KR20160064964A - Handler for electric device test - Google Patents

Abstract

The present invention relates to a handler for testing an electronic device. According to an embodiment of the present invention, the handler comprises: a cooling pocket in a pushing head of a connector, to electrically connect an electronic part to a test socket of a tester; and a fluid supply unit supplying cooling fluid to the inside of the cooling pocket. According to the present invention, the temperature required for testing the electronic part may be maintained by the cooling fluid supplied to the inside of the cooling pocket so that reliability of a test is improved.

Description

[0001] HANDLER FOR ELECTRIC DEVICE TEST [0002]

The present invention relates to a handler used for testing of produced electronic components.

The handler supports the manufactured electronic parts to be tested by the tester and classifies the electronic parts according to the test results.

The handler is disclosed through a plurality of patent documents such as Korean Patent Laid-open Publication No. 10-2002-0053406 (hereinafter referred to as "Prior Art 1") and Japanese Patent Laid-Open No. 2011-247908 (hereinafter referred to as "Prior Art 2" .

1 is a schematic diagram of a conventional handler (TH).

The conventional handler TH includes a supply part SP, a connection part CP, and a recovery part WP.

The supply part SP supplies the electronic parts loaded on the customer tray to the connection part CP.

The connection part CP electrically connects the electronic part supplied by the supply part SP to the tester through the socket board SB connected to the main body of the tester. Here, the socket board SB is provided with a plurality of test sockets TS electrically connected to the electronic components.

The collecting unit (WP) collects the tested electronic components from the connection unit (CP) and loads them on the empty customer tray while sorting according to the test result.

The supply part (SP), the connection part (CP), and the recovery part (WP) may have various forms and configurations according to the purpose of the handler.

The present invention relates to a connection (CP) among the above configurations.

The connection CP is called a pushing head 210 ', a' index head 'in the prior art 1 and a' pressing device 'in the prior art 2, as shown in the schematic diagram of FIG. 2), a vertical mover 220' A horizontal shifter 230 'and a socket guider SG.

The pushing head 210 'has pushers 212' for pressing individual electronic components into a corresponding test socket (TS, referred to in the prior art 2 as a 'test socket').

The pusher 212 'presses the electronic component D to the lower surface of the pressing portion PR. The pusher 212 'sucks and grips the electronic part D by the vacuum pressure to the lower surface of the pressing part PR. To this end, as shown in FIG. 3, the pusher 212 'is provided with a vacuum passage VT through which vacuum pressure can be applied. And guide holes GH are formed on both sides of the pressing portion PR. This pusher 212 'has a temperature sensor 212'-6 for sensing the temperature of the pusher 212' itself. The temperature of the semiconductor element to be pressed by the pusher 212 'through the temperature sensor 212' is indirectly measured.

The pushing head 210 'descends while holding the electronic component, thereby electrically connecting the electronic component to the test socket TS on the socket board SB. To this end, the pushing head 210 'is configured to be capable of horizontally moving forward and backward and vertically moving vertically.

The vertical mover 220 'moves the pushing head 210' to the socket board SB side by moving the pushing head 210 'up and down. The operation of this vertical mover 220 'is performed when the electronic component D is gripped or released from the electronic component mover shuttle (referred to as' slide table 'in the prior art 2) by the pushing head 210' This is done when the electronic component D is electrically connected to or disconnected from the test socket TS.

The horizontal shifter 230 'horizontally moves the pushing head 210' in the forward and backward directions. Here, the horizontal movement of the pushing head 210 'is performed when moving the upper point of the shuttle and the upper point of the socket board SB.

