CN110244141B - Sorter for testing electronic components - Google Patents
Sorter for testing electronic components Download PDFInfo
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- CN110244141B CN110244141B CN201811390788.6A CN201811390788A CN110244141B CN 110244141 B CN110244141 B CN 110244141B CN 201811390788 A CN201811390788 A CN 201811390788A CN 110244141 B CN110244141 B CN 110244141B
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- Prior art keywords
- temperature
- electronic component
- contact
- pusher
- electronic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2301/00—Sorting according to destination
- B07C2301/0008—Electronic Devices, e.g. keyboard, displays
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a sorter for testing electronic components, comprising: a pressurizer for pressurizing the electronic component; and a contact plate interposed between the electronic component and a pusher constituting the presser, wherein a temperature measuring instrument is provided on a contact cap of the contact plate, and the temperature of the electronic component is adjusted by controlling a temperature adjusting section based on temperature information obtained by the temperature measuring instrument. According to the present invention, the stability of the temperature measuring device is ensured and the temperature of the electronic component can be accurately measured, and the poor contact between the pusher and the contact cap and the like can be grasped, thereby preventing the poor test and further providing the reliability of the test and the equipment.
Description
Technical Field
The present invention relates to a handler for testing electronic components to be produced, and more particularly to a pressing section for pressing electronic components and temperature adjustment of electronic components.
Background
A handler is a device that supports manufactured electronic components to be tested by a tester and sorts the electronic components by grades according to the test results.
The sorting machine is disclosed in various patent documents such as korean laid-open patent No. 10-2002-.
Fig. 1 is a schematic view of a conventional sorter TH.
The conventional separator TH includes a supply portion SP, a pressurizing portion PP, and a recovery portion WP.
The supply section SP supplies the electronic components mounted on the customer tray (customer tray) to the pressurizing section PP.
The pressurizing part PP pressurizes the electronic component supplied from the supply part SP toward a Socket board SB side connected to the main body of the Tester, so that the electronic component is electrically connected to the Tester. Here, the Socket board SB is provided with a plurality of Test sockets (Test sockets) TS electrically connected to the electronic components.
The collecting section WP collects the tested electronic components from the pressing section PP, classifies the electronic components according to the test results, and loads the electronic components on an empty customer tray.
The supply portion SP, the pressure portion PP, and the recovery portion WP as described above may have various forms and configurations according to the purpose of use of the separator TH.
The present invention relates to the pressure part PP and the temperature adjusting function in the above-described configuration.
As shown in the schematic view of fig. 2, the pressing section PP includes a presser 210' (referred to as an "Index head" in the related art 1 and a "press device" in the related art 1), a vertical shifter 220' and a horizontal shifter 230 '.
The presser 210 'has a pusher (pusher)212' for pressing each electronic component toward the corresponding test socket TS (referred to as "inspection socket" in the related art 2).
As shown in fig. 3, the pusher 212' presses the electronic component D through the lower surface of the pressing part PR. And, the pusher 212' adsorbs and holds the electronic component D by vacuum pressure through the lower surface of the pressing part PR. For this purpose, a vacuum path VW to which a vacuum pressure can be applied is formed in the pusher 212'. Such a pusher 212' is equipped with a temperature sensor 212' c for sensing the temperature of the pusher 212' itself. The temperature of the electronic component pressed by the pusher 212 'can be indirectly sensed by the temperature sensor 212' c.
The pressurizer 210' is lowered in a state of holding the electronic part, thereby electrically connecting the electronic part to the test socket TS located at the socket board SB. For this reason, the presser 210' is configured to be capable of moving horizontally back and forth and vertically up and down.
The vertical mover 220' advances or retracts the presser 210' toward the socket board SB side by raising or lowering the presser 210 '. The operation of the vertical mover 220 'as described above is performed when the electronic component is gripped or released from the electronic component moving shuttle (referred to as a "slide table" in the related art 2) by the presser 210' and when the electronic component D is electrically connected to the test socket TS or released from the connection.
The horizontal mover 230 'horizontally moves the pressurizer 210' in the front-rear direction. Here, the horizontal movement of the presser 210' is performed while moving the upper fulcrum of the shuttle and the upper fulcrum of the socket SB.
In addition, electronic components can self-heat during testing. In particular, self-heating of electronic components such as CPUs that require computation is very large. Also, self-heating increases the temperature of the electronic component, which prevents the electronic component from being tested while maintaining a suitable temperature that meets test conditions.
In korean patent No. 10-0706216 (hereinafter, referred to as "prior art 3"), a heat sink (Heatsink) is provided in order to adjust the temperature of electronic components. However, according to prior art 3, the structure of the pusher is complicated, so that productivity is not good and durability is reduced.
