CN105032776A

CN105032776A - Test sorting machine

Info

Publication number: CN105032776A
Application number: CN201510516354.6A
Authority: CN
Inventors: 罗闰成; 吕东铉; 金溶范
Original assignee: Techwing Co Ltd
Current assignee: Techwing Co Ltd
Priority date: 2012-03-16
Filing date: 2013-02-06
Publication date: 2015-11-11
Anticipated expiration: 2033-02-06
Also published as: CN105032776B; KR101968984B1; TW201341820A; TWI470246B; KR20130105265A

Abstract

The present invention relates to a test handler. According to the present invention, there is provided an air circulation channel formed at a sidewall surface of the de-soak chamber so as to uniformly restore the semiconductor elements, which are carried on the test trays and moved into the de-soak chamber, back to the room temperature or a predetermined temperature. Further, by means of installing a dedicated circulation apparatus, the air in the de-soak chamber is subjected to circulation through the channel, thereby improving the stability and reliability of the equipment.

Description

Test handler

The divisional application that the application is the applying date is on February 6th, 2013, application number is the application for a patent for invention " Test handler " of 201310047421.5.

Technical field

The Test handler of the semiconductor element test carried out before the present invention relates to a kind of semiconductor element for supporting outbound to produce.

Background technology

Test handler a kind ofly to be supported to the semiconductor element through particular manufacturing process manufacture, makes it to be tested by test machine, and semiconductor element is loaded into the equipment of user tray by grade separation according to test result.

Fig. 1 is the concept map watching existing Test handler 100 that the semiconductor element of loading is supplied in test machine side at test pallet under the state stood vertically, that take side docking mode from plane, by it with reference to known, Test handler 100 is for comprising test pallet 110, loading attachment 120, all hot cell (SOAKCHAMBER) 130, test cabinet (TESTCHAMBER) 140, moving back equal hot cell (DESOAKCHAMBER) 150, discharge mechanism 160 etc. and form.

Test pallet 110 has the multiple inserts can settling semiconductor element, and is circulated along the closed path C of regulation by multiple conveyer (not shown).

The not semiconductor element being after tested loaded into user tray (not shown) is loaded (loading) to the test pallet 110 being positioned at " loaded " position (LP:LOADINGPOSITION) by loading attachment 120.

Be equipped with equal hot cell 130, for before test each semiconductor element be loaded on the test pallet 110 that sends being carried out preheating or precooling by test environment conditions.

Be equipped with test cabinet 140, in equal hot cell 130, after preheating/precooling, be sent to for test the semiconductor element that the test pallet 110 of test position (TP:TESTPOSITION) loads.

Equal hot cell 150 is moved back in outfit, for the predetermined temperature of degree no problem when being returned to room temperature by cool by the semiconductor element heated that the test pallet 110 that arrives transmitting from test cabinet 140 of blowing loads or unload, or, by warm braw or heater etc., cooled semiconductor element heated and returned to the predetermined temperature of the degree of normal temperature or unlikely generation condensation.

Each semiconductor element is unloaded (unloading) to empty user tray from the test pallet 110 being arranged in unloading position (UP:UNLOADINGPOSITION) by discharge mechanism 160 by grade separation.

As mentioned above, semiconductor element along with the state being loaded into test pallet 110 through equal hot cell 120, test cabinet 130 and move back equal hot cell 140 and again lead to the closed path C in equal hot cell 120 successively through unloading position UP and " loaded " position LP and circulate.

On the other hand, there is in Test handler 100 test pallet 110 that multiple circulate along closed path C, and illustrate as front, equal hot cell 130 is prior is before test adjusted to the temperature meeting test condition by semiconductor element, and move back equal hot cell 150 after test completes in advance semiconductor element was reverted to predetermined temperature before unloading, this improves the process capacity of equipment to greatest extent in order to the running rate by raising test machine (TESTER) and discharge mechanism (UP).At this, as everyone knows, multiple test pallet 110 be contained in the lump equal hot cell 130 or move back equal hot cell 150 state under by parallel convey, within the time of parallel convey like this, the semiconductor element being loaded into test pallet 110 rests on equal hot cell 130 and moves back in equal hot cell 150 and is achieved temperature adjustment.

