KR102340726B1 - burn-in test device having dual test chamber - Google Patents

Abstract

A burn-in test apparatus having a dual test chamber is disclosed. The disclosed burn-in test apparatus having a dual test chamber accommodates semiconductor substrates, respectively, and provides an inspection space in which the received semiconductor substrate is inspected. a first test chamber and a second test chamber; first and second blowers respectively disposed on sides of the first and second test chambers to supply air to the first and second test chambers; and a first heating unit and a second heating unit for increasing the temperature of the air provided to the first test chamber and the second test chamber.

Description

Burn-in test device having dual test chamber

The present invention relates to a burn-in test apparatus, and more particularly, it has a dual test chamber, so that it is possible to implement a high-power level device such as 18kw class, and air is appropriately and evenly distributed to create a thermal atmosphere of a predetermined temperature in the test chamber The air introduced into the test chamber is induced to be concentrated toward the semiconductor substrates housed in the test chamber, so that the semiconductor substrates can be tested accurately under a uniform thermal atmosphere at a predetermined temperature set without temperature deviation, and It relates to a burn-in test apparatus having a dual test chamber capable of improving air supply efficiency by not supplying air.

In general, a semiconductor substrate on which a semiconductor integrated circuit is formed is subjected to a reliability test procedure after completion of a production process. In general, reliability is verified by whether a predetermined voltage is applied under severe thermal conditions to withstand a predetermined time.

As described above, a device configured to create a predetermined thermal atmosphere and apply a voltage in order to test the reliability of the semiconductor component is referred to as a burn-in test device.

The burn-in test apparatus includes a test chamber inside a main body, is configured to stack a plurality of semiconductor substrates in a rack provided in the test chamber, and test signals such as test voltages connected to the semiconductor substrates accommodated in the test chamber It is configured to include an interface connection unit for applying the to the semiconductor substrate.

This conventional burn-in test apparatus is disclosed in Korean Patent Registration No. 10-1207891.

The burn-in test apparatus disclosed in Korean Patent Registration No. 10-1207891 includes: a burn-in chamber for accommodating semiconductor components; a main blower for circulating air in the burn-in chamber; a heating unit for increasing a temperature of air supplied into the burn-in chamber; a first outdoor air intake unit for introducing external air into the burn-in chamber; a bet discharge unit for discharging the air inside the chamber to the outside; a second outdoor air intake unit for introducing external air into the burn-in chamber; Between the bet discharge unit and the second outdoor air intake unit, the air introduced into the second outdoor air intake unit is guided to the burn-in chamber, and air from the burn-in chamber is guided to the bet discharge unit, but the bet discharge unit and A burn-in test chamber for inspecting semiconductor components in which a flow guide member for preventing air mixing between the second outdoor air intake units is disposed has been published.

However, in this conventional burn-in test apparatus, air, which is heated by a heating unit and provided to create a predetermined thermal atmosphere in the burn-in chamber (test chamber), is introduced through one upper end of the burn-in chamber and exits again through the other upper end. Therefore, it takes a lot of time to create a thermal atmosphere with a uniform temperature in the entire area of the burn-in chamber, so there is a problem in that a quick test cannot be performed.

In particular, due to this structure, there is a problem in that the reliability of the test is lowered because a plurality of semiconductor components accommodated in the burn-in chamber cannot be tested under a thermal atmosphere (thermal condition) of the same temperature at the initial stage of the test due to this structure.

Republic of Korea Patent No. 10-1207891

The present invention was devised to solve the problems of the prior art as described above, and it is possible to implement a high-power class device such as 18 kw class by having a dual test chamber, and air is properly supplied to create a thermal atmosphere of a predetermined temperature in the test chamber. The air introduced into the test chamber is induced to be concentrated toward the semiconductor substrates housed in the test chamber, so that the semiconductor substrates are accurately tested under a uniform thermal atmosphere at a predetermined temperature set without temperature deviation. An object of the present invention is to provide a burn-in test apparatus having a dual test chamber capable of improving air supply efficiency by not supplying air to unnecessary areas.

In order to achieve the above object, the burn-in test apparatus having a dual test chamber of the present invention provides an inspection space for accommodating semiconductor substrates and inspecting the received semiconductor substrates, and is parallel to each other to form a separate inspection space. a first test chamber and a second test chamber which are disposed to be formed in mutually independent spaces; first and second blowers respectively disposed on sides of the first and second test chambers to supply air to the first and second test chambers; and a first heating unit and a second heating unit for increasing the temperature of the air provided to the first test chamber and the second test chamber.

A first air inlet panel part forming one side wall of each of the first test chamber and the second test chamber and having a plurality of air outlet holes to introduce air into the first test chamber and the second test chamber; 2 air inlet panel unit; It is formed on the outside of each of the first air inlet panel part and the second air inlet panel part and is installed at a position opposite to the first blower and the second blower with respect to the first test chamber and the second test chamber. a first air supply duct unit and a second air supply duct unit for supplying air to each of the first air inlet panel unit and the second air inlet panel unit; The first air supply duct part connects the respective discharge sides of the first blower and the second blower with the first air supply duct part and the second air supply duct part, so that the air supplied from the first blower and the second blower is supplied to the first air supply duct part. and a first connection duct part and a second connection duct part for guiding the second air supply duct part; Each of the first and second test chambers is connected to the first blower and the second blower so that air discharged from each of the first and second test chambers is discharged from the inlet of the first blower and the second blower. It may be configured to further include; a first air return duct portion and a second air return duct portion forming a flow path to move to the side.