The socket guider (SG) guides the test socket of the socket board (SB) to be correctly positioned. The socket guider SG is formed with an exposure hole EH at a position corresponding to the test socket and the pusher 212 'so that the test socket TS can be exposed to the pusher 212' side. The socket guider SG is also provided with a guide pin GP which is inserted into the guide hole GH of the pusher 212 'to align the position of the pusher 212'. That is, the guide pin GP ultimately leads to an elaborate electrical connection between the electronic component and the test socket TS, which is held by the pusher 212 '. This socket guider SG is a handler in which a test tray is not provided or a pusher 212 'having a function of gripping an electronic part D as mentioned above, Lt; RTI ID = 0.0 > handler < / RTI >

On the other hand, an electronic component generates its own heat while being tested. Particularly, electronic parts requiring calculation such as a CPU have a large heat generation. Self-heating increases the temperature of electronic components. Thus hindering the electronic components from being tested while maintaining the proper temperature for the test conditions.

Korean Patent Publication No. 10-0706216 or Korean Publication No. 10-2009-0102625 (hereinafter referred to as "Prior Art 3") is provided with a heat sink for controlling the temperature of electronic components. However, according to the prior art 3, the structure of the pusher is complicated, resulting in poor productivity and durability.

In Korean Patent Laid-Open No. 10-2008-0086320 (hereinafter referred to as "Prior Art 4"), an air through hole is formed in a pusher to adjust the temperature of an electronic component, and air for temperature control is supplied from the duct to the air through hole. However, the conventional art 4 can not be applied to a pusher 212 'to which a structure for holding an electronic component by vacuum pressure is applied. This is because the pusher can not have both of the functions of vacuum adsorption function and temperature control air supply which are opposite to each other.

In addition, the above methods decrease the reliability of the test because the response of the temperature control of the electronic component is slow due to the operation of the temperature control function.

It is an object of the present invention to provide a technique capable of providing a heating element in a pusher and adjusting the temperature of an electronic component being pressed by the pusher with a cooling fluid.

The above-described handler for testing electronic components according to the present invention includes: a supply unit for supplying electronic components; A connecting portion for electrically connecting the electronic component supplied by the supplying portion to the test socket of the tester; An adjusting unit for adjusting a temperature of an electronic component electrically connected to the test socket by the connecting unit; A recovery unit for recovering the tested electronic components by the tester; And a control unit for controlling each of the above configurations; The connecting portion including: a pushing head for pressing the electronic component toward the test socket; And a mobile device for advancing or retracting the pushing head toward the test socket side; Wherein the pushing head comprises: a pusher for pressing the electronic component toward the test socket; And a cooling pocket in contact with said pusher and through which a cooling fluid supplied by said conditioning portion passes; And the regulating portion includes a fluid supplier for supplying the cooling fluid into the cooling pocket.

The pusher has a temperature sensing element for sensing the temperature of the electronic component which is urged by the pusher toward the test socket.

The temperature sensing element further senses the temperature of the pusher itself.

The connecting portion having a guide pin for guiding the test socket to be correctly positioned and guiding the position of the pusher accurately; Wherein the pusher includes a metal body with one side made of a pressing part and a part of the other side being in contact with a part of the cooling pocket.

Wherein the pusher is made of a material having a heat capacity smaller than that of the pressing portion, and the guide member has a guide hole into which the guide pin is inserted; .

Wherein the pusher further comprises: a thermoelectric element mounted on the pusher to supply heat to the electronic component being pressed toward the test socket by the pusher; A metal body having a receiving groove for receiving the thermoelectric element; .

The metal body is brought into contact with the cooling pocket through the outer rim of the receiving groove.

The pusher comprising: a heater mounted on the pusher to supply heat to the electronic component being pressed toward the test socket by the pusher; And a heat pipe for heat exchange between the cooling fluid inside the cooling pocket and the electronic component; And the heat pipe extends toward the electronic component side where one side is in contact with the cooling fluid inside the cooling pocket and the other side is pressed.

An insulation groove is formed in the pusher at a position where the interruption of the heat pipe is located.

The controller can control the temperature of the electronic component by controlling the controller according to the temperature measured through the temperature sensitive element in the electronic component.

According to the present invention, since the temperature of the electronic component to be pressed by the pusher is quickly adjusted through the reduction of the heat capacity of the heating element, the cooling fluid, and the pusher provided in the pusher and the supply amount of the cooling fluid, do.