In some technology of relevant Test handler 100 described above, the present invention relates to a kind of by moving back in equal hot cell 150 technology each semiconductor element being reverted to normal temperature or predetermined temperature and suitably realized to make the unloading operation after this carried out, this part is described in more detail.

If the semiconductor element carrying out at low temperatures testing directly to be sent to open unloading position of giving outside air, then likely there is condensation vapor in the surface of semiconductor element because contacting with the air of normal temperature, thus semiconductor element is caused damage, and when the pad portion of discharge mechanism clamping semiconductor element, the quality of commodity may be made to drop because of the remained on surface pad print of semiconductor element.

And when at high temperature carrying out testing, if the semiconductor element of high temperature is directly sent to unloading position, then exists and may cause the pad portion fusing of discharge mechanism or the hidden danger of bonding because of the heat of high temperature residuing in semiconductor element.

Therefore be necessary move back equal hot cell 150 by forming and the semiconductor element be completed is reverted to normal temperature or predetermined temperature as previously mentioned.For this reason, as shown in Figure 2, the inside, equal hot cell 150 of moving back being formed in Test handler 100 in prior art has heater 170, fan 180 and direction plate 190.At this, direction plate 190 is that the air in order to will be blown afloat by fan is guided towards predetermined direction and is equipped with.

Heater 170 is provided to the underside area of moving back inner space, equal hot cell 150, and be equipped with fan 180 be in order to along test pallet 110 side to will be obtained by heater 170 heat air from downside upward side to supply.According to this formation, be that heater 170 and fan 180 work the temperature improving and be positioned at the semiconductor element moving back inside, equal hot cell 150 when low-temperature test, and when high temperature test be the temperature only had fan 180 to work and circulated by inner air to reduce semiconductor element, or also can reduce temperature by a small amount of cryogenic gas of supply.

But, be but expand the size of test pallet for improving process capacity recently, and along with the shortening of testing time, shorten test pallet in consideration and stay in the time of moving back equal hot cell.

If but the prior art according to Fig. 2, scatter and each semiconductor element of each semiconductor element meta in the lower portion close to heater 170 that be loaded into the whole region of test pallet 110 can revert to required temperature within the predetermined short time though just can produce, but relatively can not revert to temperature required deviation in the predetermined short time away from each semiconductor element being positioned at upper portion of heater 170.In particular, why when low-temperature test, the heat of heater 170 successfully can not be passed to the upper portion of test pallet 110, be because the interval be contained between each test pallet moving back inside, equal hot cell 150 is narrow, to such an extent as to heat successfully cannot be delivered to the upper portion of the test pallet 110 that size has expanded.

To solve problem as above, just time of wanting extended testing system pallet to stay in move back equal hot cell (test pallet move back soaking chamber interior walk abreast mobile in time of stopping), but elongatedly will the process capacity of equipment be dropped the circulation timei of test pallet in this case.If but therefore to expand the inner space of moving back equal hot cell, thus but the time of staying of extended testing system pallet can be contained in the number of the test pallet moving back equal hot cell by increase and maintain process capacity, certainly needless to say, the problem that additionally must make the production cost rising caused by test pallet also will produce in the maximization of then equipping.

Therefore, in order to guarantee again to move back the function in equal hot cell while maintaining existing equipment size, the research team of the applicant has attempted increasing the capacity of heater or setting up the method etc. of heater/fan, but never obtain may for satisfied result.

Summary of the invention

For solving the problem, the object of the present invention is to provide a kind of air moving back soaking indoor by utilizing special passage to make to be circulated, thus each semiconductor element in the whole region being loaded into test pallet can be made to return to temperature required technology equably.