The first air supply duct part, the first test chamber, the first air return duct part, and the first blower are sequentially arranged in a line in a horizontal direction, and the second air supply duct part and the second test chamber , the second air return duct unit and the second blower may be configured to be sequentially arranged in a line in a horizontal direction.

The first heating part is disposed between the first air recovery duct part and the first blower, and the second heating part is configured to be disposed between the second air recovery duct part and the second blower, or the first heating part A part may be installed on the first connection duct part, and the second heating part may be configured to be installed on the second connection duct part.

a first cooling unit and a second cooling unit installed inside each of the first air return duct unit and the second air return duct unit to lower the temperature of the air provided to the first test chamber and the second test chamber; It may be configured to further include.

a first air distribution guide unit installed to be spaced apart from the first air supply duct by a predetermined interval and supplying the air supplied from the first blower to the first air inlet panel; and a second air distribution guide unit installed to be spaced apart from the second air supply duct by a predetermined interval and supplying the air supplied from the second blower to the second air inlet panel unit; can be

A front surface of each of the first test chamber and the second test chamber may be configured with an entrance for introducing or withdrawing a semiconductor substrate, and a sliding door for opening and closing the entrance and exit may be configured.

The entrance may be configured as one, so that one side of the entrance is connected to the inside of the first test chamber, and the other side of the entrance is connected to the outside of the second test chamber.

The entrance is configured to include a first entrance formed in the front surface of the first test chamber and a second entrance formed in the front surface of the second test chamber, and the sliding door includes a first sliding door that opens and closes the first entrance; It may be configured to include a second sliding door for opening and closing the second entrance.

It is installed on the sliding door so as to be movable back and forth, and the sliding door moves forward with the entrance closed to prevent the air flowing into the first test chamber and the second test chamber from flowing toward the entrance, thereby preventing the flow of air. Air loss prevention means for preventing loss; may be configured to further include.

As described above, in the present invention, two test chambers are configured side by side in one burn-in test device, and air at a predetermined temperature is independently provided to each test chamber in a circulating manner, thereby performing a test on a test board in each test chamber. Since inspection can be made, it has the effect of making it possible to implement a high-output burn-in test device such as 18kw class.

In addition, since an air distribution guide unit is provided in the air supply duct for supplying air to each test chamber, a uniform thermal atmosphere can be created for each test chamber without temperature deviation according to the height, thereby inspecting semiconductor substrates. It has the effect of increasing the reliability in temperature conditions, enabling accurate inspection, and reducing the time required to create a thermal atmosphere.

In addition, according to the present invention, the sliding door is configured to slide left and right and slide forward and backward, so that the entrance and exit of the test chamber can be opened and closed more concisely and precisely. By forming the double packing structure, the sealing of the test chamber is made more secure, so that an error in the inspection of the semiconductor substrate does not occur and an accurate inspection can be made.

In particular, the sliding door of the present invention is provided with an air loss prevention means to prevent the air flow loss from flowing forward in the state that the sliding door blocks the entrance and the air supplied to the test chamber flows toward the entrance. Efficient operation of the cooling unit and the like can be achieved.

1 is a view showing a burn-in test apparatus having a dual test chamber according to an embodiment of the present invention;
Figure 2 is a view showing the first inclined plate of the air distribution guide unit shown in Figure 1, ((a) is a front view, (b) is a side view),
3 is a perspective view of a first swash plate of the present invention;
4 is a view of the two-stage guide shown in FIG. 2, ((a) is a front view, (b) is a side view)
5 is a side view showing the air inlet panel part of the present invention, ((a) is a separation view, (b) is a combined view)
Figure 6 is a front view showing each configuration of the air inlet panel portion of Figure 5,
7 is a front view showing each configuration for another form of the air inlet panel part,
8 is a front view showing the air exhaust panel part of the present invention,
9 is a front view showing an installation structure of a sliding door of a burn-in test apparatus having a dual test chamber according to an embodiment of the present invention;
10 is an enlarged view of part A of FIG. 9;
11 is a side view showing the front and rear guides in the installation structure of the sliding door of the burn-in test apparatus of the present invention;
12 is an enlarged view of part B of FIG. 11;
13 is a side view showing the front and rear driving means in the installation structure of the sliding door of the burn-in test apparatus of the present invention;
14 is an enlarged view of part C of FIG. 13;
15 to 18 are plan views showing the operating state of the sliding door and the operating state of the air loss prevention means of the burn-in test apparatus of the present invention.

The above objects, other objects, features and advantages of the present invention will be easily understood through the following preferred embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed content may be thorough and complete, and the spirit of the present invention may be sufficiently conveyed to those skilled in the art.

In this specification, when a component is referred to as being on another component, it means that it may be directly formed on the other component or a third component may be interposed therebetween. In addition, in the drawings, the thickness of the components is exaggerated for effective description of the technical content.

Embodiments described herein will be described with reference to cross-sectional and/or plan views, which are ideal illustrative views of the present invention. In the drawings, thicknesses of films and regions are exaggerated for effective description of technical content. Accordingly, the shape of the illustrative drawing may be modified due to manufacturing technology and/or tolerance. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include changes in the form generated according to the manufacturing process. For example, the etched region shown at a right angle may be rounded or have a predetermined curvature. Accordingly, the regions illustrated in the drawings have properties, and the shapes of the regions illustrated in the drawings are intended to illustrate specific shapes of regions of the device and not to limit the scope of the invention. In various embodiments of the present specification, terms such as first, second, etc. are used to describe various components, but these components should not be limited by these terms. These terms are only used to distinguish one component from another. The embodiments described and illustrated herein also include complementary embodiments thereof.

