KR102252639B1 - Electric device unloading equipment - Google Patents

Abstract

The present invention relates to an electronic component unloading equipment.
The electronic component unloading device according to the present invention includes: an electronic component rotating device for rotating an electronic component in a vertical state in a horizontal state; A first picking device for unloading the electronic component vertically loaded in the test tray in the unloading position from the test tray and then supplying the vertical electronic component to the electronic component rotating device; And a second picking device for moving and loading the electronic component rotated in a horizontal state by the electronic component rotating device to an underfill jig at a loading position. Includes.
According to the present invention, an electronic component in a vertical state that has undergone the first test process after production of the electronic component is unloaded from the test tray and loaded in the underfill jig in a horizontal state, so that it can quickly enter the subsequent process, thereby improving productivity. .

Description

Electronic component unloading equipment {ELECTRIC DEVICE UNLOADING EQUIPMENT}

The present invention relates to a technology for unloading an electronic component loaded on a test tray with an underfill jig.

Electronic components such as SSDs (Solid State Drives) are produced and then loaded onto processing trays. And electronic components loaded in the process tray are moved and loaded into the test tray for testing. The electronic component is electrically connected to the tester while being loaded on the test tray, thereby performing a first test process for the electronic component.

After the electronic component determined to be good in the first test process is completed into a shipment product through a casing process and a labeling process, a second test process is performed. After the second test process, according to the test result, electronic components are classified into good products and defective products, and only good products are shipped.

In the past, productivity was low because a series of processes as described above except for the test process were performed by hand. Therefore, the applicant of the present invention, prior to the present invention, labeling equipment capable of performing a casing process and labeling process for electronic components (Korean Application No. 10-2014-0041140, hereinafter referred to as'prior invention 1'), labeling Test equipment for performing the second test process on completed electronic parts (Korean Application No. 10-2014-0091798, hereinafter referred to as'Prior Invention 2'), classifying electronic parts for which the second test has been completed according to test results. An electronic component sorting device (Korean Application No. 10-2014-0154576, hereinafter referred to as'Prior Invention 2') has been proposed.

Prior Invention 1 is a technology related to equipment for performing casing work and labeling work on electronic parts that are determined to be good products after a first test process.

Prior Invention 2 is a technology related to equipment for performing a second test process for electronic components on which casing work and labeling work have been completed.

Prior invention 3 is a technology for classifying electronic components according to test results after the second test process.

In addition, the applicant of the present invention is to form a system with the equipment according to the prior inventions 1 to 3 above, and to load electronic components loaded on the process tray into the test tray to perform the first test process. Equipment (Korean Application No. 10-2014-01909640, hereinafter referred to as'Prior Invention 4') has been proposed.

The present invention relates to a process of unloading an electronic component from a test tray to an underfill jig after a first test is performed by a tester after an electronic component is loaded in a test tray by the electronic component loading device according to the prior invention 4 above.

For reference, the electronic components loaded on the underfill jig while being unloaded from the test tray by the equipment according to the present invention are provided with the equipment according to Prior Invention 1 above, so that casing and labeling operations are performed. In addition, the underfill jig referred to in the present specification is referred to as a tray with a symbol'T' in Prior Invention 1.

An object of the present invention is to provide a novel equipment for unloading an electronic component loaded in a test tray from a test tray after a first test process is performed.

The electronic component unloading device according to the present invention as described above includes: an electronic component rotating device for rotating an electronic component in a vertical state in a horizontal state; A first picking device for unloading the electronic component vertically loaded in the test tray in the unloading position from the test tray and then supplying the vertical electronic component to the electronic component rotating device; And a second picking device for moving and loading the electronic component rotated in a horizontal state by the electronic component rotating device to an underfill jig at a loading position. Includes.

The electronic component unloading device includes a tray transfer device for transferring a test tray from a standby position to the unloading position or from the unloading position to the standby position; It may further include.

The electronic component unloading device includes: a tray moving device for moving a test tray in a supply/demand position to the standby position; It may further include.

The electronic component unloading device includes: a tray transport device for transporting the test tray in the standby position to a tray carrying position; It may further include.

The electronic component unloading device includes a first type of tray transfer device for transferring a first type of test tray from a standby position to the unloading position or from the unloading position to the standby position; And a second type of tray for transferring a second type of test tray having a structure different from the first type of test tray from the standby position to the unloading position or from the unloading position to the standby position. Conveying device; It may further include.

The electronic component unloading device includes: a tray support device for supporting a test tray in an unloading position; It may further include.

The tray support device includes: a supporter for supporting a first test tray of a first type; And a pair of support rails supporting a second type of test tray having a structure different from that of the first test tray. It may include.

The electronic component unloading device includes: the tray transport device for transporting the test tray in a first standby position to a second standby position; And a tray transfer device for transferring the test tray in the second standby position to the unloading position. It may further include.

The electronic component unloading device includes an upper plate detachment device for detaching the upper plate of the underfill jig from the lower plate; It may further include.

An opening groove is formed in the lower plate, and the upper plate detaching device grips the upper plate through the opening groove.

The electronic component unloading device includes: a first jig moving device for positioning the lower plate from which the upper plate has been removed by the upper plate detaching device at a first moving end position; A lower plate transfer device for transferring the lower plate at the first moving end position to the loading position; And a second jig moving device for positioning the underfill jig to which the upper plate is coupled by the upper plate detaching device to a second moving end position after the electronic component is loaded at the loading position. It may further include.

The electronic component unloading device includes: a jig transporting device for transporting an empty underfill jig in a supply position to a moving start position; The first jig moving device moves the underfill jig at the moving start position to the upper plate removal position where the upper plate is removed by the upper plate detachment device, and then moves the lower plate from which the upper plate is removed. 1 It can be implemented to move to the moving end position.

The electronic component unloading device includes: a jig reversing device for rotating an underfill jig in a reversing position 180 degrees with a horizontal axis as a rotation axis; And a jig transport device for transporting the underfill jig in the second movement end position to the reverse position. It may further include.

The first picking device has a release pin for releasing a holding state of a holding device that is provided in the test tray and holds the loaded electronic component.

The first picking device may further include a separation preventing member for preventing separation of an electronic component whose holding state is released by an action of the release pin.

According to the present invention, there are the following effects.

First, after the first test process is carried out, it is used to supply electronic parts to the casing and labeling equipment proposed in the first prior invention by unloading the vertical electronic parts loaded in the test tray through an automated flow. Productivity can be improved by loading the underfill jig horizontally.

Second, since the unloading operation can be performed by accommodating all different types of test trays, there is no need to provide unloading equipment for each type of test tray, thereby reducing investment cost.

Third, it is possible to reduce the hassle by inverting the electronic components loaded in the underfill jig up and down as necessary, and improve productivity by maintaining an automated flow in the entire system.

1 is a schematic perspective view of a first test tray applied to an electronic component unloading device according to an embodiment of the present invention.
2 is a schematic perspective view of a second test tray applied to an electronic component unloading device according to an embodiment of the present invention.
3 is a schematic perspective view of a loading frame used to supply the second test tray of FIG. 2 to the electronic component unloading equipment according to an embodiment of the present invention.
4 is a schematic perspective view of an underfill jig applied to an electronic component unloading device according to an embodiment of the present invention.
5 is a conceptual plan view of an electronic component unloading device according to an embodiment of the present invention.
6 and 7 are reference diagrams for explaining a movement flow of an electronic component performed in the electronic component unloading device of FIG. 5.
FIG. 8 is a reference diagram for explaining a movement flow of a test tray having a first form in the electronic component unloading device of FIG. 5.
FIG. 9 is a reference diagram for explaining a movement flow of a test tray having a second form in the electronic component unloading device of FIG. 5.
FIG. 10 is a reference diagram for explaining a movement flow of an underfill jig performed in the electronic component unloading device of FIG. 5.
11 is a schematic perspective view of a first tray moving device applied to the electronic component unloading device of FIG. 5.
12 to 14 are schematic perspective views of a second tray mover constituting the first tray mover of FIG. 11.
15 is a schematic perspective view of a first tray transfer device applied to the electronic component unloading device of FIG. 5.
16 is a schematic perspective view of a third tray transfer device applied to the electronic component unloading device of FIG. 5.
17 and 18 are schematic perspective views of a second tray support device applied to the electronic component unloading device of FIG. 5.
Fig. 19 is a schematic perspective view of a first supporter configured in the second tray support device of Fig. 17;
FIG. 20 is a schematic perspective view of a first electronic component rotating apparatus applied to the electronic component unloading device of FIG. 5.
21 and 22 are operational state diagrams for explaining the operation of the first electronic component rotating apparatus of FIG. 20.
23 is a schematic perspective view of a first picking device applied to the electronic component unloading device of FIG. 5.
FIG. 24 is a schematic perspective view of a first tray carrying device applied to the electronic component unloading device of FIG. 5.
25 is a schematic perspective view of a second picking device applied to the electronic component unloading device of FIG. 5.
FIG. 26 is a schematic perspective view of a top plate removal device applied to the electronic component unloading device of FIG. 5.
FIG. 27 is a schematic perspective view of a jig inversion device applied to the electronic component unloading device of FIG. 5.
28 is a partial exploded view of the jig inversion device of FIG. 27;
29 to 32 are operational state diagrams showing the front of the jig reversing device in order to explain the operation of the jig reversing device of FIG. 28;
33 is a schematic perspective view of a jig transfer device applied to the electronic component unloading device of FIG. 5.