1 to 3 are reference views for explaining a conventional handler for testing electronic parts.
4 is a plan view of a handler for testing electronic components according to an embodiment of the present invention.
Figure 5 is a schematic perspective view of the connection applied to the handler of Figure 4;
FIG. 6 is an exploded perspective view showing the pusher in the connection portion of FIG. 5; FIG.
FIG. 7 is a schematic cross-sectional view of the pusher according to the first embodiment applied to the connection of FIG. 4; FIG.
FIG. 8 is a schematic cross-sectional view of a pusher according to a second embodiment applied to the connection of FIG. 4; FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For simplicity of description, redundant description is omitted or compressed as much as possible.

4, the handler TH for testing electronic components according to the present invention includes a pair of redirection boards 111 and 112, a first mobile device 120, a pair of mobile shuttles MS1, and MS2, a connection unit 200, a control unit 300, a second mobile unit 420, and a control unit 500.

Electronic components may be loaded in the redistribution boards 111 and 112. These red plates 111 and 112 have a heater to heat the loaded electronic components to a temperature required for the test. Of course, the operation of the heater is stopped at the room temperature test.

The first mobile device 120 moves the electronic components of the customer tray CT ₁ to the redirecting boards 111 and 112 or moves the electronic components of the redirecting boards 111 and 112 to the moving shuttle MS1, . To this end, the first mobile device 120 is provided so as to move in the left-right direction and the back-and-forth direction (see arrows a and b).

Is provided to enable and electronic components can be loaded, moved to the right and left direction through the testing position (TP) (see the arrow c _1, c ₂₎ moving the shuttle (MS1, MS2).

The connection part 200 electrically connects the electronic parts loaded in the moving shuttle MS1 / MS2 in the test position TP to the test sockets TS thereunder. To this end, the connection portion 200 includes a pushing head 210, a socket guider SG, a vertical mover 220 and a horizontal mover 230 as referenced in the solid line portion of Fig.

The pushing head 210 has eight pushers 212. Thus, eight electronic components are electrically connected to the tester at one time. Of course, the number of pushers 212 provided in the pushing head 210 may vary depending on the product. With respect to the pushing head 210, the embodiment will be described later.

The socket guider (SG) guides the test socket (TS) of the socket board (SB) to be correctly positioned. An opening hole EH in which the test socket TS can be exposed to the pusher 212 side is formed at a position corresponding to the test socket TS and the pusher 212 in the socket guider SG. The socket guider SG is also provided with a guide pin GP for aligning the position of the pusher 212 by being inserted into the guide hole GH of the pusher 212. [ The socket guider SG can be divided into a socket guide SL in which an exposure hole EH in which a test socket TS can be inserted and a docking plate DP for guiding the socket guide SL have. When the socket guide SL and the docking plate DP are separated from each other, the socket guide SL is connected to the docking plate DP provided on the handler TH while being coupled to the socket board SB, . To match the socket guide SL with the docking plate DP, the socket guide SL is provided with a matching pin AP for guiding the matching and the matching pin AP is inserted into the docking plate DP A matching hole AH is formed. Needless to say, the socket guide and the docking plate may be integrally combined as in the prior art.

The vertical mover 220 moves the pushing head 210 up and down (see arrow d). Accordingly, the pushing head 220 can advance or retract toward the socket board SB and can advance or retract toward the movable shuttles MS1 and MS2.

The horizontal shifter 230 moves the pushing head 210 in the forward and backward direction (see arrow e). Therefore, the pushing head 210 can electrically connect the test socket TS after gripping the electronic component alternately in the moving shuttle of code MS1 and the moving shuttle of code MS2.

For reference, a test chamber may be provided in an area defined by the test position TP. When the test chamber is provided, the connection portion 200 or at least the pushing head 210 is positioned inside the test chamber. Of course, the interior of the test chamber is adjusted to the temperature required to test the electronic components.

The regulator 300 includes a fluid feeder 310 and a flow control valve 320 as referenced in the dotted line portion of FIG.

The fluid supply 310 supplies a cooling fluid for lowering the temperature of the electronic component to the pushing head 210.

