CN113720563A

CN113720563A - Test processor and control method thereof

Info

Publication number: CN113720563A
Application number: CN202110564855.7A
Authority: CN
Inventors: 崔凡洛; 崔僖峻
Original assignee: Techwing Co Ltd
Current assignee: Techwing Co Ltd
Priority date: 2020-05-25
Filing date: 2021-05-24
Publication date: 2021-11-30
Also published as: TWI807327B; TW202144754A; TW202342956A; TW202342954A

Abstract

The invention relates to a test processor and a control method thereof. Specifically, according to an embodiment of the present invention, there may be provided a test processor including: a pouch frame having a plurality of pouch spaces for accommodating electronic components; and a plurality of impact absorbing members disposed in the plurality of pocket spaces for seating the electronic parts, the impact absorbing members being formed of an elastic material to absorb an impact applied to the electronic parts when the electronic parts fall toward the impact absorbing members so that the electronic parts are seated on the impact absorbing members, a plurality of wall portions being formed to protrude upward in the pocket frame in such a manner as to surround the impact absorbing members.

Description

Test processor and control method thereof

Technical Field

The invention relates to a test processor and a control method thereof.

Background

With recent development of technical fields relating to electronic components such as semiconductor elements, demands for electronic components are increasing. In particular, electronic components that are small in size and have improved functions are required. Accordingly, the size of the electronic component is reduced, but the number of terminals of one electronic component is increased, so that the number of terminals per unit area of the electronic component is increased. In the case of such an electronic component, even under the same impact, the impact applied to one terminal is larger than an electronic component having a small number of terminals per unit area. Therefore, in the process of testing the electronic parts, it becomes more vulnerable to the impact applied to the electronic parts.

On the other hand, when electronic parts are manufactured through a predetermined manufacturing process, tests are performed by a test handler (test handler) and a tester (tester), and classified by grades according to test results. In such a test process, the electronic components are moved through a predetermined path while being loaded on a test tray (test tray) and tested. However, electronic components manufactured by a predetermined manufacturing process are loaded in a customer tray (customer tray) to be supplied, and are transferred from the customer tray to a test tray through various work stations including a buffer station in order to test them. In addition, the electronic parts pass through the open unit so as to be seated on the test tray. In this way, in order to test electronic parts, the electronic parts are loaded from the customer tray, passed through the table, the opening unit, and held by the loading/unloading device a plurality of times until being unloaded onto the test tray, and then subjected to a process of releasing the holding.

At this time, when the loading/unloading device grips the electronic part or releases the grip of the electronic part, a predetermined impact will be applied to the electronic part. In particular, in the process of vacuum-sucking the electronic part to hold the electronic part, the electronic part may be damaged due to a predetermined pressing force applied to the electronic part. For example, when the electronic component is pressurized to perform vacuum suction, a terminal portion of the electronic component may be deformed, and the electronic component itself may be bent (bending). As another example, electronic components having special uses may be manufactured in a form that is bent from the beginning to suit the purpose, and among the terminals of these electronic components, the terminal disposed at the outermost side may receive stronger impact than the terminal disposed at the inner side. In this way, in the electronic component in the bent form, the edge portion is more fragile to impact than the inner side, and may be more likely to be damaged.

In addition, when the rigidity of the test tray is greater than that of the electronic parts, the electronic parts may be damaged when the electronic parts are placed on the test tray or the like. In this way, when the electronic component is transferred to be tested or is being tested, predetermined damage continues to accumulate, and when the number of terminals per unit area of the electronic component increases, the impact accumulated on one terminal becomes large. The accumulation of such shock becomes a factor of the performance degradation of the electronic component.

Therefore, there is a need to minimize the impact applied to the electronic component during the transfer of the electronic component for testing or being tested, and to prevent damage to the terminals of the electronic component.

Disclosure of Invention

In view of the foregoing background, embodiments of the present invention have been invented to provide a test handler to minimize impact applied to electronic parts during a process of transferring to test the electronic parts and a test process, and to prevent damage to terminals of the electronic parts.

According to an embodiment of the present invention, there may be provided a test processor including: a pocket (pocket) frame having a plurality of pocket spaces for receiving electronic components; and

a plurality of impact absorbing members disposed in the plurality of pocket spaces for seating the electronic parts, the impact absorbing members being formed of an elastic material to absorb an impact applied to the electronic parts when the electronic parts fall toward the impact absorbing members so that the electronic parts are seated on the impact absorbing members, a plurality of wall portions being formed to protrude upward in the pocket frame in such a manner as to surround the impact absorbing members.

Further, there may be provided a test handler, the impact absorbing member comprising: a first impact absorbing member; and a second impact absorbing member disposed above the first impact absorbing member, the second impact absorbing member having a surface friction coefficient smaller than that of the first impact absorbing member,

the elastic force of the first impact absorbing member is higher than the elastic force of the second impact absorbing member.

Further, it is possible to provide a test handler, the plurality of wall portions being spaced apart from the impact absorbing member by a predetermined distance in a horizontal direction so that a spacing space is provided between the wall portions and the impact absorbing member, a part of the electronic component being disposed in the spacing space when the electronic component is seated on the impact absorbing member, a pocket opening hole being formed in the pocket frame to penetrate the pocket frame, and a buffer opening hole being formed in the impact absorbing member to penetrate the impact absorbing member to correspond to the pocket opening hole.

Further, there may be provided a test handler, the impact absorbing member comprising: a first impact absorbing member; and a second impact absorbing member disposed above the first impact absorbing member, the open buffer hole including: a first cushion open hole formed in the first impact absorbing member to correspond to the bag-shaped open hole; and a second buffer open hole formed in the second impact absorbing member to correspond to the first buffer open hole.

Further, a test processor may be provided, comprising: a main body portion; a pouch-shaped frame detachably coupled to the main body, the pouch-shaped frame having a pouch-shaped space in which the electronic component can be placed; and

and an impact absorbing member interposed between the pouch frame and the body portion, in which the electronic component can be seated, the impact absorbing member being formed of an elastic material to absorb an impact applied to the electronic component when the electronic component falls toward the impact absorbing member, thereby seating the electronic component on the impact absorbing member.

Further, it is possible to provide a test processor in which a bag-shaped groove portion in which any one portion of the impact absorbing member can be housed is formed in the bag-shaped frame, a body groove portion in which another portion of the impact absorbing member can be housed is formed in the body portion, and the impact absorbing member is fixedly supported on the bag-shaped frame and the body portion by being housed in the bag-shaped groove portion on one side and in the body groove portion on the other side.

Further, a test processor may be provided, comprising: a main body portion; a pouch-shaped frame detachably coupled to the main body, the pouch-shaped frame having a pouch-shaped space in which an electronic component can be placed; and

and a support member interposed between the bag-shaped frame and the body portion, the support member being capable of receiving the electronic component, the support member having a first open hole and a plurality of second open holes formed therein, wherein when the electronic component is received on the support member, a part of the terminals of the electronic component is capable of passing through the first open hole, another part of the terminals of the electronic component is capable of passing through the plurality of second open holes, and the plurality of second open holes are capable of being formed along a periphery of the first open hole.

Further, it is possible to provide a test handler in which a protrusion for supporting the support member is formed in the body portion to protrude from one surface of the body portion, a pocket groove portion into which the support member can be inserted is formed in the pocket frame, and the support member is fixedly supported on the pocket frame by inserting at least a part of the protrusion and the support member into the pocket groove portion when the pocket frame is coupled with the body portion.

Further, there may be provided a test handler, in which a first fixing member is provided in the pouch frame, in the body portion, a second fixing member for engaging with the first fixing member is formed, in which a support fixing hole is formed in the support member, the support fixing hole being provided at a position corresponding to the second fixing member and for engaging with any one of the first fixing member and the second fixing member,

and either one of the first fixing element and the second fixing element is engaged with the other one of the first fixing element and the second fixing element at the support fixing hole to fix the support member to the main body.

