KR100867888B1 - Duct for Semiconductor Testing Handler and Testing Handler comprising the same - Google Patents

Abstract

The present invention includes a temperature composition for adjusting the temperature of the fluid supplied from the blower so that the semiconductor devices contained in the test tray is maintained at a constant temperature corresponding to the test conditions; A main body opened to a test board side such that the temperature-controlled fluid is delivered to the semiconductor devices; A flow path forming unit installed inside the main body and configured to change a flow direction of the fluid so as to form a plurality of flow paths such that the fluid is transferred to each of the regions contained in the test tray; And a duct for a semiconductor device test handler including a flow rate controller configured to adjust a flow rate of each of the fluids flowing through the plurality of flow paths.

According to the present invention, by controlling the flow rate of the temperature-controlled fluid for each zone of the test tray containing the semiconductor devices, it is possible to efficiently maintain the semiconductor devices changed to a different temperature for each zone at a constant temperature corresponding to the test conditions As a result, the accuracy and yield of test results can be improved.

Duct, Handler, Test Tray, Semiconductor

Description

Ducts for semiconductor device test handlers and test handlers including the same {Duct for Semiconductor Testing Handler and Testing Handler comprising the same}

1 is a plan view schematically illustrating a conventional semiconductor device test handler and a test apparatus for testing a semiconductor device by bonding to the handler.

2 is a perspective view of a duct for a semiconductor device test handler according to an embodiment of the present invention;

3 is an exploded perspective view of a duct for a semiconductor device test handler according to an embodiment of the present invention;

Figure 4 is a schematic cross-sectional view showing a fluid flow state in the duct for the semiconductor device test handler according to an embodiment of the present invention

FIG. 5 is a plan view schematically illustrating a configuration of a semiconductor device test handler and a test device for testing a semiconductor device by bonding to the handler according to another embodiment of the present invention; FIG.

Figure 6 is a perspective view showing the arrangement of the duct is installed to be stacked up and down in the semiconductor device test handler according to another embodiment of the present invention

7 is a perspective view of a combination of the duct and the contact pushing unit in the semiconductor device test handler according to another embodiment of the present invention

* Description of the symbols for the main parts of the drawings *

1, 1a, 1b: Ducts for semiconductor device test handlers 2, 2a, 2b: Blower

3: Temperature Composition Part 4: Body 4a: Inner Space 4b: Both Side Walls

5, 5a, 5b, 5c: flow path forming portion 6, 6a, 6b: flow control unit 7, 7a, 7b: flow path switching unit

8, 8a, 8b: support 21, rotary blade 22: rotary shaft 41: communication hole 42: receiving portion

42a: groove 43: flow control fixed hole 44: flow control guide hole 45: flow path conversion fixed hole

46: euro conversion guide 47: support guide 51: curved body

61, 61a, 61b: flow control rotation shaft 62: flow control movement port 71: flow path switching rotation shaft

72: flow path switching port 10: semiconductor device test handler

DESCRIPTION OF SYMBOLS 11 Blocking part 12 Separation part 13 1st chamber 14 Test part 15 2nd chamber

16: test board 141: contact pushing unit 1411: drive unit A, B, C: flow path

Reference Signs List 100 Conventional Semiconductor Device Test Handler 101 First Chamber 102 Test Unit

103: second chamber 104: test board 1021: contact pushing unit

The present invention relates to a handler for testing semiconductor devices, and more particularly, to a duct for a semiconductor device test handler for creating a constant temperature condition in a plurality of semiconductor devices to be tested and a test handler including the same.

In general, memory ICs or non-memory semiconductor devices and module ICs having them configured appropriately on a substrate are shipped after various tests after production.

Electronic components such as memory or non-memory semiconductor elements (hereinafter, referred to as "semiconductor elements") are electrically connected to a test apparatus and their characteristics are inspected. An apparatus for supplying semiconductor devices to the test apparatus is a handler apparatus. .

Such a handler tests a plurality of semiconductor devices at once and classifies them according to the test results.

Recently, in order to examine not only the performance of semiconductor devices at room temperature, but also the performance of semiconductor devices in extreme conditions, an extreme temperature environment of high temperature and low temperature can be created through an electric heater and a liquid nitrogen injection system. Test handlers with closed chambers have been developed.

