CN219624368U - Wafer drying mechanism and wafer cleaning and drying system - Google Patents
Wafer drying mechanism and wafer cleaning and drying system Download PDFInfo
- Publication number
- CN219624368U CN219624368U CN202320593541.4U CN202320593541U CN219624368U CN 219624368 U CN219624368 U CN 219624368U CN 202320593541 U CN202320593541 U CN 202320593541U CN 219624368 U CN219624368 U CN 219624368U
- Authority
- CN
- China
- Prior art keywords
- wafer
- drying
- box
- carrier
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a wafer drying mechanism and a wafer cleaning and drying system, wherein the wafer drying mechanism comprises: the drying chamber is provided with a vent hole for introducing drying gas; the limiting block is arranged at the bottom of the inner cavity of the drying chamber and is used for being arranged corresponding to the wafer box base and limiting and fixing the wafer box; and the bearing piece is positioned in the area surrounded by the limiting blocks and is used for supporting the wafer from the bottom so as to separate the wafer from the wafer box. According to the wafer drying mechanism, the wafer and the wafer box can be separated through the arrangement of the bearing piece and the limiting block, the two drying operations are not interfered with each other, water marks are prevented from being left on the surface of the wafer when water drops in a gap between the two drying operations are used for drying, and the cleanliness of the surface of the wafer is guaranteed.
Description
Technical Field
The utility model relates to the technical field of drying, in particular to a wafer drying mechanism. In addition, the utility model also relates to a wafer cleaning and drying system comprising the wafer drying mechanism.
Background
When cleaning and drying a semiconductor wafer, a series of steps such as alkaline cleaning solution cleaning, pure water cleaning, hydrofluoric acid cleaning, drying and the like are often required, wherein the wafer drying is used for cleaning the cleaning solution on the surface of the wafer, preventing the wafer from being oxidized and ensuring the dryness and the surface cleanliness of the surface of the wafer.
In the related art, a conventional drying mechanism includes a pull-up tank 01 and a drying chamber 02, referring to fig. 1 and 2, the bottom end of a wafer 04 is clamped in a plurality of clamping grooves 05 in a wafer box 03. When the drying operation is performed, the wafer box 03 is immersed in the pulling groove, the wafer 04 placed in the wafer box 03 finishes surface cleaning in the pure water solution in the pulling groove 01, then the wafer box 03 is slowly pulled out of the pulling groove 01, at the moment, water drops on the surface of the wafer 04 leave the surface of the wafer 04 under the action of tension, the wafer box 03 is placed in the drying chamber 02, and the residual water drops on the surface of the wafer 04 are further dried through hot nitrogen in the drying chamber 02, so that the drying operation of the wafer 04 is completed.
In this drying mode, water drops remain in the gap between the wafer 04 and the clamping groove 05 when the wafer is lifted from the lifting groove 01, and water mark defects are formed on the surface of the wafer 04 after the wafer is dried by hot air in the drying chamber 02, so that the cleanliness of the surface of the wafer 04 is affected.
In summary, how to improve the surface cleanliness of the wafer during drying is a problem to be solved by those skilled in the art.
Disclosure of Invention
Therefore, the utility model aims to provide a wafer drying mechanism, which can separate a wafer from a wafer box through the arrangement of a bearing piece and a limiting block, and the drying operations of the bearing piece and the limiting block are not interfered with each other, so that water marks are prevented from being left on the surface of the wafer when water drops in a contact gap between the bearing piece and the limiting block are dried, and the cleanliness of the surface of the wafer is ensured. Another object of the present utility model is to provide a wafer cleaning and drying system including the above wafer drying mechanism.
In order to achieve the above object, the present utility model provides the following technical solutions:
a wafer drying mechanism comprising:
the drying chamber is provided with a vent hole for introducing drying gas;
the limiting block is arranged at the bottom of the inner cavity of the drying chamber and is used for being correspondingly arranged with the wafer box base and limiting and fixing the wafer box;
and the bearing piece is positioned in the area surrounded by the limiting blocks and used for supporting the wafer from the bottom so as to separate the wafer from the wafer box. Preferably, the carrier includes a plurality of groove sets for supporting the wafer.
Preferably, the carrier further includes a circulation part for circulating the drying gas, and the circulation part is disposed at one side of the groove group.
Preferably, the two groove groups are symmetrically arranged at two sides of the circulation part.
