JP2014190708A - Electronic component-pressing device, temperature control method of electronic component, handler, and inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component-pressing device enabling a robot height to be suppressed, and to provide a temperature control method of an electronic component, a handler, and an inspection device.SOLUTION: A first hand unit 91 includes: a pressing part 911 for pressing an IC device 100 to an inspection socket 6; a heating part 912 for heating the pressing part 911; and a cooling part 913 for cooling the pressing part 911. The cooling part 913 includes: a heat dissipating part 913a; a heat connection part 913b for thermally connecting the heat dissipating part 913a to the pressing part 911; and a gas blowout part 913c for blowing out a cooling gas toward the heat dissipating part 913a. Further, when viewed from a plane whose normal is in a direction of pressing an IC device 100 by the pressing part 911, the heat dissipating part 913a is provided in a separated manner toward the in-plane direction from the pressing part 911.

Description

  The present invention relates to an electronic component pressing device, an electronic component temperature control method, a handler, and an inspection device.

Conventionally, an inspection apparatus for inspecting electrical characteristics of an electronic component such as an IC device is known.
Such an inspection apparatus supplies electronic components from the supply tray to the inspection unit, inspects the electrical characteristics of the electronic components supplied to the inspection unit, and after the inspection ends, the electronic components are collected from the inspection unit to the collection tray. It is configured to be collected. In addition, the electronic components accommodated in the supply tray are temporarily transferred to the shuttle and conveyed to the vicinity of the inspection unit by the shuttle. The shuttle is provided with a tray in which a pocket is formed, and an electronic component is accommodated in the pocket.

  The movement of the electronic component from the shuttle to the tray is performed by the inspection robot. The inspection robot holds uninspected electronic components accommodated in the shuttle, for example, by suction and supplies them to the inspection unit. Further, the inspection robot presses the electronic component against the inspection unit, thereby ensuring reliable conduction between the pin of the electronic component and the pin of the inspection unit. Further, in order to inspect the electrical characteristics while maintaining a temperature state higher than the ambient temperature of the electronic component (for example, about 60 to 130 °), the inspection robot has a temperature adjustment function (heating) that adjusts the temperature of the electronic component. Cooling means) (see, for example, Patent Document 1).

The electronic component test apparatus described in Patent Document 1 has a suction head configured such that one end of a Peltier element is in direct or indirect contact with an electronic component and the other end is connected to a cooling fin.
The inspection robot described in Patent Document 2 includes an adapter, a pusher base provided below the adapter, a presser provided below the pusher base, a heater provided below the presser, an adapter, The electronic component pressing device has a heat sink provided between the pusher bases.

JP 2009-2960 A JP 2008-151802 A

However, the electronic component test apparatus described in Patent Document 1 aims to cool the electronic component with a Peltier element and to release heat generated on the side opposite to the end of the electronic component side of the Peltier element through the radiation fin. It is an invention to do. Although the electronic component can be maintained at a temperature lower than the ambient temperature, it is not suitable for controlling the electronic component at a high temperature.
Further, the electronic component pressing device described in Patent Document 2 has a problem in that the height of the inspection robot cannot be suppressed because the above-described members are arranged side by side in the vertical direction.
An object of the present invention is to provide an electronic component pressing device, an electronic component temperature control method, a handler, and an inspection device capable of maintaining the electronic component at a temperature higher than the ambient temperature and suppressing the height. It is in.

Such an object is achieved by the present invention described below.
The electronic component pressing device of the present invention comprises a pressing unit that presses the electronic component against the inspection unit;
A heating unit for heating the pressing unit;
A cooling part for cooling the pressing part,
The cooling unit includes a heat dissipating unit, a heat connecting unit that thermally connects the heat dissipating unit and the pressing unit, and a gas ejection unit that ejects a cooling gas toward the heat dissipating unit,
When viewed from a plane whose normal direction is the pressing direction of the electronic component by the pressing portion, the heat radiating portion is provided away from the pressing portion in an in-plane direction of the plane. To do.
Thereby, an electronic component pressing device with a reduced height is obtained.

In the electronic component pressing device according to the present invention, it is preferable that the gas ejection unit can control ejection and stop of the cooling gas.
Thereby, temperature control of an electronic component can be performed effectively via a press part.
In the electronic component pressing device according to the present invention, it is preferable that the heating unit includes a heater, and the heater is provided in the pressing unit.
Thereby, an electronic component can be efficiently heated via a press part.
In the electronic component pressing device according to the present invention, it is preferable that the heating unit includes the heater, and the heater is provided adjacent to the pressing unit.
Thereby, an electronic component can be efficiently heated via a press part.

In the electronic component pressing apparatus of the present invention, it is preferable that the cooling gas is a compressed gas.
Thereby, an electronic component can be cooled efficiently via a press part.
In the electronic component pressing apparatus of the present invention, it is preferable that the cooling gas is turbulent.
Thereby, an electronic component can be cooled more efficiently via a press part.
In the electronic component pressing device according to the aspect of the invention, the gas ejection portion is arranged so that the cooling gas contacts the heat radiating portion in a state where the pressing portion presses the electronic component against the inspection portion. It is preferable.
Thus, the electronic component can be effectively cooled via the pressing portion in a state where the electronic component is pressed by the pressing portion, that is, in a state where the electrical characteristics of the electronic component are being inspected. . Therefore, a temperature change due to self-heating of the electronic component due to energization during inspection can be effectively canceled.

In the electronic component pressing device according to the aspect of the invention, it is preferable that the gas ejecting portion ejects the cooling gas from the direction orthogonal to the pressing direction of the electronic component by the pressing portion toward the heat radiating portion.
Thereby, the height of the whole apparatus can be suppressed.
In the electronic component pressing device of the present invention, it is preferable that the thermal connection portion is a heat pipe.
Thereby, heat exchange can be more efficiently performed between the pressing portion and the heat radiating portion.
In the electronic component pressing device of the present invention, it is preferable that a swing mechanism for swinging the pressing portion is provided on the side of the pressing portion opposite to the side pressing the electronic component.

The electronic component pressing device of the present invention includes a pressing unit that presses the electronic component against the inspection unit,
A heat dissipating part;
A thermal connection part that thermally connects the pressing part and the heat dissipation part;
And a heater for heating the pressing portion.
Thereby, the electronic component pressing apparatus which can perform the outstanding temperature control is obtained.

The electronic component pressing device of the present invention includes a pressing unit that presses the electronic component against the inspection unit,
A heating unit for heating the pressing unit;
A cooling part for cooling the pressing part,
The cooling unit includes a heat radiating unit, and a gas ejection unit that ejects a cooling gas toward the heat radiating unit,
The heat radiating part and the pressing part are integrally formed,
The gas ejection part is arranged to face the heat radiating part.
Thereby, the electronic component pressing apparatus which can perform the outstanding temperature control is obtained.

The electronic component pressing device of the present invention includes a pressing unit that presses the electronic component against the inspection unit,
A heating unit for heating the pressing unit;
A cooling part for cooling the pressing part,
The cooling unit includes a heat radiating unit, and a gas ejection unit that ejects a cooling gas toward the heat radiating unit,
The opposing surfaces of the heat radiating part and the pressing part are fixed close to each other,
The gas ejection part is arranged to face the heat radiating part.
Thereby, the electronic component pressing apparatus which can perform the outstanding temperature control is obtained.

The electronic component temperature control method of the present invention includes a pressing unit that presses the electronic component against the inspection unit,
A heating unit for heating the pressing unit;
A cooling unit for cooling the heater block;
A temperature sensor that detects the temperature of the electronic component pressed by the pressing unit;
A control unit that controls driving of the heating unit and the cooling unit based on a detection result of the temperature sensor;
The cooling unit includes a heat dissipating unit, a heat connecting unit that thermally connects the heat dissipating unit and the heater block, and a gas ejection unit that ejects a cooling gas toward the heat dissipating unit,
When viewed from a plane whose normal direction is the pressing direction of the electronic component by the pressing portion, the heat dissipation portion is provided away from the heater block in the in-plane direction of the plane,
With the pressing unit pressing the electronic component against the inspection unit, the control unit controls the driving of the heating unit and the cooling unit based on the detection result of the temperature sensor, whereby the electronic The temperature of the component is maintained within a predetermined temperature range.
Thereby, the temperature control method of the electronic component pressing apparatus which can perform outstanding temperature control can be provided.

