TW202342954A - Test handler and method for controlling the same - Google Patents

Abstract

This invention relates to a test processor and a control method thereof. Specifically, according to an embodiment of the present invention, a test processor may be provided. The test processor includes a bag-shaped frame having a plurality of bag-shaped spaces for accommodating electronic components; and a plurality of impact absorbing components arranged in the plurality of bag-shaped spaces for accommodating the electronic components. The impact absorbing components are formed of an elastic material to absorb impacts applied to the electronic components when the electronic components fall toward the impact absorbing components, such that the electronic component is placed on the impact absorbing components. In the bag-shaped frame, a plurality of wall portions are formed to protrude upward so as to surround the impact absorbing components.

Description

Test processors and their control methods

Field of invention

The present invention relates to a test processor and a control method thereof.

Background of the invention

Recently, with the development of technical fields related to electronic components such as semiconductor elements, the demand for electronic components is increasing. In particular, there is a need for electronic components that are small in size and have improved functionality. According to this, the size of the electronic component is reduced, but the number of terminals of one electronic component is increased, so that the number of terminals per unit area of the electronic component is increased. In the case of such electronic components, even under the same impact, the impact applied to one terminal is greater than that of electronic components having a small number of terminals per unit area. Therefore, the electronic components become more vulnerable to impacts applied to them during testing.

On the other hand, when electronic components are manufactured through predetermined manufacturing processes, they are tested by a test handler and a tester, and are classified into grades based on the test results. In this test process, the electronic component is moved to a predetermined path while being loaded on a test tray and tested. However, electronic components manufactured by predetermined manufacturing processes are loaded in customer trays and supplied, and in order to test them, they are transferred from the customer trays to the test trays through various worktables including buffer tables. In addition, the electronic components are passed through the open cell in order to be placed on test trays. In this way, to test an electronic component, it is loaded from a customer pallet, passed through the workbench, open cell, and held multiple times by the load/unload device until it is unloaded onto a test pallet, and then undergoes a de-holding process.

At this time, when the loading/unloading device holds or releases the electronic component, a predetermined impact will be applied to the electronic component. In particular, in the process of vacuum adsorbing the electronic components to hold the electronic components, the electronic components may be damaged due to the predetermined pressing force applied to the electronic components. For example, when an electronic component is pressurized for vacuum adsorption, the terminal portion of the electronic component may be deformed, and the electronic component itself may be bent. As another example, electronic components for special purposes can be manufactured in a form that is bent from the outset to suit the purpose, and the terminals of these electronic components that are arranged on the outermost side can receive a stronger force than the terminals that are arranged on the inside. impact. In this way, in an electronic component in a curved form, the edge portion is more vulnerable to impact than the inner side and may be subjected to greater damage.

In addition, when the rigidity of the test tray is greater than the rigidity of the electronic components, placing the electronic components on the test tray or the like may cause damage to the electronic components. In this way, when the electronic component is transferred for testing or is being tested, predetermined damage continues to accumulate, and when the number of terminals per unit area of the electronic component increases, the impact accumulated on one terminal becomes larger. The accumulation of such shocks becomes a factor in the performance degradation of electronic components.

Therefore, there is a need to minimize the impact applied to the electronic components during transfer of the electronic components for testing or during testing and to prevent damage to the terminals of the electronic components.

Summary of the invention

In view of the above background, embodiments of the present invention are invented to provide a test handler to minimize the impact exerted on the electronic components during the transfer and testing process of the electronic components and prevent damage to the terminals of the electronic components.

According to an embodiment of the present invention, a test processor can be provided, including: a pocket frame having a plurality of pocket spaces for accommodating electronic components; and A plurality of impact-absorbing members are arranged in the plurality of pocket spaces for placing the electronic components. The impact-absorbing members are formed of elastic materials to absorb when the electronic components fall toward the impact-absorbing members. An impact is exerted on the electronic component so that the electronic component is placed on the impact-absorbing member. In the bag-shaped frame, a plurality of wall portions protrude upward in a manner to surround the impact-absorbing member. .

Further, a test processor can be provided, the impact absorbing component includes: a first impact absorbing component; and a second impact absorbing component disposed on the upper side of the first impact absorbing component, and the second impact absorbing component is The surface friction coefficient is smaller than the surface friction coefficient of the first impact absorbing member, The elastic force of the first impact absorbing member is higher than the elastic force of the second impact absorbing member.

Further, a test processor may be provided, in which a plurality of the wall portions are spaced apart from the impact-absorbing component by a predetermined distance in a horizontal direction, so that a spacing space is provided between the wall portions and the impact-absorbing component, When the electronic component is placed on the impact absorbing member, a part of the electronic component is disposed in the separation space, and a pocket penetrating the bag frame is formed in the bag frame. ) open hole, a buffer open hole is formed in the impact absorbing member, and the buffering open hole penetrates the impact absorbing member to correspond to the bag-shaped open hole.

Further, a test processor can be provided, the impact absorbing component includes: a first impact absorbing component; and a second impact absorbing component disposed on the upper side of the first impact absorbing component, and the buffer opening hole includes: a third impact absorbing component; a buffer opening hole formed in the first impact absorbing member to correspond to the bag-shaped opening hole; and a second buffer opening hole formed in the second impact absorbing member to correspond to the first buffering opening hole; Open hole.

Further, a test processor can be provided, including: a main body; a bag-like frame that is detachably coupled to the main body, and a bag-like space capable of placing the electronic components is formed in the bag-like frame; and An impact-absorbing member is sandwiched between the bag-like frame and the main body portion, and the electronic component can be placed in the impact-absorbing member. The impact-absorbing member is formed of an elastic material to absorb when the electronic component The impact exerted on the electronic component when the component falls toward the impact absorbing member causes the electronic component to be placed on the impact absorbing member.

Furthermore, a test handler may be provided, in which a bag-shaped groove is formed in the bag-shaped frame, and any part of the impact-absorbing member can be accommodated in the bag-shaped groove, and a bag-shaped groove is formed in the main body part. There is a main body groove part in which another part of the impact absorbing member can be accommodated, and the impact absorbing member is accommodated in the bag-shaped groove part on one side and is accommodated in the main body groove on the other side. part and is fixedly supported on the bag-shaped frame and the main body part.

Further, a test processor can be provided, including: a main body; a bag-like frame that is detachably coupled to the main body, and a bag-like space capable of placing electronic components is formed in the bag-like frame; and A support member is sandwiched between the bag-shaped frame and the main body part. The electronic component can be placed in the support member. A first open hole and a plurality of second open holes are formed in the support member. When When the electronic component is placed on the supporting member, a part of the terminals of the electronic component can penetrate the first open hole, and another part of the terminal of the electronic component can penetrate the plurality of second open holes. , and the plurality of second open holes can be formed along the periphery of the first open hole.

Further, a test processor can be provided, in which a protruding portion for supporting the supporting member is protrudingly formed from one side of the main body portion in the main body portion, and a protruding portion capable of being inserted is formed in the bag-shaped frame. The bag-shaped groove portion of the support member is inserted into the bag-shaped groove portion by inserting at least a part of the support member and the protruding portion into the bag-shaped groove portion when the bag-shaped frame is combined with the main body portion. The support component is fixedly supported on the bag frame.

Further, a test processor can be provided, in which a first fixing element is provided in the bag-like frame, and a second fixing element for engaging with the first fixing element is formed in the main body, and the A support fixing hole is formed in the support member, and the support fixation hole is provided at a position corresponding to the second fixation element and is used to engage with any one of the first fixation element and the second fixation element, Either one of the first fixing element and the second fixing element is engaged with the other of the first fixing element and the second fixing element in the support fixing hole to secure the support. The components are fixed to the main body.

Further, a test processor can be provided, including: a test tray, the test tray includes a tray frame and a holding unit, the tray frame is formed with a receiving portion capable of placing electronic components, and the holding unit is capable of holding the electronic components. The component is supported on the accommodating part so that the electronic component cannot be detached from the accommodating part; and an opening unit can pressurize the holding unit so that the electronic component can be detached from the accommodating part, so The open unit includes: an open unit main body capable of pressurizing the holding unit by approaching the test tray; and a buffer support member supported by the open unit main body. When the open unit main body pressurizes the holding unit When pressed, at least a part can be disposed inside the receiving portion, and the buffer support member provided inside the receiving portion is formed of an elastic material to absorb the force exerted on the electronic component when it falls toward the buffer support member. impact on the electronic component, so that the electronic component is placed on the buffer support component, and when the open unit is spaced apart from the holding unit, a support configured in the tray frame is provided In the tray support portion for the electronic components in the accommodating portion, when the buffer support member is arranged inside the accommodating portion, the upper surface of the buffer support member is located above the upper end of the tray support portion.

Further, a test processor can be provided, including: a test tray, the test tray includes a tray frame and a holding unit, the tray frame is formed with a receiving portion capable of placing electronic components, and the holding unit is capable of holding the electronic components. The component is supported on the receiving portion so that the electronic component will not be detached from the receiving portion; and an opening unit capable of pressurizing the holding unit so that the electronic component can be detached from the receiving portion, The open units include: an open unit body capable of pressurizing the holding unit by access to the test tray; and A buffer support member is supported by the open unit body, and when the open unit body pressurizes the holding unit, at least a part thereof can be disposed inside the accommodating part, The buffer support member provided inside the receiving portion is formed of an elastic material to absorb an impact applied to the electronic component when a predetermined pressure is applied to the electronic component disposed on the buffer support member, When the opening unit is spaced apart from the holding unit, a tray support portion capable of supporting the electronic component arranged in the accommodating portion is provided in the tray frame, When the buffer support member is disposed inside the receiving portion, the upper surface of the buffer support member is located above the upper end of the tray support portion.