Preferably, the bottom of the groove group is higher than the bottom of the flow-through part.
Preferably, the groove group comprises a plurality of grooves formed along the length direction of the bearing piece.
Preferably, the grooves extend from the upper surface of the carrier toward the bottom surface of the flow-through portion.
Preferably, a supporting plate is arranged at the bottom of the drying chamber, and the bearing piece and the limiting block are arranged on the supporting plate.
The utility model also provides a wafer cleaning and drying system, which comprises:
a cleaning mechanism;
a wafer drying mechanism according to any one of the above;
the wafer drying mechanism and the cleaning mechanism are arranged on a moving route of the grabbing mechanism;
the grabbing mechanism is in signal connection with the control mechanism.
The wafer drying mechanism provided by the utility model comprises a drying chamber, a bearing piece and a limiting block, wherein a vent hole arranged on the drying chamber can be used for introducing drying gas, and a wafer supported on the bearing piece and a wafer box fixed on the limiting block can be used for drying in the drying chamber; the limiting block is arranged at the bottom of the inner cavity of the drying chamber, is correspondingly arranged with the foot seat of the wafer box, and can limit the wafer box and fix the wafer box in the drying chamber when the drying operation is carried out; the bearing piece is arranged in the area surrounded by the limiting blocks and can be used for supporting the wafer from the bottom to carry out drying operation so as to separate the wafer from the wafer box. Through the setting of carrier and stopper, can separate wafer and wafer box, both dry operation mutually noninterfere, the wafer surface is left the water mark when avoiding the interior drop of water stoving of clearance of both contacts, guarantees the cleanliness factor on wafer surface.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a wafer drying mechanism in the prior art;
FIG. 2 is a schematic diagram of a wafer and a wafer cassette according to the prior art;
FIG. 3 is a schematic diagram of a wafer drying mechanism according to the present utility model;
FIG. 4 is a schematic view of a carrier according to the present utility model;
fig. 5 is a schematic diagram of a wafer and a wafer cassette according to the present utility model when being dried.
In fig. 1 to 5, reference numerals include:
a pulling groove 01, a drying chamber 02, a wafer box 03, a wafer 04 and a clamping groove 05;
the wafer drying device comprises a drying chamber 1, a wafer box 2, a wafer 3, a limiting block 4, a bearing piece 5 and a supporting plate 6;
groove group 51, circulation portion 52.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The core of the utility model is to provide a wafer drying mechanism, which can separate a wafer 3 from a wafer box 2 through the arrangement of a bearing piece 5 and a limiting block 4, and the drying operations of the wafer 3 and the wafer box are not interfered with each other, so that water marks are prevented from being left on the surface of the wafer 3 when water drops in a contact gap between the wafer 3 and the wafer box are dried, and the cleanliness of the surface of the wafer 3 is ensured. Another core of the present utility model is to provide a wafer cleaning and drying system including the wafer drying mechanism.
The wafer drying mechanism provided by the utility model comprises a drying chamber 1, a bearing piece 5 and a limiting block 4, please refer to fig. 3, fig. 3 is a schematic structural diagram of the wafer drying mechanism.
The ventilation holes on the drying chamber 1 are used for introducing drying gas, a plurality of ventilation holes can be arranged, the wafer 3 and the wafer box 2 are dried by the drying gas, and the drying gas can be hot nitrogen or other hot gases without limitation. The specific structural form of the drying chamber 1 is not limited, and the drying chamber is matched with the structures of the wafer 3 and the wafer box 2, so that the drying operation requirements of the wafer 3 and the wafer box 2 to be dried are met.
The limiting block 4 is arranged at the bottom of the inner cavity of the drying chamber 1, the limiting block 4 is correspondingly arranged with the wafer box base, and when the wafer box base is fixed on the limiting block 4, the wafer box 2 can be limited and fixed. Through the setting of stopper, can be with wafer box 2 fixed in drying chamber 1, the number and the arrangement mode of stopper 4 depend on the mechanism of wafer box 2.
The limiting block 4 can have various structural forms, and can form stable support for the wafer box 2.
The carrier 5 is disposed inside the area surrounded by the plurality of limiting blocks 4, and is used for supporting the wafer 3 from the bottom so as to separate the wafer 3 from the wafer box 2. When the wafer 3 is placed on the carrier 5, the wafer box 2 is limited and fixed by a plurality of limiting blocks 4 outside the carrier 5.