The handler of the present invention includes a pressing unit that presses the electronic component against the inspection unit,
A heating unit for heating the pressing unit;
A cooling unit for cooling the heater block,
The heating unit has a heater for heating the pressing unit,
The cooling unit includes a heat dissipating unit, a heat connecting unit that connects the heat dissipating unit and the heat block, and a gas ejection unit that ejects a cooling gas toward the heat dissipating unit,
When viewed from a plane whose normal direction is the pressing direction of the electronic component by the pressing portion, the heat radiating portion is provided away from the heater block in the in-plane direction of the plane. To do.
Thereby, a handler capable of performing excellent temperature control is obtained.

The inspection apparatus of the present invention includes the handler of the present invention,
And having the inspection unit,
The electronic component is transported to the inspection unit by the handler.
Thereby, an inspection apparatus capable of performing excellent temperature control is obtained.

It is a top view which shows suitable embodiment of the test | inspection apparatus of this invention. It is sectional drawing of the 1st hand unit which the inspection robot of the inspection apparatus shown in FIG. 1 has. It is a fragmentary sectional view for demonstrating the rocking | fluctuation mechanism of the 1st hand unit shown in FIG. It is a top view for demonstrating the cooling part of the 1st hand unit shown in FIG. It is a perspective view for demonstrating the cooling part of the 1st hand unit shown in FIG. It is a top view for demonstrating the rocking | fluctuation mechanism of the 1st hand unit shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is a top view explaining the test | inspection procedure of the electronic component by the test | inspection apparatus shown in FIG. It is sectional drawing which shows the modification of the 1st hand unit shown in FIG. It is a top view which shows the application example of the electronic component pressing apparatus of this invention. It is a top view which shows the application example of the electronic component pressing apparatus of this invention.

Hereinafter, an electronic component pressing device, an electronic component temperature control method, a handler, and an inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.
FIG. 1 is a plan view showing a preferred embodiment of the inspection apparatus of the present invention. FIG. 2 is a cross-sectional view of the first hand unit included in the inspection robot of the inspection apparatus shown in FIG. FIG. 3 is a partial cross-sectional view for explaining the swing mechanism of the first hand unit shown in FIG. FIG. 4 is a plan view for explaining a cooling unit of the first hand unit shown in FIG. FIG. 5 is a perspective view for explaining a cooling unit of the first hand unit shown in FIG. 2. FIG. 6 is a plan view for explaining a swing mechanism of the first hand unit shown in FIG. 7 to 15 are plan views for explaining the inspection procedure of the electronic component by the inspection apparatus shown in FIG. FIG. 16 is a cross-sectional view showing a modification of the first hand unit shown in FIG. 17 and 18 are plan views showing application examples of the electronic component pressing device of the present invention.
In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. A direction parallel to the X axis is referred to as an “X direction”, a direction parallel to the Y axis is referred to as a “Y direction”, and a direction parallel to the Z axis is referred to as a “Z direction”. In each of the X direction, the Y direction, and the Z direction, the arrow tip side is referred to as “+”, and the arrow base end side is referred to as “−”.

[Inspection equipment]
The inspection apparatus 1 shown in FIG. 1 inspects (tests) the electrical characteristics of a test component (electronic component) 100 such as an IC device (IC chip), an LCD (Liquid Crystal Display), or a CIS (Contact Image Sensor). It is a device for. In the following, for convenience of explanation, the case where an IC device is used as a test part will be described as a representative, and the test part 100 is referred to as “IC device 100”.

  The inspection apparatus 1 includes a supply tray 2, a collection tray 3, a first shuttle 4, a second shuttle 5, an inspection socket (inspection unit) 6, a supply robot 7, a collection robot 8, and an inspection robot. 9 and a control device 10 for controlling these components. The inspection apparatus 1 is an apparatus that transports the IC device 100 to the inspection socket 6 and inspects (tests) the electrical characteristics of the IC device using the inspection socket 6.

  In the inspection apparatus 1, the configuration excluding the inspection socket 6 among these parts, that is, the supply tray 2, the recovery tray 3, the first shuttle 4, the second shuttle 5, the supply robot 7, the recovery robot 8, and the inspection robot 9. The handler 10 (the handler of the present invention) for carrying the IC device 100 is configured by the control device 10. Note that the configuration of the handler of the present invention is not limited to this, and at least one of these components may be omitted as necessary, and other configurations (for example, a heater, a chamber, etc.) are added. May be.

  Further, the inspection apparatus 1 includes a pedestal 11 on which the above-described parts are mounted, and a safety cover (not shown) that covers the pedestal 11 so as to accommodate the respective parts. The inside of the safety cover (hereinafter referred to as “region S”). The first shuttle 4, the second shuttle 5, the inspection socket 6, the supply robot 7, the recovery robot 8, and the inspection robot 9 are arranged and can be moved in and out of the area S. A supply tray 2 and a recovery tray 3 are arranged.

Hereinafter, each of these units will be sequentially described in detail.
(Supply tray)
The supply tray 2 is a tray for transporting the IC device 100 to be inspected from outside the region S into the region S. The supply tray 2 has a plate shape, and a plurality of pockets 21 for holding the IC device 100 are formed in a matrix in the X direction and the Y direction on the upper surface thereof.
The supply tray 2 is placed on a stage (not shown) that moves on a rail 23 extending in the Y direction so as to straddle the inside and outside of the region S. Therefore, for example, the supply tray 2 can be reciprocated in the ± Y direction along the rail 23 by moving the stage by a driving means (not shown) using a linear motor as a driving source.

(Collection tray)
The collection tray 3 is a tray for storing the inspected IC device 100 and transporting it from the area S to the outside of the area S. The collection tray 3 has a plate shape, and a plurality of pockets 31 for holding the IC device 100 are formed in a matrix in the X direction and the Y direction on the upper surface thereof.
The collection tray 3 is placed on a stage (not shown) that moves on a rail 33 extending in the Y direction so as to straddle the inside and outside of the region S. Therefore, for example, the collection tray 3 can be reciprocated along the rails 33 in the ± Y direction by moving the stage by a driving means (not shown) using a linear motor as a driving source.

In the inspection apparatus 1, a plurality (two) of collection trays 3 having such a configuration are arranged in the X direction. One of the two collection trays 3 is a tray for accommodating the IC device 100 determined as a non-defective product as a result of the inspection, and the other collection tray 3 is an IC device whose inspection result is determined as a defective product. 100 is a tray for accommodating 100. In this way, by separating the trays between the non-defective product and the defective product, the subsequent separation can be easily performed.
The collection tray 3 is provided to be separated from the supply tray 2 in the + X direction, and the first shuttle 4, the second shuttle 5, and the inspection socket 6 are provided between the supply tray 2 and the collection tray 3. Is arranged.

(First shuttle)
The first shuttle 4 further transports the IC device 100 transported into the region S by the supply tray 2 to the vicinity of the inspection socket 6. Further, the first shuttle 4 is further inspected by the inspection socket 6. For transporting 100 to the vicinity of the collection tray 3.

  As shown in FIG. 1, the first shuttle 4 includes a base member 41 and two shuttle jigs 42 and 43 fixed to the base member 41. These two shuttle jigs 42 and 43 are provided side by side in the X direction. In addition, on the upper surfaces of the shuttle jigs 42 and 43, four pockets 421 and 431 for accommodating the IC device 100 are formed in a matrix in the X direction and the Y direction, respectively.

Of the shuttle jigs 42 and 43, the shuttle jig 42 located on the supply tray 2 side is a shuttle jig that transfers and accommodates the IC device 100 accommodated in the supply tray 2, and is located on the collection tray 3 side. Reference numeral 43 denotes a shuttle jig for accommodating the IC device 100 that has been inspected by the inspection socket 6. That is, the shuttle jig 42 is a shuttle jig for accommodating an uninspected IC device 100, and the shuttle jig 43 is a shuttle jig for accommodating an inspected IC device 100.
The first shuttle 4 is supported by a rail 44 having a base member 41 extending in the X direction. The first shuttle 4 can be reciprocated in the ± X direction along the rail 44 by a driving means (not shown) using, for example, a linear motor as a driving source. ing.

(Second shuttle)
The second shuttle 5 has the same function and configuration as the first shuttle 4 described above. That is, the second shuttle 5 further transports the IC device 100 that has been transported into the region S by the supply tray 2 to the vicinity of the inspection socket 6, and further has been inspected by the inspection socket 6. This is for transporting the IC device 100 to the vicinity of the collection tray 3.