Hereinafter, preferred embodiments of the present invention as described above will be described with reference to the accompanying drawings, but redundant descriptions will be omitted or compressed as far as possible for the sake of brevity.

Before describing the electronic component unloading equipment (EDUE) according to the present invention, test trays and underfill jigs used in the electronic component unloading equipment (EDUE) will be described.

<Description of the first test tray>

As shown in FIG. 1, the electronic component ED for which the first test has been completed is loaded in _{the first test tray TT 1.} Electronic components (ED, for example,'SSD') are _{loaded in the first test tray (TT 1} ) and the first test is performed, so the first test tray (TT ₁ ) has a contact module (CM). do. The contact module CM has an insertion groove IS into which an electronic component ED in a vertical state can be inserted and a connection terminal (not shown because it is configured at the lower portion). Here, the electronic component ED inserted in the insertion groove IS may be in electrical contact with the connection terminals, and the connection terminals may be in electrical contact with the tester. Therefore, the electronic component (ED) and the tester are electrically connected through the connection terminal to perform the first test. In addition, a holding device for holding the electronic component ED inserted in the insertion groove IS is provided in the contact module CM.

For reference, the first test tray (TT ₁ ) has an identification means (IDC1) for identifying itself.

<Description of the second test tray>

As shown in FIG. 2, the electronic component ED for which the first test has been completed is loaded in _{the second test tray TT 2.} This second test tray (TT ₂ ) includes loading modules (LM) for loading the electronic component (ED) in a vertical state and a circuit board (CB) on which the loading modules (LM) are installed. The electronic component (ED) vertically loaded on the loading module (LM) of the second test tray (TT ₂ ) is electrically connected to the connection part (CP) of the circuit board (CB) through the circuit provided on the circuit board (CB). It is connected by And the connection part (CP) is electrically connected to the tester. Therefore, the electronic component (ED) loaded in the loading module (LM) is electrically connected to the tester, so that the first test is performed.

Likewise, the loading module LM is provided with a holding device for holding the loaded electronic component ED.

The second test tray (TT ₂ ) also has an identification means (IDC2) for identifying itself.

On the other hand, in order to supply the second test tray (TT ₂ ) to the electronic component unloading equipment (EDUE) according to the present embodiment, a tray loading frame (TLF) as shown in FIG. 3 is used. A plurality of second test trays TT ₂ in a horizontal state are stacked in the vertical direction in the tray loading frame TLF. The tray loading frame (TLF) is provided with a reinforcing rib (S) for maintaining the rigidity and a rail (R) for guiding and supporting the movement of _{the second test tray (TT 2) in the front and rear directions.}

For reference, the reason why the structures of the first test tray (TT ₁ ) and the second test tray (TT ₂ ) are different is that the electrical connection structure is different according to the type of tester. The electronic component unloading equipment (EDUE) according to the present embodiment is configured such that a first test tray (TT ₁ ) and a second test tray (TT ₂ ) can be arbitrarily applied. In the following, in order to prevent confusion, the first test tray (TT ₁ ) is abbreviated as a test tray (TT ₁ ), and the second test tray (TT _{2 ) is referred to as a test board (TT 2} ) to distinguish it from the first test tray. Called.

<Explanation of the underfill jig>

As shown in FIG. 4, _{an electronic component unloaded from a test tray TT 1} or a test board TT ₂ may be loaded in a horizontal state in an under fill jig (UJ). This underfill jig (UJ) is composed of an upper plate (JT) and a lower plate (JB). The electronic components ED are mounted on the lower plate JB in a horizontal state, and the upper plate JT is detachably coupled to the lower plate JB. Therefore, in order to load the electronic component ED on the underfill jig UJ, the upper plate JT must be separated from the lower plate JB. To this end, four opening grooves OS are formed in the lower plate JB. Through these four opening grooves OS, the gripping member 2711 of the upper plate detaching device 2700 to be described later can grip and support only the upper plate JT (see FIG. 26). And for history management, the lower panel (JB) is provided with an identification means (IDC3) such as a barcode, and the upper panel (JP) has an exposure groove (ES) for exposing the identification means (IDC3) to a position corresponding to the identification means (IDC3). ) Is formed. In addition, an alignment hole (UAH) is formed in the upper plate (JP) and an alignment pin (UAP) is provided in the lower plate (JB), so that proper coupling between the upper plate (JP) and the lower plate (JB) is induced and the connection state is maintained. Plan. Of course, the number or position of the opening grooves OS or the position and number of the alignment pins UAP and the alignment holes UAH may be appropriately selected.

Further, it is preferable that the lower plate JB is provided with a magnet M, and the upper plate JT is provided with a magnetic material, so that the bonding force between the lower plate JB and the upper plate JT can be maintained.

For reference, it is desirable to supply the underfill jig (UJ) to the electronic component unloading equipment in a state where a plurality of underfill jigs (UJ) are also loaded on the jig loading frame.

<Overview of the composition of electronic parts unloading equipment>

5 is a conceptual plan view of an electronic component unloading equipment (EDUE) according to an embodiment of the present invention.

Electronic component unloading equipment (EDUE) includes a first tray transfer device 1100, a second tray transfer device 1200, a first tray transfer device 1300, a second tray transfer device 1400, and a third tray transfer device. 1500, a first tray support device 1600, a second tray support device 1700, a first electronic component rotating device 1800, a second electronic component rotating device 1900, a first picking device 2100, Tray transport device 2200, tray take-out device 2300, second picking device 2400, first jig moving device 2500, second jig moving device 2600, upper plate detaching device 2700, lower plate transporting device (2800), a jig elevating device 2900, a jig transport device 3100, a jig reversing device 3200, a jig transfer device 3300, a jig carrying device 3400, and a control device 3500.

The first tray moving device 1100 moves _{the test board (TT 2} ) in the state loaded on the test tray (TT ₁ ) or loading frame (TLF) _{supplied to the first supply position (SDP 1} ) to the first standby position ( Move to WP _{1 ).} In addition, the first tray moving device 1100 moves the empty test board TT _{2 in the first standby position WP 1} to the first supply and demand position SDP ₁ .

A second tray movement device 1200, a second supply position (SDP ₂₎ a test tray (TT ₁₎ and a test board (TT ₂₎ in the stacked state in the loading frame (TLF) a second stand-by position supplied to the ( Move to WP _{2 ).} Likewise, the second tray moving device 1200 moves _{the empty test board TT 2} in the loaded state of the loading frame TLF in _{the second waiting position WP 2} to the second receiving position SDP ₂ .

The first tray transfer device 1300 transfers the test board (TT ₂ ) in the first standby position (WP ₁ ) to the first unloading position (UP ₁ ) or the first unloading position (UP ₁ ). Transfer the empty test board (TT ₂ ) to the first standby position (WP _{1 ).}

The second tray transfer device 1400 transfers the test board TT _{2 in the second standby position WP 2} to the second unloading position UP ₂ . In addition, the second tray transfer device 1400 also transfers the test board TT _{2 in the second unloading position UP 2} to the second standby position WP ₂ .

The third tray transfer device 1500 transfers the test tray TT _{1 in the second standby position WP 2} to the second unloading position UP ₂ . Of course, the third tray transfer device 1400 also transfers the test tray TT _{1 in the second unloading position UP 2} to the second standby position WP ₂ .

The first tray support device 1600 supports the test board TT _{2 in the first unloading position UP 1} .

The second tray support device 1700 supports a test tray (TT ₁ ) or a test board (TT ₂ ) in _{a second unloading position (UP 2 ).}

The first electronic component rotating device 1800 and the second electronic component rotating device 1900 are _{unloaded from the test tray TT 1} or the test board TT ₂ by the first picking device 2100 and are in a vertical state. The loaded electronic component (ED) is rotated in a horizontal state.

The first picking device 2100 unloads the _{electronic component ED from the test tray TT 1} or the test board TT ₂ , and then transfers the vertical electronic component ED to the first electronic component rotating device 1800. ) Or the second electronic component rotating device (1900). In addition, the first picking device 2100 is a position to remove the electronic component (ED) determined to be defective in the first test process among the electronic components (ED) unloaded from the _{test tray (TT 1} ) or the test board (TT _{2 ).} Load it in the removal tray (RT) in (RP).

Tray transport device 2200 includes a first stand-by position of electronic components (ED) is the stack of test trays (TT _1), and carried to the second waiting position (WP _2), a second stand-by position in the (WP ₁₎ (WP ₂₎ an empty test tray (TT ₁₎ in the tray is carried to the out position (TCP).

The tray take-out device 2300 carries out the test tray (TT ₁ ) in the tray take-out position (TCP) to an external equipment or a loading device. _{Of course, depending on the implementation, the tray carrying device 2300 places the test tray (TT 1} ) supplied from the outside with the electronic component (ED) loaded at the tray carrying position (TCP), and the tray carrying device 2200 ) May be implemented to move the _{test tray (TT 1} ) in the tray take-out position (TCP) to the first standby position (WP ₁ ) or the second standby position (WP _{2 ).}

The second picking device 2400 grasps the electronic component ED rotated in a horizontal state by the first electronic component rotating device 1800 or the second electronic component rotating device 1900 and is positioned at the loading position LP. Load it on the lower plate (JB) of the underfill jig (UJ).

The first jig moving device 2500 moves the underfill jig (UJ) supplied to the moving start position (MSP) by the jig transport device 3100 to the top plate removal position (TTP), and moves the top plate from the top plate removal position (TTP). (JT) moves the removed lower plate (JB) to the first movement end position (MEP ₁ ).