Through the setting of stopper 4 and carrier 5, can make wafer 3 when the drying not contact with wafer box 2, the wafer 3 surface leaves the water mark when the clearance internal water drop stoving of avoiding both contacts, guarantees the cleanliness factor on wafer 3 surface.
After the wafer 3 is usually cleaned based on the pure water solution, when the wafer 3 is extracted from the pure water solution, water drops on the surface of the wafer 3 drop under the action of tension, the wafer 3 is further put on the bearing piece 5 for drying operation, the bearing piece 5 is always kept in a dry state, and when the wafer 3 is placed on the bearing piece 5, the surface of the wafer 3 can be directly dried by the drying gas in the drying chamber 1, so that the surface of the wafer 3 is ensured to be clean, and the generation of water marks is avoided.
Alternatively, the carrier 5 may have various forms, such as V-shape, Y-shape, W-shape, etc., capable of forming a stable support.
When carrying out the stoving operation, because stopper 4 and carrier 5 components of a whole that can function independently set up, promptly do not contact between wafer 3 and the wafer box 2, both carry out the stoving operation alone, do not influence each other, have avoided the water mark that the water droplet that the contact surface clearance caused when wafer 3 contacted with wafer box 2, guarantee the drying effect of wafer 3 and wafer box 2, guarantee the cleanliness factor on wafer 3 surface, improve the stoving quality, reduce the damage rate of wafer 3.
The wafer drying mechanism comprises a drying chamber 1, a bearing piece 5 and a limiting block 4, wherein a wafer 3 supported on the bearing piece 5 and a wafer box 2 fixed on the limiting block 4 can be dried in the drying chamber 1; the limiting block 4 is arranged at the bottom of the inner cavity of the drying chamber 1, and the limiting block 4 is correspondingly arranged with the foot seat of the wafer box 2, so that the wafer box 2 can be limited and fixed in the drying chamber 1 when the drying operation is performed; the carrier 5 is disposed inside the area surrounded by the plurality of limiting blocks 4, and can be used for supporting the wafer 3 from the bottom to perform drying operation, so that the wafer 3 and the wafer box 2 are separated, and the drying operation of the wafer 3 and the wafer box 2 are not interfered with each other. Through the setting of carrier 5 and stopper 4, can separate wafer 3 and wafer box 2, the dry operation mutually noninterfere between the two, the wafer 3 surface leaves the water mark when avoiding the clearance interior drop of water stoving of both contacts, guarantees the cleanliness factor on wafer 3 surface.
On the basis of the above embodiment, the carrier 5 comprises a plurality of groove sets 51 for supporting the wafer 3.
Referring to fig. 4 and 5, the groove sets 51 are integrally formed on the carrier 5, and the number and arrangement of the groove sets 51 are not limited.
The groove sets 51 may be used to support the wafer 3, and may support one wafer 3 with a single groove set 51, or may support one wafer 3 with multiple groove sets 51.
On the basis of any of the above embodiments, the carrier 5 further includes a circulation portion 52 for circulating the drying gas, and the circulation portion 52 is disposed at one side of the groove group 51.
Referring to fig. 4, the flow portion 52 is integrally formed with the groove set 51, the flow portion 52 is disposed at one side of the groove set 51, and has a space for the flow of the drying gas, so that the drying operation of the wafer 3 can be matched, and the specific form of the flow portion 52 is not limited.
The arrangement of the circulation part 52 can facilitate the circulation of the drying gas in the drying chamber 1, enhance the drying effect on the wafer 3 and ensure the drying quality.
On the basis of any of the above embodiments, the two groove groups 51 are symmetrically disposed on both sides of the flow-through portion 52.
Referring to fig. 4, the carrier 5 includes a flow portion 52 and groove sets 51 symmetrically disposed on two sides thereof, and the two groove sets 51 can jointly form a support for the bottom of the wafer 3. The arrangement of the flow-through part 52 can reduce the contact area between the carrier 5 and the wafer 3 and improve the drying effect.
The size and arrangement of the flow-through portion 52 can be designed in accordance with the specific situation, and can be set to be slightly wider on the basis of ensuring stable support of the wafer 3 by the groove group 51.
On the basis of any of the above embodiments, the bottom of the groove group 51 is higher than the bottom of the flow-through portion 52.
