CN105032776B - Testing, sorting machine - Google Patents
Testing, sorting machine Download PDFInfo
- Publication number
- CN105032776B CN105032776B CN201510516354.6A CN201510516354A CN105032776B CN 105032776 B CN105032776 B CN 105032776B CN 201510516354 A CN201510516354 A CN 201510516354A CN 105032776 B CN105032776 B CN 105032776B
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- Prior art keywords
- test
- hot cell
- semiconductor element
- test pallet
- equal hot
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The present invention relates to a kind of testing, sorting machine.According to the present invention, there is provided it is a kind of moving back equal hot cell a side wall formed air circulation passage, move back each semiconductor element loaded on test pallet in soaking room that will be displaced into and equably revert to normal temperature or predetermined temperature, and the air for moving back soaking chamber interior is circulated by passage by being equipped with special EGR, so as to improve the technology of the stability of equipment and reliability.
Description
The application is " to be surveyed for the application for a patent for invention of on 2 6th, 2013, Application No. 201310047421.5 applying date
The divisional application of examination separator ".
Technical field
The present invention relates to it is a kind of for support outbound to produce semiconductor element before carried out semiconductor element survey
The testing, sorting machine of examination.
Background technology
Testing, sorting machine is that a kind of semiconductor element to by particular manufacturing process manufacture is supported, and is allowed to pass through
Test machine is tested, and semiconductor element is loaded into the equipment of user tray according to test result by grade separation.
Fig. 1 is to watch in the state of standing vertically the semiconductor element of loading being supplied in into survey in test pallet from plane
Test-run a machine side, the existing testing, sorting machine 100 of taking side docking mode concept map, by it with reference to understanding, testing, sorting
Machine 100 is to include test pallet 110, loading attachment 120, equal hot cell (SOAK CHAMBER) 130, test cabinet (TEST
CHAMBER) 140, equal hot cell (DESOAK CHAMBER) 150, discharge mechanism 160 etc. are moved back and is formed.
Test pallet 110 has the multiple inserts that can dispose semiconductor element, and (is not schemed by multiple conveyers
Show) and circulated along defined closed path C.
The semiconductor element not after tested that loading attachment 120 will be loaded into user tray (not shown) loads
(loading) arrive and be located at " loaded " position (LP：LOADING POSITION) test pallet 110.
Equal hot cell 130 is equipped with, for being led before test by be loaded on the test pallet 110 sent half and half
Volume elements part is preheated by test environment conditions or precooling.
Test cabinet 140 is equipped with, test position (TP is sent to after preheating/precooling in equal hot cell 130 for test：
TEST POSITION) test pallet 110 on the semiconductor element that is loaded.
Equal hot cell 150 is moved back in outfit, for by blow by from test cabinet 140 transmit and to test pallet 110 on institute
The heated semiconductor element loaded is cooled down and returns to the pre- constant temperature for the degree being had no problem when room temperature or unloading
Degree, or, cooled semiconductor element is heated to return to normal temperature or will not produce by warm wind or heater etc.
The predetermined temperature of the degree of raw condensation.
Discharge mechanism 160 is from positioned at unloading position (UP：UNLOADING POSITION) test pallet 110 in by half and half
Conductor element is unloaded (unloading) by grade separation to empty user tray.
As described above, semiconductor element passes through equal hot cell 120, test cabinet along to be loaded into the state of test pallet 110
130 and move back equal hot cell 140 and successively by unloading position UP and " loaded " position LP and again lead to equal hot cell 120 closed path
C is circulated.
On the other hand, there are multiple test pallets 110 circulated along closed path C in testing, sorting machine 100, and as before
It is stated that semiconductor element is adjusted to the temperature that meets test condition by equal hot cell 130 in advance before test, and move back equal hot cell
Semiconductor element is reverted to predetermined temperature by 150 in advance after the completion of test before unloading, and this is to be tested by improving
The running rate of machine (TESTER) and discharge mechanism (UP) and improve the processing capacity of equipment to greatest extent.Here, such as many institute's weeks
Know, multiple test pallets 110 are transmitted parallel in the state of being contained in equal hot cell 130 in the lump or moving back equal hot cell 150, such
In the time transmitted parallel, the semiconductor element for being loaded into test pallet 110 rests on equal hot cell 130 and moved back in equal hot cell 150
And it is achieved temperature adjustment.
