CN107110910A - Separator for testing electronic parts - Google Patents
Separator for testing electronic parts Download PDFInfo
- Publication number
- CN107110910A CN107110910A CN201580058183.5A CN201580058183A CN107110910A CN 107110910 A CN107110910 A CN 107110910A CN 201580058183 A CN201580058183 A CN 201580058183A CN 107110910 A CN107110910 A CN 107110910A
- Authority
- CN
- China
- Prior art keywords
- pusher
- electronic unit
- temperature
- separator
- test jack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
Abstract
The present invention discloses a kind of separator for testing electronic parts.Shown separator for testing the electronic unit includes：Cooling bag, it is placed in the pusher head of connection member, and the electronic unit is electrically connected to the test jack of tester by the connection member；And fluid supply machine, it is used to cooling fluid being supplied to inside the cooling bag.Reliability in the separator enhancing test of the present invention, because the separator can be due to the temperature required for testing the electronic unit supplied to the cooling fluid inside the cooling bag and maintaining.
Description
Technical field
The present invention relates to a kind of separator for being used for testing manufactured electronic unit.
Background technology
Separator supports the test of manufactured electronic unit by tester, and according to test result to being tested
Electronic unit presses grade separation.
Including Korean Patent Publication case the 10-2002-0053406th (hereinafter referred to " prior art 1 ") and Japan is specially
A large amount of patent documents of sharp publication the 2011-247908th (hereinafter referred to " prior art 2 ") disclose such separator.
Fig. 1 is the schematic diagram of typical separator (TH).
Typical separator (TH) includes supply part (SP), connection member (CP) and recovery part (WP).
The electronic unit being loaded on consumer's pallet is supplied to connection member (CP) by supply part (SP).
What the socket (SB) that connection member (CP) is connected via the main body with tester will be supplied by supply part (SP)
Electronic unit is electrically connected to tester.Herein, socket (SB) includes a plurality of test jacks electrically connected with electronic unit
(TS)。
By the electronic unit tested, from after connection member (CP) recovery, recovery part (WP) is by the electronics tested
Part is loaded on consumer's pallet of sky, while being classified according to test result.
Supply part (SP), connection member (CP) and recovery part (WP) can have each according to the application target of separator
The form of kind and structure.
The present disclosure generally relates to the connection member in above-mentioned part (CP).
As shown in Fig. 2 schematic diagram, connection member (CP) includes pusher head 210 ' (in prior art 1 referred to as " dividing head ",
But in prior art 2 referred to as " pressue device "), vertically move body 220 ', horizontal moving body 230 ' and socket guiding device (SG).
Pusher head 210 ', which has, to be used to each of electronic unit being pressed into correspondence test jack (TS) (prior art
Pusher 212 ' in 2 referred to as " socket for being used for test ").
Bottom side pressing electronic unit (D) of the pusher 212 ' towards pressing component (PR).In addition, pusher 212 ' is by vacuum
Electronic unit (D) is adsorbed and captured to pressing component (PR) bottom side by pressure.Therefore, as shown in figure 3, pusher 212 ' has
Free-air path (VT) is with applying vacuum pressure.In addition, bullport (GH) is formed at pressing component (PR) both sides.Pusher 212 '
Temperature sensor 212 ' -6 with the temperature for sensing pusher 212 ' itself.Temperature sensor 212 ' -6 indirectly measure by
The temperature for the semiconductor subassembly that pusher 212 ' is pressed.
Electronic unit is electrically connected to socket (SB) survey by declining when capturing electronic unit by pusher head 210 '
Try socket (TS).Therefore, pusher head 210 ' can along the longitudinal direction be moved horizontally and vertically moved along the vertical direction.
Vertically move body 220 ' to rise or fall pusher head 210 ', to be moved forward or rearward promotion towards socket (SB)
First 210 '.When the electronic unit by the certainly mobile shuttle (being referred to as " sliding stand " in prior art 2) of pusher head 210 ' clamps electronics
Part (D) or when releasing clamping, and when electronic unit (D) to be electrically connected to test jack (TS) or release connection, behaviour
Body 220 ' for vertical movement.
Horizontal moving body 230 ' moves horizontally pusher head 210 ' along the longitudinal direction.Herein, when the top for being moved to shuttle and
During the top of socket (SB), pusher head 210 ' is moved horizontally.