In korean laid-open patent No. 10-2008-0086320 (hereinafter referred to as "prior art 4"), an air through hole is formed in a pusher in order to adjust the temperature of an electronic component, and air for temperature adjustment is supplied to the air through hole in a duct. However, the related art 4 is difficult to be applied to the case of using the pusher 212' as a structure for grasping the electronic component by vacuum pressure. This is because the pusher must be provided with a vacuum suction function and an injection temperature adjusting air function which are opposite to each other.
Also, the above-described method is slow in response to the temperature of the electronic part being adjusted by the operation of the temperature adjusting function, and accordingly results in a decrease in reliability of the test.
Accordingly, the inventors of the present invention proposed a technique of adjusting the temperature of the pusher by a cooling pack or a heater so as to instantaneously respond to the temperature change of the electronic parts, through Korean laid-open patent No. 10-2016-0064964 (hereinafter referred to as "comparative technique 1").
Further, korean laid-open patent No. 10-2017-0116875 (hereinafter referred to as "comparative technique 2"), which is a further improvement of the comparative technique 1, additionally proposes a technique in which a fluid passage through which a cooling fluid passes is formed in a pusher. According to this comparative technique 2, a contact plate is provided between the pusher and the electronic component. And the contact plate is provided with a contact cap corresponding to the pushing piece in a one-to-one mode. According to this configuration, in comparative technique 2, the pusher is in contact with the contact cap, and the contact cap is in contact with the electronic component. That is, in comparative technique 2, the pusher is indirectly contacted with the electronic component.
In both of comparative technique 1 and comparative technique 2, the pusher is provided with a temperature sensor for measuring the temperature of the electronic component, and the temperature sensor is provided on the side of the surface of the pusher in contact with the electronic component. Therefore, according to comparative technique 1, the temperature sensor can be directly contacted with the electronic component, but according to comparative technique 2, the temperature sensor cannot be directly contacted with the electronic component.
That is, in the case of the comparative technique 2, there is a structure in which the temperature sensor is interposed between the contact caps to measure the temperature of the electronic component, so that there are problems as follows.
First, since the temperature sensor is spaced apart from the electronic component by the thickness of the contact cap, a delay and a deviation occur between the temperature of the semiconductor element and the temperature measured by the temperature sensor. And, the thicker the thickness of the contact cap, the greater such retardation and deviation.
Second, if the face of the contact cap that interfaces with the pusher is not uniform or sloped due to manufacturing or mechanical setup failures, the accuracy of the temperature measured by the temperature sensor is very low.
In addition, when the pressing operation is performed, in the comparative technique 1, the temperature sensor is directly contacted to the electronic component, and in the comparative technique 2, the temperature sensor is directly contacted to the contact cap, so that both of them have a risk of breakage of the temperature sensor, which may cause a decrease in reliability of the test and reliability of the apparatus due to a failure in temperature adjustment.
Disclosure of Invention
The objects of the present invention are as follows:
first, a technique is provided that is capable of ensuring the stability of a temperature measurer that measures the temperature of an electronic component and achieving relatively more accurate temperature measurement.
Second, a technique is provided that can grasp a defective contact or the like between the pusher and the contact cap.
Third, a technique is provided that can shorten the test time by maintaining a proper pusher temperature between the test of the previous electronic component and the test of the next electronic component.
The handler for testing electronic parts according to the present invention as described above comprises: a supply section that supplies an electronic component; a pressurizing part for pressurizing the electronic component so that the electronic component supplied by the supplying part is electrically connected to a test slot of a tester; a temperature adjusting part for adjusting the temperature of the electronic component electrically connected to the test socket through the pressurizing part; a recovery part for recovering the electronic component tested by the tester; and a control part which controls the supply part, the pressurization part, the temperature adjustment part and the recovery part, wherein the pressurization part comprises: a pressurizer for pressurizing the electronic component toward the test socket side; and a contact plate interposed between the presser and the electronic component and having a plurality of contact caps that are in direct contact with the electronic component to press the electronic component, the presser including: a plurality of pushing members, corresponding to the contact caps one by one, for pushing the contact caps when performing a pressing operation, thereby enabling the contact caps to contact the electronic components and press the electronic components; a setting plate provided with the plurality of pushing members; and a mover for moving the set plate forward or backward toward the test socket so that the pusher presses or releases the pressing of the contact caps, wherein the contact plate further includes a plurality of temperature measuring devices provided for each of the contact caps to measure a temperature of the electronic component, and the control unit controls the temperature adjusting unit to adjust the temperature of the electronic component to be tested based on temperature information of the electronic component measured by the temperature measuring devices.