Further, a test processor may be provided, comprising: a test tray including a tray frame in which a receiving portion in which an electronic component can be placed is formed, and a holding unit capable of supporting the electronic component on the receiving portion so that the electronic component does not come off from the receiving portion; and an opening unit capable of pressurizing the holding unit so that the electronic component can be detached from the housing portion, the opening unit including: an open unit body capable of pressurizing the holding unit by approaching the test tray; and a buffer support member supported by the open unit body, at least a portion of which is arrangeable inside the housing portion when the open unit body pressurizes the holding unit, the buffer support member provided inside the housing portion being formed of an elastic material to absorb an impact applied to the electronic component when the electronic component falls toward the buffer support member, thereby seating the electronic component on the buffer support member, a tray support portion capable of supporting the electronic component arranged in the housing portion is provided in the tray frame when the open unit is spaced apart from the holding unit, and an upper surface of the buffer support member is located at an upper side of an upper end of the tray support portion when the buffer support member is arranged inside the housing portion.

Further, a test processor may be provided, comprising: a test tray including a tray frame in which a receiving portion in which an electronic component can be placed is formed, and a holding unit capable of supporting the electronic component on the receiving portion so that the electronic component does not come off from the receiving portion; and

an opening unit capable of pressurizing the holding unit to enable the electronic component to be separated from the accommodating portion,

the open cell includes:

an open unit body capable of pressurizing the holding unit by approaching the test tray; and

a buffer support member supported by the open unit main body and at least a part of which is capable of being disposed inside the housing portion when the open unit main body pressurizes the holding unit,

the buffer support member disposed inside the housing portion is formed of an elastic material to absorb an impact applied to the electronic component when a predetermined pressure is applied to the electronic component placed on the buffer support member,

a tray support portion capable of supporting the electronic component arranged in the housing portion is provided in the tray frame when the opening unit is spaced apart from the holding unit,

when the buffer support member is arranged inside the accommodating portion, the upper surface of the buffer support member is positioned above the upper end of the tray support portion.

Further, a test processor may be provided, comprising:

a test tray including a tray frame in which a housing portion in which an electronic component can be disposed is formed, a tray support member for supporting between a plurality of terminals of the electronic component disposed in the housing portion, and a holding unit capable of supporting the electronic component on the tray support member so that the electronic component does not come off from the housing portion; and

the open cell includes:

a buffer support member supported by the open cell body and formed of an elastic material,

an open hole is formed in the tray supporting member, through which at least a portion of the terminal of the electronic component can pass when the electronic component is seated in the tray supporting member.

Further, a test handler may be provided, when the electronic part falls toward the tray supporting part or a predetermined pressure is applied to the electronic part seated on the tray supporting part, the buffer supporting part abuts against a bottom surface of the tray supporting part to absorb an impact applied to the tray supporting part and the electronic part and to support the electronic part exposed through the open hole.

Further, there may be provided a test processor control method comprising:

a moving step in which the loading device moves to above the accommodating portion of the tray frame while holding the electronic component;

a raising step of raising the open unit main body so that the buffer support member supported by the open unit main body is brought into close contact with a bottom surface of the tray support member supported on a lower side of the tray frame;

a holding releasing step of releasing the electronic component from being held by the loading device so that the electronic component falls toward the accommodating portion;

an impact absorbing step of supporting the electronic component exposed through an open hole formed in the tray supporting member by the buffer supporting member so as to absorb an impact applied to the electronic component when the electronic component falls toward the tray supporting member; and

a descending step of descending the open unit main body so that the buffer support member is spaced apart from a bottom surface of the tray support member,

in the step of descending,

when the open unit body is lowered, at least a part of the plurality of terminals of the electronic component is inserted into the open hole.

Further, there may be provided a test processor control method comprising:

a moving step of moving the unloading device to above the accommodating part for holding the electronic component in the accommodating part of the tray frame; a raising step of raising the open unit main body so that the buffer support member supported by the open unit main body is brought into close contact with a bottom surface of the tray support member supported on a lower side of the tray frame;

a holding step of the unloading device holding the electronic component supported by the tray supporting member;

an impact absorbing step of supporting the electronic component exposed through an open hole formed in the tray supporting member by the buffer supporting member so as to absorb an impact applied to the electronic component when a predetermined pressure is applied to the electronic component in the holding step; and

in the step of the raising,

when the open unit body is raised, at least a part of the terminals of the electronic component is raised while being inserted into the open hole.

Further, there may be provided a test handler controlling method further comprising an opening step of opening a holding unit to support or disengage the electronic component from the tray supporting member,

in the raising step, the open cell main body is raised to a predetermined position so that the open cell main body pressurizes the holding unit.

According to the embodiments of the present invention, there are effects of minimizing an impact applied to the electronic component during a process of transferring to test the electronic component and a test process, and preventing a terminal of the electronic component from being damaged.

Drawings

FIG. 1 is a perspective view conceptually illustrating a test processor, according to one embodiment of the present invention;

FIG. 2 is a perspective view of a table according to a first embodiment of the present invention;

FIG. 3 is a sectional view taken along A-A' of FIG. 2;

FIG. 4 is a cross-sectional view taken along A-A' of the table according to a second embodiment of the present invention;

FIG. 5 is a perspective view of a table according to a third embodiment of the present invention;

FIG. 6 is a sectional view taken along B-B' of FIG. 5;

FIG. 7 is a cross-sectional view of a table according to a fourth embodiment of the present invention taken along line B-B';

fig. 8 is a perspective view of a table according to a fifth embodiment of the present invention;

FIG. 9 is an exploded perspective view of the table of FIG. 8;

FIG. 10 is a bottom perspective view of the pouch frame of FIG. 9;

FIG. 11 is a perspective view of a table according to a sixth embodiment of the present invention;

FIG. 12 is an exploded perspective view of the table of FIG. 11;

fig. 13 is a bottom perspective view and a partial enlarged view of the pouch frame of fig. 12;

fig. 14 is an enlarged view of C of fig. 12;

FIG. 15 is a perspective view of the support member of FIG. 12;

FIG. 16 is a perspective view conceptually showing a test handler according to a seventh embodiment of the present invention;

FIG. 17 is a perspective view of the test tray and open cell of FIG. 16;

FIG. 18 is an enlarged perspective view of a portion of the test tray and open cell of FIG. 16;

FIG. 19 is a sectional view taken along D-D' of FIG. 18;

fig. 20 is a sectional view showing a mode in which the holding unit in fig. 18 is in a released state;

fig. 21 is a longitudinal sectional view of a test tray and an open unit according to an eighth embodiment of the present invention;

fig. 22 is a view showing a mode in which the opening unit of fig. 21 is raised and the holding unit is in a released state;

fig. 23 is an enlarged view of a portion E of fig. 22;

fig. 24 is a view showing a mode in which the open unit of fig. 22 is lowered and the holding unit is in a detachment prevention state;

FIG. 25 is an enlarged view of F in FIG. 24;

fig. 26 is a flowchart sequentially showing a test processor control method according to an eighth embodiment of the present invention.

Detailed Description

Hereinafter, specific embodiments for implementing the spirit of the present invention will be described in detail with reference to the accompanying drawings.

In describing the present invention, when it is judged that a detailed description of a related known configuration or function may make the gist of the present invention unclear, a detailed description thereof will be omitted.

In addition, when a certain component is referred to as being "connected", "supported", or "coupled" to another component, it is to be understood that the component may be directly connected, supported, or coupled to the other component, but the other component may be present therebetween.

The terminology used in the description is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Unless the context clearly dictates otherwise, singular expressions include plural expressions.

In addition, various constituent elements may be described using terms including ordinal numbers of first, second, etc., but the corresponding constituent elements are not limited by these terms. These terms are used only for the purpose of distinguishing one constituent element from another constituent element.