  As shown in FIG. 1, the second shuttle 5 includes a base member 51 and two shuttle jigs 52 and 53 fixed to the base member 51. These two shuttle jigs 52 and 53 are provided side by side in the X direction. Further, on the upper surfaces of the shuttle jigs 52 and 53, four pockets 521 and 531 for accommodating the IC device 100 are formed in a matrix in the X direction and the Y direction, respectively.

  Of the shuttle jigs 52 and 53, the shuttle jig 52 located on the supply tray 2 side is a shuttle jig that transfers and accommodates the IC device 100 accommodated in the supply tray 2, and is located on the collection tray 3 side. Reference numeral 53 denotes a shuttle jig for accommodating the IC device 100 that has been inspected by the inspection socket 6. That is, the shuttle jig 52 is a shuttle jig for accommodating an uninspected IC device 100, and the shuttle jig 53 is a shuttle jig for accommodating an inspected IC device 100.

The second shuttle 5 is supported by a rail 54 having a base member 51 extending in the X direction, and can be reciprocated in the ± X direction along the rail 54 by driving means (not shown) using, for example, a linear motor as a driving source. ing.
The second shuttle 5 is provided in the −Y direction away from the first shuttle 4 described above, and an inspection socket 6 is disposed between the first shuttle 4 and the second shuttle 5. ing.

(Inspection socket)
The inspection socket (inspection unit) 6 is a socket for inspecting (testing) the electrical characteristics of the IC device 100.
The inspection socket 6 has four individual inspection sockets 61 for arranging the IC device 100. The four individual sockets 61 for inspection are provided in a matrix so that two each are arranged in the X direction and the Y direction. Further, the arrangement pitch of the four individual inspection sockets 61 is substantially equal to the arrangement pitch of the four pockets formed in each of the shuttle jigs 42, 43, 52, 53. Thereby, the IC device 100 can be smoothly transported between the shuttle jigs 42, 43, 52, 53 and the individual inspection socket 61.

Each individual inspection socket 61 is provided with a plurality of probe pins (not shown) that protrude from the bottom. Each of the plurality of probe pins is biased upward by a spring or the like. When the IC device 100 is disposed in the individual inspection socket 61, the plurality of probe pins come into contact with external terminals of the disposed IC device 100. As a result, the IC device 100 and the control apparatus 10 (inspection control unit 101 to be described later) are electrically connected via the probe pins, that is, the IC device 100 can be inspected.
The inspection socket 6 is preferably detachably fixed to the base 11. Thereby, the inspection socket 6 can be easily replaced according to the target inspection, or the inspection socket 6 suitable for the size and shape of the IC device 100 can be replaced.

(Supply robot)
The supply robot 7 is a robot that conveys the IC device 100 accommodated in the supply tray 2 to the shuttle jigs 42 and 52.
The supply robot 7 is supported by the support frame 72 supported by the pedestal 11, the moving frame 73 supported by the support frame 72 and reciprocally movable in the ± Y direction with respect to the support frame 72, and supported by the moving frame 73. It has a hand unit support part 74 that can reciprocate in the ± X direction with respect to the frame 73 and four hand units 75 supported by the hand unit support part 74.

  A rail 721 extending in the Y direction is formed on the support frame 72, and the moving frame 73 reciprocates in the Y direction along the rail 721. The moving frame 73 is formed with a rail (not shown) extending in the X direction, and the hand unit support portion 74 reciprocates in the X direction along this rail. Note that the movement of the moving frame 73 with respect to the support frame 72 and the movement of the hand unit support portion 74 with respect to the moving frame 73 are performed by, for example, driving means (not shown) using a linear motor as a driving source.

  The four hand units 75 are arranged in a matrix so that two each are arranged in the X direction and the Y direction. Each hand unit 75 includes a holding unit that holds the IC device 100 and a lifting device that lifts and lowers the holding unit in the Z direction. The holding unit is configured by, for example, a suction nozzle and can hold the IC device 100 by suction. Further, the lifting device can be, for example, a device that uses a driving means that uses a linear motor as a driving source.

(Inspection robot)
The inspection robot 9 conveys the IC device 100 accommodated in the shuttle jigs 42 and 52 to the inspection socket 6 and also conveys the IC device 100 that has been inspected from the inspection socket 6 to the shuttle jigs 43 and 53. It is. The inspection robot 9 has a function of pressing the IC device 100 against the inspection socket 6 (probe pin) and applying a predetermined inspection pressure to the IC device 100 when the IC device 100 inspects the inspection socket 6. Have.

  As shown in FIG. 1, the inspection robot 9 is fixed to the base 11 and supported by the first frame 9A and the first frame 9A, and reciprocates in the ± Y direction with respect to the first frame 9A. A movable second frame 9B, a first hand unit support portion 9C ′ and a second hand unit support portion 9C ″ supported by the second frame 9B and capable of moving up and down in the Z direction with respect to the second frame 9B; Four first hand units (electronic component pressing devices) 91 supported by one hand unit support 9C ′ via a lifting device 9D ′, and supported by a second hand unit support 9C ″ via a lifting device 9D ″ The four second hand units (electronic component pressing devices) 92 are provided.

  Since the first and second hand unit support portions 9C ′ and 9C ″ are both supported by the second frame 9B, they move integrally in the X direction and the Y direction, but in the Z direction, the lifting device 9D ′. , 9D "can be moved independently. The movement of the movement of the second frame 9B relative to the first frame 9A is performed by a driving means (not shown) using, for example, a linear motor as a driving source.

The first hand unit 91 is an apparatus that conveys the IC device 100 between the shuttle jigs 42 and 43 and the inspection socket 6.
The first hand units 91 are arranged in a matrix so as to be arranged two by two in the X direction and the Y direction below the first hand unit support portion 9C ′. Further, the arrangement pitch of the first hand units 91 is substantially the same as the arrangement pitch of the four pockets 421 and 431 formed in the shuttle jigs 42 and 43 and the four individual sockets 61 for inspection provided in the inspection socket 6. equal. Thereby, the IC device 100 can be smoothly transported between the shuttle jigs 42 and 43 and the inspection socket 6.

The second hand unit 92 is an apparatus that conveys the IC device 100 between the shuttle jigs 42 and 43 and the inspection socket 6.
The second hand units 92 are arranged in a matrix so that two second hand units 92 are arranged in the X direction and the Y direction below the second hand unit support portion 9C ″. The installation pitch is substantially equal to the arrangement pitch of the four pockets 521 and 531 formed in the shuttle jigs 52 and 53 and the four individual sockets 61 for inspection provided in the inspection socket 6. Thereby, the shuttle jig 52 and The IC device 100 can be smoothly transported between the inspection socket 53 and the inspection socket 6.
Hereinafter, although the structure of the 1st hand unit 91 and the 2nd hand unit 92 is demonstrated, since each hand unit 91 and 92 is the mutually same structure, it represents below about the one 1st hand unit 91 below. A description of the other first hand units 91 and the second hand units 92 will be omitted.

[First hand unit]
As shown in FIGS. 2 and 4, the first hand unit (pusher) 91 includes a pressing unit 911, a heating unit 912 that heats the pressing unit 911, a cooling unit 913 that cools the pressing unit 911, and a pressing unit 911. And a control unit 915 for controlling the driving of the heating unit 912 and the cooling unit 913 based on the detection result of the temperature sensor 914.

  Further, the first hand unit 91 has a swing mechanism 93 for swinging the pressing portion 911. The pressing portion 911 is supported and fixed to the first hand unit support portion 9C ′ via the swing mechanism 93. The swing mechanism 93 enables the IC device 100 held by the pressing portion 911 to be inclined to the bottom surface of the individual socket 61 for inspection by enabling the pressing portion 911 to swing with respect to the first hand unit support portion 9C ′. This is a mechanism for following (following). By providing such a mechanism, the IC device 100 can be uniformly pressed against the surface of the individual socket 61 for inspection.

-Oscillation mechanism-
The rocking mechanism 93 includes a rocking body 94 and a floating body 96 suspended from the rocking body 94 via floating means 95.
The rocking body 94 includes a rocking body 941 that rocks, a rubber film (film-like elastic member) 942 that adheres to the surface of the rocking body 941 and rocks the rocking body 941, and a rubber film. And a support member 943 for supporting 942. In the present embodiment, the support member 943 is divided into two parts, and the rubber film 942 is sandwiched between the two parts, and the two parts are coupled by screws or the like, thereby supporting the rubber film 942. . The rubber film 942 supported by the support member 943 is disposed in a thin film shape in a direction orthogonal to the ascending / descending direction of the first hand unit 91.

