JP2000035458A - Electronic component testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component testing device capable of effectively preventing dew condensation around a socket when a test is performed under conditions below room temperatures and capable of preventing failure of an electronic component for a testing circuit mounted around the socket when a test is performed under high-temperature conditions. SOLUTION: A closed space 124 is formed on, at least, one side of a wiring board 100. A dry gas blowing device 220 capable of blowing dry gas to at least two nozzles, a first nozzle 210 and second nozzle 212, communicating with the closed space 124, is disposed outside a chamber. A solenoid valve 218 is mounted between the first nozzle 210 and the dry gas blowing device 220, and switching takes places between a below-room-temperature control state where dry gas is blown from the dry gas blowing device 220 to the first nozzle 210 and a high-temperature control state where air in the closed space 124 is exhausted from the solenoid valve 218 to the exterior through the first nozzle 210.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component test apparatus capable of testing an electronic component such as an IC chip in a chamber by switching between a state of normal temperature or lower (normal temperature or lower) and a high temperature state. More specifically, it is possible to effectively prevent dew condensation in the vicinity of the socket during a test at room temperature or lower, and to prevent failure of the test circuit electronic components mounted near the socket during the test in a high temperature state. The present invention relates to an electronic component test apparatus capable of preventing the occurrence of an electronic component.

[0002]

2. Description of the Related Art In the course of manufacturing semiconductor devices and the like,
A test device for testing an electronic component such as an IC chip finally manufactured is required. As one type of such a test apparatus, an apparatus for testing an IC chip under normal temperature or a temperature lower than normal temperature is known. This is because, as a characteristic of the IC chip, it is ensured that the IC chip operates well even at normal temperature or low temperature.

In such a test apparatus, the upper part of the test head is covered with a chamber, the inside is made a closed space,
The C chip is transported over the test head, where the IC
The chip is connected to the test head by pressing it, and the test is performed while keeping the inside of the chamber at a normal or low temperature within a certain temperature range. By such a test, the IC chip is successfully tested, and at least is classified into a good product and a defective product.

In a test apparatus for testing an IC chip inside a chamber as described above, a chip mounting / dismounting opening of a socket for mounting an IC chip is directed into the chamber, and a terminal of the socket is connected to a wiring board (performance board) outside the chamber. ) To connect to the test head, the rear surface of the socket has a structure in which outside air can easily enter. For this reason, there is a problem that dew condensation easily occurs on the wiring board and the test head existing on the back surface of the socket. If condensation forms on the wiring board or test head on the back of the socket and the condensed water flows into the electrical connection, there is a risk of causing a short circuit phenomenon in the electrical wiring, so it is necessary to prevent condensation as much as possible.

Therefore, a sealed space is formed on at least one side of the wiring board located on the back of the socket, and dry air is sealed from the nozzle into the sealed space, and the outside air comes into contact with the test component maintained at a low temperature. To prevent condensation.

[0006]

However, by using such a test apparatus, the inside of the chamber is brought to a high temperature state and the IC
When testing the chip, the temperature of the test circuit electronic components such as the relay circuit, the capacitor and the resistor, which are arranged on the wiring board located inside the sealed space located on the back of the socket, becomes too high, There is a problem that a failure occurs in a time test. This is probably because there is almost no air flow inside the enclosed space.

[0007] The present invention has been made in view of such circumstances, and can effectively prevent dew condensation in the vicinity of a socket in a test at a normal temperature or lower, and can be mounted near a socket in a test in a high temperature state. It is an object of the present invention to provide an electronic component test apparatus capable of preventing a failure of an electronic component for a test circuit.

[0008]

In order to achieve the above object, an electronic component testing apparatus according to the present invention comprises a socket on which an electronic component to be tested is removably mounted, a socket guide for holding the socket, and a socket. A socket capable of maintaining the inside in a high temperature state and a normal temperature or lower state, wherein the socket guide is attached to the chamber opening so that the electronic component attaching / detaching opening of the socket faces the inside of the chamber;
A wiring board electrically connected to the terminal of the socket and disposed outside the chamber opening of the chamber; and a closed space formed on at least one side of the wiring board located outside the socket guide. A sealing member for attaching the wiring board to the outside of the chamber, at least two first and second nozzles communicating with the enclosed space, and blowing dry gas toward the first and second nozzles. A dry gas blower that can be installed between the first nozzle and the dry gas blower, and a room temperature or lower control state that blows dry gas from the dry gas blower toward the first nozzle. ,
Valve means capable of switching to a high temperature control state in which the gas in the closed space is discharged to the outside through the first nozzle.