To this end, the semiconductor devices to be tested are mounted in a test tray and tested.

The test tray is usually arranged with a plurality of carrier modules in which one semiconductor element is stored, and stored in the carrier module so that the semiconductor elements can be fixed and released.

FIG. 1 is a plan view schematically illustrating a conventional semiconductor device test handler and a test apparatus for testing a semiconductor device by bonding to the handler.

In particular, FIG. 1 shows a plan view of a chamber portion of a test handler and a test board of a test apparatus in direct contact with the handler. The chamber portion of the handler includes a first chamber 101, a test unit 102, and a second chamber 103.

In the first chamber 101, the test tray T is heated or cooled while being transferred step by step, and the semiconductor devices contained in the test tray T are adjusted to a temperature corresponding to the test condition.

The test tray T adjusted to the testable temperature from the first chamber 101 is transferred to the test unit 102. Subsequently, the test tray T is pushed toward the test board 104 by the contact pushing unit 1021 formed on one side of the test unit 102, and the semiconductor devices contained in the test tray T are electrically tested.

When the electrical test of the semiconductor device by the test board 104 is completed, the contact pushing unit 1021 is released from the test tray T, and the test tray T is transferred to the second chamber 103. .

The test tray T transferred to the second chamber 103 is restored to room temperature while being transferred by one step in the second chamber 103.

Here, the semiconductor devices contained in the test tray T located in the test unit 102 should be tested at a constant temperature.

However, in practice, the semiconductor devices contained in the test tray T may be transferred to the test board 104 while the test tray T is transferred from the first chamber 101 to the test unit 102, or Partial heat loss occurs during the electrical connection to the test board 104, so that the test can be performed without maintaining the constant temperature.

This means that even if the semiconductor devices are contained in one test tray T, the test class is not reliable.

This problem is becoming a bigger problem as semiconductor devices are integrated and miniaturized, so that a large number of semiconductor devices are contained in one test tray T.

The present invention has been made to solve the above problems,

It is an object of the present invention to provide a duct for a semiconductor device test handler and a test handler including the same so that the test is performed while the semiconductor devices contained in the test tray are maintained at a constant temperature corresponding to the test conditions.

Another object of the present invention is to meet the trend of recent integration of semiconductor devices and to miniaturize to obtain accurate test results, and thus to include a duct for a semiconductor device test handler that can improve the reliability and yield of the test Its purpose is to provide a test handler.

The duct for the semiconductor device test handler and the test handler including the same according to the present invention for achieving the above object of the present invention includes the following configuration.

A duct for a semiconductor device test handler according to an embodiment of the present invention includes a temperature composition unit configured to adjust a temperature of a fluid supplied from a blower so that semiconductor devices contained in a test tray are maintained at a constant temperature corresponding to a test condition; A main body opened to a test board side such that the temperature-controlled fluid is delivered to the semiconductor devices; A flow path forming unit installed inside the main body and configured to change a flow direction of the fluid so as to form a plurality of flow paths such that the fluid is transferred to each of the regions contained in the test tray; And a flow rate controller configured to adjust a flow rate of each of the fluids flowing through the plurality of flow paths.

Therefore, even when a plurality of semiconductor devices contained in the test tray are changed to different temperatures in each zone, the semiconductor devices may be maintained at a constant temperature corresponding to the test conditions by adjusting the fluid to be transferred at different flow rates in each zone. Improve the accuracy and yield of test results.

According to another aspect of the present invention, a semiconductor device test handler includes: a first chamber configured to adjust semiconductor devices contained in a test tray to a temperature corresponding to a test condition; A test unit having a contact pushing unit for connecting semiconductor elements contained in a test tray transferred from the first chamber to a test board; A duct coupled to the contact pushing unit and including a blocking unit for preventing fluid from leaking between the mating surfaces of the contact pushing unit and maintaining the semiconductor elements contained in the test tray at a constant temperature; And a second chamber that receives the test tray that has been tested from the test unit and restores the test tray to room temperature.

Therefore, heat loss that may occur in the process of transferring the temperature-controlled fluid to the semiconductor devices contained in the test tray may be minimized, thereby improving work efficiency and minimizing work time delay.

Here, the present invention is divided into an embodiment of a duct for a semiconductor device test handler, and another embodiment of a semiconductor device test handler including the duct.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of the configuration of the duct for the semiconductor device test handler as an embodiment of the above-described embodiment will be described in detail.

