。On the other hand, the proper pressure set by the operation panel 10 (determined by the type of IC as described later) is set by the device control section 11, and the proper pressure converted into a voltage is sent to the pressure control section 9.
The pressure control unit 9 detects the pressure and the device control unit
The proper pressure received from 11 is compared, and a signal is sent to the regulator 7 so that they are equal and the output air pressure is controlled.
【００１５】レギュレータ 7で適正圧力に調整された圧
縮空気は, 電磁弁6Aを経て, シリンダ 1へ送られ, 適正
圧力でＩＣをクランプする。図３は実施例に用いた圧力
レギュレータの説明図である。The compressed air adjusted to the proper pressure by the regulator 7 is sent to the cylinder 1 via the solenoid valve 6A and clamps the IC at the proper pressure. FIG. 3 is an explanatory diagram of the pressure regulator used in the embodiment.
【００１６】図において，71は給気用２方弁，72は排気
用２方弁，73は圧力制御部, 74はパイロット室, 75はダ
イヤフラム, 76はバルブアセンブリ, 76は給気ポート,
78は排気ポートである。In the figure, 71 is a two-way valve for air supply, 72 is a two-way valve for exhaust, 73 is a pressure control unit, 74 is a pilot chamber, 75 is a diaphragm, 76 is a valve assembly, 76 is an air supply port,
78 is an exhaust port.
【００１７】電気制御圧力レギュレータは, 市販品とし
ては例えばオムロン製のETR200等がある。その機能の概
略は以下のようである。供給された圧縮空気の圧力を圧
力センサ8によって検出し，その値を電圧に変換して圧
力制御部73に送る。圧力制御部は圧力センサから送られ
てきた圧力値を設定値と比較してその差をパイロット室
74に送る。検出圧が設定値より低いときは給気用２方弁
71が差動してパイロット室内の圧力が上昇し，パイロッ
ト室のダイヤフラム75が押し下げられて吸気ポート77が
開き圧縮空気は流れ，出力圧縮空気Ａの圧力が上がる。The electrically controlled pressure regulator is commercially available, for example, ETR200 manufactured by OMRON. The outline of the function is as follows. The pressure of the supplied compressed air is detected by the pressure sensor 8, and the value is converted into a voltage and sent to the pressure control unit 73. The pressure control unit compares the pressure value sent from the pressure sensor with the set value and determines the difference between them.
Send to 74. Two-way valve for air supply when the detected pressure is lower than the set value
71 differentially increases the pressure in the pilot chamber, the diaphragm 75 in the pilot chamber is pushed down, the intake port 77 opens, compressed air flows, and the pressure of the output compressed air A rises.
【００１８】また，逆に検出圧が設定値より高いときは
排気用２方弁72が差動して出力圧縮空気Ａの圧力が下が
る。次に，通常の装置では, 空気圧は 4 Kg/cm2 程度で
エアシリンダを動作させるが, 実施例においては品種に
よりそれ以下になることもあり，その場合は, 圧力が低
くなるためシリンダの動作スピードが遅くなり，装置の
効率が低下することが懸念される。On the contrary, when the detected pressure is higher than the set value, the exhaust two-way valve 72 is differentially operated and the pressure of the output compressed air A is lowered. Next, in a normal device, the air cylinder is operated at an air pressure of about 4 Kg / cm 2 , but in some cases it may be less than that depending on the product type. In that case, the pressure will be low and the cylinder will operate. There is concern that the speed will slow down and the efficiency of the device will decrease.
【００１９】実施例ではこの対策として，エアシリンダ
1に２段階ストロークのものを用い，１段目は電磁弁6B
を介して通常の圧力で動作させ，２段目は電磁弁6Aを介
して圧力調整を行うことにより，エアシリンダの動作ス
ピードを低下させることなく，コンタクト圧力を調整で
きるようにしている。In the embodiment, as a countermeasure against this, an air cylinder
Uses a 2-stage stroke for 1 and solenoid valve 6B for the 1st stage
The contact pressure can be adjusted without reducing the operating speed of the air cylinder by operating at normal pressure via the solenoid valve and adjusting the pressure at the second stage via the solenoid valve 6A.