The second jig moving device 2600 moves the lower plate (JB) at the loading position (LP) to the upper plate coupling position (TJP), and the underfill jig (UJ) in which the upper plate (JT) is coupled at the upper plate coupling position (TJP). To the second movement end position (MEP ₂ ).

The upper plate detachment device 2700 removes the upper plate JT from the underfill jig UJ at the upper plate removal position TTP, and then connects the upper plate JT to the lower plate JB at the upper plate attachment position TJP. .

The lower plate transfer device 2800 moves _{the lower plate JB at the first moving end position MEP 1} to the rear loading position LP.

The jig elevating device 2900 sequentially raises the underfill jig (UJ) supplied to the jig supply position (JSP), so that the underfill jig (UJ) located at the top of the jig supply position (JSP) ) To be elevated.

The jig transportation device 3100 transports the empty underfill jig (UJ) at the jig supply position (JSP) to the transfer start position (MSP). In addition, the jig transportation device 3100 moves the underfill jig UJ filled with the electronic component ED _{in the second movement end position MEP 2 to the reverse position JDP.}

The jig reversing device 3200 rotates the underfill jig UJ in the reversing position JDP by 180 degrees with the left and right horizontal lines as a rotation axis.

The jig transfer device 3300 transfers the underfill jig UJ in the reversing position JDP to the jig carrying out position JCP.

The jig carrying device 3400 carries out the underfill jig UJ at the jig carrying position JCP.

For reference, according to the implementation of the jig carrying device 3400, it may be implemented to position the empty underfill jig (UJ) supplied by a separate device from the right side to the jig carrying position (JCP). In this case, the empty underfill jig (UJ) is transferred to the reversing position (JDP) by the jig transfer device 3300, and then the underfill jig (UJ) located at the reversing position (JDP) is transferred by the jig transfer device 3100. Implementing to be able to supply to the starting position (MSP) can be considered.

The control device 3500 controls each of the above-described configurations. _{In particular, after acquiring the identification information of the test tray (TT 1} ) or the test board (TT ₂ ) through an identification device not shown, a good electronic component (ED) is transferred to the first electronic component rotating device 1800 or the second electronic device. The first picking device 2100 is controlled to send to the component rotating device 1900 and send the defective electronic component ED to the removal position RP.

_{Next, a flow of movement of the electronic component ED, the test tray TT 1} , the test board TT ₂ , and the underfill jig UJ made in the electronic component unloading equipment EDLE having the above configuration will be described.

<Explanation of logistics in electronic parts unloading equipment>

1. Electronic component (ED) movement flow

A. Test tray (TT _One ) Is applied (refer to the arrow in Fig. 6)

Electronic components (ED) are supplied to the first supply position (SDP ₁ ) and the second supply position (SDP ₂ ) in _{a state loaded on the test tray (TT 1).} Thereafter, the electronic component (ED) is loaded in the test tray (TT ₁ ), and the first tray moving device 1100 and the second tray moving device 1200 are used to provide a first supply position (SDP ₁ ) and a second supply position. It moves from (SDP ₁ ) to the first standby position (WP ₁ ) and the second standby position (WP ₂ ) (①-1, ①-2).

The test tray (TT ₁ ) in the second standby position (WP _{2 ) is transferred (②) to the second unloading position (UP 2} ) by the third tray transfer device (1700), and the first picking device (2100) It is individually supplied (③-1, ③-2) to the first electronic component rotating device 1800 or the second electronic component rotating device 1900. For reference, the electronic component ED determined to be defective is sent to the removal position RP by the first picking device 2100 (③-3).

The electronic component ED converted from the vertical state to the horizontal state by the first electronic component rotating device 1800 or the second electronic component rotating device 1900 is moved to the loading position LP by the second picking device 2400. It is moved and loaded (④-1, ④-2) to the lower plate (JB) of the underfill jig (UP), and at the loading position (LP) according to the movement of the underfill jig (UJ) by the second jig moving device (2500). It is moved (⑤) to _{the second moving end position (MEP 2} ) through the upper plate coupling position (TJP).

_{Subsequently, the electronic component (ED) is moved (⑥) from the second movement end position (MEP 2} ) to the reversing position (JDP) while being loaded in the underfill jig (UJ), and 180 degrees by the jig inversion device 3200. After being inverted 180 degrees with the reversed underfill jig (UJ), it is moved (⑦) to the jig carrying position (JCP) by the jig transfer device 3300. Then, it is carried out (⑧) by the jig carrying device 3400 to the equipment connected to the right side or the prepared loading element.

On the other hand, the first waiting position (WP ₁₎ electronic components (ED) is to carry the second waiting position (WP ₂₎ by the tray carrier 2200 with the test tray (TT ₁₎ (①-3) in the Thereafter, it is moved from the second standby position WP ₂ to the jig carrying position JCP through each of the above-described positions, and is carried out.

B. Test board (TT ₂ ) Is applied (refer to the arrow in Fig. 7)

The electronic components (ED) are _{loaded on the test board (TT 2} ) and are in the first supply position (SDP ₁ ) and the second supply position (SDP ₂ ), the first standby position (WP ₁ ) and the second standby position (WP). _It moves to 2) (①-1, ①-2). And the first unloading position (UP ₁ ) and the second _{unloading position (UP 1) from the first standby position (WP 1} ) and the second standby position (WP ₂ ) by the first tray conveying device 1300 and the second tray conveying device 1400. It is transferred to the unloading position (UP ₂ ) (②-1, ②-2), and individually by the first picking device 2100, the first electronic component rotating device 1800 or the second electronic component rotating device 1900 It is moved to (③-1 to ③-4). After passing through the loading position (LP), the upper plate coupling position (TJP), the second moving end position (MEP ₂ ), the reversing position (JDP), and the jig carrying position (JCP), they are taken out (④-1, 2 to ⑧). . Of course, the electronic component ED determined to be defective is sent from the first unloading position UP ₁ or the second unloading position UP ₂ to the removal position RP.

2. Test tray movement flow (refer to the arrow in Fig. 8)

_{The test tray (TT 1} ) loaded with electronic components (ED) is supplied to the first supply position (SDP ₁ ) and the second supply position (SDP ₂ ), and then the first tray moving device (1100) and the second tray are moved. The device 1200 moves to the first standby position WP ₁ and the second standby position WP ₂ (①-1, ①-2).

The test tray (TT ₁ ) in the second standby position (WP _{2 ) is transferred (②) to the second unloading position (UP 2} ) by the third tray transfer device 1500, and the first picking device 2100 _{The empty test tray TT 1} in which the unloading of the electronic component ED is completed is returned (③) to _{the second standby position WP 2} by the third tray transfer device 1500. _{Then, it is moved (④) from the second standby position (WP 2} ) to the tray take-out position (TCP) by the tray transport device 2200, and then is taken out (⑤).

On the other hand, the move to the first waiting position (WP ₁₎ test tray (TT ₁₎ to the second waiting position (WP ₂₎ by the tray transport device 2200 in the (①-3), a second unloading position after the It is carried out through (UP ₂ ), the second standby position (WP ₂ ), and the tray take-out position (TCP).

3. Test board movement flow (refer to the arrow in Fig. 9)

_{The test board (TT 2} ) loaded with the electronic component (ED) is supplied to the first supply position (SDP ₁ ) and the second supply position (SDP ₂ ), and then the first tray moving device (1100) and the second tray are moved. The device 1200 moves to the first standby position WP ₁ and the second standby position WP ₂ (①-1, ①-2).

_{In addition, the first unloading position (UP 1} ) and the second unloading position (UP 1) and the second tray transfer device 1300 and the second tray transfer device 1400 at the first standby position (WP ₁ ) and the second standby position (WP _{2 ).} It is moved (②-1, ②-2) to the unloading position (UP _{2 ).}

Later, a first unloading position (UP ₁₎ and the blank test board (TT _2), the unloading of the electronic part (ED) is completed at the second unloading position (UP ₂₎ has a first tray conveying apparatus 1300 and the 2 It is returned to the first standby position (WP ₁ ) and the second standby position (WP ₂ ) by the tray transfer device 1400 (③-1, ③-2), and the first tray transfer device 1100 and the second _{2 It is returned to the first supply and demand position (SDP 1} ) and the second supply and demand position (SDP ₂ ) by the tray moving device 1200 (④-1, ④-2) and then taken out.

4. Flow of movement of the underfill jig (refer to the arrow in Fig. 10)

The empty underfill jig (UJ) is supplied to the jig supply position (JSP), and is transferred (①) to the transfer start position (MSP) by the jig transportation device 3100, and then the top plate by the first jig transfer device 2500. It is moved (②) to the removal location (TTP).

The upper plate (JT) removed from the lower plate (JB) by the upper plate detacher (2700) at the upper plate removal position (TTP) is moved to the upper plate bonding position (TJP) (③-1), and the lower plate (JB) is the first It is moved (③-2) to the first moving end position (MEP _{1) by the jig moving device 2500.}

The lower plate (JB) in the first moving end position (MEP ₁ ) is moved (④) to the loading position (LP) by the lower plate transfer device (2800), and the electronic component (ED) can be loaded from the loading position (LP). The completed lower plate (JB) is moved (⑤) to the upper plate coupling position (TJP) by the second jig moving device (2600).