The temperature measuring device can be spaced apart from the pusher and the electronic component when the electronic component is pressurized by the pressurizer.
The temperature measurer is equipped to be embedded in the contact cap.
The pressurizer further includes a temperature sensor for sensing a temperature of the pusher, and the control unit compares temperature information sensed by the temperature measurer with temperature information sensed by the temperature sensor to alarm that a failure has occurred when a difference between the two temperatures exceeds a preset reference value.
The temperature adjustment portion includes: a cooling fluid supplier supplying a cooling fluid to the pressurizer; and a heater provided to the pusher to heat the pusher.
The pressurizer further comprises a temperature sensor for sensing the temperature of the pusher, the control part stores the temperature of the pusher when a previous electronic component is tested, and when the pressurizing operation is released for testing the next electronic component after the previous electronic component is tested, the temperature adjusting part is controlled to maintain the temperature of the pusher at the temperature when the previous electronic component is tested.
According to the present invention, the following effects are provided:
first, the temperature measuring device is disposed on the contact cap, and the temperature sensing element is spaced apart from the pusher and the electronic component, so that the risk of damage due to contact impact is reduced, and relatively more accurate temperature measurement of the electronic component can be realized, thereby improving the reliability of the test.
Second, a poor contact between the pusher and the contact cap or whether the temperature measurer or the temperature sensor is malfunctioning can be grasped by a deviation between the temperature sensed by the temperature measurer and the temperature measured by the temperature sensor, so that a poor test can be prevented, thereby improving the reliability of the apparatus.
Third, in the case where the pressurizing operation is released and the temperature measuring instrument is spaced apart from the electronic component, the temperature information of the electronic component before the test is flexibly applied to maintain the proper pusher temperature, thereby shortening the test time and improving the processing capacity.
Drawings
Fig. 1 to 3 are diagrams for explaining a conventional handler for electronic component testing.
Fig. 4 is a plan view of a handler for electronic parts testing according to an embodiment of the present invention.
Fig. 5 is a schematic perspective view of a pressurizing portion applied to the sorter of fig. 4.
Fig. 6 is a schematic cross-sectional view of a pusher applicable to the pressurization part of fig. 5.
FIG. 7 is a side view of a presser according to an example of application of the pusher of FIG. 6.
Fig. 8 is an exploded view of the main part of the pressurizer related to fig. 7.
Fig. 9 and 10 are views for explaining main features of the pressurizer of fig. 8.
Fig. 11 is a reference diagram for explaining a state where the contact cap is replaced according to a dimensional change of the electronic component to be tested, in comparison with fig. 10.
Fig. 12 is a schematic view of a pressurizer of another embodiment to which the present invention can be applied.
Description of the symbols
TH: sorter for electronic component test SP: supply part
200: the pressurization part 210: pressurizer
212: urging member 212 a: pushing component
212 c: first temperature sensor 212 d: second temperature sensor
FT: fluid passage 216: contact plate
216 a: contact cap 216 b: temperature measuring device
220: the vertical mover 300: temperature adjusting part
WP: the recovery unit 500: control unit
Detailed Description
Hereinafter, preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings, and repetitive descriptions will be omitted or compressed as much as possible for the sake of simplicity of description.
As shown in fig. 4, the handler TH for electronic component test (hereinafter, simply referred to as "handler") according to the present invention includes a pair of loading trays 111 and 112, a first mover 120, a pair of moving shuttles MS1 and MS2, a pressing section 200, a temperature adjusting section 300, a second mover 420, and a control section 500.
Electronic components can be mounted on the mounting trays 111 and 112. Such loading trays 111, 112 may have heaters to heat the loaded electronic components to the temperature required for testing. Of course, the operation of the heater is stopped when the room temperature test is performed.
The movable shuttles MS1 and MS2 may be provided with electronic components and are equipped to be movable in the left-right direction (refer to arrows a and b) passing through the test position TP.
The pressurizing part 200 electrically connects the electronic components mounted on the movable shuttle MS1/MS2 located at the test position TP to the test socket TS of the socket board SB located therebelow. For this, referring to the solid line part in the schematic view of fig. 5, the pressing section 200 includes a presser 210, a vertical mover 220, and a horizontal mover 230.
The pressurizer 210 pressurizes the electronic component so that the electronic component can be directly connected to the tester. An example of such a pressurizer 210 will be described separately later.
The vertical mover 220 raises and lowers the presser 210 (refer to arrow d). Accordingly, the presser 210 can advance or retreat to the test slot TS side and can advance or retreat to the moving shuttle MS1, MS2 side.