The test jack of socket guiding device (SG) guide socket plate (SB) is to be positioned at accurate location.Socket guiding device (SG)
With the exposing hole (EH) formed at the position corresponding to test jack and pusher 212 '.In addition, socket guiding device (SG)
It is described to wait each of guiding pin to be to insert in the bullport (GH) of pusher 212 ' with guiding pin, to be directed at pusher
212 ' position.That is, guiding pin (GP) electronic unit that finally induction is adsorbed and captured by pusher 212 ' is inserted with test
Accurate electrical connection between seat (TS).Socket guiding device (SG) is particularly suitable for use in the separator without test pallet, or is applicable
Inserted in the pusher 212 ' of the function wherein with clamping electronic unit (D) through realizing so that electronic unit (D) is forced into test
The separator of seat (TS) (as described above).
Meanwhile, electronic unit produces heat in test.Especially, such as the need for CPU arithmetical operation electronic unit
Produce amount of heat.In addition, because the temperature of the generation increase electronic unit of heat, is maintaining the appropriate temperature for testing
When spending, it hinders electronic unit tested person.
Korean Patent No. 10-0706216 and Korean Patent Publication case the 10-2009-0102625th (hereinafter referred to "
Prior art 3 ") open separator, it is described to wait each of separator to include being used to adjust the radiating of the temperature of electronic unit
Device.However, according to the separator of prior art 3 due to the labyrinth of pusher not good, and the durability in terms of productivity ratio
Aspect is deteriorated.
Korean Patent Publication case the 10-2008-0086320th (hereinafter referred to " prior art 4 ") a kind of open sorting
Machine, it includes airflow hole and pipeline, and the airflow hole is formed at for adjusting the temperature of electronic unit in pusher, and described
Pipeline is used for the air supply of regulation temperature to the airflow hole.However, prior art 4 be not applicable in be used to by
Vacuum pressure clamps the pusher of the structure of electronic unit, because the pusher can not have two incompatible work(
Can, that is, Incision Machine's and for supplying air to adjust the function of temperature.
In addition, the reliability of above-mentioned prior art reduction test, because adjusting electricity by temp regulating function
The reaction of the temperature of subassembly is slow.
The content of the invention
Technical problem
Therefore, the problems noted above of the invention for having made great efforts to solve to occur in prior art, and it is an object of the present invention to
The separator for testing electronic parts is provided, the separator includes heating component, and the heating component is placed in pusher
Go up and cooling fluid can be used to adjust the temperature of the electronic unit pressed by pusher.
Technical scheme
To reach above target, the present invention is provided to the separator of testing electronic parts, it includes：Supply part, its
For supplying electronic unit；Connection member, it is used for the test that the electronic unit supplied by supply part is connected to tester
Socket；Regulating member, it is used for the temperature for adjusting the electronic unit that test jack is electrically connected to by connection member；Recovery part,
It is used to reclaim the electronic unit by tester Complete test；And control unit, it is used to control all parts, wherein described
Connection member includes：Pusher head, it is used to press electronic unit towards test jack；And moving body, it is used for towards test jack
Forward or self-test socket is moved rearwards by pusher head, wherein the pusher head includes：Pusher, it is used to press towards test jack
Electronic unit；And cooling bag, the cooling fluid that it is connected on pusher and supplied by regulating member by the cooling bag,
And wherein described regulating member includes fluid supply machine, the fluid supply machine is used to cooling fluid being supplied in cooling bag
Portion.
Pusher includes temperature sensing component, and the temperature sensing component is used to sense to be pressed by pusher towards test jack
Electronic unit temperature.
The temperature sensing component further senses the temperature of pusher in itself.
Connection member further comprises socket guiding device, and there is the socket guiding device guiding to sell, and the guiding pin is used for
Guiding test jack guides the accurate location of pusher to be positioned at accurate location.Pusher includes metal master, the gold
One side of owner's body has pressing component, and another side is partly contacted with a part for cooling bag.
Pusher further comprises guiding elements, and the material that the guiding elements is less than pressing component by thermal capacity is made,
And with the bullport inserted with guiding pin.
Pusher includes：Thermoelectric components, it is installed on pusher to supply heat to by pusher towards test jack
The electronic unit of pressing；And metal master, it has the receiving slit for being used for receiving thermoelectric components wherein.
Metal master is contacted via the outward flange for forming receiving slit with cooling bag.