Test handler according to the present invention comprises as mentioned above: test pallet, is transmitted along predetermined circulating path; Loading attachment, loads semiconductor element to described test pallet; Equal hot cell, after having completed the test pallet of the loading of semiconductor element in collecting by described loading attachment, has carried out preheating/precooling according to test environment conditions to each semiconductor element; Test cabinet, for supporting the test of each semiconductor element that the test pallet from described equal hot cell loads; Moving back equal hot cell, for making each semiconductor element of loading on the test pallet come through described test cabinet revert to predetermined temperature, and a sidewall being formed with the passage that can make air movement along the vertical direction; EGR, is able to be circulated by described passage for the air moving back soaking chamber interior described in making; And discharge mechanism, move back from described the semiconductor element that the test pallet in equal hot cell loads for unloading.

The side of described passage plays a role as sucking the suction inlet of air from described inside of moving back equal hot cell, opposite side plays a role as discharging the outlet of air to described inside of moving back equal hot cell, described EGR work for the air moving back soaking chamber interior described in making be inhaled into by described suction inlet after be discharged by described outlet.

Described EGR comprises: the suction fan being incorporated into described suction inlet side; And be incorporated into the discharge fan of described outlet side.

Described outlet is multiple, and described discharge fan is also equipped with multiple.

Also comprise the heater of the upper-side area of moving back soaking chamber inner space described in being positioned at, to move back the inside in equal hot cell described in heating.

Be formed with the door that the described side wall surface moving back equal hot cell described in described passage can be the inside for moving back equal hot cell described in opening and closing.

Preferably, also comprise when opening described door, for isolating the block device of described heater and operator.

Described block device comprises: the barrier film of moving back the inside in equal hot cell described in being provided to opening or closing; And be arranged at the propeller of described door, for the described barrier film of promotion.

Following effect is then had according to the present invention as above.

The first, because each semiconductor element being loaded into the whole region of test pallet can revert to required temperature within the predetermined short time, thus there is the effect that the stability of equipment and reliability are improved.

The second, be passage owing to not utilizing special passage by door flexible utilization, therefore can remain existing specification by untouched for the specification of Test handler, and be suitable for the present invention existing weaponry and equipment to be carried out improveing also easily realizing.

Accompanying drawing explanation

Fig. 1 is the conceptual plane about the Test handler under prior art.

Fig. 2 is for being usually applicable to the schematic configuration diagram moving back soaking chamber interior of Test handler shown in Fig. 1.

Fig. 3 is the conceptual plane about the Test handler according to the embodiment of the present invention.

Fig. 4 a is about forming the approximate three-dimensional map moving back the door of a sidewall in equal hot cell.

Fig. 4 b illustrates the approximate three-dimensional map moving back in equal hot cell the state being combined with suction fan and discharging fan.

Fig. 4 c is the approximate three-dimensional map about the door according to another example.

Fig. 5 is the conceptual front elevation about the door in Fig. 4.

Fig. 6 is the reference figure for illustration of the main action about the Test handler in Fig. 3.

Fig. 7 be about Test handler major part according to another embodiment of the present invention with reference to figure.

The reference diagram that Fig. 8 a to 8c is the effect for illustration of the major part about Test handler shown in Fig. 7.

Fig. 9 is the skeleton diagram about the Test handler major part according to further embodiment of this invention.

Symbol description:

300: Test handler 310: test pallet

320: loading attachment 330: all hot cells

340: test cabinet 350: move back equal hot cell

351: door 351a: passage

351a-1: suction inlet 351a-2a ~ 351a-2f: outlet

360: EGR 361: suction fan

362a ~ 362f: discharge fan 370: heater

380: discharge mechanism 790: block device

791: barrier film 792: propeller

Detailed description of the invention

Illustrate as above according to a preferred embodiment of the invention referring to accompanying drawing, and the terseness in order to illustrate, explanation involved in background technology is then omitted or reduction as far as possible.

Fig. 3 is the conceptual plane about the Test handler 300 according to the embodiment of the present invention.

According to the Test handler 300 of the present embodiment for comprising test pallet 310, loading attachment 320, all hot cell 330, test cabinet 340, moving back equal hot cell 350, EGR 360, heater 370 and discharge mechanism 380 etc. and form.

As above during some are formed, due to test pallet 310, loading attachment 320, all hot cell 330, test cabinet 340 and discharge mechanism 380 with in background technology illustrated by identical, therefore the description thereof will be omitted.