The terminology used herein is for the purpose of describing the embodiments, and is not intended to limit the present invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, the terms 'comprises' and/or 'comprising' do not exclude the presence or addition of one or more other components.

In describing the specific embodiments below, various specific contents have been prepared to more specifically describe the invention and help understanding. However, a reader having enough knowledge in this field to understand the present invention may recognize that it may be used without these various specific details. In some cases, it is mentioned in advance that in describing the invention, parts that are commonly known and not largely related to the invention are not described in order to avoid confusion for no reason in explaining the invention.

Hereinafter, a burn-in test apparatus having a dual test chamber according to an embodiment of the present invention will be described with reference to FIGS. 1 to 13 .

1 to 8, the burn-in test apparatus of the present invention includes test chambers 110a and 110b, air inlet panel parts 115a and 115b, air exhaust panel parts 120a and 120b, and blowers 130a and 130b. , heating units 140a and 140b, air discharge passage units 150a and 150b, air supply duct units 155a and 155b, connection duct units 157a and 157b, and air return duct units 160a and 160b. is composed

The test chambers 110a and 110b are formed in a rectangular box shape to form an inspection space for performing a burn-in test on a semiconductor substrate, and are configured to be provided in the apparatus body 101 . The test chambers 110a and 110b of the present invention are configured to form an inspection space independent of each other in the first test chamber 110a and the second test chamber 110b side by side. That is, the separator 104 is configured between the first test chamber 110a and the second test chamber 110b, so that the first test chamber 110a and the second test chamber 110b are completely separated from two inspection spaces. is configured to form

In addition, an entrance 105 is formed on the front portion of the first test chamber 110a and the second test chamber 110b, and the semiconductor substrates are connected to the first test chamber 110a and the second test chamber through the entrance 105. It may be drawn into or withdrawn from the chamber 110b.

In this embodiment, the doorway 105 is formed vertically over the front surface of the first test chamber 110a and the front surface of the second test chamber 110b, so that the upper part of the doorway 105 is the first test chamber 110a. and the lower portion is configured to be connected to the second test chamber 110b.

However, the present invention is not limited thereto, and two entrances 105 may be configured to be formed separately on the front surface of the first test chamber 110a and the front surface of the second test chamber 110b.

In addition, a plurality of connection parts for applying a test signal by being connected to a plurality of semiconductor substrates stacked and accommodated in each of the test chambers 110a and 110b may be formed on the rear surface of each of the test chambers 110a and 110b.

Racks for accommodating a plurality of semiconductor substrates are installed in each of the test chambers 110a and 110b, and the plurality of substrates are accommodated in each of the test chambers 110a and 110b in a stacked form through the racks and are connected to a plurality of connectors. can be

The air inlet panel parts 115a and 115b are composed of a first air inlet panel part 115a and a second air inlet panel part 115b, respectively, to the first test chamber 110a and the second test chamber 110b. As configured, it is a member constituting one side wall of each test chamber (110a, 110b). A plurality of air inlet holes are formed in each of the air inlet panel parts 115a and 115b so that air for forming a thermal atmosphere in each of the test chambers 110a and 110b flows into the test chambers 110a and 110b. do.

The air exhaust panel parts 120a and 120b are composed of a first air exhaust panel part 120a and a second air exhaust panel part 120b, respectively, to the first test chamber 110a and the second test chamber 110b. As configured, it is a member constituting the other side wall of each test chamber (110a, 110b). A plurality of air outlet holes are formed in each air outlet panel unit (120a, 120b) so that the air in the test chambers (110a, 110b) is discharged through the air outlet holes formed in each air outlet panel unit (120a, 120b). is composed

The blowers 130a and 130b are configured to include a first blower 130a for supplying air to the first test chamber 110a and a second blower 130b for supplying air to the second test chamber 110b. do.

The first blower 130a is installed on the right side of the first test chamber 110a opposite to the first air inlet panel part 115a, and the second blower 130b is connected to the second air inlet panel part 115b and It is configured to be disposed on the opposite right side of the second test chamber 110b.

Meanwhile, in the present invention, the first blower 130a is configured to be disposed on the second blower 130b, and each of the first blower 130a and the second blower 130b may be composed of at least one or more. That is, the first blower 130a is configured to be installed side by side in two front and rear as shown in FIG. can

The first blower 130a is configured to suck in the air discharged from the first test chamber 110a and supply air to the first air inlet panel part 115a, and the second blower 130b is the second test chamber It is configured to suck the air discharged from (110b) and supply air to the second air inlet panel part (115b).

The heating units 140a and 140b include a first heating unit 140a and a second heating unit 140b, and the first heating unit 140a has the temperature of the test air provided to the first test chamber 110a. is configured to increase the temperature, and the second heating unit 140b is configured to increase the temperature of the test air provided to the second test chamber 110b.

The first heating unit 140a is installed on the inlet side of the first blower 130a, and the second heating unit 140b is configured to be installed on the inlet side of the second blower 130b.

Each of the first heating unit 140a and the second heating unit 140b is configured such that a plurality of heaters are disposed at a predetermined interval, and increases the temperature of the air supplied to each test chamber 110a and 110b, and heats it. The used air may be supplied into each of the test chambers 110a and 110b to create a thermal atmosphere for testing the semiconductor substrate in each of the test chambers 110a and 110b.