In some technologies of relevant testing, sorting machine 100 as described above, the present invention relates to one kind by moving back equal hot cell
Each semiconductor element is reverted into normal temperature or predetermined temperature so that the unloading operation hereafter carried out is able to what is be appropriately carried out in 150
Technology, this part is illustrated in more detail.
If the semiconductor element tested at low temperature is routed directly into the open unloading position for giving outside air,
It is possible to have condensation vapor because of the air contact with normal temperature in the surface of semiconductor element, so as to cause to damage to semiconductor element
Evil, and in the pad portion of discharge mechanism clamping semiconductor element, commodity may be made because the remained on surface pad of semiconductor element prints
Quality drop.
And in the case of being tested at high temperature, if the semiconductor element of high temperature is routed directly into unloading position,
In the presence of the hidden danger that because residuing in the heat of high temperature of semiconductor element the pad portion of discharge mechanism may be caused to melt or bond.
It is therefore desirable to move back equal hot cell 150 by composition as previously mentioned to revert to the semiconductor element being completed
Normal temperature or predetermined temperature.Therefore, as shown in Fig. 2 the moving back inside equal hot cell 150 of testing, sorting machine 100 is formed in the prior art
With heater 170, fan 180 and direction plate 190.Here, direction plate 190 be in order to by by the air that fan is blown afloat towards pre-
Determine direction guiding and be equipped with.
Heater 170 is provided to the underside area for moving back the equal inner space of hot cell 150, and it is in order to which edge is surveyed to be equipped with fan 180
The side direction of pallet 110 is tried by side direction is supplied upward from downside by the air that heater 170 is heated.According to this structure
Into work the semiconductor element improved positioned at moving back inside equal hot cell 150 in low-temperature test for heater 170 and fan 180
Temperature, and inner air is circulated to reduce semiconductor element to only have fan 180 to work in high temperature test
Temperature, or temperature can also be reduced by supplying a small amount of cryogenic gas.
However, be the size that test pallet is expanded for raising processing capacity recently, and with the contracting of testing time
It is short, the time for moving back equal hot cell is stayed in consideration shortening test pallet.
But if prior art according to Fig. 2, distribution will be produced and be loaded into the whole area of test pallet 110
Though each semiconductor element of each semiconductor element middle position in domain in the lower portion close to heater 170 can be in the predetermined short time
Required temperature is inside reverted to, but each semiconductor element positioned at upper portion for being relatively far from heater 170 but can not
The deviation of temperature needed for being reverted within the predetermined short time.In particular, why in low-temperature test heater 170 heat
The upper portion of test pallet 110 can not be successfully transferred to, is because being contained in each test pallet moved back inside equal hot cell 150
Between interval it is narrow, so that it cannot heat to be successfully sent to the upper portion for the test pallet 110 that size has expanded.
To solve the problems, such as above, just to want extended testing system pallet to stay in the time for moving back equal hot cell, (test pallet is moving back
Residence time during soaking chamber interior is mobile parallel), but the circulation time of test pallet elongated will make equipment in this case
Processing capacity drop.If but therefore to expand the inner space for moving back equal hot cell, so as to the residence time of extended testing system pallet
But the number for the test pallet for moving back equal hot cell can be contained in further through increase and maintain processing capacity, then the maximization equipped is not from
It must say, must additionally make the problem of production cost caused by test pallet rises will also produce.
Therefore, in order to maintain it is existing equipment size while and can ensure to move back the function in equal hot cell, the applicant's grinds
Study carefully method that team has attempted to increase the capacity of heater or set up heater/fan etc., but it may be satisfied never to obtain
As a result.
