KR101029063B1 - Contact Unit and Test Handler using the same - Google Patents

Abstract

The present invention is a base plate; A fixed plate coupled to the base plate; And a pushing plate coupled to the fixed plate and having a pusher for contacting the semiconductor element, wherein one of the base plate, the fixed plate, and the pushing plate is provided with a temperature correction means. A contact unit, and a test handler using the same,

According to the present invention, the temperature correction means is provided in the contact unit to maintain a constant temperature of the fluid supplied to the various paths through the temperature correction means at the test temperature, thereby minimizing the temperature difference of the fluid delivered to the semiconductor devices Thus, the reliability of test results for semiconductor devices can be improved.

Contact unit, test handler

Description

Contact unit and test handler using the same}

The present invention relates to a test handler, and more particularly, to a configuration of a test chamber that allows a plurality of semiconductor devices to be tested at a constant test temperature.

The test handler is a device that tests whether the semiconductor device produced through various processes is operating normally. The mass-produced semiconductor device is tested by the test handler to determine whether the performance is qualified, and according to the test result, After separation, only good products will be shipped.

A general test handler is designed to perform a test on a semiconductor device at a constant test temperature of high or low temperature in order to test whether the semiconductor device functions in a high or low temperature state. In addition, a plurality of semiconductor devices are tested simultaneously to improve productivity through mass production. For this purpose, the plurality of semiconductor devices is tested in a state called a test tray.

Hereinafter, a conventional test handler will be described with reference to the drawings.

1 is a schematic plan view of a conventional test handler, in which a configuration for loading a plurality of semiconductor devices to be tested into a test tray and a configuration for unloading a plurality of tested semiconductor devices from a test tray are omitted. Only the configuration of the chambers for testing the semiconductor devices contained in the tray under a constant test temperature is shown.

As can be seen in FIG. 1, the conventional test handler 1 comprises a first chamber 2, a test chamber 4, and a second chamber 8.

The first chamber 2 is heated or cooled while the test tray T is transferred step by step so that the semiconductor devices contained in the test tray T are adjusted to the test temperature. After the semiconductor devices are adjusted to the test temperature as described above, the test tray T moves to the test chamber 4.

The test chamber 4 is provided with a thermostat device 5 so as to maintain a controlled test temperature state in the first chamber 2, and the semiconductor devices contained in the test tray T are connected to the test board 9; The contact unit 6 is provided so that it may connect. The thermostat 5 discharges a predetermined heated or cooled fluid so that the semiconductor devices can be tested at a constant test temperature, and the contact unit 6 pushes the semiconductor devices toward the test board 9 so that the semiconductor devices The test board 9 can be connected to the test board 9. After the semiconductor devices are tested as described above, the test tray T moves to the second chamber 8.

In the second chamber 8, the test tray T is moved by one step to cool or heat the semiconductor devices contained in the test tray T to return to the normal temperature state.

In order to obtain reliable test results for the plurality of semiconductor devices through the test handler 1, the plurality of semiconductor devices must be tested at a constant test temperature. That is, when the test is performed in a state where a difference in test temperature occurs in each of the plurality of semiconductor devices, the reliability of the test results for each of the semiconductor devices becomes low.

In the case of the conventional test handler 1, a separate thermostat 5 is provided in the test chamber 4 in order to maintain a constant test temperature when testing semiconductor devices. The thermostat 5 is a device that maintains a constant temperature by controlling the fluid generated in the blower to a test temperature of a high temperature or a low temperature and then transfers the fluid toward the semiconductor devices through a predetermined path. However, since the fluid adjusted to the test temperature in the thermostat 5 is transferred to each of the semiconductor elements through different paths, the temperature of the fluid delivered to the semiconductor elements is different from each other. As a result, in the conventional test handler 1, the test is performed in a state where a test temperature difference occurs between a plurality of semiconductor elements, and thus a problem in that reliability of the test result is deteriorated.

An object of the present invention is to provide a contact unit provided in a test chamber for allowing a test to be performed in a state in which a test temperature difference is minimized among a plurality of semiconductor devices, and a test handler including the same.

The present invention, in order to achieve the above object, a base plate; A fixed plate coupled to the base plate; And a pushing plate coupled to the fixed plate and having a pusher for contacting the semiconductor element, wherein one of the base plate, the fixed plate, and the pushing plate is provided with a temperature correction means. A contact unit is provided.