Pusher includes：Heater, its be installed on pusher with supply heat to by pusher towards test jack by
The electronic unit of pressure；And heat pipe, it is used for the exchanged heat between the cooling fluid and electronic unit being present in cooling bag
Amount.The heat pipe has a side being contacted with the cooling fluid inside cooling bag, and towards the electronic unit pressed
The another side of extension.
Pusher has insulated hole, and the insulated hole is formed at the position of the center section of positioning heat pipe.
Control unit controls to adjust part via the temperature-sensitive component of electronic unit according to the temperature measured, to control
The temperature of electronic unit processed.
Beneficial effect
The heating component that is placed on pusher can be reduced according to the separator for testing electronic parts of the present invention
Thermal capacity, cooling fluid and pusher come the rapid ministry of electronics industry for adjusting and being pressed by pusher via the supply of control cooling fluid
The temperature of part, so as to significantly increase the reliability in test.
Brief description of the drawings
Fig. 1 to 3 is the reference-view for explaining the typical separator for testing electronic parts.
Fig. 4 is the plan view of the separator for testing electronic parts according to embodiments of the invention.
Fig. 5 is the perspective illustration of the connection member applied to Fig. 4 separators.
Fig. 6 is the decomposition diagram of the pusher separated with the connection member of the 5th figure.
Fig. 7 is that the signal of the pusher of the connection member applied to Fig. 4 of the first preferred embodiment according to the present invention is cutd open
Face figure.
Fig. 8 is that the signal of the pusher of the connection member applied to Fig. 4 of the second preferred embodiment according to the present invention is cutd open
Face figure.
Symbol description
TH：Separator for testing electronic parts
SP：Supply part
WP：Recovery part
200：Connection member
210、210A、210B：Pusher head
211A、211B：Cooling bag
212、212A、212B：Pusher
212A-4：Thermoelectric components
212B-4：Heater
SG：Socket guiding device
220：Vertically move body
230：Horizontal moving body
300：Regulating member
310：Fluid supply machine
320：Flow control valve
500：Control unit
Embodiment
Presently preferred embodiments of the present invention is described in detail referring now to accompanying drawing.In order to simplify description, it will omit or shorten weight
Multiple description.
As shown in figure 4, according to separator (TH) (hereinafter referred to " sorting for testing electronic parts of the present invention
Machine ") include a pair of loading plates 111 and 112, the first moving body 120, a pair of movement shuttles (MS1 and MS2), connection member 200,
Regulating member 300, the second moving body 420 and control unit 500.
Electronic unit can be loaded on loading plate 111 and 112.Loading plate 111 and 112 has heater respectively, described etc.
Heater tests necessary temperature the electronic unit loaded to be heated to.Certainly, when test is carried out at room temperature,
Heater is stopped operation.
First moving body 120 is by consumer's pallet (CT1) electronic unit be moved to loading plate 111 and 112, or will load
The electronic unit of plate 111 and 112 is moved to the mobile shuttle (MS1) for being positioned at the left side.Therefore, the first moving body 120 is through installing
With can in left-right direction and fore-and-aft direction (reference arrow a and b) is mobile.
Electronic unit can be loaded on mobile shuttle (MS1 and MS2), and the mobile shuttle (MS1 and MS2) such as described is through placement
With can by after test position (TP) in left-right direction (referring to arrow C1And C2) mobile.
Connection member 200 electrically connects the electronic unit being loaded on mobile shuttle MS1 and MS2 at test position (TP) place
To the test jack (TS) for being positioned at the lower section of connection member 200.Therefore, as shown in solid lines in fig. 5, connection member 200 includes
Pusher head 210, socket guiding device (SG), vertically move body 220 and horizontal moving body 230.
Pusher head 210 has eight pushers 212.Therefore, once eight electronic units can be electrically connected to tester.When
So, the number for the pusher 212 being installed in pusher head 210 may depend on product to change.It can be described later by embodiment
Such pusher head 210.
