JP2016102684A - Electronic component conveyance device, electronic component inspection device and electronic component pressing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device, electronic component inspection device and electronic component pressing device which enable temperature control of an electronic component to be performed with higher accuracy or allow for highly responsive temperature control.SOLUTION: An inspection device 1 comprises a heat conduction structure 30 that can hold an electronic component and is heat conductive, a heat radiation structure 40 that can radiate heat by allowing fluid to pass through, and an inspection part that inspects the electronic component. The heat radiation structure 40 is disposed so that it can contact or separate from the heat conduction structure 30.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic component conveying device, an electronic component inspection device, and an electronic component pressing device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device has been known. A transport device is incorporated. When inspecting an IC device, the IC device gripped by the gripping portion of the electronic component transport apparatus is placed in the holding portion. And a holding part presses an IC device toward a holding | maintenance part. As a result, the plurality of terminals of the IC device are pressed against the plurality of probe pins provided in the holding portion, and the terminals of the IC device and the probe pins are brought into contact with each other and are electrically connected.

  Further, when an IC device is inspected, the IC device may be adjusted to a desired temperature and inspected. In this case, a member having a heat sink (heat absorbing / dissipating body) is brought into contact with the IC device to exchange heat with the IC device (see, for example, Patent Document 1).

JP 2003-28923 A

  However, since the apparatus described in Patent Document 1 has a structure in which the heat sink is simply fixedly installed, it is difficult to perform sufficient heat exchange, that is, temperature control.

  An object of the present invention is to provide an electronic component transport device, an electronic component inspection device, and an electronic component pressing device that can perform temperature control on an electronic component more accurately or can make temperature control more responsive. There is.

Such an object is achieved by the present invention described below.
[Application Example 1]
The electronic component transport device of the present invention is capable of gripping an electronic component and capable of conducting heat,
A heat dissipating part capable of dissipating heat by passing a fluid,
The heat dissipating part is disposed so as to be able to contact or be separated from the heat conducting part.

  Thereby, temperature control with respect to an electronic component can be performed more correctly, or higher responsiveness of temperature control is possible.

[Application Example 2]
In the electronic component transport device according to the present invention, it is preferable that the electronic component transport device includes a contact drive unit that contacts the heat radiating unit with the heat conducting unit, and the contact drive unit is configured by a fluid device.

  Thereby, compared with the case where the contact drive part is comprised with electric equipments, such as a motor, for example, power consumption can be suppressed and piping, wiring, etc. can also be simplified. In addition, it contributes to the downsizing of the contact drive part, that is, space saving.

[Application Example 3]
In the electronic component transport apparatus according to the present invention, it is preferable that the contact driving portion includes a cylinder portion having a hollow portion and a piston portion that slides in the hollow portion.

  Thereby, compared with the case where the contact drive part is comprised with electric equipments, such as a motor, for example, power consumption can be suppressed further and piping, wiring, etc. can be further simplified. In addition, this further contributes to the downsizing of the contact drive unit, that is, space saving.

[Application Example 4]
In the electronic component conveying apparatus of the present invention, it is preferable that the piston portion has a larger elastic deformation rate or plastic deformation rate than the heat radiating portion.

  Thereby, the collision sound which may arise between a piston part and a thermal radiation part, and abrasion of a thermal radiation part can be prevented or suppressed.

[Application Example 5]
In the electronic component transport device of the present invention, it is preferable that a member having a larger elastic deformation rate or plastic deformation rate than the piston portion and the heat dissipation portion is interposed between the piston portion and the heat dissipation portion.

  Thereby, the collision sound which may arise between a heat radiating part and a piston part, and a heat radiating part, and abrasion of a piston part can be prevented or suppressed.

[Application Example 6]
In the electronic component transport device of the present invention, it is preferable that a plate member is interposed between the piston portion and the heat radiating portion.

  Thereby, the collision sound which may arise between a piston part and a thermal radiation part and abrasion of a thermal radiation part and a piston part can be prevented or suppressed.

[Application Example 7]
In the electronic component transport apparatus according to the present invention, it is preferable that the electronic apparatus carrying device includes a separation drive unit that separates the heat dissipation unit from the heat conduction unit, and the separation drive unit includes an elastic member.
Thereby, a thermal radiation part can be spaced apart from a heat conductive part by simple structure.

[Application Example 8]
In the electronic component transport device of the present invention, it is preferable that a heat insulating member is provided between the elastic member and the heat radiating portion.

  Thereby, it can prevent that the heat from a heat conductive part is transmitted to a thermal radiation part via an elastic member.

[Application Example 9]
In the electronic component transport device of the present invention, the elastic member is a coil spring,
It is preferable that a convex member protruding in a convex shape on the coil spring side is provided between the coil spring and the heat radiating portion.
Thereby, a coil spring can be expanded-contracted stably.

[Application Example 10]
In the electronic component conveying apparatus of the present invention, it is preferable that the convex member has a heat insulating property.

  Thereby, it can prevent that the heat from a heat conductive part is transmitted to a thermal radiation part via an elastic member.

[Application Example 11]
In the electronic component conveying apparatus of the present invention, it is preferable that a convex member protruding in a convex shape on the coil spring side and a heat insulating member are provided between the coil spring and the heat radiating portion.

  Thereby, it can prevent that the heat from a heat conductive part is transmitted to a thermal radiation part via an elastic member. Further, the coil spring can be expanded and contracted stably.

[Application Example 12]
In the electronic component transport device of the present invention, it is preferable that the direction in which the heat radiating portion abuts on the heat conducting portion is a direction in which the heat conducting portion abuts on the electronic component.

  Thereby, since both directions become the same, for example, the configuration of the electronic component transport apparatus can be simplified, and control is also facilitated.

[Application Example 13]
In the electronic component transport device of the present invention, it is preferable that the direction in which the heat radiating portion is separated from the heat conducting portion is opposite to the direction in which the heat conducting portion is brought into contact with the electronic component.

  Thereby, since both directions become the same, for example, the configuration of the electronic component transport apparatus can be simplified, and control is also facilitated.

[Application Example 14]
In the electronic component transport apparatus according to the present invention, it is preferable that the heat dissipating part has a heat dissipating member.
Thereby, heat dissipation with respect to a heat conductive part is easily performed via a heat radiating member.

[Application Example 15]
In the electronic component transport apparatus according to the present invention, it is preferable that the heat dissipating unit includes a heat conducting member having a heat capacity larger than that of the heat dissipating member.

  Thereby, in the state which the heat dissipation part contact | abutted to the heat conductive part, the heat of a heat conductive part can be rapidly transmitted to a heat radiating member via a heat conductive member, and the heat dissipation effect improves.

[Application Example 16]
In the electronic component transport apparatus according to the present invention, the fluid is preferably air.
As a result, it is possible to prevent peripheral devices and the like from being contaminated by the fluid.

[Application Example 17]
In the electronic component transport apparatus according to the present invention, it is preferable that the fluid is sprayed in a state where the heat radiating portion is in contact with or separated from the heat conducting portion.

  Thereby, it is possible to sufficiently ensure the temperature difference between the heat radiating portion and the heat conducting portion, so that heat absorption to the heat conducting portion can be performed more quickly with the heat radiating portion in contact with the heat conducting portion, Increases heat dissipation effect.

[Application Example 18]
In the electronic component transport apparatus according to the present invention, it is preferable that a stroke when the heat dissipating part contacts or separates from the heat conducting part is larger than 0 mm and smaller than 5 mm.

  Thereby, the movement time of a thermal radiation part can be shortened as much as possible, Therefore Rapid heat exchange between a thermal radiation part and a heat conduction part can be performed.

[Application Example 19]
The electronic component inspection apparatus of the present invention is capable of gripping an electronic component and capable of conducting heat, and a heat conducting unit,
A heat dissipating part capable of dissipating heat by passing a fluid;
An inspection unit for inspecting the electronic component,
The heat dissipating part is disposed so as to be able to contact or be separated from the heat conducting part.

  Thereby, temperature control with respect to an electronic component can be performed more correctly, or higher responsiveness of temperature control is possible.

[Application Example 20]
The electronic component pressing device of the present invention is capable of gripping an electronic component and is capable of conducting heat, and a heat conducting portion.
A heat dissipating part capable of dissipating heat by passing a fluid,
The heat dissipating part is disposed so as to be able to contact or be separated from the heat conducting part.

  Thereby, temperature control with respect to an electronic component can be performed more correctly, or higher responsiveness of temperature control is possible.