The meaning of "comprising" as used in the specification is to specify the presence of stated features, regions, integers, steps, actions, elements, and/or components, but does not preclude the presence or addition of other specified features, regions, integers, steps, actions, elements, components, and/or groups thereof.

In addition, in the present specification, the expressions of the upper part, the upper surface, and the like are explained based on the drawings, and may be expressed in different ways as long as the direction of the corresponding object is changed.

Hereinafter, a specific configuration of the test processor 1 according to an embodiment of the present invention will be described with reference to the drawings.

Hereinafter, referring to fig. 1, the test handler 1 according to an embodiment of the present invention may test electronic parts manufactured through a manufacturing process, sort by grades according to test results, and load in customer trays T1, T2. In addition, the test processor 1 may be detachably coupled to a tester (not shown). Such a test handler 1 may include a loading device 10, a test tray 20, a chamber 30, an unloading device 40, a stacker module 50, and a control section 60.

The loading device 10 may load the electronic components loaded in the first customer tray T1 into the test tray 20. Here, the electronic components placed on the first customer tray T1 are electronic components before being tested. The specific configuration of the loading device 10 will be described hereinafter.

The test tray 20 has a space in which electronic parts to be tested can be seated, and can be circulated along a predetermined path to test the electronic parts. In addition, the test tray 20 may house electronic parts that have completed testing.

The chamber 30 may include a wetted chamber 31, a test chamber 32, and a non-wetted chamber 33.

The wetting chamber 31 may preheat or precool the electronic parts loaded on the test tray 20 transferred from the loading position LP according to the test conditions.

The test chamber 32 may provide a space in which the electronic components preheated or precooled in the wetting chamber 31 and transferred to the inside of the test chamber 32 are tested.

The non-wetting chamber 33 may be heated or cooled inside the testing chamber 32 to assimilate the tested electronic components to the temperature required for unloading.

The unloading device 40 may sort the electronic components loaded in the test tray 20 transferred from the non-wetting chamber 33 by test grade and unload them to the second customer tray T2. Here, the electronic components placed on the second customer tray T2 are electronic components for which testing has been completed.

The stacker module 50 may store the first customer tray T1 and the second customer tray T2 loaded with electronic components.

The controller 60 may control driving of the loading device 10 and the unloading device 40. Such a control section 60 can be realized by an arithmetic device including a microprocessor, a measuring device such as a sensor, and a memory, and the implementation thereof will be apparent to those skilled in the art, and thus further detailed description thereof will be omitted.

On the other hand, in the present specification, the first customer tray T1 and the second customer tray T2 have been described as distinguished as electronic components before/after the loading test, but this is only an example to help understanding the specification, and in a practical project, the first customer tray T1 and the second customer tray T2 may be mixed during passing through the loading and unloading processes and may have the same shape and structure.

Hereinafter, a detailed configuration of the loading device 10 according to the first embodiment of the present invention will be described with reference to fig. 2 and 3. The loading device 10 may include a table 100 and a hand 200.

The work table 100 may provide a space where a plurality of electronic components loaded on the first customer tray T1 are temporarily placed before being loaded on the test tray 20, or a plurality of electronic components loaded on the test tray 20 are temporarily placed before being loaded on the second customer tray T1. Such a workstation 100 may be disposed between customer trays T1, T2 and test tray 20. In addition, the table 100 may include a pocket frame 110 and an impact absorbing member 120.

The pouch frame 110 may provide a space in which electronic components are seated. Such a pocket frame 110 may have a seating portion 111 and a wall portion 112 formed therein, and may have a pocket space P as a space in which electronic components are seated.

An impact absorbing member 120 may be disposed on the seating portion 111, and an electronic component may be seated in the impact absorbing member 120. Such a seating portion 111 may be formed on one surface of the pouch frame 110. In addition, a pouch-shaped open hole 111a penetrating the pouch-shaped frame 110 may be formed in the seating portion 111.

The wall portion 112 may guide the movement of the electronic component so that the electronic component descending toward the impact absorbing member 120 may be seated on the impact absorbing member 120. A plurality of such wall portions 112 may be provided, and the plurality of wall portions 112 may be formed to protrude upward to surround the impact absorbing member 120. In addition, the plurality of wall portions 112 may have a predetermined inclination toward the impact absorbing member 120.

The pocket space P may be a space in which the electronic component is disposed inside the pocket frame 110, and may be a space surrounded by the plurality of wall portions 112 and the impact absorbing member 120. A plurality of such pocket spaces P may be formed, and a plurality of electronic components may be arranged in the plurality of pocket spaces P.

When the electronic components are arranged in the pocket space P, the impact absorbing member 120 may provide a portion where the electronic components are seated. In addition, the impact absorbing member 120 can be made to absorb an impact applied to the electronic component. For example, when the electronic component falls toward the impact absorbing member 120, the impact absorbing member 120 can absorb the impact applied to the electronic component. Such an impact absorbing member 120 may include a material having an elastic material advantageous for impact absorption, and for example, may include silicon Si. A plurality of such impact absorbing members 120 may be provided, and a plurality of impact absorbing members 120 may be arranged in a plurality of pocket spaces P.

In addition, the impact absorbing member 120 may include a material having excellent lubricity. For example, the upper surface of the impact absorbing member 120 may be made of a material having excellent lubricity (i.e., a material having low frictional resistance) to minimize frictional force between the impact absorbing member 120 and the electronic component. In this way, when the upper surface of the impact absorbing member 120 includes a material with low frictional resistance so that the electronic component is seated on the impact absorbing member 120, it is possible to prevent the electronic component from slipping off the impact absorbing member 120 or poor seating from occurring. As another example, the surface of the impact absorbing member 120 may be formed as a flat surface without irregularities to prevent occurrence of poor seating of the electronic components.

The impact absorbing member 120 is disposed on the seat portion 111, and may be fixedly supported on the seat portion 111. For example, the impact absorbing member 120 may be adhered to the upper surface of the seating portion 111 by an adhesive (not shown). In addition, the impact absorbing member 120 may have a predetermined thickness, and a buffer open hole 120a penetrating the impact absorbing member 120 in a thickness direction (e.g., up-down direction in fig. 3) may be formed in the impact absorbing member 120. Such a cushioning open hole 120a may be formed in the impact absorbing member 120 to correspond to the pouch-shaped open hole 111 a. Accordingly, the pouch-shaped open hole 111a and the buffering open hole 120a may communicate with each other. In addition, when the electronic component is seated on the impact absorbing member 120, the buffer open holes 120a may prevent an air layer from being formed between the electronic component and the impact absorbing member 120 such that the electronic component is spaced apart from the impact absorbing member 120.

The hand 200 may hold a plurality of electronic components placed on the customer tray T1 and transfer the electronic components to the table 100, and may be placed on the impact absorbing member 120. The hand 200 can grip a plurality of electronic components placed on the table 100 and transfer the electronic components to the test tray 20. Further, the hand 200 can release the holding of the electronic component from above the impact absorbing member 120 and drop it.

For example, the hand 200 can hold the electronic component by a predetermined vacuum pressure. On the other hand, when the electronic component is held by the hand 200, an impact may be applied to the electronic component due to the pressure applied by the hand 200, but such an impact may be minimized by the impact absorbing member 120. In other words, when the hand 200 holds the electronic component, an impact applied to the electronic component can be absorbed by the impact absorbing member 120 by the elastic force of the impact absorbing member 120. In this way, there is an effect that the impact applied to the electronic component by the impact absorbing member 120 is minimized.

As another example, since the rigidity of the placement portion 111 is greater than that of the electronic component, when the hand 200 places the electronic component in the pocket space P, if the electronic component falls and is immediately placed on the placement portion 111, an impact may be applied to the electronic component. However, when the hand 200 releases the grip of the electronic component, the electronic component is seated on the impact absorbing member 120 having an elastic force, thereby minimizing the impact applied to the electronic component. In addition, the following effects are provided: by including a material having low frictional resistance on the upper surface of the impact absorbing member 120, even if the electronic component is placed on the upper surface of the impact absorbing member 120, it does not come off from the impact absorbing member 120 and can be placed at a predetermined position.