The swing part main body 941 is fixed (for example, bonded) to the rubber film 942. In the present embodiment, the rubber film 942 is fixed to the upper surface of the swing part main body 941, but the present invention is not limited to this, and the rubber film 942 may penetrate the swing part main body 941. The surface of the swing part main body 941 may be covered. Further, the rubber film 942 may not be bonded to the swing part main body 941.
As the rubber film 942, it is preferable to use a material that does not easily deteriorate. Examples of such a material include silicone rubber, fluorine rubber, nitrile rubber, and epichlorohydrin rubber.
Further, the rocking body 94 is a locking portion 944 that regulates the rocking range of the rocking portion main body 941 so that the rocking portion main body 941 rocks more than necessary and excessive stress is not generated on the rubber film 942. have. The locking portion 944 is a member for locking the swinging portion main body 941 to the support member 943. Moreover, the latching | locking part 944 has a rocking | fluctuation control part.

As shown in FIG. 2, a space S <b> 1 is formed between the inner peripheral surface of the locking portion 944 and the outer peripheral surface of the swinging portion main body 941. The space S1 is a space for enabling the swinging part main body 941 to swing. The space S1 is designed so that the swinging part main body 941 swings by 0.5 degrees at the maximum. Thereby, excessive rocking can be prevented while securing a rocking range sufficient for the inspection of the rocking part main body 941.
A concave portion 941a extending in the vertical direction is formed on the outer peripheral surface of the swinging portion main body 941, and a convex portion 944a that engages with the concave portion 941a is formed on the inner peripheral surface of the locking portion 944. Thereby, the excessive rotation (turning) of the swing part main body 941 is prevented.

  In addition, a sealed space S3 is formed in the rocking body 94 by the rubber film 942 and the support member 943. An air hole 943a for air to enter and exit from the pressure adjusting means 99 is provided on the upper surface of the sealed space S3. When positive pressure is supplied from the pressure adjusting means 99 to the sealed space S3, the rubber film 942 bends downward so that the sealed space S3 expands. As a result, the swinging portion main body 941 is biased downward. The swinging part main body 941 urged downward is locked by the locking part 944.

  The first hand unit 91 is lowered in a state where the swinging portion main body 941 is locked to the locking portion 944 (a state where the space S3 is pressurized), and a force larger than the pressure applied by the pressure adjusting means 99 is used. When pressed against the individual inspection socket 61, as shown in FIG. 3, the swinging portion main body 941 moves away from the locking portion 944 and follows the inclination of the individual inspection socket 61 while swinging. Thereby, the IC device 100 can be uniformly pressed against the surface (probe pin) of the individual socket 61 for inspection.

  The pressure adjusting means 99 is not particularly limited as long as the pressure in the space S3 can be adjusted. For example, the pressure adjusting means 99 is located in the middle of the flow path connecting the pump, the pump and the air hole 943a. It can be set as the structure which has an electromagnetic valve. The electromagnetic valve can take a state where the pump and the air hole 943a communicate with each other, a state where the air hole 943a is closed, and a state where the air hole 943a is released to the atmosphere. Thereby, air can be supplied into the space S3 from the pump, or the air in the space S3 can be removed, and the pressure in the space S3 can be adjusted.

  A floating body 96 is arranged below the swinging part main body 941 via a floating means 95. The floating means 95 is composed of a plurality of steel balls 951 such as bearings. The steel ball 951 is disposed in a space S2 that allows the steel ball 951 to move in a plane (movement and rotation in the X and Y directions). The floating body 96 can move in the X and Y directions with respect to the swinging portion main body 941 or rotate around the Z axis (θ direction) by rolling the steel ball 951 in the space S2. Therefore, even if the IC device 100 held by the pressing portion 911 is displaced in the X, Y, and θ directions with respect to the individual inspection socket 61, the IC device 100 is more accurately placed on the individual inspection socket 61. Can be pressed.

  Further, the swing mechanism 93 has a restoring means for returning the position of the floating body 96 moved relative to the swing portion main body 941 to the original position (natural state). The restoring means includes a leaf spring 97 fixed to the floating body 96. The swinging part main body 941 is in contact with the leaf spring 97 in four directions. For example, when the floating body 96 moves in the X direction, the leaf spring 97 in the Y direction bends in the X direction, and tries to return the floating body 96 to the original position by the stress of the leaf spring 97. Similarly, even if the floating body 96 moves in the Y direction or the θ direction, the floating body 96 tries to return to the original position by the stress of the leaf spring 97. Thereby, after the test of the IC device 100 is completed, the floating body 96 is restored to the original position, so that the IC device 100 to be tested next can be easily sucked. In this embodiment, a plate spring is used as the restoring means, but a coil spring (compression spring, tension spring), an elastic body such as rubber, or the like may be used.

-Pressing part-
The pressing portion 911 is fixed to the lower side of the movable body 96. The pressing part 911 is a part that holds the IC device 100 and presses the IC device 100 against the individual socket 61 for inspection. The pressing portion 911 is also a part that transmits heat to the held IC device 100 and absorbs heat from the IC device 100.

  As shown in FIG. 2, the pressing part 911 is composed of two parts. Specifically, the pressing portion 911 includes a heater block (first heat conducting member) 911a fixed to the lower side of the floating body 96 and a contact pusher (second heat conducting member) fixed to the lower side of the heater block 911a. ) 911b. The heater block 911a and the contact pusher 911b are fixed and connected by, for example, screwing, bonding, fitting, or the like.

  The lower surface of the contact pusher 911b is a holding surface that holds the IC device 100, and is a flat surface. Thereby, a large contact area with the upper surface of the IC device 100 can be ensured, and generation of a gap (a heat insulating layer composed of air) between the contact pusher 911b and the IC device 100 can be suppressed. Can do. Therefore, the IC device 100 can be stably held by the pressing portion 911, and heat can be efficiently transferred to and from the IC device 100.

  The heater block 911a and the contact pusher 911b are each made of a material that is hard and has high thermal conductivity. Thereby, it can be set as the press part 911 which can exhibit the function mentioned above reliably. The material that is hard and has high thermal conductivity is not particularly limited. For example, various metals such as iron, nickel, cobalt, gold, platinum, silver, copper, aluminum, magnesium, titanium, and tungsten, or of these metals Alloys or intermetallic compounds containing at least one kind, and oxides, nitrides, carbides, and the like of these metals can be given.

  The contact pusher 911b is formed with a suction hole 981 opened on the lower surface thereof. A suction means 983 and a gas ejection means 984 for supplying a gas having a higher thermal conductivity than air are connected to the suction hole 981 via a switching valve (switch) 982, and suction is performed by driving the switching valve 982. The state where the hole 981 and the suction means 983 are connected and the state where the suction hole 981 and the gas ejection means 984 are connected can be switched.

  The suction unit 983 includes a pump such as a vacuum pump, for example, and has a function of reducing the pressure in the suction hole 981. When the inside of the suction hole 981 is decompressed in a state where the lower surface of the pressing portion 911 is pressed against the upper surface of the IC device 100 (that is, the opening of the suction hole 981 is closed by the IC device 100), the IC device 100 is Can be adsorbed and held. Accordingly, the IC device 100 can be transported from the shuttle jig 42 to the individual inspection socket 61 and the IC device 100 can be conveyed from the individual inspection socket 61 to the shuttle jig 43 easily and reliably.

The gas ejection unit 984 has a function of supplying a predetermined gas from the opening of the suction hole 981 between the pressing portion 911 and the IC device 100. The gas to be supplied is a gas having a higher thermal conductivity than air (dry air). In particular, helium can be preferably used as such a gas.
As described above, in order to efficiently perform the heat transfer performed between the pressing portion 911 and the IC device 100, the lower surface of the pressing portion 911 is a flat surface, and the gap between the IC device 100 and the IC device 100 is kept small. . However, a minute gap may be formed between the pressing portion 911 and the IC device 100 due to processing accuracy, bending of the upper surface of the IC device 100, or the like. The air existing in the gap functions as a heat insulating layer, and the efficiency of heat transfer between the pressing portion 911 and the IC device 100 may be reduced. Therefore, by supplying helium between the pressing portion 911 and the IC device 100 by the gas ejection means 984, the gap is filled with helium, and the above-described reduction in heat transfer can be prevented.

