TW202144754A - Test handler and method for controlling the same - Google Patents
Test handler and method for controlling the same Download PDFInfo
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- TW202144754A TW202144754A TW110118864A TW110118864A TW202144754A TW 202144754 A TW202144754 A TW 202144754A TW 110118864 A TW110118864 A TW 110118864A TW 110118864 A TW110118864 A TW 110118864A TW 202144754 A TW202144754 A TW 202144754A
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- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/08—Shock-testing
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Abstract
Description
發明領域Field of Invention
本發明涉及測試處理器及其控制方法。The present invention relates to a test processor and a control method thereof.
發明背景Background of the Invention
近來隨著與半導體元件等電子部件有關的技術領域的發展,對電子部件的需求正在增加。尤其,需要尺寸小並且具有改善的功能的電子部件。據此,電子部件的尺寸減小,但是一個電子部件的端子的數量增加,使得電子部件的每單位面積的端子的數量增加。在這種電子部件的情況下,即使在相同的衝擊下,施加到一個端子的衝擊也大於在單位面積上具有少量端子的電子部件。因此,在測試電子部件的過程中,變得更脆弱於施加到電子部件上的衝擊。With the recent development of the technical field related to electronic components such as semiconductor elements, the demand for electronic components is increasing. In particular, there is a need for electronic components that are small in size and have improved functions. According to this, the size of the electronic component is reduced, but the number of terminals of one electronic component is increased, so that the number of terminals per unit area of the electronic component is increased. In the case of such an electronic part, even under the same shock, the shock applied to one terminal is larger than that of an electronic part having a small number of terminals per unit area. Therefore, during testing of electronic components, it becomes more vulnerable to shocks applied to the electronic components.
另一方面,當通過預定的製造工程製造電子部件時,由測試處理器(test handler)和測試器(tester)進行測試,並根據測試結果按等級進行分類。在這種測試過程中,電子部件在被裝載於測試托盤(test tray)上的同時移動預定路徑並進行測試。然而,通過預定製造工程製造的電子部件被裝載於客戶托盤(customer tray)中來供應,並且為了對其進行測試,通過包括緩衝台的各種工作台從客戶托盤移送到測試托盤。此外,電子部件會通過開放單元,以便安置在測試托盤上。以此方式,為了測試電子部件,將從客戶托盤中裝載,經過工作台、開放單元,並由裝載/卸載裝置多次把持,直到卸載到測試托盤上為止,然後經歷解除把持的過程。On the other hand, when electronic components are manufactured through a predetermined manufacturing process, tests are performed by a test handler and a tester, and are classified into grades according to the test results. In such a testing process, electronic components are moved and tested by a predetermined path while being loaded on a test tray. However, electronic components manufactured through a predetermined manufacturing process are loaded into customer trays to be supplied, and in order to test them, are transferred from the customer trays to the test trays through various worktables including a buffer table. In addition, the electronic components pass through the open cell for placement on the test tray. In this way, to test electronic components, it will be loaded from the customer tray, passed through the table, opened the cell, and held by the loading/unloading device multiple times until it is unloaded onto the test tray, and then undergoes a process of de-holding.
此時,當裝載/卸載裝置把持電子部件或解除對電子部件的把持時,預定的衝擊將被施加到電子部件上。尤其,在真空吸附電子部件以把持電子部件的過程中,電子部件可能會由於施加到電子部件上的預定加壓力而損壞。例如,當電子部件被加壓以進行真空吸附時,電子部件的端子部分可能會變形,並且電子部件本身可能會彎曲(bending)。作為另一示例,可以以從一開始就彎曲以適合該目的的形態製造具有特殊用途的電子部件,並且這些電子部件的端子中配置在最外部的端子比配置在內側的端子可以接受更強的衝擊。以此方式,在彎曲形態的電子部件中,邊緣部分比內側更脆弱於衝擊,並且可能被施加更大的損壞。At this time, when the loading/unloading device grips the electronic parts or releases the grip of the electronic parts, a predetermined impact will be applied to the electronic parts. In particular, in the process of vacuum suctioning the electronic parts to hold the electronic parts, the electronic parts may be damaged due to a predetermined pressing force applied to the electronic parts. For example, when the electronic part is pressurized for vacuum suction, the terminal portion of the electronic part may be deformed, and the electronic part itself may be bent. As another example, electronic components for special purposes can be manufactured in a form that is bent from the beginning to suit the purpose, and the terminals of these electronic components that are arranged on the outermost side can accept stronger than the terminals arranged on the inner side. shock. In this way, in an electronic component in a bent configuration, the edge portion is more vulnerable to impact than the inner side and may be more damaged.