In the present invention, each heating unit (140a, 140b) is formed on the current side of each blower (130a, 130b), while the air discharged from each test chamber (110a, 110b) passes through each heating unit (140a, 140b) After being heated, it is sucked into each blower 130a, 130b, and each blower 130a, 130b blows the heated air to each air inlet panel part 115a, 115b, and the heated air is heated in each test chamber 110a, 110b) can be configured to be supplied into.

The air discharge passage units 150a and 150b include a first air discharge passage portion 150a and a second air discharge passage portion 150b, and the first air discharge passage portion 150a is a portion of the first blower 130a. It is connected to the discharge side, and the second air discharge passage part 150b is configured to be connected to the discharge side of the second blower 130b. In the present embodiment, the first air discharge passage part 150a is configured to be upward from the first blower 130a, and the second air discharge passage part 150a is configured to be downward from the second blower 130b.

The air supply duct parts 155a and 155b include a first air supply duct part 155a and a second air supply duct part 155b, and the first air supply duct part 155a is a first air inlet panel part ( 115a) formed outside the first test chamber 110a and configured to supply air supplied from the first blower 130a, the second air supply duct part 155b is the second air inlet panel part 115b It is formed on the outside of the second test chamber (110b) is configured to supply the air supplied from the second blower (130b).

The first air supply duct part 155a is configured to be disposed at a position opposite to the first blower 130a with respect to the first test chamber 110a, and the second air supply duct part 155b is the second test chamber It is configured to be disposed at a position opposite to the second blower 130b with respect to (110b).

That is, the first air supply duct part 155a is disposed on the left side with respect to the first test chamber 110a, the first blower 130a is installed on the right side, and the first air supply duct part 155a is installed on the right side with respect to the second test chamber 110b. The second air supply duct portion (155b) is disposed on the left side and the second blower (130b) is installed on the right side.

The connection duct parts 157a and 157b include a first connection duct part 157a and a second connection duct part 157b, and the first connection duct part 157a includes the first air discharge passage part 150a and the first connection duct part 150a. It is configured to connect the air supply duct part 155a, and the second connection duct part 157b is configured to connect the second air discharge passage part 150b and the second air supply duct part 155b. In addition, in the present invention, the first connection duct part 157a is configured to be disposed above the first test chamber 110a, and the second connection duct part 157b is disposed to be disposed below the second test chamber 110b. is composed

The air recovery duct parts 160a and 160b include a first air recovery duct part 160a and a second air recovery duct part 160b.

The first air return duct unit 160a connects the first test chamber 110a and the inlet side of the first blower 130a to remove the air discharged from the first test chamber 110a of the first blower 130a. It is configured to guide to the entrance side.

That is, the first air return duct unit 160a has one side configured to be connected to the first air exhaust panel unit 120a, and the other side configured to be connected to the inlet side of the first blower 130a, so as to discharge the first air. It is configured to guide the air discharged from the first test chamber 110a through the panel part 120a to the inlet side of the first blower 130a.

At this time, the first heating unit 140a is configured to be disposed between the first air recovery duct unit 160a and the first blower 130a, and the first blower 130a is provided through the first air recovery duct unit 160a. is configured to heat the temperature of the air guided into the furnace.

In addition, the second air return duct unit 160b has one side configured to be connected to the second air exhaust panel unit 120b, and the other side configured to be connected to the inlet side of the second blower 130b, so as to discharge the second air It is configured to guide the air discharged from the second test chamber 110b through the panel part 120b toward the inlet side of the second blower 130b.

At this time, the second heating unit 140b is disposed between the second air recovery duct unit 160b and the second blower 130b, and the second blower 130b is passed through the second air recovery duct unit 160b. is configured to heat the temperature of the air guided into the furnace.

In the present invention, the first air supply duct part 155a, the first test chamber 110a, the first air return duct part 160a and the first blower 130a are sequentially arranged in a line in the horizontal direction, and the second The air supply duct part 155b, the second test chamber 110b, the second air return duct part 160b, and the second blower 130b are configured to be sequentially arranged in a row in the horizontal direction.

In addition, the configuration of the first air supply duct unit 155a, the first test chamber 110a, the first air recovery duct unit 160a, and the first blower 130a arranged in a line and the second air supply duct arranged in line The configuration of the part 155b, the second test chamber 110b, the second air return duct part 160b, and the second blower 130b is configured to be arranged vertically side by side.

In the present invention, in order to supply air at an appropriate temperature for semiconductor substrate inspection to each of the first test chamber 110a and the second test chamber 110b, a first heating unit 140a for heating the temperature of the air, and In addition to the configuration of the second heating unit 140b, cooling units 145a and 145b for lowering the heated air temperature to an appropriate temperature may be further included.

The cooling units 145a and 145b may be formed of an evaporator, and are configured to include a first cooling unit 145a and a second cooling unit 145b. The first cooling part 145a may be installed in the first air return duct part 160a, and the second cooling part 145b may be installed in the second air duct recovery part 160b.

With the above configuration, the air discharged from the first test chamber 110a passes through the first air return duct unit 160a and is guided to the first blower 130a by the first cooling unit 145a and the first heating unit. After being heated or cooled to an appropriate temperature for the semiconductor substrate test by the part 140a, the first air discharge passage part 150a, the first connection duct part 157a, and the first air supply through the first blower 130a. While the process of moving to the first air supply panel unit 115a through the duct unit 155a and flowing into the first test chamber 110a through the first air supply panel unit 115a is circulated, the first test chamber (110a) A thermal atmosphere of a predetermined temperature for the board test is created by the supplied air.