The horizontal shifter 230 moves the presser 210 in the front-rear direction (refer to arrow e). Therefore, the pressurizer 210 can electrically connect the electronic component to the test socket TS after alternately grasping it between the moving shuttle of reference numeral MS1 and the moving shuttle of reference numeral MS 2.
For reference, a region defined as a test site TP may be provided with a test chamber. Also, in the case of being equipped with a test chamber, the pressurizing portion 200 or at least the pressurizer 210 is located inside the test chamber. Of course, the interior of the test chamber is adjusted to the temperature required for testing the electronic components.
Referring to the dotted line of fig. 5, the temperature adjusting part 300 includes a cooling fluid supplier 310, a flow control valve 320, and a heater 330 (see fig. 6) provided to the pusher 212 (see fig. 6) of the pressurizer 210.
The cooling fluid supplier 310 supplies a cooling fluid for adjusting the temperature of the electronic component to the pressurizer 210. Such a cooling fluid supplier 310 may include: a pump 311 for pumping a predetermined amount of cooling fluid; a cooling module 312 for cooling the cooling fluid to a predetermined temperature.
The flow control valve 320 controls the supply amount of the cooling fluid supplied through the cooling fluid supplier 310.
Two heaters 330 (see fig. 6) are provided on each of the pushers 212 to heat the pushers 212. Of course, heater 330 is provided for ultimately heating the electronic component via pusher 212.
The pump 311, the cooling module 312, the flow control valve 320, and the heater 330 of the temperature adjusting unit 300 are controlled by the control unit 500. Therefore, the temperature, the supply flow rate, and the supply flow rate of the supplied cooling fluid can be adjusted according to the test temperature condition of the electronic component. Accordingly, if the temperature, the supply flow rate, and the supply flow rate of the cooling fluid are determined according to the test temperature condition, the cooling fluid supplier 310 continuously supplies the cooling fluid adjusted to the determined temperature, supply flow rate, and supply flow rate.
The second mover 420 sorts the tested electronic parts of the moving shuttles MS1, MS2 located at the current right side according to the test result and moves them to the customer tray CT2. For this reason, the second mover 420 may move in the left-right direction (refer to an arrow f of fig. 4) or in the front-back direction (refer to an arrow g of fig. 4).
The control part 500 controls the respective configurations as described above, and specific control according to the control part 500 as described above will be described later.
For reference, the above-described constitution is used for the customer tray CT1The supply of the electronic components to the loading trays 111, 112 and the first mover 120 side of the pressing portion 200 may be defined as a supply portion SP for supplying the electronic components, and the electronic components whose test is completed by the tester are moved to the customer tray CT2The second mover 420 side of (a) may be defined as a recovery portion WP. Here, the pair of moving shuttles MS1 and MS2 may be the supply portion SP or the collection portion WP depending on the position.
< example of pressurizer >
The pressing section 200 has a plurality of pushers 212 for pressing the electronic component.
First, the pusher 212 will be described with reference to fig. 6.
The pushing member 212 of fig. 6 includes a pushing part 212a, a first temperature sensor 212c, and a second temperature sensor 212 d.
The pushing member 212a has a cross-section in the shape of a "T" and is divided into an upper coupling portion 212a-1 and a lower contact portion 212 a-2.
The coupling portion 212a-1 is coupled to a setting plate described later.
The contact portion 212a-2 is a portion having a smaller width than the coupling portion 212a-1, and a contact end CE as a lower end surface thereof is inserted into and contacts a contact cap described later. An installation groove for installing the heater 330 is formed at such a contact portion 212 a-2.
The pushing member 212a is provided with a fluid passage FT through which the cooling fluid supplied and recovered by the cooling fluid supplier 310 passes.
The first temperature sensor 212c and the second temperature sensor 212d are disposed to measure temperatures of the upper side and the lower side of the push member 212a, respectively. Here, the second temperature sensor 212d is preferably provided on the contact end CE side of the contact portion 212a-2 so as to be close to the electronic component.
Fig. 7 is an example of the presser 210 to which the above-described urging member 212 is applied, and fig. 8 is an exploded view of a main part of the presser 210.
As shown in fig. 7 and 8, the pressurizer 210 includes a setting plate 211, a pushing member 212, a setting structure 213, a support spring 214, a fluid distributor 215, and a contact plate 216.
Referring to fig. 9, pusher 212 is provided on installation plate 211 via installation structure 213. Installation plate 211 has installation hole IO formed therein, through which contact portion 212a-2 of pusher 212 can pass and be installed to project forward.
The pusher 212 has already been described above, and therefore, the description thereof is omitted.