2 is a perspective view of a duct for a semiconductor device test handler according to an embodiment of the present invention, FIG. 3 is an exploded perspective view of a duct for a semiconductor device test handler according to an embodiment of the present invention, and FIG. 4 is an embodiment of the present invention. A cross-sectional view schematically showing a state in which a fluid flows in a duct for a semiconductor device test handler according to an embodiment.

2 and 3, a duct 1 for a semiconductor device test handler according to an exemplary embodiment of the present invention may include a blower 2, a temperature forming part 3, a body 4, and a flow path forming part 5. , Flow rate control unit 6, flow path switching unit 7, and support 8.

The blower 2 is coupled to the outside of the main body 4 to supply fluid to the inside of the main body 4, a plurality of rotary blades 21 is provided to rotate around the rotating shaft 22, the main body The fluid is supplied to the inside of (4), and the fluid may be used as air.

The temperature composition part 3 is installed inside the main body 4 to heat or cool the temperature of the fluid supplied from the blower 2, and to keep the semiconductor elements contained in the test tray at a constant temperature corresponding to the test conditions. To control the temperature of the fluid, a heat transfer heater or a liquid nitrogen injection system may be used.

The main body 4 is formed to be opened to the test board side while defining an inner space 4a so as to transfer the fluid supplied from the blower 2 to the test board side. In addition, the main body 4 transmits the fluid whose temperature is controlled by the temperature composition part 3 to the test board side, the communication hole 41, the receiving portion 42, the flow control fixed hole 43, the flow rate control And a guide hole 44, a flow path switching hole 45, a flow path switching guide ball 46, and a support guide ball 47.

The communication hole 41 is a rectangular plate-shaped through hole formed on the upper side of the main body 4, and is a passage for introducing the fluid supplied from the blower 2 into the inner space 4a of the main body 4.

The accommodating part 42 accommodates the temperature composition part 3 inside the main body 4 and includes a '⊂' shaped groove 42a formed in both side walls 4b of the main body 4, Through the groove 42a, the temperature composition part 3 may be connected to a power supply part (not shown) provided at the outside.

The flow rate control fixing hole 43 is a through hole formed in both side walls (4b) of the main body 4, the flow rate control part 6 is rotatably coupled.

2 to 4, the flow rate adjusting guide hole 44 is a through-hole formed near the upper side of the flow rate adjusting hole 43 at both side walls 4b of the main body 4. In addition, the flow control guide hole 44 is a rectangular through-hole formed by extending a predetermined length horizontally in both sides with respect to the flow control fixing hole 43, the movement distance during the rotation of the flow control unit 6 It defines, and guides the movement path of the flow control unit (6).

On the other hand, the flow control guide hole 44 and the flow control fixing hole 43 is preferably formed in a number corresponding to the number provided with the flow control unit (6). For example, as shown in FIG. 3, when two flow rate adjusting units 6 are provided, two pairs of flow rate adjusting guides 44 and flow rates are separated from each side wall 4b of the main body 4 by a predetermined distance. The control fixing hole 43 may be formed.

In addition, in this case, the plurality of flow control guide holes 44 are arranged on the same horizontal line so that the mutual flow does not occur when the plurality of flow control units 6 rotate. It is preferred that they are formed spaced apart from each other at different distances.

The flow path switching fixing hole 45 is a through hole formed in both side walls (4b) of the main body 4, the flow path switching portion 7 is rotatably coupled.

The flow path switching guide hole 46 is a through hole formed spaced apart from the flow path switching hole 45 on both side walls (4b) of the body (4). In addition, the flow path switching guide hole 46 is a rectangular through-hole formed vertically extending vertically up and down with respect to the flow path switching fixing hole 45, the movement distance during the rotation of the flow path switching unit (7) It is prescribed, and guides the movement path of the flow path switching unit (7).

The support guide hole 47 is a through hole formed in both side walls 4b of the main body 4, and the support 8 is movably coupled thereto. In addition, the support guide hole 47 is preferably formed as a rectangular through-hole is formed to extend a predetermined length horizontally to guide the movement path while defining the movement distance during the movement of the support (8).

