JPH1130642A - Testing set of integrated circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To a state of temperature being strictly controlled during the whole time a device is tested, without entailing any temperature drop due to its connection with a test head, at a time when the test of electric characteristics carried out by a single thermostatic bath. SOLUTION: In order to heat a device D mounted on a socket board 1 fed into a thermostatic bath 23 of a test part from a loader-unloader part, up to the setting temperature, a projection at one side is a suction part 30a, and another projection at the other side is turned to a blowoff part 30b, and in this constitution, a duct 30 whose interval between these elements 30a and 30b is turned to a communicating part 30c, is installed in this thermostatic bath 23. A fan 31 and a heater 32 are set up in the duct 30, and in a position at the downstream side of the heater 32, it is branched off to first, second and third branch passages 35a, 35b and 35c, and a second heater 37 is installed in the third branch passage 35c directed to a test position PT, and further a preheat temperature detector 38 detecting a temperature in a preheat position PP and a test temperature detector 39 detecting a temperature in the test position PT are installed as well.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC device test apparatus for testing the electrical characteristics of an IC device (hereinafter simply referred to as a device), and more particularly to a device for heating or cooling an IC device. The present invention relates to an apparatus for testing under a predetermined temperature condition.

[0002]

2. Description of the Related Art For example, in a test apparatus for testing and measuring the electrical characteristics of a device, the device is energized by
It is roughly composed of an IC tester that tests the electrical characteristics, and an IC handler that transports the device to a position connected to the IC tester and classifies and stores the devices after the test and measurement. IC handlers are roughly classified into two types according to the device transport system. First, the first transfer method is a self-weight sliding method in which an inclined transfer path is provided and the device slides under its own weight along this transfer path, and the second transfer method forcibly transfers the device. This is a forced transport system. In general, the forced transport system is configured to transport in a horizontal direction. Of these methods, the self-weight sliding method does not require a means for transporting and driving the device, so the configuration of the IC handler is extremely simple, whereas the forced transportation method requires a transportation means such as a transportation conveyor. Must be provided.

As a device mounting method, there are a pin insertion method and a surface mounting method. The DIP type device is a typical pin insertion type device, and since the lead pins extend downward from both the left and right sides of the package portion, the lead pins extend across the transport path. If the package is arranged and the package portion slides on the sliding surface on the transport path, it is possible to smoothly and surely slide by its own weight, so that the transport method of the own weight can be adopted. On the other hand, for example, SOP type, SOJ type, QF
In a device such as a P-type device, a lead pin bent outward from the package portion is extended. For this reason, if the self-weight sliding method is employed, there is an inconvenience such as frequent jamming in a transport path. , A forced conveyance system is adopted.

In the forced transfer method, a socket board for transferring devices is used to transfer a large number of devices at the same time. For example, in the case of the SOP type device D shown in FIG. 5, a rectangular and flat socket board 1 is used, and the socket board 1 has a plurality of rows and a plurality of device accommodating sections 2 arranged in each row. You. For example, if the device accommodating portions are formed at eight places over four rows, 3
Two devices can be transported simultaneously. The device D has a large number of lead pins L extending on both left and right sides of the package portion P. The lead pins L extend straight outward from the side of the package portion P at the base portion, and extend downward on the way. And bent outward again at a position corresponding to the bottom surface of the package portion P.

Each device accommodating portion 2 formed on the socket board 1 is formed by making the upper surface side of the socket board 1 concave. And in each device accommodation part 2,
As shown in FIG. 6, a device positioning mechanism and a device holding mechanism are provided. The device positioning mechanism includes a positioning wall 3, and the lead pin L is positioned by the positioning wall 3.

