CN117558615B - Post-cleaning drying method for wafer loaded with wafer material box - Google Patents
Post-cleaning drying method for wafer loaded with wafer material box Download PDFInfo
- Publication number
- CN117558615B CN117558615B CN202311216092.2A CN202311216092A CN117558615B CN 117558615 B CN117558615 B CN 117558615B CN 202311216092 A CN202311216092 A CN 202311216092A CN 117558615 B CN117558615 B CN 117558615B
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- China
- Prior art keywords
- wafer
- drying
- material box
- wafers
- cleaning
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001035 drying Methods 0.000 title claims abstract description 74
- 239000000463 material Substances 0.000 title claims abstract description 54
- 238000004140 cleaning Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 11
- 235000012431 wafers Nutrition 0.000 claims description 187
- 239000007789 gas Substances 0.000 claims description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/06—Controlling, e.g. regulating, parameters of gas supply
- F26B21/10—Temperature; Pressure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/06—Controlling, e.g. regulating, parameters of gas supply
- F26B21/12—Velocity of flow; Quantity of flow, e.g. by varying fan speed, by modifying cross flow area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application relates to a method for drying a wafer loaded with a wafer material box after cleaning, which separates the wafer in the wafer material box loaded with the wafer from the wafer material box after cleaning, and then respectively dries the wafer and the wafer material box.
Description
Technical Field
The application belongs to the technical field of wafer production, and particularly relates to a method for drying wafers loaded with a wafer material box after cleaning.
Background
The wafer cassette is also known as Casstte and is capable of holding a large number of wafers, such as 30 wafers or 50 wafers. In the mass production of wafers, wafer cassettes are typically used to hold wafers for cleaning and drying. Because of the wafer cassettes, transport at different stations, cleaning and drying can be performed simultaneously with a large number of wafers.
However, in the drying process, the wafer material box usually has a complex structure, so that a lot of cleaning liquid remains, the drying time of the wafer material box is long, and under the same conditions, the wafer is already dried, but the wafer material box is not dried, so that when the wafer and the wafer material box are dried together, the temperature and the flow of the drying gas are limited due to the existence of the wafer, the drying of the wafer material box needs to be waited, the drying efficiency is low, and the drying effect is poor.
Disclosure of Invention
The invention aims to solve the technical problems that: in order to solve the defects in the prior art, the method for drying the wafer loaded with the wafer material box after cleaning is provided, and the drying efficiency is improved.
The technical scheme adopted for solving the technical problems is as follows:
A post-cleaning drying method for wafers loaded with a wafer cassette, comprising the steps of:
S1: cleaning a wafer material box loaded with wafers;
S2: after the cleaning is finished, separating the wafer from the wafer material box;
S3: respectively drying the wafer and the wafer material box, wherein the temperature and the flow of the drying gas of the wafer material box are higher than those of the wafer;
S4: and loading the dried wafer into a wafer material box.
Preferably, the post-cleaning drying method of the wafer loaded with the wafer cassette of the present invention, the wafer cassette is dried in an inclined manner.
Preferably, in the post-cleaning drying method for wafers loaded with the wafer cassettes of the present invention, the drying time of the wafers and the wafer cassettes in step S3 is the same as or different from the time allowed by the process.
Preferably, in the post-cleaning drying method for wafers loaded with the wafer cassettes of the present invention, the heights of the wafers are different when the wafers are dried.
Preferably, in the post-cleaning drying method for the wafer loaded with the wafer material box, when the wafer is separated from the wafer material box in the step S2, the wafer is ejected out of an outlet at the top of the wafer material box through the ejection block and then is placed on the wafer placement block, and the wafer placement block is correspondingly provided with the limiting groove for accommodating each wafer, so that the heights of the wafers are different during drying through the difference of the heights of the limiting grooves.
Preferably, in the post-cleaning drying method for a wafer loaded with a wafer cassette according to the present invention, when the wafer dried in step S4 is loaded into the wafer cassette, the temperature difference between the wafer and the wafer cassette is not more than 5 ℃.
Preferably, in the post-cleaning drying method for a wafer loaded with a wafer cassette according to the present invention, in the step S3, when the wafer cassette is dried, the wafer cassette is dried at a temperature higher than the temperature of the drying gas of the wafer, and then is dried at a temperature equal to the temperature of the drying gas of the wafer.
Preferably, in the post-cleaning drying method for wafers loaded with the wafer cassettes of the present invention, the drying gas is nitrogen.
Preferably, in the post-cleaning drying method for wafers loaded with wafer cassettes of the present invention, the drying of the wafers and the wafer cassettes in step S3 is performed in different drying tanks or in mutually isolated portions of the same drying tank.
The beneficial effects of the invention are as follows:
According to the method for drying the wafer loaded with the wafer material box after cleaning, the wafer in the wafer material box loaded with the wafer after cleaning is separated from the wafer material box, and then the wafer and the wafer material box are dried respectively, and the wafer material box is generally difficult to dry and the wafer is easier to dry, so that the temperature and the flow of the drying gas for the wafer material box are higher than those of the wafer during drying, and the wafer material box and the wafer can achieve the same drying effect in the same or similar time, and the drying efficiency and the drying effect are improved.
Drawings
The technical scheme of the application is further described below with reference to the accompanying drawings and examples.
FIG. 1 is a flow chart of a method for post-rinse drying of wafers loaded with a wafer cassette according to an embodiment of the present application;
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the scope of the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art in a specific case.
The technical scheme of the present application will be described in detail below with reference to the accompanying drawings in combination with embodiments.