The test jack (TS) of socket guiding device (SG) guide socket plate (SB) is to be accurately positioned.Socket guiding device (SG) has
There is an exposing hole (EH), the exposing hole formation such as described is at the position corresponding to test jack (TS) and pusher 212, to survey
Examination socket (TS) can expose to the open air towards pusher 212.In addition, socket guider (SG) has guiding pin (GP), it is described to wait guiding pin point
Cha Ru not be in the bullport (GH) of pusher 212, to be directed at the position of pusher 212.Such socket guiding device (SG) is divided into：
Socket guiding piece (SL) with exposing hole, test jack (TS) is inserted into the exposing hole such as described；And buttcover plate (DP), its
Accurate location for guide socket guiding piece (SL) is combined.If socket guiding device (SG) is divided into socket guiding piece (SL) and right
Fishplate bar (DP), then when installing equipment, socket guiding piece (SL) is combined into the buttcover plate (DP) being installed on separator (TH)
In the state of socket (SB), the buttcover plate is matched.For socket guiding piece (SL) is matched with buttcover plate (DP), socket guiding
Part (SL) has the matching pin (AP) for being used for guiding adjustment, and buttcover plate (DP) has the mating hole inserted with matching pin (AP)
(AH).Certainly, can integrally plate connector guiding piece and buttcover plate as typical separator.
Vertically move body 220 and rise or fall pusher head 210 (referring to arrow d).Therefore, pusher head 210 can be towards socket
(SB) move forward or be moved rearwards by from socket (SB), or moved forward or certainly mobile shuttle towards mobile shuttle (MS1 and MS2)
(MS1 and MS2) is moved rearwards by.
Horizontal moving body 230 moves pusher head 210 (referring to arrow e) along the longitudinal direction.Therefore, pusher head 210 can be in folder
Hold after electronic unit, electronic unit is alternately electrically connected to test in mobile shuttle (MS1) and mobile shuttle (MS2) place and inserted
Seat (TS).
In order to refer to, test chamber can be placed in test position (TP) region.Under the situation of placement test chamber, even
Relay part 200 or at least pusher head 210 is positioned inside test chamber.Certainly, the inside of test chamber is adjusted with survey
Try temperature necessary to electronic unit.
As shown in broken line in fig. 5, regulating member 300 includes fluid supply machine 310 and flow control valve 320.
Cooling fluid is supplied to pusher head 210 to reduce the temperature of electronic unit by fluid supply machine 310.
Flow control valve 320 controls the supply for the cooling fluid supplied by fluid supply machine 310.
Second moving body 420 will be present in the electronic unit tested being positioned on the mobile shuttle MS1 or MS2 on the right
It is moved to consumer's pallet (CT2), while waiting electronic unit classification by described according to test result.Therefore, the second moving body 420
Can be ((mobile referring to arrow g) referring to arrow f) or fore-and-aft direction in left-right direction.
Control unit 500 controls above-mentioned part.
For by consumer's pallet (CT1) electronic unit supplied to connection member 200 loading plate 111 and 112 and
First moving body 120 can be defined for supplying the supply part (SP) of electronic unit, and by by tester Complete test
Electronic unit is towards consumer's pallet (CT2) the second mobile moving body 420 can be defined as recovery part (WP).Herein, a pair
Mobile shuttle MS1 and MS2 may depend on its position to serve as supply part (SP) or recovery part (WP).
Next, will describe according to the pusher head 210 of presently preferred embodiments of the present invention.
<According to the pusher head of first embodiment>
As shown in fig. 6, according to the present invention the first preferred embodiment pusher head 210A include four cooling bag 211A and
Eight pusher 212A.Two pusher 212A correspond to a cooling bag 211A.Certainly, pusher, three or three
Above pusher or all pushers can correspond to a cooling bag according to embodiment.
Cooling bag 211A has the entrance (IH) for the inflow for being used to allow cooling fluid and the stream for allowing cooling fluid
The outlet (OH) gone out.In addition, cooling bag 211A has a plurality of heat exchanger plates (HCP), it is described to wait heat exchanger plate to be formed at cooling
Inside bag 211A, and extend internally to carry out heat exchange from outer wall (OW).That is, the cooling stream supplied from fluid supply machine 310
Body flows into cooling bag 211A via entrance (IH), and is then passed through after the flow channel by being formed by heat exchanger plate (HCP)
By exporting (OH) outflow.In the case, the cold air of cooling fluid is passing through the cooling bag 211A with heat exchanger plate (HCP)
And through after pusher 212A, it is transferred quickly to electronic unit.In other words, the heat of electronic unit is passing through pusher 212A
Afterwards, cooling fluid is flowed out to rapidly via cooling bag 211A.
As shown in fig. 7, pusher 212A include contact component 212A-1, pressing component 212A-2, guiding elements 212A-3,
Thermoelectric components 212A-4, temperature sensing component 212A-6, temperature sensor (PTS) and clamping mould 212A-7.
Contact component 212A-1 and pressing component 212A-2 is integrally formed metal master.