The temperature correction means may be composed of a temperature sensor for sensing the temperature and a temperature controller for adjusting the temperature. At this time, the temperature sensing unit and the temperature control unit are paired with each other to constitute a unit temperature correction means, a plurality of unit temperature correction means are formed, the plurality of unit temperature correction means can be operated individually. In addition, the plurality of unit temperature correction means may be formed at the corners of the one plate. The temperature sensing unit may be accommodated in an accommodation groove formed on one surface of the one plate, and the temperature adjusting unit may be attached to one surface of the one plate while covering the temperature sensing unit. In addition, the temperature control unit may be made of a heating wire and an insulating pad surrounding the heating wire.

One of the plates is provided with a vent for becoming an air flow passage, the vent may be formed in the temperature correction means corresponding to the vent.

The temperature correction means may be provided in the base plate, wherein the temperature correction means may be attached to one surface of the base plate in contact with the fixed plate.

The present invention also includes a first chamber for heating or cooling a semiconductor device to a test temperature; A test chamber connected to the first chamber and performing a test on the semiconductor device; And a second chamber connected to the test chamber and for returning the tested semiconductor device to a room temperature state, wherein the test chamber is in contact with a tester and a thermostat device for maintaining the test temperature state. And a contact unit, wherein the contact unit comprises: a base plate; A fixed plate coupled to the base plate; And a pushing plate coupled to the fixed plate and having a pusher for contacting the semiconductor element, wherein one of the base plate, the fixed plate, and the pushing plate is provided with a temperature correction means. Provide a test handler to

According to the present invention as described above has the following effects.

First, the present invention is provided with a temperature correction means in the contact unit to maintain a constant temperature of the fluid supplied to the various paths through the temperature correction means at the test temperature, thereby minimizing the temperature difference of the fluid delivered to the semiconductor devices Thus, the reliability of test results for semiconductor devices can be improved.

Secondly, the present invention forms a plurality of unit temperature correction means in pairs with a temperature sensing unit and a temperature control unit and operates a plurality of unit temperature correction means individually, so that the temperature of the fluid can be sensed for each region, and accordingly the test Appropriate temperature correction can be performed for the area where the temperature and difference have occurred.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

<Contact unit>

2 is an exploded perspective view of a contact unit according to an embodiment of the present invention, Figure 3 and Figure 4 is a perspective view of a base plate having a temperature correction means according to an embodiment of the present invention.

As can be seen in FIG. 2, the contact unit 101 according to an embodiment of the present invention includes a base plate 100, a fixing plate 200, and a pushing plate 300.

The contact unit 101 serves to connect the semiconductor devices to the test board by pushing the semiconductor devices contained in the test tray toward the test board. To this end, a predetermined driving device is connected to the base plate 100 formed at the rear of the contact unit 101, so that the base plate 100 can be advanced by the driving device. When the plate 100 is advanced, the pushing plate 300 formed at the front of the contact unit 101 pushes the semiconductor elements contained in the test tray. Here, the pushing plate 300 is provided with a plurality of pushers 320, the pusher 320 is in contact with the semiconductor elements to push the semiconductor devices toward the test board.

On the other hand, the test tray is changed to various models according to the size and the number of semiconductor devices accommodated, and if the test tray is changed to various models in this way, the pushing plate 300 should also be changed to correspond thereto. Therefore, in consideration of changing the pushing plate 300 of various models from time to time, rather than directly coupling the pushing plate 300 to the base plate 100, the pushing plate 300 to the fixed plate ( It is advantageous to couple the fixing plate 200 to the base plate 100 after the fixing to the 200. Accordingly, in the contact unit 101 according to the present invention, the base plate 100 is disposed at the rear end, the fixing plate 200 is coupled to the front of the base plate 100, and the pushing plate is placed in front of the fixing plate. 300 is combined.

When the contact unit 101 according to the present invention is disposed in the test chamber, a constant temperature device is disposed behind the contact unit 101, more specifically, behind the base plate 100, so that the constant temperature device is provided. From this, the fluid adjusted to the test temperature is supplied. In this way, the fluid supplied from the thermostat is transferred to the semiconductor elements in the test tray disposed in front of the contact unit 101 and more specifically in front of the pushing plate 300 via the contact unit 101. . To this end, each of the base plate 100, the fixing plate 200, and the pushing plate 300 constituting the contact unit 101 is provided with a vent for moving the fluid.