3 and 4, the flow path forming part 5 is installed in the inner space 4a of the main body 4 and includes a curved body 51 that is bent at a predetermined inclination angle. The transfer direction is switched so that the fluid supplied to the inner space 4a of the fluid is directed to the test tray in the test unit. In addition, the flow path forming part 5 forms a plurality of flow paths while dividing the inner space 4a, and accordingly, the temperature-controlled fluid is transferred to each zone of the test tray through the temperature composition part 3. do.

As described above, the flow path forming part 5 partially loses heat while the semiconductor elements contained in the test tray are transferred to the test board, while being transferred to the test board, or electrically connected to the test board. This occurs because the temperature change may occur.

Therefore, as shown in FIG. 4, the flow path forming unit 5 is configured to transfer the fluid having a temperature controlled to the lower side, the middle side, and the upper side of the test tray, respectively. B), and the first flow path forming portion 5a, the second flow path forming portion 5b, and the third flow path forming portion 5c forming the third flow path C are preferably included. In this case, the first flow path forming portion 5a, the second flow path forming portion 5b, and the third flow path forming portion 5c form a plurality of flow paths A, B, and C. As shown in, it is preferred that each is formed in a different size.

Meanwhile, the number of the flow path forming parts 5 and the number of the flow paths formed therein may be formed in a number corresponding to the number of areas to be transmitted by dividing the semiconductor devices contained in the test tray by area.

Referring to FIG. 3, the flow rate control part 6 is formed in a rectangular plate shape as a whole, and controls the flow rate of each of the fluids flowing through the plurality of flow paths formed by the flow path forming part 5. Accordingly, the flow rate control unit 6 allows the semiconductor devices to adjust temperature for each zone contained in the test tray, and includes a flow rate control rotation shaft 61 and a flow rate control movement hole 62.

Referring to FIG. 4, the flow rate adjusting part 6 may be changed to different temperatures according to the location of each region in which the semiconductor devices are contained in the test tray, and thus the opening areas of the plurality of flow paths A, B, and C, respectively. Adjust the flow rate of each of the fluid flowing through the flow path (A, B, C). Thus, semiconductor devices changed at different temperatures for each zone are kept at a constant temperature corresponding to the test conditions. In this case, the flow rate control unit 6 can adjust the flow rate of the fluid delivered to each zone of the test tray more accurately and efficiently according to the opening area of each of the plurality of flow paths (A, B, C), each flow path It is preferable to be provided in the inlet side of (A, B, C).

3 and 4, the flow rate control rotation shaft 61 is a protrusion rotatably coupled to the flow rate control fixing hole 43 of the main body 4, and functions as a rotation axis of the flow rate control unit 6. . Therefore, the flow rate control part 6 rotates about the flow rate control rotation shaft 61 to adjust the opening area of each of the plurality of flow paths A, B, and C, without impeding the flow of the fluid. It is possible to adjust the flow rate of each of the fluids.

In addition, the flow rate control rotation shaft 61 is preferably provided on the boundary line of the plurality of flow path (A, B, C). This is to install the first flow rate control part 6a and the second flow rate control part 6b on the same line as the second flow path forming part 5b and the third flow path forming part 5c, respectively. Accordingly, the first flow rate control part 6a adjusts the open areas of the first flow path A and the second flow path B while rotating about the first flow rate control rotation shaft 61a. The flow rate adjusting part 6b may adjust the open areas of the second flow path B and the third flow path C while rotating about the second flow control rotation shaft 61b. Therefore, the flow rate adjusting unit 6 may be provided with a smaller number than the number of the flow paths A, B, and C, thereby reducing manufacturing costs and improving work efficiency. In addition, in this case, since the opening area of the second flow path B is controlled by the first flow rate control part 6a and the second flow rate control part 6b, the second flow path B can be adjusted to a wider variety of open areas, thereby providing a flow rate of the fluid. And it is possible to further improve the accuracy of the temperature control for the semiconductor devices accordingly.

The flow rate control opening (62) is a protrusion inserted to move to the flow rate adjustment guide hole 44, the plurality while moving in the state inserted into the flow rate adjustment guide hole 44 during the rotation of the flow rate control section (6) The flow rate of the fluid flowing through the two flow paths (A, B, C) is adjusted.