The bottom of the groove set 51 is higher than the bottom of the flow-through part 52, so that the drying gas can smoothly flow in the carrier 5, thereby ensuring the drying effect on the wafer 3 and avoiding the generation of water marks on the surface of the wafer 3.
No matter what the shape of the grooves of the groove group 51 is, it is necessary to secure a height difference between the groove group 51 and the circulation portion 52 and to secure circulation of the drying air.
On the basis of any of the above embodiments, the groove set 51 includes a plurality of grooves opened along the length direction of the carrier 5.
Referring to fig. 4 and 5, a plurality of grooves may be used to place a plurality of wafers 3, and a plurality of wafers 3 may be placed on one carrier 5, so as to improve the drying efficiency of the wafers 3.
The grooves are arranged along the length direction of the bearing piece 5, and the grooves can be arranged at equal intervals or at intervals, and can be specifically determined according to actual operation requirements.
On the basis of any of the above embodiments, the grooves extend from the upper surface of the carrier 5 to the bottom surface of the flow-through portion 52.
Referring to fig. 4 and 5, the lower side of the groove with the inclined surface is adjacent to the circulation portion 52, and the groove groups 51 on both sides of the circulation portion 52 can cooperate to form a V-shaped support for the wafer 3, so as to ensure the stability of the support and prevent the wafer 3 from falling during the drying process.
On the basis of any of the above embodiments, the bottom of the drying chamber 1 is provided with a supporting plate 6, and the bearing piece 5 and the limiting block 4 are both arranged on the supporting plate 6.
The bottom of drying chamber 1 is located to backup pad 6, and carrier 5 and stopper 4 all locate backup pad 6, and the mode of connection between both and backup pad 6 is all preferable for dismantling the connection.
In the present embodiment, the structural form of the support plate 6 is not limited, and the whole is relatively flat to form a smooth support for the wafer 3 and the wafer cassette 2.
In addition to the above-described wafer drying mechanism, the present utility model also provides a wafer cleaning and drying system including the wafer drying mechanism disclosed in the above-described embodiment, the wafer cleaning and drying system including:
a cleaning mechanism;
the wafer drying mechanism is the wafer drying mechanism according to any one of the above embodiments;
the wafer drying mechanism and the cleaning mechanism are arranged on a moving route of the grabbing mechanism;
the grabbing mechanism is in signal connection with the control mechanism.
The control mechanism can control the grabbing mechanism to move to the upper parts of the cleaning mechanism and the wafer drying mechanism so as to grab the wafer and move the wafer to a required position for drying operation and cleaning operation.
The wafer cleaning and drying system provided in this embodiment further includes a supply mechanism for supplying a drying gas, which can continuously supply the drying gas into the drying chamber 1 of the wafer drying mechanism.
In addition to the above embodiment, the structure of each other portion of the wafer cleaning and drying system is referred to in the prior art, and will not be described herein.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The wafer drying mechanism and the wafer cleaning and drying system provided by the utility model are described in detail above. The principles and embodiments of the present utility model have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present utility model and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the utility model can be made without departing from the principles of the utility model and these modifications and adaptations are intended to be within the scope of the utility model as defined in the following claims.
Claims (9)
1. A wafer drying mechanism, comprising:
the drying device comprises a drying chamber (1), wherein a vent hole for introducing drying gas is formed in the drying chamber (1);
the limiting block (4) is arranged at the bottom of the inner cavity of the drying chamber (1), and the limiting block (4) is used for being arranged corresponding to the wafer box base and can limit and fix the wafer box (2);
and the bearing piece (5) is positioned in the area surrounded by the limiting blocks (4) and is used for supporting the wafer (3) from the bottom so as to separate the wafer (3) from the wafer box (2).
2. Wafer drying mechanism according to claim 1, characterized in that the carrier (5) comprises a number of groove sets (51) for supporting the wafers (3).
3. Wafer drying mechanism according to claim 2, characterized in that the carrier (5) further comprises a flow-through portion (52) for the flow-through of a drying gas, which flow-through portion (52) is provided at one side of the groove group (51).
4. A wafer drying mechanism according to claim 3, wherein two of the groove groups (51) are symmetrically provided on both sides of the flow-through portion (52).
5. Wafer drying mechanism according to claim 3 or 4, characterized in that the bottom of the groove group (51) is higher than the bottom of the flow-through part (52).