Similarly, the air discharged from the second test chamber 110b passes through the second air return duct unit 160b and is guided to the second blower 130b by the second cooling unit 145b and the second heating unit 140b. After being heated or cooled to an appropriate temperature for the semiconductor substrate test by 155b) to the second air supply panel unit 115b, and the process of flowing into the second test chamber 110b through the second air supply panel unit 115b is circulated, while the second test chamber 110b The internally supplied air creates a thermal atmosphere at a predetermined temperature for the board test.

As described above, in the present invention, a first test chamber 110a and a second test chamber 110b are configured side by side in a vertical and parallel manner in one burn-in test apparatus, and air at a predetermined temperature is independently supplied to each test chamber 110a and 110b. Since it is provided in a circulating method, it is possible to implement a high-output burn-in test apparatus such as 18kw class because the test board can be tested in each of the test chambers 110a and 110b.

That is, since 9kw output capacity can be applied to each of the dual test chambers 110a and 110b configured side by side, it is possible to implement a high-power burn-in test apparatus of 18kw class.

Meanwhile, in the present invention, the first connection duct part 157a is disposed above the first test chamber 110a, and the second connection duct part 157b is disposed below the second test chamber 110b. As can be seen from the arrow indicating the air flow of 1, the first test chamber 110a is supplied with air by counterclockwise air circulation, and the second test chamber 110b is supplied with air by clockwise air circulation. The flow of each air discharged through each of the first blower 130a and the second blower 130b and moved to the first air supply duct part 155a and the second air supply duct part 155b so that the air is supplied. It is configured such that the flow can occur in completely spaced apart locations.

In the present invention, the first heating unit 140a is disposed between the first air return duct unit 160a and the inlet side of the first blower 130a, and the second heating unit 140b is the second air return duct unit. Although it has been described as being disposed between the part 160b and the inlet side of the second blower 130b, it is not limited thereto, and the first heating part 140a is configured on the first connection duct part 157a, Of course, the second heating unit 140b may be configured on the second connection duct unit 157b. In addition, each of the first cooling unit 145a and the second cooling unit 145b may be configured to be installed on the first connecting duct unit 157a and the second connecting duct unit 157b.

On the other hand, the present invention is installed in each of the first air supply duct portion (155a) and the second air supply duct portion (155b), the air supplied from each blower (130a, 130b) is supplied to the first air inlet panel portion (115a) and It may be configured to further include air distribution guide units 170a and 170b for distributing and supplying the second air inlet panel 115b, respectively.

1 to 4 , the air distribution guide units 170a and 170b include a first air distribution guide unit 170a and a second air distribution guide unit 170b, each of which is a first air supply duct It is configured to be installed in the portion (155a) and the second air supply duct portion (155b).

In this embodiment, the first air supply duct part 155a has a structure in which air is introduced from the upper side, and the second air supply duct part 155b has a structure in which air is introduced from the lower side, and accordingly, the first air distribution guide unit ( 170a) and the second air distribution guide unit 170b differ only in that they are installed symmetrically up and down, but have the same configuration and perform the same operation, so that only the first air distribution guide unit 170a will be described.

The first air distribution guide unit 170a is for sequentially distributing and supplying the air supplied from the first blower 130a from one end to the other end of the first air inlet panel unit 115a. 171), a two-stage guide 174, is configured to include a three-stage guide (175).

The first stage guide 171 , the second stage guide 174 , and the third stage guide 175 are installed in the first air supply duct part 155a, and the first air supply duct connected to the first connection duct part 157a It is installed so as to be sequentially arranged at a predetermined interval from one end of the portion (155a) toward the other end.

The first-stage guide 171 is installed so as to be disposed in the middle of the width direction of the upper portion of the first air supply duct part 155a and divides the supplied air in half to distribute the first-stage guide 171 in the middle and at the lower end of the height of the first-stage guide 171 . A first inclined plate 173 and a second inclined plate 172 are provided to be inclined downward toward the air inlet panel portion 115a.

The two-stage guide 174 is disposed under the second inclined plate 172 and is installed to be inclined downwardly from the first air supply duct part 155a toward the first air inlet panel part 115a, and the three-stage guide ( 175 is spaced apart from the lower portion of the two-stage guide 174 by a predetermined interval, and is installed to be inclined downwardly from the first air supply duct portion 155a toward the first air inlet panel portion 115a.

The air flowing into the first air supply duct part 155a from the first connection duct part 157a is distributed in half by the first-stage guide 171 , and among the air distributed in half by the first-stage guide 171 . The air introduced in the width direction of the first air supply duct part 155a is guided to the upper part of the first air inlet panel part 115a by the first inclined plate 173 and the second inclined plate 172 to conduct the first test. The air introduced into the interior of the chamber 110a and introduced to the outside in the width direction of the first air supply duct part 155a among the air distributed in half by the first-stage guide 171 is the second-stage guide 174 and the third It is guided to the lower part of the first air inlet panel part 115a by the step guide 175 and introduced into the interior of the first test chamber 110a.

At this time, the first swash plate 173 of the present invention is configured such that the first air pass hole 173a elongated in the longitudinal direction is formed, and the second swash plate 174 has no through hole at all, so that the first air supply duct A part of the air introduced in the width direction of the part 155a is guided to the first air inlet panel part 115a by the first inclined plate 173, and the rest passes through the first air pass hole 173a and then It may be guided to the first air inlet panel part 115a by the second inclined plate 174 and may be uniformly guided as a whole to the upper region of the first air inlet panel part 115a.