FIG. 1 is a schematic view showing a first embodiment of the electronic component inspection apparatus of the present invention. FIG. 2 is a plan view showing the operating state of the main part of the electronic component inspection apparatus shown in FIG. FIG. 3 is a schematic exploded perspective view showing the inspection robot of the transport unit of the electronic component inspection apparatus shown in FIG. FIG. 4 is a vertical sectional view showing an operating state of one hand unit of the socket layout kit that can be mounted on the inspection robot shown in FIG. FIG. 5 is a vertical sectional view showing an operating state of one hand unit of the socket layout kit that can be attached to the inspection robot shown in FIG. 6 is an enlarged detailed vertical sectional view showing a state in which the hand unit shown in FIGS. 4 and 5 is holding the IC device. FIG. 7 is a perspective view illustrating a piston portion of the hand unit illustrated in FIGS. 4 and 5. FIG. 8 is a horizontal cross-sectional view showing the heat sink and its surroundings that the hand unit shown in FIGS. 4 and 5 has. FIG. 9 is a plan view showing the positional relationship among the thermocouple, platinum sensor, and IC device that the hand unit shown in FIGS. 4 and 5 has. FIG. 10 is a plan view showing the positional relationship between the first contact member and the second contact member in the contact member of the hand unit shown in FIGS. 4 and 5. FIG. 11 is a vertical longitudinal sectional view showing a state in which the first contact member included in the hand unit shown in FIGS. 4 and 5 is deformed according to the IC device. FIG. 12 is a block diagram showing the relationship of the main parts in the hand unit shown in FIGS. 4 and 5. FIG. 13 is a vertical longitudinal sectional view showing the heat sink and its periphery of one hand unit in the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 14 is a vertical longitudinal sectional view showing a separation drive unit of one hand unit in the electronic component inspection apparatus (third embodiment) of the present invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an electronic component conveying device, an electronic component inspection device, and an electronic component pressing device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic view showing a first embodiment of the electronic component inspection apparatus of the present invention. FIG. 2 is a plan view showing the operating state of the main part of the electronic component inspection apparatus shown in FIG. FIG. 3 is a schematic exploded perspective view showing the inspection robot of the transport unit of the electronic component inspection apparatus shown in FIG. 4 and 5 are vertical cross-sectional views showing the operating state of one hand unit of the socket layout kit that can be mounted on the inspection robot shown in FIG. 6 is an enlarged detailed vertical sectional view showing a state in which the hand unit shown in FIGS. 4 and 5 is holding the IC device. FIG. 7 is a perspective view illustrating a piston portion of the hand unit illustrated in FIGS. 4 and 5. FIG. 8 is a horizontal cross-sectional view showing the heat sink and its surroundings that the hand unit shown in FIGS. 4 and 5 has. FIG. 9 is a plan view showing the positional relationship among the thermocouple, platinum sensor, and IC device that the hand unit shown in FIGS. 4 and 5 has. FIG. 10 is a plan view showing the positional relationship between the first contact member and the second contact member in the contact member of the hand unit shown in FIGS. 4 and 5. FIG. 11 is a vertical longitudinal sectional view showing a state in which the first contact member included in the hand unit shown in FIGS. 4 and 5 is deformed according to the IC device. FIG. 12 is a block diagram showing the relationship of the main parts in the hand unit shown in FIGS. 4 and 5.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. 3 to 7 and 11 (the same applies to FIGS. 13 and 14), the upper side in the Z-axis direction is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball Grid Array) package and an LGA (Land Grid Array) package, an LCD (Liquid Crystal Display), and an OLED (Organic Electroluminescence Display). Electronic devices including display devices such as electronic paper, CIS (CMOS Image Sensor), CCD (Charge Coupled Device), various sensors such as acceleration sensors, gyro sensors, pressure sensors, and various vibrators including crystal vibrators This is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of parts. In the following, for convenience of explanation, a case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 9”. In this embodiment, the IC device 9 includes a plate-like circuit unit 91 having terminals and a plate-like semiconductor unit (wafer unit) 92 mounted on the center of the circuit unit 91. Is given as an example. The semiconductor unit 92 has a smaller area than the circuit unit 91 in plan view of the IC device 9 (see FIGS. 9 and 10).

  As shown in FIG. 1, the inspection apparatus 1 includes a supply unit 2, a supply side arrangement unit 3, a transport unit 4, an inspection unit 5, a collection side arrangement unit 6, a collection unit 7, and control of these units. And a control unit 8 for performing The inspection apparatus 1 includes a supply unit 2, a supply side arrangement unit 3, a conveyance unit 4, an inspection unit 5, a base 11 on which a collection side arrangement unit 6 and a collection unit 7 are arranged, a supply side arrangement unit 3, and a conveyance unit 4. And a cover 12 that covers the base 11 so as to accommodate the inspection unit 5 and the collection side arrangement unit 6. The base surface 111 which is the upper surface of the base 11 is substantially horizontal, and the constituent members of the supply side array unit 3, the transport unit 4, the inspection unit 5, and the collection side array unit 6 are arranged on the base surface 111. ing. In addition, the inspection apparatus 1 may have a heater, a chamber, or the like for heating the IC device 9 as necessary.

  In such an inspection apparatus 1, the supply unit 2 supplies the IC device 9 to the supply side arrangement unit 3, the supply side arrangement unit 3 arranges the supplied IC device 9, and the arranged IC device 9 is transferred to the conveyance unit 4. Is transported to the inspection unit 5, the inspection unit 5 inspects the IC device 9 that has been transported, and the transport unit 4 transports / arranges the IC device 9 that has been inspected to the collection side array unit 6. The collection unit 7 collects the arranged IC devices 9. According to such an inspection apparatus 1, supply, inspection, and collection of the IC device 9 can be automatically performed. The inspection apparatus 1 is transported by a configuration excluding the inspection unit 5, that is, by a part of the supply unit 2, the supply side arrangement unit 3, the conveyance unit 4, the collection side arrangement unit 6, the collection unit 7, and the control unit 8. An apparatus (electronic component conveying apparatus) 10 is configured. The transport device 10 transports the IC device 9 and the like.

Hereinafter, configurations of the transport unit 4 and the inspection unit 5 will be described.
≪Transport section≫
As shown in FIG. 2, the transport unit 4 transports the IC device 9 disposed on the mounting stage 341 of the supply side array unit 3 to the inspection unit 5 and finishes the inspection in the inspection unit 5. 9 is a unit that transports 9 to the collection side arrangement unit 6. Such a transport unit 4 includes a shuttle 41, a supply robot 42, an inspection robot 43, and a collection robot 44.

-Shuttle-
The shuttle 41 transports the IC device 9 on the mounting stage 341 to the vicinity of the inspection unit 5, and further transports the inspected IC device 9 inspected by the inspection unit 5 to the vicinity of the collection side array unit 6. It is a shuttle to do. In such a shuttle 41, four pockets 411 for accommodating (arranging) the IC device 9 are formed side by side in the X direction. The shuttle 41 is guided by a linear motion guide and can be reciprocated in the X direction by a drive source such as a linear motor.

-Supply robot-
The supply robot 42 is a robot that conveys the IC device 9 disposed on the placement stage 341 to the shuttle 41. Such a supply robot 42 is supported by the base 11, a support frame 421 supported by the support frame 421, a movable frame 422 that can reciprocate in the Y direction with respect to the support frame 421, and a movable frame 422. And four hand units (gripping robots) 423. Each hand unit 423 includes an elevating mechanism and a suction nozzle, and can grip the IC device 9 by suction.

-Inspection robot-
The inspection robot 43 is a robot that transports the IC device 9 accommodated in the shuttle 41 to the inspection unit 5 and also transports the IC device 9 that has been inspected from the inspection unit 5 to the shuttle 41. The inspection robot 43 includes a support frame 431 supported by the base 11, a moving frame (pressing member arrangement member mounting member) 432 supported by the support frame 431 and capable of reciprocating in the Y direction with respect to the support frame 431, and moving. A socket layout kit 45 mounted (supported) on the frame 432. The socket layout kit 45 has a plurality of hand units 46 as pressing members capable of pressing the IC device 9. The inspection robot 43 can press the IC device 9 against the inspection unit 5 that is a socket via each hand unit 46 during the inspection. Thereby, a predetermined inspection pressure can be applied to the IC device 9. The configuration of the socket layout kit 45 will be described later.

-Recovery robot-
The collection robot 44 is a robot that conveys the IC device 9 that has been inspected by the inspection unit 5 to the collection side arrangement unit 6. Such a collection robot 44 is supported by the support frame 441 supported by the base 11, the moving frame 442 supported by the support frame 441 and reciprocally movable in the Y direction with respect to the support frame 441, and the moving frame 442. And four hand units (gripping robots) 443. Each hand unit 443 includes an elevating mechanism and a suction nozzle, and can grip the IC device 9 by suction.

