KR102053087B1 - Side docking type test handler - Google Patents

Abstract

The present invention relates to a test handler.
According to the present invention, an air circulation flow path is formed on one side wall of the desock chamber in order to evenly return the semiconductor elements loaded in the test tray moving in the desock chamber to room temperature or a constant temperature, and is provided with a separate circulation device. Therefore, a technology for improving the stability and reliability of the equipment is proposed by allowing the air inside the desock chamber to circulate through the flow path.

Description

Side Docking Test Handler {SIDE DOCKING TYPE TEST HANDLER}

The present invention relates to a test handler supported for testing a semiconductor device prior to shipping the produced semiconductor device.

The test handler supports a semiconductor device manufactured through a predetermined manufacturing process to be tested by a tester, and classifies the semiconductor device according to a test result and loads the semiconductor device into a customer tray.

1 is a conceptual view of a test handler 100 having a side docking method of supplying a semiconductor device loaded to a tester side in a state in which a conventional test tray is standing vertically. Referring to this, the test handler 100 is Including a test tray 110, a loading device 120, a soak chamber 130, a test chamber 140, a test chamber 140, a desoak chamber 150, an unloading device 160, etc. It is composed.

The test tray 110 has a plurality of inserts on which the semiconductor device can be seated, and circulates along the closed path C defined by a plurality of transfer devices (not shown).

The loading device 120 loads an untested semiconductor device loaded in a customer tray (not shown) into the test tray 110 in a loading position LP.

The soak chamber 130 is provided for preheating or precooling according to test environmental conditions before testing the semiconductor devices loaded in the transferred test tray 110.

The test chamber 140 is provided for testing a semiconductor device loaded in the test tray 110 that is preheated / precooled in the soak chamber 130 and then transferred to the test position TP.

The desock chamber 150 cools the heated semiconductor element loaded in the test tray 110 transferred from the test chamber 140 by blowing to return to a constant temperature such that there is no problem at room temperature or unloading. Or, it is provided to return the cooled semiconductor element to a constant temperature such that normal temperature or condensation does not occur by heating with a warm air or a heater.

The unloading device 160 classifies the semiconductor devices from the test tray 110 in the unloading position (UP) by test grade and unloads them into empty customer trays.

As described above, the semiconductor device is loaded in the test tray 110 and passes through the soak chamber 120, the test chamber 130, and the desock chamber 140, and the unloading position UP and the loading position LP. ) Is sequentially passed through the closed path (C) leading to the soak chamber 120 again.

Meanwhile, the test handler 100 includes a plurality of test trays 110 that circulate along the closed path C. As described above, the soak chamber 130 has a semiconductor device according to a test condition before testing. The temperature is set, and the desock chamber 150 returns the semiconductor device to a predetermined temperature before the unloading after the test is performed, which ultimately increases the operation rate of the tester and the unloading device UP. To improve the processing capacity of the equipment. Here, as is well known, a plurality of test trays 110 are translated in a state in which the plurality of test trays 110 are accommodated together in the soak chamber 130 or the desock chamber 150, and thus the test trays 110 are loaded in the test tray 110 during the time of the translational transfer. The semiconductor device may adjust temperature while staying in the soak chamber 130 and the desoak chamber 150.

Among the techniques for the test handler 100 as described above, the present invention relates to a technique for the subsequent unloading operation to be properly performed by returning the semiconductor elements to the room temperature or a constant temperature in the desock chamber 150, this part This is explained in more detail.

If the semiconductor device tested at low temperature is directly sent to the open air and the unloading position, the water may form on the surface of the semiconductor device in contact with air at room temperature, which may cause damage to the semiconductor device. When the pad grips the semiconductor device, pad marks remain on the surface of the semiconductor device, which may reduce product quality.

In addition, even when the test is performed at a high temperature, if the high temperature semiconductor device is directly sent to the unloading position, the pad of the unloading device may be melted or pressed due to the high temperature heat remaining in the semiconductor device.

Therefore, as described above, it is necessary to configure the desock chamber 150 to return the tested semiconductor device to room temperature or constant temperature. To this end, as shown in FIG. 2, a heater 170, a fan 180, and a direction plate 190 are provided inside the desock chamber 150 configured in the conventional test handler 100. The direction plate 190 is provided to guide the air blown by the fan in a predetermined direction.