Further, a test processor can be provided, including: Test tray, the test tray includes a tray frame, a tray support component and a holding unit, the tray frame is formed with a receiving portion capable of disposing electronic components, and the tray support component is used to support the electronic components configured in the receiving portion. Between the plurality of terminals of the component, the holding unit can support the electronic component on the tray support component so that the electronic component does not detach from the receiving portion; and an opening unit capable of pressurizing the holding unit so that the electronic component can be detached from the receiving portion, The open units include: an open unit body capable of pressurizing the holding unit by access to the test tray; and a buffer support member supported by the open unit body and formed of elastic material, An open hole is formed in the tray support member, and when the electronic component is placed in the tray support member, at least a part of the terminals of the electronic component can pass through the open hole.

Further, a test handler may be provided. When the electronic component falls toward the tray support component or applies a predetermined pressure to the electronic component placed on the tray support component, the buffer support component is in contact with the tray support component. The bottom surface of the component is in close contact to absorb the impact exerted on the tray support component and the electronic component, and supports the electronic component exposed through the open hole.

Further, a test processor control method can be provided, including: In the moving step, the loading device moves above the receiving part of the pallet frame while holding the electronic components; The raising step is to raise the open unit body so that the buffer support component supported by the open unit body is in close contact with the bottom surface of the pallet support component supported on the lower side of the pallet frame; A gripping release step in which the loading device releases the grip of the electronic component so that the electronic component falls toward the receiving portion; An impact absorbing step in which the buffer support member supports the electronic component exposed through an open hole formed in the tray support member so as to absorb an impact applied to the electronic component when the electronic component falls toward the tray support member impact on; and a lowering step of lowering the open unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member, During the descending step, When the open unit body is lowered, at least some of the plurality of terminals of the electronic component are inserted into the open hole.

Further, a test processor control method can be provided, including: In the moving step, the unloading device moves above the receiving part of the pallet frame in order to hold the electronic components in the receiving part; in the rising step, the open unit body is raised so that the buffer support component supported by the open unit body is in contact with the supporting part. The bottom surface of the pallet support component on the lower side of the pallet frame is close to each other; A holding step in which the unloading device holds the electronic component supported by the tray support member; An impact absorbing step in which the buffer support member supports the electronic component exposed through an open hole formed in the tray support member so as to absorb a predetermined pressure applied to the electronic component in the holding step. Impact on electronic components; and a lowering step of lowering the open unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member, During the rising step, When the open unit body rises, at least a part of the terminals of the electronic component rises while being inserted into the open hole.

Further, a test processor control method may be provided, further comprising an opening step of opening the holding unit to support the electronic component by the tray support component or detach the electronic component from the tray support component, In the raising step, the open unit body is raised to a predetermined position so that the opening unit body pressurizes the holding unit.

According to the embodiment of the present invention, there are effects of minimizing impact applied to the electronic component during the process of transferring the electronic component for testing and the testing process, and preventing terminal damage of the electronic component.

Detailed implementation

Hereinafter, specific embodiments for realizing the spirit of the present invention will be described in detail with reference to the accompanying drawings.

In addition, when describing the present invention, if it is judged that the detailed description of related well-known structures or functions may make the gist of the present invention unclear, the detailed description thereof will be omitted.

In addition, when it is mentioned that a certain constituent element is "connected," "supported," or "coupled" to another constituent element, it should be understood that the other constituent element may be directly connected, supported, or coupled to the other constituent element, but the other constituent element may exist in the middle.

The terminology used in this specification is only used to describe specific embodiments and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In addition, terms including first, second, etc. ordinal numbers may be used to describe various constituent elements, but the corresponding constituent elements are not limited by these terms. These terms are only used for the purpose of distinguishing one element from another element.

As used in this specification, "comprising" will have the meaning to embody specific characteristics, regions, integers, steps, acts, elements and/or ingredients and does not exclude other specific characteristics, regions, integers, steps, actions, elements, ingredients and/or ingredients. or the existence or addition of a group.

In addition, in this specification, the expressions such as the upper part and the upper surface described based on the drawings may be expressed in different ways as long as the direction of the corresponding object is changed.

In the following, the specific structure of the test processor 1 according to an embodiment of the present invention will be described with reference to the accompanying drawings.

Hereinafter, referring to FIG. 1 , a test processor 1 according to an embodiment of the present invention can test electronic components manufactured through manufacturing engineering, classify them according to grades according to the test results, and load them in customer pallets T1, T2. In addition, the test processor 1 can be detachably combined with the tester (not shown). This test processor 1 may include a loading device 10, a test tray 20, a cavity 30, an unloading device 40, a stacker module 50 and a control part 60.

The loading device 10 can load the electronic components loaded in the first customer tray T1 into the test tray 20 . Here, the electronic components placed on the first customer tray T1 are electronic components before being tested. The specific structure of the loading device 10 will be described below.

The test tray 20 has a space in which electronic components to be tested can be placed, and can be circulated along a predetermined path to test the electronic components. In addition, the test tray 20 can house electronic components that have been tested.

The chamber 30 may include a wetted chamber 31 , a test chamber 32 and a non-wetted chamber 33 .

The wetting chamber 31 can preheat or precool the electronic components loaded on the test tray 20 transferred from the loading position LP according to the test conditions.

The test chamber 32 may provide a space in which electronic components that have been preheated or precooled in the wetting chamber 31 and moved inside the test chamber 32 are tested.

The non-wetting chamber 33 may be heated or cooled inside the test chamber 32 to assimilate the electronic components undergoing testing to a temperature required for unloading.

The unloading device 40 can classify the electronic components loaded in the test tray 20 transferred from the non-wetting chamber 33 according to the test level, and unload them to the second customer tray T2. Here, the electronic components placed on the second customer tray T2 are electronic components that have completed testing.

The stacker module 50 can store the first customer pallet T1 and the second customer pallet T2 loaded with electronic components.

The controller 60 can control the driving of the loading device 10 and the unloading device 40 . This control unit 60 can be implemented by a computing device including a microprocessor, a measuring device such as a sensor, and a memory. This implementation is obvious to those skilled in the art, and therefore further detailed description is omitted.

On the other hand, in this specification, the first customer pallet T1 and the second customer pallet T2 have been differentiated and described as electronic components before/after loading testing, but this is only an example to help understand the specification. In actual engineering, the One customer pallet T1 and the second customer pallet T2 may be mixed during the loading and unloading process and may have the same shape and structure.

Hereinafter, the detailed structure of the loading device 10 according to the first embodiment of the present invention will be described with reference to FIGS. 2 and 3 . The loading device 10 may include a workbench 100 and a hand 200 .

The workbench 100 may provide a plurality of electronic components loaded on the first customer tray T1 before being loaded on the test tray 20, or a plurality of electronic components loaded on the test tray 20 before being loaded on the second customer tray T1. , a temporary placement space. This workbench 100 can be arranged between the customer trays T1 and T2 and the test tray 20 . In addition, the workbench 100 may include a bag frame 110 and an impact absorbing member 120 .

The pocket frame 110 may provide space for housing electronic components. This bag-shaped frame 110 may be formed with a placement portion 111 and a wall portion 112, and may be formed with a bag-shaped space P as a space for placing electronic components.

An impact absorbing member 120 may be disposed on the mounting part 111, and electronic components may be accommodated in the impact absorbing member 120. Such a seating portion 111 may be formed on one side of the bag frame 110 . In addition, a bag-shaped opening hole 111 a penetrating the bag-shaped frame 110 may be formed in the seating portion 111 .

The wall portion 112 may guide the movement of the electronic components so that the electronic components descending toward the impact absorbing member 120 may be placed on the impact absorbing member 120 . A plurality of such wall portions 112 may be provided, and the plurality of wall portions 112 may be formed to protrude upward to surround the impact absorbing member 120 . In addition, the plurality of wall portions 112 may have a predetermined inclination toward the impact absorbing member 120 .

The bag-shaped space P may be a space in which electronic components are arranged inside the bag-shaped frame 110 , and may refer to a space surrounded by the plurality of wall portions 112 and the impact-absorbing member 120 . A plurality of such pocket spaces P may be formed, and a plurality of electronic components may be arranged in the plurality of pocket spaces P.

When the electronic components are disposed in the pocket space P, the impact absorbing member 120 may provide a portion where the electronic components are placed. In addition, the impact absorbing member 120 can be caused to absorb impact applied to the electronic component. For example, when the electronic components fall toward the shock absorbing member 120, the shock absorbing member 120 may absorb the shock applied to the electronic components. The impact-absorbing component 120 may include a material with an elastic material that is beneficial to impact absorption, for example, may include silicon. A plurality of such impact absorbing members 120 may be provided, and the plurality of impact absorbing members 120 may be arranged in a plurality of pocket spaces P.

