JP2705420B2 - Temperature control method of low temperature handler - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC for testing and measuring an IC device (integrated circuit element) at a low temperature.
The present invention relates to a temperature control method in a handler, a so-called low-temperature handler.

[0002]

2. Description of the Related Art A device test apparatus for testing and measuring the electrical characteristics of an IC device includes an IC tester and an IC handler. The IC tester includes a test head having a socket for connecting an IC device, and a tester main body that processes a signal from the IC device and measures whether or not the IC device operates normally. The IC handler supplies an IC device, sequentially connects the IC device to a test head, and forms a mechanism for storing the IC devices by classifying them based on test results.

[0003] Testing of IC devices is performed not only at room temperature but also at high and low temperatures. For this purpose, a constant temperature bath is used to heat or cool the IC device to a temperature set at the time of the test. In a high-temperature handler for testing an IC device in a high-temperature state, a preheating section and a measuring section for connecting to a test head were provided as a device traveling path in a constant-temperature bath, and the IC device was sent into the constant-temperature bath. After the IC device is heated to the set temperature by retaining the IC device in the preheating unit for a predetermined time, the IC device is transferred to the measurement unit and a test is performed. In contrast, a low-temperature handler for testing an IC device in a low-temperature state is provided with a cooling unit and a measuring unit in a constant temperature bath, and the IC device stays in the cooling unit for a predetermined time to lower to a set temperature. After letting
The test is transferred to the measuring section and is performed. In addition, both the high-temperature handler and the low-temperature handler are the same in that the temperature is set at a predetermined temperature by staying at a site where temperature processing is performed, and then the test is performed by moving to a measurement unit. For this reason, a so-called high-low temperature handler that uses a low-temperature handler and a high-temperature handler by installing a heating unit and a cooling unit in a thermostat is also used.

[0004]

When a low temperature handler or a high / low temperature handler is used to test an IC device at a predetermined low temperature, a refrigerant such as liquid nitrogen is used to supply the refrigerant into a thermostat. However, a duct is provided in order to bring the entire thermostat to a uniform temperature state with the refrigerant, a fan such as a cross flow fan for circulating cooling air is installed in the duct, and the refrigerant is injected downstream of the fan. A refrigerant supply pipe having a plurality of outlets is provided. The refrigerant supplied from the refrigerant supply pipe is vaporized when ejected from the refrigerant outlet, and is conveyed to a circulating flow by a fan to circulate in the thermostat. Here, since the coolant supply source is generally provided only at one place, the temperature condition can be made somewhat uniform when the internal space of the constant temperature bath is small. If a multiple handler is configured to test a large number of IC devices at the same time, the internal space of the thermostat becomes large, so that it is extremely difficult to make the whole temperature uniform. In particular, the only way to perform temperature control by using liquid nitrogen as a refrigerant and ejecting this liquid nitrogen from a refrigerant outlet formed in a pipe is to control the amount of refrigerant to be ejected, which itself requires fine control. Coupled with the difficulties,
There is a problem that it is extremely difficult to control the entire inside of the thermostat so as to accurately reach the set temperature.

The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to extremely strictly control the temperature of a traveling path on which an IC device travels in a thermostat. Is to be able to do that.

[0006]

SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, the present invention provides a refrigerant supply unit for forming a circulating flow.
IC device in a thermostat equipped with a duct with a fan
A vice travel path is provided, and an IC
With a test head for testing and measuring
At least upstream of the test head on this road.
A heater is provided at a predetermined position and transported along the traveling path
This test is performed by cooling the IC device to a predetermined temperature.
IC connected to the head for test and measurement of its electrical characteristics
A method for controlling the temperature of a handler, comprising:
To supply the refrigerant from
After lowering the temperature, the heater is used to heat the running path.
By heat, it is to to adjust so that the position of the cooling unit and the measurement unit reaches the set temperature even without least in the traveling path and its features.

[0007]

As described above, since the low-temperature handler and the high-temperature handler have substantially the same configuration except that the temperature conditions are different, those configured as high-low temperature handlers are widely used. In the high / low temperature handler, a heater is provided in a temperature processing unit (a cooling unit in the case of a low temperature handler, and a heating unit in the case of a high temperature handler) constituting a traveling path of the IC device . The heater is an IC
On the device path, upstream from the test head position
And a heater for heating the traveling path.
You. In addition, since the measuring unit is provided with an opening in the constant temperature bath so that the test head of the IC tester disposed outside the constant temperature bath faces the inside of the constant temperature bath, a heater is also provided around the opening. Provided as needed. These heaters are operated only when used as a high-temperature handler, and are stopped when used as a low-temperature handler.

