CN109647784B

CN109647784B - Method for cleaning quartz wafer

Info

Publication number: CN109647784B
Application number: CN201910085017.4A
Authority: CN
Inventors: 欧阳林; 欧阳晟; 韩何明; 欧阳华
Original assignee: Guangzhou Jingyou Electronic Technology Co ltd
Current assignee: Guangzhou Jingyou Electronic Technology Co ltd
Priority date: 2019-01-29
Filing date: 2019-01-29
Publication date: 2022-04-01
Anticipated expiration: 2039-01-29
Also published as: CN109647784A

Abstract

The invention relates to the field of quartz wafer processing, and particularly discloses a quartz wafer cleaning method, which sequentially comprises the following steps: mounting a quartz wafer into a coating clamp through a wafer arrangement process; putting the film coating clamp with the mounted quartz wafer into a cleaning tank for cleaning; and dehydrating and spin-drying the cleaned coating clamp. The invention provides a new cleaning scheme, wherein the quartz wafers are cleaned after being arranged on the coating fixture, so that each quartz wafer has an independent cleaning space and can be cleaned in all directions in the cleaning process, and therefore, impurities such as particle impurities, adhered dust and the like on the surfaces of the quartz wafers are removed, the cleaning effect is excellent, and the subsequent coating quality is improved. Meanwhile, the cleaned quartz wafer does not need to be detached from the coating clamp for transfer, and the subsequent coating step can be directly carried out, so that the complexity of the process is greatly simplified, and the production efficiency is improved.

Description

Method for cleaning quartz wafer

Technical Field

The invention relates to the field of quartz wafer processing, in particular to a quartz wafer cleaning method.

Background

With the upgrading of electronic communication terminals, higher requirements are also put on piezoelectric quartz devices, especially in terms of stability and miniaturization. Quartz wafer is one of very important subassembly among the piezoelectric quartz device, involves the clean process of washing in the course of working of quartz wafer, and the wafer after wasing forms electrode circuit through the coating film, if the quartz wafer cleaning effect is not good will directly influence the effect of coating film to influence follow-up finished product quality, consequently, the cleaning process has one of the links of decisive factor to final product quality.

At present, a quartz crystal manufacturer cleans a certain number of wafers in a basket as shown in fig. 1, and then cleans a plurality of baskets 12 in a cleaning tank 11, as shown in fig. 2, and then cleans the wafers by dehydrating with alcohol or by spin-drying, as shown in fig. 3, and then dries the wafers by baking. This scheme is placed a plurality of wafers in same basket, because wafer itself is thinner, adsorbs very easily between the wafer when wasing together, can not fully scatter between piece and the piece, and the wafer that adsorbs together is difficult to the sanitization, and during the wafer washing, especially after the wafer is dry, can obviously see the residue of surface grinding sand, the cleaning performance is poor.

In order to solve the problem that wafers are easily adsorbed to each other, a cleaning apparatus for a quartz wafer has been developed. Only place a wafer through corresponding in single washing box, it is rotatory to drive the wash bowl through driving motor, and the washing liquid erodees the washing to the wafer in the washing box, and simultaneously, the jet head one-to-one of washing box and air heater washs the back and carries out the drying to the wafer in every washing box with the air heater, so makes the wafer in every washing box fully dry. This scheme can avoid the wafer to pile up and take place to collide with the damage in the cleaning process, guarantees simultaneously that wafer cleaning and drying are thorough, but the washing and the drying efficiency of this scheme are low excessively, are unfavorable for production efficiency's promotion.

Disclosure of Invention

The invention aims to overcome at least one defect (deficiency) of the prior art and provides a quartz wafer cleaning method which has good cleaning effect and is beneficial to improving the coating quality and the production efficiency.

The technical scheme adopted by the invention is as follows: a method for cleaning a quartz wafer sequentially comprises the following steps: mounting a quartz wafer into a coating clamp through a wafer arrangement process; putting the film coating clamp with the mounted quartz wafer into a cleaning tank for cleaning; and dehydrating and spin-drying the cleaned coating clamp.

