KR20180077451A - Handling system for testing electronic devices - Google Patents

Abstract

The present invention relates to a handling system for testing electronic components. The handling system for testing electronic components according to the present invention comprises: a supply/recovery unit for supplying/recovering a test tray to/from a test area divided into a first test area and a second test area; a first handler unit disposed adjacent to the first test area; a second handler unit disposed adjacent to the second test area; and a control unit for controlling operations of the supply/recovery unit, the first handler unit, and the second handler unit. According to the present invention, there is an advantage that even when the operation of either the first handler unit or the second handler unit is to be stopped, the handler unit on either side can supply the test tray to both the first test area and the second test area, and test tray can be recovered from both the first test region and the second test region, thereby increasing the operation rate of the tester.

Description

[0001] HANDLING SYSTEM FOR TESTING ELECTRONIC DEVICES [0002]

The present invention relates to a handling system for testing electronic components.

The produced electronic parts are tested by a tester and divided into good and defective parts, so only good parts are shipped.

Electrical connection between the tester and the electronic component is performed by a handler for testing electronic components (hereinafter, referred to as a 'handler'), and there are various types of handlers depending on the type of electronic component. The present invention relates to a handler to which a test tray to which a plurality of electronic parts can be loaded is applied.

The handler to which the test tray is applied may have various forms including Korean Patent Laid-Open No. 10-2013-0105104 and the like. Generally, the handler includes a loading unit 110, a first chamber 120, A first chamber 130, a connector 140, a second chamber 150, and an unloading unit 160.

The loading unit 110 loads electronic components to be tested loaded in the customer tray CT ₁ into a test tray TT in a loading position LP.

The first chamber 120 is provided to pre-adjust (preheat or precool) the temperature according to the test temperature condition prior to testing the electronic components loaded in the received test tray TT.

The test chamber 130 is provided to test the electronic components of the test tray TT that have been preheated / precooled in the first chamber 120 and then transferred to the test position TP (TEST POSITION). That is, the test chamber 130 is provided to maintain the temperature of the electronic components loaded in the received test tray TT at the test temperature condition.

The connector 140 electrically connects the electronic components loaded in the test tray TT of the test position TP to the tester.

The second chamber 150 is provided to cool the electronic components in a heated state of the test tray TT transferred from the test chamber 130 and to return the temperature to a temperature at which no problem occurs at room temperature or unloading .

The unloading unit 160 unloads the electronic components from the test tray TT in the unloading position UP and moves the unclassified customer tray CT ₂ into the unclassified customer tray CT ₂ according to the test grade.

As has been seen, the test tray TT is circulated along the circulation path CC leading to the loading position LP via the loading position LP, the test position TP and the unloading position UP, A plurality of conveyers not shown for conveying the test tray TT in each of the sections constituting the circulation path CC.

The handler 100 shown in FIG. 1 transports the test tray TT in a closed circulation path CC and a structure in which the test chamber 130 is placed between the first chamber 110 and the second chamber 150 , It is difficult to provide four or more test windows (TW) in consideration of the width and height of the equipment. Here, the test window TW refers to a window in which electronic components are electrically connected to a tester, and one test tray TT corresponds to one test window TW. Of course, the tester TESTER is coupled to the handler 100 via the test window TW.

 Thus, the number of electronic components that can be tested at one time is limited to the number of test trays (TT) loaded from one to at least three test trays (TT), which allows the handler 100, which can not expand indefinitely, . Accordingly, Korean Patent Application No. 10-2016-0116620 (hereinafter referred to as "prior art"), which was filed by the applicant of this application, proposed a technique for supplying test trays to a plurality of testers.

 However, in the prior art, the operation of the plurality of tester must be stopped when either one of the loading or unloading configuration of the handler is to be stopped. Therefore, prior art technology is a technology that can reduce the capacity of the tester because of its reduced utilization rate.

An object of the present invention is to provide a technique capable of continuously activating a tester even when a part of a handling system is shut down due to malfunction, malfunction or periodic inspection.

A handling system for testing electronic components according to the present invention includes a supply and recovery unit for supplying a test tray loaded with electronic components to be tested to a test region and for collecting test trays loaded with tested electronic components from a test region; Wherein the test region is divided into a first test region and a second test region, in which the testers for testing the electronic components are located, adjacent to the first test region, After unloading the electronic parts from the test tray after receiving the loaded test tray, the electronic parts are classified according to the test result, and the tested electronic parts are tested after loading the electronic parts to be tested with the unloaded test tray A first handler capable of sending a test tray loaded with electronic components to the supply and recovery unit; And a second test area that is provided adjacent to the second test area, receives the test tray loaded with the tested electronic parts from the supply and collection part, unloads the electronic parts from the test tray, classifies the electronic parts according to the test result, A second handler unit for loading electronic components to be tested into an unloaded test tray and then sending a test tray loaded with electronic components to be tested to the supply and recovery unit; And a control unit for controlling operations of the supply and recovery unit, the first handler unit, and the second handler unit. .

The first handler unit and the second handler unit are disposed to face each other with the supply and recovery unit interposed therebetween.

The first handler portion and the second handler portion are arranged side by side on one side of the feed and return portion.

The control unit controls the supply and recovery unit, the first handler unit, and the second handler unit to operate in any one of the operation modes including the first operation mode, the second operation mode and the third operation mode Wherein in the first operation mode, the first handler unit and the second handler unit operate together, and the first handler unit supplies the test tray to the first test area or the test tray from the first test area Wherein the second handler portion is operative to supply a test tray to the second test region or to withdraw a test tray from the second test region, and in the second operation mode, the first handler portion is activated and the second By stopping the handler part, the first handler can stop the first test area and the second test area Wherein the second handler section is operable to supply a tray or to withdraw a test tray from the first test area and the second test area, wherein in the third operating mode the first handler section is stopped and the second handler section is activated, A handler unit is operative to supply a test tray to the first test area and the second test area or to recover a test tray from the first test area and the second test area.