Contact component 212A-1 is formed at a side (upside in diagram) for metal master, and the metal master has
There is receiving slit (ES), the receiving slit is formed at a side of the metal master, for receiving thermoelectric components 212A-4.
In this embodiment, contact component 212A-1 is placed in receiving slit (ES) outer edge.Certainly, it is contemplated that cooling capacity is set
Contact component 212A-1 contact is counted to cooling bag 211A contact area.
Pressing component 212A-2 is formed at the another side (downside in diagram) of metal master, and with from contact component
The rectangle post shapes that 212A-1 extends towards electronic unit (along along schema in downward direction) are formed.By pressing component 212A-2's
Lower end presses electronic unit.
In addition, metal master has free-air path (VT), vacuum pressure can be inputted to the ministry of electronics industry via the free-air path
Part, and be formed at for the mounting hole (IS) for installing temperature sensing component 212A-6 in pressing component 212A-2 bottom side.
The material that guiding elements 212A-3 is less than metal master by thermal capacity is made, the material such as such as epoxy resin
The material based on resin, and the guiding elements has a bullport (GH), and the guiding pin (GP) of socket guiding device (SG) is respectively
It is inserted into described bullport of Denging.Therefore, when in guiding pin (GP) the insertion bullport (GH) of socket (SB), it is precisely directed to
Pusher 212A position.
In order to refer to, generally, owner's formation one in contact component, pressing component and guiding elements is integrally formed
Metal master.In the case, electronic unit is reacted because the thermal capacity of metal master becomes slower according to temperature controlled, and
The reliability of the reaction deterioration test.Therefore, in the present invention, metal master, and guiding elements are pruned carefully as far as possible
212A-3 is attached to reduction part to minimize the thermal capacity of metal master.Therefore, electronic unit can be reached rapidly and depends on temperature
Spend the thermotonus of the operation of regulatory function.
Thermoelectric components 212A-4 systems are put into receiving slit (ES), and according to the control of control unit 500 by applying heat extremely
Pressing component 212A-2.Thermoelectric components 212A-4 has the function of according to circumstances blocking from the cooling bag 211A cold airs flowed.
Therefore, flowed into for the cold air that makes cooling bag 211A in metal master, metal master is to form receiving slit (ES) outward flange
(OE) assembled with the cooling bag 211A modes contacted.
Temperature sensing component 212A-6 is installed in mounting hole (IS), to sense the electronic unit pressed by pusher 212A
Surface temperature.In addition, the temperature information sensed is transferred to control unit 500.Certainly, to be accurate under the temperature conditionss needed for
Testing electronic parts, should sense the internal temperature of electronic unit.However, the restricted of presence is：Electronic unit can only be sensed
Surface temperature because temperature sensing should not damage product.Therefore, it is to come relatively accurately via the surface temperature of electronic unit
The internal temperature of electronic unit is estimated, many experiments should be constantly carried out.Therefore, experimental data should be used according to the table of electronic unit
The information of face temperature carrys out operation temperature regulatory function.
Temperature sensor (TS) senses the temperature of metal master.
In this embodiment, the temperature and temperature sensor of electronic unit are sensed with temperature sensing component 212A-6
(PTS) mode of the temperature of sensing metal master assembles separator.
However, temperature sensor (PTS) can be omitted whenever necessary.In the case, temperature sensing component 212A-6 can feel
Survey the temperature of electronic unit or the temperature of metal master.For example, when pusher 212A is contacted with electronic unit, temperature sensing group
Part 212A-6 senses the temperature of electronic unit, but when pusher 212A is separated with electronic unit, temperature sensing component 212A-6
Sense the temperature of metal master.
Clamping mould 212A-7 is formed at the shape of rectangular frame at pressing component 212A-2 lower end.Clamp mould
212A-7 will be positioned in clamping the face seal of the electronic unit inside mould 212A-7, to draw via free-air path (VT)
The vacuum pressure entered can put on the surface of electronic unit.
Next, description to be utilized to the behaviour of the basic element of character of the separator (TH) with pusher head 210A of above structure
Make.