  The gas supply by the gas ejection means 984 is performed immediately before or simultaneously with the pressing of the IC device 100 to the inspection individual socket 61 by the first hand unit 91. Specifically, after the IC device 100 is transported to the inspection individual socket 61 by the first hand unit 91, the suction of the IC device 100 is once released. Then, the switching valve 982 is switched to connect the gas ejection means 984 to the suction hole 981, and helium is ejected from the suction hole 981 between the pressing portion 911 and the IC device 100 by the gas ejection means 984. Then, while continuing to eject helium, the pressing portion 911 is moved downward to press the IC device 100 to the individual inspection socket 61 with a predetermined inspection pressure. Accordingly, helium is filled in the gap between the pressing portion 911 and the IC device 100, and heat transfer between the pressing portion 911 and the IC device 100 can be efficiently performed. Therefore, the temperature control during the inspection of the IC device 100 can be performed with higher accuracy.

-Heating part-
The heating unit 912 heats the IC device 100. The heating unit 912 has a heater 912 a provided in the pressing unit 911. When the heater 912a is driven, the heat of the heater 912a is transmitted to the IC device 100 through the pressing portion 911, and the IC device 100 is heated. Here, as described above, since the pressing portion 911 (the heater block 911a and the contact pusher 911b) is made of a material having high thermal conductivity, the IC device 100 can be efficiently heated.

  In addition, it is preferable that thermal conductive grease is applied (filled) between the heater 912a and the pressing portion 911. Thereby, the heat of the heater 912a can be efficiently transmitted to the pressing portion 911. In the present embodiment, the heater 912a is fitted in the pressing portion 911, but the arrangement of the heater 912a is not limited to this. For example, the heater 912a may be fitted in the heater block 911a. The heater 912a may be disposed on the outer wall of the pressing portion 911. Further, the heater 912a is disposed apart from the pressing portion 911, and may be thermally connected to the pressing portion 911 by, for example, a heat pipe.

-Cooling section-
As shown in FIG. 4, the cooling unit 913 cools the IC device 100. The cooling unit 913 includes a heat sink (heat radiating unit) 913a, a heat connection unit 913b that thermally connects the heat sink 913a and the heater block 911a, and a nozzle (gas ejection unit) 913c that ejects the cooling gas G toward the heat sink 913a. And have.
The cooling unit 913 is configured to cool the IC device 100 via the heater block 911a and the pressing unit 911 by bringing the cooling gas G from the nozzle 913c into contact with the heat sink 913a to cool the heat sink 913a. . According to such a configuration, the IC device 100 can be cooled easily and efficiently.

  The heat sink 913a is arranged next to the heater block 911a and spaced from the heater block 911a. That is, the heat sink 913a is provided to be separated from the heater block 911a in the XY plane in the XY plan view (plan view in which the pressing direction (Z direction) of the IC device 100 by the pressing unit 911 is a normal line). Yes. The heat sink 913a may be disposed so as to be separated from the heater block 911a in the XY plane direction in the XY plan view, and may be displaced in the Z direction with respect to the heater block 911a, for example.

  By disposing the heat sink 913a away from the heater block 911a, direct heat exchange between the heat sink 913a and the heater block 911a (heat exchange not via the heat connection portion 913b) can be prevented. For example, an IC device The excessive cooling of 100, the fall of the heating capability of the IC device 100, etc. can be prevented. Note that the heat sink 913a is spaced apart from the heater block 911a means that the heat sink 913a and the heater block 911a are in direct contact with each other without any other member, as in this embodiment. In addition to a configuration in which a gap is formed between the heat sink 913a and the heater block 911a, for example, a configuration in which the heat sink 913a and the heater block 911a are in contact via a heat insulating layer is also included.

  Further, by arranging the heat sink 913a next to the heater block 911a, the air flow from the nozzle 913c can be efficiently brought into contact with the heat sink 913a, and the entire length (the length in the Z direction) of the lower part from the swinging body 941 Can be shortened. By shortening the overall length of this portion, the function of the swing mechanism 93 can be fully exhibited.

  This will be described in detail with reference to FIG. FIG. 6 shows two models in which the entire length of the lower part from the swinging part main body 941 is different. FIG. 6 shows a state in which the IC device 100 is swung so as to be inclined by the same amount. As can be seen from FIG. 6, in the model having a short overall length shown in FIG. 6A, the amount of displacement of the IC device 100 in the XY plane direction due to the tilting of the swinging portion main body 941 is caused by the floating body 96. You can cancel by playing against. Therefore, it is possible to place the IC device 100 on the inspection individual socket 61 with the correct posture and position. On the other hand, in the model with a long overall length shown in (b), the amount of displacement of the IC device 100 in the XY plane direction due to the tilting of the swinging portion main body 941 with respect to the model in (a) increases. Even if the floating body 96 moves as much as possible with respect to the swinging portion main body 941, the amount of deviation cannot be canceled. Therefore, there is a high possibility that the IC device 100 cannot be placed in the individual socket for inspection 61 in the correct posture and position, and the correct conduction with the probe pin cannot be obtained. From the above, it can be said that the inspection of the IC device 100 can be surely performed by shortening the overall length of the portion below the swinging part main body 941 as much as possible.

As shown in (b), even if the entire length of the lower part from the swinging part main body 941 is long, the above-described problems can be solved if the floating range of the floating body 96 is secured large. In this case, however, the first hand unit 91 becomes larger as the swing mechanism 93 becomes larger. Further, when the size of the first hand unit 91 is increased, the arrangement pitch of the four first hand units 91 is also increased, leading to an increase in size of the inspection apparatus 1.
4 and 5, a plurality of fins 913a 'extending in the XZ plane are formed side by side in the Y direction on the upper surface side and the lower surface side of the heat sink 913a. Thereby, the heat dissipation efficiency of the heat sink 913a increases, and the IC device 100 can be cooled more efficiently.

  The thermal connection portion 913b is formed in an elongated shape, one end portion is connected to the heat sink 913a, and the other end portion is connected to the heater block 911a. Thereby, the heat sink 913a and the heater block 911a are thermally connected via the thermal connection part 913b. Although it will not specifically limit as the heat connection part 913b if the heat sink 913a and the heater block 911a can be thermally connected, It is preferable that it is a heat pipe. The heat pipe is a pipe made of a material having high thermal conductivity such as metal, in which a volatile liquid (working fluid) is sealed, and a known pipe can be used. Thus, by using a heat pipe as the thermal connection portion 913b, the IC device 100 can be efficiently cooled via the pressing portion 911.

  In the present embodiment, the configuration in which the heat sink 913a and the heater block 911a are connected by one thermal connection portion 913b has been described. However, the number of the thermal connection portions 913b is not limited to one, but two It may be the above. By installing a plurality of refrigerants, the refrigerant can be circulated satisfactorily. For example, in the present embodiment, as shown in FIG. 5, the heat connecting portion 913b connects the heat sink 913a and the heater block 911a on the −Y axis side, and the heat sink 913a is cantilevered by the heater block 911a. However, in this configuration, a heat connecting part for connecting the heat sink 913a and the heater block 911a on the + Y axis side is added (that is, using two heat connecting parts), and the heat sink 913a is connected to the heater block 911a. It is good also as a structure supported by both ends. Thereby, compared with the case where the heat sink 913a is cantilevered, vibration of the heat sink 913a can be suppressed and damage to the heat sink 913a due to the vibration can be prevented. In such a configuration, the load in the moment direction can be reduced by designing the straight line connecting the connection portions of the two heat connection portions 913b to the heat sink 913a to pass through the center of gravity of the heat sink 913a. The above effect becomes more remarkable.

  As shown in FIG. 4, the nozzle 913 c is fixed to the pedestal 11 and is fixedly disposed (so as not to move) with respect to the individual socket 61 for inspection. The nozzle 913c is arranged so that the cooling gas G is in contact with the heat sink 913a in a state where the first hand unit 91 presses the IC device 100 against the individual socket 61 for inspection. By arranging the nozzle 913c in such an arrangement, the IC device 100 under inspection can be reliably cooled.

  The nozzle 913c is arranged so as to eject the cooling gas G from the X direction (a direction orthogonal to the pressing direction (Z direction) of the IC device 100 by the pressing portion 911) toward the heat sink 913a. By ejecting the cooling gas G from such a direction, the cooling gas G can be efficiently brought into contact with most of the outer surface of the heat sink 913a (particularly, the fins arranged above and below). The IC device 100 can be efficiently cooled via the unit 911. Moreover, the arrangement height of the nozzle 913c can be suppressed.