The supplying and collecting unit receives the test tray on which the electronic parts to be tested are loaded from the first handler unit and supplies the test tray to the first test area and then collects the tested electronic components from the first test area, A first supply and recovery section for sending to the handler section; A second supply unit that receives a test tray on which electronic components to be tested are loaded from the second handler unit, supplies the test tray to the second test area, and recovers the tested electronic components from the second test area to the second handler unit, And a recovery portion; And a transfer portion for transferring a test tray between the first supply and recovery portion and the second supply and recovery portion; Wherein the control unit moves the test tray between the first supply and recovery portion and the second supply and recovery portion via the transfer portion in the second mode or the third mode.

The first supply and recovery portion includes a first supply chamber for accommodating a test tray loaded with electronic components to be tested; A first recovery chamber for receiving a test tray on which tested electronic components are loaded; And a first transfer chamber for receiving the test tray loaded with the tested electronic components from the first test area and moving the test tray to the first recovery chamber, Device; Wherein the second supply and recovery portion comprises a second supply chamber for receiving a test tray loaded with electronic components to be tested; A second recovery chamber for receiving a test tray on which tested electronic components are loaded; And a second transfer chamber for transferring the test tray in the second supply chamber to the second test area and receiving the test tray loaded with the tested electronic components from the second test area, ; .

The first moving device may include a first moving chamber capable of carrying in or out of the test tray and moving to a position corresponding to the tester in the first test area; And a first conveyor for moving the first moving chamber; Wherein the second moving device includes a second moving chamber capable of loading or unloading a test tray and capable of moving to a position corresponding to a tester in the second test area; And a second conveyor for moving the second moving chamber; .

Wherein the transfer portion includes a rotator that rotates a test tray received from the first supply and recovery portion or the second supply and recovery portion by 180 degrees about a line perpendicular to the horizontal plane, And a horizontal mover for horizontally moving the test tray to deliver the test tray between the second supply and withdrawal portions.

According to the present invention, even when one of the first handler unit and the second handler unit is to be shut down, the test tray can be supplied to or recovered from the other side, thereby increasing the operating rate of the tester.

Particularly, according to the present invention, the first handler unit and the second handler can be sequentially checked even at a predictable periodic check, thereby improving the operation efficiency of the handling system.

1 is a conceptual plan view of a conventional handler for testing electronic components.
2 is a conceptual plan view of an electronic part handling system according to a first embodiment of the present invention.
Fig. 3 is an excerpt of an example of a supply and recovery unit applied to the handling system of Fig. 2;
Fig. 4 is a schematic view of the first transfer chamber applied to the feed and withdrawal portion of Fig. 3;
Figure 5 is a conceptual top view of the first mobile chamber of Figure 4;
6 is a schematic view of an interference eliminator provided in the first moving chamber of FIG.
FIG. 7 is a schematic view of the delivery portion applied to the feed and recovery portion of FIG. 3;
8 is a reference diagram for explaining the first operating mode of the handling system of Fig.
Fig. 9 is a reference diagram for explaining a second operation mode of the handling system of Fig. 2; Fig.
Fig. 10 is a reference diagram for explaining a third operating mode of the handling system of Fig. 2; Fig.
Fig. 11 is a reference diagram for explaining a fourth operating mode of the handling system of Fig. 2; Fig.
Fig. 12 is a reference diagram for explaining a fifth operation mode of the handling system of Fig. 2; Fig.
13 is a conceptual plan view of an electronic part handling system according to a second embodiment of the present invention.
FIG. 14 is an excerpt of an example of a supply and recovery unit applied to the handling system of FIG. 13; FIG.
Fig. 15 is a schematic view of a transfer part applied to the supply and recovery unit of Fig. 14;
16 is a reference diagram for explaining a first operation mode of the handling system of Fig.
17 is a reference diagram for explaining a second operation mode of the handling system of Fig.
Figs. 18 and 19 are reference views for explaining the fourth operation mode of the handling system of Fig.
20 is a conceptual plan view of a handling system according to a variation of the handling system of FIG.
Figure 21 is an example of a test tray that may be applied to the handling system of Figures 3 and 13.

Preferred embodiments according to the present invention will be described with reference to the accompanying drawings, wherein redundant description of the same constitution is omitted or compressed as much as possible for brevity of description.

[Description of First Embodiment]

<Schematic Configuration Explanation>

FIG. 2 is a conceptual plan view of a handling system for testing electronic components (HS1, hereinafter referred to as "handling system") according to a first embodiment of the present invention.

Referring to FIG. 2, the handling system HS1 according to the present embodiment includes a supply and recovery unit 200, a first handler unit 300, a second handler unit 400, and a control unit 500.

The supplying and collecting unit 200 supplies the test tray TT carrying the electronic components to be tested to the test region TS, TS = TS1 + TS1 '+ TS2 + TS2' (TT) from the test area (TS). Here, as in the prior art, a plurality of testers TESTER1 and TESTER2 are arranged in the front and rear directions on both left and right sides of the test region TS, and a test chamber TC is provided for temperature control of the electronic components. Of course, the test chamber TC may be omitted if it is provided for a room temperature test. Such a test region TS is divided into a first test region TS1 and a second test region TS2 and TS2 '.

The first handler unit 300 receives the test tray TT on which the tested electronic components are loaded from the supply and recovery unit 200 and unloads the electronic components from the test tray TT, (TT) to which the electronic components to be tested are loaded, to the feeding and collecting unit 200, and the test tray TT to which the electronic components to be tested are loaded send. The first handler unit 300 in this embodiment is provided adjacent to the first test area TS1 and TS1 'to the front side of the supply and recovery unit 200. [

The second handler unit 400 receives the test tray TT on which the tested electronic components are loaded from the supplying and collecting unit 200 and unloads the electronic components from the test tray TT, And loads the electronic components to be tested with the unloaded test tray (TT), and then sends the loaded test tray (TT) to the supply and recovery unit 200 . The second handler unit 400 in this embodiment is provided adjacent to the second test area TS2 and TS2 'on the rear side of the supply and recovery unit 200. [ Accordingly, the first handler unit 300 and the second handler unit 400 are opposed to each other with the supply and recovery unit 200 interposed therebetween.