Setting test temperature for test is increased to for the temperature of the electronic unit by test jack (TS) is pressed into, control
The increase thermoelectric components of part 500 212A-4 processed output.In the case, whenever necessary, can be by the confession for reducing cooling fluid
It should measure to reduce the cold air flowed into pusher 212A via cooling bag 211A.Therefore, electronic unit is tested rapidly with setting
Temperature is assimilated, and in above state, carries out the test of electronic unit.However, during testing, when electronic unit temperature by
When producing and increasing in the heat of electronic unit in itself, control unit is via the ministry of electronics industry for being received from temperature sensing component 212A-6
The temperature information on the surface of part suitably reduces thermoelectric components 212A-4 output.Whenever necessary, the controlling stream of control unit 500
Control valve 320 is to increase the supply of cooling fluid.Meanwhile, when reducing thermoelectric components 212A-4 output, via cooling
Bag 211A is relatively small to having via contact component 212A-1 outward flange (OE) input from the cold air for cooling down flow of fluid
Thermal capacity pusher 212A, and input to pusher 212A cold air as reduction as many rapid turn of thermal capacity
Move to electronic unit.Therefore, the temperature of electronic unit is rapidly reached design temperature.
Certainly, when being down at a temperature of electronic unit below design temperature, the temperature of electronic unit is via acting in opposition
Increase to design temperature.
In this embodiment, the supply of cooling fluid and thermoelectric components 212A-4 control by control unit 500 complementally
Control.
In this embodiment, temperature is controlled rapidly via the supply of cooling fluid and thermoelectric components 212A-4 control.
However, to be accurate and be finely controlled temperature in more stable mode, two variables (that is, the supply of cooling fluid and thermoelectricity
The control of component) any one of it is fixed, and another one only can be used.Especially, when fixed thermoelectric components 212A-4 output
During the supply of value and control cooling fluid, more stable result can be obtained.In addition, ought not only change the supply of cooling fluid
And when changing the temperature of cooling fluid, the present invention may achieve the quick control of temperature.
<According to the pusher head of second embodiment>
Pusher head according to the second embodiment of the present invention also includes four cooling bags and eight pushers.
Because identical with the cooling bag according to first embodiment according to the cooling bag of second embodiment, it will omit to cold
But the description of bag.
As shown in figure 8, each of pusher 212B includes contact component 212B-1, pressing component 212B-2, guiding
Component 212B-3, heater 212B-4, heat pipe 212B-5, temperature sensing component 212B-6 and clamping mould 212B-7.
Contact component 212B-1 is contacted with cooling bag 211B.
Pressing component 212B-2 is formed in the form of the rectangular column extended downwardly from contact component 212B-1.
In the same manner, contact component 212B-1 and pressing component 212B-2 is an integrally formed metal master, and
The metal master has free-air path (VT), and vacuum pressure can be inputted to electronic unit via the free-air path.
The material that guiding elements 212B-3 is less than metal master by thermal capacity is made, and with bullport (GH), socket draws
The guiding pin (GP) for leading device (SG) is inserted into described bullport of Denging respectively.
Heater 212B-4 is installed at pusher 212B contact component 212B-1, and according to the control of control unit 500
Make applying heat to metal master.
Heat pipe 212B-5 has the upside that is contacted with the cooling fluid inside cooling bag 211B, and towards the electricity pressed
The another side of subassembly (D) extension.Therefore, the cold air of the cooling fluid of cooling bag 211B internal flows is along heat pipe
212B-5 is transferred quickly to pusher 212B end portion, and electronic component placing is on the end portion.Therefore, it is reached
The rapid temperature control reaction of electronic unit.Escaped into minimize by contact component 212B-1 and pressing component 212B-2 groups
Into the cold air of metal master shift cold air by heat pipe 212B-5 simultaneously, the metal master has insulated hole
(IH), the insulated hole is formed at the position of positioning heat pipe 212B-5 center section.Certainly, insulated hole (IH) can be filled
There is insulating materials.
Meanwhile, temperature sensing component 212B-6 and clamping mould 212B-7 description will be omitted, because they are real with first
The temperature sensing component and clamping mould applied in example are identical.
Next, description to be utilized to the behaviour of the basic element of character of the separator (TH) with pusher head 210B of above structure
Make.
Setting test temperature for test is increased to for the temperature of the electronic unit by test jack (TS) is pressed into, control
The increase heater of part 500 212B-4 processed output.Whenever necessary, can by reduce cooling fluid supply come reduce via
The cold air that cooling bag 211B is flowed into pusher 212B.Therefore, electronic unit assimilates rapidly with setting test temperature, and gives
Test.However, during testing, if the temperature of electronic unit is because the heat of itself is produced and is increased, control unit warp
Heater 212B-4 is suitably reduced by the temperature information on the surface for the electronic unit for being received from temperature sensing component 212B-6
Output.Whenever necessary, control unit 500 controls flow control valve 320 to increase the supply of cooling fluid.Meanwhile, when subtracting
During few heater 212B-4 output, inputted rapidly to pusher from the cold air for cooling down flow of fluid via heat pipe 212B-5
212B lower end, and it is subsequently transferred to electronic unit.Therefore, the temperature of electronic unit is rapidly reached design temperature.