The flow control valve 320 controls the supply amount of the cooling fluid supplied by the fluid supplier 310.

The second mobile device 420 while classified according to the test results the test is completed and electronic components in the moving shuttle (MS1, MS2), also located in the right-hand side is moved to a customer tray (CT _2). Therefore, the second mobile device 420 can be moved in the left-right direction (see arrow f) or in the back-and-forth direction (see arrow g).

The control unit 500 controls each of the above configurations.

The redistribution boards 111 and 112 and the first mobile 120 side for supplying the electronic components of the customer tray CT ₁ to the connection unit 200 among the above configurations are defined as a supply unit SP for supplying electronic components And the side of the second mobile unit 420 that moves the electronic component tested by the tester to the customer tray CT ₂ may be defined as a retrieval unit WP. Here, the pair of movable shuttles MS1 and MS2 function as a supply part SP and a recovery part WP depending on their positions.

Subsequently, the pushing head 210 will be described according to the embodiments.

≪ Pushing head according to the first embodiment >

As in the partially exploded perspective view of Fig. 6, the pushing head 210A according to the present embodiment includes four cooling pockets 211A and eight pushers 212A. Two pushers 212A correspond to one cooling pocket 211A. Of course, depending on the implementation, one pusher may correspond to one cooling pocket, three or more pushers may correspond to one cooling pocket, and all the pushers may correspond to one cooling pocket.

The cooling pocket 211A has an inlet IH for inputting the cooling fluid and an outlet OH for outputting the cooling fluid. Inside the cooling pocket 211A, a plurality of heat exchange plates (HCP) extending inward from the outer wall OW for heat exchange are formed. That is, the cooling fluid supplied from the fluid feeder 310 is input into the inside of the cooling pocket 211A through the inlet IH and then flows through the outlet formed by the plurality of heat exchange plates (HCP) do. At this time, the cool air of the cooling fluid is quickly transferred to the electronic component via the pusher 212A through the cooling pocket 211A including the heat exchange plate (HCP). In other words, the heat of the electronic component quickly escapes to the cooling fluid through the cooling pocket 211A via the pusher 212A.

The pusher 212A has a contact portion 212A-1, a pressing portion 212A-2, a guide member 212A-3, a thermoelectric element 212A-4, a temperature sensing element 212A- 6, a temperature sensor (PTS) and a gripping mold 212A-7.

The contact portion 212A-1 and the pressing portion 212A-2 are metal bodies formed integrally with each other.

The contact portion 212A-1 is provided on one side (upper side in the figure) of the metal body, and on one side of the metal body, a receiving groove ES capable of receiving the thermoelectric element 212A-4 is formed have. In this embodiment, the contact portion 212A-1 is provided on the outer edge of the receiving groove ES. Of course, the contact area of the contact portion 212A-1 in contact with the cooling pocket 211A can be designed in consideration of the cooling capacity.

The pressing portion 212A-2 is provided on the other side (lower side in the drawing) of the metal body and is in the form of a rectangular column extending from the contact portion 212A-1 to the side of the electronic component (downward in the drawing). The electronic component is pressed by the lower end of the pressing portion 212A-2.

The metal body is provided with a vacuum passage VT through which vacuum pressure can be inputted as an electronic component and a mounting groove IS for mounting the temperature sensing element 212A-6 on the lower surface of the pressing portion 212A- Is formed.

The guide member 212A-3 is made of a material having a heat capacity smaller than that of the metal body (for example, a resin-based material such as an epoxy) and is inserted into a guide hole GH Is formed. The position of the pusher 212A is precisely aligned as the guide pin GP of the socket board SB is inserted into the guide hole GH.

For reference, conventionally, the guide member is integrated with one metal body together with the contact portion and the pressurizing portion. In this case, due to the heat capacity of the metal body itself, the reaction of the electronic components due to the temperature control becomes slower, which lowers the reliability of the test. Therefore, in the present invention, the heat capacity of the metal body is minimized by cutting the metal body as much as possible and adding the guide member 212A-3 to the cut portion. This allows the temperature response of the electronic components to be quickened by the operation of the temperature control function.