The control unit 500 controls operations of the supply and recovery unit 200, the first handler unit 300, and the second handler unit 400.

Next, each of the above-described configurations will be described in more detail.

<Description of Supply and Collection Unit>

The feed and recovery section 200 includes a first feed and recovery section 210, a second feed and recovery section 220, and a delivery section 230, as in the excerpt of FIG.

The first supplying and collecting part 210 receives the test tray TT on which the electronic parts to be tested are loaded from the first handler part 300 and supplies the test tray TT to the first test areas TS1 and TS1 ' The tested electronic components are recovered from the regions TS1 and TS1 'and sent to the first handler unit 300. [ To this end, the first supply and recovery portion 210 includes a first supply chamber 211, a first collection chamber 212, and a first movement device 213.

The first supply chamber 211 receives the test tray TT on which the electronic components to be tested coming from the first handler unit 300 are loaded. A plurality of test trays TT may be accommodated in the first supply chamber 211 and a temperature environment required for a high temperature or low temperature test may be established. Since the left side wall of the first supply chamber 211 can be opened and closed, the operator can manually carry the test tray TT into the first supply chamber 211.

The first water collection chamber 212 receives the test tray TT on which the tested electronic components from the first moving device 213 are loaded. Similarly, a plurality of test trays (TT) may be accommodated in the first water collection chamber 212, and the temperature environment required for removing the thermal stimulus may be formed or blown possible. In addition, the right side wall of the first collection chamber 213 can be opened and closed, and the operator can manually take out the test tray TT from the first collection chamber 212. [

For reference, a test performed on a constant movement path, such as movement of a test tray TT in various chambers such as the first supply chamber 211 and the first collection chamber 212, and movement of a test tray TT between chambers, The movement of the tray TT is known from Korean Patent Laid-Open No. 10-2008-0082591 or a number of patent documents such as FIG. 12 attached to the specification of the prior art, so that a detailed description thereof will be omitted. When the handling system HS1 is designed for a room temperature test, the first supply chamber 211 and the first recovery chamber 212 may be omitted as in the test chamber TC, Only moving structures will be sufficient.

The first moving device 213 receives the test tray TT in the first supply chamber 211 and selectively moves the test tray TT to an empty test chamber TC in the first test area TS1, TS1 ' The test tray TT on which the tested electronic components have been loaded is received from the test areas TS1 and TS1 'and is moved to the first collection chamber 212. [ The first moving device 213 may have the same structure as the moving chamber + feeder + elevator of the prior art. That is, the first moving device 213 in this embodiment includes the first moving chamber 213a, the first conveyor 213b, and the first elevator 213c.

The first moving chamber 213 is capable of moving the test tray TT in the forward and backward directions so as to be brought in or out of correspondence with the tester TESTER1 in the first test areas TS1 and TS1 ' . This first moving chamber 213 may have a first space S1 and a second space S2, which are separated by a mutual dividing wall SW, as referred to in the prior art and Fig. In this case, for example, the first space S1 may be utilized for the high temperature test and the second space S2 may be utilized for the low temperature test. That is, the first space S1 and the second space S2 separated from each other may be selectively used under different test temperature conditions. Of course, as shown in the prior art, for example, the first space S1 is utilized to apply a thermal stimulus to the electronic component, and the second space S2 is utilized to remove the thermal stimulus from the electronic component It is possible. The first moving chamber 213 is provided with a test tray TT in the first space S1 or a second space S2 in the test chamber TC or the rear portion Doors D for opening and closing an entrance port for sending the test tray TT to the first space S2 or the first space S1 and the second space S2 are provided on the left and right wall surfaces and the rear wall surface.

Of course, inside the first moving chamber 213a, the test tray TT may be moved in the left or right direction as referred to in the prior art and the conceptual plan view of FIG. 5, or the test tray TT may be moved in the leftward direction Or mobile devices M1 and M2 for fetching from the right direction. According to this embodiment, an interference eliminator (IR) for preventing interference with the mobile devices M 1 and M 2 for the back and forth movement of the test tray TT is provided in the first movement chamber 213 a, Respectively, in the space S1 and the second space S2.

The interference eliminator IR includes a guide rail GR, a mounting plate IP and a lifting cylinder UD as shown in Fig.

The guide rail GR is elongated in the front-rear direction and guides the movement of the test tray TT moving in the back-and-forth direction, or supports the test tray TT.

The mounting plate IP is provided with a guide rail GR.

The lifting cylinder UD lifts the mounting plate IP slightly so that the guide rail GR supports the test tray TT or releases the support. When the mounting plate IP rises and the guide rail GR supports the test tray TT, the interference between the mobile devices M1 and M2 and the test tray TT is removed and the test tray TT is moved backward Or the test tray TT coming from the transfer portion 230 can be moved forward and placed on the guide rail GR. Of course, when the mounting plate IP descends and the support of the test tray TT by the guide rail GR is released, the test tray TT is moved in the left and right direction by the user equipments M1, . Since the elevating cylinder UD is provided as an elevating means for elevating and lowering the mounting plate IP, it can be considered that the elevating cylinder is replaced with the elevating motor.

For reference, it may well be considered to implement the interference eliminator to support the test tray TT with the support belt rotated by the drive motor instead of the guide rail GR for the forward and backward movement of the test tray TT . In this case, the test trays placed on the support belts can be moved in the forward and backward direction by the normal and reverse rotation of the drive motor by the normal and reverse operation of the drive motor, and corresponding structures of the same structure are required in the transfer parts 230 as well.

The first conveyor 213b moves the first moving chamber 213a in the forward and backward direction within the first test area TS1, TS1 '.

The first elevator 213c supports selective use of the first space S1 or the second space S2 by lifting the mobile chamber 213a as in the prior art.