When being down at a temperature of electronic unit below design temperature, the temperature of electronic unit is increased to via acting in opposition
Design temperature.
In this embodiment, the supply of cooling fluid and heater 212B-4 control are complementally controlled by control unit 500
System.Certainly, the supply of cooling fluid can be fixed and by any one of heater 212B-4 heats supplied.
Meanwhile, in the description herein, the present invention is divided into first embodiment and second embodiment, but first embodiment and second
Embodiment can according to circumstances be applied to a product.In other words, thermoelectric components 212A-4 and heater 212B-4 can mount to one
Individual pusher.
<With reference to details>
In order to refer to, depending on the species of electronic unit, separator of the invention can have temperature-sensitive component, such as hot two pole
Manage (for example, with the semiconductor device for being placed in thermal diode therein).In the case, the voltage of thermal diode can be used
Value measures the internal temperature of electronic unit.In the case, control unit 500 can be based on the temperature-sensitive component via electronic unit
The temperature of measurement controls the temperature of electronic unit, and the electronic unit is in the case of no operation, omit or install
In the state of temperature sensing component.
Certainly, according to circumstances, control unit 500 can be measured by utilizing or combining via the temperature-sensitive component of electronic unit
The owner in temperature and the temperature sensed by temperature sensing component 212A-6 or 212B-6 controls the temperature of electronic unit.Example
Such as, control unit 500 by the temperature of the temperature-sensitive component measurement via electronic unit and by temperature sensing component 212A-6 or
The average value or weighted average of the temperature of 212B-6 sensings then control electricity to calculate temperature according to the temperature calculated
The temperature of subassembly.
As described above, although refer to the exemplary embodiment special exhibition of alterations and the present invention and describe this hair
It is bright, but general those skilled in the art will be understood that disclosed embodiment of this invention is exemplary, and the invention is not restricted to particular implementation
Example.It should also be understood that should by claims below and belong to the present invention technology category the claim etc.
Concept is imitated to explain the protection category of the present invention.
Claims (10)
1. a kind of separator for testing electronic parts, it is included：
Supply part, it is used to supply electronic unit；
Connection member, it is used for the test jack that the electronic unit supplied by the supply part is electrically connected to a tester；
Regulating member, it is used for the temperature for adjusting the electronic unit that the test jack is electrically connected to by the connection member
Degree；
Recovery part, it is used to reclaim the electronic unit for completing test by the tester；And
Control unit, it is used to control each part,
Wherein described connection member is included：Pusher head, it is used to press electronic unit towards the test jack；And moving body,
It is used to be moved rearwards by the pusher head forward or from the test jack towards the test jack,
Wherein described pusher head is included：Pusher, it is used to press the electronic unit towards the test jack；And cooling
Bag, the cooling fluid that it is connected on the pusher and supplied by the regulating member by the cooling bag, and
Wherein described regulating member includes fluid supply machine, and the fluid supply machine is used to cooling fluid being supplied to the cooling
Bag is internal.
2. it is used for the separator of testing electronic parts as claimed in claim 1, wherein the pusher includes temperature sensing group
Part, the temperature sensing component is used for the temperature for sensing the electronic unit pressed by the pusher towards the test jack.
3. it is used for the separator of testing electronic parts as claimed in claim 1, wherein the temperature sensing component is further felt
Survey the temperature of the pusher in itself.
4. it is used for the separator of testing electronic parts as claimed in claim 1, wherein the connection member is further comprising slotting
Seat guiding device, the socket guiding device has a guiding pin, and the guiding pin is used to guide the test jack to be positioned at standard
True position, and the accurate location of the guiding pusher, and
Wherein described pusher includes metal master, and a side of the metal master is formed by pressing component, and opposite side
An a part of part with the cooling bag is contacted.
5. it is used for the separator of testing electronic parts as claimed in claim 4, wherein the pusher is further comprising guiding
Component, the material that the guiding elements is less than the pressing component by thermal capacity is made, and drawing with the insertion guiding pin
Guide hole.