The thermoelectric element 212A-4 is accommodated in the receiving groove ES and applies heat to the pressing portion 212A-2 under the control of the controller 500. [ Such a thermoelectric element 212A-4 may also function to shut off the cold air coming from the cooling pocket 211A as occasion demands. Accordingly, the metal body is configured so that the outer edge OE of the receiving groove ES is in contact with the cooling pocket 211A so that the cool air of the cooling pocket 211A can be introduced into the metal body.

The temperature sensing element 212A-6 senses the surface temperature of the electronic component that is installed in the installation groove IS and is pressed by the pusher 212A. The sensed temperature information is transmitted to the controller 500. Of course, in order to perform an accurate test on an electronic component under a required temperature condition, the temperature inside the electronic component must be sensed. However, since the product can not be damaged due to the temperature sensing, there is a limitation that it is necessary to detect only the surface temperature of the electronic component. Therefore, a large number of experiments must be continuously performed so as to estimate the temperature inside the electronic component relatively accurately as the surface temperature of the electronic component. Then, the temperature control function according to the surface temperature information of the electronic parts is operated with the experimental data.

The temperature sensor (PTS) senses the temperature of the metal body.

In this embodiment, the temperature sensing element 212A-6 senses the temperature of the electronic component and the temperature sensor PTS senses the temperature of the electronic component.

However, depending on the implementation, the temperature sensor (PTS) may be omitted. In this case, the temperature sensing element 212A-6 can sense the temperature of the electronic component or the temperature of the metal body. For example, when the pusher 212A is in contact with the electronic component, the temperature sensing element 212A-6 senses the temperature of the electronic component, but when the pusher 212A is separated from the electronic component, the temperature sensing element 212A -6) senses the temperature of the metal body.

The gripping mold 212A-7 is provided at the lower end of the pressing portion 212A-2 in the form of a quadrangular rim. The gripping mold 212A-7 closes the surface of the electronic component inside the gripping mold 212A-7 to come in through the vacuum passage VT So that vacuum pressure can be applied to the surface of the electronic component.

Next, the operation of the main part of the handler TH having the pushing head 210A having the above structure will be described.

The controller 500 raises the output of the thermoelectric element 212A-4 so as to raise the pressed electronic component in the test socket TS to the set test temperature for testing. At this time, if necessary, the supply amount of the cooling fluid may be reduced to reduce the cold air inputted into the pusher 212A through the cooling pocket 211A. As a result, the electronic component is quickly moved to the set test temperature, and the electronic component is tested in this state. However, if the temperature of the electronic component rises due to self-heating during the test, the controller appropriately reduces the output of the thermoelectric element 212A-4 through temperature information on the surface of the electronic component coming from the temperature sensing element 212A-6. If necessary, the control unit 500 may control the flow control valve 320 to increase the supply amount of the cooling fluid. On the other hand, when the output of the thermoelectric element 212A-4 is reduced, the cool air coming from the cooling fluid through the cooling pocket 211A passes through the outer edge OE of the contact portion 212A-1, ), And the cold air inputted into the pusher 212A transfers the cold air to the electronic parts as quickly as the reduced heat capacity. As a result, the temperature of the electronic component quickly approaches the set temperature.

Of course, if the temperature of the electronic component falls below the set temperature, the temperature of the electronic component is raised to the set temperature through the above reverse operation.

In this embodiment, the supply of the cooling fluid and the control of the thermoelectric element 212A-4 are complementarily controlled by the controller 500. [

In this embodiment, the cooling fluid is supplied and the thermoelectric element 212A-4 is controlled at the same temperature for quick control. However, for more stable temperature control and fine control, either one of the two variables of supply of cooling fluid and control of thermoelectric element 212A-4 may be fixed and only one of them may be used. Particularly, when the output value of the thermoelectric element 212A-4 is fixed and the supply amount of the cooling fluid is adjusted, it may have a more stable result. In addition, rapid temperature control can be achieved by varying not only the supply amount of the cooling fluid but also the temperature of the cooling fluid.