The first moving device 213 according to the present invention may supply the test tray TT to the test chambers TC disposed on both the left and right sides of the first test areas TS1 and TS1 ' It is the same as the prior art in that the test tray TT is retrieved from the test chambers TC but the test tray TT is sent to the transfer part 230 rearward by the transfer device DA or the transfer part 230 (TT) from a test tray (TT).

The second supplying and collecting part 220 receives the test tray TT on which the electronic parts to be tested are loaded from the second handler part 400 and supplies the test tray TT to the second test areas TS2 and TS2 ' The tested electronic components are recovered from the regions TS2 and TS2 'and sent to the second handler unit 400. [ To this end, the second feed and retrieve portion 220 includes a second feed chamber 221, a second collecting chamber 222, and a second move device 223. This second feed and retrieve portion 220 is provided symmetrically with the same configuration as the first feed and retrieve portion 210. That is, the second supply chamber 221, the second recovery chamber 222, and the second transfer device 223 of the second supply and recovery section 220 are connected to the first supply chamber 210 of the first supply and recovery section 210, The first recovery chamber 211, the first recovery chamber 212, and the first moving device 213. [ Similarly, the second moving chamber 223a, the second conveyor 223b and the second elevator 223c of the second moving device 223 are connected to the first moving chamber 213a of the first moving device 213, The conveyor 213b and the first elevator 213c. Therefore, the description of the second supply and recovery section 220 is omitted.

The transfer portion 230 is provided to transfer the test tray TT between the first supply and recovery portion 210 and the second supply and recovery portion 220. That is, the test tray TT may be moved from the first feed and recovery portion 210 to the second feed and retrieve portion 220 via the delivery portion 230 and to the second feed and retrieve portion 220 To the first feeding and collecting portion 210 through the portion 230 of the first feeding and collecting portion 210. This transmission portion 230 includes support rails 231a and 231b, a foot plate 232, a transporter 233, a vertical mover 234 and a rotator 235 as in the schematic diagram of Fig.

The support rails 231a and 231b support the test tray TT and guide the movement of the test tray TT moving in the anteroposterior direction.

Supporting rails 231a and 231b are provided on the support plate 232.

The feeder 233 pushes the test tray TT pulled from the first moving chamber 213a or the second moving chamber 223a or pushes the test tray TT placed on the support rails 231a and 231b 1 moving chamber 213a or the second moving chamber 223a. This transponder 233 may be provided in the same structure as the mobile device shown in FIG. 12 attached to the specification of the prior art.

For reference, the transfer portion 230 in this embodiment does not constitute a chamber. However, when it is necessary to minimize the loss of heat or cool air during the transfer process of transferring the test tray TT between the first supply and recovery section 210 and the second supply and recovery section 220 in a high temperature or low temperature test It may be advantageously considered to constitute the transfer chamber also in the transfer portion 230. In this case, the transfer chamber may be divided into two spaces by the separation wall as in the first transfer chamber 213a, and a door for the entrance and exit of the test tray TT should be provided. Of course, the transmitter 233 must also be configured in two spaces. If the transfer chamber needs to be rotated by 180 degrees, the door may be provided only on the front and rear side walls. However, if the transfer chamber does not need to be rotated, the door must be provided on both the front and rear walls.

The vertical mover 234 can move the support plate 232 so that the support rails 231a and 231b can be positioned at a height corresponding to the first space S1 and the second space S2, .

The rotator 235 rotates the support plate 232 by 180 degrees with a line Z perpendicular to the horizontal plane of the support plate 232 as a rotation axis so that the test tray TT placed on the support rails 231a and 231b rotates 180 degrees I can do it.

When the test tray TT is placed on the support rails 231a and 231b and the rotator 235 is moved in the first movement chamber 213a by pulling the test tray TT from the first moving chamber 213a, The test tray TT is rotated by 180 degrees by rotating the support plate 232 by 180 degrees so that the pusher 233 pushes the test tray TT to the second movement chamber 223a to rotate the test tray TT TT are moved from the first moving chamber 213a of the first feeding and collecting part 210 to the second moving chamber 223a of the second feeding and collecting part 220. [ In this way, the test tray TT can be transferred between the first moving chamber 213a and the second moving chamber 223a while being rotated by 180 degrees.

&Lt; Description of First Handler Unit >

The first handler portion 300 includes a first loading shuttle 310, a first loader 320, a first unloading shuttle 330, and a first unloader 340 as illustrated in FIG.

The first loading shuttle 310 has first loading tables 311a and 311b which move in the forward and backward directions. Electronic components may be loaded on the first loading tables 311a and 311b. The first mounting tables 311a and 311b may be provided with a heater to heat the electronic components to be mounted.

A first loader 320 moves the electronic component in the customer tray (CT ₁₎ a first mounting table (311a, 311b) in the front and, the first load from the first stacking table (311a, 311b) in the rear Move the electronic component to the test tray TT in position LP1. Embodiment to the first loader 320 includes a first mounting table in the loader A and the rear moving the electronic component in the customer tray (CT ₁₎ a first mounting table (311a, 311b) at the front in accordance with (311a, And a loader B for moving the electronic component from the first loading position LP1 to the test tray TT in the first loading position LP1. Here, the first loading position LP1 is between the first loading tables 311a and 311b and the first first supplying chamber 211. [

The first unloading shuttle 330 has a second loading table 331a, 311b which moves in the forward and backward direction. Similarly, the electronic parts can be loaded on the second loading tables 331a and 331b.

The second unloader 340 moves the electronic parts loaded on the test tray TT in the unloading position UP2 to the second loading tables 331a and 331b on the rear side, then from (331a, 331b) moves while classifying the electronic components to the customer tray (CT ₂₎ as a test rating. Of course, the second unloader 340 is also connected to the unloader A for moving the electronic parts in the first unloading position UP1 to the second loading tables 331a and 331b on the rear side and the second loading table And an unloader B for moving the electronic components from the _first tray 331a and the _second tray 331b to the customer tray CT2 while classifying the electronic components according to the test grades. Here, the first unloading position UP1 is between the second loading tables 331a and 331b and the first collecting chamber 212.