In addition, the flow rate control movement hole 62 is the flow rate adjustment guide hole 44 and the flow rate adjustment fixing hole 43 so as not to interfere with each other during the rotation of the plurality of flow rate control unit 6 as described above Similarly, a plurality of spaced apart from the flow rate control rotation shaft 61 at different distances may be formed. Therefore, the first flow rate control part 6a and the second flow rate control part 6b are preferably formed in different sizes.

3 and 4, the flow path switching unit 7 is formed in a rectangular plate shape as a whole, rotatably coupled to the main body 4 to adjust the flow direction and flow rate of the fluid, the flow path switching rotary shaft ( 71) and a flow path switching port 72.

In addition, the flow path switching unit 7 rotates and adjusts the opening area of the inlet side D of the third channel C, and is discharged to the outlet side E of the third channel C. Adjust the direction of fluid delivery. Therefore, it is possible to more efficiently control the delivery direction of the fluid discharged to the last row side of the semiconductor elements contained in the test tray through the third passage (C). In this case, when the flow path switching unit 7 rotates upward (7a), the flow direction of the fluid discharged through the third flow path C may be switched to face the center direction of the test tray, and rotate downward. The lower surface 7b may distribute the delivery direction of the fluid discharged through the third channel C to the outside of the test tray.

The flow path switching rotation shaft 71 is a projection rotatably coupled to the flow path switching fixed hole 45, and functions as a rotation shaft of the flow path switching unit (7). Accordingly, the flow path switching unit 7 may rotate about the flow path switching rotation shaft 71 to adjust the delivery direction and the flow rate of the fluid, so as not to impede the flow of the fluid.

The flow path switching opening 72 is a protrusion that is movably inserted into the flow path switching guide hole 46, while moving in the state inserted into the flow path switching guide hole 46 when the flow path switching unit 7 rotates. The delivery direction and the flow rate of the fluid flowing through the third passage C are adjusted.

On the other hand, although not shown, the flow rate control unit 6 and the flow path switching unit 7 is provided with a driving unit (not shown) on each rotating shaft, it can be rotated by the driving force provided by the driving unit, the driving unit The motor can be used.

3 and 4, the support 8 is inserted into the support guide hole 47 so as to be movable, and supports the bottom of one end of the first flow channel forming part 5a to support the first flow path ( The fluid discharged through A) is directed toward the center of the test tray. Thus, the temperature controlled fluid can be delivered to the semiconductor devices contained in the test tray as a whole.

In addition, the support 8 is implemented to move in the state inserted into the support guide hole 47 while supporting one end of the first flow path forming portion (5a), discharge through the first flow path (A) It is possible to control the degree of fluid flow toward the center of the test tray.

On the other hand, the semiconductor device test handler duct 1 according to an embodiment of the present invention may further include a control unit (not shown), the control unit flowing through a plurality of flow path (A, B, C) The flow rate control unit 6 and the flow path switching unit 7 is controlled to adjust the delivery direction and the flow rate of the fluid.

In addition, the controller receives temperature information from a temperature sensor installed in each zone of the test tray, and analyzes the corresponding temperature information to determine the degree of change of the temperature of the semiconductor devices for each zone. Accordingly, the controller may maintain the semiconductor devices contained in the test tray at a constant temperature corresponding to the test conditions by adjusting the rotation degree of the flow rate control unit 6 and the flow path switching unit 7. In this case, the control unit controls the driving unit connected to the flow rate control rotation shaft 61 and the flow path switching rotation shaft 71, the degree of rotation of the flow rate control unit 6 and the flow path switching unit 7 and the plurality of flow paths accordingly. (A, B, C) Each open area can be adjusted. Therefore, by supplying a fluid having a different flow rate in each zone of the test tray containing the semiconductor devices, the semiconductor devices changed at different temperatures in each zone can be maintained at a constant temperature corresponding to the test conditions.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the coupling relationship and the operating relationship of the duct 1 for a semiconductor device test handler according to an embodiment of the present invention will be described in detail.

2 and 3, the blower 2 is coupled to the outside of the main body 4 to supply fluid to the inner space 4a through the communication hole 41 of the main body 4, The temperature composition part 3 is coupled to the receiving portion 42 of the body 4 so as to heat or cool the fluid supplied from the blower 2.