In the present invention, the "closed space" is not limited to a completely closed space, but may be a space that communicates with the outside through some gap, and a dry gas is sealed in the space. It is sufficient that the degree of sealing is as high as possible. The dry gas is not particularly limited, but is preferably dry air.

The electronic component test apparatus according to the present invention further includes control means for judging whether the temperature control inside the chamber is in a control state below normal temperature or in a high temperature control state, and controlling the valve means based on the judgment. Is preferred.

An electronic component testing apparatus according to the present invention is mounted around a chamber opening of the chamber, and when the temperature control inside the chamber is in a controlled state below normal temperature,
It is preferable to further include a heating board capable of heating the wiring board by heat transfer. In the present invention, the heating board is not particularly limited, but is preferably a board having a planar heating element such as a rubber heater sandwiched therebetween. The electronic component tested by the test apparatus according to the present invention is not particularly limited, but an IC chip is preferably exemplified.

It is preferable that the heating board is mounted around a chamber opening of the chamber via a fixed base. It is preferable that the socket guide is detachably attached to the fixed base. The wiring board, on the wiring board side of the socket guide,
It is preferable that the heating board is in contact with the heating board via a wiring board holding ring.

The closed space is formed between the wiring board and a reinforcing plate attached to the wiring board on a side opposite to the chamber, and the first nozzle and the second nozzle are mounted on the reinforcing plate. Preferably, there is.

Alternatively, the closed space may be formed in a gap between the socket adapter and the wiring board, and the first nozzle and the second nozzle may be mounted on the heating board.

[0015]

When an electronic component test is performed using the electronic component test apparatus according to the present invention with the inside of the chamber at room temperature or lower, at least two first nozzles and at least two second nozzles are used to form at least the wiring board. A dry gas is introduced into the closed space formed on one side. As a result, the closed space is filled with the dry gas, and intrusion of outside air can be prevented. As a result, dew condensation on the rear surface of the socket guide can be effectively prevented.

Using the electronic component test apparatus according to the present invention,
When testing electronic components in a high temperature state inside the chamber, a dry gas or another gas (usually air) is passed through one second nozzle into an enclosed space formed on at least one side of the wiring board. Is introduced. Then, the valve means connected to the other first nozzle is switched, and the gas in the closed space is discharged to the outside through the first nozzle. As a result, a gas flow is formed inside the enclosed space, and the electronic components for the test circuit for stabilizing the test characteristics such as the relay circuit, capacitors, and resistors placed on the wiring board inside the enclosed space are cooled. Becomes possible. As a result, the temperature of the test circuit electronic component does not become too high, and no failure occurs in a short test.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings.

FIG. 1 is a schematic overall view of an IC chip test apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view of a main part of the IC chip test apparatus, and FIG. FIG. 4 is a schematic view of a device for introducing dry air into the enclosed space shown in FIG. 2, and FIG. 5 is a schematic diagram of an IC chip test device according to another embodiment of the present invention. FIG. 6 is a schematic view of an apparatus for introducing dry air into the enclosed space shown in FIG.

First Embodiment As shown in FIG. 1, an IC chip component testing apparatus 2 according to the present embodiment is an apparatus for testing an IC chip as a component to be tested at room temperature, low temperature or high temperature. Yes,
It has a handler 4 and a test main unit not shown. The handler 4 carries out an operation of sequentially transporting the IC chips to be tested to the IC sockets provided in the test head, classifying the tested IC chips in accordance with the test results, and storing them in a predetermined tray.

In the present embodiment, the handler 4 has a chamber 6, and a test stage 8 in the chamber 6.
Then, the upper part of the test head 10 is exposed. FIG. 2 shows the upper part of the test head 10. A socket 20 is mounted on the upper part of the test head 10. The chip mounting / dismounting port of the socket 20 faces the inside of the chamber 6 so that the IC chip 22 to be tested conveyed by the suction head 24 is removably and sequentially mounted on the socket 20.