The traditional quartz wafer cleaning method is usually to intensively clean the quartz wafer before the wafer arrangement, and the quartz wafer is inevitably adsorbed and stacked in the cleaning process, so that the cleaning of the quartz wafer is not clean, and the quality of subsequent coating is affected. The invention provides a new cleaning scheme, wherein the quartz wafers are cleaned after being arranged on the coating fixture, so that each quartz wafer has an independent cleaning space and can be cleaned in all directions in the cleaning process, and therefore, impurities such as particle impurities, adhered dust and the like on the surfaces of the quartz wafers are removed, the cleaning effect is excellent, and the subsequent coating quality is improved. Meanwhile, the cleaned quartz wafer does not need to be detached from the coating clamp for transfer, and the subsequent coating step can be directly carried out, so that the complexity of the process is greatly simplified, and the production efficiency is improved.

Meanwhile, in the prior art, the cleaned quartz wafer is usually dehydrated by alcohol, and after a period of time, the cleaned quartz wafer needs to be replaced by new alcohol to prevent the cleaned quartz wafer from being polluted again, so that a large amount of alcohol is required to be used, and the production cost is increased. The invention adopts a spin-drying dehydration mode, thereby avoiding the use of alcohol and reducing the production cost.

As a preferred scheme, the cleaning of the coating clamp specifically comprises the following steps: and mounting the coating clamp with the quartz wafer mounted in a cleaning basket, and then placing the cleaning basket in a cleaning tank.

In order to facilitate cleaning and transferring, the film coating clamp with the quartz wafers installed is uniformly installed in a cleaning basket, and the cleaning efficiency is improved in order to increase the number of the quartz wafers cleaned at a time. This scheme has adopted the mode of placing the multi-disc coating film anchor clamps in a belt cleaning device, sets up certain distance between the coating film anchor clamps, guarantees that the quartz wafer on every coating film anchor clamps has sufficient washing space, can receive omnidirectional washing.

As a preferable scheme, in order to facilitate quick assembly and disassembly of the coating fixture by an operator, the cleaning basket is provided with a plurality of guide rail grooves in an insertion installation mode, and the guide rail grooves are used for insertion installation of the coating fixture.

As a preferable scheme, in order to further improve the cleaning efficiency and simultaneously avoid the overlong size design of the cleaning device, the guide rail grooves are arranged in multiple rows/multiple columns, and the guide rail grooves of two adjacent rows/multiple columns are arranged in a staggered manner. According to the scheme, the guide rail grooves are arranged in rows/columns, each row/column comprises a plurality of guide rail grooves, and the guide rail grooves between adjacent rows/columns are arranged in a staggered mode, namely the coating clamps between adjacent rows/columns are arranged in a staggered mode, so that the cleaning effect can be improved.

Preferably, the side and/or bottom of the cleaning basket is provided with openings.

As a preferred scheme, the dehydration of the coating clamp specifically comprises: and (3) installing the cleaned coating clamp into a dehydration basket, and drying the quartz wafer and the coating clamp in a centrifugal dehydration mode.

As a preferable scheme, the dehydration basket is provided with a plurality of guide rail grooves, and the guide rail grooves are used for inserting and installing the film coating clamp.

As a preferred scheme, in order to facilitate rapid moisture removal and improve the dehydration efficiency, the dehydration basket is provided with dehydration holes, and the dehydration holes comprise first opening holes arranged on the side surfaces of the dehydration basket.

Preferably, the dewatering aperture further comprises a second opening disposed in a bottom surface of the dewatering basket. Establish the second fenestrate of dehydration hand-basket bottom and can let the water that flows out from the coating fixture directly flow out from the second fenestrate, help promoting the dehydration effect.

In practical application, in order to improve the dewatering effect and the dewatering efficiency, the areas of the first opening holes and the second opening holes can be designed to be the largest on the premise of ensuring the stable structure of the dewatering basket.

Preferably, the area of the second opening is smaller than that of the bottom surface; or the sum of the areas of all the second opening holes is smaller than the area of the bottom surface.

As a preferred scheme, in order to prevent the dehydration from being insufficient, further guarantee the quartz crystal plate is fully dried, raise production efficiency, still include the step of baking after the coating film clamp dehydrates: and putting the dehydrated coating clamp into a baking device for baking.

Compared with the prior art, the invention has the beneficial effects that: the novel cleaning scheme is provided, the quartz wafers are cleaned after being arranged on the film coating clamp, so that in the cleaning process, each quartz wafer has an independent cleaning space and can be cleaned in an all-around manner, and therefore impurities such as particle impurities and adhesion dust on the surfaces of the quartz wafers are removed, the cleaning effect is excellent, and the follow-up film coating quality is promoted. Meanwhile, the cleaned quartz wafer does not need to be detached from the coating clamp for transfer, and the subsequent coating step can be directly carried out, so that the complexity of the process is greatly simplified, and the production efficiency is improved.