  Such a transport unit 4 transports the IC device 9 as follows. First, the shuttle 41 moves to the left in the figure, and the supply robot 42 transports the IC device 9 on the placement stage 341 to the shuttle 41 (STEP 1). Next, the shuttle 41 moves to the center, and the inspection robot 43 transports the IC device 9 on the shuttle 41 to the inspection unit 5 (STEP 2). Next, the inspection robot 43 transports the IC device 9 that has been inspected by the inspection unit 5 to the shuttle 41 (STEP 3). Next, the shuttle 41 moves to the right side in the figure, and the recovery robot 44 transports the inspected IC device 9 on the shuttle 41 to the recovery side arrangement unit 6 (STEP 4). By repeating such STEP 1 to STEP 4, the IC device 9 can be transported to the collection side array unit 6 via the inspection unit 5.

  The configuration of the transport unit 4 has been described above. As the configuration of the transport unit 4, the IC device 9 on the mounting stage 341 is transported to the inspection unit 5, and the IC device 9 that has been inspected is collected on the collection side array unit 6. If it can be conveyed to, it will not be specifically limited. For example, the shuttle 41 is omitted, and any one of the supply robot 42, the inspection robot 43, and the collection robot 44 is used to transport the placement stage 341 to the inspection unit 5, and from the inspection unit 5 to the collection side arrangement unit 6. You may carry to.

≪Inspection Department≫
The inspection unit 5 is a unit that inspects and tests the electrical characteristics of the IC device 9. As shown in FIG. 2, the inspection unit 5 includes eight holding units 51 in which the IC devices 9 are arranged. Each of the holding portions 51 is provided with a plurality of probe pins (electrode terminals) (not shown) that are electrically connected to the terminals (electrode terminals) of the IC device 9. Each probe pin is electrically connected to the control unit 8. When the IC device 9 is inspected, one IC device 9 is arranged (held) in one holding unit 51. Each terminal of the IC device 9 disposed in the holding unit 51 is pressed against each probe pin with a predetermined inspection pressure by pressing the hand unit 46 of the inspection robot 43. Thereby, each terminal of the IC device 9 and each probe pin are electrically connected (contacted), and the IC device 9 is inspected via the probe pin. The inspection of the IC device 9 is performed based on a program stored in the control unit 8.

≪Control part≫
The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit, for example, inspects the electrical characteristics of the IC device 9 disposed in the inspection unit 5 based on a program stored in a memory (not shown). The drive control unit controls the driving of each of the supply unit 2, the supply side arrangement unit 3, the conveyance unit 4, the inspection unit 5, the collection side arrangement unit 6, and the collection unit 7, for example, conveyance of the IC device 9 and the like. I do.

≪Socket layout kit≫
As described above, the inspection robot 43 has the socket layout kit 45 attached to the moving frame 432 that can reciprocate in the Y direction. The socket layout kit 45 is an electronic component pressing device for pressing the IC device 9 against the inspection unit 5.

  As shown in FIG. 3, the socket layout kit 45 has the same number of holding units 51 of the inspection unit 5 as described above, that is, eight hand units 46 and a base (pressing member) on which these hand units 46 are arranged and supported. Arrangement member) 47. As a result, the eight IC devices 9 can be collectively pressed against the inspection unit 5, so that the inspection efficiency can be improved.

  The socket layout kit 45 moves when the IC device 9 is pressed in the Z-axis direction, and when viewed in plan from that direction, the longitudinal direction of the base 47 is the X direction, and the width direction orthogonal to the longitudinal direction is the Y direction. Attached to the frame 432 for use. Here, the method of mounting the socket layout kit 45 on the moving frame 432 is not particularly limited, and examples thereof include a screwing method. When the screwing method is used, the socket layout kit 45 is detachably attached to the moving frame 432. This facilitates replacement of the socket layout kit 45.

  By the way, the socket layout kit 45 is replaced with one having a different number or arrangement of hand units 46 according to, for example, the type and size of the IC device 9 and the type of inspection.

  In the configuration shown in FIG. 3, the socket layout kit 45 includes eight hand units 46 arranged in the same matrix as the holding unit 51 of the inspection unit 5, that is, two rows in the Y direction and four columns in the X direction. Are arranged in a matrix. Among the two rows and four columns, there is also a socket layout kit 45 in which the pitch between the hand units 46 adjacent in the X direction, that is, the distance between the centers is different.

  In addition to the two rows and four columns, the socket layout kit 45 includes, for example, four hand units 46 arranged in a matrix of two rows in the X direction and two columns in the Y direction, Hand units 46 are arranged in a matrix of 2 rows in the Y direction and 3 columns in the X direction, and 12 hand units 46 are arranged in a matrix of 2 rows in the Y direction and 6 columns in the X direction. 16 hand units 46 arranged in a matrix of 2 rows in the Y direction and 8 columns in the X direction, 4 hand units 46 in a matrix of 1 row in the Y direction and 4 columns in the X direction And eight hand units 46 arranged in a matrix of one row in the Y direction and eight columns in the X direction.

  As shown in FIG. 3, the base 47 is attached to the moving frame 432 from the lower side among the members constituting the socket layout kit 45.

  The base 47 is composed of a horizontally long plate member along the X direction, and has a rectangular shape in plan view, and is used in common regardless of the number and arrangement of the hand units 46. As a result, parts can be shared, leading to cost reduction in manufacturing the socket layout kit 45.

  Note that the base 47 is allowed to be disposed with respect to the base 47 in a plan view of the base 47 when the socket layout kit 45 is designed, regardless of the number and arrangement of the hand units 46. The first area (pressing member arrangement area) A1, which is the maximum area, is set in advance, that is, determined (see FIG. 3). In FIG. 3, the first area A1 is hatched. And in this 1st field A1, the arrangement number and arrangement mode of hand unit 46 can be chosen freely, and, therefore, the freedom degree of design of socket layout kit 45 improves.

  On one edge portion 473 along the Y direction of the base 47 (right side in FIG. 3), one deficient portion 474 is arranged at equal intervals. The missing portion 474 is used as a part of a wiring route of a cable connected to each hand unit 46, for example.

  The maximum length (full length) Lmax of the base 47 is preferably not less than 100 mm and not more than 400 mm, and more preferably not less than 200 mm and not more than 300 mm. The maximum width Wmax of the base 47 is preferably 50 mm or more and 200 mm or less, and more preferably 100 mm or more and 200 mm or less. The maximum thickness Tmax of the base 47 is preferably 4 mm or more and 10 mm or less, and more preferably 6 mm or more and 8 mm or less.

  The constituent material of the base 47 is not particularly limited, and for example, various metal materials such as aluminum and an aluminum alloy can be used.

  As shown in FIGS. 4 and 5, the hand unit 46 includes a connecting structure (connecting portion) 20 to which the hand unit 46 is connected to the base 47, and the connecting structure on the lower side of the connecting structure 20. 20 and a heat conduction structure (heat conduction part) 30 supported by 20, and a heat radiation structure (heat radiation part) 40 movable in the vertical direction between the connection structure 20 and the heat conduction structure 30. Yes. 4 and 5, one hand unit 46 is representatively drawn.

  The connection structure 20 includes a first fluid device 201, a second fluid device 202 positioned below the first fluid device 201, and an intermediate member positioned between the first fluid device 201 and the second fluid device 202. 203.

  The first fluid device 201 is a device that bears pressing and separation of the IC device 9 with respect to the inspection unit 5. The first fluid device 201 includes a cylinder part 201a, a piston part 201b, and a diaphragm 201c.

  The cylinder part 201a has a hollow part 201d in which the diaphragm 201c is accommodated, and a flow path 201e that communicates with the hollow part 201d and through which a working fluid 209a that deforms the diaphragm 201c passes.

  The piston part 201b protrudes downward from the hollow part 201d of the cylinder part 201a, and is connected to the cylinder part 201a via a diaphragm 201c.

  When the working fluid 209a from the pump (not shown) flows into the hollow portion 201d via the flow path 201e and is supplied, the pressure in the hollow portion 201d rises and the diaphragm 201c is deformed. Thereby, the piston part 201b and the member located below the piston part 201b, that is, the intermediate member 203, the second fluid device 202, the heat radiation structure 40, the heat conduction structure 30, and the like are collectively lowered. The IC device 9 held by the heat conducting structure 30 can be pressed against the inspection unit 5. In FIGS. 4 and 5, the piston portion 201 b is pushed downward.

  Further, from this state, when the working fluid 209a flows out from the hollow portion 201d through the flow path 201e and is discharged, the pressure in the hollow portion 201d decreases, and the diaphragm 201c is deformed in the opposite direction. As a result, the piston part 201b and the member located below the piston part 201b can be collectively pulled up, and thus the IC device 9 held by the heat conducting structure 30 can be removed from the inspection part 5. Can be separated.