另外,當測試托盤的剛性大於電子部件的剛性時,將電子部件安置在測試托盤等上時,會對電子部件造成損壞。以此方式,當電子部件被移送以進行測試或正在測試時,預定的損壞繼續累積,並且當電子部件的每單位面積的端子數量增加時,在一個端子上累積的衝擊會變大。這種衝擊的累積成為電子部件性能下降的因素。In addition, when the rigidity of the test tray is greater than that of the electronic components, damage to the electronic components may be caused when the electronic components are placed on the test tray or the like. In this way, predetermined damage continues to accumulate while the electronic component is being transported for testing or being tested, and the shock accumulated on one terminal becomes greater as the number of terminals per unit area of the electronic component increases. The accumulation of such shocks becomes a factor that degrades the performance of electronic components.
因此,需要最小化在移送電子部件以測試或正在測試期間施加到電子部件上的衝擊,並防止損壞電子部件的端子。Accordingly, there is a need to minimize the shock applied to the electronic components during handling of the electronic components for testing or being tested, and prevent damage to the terminals of the electronic components.
發明概要Summary of Invention
考慮到上述背景,發明了本發明的實施例,提供一種測試處理器,以最小化在移送以測試電子部件的過程及測試過程中施加於電子部件上的衝擊,並防止損壞電子部件的端子。With the above background in mind, embodiments of the present invention have been invented to provide a test handler that minimizes shocks applied to electronic components during transfer and testing and prevents damage to terminals of the electronic components.
根據本發明的一實施方式,可以提供一種測試處理器,包括:袋狀(pocket)框架,具有多個用於收容電子部件的袋狀空間;以及 多個衝擊吸收部件,配置在所述多個袋狀空間中,用於安置所述電子部件,所述衝擊吸收部件由彈性材料形成,以吸收當所述電子部件朝向所述衝擊吸收部件下落時施加在所述電子部件上的衝擊,從而使所述電子部件安置在所述衝擊吸收部件上,在所述袋狀框架中,多個壁部以包圍所述衝擊吸收部件的方式向上凸出形成。According to an embodiment of the present invention, there can be provided a test handler including: a pocket frame having a plurality of pocket spaces for accommodating electronic components; and a plurality of shock absorbing members disposed in the plurality of pocket-like spaces for accommodating the electronic components, the shock absorbing members being formed of an elastic material to absorb when the electronic components are dropped toward the shock absorbing member A shock applied to the electronic component so that the electronic component is seated on the shock absorbing member, in the bag-shaped frame, a plurality of wall portions are formed to protrude upward so as to surround the shock absorbing member .
進一步地,可以提供一種測試處理器,所述衝擊吸收部件包括:第一衝擊吸收部件;以及第二衝擊吸收部件,配置在所述第一衝擊吸收部件的上側,所述第二衝擊吸收部件的表面摩擦係數小於所述第一衝擊吸收部件的表面摩擦係數, 所述第一衝擊吸收部件的彈性力高於所述第二衝擊吸收部件的彈性力。Further, a test handler may be provided, the shock absorbing member includes: a first shock absorbing member; and a second shock absorbing member disposed on the upper side of the first shock absorbing member, the second shock absorbing member the surface friction coefficient is smaller than the surface friction coefficient of the first shock absorbing member, The elastic force of the first shock absorbing member is higher than the elastic force of the second shock absorbing member.
