KR20190014004A - Side docking type test handler - Google Patents

Abstract

The present invention relates to a test handler. According to the present invention, presented is a technique to improve the stability and reliability of equipment since an air circulation flow path is formed on one side wall of a desoak chamber for evenly returning semiconductor elements loaded on a test array moving in the desoak chamber to room temperature or constant temperature, and a separate circulation device is provided to circulate air in the desoak chamber through the air circulation path.

Description

Side docking test handler {SIDE DOCKING TYPE TEST HANDLER}

The present invention relates to a test handler that is supported in testing a semiconductor device prior to shipping produced semiconductor devices.

The test handler supports a semiconductor device manufactured through a predetermined manufacturing process so that the semiconductor device can be tested by a tester. The test handler classifies semiconductor devices according to the test results and loads the semiconductor devices on a customer tray.

FIG. 1 is a conceptual view of a test handler 100, which is a side-docking type system in which a conventional semiconductor device is vertically erected and supplies a loaded semiconductor device to a tester side. Referring to FIG. 1, A test tray 110, a loading device 120, a soak chamber 130, a test chamber 140, a desock chamber 150, an unloading device 160, .

The test tray 110 has a plurality of inserts on which semiconductor elements can be placed and circulates along a closed path C defined by a plurality of transfer devices (not shown).

The loading device 120 loads the untested semiconductor device loaded in the customer tray (not shown) into the test tray 110 at the loading position (LP).

The soak chamber 130 is provided to preheat or precool the semiconductor devices loaded on the test tray 110 according to test environment conditions before testing.

The test chamber 140 is provided for testing the semiconductor devices loaded in the test tray 110 that have been preheated / precooled in the soak chamber 130 and then transferred to a test position (TP).

The desolator chamber 150 is cooled by blowing the heated semiconductor element loaded in the test tray 110 transferred from the test chamber 140 and returned to a predetermined temperature at which the temperature is unlikely to be at room temperature or unloaded Or to return the cooled semiconductor element to a predetermined temperature at which the semiconductor element is heated to a normal temperature or condensation by heating it with warm air or a heater.

The unloading device 160 classifies the semiconductor devices from the test tray 110 at an unloading position (UP: UNLOADING POSITION) according to the test grade and unloads them into the empty customer tray.

The unloading position UP and the loading position LP of the semiconductor device are stored in the test tray 110 via the soak chamber 120, the test chamber 130, and the desorption chamber 140. [ And then back to the soak chamber 120 along the closed path C.

The test handler 100 is provided with a plurality of test trays 110 circulating along the closed path C. As described above, the soak chamber 130 may be provided with a plurality of test trays 110, The desoak chamber 150 returns the semiconductor device to a predetermined temperature in advance of unloading after the test, which increases the operation rate of the tester and the unloading device UP, This is to improve the processing capacity of the equipment. Here, as is well known, a plurality of test trays 110 are translationally transferred while being accommodated in the soak chambers 130 or the desock chambers 150, and thus the test trays 110 The semiconductor device can be maintained in the soak chambers 130 and the desorption chambers 150 so that the temperature can be adjusted.

Among the techniques for the test handler 100 as described above, the present invention relates to a technique for appropriately performing the unloading operation at a later time by returning the semiconductor elements to room temperature or a predetermined temperature in the desock chamber 150, Will be described in more detail.

If the semiconductor device tested at a low temperature is directly sent to the unloading position of the open air and the outside air, moisture may be formed on the surface of the semiconductor device by contact with the air at room temperature, thereby damaging the semiconductor device. When a pad holds a semiconductor element, a pad mark is left on the surface of the semiconductor element, thereby deteriorating the quality of the product.

Also, even if the test is performed at a high temperature, if the high temperature semiconductor element is directly sent to the unloading position, the pad of the unloading apparatus may melt or stick due to the high temperature heat remaining in the semiconductor element.

Therefore, it is necessary to constitute the dissocking chamber 150 as described above, and return the tested semiconductor element to room temperature or a predetermined temperature. 2, a heater 170, a fan 180, and a direction plate 190 are provided in the desiccation chamber 150 formed in the conventional test handler 100. As shown in FIG. Here, the direction plate 190 is provided to guide the air blown by the fan in a constant direction.