  The second fluid device 202 is a device that functions as an abutment drive unit that abuts the heat dissipation structure 40 on the heat conduction structure 30. Since the contact drive unit is configured by a fluid device, for example, compared to a case where the contact drive unit is configured by an electrical device such as a motor, power consumption can be suppressed, Wiring etc. can also be simplified. In addition, it contributes to the downsizing of the contact drive unit, that is, the space saving. As a result, the hand unit 46 itself is also small.

  As shown in FIGS. 4 and 5, the second fluid device 202 includes (includes) a cylinder portion 204, a piston portion 205, and a gasket portion 206.

  The cylinder part 204 has a flat shape, and includes a hollow part 204a in which the piston part 205 slides, and a flow path 204b that communicates with the hollow part 204a and through which the working fluid 209b that slides the piston part 205 passes. Yes. Thereby, the 2nd fluid apparatus 202 becomes a thin thing, Therefore, it contributes to size reduction of the hand unit 46. FIG.

  The hollow portion 204 a is open to the lower surface of the cylinder portion 204. Thereby, the piston part 205 can protrude downward. With this protrusion, as shown in FIG. 5, the heat dissipation structure 40 can be pushed down and brought into contact with the heat conduction structure 30.

  The flow path 204 b is open to the upper surface of the cylinder portion 204 and communicates with the relay flow path 203 a of the intermediate member 203. Note that the flow path 204b is provided with a sealing member (packing) 204c that maintains airtightness with the relay flow path 203a.

  As shown in FIG. 7, the piston part 205 is comprised with the member which makes | forms disk shape. A reduced diameter portion 205 a whose outer diameter is reduced is formed on the outer peripheral portion of the piston portion 205. A ring-shaped gasket portion 206 is fitted into the reduced diameter portion 205a (see FIGS. 4 and 5). Thereby, the piston part 205 can slide with the gasket part 206, and the airtightness in the hollow part 204a can be maintained regardless of sliding and stopping.

  At the center of the upper surface of the piston part 205, two protruding parts 205 b that protrude upward and are spaced apart from each other in the radial direction of the piston part 205 are formed. The flow path 204b is open facing the two protrusions 205b. As a result, as shown in FIG. 7, the working fluid 209b that has flowed in through the flow path 204b can sequentially pass between the two protrusions 205b to the outer peripheral side of each protrusion 205b. By such a flow of the working fluid 209b, the upper surface of the piston portion 205 can be pressed as uniformly as possible, that is, without excess or deficiency, and thus the piston portion 205 can be slid downward and easily protruded. be able to.

  Further, the relay flow path 203a of the intermediate member 203 is opposite to the flow path 204b of the cylinder part 204, and the communication hole 477 (see FIG. 3) of the base 47 and the frame side communication hole (mounting member side communication) of the moving frame 432 are provided. Hole) 433 (see FIG. 3) and connected to pump 207. Thereby, the working fluid 209b can be supplied toward the piston part 205 side.

  As shown in FIGS. 4 and 5, a solenoid valve 208 is installed between the pump 207 and the communication hole 477 of the base 47. Thereby, supply of the working fluid 209b and supply stop of the working fluid 209b can be switched. In the state where supply of the working fluid 209b is stopped, the hollow portion 204a of the cylinder portion 204 is released into the atmosphere via the solenoid valve 208. As a result, the heat dissipation structure 40 is released from the pressing force of the piston portion 205, and the heat dissipation structure 40 can be separated from the heat transfer structure 30 by an urging force of a compression coil spring 305 described later.

  As described above, the base 47 is provided with the communication hole 477. In the present embodiment, as shown in FIG. 3, eight communication holes 477 are provided. These communication holes 477 are arranged in pairs at the four corners of the base 47, that is, in the vicinity of the four corners 478. This arrangement area is a second area (communication hole arrangement area) A2 different from the first area A1 in plan view of the base 47. Thus, the base 47 is divided into the first area A1 and the second area A2. In the first region A1, since there are structures such as a heater, a vacuum chuck, and a compliance mechanism in the vicinity of the hand unit 46 itself, the formation of the communication hole 477 can be difficult. However, the formation of the communication hole 477 can be easily ensured by setting the second region A2.

  In addition, since each communication hole 477 is disposed in the vicinity of the corner portion 478 of the base 47, that is, in the second region A 2 that is as far as possible in the base 47, when the hand unit 46 is attached to or detached from the base 47, piping is performed. It is possible to prevent the work of redoing from becoming complicated.

  In each second region A2, the two communication holes 477 are arranged along the longitudinal direction of the base 47, that is, the X direction. Thereby, the first region A1 can be secured as wide as possible, and thus the degree of freedom in designing the socket layout kit 45 by selecting the number and arrangement of the hand units 46 is further improved.

With the arrangement as described above, four communication holes 477 in the base 47 are arranged in the X direction and two in the Y direction. The center distance _{L 1} of the nearest communication hole 477 between which is positioned in the X direction is preferably from 240 mm ± 20 mm, and more preferably 240 mm ± 5 mm (see FIG. 3). Center distance _{L 2} of the farthest communication hole 477 between which is positioned in the X direction is preferably from 260 mm ± 20 mm, and more preferably 260 mm ± 5 mm (see FIG. 3). The center-to-center distance W ₁ between the communication holes 477 positioned in the Y direction is preferably 93.5 mm ± 20 mm, and more preferably 93.5 mm ± 5 mm. With such a numerical range, the base 47 becomes highly versatile regardless of the number and arrangement of the hand units 46.

  In addition, the base 47 is provided with a sealing member (packing) 49 that maintains airtightness between the communication hole 477 and the frame side communication hole 433 in a mounted state where the socket layout kit 45 is mounted on the moving frame 432. Yes. Each sealing member 49 has a ring shape in a plan view of the base 47 and is disposed so as to surround the corresponding communication hole 477, that is, concentrically with the corresponding communication hole 477. Thereby, it is possible to prevent the refrigerant from leaking from between the socket layout kit 45 and the moving frame 432.

  The constituent material of the sealing member 49 is not particularly limited, and various rubber materials such as silicone rubber can be used.

  As shown in FIGS. 4 and 5, the heat conduction structure 30 is connected to the lower side of the connection structure 20 via a guide member (support part) 50 described later. The heat conducting structure 30 can grip the IC device 9 and can conduct heat to the IC device 9 in the gripped state.

  As shown in FIGS. 4 to 6, the heat conducting structure 30 includes a heat conducting block (heat conducting member) 301, an abutting member 302 that can abut on the IC device 9, and the abutting member 302 as a heat conducting block. And a support member 303 that supports the substrate 301.

  The heat conduction block 301 is made of a metal material such as aluminum, for example, and includes a heater 304 therein. When the heater 304 generates heat, the heat can be transmitted to the IC device 9 in contact with the contact member 302 via the support member 303. Thereby, the IC device 9 can be heated to a predetermined temperature suitable for inspection.

  As the heater 304, for example, a rod-shaped ceramic heater can be used.

  In addition, a plurality of compression coil springs 305, which are elastic members, are installed between the heat conduction block 301 and the heat dissipation structure 40 in a compressed state. These compression coil springs 305 are preferably arranged at equal intervals around the center of the heat conduction block 301 in a plan view from the direction in which the IC device 9 is pressed.

  On the upper surface of the heat conduction block 301, a lower end portion of each compression coil spring 305 is inserted and a spring seat 301a to be supported is recessed. On the other hand, the upper end portion of the compression coil spring 305 is inserted into the lower surface of the heat conducting member 16 of the heat dissipation structure 40 so as to face each spring seat 301a, and the supported spring seat 161 is recessed. ing. By providing the spring seats 301a and 161, the compression coil spring 305 can stably expand and contract. When the compression coil spring 305 is extended, the heat dissipation structure 40 can be separated from the heat conduction structure 30 by the biasing force at that time. Thus, the compression coil spring 305 functions as a separation drive unit that separates the heat dissipation structure 40 from the heat conduction structure 30.

  The support member 303 has an inner cylinder part 303a and an outer cylinder part 303b that protrude downward and are arranged concentrically.

  A suction member 306 capable of sucking the IC device 9 is attached to the inner cylinder portion 303a by fitting. The adsorbing member 306 is a member having a bellows shape, which is formed of a cylindrical body having elasticity.