進一步地,可以提供一種測試處理器,多個所述壁部在水平方向上與所述衝擊吸收部件間隔開預定距離,從而在所述壁部與所述衝擊吸收部件之間設置有間隔空間,當所述電子部件被安置在所述衝擊吸收部件上時,所述電子部件的一部分被配置在所述間隔空間中,所述袋狀框架中形成有貫通所述袋狀框架的袋狀(pocket)開放孔,在所述衝擊吸收部件中形成有緩衝開放孔,所述緩衝開放孔貫通所述衝擊吸收部件以對應於所述袋狀開放孔。Further, a test handler may be provided in which a plurality of the wall portions are spaced apart from the shock absorbing member by a predetermined distance in the horizontal direction, so that a space is provided between the wall portions and the shock absorbing member, When the electronic component is placed on the shock absorbing member, a part of the electronic component is arranged in the space, and a pocket passing through the pocket frame is formed in the pocket frame. ) an open hole, and a buffer open hole is formed in the shock absorbing member, and the buffer open hole penetrates the shock absorbing member so as to correspond to the bag-shaped open hole.
進一步地,可以提供一種測試處理器,所述衝擊吸收部件包括:第一衝擊吸收部件;以及第二衝擊吸收部件,配置在所述第一衝擊吸收部件的上側,所述緩衝開放孔包括:第一緩衝開放孔,形成在所述第一衝擊吸收部件中以對應於所述袋狀開放孔;以及第二緩衝開放孔,形成在所述第二衝擊吸收部件中以對應於所述第一緩衝開放孔。Further, a test handler may be provided, the shock absorbing member includes: a first shock absorbing member; and a second shock absorbing member disposed on the upper side of the first shock absorbing member, the buffer opening hole includes: a first shock absorbing member A buffer opening hole formed in the first shock absorbing member to correspond to the bag-shaped opening hole; and a second buffer opening hole formed in the second shock absorbing member to correspond to the first buffer Open hole.
進一步地,可以提供一種測試處理器,包括:主體部;袋狀框架,可分離式結合於所述主體部,所述袋狀框架中形成有能夠放置所述電子部件的袋狀空間;以及 衝擊吸收部件,夾入於所述袋狀框架與所述主體部之間,在所述衝擊吸收部件中能夠安置所述電子部件,所述衝擊吸收部件由彈性材料形成,以吸收當所述電子部件朝向所述衝擊吸收部件下落時施加在所述電子部件上的衝擊,從而使所述電子部件安置在所述衝擊吸收部件上。Further, a test handler can be provided, comprising: a main body part; a bag-shaped frame detachably coupled to the main body part, a bag-shaped space capable of placing the electronic component is formed in the bag-shaped frame; and a shock absorbing member sandwiched between the bag-shaped frame and the main body, in which the electronic parts can be accommodated, the shock absorbing member being formed of an elastic material to absorb when the electronic parts are The shock applied to the electronic component when the component falls toward the shock absorbing member causes the electronic component to be seated on the shock absorbing member.
進一步地,可以提供一種測試處理器,在所述袋狀框架中形成有袋狀槽部,在所述袋狀槽部中能夠收容所述衝擊吸收部件的任一部分,在所述主體部中形成有主體槽部,在所述主體槽部中能夠收容所述衝擊吸收部件的另一部分,所述衝擊吸收部件通過一側收容於所述袋狀槽部中並且另一側收容於所述主體槽部中而固定支撐於所述袋狀框架及所述主體部上。Further, it is possible to provide a test handler in which a bag-shaped groove portion is formed in the bag-shaped frame, any part of the shock absorbing member can be accommodated in the bag-shaped groove portion, and a bag-shaped groove portion is formed in the main body portion. There is a main body groove portion in which the other part of the shock absorbing member can be accommodated, the shock absorbing member being accommodated in the bag-shaped groove portion on one side and accommodated in the main body groove on the other side It is fixed and supported on the bag-shaped frame and the main body part.
進一步地,可以提供一種測試處理器,包括:主體部;袋狀框架,可分離式結合於所述主體部,所述袋狀框架中形成有能夠放置電子部件的袋狀空間;以及 支撐部件,夾入於所述袋狀框架與所述主體部之間,所述支撐部件中能夠安置所述電子部件,在支撐部件中形成有第一開放孔及多個第二開放孔,當所述電子部件被安置在所述支撐部件上時,所述電子部件端子中的一部分能夠貫通所述第一開放孔,所述電子部件的端子的另一部分能夠貫通所述多個第二開放孔,並且所述多個第二開放孔能夠沿所述第一開放孔的週邊形成。Further, a test handler can be provided, comprising: a main body part; a bag-shaped frame detachably coupled to the main body part, a bag-shaped space capable of placing electronic components is formed in the bag-shaped frame; and a support member sandwiched between the bag-shaped frame and the main body, the electronic component can be placed in the support member, and a first open hole and a plurality of second open holes are formed in the support member. When the electronic component is placed on the support member, a part of the terminals of the electronic component can pass through the first open hole, and another part of the terminal of the electronic component can pass through the plurality of second open holes , and the plurality of second open holes can be formed along the periphery of the first open holes.
進一步地,可以提供一種測試處理器,在所述主體部中,用於支撐所述支撐部件的凸出部從所述主體部的一面凸出形成,在所述袋狀框架中形成有能夠插入所述支撐部件的袋狀槽部,當所述袋狀框架與所述主體部相結合時,通過將所述支撐部件及所述凸出部的至少一部分插入到所述袋狀槽部中,將所述支撐部件固定支撐於所述袋狀框架上。Further, it is possible to provide a test handler in which a protruding portion for supporting the support member in the main body portion is formed to protrude from one surface of the main body portion, and a bag-shaped frame is formed with a protruding portion capable of being inserted into the main body portion. In the pocket-shaped groove portion of the support member, when the pocket-shaped frame is coupled to the main body portion, by inserting at least a part of the support member and the protruding portion into the pocket-shaped groove portion, The support member is fixedly supported on the bag-shaped frame.
進一步地,可以提供一種測試處理器,在所述袋狀框架中設有第一固定元件,在主體部中,形成有用於與所述第一固定元件相接合的第二固定元件,在所述支撐部件中形成有支撐固定孔,所述支撐固定孔設於與所述第二固定元件相對應的位置並用於與所述第一固定元件及第二固定元件中的任一個相接合, 所述第一固定元件及所述第二固定元件中的任一個,通過與所述第一固定元件及所述第二固定元件中的另一個在所述支撐固定孔相接合來將所述支撐部件固定到所述主體部上。Further, a test handler may be provided, wherein a first fixing member is provided in the bag-shaped frame, a second fixing member for engaging with the first fixing member is formed in the main body portion, and a second fixing member is formed in the main body portion. A support fixing hole is formed in the support member, and the support fixing hole is arranged at a position corresponding to the second fixing element and is used for engaging with any one of the first fixing element and the second fixing element, Either one of the first fixing element and the second fixing element is engaged with the other one of the first fixing element and the second fixing element in the support fixing hole to hold the support A component is secured to the body portion.