In addition, the impact absorbing member 120 may include a material having excellent lubricity. For example, the upper surface of the shock absorbing member 120 may be made of a material with excellent lubricity (ie, a material with low frictional resistance) to minimize friction between the shock absorbing member 120 and the electronic component. In this manner, when the upper surface of the shock absorbing member 120 includes a low friction resistance material and the electronic components are mounted on the shock absorbing member 120 , the electronic components can be prevented from sliding away from the shock absorbing member 120 or being poorly positioned. As another example, the surface of the impact absorbing member 120 may be formed as a flat surface without unevenness to prevent the occurrence of poor placement of electronic components.

The impact absorbing member 120 is disposed on the mounting portion 111 and can be fixedly supported on the mounting portion 111 . For example, the impact absorbing member 120 may be adhered to the upper surface of the seating part 111 through an adhesive (not shown). In addition, the impact absorbing member 120 may have a predetermined thickness, and a buffer opening hole 120 a penetrating the impact absorbing member 120 in the thickness direction (for example, the up and down direction in FIG. 3 ) may be formed in the impact absorbing member 120 . Such a buffer opening hole 120a may be formed in the impact absorbing member 120 to correspond to the bag-shaped opening hole 111a. Therefore, the bag-shaped open hole 111a and the buffer open hole 120a may be communicated with each other. In addition, when the electronic component is placed on the shock absorbing member 120, the buffer opening hole 120a can prevent an air layer from being formed between the electronic component and the shock absorbing member 120, so that the electronic component is spaced apart from the shock absorbing member 120.

The hand 200 can hold a plurality of electronic components placed on the customer tray T1 and transfer them to the workbench 100, and can place them on the impact absorbing member 120. In addition, the hand 200 can hold a plurality of electronic components placed on the workbench 100 and transfer them to the test tray 20 . In addition, the hand 200 can release the grip of the electronic component from the upper side of the impact absorbing member 120 and drop the electronic component.

For example, the hand 200 can hold electronic components through a predetermined vacuum pressure. On the other hand, when the hand 200 holds the electronic component, an impact may be exerted on the electronic component due to the pressure exerted by the hand 200 , but this impact can be minimized by the impact absorbing member 120 . In other words, when the hand 200 holds the electronic component, the impact applied to the electronic component can be absorbed by the impact absorbing member 120 by the elastic force of the impact absorbing member 120 . In this way, there is an effect that the impact applied to the electronic components by the impact absorbing member 120 is minimized.

As another example, since the rigidity of the placement part 111 is greater than the rigidity of the electronic component, when the hand 200 places the electronic component in the bag-like space P, if the electronic component falls and is immediately placed on the placement part 111, the impact will Can be applied to electronic components. However, when the hand 200 releases the grip of the electronic component, the electronic component is placed on the impact absorbing member 120 having elastic force, thereby minimizing the impact applied to the electronic component. In addition, there is an effect that by including a material with low frictional resistance on the upper surface of the shock absorbing member 120, even if the electronic component is placed on the upper surface of the shock absorbing member 120, it will not be detached from the shock absorbing member 120, and Can be placed at the designated location.

On the other hand, the hand 200 provided in the unloading device 40 may be provided, and the hand 200 provided in the unloading device 40 may transfer the electronic components placed on the test tray 20 to the second customer tray T2. In addition, the hand 200 provided in the loading device 10 may be named the first hand 200 , and the hand 200 provided in the unloading device 40 may be named the second hand 200 .

On the other hand, in addition to these configurations, according to the second embodiment of the present invention, the impact absorbing member 120 may include a first impact absorbing member 121 and a second impact absorbing member 122 . Hereinafter, a second embodiment of the present invention will be explained further with reference to FIG. 4 . When describing the second embodiment, differences compared with the above-described embodiment will mainly be described, and the same descriptions and reference numerals will be used to refer to the above-described embodiment.

Referring to FIG. 4 , the impact absorbing member 120 may include a first impact absorbing member 121 and a second impact absorbing member 122 , and the buffer opening hole 120 a may include a first buffer opening hole 121 a and a second buffer opening hole 122 a.

The first impact absorbing member 121 may be provided on the seating part 111 and may be formed of an elastic material. The elastic force of this first impact absorbing member 121 may be higher than the elastic force of the second impact absorbing member 122 . In addition, the first shock absorbing member 121 may have a first buffer opening hole 121a formed in the first shock absorbing member 121 to correspond to the bag-shaped opening hole 111a.

The second shock absorbing member 122 may be provided on the first shock absorbing member 121 and may provide a portion where electronic components are mounted. In addition, the second shock absorbing member 122 may be formed with a second buffer opening hole 122 a penetrating the second shock absorbing member 122 in the thickness direction (for example, the up-and-down direction in FIG. 4 ). This second impact absorbing member 122 may have a predetermined elastic force and have a smaller friction resistance than the first impact absorbing member 121 . For example, the second impact absorbing member 122 may include an engineering plastic that has high lubricity due to low frictional resistance. In a more detailed example, the second impact absorbing component 122 may include nylon, polyphenylene oxide (mPPO), polycarbonate (PC), polyacetal (Acetal), and polybutylene terephthalate. (PBT) at least one.

In this way, since the second impact absorbing member 122 has low frictional resistance, when the electronic component is placed on the second impact absorbing member 122, the electronic component has the ability to not detach from the second impact absorbing member 122 and be placed on the second impact absorbing member 122. Second, the effect on the impact absorbing member 122.

In addition, there is an effect that since the second shock absorbing member 122 and the first shock absorbing member 121 have elastic force, when the electronic component is placed on the second shock absorbing member 122, due to the elasticity of the first shock absorbing member 121, there is an effect. The impact between the second impact absorbing member 121 and the electronic component will be absorbed by the first impact absorbing member 121 .

Therefore, when the electronic components are placed on the second impact absorbing member 122, there is an effect that the impact applied to the electronic components is minimized.

On the other hand, in addition to this configuration, according to the third embodiment of the present invention, the wall portion 112 may be spaced apart from the impact absorbing member 120 . Hereinafter, a third embodiment of the present invention will be further described with reference to FIGS. 5 and 6 . When describing the third embodiment, differences compared with the above-described embodiment will be mainly described, and the same descriptions and reference numerals will be used to refer to the above-described embodiment.

Referring to FIGS. 5 and 6 , the workbench 100 may include a bag frame 110 and an impact absorbing member 120 .

A bag-shaped open hole 111 a penetrating the bag-shaped space P may be formed in the bag-shaped frame 110 .

A plurality of wall portions 112 may be provided, and the plurality of wall portions 112 may be formed to protrude upward to surround the impact absorbing member 120 .

In addition, the plurality of wall portions 112 may be spaced apart from the impact absorbing member 120 in the horizontal direction. In other words, the plurality of wall portions 112 may be spaced apart by a predetermined distance from a side of the impact absorbing member 120 facing the wall portion 112 . In this manner, the separation space S can be provided between the wall portions 112 and the impact absorbing member 120 by spaced apart the plurality of wall portions 112 from the impact absorbing member 120 .

The terminal portion of the electronic component may be provided in the separation space S. For example, multiple terminals may be arranged at the edge of the electronic component. In addition, when the electronic component is placed on the shock absorbing member 120 , the edge of the electronic component may be disposed in the separation space S without being placed on the shock absorbing member 120 . In this case, since the terminals of the electronic components do not contact the shock absorbing member 120, they can be protected from shocks caused by contact with the shock absorbing member 120.

In addition, the shock absorbing member 120 may be formed with a buffer opening hole 120 a penetrating the shock absorbing member 120 so as to correspond to the bag-shaped opening hole 111 a.

On the other hand, the terminals of the electronic component may not only be formed on the entire front surface of the electronic component, but may also be formed concentratedly at the edges of the electronic component. When such an electronic component is bent with a predetermined curvature, the load is relieved at the center portion and the load is concentratedly applied to the terminals at the edges. However, according to the third embodiment of the present invention, since the separation space S is formed between the wall portion 112 and the impact absorbing member 120 , the terminal formed at the edge portion of the electronic component can be placed in the separation space S. This has the effect of protecting the terminals formed at the edge portions of the electronic components from impacts caused by contact with the impact absorbing member 120 .

On the other hand, in addition to this configuration, according to the fourth embodiment of the present invention, the wall portion 112 may be spaced apart from the first impact absorbing member 121 and the second impact absorbing member 122 . Hereinafter, a fourth embodiment of the present invention will be explained further with reference to FIG. 7 . When describing the fourth embodiment, differences compared with the above-mentioned embodiment will be mainly described, and the same descriptions and reference numerals will be used to refer to the above-mentioned embodiment.

Referring to FIG. 7 , the workbench 100 may include a bag frame 110 and an impact absorbing member 120 .

The impact absorbing member 120 may include a first impact absorbing member 121 and a second impact absorbing member 122, and the buffer opening hole 120a may include a first buffer opening hole 121a and a second buffer opening hole 122a.

The first impact absorbing member 121 may be provided on the seating part 111 and may be formed of an elastic material. The elastic force of the first impact absorbing member 121 may be higher than the elastic force of the second impact absorbing member 122 . In addition, the first shock absorbing member 121 may have a first buffer opening hole 121a formed in the first shock absorbing member 121 to correspond to the bag-shaped opening hole 111a.

The second impact absorbing member 122 may be provided on the first impact absorbing member 121 and may be fixedly supported on the first impact absorbing member 121 . For example, the second impact absorbing member 122 may be adhered to the upper surface of the first impact absorbing member 121 through an adhesive (not shown). This second impact absorbing member 122 may have a predetermined thickness, and a second buffer opening hole penetrating the second impact absorbing member 122 in the thickness direction (for example, the up and down direction of FIG. 7 ) may be formed in the second impact absorbing member 122 . 122a.