Performed to thus may be provided so as to go directly to the test tray (TT) in the first loader 320 is the first loading position (LP1) from the electronic component customer tray (CT _1), If this is the case in the 1 loading shuttle 320 may be omitted. For the same reason, the second unloading shuttle 330 may also be omitted.

<Description of Second Handler Unit>

The second handler unit 400 includes a second unloading shuttle 410 having a second loading shuttle 410 having a first loading table 411a and 411b, a second loader 420 and a second loading table 431a and 431b. (430), and a second unloader (440). The second handler unit 400 is provided symmetrically with the first handler unit 300. In other words, the second loading shuttle 410, the second loader 420, the second unloading shuttle 430, and the second unloader 440 of the second handler unit 400 are connected to the first handler unit 300 The first loading shuttle 310, the first loader 320, the first unloading shuttle 330, and the first unloader 340 have the same configuration. Therefore, the description thereof will be omitted.

The handling system HS1 having the above configuration can be operated in five operation modes, and the control unit 500 selects one of the five operation modes according to the input command of the administrator, And controls each configuration.

Hereinafter, the operation modes according to the control of the controller 500 will be described.

&Lt; First Operation Mode - See Fig. 8 >

The first operating mode is selected when both the first handler unit 300 and the second handler unit 400 are operable.

The first handler unit 300 supplies the test tray TT to the empty test chamber TC in the first test zone TS1 or TS1 ' And the second handler unit 400 operates to recover the test tray TT from the test chamber TC in the second test zone TS2 and TS2 ' TC to supply the test tray TT or to withdraw the test tray TT from the test chamber TC in the second test area TS2, TS2 '.

The test tray TT passing through the first handler unit 300 in the first operation mode is in the first loading position LP1, the first supply chamber 211, the first moving chamber 213a, the first test region TS1 , The first moving chamber 213a, the first collecting chamber 212, the first unloading position UP1 and the first loading position LP1 in the first loading position LP1, Move the default path (A). Incidentally, in response to movement of the test tray (TT), a first handler of electronic components to be supplied and recovered by the unit 300, a customer tray (CT ₁₎ a first loading shuttle 310, a first loading position (LP1 in The first moving chamber 213a, the test chamber TC in the first test region TS1, TS1 ', the first moving chamber 213a, the second moving chamber 213b, , the number is moved to the first chamber 212, a first unloading position (UP1), a first unloading shuttle through the 330 customer tray (CT _2). Of course, the electronic components are tested by the tester (TSETER1) coupled toward the testing chamber (TC) when it is in the test chamber (TC), through the second unloading shuttle 330 is moved to the customer tray (CT ₂₎ When they are classified according to the test grade, they are moved.

In the first operating mode, the test tray TT passing through the second handler unit 400 is connected to the second loading position LP2, the second supply chamber 221, the second moving chamber 223a, The second moving chamber 223a, the second collecting chamber 222 and the second unloading position UP2 in the first loading position LP2 and the second loading position LP2 in the second loading position TP2, TS2, TS2 ' 2 Move the default path (B). In response to the movement of the test tray TT, the electronic components supplied and recovered by the second handler unit 400 are transferred from the customer tray CT ₁ to the second loading shuttle 410, to the second loading position LP2 The test chamber TC, the second moving chamber 223a in the second test chamber TS2, the second feed chamber 221, the second moving chamber 223a, the second test zone TS2, TS2 ' , is moved to the second recovery chamber 222, the second unloading position (UP2), a second unloading shuttle through the 430 customer tray (CT _2).

&Lt; Second operation mode - see Fig. 9 >

In the second operating mode, the first handler unit 300 is operated and the second handler unit 400 is stopped. At this time, the second handler unit 400 may be in a state of failure repair, periodic periodical inspection, replacement, and the like.

The first handler unit 300 is connected to the test tray TC in an empty state in the first test zone TS1 and the second test zone TS2 and TS2 ' TT or to recover the test tray TT from the test chamber TC in the first test zone TS1, TS1 'and the second test zone TS2, TS2' The first supply chamber 400, the second supply chamber 221, and the second recovery chamber 222 are deactivated.

In the second operating mode, the test tray TT moves the first basic path A or moves the first loading position UP1, the first supply chamber 211, the first moving chamber 213a, the transfer portion 230 The test chamber TC, the second moving chamber 223a, the transfer portion 230, the first moving chamber 213a, and the second moving chamber 223a in the second test chamber TS2, TS2 ' It is possible to move the first expansion path C extending to the first loading position LP1 via the first water collection chamber 212 and the first unloading position UP1. At this time, in the transmitting portion 230, the test tray TT is rotated 180 degrees so that the terminals of the electronic component supplied by the first handler portion 300 and the tester (not shown) in the second test region TS2, TS2 ' TESTER2 can be electrically contacted with each other.

Of course, when designing the handling system HS1, the electrical contact direction of the tester TESTER1 to be installed in the first test areas TS1 and TS1 'and the tester TESTER2 to be installed in the second test areas TS2 and TS2' It is not necessary for the test tray TT to rotate 180 degrees in the transmitting portion 230. [ In such a case, it may be considered that the test tray TT is configured to be able to move directly between the first and second moving chambers 213a and 223a, and the transmitting portion 230 is omitted.

&Lt; Third operating mode - see Fig. 10 >

In the third operating mode, the first handler unit 300 is stopped and the second handler unit 400 is operated.

The second handler unit 400 is connected to the empty test chamber TC in the first test zone TS1 and the second test zone TS2 and TS2 ' TT or to recover the test tray TT from the test chamber TC in the first test zone TS1, TS1 'and the second test zone TS2, TS2' The first supply chamber 211, and the first recovery chamber 212 are deactivated.

In the third operating mode, the test tray TT moves the second basic path B or moves the second loading position LP2, the second supply chamber 221, the second moving chamber 223a, the transfer portion 230 The test chamber TC in the first test zone TS1, TS1 ', the first transfer chamber 213a, the transfer portion 230, the second transfer chamber 223a, the first transfer chamber 213a, the first transfer chamber 213a, The second recovery chamber 222, and the second unloading position UP2 to the second loading position LP2.