On the other hand, the unloading device 40 may be provided with a hand 200, and the hand 200 provided in the unloading device 40 may transfer the electronic components placed on the test tray 20 to the second customer tray T2. In addition, the hand 200 provided in the loading device 10 may be named a first hand 200, and the hand 200 provided in the unloading device 40 may be named a second hand 200.

On the other hand, according to the second embodiment of the present invention, in addition to these configurations, the impact absorbing member 120 may include a first impact absorbing member 121 and a second impact absorbing member 122. Hereinafter, the second embodiment of the present invention will be described further with reference to fig. 4. In describing the second embodiment, the points of difference from the above-described embodiment will be mainly described, and the same description and reference numerals refer to the above-described embodiment.

Referring to fig. 4, the impact absorbing member 120 may include a first impact absorbing member 121 and a second impact absorbing member 122, and the buffer open hole 120a may include a first buffer open hole 121a and a second buffer open hole 122 a.

The first impact absorbing member 121 may be disposed on the seating portion 111 and may be formed of an elastic material. Such an elastic force of the first impact absorption member 121 may be higher than that of the second impact absorption member 122. In addition, the first impact-absorbing member 121 may have a first buffer open hole 121a formed at the first impact-absorbing member 121 to correspond to the bag-shaped open hole 111 a.

The second impact absorbing member 122 may be disposed on the first impact absorbing member 121, and a portion where electronic components are disposed may be provided. In addition, the second impact absorbing member 122 may be formed with a second buffer opening hole 122a penetrating the second impact absorbing member 122 in the thickness direction (for example, the vertical direction in fig. 4). Such a second impact absorbing member 122 may have a predetermined elastic force and have a frictional resistance smaller than that of the first impact absorbing member 121. For example, the second impact absorbing member 122 may include engineering plastics (engineering plastics) having high lubricity due to low frictional resistance. In a more detailed example, the second impact absorbing member 122 may include at least one of nylon (nylon), polyphenylene ether (mPPO), Polycarbonate (PC), polyacetal (Acetal), and polybutylene terephthalate (PBT).

In this way, since the second impact absorbing member 122 has low frictional resistance, when the electronic component is placed on the second impact absorbing member 122, the electronic component has an effect of not being detached from the second impact absorbing member 122 to be placed on the second impact absorbing member 122.

In addition, the following effects are provided: since the second impact absorbing member 122 and the first impact absorbing member 121 have elastic force, when the electronic component is mounted on the second impact absorbing member 122, the impact between the second impact absorbing member 121 and the electronic component is absorbed by the first impact absorbing member 121 due to the elasticity of the first impact absorbing member 121.

Therefore, when the electronic component is placed on the second impact absorbing member 122, there is an effect that the impact applied to the electronic component is minimized.

On the other hand, in addition to such a constitution, according to the third embodiment of the present invention, the wall portion 112 may be provided at a distance from the impact absorbing member 120. Hereinafter, a third embodiment of the present invention will be described with further reference to fig. 5 and 6. In describing the third embodiment, differences from the above-described embodiment will be mainly described, and the same description and reference numerals will be given to the above-described embodiment.

Referring to fig. 5 and 6, the table 100 may include a pouch frame 110 and an impact absorbing member 120.

A pouch opening hole 111a penetrating the pouch space P may be formed in the pouch frame 110.

The wall portion 112 may be provided in plurality, and a plurality of wall portions 112 may be formed to protrude upward to surround the impact absorbing member 120.

In addition, the plurality of wall portions 112 may be provided at intervals from the impact absorbing member 120 in the horizontal direction. In other words, the plurality of wall portions 112 may be spaced apart from a face of the impact absorbing member 120 facing the wall portions 112 by a predetermined distance. In this way, the spacing space S can be provided between the wall portion 112 and the impact absorbing member 120 by disposing the plurality of wall portions 112 at intervals from the impact absorbing member 120.

The terminal portion of the electronic component may be disposed in the spacing space S. For example, the plurality of terminals may be arranged at an edge of the electronic component. In addition, when the electronic component is seated on the impact absorbing member 120, the edge of the electronic component may be disposed in the spacing space S without being seated on the impact absorbing member 120. In this case, since the terminals of the electronic component do not contact the impact absorbing member 120, it is possible to protect them from the impact generated by the contact with the impact absorbing member 120.

Further, the impact absorbing member 120 may be formed with a buffer open hole 120a penetrating the impact absorbing member 120 so as to correspond to the bag-like open hole 111 a.

On the other hand, the terminals of the electronic component may be formed not only on the entire front surface of the electronic component but also collectively at the edges of the electronic component. When such an electronic component is bent to have a predetermined curvature, a load is relieved in the center portion, and the load is intensively applied to the terminals at the edges. However, according to the third embodiment of the present invention, since the spacing space S is formed between the wall portion 112 and the impact absorbing member 120, the terminals formed at the edge portion of the electronic component can be placed in the spacing space S. Accordingly, the terminal formed at the edge portion of the electronic component is protected from the impact generated by the contact with the impact absorbing member 120.

On the other hand, in addition to such a configuration, according to the fourth embodiment of the present invention, the wall portion 112 may be provided at a distance from the first impact absorbing member 121 and the second impact absorbing member 122. Hereinafter, a fourth embodiment of the present invention will be described further with reference to fig. 7. In describing the fourth embodiment, differences from the above-described embodiment will be mainly described, and the same description and reference numerals will be given to the above-described embodiment.

Referring to fig. 7, the table 100 may include a pocket frame 110 and an impact absorbing member 120.

The impact absorbing member 120 may include a first impact absorbing member 121 and a second impact absorbing member 122, and the buffer open hole 120a may include a first buffer open hole 121a and a second buffer open hole 122 a.

The first impact absorbing member 121 may be disposed on the seating portion 111 and may be formed of an elastic material. Such an elastic force of the first impact absorbing member 121 may be higher than that of the second impact absorbing member 122. In addition, the first impact-absorbing member 121 may have a first buffer open hole 121a formed in the first impact-absorbing member 121 to correspond to the bag-shaped open hole 111 a.

The second impact absorbing member 122 may be disposed on the first impact absorbing member 121, and may be fixedly supported on the first impact absorbing member 121. For example, the second impact absorbing member 122 may be adhered to the upper surface of the first impact absorbing member 121 by an adhesive (not shown). Such a second impact absorbing member 122 may have a predetermined thickness, and a second buffer opening hole 122a penetrating the second impact absorbing member 122 in the thickness direction (for example, the up-down direction of fig. 7) is formed in the second impact absorbing member 122.

The second bumper open hole 122a may be formed in the second impact absorbing member 122 in a manner corresponding to the first bumper open hole 121 a. Accordingly, the second buffer open hole 122a and the first buffer open hole 121a may communicate with each other. In addition, the second buffer open hole 122a may prevent an air layer from being formed between the electronic part and the second impact absorbing member 122 when the electronic part is seated on the second impact absorbing member 122, so that the electronic part is spaced apart from the second impact absorbing member 122.

The wall portion 112 may be provided in plurality, and the plurality of wall portions 112 may be formed to protrude upward to surround the first impact absorbing member 121 and the second impact absorbing member 122.

In addition, the plurality of wall portions 112 may be provided at intervals from the impact absorbing member 120 in the horizontal direction. In other words, the plurality of wall portions 112 may be spaced apart from a face of the impact absorbing member 120 facing the wall portions 112 by a predetermined distance. In this way, the plurality of wall portions 112 are provided at intervals from the first and second

impact absorbing members

121, 122, whereby the spacing space S can be formed between the wall portions 112 and the first and second

impact absorbing members

121, 122.