[0006] The device holding mechanism presses the package portion P of the device D against the device accommodating portion 2. For this purpose, the device holding mechanism has a turning arm 4 that turns vertically. Is formed with a pressing portion 4a that contacts the package portion P of the device D. A rotation shaft 5 fixedly provided in the device accommodating portion 2 is inserted into a substantially intermediate position of the rotation arm 4, and the rotation arm 4 rotates vertically around the rotation shaft 5. It works. Further, a torsion coil spring 6 (see FIG. 7) mounted on the rotation shaft 5 acts on the rotation arm 4, and by the operation of the torsion coil spring 6, the pressing portion 4 a of the rotation arm 4 is moved. It is always urged to press the device D. The rotating arm 4 holds the device D fixedly by the spring force of the torsion coil spring 6 and connects the device D to the socket board 1.
In order to place the rotary arm 4 on the socket board 1 or remove it from the socket board 1, the rotating arm 4 is rotated in a direction against the urging force of the torsion coil spring 6, that is, the pressing portion 4a is rotated upward. In order to transfer the device D to the socket board 1, as shown in FIG. 7, the device D is transferred to the socket board 1 by using device transfer means 9 including a suction head 7 and a pressing rod 8. It can be placed on or removed from the device housing 2.

By the way, when testing the device D, not only is the device D tested at room temperature, but also
The test may be performed in a high temperature state by heating the device D, or the test may be performed in a low temperature state by cooling the device D.
As described above, a constant temperature bath is used when performing a high temperature test or a low temperature test. When this thermostatic bath is used as a high-temperature bath, a heater is mounted. When the thermostatic bath is used as a low-temperature bath, a refrigerant supply device for supplying a refrigerant such as liquid nitrogen is provided.
Further, when used as a high / low temperature tank, a heater and a refrigerant supply device are provided. A fan is used to generate a circulating flow inside the constant temperature bath in order to spread heated air and cool air inside the constant temperature bath, so that the entire inside of the constant temperature bath is brought into a uniform temperature state.

FIG. 8 shows a schematic configuration of a device high-temperature test apparatus provided with a thermostat. In the figure, 10 is a loader section, 11 is a preheat tank, 12 is a test tank, and 13 is an unloader section. Of these, the interiors of the preheat tank 11 and the test tank 12 are strictly adjusted to a predetermined set temperature by providing a heater and a fan. The device D is placed in each device accommodating section 2 of the socket board 1 and is loaded from the loader section 10 to the preheating tank 11.
Sent inside. A plurality of socket boards 1 can be accommodated in the preheat tank 11, and the socket boards 1 in the preheat tank 11 are sequentially fed at a pitch. The device D is heated together with the socket board 1 to the measurement temperature during this time.

When the device D is heated to the set temperature, the socket board 1 moves from the preheating tank 11 to the test tank 12. And test tank 1
In the case of 2, the device D is connected to the test head 15 of the IC tester 14 arranged opposite to the test tank 12 while keeping the device D at the set temperature, as shown in FIG.
The test head 15 is provided with an interface board 17 provided with a required number of electrode pins 16.
By contacting each of the electrode pins 16 of 7 and energizing between them, a test of the electrical characteristics of the device D is performed.

The plurality of devices D mounted on the socket board 1 as described above are tested for electrical characteristics at one time. When the tests are completed, the process moves to the unloader section 13. By providing means for performing classification in the unloader section 13, the devices D can be classified based on the test results and stored in a predetermined jig. If an identification mark or the like is provided on the socket board 1, the unloader unit 13 does not necessarily need to classify the individual devices D.

[0011]

In the above-mentioned prior art configuration, a preheat tank 11 and a test tank 12 are used as constant temperature baths. The reason for this is that in the preheat bath 11 for heating the device D to the set temperature, the device D may be raised to a predetermined temperature, whereas in the test bath 12, the temperature of the device D raised to the set temperature is reduced. It needs to be strictly maintained. For this reason, the volume of the test tank 12 is extremely small as compared with the preheat tank 11 because the temperature control is performed more strictly in the test tank 12. Moreover, when the device D makes contact with the electrode pins 16 of the interface board 17, the heat of the leads L of the device D is absorbed by the electrode pins 16 side. When it becomes long from ten seconds to several minutes, the device D
The amount of heat radiation from the air becomes considerably large. Therefore, test tank 1
In order to maintain the device D at the set temperature in Step 2, the test tank 1
The temperature in 2 is set slightly higher than the set temperature.

As described above, even if the same temperature chamber is used, it may be configured as the preheat tank 11 or the test chamber 12 may be used.
Since the required temperature management method differs depending on whether or not the configuration is adopted, two conventional thermostats are used in the prior art. However, providing two separate thermostats increases the size of the test apparatus. Further, not only is the configuration and control of the apparatus complicated, such as the need to deliver the socket board 1 between the preheat tank 11 and the test tank 12, but also the preheating tank 11 and the test tank 12 have separate heating means. Since it is necessary to perform heating, there is an inconvenience that energy consumption is wasted.