That is, the base plate 100 is provided with a first vent hole 110, the fixing plate 200 is provided with a second vent hole 210, and the pushing plate 300 and the pusher 320 are also provided. The third vent 321 is provided. The first vent opening 110, the second vent opening 210, and the third vent opening 321 are sufficient to communicate with each other, and the shape thereof may be variously changed. Therefore, the fluid supplied from the thermostat is the first vent holes 110 provided in the base plate 100, the second vent holes 210 provided in the fixing plate 200, and the pushing plate 300 and the pusher. It is delivered to each of the semiconductor elements in the test tray via the third vent 321 provided in (320).

However, the paths of the fluids supplied from the thermostat and delivered to each of the semiconductor devices may not be identical to each other, and thus the temperatures of the fluids delivered to the semiconductor devices may be different from each other. Therefore, in order to maintain a constant temperature of the fluid delivered to each of the semiconductor devices, in the present invention, the temperature correction means 400 is provided in the contact unit 101. In particular, in one embodiment of the present invention, the temperature correction means 400 is provided on the base plate 100 constituting the contact unit 101.

The temperature correction means 400 is composed of a temperature sensing unit for sensing the temperature and a temperature adjusting unit for adjusting the temperature, an embodiment of the temperature correction means 400 is shown in FIGS. 3 and 4.

3 illustrates a state in which the temperature controllers 410a, 410b, 410c, and 410d are disassembled from the base plate 100, and FIG. 4 shows the temperature sensors 420a, 420b, and 420c from the base plate 100. , 420d) is disassembled.

As shown in FIG. 3, the temperature adjusting parts 410a, 410b, 410c, and 410d are formed at four corners of the base plate 100, respectively, and as shown in FIG. 4, the temperature sensing parts 420a, 420b, 420c, 420d) is also formed at four corners of the base plate 100 separately.

The temperature sensing units 420a, 420b, 420c, and 420d are accommodated in the accommodation grooves 120 formed on one surface of the base plate 100.

The temperature control parts 410a, 410b, 410c, and 410d are attached to one surface of the base plate 100 while covering the temperature sensing parts 420a, 420b, 420c, and 420d. In addition, the temperature control part (410a, 410b, 410c, 410d) is provided with a fourth vent (416a, 416b, 416c, 416d) in communication with the first vent 110 provided in the base plate 100 In addition, the fluid supplied from the thermostat can be delivered to each of the semiconductor elements in the test tray via the vents.

The individually formed temperature controllers 410a, 410b, 410c, and 410d and the temperature detectors 420a, 420b, 420c, and 420d are paired to form unit temperature correction means. That is, one temperature control unit 410a and a temperature sensing unit 420a are formed in a pair on the upper left side of the base plate 100 to form one unit temperature correction means, and the left side of the base plate 100 Unit temperature correction means is also provided in the lower part, the upper right part, and the lower right part, respectively.

The unit temperature correction means operates individually to perform temperature correction. Specifically, the temperature of a predetermined portion of the base plate 100 in any one of the temperature sensing units 420a, 420b, 420c, or 420d. If the detected temperature is different from the test temperature, any one of the temperature control unit 410a, 410b, 410c, or 410d paired with it operates to adjust the temperature of the predetermined portion of the base plate 100. Done. For the operation of the temperature correction means, the end of the temperature sensing unit (420a, 420b, 420c, or 420d) is connected to an external control unit through a hole (not shown) formed on the side of the base plate 100 The controller controls the temperature controller 410a, 410b, 410c, or 410d.

The temperature controllers 410a, 410b, 410c, and 410d may include heating wires 412a, 412b, 412c, and 412d and insulating pads 414a, 414b, 414c, and 414d surrounding the heating wires 412a, 412b, 412c, and 412d. Is made of. Ends of the heating wires 412a, 412b, 412c, and 412d are connected to an external power supply unit, and when power is applied from the power supply unit, the heating wires 412a, 412b, 412c, and 412d are heated to correspond to the base plate 100. The temperature of the part is controlled. In some cases, the temperature control unit 410a, 410b, 410c, 410d may be configured to cool the temperature of a predetermined portion.

 In general, since the edge portion is more likely to require temperature correction than the center portion of the base plate 100, the case in which a plurality of unit temperature correction means is formed at the corner of the base plate 100, but is not limited thereto. The position of formation of the plurality of unit temperature correction means can be variously changed.

On the other hand, the temperature correction means 400 consisting of the temperature control unit (410a, 410b, 410c, 410d) and the temperature sensing unit (420a, 420b, 420c, 420d) described above is the front of the base plate 100, namely It is attached to one surface of the base plate 100 in contact with the fixing plate 200, which is connected to the driving device in the rear of the base plate 100, if the temperature correction means 400 in the rear of the base plate 100 This is because additional work such as disconnecting the drive device is required for the maintenance of the temperature correction means 400 when attaching (). However, in some cases, the temperature correction means 400 may be attached to the rear of the base plate 100.