The underfill jig (UJ) in which the upper plate (JT) is coupled to the lower plate (JB) by the upper plate detacher (2700) at the upper plate coupling position (TJP) is a second movement end position (MEP) by the second jig moving device (2600). _It is moved (⑥) to 2 ). Subsequently, the underfill jig (UJ) is _{transported (⑦) from the second moving end position (MEP 2} ) to the reversing position (JDP) by the jig transport device 3100. And the underfill jig (UJ) inverted 180 degrees by the jig reversing device 3200 from the reversing position (JDP) is moved (⑧) to the jig carrying position (JCP) by the jig transfer device 3300, and the jig carrying device ( 3400).

<Description of detailed configuration of electronic component unloading equipment>

Each of the aforementioned components configured for the movement flow of the electronic component ED described above will be described in detail.

1. The first tray moving device and the second tray moving device

The first tray moving device 1100 is as shown in FIG. 11 in order to move the test tray (TT ₁ ) or the test board (TT ₂ ) in the first receiving position (SDP ₁ ) to the first standby position (WP _{1 ).} It is equipped with two tray movers (1110, 1120).

The first tray mover 1110 supports a loading frame TLF in which a test tray TT ₁ or a test board TT _{2 is loaded in a first supply/receiving position SDP 1.}

The second tray mover 1120 supports the loading frame TLF in which the test tray TT ₁ or the test board TT _{2 is loaded in the first standby position WP 1.}

In addition, the first tray mover 1110 and the second tray mover 1120 above have a test tray (TT ₁ ) or a test board (TT ₂ ) _{in the first supply position (SDP 1 ).} ) To the first standby position (WP ₁ ).

Next, look at the detailed configuration required for lifting and moving the test tray (TT _{1) or loading frame (TLF).}

12 is a schematic perspective view of the second tray mover 1120. As shown in Fig. 12, the second tray mover 1120 includes a lift frame 1121, a lift member 1122, a first moving belt part 1123, a second moving belt part 1124, a moving motor 1125, and a stopper. (STP) and elevator (U/D).

The elevating frame 1121 is provided to be elevating. According to the lifting of the lifting frame 1121, the first moving belt portion 1123 and the second moving belt portion 1124 are placed on the test tray TT ₁ or the loading frame TLF.

The lift member 1122 lifts the lift frame 1121.

The first moving belt part 1123 is installed on the lifting frame 1121 to move up and down together with the lifting frame 1121, and a pair of moving belts (MB ₁ , MB ₂ ), driving pulleys (DP) and driven pulleys ( PP).

Since the second moving belt part 1124 is the same as the first moving belt part 1123, a description thereof will be omitted.

For reference, in _{the case of the test tray (TT 1} ), as shown in FIG. 13, the first moving belt part 1123 and the second moving belt part 1124 are supported respectively, but the loading frame in which the _{test board TT 2 is loaded.} In the case of (TLF), as shown in FIG. 14, the first moving belt part 1123 and the second moving belt part 1124 are supported together.

The moving motor 1125 rotates the driving pulleys DP so that the moving belts MB ₁ and MB ₂ rotate the driving pulley DP and the driven pulley PP to the rotation return point.

The stopper (STP) is _{provided to prevent the test tray (TT 1} ) from being pushed. Therefore, if the stopper (STP) is erected by a driving source not shown, the test tray (TT ₁ ) or the loading frame (TLF) is prevented from being pushed, and when the stopper (STP) is laid down, the test tray (TT ₁ ) or loading frame (TLF) is prevented from being pushed. ) Can be moved forward and backward.

_{The elevator (U/D) raises and lowers the test tray (TT 1} ) or the loading frame (TLF) placed on the first moving belt portion 1123 or the second moving belt portion 1124 at a predetermined interval. This elevator (U/D) acts when the test board (TT ₂ ) or, depending on the implementation, the test tray (TT ₁ ) is discharged to the front. For example, in the course of the test tray (TT ₁₎ discharging the front end of the test tray (TT ₁₎ in contact with the stopper (STP) stopper (STP) is pushed in the forward direction, the stopper (STP) by a sensor (not shown) Sense the jungle. When the advance of the stopper (STP) detection, lift (U / D) is operating to when the first moving belt portion of the test tray (TT ₁₎ by raising the test tray (TT ₁₎ (1123) and the second moving belt It is spaced upward from portion 1124. At the same time, the operation of the first moving belt part 1123 or the second moving belt part 1124 is stopped. And when the operation of the first moving belt part 1123 or the second moving belt part 1124 is stopped, the elevator (U/D) operates in reverse to move the test tray (TT ₁ ) to the first moving belt part 1123 or It is put on the second moving belt portion (1124). This lift (U / D) in the test tray (TT ₁₎ to the lifting because the stopper (STP) test tray in the lower layer of the move is stopped by the (TT ₁₎ and a test tray in the lower layer (TT ₁ which by This is to prevent damage by the first moving belt part 1123 or the second moving belt part 1124 on which the electronic component ED loaded in) is operated.

In FIG. 11, reference numeral r denotes a roller for guiding the forward and backward movement _{of the test tray TT 1.}

Meanwhile, the first tray mover 1110 has the same configuration as the second tray mover 1120. However, in the first tray mover 1110, _{there is no need to elevate the test tray TT 1} or the loading frame TLF, so the elevating frame and the crew may be omitted.

When the moving motors 1125 of the first tray mover 1110 and the second tray mover 1120 having the above configuration operate, the test tray (TT ₁ ) or test board _{supplied to the first supply position (SDP 1)} The loading frame (TLF) in which (TT ₂ ) is loaded is moved from the first supply and demand position (SDP ₁ ) to the rear first standby position (WP ₁ ) _{with circulation rotation of the moving belts (MB 1} , MB _{2 ).} Of course, when the moving motors 125 of the first tray mover 1110 and the second tray mover 1120 operate in reverse, the loading frame TLF in the first standby position _{WP 1 is at the first standby position (} It is moved _{from WP 1} ) to the first supply/demand position (SDP _{1 ).}

In addition, the loading frame (TLF) in which the test tray (TT ₁ ) or the test board (TT ₂ ) is loaded in the first standby position (WP ₁ ) is operated by the crew 1122 of the second tray mover 1120. It can be raised or lowered. The reason that the test tray (TT ₁ ) or the loading frame (TLF) can be lifted from the first standby position (WP ₁ ) is, the first tray transfer device 1300 and the tray transfer device 2200 to be described later This is because it is necessary to adjust the height _{of the test tray (TT 1} ) or loading frame (TLF) for proper operation required to transport the uppermost test board (TT ₂ ) or test tray (TT _{1 ). For example, the test tray TT 1} at the top of the first standby position WP ₁ is sent to the second unloading position UP ₂ via the second standby position WP _{2. In addition, the test tray TT 1} in which unloading of the electronic component ED is completed is carried out through the second standby position WP ₂ and the tray take-out position TCP. Then follow the same path as the test tray (TT _1), the test tray (TT ₁₎ the previously discharged in the upper side of the following ranking of the test tray (TT ₁₎ taken out by a predetermined height raised the stacked test tray (TT ₁₎ Will move. Likewise, when the test board (TT ₂ ) loaded on the loading frame (TLF) is loaded again on the loading frame (TLF) after the electronic component (ED) is unloaded from the top of the top, the loading frame (TLF) rises to a certain height. Thus, the electronic component (ED) loaded on the test board (TT _{2) at the next highest level is unloaded.}

On the other hand, depending on the implementation, when the test tray (TT ₁ ) is applied, it will be considered that the first moving belt part 1123 and the second moving belt part 1124 of the second tray mover 1120 are independently elevated and lowered. I can.

The second tray moving device 1200 moves the test tray (TT ₁ ) or the test board (TT ₂ ) in the second supply position (SDP ₂ ) to the second standby position (WP ₂ ). It is moved and has the same configuration as that of the first tray moving device 1100, so a description thereof will be omitted.

2. The first tray transfer device and the second tray transfer device

The first tray transfer device 1300 transfers the test board (TT ₂ ) in the first standby position (WP ₁ ) to the first unloading position (UP ₁ ) or the first unloading position (UP ₁ ). In order to transfer the test board TT ₂ to the first standby position WP ₁ , as shown in FIG. 15, a gripping member 1310, an elevator 1320, and a front-rear mover 1330 are included.

The gripping member 1310 is provided to be elevating and has a gripping pin 1311 protruding upward. The gripping member 1310 grips the test board TT ₂ by the gripping pin 1311 by ascending, and releases the gripping _{of the test board TT 2} by the gripping pin 1311 by falling. Of course, for this purpose, it is preferable that a gripping hole into which the gripping pin 1311 can be inserted is formed on the bottom of _{the test board TT 2.}

The elevator 1320 raises and lowers the gripping member 1310 so that the gripping pin 1311 can be inserted into the gripping hole of the _{test board TT 2 or removed from the gripping hole.} Accordingly, the gripping member 1310 may grip the test board TT ₂ or release the grip.

The front-rear mover 1330 moves the gripping member 1310 and the elevator 1320 in the front-rear direction. Therefore, as the holding member 1310 moves back and forth, the test board (TT ₂ ) is withdrawn from the loading frame (TLF) at the first standby position (WP ₁ ) in the front and is transferred to _{the first unloading position (UP 1) in the rear.} Or, while being transferred from the first unloading position (UP ₁ ) to the first standby position (WP ₁ ) in front, it may be loaded on the loading frame (TLF). At this time, the test board (TT ₂ ) loaded on the loading frame (TLF) is gripped by the gripping member 1310 for rearward movement, or the test board (TT ₂ ) in _{the first unloading position (UP 1) is} In order to be properly loaded on the loading frame TLF, it is necessary to lift the loading frame TLF by the second tray mover 1120 to adjust the height of the _{test board TT 2 as mentioned above.} For reference, in this embodiment, as shown in FIG. 15, a rodless cylinder is applied as the front-rear mover 1330 for space utilization, but depending on implementation, a general cylinder may be applied for cost reduction.