On the other hand, the first inclined plate 173 of the present invention may be configured to be separately configured and coupled to the first-stage guide 171 by fastening means such as bolts, and for this purpose, the upper end is coupled with the first-stage guide 171 . A first coupling plate 173b for this may be provided, and in addition, a second coupling plate 173c fixedly coupled to the main body 101 or the air supply duct portions 155a. ) may be provided.

A second air pass hole 174a is formed in the second stage guide 174 long in the longitudinal direction, and no through hole is formed in the third stage guide 175, so that the width of the first air supply duct part 155a A part of the air introduced outward in the direction and moved to the lower part of the first air supply duct part 155a is guided to the first air inlet panel part 115a by the two-stage guide 174, and the rest is the second air pass hole ( After passing through 174a), it may be guided to the first air inlet panel 155a by the three-stage guide 175 and uniformly guided throughout the lower region of the first air inlet panel part 115a.

In addition, the two-stage guide 174, like the first inclined plate 173, the upper coupling plate (174b) and A side coupling plate 174 may be provided.

As such, in the present invention, a first-stage guide 171 , a second-stage guide 174 , and a third-stage guide 175 are installed in the first air supply duct part 155a along the longitudinal direction, so that the first air supply duct part 155a is installed. ) by guiding the air introduced to the first air inlet panel part 115a with a height difference, the air passes through the entire upper and lower regions of the first air inlet panel part 115a and into the first test chamber 110a. It is introduced into the interior of the first test chamber 110a, so that it is possible to create a uniform thermal atmosphere as a whole without temperature deviation according to the vertical height.

Meanwhile, referring to FIGS. 5 and 6 , in the present invention, each of the first and second air inlet panel parts 115a and 115a includes a panel body 116 having a rectangular receiving groove 116a formed therein, and a receiving groove 116a. A honeycomb member 117 and a honeycomb member 117 having a honeycomb hole 117a having a predetermined width to improve straightness while evenly dispersing the air introduced through the air inlet 116 formed in the panel body 116 and installed in the panel body 116, and the panel body It is coupled to the rim of the 116 and is configured to include a cover plate 118 having an air outlet 118a for discharging air passing through the honeycomb hole 117a.

As such, the air inlet panel parts 115a and 115b of the present invention are configured to include a honeycomb member 117 having a honeycomb hole 117a, thereby improving the straightness of the air supplied to the test chambers 110a and 110b. As a result, the air is not discharged to unnecessary regions of the test chambers 110a and 110b, and it can help to be guided to the region in which the semiconductor substrate is substantially accommodated.

On the other hand, the air inlet panel part (115a, 115b) of the present invention has a plurality of air inlets (116b) formed on the inner surface of the receiving groove (116a) of the panel body 116 at a predetermined interval up and down as shown in FIG. It may be made, but is not limited thereto, and an air inlet 116b' may be formed in the panel body 116' as shown in FIG.

In addition, in FIG. 6 , the air outlets 118a are formed through the cover plate 118 at predetermined intervals up and down, but the present invention is not limited thereto. The air outlet 118a' penetrated by this one is configured, and a metal mesh network 118b is welded to the edge of the cover plate 118' by welding, and the air outlet 118a' is formed by the mesh network 118b. It may be formed in a form configured to be covered.

On the other hand, referring to FIG. 8 , each of the air exhaust panel parts 120a and 120b of the present invention is formed in a square plate shape, and a plurality of air exhaust holes 121a may be formed through it. However, the present invention is not limited thereto, and the air outlet plate lever parts 120a and 120b have one air outlet hole formed in the center like the cover plate and the mesh network of the air inlet panel shown in FIG. 7 and cover the air outlet hole. The mesh network may be formed in a combined form.

9 to 15 , the present invention is configured to further include a sliding door 200 installed on the front portion of the device body 101 to open and close the doorway 105 by moving left and right and back and forth. In addition, in the present invention, the left and right sliding part 210 for guiding the left and right sliding movement of the sliding door 200, the front and rear sliding part 220 for guiding the front and rear sliding movement of the sliding door 200, and the sliding door 200 left and right It is configured to include a left and right movement driving means 230 for moving, and a forward and backward movement driving means 240 for moving the sliding door 200 back and forth.

The left and right sliding parts 210 are configured as a pair, one connects the upper front part of the device body 101 and the upper end of the sliding door 200, and the other slides with the lower front part of the device body 101 . It is configured to connect the lower end of the door 200, and is configured to guide the left and right sliding movement of the sliding door 200. Each of the left and right sliding parts 210 has the same configuration except that the installation location is different.

Each of the left and right sliding parts 210 is made of an lm guide module, and is configured to include the left and right lm rails 212 and the left and right lm blocks 214 . The left and right lm rails 212 are fixedly installed in the left and right directions on the front part of the device body 101, and the left and right lm blocks 214 are movable left and right along the left and right lm rails 212, and the front and rear sliding parts 220 is configured to be connected to the sliding door 200 by the , and the sliding door 200 is configured to be movable left and right by the left and right sliding parts 210 .

9 to 12, the front and rear sliding part 220 is made of an lm guide module, and is configured to connect the sliding door 200 and the left and right lm blocks 214 so that the sliding door 200 slides forward and backward. guide

The front and rear sliding unit 220 is configured to include the front and rear lm rails 223 and the front and rear lm blocks 221 , and the front and rear lm blocks 221 are configured to be slidable along the front and rear lm rails 223 .