  The support member 303 is provided with a suction channel 303c that sucks the inside of the adsorption member 306, and the heat conduction block 301 is provided with a relay channel 301b that communicates with the suction channel 303c. Further, the relay flow path 301b is connected to the ejector 307. When the ejector 307 is operated, the inside of the suction member 306 is sucked to be in a vacuum state, so that the IC device 9 can be sucked and held. When the vacuum break is performed by the ejector 307, the suction to the IC device 9 is released. The suction flow path 303c is provided with a sealing member (packing) 303d that maintains airtightness with the relay flow path 301b.

  As shown in FIG. 6, the contact member 302 includes a first contact member 13 that contacts the upper surface 921 of the semiconductor portion 92 of the IC device 9 and a second contact that contacts the upper surface 911 of the circuit portion 91 of the IC device 9. A contact member 14.

  The first contact member 13 is made of a plastically deformable metal foil, and is in contact with the lower end of the outer cylinder portion 303 b of the support member 303. Accordingly, the first contact member 13 can face the upper surface 921 of the semiconductor portion 92 of the IC device 9 and can contact the upper surface 921.

  Moreover, as shown to Fig.11 (a), the 1st contact member 13 is formed with the micro unevenness | corrugation previously, ie, has comprised the waveform. On the other hand, fine irregularities that may inevitably occur in manufacturing are also formed on the upper surface 921 of the semiconductor portion 92. This uneven shape is naturally different from the uneven shape of the first contact member 13.

  Then, as shown in FIG. 11B from the state shown in FIG. 11A, the first contact member 13 and the semiconductor portion of the IC device 9 (hereinafter, this IC device 9 is referred to as “IC device 9A”). When the upper surface 921 of 92 is brought into contact, the first contact member 13 can be easily plastically deformed so as to follow the uneven shape of the upper surface 921 due to its unevenness. The contact area increases. Thereafter, as shown in FIG. 11C, the first contact member 13 and the IC device 9A are separated. At this time, the first contact member 13 is separated in a state of being plastically deformed while keeping the uneven shape of the upper surface 921 of the IC device 9A. Next, as the IC device 9A is transported, as shown in FIG. 11 (d), the first abutting member 13 this time is different from the IC device 9 (hereinafter referred to as “IC device 9B”). ”). When the first contact member 13 and the upper surface 921 of the semiconductor portion 92 of the IC device 9B are brought into contact with each other as shown in FIG. The plastic device can be easily plastically deformed so as to follow the uneven shape of the upper surface 921 of the IC device 9B, and thus the contact area with the upper surface 921 is increased.

  Thus, the first contact member 13 can sufficiently contact the upper surface 921 regardless of the uneven shape of the upper surface 921 of the semiconductor portion 92 of the IC device 9. Thereby, the heat exchange between the first contact member 13 and the IC device 9 is performed without excess or deficiency, and thus temperature control (temperature adjustment) such as heating for the IC device 9 can be performed more accurately. In addition, heat exchange is performed quickly, so that the temperature control can be made more responsive.

  The metal material constituting the first contact member 13 is not particularly limited, and for example, a material containing indium is preferably used. Thereby, the 1st contact member 13 becomes easy to carry out plastic deformation. In addition, even if the plastic deformation is repeated, the first contact member 13 itself has durability enough to prevent the first contact member 13 from being damaged.

  As described above, the first contact member 13 is formed with minute irregularities in advance. The method for forming the unevenness is not particularly limited, and, for example, a method by embossing is used.

  The thickness of the first contact member 13 is preferably 0.1 mm or more and 0.5 mm or less, for example, and more preferably 0.1 mm or more and 0.2 mm or less. Further, when the thickness of the first abutting member 13 is 0.2 mm, the difference in unevenness of the first abutting member 13, that is, the difference between the highest point of the convex portion and the lowest point of the concave portion is, for example, , About 0.3 mm is preferable.

  Moreover, as shown in FIG. 6, the 1st contact member 13 is mounted | worn with the outer cylinder part 303b by bending the edge part 131 to the outer peripheral side of the outer cylinder part 303b, and carrying out plastic deformation.

  As shown in FIG. 10, a through hole 132 is formed at the center of the first contact member 13. In a state before the IC device 9 is sucked, the suction member 306 may protrude from the first abutting member 13 in the direction in which the IC device 9 is pressed, that is, downward, through the through hole 132. (See FIGS. 4 and 5). As a result, the IC device 9 is first sucked and pulled toward the hand unit 46, and thereafter, the IC device 9 and the first contact member 13 can be stably brought into contact with each other.

  As shown in FIGS. 6 and 10, the first contact member 13 is entirely surrounded by a cylindrical second contact member 14, that is, disposed inside the second contact member 14. Has been. As a result, the edge 131 of the first contact member 13 is sandwiched between the outer peripheral portion of the outer cylinder portion 303 b of the support member 303 and the inner peripheral portion of the second contact member 14. Therefore, detachment of the first contact member 13 is prevented. Further, the first contact member 13 made of metal foil can be protected by the second contact member 14.

  As described above, the second contact member 14 is a member that contacts the upper surface 911 of the circuit unit 91 of the IC device 9. The second contact member 14 has a cylindrical shape, and has a flange portion 141 whose outer diameter is increased at the base end portion. The flange portion 141 is supported and fixed to the support member 303 by a method such as screwing.

  As shown in FIG. 6, the second contact member 14 has a protruding portion 142 that protrudes from the first contact member 13 in the direction in which the IC device 9 is pressed. The IC device 9 has a portion having a thickness of the circuit portion 91 alone and a portion having a total thickness of two portions of the circuit portion 91 and the semiconductor portion 92. For this reason, since the 1st contact member 13 and the 2nd contact member 14 cannot contact on the same plane with respect to IC device 9, projection part 142 projected rather than the 1st contact member 13 is It is in contact with the circuit portion 91.

  The protrusion amount h of the protrusion 142 can be adjusted by using a shim (SIM) 302a formed of a plate member, that is, can be adjusted by a so-called “shim tone”. Thereby, the protrusion amount h can be adjusted according to the thickness of the semiconductor portion 92, and thus the protrusion 142 can contact the circuit portion 91 regardless of the thickness of the semiconductor portion 92.

  For the shim tone, a plurality of types of shims 302a having different thicknesses are prepared, and one that can obtain a desired protrusion amount h is appropriately selected from these. Then, the selected shim 302a is inserted between the flange portion 141 of the second abutting member 14 and the flange portion 303e whose outer diameter of the support member 303 is increased. In the configuration shown in FIG. 6, as an example, two shims 302a having different thicknesses are inserted.

  The second contact member 14 has a length in the Z direction, that is, a thickness that is greater than the thickness of the first contact member 13. Thus, for example, when the inspection of the IC device 9 is performed by the inspection unit 5, the circuit unit 91 of the IC device 9 is sufficiently pressed against the inspection unit 5 and the circuit unit 91 and the inspection unit 5 are electrically connected. Therefore, an accurate inspection can be performed.

  In addition, since the second contact member 14 contacts the circuit portion 91, the second contact member 14 is preferably made of an insulating material, that is, a resin material. It does not specifically limit as a resin material, For example, a polyamide imide and polyetheretherketone can be used. By using such a material as a constituent material, a short circuit between the second contact member 14 and the circuit portion 91 can be prevented.

  As described above, in the inspection of the IC device 9, the IC device 9 is heated by the heater 304. In this case, it is necessary to adjust the IC device 9 to a temperature suitable for inspection. As shown in FIGS. 4 and 5, the heat conducting structure 30 is provided with a temperature adjusting unit 308 for adjusting the temperature.

  The temperature adjustment unit 308 includes a thermocouple 308a as a first temperature detection unit and a platinum sensor (Pt sensor) 308b as a second temperature detection unit. As shown in FIG. 12, the thermocouple 308a and the platinum sensor 308b are electrically connected to the control unit 8, respectively.

  As shown in FIG. 6, the thermocouple 308 a is embedded in the outer cylinder portion 303 b of the support member 303 and is arranged close to the first contact member 13 side. This arrangement position is closer to the IC device 9 than the arrangement position of the platinum sensor 308b. Thereby, the thermocouple 308a can detect the temperature of the outer cylinder portion 303b that can approximate the temperature of the IC device 9 at a position as close as possible to the IC device 9. Therefore, the temperature control for the IC device 9 can be performed more accurately, and the temperature control can be made more responsive.

  The thermocouple 308a is obtained by joining two different kinds of metals different from the metal materials constituting the support member 303 and the first abutting member 13, and generates heat due to a temperature difference between the two contacts of the different kinds of metals. It is a temperature sensor that uses the phenomenon of power generation (Seebeck effect). Since the thermocouple 308a having such a configuration is much smaller than the platinum sensor 308b, the thermocouple 308a can be easily disposed at a desired location regardless of the location.