Examples
The embodiment provides a method for drying wafers loaded with a wafer cassette after cleaning, as shown in fig. 1, comprising the following steps:
S1: cleaning a wafer material box loaded with wafers;
S2: after the cleaning is finished, separating the wafer from the wafer material box;
S3: respectively drying the wafer and the wafer material box, wherein the temperature and the flow of the drying gas of the wafer material box are higher than those of the wafer;
s4: and loading the dried wafer into a wafer material box, and then carrying out subsequent procedures.
According to the method for drying the wafer loaded with the wafer material box after cleaning, the wafer in the wafer material box loaded with the wafer after cleaning is separated from the wafer material box, and then the wafer and the wafer material box are dried respectively.
Further, the wafer material box is dried in an inclined mode, so that liquid on the wafer material box can drop after flowing.
Further, in the step S3, the drying time of the wafer and the wafer material box is the same, and by adjusting the temperature and the flow of the drying gas, the experiment verifies that the drying effect of the wafer and the wafer material box is consistent under the same time, and strong wind can be used for drying the wafer material box, but strong wind cannot be used for drying the wafer.
Further, when the wafers are dried, the heights of the wafers are different, for example, the wafers may be arranged to be staggered in height, or may be arranged to be gradually higher or lower in one direction.
And S2, when the wafer is separated from the wafer material box in the step S, the wafer is ejected out of an outlet at the top of the wafer material box through the ejection block and then is placed on the wafer placement block, the wafer placement block is correspondingly provided with limiting grooves for accommodating each wafer, and the heights of the limiting grooves are different, so that the heights of the wafers in the drying process are different.
Further, when the wafer dried in the step S4 is loaded into the wafer cassette, the temperature difference between the wafer and the wafer cassette is not more than 5 ℃. When the temperature is the same, the wafer material box can be prevented from being overhigh.
Further, in the step S3, when the wafer cassette is dried, the wafer cassette is dried at a temperature higher than the temperature of the drying gas of the wafer, and then is dried at a temperature equal to the temperature of the drying gas of the wafer. By the drying mode of firstly increasing and secondly decreasing, the temperature difference between the wafer and the wafer box after drying can be reduced.
Further, the drying gas is nitrogen. The use of nitrogen can prevent oxidation of the wafer.
Further, in the step S3, the drying of the wafer and the wafer cassette is performed in different drying tanks or in mutually isolated portions of the same drying tank.
With the above-described preferred embodiments according to the present application as a teaching, the worker skilled in the art could make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of claims.
Claims (5)
1. A method for post-cleaning drying of wafers loaded with a wafer cassette, comprising the steps of:
S1: cleaning a wafer material box loaded with wafers;
S2: after the cleaning is finished, separating the wafer from the wafer material box;
S3: drying the wafer and the wafer material box respectively, wherein the temperature and the flow of the drying gas of the wafer material box are higher than those of the wafer; when the wafers are dried, the wafers are different in height, and are arranged to be staggered in height or gradually changed in height in one direction; s4: loading the dried wafer into a wafer material box;
In the S2 step, when the wafer is separated from the wafer material box, the wafer is ejected out of an outlet at the top of the wafer material box through the ejection block and then is placed on the wafer placing block, the wafer placing block is correspondingly provided with a limiting groove for accommodating each wafer, and the heights of the wafers are different when the wafers are dried through the difference of the heights of the limiting grooves;
S3, when the wafer material box is dried in the step, firstly, drying is carried out at a temperature higher than the temperature of the drying gas of the wafer, and then, drying is carried out at a temperature equal to the temperature of the drying gas of the wafer;
In the step S3, the drying of the wafer and the wafer material box is carried out in different drying tanks or in mutually isolated parts of the same drying tank.
2. The post-cleaning drying method of wafers loaded with wafer cassettes as set forth in claim 1, wherein the wafer cassettes are dried in an inclined manner.
3. The post-cleaning drying method of wafer cassette loading wafer according to claim 1, wherein the drying time of wafer and wafer cassette in step S3 is the same as or different from the time allowed by the process.
4. The post-cleaning drying method of wafer cassette loading wafers as set forth in claim 1, wherein the temperature difference between the wafer and the wafer cassette is not more than 5 ℃ when the wafer dried in step S4 is loaded into the wafer cassette.
5. The post-cleaning drying method of wafers loaded with a wafer cassette according to claim 1, wherein the drying gas is nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311216092.2A CN117558615B (en) | 2023-09-19 | 2023-09-19 | Post-cleaning drying method for wafer loaded with wafer material box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311216092.2A CN117558615B (en) | 2023-09-19 | 2023-09-19 | Post-cleaning drying method for wafer loaded with wafer material box |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117558615A CN117558615A (en) | 2024-02-13 |
| CN117558615B true CN117558615B (en) | 2024-06-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311216092.2A Active CN117558615B (en) | 2023-09-19 | 2023-09-19 | Post-cleaning drying method for wafer loaded with wafer material box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117558615B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN219624368U (en) * | 2023-03-23 | 2023-09-01 | 江苏启微半导体设备有限公司 | Wafer drying mechanism and wafer cleaning and drying system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010058878A (en) * | 1999-12-30 | 2001-07-06 | 박종섭 | Wet station |
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- 2023-09-19 CN CN202311216092.2A patent/CN117558615B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN219624368U (en) * | 2023-03-23 | 2023-09-01 | 江苏启微半导体设备有限公司 | Wafer drying mechanism and wafer cleaning and drying system |
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| Publication number | Publication date |
|---|---|
| CN117558615A (en) | 2024-02-13 |
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| GR01 | Patent grant |