  In this embodiment, the nozzle 913c is arranged so as to eject the cooling gas G from the X direction toward the heat sink 913a. However, the nozzle 913c is arranged so as to eject the cooling gas G toward the heat sink 913a. There is no particular limitation as long as it is possible. For example, the cooling gas G may be arranged to be ejected toward the heat sink 913a from the Y direction or the XY in-plane direction and the direction inclined from both the X and Y directions. Further, the “direction perpendicular to the pressing direction (Z direction) of the IC device 100 by the pressing portion 911” is not limited to a direction coinciding with the XY in-plane direction, and some component in the Z direction in the XY in-plane direction. Specifically, a direction inclined about ± 10 ° around an axis in the XY plane is also included.

  Here, the cooling gas G ejected from the nozzle 913c is not particularly limited as long as the heat sink 913a can be cooled, but the compressed gas (compressed with a pressure larger than the atmospheric pressure (for example, about 10 times the atmospheric pressure)). Gas). Thereby, the heat sink 913a can be efficiently cooled. The cooling gas G may be either laminar or turbulent, but is preferably turbulent. Since the turbulent flow has a higher effect of transporting and diffusing heat than the laminar flow, the heat sink 913a can be cooled more efficiently by ejecting the cooling gas G as a turbulent flow to the heat sink 913a. it can. Here, the “turbulent flow” means an air flow having a Reynolds number larger than the critical Reynolds number, and the “laminar flow” means an air flow having a Reynolds number smaller than the critical Reynolds number.

  Further, the cooling gas G is not particularly limited, but for example, air is preferably used. As a result, the handling becomes simple and the cooling cost can be reduced. Moreover, as the cooling gas G, it is also preferable to use a gas having a higher thermal conductivity than air such as hydrogen or helium. In this case, since the gas is more expensive than air, the cooling cost is increased as compared with the case of air, but the cooling performance is improved. That is, by using hydrogen, helium, or the like, the IC device 100 can be cooled at a higher speed. Furthermore, the cooling performance can be improved by using a refrigeration cooler (refrigeration dryer) and using cooled compressed air.

-Temperature sensor-
The temperature sensor 914 is a temperature sensor for detecting the temperature of the IC device 100. The temperature sensor 914 is embedded in the pressing portion 911 and at a position as close as possible to the IC device 100. That is, the temperature sensor 914 indirectly detects the temperature of the IC device 100 by detecting the temperature of the pressing portion 911.

In the present embodiment, the temperature sensor 914 is configured to indirectly detect the temperature of the IC device 100, but may be configured to directly detect the temperature of the IC device 100. Specifically, for example, the temperature sensor 914 may be disposed so as to be exposed on the lower surface of the pressing portion 911, and the temperature sensor 914 may come into contact with the held IC device 100.
The temperature sensor 914 is not particularly limited, and for example, a Pt sensor such as a platinum sensor, a thermocouple, a thermistor, or the like can be used. If the IC device 100 has a built-in thermal diode, the temperature sensor 914 may be omitted and the temperature of the IC device 100 may be detected by the thermal diode.

-Control unit-
As shown in FIG. 4, the control unit 915 controls driving of the heating unit 912 and the cooling unit 913 based on the temperature of the IC device 100 detected by the temperature sensor 914, and sets the temperature of the IC device 100 to a predetermined temperature range. (For example, it is configured to maintain the set temperature T ± 2 ° C.). By performing such control, the IC device 100 can be inspected at the set temperature T. In particular, the temperature rise due to self-heating of the IC device 100 can be canceled and the temperature of the IC device 100 being inspected can be kept substantially constant, so that the IC device 100 can be inspected more accurately. .

  For example, the control unit 915 drives the heating unit 912 (heater 912a) after the first hand unit 91 causes the IC device 100 to be pressed against the individual socket 61 for inspection with a predetermined inspection pressure. Based on the temperature of the IC device 100 detected by the temperature sensor 914, the IC device 100 is heated to a set temperature (for example, 100 ° C.) T. When the temperature of the IC device 100 is stabilized near the set temperature T, the IC device 100 is driven and the inspection is started. When the inspection is started, the IC device 100 is heated by self-heating. The control unit 915 performs feedback control according to the temperature of the IC device 100 detected by the temperature sensor 914, and maintains the temperature of the IC device 100 in the vicinity of the set temperature T (for example, about the set temperature T ± 2 ° C.).

  Specifically, when the IC device 100 exceeds the set temperature T due to self-heating, the control unit 915 stops driving the heating unit 912 and drives the cooling unit 913. On the other hand, when the temperature of the IC device 100 falls below the set temperature T due to the cooling by the cooling unit 913, the control unit 915 stops the cooling unit 913 and drives the heating unit 912. By performing such feedback control, the temperature of the IC device 100 under inspection can be stabilized near the set temperature T.

  Note that the method for controlling the heating unit 912 and the cooling unit 913 of the control unit 915 is not limited to the method for switching the driving of the heating unit 912 and the cooling unit 913 as described above. For example, the control may be such that the cooling unit 913 is driven only when the IC device 100 exceeds the set temperature T while the heating unit 912 is always driven during the inspection. Further, during the inspection, the heating unit 912 and the cooling unit 913 are always driven, and the control of changing the output of each unit 912, 913 according to the temperature of the IC device 100, specifically, the IC device 100 The control may be such that, as the temperature rises, the output of the heating unit 912 is reduced and the output of the cooling unit 913 is increased. Thus, by driving the heating unit 912 and the cooling unit 913 at the same time, an excessive and steep temperature change of the IC device 100 can be prevented, and the temperature fluctuation of the IC device 100 can be suppressed small. .

(Recovery robot)
The collection robot 8 is a robot for transporting the inspected IC device 100 accommodated in the shuttle jigs 43 and 53 to the collection tray 3.
The collection robot 8 has the same configuration as the supply robot 7. That is, the collection robot 8 is supported by the support frame 82 supported by the pedestal 11, the movable frame 83 supported by the support frame 82 and reciprocally movable in the Y direction with respect to the support frame 82, and the movable frame 83. A hand unit support portion 84 that can reciprocate in the X direction with respect to the moving frame 83 and a plurality of hand units 85 supported by the hand unit support portion 84 are provided. Since the configuration of each of these units is the same as the configuration of each corresponding unit of the supply robot 7, the description thereof is omitted.
Here, in the inspected IC device 100 accommodated in the shuttle jig 43 (53), there are a non-defective product that has passed the inspection and a defective product that has failed. Therefore, as described above, non-defective products are stored in one collection tray 3 and defective products are stored in the other collection tray 3.

(Control device)
The control device 10 includes a drive control unit 102 and an inspection control unit 101. The drive control unit 102 controls, for example, the movement of the supply tray 2, the recovery tray 3, the first shuttle 4 and the second shuttle 5, and the mechanical drive of the supply robot 7, the recovery robot 8, the inspection robot 9, and the like. . One inspection control unit 101 inspects the electrical characteristics of the IC device 100 disposed in the inspection socket 6 (inspection individual socket 61) based on a program stored in a memory (not shown). The control unit 915 described above may be incorporated in the drive control unit 102.
The configuration of the inspection apparatus 1 has been described above.

[Inspection method using inspection equipment]
Next, an inspection method for the IC device 100 by the inspection apparatus 1 will be described with reference to FIGS. Note that the inspection method described below, in particular, the transport procedure of the IC device 100 is an example, and the present invention is not limited to this.

(Step 1)
First, as shown in FIG. 8, the supply tray 2 in which the IC device 100 is accommodated in each pocket 21 is transported into the region S, and the first and second shuttles 4 and 5 are moved to the −X direction side.
(Step 2)
Next, as shown in FIG. 8, the IC device 100 accommodated in the supply tray 2 is transferred to the shuttle jigs 42 and 52 by the supply robot 7, and the IC devices 100 are placed in the pockets 421 and 521 of the shuttle jigs 42 and 52. To accommodate.

(Step 3)
Next, as shown in FIG. 9, both the first and second shuttles 4 and 5 are moved to the + X direction side, the shuttle jig 42 is on the + Y direction side with respect to the inspection socket 6, and the shuttle jig 52 is for inspection. The socket 6 is arranged in the −Y direction side.
(Step 4)
Next, as shown in FIG. 10, the second frame 9B is moved so that the first hand unit support portion 9C ′ is positioned immediately above the shuttle jig 42, and the second hand unit support portion 9C ″ is the inspection socket 6 Then, the IC device 100 accommodated in the shuttle jig 42 is held by each first hand unit 91.