The installation structure 213 is provided to install the pusher 212 on the installation plate 211. The installation structure 213 includes a coupling plate 213a and a support base 213 b.
The coupling plate 213a is coupled to the setting plate 211, and is formed with a passing hole TH through which the contact portion 212a-2 of the pusher 212 can pass. In such a coupling plate 213a, an alignment hole AH into which a guide pin 212f-1 provided in the guide member 212f of the pusher 212 shown in fig. 6 is inserted is formed. Thus, the upper end of pusher 212 is shown aligned through the array of holes AH.
The support bases 213b are provided to the coupling plate 213a at predetermined intervals, and support the upper ends of the support springs 214 so that the support springs 214 can elastically support the pushing members 212.
The supporting spring 214 elastically supports the upper end of the pusher 212 so that the pusher 212 can be implemented to be capable of moving forward and backward by a predetermined distance.
The fluid distributor 215 is arranged for supplying the cooling fluid to the fluid passage FT of the pusher 212 provided by the setting structure 213.
The contact plate 216 is interposed between the pusher 212 and the electronic component D, and has a plurality of contact caps 216a and a temperature measuring unit 216 b.
The contact cap 216a is opened upward and made of a metal material such as copper having excellent thermal conductivity so that the cold air or heat of the pushing member 212a can be quickly transmitted to the electronic component.
The temperature measuring device 216b is provided to sense the temperature of the electronic component. That is, in the present embodiment, the second temperature sensor 212d and the temperature measuring device 216b are provided to sense the temperature of the electronic component. In the present embodiment, a temperature measurer 216b for sensing the temperature of the electronic component independently from the second temperature sensor 212d is provided to the contact cap 216a in order to sense the temperature of the electronic component more accurately and to determine whether a bad operation occurs.
The application of the contact board 216 described above is provided for the convenience of component exchange and the effective use of resources. Typically, only the pusher 212 can be replaced in its entirety if the electronic components to be tested are of different sizes. In this case, the work of replacing the pusher 212 is very complicated and consumes a lot of time due to the connection relationship between the pusher 212 and the cooling fluid, and resources are wasted in consideration of the scale of the refrigerant or other components to be replaced. However, if the contact plate 216 is applied as in the present embodiment, the contact cap 216a may be replaced after only the contact plate 216 is detached, or a previously prepared contact plate 216 may be installed, so that the replacement work thereof is very easy, and waste of resources can also be prevented.
Of course, the number of contact caps 216a provided to the contact plate 216 is the same as the number of pushers 212. That is, in the case of a handler for testing eight electronic components at a time, eight pusher members 212 and contact caps 216a need to be provided, and the pusher members 212 correspond to the contact caps 216a one-to-one.
In addition, if the temperature of the electronic component is sensed only by the second temperature sensor 212d as in the aforementioned comparative technique 2, even if the thermal conductivity of the contact cap 216a is good, a delay (delay) due to the time required to sense the temperature may occur, thermal conduction unevenness may be caused depending on the degree of contact between the pusher 212 and the contact cap 216a, and finally, a temperature control failure may occur. However, if the temperature of the electronic component is measured by the temperature measurer 216b provided to the contact cap 216a as in the present embodiment, the time delay with respect to measuring the temperature of the electronic component is minimized, and the degree of contact between the pusher 212 and the contact cap 216a does not need to be considered.
Whether or not a malfunction occurs is determined by the temperature difference between the first temperature sensor 212c or the second temperature sensor 212d and the temperature measurer 216b, which will be described later.
Fig. 10 illustrates the relationship between the pusher 212 and the contact cap 216a in a state where the electronic component is electrically connected to the tester by the presser 210.
As shown in fig. 10, the urging member 212 urges the contact cap 216a in a state where the lower end portion of the contact portion 212a-2 is covered with the contact cap 216a, so that the contact cap 216a can press the electronic component D. At this time, the contact end CE of the contact portion 212a-2 is surface-contacted to the contact end 216a-1 of the contact cap 216a, thereby achieving rapid conduction of hot or cold air and proper transfer of pressure. Here, the contact end 216a-1 of the contact cap 216a is the lower end of the contact cap 216a which is in surface contact with the electronic component. In addition, as shown, a temperature measurer 216b is provided to be embedded in the contact end 216a-1 of the contact cap 216 a. Accordingly, the temperature measuring device 216b is spaced apart from the pusher 212 and also from the electronic component D. However, the temperature measuring device 216b is disposed closer to the electronic component than the second temperature sensor 212d, and therefore the temperature of the electronic component can be sensed correspondingly faster and more accurately, and since the temperature measuring device 216b does not receive direct impact when the electronic component is subjected to the pressing operation, the risk of breakage is reduced. Preferably, in order to accurately and rapidly sense the temperature, it is considered to realize that the interval between the temperature measurer 216b and the electronic component D is within 2mm when the pusher 212 pressurizes the electronic component D.