  On the other hand, the platinum sensor 308 b is embedded in the heat conduction block 301. The platinum sensor 308b is generally less deteriorated with time than the thermocouple 308a, and thus can detect temperature stably over a long period of time.

  As shown in FIG. 9, the position of the platinum sensor 308b is a plan view from the pressing direction of the IC device 9, and the position of the center 93 of the IC device 9 is between the position of the thermocouple 308a and the position of the platinum sensor 308b. It is preferable that the setting is as follows. Thereby, the temperature detection range for the IC device 9 can be ensured as wide as possible.

  And the control part 8 can judge whether the detected value detected by the thermocouple 308a can be used based on the detected value detected by the platinum sensor 308b (refer FIG. 12). As described above, the platinum sensor 308b is generally less deteriorated with time than the thermocouple 308a, and thus can detect temperature stably over a long period of time. Therefore, when the inspection device 1 is continuously used for a long time and the temperature of the IC device 9 at that time is, for example, 50 degrees, even if the platinum sensor 308b detects 52 degrees, the thermocouple 308a detects 25 degrees. May be. Thus, when there is a deviation in the detected value and the deviation exceeds a threshold value (for example, 5 degrees), the thermocouple 308a is considered to be deteriorated, and prompt replacement of the thermocouple 308a can be promoted. As a result, the detected temperature is guaranteed, and a decrease in the inspection accuracy of the IC device 9 can be prevented. In addition, an inspection for preventing such a decrease in inspection accuracy can be performed regularly (for example, once every six months).

  As another application of the platinum sensor 308b, the control unit 8 corrects the detection value detected by the thermocouple 308a based on the detection value detected by the thermocouple 308a and the detection value detected by the platinum sensor 308b. (See FIG. 12). For example, when there is a discrepancy between the detection value at the thermocouple 308a and the detection value at the platinum sensor 308b as described above, a correction that offsets the discrepancy is made to the detection value at the thermocouple 308a. Can be done. This also can prevent a decrease in the inspection accuracy of the IC device 9.

  The temperature adjustment unit 308 includes the thermocouple 308a and the platinum sensor 308b in the present embodiment, but is not limited to this, and the platinum sensor 308b may be omitted.

  Then, after the IC device 9 is heated, the IC device 9 needs to be cooled. Therefore, a heat radiation structure 40 that promotes heat radiation to the heat conduction structure 30 is disposed between the heat conduction structure 30 and the connection structure 20 described above.

  As shown in FIGS. 4 and 5, the heat dissipation structure 40 includes a heat sink 15 that is a heat dissipation member, and a heat conducting member 16 that is disposed in contact with the lower portion of the heat sink 15. The heat dissipating structure 40 has a first position (see FIG. 4) that is in a state of being separated from the heat conducting structure 30 and a second position that is in a state of being in contact with the heat conducting structure 30 (see FIG. 5). Can be moved up and down.

  In the hand unit 46, the above-described second fluid device 202 is responsible for lowering the heat dissipation structure 40 from the first position to the second position. On the other hand, the above-described compression coil spring 305 is responsible for raising the heat dissipation structure 40 from the second position to the first position.

  Since the heat dissipating structure 40 is separated from the heat conducting structure 30 at the first position, heat conduction from the heat conducting structure 30 in which the heater 304 is operating is blocked (or suppressed). Yes. Thereby, the temperature difference between the heat dissipation structure 40 and the heat conduction structure 30 is larger than, for example, the temperature difference when the heat dissipation structure 40 and the heat conduction structure 30 are always in contact.

  Thereafter, when the heat dissipation structure 40 moves from the first position to the second position, the heat dissipation structure 40 and the heat conduction structure 30 come into contact with each other. Thereby, the heat of the heat conducting structure 30 is steeply taken away by the heat radiating structure 40, and heat radiation to the heat conducting structure 30 is promoted. As a result, the IC device 9 is cooled.

  When the IC device 9 is heated, the IC device 9 can be quickly heated by moving the heat dissipation structure 40 to the first position again.

  As described above, since the heat dissipation structure 40 can be brought into contact with or separated from the heat conduction structure 30, the temperature control for the IC device 9 can be performed more accurately. In addition, since the temperature difference between the heat dissipation structure 40 and the heat conduction structure 30 can be sufficiently secured in advance at the first position before the heat dissipation structure 40 moves to the second position, The endothermic heat absorption structure 30 can be quickly absorbed at the position. Thereby, higher response of temperature control can be achieved.

  Whether the heat dissipating structure 40 is positioned at the first position or the second position is determined based on the detection results of the thermocouple 308a and the platinum sensor 308b by the control unit 8 using the solenoid valve 208. This is performed by controlling the operation of (see FIG. 12).

  Further, the stroke S when the heat dissipation structure 40 abuts or separates from the heat conduction structure 30, that is, the moving distance that the heat dissipation structure 40 moves between the first position and the second position is: It is preferably larger than 0 mm and smaller than 5 mm, more preferably 0.2 mm or more and 1 mm or less. Thereby, the movement time of the heat radiating structure 40 can be shortened as much as possible. Therefore, rapid heat exchange between the heat radiating structure 40 and the heat conducting structure 30 can be performed.

  The heat sink 15 included in the heat dissipation structure 40 includes a base portion 151 and a large number of fins 152 that integrally protrude from the base portion 151 upward. In addition, the multiple fins 152 are arranged at intervals. The heat sink 15 is made of a metal material such as aluminum or stainless steel. Thereby, heat dissipation to the heat conduction structure 30 is easily performed via the heat sink 15 in a state where the heat dissipation structure 40 is located at the second position.

  In the hand unit 46, the heat radiating structure 40 is located at the first position in at least one of the first position and the second position, and the heat sink 15 is connected to the heat sink 15 from the numerous outlets 481 of the cooling structure 48. The refrigerant is sprayed toward the head (see FIG. 4). Thereby, the refrigerant can pass between the fins 152, and the heat dissipation in the heat sink 15 is further promoted. Therefore, the temperature difference between the heat dissipation structure 40 and the heat conduction structure 30 can be further sufficiently ensured, and heat absorption to the heat conduction structure 30 can be performed more quickly at the second position.

  The cooling structure 48 is arranged so that the refrigerant is ejected from the center in the width direction of the base 47, that is, from the inside to the outside (in the configuration shown in FIG. 4, from the back side to the front side). It is preferable. Thereby, it is possible to prevent the refrigerant used for cooling the IC device 9 held by one hand unit 46 from blowing off the IC device 9 held by another hand unit 46.

  In addition, the cooling structure 48 of the eight hand units 46 has a refrigerant communication hole formed in one second region A2 in the base 47 via a tube (not shown) branched into eight. 479 (see FIG. 3). Then, in a state where the socket layout kit 45 is mounted on the moving frame 432, the refrigerant communication hole 479 communicates with the refrigerant frame side communication hole 434 formed in the moving frame 432. The refrigerant frame side communication hole 434 is connected to a refrigerant supply source (not shown) that supplies the refrigerant on the upstream side. Thus, the cooling structure 48 can receive the supply of the refrigerant from the refrigerant supply source and eject the refrigerant.

  As shown in FIG. 3, the base 47 is sealed to maintain the airtightness between the refrigerant communication hole 479 and the refrigerant frame side communication hole 434 when the socket layout kit 45 is attached to the moving frame 432. A member 49 is provided. The sealing member 49 is disposed so as to surround the refrigerant communication hole 479 in substantially the same manner as the other sealing members 49.

  The refrigerant ejected by the cooling structure 48 is not particularly limited, and for example, a fluid such as compressed air can be used. When compressed air is used as the refrigerant, it is possible to prevent peripheral equipment and the like from being contaminated by the jetted refrigerant.

  In addition, the cooling structure 48 is configured to eject the refrigerant, but is not limited thereto, and may be configured with a cooling fan, for example.

  As described above, the second fluid device 202 is responsible for lowering the heat dissipation structure 40 from the first position to the second position. The lower surface of the piston portion 205 of the second fluid device 202 collides with at least one fin 152 of the heat sink 15 when the heat dissipation structure 40 is pushed down. For this reason, it is preferable that the piston part 205 has a larger elastic deformation rate or plastic deformation rate than the heat sink 15. Thereby, it is possible to prevent or suppress a collision sound generated at the time of collision and wear of the piston portion 205.

  For example, when the heat sink 15 is made of various metal materials, the piston portion 205 is preferably made of various rubber materials such as urethane rubber. In addition, when the heat sink 15 is made of stainless steel which is one of metal materials, the piston portion 205 is preferably made of aluminum.