The content of the invention
To solve the above problems, make to move back in soaking room by using special passage it is an object of the invention to provide a kind of
Air circulated, each semiconductor element of the whole region so as to make to be loaded into test pallet equably recovers to institute
Need the technology of temperature.
Included as described above according to the testing, sorting machine of the present invention：Test pallet, transmitted along predetermined circulating path；
Loading attachment, semiconductor element is loaded to the test pallet；Equal hot cell, for having been completed in collecting by the loading attachment
After the test pallet of the loading of semiconductor element, each semiconductor element is carried out according to test environment conditions to preheat/precooling；Survey
Room is tried, for supporting the test from each semiconductor element loaded on the test pallet in hot cell；Equal hot cell is moved back, is used
Predetermined temperature, and a side wall are reverted in each semiconductor element loaded on the test pallet for making to come by the test cabinet
On formed with the passage that air can be made to move along the vertical direction；EGR, for obtaining the air for moving back soaking chamber interior
To be circulated by the passage；And discharge mechanism, filled for unloading on the test pallet for moving back equal hot cell
The semiconductor element of load.
The side of the passage plays a role as the suction inlet from the inside suction air for moving back equal hot cell, another
Side plays a role as the outlet of air is discharged to the inside for moving back equal hot cell, and the EGR works as that can make institute
State move back soaking chamber interior air be inhaled into by the suction inlet after be discharged by the outlet.
The EGR includes：It is incorporated into the suction fan of the suction inlet side；And it is incorporated into the outlet side
Discharge fan.
The outlet to be multiple, and the discharge fan be also equipped with it is multiple.
Also include the heater positioned at the upper-side area for moving back soaking chamber inner space, to move back equal hot cell described in heating
It is internal.
Can be used to being opened and closed described to move back equal hot cell formed with the side wall for moving back equal hot cell described in the passage
Inside door.
Preferably, in addition to when opening the door, for isolating the block device of the heater and operator.
The block device includes：It can be opened and closed to be provided to the barrier film of the inside for moving back equal hot cell；And it is arranged at institute
The propeller of door is stated, for promoting the barrier film.
Then there is following effect according to present invention as above.
First, it can recover due to being loaded into each semiconductor element of whole region of test pallet within the predetermined short time
For required temperature, thus the effect for thering is the stability of equipment and reliability to be improved.
Second, due to being passage by door flexible utilization not using special passage, therefore can be by testing, sorting machine
Specification is untouched to remain existing specification, and is applicable the present invention so that existing weaponry and equipment is improved also into easily realization.
Brief description of the drawings
Fig. 1 is the conceptual plan on the testing, sorting machine under prior art.
Fig. 2 is the schematic configuration diagram for moving back soaking chamber interior for being commonly available to testing, sorting machine shown in Fig. 1.
Fig. 3 is the conceptual plan on testing, sorting machine according to embodiments of the present invention.
Fig. 4 a are the approximate three-dimensional maps on forming the door for the side wall for moving back equal hot cell.
Fig. 4 b are the approximate three-dimensional map for showing to move back the state that suction fan is combined with equal hot cell and discharges fan.
Fig. 4 c are the approximate three-dimensional maps on the door according to another.
Fig. 5 is the conceptual front elevation on the door in Fig. 4.
Fig. 6 is the reference picture for illustrating the main action on the testing, sorting machine in Fig. 3.
Fig. 7 is the reference picture on testing, sorting machine major part according to another embodiment of the present invention.
Fig. 8 a to 8c are the reference chart for illustrating the effect of the major part on testing, sorting machine shown in Fig. 7.
Fig. 9 is the skeleton diagram on the testing, sorting machine major part according to further embodiment of this invention.