The present invention has been made in view of the above points, and an object of the present invention is to enable a single thermostat to maintain a device in a strictly controlled temperature state when testing electrical characteristics. It is to make.

[0014]

To achieve the above object, the present invention provides an IC tester provided with a contact board for testing the electrical characteristics of an IC device, and an IC connected to the contact board. The device is accommodated in the socket board, and the I
What is claimed is: 1. An apparatus for testing an IC device comprising: a constant temperature bath for adjusting a temperature of a C device to a predetermined set temperature, wherein the constant temperature bath has an inlet at a lower side and a discharge unit at an upper side. At the same time, a plurality of the socket boards are arranged at predetermined intervals in the upper and lower spaces, and the uppermost socket board is a test position where the socket board is connected to the contact board, and the lower portion is a preheating position, and each of these sockets is The board is sequentially pitch-fed upward, and a duct provided with an air circulation fan is provided in the constant temperature bath, and a temperature control unit is provided in a passage in the duct, and the temperature control unit is provided with a temperature control unit. A partition wall for branching the passage after passing into a branch passage with the outlet directed to the preheat position and another branch passage with the outlet directed to the test position is provided. Te, that it has a configuration to place the other temperature control means to the other branch passage is for its features.

Each of the temperature control means is at least one of a heater and a coolant supply means. A heater is used when performing a high temperature test, and a coolant supply means is used when performing a low temperature test. To ensure that all devices arranged vertically and horizontally on the socket board are in a uniform temperature state, the outlet of each branch passage should be oriented in a direction substantially parallel to the socket board, and more preferably, preheating. The socket boards at the position and the test position are arranged in a direction in which the air flow from each branch passage is a flow in a direction parallel to its short side. When the socket board is carried into the thermostat, it is heated or cooled as quickly as possible. For this purpose, of the branch passage toward the preheat position side,
The socket board at the lowermost position of the preheating position may be configured to have a narrower outlet than the socket board above it, and to provide a partition wall between this outlet and another outlet. . If the suction port is opened at a position almost opposite to the outlet port across the socket board, the air circulation in the bath becomes smoother, and the temperature inside the constant temperature bath becomes more uniform. be able to.

[0016]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 is a schematic configuration diagram of the entire test apparatus, FIG. 2 is a cross-sectional view of a thermostat, FIG. 3 is a configuration diagram of a duct, and FIG. 4 is a configuration diagram of a blowout portion of the duct. In the following description, a configuration in which a device is heated to perform a test of electrical characteristics is shown. However, instead of a heater, a configuration in which a refrigerant such as nitrogen gas is supplied to a thermostat is provided. However, the present invention can be applied to a case where a device is tested in a cooled state.

First, in FIG. 1, reference numeral 20 denotes a loader / unloader unit, and reference numeral 21 denotes a test unit. In order to transport the device D, as described in the prior art described above,
A socket board 1 in which devices D are accommodated in a large number of device accommodation sections 2 is used. This socket board 1 is stocked in the loader / unloader section 20 and
After the test is completed, the device D is transferred to the loader / unloader unit 20 with the device D placed on the socket board 1 after the test.

The test section 21 comprises an IC tester 22 and a thermostat 23. The IC tester 22 has a test head 24, and an interface board 25 is provided on the test head 24. A large number of electrode pins (not shown) are provided on a lower surface of the interface board 25. Therefore, by applying a current while the leads L of the device D are in contact with each other, a test of the electrical characteristics of the device D is performed.

The thermostat 23 has a casing formed of a heat insulating wall, and a pair of upper and lower openings 26a and 26b are formed on a side wall of the loader / unloader 20 side. The lower opening 26a is an entrance of the socket board 1, and the upper opening 26b is an exit of the socket board 1. Opening and closing shutters are provided at the carry-in port 26a and the carry-out port 26b in order to carry the socket board 1 in and out. The socket board 1 introduced into the thermostatic chamber 23 from the carry-in port 26a is raised one pitch at a time by a driving means (not shown) including a pitch feeding means, a chain and the like. Thus, the socket boards 1 are arranged vertically at predetermined intervals. When the socket board 1 is located at the uppermost position, the socket board 1 is connected to the interface board 25. Therefore, an uppermost position the test position P _T of the socket board 1, in the position lower than the test position P _T, and preheating position P _P to heat the device D placed on the socket board 1 to a set temperature Become. In preheating position P _P, so that the socket board 1 is placed (six in the drawing) a plurality.