≪ Pushing head according to the second embodiment &

The pushing head according to the present embodiment also includes four cooling pockets and eight pushers.

Since the cooling pocket is the same as that in the first embodiment, the description is omitted.

8, the pusher 212B includes a contact portion 212B-1, a pressing portion 212B-2, a guide member 212B-3, a heater 212B-4, a heat pipe 212B-5, Temperature sensing element 212B-6, and gripping mold 212B-7.

The contact portion 212B-1 is a portion in contact with the cooling pocket 211B.

The pressing portion 212B-2 is in the form of a square pillar extending downward from the contact portion 212B-1.

Similarly, the contact portion 212B-1 and the pressing portion 212B-2 are formed integrally with each other, and the metal body is provided with a vacuum passage VT through which vacuum pressure can be inputted as an electronic component.

The guide member 212B-3 is made of a material having a heat capacity smaller than that of the metal body, and a guide hole GH into which the guide pin GP of the socket guider SG is inserted is formed.

The heater 212B-4 is installed in the contact portion 212B-1 of the pusher 212B and applies heat to the metal body under the control of the controller 500. [

The heat pipe 212B-5 is extended to the electronic component D side where the upper side is in contact with the cooling fluid inside the cooling pocket 211B and the other side is pressed. Accordingly, the cool air of the cooling fluid flowing inside the cooling pocket 211B is rapidly transferred to the lower end portion of the pusher 212B having the electronic component by the heat pipe 212B-5. Therefore, the temperature control reaction of the electronic parts can be performed quickly. In order to minimize the escape of cold air into the metal body made of the contact portion 212B-1 and the pressurizing portion 212B-2 while the cold air is transmitted by the heat pipe 212B-5, (IH) is formed where the interruption of the heat sink 212B-5 is located. Of course, the heat insulating groove IH may be filled with a heat insulating material.

On the other hand, the metal body made of the contact portion 212B-1 and the pressing portion 212B-2

The temperature sensing element 212B-6 and the gripping mold 212B-7 are the same as those in the first embodiment, and a description thereof will be omitted.

Next, the operation of the main part of the handler TH having the pushing head 210B having the above structure will be described.

The controller 500 raises the output of the heater 212B-4 so as to raise the pressed electronic component in the test socket TS to the set test temperature for testing. Likewise, if necessary, the supply amount of the cooling fluid can be reduced to reduce the cold air input to the pusher 212B through the cooling pocket 211B. When the temperature of the electronic component rises due to self-heating or the like as a result of the test being performed, the temperature of the electronic component reaches the control unit 500 through the temperature information on the surface of the electronic component coming from the temperature sensing element 212A- Appropriately reduces the output of the heater 212B-4. Similarly, if necessary, the control unit 500 may control the flow control valve 320 to increase the supply amount of the cooling fluid. On the other hand, when the output of the heater 212B-4 is reduced, the cool air coming from the cooling fluid through the heat pipe 212B-5 is quickly inputted to the lower end portion of the pusher 212B and then transferred to the electronic part. As a result, the temperature of the electronic component quickly approaches the set temperature.

Similarly, when the temperature of the electronic component falls below the set temperature, the temperature of the electronic component is raised to the set temperature through the above reverse operation.

Also in this embodiment, the supply of the cooling fluid and the control of the heater 212B-4 are complementarily controlled by the control unit 500. [ It is also possible to fix either the supply of the cooling liquid for cooling the melon and the heat supply of the heater 212B-4.

In the meantime, although the first embodiment and the second embodiment have been described for the explanation of the present invention, the first embodiment and the second embodiment may be applied to one product together. That is, the thermoelectric elements 212A-4 and the heaters 212B-4 may be formed together in one pusher.

<Warehouse Items>

For reference, depending on the kind of the electronic component, it may have a temperature sensitive device such as a thermal diode in itself (for example, a semiconductor device having a thermal diode). In this case, the temperature inside the electronic component can be measured using the voltage value of the thermal diode. In this case, the control unit 500 may control the temperature of the electronic component based on the temperature measured through the temperature sensitive element in the electronic component, without omitting the temperature sensing element, but without operating it.