Forming the door 351 moving back a sidewall in equal hot cell 350 is for the inside in equal hot cell 350 is moved back in opening and closing and be equipped with, as shown in fig. 4 a, the passage 351a (with reference to dotted line) that can make air movement is along the vertical direction formed outside it and between inner face, and as shown in Figure 5, its exterior side has heat-barrier material 351b.At this, suction inlet 351a-1 as the upside of passage 351a be in order to suck the air that heats by heater 370 and be only formed with, as outlet 351a-2a, 351a-2b, 351a-2c, 351a-2d, 351a-2e, 351a-2f of the downside of passage 351a then in order to discharged being discharged equably by the top and the bottom, side of test pallet 310 by the air heated and be formed at upper and lower side multiple can be made.Certainly, this outlet 351a-2a, 351a-2b, 351a-2c, 351a-2d, 351a-2e, 351a-2f also can as shown in reference to figure Fig. 4 c, zoning be only a larger hole H-shaped is formed in the interior sidewall surface of a 351A after each discharge fan is set.

As shown in Figure 4 b, EGR 360 is able to be undertaken circulating being equipped with by passage 351a to make the air moving back inside, equal hot cell 351, can comprise the suction fan 361 that is incorporated into suction inlet 351a-1 side and is incorporated into multiple discharge fan 362a ~ 362f of each outlet 351a-2a, 351a-2b, 351a-2c, 351a-2d, 351a-2e, 351a-2f side and forms.As long as because the one party formed according to embodiment in this suction fan 361 and discharge fan 362a ~ 362f can realize being circulated by the air of passage 351a, therefore this situation also can be paid attention to as another embodiment of the present invention fully.Further, suction fan and discharge the number of fan and can have some change according to other heaters do not related in the size of the structure of equipment, air quantity, test pallet and the present invention and whether walking abreast of fan in position.That is, although be only provided with a suction fan 361 owing to forming the restriction of position in this example, but also by two or more with being in series or in parallel to form, the number of discharging fan can also can be increased and decreased.

Heater 370 is equipped with to heat the inside of moving back equal hot cell 350, is positioned at the upper-side area of moving back inner space, equal hot cell 350.Why like this heater 370 is arranged at upper-side area, be because be conducive to guaranteeing installation space compared with other regions.If arrange heater 370 in parts such as sides, the problem of the large palpulus increase of equipment and so on may be there is.And also can be presented as shown in Figure 6, add that in the rear end of heater 370 blowing fan 390 is set, will be promptly sent to suction fan 361 side by the heat heated.

With reference to Fig. 6, the work about the major part with Test handler 300 as constructed as above is described.

Be by heater 370, the upper-side area of moving back inside, equal hot cell 350 is heated during low-temperature test, to be fed to equably by passage 351a in the process of the top and the bottom, side of each test pallet 310 along with the work of suction fan 361 and each discharge fan 362a ~ 362f by the air that heats and to contact with each semiconductor element, to make each semiconductor element in the whole region being loaded into test pallet 310 rise to required temperature equably, thus each semiconductor element is reverted to the temperature of expectation within the predetermined short time.

Obviously, be under the out-of-work state of heater 370, only have suction fan 361 and each discharge fan 362a ~ 362f to carry out work during high temperature test, and because the air of normal temperature is now also in the top and the bottom, side being supplied in each test pallet 110 equably, each semiconductor element in the whole region being loaded into test pallet 110 thus can be made to be reduced to required temperature equably.

Further and also can comprise for operator being isolated from the heat that heater produces during at door capable of being opened the block device protecting operator under formation as above according to Test handler of the present invention.This is described with reference to Fig. 7.

As shown in the partial perspective view of Fig. 7, block device 790 comprises barrier film 791 and propeller 792.

Barrier film 791 for having the Square consisting of two isosceles right-angled triangles shape of enough width that operator can be cut off from heater, and is incorporated into opening or closing by hinge H and moves back above equal hot cell 750.