As described above, the test is performed in a state where the device D mounted on the socket board 1 is heated to the set temperature in the constant temperature bath 23. For this purpose, the inside of the constant temperature bath 23 is heated. For this purpose, a duct 30 is provided in the thermostat 23. This duct 30 is entirely U-shaped and has a width dimension wider than the long side of the socket board 1. One of the protruding portions of the duct 30 is a suction portion 30a, and the other protruding portion is a blowing portion 30.
b and a communication portion 30c between the suction portion 30a and the blowing portion 30b. And carry-in entrance 2
6a, carry-out port 26b is formed, the pre-heat position P _P and test position P _T is the suction unit 30a and the blowout portion 30
b.

A fan 31 such as a cross flow fan is mounted on the suction portion 30a side in the duct 30, and a heater 32 such as a rod heater is mounted on the communication portion 30c.
Is provided. Therefore, the fan 3 in the duct 30
Air flow toward the balloon portion 30b through the communicating portion 30c from the suction portion 30a side by the 1 is formed, also the air blown from the blowing unit 30b preheating position P _P
And a circulating flow of flowing into the suction portion 30a via the test position _PT . Then, in the duct 30, the airflow is heated by the heater 32. Then, by controlling the amount of heat generated by the heater 32, the temperature of the atmosphere in the constant temperature bath 23 is controlled to be the set temperature.

A suction port 33 having a large opening area is formed in the suction section 30a, and a blow port is formed in the blow section 30b. The blow port is divided into a plurality of sections vertically. ing. That is,
A first outlet 34a is formed at the lowermost position, a second outlet 34b is formed at the center, and a third outlet 34c is formed at the uppermost portion. The passage formed inside the duct 30 is formed by a single passage 35 up to the position where the heater 32 is provided, but at a position downstream of the heater 32, the first, second and third passages are formed. Branch passages 35a, 35
b, 35c. Thus, the branch passage 35
a, 35b, 35c are defined by the communicating portion 30
A plurality of partition walls are provided from c to the blowing section 30b.

The passage leading from the first branch passage 35a to the first outlet 34a is intended for blowing heated air toward the socket board 1 located at the bottom of the preheating position P _P. Here, since the lowermost socket board 1 has just been carried into the constant temperature bath 23 and the socket board 1 needs to be rapidly heated,
Increase the air flow as much as possible. For this reason, the opening area of the first branch passage 35a on the inflow side is not so different from the second and third branch passages 35b and 35c, but the first branch passage 35a serves as an outlet.
Outlet 34a is small.

Further, the second branch passage 35b and the second outlet 34b is for heating the other socket board 1 in preheating position P _P, the second outlet 34b is very large opening ing. However, in order to regulate the flow of the heated air from the second outlet 34b, a guide plate 36 is provided at a substantially middle position in the vertical direction.

The third branch passage 35c and the third outlet 34c connected to the third branch passage 35c are for supplying heated air to the socket board 1 at the test position _PT . Here, a second heater 37 is mounted at an intermediate position of the third branch passage 35c.
Is constituted by a rod heater or the like.
From the third branch passage 35c to the third outlet 34
The air blown out through c becomes heated air at a temperature higher than the set temperature.

In the constant temperature bath 23, temperature control is strictly performed. For this purpose, a temperature detector for detecting the temperature in the bath is provided. Here, the temperature detector, a preheat temperature detector 38 for detecting the temperature of the preheating position P _P, composed of test temperature detector 39. which detects the temperature of the test position P _T. The preheat temperature detector 38 is connected to the suction section 3 of the duct 30.
On the 0a side, the preheat position P _P in the flow of heated air
, And the test temperature detector 39 is arranged substantially at the center of the test position _PT . Accordingly, the amount of heat generated by the heater 32 is controlled based on the temperature detected by the preheat temperature detector 38, and is maintained at a predetermined set temperature. In addition, the test temperature detector 39
The amount of heat generated by the second heater 37 is controlled based on the detected temperature, so that the temperature of the heated air at the test position _PT can be adjusted. In the drawing, reference numeral 40 denotes a guide wall for smoothly flowing the airflow from the suction portion 30a to the communication portion 30c.