However, in the present invention, the heater is operated even when used as a low-temperature handler. That is, a coolant is supplied from the coolant supply unit to cool the inside of the thermostat to a temperature equal to or lower than the set temperature. Then, this temperature is detected by a temperature sensor, and the IC device
By operating a heater such as a panel heater provided on a traveling path on which the chair travels , the temperature of the relevant portion is raised to a set temperature. Here, the temperature of the traveling path is directly controlled by the heater.
Therefore, finer control can be performed as compared with temperature control by supply of the refrigerant for controlling the temperature of the entire space of the constant temperature bath, so that extremely strict temperature control becomes possible. And I
If the travel path of the C device is at the set temperature, the IC device can be cooled and maintained at the set temperature , so that the volume in the constant temperature chamber such as a multiple handler is large.
This heater, in addition to cooling the entire thermostat,
At least, the temperature of the road is strictly controlled.
Reliable setting of IC devices traveling along this travel path
Can be kept at temperature .

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, in FIG. 1, 1 is an IC handler,
2 indicates an IC tester, 3 indicates an IC device, and I
The C handler 1 includes a device supply path 10 for supplying the IC device 3, a thermostat 11, and a device discharge chute 12. The thermostat 11 is provided in a thermostat chamber 13 defined by heat insulating walls. A device travel path is provided. The device supply path 1 is located above the thermostatic chamber 13.
A device introduction opening 14 for receiving the IC device 3 to be tested is formed from 0, and a device discharge opening for discharging the IC device 3 after the test is completed to the device discharge path 12 is formed in the lower part of the constant temperature chamber 13. 15 are provided. Here, as shown in FIGS. 2 and 3, a plurality of rows (eight rows in the drawing) of the device traveling paths in the constant temperature chamber 13 are provided.

The IC tester 2 comprises a front wall 11 of a thermostatic chamber 11.
a, and the IC tester 2 has 8
A total of 16 sockets 2a are provided as test heads in a row and two stages, and each of these sockets 2a faces the constant temperature chamber 13 through a through hole 16 formed in the front wall 11a of the constant temperature bath 11.

The device traveling path provided in the thermostat 11 includes a cooling section chute 20 composed of an inclined chute on the opening 14 side on the device introduction side, a measuring section chute 21 composed of a vertical chute, and a cooling section chute. A direction change section 22 for changing the direction from the chute 20 and moving to the measuring section chute 21. The cooling unit chute 20 cools the IC device 3 introduced into the thermostat 11 to a set temperature by retaining the IC device 3 for a predetermined time. Then, the IC devices 3 cooled by the cooling unit chute 20 are separated one by one by individual separating means 23 composed of a pair of cylinders and sent to the direction changing unit 22. By rotating to the position shown by the line, it is sent to the measuring unit chute 21. This measuring unit chute 21
Is a movable chute 21a and the movable chute 21
and a fixed chute portion 21b above and below a, and a drive unit 24 is connected to the movable chute portion 21a. The drive unit 24 positions the IC device 3 sent from the upper fixed chute portion 21b into the movable chute 21a at a predetermined position, clamps the IC device 3, and moves the IC device 3 toward the socket 2a of the IC tester 2. Connect the lead of IC device 3 to socket 2a
The IC device 3 is tested in this state. After the test, the IC device 3 is returned to the original position to release the clamp and the positioning.
After passing through 1b, it is sent out to the device discharge path 12 from the opening 15 on the device discharge side. In addition, the individual separation means 2 described above
Since the configurations of the drive unit 3 and the drive unit 24 are well known in the related art, specific illustration and description thereof are omitted.

The thermostat 11 is used as a low-temperature handler for testing the IC device 3 by cooling the IC device 3 to a predetermined set temperature. The thermostat 11 is used as a high-temperature handler for testing the IC device 3 in a heated state. It is configured as a high / low temperature handler that can also be used. For this purpose, the thermostatic bath 11 is equipped with a circulating flow forming mechanism, a cooling mechanism and a heating mechanism.