The second buffer opening hole 122a may be formed in the second impact absorbing member 122 in a manner corresponding to the first buffer opening hole 121a. Therefore, the second buffer opening hole 122a and the first buffer opening hole 121a may communicate with each other. In addition, the second buffer opening hole 122a can prevent an air layer from being formed between the electronic component and the second shock absorbing member 122 when the electronic component is placed on the second shock absorbing member 122, so that the electronic component and the second shock absorbing member 122 122 spaced apart.

The plurality of wall portions 112 may be provided, and the plurality of wall portions 112 may be formed to protrude upward to surround the first impact absorbing member 121 and the second impact absorbing member 122 .

In addition, the plurality of wall portions 112 may be spaced apart from the impact absorbing member 120 in the horizontal direction. In other words, the plurality of wall portions 112 may be spaced apart by a predetermined distance from a side of the impact absorbing member 120 facing the wall portion 112 . In this manner, a gap may be formed between the wall portions 112 and the first and second impact absorbing members 121 and 122 by spaced apart the plurality of wall portions 112 from the first and second impact absorbing members 121 and 122 . Interval space S.

The terminal portion of the electronic component may be provided in the separation space S. For example, multiple terminals may be arranged at the edge of the electronic component. In addition, when the electronic component is disposed on the second shock absorbing member 1220 , the edge of the electronic component may be disposed in the separation space S without being disposed on the second shock absorbing member 122 . In this case, since the terminal of the electronic component does not contact the second shock absorbing member 122, it can be protected from the shock caused by contact with the second shock absorbing member 122.

In this way, by forming the separation space S, there is an effect of protecting the terminals of the electronic components from impacts caused by contact with the second impact absorbing member 122 .

In addition, when the electronic component is placed on the second impact absorbing member 122, due to the elasticity of the first impact absorbing member 121, there is a possibility that the impact between the second impact absorbing member 122 and the electronic component is absorbed by the first impact absorbing member 121. Effect.

Therefore, when the electronic components are placed on the second impact absorbing member 122, there is an effect that impact applied to the electronic components can be minimized.

On the other hand, in addition to this configuration, according to the fifth embodiment of the present invention, the workbench 100 may further include a main body portion 140 . Hereinafter, a fifth embodiment of the present invention will be further described with reference to FIGS. 8 to 10 . When describing the fifth embodiment, differences compared with the above-described embodiment will be mainly described, and the same descriptions and reference numerals will be used to refer to the above-described embodiment.

Referring to FIG. 8 , the workbench 100 may provide a space in which a plurality of electronic components loaded in the customer tray T1 are temporarily placed before being loaded into the test tray 20 . This kind of workbench 100 may include a bag frame 110, a buffer member 120 and a main body part 140.

Referring to FIG. 9 , the pocket frame 110 may provide a space for housing electronic components. In addition, the bag frame 110 is detachably coupled to the main body 140 . A plurality of such bag frames 110 may be provided, and the plurality of bag frames 110 may be supported by the main body part 140 . In addition, a plurality of pocket spaces P may be formed in a plurality of pocket frames 110 . The wall portion 112, the pocket groove portion 113, and the correction hole 114 may be formed in the pocket frame 110.

A plurality of wall portions 112 may be provided, and the plurality of wall portions 112 may be formed to protrude upward to surround the buffer member 120 . In addition, the plurality of wall portions 112 together with the buffer member 120 may form a pocket space P, which is a space in which electronic components are arranged inside the pocket space P. A plurality of such pocket spaces P can be formed.

Referring to FIG. 10 , the bag-shaped groove portion 113 may provide a portion in which a portion of the buffer member 120 is accommodated. This bag-shaped groove 113 may be a portion introduced from the bag-shaped frame 110 and can prevent the buffer member 120 accommodated in the bag-shaped groove 113 from being detached.

When the bag frame 110 is combined with the main body part 140, the correction holes 114 may be engaged with the correction pins 143 of the main body part 140 to correct the positions therebetween. For example, the positions of the bag frame 110 and the main body portion 140 relative to each other can be corrected by inserting the correction pins 143 into the correction holes 114 . A plurality of correction holes 114 may be formed.

When the electronic components are placed in the pocket space P, the buffer member 120 may provide a portion for placing the electronic components. In addition, the buffer member 120 may be provided to absorb impact applied to the electronic component. For example, the buffer member 120 may have a pad shape extending in one direction, and may include silicon (Si). A plurality of such buffer members 120 may be provided, and the plurality of buffer members 120 may be supported by the main body part 140 .

In addition, when the bag frame 110 and the main body part 140 are combined, the buffer member 120 may be sandwiched between the bag frame 110 and the main body part 140 . For example, a part of the buffer member 120 may be accommodated in a main body groove 141 described below in the main body 140 , and the other part of the buffer member 120 may be accommodated in a bag-shaped groove 113 of the bag-shaped frame 110 . In this manner, the buffer member 120 is inserted into the bag-shaped groove part 113 and the main body part 141, so that it can be fixedly supported at a predetermined position without being detached from the bag-shaped frame 110 and the main body part 140.

On the other hand, the buffer member 120 is provided on the main body groove portion 141 and can be fixedly supported on the main body portion 140 . For example, the buffer member 120 may be adhered to the upper surface of the main body groove 141 through an adhesive (not shown). In addition, the buffer member 120 may have a predetermined thickness, and a buffer opening hole 120 a penetrating the buffer member 120 may be formed in the buffer member 120 in the thickness direction. This buffer opening hole 120a may be formed at a position corresponding to the main body opening hole 142 described later. Therefore, the buffer opening hole 120a and the main body opening hole 142 may communicate with each other. In addition, when the electronic component is placed on the buffer member 120 through the buffer opening hole 120a, an air layer is formed between the electronic component and the buffer member 120 to prevent the electronic component from being spaced apart from the buffer member 120.

Referring again to FIG. 9 , the main body portion 140 may support a plurality of bag frames 110 and may support a plurality of buffer members 120 . The main body groove part 141, the main body opening hole 142, and the correction pin 143 may be formed in the main body part 140.

The main body groove portion 141 may support the buffer member 120 and may provide a portion for accommodating a portion of the buffer member 120 . In other words, when a part of the buffer member 120 is received in the main body groove portion 141, the main body groove portion 141 can fixedly support the buffer member 120.

The main body opening hole 142 may be formed through the main body part 140 and may be formed in the main body groove part 141 . This main body opening hole 142 may be communicated with the buffer opening hole 120a.

When the bag frame 110 is combined with the main body part 140, the correction pins 143 may be engaged with the correction holes 114, thereby correcting the positions therebetween. For example, the correction pin 143 may be formed to protrude from the main body part 140 to be inserted into the correction hole 114 . A plurality of such correction pins 143 may be provided and may engage a plurality of correction holes 114 formed in a plurality of bag frames 110 .

In this manner, there is an effect that by engaging the correction pin 143 with the correction hole 114, the relative position of the bag frame 110 and the main body part 140 can be corrected so that they can be combined with each other.

In addition, by inserting the buffer member 120 into the bag-shaped groove part 113 and the main body groove part 141, it can be fixedly supported without being detached from the bag-shaped frame 110 or the main body part 140. When placing electronic components, it can be more stable. Effectively absorbs shock applied to electronic components.

In addition, since the main body part 140 and the bag-shaped frame 110 are provided separately, when the buffer member 120 is provided on the main body part 140, there is an effect that the buffer member 120 can be installed more easily and quickly.

On the other hand, in addition to this configuration, according to the sixth embodiment of the present invention, the workbench 100 may further include a support member 150 . Hereinafter, a sixth embodiment of the present invention will be further described with reference to FIGS. 11 to 15 . When describing the sixth embodiment, the differences compared with the above-mentioned embodiments will be mainly described, and the same descriptions and reference numerals will be used to refer to the above-mentioned embodiments.

Referring to FIGS. 11 and 12 , the workbench 100 may include a bag frame 110 , a main body 140 and a support member 150 .

The wall part 112, the bag-shaped groove part 113, the correction hole 114 and the fixing pin 115 may be formed in the bag-shaped frame 110.

Referring to FIG. 13 , the bag-shaped groove portion 113 may provide a portion into which at least a portion of the supporting member 150 and a protruding portion 144 described later are inserted. This bag-like groove portion 113 may be a portion introduced into the bag-like frame 110 and may prevent the support member 150 inserted into the bag-like groove portion 113 from being detached from the bag-like frame 110 .

The fixing pin 115 can fix the supporting component 150 on the protruding portion 144 of the main body portion 140 . This fixing pin 115 can be inserted through the support fixing hole 153 described later, and can be engaged with the main body fixing hole 145 described later. For example, when the bag frame 110 , the support member 150 and the main body part 140 are arranged in sequence, the fixing pins 115 will be inserted into the support fixing holes 153 and the main body fixing holes 145 in order to fix the support part 150 to the protruding part 144 . A plurality of such fixing pins 115 may be provided, and the plurality of fixing pins 115 may be protrudingly formed.

Referring to FIGS. 12 and 14 , the main body opening hole 142 , the correction pin 143 , the protruding portion 144 and the main body fixing hole 145 may be formed in the main body part 140 .