The heater 170 is disposed in a lower region of the inner space of the desiccation chamber 150 and the fan 180 supplies air heated by the heater 170 in the direction toward the test tray 110 from the lower side to the upper side . According to this configuration, the heater 170 and the fan 180 operate during the low-temperature test to raise the temperature of the semiconductor element in the desicc chamber 150, and only the fan 180 operates during the high- The temperature of the semiconductor element may be lowered or the temperature may be lowered by supplying a small amount of the low temperature gas.

However, in recent years, the size of the test tray has been enlarged to improve the processing capacity, and as the test time is shortened, the test tray is expected to be shortened in the desock chamber.

However, according to the prior art as shown in FIG. 2, the semiconductor elements in the lower portion near the heater 170 among the semiconductor elements spread over the entire region of the test tray 110 are returned to the required temperature in a predetermined short time The semiconductor elements in the upper portion relatively farther away from the heater 170 may deviate from the desired temperature in a short time. Particularly, the reason why the heat of the heater 170 is not transmitted to the upper portion of the test tray 110 during the low temperature test is that the interval between the test trays accommodated in the deshook chamber 150 is narrow, The heat can not be smoothly transmitted to the upper portion of the body 110.

In order to solve the above problem, it is necessary to increase the time for the test tray to stay in the disc chamber (the time for the test tray to stay translationally moving within the disc chamber). In this case, . However, by extending the internal space of the dissocking chamber, the time for staying in the test tray is increased. If the number of test trays that can be accommodated in the soak chamber is increased to maintain the processing capacity, There arises a problem of an increase in the unit cost of production from the necessity.

Therefore, in order to secure the function of the dissocking chamber while maintaining the size of the conventional equipment, the applicants of the applicant have attempted to increase the capacity of the heater or to install the heater / fan additionally, but have obtained satisfactory results .

An object of the present invention is to provide a technique for circulating air in a desiccation chamber through a separate flow path so that semiconductor devices loaded in all regions of a test tray can be returned to a required temperature uniformly will be.

The test handler according to the present invention as described above includes: a test tray traversed along a predetermined circulation path; A loading device for loading semiconductor devices into the test tray; A soak chamber provided to accommodate a test tray in which loading of the semiconductor device is completed by the loading device and to preheat / pre-cool the semiconductor devices according to test environment conditions; A test chamber provided to support testing of semiconductor devices loaded in a test tray from the soak chamber; A desiccant chamber which is provided for returning the semiconductor devices loaded on the test tray passing through the test chamber to a predetermined temperature and in which a flow path through which air can be vertically moved is formed on one side wall; A circulation device provided so that air in the desicc chamber can be circulated while passing through the flow path; And an unloading device for unloading the semiconductor device loaded on the test tray from the deshook chamber; .

One side of the flow path serving as a suction port for sucking air from the inside of the desicc chamber and the other side serving as a discharge port for discharging air into the desicc chamber, So that air can be sucked into the suction port and then discharged to the discharge port.

The circulation device includes a suction fan coupled to the suction port side; And A discharge fan coupled to the discharge port side; .

A plurality of the discharge ports are provided, and a plurality of the discharge fans are also provided.

And a heater positioned in an upper region of the internal space of the deshock chamber for heating the interior of the deshok chamber.

The one side wall surface of the desicc chamber in which the flow path is formed may be a door for opening and closing the inside of the desicc chamber.

And a breaker for blocking the heater from the worker when the door is opened.

Wherein the circuit breaker comprises: a blocking layer provided inside the desicc chamber so as to be foldable; And a pusher installed on the door to push the blocking membrane; .

According to the present invention as described above, the following effects can be obtained.

First, the semiconductor devices loaded in the entire area of the test tray can be returned to a required temperature within a predetermined short time, thereby improving the stability and reliability of the equipment.

Second, since the door is used as a duct without using a separate duct, the standard of the test handler can be kept as it is in the conventional standard, and the existing equipment can be easily improved by applying the present invention.