The terminal portion of the electronic component may be disposed in the spacing space S. For example, the plurality of terminals may be arranged at an edge of the electronic component. In addition, when the electronic component is seated on the second impact absorbing member 1220, the edge of the electronic component may be disposed in the spacing space S without being seated on the second impact absorbing member 122. In this case, since the terminals of the electronic component do not contact the second impact absorbing member 122, it is possible to protect them from the impact generated by the contact with the second impact absorbing member 122.

In this way, by forming the spacing space S, there is an effect of protecting the terminals of the electronic component from an impact generated by contact with the second impact absorbing member 122.

In addition, when the electronic component is placed on the second impact absorbing member 122, there is an effect that the impact between the second impact absorbing member 122 and the electronic component is absorbed by the first impact absorbing member 121 due to the elasticity of the first impact absorbing member 121.

Therefore, when the electronic component is placed on the second impact absorbing member 122, there is an effect that an impact applied to the electronic component can be minimized.

On the other hand, according to the fifth embodiment of the present invention, in addition to such a configuration, the table 100 may further include a main body portion 140. Hereinafter, a fifth embodiment of the present invention will be described with further reference to fig. 8 to 10. In describing the fifth embodiment, differences from the above-described embodiment will be mainly described, and the same description and reference numerals will be given to the above-described embodiment.

Referring to fig. 8, the work table 100 may provide a space in which a plurality of electronic components loaded in the customer tray T1 are temporarily seated before being loaded in the test tray 20. Such a table 100 may include a pocket frame 110, a cushioning member 120, and a main body portion 140.

Referring to fig. 9, the pouch frame 110 may provide a space for accommodating electronic components. In addition, the pouch frame 110 may be detachably coupled to the body part 140. A plurality of such pocket frames 110 may be provided, and a plurality of pocket frames 110 may be supported by the body part 140. In addition, a plurality of pocket spaces P may be formed in the plurality of pocket frames 110. Wall portions 112, pocket groove portions 113, and correction holes 114 may be formed in the pocket frame 110.

The wall portion 112 may be provided in plurality, and a plurality of wall portions 112 may be formed to protrude upward to surround the cushioning member 120. The plurality of wall portions 112 may form a pocket space P, which is a space in which the electronic component is disposed inside the pocket space P, together with the cushioning material 120. A plurality of such pocket spaces P may be formed.

Referring to fig. 10, pocket groove 113 may provide a portion in which a portion of cushioning material 120 is accommodated. Such a pocket groove portion 113 may be a portion formed by being introduced from the pocket frame 110, and the cushioning member 120 received in the pocket groove portion 113 may be prevented from being detached.

When the pocket frame 110 is coupled with the body part 140, the rectification hole 114 may be engaged with the rectification pin 143 of the body part 140 to rectify the position therebetween. For example, the position of the pocket frame 110 and the body part 140 relative to each other may be corrected by inserting the correcting pin 143 into the correcting hole 114. Such a correction hole 114 may be formed in plural.

The buffer part 120 may provide a portion where the electronic part is seated when the electronic part is placed in the pocket space P. In addition, a buffer member 120 may be provided to absorb an impact applied to the electronic component. For example, the buffer member 120 may be in a pad (pad) shape formed to extend in one direction, and may include silicon (Si). A plurality of such cushioning members 120 may be provided, and a plurality of cushioning members 120 may be supported by body portion 140.

When the pouch frame 110 is coupled to the body 140, the cushioning member 120 may be interposed between the pouch frame 110 and the body 140. For example, a part of the cushioning material 120 may be accommodated in a body groove portion 141 of the body portion 140, which will be described later, and another part of the cushioning material 120 may be accommodated in the pocket groove portion 113 of the pocket frame 110. In this way, cushioning member 120 is inserted into pocket groove portion 113 and body groove portion 141, and can be fixedly supported at a predetermined position without being detached from pocket frame 110 and body portion 140.

On the other hand, the cushioning member 120 is provided on the body groove portion 141 and can be fixedly supported on the body portion 140. For example, the buffer member 120 may be adhered to the upper surface of the body groove portion 141 by an adhesive (not shown). In addition, the cushioning member 120 may have a predetermined thickness, and a cushioning open hole 120a penetrating the cushioning member 120 may be formed in the cushioning member 120 in the thickness direction. Such a buffer opening hole 120a may be formed at a position corresponding to a body opening hole 142 described later. Accordingly, the buffer open hole 120a and the body open hole 142 may communicate with each other. In addition, when the electronic parts are seated on the buffer member 120 through the buffer open holes 120a, an air layer is formed between the electronic parts and the buffer member 120 to prevent the electronic parts from being spaced apart from the buffer member 120.

Referring again to fig. 9, the body part 140 may support a plurality of pocket frames 110 and may support a plurality of cushioning members 120. The body groove 141, the body opening hole 142, and the correcting pin 143 may be formed in the body 140.

Body groove portion 141 may support cushioning member 120 and may provide a portion that receives a portion of cushioning member 120. In other words, when a portion of the cushioning member 120 is received in the body groove portion 141, the body groove portion 141 can fixedly support the cushioning member 120.

The body opening hole 142 may be formed through the body 140 and may be formed in the body groove 141. Such a body open hole 142 may communicate with the buffer open hole 120 a.

When the pocket frame 110 is coupled with the body part 140, the leveling pins 143 may be engaged with the leveling holes 114, thereby leveling the position therebetween. For example, the leveling pins 143 may be formed to protrude from the body portion 140 to be inserted into the leveling holes 114. A plurality of such leveling pins 143 may be provided and may be engaged with a plurality of leveling holes 114 formed in a plurality of pocket frames 110.

In this way, the following effects are obtained: by engaging the leveling pins 143 with the leveling holes 114, the relative positions of the pocket frame 110 and the main body portion 140 can be leveled so that they can be coupled to each other.

In addition, by inserting the buffer member 120 into the pocket groove portion 113 and the body groove portion 141, it is not detached from the pocket frame 110 or the body portion 140 and can be fixedly supported, and there is an effect that impact applied to the electronic component can be absorbed more stably when the electronic component is seated.

In addition, since the main body part 140 and the pocket frame 110 are separately provided, there is an effect that when the cushioning member 120 is provided on the main body part 140, it can be more easily and quickly provided.

On the other hand, according to the sixth embodiment of the present invention, in addition to such a configuration, the table 100 may further include a support member 150. Hereinafter, a sixth embodiment of the present invention will be described with further reference to fig. 11 to 15. In describing the sixth embodiment, differences from the above-described embodiment will be mainly described, and the same description and reference numerals will be given to the above-described embodiment.

Referring to fig. 11 and 12, the table 100 may include a pouch frame 110, a body portion 140, and a support member 150.

The pocket frame 110 may have a wall 112, a pocket groove 113, a correction hole 114, and a fixing pin 115.

Referring to fig. 13, pocket groove 113 may be provided with a portion into which support member 150 and at least a portion of protrusion 144 described later are inserted. Such a pocket groove portion 113 may be a portion introduced into the pocket frame 110, and the support part 150 inserted into the pocket groove portion 113 may be prevented from being detached from the pocket frame 110.

The fixing pin 115 may fix the support member 150 to the protrusion 144 of the body part 140. Such a fixing pin 115 is inserted through a support fixing hole 153 described later and is engageable with a body fixing hole 145 described later. For example, when the pouch frame 110, the support member 150, and the body part 140 are sequentially disposed, the fixing pins 115 are sequentially inserted into the support fixing holes 153 and the body fixing holes 145 to fix the support member 150 to the protrusion part 144. A plurality of such fixing pins 115 may be provided, and the plurality of fixing pins 115 may be protrusively formed.

Referring to fig. 12 and 14, a body opening hole 142, a leveling pin 143, a protruding portion 144, and a body fixing hole 145 may be formed in the body 140.