Propeller 792 is equipped with in order to the upper part promoting barrier film 791, is arranged at the internal face of door 751.

Then with reference to the effect of the schematically sectional side view explanation block device 790 of Fig. 8 a to Fig. 8 c.

As shown in Figure 8 a, under the state of door 751 closedown, propeller 792 supports and is in folding barrier film 791.If operator's door capable of being opened 751 is just as shown in Figure 8 b, propeller 792 also together the moving direction of propylaeum 751 retreat mobile (being that benchmark retreats with barrier film) and rely on deadweight to launch to make barrier film 791.Therefore the barrier film 791 launched can be relied on to be isolated from heater 770 by operator W.That is, due to when operator as required door capable of being opened 751 when may be passed to operator because of the high temperature air heated by heater and operator is scalded, therefore under the heat of heater 770, operator to be protected.After this be as shown in Figure 8 c when operator W closes door 751, because propeller 792 will promote the upper part of barrier film 791 in advance, therefore barrier film 791 will fold again.

On the other hand, as shown in Figure 9, the present invention can also with by being equipped with heater 991 separately again at the lower area moving back inner space, equal hot cell 950 and fan 992 combines to make the prior art by the air heated is supplied from downside to upside.And when taking the formation as Fig. 9 like this, the applicant has confirmed to be taken as same as the prior art by the overall specification of Test handler, the temperature that simultaneously also can realize the semiconductor element of desired magnitude when low-temperature test has risen.

As mentioned above, of the present invention illustrating is completed according to the embodiment with reference to accompanying drawing, but due to above-described embodiment be only enumerate preference of the present invention to be described, therefore can not be interpreted as that the present invention is only confined to above-described embodiment, interest field of the present invention is interpreted as claims and equivalent categories thereof.

Claims

1. a Test handler, is characterized in that, comprising:

Test pallet, is transmitted along predetermined circulating path;

Loading attachment, loads semiconductor element to described test pallet;

Equal hot cell, after having completed the test pallet of the loading of semiconductor element in collecting by described loading attachment, has carried out preheating/precooling according to test environment conditions to each semiconductor element;

Test cabinet, for supporting the test of each semiconductor element that the test pallet from described equal hot cell loads;

Move back equal hot cell, for each semiconductor element that the test pallet come through described test cabinet loads is reverted to predetermined temperature, and on a sidewall, be formed with the passage that can make air movement;

EGR, the air moving back soaking chamber interior described in making is able to be circulated by described passage; And

Discharge mechanism, moves back from described the semiconductor element that the test pallet in equal hot cell loads for unloading

The side of described passage is as moving back the suction inlet of the air of soaking chamber interior described in sucking and playing a role, and opposite side plays a role as outlet,

Described EGR make air be connected to along moving back the inside in equal hot cell, described suction inlet and described outlet described in process described in move back the air of the inside in equal hot cell circulating path circulate.

2. Test handler as claimed in claim 1, it is characterized in that, described passage is formed along the vertical direction,

Described suction inlet is positioned at upside compared to described outlet.

3. Test handler as claimed in claim 2, it is characterized in that, described EGR comprises:

Be incorporated at least one suction fan of described suction inlet side; And

Be incorporated at least one discharge fan of described outlet side.

4. Test handler as claimed in claim 3, is characterized in that, also comprise the primary heater of the upper-side area of moving back soaking chamber inner space described in being positioned at, to move back the inside in equal hot cell described in heating,

Described primary heater is positioned at top compared to described test pallet.

5. Test handler as claimed in claim 4, is characterized in that, during low-temperature test, described primary heater, at least one suction fan described and at least one discharge fan described all work,

During high temperature test, described primary heater quits work.

6. Test handler as claimed in claim 4, is characterized in that, also comprise the secondary heater of the lower area moving back soaking chamber inner space described in being configured at,

Described secondary heater is positioned at below compared to described test pallet.

7. Test handler as claimed in claim 1, it is characterized in that, described passage is formed at the door of the inside for moving back equal hot cell described in opening and closing, and between the outside being formed at described door and inner face,

Described door has heat-barrier material at the exterior side of described door.