The flow path forming unit 5 is a first flow path to form a first flow path (A), a second flow path (B), and a third flow path (C) facing the lower side, the middle side, and the upper side of the test tray, respectively. The forming portion 5a, the second flow path forming portion 5b, and the third flow path forming portion 5c are coupled to the inner space 4a of the main body 4. In this case, the first flow path forming portion 5a is coupled so that one end thereof is supported by the support 8, and the support 8 is movable to the support guide hole 47 of the main body 4. Combined.

The flow rate adjusting part 6 has a first flow rate of the first flow rate adjusting part 6a on the inlet side interface of the first flow path A and the second flow path B in the inner space 4a of the main body 4. The adjustment rotation shaft 61a is rotatably coupled, and the second flow rate adjustment rotation shaft 61b of the second flow rate adjustment part 6b rotates on the inlet side interface of the second flow path B and the third flow path C. Possibly combined. In this case, the first flow rate control rotation shaft 61a and the second flow rate control rotation shaft 61b are installed on the same line as the second flow passage forming portion 5b and the third flow passage forming portion 5c, respectively. In the state in which the copper ball 62 is movably inserted into the flow regulation guide hole 44, the flow regulating rotation shaft 61 is rotatably coupled to the flow regulating fixed hole 43.

The flow path switching unit 7 is inserted into the flow path switching guide hole 46 of the main body 4 so that the flow path switching movement hole 72 is movable, the flow path switching rotation shaft 71 of the body 4 It is rotatably coupled to the flow path switching fixed hole (45).

Referring to FIG. 4, in the coupled state as described above, when the blower 2 rotates about the rotating shaft 22 and supplies fluid to the inside of the main body 4 by the rotary blades 21,

The fluid is supplied to the inner space 4a of the body 4 through the communication hole 41, and the semiconductor elements contained in the test tray by the temperature composition part 3 can be maintained at a constant temperature corresponding to the test conditions. Heated or cooled to temperature.

The fluid whose temperature is controlled is controlled by the first flow rate control part 6a, the second flow rate control part 6b, and the flow path switching part 7 to the first flow path A, the second flow path B, And a flow rate corresponding to the open area of each of the third flow paths C and is discharged to the test tray located on the test board side. In this case, the fluid discharged through the third flow path C is discharged by switching the delivery direction by the flow path switching unit 7.

The controller controls the degree of rotation of the flow rate control unit 6 and the flow path switching unit 7 so as to maintain the semiconductor devices changed at different temperatures for each zone of the test tray from the received temperature information at a constant temperature corresponding to the test conditions. Adjust

In addition, the fluid discharged through the first flow path (A) is discharged by adjusting the degree toward the center of the test tray according to the extent that the support (8) supports one end of the first flow path forming portion (5a) do.

Through such an operation relationship, the semiconductor devices can be connected to the test board while being maintained at a constant temperature corresponding to the test conditions, thereby improving the accuracy and yield of the test results for the semiconductor devices.

Hereinafter, as another embodiment of the above-described embodiment, a preferred embodiment of the configuration of the semiconductor device test handler will be described in detail with reference to the accompanying drawings.

Here, since the semiconductor device test handler according to another embodiment of the present invention has a configuration that is substantially coincident with the duct for the semiconductor device test handler according to the above-described embodiment, a detailed description thereof will not be obscure the subject matter of the present invention. It will be omitted, only the configuration with differences will be described.

5 is a plan view schematically illustrating a configuration of a semiconductor device test handler and a test device for testing a semiconductor device by bonding to the handler according to another embodiment of the present invention.

In particular, FIG. 5 shows a plan view of a chamber portion of a test handler and a test board of a test apparatus directly bonded to the handler.

Referring to FIG. 5, a semiconductor device test handler 10 according to another exemplary embodiment may include a chamber part including a first chamber 13, a test part 14, and a second chamber 15, and a duct. It includes (1).

Although not shown, the semiconductor device test handler 10 may include an apparatus for performing sorting operations on semiconductor devices while exchanging a chamber and a test tray T. Here, the apparatus for performing the sorting operation may store the semiconductor device to be tested in the carrier module of the test tray T, and classify the tested semiconductor device according to the grade according to the test result. Since the apparatus for performing such a sorting operation is obvious to those skilled in the art, the detailed description thereof will be omitted in order not to obscure the subject matter of the present invention.