【００２０】また，実際の運用においては，エアシリン
ダの摩擦による抵抗や接触子の摺動抵抗の影響を補正し
て圧力を設定する。また，ICの良品サンプルを測定治具
上に載せ, 全部のピンの接触がとれるところまで圧力を
上げ, その値を設定値とすることもできる。Further, in actual operation, the pressure is set by correcting the influence of the resistance due to the friction of the air cylinder and the sliding resistance of the contact. It is also possible to place a good sample of the IC on a measuring jig, raise the pressure to the point where all pins can be contacted, and use that value as the set value.
【００２１】次に, 適正空気圧の設定法について説明す
る。 (1) 接触子に必要な押圧より計算して設定 測定治具の接触子に必要な押圧はその種類によって, １
ピン当たり， 板バネタイプ I 100〜120 g 板バネタイプ II 30〜 40 g ポゴピンタイプ 100〜120 g である。Next, a method of setting the proper air pressure will be described. (1) Calculate and set from the pressure required for the contactor The pressure required for the contactor of the measuring jig depends on the type
Per pin, leaf spring type I 100 to 120 g, leaf spring type II 30 to 40 g, pogo pin type 100 to 120 g.
【００２２】実施例では，接触子のタイプ別に上記の値
に見合った適切な押圧になるように空気圧を設定する。
例えば，板バネタイプ Iの48ピンのICに対してコンタク
トに必要な押圧は, コンタクトに必要な押圧＝(100〜120)g ×48＝(4.8〜5.
76)Kg となる。コンタクトに必要な押圧Ｆはシリンダの押圧で
あるので，シリンダの径を30mmφとすると, (4.8〜5.76)Kg ＝π×(1.5 cm)2 ×空気圧 Kgf/cm2, 空気圧＝0.68〜0.81 Kgf/cm2 となる。In the embodiment, the air pressure is set so as to obtain an appropriate pressure corresponding to the above value for each contact type.
For example, the pressure required for contacting a leaf spring type I 48-pin IC is the pressure required for contact = (100 to 120) g × 48 = (4.8 to 5.
76) Kg. Since the pressure F required for contact is the pressure of the cylinder, if the diameter of the cylinder is 30 mmφ, (4.8 to 5.76) Kg = π × (1.5 cm) 2 × air pressure Kgf / cm 2 , air pressure = 0.68 to 0.81 Kgf / It becomes cm 2 .
【００２３】表１に, 上記のエアシリンダを用いた場合
の, 各種ICに対する適正空気圧と測定治具の接触子との
例を示す。Table 1 shows examples of appropriate air pressures for various ICs and contacts of the measuring jig when the above air cylinder is used.
【００２４】[0024]
【表１】 パッケージ名 適正押圧(Kgf) 適正空気圧(Kgf/cm2) 接触子タイプ DIP 300mil 20ピン 0.6〜 0.8 0.09〜0.11 板パネ II SOP 350mil 32ピン 3.2〜 3.8 0.45〜0.54 板パネ I PLCC 84ピン 8.4〜10.1 1.12〜1.43 板パネ I QFP 120ピン 12.0〜14.4 1.70〜2.04 板パネ I PGA 256ピン 25.6〜30.7 3.32〜4.34 ポゴピン ここで，DIP はデュアル・イン・ラインパッケージ, SO
P はスモール・アウトライン・パッケージ, PLCCはプラ
スチック・リードレス・チップ・キャリア, QFP はクワ
ッド・フラット・パッケージ, PGA はピン・グリッド・
アレイである。なお，300 mil 等は幅方向の端子列間隔
を表す。 (2) ICテスタにより接触抵抗をチェックする方法 接触子にICを載せ, 最初空気圧を上記の計算値より低く
設定し，除々に空気圧を上げていき, ICテスタで接触抵
抗値をチェックしてこれが規格内に入るように圧力を設
定し，その圧力を適正空気圧として装置のメモリに登録
する。この際,このようにして設定された空気圧と上記
の計算値との間に大きな差異があるときは, どこかに異
常があるものと判断して警告を出す。[Table 1] Package name Proper pressure (Kgf) Proper air pressure (Kgf / cm 2 ) Contact type DIP 300mil 20-pin 0.6 to 0.8 0.09 to 0.11 Plate panel II SOP 350mil 32-pin 3.2 to 3.8 0.45 to 0.54 Plate panel I PLCC 84 Pin 8.4 to 10.1 1.12 to 1.43 Board panel I QFP 120 pin 12.0 to 14.4 1.70 to 2.04 Board panel I PGA 256 pin 25.6 to 30.7 3.32 to 4.34 Pogo pin where DIP is dual in line package, SO
P is a small outline package, PLCC is a plastic leadless chip carrier, QFP is a quad flat package, PGA is a pin grid package.