IC socket 2 provided on test head 10
0 is a test main unit through a cable (not shown)
The IC chip 22 detachably mounted on the IC socket 20 is connected to a main test device via a cable, and the IC chip 22 is tested by a test signal from the main test device. The relationship between the IC socket 20, the chamber 6, and the test head 10 will be described later in detail.

As shown in FIG. 1, the handler 4 stores an IC chip to be tested, and
It has an IC storage unit 30 for classifying and storing chips. I
The C storage unit 30 includes a loader tray 32A on which IC chips to be tested are mounted, classification trays 32B to 32E on which tested IC chips are classified and mounted, an empty tray 32F, and an optional tray. 32G are arranged. These trays 32A to 32G are arranged at predetermined intervals along the X-axis direction, and are stacked and arranged in the Z-axis direction (height direction).

The IC chip mounted on the loader tray 32A is connected to the first XY transfer device 3 mounted on the handler 4.
4, the wafer is transferred onto a soak stage 36 inside the chamber 6. In addition, the test head 10
The IC chips that have been tested are finally sorted and mounted on the sorting trays 32B to 32E of the IC storage unit 30 using the second XY transfer device 35. Among the sorting trays 32B to 32E, for example, the tray 32
C is a non-defective tray, and the other trays are defective or retest trays.

The empty tray 32F includes the sorting trays 32B-
When 32E is full of tested IC chips, it is transported and stacked thereon and used as a sorting tray. The option tray 32G is used for other purposes.

The interior of the chamber 6 has a sealed structure except that the transfer section of the IC chip is freely opened by a shutter or the like. For example, a high temperature of about 160 ° C. from room temperature or −60 ° C. from room temperature. It can be maintained at a low temperature. The interior of the chamber 6 is divided into a soak stage 36, a test stage 8, and an exit stage 40.

On the soak stage 36, a turntable 38 is arranged. On the surface of the turntable 38,
Recesses 42 in which IC chips are temporarily stored are arranged at a predetermined pitch along the circumferential direction. In the present embodiment, two rows of recesses 42 are formed in the radial direction of the turntable 38, and the two rows of recesses 42 are arranged at a predetermined pitch along the circumferential direction. The turntable 38 rotates clockwise. The loading position 44 by the first XY transfer device 34
The IC chip mounted in the recess 42 of the turntable 38 is subjected to thermal stress up to the temperature condition to be tested while the turntable 38 is index-fed in the rotation direction.

At a take-out position 46 located at a position about 240 degrees in the rotational direction from the mounting position 44 with respect to the rotation center of the turntable 38,
A suction head mounted on one of the three contact arms 48 is located, and at that position, the IC chip can be taken out of the recess 42 by the suction head. Three
The two contact arms 48 are mounted at substantially equal intervals in the circumferential direction with respect to the rotation shaft 50, and are capable of being indexed by 120 degrees in a clockwise rotation direction about the rotation shaft 50. The index feed is
Stopping after a predetermined angle rotation, and then repeating the predetermined angle rotation again. Contact arm 48
In the index feed, the time during which the arm 48 is stopped corresponds to the time obtained by adding the time for attaching and detaching the IC chip to and from the socket to the time when the IC chip is mounted on the socket on the test head 10 for testing. . The stop time of the index feed is the same as the stop time of the index feed on the turntable 38, and the turntable 38 and the contact arm 48 rotate so as to synchronize with the index feed.

In this embodiment, one suction head of the three contact arms 48 is located on the take-out position 46 of the soak stage 36, and the other contact arm 4
The suction head of No. 8 is located on the contact head 10 of the test stage 8, and the suction head of another contact arm 48 is located on the entrance 52 of the exit stage 40.

The IC chip mounted in the concave portion 42 of the turntable 38 at the mounting position 44 of the turntable 38
A predetermined thermal stress is applied during the index feed from the mounting position 44 to the removal position 46, and the suction is performed by the suction head of the contact arm 48 at the removal position 46. The IC chip sucked by the suction head is arranged on the test head 10 by index-feeding the contact arm 48 clockwise. At that position, as shown in FIG. 2, the IC chip 22 sucked and held by the suction head 24 is attached to the socket 20, and
The test is performed.