The second tray transfer device 1400 transfers the test board (TT ₂ ) in the second standby position (WP ₂ ) to the second unloading position (UP ₂ ), or to the second unloading position (UP ₂ ). It has the same configuration of the first tray transfer device 1300 in order to transfer the empty test board (TT ₂ ) to the second standby position (WP _{2 ).} Therefore, a detailed description of the configuration is omitted.

3. 3rd tray transfer device

The third tray transfer device 1500 transfers the test tray (TT ₁ ) in the second standby position (WP ₂ ) to the second unloading position (UP ₂ ), and moves the test tray (UP 2) in the second unloading position (UP ₂ ). Transfer the test tray (TT ₁ ) to the second standby position (WP _{2 ).} To this end, the third tray transfer device 1500 includes a first tray transfer machine 1510 and a second tray transfer machine 1520 as shown in FIG. 16.

The first tray transfer machine 1510 includes a gripper 1511, a horizontal transfer machine 1512, and a vertical transfer machine 1513.

The gripper 1511 is a pair of grip members 1511a, 1511b whose intervals can be adjusted by a pair of driving cylinders DS1 and DS2, and grips both front and rear ends of the _{test tray TT 1 or releases the grip.} can do. The gripper 1511 may have a rotation source RDF capable of rotating the grip members 1511a and 1511b. The rotation circle RDF folds or unfolds the grip members 1511a and 1511b inward or outward by rotating the grip members 1511a and 1511b in the direction of the arrow. _{Accordingly, when the test board TT 2} is moved by the second tray transfer device 1400, interference between the test board TT ₂ and the grip members 1511a and 1511b can be excluded.

The horizontal mover 1512 moves the gripper 1511 in the front-rear direction, so that the test tray TT _{1 held} by the gripper 1511 is moved from the second standby position WP ₂ to the second unloading position UP ₂ . To or from the second unloading position (UP ₂ ) to the second standby position (WP ₂ ).

The vertical mover 1513 lifts the gripper 1511. Therefore, the gripper 1511 is a test tray (TT ₁₎ to be lowered or raised to the height, or if it is to be gripped, can be raised and lowered in a state of releasing the grip of the test tray (TT _1).

The second tray transfer machine 1520 is provided to be symmetrical with the first tray transfer machine 1510 and has the same configuration as the first tray transfer machine 1510, so its description will be omitted.

Of course, the first tray transfer machine 1510 and the second tray transfer machine 1520 may be operated independently or interlocked with each other.

_{Here, the test tray (TT 1} ) must be positioned at a height where the first tray transfer machine (1510) and the second tray transfer machine (1520) can grip the test tray (TT _{1 ).} There is a need to lift the test tray (TT _{1) by 1120.}

4. The first tray support device and the second tray support device

The first tray supporting device 1600 supports the test board TT _{2 in the first unloading position UP 1} , and the second tray supporting device 1700 is the test _{in the second unloading position UP 2.} Support tray (TT ₁ ) or test board (TT ₂ ).

First, looking at the second tray support device 1700, the second tray support device 1700 includes a pair of support rails 1711 and 1712, a pair of supporters 1721 and 1722, and an installation frame as shown in FIG. (1730) is provided.

A pair of support rails (1711, 1712) is supporting the both ends of the test board (TT _2), the second guides the longitudinal movement of the test board (TT ₂₎ to move back and forth by the tray transport apparatus 1500.

A pair of supporters 1721 and 1722 support the test tray TT ₁ as shown in FIG. 18. Among the pair of supporters 1721 and 1722, the first supporter 1721 will be examined.

The first support 1721 includes a support plate 1721a and an elevator 1721b as shown in FIG. 19.

The support plate 1721a is provided to be elevating and supports the test tray TT ₁ .

The elevator 1721b raises and lowers the support plate 1721a. Therefore, when the test board (TT ₂ ) is applied, the support plate 1721a is lowered so that the support plate 1721a does not interfere with the movement of the _{test board TT 2.} In addition, when the test tray TT ₁ is applied, the support plate 1721a is raised so that the test tray TT ₁ may be positioned at an appropriate height for unloading of the electronic component ED.

The second supporter 1722 has the same configuration as the first supporter 1721.

Meanwhile, the first tray support device 1600 may be configured in the same manner as the second tray support device 1700. _{However, considering the distribution of the test tray (TT 1} ) made in the electronic component unloading equipment (EDUE) according to the present embodiment, the first tray support device 1600 does not need to _{support the test tray (TT 1 ).} Therefore, it is preferable to omit a pair of supporters for supporting _{the test tray TT 1 in} the first tray support device 1600.

5. The first electronic component rotating device and the second electronic component rotating device

The first electronic component rotating device 1800 and the second electronic component rotating device 1900 rotate the vertical electronic component ED received from the first picking device 2100 in a horizontal state.

First, a first electronic component rotating apparatus 1800 will be described with reference to FIG. 20.

The first electronic component rotating apparatus 1800 includes a moving plate 1810, a front-rear moving source 1820, a parts rotator 1830, and a parts aligner 1840.

The moving plate 1810 is provided to be movable in the front-rear direction. A component rotator 1830 and a component aligner 1840 are installed on the moving plate 1810. For reference, depending on implementation, a plurality of subform rotators and part aligners may be installed on the moving plate 1810 in order to improve the processing capacity.

The front-rear moving source 1820 moves the moving plate 1810 in the front-rear direction. Accordingly, the parts rotating machine 1830 and the parts aligner 1840 installed on the moving plate 1810 receive the electronic parts ED from the first picking device 2100 and the electronic parts ( ED) can be moved between positions. That is, when the electronic component ED is received from the first picking device 2100, the moving plate 1810 is in a forward-moving state, and when the electronic component ED is given to the second picking device 2400, The moving plate 1810 is in a state of being moved to the rear. Accordingly, operation areas of the first picking device 2100 and the second picking device 2400 are separated from each other, so that interference between the first picking device 2100 and the second picking device 2400 is prevented.

The component rotator 1830 includes an installation frame 1831, a rotation member 1832, a pair of gripping members 1833a and 1833b, a first gap adjuster 1834, and a rotation drive source 1835.

The installation frame 1831 has a lower end fixed to the moving plate 1810. In addition, a rotating member 1832 and the like are installed on the upper side of the installation frame 1831.

The rotating member 1832 is provided to be rotatable.

A pair of gripping members 1833a and 1833b are installed on the rotating member 1832 so as to be moved back and forth somewhat in a direction facing each other, and grips the electronic component ED but releases the gripping. The pair of gripping members 1833a and 1833b has gripping grooves GSa and GSb into which both ends of the electronic component ED can be inserted in a direction facing each other.

The first gap adjuster 1834 moves the pair of gripping members 1833a and 1833b in a direction facing each other or away from each other, so that the pair of gripping members 1833a and 1833b grips the electronic component ED. Or release the grip of the electronic component (ED). Here, the gap between the pair of gripping members 1833a and 1833b when the electronic component ED is inserted is a gap that is wide enough so that it does not slip away while the electronic component ED falls and slides into the gripping grooves GSa and GSb. It is desirable to keep it. At this time, since the lower ends of the gripping grooves GSa and GSb have a closed jaw structure, the electronic component ED does not fall. And when the electronic component ED is completely inserted into the gripping grooves GSa and GSb, the pair of gripping members 1833a and 1833b are approached in a facing direction to stably grip the electronic component ED. This prevents the electronic component ED from shaking off.

The rotation drive source 1835 rotates the rotation member 1832. Accordingly, the electronic component ED held by the gripping members 1833a and 1833b in a vertical state may be converted to a horizontal state according to the rotation of the rotating member 1832.

The parts aligner 1840 includes a left and right aligner 1841, a pair of alignment members 1842a and 1842b, and a second spacer 1843.

The left and right aligner 1841 supports the right end of the electronic component ED converted to a horizontal state, and aligns the left and right positions of the electronic component ED. To this end, the left and right aligner 1841 includes a cylinder 1841a and a support member 1841b. The support member 1841b advances to the left by the cylinder 1841a to align the left and right positions of the electronic component ED. Of course, the support member 1841b has a support jaw for supporting the right end of the electronic component ED.

The pair of alignment members 1833a and 1833b aligns the electronic component ED in a horizontal state placed on the base plate 1841. To this end, a pair of alignment members 1842a and 1842b are installed to be movable in a direction approaching or moving away from each other. Supporting jaws for supporting the front and rear ends of the electronic component ED are also formed in the pair of alignment members 1833a and 1833b.

The second spacing adjuster 1843 moves the pair of alignment members 1842a and 1842b in a direction approaching or moving away from each other.

Subsequently, the operation of the first electronic component rotating device 1800 as described above will be described.

At present, Fig. 20 shows a state in which a gap between the pair of gripping members 1833a and 1833b is slightly widened while the moving plate 1810 is advanced forward.

When the electronic component ED in the vertical state is inserted into the gripping grooves GS1 and GS2 of both gripping members 1833a and 1833b by the first picking device 2100 in the state as shown in FIG. 20, the first gap adjuster 1834 ) Narrows the gap between the pair of gripping members 1833a and 1833b, and the electronic component ED is gripped by both gripping members 1833a and 1833b. And as shown in Fig. 21, the moving plate 1810 is retracted to the rear by the front-rear moving source 1820. Of course, unlike FIG. 21, the electronic component ED may be first rotated and then the moving plate 1810 may be moved according to the designer's intention or to prevent interference with other structures in the electronic component unloading equipment (EDUE).