In addition, in the above description, only the state in which the temperature correction means 400 is provided in the base plate 100 is described, but is not necessarily limited thereto, and the temperature correction means 400 may be the fixed plate 200 or the pushing plate. 300 may be provided.

<Test handler>

Figure 5 is a schematic plan view of a test handler according to an embodiment of the present invention, Figure 6 is a schematic perspective view of a thermostat provided in the test chamber according to an embodiment of the present invention.

As can be seen in Figure 5, the test handler according to an embodiment of the present invention, the loading stacker 20, the unloading stacker 30, the buffer unit 40, the exchange unit 50, the rotating unit 55, It comprises a first chamber 60, a test chamber 70 and the second chamber (80).

The loading stacker 20 accommodates semiconductor devices to be tested, and the semiconductor devices to be tested are contained in a container called a customer tray (not shown) in the loading stacker 20.

The unloading stacker 30 separates and receives the tested semiconductor devices according to a test result. The semiconductor devices determined to be good or defective according to the test result are stored in a customer tray (not shown) in the unloading stacker 30. It is separated into a container called si).

The buffer unit 40 temporarily receives semiconductor devices between the loading stacker 20 and the exchange unit 50, and between the unloading stacker 30 and the exchange unit 50.

The exchange unit 50 loads the semiconductor devices to be tested in the test tray T and unloads the tested semiconductor devices from the test tray T.

The rotating unit 55 rotates the test tray T containing the semiconductor elements from a horizontal state to a vertical state or from a vertical state to a horizontal state.

The first chamber 60 is for controlling semiconductor devices to a test temperature of high or low temperature. The first chamber 60 is heated or cooled while the test tray T is transferred by one step in the first chamber 60. The semiconductor devices contained in T) are adjusted to the test temperature.

The test chamber 70 is for performing a test on semiconductor devices, and the test chamber 70 is provided with a thermostat 75 so as to maintain a controlled test temperature state in the first chamber 60. The contact unit 101 may be provided to connect the semiconductor devices contained in the test tray T with the test board 90.

The thermostat 75 is for discharging a predetermined heated or cooled fluid so that the semiconductor devices can be tested at a constant test temperature, and an embodiment of the thermostat 75 is illustrated in FIG. 6.

As can be seen in Figure 6, the thermostat device 75 according to an embodiment of the present invention comprises a blower 752, the temperature composition unit 753, the body 754, and the flow path forming portion (755).

The blower 752 is coupled to an outer side of the main body 754 to supply a fluid to the inner side of the main body 754. In the blower 752, a plurality of rotary blades rotate inside the main body 754. To supply fluid.

The temperature composition unit 753 is installed inside the main body 754 to heat or cool the fluid supplied from the blower 752 to form a test temperature, and is used for an electric heater or fluid cooling for heating a fluid. A liquefied nitrogen injection system or the like can be used.

The main body 754 has an open inner space 754a to transfer the fluid formed at the test temperature in the temperature composition unit 753 toward the contact unit 101 through the inner space 754a.

The flow path forming unit 755 is installed in the inner space 754a of the main body 754 so that the fluid supplied to the inner space 754a of the main body 754 forms a plurality of flow paths and is divided into sections for the contact unit. To (101). That is, the flow path forming portion 755 is composed of a first flow path forming portion 755a on the lower side, a second flow path forming portion 755b on the central side, and a third flow path forming portion 755c on the upper side. The first passage A, the second passage B, and the third passage C are formed to be transferred to the contact unit 101.

Referring to the operation of the thermostat 75 according to an embodiment of the present invention, when the rotary blade is rotated in the blower 752 to supply the fluid to the inside of the main body 754, the fluid is the temperature composition unit After passing through the 753, the fluid formed at the test temperature is supplied to the inner space 754a of the main body 754, and then the first flow path forming part 755a and the second flow path forming part ( 755b and the third flow path forming unit 755c, the first flow path A, the second flow path B, and the third flow path C are formed and transferred to the contact unit 101. As such, since the fluid is transferred through the various flow paths in the thermostat 75, the temperatures of the fluids to be transferred may be different from each other, and accordingly, the contact unit 101 is formed in front of the thermostat 75. It is desirable to calibrate the temperature of the fluid at. Therefore, in the present invention, by forming the contact unit 101 having the above-described temperature correction means 400 in front of the thermostat 75, the temperature of the fluid finally delivered to the semiconductor elements can be kept constant To help.