Also, the contact cap 216a or at least the contact terminal 216a-1 is formed using a metal material such as copper having high thermal conductivity, so that accuracy in almost directly sensing the temperature of the electronic component can be ensured.
For reference, fig. 11 shows a state in which the contact cap 216a corresponding thereto is replaced when the size of the electronic component to be tested becomes small. In this way, in the case where the contact plate 216 is applied as in the present embodiment, the compatibility of the handler TH for testing electronic parts of various specifications is improved.
The description of the sorting machine TH according to the present invention will be continued since the temperature measuring device 216b, the first temperature sensor 212c, and the second temperature sensor 212d can be variously controlled and flexibly applied by the control unit 500.
1. Bad alarm
When testing the electronic component, the control part 500 appropriately controls the temperature adjustment part 300 by the temperature information sensed from the temperature measurer 216b, so that the electronic component can be tested under the required test temperature condition.
Further, the control unit 500 compares the temperature information sensed from the temperature measuring device 216b with the temperature information sensed by the first temperature sensor 212c or the second temperature sensor 212 d. When the temperature difference obtained by the comparison exceeds a preset reference value (for example, 30 degrees), the control unit 500 can know that the pusher 212 is not in normal contact with the contact cap 216a or that the first temperature sensor 212c, the second temperature sensor 212d, or the temperature measuring device 216b is malfunctioning, and in this case, can give an alarm to the manager that a failure has occurred. That is, according to the present invention, since the temperature of the electronic component D is sensed by the temperature measuring device 216b, the first temperature sensor 212c or the second temperature sensor 212D is not necessarily configured and may be omitted entirely. However, as described above, by comparing the temperature information sensed from the temperature measurer 216b with the temperature information sensed by the first temperature sensor 212c or the second temperature sensor 212d, various bad conditions can be grasped, and therefore, it is highly preferable that the first temperature sensor 212c or the second temperature sensor 212d should be considered to be provided. Similarly, only one of the first temperature sensor 212c and the second temperature sensor 212d may be optionally provided. Also, the second temperature sensor 212d is provided on the side surface side of the pushing member 212a, and thus may be provided so as to prevent direct contact with the contact cap 216 a.
2. Selectively ON (ON) and OFF (OFF)
When the electronic component D is tested, accurate temperature measurement of the electronic component D is required, and therefore the temperature measurer 216b should be in an ON (ON) state. At this time, depending on the implementation, the temperature information about the pusher member 212 from the first temperature sensor 212c or the second temperature sensor 212d may not be required, and therefore, the first temperature sensor 212c and the second temperature sensor 212d are in an OFF (OFF) state.
In addition, the temperature information measured by the temperature measuring device 216b is not required in the blank time between the test of the electronic component D that has been previously tested and the test of the electronic component D to be tested next, and therefore the temperature measuring device 216b needs to be in the off state. However, for the next test, the pusher member 212 cannot be too cold or too hot, and therefore, the temperature of the pusher member 212 should be adjusted based ON the temperature information measured by the first temperature sensor 212c or the second temperature sensor 212d after the first temperature sensor 212c and the second temperature sensor 212d are in the ON (ON) state.
3. Maintaining proper temperature of the pusher
As described above, the temperature information measured by the temperature measurer 216b is not required in the blank time between the test of the electronic component D after the previous test and the test of the electronic component D to be tested next. However, in order to maintain the proper temperature of the electronic component D, it is necessary to maintain the proper temperature of the pusher 212. Therefore, when the test is performed on the previous electronic component D, the first temperature sensor 212c and the second temperature sensor 212D sense and store the test temperature of the pusher 212, and when the pressing operation of the presser 210 is released for the test on the next electronic component D after the test on the previous electronic component D is completed, it is necessary to maintain the temperature of the pusher 212 at the temperature at the time of the test on the previous electronic component D. In this case, the control unit 500 needs to keep the proper temperature of the pusher 212 by causing the first temperature sensor 212c and the second temperature sensor 212D to be in the ON (ON) state even when the test is performed ON the previous electronic component D, sensing and storing the temperature of the pusher 212, and controlling the temperature adjustment unit 300 based ON the stored temperature information and the temperature information from the first temperature sensor 212c and the second temperature sensor 212D.