Subsequently, in the state of FIG. 21, the rotation drive source 1835 operates to rotate the rotation member 1832 as shown in FIG. Accordingly, while the pair of gripping members 1833a and 1833b rotate together with the rotating member 1832, the electronic component ED is also switched from a vertical state to a horizontal state.

For reference, in the state of FIG. 22, in order to prevent drop interference by the pair of alignment members 1842a and 1842b when the electronic component ED, which is converted to a horizontal state, is dropped, a pair of alignment members 1842a, The gap between 1842b) is slightly wider.

In the state of Fig. 22, when the first gap adjuster 1834 operates in reverse to release the gripping of the electronic component ED by the pair of gripping members 1833a and 1833b, the electronic component ED is in a horizontal state. It falls parallel to the bottom. At this time, since the surfaces of the pair of alignment members 1842a and 1842b facing each other guide the falling of the electronic component ED, the front and rear ends of the electronic component ED are the pair of alignment members 1842a and 1842b. Falls stably while contacting the faces facing each other. And the rotation drive source 1835 operates in reverse to rotate the rotation member 1832 in the reverse direction.

On the other hand, when the dropping of the electronic component ED is completed, the electronic component ED is supported by the support member 1841b and the support jaws of the pair of alignment members 1833a and 1833b. Subsequently, the support member 1841b advances in the left direction to align the left and right positions of the electronic component ED, and the second gap adjuster 1843 is operated to narrow the gap between the pair of alignment members 1842a and 1842b. Align the part (ED) in the correct position in the front-rear direction. And the second gap adjuster 1843 operates in reverse to slightly widen the gap between the pair of alignment members 1842a and 1842b. Therefore, the second picking device 2400 can grip the electronic component ED at an appropriate position, and the horizontal electronic component ED is gripped by the second picking device 2400, so that the loading position LP Can be moved to. Of course, when the electronic component ED is moved to the loading position LP by the second picking device 2400, the moving plate 1810 is moved forward again, and the electronic component coming by the first picking device 2100 ( ED) can be received.

Since the second electronic component rotating device 1900 is additionally provided along with the first electronic component rotating device 1800 to increase processing capacity, the second electronic component rotating device 1900 is the first electronic component rotating device 1800. It has the same configuration as Therefore, a description of the second electronic component rotating device 1900 will be omitted.

6. First picking device

The first picking device 2100 unloads the electronic component (ED) from the test tray (TT ₁ ) or the test board (TT _{2 ) in the first unloading position (UP 1} ) or the second unloading position (UP _{2 ).} After loading, the electronic component ED is supplied to the first electronic component rotating device 1800 or the first electronic component rotating device 1900 in a state in which the moving plate 1810 is advanced forward. To this end, the first picking device 2100 includes a picking module 2110, a first horizontal mover 2120, a second horizontal mover 2130, and a vertical mover 2140, as shown in FIG. 23.

The picking module 2110 includes a pair of pickers 2111a and 2111b and a pair of elevators 2112a and 2112b.

The pair of pickers 2111a and 2111b face each other with the paired gripping members CE ₁ and CE ₂ and the gripping members CE ₁ and CE _{2 in order to grip both ends of the electronic component ED.} It has advances and discharges (AR ₁ , AR ₂ ) to advance and retreat.

A pair of elevators 2112a and 2112b are provided to independently lift and lower the first picker 2111a and the second picker 2111b. Therefore, while being able to grasp and move two electronic parts ED at a time, it is possible to sequentially supply electronic parts to each of the first electronic part rotating device 1800 and the second electronic part rotating device 1900. .

The first horizontal mover 2120 moves the picking module 2110 in the front-rear direction.

The second horizontal mover 2130 moves the picking module 2110 in the left and right directions.

The vertical mover 2140 raises and lowers the picking module 2110.

In the first picking device 2100 in this embodiment, since the pair of pickers 2111a and 2111b can each hold the electronic component ED, two electronic components ED can be moved at a time. Was implemented to be able to. However, depending on implementation, only one picker may be provided, or three or more pairs of pickers may be provided.

In addition, the pair of pickers 2111a and 2111b includes a release pin RP and a separation preventing member PP. Prior to gripping the electronic component (ED), the release pin (RP) is an electronic component by a holding machine provided in the contact module (CM) _{of the test tray (TT 1} ) or the loading module (LM) of the _{test board (TT 2 ).} ED)'s holding state is released. This release pin (RP) has a stopper (SP) whose outer diameter is expanded in the middle, and can be lifted by a cylinder (CD). And a spring (S) is provided between the release pin (RP) and the cylinder (CD). Therefore, when the release pin (RP) descends, the stopper (SP) part is caught in the hole, so that the release pin (RP) descends only enough distance to operate the holding machine of the contact module (CM) or the loading module (LM). do. In addition, when the cylinder (CD) lowers the release pin (RP), when excessive lowering of the release pin (RP) occurs, the spring (S) is compressed, so that the contact module (CM) or the loading module ( LM) damage is prevented.

When the release preventing member (PP) releases the electronic component (ED) by the release pin (RP), the electronic component (ED) is moved upward from the contact module (CM) or the loading module (LM) by the impact caused by the release operation. To prevent it from being thrown away. For reference, in the equipment implemented so that the first picking device 2100 loads an electronic component (ED) into a contact module (CM) or a loading module (LM), the electronic component (ED) is loaded into a contact module (CM) or a loading module. When loaded on the (LM), the separation preventing member (PP) functions as a pressing member that presses the electronic component (ED) downward.

7. Tray transport device

The tray transport device 2200 transports the test tray (TT ₁ ) from the first standby position (WP ₁ ) to the second standby position (WP ₂ ), or the tray transport position (TCP) from the second standby position (WP _{2 ).} To be transported. This tray transport device 2200 _{only differs in the transport direction of the test tray TT 1} , and has substantially the same configuration as the first tray transporter 1510 of the third tray transport device 1500 described above, so the description thereof Is omitted.

8. Tray take-out device

The tray carrying device 2300 is provided to carry out the _{test tray TT 1} in the tray carrying position TCP in the left direction. As shown in FIG. 24, the tray carrying device 2300 includes a pair of carrying belts 2311 and 2312, a carrying out motor 2320, a driving pulley 2330, and a driven pulley 2340.

The carry-out belts 2311 and 2312 rotate with the drive pulley 2330 and the driven pulley 2340 as rotation return points by the operation of the carry-out motor 2320. Therefore, when the take-out motor 2320 operates, the test tray TT ₁ placed in the tray take-out position TCP by the tray transport device 2200 is taken out to the left. In this case, _{a loading device for receiving the test tray TT 1} may be provided in the left direction, or other equipment connected to the left side of the electronic component unloading device according to the present embodiment may be provided.

9. Second picking device

The second picking device 2400 sucks and holds the electronic component ED from the first electronic component rotating device 1800 or the second electronic component rotating device 1900 in a state in which the moving plate 1810 is moved backward. After moving and loading it to the lower plate (JB) of the underfill jig (UJ) in the loading position (LP). To this end, the second picking device 2400 includes a picking module 2410, a first horizontal mover 2420, a second horizontal mover 2430, and a vertical mover 2440, as shown in FIG. 25.

The picking module 2410 has two pickers P1 and P2 capable of adsorbing and holding the electronic component ED in a horizontal state by vacuum pressure. Here, in this embodiment, two pickers P1 and P2 are implemented to hold one electronic component ED. However, depending on implementation, one picker may be implemented to move two electronic parts at a time by holding one electronic part. Furthermore, by configuring different distance differences or different sizes of the gripping portions of the pickers together with the cylinder, it may be implemented to extend and contract as necessary. Through this, it is also possible to design electronic components of different standards to be gripped or released with one picker or multiple pickers.

The first horizontal mover 2420 moves the picking module 2410 in the front-rear direction. Accordingly, it is possible for the picking module 2410 to move back and forth using the currently empty loading portion on the lower plate JB of the underfill jig UJ as a target position.

The second horizontal mover 2430 moves the picking module 2410 in the left and right direction so that the picking module 2410 is positioned on the side of the first electronic component rotating device 1800 or the second electronic component rotating device 1900 or loaded. It should be located at the location (LP).

The vertical mover 2440 makes it possible for the picking module 2410 to hold the electronic component ED or to load the electronic component ED on the lower plate JB of the underfill jig UJ by raising and lowering the picking module 2410. And, it is possible to horizontally move the picker module 2410 without interference with other components.

10. The first jig moving device and the second jig moving device

The first jig moving device 2500 moves the underfill jig (UJ) supplied to the moving start position (MSP) by the jig transport device 3100 to the top plate removal position (TTP), and moves the top plate from the top plate removal position (TTP). (JT) moves the removed lower plate (JB) to the first movement end position (MEP ₁ ).

In addition, the second jig moving device 2600 moves the lower plate JB at the loading position LP to the upper plate coupling position TJP, and the underfill jig in which the upper plate JT is coupled at the upper plate coupling position TJP. UJ) is moved to the second movement end position (MEP ₂ ).

Since the first jig moving device 2500 and the second jig moving device 2600 have substantially the same configuration as the previously mentioned tray carrying device 2300 of FIG. 24, a description thereof will be omitted.