The IC chip 22 mounted on the socket 20 on the test head 10 and subjected to the test is attached to the suction head 2.
4 and is indexed clockwise by the contact arm 48 shown in FIG. 1 to be positioned above the entrance 52 of the exit stage 40. At that position, the tested IC chip is slid by the exit shifter to the exit position 54 in the direction of arrow A. Exit stage 40
In the exit position, the IC chip placed on the exit shifter is returned from the low or high temperature, which is the temperature at the time of the test, to the normal temperature. In the case of a low-temperature test, this exit stage 40
In this case, by returning the IC chip to room temperature, it is possible to effectively prevent the IC chip immediately after being taken out of the chamber 6 from forming dew.

At the exit position 54 of the exit stage 40, the IC chip placed on the exit shifter is returned to room temperature, and then shifted by the exit arm (not shown) in the direction of arrow B to the receiving position 56. You will be transferred to the exit turn you have arranged. The exit turn rotates in the direction of arrow C and is reciprocally movable between the receiving position 56 and the discharging position 58. The suction head of the second XY transfer device 35 is configured to be movable to the discharge position 58 of the exit turn, and the tested IC chip arranged at the discharge position by the exit turn is transferred by the transfer device 35 to the test result. Then, the sheet is conveyed to any of the sorting trays 32B to 32E.

In the component test apparatus 2 according to the present embodiment, the soak stage 36 is provided in the chamber 6 of the handler 4.
A heat exchange device for a soak stage 60 is disposed on the ceiling of the test stage, and a heat exchange device for a test stage 62 is disposed on the side wall of the test stage 8. These heat exchange devices 60 and 62 have a cooling device, a heating device, and a blowing device so that the electronic component testing device according to the present embodiment can perform not only a low temperature test but also a high temperature test.
The cooling device and the heating device are switched and used. These heat exchange devices 60 and 62 are controlled by a temperature control device 70. The temperature control device 70 receives a temperature sensor 72 disposed on the test stage 8, a temperature sensor 74 disposed on the soak stage 36, and output signals from other sensors, and responds to output signals from these sensors. Thus, the heat exchange amount (output) of the heat exchange devices 60 and 62 can be controlled.

As shown in FIGS. 2 and 3, in the test stage 8, the bottom of the chamber 6 made of a heat insulating material or the like and a part of the main base 80 holding the chamber 6 are cut away, and the test is performed there. The socket 20 held on the head 10 is mounted.

The socket 20 is held by a socket guide 82. The socket guide 82 has a plurality of guide holes 84, as shown in FIG.
A guide rod 86 fixed to the chamber 6 side is inserted so as to be aligned with the chamber 6.

The guide rod 86 is attached to a base ring 88. The base ring 88 includes a fixed base 90
To form a chamber opening 92.
The fixed base 90 has heat insulation like the chamber 6,
It is detachably fixed to the bottom opening of the chamber 6 and the main base 80.

As shown in FIG. 2, the socket guide 82 is provided with a plurality of guide pins 94 projecting toward the inside of the chamber 6. Each of the guide pins 94 is inserted into a guide hole 96 of a guide plate 95 mounted on the suction head 24, and the IC chip 2 sucked and held by the suction head 24.
2 and the socket 20 are positioned.

A low-temperature socket adapter 98 is connected to the rear surface of the socket 20 (outside the chamber), and is electrically connected to the terminals of the socket 20. Adapter 98
Is fixed to a substantially central portion surface of the wiring board 100,
The electrical connection between the terminal of the socket 20 and the wiring board 100 is achieved. On the lower surface of the wiring board 100, a movable pin holding ring 1 protruding from the test head 10 in a ring shape.
A plurality of movable pins 104 on the device 02 are electrically connected. The movable pin 104 is mounted upward on the movable pin holding ring 102, is supported by a pogo pin (spring) so as to be able to protrude and retract in the axial direction by a spring, and the movable pin is urged in a projecting direction by the spring. The contact pins are also pressed against the lower surface terminals of the wiring board 100 to establish electrical connection with the wiring board 100. Note that the wiring board 100 is also called a performance board.

The test head 10 receives a drive signal from a test main unit (not shown) and is mounted on the socket 20 via a movable pin holding ring 102, a movable pin 104, a wiring board 100 and an adapter 98. A test drive signal is transmitted to the IC chip 22.