Of course, depending on the implementation, the controller 500 may utilize / combine both the temperature measured through the temperature sensitive element in the electronic component and the temperature sensed by the temperature sensing element 212A-6 or 212B-6) The temperature of the component may be controlled. For example, after the temperature is calculated by the average value or the weighted average value of the temperature sensed by the control unit 500 through the temperature sensing element and the temperature sensing element 212A-6 or 212B-6) The temperature of the electronic component can be controlled according to the temperature.

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the scope of the invention is to be construed as being limited only by the following claims and their equivalents.

TH: Handler for testing electronic components
SP: Supply part
WP: Recall part
200: Connection
210, 210A, 210B: pushing head
211A, 212B: cooling pocket
212, 212A, 212B:
212A-4: Thermoelectric element
212B-4: Heater
SG: socket guider
220: Vertical mobile station
230: Horizontal mover
300:
310: fluid feeder 320: flow control valve
500:

Claims (10)

A supply part for supplying an electronic part;
A connecting portion for electrically connecting the electronic component supplied by the supplying portion to the test socket of the tester;
An adjusting unit for adjusting a temperature of an electronic component electrically connected to the test socket by the connecting unit;
A recovery unit for recovering the tested electronic components by the tester; And
A controller for controlling each of the above configurations; Lt; / RTI &gt;
The connecting portion
A pushing head for pressing the electronic component to the test socket side; And
A mobile device for advancing or retracting the pushing head toward the test socket side; Lt; / RTI &gt;
The pushing head includes:
A pusher for pressing the electronic component to the test socket side; And
A cooling pocket in contact with said pusher and through which a cooling fluid supplied by said conditioning portion passes; / RTI &gt;
Characterized in that the regulating part comprises a fluid feeder for supplying a cooling fluid into the inside of the cooling pocket
Handler for testing electronic components The method according to claim 1,
Characterized in that the pusher has a temperature sensing element for sensing the temperature of the electronic component being pressed toward the test socket by the pusher
Handler for testing electronic components. The method according to claim 1,
Characterized in that the temperature sensing element further senses the temperature of the pusher itself
Handler for testing electronic components. The method according to claim 1,
The connecting portion having a guide pin for guiding the test socket to be correctly positioned and guiding the position of the pusher accurately; Further comprising:
Characterized in that the pusher comprises a metal body, one side of which is a pressurizing portion and the other of which is in contact with a portion of the cooling pocket
Handler for testing electronic components. 5. The method of claim 4,
Wherein the pusher is made of a material having a heat capacity smaller than that of the pressing portion, and the guide member has a guide hole into which the guide pin is inserted; &Lt; RTI ID = 0.0 &gt;
Handler for testing electronic components. The method according to claim 1,
The pusher
A thermoelectric element mounted on the pusher to supply heat to the electronic component being pressed toward the test socket by the pusher; And
A metal body having a receiving groove for receiving the thermoelectric element; &Lt; RTI ID = 0.0 &gt;
Handler for testing electronic components. The method according to claim 6,
Characterized in that the metal body is in contact with the cooling pocket through the outer rim of the receiving groove
Handler for testing electronic components. The method according to claim 1,
The pusher
A heater mounted on the pusher to supply heat to the electronic component being pressed toward the test socket by the pusher; And
A heat pipe for heat exchange between the cooling fluid inside the cooling pocket and the electronic component; Lt; / RTI &gt;
Characterized in that the heat pipe is extended to the side of the electronic component where one side is in contact with the cooling fluid inside the cooling pocket and the other side is pressed
Handler for testing electronic components. 9. The method of claim 8,
Characterized in that the pusher is provided with a heat insulating groove at a position where the interruption of the heat pipe is located
Handler for testing electronic components. The method according to claim 1,
Wherein the controller controls the temperature of the electronic component by controlling the controller according to the temperature measured through the temperature sensitive element in the electronic component
Handler for testing electronic components.

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