11. Top plate removal device

The upper plate detachment device 2700 removes the upper plate JT from the underfill jig UJ at the upper plate removal position TTP, and then connects the upper plate JT to the lower plate JB at the upper plate attachment position TJP. . To this end, the upper plate detachment device 2700 includes a gripping module 2710, a vertical mover 2720, and a horizontal mover 2730, as shown in FIG. 26.

The gripping module 2710 may grip the upper plate JT or release the gripping. Here, the gripping members 2711 of the gripping module 2710 may grip and support only the upper plate JT through the opening groove OS of the lower plate JB. At this time, since the upper plate JT and the lower plate JB are coupled by the magnet M, the lower plate JB can be lifted together when the upper plate JT is lifted. Therefore, the electronic component unloading equipment (EDUE) is preferably provided with a pressurizer (PA) that can press the lower plate (JB) downward through the exposed groove (ES) of the upper plate (JT). Of course, the pressurizer (PA) may be provided with an elastic sheet for preventing damage to the portion in contact with the lower plate (JB).

The vertical mover 2720 raises and lowers the holding module 2710 so that the holding module 2710 can remove the upper plate JT from the underfill jig UJ or couple the upper plate JT to the lower plate JB.

The horizontal mover 2730 moves the gripping module 2710 from the upper plate removal position (TTP) to the upper plate coupling position (TJP), or from the upper plate coupling position (TJP) to the upper plate removal position (TTP).

12. Lower plate transfer device

The lower plate transfer device 2800 transfers _{the lower plate JB at the first moving end position MEP 1} to the rear loading position LP. The lower plate transfer device 2800 is only different in that it grips and transfers the lower plate JB, but the description thereof will be omitted since it has the same practical configuration as the upper plate detachment device 2700.

13. Jig lifting device

The jig lifting device 2900 sequentially raises the underfill jigs (UJ) supplied to the jig supply position (JSP) in a vertically stacked state, so that the underfill jig (UJ) located at the top of the jig transport device 3100 It can be moved to the transfer start position (MSP) by

For reference, the underfill jig (UJ) may be supplied to the jig supply position (JSP) in a state loaded on a separate loading frame for loading the underfill jig (UJ).

In this case, the jig elevating device 2900 may be implemented to sequentially raise the underfill jig by raising the loading frame stepwise by a predetermined height, or may be implemented to sequentially raise only the underfill jig.

The jig lifting device 2900 as described above may be configured substantially the same as the lifting frame 1121 and the elevator 1122 of the second tray mover 1120 mentioned above, or may be modified and applied as necessary. .

14. Jig transportation device

The jig transportation device 3100 transports the empty underfill jig (UJ) at the jig supply position (JSP) to the transfer start position (MSP). In addition, the jig transportation device 3100 moves the underfill jig UJ filled with the electronic component ED _{in the second transfer end position MEP 2 to the reverse position JDP.} Since the jig transportation device 3100 differs only in the transfer distance, its configuration is substantially the same as that of the aforementioned upper plate detachment device 2700, a detailed description thereof will be omitted.

15. Jig inversion device

_{The jig reversing device 3200 uses the underfill jig (UJ) transported from the second movement end position (MEP 2} ) to the reversing position (JDP) by the jig transport device 3100 and rotates the horizontal line in the left and right direction as a rotation axis. Also rotates. To this end, the jig reversal device 3200 includes a jig support 3210, a jig reversal 3220, and an installation frame 3230, as shown in FIG. 27 and FIG. 28, which are partially exploded views.

The jig support 3210 includes a base plate 3211 and an elevating drive source 3212.

The support plate 3211 is provided to support the underfill jig UJ.

The elevating drive source 3212 elevates the base plate 3211. Therefore, when the base plate 3211 is raised by the lifting drive source 3212, the underfill jig (UJ) in the reverse position (JDP) can be supported by the base plate 3211, and when the base plate 3211 is lowered The support state of the underfill jig UJ by the support plate 3211 is released.

The jig reverser 3220 includes a gripping module 3221 and a reversing motor 3222.

The gripping module 3221 may grip or release the underfill jig UJ. To this end, the gripping module 3221 includes an installation block 3221a, an elevation block 3221b, an elevation drive source 3221c, a cam block 3221d, and an interlocking shaft 3221e. Here, the installation block 3221a, the lifting block 3221b, the lifting drive source 3221c, and the cam block 3221d are provided in pairs to be symmetrically left and right.

The installation block 3221a is rotatably installed on the installation frame 3230 and has a support part SP capable of supporting the underfill jig UJ.

The lifting block (3221b) is installed to be able to lift a little from the lower side of the installation block (3221a), cam projections (CP) are provided at the front and rear ends, and a pair of gripping projections (GP) protruding toward the underfill jig (UJ) Is equipped.

The elevating drive source 3221c is provided to elevate the elevating block 3221b.

The cam blocks 3221d are installed at both front and rear ends of the installation block 3221a, respectively, and cam grooves CS into which the cam protrusions CP of the lifting block 3221b are inserted are formed. Here, the cam groove CS has a first vertical section PS1, a second vertical section PS2, and an inclined section TS.

The first vertical section PS1 guides the elevating cam protrusion CP in the vertical direction. This first vertical section PS1 may be omitted.

The second vertical section PS2 is located above the first vertical section PS1 and guides the rising and lowering cam protrusion CP in the vertical direction.

The inclined section TS connects the upper end of the first vertical section PS1 and the lower end of the second vertical section PS2, and the elevating cam protrusion CP has a moving displacement in the direction of the underfill jig (UJ) or The descending cam protrusion CP has an angle of approximately 45 degrees with the horizontal line so as to have a moving displacement in a direction opposite to the underfill jig UJ. Accordingly, the cam protrusion CP moves while having a vertical displacement and a horizontal displacement in the inclined section TS. Accordingly, the lifting block 3221b having the cam protrusion CP also moves while having a vertical displacement and a horizontal displacement.

The interlocking shaft 3221e is provided in a pair of front and rear, and connects the installation blocks 3221a on the left and right sides so that the installation blocks 3221a on the left and right sides can rotate together.

The reversing motor 3222 rotates the installation block 3221a 180 degrees with the horizontal line in the left and right direction as a rotation axis, and ultimately rotates the gripping module 3221 by 180 degrees, and accordingly, the underfill gripped by the gripping module 3221 Invert the jig (UJ) 180 degrees.

The installation frame 3230 is provided to install the jig switcher 3220 and supports the jig switcher 3220. Here, the jig board 3220 is installed above the jig support 3210.

Subsequently, the operation of the jig inversion device 3200 as described above will be described.

As shown in Fig. 29, when the underfill jig (UJ), which has been transported to the reversal position (JDP) by the jig transport device 3100 in the elevated state of the base plate 3211, is placed on the base plate 3211, the lifting drive source 3221c It is operated to raise the lifting block (3221b). The lifting block 3221b is guided by the cam groove CS of the cam block 3221d through the cam protrusion CP, and moves horizontally toward the underfill jig UJ along with the lifting. At this time, while the cam protrusion CP moves through the inclined section TS, the gripping protrusion GP of the lifting block 3221b advances toward the underfill jig UJ, and accordingly, the gripping protrusion GP moves to the underfill jig UJ. Is placed in a position that can support it. Subsequently, when the lifting block 3221b further rises, the cam protrusion CP passes through the second vertical section PS2, and the gripping protrusion GP attaches the underfill jig UJ to the support part SP as shown in FIG. Make it close. Accordingly, the underfill jig UJ is held by the holding module 3221 while being sandwiched between the holding protrusion GP and the support part SP. In the state of FIG. 30, the base plate 3211 descends as in FIG. 31, and the reversing motor 3222 operates to rotate the gripping module 3221 by 180 degrees as in FIG. Accordingly, the underfill jig UJ held by the holding module 3221 is also rotated 180 degrees. And when the rotation of the gripping module 3221 is completed, the base plate 3211 rises to support the underfill jig (UJ), and the lifting block 3221b rises (this is based on the state that the gripping module rotated 180 degrees, so it is lifted). The block is expressed as rising), whereby the gripping module 3221 releases the grip of the underfill jig UJ.

16. Jig transfer device

The jig transfer device 3300 transfers the underfill jig UJ in the reversing position JDP to the jig carrying out position JCP on the right. To this end, the jig transfer device 3300 includes a pair of guide rails 3311 and 3312, a push rod 3320 and a transfer drive source 3330 as shown in FIG. 33.

A pair of guide rails 3311 and 3312 support the underfill jig UJ when the base plate 3211 of the jig support 3210 descends, and guide the movement of the underfill jig UJ in the right direction.

The pusher 3320 is provided to push and transport the underfill jig UJ supported by the pair of guide rails 3311 and 3312 to the jig carrying position JCP on the right side.

The transfer drive source 3330 moves the pusher 3320 in the left and right directions.

Accordingly, when the base plate 3211 descends and the underfill jig UJ is supported by the guide rails 3311 and 3312, the transfer drive source 3330 operates to move the push rod 3320 to the right. As a result, the underfill jig UJ is moved while being pushed by the pusher 3320, so that the underfill jig UJ is transferred from the reversing position JDP to the jig carrying position JCP. Of course, when the transfer of the underfill jig (UJ) is completed, the transfer drive source 3330 operates in reverse to move the pusher 3320 to the left.

17. Jig carrying device

The jig carrying device 3400 carries out the underfill jig UJ at the jig carrying position JCP. In this case, the unloaded underfill jig (UJ) may be moved to a separate equipment coupled to the rear end or may be loaded in a separately provided loading device. Since the jig carrying device 3400 has substantially the same configuration as the previously mentioned tray carrying device 2300, a detailed description thereof will be omitted.