Drawings

FIG. 1 shows a conventional apparatus for cleaning a quartz wafer.

FIG. 2 is a schematic diagram of a prior art quartz wafer cleaning process.

FIG. 3 is a schematic diagram of a dehydration process of a quartz wafer according to the prior art.

FIG. 4 is a schematic view of a coating jig with a quartz wafer mounted thereon.

Fig. 5 is a schematic structural diagram of the cleaning apparatus for a quartz wafer according to the present embodiment.

Fig. 6 is a top view and a left side view of the cleaning apparatus for a quartz wafer according to the present embodiment.

FIG. 7 is a schematic view of the dewatering device in the embodiment.

FIG. 8 is a schematic structural view of the dewatering basket with a coating fixture in the embodiment.

Reference numerals: 11. a cleaning tank; 12. a basket; 13. a rotating bracket of the dewatering device; 21/31, coating fixture; 22. dewatering and lifting the basket; 23. a centrifugal support; 24. a mounting member; 221. a first guide rail groove; 222. mounting holes; 223. a third opening hole; 224. a support plate; 225. a fourth aperture; 32. lifting a basket; 301. a first opening hole; 401. a second opening; 402. a second guide rail groove; 403. and reinforcing the side plates.

Detailed Description

The drawings are only for purposes of illustration and are not to be construed as limiting the invention. For a better understanding of the following embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

Examples

The embodiment provides a method for cleaning a quartz wafer, which specifically comprises the following steps:

(1) sheet arranging: the quartz wafer is first mounted on a coating fixture by a wafer arranging device or a manual wafer arranging method, wherein the coating fixture used in the present embodiment is shown in fig. 4.

(2) Cleaning: mounting the film coating clamp after arranging the sheets on a cleaning basket, wherein the cleaning basket is provided with a plurality of guide rail grooves, and the film coating clamp is mounted on the cleaning basket in a mode of being inserted into the guide rail grooves; placing the cleaning lifting basket provided with the film coating clamp into a cleaning tank for cleaning;

(3) and (3) dehydrating: taking off the cleaned film coating clamp from the cleaning device, and then installing the film coating clamp on a dewatering device, wherein the dewatering device comprises a plurality of dewatering baskets provided with a plurality of guide rail grooves, and the film coating clamp is installed on the dewatering baskets in a mode of being inserted into the guide rail grooves; spin-drying the quartz wafer and the coating fixture by high-speed operation;

(4) and (3) baking: and taking the spin-dried coating clamp down from the dehydration lifting basket, and then putting the spin-dried coating clamp into a drying device for drying.

Wherein, the baked film coating clamp can directly carry out the next film coating process.

The cleaning scheme that this embodiment provided has guaranteed that in the cleaning process, every quartz wafer has independent washing space, can receive omnidirectional washing to get rid of impurity such as particle impurity, adhesion dust on quartz wafer surface, the cleaning performance is excellent, helps promoting follow-up coating film quality. Meanwhile, the quartz wafer does not need to be detached from the film coating clamp for transfer in the whole cleaning process, the complexity of each step is greatly simplified, and the production efficiency is improved.

As shown in fig. 5 and 6, the present embodiment further provides a cleaning apparatus for a quartz wafer suitable for the above cleaning method, comprising a basket 32 having an upper opening. The basket 32 is substantially square, and two reinforcing side plates 403 are further provided in the middle to divide the basket 32 into 3 sections, each section being provided with 10 rail grooves 402. The rail groove 402 is used for mounting the coating clamp 31, and the quartz wafer is mounted on the coating clamp.

As shown in fig. 5, the cleaning device provided by this embodiment can hold 3 rows of coating fixtures, and two sides of each row are provided with 10 guide rail grooves, that is, 1 cleaning device can hold 30 coating fixtures, and the coating fixtures are installed and then are higher than the basket. Therefore, the quartz wafers can be effectively and completely prevented from being adsorbed and stacked together during cleaning, the thorough cleaning of the wafers is ensured, and the cleaning efficiency is not influenced.