  The heat conduction member 16 is fixed to the lower surface of the base portion 151 of the heat sink 15 by, for example, screwing. The heat conducting member 16 is formed of a plate member or a block-like member that is thicker than the base portion 151. The heat capacity of the heat conducting member 16 is larger than the heat capacity of the heat sink 15. Thereby, in a state where the heat dissipation structure 40 is located at the second position, the heat of the heat conduction structure 30 can be quickly transmitted to the heat sink 15 via the heat conduction member 16, and the heat dissipation effect is improved. . As the constituent material of the heat conducting member 16, for example, the same constituent material as that of the heat sink 15 can be used.

  As described above, the heat dissipating structure 40 contacts the heat conducting structure 30 at the second position, and heat is transferred from the heat conducting structure 30, that is, heat exchange with the heat conducting structure 30. Is done. At this time, it is preferable to further promote heat exchange. Therefore, as shown in FIGS. 4 to 6, a heat exchange promoting member (heat conducting member) 17 for further promoting heat exchange is disposed on the heat conducting block 301 of the heat conducting structure 30.

  As shown in FIG. 6, the heat exchange promoting member 17 includes a first heat conducting member 171 that is a fluid heat conducting grease and a second heat conducting member 172 that is solid indium.

  The first heat conducting member 171 is formed in layers on the upper surface of the heat conducting block 301. The second heat conducting member 172 has a plate shape and is disposed in contact with the first heat conducting member 171 on the heat dissipation structure 40 side. As a result, the thickness of the heat exchange promoting member 17 as a whole can be suppressed, and heat conduction from the heat conducting structure 30 to the heat dissipation structure 40 is performed quickly.

  The thickness of the first heat conducting member 171 is the same as or thinner than the thickness of the second heat conducting member 172. For example, the thickness of the second heat conducting member 172 is 0.2 times or more and 1 times the thickness of the second heat conducting member 172. Or less, more preferably 0.5 times or more and 0.9 times or less.

  By providing the heat exchange promotion member 17 as described above, the heat exchange time between the heat dissipation structure 40 and the heat conduction structure 30 can be reduced as compared with the case where the heat exchange promotion member 17 is omitted. It can be shortened. As a result, the temperature control for the IC device 9 can be made more responsive.

  Moreover, since the 2nd heat conductive member 172 is comprised with indium, it becomes what is easily plastically deformed. As a result, even if minute irregularities are formed on the lower surface of the heat conducting member 16 of the heat dissipation structure, for example, when the heat dissipation structure moves to the second position, the second heat conducting member 172 It can be easily plastically deformed to conform to the shape, and thus the contact area with the heat conducting member 16 is increased. This increase in the contact area contributes to an improvement in thermal conductivity from the heat conducting structure 30 to the heat dissipation structure 40.

  As shown in FIG. 6, the area (area in plan view) of the first heat conducting member 171 is smaller than the area (area in plan view) of the second heat conducting member 172. As a result, even when the second heat conducting member 172 crushes the first heat conducting member 171 when the heat dissipation structure 40 has moved to the second position, the first heat conducting member 171 has the second heat conducting member 171. Protruding from the conductive member 172 can be prevented. Therefore, the first heat conducting member 171 can be prevented from adhering to other members such as the compression coil spring 305.

  The area of the first heat conducting member 171 is preferably 0.5 to 0.95 times the area of the second heat conducting member 172, preferably 0.8 to 0.9 times. More preferably.

  In the heat exchange promoting member 17, the second heat conducting member 172 may be omitted. In this case, it is preferable to surround the first heat conductive member 171 that is the heat conductive grease with a frame-shaped member.

  As shown in FIGS. 4 and 5, the connection structure 20 and the heat conduction structure 30 are connected via a guide member 50. In addition, a through hole 162 through which the guide member 50 passes is formed in the heat conducting member 16 of the heat dissipation structure 40. Thereby, the heat dissipation structure 40 is supported and guided through the guide member 50 so as to be slidable between the first position and the second position.

  The direction in which the heat dissipation structure 40 abuts against the heat conduction structure 30 by the guide of the guide member 50 is the direction in which the IC device 9 abuts the heat conduction structure 30.

  On the other hand, the direction in which the heat dissipation structure 40 is separated from the heat conduction structure 30 by the guide of the guide member 50 is opposite to the direction in which the heat conduction structure 30 is brought into contact with the IC device 9.

  In addition, the guide member 50 is provided such that an upper end portion thereof is fixed to the cylinder portion 204 of the second fluid device 202 of the connection structure 20 and a lower end portion thereof is fixed to the heat conduction block 301 of the heat conduction structure 30. ing. Thereby, the thermal radiation structure 40 can slide stably.

  As shown in FIG. 8, when the IC device 9 is viewed in a plan view from the pressing direction, four guide members 50 are arranged around the heat sink 15, that is, at equal intervals so as to surround the heat sink 15. Yes. With such an arrangement, the heat dissipation structure 40 slides smoothly.

  The four guide members 50 are arranged on the circumference centered on the heat sink 15 in the configuration shown in FIG. 8, but are not limited to this. For example, the arrangement of the four guide members 50 may be a rectangle with each guide member 50 as a vertex. That is, when a straight line centering on the heat sink 15 is assumed in plan view, the four guide members 50 may be arranged symmetrically with respect to the straight line.

  Further, the number of guide members 50 is four in the configuration illustrated in FIG. 8, but is not limited thereto, and may be two, three, or five or more, for example.

  The cross-sectional shape of the guide member 50 is more preferably circular (see FIG. 8), but is not limited thereto, and may be, for example, an ellipse or a polygon.

  By the way, since the heat dissipation structure 40 slides on the guide member 50 fixed to the heat conducting structure 30, heat from the heat conducting structure 30 is prevented from being transmitted through the guide member 50. Is preferred. In the hand unit 46, the guide member 50 is composed of a heat insulating member and has a smaller heat capacity than the heat conduction block 301 of the heat conduction structure 30. Such a material is not particularly limited, and for example, a resin material can be used, and it is particularly preferable to use polyamideimide or polyetheretherketone among the resin materials.

  The guide member 50 having such a heat insulating property can prevent heat from the heat conducting structure 30 from being transmitted to the heat dissipation structure 40 via the guide member 50. Thereby, the temperature control for the IC device 9 can be performed more accurately, and the temperature control can be made more responsive.

  The polyamideimide or polyetheretherketone constituting the guide member 50 is excellent in either slidability or wear resistance. Thereby, even if the heat dissipation structure 40 repeatedly slides on the guide member 50, the guide member 50 can be prevented from being deteriorated due to friction, and the durability is excellent.

  In addition, although it is preferable that the guide member 50 is comprised with a resin material, it is not limited to this, For example, you may be comprised with ceramics. Moreover, although the guide member 50 can also be comprised with a metal material, it is preferable that the guide member 50 is a hollow body in this case.

Second Embodiment
FIG. 13 is a vertical longitudinal sectional view showing the heat sink and its periphery of one hand unit in the electronic component inspection apparatus (second embodiment) of the present invention.

  Hereinafter, the second embodiment of the electronic component conveying device, the electronic component inspection device, and the electronic component pressing device according to the present invention will be described with reference to this figure. The description of items is omitted.

  This embodiment is the same as the first embodiment except that the configuration of the heat sink is different.

  As shown in FIG. 13, in the present embodiment, the buffer member 18 is interposed between the piston portion 205 of the second fluid device 202 and the heat sink 15 of the heat dissipation structure 40.

  The buffer member 18 is composed of a plate member having a larger elastic deformation rate or plastic deformation rate than the piston portion 205 and the heat sink 15. The buffer member 18 is fixed to the upper ends of the fins 152 of the heat sink 15 at a time. Thereby, it is possible to prevent or suppress the collision sound generated when the piston portion 205 and the buffer member 18 collide and the wear of the piston portion 205.

  For example, when the buffer member 18 and the heat sink 15 are made of various metal materials, the buffer member 18 is preferably made of various rubber materials such as urethane rubber. In addition, when the buffer member 18 and the heat sink 15 are made of stainless steel which is one of metal materials, the buffer member 18 is preferably made of aluminum.

<Third Embodiment>
FIG. 14 is a vertical longitudinal sectional view showing a separation drive unit of one hand unit in the electronic component inspection apparatus (third embodiment) of the present invention.

  Hereinafter, a third embodiment of the electronic component conveying device, the electronic component inspection device, and the electronic component pressing device according to the present invention will be described with reference to this drawing. The third embodiment will be described mainly with respect to the differences from the above-described embodiments. The description of items is omitted.

  The present embodiment is the same as the first embodiment except that the structure for supporting the compression coil spring as a separation drive unit that separates the heat dissipation structure from the heat conduction structure is different.