The protrusion 144 may support the support member 150 and may provide a portion to seat the support member 150 . The protruding portion 144 may be a portion protruding from the main body portion 140 to a predetermined height. In addition, the protrusion 144 may be inserted into the pocket groove 113 together with the support member 150 .

The main body fixing hole 145 may be engaged with the fixing pin 115 to fix the supporting member 150 . For example, the main body fixing hole 145 may be formed through the main body part 140 to insert the fixing pin 115 . In addition, the body fixing holes 145 may be formed in plurality, and the plurality of body fixing holes 145 may be formed on the protruding portion 144 . The above-mentioned fixing pin 115 and main body fixing hole 145 can be named as the first fixing element 115 and the second fixing element 145 respectively, and can be modified so that the first fixing element 115 has a hole shape and the second fixing element 145 has a pin shape. Therefore, any one of the first fixing element 115 and the second fixing element 145 is engaged with the other of the first fixing element 115 and the second fixing element 145 on the support fixing hole 153 to fix the support member 150 to the main body part 140 superior.

Referring to Figure 15, a support member 150 may be provided to support electronic components. For example, this support member 150 may be provided as a film for supporting electronic components. In addition, the support member 150 may be supported on the protrusion 144 and may be disposed on an upper surface of the protrusion 144 .

When the bag frame 110 is combined with the main body part 140, this supporting member 150 may be sandwiched between the bag frame 110 and the main body part 140. For example, the support member 150 may be inserted into the bag groove 113 to be supported by the bag frame 110 . The first open hole 151 , the second open hole 152 and the support fixing hole 153 may be formed in the support member 150 .

When the electronic component is supported by the supporting member 150 , a portion of the terminals of the electronic component may pass through the first open hole 151 . For example, a terminal formed in the center of the electronic component may penetrate the first open hole 151 . This first open hole 151 penetrates the support member 150 in the thickness direction of the support member 150 and may be formed in the center of the support member 150 .

When the electronic component is supported by the supporting member 150, some terminals of the electronic component may penetrate through the second open hole 152. For example, a terminal formed at an edge of the electronic component may penetrate the second open hole 152 . This second open hole 152 surrounds the first open hole 151 along the periphery of the first open hole 151 and penetrates the support member 150 in the thickness direction of the support member 150 . In addition, a plurality of second open holes 152 may be formed.

On the other hand, the depths of the first open hole 151 and the second open hole 152 in the thickness direction of the support member 150 may be the same as the thickness t of the support member 150 . In addition, the first open hole 151 and the second open hole 152 may be formed in the support member 150 in a manner equal to or deeper than the terminal length of the electronic component.

A support fixing hole 153 may be formed through the support member 150 to insert the fixing pin 115 . Such support fixing holes 153 may be formed at positions corresponding to the main body fixing holes 145 . Therefore, the fixing pin 115 inserted into the support fixing hole 153 can be inserted into the main body fixing hole 145, and the support member 150 can be fixedly supported on the protruding portion 144.

In this way, since the first open hole 151 and the second open hole 152 are formed on the support member 150, there is an effect that various types of electronic components can be mounted on the support member 150 regardless of the number of terminals.

In addition, there is an effect that the support member 150 is inserted into the fixing pin 115 and into the bag-shaped groove portion 113 without being separated from the protruding portion 144 .

On the other hand, in addition to this configuration, according to the seventh embodiment of the present invention, the loading device 10 may further include an opening unit 300. Hereinafter, a seventh embodiment of the present invention will be further described with reference to FIGS. 16 to 20 . When describing the seventh embodiment, differences compared with the above-mentioned embodiments will be mainly described, and the same descriptions and reference numerals will be used to refer to the above-mentioned embodiments.

Referring to FIGS. 16 and 17 , the loading device 10 may further include an opening unit 300 .

The opening unit 300 can convert the later-described holding unit 22 of the test tray 20 into a release state or a separation prevention state. This open unit 300 can move away from or close to the test tray 20 to load electronic components. Additionally, the opening unit 300 may include a drive device (not shown) such as a hydraulic piston for such movement. However, in this specification, it is shown that the open unit 300 is close to or far away from the test tray 20, but this is only an example, and the test tray 20 can also be close to or far away from the open unit 300. This open unit 300 may include an open unit body 310, a support member 320 and an elastic unit 330.

The opening unit body 310 may support the support 320 and open the holding unit 22 of the test tray 20 . The recess 311, the opening protrusion 312, the positioning protrusion 313 and the anti-adhesion protrusion 314 may be formed in such an open unit body 310.

The recess 311 may be formed on one side of the open unit body 310 , and such side may be a surface on the test tray 20 side. The support member 320 may be received in such a recess 311, and a groove 311a may be provided for receiving the elastic unit 330.

The opening protrusion 312 can operate the holding unit 22 . Such an open unit 300 may be provided adjacent to the recess 311 and may be formed protruding toward the test tray 20 . In addition, the opening protrusion 312 may be formed on the opening unit body 310 to correspond to the holding unit 22 .

The positioning protrusion 313 can guide the relative movement between the test tray 20 and the opening unit 300 so that the opening protrusion 312 can act on the holding unit 22 . In other words, the opening protrusion 312 can be guided to the holding unit 22 with higher accuracy by the positioning protrusion 313 .

When the open unit 300 is close to the test tray 20, the anti-stick protrusions 314 can prevent the open unit 300 from being too close to the test tray 20. Therefore, even when the opening protrusion 312 operates the holding unit 22, the opening unit 300 and the test tray 20 can be maintained at a predetermined distance.

Referring to FIG. 18 , the support 320 may be supported by the open unit body 310 to advance and retreat in a direction away from the open unit body 310 . For example, the support 320 may move in a direction away from the open unit body 310 within the recess 311 of the open unit body 310 and may move in a direction approaching the open unit body 310 . This support member 320 can support the electronic components accommodated in the test tray 20 in the released state. This support member 320 may include a support body 321 and a buffer support component 322.

The support body 321 may support the elastic unit 330. For this purpose, an elastic member groove 321a may be formed in the support body 321.

The buffer support member 322 may provide a portion where electronic components in the accommodating portion 21 a described later are placed. This buffer support member 322 can be inserted into the receiving portion 21a in the unlocked state of the holder 22a, and the electronic components can be supported by the buffer support member 322. The contact area between the buffer support member 322 and the electronic components may be wider than the contact area between the tray support parts 21b described later and the electronic components. The buffer support members 322 are located between the tray support parts 21b in the released state. In addition, when the buffer support member 322 is provided inside the accommodating part 21a, the upper surface of the buffer support member 322 may be located above the upper end of the tray support part 21b.

The buffer support member 322 may be provided to absorb impact applied to the electronic components. For example, if the hand 200 releases the grip of the electronic component on the receiving portion 21a, when the electronic component is placed on the buffer support member 322, the buffer support member 322 can absorb the impact applied to the electronic component. As another example, when the hand 200 holds an electronic component provided in the receiving portion 21a, if a predetermined pressure is applied to the electronic component, the buffer support member 322 may absorb the impact applied to the electronic component. The buffer support component 322 may include a material with an elastic material that is good for absorbing impact, such as silicone resin (Si).

The buffer support member 322 may be disposed on the upper surface of the support body 321 and may be fixedly supported on the support body 321 . For example, the buffer support component 322 may be adhered to the upper surface of the support body 321 through an adhesive (not shown). Furthermore, the buffer support member 322 may be formed with a buffer support hole 322a penetrating the buffer support member 322 in the thickness direction (for example, the up-and-down direction in FIG. 19 ). This buffer support hole 322a may be communicated with a hole formed in the support body 321. In addition, when the electronic component is placed on the buffer support member 322, an air layer is formed between the electronic component and the buffer support member 322, so that the buffer support hole 322a can prevent the electronic component from being spaced apart from the buffer support member.

Referring to FIG. 19 , the elastic unit 330 may press the support 320 toward the test tray 20 . This elastic unit 330 may include an elastic member 331 and a detachment preventing portion 332 .

The elastic component 331 can press the support 320 toward the test tray 20 . For example, the elastic member 331 may be sandwiched between the support body 321 and the open unit body 310 . One end of this elastic member 331 can be received in the elastic member groove 321a provided at the lower part of the support body 321, and the other end can be received in the recess 311 of the open unit body 310. When the pressure is released, this elastic unit 330 moves the support member 320 that is pressed by the test tray 20 and moves in the direction close to the open unit body 310 to a direction away from the open unit body 310 through the restoring force. In addition, while the test tray 20 moves a predetermined distance away from the open unit 300, the support member 320 is pressed toward the test tray 20 by the elastic member 331, so that it can be in close contact with the test tray 20, and the support member 320 can support the electronics in the receiving part 21a. part.

The detachment prevention part 332 can prevent the support 320 from being completely detached from the open unit body 310 . One end of this detachment prevention part 332 can be fixed on the open unit body 310 and can guide the support 320 to move in a direction away from the open unit body 310 . In addition, when the support member 320 is pressed by the elastic member 331 and moves in a direction away from the open unit body 310, the other end of the separation prevention part 332 may restrict the movement of the support member 320.

However, in this specification, it has been described that the elastic unit 330 is provided to press the support member 320 toward the test tray 20 and prevent the support member 320 from being detached from the open unit body 310, but this is only an example, and the elastic unit 330 may be omitted. Therefore, the support member 320 can also be fixedly supported on the open unit body 310 .