(Step 5)
Next, as shown in FIG. 11, the second frame 9B is moved to the −Y direction side so that the first hand unit support portion 9C ′ is located immediately above the inspection socket 6 and the second hand unit support portion 9C. "Is positioned directly above the shuttle jig 52.
Further, in parallel with the movement of the second frame 9B, the following work is also performed. First, the first shuttle 4 is moved to the −X direction side so that the shuttle jig 42 is aligned with the supply tray 2 in the + Y direction. Next, the IC device 100 accommodated in the supply tray 2 is transferred to the shuttle jig 42 by the supply robot 7, and the IC device 100 is accommodated in each pocket 421 of the shuttle jig 42.

(Step 6)
Next, the first hand unit support portion 9C ′ is lowered by the lifting device 9D ′, and the IC device 100 held by each first hand unit 91 is placed in the individual socket 61 for inspection. At this time, each first hand unit 91 presses the IC device 100 against the individual test socket 61 with a predetermined test pressure. As a result, the external terminals of the IC device 100 and the probe pins provided in the individual inspection socket 61 are electrically connected. Then, after the IC device 100 is set to a predetermined temperature by the temperature control by the control unit 915 described above, each IC device 100 is inspected by the inspection control unit 101. When the inspection is completed, the first hand unit support portion 9C ′ is raised and the IC device 100 is taken out from the individual inspection socket 61.
In parallel with this operation, each second hand unit 92 supported by the second hand unit support portion 9C ″ holds the IC device 100 accommodated in the shuttle jig 52, and takes out the IC device 100 from the shuttle jig 52.

(Step 7)
Next, as shown in FIG. 12, the second frame 9B is moved to the + Y direction side, and the first hand unit support portion 9C ′ is positioned immediately above the shuttle jig 43 of the first shuttle 4, and the second hand unit It is assumed that the support portion 9C ″ is positioned immediately above the inspection socket 6 (inspection origin position).

  Further, in parallel with the movement of the second frame 9B, the following work is also performed. First, the second shuttle 5 is moved to the −X direction side so that the shuttle jig 52 is aligned with the supply tray 2 in the + Y direction. Next, the IC device 100 accommodated in the supply tray 2 is transferred to the shuttle jig 52 by the supply robot 7, and the IC device 100 is accommodated in each pocket 521 of the shuttle jig 52.

(Step 8)
Next, as shown in FIG. 13, the second hand unit support portion 9C ″ is lowered, and the IC device 100 held by each second hand unit 92 is disposed in the individual socket 61 for inspection. After the predetermined temperature is reached, the IC device 100 is inspected while applying inspection pressure. When the inspection is completed, the second hand unit support portion 9C ″ is raised and the IC device 100 is taken out from the individual inspection socket 61. .

  In parallel with this work, the following work is performed. First, the inspected IC device 100 held by each first hand unit 91 is accommodated in each pocket 431 of the shuttle jig 43. Next, the first shuttle 4 is moved to the + X direction side so that the shuttle jig 42 is aligned in the + Y direction with respect to the inspection socket 6 and is positioned directly below each first hand unit 91. Next, each first hand unit 91 holds the IC device 100 accommodated in the shuttle jig 42, and the inspected IC device 100 accommodated in the shuttle jig 43 is transferred to the recovery tray 3 by the recovery robot 8. .

(Step 9)
Next, as shown in FIG. 14, the second frame 9 </ b> B is moved to the −Y direction side, and the first hand unit support portion 9 </ b> C ′ is positioned immediately above the inspection socket 6 and the second hand unit support portion 9 </ b> C. "Is positioned directly above the shuttle jig 53.
In parallel with the movement of the second frame 9B, the following work is also performed. First, the first shuttle 4 is moved to the −X direction side so that the shuttle jig 43 is aligned in the + Y direction with respect to the inspection socket 6. Next, the IC device 100 accommodated in the supply tray 2 is transferred to the shuttle jig 42 by the supply robot 7, and the IC device 100 is accommodated in each pocket 421 of the shuttle jig 42.

(Step 10)
Next, as shown in FIG. 15, the first hand unit support portion 9 </ b> C ′ is lowered, and the IC device 100 held by each first hand unit 91 is placed in the individual socket 61 for inspection. Then, after the IC device 100 is set to a predetermined temperature, the inspection control unit 101 performs inspection of the IC device 100. When the inspection is completed, the first hand unit support portion 9C ′ is raised, and the IC device 100 is taken out from the individual inspection socket 61.

  In parallel with this work, the following work is performed. First, the inspected IC device 100 held by each second hand unit 92 is accommodated in each pocket 531 of the shuttle jig 53. Next, the second shuttle 5 is moved to the + X direction side so that the shuttle jig 52 is arranged in the −Y direction with respect to the inspection socket 6 and is positioned directly below the second hand unit 92. Next, each second hand unit 92 holds the IC device 100 accommodated in the shuttle jig 52, and the inspected IC device 100 accommodated in the shuttle jig 53 is transferred to the recovery tray 3 by the recovery robot 8. .

(Step 11)
Thereafter, Step 7 to Step 10 described above are repeated. In the middle of this repetition, when all of the IC devices 100 accommodated in the supply tray 2 have been moved to the first shuttle 4, the supply tray 2 moves out of the region S. Then, after supplying a new IC device 100 to the supply tray 2 or exchanging it with another supply tray 2 in which the IC device 100 is already accommodated, the supply tray 2 moves again into the region S. Similarly, when the IC device 100 is accommodated in all the pockets 31 of the collection tray 3 during the repetition, the collection tray 3 moves out of the area S. Then, after the IC device 100 accommodated in the recovery tray 3 is removed or the recovery tray 3 is replaced with another empty recovery tray 3, the recovery tray 3 moves into the region S again.

According to the above method, the IC device 100 can be efficiently inspected. Specifically, the inspection robot 9 includes a first hand unit 91 and a second hand unit 92. For example, in a state where the IC device 100 held by the first hand unit 91 is being inspected, In parallel with this, the IC device 100 that has been inspected by the second hand unit 92 is accommodated in the shuttle jig 53, and the IC device 100 to be inspected next is held and is in standby. Thus, by performing different operations using the two hand units, useless time can be reduced and the IC device 100 can be inspected efficiently.
The inspection apparatus 1 has been described above.

  As a modification of the first hand unit 91 included in the inspection apparatus 1, the configuration shown in FIG. 16 can be applied. The first hand unit 91A shown in FIG. 16 has the same configuration as that of the first hand unit 91 described above except that it includes a heat insulating layer 910A. Accordingly, only the heat insulating layer 910A will be described below, and the other description will be omitted. Note that a modification similar to that in FIG. 16 can be applied to the second hand unit 92.

As shown in FIG. 16, the heat insulating layer 910 </ b> A is provided between the heater block 911 a and the floating body 96. Thereby, since heat exchange between the heater block 911a and the floating body 96 is suppressed, the IC device 100 can be efficiently heated and cooled as compared with the configuration shown in FIG.
The heat insulating layer 910A is not particularly limited as long as heat exchange between the heater block 911a and the floating body 96 can be suppressed. For example, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyamide, polyimide, polyurethane Various resin materials such as these can be used. In addition, foams such as foamed polyurethane, foamed polyethylene, and foamed polypropylene can also be used.

  As another modification of the first hand unit 91 included in the inspection apparatus 1, the configuration shown in FIG. 17 can be applied. The first hand unit 91B shown in FIG. 17 has the same configuration as that of the first hand unit 91 described above except that the structure of the connection portion between the heater block 911a and the heat sink 913a is different. Therefore, in the following, the structure of the connection portion between the heater block 911a and the heat sink 913a will be mainly described, and other description will be omitted. Note that a modification similar to that in FIG. 17 can be applied to the second hand unit 92.

  As shown in FIG. 17, in this modification, the heater block 911a and the heat sink 913a are integrally formed (formed simultaneously as one component). In other words, the heat connection part 913b is omitted from the above-described embodiment, and the heater block 911a and the heat sink 913a are directly connected. Thus, by integrally forming the heater block 911a and the heat sink 913a, the heat transfer between the heater block 911a and the heat sink 913a can be efficiently performed, and the IC device 100 is cooled easily and efficiently. be able to.

  The heater block 911a and the heat sink 913a are each made of a material that is hard and has high thermal conductivity. The material that is hard and has high thermal conductivity is not particularly limited. For example, various metals such as iron, nickel, cobalt, gold, platinum, silver, copper, aluminum, magnesium, titanium, and tungsten, or of these metals Alloys or intermetallic compounds containing at least one kind, and oxides, nitrides, carbides, and the like of these metals can be given.