The heater 170 is provided in the lower region of the internal space of the desock chamber 150, and the fan 180 supplies the air heated by the heater 170 in the test tray 110 side from the lower side to the upper side. Is prepared for. According to this configuration, during the low temperature test, the heater 170 and the fan 180 operate to increase the temperature of the semiconductor element inside the desock chamber 150, and during the high temperature test, only the fan 180 operates to operate the internal air. By circulating, the temperature of the semiconductor device may be lowered or the temperature may be lowered by supplying a small amount of low temperature gas.

However, in recent years, the size of the test tray has been expanded to improve the processing capacity, and as the test time is shortened, it is trying to take a short time of the test tray staying in the desock chamber.

However, according to the related art as shown in FIG. 2, the semiconductor devices in the lower portion close to the heater 170 among the semiconductor elements spread and stacked in the entire area of the test tray 110 may be returned to the required temperature in a predetermined short time. However, the semiconductor devices in the upper portion relatively far from the heater 170 may cause a deviation from failing to return to the required temperature in a predetermined short time. In particular, the reason why the heat of the heater 170 is not transmitted well to the upper portion of the test tray 110 during the low temperature test is because the space between the test trays accommodated inside the desock chamber 150 is narrow and the test tray is enlarged in size. This is because heat cannot be smoothly transmitted to the upper portion of the 110.

If the above problem is to be solved, it is necessary to increase the time that the test tray stays in the desock chamber (the time the test tray stays translating inside the desock chamber). Will drop. However, if the internal space of the desock chamber is expanded, the test tray stays longer, but the number of test trays that can be accommodated in the desock chamber is increased to maintain the processing capacity. The problem of rising production cost comes from doing.

Therefore, in order to secure the function of the desock chamber while maintaining the size of the conventional equipment, the researchers of the applicant have tried to increase the capacity of the heater or install a heater / fan additionally, but have obtained satisfactory results. I could not.

SUMMARY OF THE INVENTION An object of the present invention for solving the above problems is to provide a technique for circulating air in the desock chamber through a separate flow path so that semiconductor devices loaded in the entire area of the test tray can be evenly returned to the required temperature. will be.

The test handler according to the present invention as described above, the test tray is transported along a predetermined circulation path; A loading device for loading a semiconductor device into the test tray; A soak chamber provided for preheating / precooling the semiconductor devices according to test environmental conditions after accommodating the test trays in which the semiconductor devices are loaded by the loading device; A test chamber provided to support a test of semiconductor devices loaded in a test tray from the soak chamber; A desock chamber provided to return the semiconductor devices loaded in the test tray passing through the test chamber to a predetermined temperature, and a flow path through which air can be moved in an up and down direction is formed on one wall; A circulation device provided to allow air inside the desock chamber to circulate while passing through the flow path; And an unloading device for unloading the semiconductor device loaded in the test tray from the desock chamber. It includes.

One side of the flow passage serves as an inlet for sucking air from the inside of the desock chamber, the other side serves as an outlet for discharging air into the inside of the desock chamber, and the circulation device is inside the desock chamber. Air is sucked into the inlet and then discharged to the outlet.

The circulation device, the suction fan is coupled to the suction port side; And a discharge fan coupled to the outlet side. It includes.

The discharge port is a plurality, the discharge fan is also provided in plurality.

The apparatus may further include a heater positioned in an upper region of the desock chamber internal space to heat the inside of the desock chamber.

The one side wall surface of the desock chamber in which the flow path is formed may be a door for opening and closing the inside of the desock chamber.

It is preferable to further include a circuit breaker for disconnecting the heater from the operator when opening the door.

The circuit breaker may include: a blocking film provided to be foldable inside the desock chamber; And a pusher installed in the door to push the blocking film. It includes.

According to the present invention as described above has the following effects.

First, the semiconductor devices loaded in the entire area of the test tray can be returned to the required temperature within a predetermined short time, thereby improving the stability and reliability of the equipment.

Second, since the door is used as a duct without using a separate duct, the standard of the test handler can be taken as it is, and the existing equipment can be easily improved by applying the present invention.