The protrusion 144 may support the support member 150, and may provide a portion where the support member 150 is seated. Such a projection 144 may be a portion that projects from the main body 140 to a predetermined height. In addition, the convex portion 144 may be inserted into the pocket groove portion 113 together with the support member 150.

The body fixing hole 145 may be engaged with the fixing pin 115 to fix the support member 150. For example, a body fixing hole 145 may be formed through the body 140 to insert the fixing pin 115. In addition, the body fixing hole 145 may be formed in plurality, and a plurality of body fixing holes 145 may be formed on the protrusion 144. The fixing pins 115 and the body fixing holes 145 may be named as first fixing elements 115 and second fixing elements 145, respectively, and may be modified such that the first fixing elements 115 have a hole shape and the second fixing elements 145 have a pin shape. Accordingly, either one of the first and second fixing

elements

115 and 145 is engaged with the other one of the first and second fixing

elements

115 and 145 on the support fixing hole 153 to fix the support member 150 to the body part 140.

Referring to fig. 15, a support member 150 may be provided to support the electronic components. Such a support member 150 may be provided as a film for supporting an electronic component, for example. In addition, the support member 150 may be supported on the protrusion 144 and may be seated on an upper surface of the protrusion 144.

Such a support member 150 may be interposed between the pocket frame 110 and the body part 140 when the pocket frame 110 is combined with the body part 140. For example, the support part 150 may be inserted into the pocket groove part 113 to be supported by the pocket frame 110. The first open hole 151, the second open hole 152, and the support fixing hole 153 may be formed in the support member 150.

When the electronic component is supported by the support member 150, a part of the terminals of the electronic component may be penetrated through the first open hole 151. For example, a terminal formed in the center of the electronic component may pass through the first open hole 151. Such a first open hole 151 penetrates the support member 150 in the thickness direction of the support member 150, and may be formed at the center portion of the support member 150.

When the electronic component is supported by the support member 150, some of the terminals of the electronic component may be penetrated in the second open hole 152. For example, the terminal formed at the edge of the electronic component may pass through the second open hole 152. Such a second open hole 152 surrounds the first open hole 151 along the periphery of the first open hole 151, and penetrates the support member 150 in the thickness direction of the support member 150. In addition, a plurality of second open holes 152 may be formed.

On the other hand, the depth of the first and second

open holes

151 and 152 in the thickness direction of the support member 150 may be the same as the thickness t of the support member 150. In addition, the first and second

open holes

151 and 152 may be formed in the support member 150 to be equal to or deeper than the length of the terminals of the electronic component.

A support fixing hole 153 may be formed through the support member 150 to insert the fixing pin 115. Such support fixing holes 153 may be formed at positions corresponding to the body fixing holes 145. Accordingly, the fixing pin 115 inserted into the support fixing hole 153 may be inserted into the body fixing hole 145, and the support member 150 may be fixedly supported at the protrusion 144.

In this way, since the first and second

open holes

151 and 152 are formed on the support member 150, there is an effect that various types of electronic components can be placed on the support member 150 regardless of the number of terminals.

In addition, the following effects are provided: the support member 150 is inserted into the fixing pin 115 and into the pocket groove portion 113 without departing from the projecting portion 144.

On the other hand, according to the seventh embodiment of the present invention, in addition to such a configuration, the loading device 10 may further include an opening unit 300. Hereinafter, a seventh embodiment of the present invention will be described with further reference to fig. 16 to 20. In describing the seventh embodiment, differences from the above-described embodiment will be mainly described, and the same description and reference numerals will be given to the above-described embodiment.

Referring to fig. 16 and 17, the loading device 10 may further include an opening unit 300.

The opening unit 300 may convert a later-described holding unit 22 of the test tray 20 into a released state or a disengagement prevention state. Such an open unit 300 may be moved in a direction away from or close to the test tray 20 to load electronic components. In addition, the opening unit 300 may include a driving means (not shown) such as a hydraulic piston for such movement. However, in the present specification, the open unit 300 is shown to be close to or away from the test tray 20, but this is merely an example, and the test tray 20 may also be close to or away from the open unit 300. Such an open cell 300 may include an open cell body 310, a supporter 320, and an elastic unit 330.

The open unit body 310 may support the supporter 320 and open the holding unit 22 of the test tray 20. A recess 311, an opening protrusion 312, a positioning protrusion 313, and an anti-sticking protrusion 314 may be formed in such an open cell body 310.

The recess 311 may be formed at one side of the open unit body 310, which may be a surface of the test tray 20 side. The supporter 320 may be received in such a recess 311, and a groove 311a may be provided for receiving the elastic unit 330.

The opening protrusion 312 may operate the holding unit 22. Such an open cell 300 may be disposed adjacent to the recess 311 and may be formed to protrude toward the test tray 20. In addition, an open protrusion 312 may be formed on the open unit body 310 to correspond to the holding unit 22.

The positioning protrusion 313 may guide the relative movement between the test tray 20 and the opening unit 300 so that the opening protrusion 312 may act on the holding unit 22. In other words, the open protrusion 312 can be guided to the holding unit 22 with higher accuracy by the positioning protrusion 313.

The anti-sticking protrusion 314 may prevent the open unit 300 from being too close to the test tray 20 when the open unit 300 approaches the test tray 20. Therefore, even when the opening protrusion 312 operates the holding unit 22, the opening unit 300 can be maintained at a predetermined interval from the test tray 20.

Referring to fig. 18, the supporter 320 may be supported by the open cell body 310 to advance and retreat in a direction away from the open cell body 310. For example, the supporter 320 may move in a direction away from the open cell body 310 within the recess 311 of the open cell body 310, and may move in a direction approaching the open cell body 310. Such a support 320 may support the electronic components received in the test tray 20 in a released state. Such a supporter 320 may include a supporter 321 and a buffer supporting member 322.

The support 321 may support the elastic unit 330. For this, an elastic member groove 321a may be formed in the support body 321.

The buffer support member 322 may provide a portion in which electronic components in the accommodation portion 21a described later are arranged. Such a cushion support member 322 can be inserted into the accommodating portion 21a in the unlocked state of the holder 22a, and the electronic component can be supported by the cushion support member 322. Such a contact area of the cushion support member 322 with the electronic component may be wider than a contact area of the tray support portion 21b with the electronic component, which will be described later, and the cushion support member 322 is located between the tray support portions 21b in the released state. In addition, when the buffering support member 322 is disposed inside the receiving portion 21a, the upper surface of the buffering support member 322 may be positioned above the upper end of the tray supporting portion 21 b.

A buffer support member 322 may be provided to absorb an impact applied to the electronic part. For example, if the hand 200 releases the holding of the electronic component on the housing portion 21a, the buffer support member 322 can absorb the impact applied to the electronic component when the electronic component is placed on the buffer support member 322. As another example, when the hand 200 holds the electronic component disposed in the housing portion 21a, if a predetermined pressure is applied to the electronic component, the buffer support member 322 can absorb the impact applied to the electronic component. Such a buffer support member 322 may include a material having an elastic material advantageous for absorbing impact, and may include, for example, silicone (Si).

The buffer supporting member 322 may be disposed on an upper surface of the supporting body 321, and may be fixedly supported on the supporting body 321. For example, the buffer support member 322 may be adhered to the upper surface of the support 321 by an adhesive (not shown). Also, the cushion support member 322 may have a cushion support hole 322a formed therein that penetrates the cushion support member 322 in the thickness direction (e.g., the up-down direction in fig. 19). Such buffer support holes 322a may communicate with holes formed in the support body 321. In addition, when the electronic part is seated on the buffer support part 322, an air layer is formed between the electronic part and the buffer support part 322, so that the buffer support hole 322a may prevent the electronic part from being spaced apart from the buffer support part.

Referring to fig. 19, the elastic unit 330 may press the supporter 320 toward the test tray 20. Such an elastic unit 330 may include an elastic member 331 and a detachment prevention part 332.