Symbol description：
300：Testing, sorting machine 310：Test pallet
320：Loading attachment 330：Equal hot cell
340：Test cabinet 350：Move back equal hot cell
351：Door 351a：Passage
351a-1：Suction inlet 351a-2a~351a-2f：Outlet
360：EGR 361：Suction fan
362a~362f：Discharge fan 370：Heater
380：Discharge mechanism 790：Block device
791：Barrier film 792：Propeller
Embodiment
Explanation is as described above according to a preferred embodiment of the invention referring to the drawings, and for the terseness of explanation,
Involved explanation is then omitted or reduced as far as possible in background technology.
Fig. 3 is the conceptual plan on testing, sorting machine 300 according to embodiments of the present invention.
It is comprising test pallet 310, loading attachment 320, equal hot cell 330, survey according to the testing, sorting machine 300 of the present embodiment
Examination room 340, move back equal hot cell 350, EGR 360, heater 370 and discharge mechanism 380 etc. and form.
As above in some compositions, due to test pallet 310, loading attachment 320, equal hot cell 330, test cabinet 340 and unloading
Device 380 is illustrated identical with background technology, therefore the description thereof will be omitted.
The door 351 for forming a side wall for moving back equal hot cell 350 is for the inside in equal hot cell 350 is moved back in opening and closing and is equipped with, such as
Shown in Fig. 4 a, formed with the passage 351a (with reference to dotted line) that air can be made to move along the vertical direction between its outside and inner face, and
As shown in figure 5, its exterior side has heat-barrier material 351b.Here, the suction inlet 351a-1 as passage 351a upside be for
Suction is only formed with one by the air that heater 370 is heated, and the outlet 351a- of the downside as passage 351a
2a, 351a-2b, 351a-2c, 351a-2d, 351a-2e, 351a-2f are then in order to which the heated air for making to be discharged leads to
Equably discharge and in upper and lower side formed with multiple the side top and the bottom for crossing test pallet 310.Certainly, this outlet
351a-2a, 351a-2b, 351a-2c, 351a-2d, 351a-2e, 351a-2f can also be as shown in reference picture Fig. 4 c, and zoning is
Only each discharge fan will be set after larger hole H-shaped Cheng Yumen 351A interior sidewall surface.
As shown in Figure 4 b, EGR 360 is in order that the air moved back inside equal hot cell 351 is able to enter by passage 351a
What row was circulated and was equipped with, it can include and be incorporated into the suction fan 361 of suction inlet 351a-1 sides and be incorporated into each outlet 351a-
Multiple discharge fan 362a~362f of 2a, 351a-2b, 351a-2c, 351a-2d, 351a-2e, 351a-2f side and form.By
It can be achieved in the one party that as long as this suction fan 361 is formed according to embodiment and is discharged in fan 362a~362f logical
Passage 351a air circulation is crossed, therefore the situation can also be used as another embodiment of the present invention and fully pay attention to.
Also, the number and position of suction fan and discharge fan can be according to the structure of equipment, air quantity, the size of test pallet and this hairs
In bright without reference to other heaters and fan whether parallel and have some change.That is, although due to forming position in this example
Limitation and be only provided with a suction fan 361, but can also can also increase by two or more with being in series or in parallel to form
Emission reduction goes out the number of fan.
Heater 370 is to move back the inside in equal hot cell 350 in order to heat and be equipped with, positioned at moving back the equal inner space of hot cell 350
Upper-side area.Why heater 370 is so arranged at upper-side area, is because compared with other regions it is advantageously ensured that setting
Between being empty.If heater 370 is set in place of side etc., it would be possible to the problem of big palpulus increase of equipment etc be present.And
It can be presented as shown in fig. 6, being added in the rear end of heater 370 and blowing fan 390 is set, heated heat is rapid
It is sent to the side of suction fan 361 in ground.
Reference picture 6 illustrates the work on the major part with testing, sorting machine 300 as constructed as above.