In the following, the test tray 20 will be described in detail. The test tray 20 can accommodate electronic components, and the objects accommodated in the test tray 20 can be prevented from being detached by the holding unit 22 described below. Electronic components can be loaded or unloaded into such test trays 20 . This test tray 20 may include a tray frame 21 and a holding unit 22 .

The tray frame 21 may be formed with a receiving portion 21a in which electronic components can be placed. The receiving portion 21a may be configured in the form of a through hole, and the through hole may be formed to be narrowed toward one side. For example, the accommodating portion 21a may be formed to be narrowed toward the open unit 300. One side of such accommodating portion 21a can be used as an entrance for moving electronic components. On the other hand, the tray support portion 21b may be formed on the tray frame 21. This tray supporting part 21b may be a protrusion protruding from the receiving part 21a. In addition, the tray support part 21b can contact and support the electronic components placed in the accommodating part 21a.

Referring to FIGS. 19 and 20 , the holding unit 22 can selectively hold the electronic components arranged in the accommodating portion 21 a. Therefore, even if the test tray 20 moves or rotates, the electronic components can be restrained without being detached from the test tray 20 . The holding unit 22 can be converted into either a release state or a disengagement preventing state by the opening unit 300 . Here, the release state refers to a state in which the electronic components are allowed to be placed and detached from the accommodating part 21a by the opening unit 300, and the detachment prevention state refers to a state in which the electronic components are prevented from being detached from the accommodating part 21a. The holding unit 22 may include a retainer 22a and a retainer spring 22b.

The holder 22a can selectively hold the electronic components accommodated in the accommodating portion 21a. Such a holder 22a may be pivoted, for example by a hinge connection. In other words, without applying any force to the retainer 22a, the retainer 22a can be rotated about the pivot axis toward the direction of the tray support portion 21b by the force of the retainer spring 22b, so that the retainer 22a can be held by the retainer 22a. Electronic components. In addition, if the electronic components are placed in the accommodating part 21a, one side of the electronic components may be supported by the holder 22a, and the other side of the electronic components may be supported by the tray support part 21b.

Retainer spring 22b may provide a restoring force to retainer 22a. On the other hand, in this specification, the retainer spring 22b is shown as a torsion spring, but this is only an example, and other well-known springs may also be used.

Hereinafter, the operation and effect of the test processor 1 according to the seventh embodiment of the present invention will be described.

The hand 200 can load a plurality of electronic components loaded on the customer trays T1 and T2 onto the workbench 100 . The workbench 100 can move multiple electronic components to the test tray 20 . In addition, the hand 200 can move a plurality of electronic components loaded on the workbench 100 to the upper side of the test tray 20 and release the grip on the upper side of the test tray 20 .

The opening unit 300 can be raised toward the test tray 20 so that the receiving portion 21a of the test tray 20 is in a released state. At this time, the opening protrusion 312 of the opening unit 300 rotates the holder 22a, so that the accommodating part 21a can be in a released state. In addition, when the open unit 300 is in close contact with the test tray 20, the buffer support member 322 may be disposed inside the accommodating part 21a.

When the hand 200 releases the electronic component from the upper side of the receiving portion 21a, the electronic component can be lowered and placed on the buffer support member 322. In addition, when the open unit 300 is lowered, the electronic components placed on the buffer support part 322 may be supported by the tray support part 21b. At this time, the retainer 22a can be in a disengagement preventing state by the retainer spring 22b being rotated to the original position.

In this way, when the hand 200 releases the electronic component from the upper side of the receiving portion 21a, the buffer support member 322 has elastic force, so the impact between the buffer support member 322 and the electronic component will be absorbed by the buffer support member 322. Therefore, there is an effect of minimizing the impact applied to the electronic components.

In addition, since one end portion of the buffer support member 322 is provided on the upper side of the tray support portion 21b, when the electronic component is lowered, it can be placed on the buffer support member 322, and impact applied to the electronic component can be minimized. Thereafter, when the buffer support part 322 is lowered, the electronic components placed on the buffer support part 322 will be supported by the tray support part 21b. At this time, the electronic components can be supported by the tray support part 21b without being impacted. Therefore, there is an effect of preventing impact on electronic components.

On the other hand, in addition to this configuration, according to the eighth embodiment of the present invention, the test tray 20 may omit the test support part 21b and include the tray support part 23. Hereinafter, an eighth embodiment of the present invention will be further described with reference to FIGS. 21 to 23 . When describing the eighth embodiment, the differences compared with the above-mentioned embodiments will be mainly described, and the same descriptions and reference numerals will refer to the above-mentioned embodiments.

The tray support member 23 can support the electronic component 2 placed inside the accommodating part 21a. For example, the tray support member 23 may support between the plurality of terminals 2a of the electronic component. Such a pallet support member 23 may be supported by the pallet frame 21 on the underside of the pallet frame 21 . In addition, a plurality of open holes 23 a through which terminals of electronic components can pass may be formed in the tray support member 23 . For example, when the electronic components are supported by the tray supporting member 23, the plurality of terminals of the electronic components may be exposed downward through the plurality of open holes 23a.

The holding unit 22 can prevent the electronic components supported by the tray support member 23 from being detached from the tray support member 23 .

The buffer support member 322 can absorb the impact applied to the tray support member 23 and the electronic components supported by the tray support member 23 . For example, the buffer support member 322 may absorb an impact applied to the tray support member 23 when the electronic components fall toward the tray support member 23 or when a predetermined pressure is applied to the electronic components. That is, the buffer support member 322 is in close contact with the bottom surface of the tray support member 23 to absorb the impact applied to the tray support member 23 . Furthermore, the buffer support member 322 may support the electronic components exposed through the opening hole 23 a, thereby absorbing the impact applied to the electronic components when they are placed on the tray support member 23 .

Hereinafter, the test processor control method S10 according to the eighth embodiment of the present invention will be described with reference to FIGS. 21 to 26 .

The test processor control method S10 may support testing of electronic components by loading or unloading the electronic components into the test tray 20 . This test processor control method S10 may include a moving step S100, a rising step S200, an opening step S300, a grip releasing step S400, a gripping step S500, an impact absorbing step S600, and a descending step S700.

In the moving step S100, the loading device 10 holding the electronic components may be moved to the accommodating portion 21a of the test tray 20 on which the electronic components are not placed. In this case, the electronic components may be located on the upper side of the accommodating portion 21a. In addition, in the moving step S110, the unloading device 40 may move to the accommodating part 21a to hold the electronic components placed on the tray support member 23 of the test tray 20 that has completed testing.

Referring to FIG. 22 , in the rising step S200 , the opening unit 300 may be raised to approach the test tray 20 . In addition, in the raising step S200, the open unit body 310 may be raised so that the buffer support member 322 is in close contact with the bottom surface of the tray support member 23. On the other hand, when the raising step S200 is performed while the electronic components are supported by the tray support member 23 , the electronic components are not supported by the tray support member 23 but rise while being supported by the buffer support member 322 .

In the opening step S300 , the holding unit 22 may be opened so that the electronic components may be placed on the tray support part 23 . That is, the holding unit 22 may be in a released state. For example, in the opening step S300, the opening protrusion 312 may pressurize the holder 22a so that the holder 22a rotates.

In the grip releasing step S400, the loading device 10 can release the grip of the electronic component so that the electronic component falls toward the accommodating portion 21a. This grip releasing step S400 can be performed when the electronic components are not supported by the tray supporting member 23 .

In the holding step S500, the unloading device 40 can hold the electronic component supported by the tray support member 23. This holding step S500 can be performed when the electronic components are supported by the tray supporting member 23 .

Referring to FIG. 23 , in the impact absorbing step S500 , when the electronic components fall toward the tray support member 23 , the impact applied to the electronic components may be absorbed. In addition, in the impact absorbing step S500, when a predetermined pressure is applied to the electronic components supported by the tray support member 23, the impact applied to the electronic components can be absorbed. For example, in the impact absorbing step S500, the buffer support member 322 supports the terminals of the electronic components exposed through the open holes 23a formed in the tray support member 23, so that the impact applied to the electronic components can be absorbed. .

Referring to FIGS. 24 and 25 , in the lowering step S600 , the open unit body 310 may be lowered so that the buffer support member 322 is spaced apart from the bottom surface of the tray support member 23 . In addition, if the lowering step S600 is performed after the grip releasing step S400, when the open unit main body 310 is lowered, at least a part of the plurality of terminals of the electronic component can be inserted into the open hole 23a.

The embodiments of the present invention have been described above as specific examples, but these are only examples, and the present invention is not limited thereto, but should be interpreted to have the broadest scope based on the basic ideas disclosed in this specification. Those skilled in the art may combine/substitute the disclosed embodiments to implement patterns of shapes not shown, without departing from the scope of the invention. In addition, those skilled in the art can easily change or modify the disclosed embodiments based on this description, and it is clear that such changes or modifications also belong to the scope of the present invention.