The elastic member 331 may press the support 320 toward the test tray 20. For example, the elastic member 331 may be interposed between the support 321 and the open cell main body 310. One end of such an elastic member 331 may be received in an elastic member groove 321a provided at a lower portion of the support 321, and the other end may be received in the recess 311 of the open unit main body 310. When the pressurization is released, such an elastic unit 330 moves the support 320, which is pressurized by the test tray 20 to move in a direction approaching the open cell main body 310, to a direction away from the open cell main body 310 by a restoring force. While the test tray 20 is moved a predetermined distance in a direction away from the opening unit 300, the supporter 320 is pressed against the test tray 20 by the elastic member 331 so as to be closely attached to the test tray 20, and the supporter 320 can support the electronic components in the receiving portion 21 a.

The detachment prevention part 332 may prevent the supporter 320 from being completely detached from the opening unit body 310. One end of the separation preventing part 332 may be fixed to the open unit body 310, and may guide the supporter 320 to move in a direction away from the open unit body 310. In addition, when the supporter 320 is pressed by the elastic member 331 and moved in a direction away from the open unit body 310, the other end of the disengagement preventing part 332 may limit the movement of the supporter 320.

However, in the present specification, it has been described that the elastic unit 330 is provided to press the supporter 320 toward the test tray 20 and prevent the supporter 320 from being detached from the open unit main body 310, but this is merely an example and the elastic unit 330 may be omitted. Therefore, the supporter 320 may also be fixedly supported on the open cell body 310.

Hereinafter, the test tray 20 will be described in detail. The test tray 20 can house electronic components, and the object housed in the test tray 20 can be prevented from coming off by a holding unit 22 described later. Electronic components may be loaded or unloaded in such a test tray 20. Such a test tray 20 may include a tray frame 21, a holding unit 22.

The tray frame 21 may have a receiving portion 21a in which electronic components can be placed. Such a receiving portion 21a may be configured in the form of a through hole, and such a through hole may be formed to be narrowed toward one side. For example, the receiving portion 21a may be formed to be narrower toward the opening unit 300. One side of such a housing portion 21a may be used as an entrance for moving the electronic component. On the other hand, the tray support portion 21b may be formed on the tray frame 21. Such a tray support portion 21b may be a protrusion protruding from the receiving portion 21 a. In addition, the tray support portion 21b may contact and support the electronic component placed in the receiving portion 21 a.

Referring to fig. 19 and 20, the holding unit 22 can selectively hold the electronic component disposed in the housing portion 21 a. Therefore, even if the test tray 20 moves or rotates, the electronic components may be restrained from being detached from the test tray 20. Such a holding unit 22 can be switched to any one of the released state and the detachment prevention state by the opening unit 300. Here, the released state is a state in which the placement and detachment of the electronic component to and from the receiving portion 21a are permitted by the opening unit 300, and the detachment-preventing state is a state in which the detachment of the electronic component from the receiving portion 21a is prevented. The holder unit 22 may include a holder 22a and a holder spring 22 b.

The holder 22a can selectively hold the electronic component accommodated in the accommodating portion 21 a. Such a holder 22a may be pivoted, for example, by a hinge connection. In other words, without applying any force to the holder 22a, the holder 22a can be rotated in the direction toward the tray support portion 21b centering on the pivot by the urging force of the holder spring 22b, so that the electronic component can be held by the holder 22 a. In addition, if the electronic component is placed in the housing portion 21a, one side of the electronic component may be supported by the holder 22a and the other side of the electronic component may be supported by the tray support portion 21 b.

The holder spring 22b may provide a restoring force to the holder 22 a. On the other hand, in the present specification, the retainer spring 22b is shown as a torsion spring, but this is merely an example, and other well-known springs may be used.

Hereinafter, the operation and effect of the test processor 1 according to the seventh embodiment of the present invention will be described.

The hand 200 can load a plurality of electronic components loaded on the customer trays T1, T2 onto the table 100. The table 100 may transfer a plurality of electronic components to the test tray 20. The hand 200 can move the plurality of electronic components mounted on the stage 100 to the upper side of the test tray 20 and release the holding of the electronic components on the upper side of the test tray 20.

The opening unit 300 may be raised toward the test tray 20 so that the receiving portion 21a of the test tray 20 is in a released state. At this time, the opening projection 312 of the opening unit 300 rotates the holder 22a, so that the receiving portion 21a can be in a released state. When the opening unit 300 is in close contact with the test tray 20, the buffer support member 322 may be disposed inside the receiving portion 21 a.

When the hand 200 releases the holding of the electronic component from the upper side of the housing portion 21a, the electronic component can be lowered and set on the buffer support member 322. In addition, when the opening unit 300 is lowered, the electronic parts seated on the buffer supporting parts 322 may be supported by the tray supporting parts 21 b. At this time, the holder 22a may be in the disengagement prevention state by the holder spring 22b being rotated to the home position.

In this way, when the hand 200 releases the holding of the electronic component from the upper side of the housing portion 21a, the buffer support member 322 has an elastic force, and the impact between the buffer support member 322 and the electronic component is absorbed by the buffer support member 322. Therefore, there is an effect of minimizing the impact applied to the electronic component.

In addition, since one end portion of the buffering support member 322 is disposed at the upper side of the tray support portion 21b, when the electronic component is lowered, it can be seated on the buffering support member 322, and the impact applied to the electronic component can be minimized. Thereafter, when the buffering support members 322 are lowered, the electronic parts seated on the buffering support members 322 are supported by the tray support portions 21b, and at this time, the electronic parts can be supported by the tray support portions 21b without being impacted. Therefore, there is an effect of preventing impact applied to the electronic component.

On the other hand, according to the eighth embodiment of the present invention, in addition to such a constitution, the test tray 20 may omit the test support part 21b and include the tray support member 23. Hereinafter, an eighth embodiment of the present invention will be described with further reference to fig. 21 to 23. In describing the eighth embodiment, differences from the above-described embodiment will be mainly described, and the same description and reference numerals will be given to the above-described embodiment.

The tray support member 23 can support the electronic component 2 placed inside the housing portion 21 a. For example, the tray supporting member 23 may support between the plurality of terminals 2a of the electronic component. Such a tray support member 23 may be supported by the tray frame 21 at the lower side of the tray frame 21. In addition, a plurality of open holes 23a through which the terminals of the electronic component can pass may be formed in the tray supporting member 23. For example, when the electronic components are supported by the tray supporting member 23, the plurality of terminals of the electronic components may be exposed downward through the plurality of open holes 23 a.

The holding unit 22 can prevent the electronic components supported by the tray supporting member 23 from coming off the tray supporting member 23.

The buffer supporting member 322 can absorb the impact applied to the tray supporting member 23 and the electronic components supported by the tray supporting member 23. For example, when the electronic component falls toward the tray supporting member 23 or when a predetermined pressure is applied to the electronic component, the buffer supporting member 322 may absorb the impact applied to the tray supporting member 23. That is, the cushion support member 322 abuts against the bottom surface of the tray support member 23 to absorb the impact applied to the tray support member 23. Also, the buffer supporting member 322 may support the electronic parts exposed through the open holes 23a, thereby absorbing impact applied to the electronic parts when the electronic parts are seated on the tray supporting member 23.

Hereinafter, a test handler control method S10 according to an eighth embodiment of the present invention will be explained with reference to fig. 21 to 26.

The test handler control method S10 may support testing of electronic components by loading or unloading the electronic components into the test tray 20. Such a test handler control method S10 may include a moving step S100, an ascending step S200, an opening step S300, a grip releasing step S400, a gripping step S500, an impact absorbing step S600, and a descending step S700.

In the moving step S100, the loading device 10 holding the electronic component can be moved to the accommodating portion 21a of the test tray 20 where the electronic component is not placed. In this case, the electronic component may be located above the housing portion 21 a. In addition, in the moving step S110, the unloading device 40 may move onto the housing portion 21a to hold the electronic components placed on the tray supporting members 23 of the test tray 20 on which the test has been completed.