<Description of configurations that can be omitted>

In the above embodiment, various configurations are added to increase the processing capacity, but many configurations may be omitted if processing capacity is not considered.

1. Even with only the second tray transfer device 1200, the second tray transfer device 1400, the third tray transfer device 1500, and the second tray support device 1700, the electronic component (ED) is first picked. Since it can be supplied to the device 2100, the first tray transfer device 1100, the first tray transfer device 1300, and the first tray support device 1600 may be omitted.

Furthermore, if the operator is designed to directly supply the loading frame (TLF) loaded with the test tray (TT ₁ ) or test board (TT ₂ ) to the first standby position (WP ₁ ) or the second standby position (WP _{2 ),} The first tray mover 1110 may be omitted from the first tray moving device 1100 or the second tray moving device 1200, and the first moving belt part 1123 and the second moving belt part 1124 are also Can be omitted.

2. If processing capacity is not considered, either the first electronic component rotating device 1800 or the second electronic component rotating device 1900 may be omitted.

3. If the test tray (TT ₁ ) is also controlled to be carried out to the first supply position (SDP ₁ ) or the second supply position (SDP ₂ ) like the test board (TT ₂ ), the tray take-out device 2300 will be omitted. I can.

4. If the first jig moving device 2500 is implemented to move both left and right directions of the underfill jig (UJ) without considering the processing speed, the second jig moving device 2600 and the lower plate moving device 2800 It can also be omitted.

5. If the 180 degree inversion of the underfill jig UJ is not required, the jig inversion device 3200 may be omitted.

6. If the underfill jig (UJ) is implemented to be carried out through the jig supply position (JSP), the jig transfer device 3300 and the jig take-out device 3400 may be omitted.

7. If the underfill jig (UJ) is provided in a form without an upper plate, it is possible to omit the upper plate detaching device 2700.

_{8. Depending on the implementation, the configuration for the test board (TT 2} ) is omitted by being implemented so that only the test tray (TT ₁ ) is applied, or the test board (TT ₂ ) is implemented so that only the test tray (TT ₁ ) is applied. You can omit the configuration.

_{9. In this embodiment, a test tray (TT 1} ) or a loading frame (TLF) for proper transfer operation of the first tray transfer device 1300, the second tray transfer device 1400, and the third tray transfer device 1500 It has this elevating structure. However, depending on the implementation, it may be considered that the first tray transfer device 1300, the second tray transfer device 1400, and the third tray transfer device 1500 lift up and down.

Therefore, a detailed description of the present invention has been made by an embodiment with reference to the accompanying drawings, but since the above-described embodiment has been described only with a preferred example of the present invention, the present invention is limited to the above embodiment. It should not be understood, and the scope of the present invention should be understood as the following claims and equivalent concepts.

EDUE: Electronic component unloading equipment
1100: first tray moving device
1200: second tray moving device
1300: first tray transfer device
1400: 2nd tray transfer device
1500: 3rd tray transfer device
1600: first tray support device
1700: second tray support device
1800: first electronic component rotating device
1900: second electronic component rotating device
2100: first picking device
2200: Tray transport device
2400: second picking device
2500: first jig moving device
2600: second jig moving device
2700: upper plate detachment device
2800: Lower plate transfer device
3100: jig transportation device
3200: Jig inversion device

Claims (13)

An electronic component rotating device for rotating an electronic component in a vertical state in a horizontal state;
A first picking device for unloading the electronic component vertically loaded in the test tray in the unloading position from the test tray and then supplying the vertical electronic component to the electronic component rotating device; And
A second picking device for moving and loading the electronic component rotated in a horizontal state by the electronic component rotating device to an underfill jig at a loading position; Including,
The first picking device grips both ends of the electronic component in a vertical state,
The second picking device grips the plane of the electronic component in a horizontal state,
The second picking device has two pickers capable of adsorbing and holding electronic parts in a horizontal state by vacuum pressure,
The two pickers hold one electronic component.
Electronic component unloading equipment. An electronic component rotating device for rotating an electronic component in a vertical state in a horizontal state;
A first picking device for supplying an electronic component to the electronic component rotating device;
A second picking device for moving the electronic component rotated by the electronic component rotating device to a loading position; Including,
The first picking device pressurizes and grips the electronic component,
The second picking device grips the electronic component by adsorbing it under vacuum pressure,
The second picking device has two pickers capable of adsorbing and holding electronic parts in a horizontal state by vacuum pressure,
The two pickers hold one electronic component.
Electronic component unloading equipment. An electronic component rotating device for rotating an electronic component in a vertical state in a horizontal state;
A first picking device for unloading the electronic component vertically loaded in the test tray in the unloading position from the test tray and then supplying the vertical electronic component to the electronic component rotating device; And
A second picking device for moving and loading the electronic component rotated in a horizontal state by the electronic component rotating device to an underfill jig at a loading position; Including,
The first picking device grips both ends of the electronic component in a vertical state,
The second picking device grips the plane of the electronic component in a horizontal state,
The first picking device,
A pair of pickers each holding both ends of the electronic component; And
An elevator for independently lifting and lowering the pair of pickers; Including,
The picker includes a separation preventing member that prevents the electronic component from being separated by an impact caused by the release of the electronic component by the release pin.
Electronic component unloading equipment. An electronic component rotating device for rotating an electronic component in a vertical state in a horizontal state;
A first picking device for supplying an electronic component to the electronic component rotating device;
A second picking device for moving the electronic component rotated by the electronic component rotating device to a loading position; Including,
The first picking device pressurizes and grips the electronic component,
The second picking device grips the electronic component by adsorbing it under vacuum pressure,
The first picking device,
A pair of pickers each holding both ends of the electronic component; And
An elevator for independently lifting and lowering the pair of pickers; Including,
The picker includes a separation preventing member that prevents the electronic component from being separated by an impact caused by the release of the electronic component by a release pin.
Electronic component unloading equipment. An electronic component rotating device for rotating an electronic component in a vertical state in a horizontal state;
A first picking device for unloading the electronic component vertically loaded in the test tray in the unloading position from the test tray and then supplying the vertical electronic component to the electronic component rotating device; And
A second picking device for moving and loading the electronic component rotated in a horizontal state by the electronic component rotating device to an underfill jig at a loading position; Including,
The first picking device grips both ends of the electronic component in a vertical state,
The second picking device grips the plane of the electronic component in a horizontal state,
The first picking device,
A pair of pickers each holding both ends of the electronic component; And
An elevator for independently lifting and lowering the pair of pickers; Including,
The picker includes a separation preventing member that prevents the electronic component from being separated by an impact caused by the release of the electronic component by a release pin,
The separation preventing member has a function of pressing the electronic component downward
Electronic component unloading equipment. An electronic component rotating device for rotating an electronic component in a vertical state in a horizontal state;
A first picking device for supplying an electronic component to the electronic component rotating device;
A second picking device for moving the electronic component rotated by the electronic component rotating device to a loading position; Including,
The first picking device pressurizes and grips the electronic component,
The second picking device grips the electronic component by adsorbing it under vacuum pressure,
The first picking device,
A pair of pickers each holding both ends of the electronic component; And
An elevator for independently lifting and lowering the pair of pickers; Including,
The picker includes a separation preventing member that prevents the electronic component from being separated by an impact caused by the release of the electronic component by a release pin,
The separation preventing member has a function of pressing the electronic component downward
Electronic component unloading equipment. An electronic component rotating device for rotating an electronic component in a vertical state in a horizontal state;
A first picking device for unloading the electronic component vertically loaded in the test tray in the unloading position from the test tray and then supplying the vertical electronic component to the electronic component rotating device; And
A second picking device for moving and loading the electronic component rotated in a horizontal state by the electronic component rotating device to an underfill jig at a loading position; Including,
The first picking device grips both ends of the electronic component in a vertical state,
The second picking device grips the plane of the electronic component in a horizontal state,
The second picking device vacuum-adsorbs electronic parts in a horizontal state with one picker or several pickers according to the electronic part standard.
Electronic component unloading equipment. An electronic component rotating device for rotating an electronic component in a vertical state in a horizontal state;
A first picking device for supplying an electronic component to the electronic component rotating device;
A second picking device for moving the electronic component rotated by the electronic component rotating device to a loading position; Including,
The first picking device pressurizes and grips the electronic component,
The second picking device grips the electronic component by adsorbing it under vacuum pressure,
The second picking device vacuum-adsorbs electronic parts in a horizontal state with one picker or several pickers according to the electronic part standard.
Electronic component unloading equipment. The method according to any one of claims 1 to 8,
The first picking device,
A pair of gripping members for pressing and gripping both ends of the electronic component; And
Including; advance and retreat for advancing and retreating the holding members in a direction facing each other,
The second picking device has a picker capable of holding a flat surface of an electronic component in a horizontal state by vacuum pressure.
Electronic component unloading equipment. The method according to any one of claims 1, 2, 7 and 8,
The first picking device,
A pair of pickers each holding both ends of the electronic component; And
An elevator for independently lifting and lowering the pair of pickers; Including
Electronic component unloading equipment. The method of claim 10,
The picker includes a release pin for releasing the holding state of the electronic component prior to gripping the electronic component.
Electronic component unloading equipment. The method according to claim 3 or 4,
The separation preventing member has a function of pressing the electronic component downward
Electronic component unloading equipment. The method according to any one of claims 3 to 8,
The second picking device has two pickers capable of adsorbing and holding electronic parts in a horizontal state by vacuum pressure,
The two pickers hold one electronic component.
Electronic component unloading equipment.

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