<Fourth operation mode - see FIG. 11>

In the fourth operating mode, the first handler unit 300 is operated and the second handler unit 400 is stopped, while the second supply chamber 221 and the second recovery chamber 222 are operated.

The first handler unit 300 supplies the test tray TT to the empty test chamber TC in the first test area TS1 or TS1 ' To recover the test tray TT from the test chamber TC in the test chamber TT. Therefore, the test tray TT passing through the first handler unit 300 moves along the first basic path A.

When the test tray TT loaded with the electronic components to be tested by manual operation by the operator is brought into the second supply chamber 221 (see arrow a), the test tray TT is moved to the second supply chamber 221, , The second shortening path F (F) leading to the test chamber (TC), the second moving chamber 223a, and the second collecting chamber 222 in the second moving chamber 223a, the second test region TS2, TS2 ' ). Of course, the test tray TT in the second recovery chamber 222 is manually removed (see arrow b) by the operator. For reference, the test tray TT taken out of the second water collection chamber 222 is provided as a separate sorting device (not shown) so that the tested electronic components can be classified according to the test grade.

<Fifth operation mode - see FIG. 12>

In the fifth operating mode, the first handler unit 300 is stopped and the second handler unit 400 is operated. At this time, the first supply chamber 211 and the first recovery chamber 212 are operated.

In the fifth operation mode, the second handler unit 400 supplies the test tray TT to the empty test chamber TC in the second test zone TS2, TS2 'or the second test zone TTS2 To recover the test tray TT from the test chamber TC in the test chamber TT. Therefore, the test tray TT passing through the second handler unit 400 moves on the second basic path B.

When the test tray TT loaded with the electronic parts to be manually tested by the operator is brought into the first supply chamber 211 (see arrow c), the test tray TT is moved in the first supply chamber 211 The first shortening path E leading to the first moving chamber 213a, the test chamber TC in the first test zone TS1, TS1 ', the first moving chamber 213a, the first collecting chamber 212, . Likewise, the test tray TT in the first recovery chamber 212 is removed manually (see arrow d) by the operator and provided as a separate sorting device so that the tested electronic components can be classified according to the test grade .

&Lt; Description of Second Embodiment >

<Schematic Configuration Explanation>

13 is a conceptual plan view of a handling system HS2 according to a second embodiment of the present invention.

Referring to FIG. 13, the handling system HS2 according to the present embodiment includes a supply and recovery unit 600, a first handler unit 700, a second handler unit 800, and a control unit 900. The roles of the supply and recovery unit 600, the first handler unit 700, the second handler unit 800 and the control unit 900 of the handling system HS2 according to the present embodiment are the same as those of the handling system according to the first embodiment. (HS1), but there is a difference in the arrangement structure and operation of each major configuration. Therefore, the following description will focus on the differences from the first embodiment.

The first handler unit 700 and the second handler unit 800 in this embodiment are arranged side by side on the front side of the supply and recovery unit 600.

The supplying and collecting unit 600 supplies the test tray TT carrying the electronic components to be tested to the test area TS, TS = TS1 + TS1 '+ TS2 + TS2' (TT) from the test area (TS). The supply and recovery unit 200 in the first embodiment has a long form in the front-rear direction, but the supply and recovery unit 600 in this embodiment has a form of approximately "II".

The first handler unit 700 receives the test tray TT from the supply and recovery unit 600, unloads the tested electronic components, loads the electronic components to be tested, and sends the unloaded electronic components to the supply and recovery unit 600 .

The second handler unit 800 receives the test tray TT from the supply and recovery unit 600, unloads the tested electronic components, loads the electronic components to be tested, and sends the unloaded electronic components to the supply and recovery unit 600 .

The control unit 900 controls operations of the supply and recovery unit 600, the first handler unit 700, and the second handler unit 800.

Next, each of the above-described configurations will be described in more detail.

<Description of Supply and Collection Unit>

The feed and recovery portion 600 includes a first feed and recovery portion 610, a second feed and recovery portion 620, and a delivery portion 630 as in the excerpt of FIG.

The first feeding and collecting portion 610 includes a first moving device 613 including a first feeding chamber 611, a first collecting chamber 612 and a first moving chamber 613a, The roles and configurations are the same as those in the first supply chamber 211, the first recovery chamber 212, and the first movement device 213 in the first embodiment.

The second supply and recovery portion 620 includes a second transfer device 623 including a second supply chamber 621, a second recovery chamber 622 and a second transfer chamber 623a, The roles and configurations are the same as those of the second supply chamber 221, the second recovery chamber 222 and the second moving device 223 of the first embodiment. Of course, as in the first embodiment, the first moving chamber 613a and the second moving chamber 623a are separated from each other by the separating wall to form two spaces S1 and S2, The sign is not indicated).

Thus, the first supply / recovery portion 610 and the second supply / recovery portion 620 are arranged side by side in the left-right direction, and their basic roles and configurations are the same.

The transfer portion 630 is provided to transfer the test tray TT between the first supply and recovery portion 610 and the second supply and recovery portion 620. The transfer portion 630 in the present embodiment includes support rails 631a and 631b, transfer chamber 632, translators 633, vertical mover 634, and horizontal And a mobile device 635.

The support rails 631a and 631b support the test tray TT and guide the movement of the test tray TT moving in the anteroposterior direction.

The transfer chamber 632 receives the test tray TT and is provided with a door D for allowing the test tray TT to enter and exit the front side wall. The transfer chamber 632 can be moved in the horizontal direction.

The transfer unit 633 transfers the test tray TT from the first transfer chamber 613a or the second transfer chamber 623a or pushes the test tray TT placed on the support rails 631a and 631b 1 moving chamber 613a or the second moving chamber 623a.

The vertical mover 634 is configured to move the support rails 631a and 631b to positions corresponding to the two spaces S1 and S2 of the movable chambers 613a and 623a, Thereby raising and lowering the chamber 632.