In this embodiment, as shown in FIGS. 2 and 3, a heating board 106 having an opening at the center is fixed to the lower surface of the fixed base 90 by bolts or the like. The heating board 106 is also referred to as a HIFIX heater, and has a planar heating element 108 such as a rubber heater sandwiched between aluminum plates or the like. A first sealing member 112 is mounted on the lower surface of the heating board 106 in advance. The first seal member 112 is made of an elastic sheet such as a silicone sponge rubber sheet. Heating board 10
The upper surface of the wiring board pressing ring 114 is detachably contacted with the lower surface on the inner peripheral side of 6 via the first seal member 112 to seal the gap. Further, a second seal member 116 is mounted between the wiring board holding ring 114 and the wiring board 100 to seal a gap therebetween. The second seal member 116 is a first seal member 1
12 is made of the same or different synthetic resin sheet.

As a result of the sealing by the first seal member 112 and the second seal member 116, a first sealed space 118 is formed on the wiring board side of the socket guide 82. The first enclosed space 118 communicates with passages 200 and 202 formed in the heating board 106.
Dry air can be enclosed in the first closed space 118.

As shown in FIGS. 2 and 3, the wiring board holding ring 114 is disposed at a position corresponding to the position of the movable terminal 104 that contacts the lower surface terminal portion of the wiring board 100. By contacting the lower surface of the wiring board 106, the wiring board 100 is pushed downward, and electrical contact between the movable terminal 104 and the wiring board 100 is secured.

A reinforcing plate 120 is mounted on the lower surface of the central portion of the wiring board 100 (on the opposite side to the chamber) via a plurality of spacers 122. The reinforcing plate 120 is a wiring board 1
00 is for preventing bending and the like, and is located inside the movable pin holding ring 102. Reinforcing plate 120
The ring-shaped third seal member 1 is provided between the outer periphery of the reinforcing plate 120 and the inner periphery of the movable pin holding ring 102 so as to form a second sealed space 124 between the third sealing member 124 and the wiring board 100.
26 is attached. The third seal member 126 is formed of a ring of the same or different synthetic resin as the first seal member, and seals between the reinforcing plate 120 and the wiring board 100.

The reinforcing plate 120 is provided with first and second nozzles 210 and 212 communicating with the second closed space 124. A gap 130 is also formed between the seal ring 128 mounted on the outer periphery of the socket adapter 98 and the wiring board 100, and the gap 130 is formed through a through hole formed in the wiring board 100. It communicates with the inside of the second closed space 124.

As shown in FIG. 4, the first and second nozzles 210 and 212 mounted on the reinforcing plate 120 are connected to a dry gas blower 220 through pipes 214 and 216, respectively. An electromagnetic valve 218 as valve means is mounted in the middle of a pipe 214 connecting the first nozzle 210 and the blower 220. The solenoid valve 218 is controlled by the controller 300 of the handler, and controls the air below the normal temperature to blow dry air from the dry gas blower 220 toward the first nozzle 210 and the air in the second closed space 124 with the first nozzle. The state is switched to a high temperature control state in which the electromagnetic valve 218 is discharged to the outside through the 210.
The control device 300 receives a command to make the inside of the chamber 6 a normal temperature or lower to perform a normal temperature or low temperature test of the IC chip, controls the solenoid valve 218, and
The dry air is blown toward the nozzle 210. The control device 300 sets the inside of the chamber 6 to a high temperature state and
When a command to perform a high-temperature test of the chip is received, the electromagnetic valve 218 is controlled, and the air in the second sealed space 124 is discharged from the electromagnetic valve 218 to the outside through the first nozzle 210.

In this embodiment, the dry air generated by the dry gas blower 220 is supplied from the second nozzle 212 to the second closed space 1 irrespective of the normal temperature or lower control state and the high temperature control state.
24 is configured to be blown.

When a low-temperature test of an electronic component is performed at a room temperature or lower, particularly at a low temperature, using the IC test apparatus 2 according to the present embodiment, at least two first nozzles 210 shown in FIG. Dry air is introduced from the second nozzle 212 into the second closed space 124. As a result, the second closed space is filled with the dry air, and the invasion of the outside air can be prevented. As a result, dew condensation on the back surface of the socket guide 82 can be effectively prevented.