First, as a circulating flow forming mechanism, a duct 30 provided parallel to and below the cooling unit chute 20 is provided.
A suction port 30 a is provided at a position near the device introduction opening 14 of the duct 30, and a blowout port 30 b opening toward the measuring section chute 21 is provided at a position near the direction changing section 22. And the cooling unit chute 20
And a blowout port 30c that opens toward the outlet. A cross flow fan 31 is provided at a position near the suction port 30a in the duct 30.
A circulating flow is formed in the constant temperature chamber 13 by the cross flow fan 31. Further, the outlets 30b and 3
An air volume adjusting plate 32 for adjusting the volume of the blown air is provided at the branch position from 0c and in the outlets 30b and 30c.

Next, the cooling mechanism has a refrigerant ejection pipe 40 provided on the downstream side of the position where the cross flow fan 31 is disposed in the duct 30.
0 is installed so as to cross the duct 30 as shown in FIG. 4, and one end thereof is connected to a refrigerant supply pipe 41. The refrigerant supply pipe 41 is connected to a refrigerant cylinder 43 such as liquid nitrogen via a flow control valve 42 on the way. A plurality of refrigerant ejection holes 40a are formed in the refrigerant ejection pipe 40, and the refrigerant is ejected from the refrigerant cylinder 43 through the flow control valve 42 into the duct 30 through the refrigerant ejection holes 40a to vaporize the refrigerant. Like that.

Further, as a heating mechanism, a plurality of rod heaters 50 are disposed in the duct 30 and a lower portion of the cooling unit chute 20 (when used as a high-temperature handler, it becomes a heating unit chute). As shown in FIG. 2, a panel heater 51 is provided. Further, as shown in FIG. 3, the through hole 16 in the front wall 11a of the thermostatic chamber 11 where the measuring unit chute 21 is located is provided with each socket 2a. A panel heater 52 is provided in which the arrangement position is the opening 52a. The rod heater 50 is for forming a high-temperature circulating flow in the thermostat 11, and the panel heater 51 is
C device 3 is directly heated,
Is for maintaining the set temperature state when testing the IC device 3.

In the present invention, as described above, since the device running path in the constant temperature bath 11 including the cooling unit chute 20 and the measuring unit chute 21 is provided with eight lanes, the cooling mechanism is used. It is difficult to uniformly maintain the entire constant temperature chamber 13 at the set temperature only by circulating the cool air supplied from the refrigerant ejection pipe 40 constituting the refrigerant outlet pipe 40. Temperature control is performed in combination with a heating mechanism. In addition, it is not necessary to maintain the entire temperature-controlled room 13 accurately and uniformly in a uniform temperature state. It suffices that the lane is at the set temperature exactly. Therefore, the cooling unit chute 2
0, temperature sensors 60 are provided on both sides of the movable chute 21a.
Is provided, and the temperature is adjusted based on the detected temperatures of the temperature sensors 60 and 61. The number and arrangement of the temperature sensors 60 and 61 are not limited to those described above. To improve the temperature detection accuracy, a larger number of temperature sensors may be attached to necessary places.

Therefore, a method for adjusting the temperature based on the above configuration will be described. In the following, description will be made assuming that the set temperature is, for example, −35 ° C., but the set temperature is appropriately set according to the purpose and the like, and the present invention is not limited to this temperature. Needless to say.

First, when starting the apparatus, the inside of the constant temperature chamber 13 must be cooled as soon as possible. For this purpose, a large amount of refrigerant is supplied from the refrigerant cylinder 43 to the refrigerant discharge pipe 40, and the cross flow fan 31 is operated to circulate cool air into the constant temperature chamber 13 so that the set temperature is -35 ° C. Lower, eg-
Rapidly cool to about 40 ° C. And constant temperature room 1
Even if the inside of 3 is not a uniform temperature, at least the whole is-
When the temperature falls below 35 ° C., the supply flow rate of the refrigerant is reduced by the flow control valve 42. The supply flow rate of the refrigerant squeezed in this way is set at a temperature equal to or lower than a set temperature, for example, −40 ° C.
That can be maintained at The temperature of the temperature sensor 60 provided at the position of the cooling unit chute 20 and the temperature of the temperature sensor 61 provided at the position of the movable chute portion 21a are detected. Activate 52 to adjust these parts to the set temperature of -35 ° C. As a result, the temperature can be adjusted very quickly when the apparatus is started up, and the required area can be reliably set to the set temperature.