The first chamber 13 transfers the test tray T step by step to heat or cool the semiconductor devices contained in the test tray T to a temperature corresponding to the test conditions.

The test unit 14 receives the test tray T adjusted to the testable temperature from the first chamber 13, and tests the semiconductor devices contained in the test tray T by the contact pushing unit 141. 16).

The contact pushing unit 141 linearly moves along the Y axis and electrically connects the semiconductor elements contained in the test tray T of the test unit 14 to the test board 16. Release it.

Meanwhile, the contact pushing unit 141 may be provided in plural so as to connect the semiconductor devices contained in the plurality of test trays T to the test board 16 at one time. In this case, a plurality of contact pushing units 141 may be installed to be stacked up and down, or a plurality of contact pushing units 141 may be installed horizontally. Here, the contact pushing unit 141 has the advantage that can be reduced in the width of the entire handler equipment than a plurality is installed horizontally installed in a plurality of stacked up and down.

The second chamber 15 receives the tested test tray T from the test unit 14 and restores the semiconductor devices to room temperature while transferring the test tray T step by step.

FIG. 6 is a perspective view illustrating an arrangement of ducts stacked up and down in a semiconductor device test handler according to another embodiment of the present invention, and FIG. 7 is a view illustrating ducts and contacts in a semiconductor device test handler according to another embodiment of the present invention. Combined perspective view of the pushing unit.

5 to 7, the duct 1 is coupled to the contact pushing unit 141 and delivers the temperature controlled fluid to the test tray T in the test unit 14.

In this case, the duct 1 controls the flow rate of the fluid and delivers the semiconductor devices to each zone contained in the test tray T, thereby maintaining the semiconductor devices at a constant temperature corresponding to the test conditions. A distinction block 11 and a separator 12.

On the other hand, the duct 1 is provided with a corresponding number when the contact pushing unit 141 is provided with a plurality, as described above, it is preferable to be installed to be stacked up and down to reduce the width of the entire handler equipment Do.

In this case, as shown in FIG. 6, the duct 1 is stacked such that one duct 1a installed on the upper side and the other duct 1b disposed on the lower side are stacked in the arrangement direction opposite to each other. It is preferable to install. Looking at this in more detail, the upper duct (1a) is installed in the arrangement direction with the blower (2a) is provided on the upper side and the support (8a) is provided on the lower side, but the duct (1b) installed on the lower side is blown The apparatus 2b is provided in the lower side, and the support tool 8b is provided in the arrangement direction provided in the upper side.

Referring to FIGS. 6 and 7, the blocking part 11 has a rectangular plate shape as a whole, one side is coupled to both side walls 4b of the main body 4, and the other side is coupled to the contact pushing unit 141. Accordingly, the temperature controlled fluid is prevented from leaking between the mating surface of the contact pushing unit 141. Therefore, the blocking part 11 can minimize the generation of heat loss in the process of discharging the fluid through the duct 1 to the semiconductor elements contained in the test tray. In addition, minimized heat losses allow the semiconductor devices to be held at a constant temperature corresponding to test conditions more efficiently, minimizing the time lag required for this task.

The separating part 12 is a rectangular plate shape having a 'c' shape as a whole, and distinguishes between one duct 1a installed at an upper side and the other duct 1b installed at a lower side, and the blocking part 11 Similarly, the fluid is prevented from leaking between the mating surface between the duct 1 and the contact pushing unit 141, thereby minimizing heat loss.

In FIG. 7, non-explained reference numerals provide a driving force to the contact pushing unit 141 as the driving unit 1411. The contact pushing unit 141 may connect the semiconductor elements to the test board 16 (shown in FIG. 5) while moving with the driving force provided by the driving unit 1411. The pressing force can be released while moving with the driving force provided by 1411).

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the art that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

The present invention can achieve the following effects by the above configuration, coupling relationship and operation relationship.

According to the present invention, by controlling the flow rate of the temperature-regulated fluid in each zone of the test tray in which the semiconductor devices are contained, the semiconductor devices changed to different temperatures in each zone can be maintained at a constant temperature corresponding to the test conditions. The effect is to improve the accuracy and yield of the test results.

The present invention minimizes heat loss that may occur in the process of transferring the temperature-controlled fluid discharged through the duct to the semiconductor devices contained in the test tray, thereby improving work efficiency and delaying work time. The effect can be minimized.