The front and rear lm blocks 221 are coupled and installed in the front and rear directions to the first bracket 200a fixed to the sliding door 200, and the front and rear lm rails 223 are fixed to the left and right lm blocks 214 with the second bracket 215 ) by being coupled and installed in the front-rear direction, the sliding door 200 guides the sliding door 200 forward and backward.

9 to 12, the left and right movement driving means 230 is composed of a linear actuator such as a linear stage, the actuator body 231, and a mover 232 moving along the actuator 231. is configured to include The actuator body 231 is configured to be coupled and installed on the front part of the device body 101 in the left and right directions, and the mover 232 is configured to be connected to the sliding door 200 by the connecting means 234 and 236 so as to move left and right. It is configured to move the sliding door 200 in the left or right direction according to the driving of the driving means 230 .

At this time, the connection means 234 and 246 are formed on the front surface of the mover 232 and projecting rearward with respect to the mover 232 , and the lower end is fixedly coupled to the sliding door 200 , and the upper end has a protrusion. An insertion groove 236a into which the 234a is inserted is formed so that the sliding door 200 is interlocked to move left and right when the mover 232 moves left and right, and when the sliding door 200 moves back and forth, the protrusion 234a It is configured to include a locking member 236 that is moved back and forth along the way.

When the protrusion 234a is moved left and right together with the mover 232, the locking member 236a is moved left and right together with the protrusion 234a while the protrusion 234a is inserted into the insertion groove 236a to slide. The door 200 is slid left and right, and when the sliding door 200 is guided by the front and rear sliding unit 220 to move forward and backward, the engaging member 236 installed in the sliding door 200 closes the protrusion 234a. It can be moved back and forth accordingly.

9 and 10, 13 and 14, the forward and backward movement driving means 240 is composed of a pneumatic cylinder, an electric cylinder, and the like, and is configured to include a telescopic rod 241 that expands and contracts according to driving.

The forward and backward movement driving means 240 is configured to connect the left and right sliding parts 210 and the sliding door 200 to move the sliding door 200 in the forward and backward directions.

Specifically, the forward and backward movement driving means 240 is fixedly installed on the second bracket 215 fixedly installed on the left and right lm blocks 214, and the end of the expansion rod 241 of the forward and backward movement driving means 240 is a sliding door ( It is configured to be coupled to and fixed to the third bracket 200b fixedly installed in 200), and according to the expansion and contraction operation of the expansion rod 241, the sliding door 200 is configured to move in the front-rear direction.

In the present invention, the left and right movement driving means 230 and the forward and backward movement driving means 240 may be configured to be driven and controlled by the control of the controller.

15 to 17, the sliding door 200 of the present invention waits in the standby position without blocking the entrance 105 as shown in FIG. 15, and the left and right movement driving means 230 is driven by the control of the control unit. Accordingly, it is slid to the left so that the sliding door 200 faces the entrance 105 as shown in FIG. 16 .

In this way, in a state where the sliding door 200 faces the entrance 105 as shown in FIG. 16,

As the forward/backward movement driving means 240 is driven under the control of the control unit, the sliding door 200 advances to block the entrance 105, thereby sealing the first test chamber 110a and the second test chamber 110b. can

In the present invention, one entrance 105 is configured to be connected to the first test chamber 110a and the second test chamber 110b together, and one sliding door 200 for opening and closing the entrance 105 is also configured. do. However, the present invention is not limited thereto, and when the entrance 105 is provided in each of the first test chamber 110a and the second test chamber 110b and consists of two, the sliding door 200 is also the first test chamber ( The doorway formed in 110a) and the doorway formed in the second test chamber 110b may consist of two, respectively, and the doorway formed in the first test chamber 110a and the doorway formed in the second test chamber 110b are opened and closed, respectively. The left and right sliding unit 210, the front and rear sliding unit 220, the left and right movement driving means 230, and the front and rear movement means 240 may also be configured for each sliding door 200 for this purpose.

According to the present invention, a first packing member 105a in the form of a square ring made of a soft synthetic resin such as rubber or silicone is formed on the front of the device body 101 on the outside of the entrance 105, and also on the inner surface of the sliding door 200 The second packing member 207 in the form of a square ring made of a soft synthetic resin such as rubber or silicone is configured.

At this time, in the present invention, the size of the second packing member 207 is configured to be larger than the size of the first packing member 105a so that the sliding door 200 advances as shown in FIG. 17 to block the entrance 105 , as the first packing member 105a is inserted into the second packing member 107, the first packing member 105a is in close contact with the inner surface of the sliding door 200, and the second packing member 207 is connected to the device body 101 ) is formed with a double packing structure in close contact with the front part, so that the airtightness for the doorway 105 can be significantly improved.

On the other hand, 10 and 15, the present invention is installed in the front upper and lower front of the sliding door 200, respectively, the sliding door 200 moves forward with the doorway 105 closed in the first test chamber ( 110a) and the second test chamber 110b may be configured to further include a pair of air loss prevention means 203 for preventing a flow loss of air from flowing toward the entrance 115.

The air loss prevention means 203 is made in the form of a panel, and is configured to be fixedly coupled to the end of the expansion rod 205a of the cylinder module 205 installed in the sliding door 200, so that the cylinder module 205 is driven, that is, expansion and contraction. It is configured to advance away from the sliding door 200 or backward to approach the sliding door 200 according to the expansion/contraction operation of the rod (205a).