Figure 1 is a conceptual top view of a conventional test handler.
Figure 2 is a schematic diagram of the interior of a desiccator chamber generally applied to the test handler of Figure 1;
3 is a conceptual top view of a test handler according to an embodiment of the present invention.
4A is a schematic perspective view of a door forming one side wall of the desicc chamber;
4B is a schematic perspective view showing a state in which the suction fan and the discharge fan are coupled to the desicc chamber.
4C is a schematic perspective view of a door according to another example.
Figure 5 is a conceptual front view of the door of Figure 4;
FIG. 6 is a reference diagram for explaining operation of the main portion of the test handler of FIG. 3; FIG.
7 is a reference diagram of a major portion of a test handler according to another embodiment of the present invention.
8A to 8C are reference views for explaining the operation of the main part of the test handler referred to in Fig.
9 is a schematic view of a main part of a test handler according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments according to the present invention will be described with reference to the accompanying drawings, but for simplicity of description, descriptions described in the background art are preferably omitted or compressed.

3 is a conceptual top view of a test handler 300 in accordance with an embodiment of the present invention.

The test handler 300 according to the present embodiment includes a test tray 310, a loading device 320, a soak chamber 330, a test chamber 340, a desalting chamber 350, a circulating device 360, An unloading device 370, an unloading device 380, and the like.

The test tray 310, the loading device 320, the soak chamber 330, the test chamber 340, and the unloading device 380 are the same as those described in the background art, and thus description thereof will be omitted.

The door 351 constituting one side wall of the desiccation chamber 350 is provided for opening and closing the inside of the desiccation chamber 350 and is provided between the outer surface and the inner surface of the desiccation chamber 350 in the up- And a heat insulating material 351b is provided on the outer surface side thereof as shown in Fig. Here, only one suction port 351a-1 on the upper side of the flow path 351a is formed for sucking the air heated by the heater 370, and the discharge ports 351a-2a, 351a-2b, 351a-2d, 351a-2e, 351a-2e, 351a-2e, 351a-2e, 351a-2e, 351a-2e, 351a- Of course, these outlets 351a-2a, 351a-2b, 351a-2c, 351a-2d, 351a-2e and 351a-2f are formed in the inner wall surface of the door 351A as shown in FIG. H) may be formed and partitioned while the discharge fans are installed.

4B, the circulating device 360 is provided to allow air in the desicc chamber 351 to circulate while passing through the flow path 351a, and is connected to the suction port 351a-1 side And a plurality of discharge fans 362a to 362f coupled to the suction fan 361 and the discharge ports 351a-2a, 351a-2b, 351a-2c, 351a-2d, 351a-2e, and 351a-2f, . As the suction fan 361 and the discharge fans 362a to 362f are also provided, circulation of air through the flow path 351a can be achieved even if only one side is configured, and therefore, it can be considered as another example of the present invention have. In addition, the number and location of the intake and exhaust fans may vary depending on the structure of the equipment, the airflow, the size of the test tray, and whether or not the heater and fan are in parallel with each other. That is, in this example, only one suction fan 361 is provided due to the limitation of the configuration position, but two or more suction fans 361 may be configured in series or in parallel, or the number of discharge fans may be increased or decreased.

The heater 370 is provided to heat the interior of the desicc chamber 350 and is located in the upper region of the interior space of the desiccant chamber 350. The reason why the heater 370 is provided in the upper region is that it is more advantageous in securing the installation space than other regions. If the heater 370 is installed on the side or the like, the size of the equipment may be increased. Further, as shown in FIG. 6, a blowing fan 390 may be additionally provided at the rear end of the heater 370 so that the heated heat is quickly sent to the suction fan 361.

Operation of the main part of the test handler 300 having the above configuration will be described with reference to FIG.

In the low temperature test, the upper area inside the desicc chamber 350 is heated by the heater 370, and the heated air flows through the flow path 351a in accordance with the operation of the suction fan 361 and the discharge fans 362a to 362f And the semiconductor elements loaded in the entire area of the test tray 310 are lifted evenly to the required temperature by contacting the semiconductor elements while being evenly supplied to the upper and lower portions of the side surfaces of the test trays 310. In this way, Return to temperature.

Of course, during the high temperature test, only the suction fan 361 and the discharge fans 362a to 362f operate while the operation of the heater 370 is stopped. At this time, So that the semiconductor devices loaded in the entire area of the test tray 110 are lowered to a desired temperature.

The test handler according to the present invention may further include a circuit breaker for protecting the operator from the heat generated by the heater when the door is opened. This will be described with reference to FIG.