Referring to fig. 22, in the ascending step S200, the opening unit 300 may ascend to access the test tray 20. In addition, in the raising step S200, the open unit main body 310 may be raised such that the bumper support member 322 is brought into close contact with the bottom surface of the tray support member 23. On the other hand, when the raising step S200 is performed while the electronic components are supported by the tray supporting members 23, the electronic components are not supported by the tray supporting members 23 but raised while being supported by the buffer supporting members 322.

In the opening step S300, the holding unit 22 may be opened so that the electronic component may be seated on the tray supporting member 23. That is, the holding unit 22 may be in the released state. For example, in the opening step S300, the opening protrusion 312 may pressurize the holder 22a so that the holder 22a rotates.

In the grip releasing step S400, the loading device 10 may release the grip of the electronic component so that the electronic component falls toward the accommodating portion 21 a. Such a grip releasing step S400 may be performed when the electronic component is not supported by the tray supporting member 23.

In the holding step S500, the unloading device 40 can hold the electronic component supported by the tray supporting member 23. Such a holding step S500 may be performed when the electronic component is supported by the tray supporting member 23.

Referring to fig. 23, in the impact absorption step S500, when the electronic component falls toward the tray supporting member 23, the impact applied to the electronic component may be absorbed. In addition, in the impact absorbing step S500, when a predetermined pressure is applied to the electronic component supported by the tray supporting member 23, the impact applied to the electronic component can be absorbed. For example, in the impact absorbing step S500, the buffer supporting member 322 supports the terminals of the electronic components exposed through the open holes 23a formed in the tray supporting member 23, so that the impact applied to the electronic components can be absorbed. .

Referring to fig. 24 and 25, in the lowering step S600, the open unit main body 310 may be lowered such that the buffer supporting member 322 is spaced apart from the bottom surface of the tray supporting member 23. In addition, if the descending step S600 is performed after the grip releasing step S400, at least a part of the plurality of terminals of the electronic component may be inserted into the open hole 23a when the open unit body 310 descends.

The embodiments of the present invention have been described as specific embodiments as above, but these are merely examples, and the present invention is not limited thereto, and should be construed as having the broadest scope according to the basic ideas disclosed in the present specification. One skilled in the art may combine/substitute the disclosed embodiments to implement patterns of shapes not shown without departing from the scope of the invention. In addition, the disclosed embodiments may be easily changed or modified by those skilled in the art based on the present specification, and it is clear that such changes or modifications also fall within the scope of the present invention.

Claims

1. A test processor, characterized in that,

the method comprises the following steps:

a pouch frame having a plurality of pouch spaces for accommodating electronic components; and

a plurality of impact absorbing members disposed in the plurality of pocket spaces for seating the electronic components,

the impact absorbing member is formed of an elastic material to absorb an impact applied to the electronic component when the electronic component falls toward the impact absorbing member, thereby causing the electronic component to be seated on the impact absorbing member,

in the bag-like frame, a plurality of wall portions are formed to protrude upward so as to surround the impact absorbing member.

2. The test processor of claim 1,

the impact absorbing member includes:

a first impact absorbing member; and

a second impact absorbing member disposed above the first impact absorbing member,

the surface friction coefficient of the second impact absorption member is smaller than the surface friction coefficient of the first impact absorption member,

3. The test processor of claim 1,

a plurality of the wall portions are spaced apart from the impact absorbing member by a predetermined distance in a horizontal direction so that a spacing space is provided between the wall portions and the impact absorbing member,

a part of the electronic component is arranged in the spacing space when the electronic component is placed on the impact absorbing member,

a bag-shaped open hole penetrating the bag-shaped frame is formed in the bag-shaped frame,

a buffer open hole is formed in the impact absorbing member, and the buffer open hole penetrates the impact absorbing member to correspond to the bag-shaped open hole.

4. The test processor of claim 3,

the impact absorbing member includes:

a first impact absorbing member; and

the buffering open pore includes:

a first cushion open hole formed in the first impact absorbing member to correspond to the bag-shaped open hole; and

a second buffer open hole formed in the second impact absorbing member to correspond to the first buffer open hole.

5. A test processor, characterized in that,

the method comprises the following steps:

a main body portion;

a pouch-shaped frame detachably coupled to the main body, the pouch-shaped frame having a pouch-shaped space in which an electronic component can be placed; and

an impact absorbing member interposed between the bag-shaped frame and the main body portion, the impact absorbing member being capable of mounting the electronic component thereon,

the impact absorbing member is formed of an elastic material to absorb an impact applied to the electronic component when the electronic component falls toward the impact absorbing member, thereby seating the electronic component on the impact absorbing member.

6. The test processor of claim 5,

a bag-shaped groove portion in which a part of the impact absorbing member can be housed is formed in the bag-shaped frame,

a body groove portion in which another portion of the impact absorbing member can be housed is formed in the body portion,

the impact absorbing member is fixedly supported by the bag-shaped frame and the body portion with one side housed in the bag-shaped groove portion and the other side housed in the body groove portion.

7. A test processor, characterized in that,

the method comprises the following steps:

a main body portion;

a support member interposed between the pocket frame and the main body portion, the support member being capable of mounting the electronic component therein,

a first open hole and a plurality of second open holes are formed in a support member, a part of terminals of the electronic component can pass through the first open hole, another part of the terminals of the electronic component can pass through the plurality of second open holes, and the plurality of second open holes can be formed along a periphery of the first open hole when the electronic component is seated on the support member.

8. The test processor of claim 7,

in the main body portion, a protruding portion for supporting the supporting member is formed protruding from one face of the main body portion,

a pocket groove portion into which the supporting member can be inserted is formed in the pocket frame,

when the bag-shaped frame is combined with the main body part, the supporting part and at least one part of the protruding part are inserted into the bag-shaped groove part, so that the supporting part is fixedly supported on the bag-shaped frame.

9. The test processor of claim 7,

in the pocket frame a first fixing element is provided,

in the body portion, a second fixing member for engaging with the first fixing member is formed,

a support fixing hole is formed in the support member, the support fixing hole being provided at a position corresponding to the second fixing element and being engaged with any one of the first fixing element and the second fixing element,

10. A test processor, characterized in that,

the method comprises the following steps:

a test tray including a tray frame in which a receiving portion in which an electronic component can be placed is formed, and a holding unit capable of supporting the electronic component on the receiving portion so that the electronic component does not come off from the receiving portion; and

the open cell includes:

the buffer support member disposed inside the housing portion is formed of an elastic material to absorb an impact applied to the electronic component when the electronic component falls toward the buffer support member, thereby seating the electronic component on the buffer support member,

a tray support portion capable of supporting the electronic component arranged in the housing portion when the opening unit is spaced apart from the holding unit is provided in the tray frame,

11. A test processor, characterized in that,

the method comprises the following steps:

the open cell includes:

12. A test processor, characterized in that,

the method comprises the following steps:

the open cell includes:

13. The test processor of claim 12,

when the electronic component falls toward the tray supporting member or a predetermined pressure is applied to the electronic component placed on the tray supporting member, the buffer supporting member is brought into close contact with the bottom surface of the tray supporting member to absorb an impact applied to the tray supporting member and the electronic component and supports the electronic component exposed through the open hole.

14. A test handler control method, characterized in that,

the method comprises the following steps:

in the step of descending,

15. A test handler control method, characterized in that,

the method comprises the following steps:

a moving step of moving the unloading device to above the accommodating part for holding the electronic component in the accommodating part of the tray frame;

in the step of the raising,

16. The test processor control method of claim 14 or 15,

further comprising an opening step of opening the holding unit to support the electronic component by the tray supporting member or to detach the electronic component from the tray supporting member,

in the step of the raising,

the open cell body is raised to a predetermined position to cause the open cell body to pressurize the holding unit.