In the present embodiment, at the time of the low-temperature test, the heating board 106 shown in FIG. 2 is driven, and the wiring board 100 is heated by heat transfer via the wiring board holding ring 114. For this reason, the wiring board 100 located on the back surface of the socket 20 is heated to a temperature equal to or higher than the dew point of the atmospheric gas. Therefore, it is possible to more effectively prevent the occurrence of dew condensation on the wiring board 100 and the test head 10 on the rear surface of the socket.

Further, in the IC test apparatus 2 according to the present embodiment, at the time of the low-temperature test, the dry air is also sent to the first closed space 118 through the passages 200 and 202 formed in the heating board shown in FIG. , First closed space 11
8 is also filled with dry air. As a result, dew condensation on the back surface of the socket guide 82 can be more effectively prevented.

In the low-temperature test, as the dry air to be sealed in the first closed space 118, for example, dry air having a dew point temperature equal to or lower than the internal temperature of the chamber 6 is used. For example, the inside of the chamber 6 is −5.
When the temperature is about 5 ° C., it is preferable that the dew point temperature of the dry air sealed in the first sealed space 118 through the passages 200 and 202 is about −60 ° C. The temperature of the dry air is, for example, about room temperature.

In the low temperature test, the dry air introduced into the second enclosed space 124 may be slightly higher than the dew point temperature of the dry air introduced into the first enclosed space 118. Dry air at about 40 ° C. The temperature of the dry air is around room temperature. Second enclosed space 1
The dew point temperature of the dry air introduced into the inside of the first closed space 118 may be slightly higher than the dew point temperature of the dry air introduced into the inside of the first closed space 118 because the second closed space 124 has the first closed space. This is because, compared to the space 118, the space 118 is farther from the inside of the chamber 6, and the possibility of dew condensation is reduced.

When the interior of the chamber is kept at a high temperature using the IC test apparatus 2 according to the present embodiment and a high-temperature test of electronic components is performed, the control device 300 shown in FIG. Then, the air in the second closed space 124 is discharged from the solenoid valve 218 to the outside through the first nozzle 210. Also, the second nozzle 212 passes through the second
Dry air is introduced into the closed space 124. As a result, an air flow is formed inside the second sealed space 124, and the relay circuit, the capacitor and the resistance for stabilizing the test characteristics such as the capacitor and the resistance arranged on the wiring board 100 inside the second sealed space 124 are formed. Electronic component for test circuit 101
Can be cooled. As a result, the temperature of the test circuit electronic component 101 does not become too high,
There is no failure in a short test.

At the time of the high temperature test, the wiring board 1 shown in FIG.
00 is not necessary, but may be heated if necessary to maintain the IC chip 22 mounted in the socket 20 at a predetermined high temperature state. Also, in the high temperature test,
It is not necessary to introduce dry air into the first enclosed space 118 shown in FIG. 2 to prevent dew condensation, but it may be introduced. In the structure shown in FIG. 2, it is considered that the test circuit electronic component 101 does not exist inside the first closed space 118.
Also, at the time of the high temperature test, the second closed space 124 shown in FIG.
Dry air may be circulated in the same manner as described above.

Second Embodiment As shown in FIG. 5, a test board 8a of a test apparatus according to the present embodiment has a wiring board 1 as a test board.
00a is in direct contact with the lower surface of the heating board 106 via a sealing member. Hereinafter, only the points different from the test apparatus according to the first embodiment will be described, and the description of the common parts will be partially omitted.

A base ring 88a is attached to the center of a fixed base 90a attached to the bottom opening of the chamber 6, forming a chamber opening 92a. A socket guide 82a is fixed to the base ring 88a with bolts or the like so that the socket 20 is located at the center of the chamber opening 92a.

A heating board 106 having an opening at the center is provided on the back surface (outside of the chamber) of the fixed base 90a via a mounting plate 150 serving also as a heat insulating material and a sealing member.
Is fixed with bolts. Heating board 106
Is also referred to as a HIFIX heater, and is obtained by sandwiching a planar heating element 108 such as a rubber heater with an aluminum plate or the like. A first sealing member 112 is mounted on the lower surface of the heating board 106 in advance. First seal member 112
Is made of an elastic sheet such as a silicone sponge rubber sheet.