7, the breaker 790 includes a shut-off film 791 and a pusher 792. As shown in FIG.

The shielding film 791 is in the form of a rectangular plate having a sufficient width to shield the operator from the heater and is joined by the hinge H so as to be foldable on the upper surface of the deshock chamber 750.

The pusher 792 is provided to push the upper end portion of the blocking film 791 and is provided on the inner wall surface of the door 751.

The operation of the circuit breaker 790 will now be described with reference to the schematic cross-sectional side views of Figures 8A-8C.

8A, when the door 751 is closed, the pusher 792 supports the folded membrane 791 folded. If the operator opens the door 751, the pusher 792 retracts (retracts on the basis of the blocking film) in the moving direction of the door 751 as shown in FIG. 8B, so that the blocking film 791 is unfolded by its own weight. Therefore, the worker W can be cut off from the heater 770 by the shielding film 791 being opened. That is, when the operator opens the door 751 as needed, the high temperature air heated by the heater 770 is delivered to the operator, and the operator can wear an image or the like. It is to protect. When the worker W closes the door 751, the pusher 792 advances as shown in FIG. 8C to push the upper end of the blocking film 791, so that the blocking film 791 is folded again.

9, the present invention further includes a separate heater 991 and a fan 992 in a lower region of the inner space of the desoak chamber 950 so that the heated air is supplied from the lower side to the upper side May also be combined with conventional techniques. 9, the Applicant has confirmed that the temperature of the semiconductor device is increased by a desired amount during the low-temperature test, while taking the entire specifications of the test handler as in the conventional case.

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the scope of the invention is to be construed as being limited only by the following claims and their equivalents.

300: Test handler
310: Test tray 320: Loading device
330: Soak chamber
340: Test chamber
350: dissok chamber
351: Door
351a: Euro
351a-1:
351a-2a to 351a-2f:
360: circulation device
361: Suction fan
362a to 362f: exhaust fan
370: Heater
380: Unloading device
790: Breaker
791: blocking membrane 792: pusher

Claims (7)

A test tray traversed along a constant circulation path;
A loading device for loading semiconductor devices into the test tray;
A soak chamber provided to accommodate a test tray in which loading of the semiconductor device is completed by the loading device and to preheat / pre-cool the semiconductor devices according to test environment conditions;
A test chamber provided to support testing of semiconductor devices loaded in a test tray from the soak chamber;
A desolator chamber provided for returning the semiconductor elements loaded on the test tray to the predetermined temperature by the test chamber and having a flow path through which air can be moved to one side wall;
A circulation device provided so that air in the desicc chamber can be circulated while passing through the flow path; And
An unloading device for unloading the semiconductor device loaded on the test tray from the deshook chamber; Lt; / RTI >
One side of the flow path serving as a suction port for sucking air inside the desorption chamber, the other side of the flow path serving as a discharge port,
Characterized in that the circulation device circulates air along a circulation path of air leading to the interior of the soak chamber through the inside of the soak chamber, the inlet and the outlet,
Test handler. The method according to claim 1,
The flow path is formed in the vertical direction,
And the suction port is located above the discharge port
Test handler. 3. The method of claim 2,
The circulation device includes:
At least one suction fan coupled to the suction port side; And
At least one exhaust fan coupled to the outlet side; ≪ RTI ID = 0.0 >
Test handler. The method of claim 3,
Further comprising a first heater positioned in an upper region of the inner space of the desiccant chamber for heating the interior of the desiccant chamber,
Wherein the first heater is located above the test tray
Test handler. 5. The method of claim 4,
In the low temperature test, the first heater, the at least one suction fan and the at least one discharge fan are both operated,
Characterized in that in the high-temperature test, only the at least one suction fan and the at least one discharge fan are operated in a state in which the operation of the first heater is stopped
Test handler. 5. The method of claim 4,
And a second heater provided in a lower region of the inner space of the desicc chamber,
And the second heater is located below the test tray.
Test handler. The method according to claim 1,
The flow path is formed in a door for opening and closing the inside of the desicc chamber, and is formed between an outer surface and an inner surface of the door,
Characterized in that the door is provided with a heat insulating material on its outer surface side
Test handler.

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