The present invention implements to control the flow direction and the flow rate of each fluid flowing through a plurality of flow paths while rotating the flow rate control unit and the flow path switching unit about the rotation axis, so that each fluid is uniform throughout without disturbing the flow of the fluid It is possible to maximize the efficiency of the work to be delivered to the semiconductor devices.

Claims (13)

A temperature composition unit for controlling the temperature of the fluid supplied from the blower so that the semiconductor devices contained in the test tray are maintained at a constant temperature corresponding to the test condition; A main body opened to a test board side such that the temperature-controlled fluid is delivered to the semiconductor devices; A flow path forming unit installed inside the main body and configured to change a flow direction of the fluid so as to form a plurality of flow paths such that the fluid is transferred to each of the regions contained in the test tray; A flow rate controller configured to adjust a flow rate of each of the fluids flowing through the plurality of flow paths; And A flow path switching unit having a flow path switching rotation shaft rotatably coupled to the main body; The flow path switching unit is a duct for the semiconductor device test handler, characterized in that for adjusting the flow direction and the flow rate of the fluid flowing through the flow path. According to claim 1, wherein the flow rate control unit And a flow regulating rotation shaft rotatably coupled to the main body, wherein the opening area of each of the plurality of flow paths is adjusted while rotating about the flow regulating rotation shaft. The duct for a semiconductor device test handler according to claim 2, wherein the flow rate control part is provided at an inlet side of the plurality of flow paths. The duct for the semiconductor device test handler according to claim 3, wherein the flow rate control rotation shaft is formed on a boundary line of the plurality of flow paths. According to claim 2, The main body is a flow rate control fixed hole rotatably coupled to the flow rate control shaft; And a flow rate adjusting guide hole for guiding the flow rate adjusting portion to adjust an opening area of each of the plurality of flow paths while rotating about the flow rate adjusting rotation shaft. The flow rate control unit duct for a semiconductor device test handler, characterized in that it comprises a flow rate adjustment port is inserted into the flow rate adjustment hole. The method of claim 5, wherein the flow control guide hole The duct for a semiconductor device test handler, characterized in that formed in a plurality of different distances from the plurality of flow control fixed holes arranged on the same horizontal line so as not to interfere with each other during rotation of the flow control unit is provided with a plurality. delete According to claim 1, The main body is a flow path switching fixed hole rotatably coupled to the flow path switching shaft; And a flow path switching guide hole for guiding the flow path switching unit to adjust a delivery direction and a flow rate of the fluid flowing through the flow path while rotating about the flow path switching rotation shaft; The flow path switching unit duct for a semiconductor device test handler, characterized in that it comprises a flow path switching movement port is inserted into the flow path switching guide hole. The duct of claim 1, wherein the duct for the semiconductor device test handler is And a control unit for controlling the flow rate control unit and the flow path switching unit to control a flow direction and a flow rate of the fluid flowing through the plurality of flow paths. According to claim 1, wherein the duct for the semiconductor device test handler includes a support for supporting one end toward the test board side of the flow path forming portion so that the temperature-controlled fluid is entirely transferred to the semiconductor devices contained in the test tray. and, The main body duct for a semiconductor device test handler, characterized in that it comprises a support guide hole to which the support is movably coupled. A first chamber configured to adjust the semiconductor devices contained in the test tray to a temperature corresponding to the test condition; A test unit having a contact pushing unit for connecting semiconductor elements contained in a test tray transferred from the first chamber to a test board; Claims 1 to 6, coupled to the contact pushing unit, including a blocking unit for blocking the leakage of fluid between the mating surface and the contact pushing unit, and maintaining the semiconductor elements contained in the test tray at a constant temperature; A duct of any one of claims 8 to 10; And And a second chamber configured to receive the tested test tray from the test unit and restore the test tray to room temperature. 12. The method of claim 11, wherein the contact pushing unit is provided with a plurality of stacked up and down to connect the semiconductor elements contained in the plurality of test trays to the test board; The duct is a semiconductor device test handler, characterized in that the plurality is installed to be stacked up and down so as to supply the fluid to the plurality of test trays separately, and separating the plurality of ducts. 13. The semiconductor device test handler as claimed in claim 12, wherein the ducts are installed to be stacked in mutually opposite arrangement directions.

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