In this embodiment, when the socket adapter 98a, which is mounted at the approximate center of the wiring board 100a as a test board, is connected to the socket 20 and fixed, the outer peripheral surface of the wiring board 100a is heated. 10
6 is in direct contact with the lower surface via the first seal member 112.

The heating board 106 includes passages 200 and 20
2 is formed and communicates with the first sealed space 118a formed between the socket guide 82a and the wiring board 100a. As shown in FIG. 6, passages 200 and 20
2 are connected to first nozzles 210a and 212a, respectively. These nozzles 210a and 212a
Are connected to a dry gas blower 220 through pipes 214a and 216a, respectively.

An electromagnetic valve 218 as a valve means is provided in the middle of a pipe 214 connecting the first nozzle 210 and the blower 220.
Is installed. The solenoid valve 218 is controlled by the controller 300 of the handler, and controls the air below the normal temperature to blow dry air from the dry gas blower 220 to the first nozzle 210, and passes air in the first closed space 118a through the passage 200.
Further, the state is switched to a high temperature control state in which the air is discharged to the outside through the first nozzle 210. Control device 30
0 receives a command to set the inside of the chamber 6 to a room temperature or lower and perform a room temperature or low temperature test of the IC chip, controls the electromagnetic valve 218, and sends the first nozzle 210
Blow dry air toward. The control device 300
However, when receiving a command to perform a high-temperature test of the IC chip with the inside of the chamber 6 in a high-temperature state, the electromagnetic valve 218 is controlled to allow the air in the first sealed space 118 a to pass through the passage 220 and the first nozzle 210. It is discharged from the solenoid valve 218 to the outside.

In the present embodiment, the dry air generated by the dry gas blower 220 is passed from the second nozzle 212a through the passage 202 to the inside of the first closed space 118a irrespective of the normal temperature or lower control state or the high temperature control state. It is configured to blow air.

When a low-temperature test of an electronic component is performed at a room temperature or lower, particularly at a low temperature, using the IC test apparatus 2 according to the present embodiment, at least two first nozzles 210a shown in FIG. And the second nozzle 212a
Then, dry air is introduced into the first closed space 118a. As a result, the first closed space 118a is filled with the dry air, and the invasion of the outside air can be prevented. As a result, dew condensation on the back surface of the socket guide 82a can be effectively prevented.

In the present embodiment, during the low-temperature test, the heating board 106 shown in FIG. 5 is driven to heat the wiring board 100a by heat transfer. For this reason, socket 2
0 is heated to a temperature equal to or higher than the dew point of the atmospheric gas. For this reason, the occurrence of dew condensation on the wiring board 100a and the test head 10 on the rear surface of the socket can be more effectively prevented.

At the time of the low-temperature test, as the dry air to be sealed in the first closed space 118a, for example, dry air having a dew point temperature equal to or lower than the inside temperature of the chamber 6 is used. For example, if the inside of the chamber 6 is-
When the temperature is about 55 ° C., it is preferable that the dew point temperature of the dry air sealed in the first sealed space 118a through the passages 200 and 202 is about −60 ° C. The temperature of the dry air is, for example, about room temperature.

When the interior of the chamber is maintained at a high temperature using the IC test apparatus 2 according to the present embodiment and a high-temperature test of electronic components is performed, the control device 300 shown in FIG. The air in the first closed space 118a is discharged to the outside from the solenoid valve 218 through the passage 200 and the first nozzle 210a. In addition, the first sealed space 11 is passed through the one second nozzle 212a and the passage 202.
Dry air is introduced into the interior of 8a. As a result, a flow of air is formed inside the first enclosed space 118a, and a stabilization of test characteristics such as a relay circuit, a capacitor, and a resistance arranged on the wiring board 100 inside the first enclosed space 118a is performed. It becomes possible to cool the test circuit electronic component 101 (see FIG. 5). As a result, the temperature of the test circuit electronic component 101 does not become too high, and no failure occurs in a short test.

It should be noted that the present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the present invention.

For example, in the above-described embodiment, at the time of the high-temperature test, dry air was introduced from the second nozzles 212 and 212a into the closed spaces 124 and 118a. It may be configured to be introduced. In addition, the closed space 12
The dry air or just air to be introduced into the interior of the 4,118a may be pre-cooled.