From the above discussion, it will be understood that the present invention can be embodied in various forms, including but not limited to the following: Example 1. A test processor, characterized by: include: A pocket frame having a plurality of pocket spaces for containing electronic components; and A plurality of impact-absorbing components arranged in the plurality of pocket spaces for placing the electronic components, the impact-absorbing member is formed of an elastic material to absorb an impact applied to the electronic component when the electronic component falls toward the impact-absorbing member so that the electronic component is placed on the impact-absorbing member, In the bag-shaped frame, a plurality of wall portions are formed to protrude upward to surround the impact absorbing member. Example 2. Test processor as described in Example 1, where, The impact absorbing components include: first impact absorbing component; and The second impact absorbing member is arranged on the upper side of the first impact absorbing member, The surface friction coefficient of the second impact absorbing member is smaller than the surface friction coefficient of the first impact absorbing member, The elastic force of the first impact absorbing member is higher than the elastic force of the second impact absorbing member. Example 3. Test processor as described in Example 1, where, The plurality of wall portions are spaced apart from the impact absorbing member by a predetermined distance in the horizontal direction, so that a separation space is provided between the wall portions and the impact absorbing member, When the electronic component is placed on the impact absorbing member, a part of the electronic component is disposed in the separation space, A bag-shaped open hole penetrating the bag-shaped frame is formed in the bag-shaped frame, A buffer opening hole is formed in the impact absorbing member and penetrates the impact absorbing member to correspond to the bag-shaped opening hole. Example 4. A test processor as described in Example 3, where, The impact absorbing components include: first impact absorbing component; and The second impact absorbing member is arranged on the upper side of the first impact absorbing member, The buffer open holes include: A first buffer opening hole formed in the first impact absorbing member to correspond to the bag-shaped opening hole; and A second buffer opening hole is formed in the second impact absorbing member to correspond to the first buffer opening hole. Example 5. A test processor, characterized by: include: main part; a bag-shaped frame, detachably combined with the main body, and a bag-shaped space capable of placing electronic components is formed in the bag-shaped frame; and An impact-absorbing member is sandwiched between the bag-shaped frame and the main body, and the electronic component can be placed on the impact-absorbing member, The impact absorbing member is formed of an elastic material to absorb an impact applied to the electronic component when the electronic component falls toward the impact absorbing member so that the electronic component is placed on the impact absorbing member. Example 6. A test processor as described in Example 5, wherein, A bag-shaped groove portion is formed in the bag-shaped frame, and a part of the impact absorbing member can be accommodated in the bag-shaped groove portion, A main body groove portion is formed in the main body portion, and the other portion of the impact absorbing member can be accommodated in the main body groove portion, The impact absorbing member is fixedly supported on the bag frame and the main body part by being received in the bag-shaped groove part on one side and being received in the main body groove part on the other side. Example 7. A test processor, characterized by: include: main part; a bag-shaped frame, detachably combined with the main body, and a bag-shaped space capable of placing electronic components is formed in the bag-shaped frame; and A support member is sandwiched between the bag-like frame and the main body part, and the electronic component can be placed in the support member, A first open hole and a plurality of second open holes are formed in the support member. When the electronic component is placed on the support member, a part of the terminals of the electronic component can penetrate the first open hole. , another part of the terminal of the electronic component can penetrate the plurality of second open holes, and the plurality of second open holes can be formed along the periphery of the first open hole. Example 8. A test processor as described in Example 7, wherein, In the main body part, a protruding part for supporting the supporting member is formed protrudingly from one side of the main body part, A bag-shaped groove portion into which the support member can be inserted is formed in the bag-shaped frame, When the bag-shaped frame is combined with the main body part, at least a part of the supporting part and the protruding part is inserted into the bag-shaped groove part, so that the supporting part is fixedly supported on the bag-shaped groove part. on the bag-shaped frame. Example 9. A test processor as described in Example 7, wherein, A first fixing element is provided in the bag frame, In the main body part, a second fixing element for engaging with the first fixing element is formed, A support fixing hole is formed in the support member. The support fixation hole is provided at a position corresponding to the second fixation element and is used to engage with any one of the first fixation element and the second fixation element. , Any one of the first fixing element and the second fixing element is engaged with the other of the first fixing element and the second fixing element in the support fixing hole to secure the support. The components are fixed to the main body. Example 10. A test processor, characterized by: include: Test tray, the test tray includes a tray frame and a holding unit, the tray frame is formed with a receiving portion capable of placing electronic components, the holding unit can support the electronic components in the receiving portion, so that the The electronic components will not be detached from the receiving portion; and an opening unit capable of pressurizing the holding unit so that the electronic component can be detached from the receiving portion, The open units include: an open unit body capable of pressurizing the holding unit by access to the test tray; and A buffer support member is supported by the open unit body, and when the open unit body pressurizes the holding unit, at least a part thereof can be disposed inside the accommodating part, The buffer support member provided inside the receiving portion is formed of an elastic material to absorb the impact exerted on the electronic component when the electronic component falls toward the buffer support member, thereby allowing the electronic component to be placed On the buffer support component, A tray support part is provided in the tray frame, and when the open unit is spaced apart from the holding unit, the tray support part can support the electronic component arranged in the receiving part, When the buffer support member is disposed inside the receiving portion, the upper surface of the buffer support member is located above the upper end of the tray support portion. Example 11. A test processor, characterized by: include: Test tray, the test tray includes a tray frame and a holding unit, the tray frame is formed with a receiving portion capable of placing electronic components, the holding unit can support the electronic components in the receiving portion, so that the The electronic components will not be detached from the receiving portion; and an opening unit capable of pressurizing the holding unit so that the electronic component can be detached from the receiving portion, The open units include: an open unit body capable of pressurizing the holding unit by access to the test tray; and A buffer support member is supported by the open unit body, and when the open unit body pressurizes the holding unit, at least a part thereof can be disposed inside the accommodating part, The buffer support member provided inside the receiving portion is formed of an elastic material to absorb an impact applied to the electronic component when a predetermined pressure is applied to the electronic component disposed on the buffer support member, A tray support part is provided in the tray frame, and when the open unit is spaced apart from the holding unit, the tray support part can support the electronic component arranged in the receiving part, When the buffer support member is disposed inside the receiving portion, the upper surface of the buffer support member is located above the upper end of the tray support portion. Example 12. A test processor, characterized by: include: Test tray, the test tray includes a tray frame, a tray support component and a holding unit, the tray frame is formed with a receiving portion capable of disposing electronic components, and the tray support component is used to support the electronic components configured in the receiving portion. Between the plurality of terminals of the component, the holding unit can support the electronic component on the tray support component so that the electronic component does not detach from the receiving portion; and an opening unit capable of pressurizing the holding unit so that the electronic component can be detached from the receiving portion, The open units include: an open unit body capable of pressurizing the holding unit by access to the test tray; and a buffer support component supported by the open unit body and formed of elastic material, An open hole is formed in the tray support member, and when the electronic component is placed in the tray support member, at least a part of the terminals of the electronic component can pass through the open hole. Example 13. A test processor as described in Example 12, wherein: When the electronic component falls toward the tray support member or applies a predetermined pressure to the electronic component placed on the tray support member, the buffer support member is in close contact with the bottom surface of the tray support member to absorb the pressure exerted on the tray support member. The tray supports impacts on the components and the electronic components, and supports the electronic components exposed through the open holes. Example 14. A test processor control method, characterized by: include: In the moving step, the loading device moves above the receiving part of the pallet frame while holding the electronic components; The raising step is to raise the open unit body so that the buffer support component supported by the open unit body is in close contact with the bottom surface of the pallet support component supported on the lower side of the pallet frame; A gripping release step in which the loading device releases the grip of the electronic component so that the electronic component falls toward the receiving portion; An impact absorbing step in which the buffer support member supports the electronic component exposed through an open hole formed in the tray support member so as to absorb an impact applied to the electronic component when the electronic component falls toward the tray support member impact on; and a lowering step of lowering the open unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member, During the descending step, When the open unit body is lowered, at least some of the plurality of terminals of the electronic component are inserted into the open hole. Example 15. A test processor control method, characterized by: include: In the moving step, the unloading device moves to above the receiving portion of the tray frame in order to hold the electronic components in the receiving portion; The raising step is to raise the open unit body so that the buffer support component supported by the open unit body is in close contact with the bottom surface of the pallet support component supported on the lower side of the pallet frame; A holding step in which the unloading device holds the electronic component supported by the tray support member; An impact absorbing step in which the buffer support member supports the electronic component exposed through an open hole formed in the tray support member so as to absorb a predetermined pressure applied to the electronic component in the holding step. Impact on electronic components; and a lowering step of lowering the open unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member, During the rising step, When the open unit body rises, at least a part of the terminals of the electronic component rises while being inserted into the open hole. Example 16. Test processor control method as described in Example 14 or 15, wherein, further comprising an opening step of opening the holding unit to support the electronic component by the tray support member or to detach the electronic component from the tray support member, During the rising step, The open unit body is raised to a predetermined position so that the opening unit body pressurizes the holding unit.