1 is a conceptual plan view of a conventional test handler.
FIG. 2 is a schematic configuration diagram of a desock chamber generally applied to the test handler of FIG.
3 is a conceptual plan view of a test handler according to an embodiment of the present invention.
4A is a schematic perspective view of a door that forms one wall of a desock chamber;
Figure 4b is a schematic perspective view showing a state in which the suction fan and the discharge fan is coupled to the desock chamber.
4C is a schematic perspective view of a door according to another example.
5 is a conceptual front view of the door of FIG.
FIG. 6 is a reference diagram for explaining the operation of the main part of the test handler of FIG.
7 is a reference diagram for an essential part of a test handler according to another embodiment of the present invention.
8A to 8C are reference diagrams for explaining the operation of the main parts of the test handler referred to in FIG.
9 is a schematic diagram of an essential part of a test handler according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention as described above will be described with reference to the accompanying drawings.

3 is a conceptual plan view of a test handler 300 according to an embodiment of the present invention.

The test handler 300 according to the present embodiment includes a test tray 310, a loading device 320, a soak chamber 330, a test chamber 340, a desock chamber 350, a circulation device 360, and a heater. 370 and the unloading device 380 or the like.

Among the above configurations, the test tray 310, the loading device 320, the soak chamber 330, the test chamber 340, and the unloading device 380 are the same as described in the background art, and thus description thereof is omitted.

The door 351, which forms one wall of the desock chamber 350, is provided to open and close the inside of the desock chamber 350, and as shown in FIG. 4A, air is vertically disposed between the outer surface and the inner surface of the desock chamber 350. A flow path 351a (see dashed line) through which the can be moved is formed, and as shown in FIG. 5, a heat insulating material 351b is provided on the outer surface side thereof. Here, only one inlet 351a-1, which is upper side of the channel 351a, is formed to suck air heated by the heater 370, and outlets 351a-2a, 351a-2b, which are lower sides of the channel 351a, 351a-2c, 351a-2d, and 351a-2e.351a-2f) are formed in a plurality of upper and lower ends so that heated air to be discharged can be evenly discharged to upper and lower sides of the side of the test tray 310. Of course, these outlets 351a-2a, 351a-2b, 351a-2c, 351a-2d, 351a-2e, and 351a-2f may have a large hole in the inner wall of the door 351A as shown in FIG. 4C. Only H) can be formed and the discharge fans can be partitioned as they are installed.

As shown in FIG. 4B, the circulation device 360 is provided to allow air inside the desock chamber 351 to circulate while passing through the flow path 351a and is coupled to the inlet 351a-1. It comprises a suction fan 361 and a plurality of discharge fans (362a to 362f) coupled to the outlet (351a-2a, 351a-2b, 351a-2c, 351a-2d, 351a-2e, 351a-2f) side Can be. As the suction fan 361 and the discharge fans 362a to 362f are also implemented, the circulation of air through the flow path 351a may be made even if only one side is configured, and thus may be sufficiently considered as another example of the present invention. have. In addition, the number and location of the suction fan and the discharge fan may vary depending on the structure of the equipment, the air volume, the size of the test tray, and the parallel with other heaters and fans not mentioned in the present technology. That is, in this example, only one suction fan 361 is installed due to the constraint of the configuration position, but two or more suction fans may be configured in series or in parallel, and the number of discharge fans may be added or subtracted.

The heater 370 is provided to heat the inside of the desock chamber 350 and is located in an upper region of the inner space of the desock chamber 350. The reason why the heater 370 is installed in the upper region is that it is advantageous to secure the installation space than other regions. If the heater 370 is installed on the side, there may be a problem such as the size of the equipment should be increased. In addition, as shown in FIG. 6, a blower fan 390 may be additionally installed at the rear end of the heater 370, so that the heated heat is quickly sent to the suction fan 361.

The operation of the main part of the test handler 300 having the above configuration will be described with reference to FIG.

In the low temperature test, the upper region inside the desock chamber 350 is heated by the heater 370, and the heated air is connected to the flow path 351a according to the operation of the suction fans 361 and the discharge fans 362a to 362f. By passing through and evenly supplied to the upper and lower sides of the test trays 310, the semiconductor devices loaded in the entire area of the test tray 310 are evenly raised to the required temperature so that the semiconductor devices are desired within a predetermined short time. Return to temperature

Of course, during the high temperature test, only the suction fans 361 and the discharge fans 362a to 362f are operated while the heater 370 is stopped, and at this time, air at room temperature is upper and lower sides of the test trays 110. Since it is evenly supplied to the semiconductor devices loaded on the entire area of the test tray 110 is evenly lowered to the required temperature.