Further, in the above-described example, two nozzles 210, 212 or 21 are provided for a single closed space.
Although 0a and 212a are mounted, two or more nozzles may be mounted.

Further, in the test apparatus according to the present invention, a method for handling IC chips in the handler 4 is not limited to the illustrated embodiment.

[0068]

As described above, according to the electronic component test apparatus according to the present invention, it is possible to effectively prevent dew condensation in the vicinity of the socket during a test at a normal temperature or lower, and to perform the test at a high temperature. In this test, it is possible to effectively prevent a failure due to overheating or the like of the test circuit electronic component mounted near the socket.

[Brief description of the drawings]

FIG. 1 is a schematic overall view of an IC chip test apparatus according to one embodiment of the present invention.

FIG. 2 is a sectional view of a main part of the IC chip test apparatus.

FIG. 3 is a sectional view of a main part showing a state before the socket guide shown in FIG. 2 is mounted on a chamber side.

FIG. 4 is a schematic view of an apparatus for introducing dry air into the closed space shown in FIG.

FIG. 5 is a cross-sectional view of a main part of an IC chip test apparatus according to another embodiment of the present invention.

FIG. 6 is a schematic view of an apparatus for introducing dry air into the enclosed space shown in FIG.

[Explanation of symbols]

 2 Electronic component testing apparatus 4 Handler 6 Chamber 8, 8a Test stage 10 Test head 20 Socket 22 IC chip (electronic component) 24 Suction head 30 IC storage units 32A to 32G Tray 34 First 1XY transfer device 35 second XY transfer device 36 soak stage 38 turntable 40 outlet stage 48 contact arm 80 main base 82 socket guide 88, 88a base ring 90, 90a fixed base 92, 92a chamber Opening 98, 98a Socket adapter 100, 100a Wiring board 101 Test circuit electronic component 102 Movable pin holding ring 104 Movable pin 106 Heating board 108 Planar heating element 112 First seal member 114 Wiring Board push Ring 116 ... second seal member 118, 118a ... first sealed space 120 ... reinforcing board 124 ... second sealed space 126 ... third seal member 130 ... gap 150 ... mounting plate 200, 202 ... passage 210, 210a ... first Nozzles 212, 212a ... Second nozzles 214, 216, 21a, 216a ... Piping 218 ... Solenoid valve (valve means) 220 ... Dry gas blower 300 ... Controller

Claims (5)

[Claims] A socket for removably mounting an electronic component to be tested; a socket guide for holding the socket; and a socket opening for the socket so that an electronic component mounting / dismounting opening of the socket faces the inside of the chamber. A chamber attached to the unit and capable of maintaining the inside in a high temperature state and a room temperature or lower state; and a wiring board electrically connected to a terminal of the socket and arranged outside a chamber opening of the chamber. A sealing member for attaching the wiring board to the outside of the chamber so as to form a sealed space on at least one side of the wiring board located outside the socket guide; and at least two second communication members communicating with the inside of the sealed space. Blowing the drying gas toward the first nozzle and the second nozzle, and the first nozzle and the second nozzle; A dry gas blower capable of being installed between the first nozzle and the dry gas blower, and a normal temperature or lower control state for blowing dry gas from the dry gas blower toward the first nozzle; A valve means capable of switching to a high temperature control state in which gas in the space is discharged to the outside through the first nozzle. 2. The electronic component according to claim 1, further comprising: a control unit that determines whether the temperature control inside the chamber is a normal temperature or lower control state or a high temperature control state, and controls the valve unit based on the determination. Testing equipment. 3. A heating board mounted around the chamber opening of the chamber and capable of heating the wiring board by heat transfer when the temperature inside the chamber is controlled to a normal temperature or lower. The electronic component test apparatus according to claim 1, further comprising: 4. The closed space is formed between a wiring board and a reinforcing plate attached to the wiring board on a side opposite to the chamber, and the first nozzle and the second nozzle are mounted on the reinforcing plate. The electronic component test apparatus according to any one of claims 1 to 3, wherein: 5. The method according to claim 3, wherein the closed space is formed in a gap between the socket adapter and the wiring board, and the first nozzle and the second nozzle are mounted on the heating board. Electronic parts testing equipment.