The combination of the setting plate 211 and the pusher 212 of the presser 210 described above with reference to fig. 7 and the like is, for example, a form suitable for application to a handler manufactured for processing a small-variety mass-produced electronic component such as a memory semiconductor. However, the present invention can also be realized as an assembly of the form shown in fig. 12 suitably applied to a handler manufactured for handling a small-variety mass-produced electronic component such as a memory semiconductor.
For reference, the combination of FIG. 12 also has a setting plate 1211 and pusher 1212 that are substantially similar to the embodiments described above. In the case of applying such a combined body, a contact plate having a contact cap is also provided, and of course, a temperature measuring instrument is also provided in the contact cap. As described above, the present invention can be preferably applied to all kinds of sorters for adjusting the temperature of electronic parts using a pusher.
Therefore, the present invention has been described in detail with reference to the embodiments shown in the drawings, but the above-described embodiments are merely preferred embodiments of the present invention and thus it should not be construed that the present invention is limited to the above-described embodiments, and the scope of the claims of the present invention should be construed as being defined in the claims and the equivalents thereof.
Claims (5)
1. A handler for testing electronic parts, comprising:
a supply section that supplies an electronic component;
a pressurizing part for pressurizing the electronic component so that the electronic component supplied by the supplying part is electrically connected to a test slot of a tester;
a temperature adjusting part for adjusting the temperature of the electronic component electrically connected to the test socket through the pressurizing part;
a recovery part for recovering the electronic component tested by the tester; and
a control part for controlling the supply part, the pressurization part, the temperature regulation part and the recovery part,
wherein the pressurization part comprises:
a pressurizer for pressurizing the electronic component toward the test socket side; and
a contact plate interposed between the presser and the electronic component and having a plurality of contact caps that are in direct contact with the electronic component to press the electronic component,
wherein the pressurizer comprises:
a plurality of pushing members, corresponding to the contact caps one by one, for pushing the contact caps when performing a pressing operation, thereby enabling the contact caps to contact the electronic components and press the electronic components;
a setting plate provided with the plurality of pushing members; and
a mover that moves the setting plate forward or backward toward the test socket side to cause the pusher to press or release the contact cap,
wherein the contact plate further includes a plurality of temperature measurers provided to each of the contact caps to measure a temperature of the electronic part,
the control part controls the temperature adjusting part to adjust the temperature of the electronic component to be tested according to the temperature information of the electronic component measured by the temperature measuring device,
the temperature measuring device can be spaced apart from the pusher and the electronic component when the electronic component is pressurized by the pressurizer.
2. The handler for testing electronic parts according to claim 1,
the temperature measurer is equipped to be embedded in the contact cap.
3. The handler for testing electronic parts according to claim 1,
the pressurizer further includes a temperature sensor for sensing a temperature of the pusher,
the control unit stores the temperature of the pusher when a previous electronic component is tested, and controls the temperature adjustment unit to maintain the temperature of the pusher at the temperature at which the previous electronic component is tested when the pressing operation is released for testing the next electronic component after the previous electronic component is tested.
4. A handler for testing electronic parts, comprising:
a supply section that supplies an electronic component;
a pressurizing part for pressurizing the electronic component so that the electronic component supplied by the supplying part is electrically connected to a test slot of a tester;
a temperature adjusting part for adjusting the temperature of the electronic component electrically connected to the test socket through the pressurizing part;
a recovery part for recovering the electronic component tested by the tester; and
a control part for controlling the supply part, the pressurization part, the temperature regulation part and the recovery part,
wherein the pressurization part comprises:
a pressurizer for pressurizing the electronic component toward the test socket side; and
a contact plate interposed between the presser and the electronic component and having a plurality of contact caps that are in direct contact with the electronic component to press the electronic component,
wherein the pressurizer comprises:
a plurality of pushing members, corresponding to the contact caps one by one, for pushing the contact caps when performing a pressing operation, thereby enabling the contact caps to contact the electronic components and press the electronic components;
a setting plate provided with the plurality of pushing members; and
a mover that moves the setting plate forward or backward toward the test socket side to cause the pusher to press or release the contact cap,
wherein the contact plate further includes a plurality of temperature measurers provided to each of the contact caps to measure a temperature of the electronic part,
the control part controls the temperature adjusting part to adjust the temperature of the electronic component to be tested according to the temperature information of the electronic component measured by the temperature measuring device,
the pressurizer further includes a temperature sensor for sensing a temperature of the pusher,
the control unit compares the temperature information sensed by the temperature measuring unit with the temperature information sensed by the temperature sensor, and warns that a failure has occurred when the difference between the two temperatures exceeds a preset reference value.