The test handler according to the present invention may further include a circuit breaker for protecting the worker by blocking the worker from the heat generated by the heater when the door is opened in addition to the above-described configuration. This will be described with reference to FIG. 7.

As referenced in some perspective views of FIG. 7, the breaker 790 includes a barrier 791 and a pusher 792.

The blocking film 791 has a square plate shape having a sufficient width to block the worker from the heater, and is joined by the hinge H to be foldable on the upper surface of the desock chamber 750.

The pusher 792 is provided to push the upper end portion of the blocking film 791 and is provided on the inner wall surface of the door 751.

The operation of the breaker 790 will now be described with reference to the schematic side cross-sectional view of FIGS. 8A-8C.

In the state in which the door 751 is closed as shown in FIG. 8A, the pusher 792 supports the folded blocking film 791. If the worker opens the door 751, as shown in Fig. 8B, the pusher 792 also moves backward (retracts on the basis of the blocking film) in the moving direction of the door 751, so that the blocking film 791 is unfolded by its own weight. Therefore, the worker W may be blocked from the heater 770 by the unfolded blocking film 791. That is, when the worker opens the door 751 as needed, the hot air heated by the heater 770 is delivered to the worker, so that the worker may be burned. To protect. Subsequently, when the worker W closes the door 751, the pusher 792 moves forward and pushes the upper portion of the barrier film 791 as shown in FIG. 8C, thereby causing the barrier film 791 to be folded again.

Meanwhile, as shown in FIG. 9, the present invention further includes a separate heater 991 and a fan 992 in a lower region of the internal space of the desock chamber 950 so that the heated air is supplied from the lower side to the upper side. May be combined with conventional techniques. In this case, the present inventors have confirmed that the temperature of the semiconductor device is increased as much as desired during the low temperature test while taking the entire standard of the test handler as in the prior art.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, but since the above-described embodiments have only been described with reference to the preferred examples of the present invention, the present invention is limited to the above embodiments only. It should not be understood to be limited, and the scope of the present invention should be understood as the following claims and equivalent concepts.

300: test handler
310: test tray 320: loading device
330: Sock Chamber
340: test chamber
350: Desock Chamber
351: Door
351a: Euro
351a-1: inlet
351a-2a to 351a-2f: outlet
360: circulator
361: suction fan
362a to 362f: exhaust fan
370: heater
380: unloading device
790: breaker
791: 792: pusher

Claims (7)

A test tray transported along a predetermined circulation path;
A loading device for loading a semiconductor device into the test tray;
A soak chamber provided for preheating / precooling the semiconductor devices according to test environmental conditions after accommodating the test trays in which the semiconductor devices are loaded by the loading device;
A test chamber provided to support a test of semiconductor devices loaded in a test tray from the soak chamber;
A desock chamber provided to return the semiconductor devices loaded in the test tray passing through the test chamber to a predetermined temperature, and a flow path through which air can be moved is formed on one wall;
A circulation device provided to allow air inside the desock chamber to circulate while passing through the flow path; And
An unloading device for unloading the semiconductor element loaded in the test tray from the desock chamber; Including,
One side of the flow path functions as an inlet for sucking air in the desock chamber, and the other side of the flow path functions as an outlet.
The circulation device circulates air along a circulation path of air leading into the desock chamber through the inside of the desock chamber, the inlet port and the outlet port,
The flow path is formed in the door for opening and closing the inside of the desock chamber, characterized in that formed between the outer surface and the inner surface of the door
Test handler. The method of claim 1,
The flow path is formed in the vertical direction,
The inlet is located above the outlet, characterized in that
Test handler. The method of claim 2,
The circulation device,
At least one suction fan coupled to the suction port side; And
At least one discharge fan coupled to the outlet side; Characterized in that it comprises
Test handler. The method of claim 3,
And a first heater positioned at an upper region of the desock chamber internal space for heating the inside of the desock chamber.
The first heater is located above the test tray, characterized in that
Test handler. The method of claim 4, wherein
In the low temperature test, the first heater, the at least one suction fan and the at least one discharge fan are all operated,
In the high temperature test, the at least one suction fan and the at least one discharge fan may be operated while the operation of the first heater is stopped.
Test handler. The method of claim 4, wherein
Further comprising a second heater provided in the lower region of the desock chamber internal space,
The second heater is characterized in that located below the test tray
Test handler. The method of claim 1,
The door is characterized in that the insulating material is provided to the outer surface side
Test handler.

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