In a state in which the sliding door 200 blocks the entrance 115 as shown in FIG. 17, when the cylinder module 205 is driven and the expansion and contraction rod 205a is extended, the air loss prevention means 203 moves forward with it 18, the air loss prevention means 203 is moved to the rear end of the doorway 115, and the air introduced into the first and second test chambers 110a and 110b through the air inlet panel parts 115a and 115b flows into the doorway ( 105), it is possible to prevent the flow loss of air by preventing it from moving into the inside, and accordingly, it is possible to increase the operating efficiency of the blowers 130a and 130b, the heating units 140a and 140b, and the cooling units 145a and 145b. .

In the above, the present invention has been shown and described in connection with preferred embodiments for illustrating the principles of the present invention, but the present invention is not limited to the configuration and operation as shown and described as such. Rather, it will be apparent to those skilled in the art that many changes and modifications can be made to the present invention without departing from the spirit and scope of the appended claims. Accordingly, all such suitable alterations and modifications and equivalents are to be considered as falling within the scope of the present invention.

101... the body
110a, 110b...test chamber
115a, 115b...Air inlet panel part
120a, 120b... Air exhaust panel part
130a, 130b...Blower
140a, 140b...Heating part
145a, 145b...cooling part
150a, 150b... Air discharge passage part
155a, 155b...Air supply duct part
157a, 157b...Connecting duct part
160a, 160b... Air return duct part
170a, 170b...Air distribution guide unit
200...sliding door
203...Air loss prevention means
210...left and right sliding part
220...Fore and aft sliding part
230... Left and right movement driving means
240...forward and backward movement driving means

Claims (10)

a first test chamber and a second test chamber each accommodating the semiconductor substrates and providing inspection spaces in which the received semiconductor substrates are inspected, and arranged in parallel to form separate inspection spaces, respectively, and formed as independent spaces;
first and second blowers respectively disposed on sides of the first and second test chambers to supply air to the first and second test chambers;
It is configured to include; a first heating unit and a second heating unit to increase the temperature of the air provided to the first test chamber and the second test chamber;
In front of each of the first test chamber and the second test chamber, a doorway for introducing or withdrawing a semiconductor substrate is configured, and a sliding door for opening and closing the doorway is configured;
It is installed on the sliding door and is configured to be movable back and forth with respect to the sliding door, and the sliding door moves forward with the doorway closed and moves toward the rear end of the doorway to the first test chamber and the second test chamber. Burn-in test apparatus having a dual test chamber, characterized in that it further comprises; an air loss prevention means for preventing the flow loss of air by preventing the inflow of air from moving into the entrance.
The method of claim 1,
A first air inlet panel part forming one side wall of each of the first test chamber and the second test chamber and having a plurality of air outlet holes to introduce air into the first test chamber and the second test chamber; 2 air inlet panel unit;
It is formed on the outside of each of the first air inlet panel part and the second air inlet panel part and is installed at a position opposite to the first blower and the second blower with respect to the first test chamber and the second test chamber. a first air supply duct unit and a second air supply duct unit for supplying air to each of the first air inlet panel unit and the second air inlet panel unit;
The first air supply duct part connects the respective discharge sides of the first blower and the second blower with the first air supply duct part and the second air supply duct part, so that the air supplied from the first blower and the second blower is supplied to the first air supply duct part. and a first connection duct part and a second connection duct part for guiding the second air supply duct part;
Each of the first and second test chambers is connected to the first blower and the second blower so that air discharged from each of the first and second test chambers is discharged from the inlet of the first blower and the second blower. Burn-in test apparatus having a dual test chamber, characterized in that it further comprises;
3. The method of claim 2,
The first air supply duct part, the first test chamber, the first air return duct part, and the first blower are sequentially arranged in a line in a horizontal direction,
The burn-in test apparatus having a dual test chamber, characterized in that the second air supply duct part, the second test chamber, the second air return duct part, and the second blower are sequentially arranged in a horizontal direction.
3. The method of claim 2,
The first heating unit is disposed between the first air recovery duct part and the first blower, and the second heating part is configured to be disposed between the second air recovery duct part and the second blower,
A burn-in test apparatus having a dual test chamber configured such that the first heating part is installed on the first connection duct part, and the second heating part is installed on the second connection duct part.
5. The method of claim 4,
a first cooling unit and a second cooling unit installed inside each of the first air return duct unit and the second air return duct unit to lower the temperature of the air provided to the first test chamber and the second test chamber; Burn-in test apparatus having a dual test chamber, characterized in that it further comprises.
3. The method of claim 2,
a first air distribution guide unit installed to be spaced apart from the first air supply duct by a predetermined interval and supplying the air supplied from the first blower to the first air inlet panel; and,
A second air distribution guide unit installed to be spaced apart from the second air supply duct by a predetermined interval and supplying the air supplied from the second blower to the second air inlet panel unit; characterized by further comprising: Burn-in test equipment with dual test chambers.
delete The method of claim 1,
The burn-in test apparatus having a dual test chamber configured such that the entrance is configured as one, one side of the entrance is connected to the inside of the first test chamber, and the other side of the entrance is connected to the outside of the second test chamber.
The method of claim 1,
The entrance is configured to include a first entrance formed on the front surface of the first test chamber and a second entrance formed on the front surface of the second test chamber,
The sliding door is a burn-in test apparatus having a dual test chamber configured to include a first sliding door for opening and closing the first entrance and a second sliding door for opening and closing the second entrance.

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