The test of the electrical characteristics of the device D is performed as follows by using the test apparatus having the above configuration. First, a predetermined number of devices D are housed in the loader / unloader unit 20 in a state of being mounted on each device housing unit 2 of the socket board 1. Then, the socket boards 1 are taken out one by one from the loader / unloader section 20 and placed in a constant temperature bath 23 arranged in the test section 21.
It is sent into the thermostatic chamber 23 from the carry-in port 26a,
Heating is performed up to a set temperature while being sequentially pitch-fed upward, and connected to the interface board 25 of the test head 24 of the IC tester 21 to test the electrical characteristics of the device D. Then, when the test is completed, the test piece is returned to the loader / unloader section 20 from the carry-out port 26b located on the upper side of the thermostat 23.

Here, the device D mounted on the socket board 1 carried into the constant temperature chamber 23 is heated to the set temperature, but is heated from the start of connection to the interface board 25 to the end of the test. It is necessary to maintain this set temperature. For this purpose, the duct 30 is used to
A circulating flow adjusted to the set temperature (for example, 90 ° C., 110 ° C., etc.) is formed in the device 3 and the device D is heated to the set temperature together with the socket board 1 by the action of the heat of the circulating flow.

[0029] The preheating position P _P and test position P _T, balloon portion 30b of the duct 30 on one side
Are arranged, and the suction portion 30a is located on the other side. In addition, the outlet 34 of the outlet 30b
a, 34b, the air blown out from 34c is adapted to heat the air is blown out in a direction parallel to the preheating position P _P and arranged in a test position P _T socket board first surface. In addition, a suction port 33 is opened at a position opposite to the socket board 1 so that the fan 3
By the action of 1, a suction force acts on the suction port 33 side. Therefore, each of the outlets 34a, 34b, 3
The heated air blown out from 4c flows in a substantially layered manner along the socket board 1. In addition, the long side of the socket board 1 is directed to the blowing section 30b and the suction section 30a, and the air flows in parallel with the short side of the socket board 1, so that the space between the blowing section 30b and the suction section 30a. And the air flows of the upper and lower layers are almost separated from each other and hardly mixed with each other, and flow in a partitioned state.

As described above, a large flow rate flows from the lowermost first blowout port 34a in the layered airflow from the blowout section 30b toward the suction section 30a. Immediately after the operation, the socket board 1 having the lowest temperature and the device D mounted thereon are rapidly heated by a large flow of heated air. Then, by the heat of the action of the air flow from the second outlet 34b having a large opening for other socket board 1 in preheating position P _P, the device D placed on the socket board 1 and the socket board 1 Rises to the set temperature. Since the temperature of the air blown from the first and second outlets 34a and 34b is detected by the test temperature detector 38, when the detected temperature changes, the amount of heat generated by the heater 32 is controlled. As a result, the set temperature is always maintained.

[0031] are heated to above manner preheating position P _P In the device D to be reliably set temperature relationship but proceeds to the test position P _T, which is connected to the electrode pins of the test position P _T at the interface board 25 Therefore, heat is radiated from the device D to the electrode pin side, and the temperature of the device D decreases. Therefore, this test position P _T
Then, the temperature of the device D tends to be lower than the set temperature. While, in the test position P _T, since the third temperature controlled by heating the air from the outlet 34c, and the air is further heated by the second heater 37 is supplied, in the test position P _T The temperature drop of the device D is suppressed. In addition, the temperature at the test position _PT is detected by the test temperature detector 39, and the amount of heat generated by the second heater 37 is strictly controlled based on the temperature detected by the test temperature detector 39. Therefore, after the connection of the device D to the interface board 25 is started and until the test is completed, the device D is reliably maintained at the set temperature.
As a result, the electrical characteristics of the device D are accurately tested at the set temperature. Then, the third outlet 34c
Heating air heating air flowing through the pre-heat position P _P blown from, but is in a different temperature than the heated air less site, the test position P _T, is substantially pre-heat position P _P thermal Because it is a region that is partitioned in a way, it does not interfere with each other thermally,
It is strictly maintained at a predetermined temperature.