1: Test processor 2: Electronic components 2a:Terminal 10:Loading device 20:Test tray 21:Pallet frame 21a: Accommodation Department; Accommodation Department 21b: Pallet support part 22: Holding unit 22a: retainer 22b:Retainer spring 23:Pallet support parts 23a:Open hole 30:Cavity 31: Soak the cavity 32:Test cavity 33: Non-wetted cavity 40: Uninstall the device 50:Stacker module 60:Control Department 100:Workbench 110: Bag frame 111: Resettlement Department 111a: Pocket-shaped open hole 112: Wall 113: Bag-shaped groove part 114: Correction hole 115: Fixed pin 120: Impact absorbing parts; buffering parts 120a:Buffer open hole 121: First impact absorbing member 121a: First buffer opening hole 122: Second impact absorbing member 122a: Second buffer opening hole 140: Main part 141: Main body groove 142: Main body opening hole 143: Correction pin 144:Protrusion 145: Main body fixing hole 150:Support parts 151: First open hole 152: Second open hole 153:Support fixing hole 200:Hand 300:Open unit 310: Open unit body 311: concave part 311a: Groove 312:Open protrusion 313: Positioning protrusion 314: Anti-adhesive protrusions 320:Support 321:Support 321a: Elastic component slot 322: Buffer support parts 322a: Buffer support hole 330: Support elastic unit 331: Elastic parts 332: Escape prevention department LP: loading position P: pocket space S: space S10: Test processor control method S100-S700: Steps t:Thickness T1, T2: Customer pallet

FIG. 1 is a perspective view conceptually illustrating a test processor according to an embodiment of the present invention; Figure 2 is a perspective view of a workbench according to the first embodiment of the present invention; Figure 3 is a cross-sectional view taken along line AA' of Figure 2; Figure 4 is a cross-sectional view along A-A' of the workbench according to the second embodiment of the present invention; Figure 5 is a perspective view of a workbench according to a third embodiment of the present invention; Figure 6 is a cross-sectional view taken along line BB' in Figure 5; Figure 7 is a cross-sectional view of the workbench according to the fourth embodiment of the present invention taken along B-B'; Figure 8 is a perspective view of a workbench according to a fifth embodiment of the present invention; Figure 9 is an exploded perspective view of the workbench of Figure 8; Figure 10 is a bottom perspective view of the bag frame of Figure 9; Figure 11 is a perspective view of a workbench according to a sixth embodiment of the present invention; Figure 12 is an exploded perspective view of the workbench of Figure 11; Figure 13 is a bottom perspective view and a partial enlarged view of the bag frame of Figure 12; Figure 14 is an enlarged view of C in Figure 12; Figure 15 is a perspective view of the support member of Figure 12; Figure 16 is a perspective view conceptually illustrating a test processor according to a seventh embodiment of the present invention; Figure 17 is a perspective view of the test tray and open unit of Figure 16; Figure 18 is a partial enlarged perspective view of the test tray and open unit of Figure 16; Figure 19 is a cross-sectional view taken along line DD' of Figure 18; FIG. 20 is a cross-sectional view showing the holding unit in FIG. 18 in a released state; Figure 21 is a longitudinal sectional view of a test tray and an open unit according to the eighth embodiment of the present invention; Fig. 22 is a diagram showing a pattern in which the opening unit of Fig. 21 is raised and the holding unit is in a released state; Figure 23 is an enlarged view of part E of Figure 22; Fig. 24 is a diagram showing a mode in which the open unit of Fig. 22 is lowered and the holding unit is in a state to prevent disengagement; Figure 25 is an enlarged view of F in Figure 24; FIG. 26 is a flowchart sequentially showing a test processor control method according to the eighth embodiment of the present invention.

1: Test processor

10:Loading device

20:Test tray

30:Cavity

31: Soak the cavity

32:Test cavity

33: Non-wetted cavity

40: Uninstall the device

50:Stacker module

60:Control Department

100:Workbench

200:Hand

T1, T2: Customer pallet

Claims (10)

A test processor including: main part; a bag-shaped frame, detachably combined with the main body, and a bag-shaped space capable of placing electronic components is formed in the bag-shaped frame; and A support member is sandwiched between the bag-like frame and the main body part, and the electronic component can be placed in the support member, A first open hole and a plurality of second open holes are formed in the support member. When the electronic component is placed on the support member, a part of the terminals of the electronic component can penetrate the first open hole. , another part of the terminal of the electronic component can penetrate the plurality of second open holes, and the plurality of second open holes can be formed along the periphery of the first open hole. A test processor as described in request item 1, wherein, In the main body part, a protruding part for supporting the supporting member is formed protrudingly from one surface of the main body part, A bag-shaped groove portion into which the support member can be inserted is formed in the bag-shaped frame, When the bag-shaped frame is combined with the main body part, at least a part of the supporting part and the protruding part is inserted into the bag-shaped groove part, so that the supporting part is fixedly supported on the bag-shaped groove part. on the bag-shaped frame. A test processor as described in request item 1, wherein, A first fixing element is provided in the bag frame, In the main body part, a second fixing element for engaging with the first fixing element is formed, A support fixing hole is formed in the support member. The support fixation hole is provided at a position corresponding to the second fixation element and is used to engage with any one of the first fixation element and the second fixation element. , Any one of the first fixing element and the second fixing element is engaged with the other of the first fixing element and the second fixing element in the support fixing hole to secure the support. The components are fixed to the main body. A test processor including: Test tray, the test tray includes a tray frame and a holding unit, the tray frame is formed with a receiving portion capable of placing electronic components, the holding unit can support the electronic components in the receiving portion, so that the The electronic components will not be detached from the receiving portion; and an opening unit capable of pressurizing the holding unit so that the electronic component can be detached from the receiving portion, The open units include: an open unit body capable of pressurizing the holding unit by access to the test tray; and A buffer support member is supported by the open unit body, and when the open unit body pressurizes the holding unit, at least a part thereof can be disposed inside the accommodating part, The buffer support member provided inside the receiving portion is formed of an elastic material to absorb the impact exerted on the electronic component when the electronic component falls toward the buffer support member, thereby allowing the electronic component to be placed On the buffer support component, A tray support part is provided in the tray frame, and when the open unit is spaced apart from the holding unit, the tray support part can support the electronic component arranged in the receiving part, When the buffer support member is disposed inside the receiving portion, the upper surface of the buffer support member is located above the upper end of the tray support portion. A test processor including: Test tray, the test tray includes a tray frame and a holding unit, the tray frame is formed with a receiving portion capable of placing electronic components, the holding unit can support the electronic components in the receiving portion, so that the The electronic components will not be detached from the receiving portion; and an opening unit capable of pressurizing the holding unit so that the electronic component can be detached from the receiving portion, The open units include: an open unit body capable of pressurizing the holding unit by access to the test tray; and A buffer support member is supported by the open unit body, and when the open unit body pressurizes the holding unit, at least a part thereof can be disposed inside the accommodating part, The buffer support member provided inside the receiving portion is formed of an elastic material to absorb an impact applied to the electronic component when a predetermined pressure is applied to the electronic component disposed on the buffer support member, A tray support part is provided in the tray frame, and when the open unit is spaced apart from the holding unit, the tray support part can support the electronic component arranged in the receiving part, When the buffer support member is disposed inside the receiving portion, the upper surface of the buffer support member is located above the upper end of the tray support portion. A test processor including: Test tray, the test tray includes a tray frame, a tray support component and a holding unit, the tray frame is formed with a receiving portion capable of disposing electronic components, and the tray support component is used to support the electronic components configured in the receiving portion. Between the plurality of terminals of the component, the holding unit can support the electronic component on the tray support component so that the electronic component does not detach from the receiving portion; and an opening unit capable of pressurizing the holding unit so that the electronic component can be detached from the receiving portion, The open units include: an open unit body capable of pressurizing the holding unit by access to the test tray; and a buffer support component supported by the open unit body and formed of elastic material, An open hole is formed in the tray support member, and when the electronic component is placed in the tray support member, at least a part of the terminals of the electronic component can pass through the open hole. A test processor as described in request item 6, wherein, When the electronic component falls toward the tray support member or applies a predetermined pressure to the electronic component placed on the tray support member, the buffer support member is in close contact with the bottom surface of the tray support member to absorb the pressure exerted on the tray support member. The tray supports impacts on the components and the electronic components, and supports the electronic components exposed through the open holes. A test processor control method includes: In the moving step, the loading device moves above the receiving part of the pallet frame while holding the electronic components; The raising step is to raise the open unit body so that the buffer support component supported by the open unit body is in close contact with the bottom surface of the pallet support component supported on the lower side of the pallet frame; A gripping release step in which the loading device releases the grip of the electronic component so that the electronic component falls toward the receiving portion; An impact absorbing step in which the buffer support member supports the electronic component exposed through an open hole formed in the tray support member so as to absorb an impact applied to the electronic component when the electronic component falls toward the tray support member impact on; and a lowering step of lowering the open unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member, During the descending step, When the open unit body is lowered, at least some of the plurality of terminals of the electronic component are inserted into the open hole. A test processor control method includes: In the moving step, the unloading device moves to above the receiving portion of the tray frame in order to hold the electronic components in the receiving portion; The raising step is to raise the open unit body so that the buffer support component supported by the open unit body is in close contact with the bottom surface of the pallet support component supported on the lower side of the pallet frame; A holding step in which the unloading device holds the electronic component supported by the tray support member; An impact absorbing step in which the buffer support member supports the electronic component exposed through an open hole formed in the tray support member so as to absorb a predetermined pressure applied to the electronic component in the holding step. Impact on electronic components; and a lowering step of lowering the open unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member, During the rising step, When the open unit body rises, at least a part of the terminals of the electronic component rises while being inserted into the open hole. The test processor control method as described in claim 8 or 9, wherein, further comprising an opening step of opening the holding unit to support the electronic component by the tray support member or to detach the electronic component from the tray support member, During the rising step, The open unit body is raised to a predetermined position so that the opening unit body pressurizes the holding unit.