  As shown in FIG. 14, in this embodiment, a heat insulating member 60 and a convex member 70 are provided between the spring seat 161 of the heat conducting member 16 and the compression coil spring 305.

  The heat insulating member 60 is a plate-like member, and can be made of the same constituent material as that of the guide member 50, for example. Thereby, it is possible to prevent heat from the heat conducting structure 30 from being transmitted to the heat dissipation structure 40 via the compression coil spring 305.

  Further, the convex member 70 has a convex portion 701 projecting convexly toward the compression coil spring 305 side. The upper end portion of the compression coil spring 305 is fitted into the convex portion 701. Thereby, the compression coil spring 305 can be expanded and contracted stably in the spring seat 161, and thus the heat dissipation structure 40 can be quickly separated from the heat conduction structure 30.

  In the hand unit 46, one of the heat insulating member 60 and the convex member 70 may be omitted. For example, when the heat insulating member 60 is omitted, the convex member 70 preferably has heat insulating properties. Thereby, the convex member 70 can prevent the heat from the heat conduction structure 30 from being transmitted to the heat dissipation structure 40 via the compression coil spring 305. Further, since the heat insulating member 60 is omitted, the configuration of the hand unit 46 can be simplified.

  As mentioned above, although the electronic component conveying apparatus, the electronic component inspection apparatus, and the electronic component pressing apparatus of the present invention have been described with respect to the illustrated embodiments, the present invention is not limited to this, and the electronic component conveying apparatus, the electronic component inspection are not limited thereto. Each part which comprises an apparatus and an electronic component press apparatus can be substituted with the thing of the arbitrary structures which can exhibit the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying device, the electronic component inspection device, and the electronic component pressing device of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  In addition, the gripping unit that is a hand unit is configured to suck and grip the electronic component by sucking air in each of the embodiments described above, but is not limited to this. For example, the gripping unit grips the electronic component. May be.

  Further, when inspecting IC devices exceeding 16 (for example, 32) at once, the inspection can be performed by arranging four socket layout kits shown in FIG.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus 2 ... Supply part 3 ... Supply side arrangement | positioning part 341 ... Mounting stage 4 ... Conveyance part 41 ... Shuttle 411 ... Pocket 42 ... Supply robot 421 ... Support frame 422 ... Movement Frame 423 ... Hand unit 43 ... Inspection robot 431 ... Support frame 432 ... Moving frame (pressing member arrangement member mounting member)
433 …… Frame side communication hole (mounting member side communication hole)
434 …… Frame side communication hole for refrigerant 44 …… Recovery robot 441 …… Support frame 442 …… Moving frame 443 …… Hand unit 45 …… Socket layout kit 46 …… Hand unit (pressing member)
47 …… Base (Pressing member placement member)
473 …… Edge 474 …… Deficit 477 …… Communication hole 478 …… Square 479 …… Refrigerant communication hole 48 …… Cooling structure 481 …… Jet 49 封 止 Sealing member (packing)
5 ... Inspection part 51 ... Holding part 6 ... Collection side array part 7 ... Collection part 8 ... Control part 9, 9A, 9B ... IC device 91 ... Circuit part 911 ... Upper surface 92 ... Semiconductor part (Wafer part)
921 …… Top surface 93 …… Center 10 …… Conveying device 11 …… Base 111 …… Base surface 12 …… Cover 13 …… First abutting member 131 …… Edge portion 132 …… Through hole 14 …… Second contact Contacting member 141 …… Flange part 142 …… Protruding part 15 …… Heat sink 151 …… Base part 152 …… Fin 16 …… Heat conduction member 161 …… Spring seat 162 …… Through hole 17 …… Heat exchange promoting member (heat Conductive member)
171 …… First heat conducting member 172 …… Second heat conducting member 18 …… Buffer member 20 …… Connecting structure (connecting portion)
201 …… first fluid device 201a …… cylinder portion 201b …… piston portion 201c …… diaphragm 201d …… hollow portion 201e …… channel 202 …… second fluid device 203 …… intermediate member 203a …… relay channel 204 …… Cylinder part 204a …… Hollow part 204b …… Flow path 204c …… Sealing member (packing)
205 …… Piston part 205a …… Reduced diameter part 205b …… Protrusion part 206 …… Gasket part 207 …… Pump 208 …… Solenoid valve 209a, 209b …… Working fluid 30 …… Heat conduction structure (heat conduction part)
301 …… Heat conduction block (heat conduction member)
301a …… Spring seat 301b …… Relay channel 302 …… Abutting member 302a …… Shim (SIM)
303 …… Support member 303a …… Inner cylinder portion 303b …… Outer cylinder portion 303c …… Suction flow path 303d …… Sealing member (packing)
303e …… Flange part 304 …… Heater 305 …… Compression coil spring 306 …… Adsorption member 307 …… Ejector 308 …… Temperature adjustment part 308a …… Thermocouple 308b …… Platinum sensor (Pt sensor)
40 …… Heat dissipation structure (heat dissipation part)
50 …… Guide member (support part)
60 …… Heat insulation member 70 …… Convex member 701 …… Convex portion A1 …… First region (pressing member arrangement region)
A2 ... 2nd area (communication hole arrangement area)
h …… Projection amount Lmax …… Maximum length (full length)
L ₁ , L ₂ …… Center distance S …… Stroke Tmax …… Maximum thickness Wmax …… Maximum width W ₁ …… Center distance

Claims (20)

A heat-conducting part capable of gripping electronic components and conducting heat;
A heat dissipating part capable of dissipating heat by passing a fluid,
The electronic component conveying apparatus, wherein the heat dissipating part is disposed so as to be able to contact or separate from the heat conducting part.   The electronic component transport apparatus according to claim 1, further comprising a contact drive unit that makes the heat radiating unit contact the heat conduction unit, wherein the contact drive unit is configured by a fluid device.   The electronic component conveying apparatus according to claim 2, wherein the contact driving unit includes a cylinder part having a hollow part and a piston part sliding in the hollow part.   The electronic component conveying apparatus according to claim 3, wherein the piston portion has a larger elastic deformation rate or plastic deformation rate than the heat dissipation portion.   5. The electronic component transport device according to claim 3, wherein a member having a larger elastic deformation rate or plastic deformation rate than the piston portion and the heat dissipation portion is interposed between the piston portion and the heat dissipation portion.   The electronic component conveying apparatus according to claim 3, wherein a plate member is interposed between the piston portion and the heat radiating portion.   The electronic component conveying apparatus according to claim 1, further comprising a separation drive unit that separates the heat dissipation unit from the heat conduction unit, and the separation drive unit includes an elastic member.   The electronic component conveying apparatus according to claim 7, wherein a heat insulating member is provided between the elastic member and the heat radiating portion. The elastic member is a coil spring;
The electronic component conveying apparatus according to claim 7, wherein a convex member protruding in a convex shape toward the coil spring is provided between the coil spring and the heat radiating portion.   The electronic component conveying apparatus according to claim 9, wherein the convex member has a heat insulating property.   The electronic component transport apparatus according to claim 9, wherein a convex member protruding in a convex shape toward the coil spring and a heat insulating member are provided between the coil spring and the heat radiating portion.   The electronic component carrying device according to any one of claims 1 to 11, wherein a direction in which the heat radiating portion abuts on the heat conducting portion is a direction in which the heat conducting portion abuts on the electronic component.   The electronic component transport apparatus according to claim 12, wherein a direction in which the heat radiating unit is separated from the heat conducting unit is a direction opposite to a direction in which the heat conducting unit is brought into contact with the electronic component.   The electronic component conveying apparatus according to claim 1, wherein the heat dissipating part includes a heat dissipating member.   The electronic component carrying device according to claim 14, wherein the heat radiating portion includes a heat conducting member having a heat capacity larger than a heat capacity of the heat radiating member.   The electronic component conveying apparatus according to claim 1, wherein the fluid is air.   The electronic component conveying apparatus according to claim 1, wherein the fluid is sprayed in a state in which the heat radiating unit is in contact with or separated from the heat conducting unit.   The electronic component carrying device according to any one of claims 1 to 15, wherein a stroke when the heat radiating part comes into contact with or separates from the heat conducting part is larger than 0 mm and smaller than 5 mm. A heat-conducting part capable of gripping electronic components and conducting heat;
A heat dissipating part capable of dissipating heat by passing a fluid;
An inspection unit for inspecting the electronic component,
The electronic component inspection apparatus, wherein the heat radiating portion is arranged so as to be able to contact or be separated from the heat conducting portion. A heat-conducting part capable of gripping electronic components and conducting heat;
A heat dissipating part capable of dissipating heat by passing a fluid,
The electronic component pressing device, wherein the heat dissipating part is disposed so as to be able to contact or separate from the heat conducting part.

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