6. Wafer drying mechanism according to claim 5, characterized in that the groove group (51) comprises a number of grooves open in the length direction of the carrier (5).
7. Wafer drying mechanism according to claim 6, characterized in that the grooves extend from the upper surface of the carrier (5) towards the bottom surface of the flow-through part (52).
8. Wafer drying mechanism according to claim 7, characterized in that the bottom of the drying chamber (1) is provided with a support plate (6), and the carrier (5) and the limiting block (4) are both arranged on the support plate (6).
9. A wafer cleaning and drying system, comprising:
a cleaning mechanism;
a wafer drying mechanism according to any one of claims 1 to 8;
the wafer drying mechanism and the cleaning mechanism are arranged on a moving route of the grabbing mechanism;
the grabbing mechanism is in signal connection with the control mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320593541.4U CN219624368U (en) | 2023-03-23 | 2023-03-23 | Wafer drying mechanism and wafer cleaning and drying system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320593541.4U CN219624368U (en) | 2023-03-23 | 2023-03-23 | Wafer drying mechanism and wafer cleaning and drying system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219624368U true CN219624368U (en) | 2023-09-01 |
Family
ID=87792254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320593541.4U Active CN219624368U (en) | 2023-03-23 | 2023-03-23 | Wafer drying mechanism and wafer cleaning and drying system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219624368U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117542766A (en) * | 2024-01-08 | 2024-02-09 | 山东联盛电子设备有限公司 | Wafer cleaning and drying device |
| CN117558615A (en) * | 2023-09-19 | 2024-02-13 | 江苏亚电科技股份有限公司 | Post-cleaning drying method for wafer loaded with wafer material box |
-
2023
- 2023-03-23 CN CN202320593541.4U patent/CN219624368U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117558615A (en) * | 2023-09-19 | 2024-02-13 | 江苏亚电科技股份有限公司 | Post-cleaning drying method for wafer loaded with wafer material box |
| CN117558615B (en) * | 2023-09-19 | 2024-06-25 | 江苏亚电科技股份有限公司 | Post-cleaning drying method for wafer loaded with wafer material box |
| CN117542766A (en) * | 2024-01-08 | 2024-02-09 | 山东联盛电子设备有限公司 | Wafer cleaning and drying device |
| CN117542766B (en) * | 2024-01-08 | 2024-03-22 | 山东联盛电子设备有限公司 | Wafer cleaning and drying device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN219624368U (en) | Wafer drying mechanism and wafer cleaning and drying system | |
| US20170053815A1 (en) | Substrate processing apparatus and substrate processing method | |
| US4722752A (en) | Apparatus and method for rinsing and drying silicon wafers | |
| KR100886021B1 (en) | Solution treatment method and solution treatment unit | |
| JP2704309B2 (en) | Substrate processing apparatus and substrate heat treatment method | |
| WO2023011334A1 (en) | Method and mechanism for cleaning and drying wafer | |
| US20120192899A1 (en) | Liquid Processing Apparatus and Liquid Processing Method | |
| KR19980018979A (en) | Semiconductor Wafer Carrier | |
| CN114485074A (en) | Wafer drying device and drying method thereof | |
| CN105990198A (en) | Slot-type basket device for solar battery cell | |
| CN107665841B (en) | Substrate processing system | |
| US20200168482A1 (en) | Substrate processing apparatus and substrate processing method | |
| KR101408788B1 (en) | Apparatus for treating a substrate | |
| US20010045223A1 (en) | Semiconductor wafer cleaning apparatus and method of using the same | |
| KR101541867B1 (en) | Solar wafer drying system | |
| CN220852878U (en) | Silicon wafer lifting support and drying device | |
| CN217182137U (en) | A wafer vertical lifting mechanism for wafer drying device | |
| JP6184890B2 (en) | Substrate liquid processing apparatus, substrate liquid processing method, and storage medium | |
| CN215724894U (en) | Capacitor drying mechanism | |
| CN217182139U (en) | A cell body top cap for wafer drying device | |
| JPH0536668A (en) | Drying method for semiconductor substrate | |
| CN109647784B (en) | Method for cleaning quartz wafer | |
| CN219873451U (en) | Load transferring clamp and transfer device | |
| JPH11317390A (en) | Substrate drying method | |
| KR100647485B1 (en) | Method for drying a substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |