WO2008050443A1

WO2008050443A1 - Customer tray and electronic component testing apparatus

Info

Publication number: WO2008050443A1
Application number: PCT/JP2006/321491
Authority: WO
Inventors: Akihiko Ito
Original assignee: Advantest Corporation
Priority date: 2006-10-27
Filing date: 2006-10-27
Publication date: 2008-05-02
Also published as: TW200824032A

Abstract

A customer tray (8A) has a tray body (81A) and receiving members (82A) capable of receiving IC devices. A large number of holding sections (811) for holding the receiving members (82A) are formed in the tray body (81A). When a tapered section (812) of a holding section (811) and a tapered section (823) of a receiving member (82A) are not in contact with each other, the receiving member (82A) is movable relative to the tray body (81A), and when the tapered sections (812, 823) are in contact with each other, relative movement of the receiving member (82A) with respect to the tray body (81A) is fixed.

Description

Specification

Customer tray and electronic component testing equipment

Technical field

[0001] The present invention accommodates pre-tested or tested IC devices in an electronic component testing apparatus for testing electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices). The present invention relates to a customer tray that is carried in or out in a state of being carried out, and an electronic component testing apparatus using the customer tray.

Background art

[0002] In an electronic component test apparatus called a handler, a large number of IC devices housed in a tray are transported into a nodola, and each IC device is brought into electrical contact with a test head to perform an electronic component test. Have the device body (hereinafter referred to as a tester) perform the test. When the test is completed, each IC device is ejected from the test head and placed on the tray according to the test result, so that it is sorted into categories such as non-defective products and defective products.

[0003] As such a Nodler, a tray (hereinafter referred to as a test tray) that is circulated and conveyed in a handler from a tray (hereinafter referred to as a customer tray) for accommodating a pre-tested or tested IC device. There is a known type that tests IC devices by reloading the IC devices and placing the IC devices in electrical contact with the sockets of the test head while mounted on the test tray.

[0004] In this type of electronic component testing apparatus, since the IC device is mounted on the test tray before the test and the IC device is mounted on the customer tray after the test, the pick and A lot of time is spent on place work. In addition, this type of electronic component testing apparatus requires a transfer device or a dedicated test tray for transferring IC devices between the customer tray and the test tray, which increases the cost of the electronic component testing apparatus itself. I rushed.

[0005] In order to solve such problems, the conventional technique is to perform the test by transporting the customer tray itself to the test head and pressing the IC device against the socket while being accommodated in the customer tray. It is known (see, for example, Patent Document 1). [0006] However, while the customer tray is made of, for example, a synthetic resin material, a thermal stress of 55 to + 150 ° C is applied to the IC device during the test. The customer tray was thermally expanded, and the IC device input / output terminals and the contact pins of the socket could not be properly contacted during the test, making it difficult to test the IC device while it was mounted on the customer tray. .

[0007] In addition, the customer tray is designed only for the transportation of the IC device, and originally high machining accuracy is not required. For this reason, the IC device cannot be accurately positioned with respect to the socket during the test, and the IC device input / output terminals may not be in proper contact with the socket contact pins. As it was, it was difficult to test IC devices.

[0008] Patent Document 1: Japanese Utility Model Publication No. 7-8785

Disclosure of the invention

An object of the present invention is to provide a customer tray capable of testing an electronic device under test while being mounted on a customer tray, and an electronic component testing apparatus using the customer tray.

[0010] In order to achieve the above object, according to the present invention, an electronic component testing apparatus for testing an electronic device under test is carried in a state in which the electronic device under test before or after being tested is accommodated. Or a customer tray to be unloaded, which is capable of accommodating the electronic device under test, a tray main body holding the accommodating means, and allowing the relative movement of the accommodating means with respect to the tray main body. And a customer tray characterized in that the customer tray is provided (see claim 1).

[0011] In the present invention, the customer tray is provided with a floating means, and the accommodating means for accommodating the electronic device under test is movable relative to the tray body. As a result, when the electronic device under test is pressed against the contact portion of the test head, an error in the position of the electronic device under test with respect to the contact portion due to the thermal expansion or processing accuracy of the customer tray can be absorbed. It becomes possible to test the electronic device under test while it is mounted on the tray.

[0012] Although not particularly limited in the above invention, it is preferable that the apparatus further comprises a fixing means for fixing the relative movement of the accommodating means with respect to the tray body (see claim 2). [0013] The customer tray is used in addition to a test process such as an appearance inspection process and a shipping process. In order to use the customer tray even in an apparatus provided in each process, each customer tray is used on the customer tray. The position of the test electronic component must be fixed. On the other hand, according to the present invention, the customer tray can be used as usual in processes other than the test process by making it possible to fix the relative movement of the storage means by the fixing means.

[0014] Although not particularly limited in the above invention, it is preferable that the housing means is detachable from the tray body (see claim 3).

[0015] In the present invention, in the customer tray, the accommodating means can be detachably attached to the tray body. As a result, when the product type of the electronic device under test is changed, the customer tray can be made compatible with the product type change by changing only the accommodating means. This eliminates the need to prepare an entire customer tray for each type of electronic component under test, thereby reducing the cost of the customer tray.

To achieve the above object, according to the present invention, an electronic device under test is pressed against a contact portion of a test head, and an input / output terminal of the electronic device under test is electrically connected to a contact bin of the contact portion. An electronic component test apparatus for testing the electronic device under test in contact with the electronic device, wherein the electronic device under test is placed in any one of the customer trays while the electronic device under test is contained in the electronic device under test. An electronic component test apparatus is provided, wherein the electronic component test device is pressed against a contact portion to electrically contact an input / output terminal of the electronic device under test with a contact pin of the contact portion (see claim 4).

[0017] By performing the test of the electronic device under test while being accommodated in the customer tray, there is no need to transfer the electronic device under test between the trays, improving the throughput and reducing the cost of the electronic device test apparatus. Can be achieved.

[0018] Although not particularly limited in the above invention, the customer tray further includes guide means for the accommodating means to be guided to the contact portion, and at least when the electronic device under test is pressed against the contact portion. In addition, the receiving means is released from being fixed by the fixing means, can be moved relative to the tray body by the floating means, and is guided to the contact portion by the guide means. It is preferred to do so (see claim 5). [0019] Although not particularly limited in the above invention, a loader in which the customer tray in which the electronic device to be tested before testing is accommodated is mounted on a conveyance frame capable of mounting one or more of the customer trays. An application unit that applies a thermal stress at a predetermined temperature to the electronic device under test in a state where the electronic device under test is accommodated in the customer tray mounted on the conveyance frame, and the customer tray on the conveyance frame. In a state where the electronic component to be tested is pressed against the contact portion of the test head, the electronic component to be tested is placed on the customer tray mounted on the transport frame. In the accommodated state, the removing section for removing thermal stress from the electronic device under test and the customer tray containing the electronic device under test after the test And an unloader section that is removed from the conveyance frame. (See claim 6).

[0020] In the above invention, although not particularly limited, the application unit, the test unit, and the removal unit are provided on the rear side of the loader unit and the unloader unit. It is preferable to have the characteristics (see claim 7).

[0021] In the above invention, although not particularly limited, an empty customer tray that does not contain the electronic device under test is placed on the customer tray that contains the electronic device under test. It is preferable to transport the customer tray that contains the electronic device under test in a state (see claim 8).

The test tray is provided with a latch mechanism or the like for preventing the electronic device under test from popping out. The customer tray is not provided with means for preventing the pop-out. Therefore, in the present invention, the electronic device under test is accommodated on the customer tray accommodating the electronic device under test, and the electronic device under test is accommodated with an empty customer tray covered. By transporting the customer tray within the electronic component test equipment, the customer tray force can also prevent the electronic device under test from popping out.

[0023] Although not particularly limited in the above invention, the customer tray is transported while the customer tray is reversed, and the electronic components to be tested housed in the customer tray are transferred to the contact portion of the test head. It is preferable that it is pressed against (see claim 9).

[0024] The customer tray is transported with the customer tray inverted, and the electronic component under test By performing this test, it is no longer necessary to form an opening in the customer tray for the input / output terminals to face the back of the customer tray. Therefore, the electronic device under test can be prevented from dropping through this opening.

[0025] Although not particularly limited in the above invention, the total number of electronic components to be tested contained in one or two or more customer trays is the number of simultaneous measurements in the test head of the electronic component testing apparatus. It is preferable that they coincide or are an integral multiple of the number of simultaneous measurements (see claim 10). As a result, the test efficiency of the electronic component test apparatus can be improved.

Brief Description of Drawings

FIG. 1 is a perspective view showing an entire electronic component testing apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view showing the entirety of the electronic device test apparatus according to the first embodiment of the present invention.

FIG. 3 is a perspective view showing a customer tray in the first embodiment of the present invention.

[FIG. 4A] FIG. 4A is a cross-sectional view taken along the line IV-IV in FIG. 3, and shows a state in which the floating operation of the housing member is fixed.

[FIG. 4B] FIG. 4B is a cross-sectional view taken along the line IV-IV in FIG. 3, and shows a state in which the housing member can float.

FIG. 5 is a plan view showing a housing member used in the customer tray shown in FIG. 3.

[Fig. 6] Fig. 6 is a plan view showing an accommodating member of a customer tray in the second embodiment of the present invention.

FIG. 7 is an enlarged cross-sectional view of a customer tray in a third embodiment of the present invention.

FIG. 8 is a perspective view showing a conveyance frame used in the electronic component testing apparatus according to the first embodiment of the present invention.

FIG. 9A is an enlarged cross-sectional view showing a state in which the housing member of the customer tray and the guide pin of the test head are in contact with each other when the IC device is tested in the first embodiment of the present invention. The

[FIG. 9B] FIG. 9B shows a test of an IC device in the first embodiment of the present invention. It is an expanded sectional view showing a state.

FIG. 10 is a perspective view showing a cassette used for transporting a customer tray between the electronic component test apparatus and the dedicated classification apparatus in the first embodiment of the present invention.

FIG. 11 is a plan view showing a dedicated classification apparatus used in the first embodiment of the present invention.

FIG. 12 is an enlarged cross-sectional view showing a customer tray that is being transported in the electronic component test apparatus in the fourth embodiment of the present invention.

FIG. 13 is a plan view showing a test unit of an electronic device test apparatus according to a fourth embodiment of the present invention.

FIG. 14 is an enlarged cross-sectional view showing a state in which an IC device is being tested in a fourth embodiment of the present invention.

Explanation of symbols

1 ... Nordra

200 ··· Loader

210 ... Tray transfer device

300 ... Applying section

400 ··· Tess 卜咅

410 ... pusher

412 ... Guide pin

450 ... Detachable device

500 ··· Heat removal unit

600 ··· Unloader

610 ... Tray transfer device

7 ... Test head

70 · "Socket

71 ... Contact pin

72 ... Guide pin

8Α ～ 8Ε ··· Customer train 81 ... 卜 rei body

811 ··· Holding part

812 ... Tapered part

82A-82D ... with storage

821 ... concave

822 ... Opening

823

9 ... Transport frame

1000 ··· Classification machine

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 and FIG. 2 are a perspective view and a plan view showing the entire electronic component testing apparatus according to the first embodiment of the present invention.

[0030] In the handler 1 according to the first embodiment of the present invention, a tester (not shown) sends a test signal to the IC device via the test head 7 in a state where a high-temperature or low-temperature temperature stress is applied to the IC device. It is a device for testing (inspecting) whether an IC device operates properly by inputting and outputting. The IC device test using this electronic component test equipment is performed without using the test tray, with the IC device still housed in the customer tray 8A.

As shown in FIGS. 1 and 2, the handler 1 according to this embodiment includes a loader unit 200, an application unit 300, a test unit 400, a heat removal unit 500, and an unloader unit 600.

[0032] The loader unit 200 stores two customer trays 8A supplied to the handler 1 in a stacked state in the transport frame 9, and loads the transport frame 9 into the application unit 300. The customer tray 8A is transported in the nodola 1 while being housed in the transport frame 9 until it is housed in the transport frame 9 by the loader unit 200 and then reaches the unloader unit 600.

[0033] In the application unit 300, while the IC device is housed in the customer tray 8A, high temperature or low temperature thermal stress is applied to the IC device, and then it is carried into the test unit 400.

[0034] Then, in the test unit 400, each customer tray 9 is moved above the test head 7, and the IC device is tested while the IC device is accommodated in the customer tray 9. When the strike is completed, it is carried out to the heat removal unit 500.

[0035] In the heat removal unit 500, the IC device force is also removed from the unloader unit 600 after the thermal stress is removed while the IC device is housed in the customer tray 8A.

[0036] In the unloader unit 600, the customer tray 8A is removed from the transport frame 9, and the force stapler tray 8A is unloaded from the existing tray 600A and stacked on the stack of customer trays 8A. .

[0037] The customer tray that contains the IC device that has been tested in this way is transported to a dedicated classification device 1000 (see Fig. 11) separate from handler 1 by an automatic transport device such as an operator or ADV. The dedicated device 1000 classifies IC devices into categories according to test results.

[0038] Next, the customer tray 8A used in the electronic component testing apparatus according to the present embodiment will be described first.

FIG. 3 is a perspective view showing the customer tray in the first embodiment of the present invention, FIGS. 4A and 4B are sectional views taken along line IV-IV in FIG. 3, and FIG. 4A is a floating view of the housing member. FIG. 4B is a view showing a state in which the operation is fixed, FIG. 4B is a view showing a state in which the accommodation member can float, and FIG. 5 is a plan view showing the accommodation member used in the customer tray shown in FIG.

[0040] As shown in FIG. 3, the customer tray 8A in the present embodiment includes, for example, a flat tray body 81A having a synthetic resin material force, and a large number of accommodating members 82A for holding an IC device. I have. The tray body 81A is provided with a number of holding portions 811 such as through-hole caps. In the example shown in FIG. 3, the holding portion 811 is arranged on the tray body 81 A in 7 rows and 8 columns! Each holding portion 811 is inserted with a storage member 82A. In this embodiment, a total of 56 storage members 82A are provided in one customer tray 8A. Further, as shown in FIG. 3, the side surface of the tray main body 81A is attached with a barcode 817 storing the test results of each IC device accommodated in the customer tray 8A.

[0041] Note that the number of IC devices that can be accommodated in the customer tray 8D is not particularly limited to the present invention, and coincides with the number of simultaneous measurements in the test head 7, or the number of simultaneous measurements is adjusted. If the total number of IC devices that can be accommodated in multiple customer trays 8D matches the number of simultaneous measurements or is an integral multiple of the number of simultaneous measurements, The test efficiency of the child component testing apparatus can be improved.

[0042] As shown in Fig. 4A, the holding portion 811 of the tray body 81A has a tapered portion 812 that extends outwardly in a tapered shape, and has a step-like shape in the substantially central portion. A step portion 813 is provided, and a large-diameter portion 814 having a larger inner diameter is provided below the step portion 813.

As shown in FIGS. 4A and 5, the housing member 82A has a concave portion 821 for housing the IC device in a substantially central portion. An opening 822 is formed at the bottom of the recess 821 so that the input / output terminal HB of the IC device can face the back side of the customer tray 8A. In the present embodiment, only one recess 821 is formed in one housing member 82A. However, the present invention is not particularly limited to this, and one housing member 82A has two or more recesses 821. You may prepare.

[0044] Guide holes 824 for fitting guide pins 72 provided in the test head 7 are provided on both sides of the recess 821 so as to penetrate the accommodating member 82A. The lower opening of the guide hole 824 has a tapered surface 825 that expands in a tapered manner toward the outside so as to be guided by the housing member 82A force S socket 70 !.

[0045] On the outer peripheral surface of the accommodating member 82A, a tapered portion 823 that is constricted in a tapered shape by being directed inward is provided at the upper portion so as to face the tapered portion 812 of the tray body 81A. A projecting portion 826 projecting in the direction is provided at the lower portion. As shown in FIG. 5, the projecting portion 826 has a substantially L-shaped notch 827 formed at the base thereof, and can be elastically deformed in the direction of the arrow shown in FIG. When inserting the storage member 82A into the holding portion 811 of the tray main body 81A, the storage member 82A is inserted from above the tray main body 81A with the projection 826 pushed inward.

[0046] Thus, in the present embodiment, only the housing member 82A can be detached from the customer tray 8A. Thus, when the type of IC device is changed, the customer tray 8A can be made compatible with the type change by changing only the housing member 82A in the customer tray 8A.

[0047] As shown in FIG. 4A, the taper 823 and the protrusion 826 in the housing member 82A are excluded! The outer diameters of these parts are the taper 812 and the large diameter in the holding part 811 of the tray body 81A. It is smaller than the inner diameter of the portion excluding the portion 814. Due to this inner diameter difference, the accommodating member 82A can move relative to the tray body 81A.

[0048] The customer tray 8A in the present embodiment has a fixed relative movement of the housing member 82A with respect to the tray body 81A in a normal state (a state where no load is applied to the housing member 82A). When a downward force is applied to 82A, an upward force is applied to the accommodating member 82A so that it is in a floating state with respect to the tray body 81A.

That is, when the accommodating member 82A is lowered by its own weight, as shown in FIG. 4A, the tapered portion 812 of the tray body 81A and the tapered portion 823 of the accommodating member 82A are in close contact with each other. The relative movement of the housing member 82A is fixed with respect to the tray body 81A.

[0050] On the other hand, when the accommodating member 82A rises with respect to the tray main body 81A due to contact with the guide pin 72 of the test head 7, etc., as shown in FIG. 4B, the taper portion 812 of the tray main body 81A The accommodating member 82A is separated from the tapered portion 823, and the accommodating member 82A can move relative to the tray main body 81A along the main surface direction of the customer tray 8A. Note that the upper limit of the upward movement of the housing member 82A is regulated by the protrusion 826 of the housing member 82A coming into contact with the step 814 of the holding portion 811.

[0051] Note that the customer tray housing member may be configured as follows.

FIG. 6 is a plan view showing a customer tray housing member according to the second embodiment of the present invention.

[0053] In the second embodiment of the present invention, a plate panel member 828 is interposed between the holding portion 811 of the tray main body 81B and the outer peripheral surface of the accommodating member 82B. The plate panel member 828 is provided on all sides of the housing member 82B.

[0054] In this customer tray 8B, in a normal state, each plate panel member 828 presses the accommodating member 82B, and the relative movement of the accommodating member 82B with respect to the tray body 81B is fixed. Then, when the guide pin 72 provided on the test head 7 is inserted into the guide hole 824, the accommodating member 82B acts against the tray main body 81B against the elastic force of the plate panel member 828. The housing member 82B is guided by the guide pins.

FIG. 7 is an enlarged cross-sectional view of a customer tray in the third embodiment of the present invention. [0056] In the third embodiment of the present invention, instead of the tapered portions 812, 823 and the plate panel member 828, the housing member 82C is provided with a shaft 829 that protrudes downward and is applied to the shaft 829. A fitting hole 815 is formed in the tray body 81c so as to oppose to the tray body 81c. On the upper part of the fitting hole 815, an enlarged-diameter part 816 is formed that is expanded outward in a tapered shape.

In this customer tray 8C, in a normal state, the shaft 829 is fitted into the fitting hole 815 due to the weight of the housing member 82C, and the relative movement of the housing member 82C with respect to the tray body 81C is fixed.

On the other hand, when the accommodating member 82C rises with respect to the tray main body 81C due to contact with the guide pin 72 of the test head 7 or the like, the shaft 829 has a diameter-enlarged portion 816 of the guide hole 815, although not particularly illustrated. Therefore, the accommodating member 82C can move relative to the tray body 81C along the main surface direction of the customer tray 8C.

Next, each part of the electronic component test apparatus according to the first embodiment of the present invention will be described in detail.

[0060] <Loader unit 200>

As shown in FIG. 2, the loader unit 200 includes a tray moving device 210 that moves the customer tray 8 A supplied to the drum 1 in a stacked state to the transport frame 9.

As shown in FIG. 8, the conveyance frame 9 has two tray accommodating portions 91 that can accommodate customer trays 82B, and one conveyance frame 9 accommodates two customer trays 8A. It is becoming possible. The tray accommodating portion 91 penetrates the conveyance frame 9 and has a protrusion 92 protruding inward at the lower portion thereof. The customer tray 8A accommodated in the tray accommodating portion 91 is held by the protrusion 92, and the input / output terminal HB of the IC device accommodated in the customer tray 8A can face the back side of the tray transport frame 9. It has become. In the present invention, three or more tray accommodating portions 91 may be formed in the conveyance frame 9 so that one conveyance frame 9 can accommodate three or more customer trays 82B. Further, a hook (not shown) for holding the customer tray 8A accommodated in the tray accommodating portion 91 may be provided on the upper surface of the transport frame 9.

[0063] As shown in FIG. 2, the tray moving device 210 is arranged on the device substrate of the handler 1 in the Y-axis direction. The Y-axis rail 211 installed in this way, the movable arm 212 that can reciprocate along the vertical axis rail 211, and the movable arm 212 supported by the movable arm 212, and can be moved up and down by an actuator (not shown) Two gripping heads 213 are provided. Each gripping head 213 has an open / close-type gripping claw downward for gripping the customer tray 8 Α, although not particularly shown.

[0064] This tray moving device 210 is configured such that after the gripping head 213 grips and raises the customer tray 8Α located at the uppermost stage of the laminate including the customer tray 8Α supplied with the pre-process force to the handler 1, The movable arm 212 moves on the axial rail 211 and places the customer tray 8 に in the tray accommodating portion 91 of the transport frame 9. When two customer trays 8 mm are placed, the conveyance frame 9 is carried into the application unit 200.

[0065] <Applying unit 300>

The application unit 300 has a thermostatic chamber that applies a target high or low temperature stress to the IC device housed in the customer tray 8 mm. Inside the thermostatic chamber, FIG. 1 and FIG. There is a vertical conveyor that is conceptually shown in!

[0066] The vertical transfer device can hold a plurality of transfer frames 9 containing the customer tray 8mm, and can sequentially move the transfer frames 9 in the axial direction. . Until the test unit 400 becomes empty, the transfer frame 9 stands by in the application unit 300 while being held by the vertical transfer device, so that a high or low temperature stress of about 55 to + 150 ° C is applied to the IC. Applied to the device. When a predetermined thermal stress is applied to the IC device by the application unit 300, the transport frame 9 is carried into the test unit 400.

[0067] <Test unit 400>

FIG. 9A is an enlarged cross-sectional view showing a state in which the customer tray housing member and the guide pin of the test head are in contact with each other when the IC device is tested in the first embodiment of the present invention, and FIG. 9B is the IC in the first embodiment of the present invention. It is an expanded sectional view which shows the state which is testing the device.

[0068] While maintaining the thermal stress applied to the IC device, the test unit 400 presses the IC device accommodated in the customer tray 8A against the socket 70 of the test head 7 to input / output the IC device. Contact the terminal HB and the contact pin 71 of the socket 70 electrically, It has a test chamber for performing vice tests. The upper portion of the test head 7 is inserted into the inside of the test chamber through an opening (not shown) formed in the apparatus substrate, and the socket 70 is located inside the test chamber.

[0069] In the test unit 400, when the transport frame 9 is transported from the application unit 300 and each customer tray 8A is positioned above the test head 7, the transport frame 9 containing the customer tray 8A, and The pusher 410 provided above the test head 7 descends toward the test head 7, and first, as shown in FIG. 9A, guide pins 72 provided around the socket 70 on the test head 7 are provided. It abuts on each accommodating member 82A of the customer tray 8A. By this contact, the storage member 82A rises with respect to the tray body 81A, and the close contact between the taper portions 812 and 823 is released. Therefore, the storage member 82A is in contact with the tray body 81A and the main surface of the customer tray 8A. Relative movement is possible along the direction.

[0070] Guide pin 72 on the test head 7 side 72 force Guided along the taper surface 825 of the guide hole 824 of the housing member 82A, and the housing member 82A moves relative to the tray body 81A and moves into the guide hole 824. When mated, the IC device is positioned relative to the socket 70. When the pusher 410 further descends from this state, as shown in FIG. 9B, the guide pin 412 of the pusher 410 is also fitted with the upward force into the guide hole 824 of the housing member 82A, and the pressing portion 411 is recessed in the housing member 82A. Enter 821 and press the IC device into socket 70. By this pressing, the input / output terminal HB of the IC device is brought into electrical contact with the contact pin 71 of the socket 70, and the test of the IC device is executed by a tester (not shown) through the test head 7. The IC device test results are given as a barcode on the side of the customer tray 8A. When the IC device test is completed, the transfer frame 9 is delivered to the heat removal unit 500. The IC device test results can be transferred as data from the handler 1 to the dedicated classification device 1000 in addition to attaching barcodes and IC chips to the customer tray 8A itself!

[0071] <Heat removal unit 500>

The heat removal unit 500 has a heat removal tank for removing the applied thermal stress from the tested IC device, and conceptually shown in FIGS. 1 and 2 inside the heat removal tank. A vertical transfer device is provided.

[0072] The vertical transfer device may hold a plurality of transfer frames 9 containing the customer tray 8A. It is possible to move these transport frames 9 sequentially along the Z-axis direction.

In this heat removal unit 500, when a high temperature is applied to the IC device by the application unit 300, the IC device is cooled to the room temperature by blowing air and then transferred to the unloader unit 600. On the other hand, when a low temperature is applied to the IC device by the application unit 300, the IC device is heated with warm air or a heater, etc., and returned to a temperature at which condensation does not occur, and then carried out to the unloader unit 600.

[0074] <Unloader section 600>

As shown in FIG. 2, the unloader unit 600 moves the tray from the conveyance frame 9 carried out from the heat removal unit 500 to the customer tray 8A that is carried out from the handler 1 on the laminate including the customer tray 8A. A device 610 is provided.

As shown in FIG. 2, the tray moving device 610 has the same configuration as the tray moving device 210 of the loader unit 200, and is constructed on the device substrate of the handler 1 along the Y-axis direction. The Y-axis rail 611, the working arm 612 that can reciprocate along the Y-axis direction on the Y-axis rail 611, and the movable arm 612, which can be moved up and down by an actuator (not shown) 2 And two gripping heads 613. Although not specifically shown, each gripping head 613 has an openable gripping claw for gripping the customer tray 8A downward.

The tray moving device 610 moves the movable arm 612 on the Y-axis direction rail 611 after the customer head 8A accommodated in the transport frame 9 is gripped and lifted by the gripping head 613. Then, the customer tray 8A is moved onto the laminate composed of the customer tray 8A carried out from the handler 1.

[0077] <Classification device 1000>

FIG. 10 is a perspective view showing a cassette used for transporting a customer tray between the electronic component test apparatus and the classification dedicated apparatus in the first embodiment of the present invention, and FIG. 11 is used in the first embodiment of the present invention. It is a top view which shows a classification exclusive apparatus.

[0078] The laminated body composed of the customer tray 8A carried out from the handler 1 is accommodated in a force set 85 as shown in FIG. 10, and the classification dedicated apparatus is used by an operator or an automatic conveying apparatus such as ADV. Carried to 1000.

[0079] The classification dedicated apparatus 1000 is a dedicated apparatus for classifying the IC devices based on the test results of the IC devices by the electronic component testing apparatus, and is accommodated in the cassette 85 and transported to the classification dedicated apparatus 1000. Each IC device on customer tray 8A can be transferred to customer trays 8A to 8A according to the test results.

14

[0080] As shown in Fig. 11, the classification dedicated apparatus 1000 includes a Y-axis direction rail 1100 installed along the Y-axis direction on the apparatus substrate of the classification-specific apparatus 1000, and the Y-axis direction rail 110 0. A movable arm 1200 capable of reciprocating along the Y-axis direction, a movable head 1300 supported so as to be movable along the X-axis direction on the movable arm 1200, and an actuator (not shown) supported by the movable head 1300. 8 suction heads 1400 that can be moved up and down by the

[0081] This dedicated classification device 1000 recognizes the test result of each IC device based on the barcode attached to the side surface of the customer tray 8A, and the IC on the customer tray 8A contained in the cassette 85. The device is lifted with suction head 1400 sucked and held, movable head 1300 moves on movable arm 1200, and movable rail 1200 moves on Y-axis direction rail 1100. Place the IC device on 8A.

14

In addition, in the classification dedicated apparatus 1000 according to the present embodiment, as shown in FIG. 11, since it is possible to sort into four categories 8A to 8A, in addition to non-defective products and defective products. ,

14

Among non-defective products, it is possible to sort them into high-speed, medium-speed, or low-speed items. Specifically, for example, in FIG. 11, the leftmost customer tray 8A is a high-speed IC device, the second customer tray 8A from the left is a medium-speed IC device, and the third customer tray 8A from the left Is a slow IC device

twenty three

Thus, the leftmost customer tray 8A accommodates defective IC devices.

Four

In the present invention, the number of categories of the sorting destination is not particularly limited to four, and may be five or more categories including defective products that need to be tested again.

[0083] Generally, the IC device classification process tends to be a bottleneck process, but in this embodiment, the IC device classification work is performed by the classification dedicated apparatus 1000 independent of the electronic component testing apparatus. Adjust the load of the classification process by increasing or decreasing the number of 1000 devices It is possible to

[0084] As customer trays 8A to 8A for accommodating the IC devices after sorting, no

14

An inexpensive tray that does not have a floating mechanism, etc., may be used separately from the customer tray 8A transported inside.

[0085] As described above, in the present embodiment, the customer tray has a floating function that allows the accommodating member 82A to move relative to the test tray 81A, so that the thermal expansion of the customer tray 8A can be achieved at the time of contact. It is possible to absorb the error in the position of the IC device relative to the socket 70 due to the cache accuracy and to test the IC device while it is mounted on the customer tray 8A.

[0086] In the present embodiment, since the relative movement of the accommodating member 82A can be fixed by the fixing mechanism including the taper portions 812 and 823, the customer can be used in the processes other than the test process as usual. A tray can be used.

FIG. 12 is an enlarged cross-sectional view showing a customer tray that is being transported in the electronic component test apparatus in the fourth embodiment of the present invention, and FIG. 13 is a test section of the electronic component test apparatus according to the fourth embodiment of the present invention. FIG. 14 is an enlarged cross-sectional view showing a state where an IC device is tested in the fourth embodiment of the present invention.

The electronic component testing apparatus according to the fourth embodiment of the present invention is different from the electronic component testing apparatus according to the first embodiment described above in the following three points.

That is, the electronic component test apparatus according to the present embodiment includes (a) an empty customer tray 8E that does not contain an IC device (hereinafter simply referred to as an empty tray 8E) on a customer tray 8D that contains an IC device. (2) The point where the two customer trays 8D and 8E are overlapped and transported in the nodola, and (b) the customer tray 8D is inverted (that is, the input / output terminal HB is connected). The electronic component test according to the first embodiment is the point that the IC device is transported in a posture facing upward), and (c) the customer tray 8D force empty tray 8E is removed and attached before and after the test in the test unit 400. Different from the device.

[0090] Regarding the electronic component testing apparatus according to the fourth embodiment of the present invention, the description of the same configuration as the electronic component testing apparatus according to the first embodiment is omitted, and the electronic component testing apparatus according to the first embodiment is omitted. Only the differences will be described below. In the present embodiment, as shown in FIG. 12, the customer tray 8D supplies the pre-process force to the loader unit 200 of the handler 1 with the IC device input / output terminal HB facing upward. Also, as shown in the figure, an empty tray 8E that does not contain an IC device is placed on the customer tray 8D that accommodates an IC device in an inverted state. Supplied to the loader unit 200 of the handler 1. In this embodiment, the customer tray 8D is transported in the handler 1 with the IC device inverted and the empty tray 8E overlapped. The customer tray 8D that houses the IC device and the empty customer tray (empty tray) 8E that can accommodate the IC device are trays of the same structure and shape.

As shown in FIG. 13, the test unit in this embodiment removes the empty tray 8E from the top of the customer tray 8D in which the IC device immediately before the test is accommodated, as shown in FIG. When completed, an attaching / detaching device 450 for re-mounting the empty tray 8E is provided on the customer tray 8D. Although only one set of attachment / detachment device 450 is shown in FIG. 13, as shown in FIGS. 1 and 2, since two transfer frames 9 are simultaneously loaded into the test section, Two sets of attachment / detachment devices 450 are provided.

As shown in the figure, the attachment / detachment device 450 removes the customer tray 8D from above the empty tray 8E, and moves the empty tray 8E to the forwarding device 470, and the removal device The feeding device 470 transports the empty tray 8E moved by 460 to the mounting device 480, and the mounting device 480 that covers the empty tray 8E transported by the forwarding device 470 on the customer tray 8D again. .

As shown in FIG. 13, the removal device 460 includes a Y-axis direction rail 461 installed on the device board of the handler 1 along the Y-axis direction and the Y-axis direction rail 461 on the Y-axis direction. And a gripping head 463 that is provided at the tip of the movable arm 461 and that can be moved up and down by an unillustrated actuator. The gripping head 463 has an openable and closing gripping claw 464 for gripping the customer tray 8D downward. In this embodiment, eight gripping claws 464 are provided in one gripping head 463, and two empty trays 8E can be moved by the removal device 460 at the same time.

[0095] The forwarding device 470 is composed of, for example, a belt conveyor, and the operation of the removal device 460. The customer tray 8D can be moved from the area to the operating area of the mounting device 480.

[0096] As shown in the figure, the mounting device 480 includes a Y-axis direction rail 481 installed on the device board of the handler 1 along the Y-axis direction, and the Y-axis direction rail 481 extending in the Y-axis direction. A movable arm 482 that can move back and forth along, and a gripping head 483 that is provided at the distal end of the movable arm 482 and that can be moved up and down by an unillustrated actuator, are provided. The gripping head 483 has an open / close type gripping claw 484 for gripping the empty tray 8E facing downward. In the present embodiment, eight gripping claws 484 are provided in one gripping head 483, and two empty trays 8E can be moved simultaneously by the mounting device 480.

In the test unit of the present embodiment, first, the removal device 460 of the attachment / detachment device 450 removes the empty tray 8E from the top of the customer tray 8D, and moves the empty tray 8E to the forwarding device 470.

[0098] The customer tray 8D from which the empty tray 8E has been removed is moved onto the test head 7, and as shown in FIG. 14, the input / output terminal HB faces upward and is moved by a Z-axis drive mechanism (not shown). The IC device is pressed against the socket 70 through the pusher 410, and the I / O terminal HB of the IC device is in electrical contact with the contact pin 71 of the socket, and the IC is tested by a tester (not shown) through the test head 7. A device test is run. When the test is completed, the customer tray 8D is delivered from the top of the test head 7 to the heat removal unit 500 side while holding the tested IC device.

[0099] Simultaneously with the IC device test, the forwarding device 470 moves the empty tray 8E along the X-axis direction. Next, when the customer tray 8D is discharged from the test head 7 toward the heat removal unit 500, the mounting device 480 receives the empty tray 8E from the forwarding device 470, and puts the empty tray 8E on the customer tray 8D again. The customer tray 8D and the empty tray 8E are carried out to the heat removal unit 500 in an overlapped state.

As described above, in this embodiment, since the customer tray 8D containing the IC device is transported with the empty tray 8E placed on the customer tray 8D, the IC device pops out during the transportation. Can be prevented.

[0101] Further, in this embodiment, the customer puts the IC device input / output terminal HB upward. By transporting the tray 8D and executing the IC device test, it is not necessary to form an opening in the customer tray 8D to allow the input / output terminal HB of the IC device to face the back of the customer tray 8D. Therefore, it is possible to prevent the IC device from falling through this opening.

The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment includes all design changes and equivalents belonging to the technical scope of the present invention.

Claims

The scope of the claims

[1] A customer tray that is carried in or out in a state in which the electronic device under test that has been tested or has been tested is stored in an electronic device testing apparatus for testing the electronic device under test.

Accommodation means capable of accommodating the electronic device under test;

A tray body for holding the accommodating means;

Floating means for enabling relative movement of the receiving means with respect to the tray main body.

2. The customer tray according to claim 1, further comprising fixing means for fixing relative movement of the accommodating means with respect to the tray main body.

[3] The customer tray according to claim 1 or 2, wherein the accommodating means is detachable from the tray main body force.

[4] In order to test the electronic device under test by pressing the electronic device under test against the contact portion of the test head and electrically contacting the input / output terminals of the electronic device under test with the contact pins of the contact portion An electronic component testing apparatus,

The electronic device under test is pressed against the contact portion while the electronic device under test is accommodated in the customer tray according to any one of claims 1 to 3, and an input / output terminal of the electronic device under test is connected to the contact An electronic component testing device characterized in that it is in electrical contact with the contact pins of the part.

[5] The customer tray further includes guide means for guiding the accommodating means to the contact portion,

At least when the electronic component to be tested is pressed against the contact portion, the storage means is released from being fixed by the fixing means, and can be moved relative to the tray body by the floating means. 5. The electronic component testing apparatus according to claim 4, wherein the electronic component testing apparatus is guided to the contact portion by guide means.

[6] A loader unit that mounts the customer tray containing the electronic device under test before the test in a transport frame in which one or more of the customer trays can be mounted;

A state in which the electronic device under test is accommodated in the customer tray mounted on the conveyance frame An application unit that applies a thermal stress of a predetermined temperature to the electronic device under test, and the electronic device under test accommodated in the customer tray in a state where the customer tray is mounted on the transport frame. A test unit that is pressed against the contact unit, and a removal unit that removes thermal stress from the electronic device under test in a state where the electronic device under test is accommodated in the customer tray mounted on the conveyance frame;

6. The electronic component testing device according to claim 4, further comprising: an unloader unit that removes the customer tray that houses the electronic device under test after the test from the conveyance frame.

7. The electronic component testing apparatus according to claim 6, wherein the application unit, the test unit, and the removal unit are provided on the rear side of the loader unit and the unloader unit.

[8] The electronic device under test is accommodated in a state where the electronic device under test is accommodated on the customer tray accommodating the electronic device under test and an empty customer tray is covered. 8. The electronic component testing apparatus according to claim 4, wherein the electronic component testing apparatus transports a customer tray.

[9] In the state where the customer tray is inverted, the customer tray is transported, and the electronic device under test housed in the customer tray is pressed against the contact portion of the test head. The electronic component test apparatus according to claim 4.

[10] The total number of electronic components under test accommodated in one or more customer trays is equal to the number of simultaneous measurements in the test head of the electronic component testing apparatus or is an integer multiple of the simultaneous measurement constant. 11. The electronic component test apparatus according to claim 4, wherein the electronic component test apparatus is any one of claims 4 to 10.