It is an array. Note that 300 mil etc. represents the width of the terminal row. (2) Method of checking contact resistance with IC tester Place the IC on the contactor, first set the air pressure lower than the above calculated value, raise the air pressure gradually, and check the contact resistance value with the IC tester. Set the pressure so that it falls within the specifications, and register that pressure as the proper air pressure in the memory of the device. At this time, if there is a large difference between the air pressure set in this way and the above calculated value, it is judged that something is wrong and a warning is issued.
【００２５】図４は本発明を適用した試験装置の斜視図
である。図において，本発明に関連する箇所には図２と
同じ符号を付けている。実施例では，動力源に圧縮空気
を用いたが, これの代わりに油圧を用いたり，あるいは
エアシリンダの代わりにトルクモータとリニアヘッドを
用いてクランパ2を駆動し，トルクモータのトルクを装
置制御部11により制御することにより,コンタクト圧を
制御してもよい。FIG. 4 is a perspective view of a test apparatus to which the present invention is applied. In the figure, the parts related to the present invention are denoted by the same reference numerals as those in FIG. In the embodiment, compressed air is used as the power source, but hydraulic pressure is used instead of this, or the torque motor and linear head are used instead of the air cylinder to drive the clamper 2 and the torque of the torque motor is controlled by the device. The contact pressure may be controlled by controlling the part 11.
【００２６】[0026]
【発明の効果】測定治具の接触子のたわみ量, すなわち
コンタクト圧を測定治具等の寸法で制御していた従来例
に対して, 本発明では圧力で制御するため, 測定治具等
の寸法のばらつきに影響されずに一定圧力でコンタクト
することができ, 接触不良やリード変形を防止すること
ができた。The deflection amount of the contact of the measuring jig, that is, the contact pressure is controlled by the dimension of the measuring jig or the like, whereas the present invention controls the pressure by the pressure. It was possible to make contact at a constant pressure without being affected by dimensional variations, and to prevent contact failure and lead deformation.
【図面の簡単な説明】[Brief description of drawings]
【図１】 本発明の原理説明図FIG. 1 is an explanatory view of the principle of the present invention.
【図２】 本発明の実施例の説明図FIG. 2 is an explanatory diagram of an embodiment of the present invention.
【図３】 実施例に用いた圧力レギュレータの説明図FIG. 3 is an explanatory diagram of a pressure regulator used in the examples.
【図４】 本発明を適用した試験装置の斜視図FIG. 4 is a perspective view of a test apparatus to which the present invention is applied.
【図５】 従来例によるコンタクト方法の説明図FIG. 5 is an explanatory diagram of a contact method according to a conventional example.