5. The handler for testing electronic parts according to claim 1 or 4, wherein the temperature adjusting part comprises:
a cooling fluid supplier supplying a cooling fluid to the pressurizer; and
and a heater disposed on the pushing member to heat the pushing member.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0027745 | 2018-03-09 | ||
| KR20180027745 | 2018-03-09 | ||
| KR1020180058269A KR102514009B1 (en) | 2018-03-09 | 2018-05-23 | Handler for electronic component test |
| KR10-2018-0058269 | 2018-05-23 |
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| Publication Number | Publication Date |
|---|---|
| CN110244141A CN110244141A (en) | 2019-09-17 |
| CN110244141B true CN110244141B (en) | 2021-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811390788.6A Active CN110244141B (en) | 2018-03-09 | 2018-11-21 | Sorter for testing electronic components |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111495770A (en) * | 2020-04-22 | 2020-08-07 | 长沙南道电子科技有限公司 | Chip detection device |
| CN112718550B (en) * | 2020-12-11 | 2023-06-16 | 杭州长川科技股份有限公司 | Test sorting device applied to testing electronic elements |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000206186A (en) * | 1999-01-11 | 2000-07-28 | Advantest Corp | Tray transferring device |
| CN1471150A (en) * | 2002-07-24 | 2004-01-28 | δ����ҵ��ʽ���� | Apparatus for compensatnig deviation of test temperature is semiconductor device processing machine |
| CN1534754A (en) * | 2003-03-21 | 2004-10-06 | Զ���� | Temperature monitoring system of testing classifying machine |
| CN102259098A (en) * | 2010-05-26 | 2011-11-30 | 鸿劲科技股份有限公司 | Electronic component testing and classifying machine with cold testing/hot testing functions |
| CN103894347A (en) * | 2011-08-25 | 2014-07-02 | 精工爱普生株式会社 | Handler and component inspection apparatus |
| JP2014190708A (en) * | 2013-03-26 | 2014-10-06 | Seiko Epson Corp | Electronic component-pressing device, temperature control method of electronic component, handler, and inspection device |
| CN106249446A (en) * | 2016-07-20 | 2016-12-21 | 武汉华星光电技术有限公司 | Test platform and there is the gauging machine of described test platform |
| CN107110910A (en) * | 2014-11-28 | 2017-08-29 | 泰克元有限公司 | Separator for testing electronic parts |
| CN107209206A (en) * | 2015-01-12 | 2017-09-26 | 泰克元有限公司 | Testing, sorting machine pressue device |
| CN107282474A (en) * | 2016-04-12 | 2017-10-24 | 泰克元有限公司 | Separator for testing electronic parts |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5328638B2 (en) * | 2007-02-23 | 2013-10-30 | 株式会社アドバンテスト | Electronic component pressing device and electronic component testing device |
-
2018
- 2018-11-21 CN CN201811390788.6A patent/CN110244141B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000206186A (en) * | 1999-01-11 | 2000-07-28 | Advantest Corp | Tray transferring device |
| CN1471150A (en) * | 2002-07-24 | 2004-01-28 | δ����ҵ��ʽ���� | Apparatus for compensatnig deviation of test temperature is semiconductor device processing machine |
| CN1534754A (en) * | 2003-03-21 | 2004-10-06 | Զ���� | Temperature monitoring system of testing classifying machine |
| CN102259098A (en) * | 2010-05-26 | 2011-11-30 | 鸿劲科技股份有限公司 | Electronic component testing and classifying machine with cold testing/hot testing functions |
| CN103894347A (en) * | 2011-08-25 | 2014-07-02 | 精工爱普生株式会社 | Handler and component inspection apparatus |
| JP2014190708A (en) * | 2013-03-26 | 2014-10-06 | Seiko Epson Corp | Electronic component-pressing device, temperature control method of electronic component, handler, and inspection device |
| CN107110910A (en) * | 2014-11-28 | 2017-08-29 | 泰克元有限公司 | Separator for testing electronic parts |
| CN107209206A (en) * | 2015-01-12 | 2017-09-26 | 泰克元有限公司 | Testing, sorting machine pressue device |
| CN107282474A (en) * | 2016-04-12 | 2017-10-24 | 泰克元有限公司 | Separator for testing electronic parts |
| CN106249446A (en) * | 2016-07-20 | 2016-12-21 | 武汉华星光电技术有限公司 | Test platform and there is the gauging machine of described test platform |
Non-Patent Citations (1)
| Title |
|---|
| 一种集成电路芯片测试分选机的设计;苏建国 等;《江苏工程职业技术学院学报（综合版）》;20150630;第15卷(第1期);第1-3页 * |
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| CN110244141A (en) | 2019-09-17 |
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