6. it is used for the separator of testing electronic parts as claimed in claim 1, wherein the pusher is included：
Thermoelectric components, it is installed on the pusher, with supply heat to by the pusher towards the test jack by
The electronic unit of pressure；And
Metal master, it has the receiving slit for being used for receiving the thermoelectric components wherein.
7. it is used for the separator of testing electronic parts as claimed in claim 6, wherein the metal master is described via being formed
The outward flange of receiving slit is contacted with the cooling bag.
8. it is used for the separator of testing electronic parts as claimed in claim 1, wherein the pusher is included：
Heater, it is installed on the pusher, is pressed with supplying heat to by the pusher towards the test jack
The electronic unit；And
Heat pipe, it is used for the heat-shift between the cooling fluid and the electronic unit being present in the cooling bag,
Wherein described heat pipe has a side being contacted with the cooling fluid inside the cooling bag, and towards being pressed
The another side of electronic unit extension.
9. it is used for the separator of testing electronic parts as claimed in claim 8, wherein the pusher has insulated hole, it is described
Insulated hole, which is formed at, to be disposed with the position of the center section of the heat pipe.
10. it is used for the separator of testing electronic parts as claimed in claim 1, wherein the control unit is according to via described
Temperature that the temperature-sensitive component of electronic unit is measured controls the regulating member, to control the temperature of the electronic unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911041722.0A CN110780133B (en) | 2014-11-28 | 2015-10-28 | Sorting machine for testing electronic components |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0168196 | 2014-11-28 | ||
| KR20140168196 | 2014-11-28 | ||
| KR1020150145852A KR102433967B1 (en) | 2014-11-28 | 2015-10-20 | Handler for electric device test |
| KR10-2015-0145852 | 2015-10-20 | ||
| PCT/KR2015/011400 WO2016085135A1 (en) | 2014-11-28 | 2015-10-28 | Handler for testing electronic component |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911041722.0A Division CN110780133B (en) | 2014-11-28 | 2015-10-28 | Sorting machine for testing electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107110910A true CN107110910A (en) | 2017-08-29 |
| CN107110910B CN107110910B (en) | 2020-03-24 |
Family
ID=56193873
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580058183.5A Active CN107110910B (en) | 2014-11-28 | 2015-10-28 | Sorting machine for testing electronic components |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102433967B1 (en) |
| CN (1) | CN107110910B (en) |
| TW (1) | TWI593969B (en) |
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|---|---|---|---|---|
| CN107282474A (en) * | 2016-04-12 | 2017-10-24 | 泰克元有限公司 | Separator for testing electronic parts |
| CN109425908A (en) * | 2017-08-31 | 2019-03-05 | 精工爱普生株式会社 | Electronic component transmission device and electronic component check device |
| CN110244141A (en) * | 2018-03-09 | 2019-09-17 | 泰克元有限公司 | Sorting machine is used in electronic component test |
| CN112255472A (en) * | 2019-07-02 | 2021-01-22 | 细美事有限公司 | Semiconductor package testing device |
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| US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
| JP7045995B2 (en) | 2016-01-08 | 2022-04-01 | エイアー テスト システムズ | Methods and systems for equipment thermal control in electronic test equipment |
| KR101941202B1 (en) * | 2016-10-27 | 2019-01-22 | 주식회사 티에프이 | Apparatus for holding and pressing semiconductor package |
| KR102592861B1 (en) * | 2018-04-13 | 2023-10-23 | (주)테크윙 | Transfer device |
| KR102036673B1 (en) * | 2018-07-20 | 2019-10-25 | 최병규 | Cooling Module and pusher assembly of handler for testing semiconductor elements having it |
| JP7143246B2 (en) * | 2019-05-23 | 2022-09-28 | 株式会社アドバンテスト | Electronic component handling equipment and electronic component testing equipment |
| KR102249401B1 (en) * | 2020-05-14 | 2021-05-07 | 주식회사 티에프이 | Socket module associated with semiconductor test |
| TWI825981B (en) * | 2022-09-07 | 2023-12-11 | 京元電子股份有限公司 | Testing system and testing device thereof and testing method |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201632888A (en) | 2016-09-16 |
| KR102433967B1 (en) | 2022-08-22 |
| TWI593969B (en) | 2017-08-01 |
| KR20160064964A (en) | 2016-06-08 |
| CN107110910B (en) | 2020-03-24 |
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