Heated during low-temperature test for the upper-side area that makes to move back inside equal hot cell 350 by heater 370, it is heated
Air is uniformly supplied to each survey with suction fan 361 and each discharge fan 362a~362f work by passage 351a
Contacted during the side top and the bottom for trying pallet 310 with each semiconductor element, so as to be loaded into the whole of test pallet 310
Each semiconductor element in region equably rises to required temperature, so as within the predetermined short time that each semiconductor element is extensive
It is desired temperature again.
Obviously, there was only suction fan 361 and each discharge fan in the state of being stopped during high temperature test for heater 370
362a~362f is operated, and because the air of normal temperature is now also on the side of each test pallet 110 is equably supplied in
Lower part, thus each semiconductor element for the whole region that can make to be loaded into test pallet 110 be equably reduced to it is required
Temperature.
Further it can also be included being used to open under as described above form according to the testing, sorting machine of the present invention
It will be isolated during door in heat caused by operator from heater to protect the block device of operator.This reference picture 7 is entered
Row explanation.
As shown in Fig. 7 partial perspective view, block device 790 includes barrier film 791 and propeller 792.
Barrier film 791 is the corner plate shape with the enough width that can be cut off operator from heater, and
It can be opened and closed to be incorporated into by hinge H and move back above equal hot cell 750.
Propeller 792 is equipped with to promote the upper part of barrier film 791, is arranged at the internal face of door 751.
Then reference picture 8a to Fig. 8 c schematically sectional side view illustrates the effect of block device 790.
As shown in Figure 8 a, barrier film 791 of the support of propeller 792 in folding in the state of the closing of door 751.If make
Dealer opens door 751 just as shown in Figure 8 b, propeller 792 also together the moving direction of propylaeum 751 retreat it is mobile (using barrier film as
Benchmark retreats) so that barrier film 791 is deployed by deadweight.Therefore the barrier film 791 of expansion can be relied on operator W from adding
Hot device 770 is isolated.That is, may be because being heated by heater in the case of due to opening door 751 as needed as operator
High temperature air be transferred to operator and scalded operator, therefore will be under the heat of heater 770 by operator
Protect.Hereafter it is as shown in Figure 8 c, because propeller 792 will promote barrier film in advance when operator W closes door 751
791 upper part, therefore barrier film 791 will fold again.
On the other hand, as shown in figure 9, the present invention can also with by moving back the lower area of the equal inner space of hot cell 950
Heater 991 separately and fan 992 are equipped with again so that the heated air prior art of side supply on the side under combines
Together.And in the case where so taking such as Fig. 9 composition, the applicant has confirmed that can be by the entirety of testing, sorting machine
Specification is taken as same as the prior art, while can also be realized in low-temperature test in the temperature of semiconductor element of desired magnitude
Rise.
As described above, illustrating for the present invention is completed according to embodiment referring to the drawings, yet with above-mentioned
Embodiment be only enumerate the present invention preference illustrate, therefore it is not intended that the present invention be limited only to it is above-mentioned
Embodiment, the interest field of the present invention is interpreted as claims and its equivalent categories.
Claims (4)
- A kind of 1. testing, sorting machine, it is characterised in that including：Test pallet, transmitted along predetermined circulating path；Loading attachment, semiconductor element is loaded to the test pallet；Equal hot cell, for after the test pallet for the loading for having completed semiconductor element by the loading attachment is housed, root Each semiconductor element is carried out according to test environment conditions to preheat/precooling；Test cabinet, for supporting the test from each semiconductor element loaded on the test pallet in hot cell；Equal hot cell is moved back, it is pre- for each semiconductor element loaded on the test pallet come by the test cabinet to be reverted to Constant temperature degree, and formed along the vertical direction formed with the passage that can move air, the passage in a side wall；The primary heater above compared to the test pallet, to move back the inside in equal hot cell described in heating；Compared to the underlying secondary heater of the test pallet, to move back the inside in equal hot cell described in heating；EGR, the air for moving back soaking chamber interior is set to be circulated by the passage；AndDischarge mechanism, for unloading the semiconductor element loaded on the test pallet for moving back equal hot cell；The upside of the passage plays a role as sucking the suction inlet of the air for moving back soaking chamber interior, described logical The downside in road plays a role as outlet,The EGR makes air circulation so that the air heated by the primary heater after the passage by supplying The extremely test pallet,The side wall for moving back equal hot cell is door for being opened and closed the inside for moving back equal hot cell, and the outside of the door and inner face Between formed with the passage,The EGR includes at least one discharge fan for being incorporated into the outlet side,The discharge fan is arranged at the side surface direction for moving back the test pallet housed in soaking room.