The second chamber 80 is to return the tested semiconductor devices to a room temperature state, and is cooled or heated while the test tray T is moved by one step in the second chamber 80 to the test tray T. The contained semiconductor devices are returned to room temperature.

Referring to Figure 5 the operation of the test handler according to the present invention described above is as follows.

First, the semiconductor devices accommodated in the loading stacker 20 by the first picker 42 are temporarily accommodated in the buffer unit 40, and then, by the second picker 44 in the buffer unit 40. The semiconductor elements accommodated are loaded in the test tray T of the exchange unit 50.

Next, by rotating the test tray T in a horizontal state by 90 degrees in the rotating unit 55 to position the test tray (T) in a vertical state.

Next, the test tray T in the vertical state is transferred to the first chamber 60 and sequentially moved in the first chamber 60 to heat or cool the semiconductor devices to a temperature that meets the test conditions.

Next, after transferring the test tray T in the vertical state to the test chamber 70, the semiconductor devices accommodated in the test tray T are connected to the test board 90 by using the contact unit 101. Perform a test on At this time, the thermostat device 75 supplies the fluid adjusted to the test temperature, and the contact unit 101 performs temperature correction of the fluid so that the fluid controlled to the same test temperature can be supplied to the semiconductor devices.

Next, after transferring the test tray T in the vertical state to the second chamber 80, the temperature of the semiconductor devices is returned to room temperature while sequentially moving in the second chamber 80.

Next, the test tray T in the vertical state is transferred to the rotating unit 55 and then rotated 90 degrees in the rotating unit 55 to position the test tray T in the horizontal state.

Next, the semiconductor devices that have been tested are temporarily accommodated in the buffer unit 40 by using the second picker 44, and then separated into good or defective parts in the unloading stacker 30 using the first picker 42. To be loaded.

1 is a schematic plan view of a conventional test handler.

2 is an exploded perspective view of a contact unit according to an embodiment of the present invention;

3 and 4 are perspective views of a base plate having a temperature correction means according to an embodiment of the present invention.

5 is a schematic plan view of a test handler according to an embodiment of the present invention.

Figure 6 is a schematic perspective view of a thermostat provided in the test chamber according to an embodiment of the present invention.

<Description of reference numerals of the main parts of the drawing>

101: contact unit 100: base plate

200: fixed plate 300: pushing plate

400: temperature correction means 410a, 410b, 410c, 410d: temperature control unit

420a, 420b, 420c, 420d: temperature sensing unit

Claims (10)

Base plate; A fixed plate coupled to the base plate; And And a pushing plate coupled to the fixed plate and having a pusher for contacting the semiconductor element. Temperature correction means is provided on any one of the base plate, the fixed plate, and the pushing plate, The temperature correction means is composed of a temperature sensor for sensing the temperature and a temperature controller for adjusting the temperature, The temperature sensing unit is accommodated in the receiving groove formed on one surface of the one plate, The temperature control unit is a contact unit, characterized in that attached to one surface of the one plate covering the temperature sensing unit. delete The method of claim 1, The temperature sensing unit and the temperature control unit are formed in pairs to constitute a unit temperature correction means, a plurality of unit temperature correction means are formed, the plurality of unit temperature correction means is characterized in that the individual operation. The method of claim 3, The plurality of unit temperature correction means is formed in the corner of the one of the plate contact unit. delete The method of claim 1, The temperature control unit is a contact unit, characterized in that consisting of a heating wire and the insulating pad surrounding the heating wire. Base plate; A fixed plate coupled to the base plate; And And a pushing plate coupled to the fixed plate and having a pusher for contacting the semiconductor element. Temperature correction means is provided on any one of the base plate, the fixed plate, and the pushing plate, One of the plates is provided with a vent for the air flow passage, And a ventilation opening corresponding to the ventilation opening is also formed in the temperature correction means. The method of claim 1, The temperature correction means is provided in the base plate. The method of claim 8, The temperature correction means is attached to one surface of the base plate in contact with the fixed plate. A first chamber for heating or cooling the semiconductor device to a test temperature; A test chamber connected to the first chamber and performing a test on the semiconductor device; And A second chamber connected to the test chamber and for returning the tested semiconductor device to a room temperature state; The test chamber includes a thermostat for maintaining the test temperature state and a contact unit for contacting the semiconductor device with a tester. 10. The test handler of claim 1, wherein the contact unit comprises a contact unit according to any one of claims 1, 3, 4, and 6-9.

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