The horizontal shifter 635 causes the transfer chamber 632 to be located at the rear of the first transfer chamber 613a or at the rear of the second transfer chamber 623a by moving the transfer chamber 632 in the lateral direction .

The transfer chamber 632 and the first moving device 613 move in the horizontal direction perpendicular to the forward and backward directions and the first moving chamber 613a moves in the forward and backward directions But may have substantially the same structure as the first moving device 613 in that it accepts the test tray TT or exports the received test tray TT. Therefore, when the temperature maintenance of the electronic component to be moved is important, it is preferable that the transfer chamber 630 is divided into two upper and lower spaces so that the support rails 631a and 631b and the transfer unit 633 are provided in the respective spaces. . If the transfer chamber 630 is separately provided in the upper and lower spaces, the upper vertical mover 634 may be omitted.

&Lt; Description of Hand Handler >

13, the first handler unit 700 includes a first loading shuttle 710, a first loader 720, a first unloading shuttle 730, and a first unloader 740, The second handler portion 800 includes a second loading shuttle 810, a second loader 820, a second unloading shuttle 830 and a second unloader 840.

The first loading shuttle 710, the first loader 720, the first unloading shuttle 730 and the first unloader 740 of the first handler unit 700 are connected to the first loading shuttle 710 of the first embodiment, The first loader 320 and the first unloading shuttle 330 and the first unloader 340 are identical in basic role and configuration to the second loading shuttle The second unloading shuttle 830 and the second unloader 840 are connected to the second loading shuttle 410 in the first embodiment, the second loader 420, the second unloading shuttle 830, The basic roles and configurations of the unloading shuttle 430 and the second unloader 440 are the same.

The handling system HS2 having the above configuration can be operated in four operation modes, and the controller 900 selects one of the four operation modes according to an input command of the administrator, And controls each configuration.

Each operation mode will be described below.

&Lt; First operation mode - see Fig. 16 >

The first operating mode is selected when both the first handler unit 700 and the second handler unit 800 are operable.

The first handler unit 700 supplies the test tray TT to the empty test chamber TC in the first test zone TS1 or TS1 ' , TS1 ') from the test chamber (TC). Therefore, the test tray TT passing through the first handler unit 700 moves to the first basic path A '.

The second handler unit 800 supplies the test tray TT to the empty test chamber TC in the second test area TS2 or TS2 ' And operates to recover the test tray TT from the test chamber TC. Similarly, the test tray TT passing through the second handler unit 800 moves on the second basic path B '.

As such, in the first operating mode, the transmitting portion 630 is not operable as in the first embodiment.

<Second operation mode - see FIG. 17>

In the second operating mode, the first handler unit 700 is operated and the second handler unit 800 is stopped. Therefore, all the test trays TT pass through the first handler unit 700.

That is, in the second operating mode, the test tray TT may move to the first base path A 'or to the first expansion path C' through the delivery portion 630. [

&Lt; Third operation mode >

In the third mode of operation, the first handler unit 700 is stopped and the second handler unit 800 is operated so that all the test trays TT pass through the second handler unit 800. In this third mode of operation, the test tray TT may move to the second base path B 'or to the second extension path through the delivery portion 630. Here, the second extension path is a path that is line-symmetric with respect to the first extension path and the forward-backward straight line.

<Fourth operation mode - see FIGS. 18 and 19>

In the fourth operating mode, the first handler unit 700 is stopped and the second handler unit 800 is operated. At this time, the first supply chamber 611 is operated. In the fourth operation mode, the operator can manually supply the test tray TT to the first supply chamber 611 or withdraw the test tray TT from the first supply chamber 611. Of course, it is preferable that the amount of water recovered from the first supply chamber 611 is equal to the amount of water supplied manually.

In the fourth operation mode, the test tray TT passing through the second handler unit 800 may move both the second basic path B 'and the second extension path.

Also, the test tray TT manually supplied in the fourth operation mode can move the first deformation path T1 as shown in Fig. 18, or move the second deformation path T2 as shown in Fig.

Of course, the test tray TT which has passed through the first handler unit 800 and then moved to the supply and recovery unit can also be recovered through the first supply chamber 611, The test tray TT loaded through the first handler unit 611 may also be controlled to enter the first handler unit 800.

&Lt; Modification of Second Embodiment >

In the handling system HS2 according to the second embodiment of Fig. 13, the both handler portions 700, 800 are adjacent to each other. However, according to the modified example in which the interval between the supply and recovery parts 610 'and 620' is wide as shown in FIG. 20 so that the supply and recovery of the test tray TT by manual operation is possible, 621 'and the recovery chambers 612', 622 'on both sides, even if the operation of either one of the both handler units 700', 800 'is stopped, ) Can be used.

[Other References]

1. In the above embodiment, a horizontal contact structure (an underhead docking structure) in which the test tray is horizontally aligned with the lower tester is described as an example. However, when the test tray is vertically erected, The present invention can be applied to a vertical contact structure (side docking structure).

2. Test tray

Fig. 21 shows an example of a test tray TT.

The test tray TT is provided with a plurality of sockets SK and each of the socket blocks SB having a plurality of sockets SK can flow to one frame P As shown in FIG. In this case, the fine flows of the socket blocks SB allow the sockets (SKs) to be suitably electrically contacted to the tester even in thermal expansion or thermal contraction which occurs during the high temperature or low temperature test.

Although four socket blocks SB having a relatively large area are provided in Fig. 13, it is also possible to provide more than four socket blocks SB in some cases.

3. Operation Mode Related

It is possible to consider a sixth operation mode in which the test tray TT passing through the first handler unit 300 can move to the first extension path C in addition to the above fourth operation mode. In this case, the operation rate of the test in the second test areas TS2 and TS2 'can be prevented from being lowered by supplying and recovering the test tray TT by manual operation of the operator. A seventh mode of operation in which the test tray TT passing through the second handler unit 400 can move to the second extension path D in addition to the fifth operation mode can be considered.

If the operation of either one of the first handler unit 300 and the second handler unit 400 should be stopped and the test time is long, it may suffice to control the fourth operation mode or the fifth operation mode.