In this state, the IC device 3 is supplied from the device supply path 10 to the cooling unit chute 20 in the constant temperature bath 11 and is kept at the cooling unit chute 20 for a predetermined time so that the IC device 3 reaches the set temperature. Cooled.
And the IC device 3 thus cooled is
By activating the individual separating means 23, the most advanced one is separated from the others and sent into the direction changing unit 22, and by rotating the direction changing unit 22, the IC is turned on.
The device 3 moves to the measuring unit chute 21. The IC device 3 sent to the measuring unit chute 21 is located at a predetermined position in the movable chute unit 21a, that is, the lower socket 2a.
When the drive unit 24 is lowered to a position facing
The operation stops the positioning. After waiting in this state, the next IC device 3 is sent into the movable chute 21a in the same manner as described above, descends to a position facing the upper socket 2a, and is positioned at that position.
These two-stage IC devices 3 are connected to the movable chute 21a.
And the IC devices 3 are displaced to the positions indicated by the imaginary lines in FIG. 1, so that the two IC devices 3 are brought into contact with the socket 2a, and the electrical characteristics thereof are tested and measured. After the test, the movable chute 21a
Is returned to the initial position, and when the clamp and the positioning are released, the sheet is sent out to the device discharge path 12. By repeating this operation sequentially, the test of the IC device 3 is performed.

As described above, since the refrigerant is supplied from the refrigerant discharge pipe 40 to the constant temperature chamber 13 at a temperature lower than the set temperature when operating in the steady state, as described above. The temperature of each position of the movable chute portion 21a of the cooling portion chute 20 and the measurement portion chute 21 detected by the temperature sensors 60 and 61 is constantly monitored, and the panel heaters 51 and 52 are operated as necessary. With this, even if there are many lanes for device driving,
Even if the space in the constant temperature chamber 13 of the constant temperature chamber 11 is widened and it is difficult to maintain the entire inside of the constant temperature chamber 13 at a uniform temperature state, the IC device 3 is cooled to the set temperature, In order to maintain the temperature of the IC device 3 cooled in this way, it is possible to surely set the part that needs to be accurately temperature-controlled to the set temperature. Further, if the temperature is controlled only by the refrigerant supplied from the refrigerant discharge pipe 40, since this temperature management is performed only by controlling the flow rate of the refrigerant by the flow control valve 42, it is difficult to perform extremely strict temperature control. However, by using the temperature control by the heating means together, it is possible to easily and very accurately perform the temperature control. In particular, since the heater has good temperature controllability compared to the supply of the refrigerant due to its nature, extremely strict temperature control is possible, and the reliability of the test result is improved.

[0021]

As described above, the present invention provides a refrigerant supply system.
The coolant is supplied from the supply means to test and measure the entire inside of the thermostat.
Make sure that the temperature is lower than the set
By heating with a heater, less
Set the temperature of the cooling unit and measuring unit to the set temperature at least
Start-up of the device
In some cases, the device can be cooled to the set temperature quickly, and in the steady state, the temperature control in the thermostatic chamber is not performed only by the flow rate control of the refrigerant, but also by using the operation control of the heater in combination to provide a large number of device driving lanes. Thus, even if the temperature chamber becomes large, it is possible to extremely strictly control the temperature of at least a necessary portion, and to improve the reliability of the test and measurement of the IC device.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing the entire configuration of a thermostat.

FIG. 2 is a diagram illustrating the configuration of a cooling unit chute.

FIG. 3 is an explanatory diagram of a configuration of a measuring unit chute.

FIG. 4 is an explanatory diagram of a configuration of a refrigerant supply mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC handler 2 IC tester 3 IC device 11 Constant temperature chamber 13 Constant temperature chamber 20 Cooling chute 21 Measurement part chute 21a Movable chute part 30 Duct 40 Refrigerant ejection pipe 42 Flow control valve 50 Rod heater 51, 52 Panel heater 60, 61 Temperature sensor

 ────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-60-252276 (JP, A) JP-A-63-274883 (JP, A) JP-A-3-159150 (JP, A) JP-A-5-205 34405 (JP, A) JP-A-62-11244 (JP, A)

Claims (1)

(57) [Claims] A traveling path for an IC device is provided in a constant temperature bath provided with a duct provided with a refrigerant supply unit and a fan for forming a circulating flow. Rutotomoni to face the test head for measurement,
At least on this track, upstream of the test head
A heater provided at a predetermined position of the side, the IC device to be conveyed along the travel path to cool to a predetermined temperature, the temperature of and connected to the test head IC handler to perform test measurements of the electrical characteristics In the control method, the refrigerant supply
At the time of testing and measuring the entire inside of the constant temperature bath by supplying refrigerant from the stage
After setting the temperature lower than the set temperature of
Wherein the position of at least the cooling unit and the measuring unit in the traveling path is adjusted to a set temperature by heating .
Law .