In this embodiment, as shown in the left side view of fig. 6, the rail groove 402 extends through the bottom surface of the basket 32 up and down along the two side plates. In order to insert the film coating clamp into the basket, the top of the guide rail groove is provided with a chamfer, and the size of the guide rail groove is matched with the film coating clamp to be installed.

In this embodiment, 3 first opening holes 301 are respectively provided on two sides of the basket opposite to the coating jig, and the size of the first opening hole 301 is 40mm × 35 mm. Similarly, the bottom of the basket is provided with 3 rows and 4 columns of second apertures 401, which are 50.5mm x 35mm in size.

As shown in fig. 7, the present embodiment also provides a quartz wafer dehydrating apparatus suitable for the above cleaning method, comprising a dehydrating basket 22 and a centrifugal spin stand 23. The centrifugal swivel support 23 is provided with a plurality of mounting locations on which the dewatering basket 22 is mounted.

As shown in FIG. 8, the dewatering basket 22 is substantially square and has an upper opening, and protruding mounting portions are provided on both sides of the basket, respectively, and mounting holes 222 are provided on the mounting portions. The mounting portion may be conveniently held by an operator, or the mounting portion may not be provided in practical applications, and the mounting holes 222 may be directly formed in both side surfaces of the dewatering basket.

One pair of side surfaces of the dehydration basket 22 is provided with a plurality of guide rail grooves 221 for installing the coating clamp 21 in parallel, and the other pair of side surfaces is provided with a first opening hole 225; the bottom plate of which is provided with a second opening 223. In the present embodiment, two second openings 223 are provided, and the two second openings 223 are provided on both sides of the base plate, so that a base plate middle remaining support plate 224 is formed, and the support plate 224 is used to support the plating jig 21. In practical application, the second window 223 may be arranged in the middle of the bottom of the basket, but the length and width of the second window 223 are smaller than the bottom of the basket, or the second window 223 is arranged in the middle of the bottom of the basket, and the bottom part connected with the side where the guide rail groove is arranged is remained.

The guide rail groove 221 may extend to the bottom plate of the basket along the side surface of the basket, and in order to facilitate the insertion of the coating fixture into the basket, a chamfer is provided at the top of the guide rail groove 221, and the size of the guide rail groove is adapted to the size of the coating fixture to be installed.

In the present embodiment, the size of the first opening hole 225 is 60mm × 47.5 mm; the second opening 223 has a size of 76mm × 17.5 mm.

In practical application, the dehydration device provided by the embodiment is used for dehydrating the cleaned quartz wafer. After the quartz wafer coating fixture is installed and cleaned, as shown in fig. 6, the coating fixture is installed in a dehydration basket, as shown in fig. 5, and after the installation, the wafer and the coating fixture are dried by high-speed operation.

It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the technical solutions of the present invention, and are not intended to limit the specific embodiments of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention claims should be included in the protection scope of the present invention claims.

Claims

1. A method for cleaning a quartz wafer is characterized by sequentially comprising the following steps:

mounting a quartz wafer into a coating clamp through a wafer arrangement process;

installing a coating clamp with a mounted quartz wafer into a cleaning basket, wherein the coating clamp forms an installation mode of being parallel to each other, vertically arranged, staggered in two adjacent columns, staggered in two adjacent rows and arranged in multiple columns and multiple rows integrally in the cleaning basket, and then placing the cleaning basket into a cleaning tank for cleaning;

installing the cleaned coating clamp in a dehydration basket, wherein the coating clamp is arranged in the dehydration basket in a manner of being parallel to each other, vertically arranged and integrally arranged in a single row, and then drying the quartz wafer and the coating clamp in a centrifugal dehydration manner;

taking the spin-dried film coating clamp down from the dehydration basket, and then putting the spin-dried film coating clamp into a drying device for drying, wherein the dried film coating clamp can be directly subjected to the next film coating process;

the cleaning lifting basket is provided with a plurality of guide rail grooves, the guide rail grooves are used for inserting and installing the film coating clamp, the guide rail grooves are arranged in multiple rows or multiple columns, the adjacent two rows or multiple columns of guide rail grooves are arranged in a staggered mode, and the side face and the bottom face of the cleaning lifting basket are provided with holes;

the dehydration lifting basket is provided with an upper opening, a plurality of guide rail grooves for mounting a coating clamp are arranged on one pair of side surfaces in parallel, and a first opening hole is formed in the other pair of side surfaces; the bottom surface of the dehydration basket is provided with a second opening hole.