However, if the operation of either one of the first handler unit 300 and the second handler unit 400 should be stopped and the test time is short, the time required for manually feeding and collecting the test tray TT The utilization rate is lowered. Therefore, in this case, the utilization rate of the tester is improved if it is controlled to the sixth operation mode or the seventh operation mode.

4. Operation in different test modes

end. The electronic component supplied and recovered by the first handler unit 300 proceeds to the high temperature test and the electronic component supplied and recovered to the second handler unit 400 can be implemented to proceed with the low temperature test.

I. Alternatively, the test chamber TC on the left side of FIG. 2 may be operated with a high temperature test, and the test chamber TC on the right side may be operated with a low temperature test.

 As a result, a different handling mode (for example, a high temperature test mode and a low temperature test mode) can be performed in one handling system (HS), thereby reducing the trouble of the administrator. This is possible because the test tray TT can move between the first test area TS1, TS1 'and the second test area TS2, TS2'.

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the scope of the invention is to be construed as being limited only by the following claims and their equivalents.

200: Supply and recovery unit
210: first supply and recovery section
211: first supply chamber 212: first recovery chamber
213: first mobile device
213a: first moving chamber
213b: first feeder
220: second supply and recovery portion
221: second supply chamber 222: second collection chamber
223: second mobile device
223a: second moving chamber
223b: second conveying machine
230: transmission portion
300: first handler unit
400: second handler unit
500:

Claims (8)

A supply and recovery unit for supplying a test tray loaded with electronic components to be tested to a test region and for withdrawing a test tray loaded with tested electronic components from the test region; Here, the test region is divided into a first test region and a second test region, in which the testers for testing electronic components are located
And a control unit for controlling the electronic devices to be connected to the first and second test areas, wherein the electronic parts are unloaded from the test tray after receiving the test tray on which the tested electronic parts are loaded from the supplying and collecting unit, A first handler unit for loading the electronic parts to be tested with the unloaded test tray and then sending the test tray loaded with the electronic parts to be tested to the supply and recovery unit;
And a second test area that is provided adjacent to the second test area, receives the test tray loaded with the tested electronic parts from the supply and collection part, unloads the electronic parts from the test tray, classifies the electronic parts according to the test result, A second handler unit for loading electronic components to be tested into an unloaded test tray and then sending a test tray loaded with electronic components to be tested to the supply and recovery unit; And
A control unit for controlling operations of the supply and recovery unit, the first handler unit, and the second handler unit; Containing
Handling system for testing electronic components. The method according to claim 1,
The first handler unit and the second handler unit are disposed to face each other with the supply and recovery unit interposed therebetween
Handling system for testing electronic components. The method according to claim 1,
Wherein the first handler portion and the second handler portion are arranged side by side on one side of the feed and return portion
Handling system for testing electronic components. The method according to claim 2 or 3,
The control unit controls the supply and recovery unit, the first handler unit, and the second handler unit to operate in any one of the operation modes including the first operation mode, the second operation mode and the third operation mode In addition,
In the first operating mode, the first handler unit and the second handler unit operate together, and the first handler unit operates to supply the test tray to the first test area or to withdraw the test tray from the first test area And the second handler part is operative to supply a test tray to the second test area or to retrieve a test tray from the second test area,
In the second operation mode, the first handler unit is operated and the second handler unit is stopped, whereby the first handler unit supplies the test tray to the first test area and the second test area, Operating to recover the test tray from the second test area,
In the third operation mode, the first handler unit is stopped and the second handler unit is operated, so that the second handler unit supplies the test tray to the first test area and the second test area, And to recover the test tray from the second test area
Handling system for testing electronic components. 5. The method of claim 4,
The supply /
A first supply unit that receives a test tray on which electronic parts to be tested are loaded from the first handler unit and supplies the test tray to the first test area, collects tested electronic components from the first test area, And a recovery portion;
A second supply unit that receives a test tray on which electronic components to be tested are loaded from the second handler unit, supplies the test tray to the second test area, and recovers the tested electronic components from the second test area to the second handler unit, And a recovery portion; And
A transfer portion for transferring a test tray between the first supply and recovery portion and the second supply and recovery portion; / RTI &gt;
Wherein the control unit moves the test tray between the first supply and recovery portion and the second supply and recovery portion via the transfer portion in the second mode or the third mode
Handling system for testing electronic components. 6. The method of claim 5,
Wherein the first supply and recovery portion comprises:
A first supply chamber for accommodating a test tray on which electronic parts to be tested are loaded;
A first recovery chamber for accommodating a test tray on which tested electronic components are loaded; And
A first transfer chamber for receiving a test tray loaded with tested electronic components from the first test area and moving the test tray to the first recovery chamber, ; Lt; / RTI &gt;
The second supply and recovery portion may include a second supply /
A second supply chamber for accommodating a test tray on which electronic parts to be tested are loaded;
A second recovery chamber for receiving a test tray on which tested electronic components are loaded; And
A second moving device that receives a test tray in the second supply chamber to move to the second test area, receives a test tray loaded with tested electronic components from the second test area, and moves the test tray to the second collection chamber; Containing
Handling system for testing electronic components. The method according to claim 6,
Wherein the first moving device comprises:
A first moving chamber capable of carrying in or out of a test tray and capable of moving to a position corresponding to a tester in a first test area; And
A first conveyor for moving the first moving chamber; Lt; / RTI &gt;
The second moving device includes:
A second moving chamber capable of carrying in or out of the test tray and capable of moving to a position corresponding to the tester in the second test area; And
A second conveyor for moving the second moving chamber; Containing
Handling system for testing electronic components. 6. The method of claim 5,
Wherein the transfer portion includes a rotator that rotates a test tray received from the first supply and recovery portion or the second supply and recovery portion by 180 degrees about a line perpendicular to the horizontal plane, And a horizontal mover for horizontally moving the test tray to deliver the test tray between the second supply and withdrawal portions
Handling system for testing electronic components.

Images