1 エアシリンダ 2 クランパ 3 測定治具 4 ストッパ 5 IC 6 電磁弁 7 電気制御圧力レギュレータ 71 給気用２方弁 72 排気用２方弁 73 圧力制御部 74 パイロット室 75 ダイヤフラム 76 バルブアセンブリ 76 給気ポート 78 排気ポート 8 圧力センサ 9 圧力制御部 10 操作パネル 11 装置制御部 1 Air cylinder 2 Clamper 3 Measuring jig 4 Stopper 5 IC 6 Solenoid valve 7 Electrically controlled pressure regulator 71 Two-way valve for air supply 72 Two-way valve for exhaust 73 Pressure control unit 74 Pilot chamber 75 Diaphragm 76 Valve assembly 76 Air supply port 78 Exhaust port 8 Pressure sensor 9 Pressure controller 10 Operation panel 11 Device controller
Claims (1)
たICを押圧するエアシリンダ(1) と, 該エアシリンダに
供給する圧気圧を電気信号に応じて変化させるレギュレ
ータ(7) と，該圧気圧を検出する圧力センサ(8) と，該
圧力センサからの検出値を電気信号に変え該レギュレー
タに帰還して該圧気圧を設定値に保つ手段とを有するコ
ンタクト機構を具備することを特徴とするＩＣ試験装
置。1. An air cylinder (1) for pressing an IC having a lead placed on a contact of a measurement jig (3), and a regulator (7) for changing the pressure and pressure supplied to the air cylinder according to an electric signal. ), A pressure sensor (8) for detecting the pressure and pressure, and means for converting the detection value from the pressure sensor into an electric signal and feeding back to the regulator to maintain the pressure and pressure at a set value. An IC test apparatus characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5204370A JP2973785B2 (en) | 1993-08-19 | 1993-08-19 | IC test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5204370A JP2973785B2 (en) | 1993-08-19 | 1993-08-19 | IC test equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0755879A true JPH0755879A (en) | 1995-03-03 |
| JP2973785B2 JP2973785B2 (en) | 1999-11-08 |
Family
ID=16489396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5204370A Expired - Fee Related JP2973785B2 (en) | 1993-08-19 | 1993-08-19 | IC test equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2973785B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000040983A1 (en) * | 1998-12-31 | 2000-07-13 | Daito Corporation | Method for controlling ic handler and control system using the same |
| KR20020070121A (en) * | 2001-02-27 | 2002-09-05 | 안도덴키 가부시키가이샤 | Autohandler |
| US6690284B2 (en) | 1998-12-31 | 2004-02-10 | Daito Corporation | Method of controlling IC handler and control system using the same |
| WO2004059332A1 (en) * | 2002-12-25 | 2004-07-15 | Ricoh Company, Ltd. | An ic transfer device |
| JP2008224586A (en) * | 2007-03-15 | 2008-09-25 | Yokogawa Electric Corp | Inspection device |
| CN105157865A (en) * | 2015-08-17 | 2015-12-16 | 济南晶恒电子有限责任公司 | Heat welding test bed and test method of diode |
-
1993
- 1993-08-19 JP JP5204370A patent/JP2973785B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000040983A1 (en) * | 1998-12-31 | 2000-07-13 | Daito Corporation | Method for controlling ic handler and control system using the same |
| US6384734B1 (en) | 1998-12-31 | 2002-05-07 | Daito Corporation | Method of controlling IC handler and control system using the same |
| US6690284B2 (en) | 1998-12-31 | 2004-02-10 | Daito Corporation | Method of controlling IC handler and control system using the same |
| KR20020070121A (en) * | 2001-02-27 | 2002-09-05 | 안도덴키 가부시키가이샤 | Autohandler |
| WO2004059332A1 (en) * | 2002-12-25 | 2004-07-15 | Ricoh Company, Ltd. | An ic transfer device |
| US7154258B2 (en) | 2002-12-25 | 2006-12-26 | Ricoh Company, Ltd. | IC transfer device |
| CN100399038C (en) * | 2002-12-25 | 2008-07-02 | 株式会社理光 | Integrated circuit transfer device |
| JP2008224586A (en) * | 2007-03-15 | 2008-09-25 | Yokogawa Electric Corp | Inspection device |
| CN105157865A (en) * | 2015-08-17 | 2015-12-16 | 济南晶恒电子有限责任公司 | Heat welding test bed and test method of diode |
| CN105157865B (en) * | 2015-08-17 | 2017-07-11 | 济南晶恒电子有限责任公司 | The thermal weld testing stand and test method of diode |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2973785B2 (en) | 1999-11-08 |
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