- 2. testing, sorting machine as claimed in claim 1, it is characterised in that the EGR also includes：It is incorporated at least one suction fan of the suction inlet side.
- 3. testing, sorting machine as claimed in claim 2, it is characterised in that the primary heater, described during low-temperature test At least one suction fan and at least one discharge fan work,During high temperature test, the primary heater is stopped.
- 4. testing, sorting machine as claimed in claim 1, it is characterised in thatThe door has heat-barrier material in the exterior side of the door.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20120027344 | 2012-03-16 | ||
| KR10-2012-0027344 | 2012-03-16 | ||
| KR1020120116500A KR101968984B1 (en) | 2012-03-16 | 2012-10-19 | Side docking type test handler |
| KR10-2012-0116500 | 2012-10-19 | ||
| CN201310047421.5A CN103302037B (en) | 2012-03-16 | 2013-02-06 | Test handler |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310047421.5A Division CN103302037B (en) | 2012-03-16 | 2013-02-06 | Test handler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105032776A CN105032776A (en) | 2015-11-11 |
| CN105032776B true CN105032776B (en) | 2017-11-28 |
Family
ID=49453953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510516354.6A Active CN105032776B (en) | 2012-03-16 | 2013-02-06 | Testing, sorting machine |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101968984B1 (en) |
| CN (1) | CN105032776B (en) |
| TW (1) | TWI470246B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102058443B1 (en) * | 2014-03-03 | 2020-02-07 | (주)테크윙 | Test handler and circulation method of test trays in test handler |
| KR102120837B1 (en) * | 2014-04-18 | 2020-06-10 | (주)테크윙 | Test handler |
| KR102123052B1 (en) * | 2014-06-23 | 2020-06-15 | (주)테크윙 | Test handler |
| KR102120714B1 (en) | 2014-07-09 | 2020-06-17 | (주)테크윙 | Handler for testing semiconductor device |
| KR102123244B1 (en) | 2014-07-11 | 2020-06-17 | (주)테크윙 | Handler for testing semiconductor device and interface board for tester |
| CN104401078B (en) * | 2014-12-17 | 2017-03-22 | 南通大学 | Multilayer polylactic acid composite plate and preparation method thereof |
| KR102249575B1 (en) * | 2015-03-04 | 2021-05-10 | (주)테크윙 | Handler for testing semiconductor |
| KR102469918B1 (en) * | 2018-03-27 | 2022-11-23 | (주)테크윙 | Treatment chamber and handler comprising same |
| CN110764290A (en) * | 2019-10-30 | 2020-02-07 | 苏州精濑光电有限公司 | Detection mechanism |
| KR102200442B1 (en) * | 2020-04-13 | 2021-01-08 | (주)테크윙 | Test handler |
| KR102162575B1 (en) * | 2020-05-29 | 2020-10-20 | (주)테크윙 | Test handler |
| KR20210153787A (en) * | 2020-06-10 | 2021-12-20 | 세메스 주식회사 | Air flow control apparatus and test handler including the same |
| KR102419841B1 (en) * | 2020-10-20 | 2022-07-12 | 한국생산기술연구원 | Semiconductor test chamber |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105032776A (en) | 2015-11-11 |
| KR20130105265A (en) | 2013-09-25 |
| TW201341820A (en) | 2013-10-16 |
| KR101968984B1 (en) | 2019-08-26 |
| TWI470246B (en) | 2015-01-21 |
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