Here, the heater block 911a and the heat sink 913a are not necessarily formed integrally. For example, the heater block 911a and the heat sink 913a may be manufactured separately and then fixed together by bonding, fitting, or the like. Examples of the adhesion include adhesion using an adhesive (metal filler-containing adhesive) having excellent thermal conductivity, and examples of the fitting include screwing. When the heater block 911a and the heat sink 913a are manufactured separately, the opposed surfaces of the heater block 911a and the heat sink 913a are fixed close to each other. Thereby, the heat transfer between these can be performed efficiently. Thus, by making the heater block 911a and the heat sink 913a separate, the size (type) of the heat sink 913a can be changed and the cooling capacity can be adjusted. That is, the heat sink 913a can be properly used according to the capability of the heater, and the temperature of the IC device 100 can be adjusted efficiently.
The modification has been described above.

In the above description, the configuration in which the electronic component pressing device of the present invention is applied to the inspection robot 9 included in the handler has been described. The electronic component pressing device of the present invention may be applied to, for example, an inspection device 1000 that is manually operated.
An inspection apparatus 1000 illustrated in FIG. 18 includes an inspection socket 1100, a hand unit (electronic component pressing apparatus) 1200, and a lever 1300 that operates the hand unit 1200. The hand unit 1200 has the same configuration as that obtained by omitting the suction means 983 for sucking the IC device and the switching valve 982 from the first hand unit 91 described above. Therefore, detailed description of the hand unit 1200 is omitted.

  The inspection apparatus 1000 is an apparatus that manually inspects the IC device 100. Specifically, first, the operator places the IC device 100 in the inspection socket 1100. Next, when the operator operates the lever 1300, the hand unit 1200 is lowered and the IC device 100 is pressed against the inspection socket 1100. Next, the IC device 100 is inspected by the hand unit 1200 while keeping the temperature of the IC device 100 at a predetermined temperature. When the inspection is completed, the operator operates the lever 1300 to raise the hand unit 1200. Then, the IC device 100 that has been inspected is collected, and a new IC device 100 is placed in the inspection socket 1100.

  The electronic component pressing device, the electronic component temperature control method, the handler, and the inspection device of the present invention have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each part Can be replaced with any structure having a similar function. In addition, any other component may be added to the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus 11 ... Base 2 ... Supply tray 21 ... Pocket 23 ... Rail 3 ... Collection tray 31 ... Pocket 33 ... Rail 4 ... First shuttle 41 ... Base members 42, 43 ... ... Shuttle jigs 421, 431 ... Pocket 44 ... Rail 5 ... Second shuttle 51 ... Base member 52, 53 ... Shuttle jig 521, 531 ... Pocket 54 ... Rail 6 ... Inspection socket 61 ... Individual socket for inspection 7 …… Supply robot 72 …… Support frame 721 …… Rail 73 …… Moving frame 74 …… Hand unit support part 75 …… Hand unit 8 …… Recovery robot 82 …… Support frame 821 …… Rail 83 …… Moving frame 84 …… Hand unit support part 85 …… Hand unit 9 …… Test Inspection robot 9A …… First frame 9B …… Second frame 9C ′ …… First hand unit support 9C ″ …… Second hand unit support 9D ′, 9D ″ …… Elevator 91, 91A, 91B ... ... 1st hand unit 910A ... Heat insulation layer 911 ... Pressing part 911a ... Heater block 911b ... Contact pusher 912 ... Heating part 912a ... Heater 913 ... Cooling part 913a ... Heat sink 913a '... Fin 913b ... ... Thermal connection part 913c ... Nozzle 914 ... Temperature sensor 915 ... Control part 92 ... Second hand unit 93 ... Swing mechanism 94 ... Swing body 941 ... Swing part body 941a ... Recess 942 ... Rubber film 943 …… Support member 943a …… Air hole 944 …… Locking portion 944a …… Convex Numeral 95... Floating means 951... Steel ball 96... Floating body 97 .. leaf spring 981 .. suction hole 982 .. switching valve 983 .. suction means 984 .. gas ejection means 99. ... Control device 101 ... Inspection control unit 102 ... Drive control unit 100 ... IC device 1000 ... Inspection device 1100 ... Inspection socket 1200 ... Hand unit 1300 ... Lever S ... Area S1, S2, S3 ... …space

Claims (16)

A pressing part for pressing the electronic component against the inspection part;
A heating unit for heating the pressing unit;
A cooling part for cooling the pressing part,
The cooling unit includes a heat dissipating unit, a heat connecting unit that thermally connects the heat dissipating unit and the pressing unit, and a gas ejection unit that ejects a cooling gas toward the heat dissipating unit,
When viewed from a plane whose normal direction is the pressing direction of the electronic component by the pressing portion, the heat radiating portion is provided away from the pressing portion in an in-plane direction of the plane. Electronic component pressing device.   The electronic component pressing device according to claim 1, wherein the gas ejection unit can control ejection and stop of a cooling gas.   The electronic component pressing device according to claim 1, wherein the heating unit includes a heater, and the heater is provided in the pressing unit.   The electronic component pressing device according to claim 1, wherein the heating unit includes the heater, and the heater is provided adjacent to the pressing unit.   The electronic component pressing device according to claim 1, wherein the cooling gas is a compressed gas.   The electronic component pressing device according to claim 1, wherein the cooling gas is a turbulent flow.   The said gas ejection part is arrange | positioned so that the said gas for cooling may contact the said thermal radiation part in the state which the said press part is pressing the said electronic component to the said test | inspection part. The electronic component pressing apparatus according to item 1.   The electronic component according to claim 1, wherein the gas ejection unit ejects the cooling gas from the direction orthogonal to the pressing direction of the electronic component by the pressing unit toward the heat radiating unit. Pressing device.   The electronic component pressing device according to claim 1, wherein the heat connection portion is a heat pipe.   10. The electronic component pressing device according to claim 1, further comprising: a swinging mechanism that swings the pressing portion on a side opposite to a side pressing the electronic component of the pressing portion. A pressing part for pressing the electronic component against the inspection part;
A heat dissipating part;
A thermal connection part that thermally connects the pressing part and the heat dissipation part;
An electronic component pressing apparatus comprising: a heater for heating the pressing portion. A pressing part for pressing the electronic component against the inspection part;
A heating unit for heating the pressing unit;
A cooling part for cooling the pressing part,
The cooling unit includes a heat radiating unit, and a gas ejection unit that ejects a cooling gas toward the heat radiating unit,
The heat radiating part and the pressing part are integrally formed,
The electronic component pressing device, wherein the gas jetting part is disposed to face the heat radiating part. A pressing part for pressing the electronic component against the inspection part;
A heating unit for heating the pressing unit;
A cooling part for cooling the pressing part,
The cooling unit includes a heat radiating unit, and a gas ejection unit that ejects a cooling gas toward the heat radiating unit,
The opposing surfaces of the heat radiating part and the pressing part are fixed close to each other,
The electronic component pressing device, wherein the gas jetting part is arranged to face the heat radiating part. A pressing part for pressing the electronic component against the inspection part;
A heating unit for heating the pressing unit;
A cooling unit for cooling the heater block;
A temperature sensor that detects the temperature of the electronic component pressed by the pressing unit;
A control unit that controls driving of the heating unit and the cooling unit based on a detection result of the temperature sensor;
The cooling unit includes a heat dissipating unit, a heat connecting unit that thermally connects the heat dissipating unit and the heater block, and a gas ejection unit that ejects a cooling gas toward the heat dissipating unit,
When viewed from a plane whose normal direction is the pressing direction of the electronic component by the pressing portion, the heat dissipation portion is provided away from the heater block in the in-plane direction of the plane,
With the pressing unit pressing the electronic component against the inspection unit, the control unit controls the driving of the heating unit and the cooling unit based on the detection result of the temperature sensor, whereby the electronic A temperature control method for an electronic component, wherein the temperature of the component is maintained within a predetermined temperature range. A pressing part for pressing the electronic component against the inspection part;
A heating unit for heating the pressing unit;
A cooling unit for cooling the heater block,
The heating unit has a heater for heating the pressing unit,
The cooling unit includes a heat dissipating unit, a heat connecting unit that connects the heat dissipating unit and the heat block, and a gas ejection unit that ejects a cooling gas toward the heat dissipating unit,
When viewed from a plane whose normal direction is the pressing direction of the electronic component by the pressing portion, the heat radiating portion is provided away from the heater block in the in-plane direction of the plane. Handler to do. A handler according to claim 15;
And having the inspection unit,
An inspection apparatus configured to convey the electronic component to the inspection unit by the handler.

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