CN105891696A

CN105891696A - Integrated-circuit low-temperature test method

Info

Publication number: CN105891696A
Application number: CN201410605024.XA
Authority: CN
Inventors: 武平; 孙昕; 石志刚; 何超
Original assignee: Beijing Chip Advanced Science And Technology Co Ltd
Current assignee: Beijing Chip Advanced Science And Technology Co Ltd
Priority date: 2014-11-03
Filing date: 2014-11-03
Publication date: 2016-08-24

Abstract

The invention provides an integrated-circuit low-temperature test method. An integrated-circuit low-temperature test device comprises an integrated-circuit test system test board, a test board support, a sealing cover and a flexible pipe. Compressed air is continuously and constantly pumped into. A tested circuit is stored in a low temperature cabinet for at least 30 minutes, wherein the temperature of the low temperature cabinet is 5 degree lower than a specified temperature, and then a low temperature test is performed and the test must be completed in 1 minute. The low temperature test is simple and rapid, cost is low and effect is obvious. The method is suitable for a production line test application.

Description

A kind of integrated circuit low-temperature test method

Technical field

The present invention relates to a kind of integrated circuit testing field, especially integrated circuit low-temperature test field.

Background technology

Owing to the equipment operating ambient temperature containing integrated circuit is that 40 degrees below zero arrives 85 degree above freezing, if this equipment is applied to military field, its ambient temperature is probably subzero 55 degree to 125 degree above freezing, so, in order to ensure the properly functioning of equipment, it is desirable within the temperature range of appointment, the function of integrated circuit, direct current, alternating-current parameter are all tested；Room temperature, high temperature test the most easily realize, the easy frosting of low-temperature test, after frosting, affect the leakage current of circuit-under-test, functional test results；In the prior art, low-temperature test method has multiple, such as uses instrumentation-hot-fluid cover, integrated circuit is carried out function, parameter testing, test temperature can set as required, shortcoming is that the time is long, since it is desired that temperature is set, cover is buckled in and is test on integrated circuit, treat that circuit-under-test temperature stabilization is tested after 5 minutes again, for substantial amounts of production line is tested, the testing time is long, and testing cost is high.

Summary of the invention

The invention provides a kind of integrated circuit low-temperature test method, solve the above-mentioned testing time long, high in cost of production problem.

The present invention is achieved in that

Integrated circuit low temperature test device comprises integrated circuit test system test board, test board support, seal closure, seal closure is arranged on test board middle position below by screw, jet flexible rubber hose is installed in cover, flexible rubber hose has been thrown installation snifting valve and has been placed on centre position in seal closure, and one, the outside of flexible rubber hose is received on compressed air hose.

Further, seal closure to arrive the peripheral components cover of circuit-under-test.

Described low-temperature test method step is as follows:

The first step is placed in circuit-under-test and stores at least 30 minutes than nominative testing temperature in the cryostat of low 5 degree；

Second step is taken out circuit-under-test from cryostat and is placed in test jack；

3rd step testing results test program is tested；

4th pacing is taken out immediately after having tried and is placed in tray dish.

Further, test must complete in 1 minute；

Further, during low-temperature test, compressed gas is always maintained at inflated condition.

Low-temperature test of the present invention is simple, quick, low cost, and effect is obvious, is suitable for test production line and uses.

Accompanying drawing explanation

It is described further with specific embodiments below in conjunction with the accompanying drawings:

Fig. 1 low-temperature test profile

Fig. 2 low-temperature test upward view

Fig. 3 low-temperature test flow chart

Detailed description of the invention

The present invention will be described in further detail in conjunction with accompanying drawing:

With reference to accompanying drawing 1, integrated circuit test system has a test adapter, also pcb board 1 it is, it is buckled in test system by hole, location, this plate surrounding lower part and each passage of integrated circuit test system, test resource is connected, position in the middle of test board support 3 is position discontiguous with test machine, top is mounted with test jack 2, tested integrated circuit is just placed in test jack 1, test board needs to be mounted with different components and parts 4 according to tested circuit further below simultaneously, seal closure 5, flexible rubber hose 7 is mounted with snifting valve 6 through seal closure, received on compressed air hose by one 8, the outside of flexible rubber hose；

Accompanying drawing 2 upward view, devises sealing resin cover 5 in the centre position of test board 9, has support 10 to support below the test board of large scale test system, and resin cover 11 is fixed on test board support 10 by screw 14.On support, flexible rubber hose is installed in punching, and one leads to outside test board, and one leads in the middle of resin cover, installs snifting valve 13 in cup on flexible rubber hose, and compressed air piping is received in outer end, constitutes a complete circuit-under-test test environment；Thus with testing results program, circuit-under-test can be carried out low-temperature test；

The resin cover size closed is except relevant with middle clearance spaces, also relevant with the peripheral components of pcb board, peripheral components is all covered as far as possible, the snifting valve of cup is in the centre position of socket, centre position is that in test process, temperature is minimum, and the possibility preventing frosting more can be played in gas outlet herein.

Circuit-under-test flow chart such as accompanying drawing 3, circuit-under-test is first placed in and stores at least 30 minutes in the cryostat of low 5 degree than assigned temperature, then takes out circuit-under-test and be placed in socket, tightens the lid of socket；Testing results test program is tested, and places test jack from taking out circuit-under-test, and testing results program software is tested, take out immediately after having tested and be placed in tray dish, test must complete in 1 minute, and during low-temperature test, compressed gas is always maintained at inflated condition.

The method is applied on test production line, and effect is obvious, saves the testing time of test machine, also saves the space of Clean room simultaneously, and testing cost substantially reduces.

The above is inventive embodiment, all impartial changes done according to scope of the invention as claimed and modification, all should belong to the covering scope of the claims in the present invention.

Claims

1. an integrated circuit low-temperature test method is characterized in that: integrated circuit low temperature test device comprises Integrated circuit test system test board, test board support, seal closure；Seal closure is pacified by screw Being contained in test board middle position below, install jet flexible rubber hose in cover, flexible rubber hose one installs spray Air valve is placed on centre position in seal closure, and compressed air hose is received in one, the outside of flexible rubber hose On.

Method the most according to claim 1, it is characterised in that seal closure will be the periphery of circuit-under-test Device enclosure arrives.

Method the most according to claim 1, it is characterised in that low-temperature test method step is:

The first step is placed in circuit-under-test and stores at least 30 than assigned temperature in the cryostat of low 5 degree Minute；

Second step is taken out circuit-under-test from cryostat and is placed in socket；

3rd step testing results test program is tested；

Method the most according to claim 3, it is characterised in that low-temperature test must be complete in 1 minute Become.

Method the most according to claim 3, it is characterised in that during low-temperature test, compressed gas It is always maintained at inflated condition.