As described above, by using the duct 30, the passage in the duct 30 is divided into two sections, and the test position P
Because they adjusted to different temperatures from the preheating position P _P air flow in the second heater 37 to be supplied toward the _T, without using the two thermostat of the preheating tank and the test vessel, A single thermostat 23 can be used. Therefore, the entire configuration of the test apparatus is simplified, and control such as setting of the opening and closing timing of the shutter when loading and unloading the socket board is facilitated. Further, the entire thermostat 23 is maintained at a substantially set temperature by the heater 32, and the second heater 37 compensates for the temperature drop of the device D during the test at the test position _PT , so that the energy consumption is also 2. Savings can be achieved compared to the tank system.

[0033]

As described above, the present invention is constructed as described above, and when conducting a test of electrical characteristics in a single thermostat, the temperature does not decrease due to connection with the test head.
During the test, the device can be maintained at a strictly controlled temperature.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an entire IC device test apparatus.

FIG. 2 is a sectional view of a thermostat.

FIG. 3 is an explanatory diagram of a configuration of a duct.

FIG. 4 is an explanatory diagram of a configuration of a blow-out portion of a duct.

FIG. 5 is an external view showing a device and a socket board.

FIG. 6 is an external view showing a configuration of a device accommodating section in the socket board.

FIG. 7 is an explanatory diagram of a configuration of a device attaching / detaching mechanism on a socket board.

FIG. 8 is a schematic configuration diagram of a conventional IC device test apparatus.

FIG. 9 is a configuration explanatory view showing a connection state between a socket board and an interface board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Socket board 2 Device accommodating part 20 Loader / unloader part 21 Test part 22 IC tester 23 Thermostat 24 Test head 25 Interface board 26a Carry-in port 26b Carry-out port 30 Duct 30a Suction part 30b Blow-out part 30c Communication part 31 Fan 32 Heater 33 Suction Mouth 34a-34c
Outlet 35 passage 35a-35c
Branch passage 37 Second heater 38 Preheat temperature detector 39 Test temperature detector D Device P Package part L Lead P _P Preheat position _PT Test position

Claims (7)

[Claims] An IC tester provided with a contact board for testing electrical characteristics of an IC device, an IC device connected to the contact board is accommodated in a socket board, and an IC accommodated in the socket board is provided.
In an IC device test apparatus provided with a thermostat for adjusting the device to a predetermined set temperature, the thermostat has an introduction portion formed on a lower side and a discharge portion formed on an upper side, and the discharge portion is formed on the upper side. Inside, a plurality of the socket boards are arranged at predetermined intervals above and below, a test position where the uppermost socket board is connected to the contact board, and a lower portion thereof is a preheating position, and these socket boards are sequentially set. It is arranged to feed pitch upwards, and a duct equipped with an air circulation fan is provided in the constant temperature bath, a temperature control means is provided in a passage in the duct, and after passing through the temperature control means, A passage is provided that branches the passage into a branch passage with the outlet facing the preheat position and another branch passage with the outlet facing the test position. , Testing of the IC device is characterized in that the construction of arranging the other temperature control means to the other branch passage. 2. The IC device test apparatus according to claim 1, wherein each of the temperature control means is at least one of a heater and a coolant supply means. 3. The duct includes a suction portion and a blow-out portion located on both sides of a portion where the socket board is located, and a communication portion communicating between the suction portion and the blow-out portion. 2. The method according to claim 1, wherein
Test device for C device. 4. The IC device test apparatus according to claim 1, wherein the outlets of the branch passages are oriented in a direction substantially parallel to the socket board. 5. The socket board according to claim 4, wherein the socket boards at the preheating position and the test position are arranged in a direction in which the air flow from each of the branch passages flows in a direction parallel to a short side thereof. Test equipment for IC devices. 6. A branch port toward the socket board at the lowermost position of the preheat position in the branch passage toward the preheat position is narrower than a socket board above the branch board. 2. A structure in which a guide wall is provided between the opening and the mouth.
The test device for an IC device according to claim 1. 7. The duct according to claim 3, wherein a suction port is opened at a position substantially opposite to the outlet with the socket board at the preheat position and the test position interposed therebetween. Test equipment for IC devices.