進一步地,可以提供一種測試處理器,包括:測試托盤,所述測試托盤包括托盤框架及保持單元,所述托盤框架中形成有能夠安置電子部件的收容部,所述保持單元能夠將所述電子部件支撐於所述收容部,以使所述電子部件不會從所述收容部脫離;以及開放單元,能夠對所述保持單元加壓以使所述電子部件能夠從所述收容部脫離,所述開放單元包括:開放單元主體,能夠通過接近所述測試托盤來對所述保持單元加壓;以及緩衝支撐部件,由所述開放單元主體支撐,當所述開放單元主體對所述保持單元加壓時,至少一部分能夠配置在所述收容部內側,設置在所述收容部內側的所述緩衝支撐部件由彈性材料形成,以當所述電子部件朝向所述緩衝支撐部件下落時吸收施加在所述電子部件上的衝擊,從而使所述電子部件安置在所述緩衝支撐部件上,當所述開放單元從所述保持單元間隔開時,在所述托盤框架中設有能夠支撐配置在所述收容部中的所述電子部件的托盤支撐部,當所述緩衝支撐部件配置在所述收容部內側時,所述緩衝支撐部件的上表面位於所述托盤支撐部的上端的上側。Further, a test handler can be provided, comprising: a test tray, the test tray includes a tray frame and a holding unit, the tray frame is formed with a receiving part capable of placing electronic components, and the holding unit can hold the electronic components A component is supported on the accommodating portion so that the electronic component is not detached from the accommodating portion; and an opening unit can press the holding unit so that the electronic component can be detached from the accommodating portion, so that The opening unit includes: an opening unit main body capable of pressurizing the holding unit by approaching the test tray; and a buffer support member supported by the opening unit main body, when the opening unit main body presses the holding unit. When pressed, at least a part can be arranged inside the receiving portion, and the buffer support member provided inside the receiving portion is formed of an elastic material to absorb the impact applied to the buffer support member when the electronic component falls toward the buffer support member. impact on the electronic components, so that the electronic components are placed on the buffer support member, and when the opening unit is spaced apart from the holding unit, there is provided in the tray frame capable of supporting the arrangement on the In the tray support portion of the electronic component in the accommodating portion, when the buffer supporting member is arranged inside the accommodating portion, the upper surface of the buffer supporting member is positioned above the upper end of the tray supporting portion.
進一步地,可以提供一種測試處理器,包括:測試托盤,所述測試托盤包括托盤框架及保持單元,所述托盤框架中形成有能夠安置電子部件的收容部,所述保持單元能夠將所述電子部件支撐於所述收容部,以使所述電子部件不會從所述收容部脫離;以及 開放單元,能夠對所述保持單元加壓以使所述電子部件能夠從所述收容部脫離, 所述開放單元包括: 開放單元主體,能夠通過接近所述測試托盤來對所述保持單元加壓;以及 緩衝支撐部件,由所述開放單元主體支撐,當所述開放單元主體對所述保持單元加壓時,至少一部分能夠配置在所述收容部內側, 設置在所述收容部內側的所述緩衝支撐部件由彈性材料形成,以在將預定壓力施加到安置於所述緩衝支撐部件上的電子部件時吸收施加到所述電子部件上的衝擊, 當所述開放單元從所述保持單元間隔開時,在所述托盤框架中設有能夠支撐配置在所述收容部中的所述電子部件的托盤支撐部, 當所述緩衝支撐部件配置在所述收容部內側時,所述緩衝支撐部件的上表面位於所述托盤支撐部的上端的上側。Further, a test handler can be provided, comprising: a test tray, the test tray includes a tray frame and a holding unit, the tray frame is formed with a receiving part capable of placing electronic components, and the holding unit can hold the electronic components a component is supported on the receiving portion so that the electronic component is not detached from the receiving portion; and an opening unit capable of pressurizing the holding unit so that the electronic component can be detached from the accommodating portion, The open unit includes: an open unit body, enabling the holding unit to be pressurized by accessing the test tray; and The buffer support member is supported by the open unit body, and at least a part of the support member can be disposed inside the accommodating portion when the open unit body presses the holding unit, the buffer support member provided inside the housing portion is formed of an elastic material to absorb shock applied to the electronic component when a predetermined pressure is applied to the electronic component placed on the buffer support member, When the opening unit is spaced apart from the holding unit, a tray support portion capable of supporting the electronic components arranged in the housing portion is provided in the tray frame, When the buffer support member is disposed inside the accommodating portion, the upper surface of the buffer support member is positioned above the upper end of the tray support portion.
進一步地,可以提供一種測試處理器,包括: 測試托盤,所述測試托盤包括托盤框架、托盤支撐部件及保持單元,所述托盤框架中形成有能夠配置電子部件的收容部,所述托盤支撐部件用於支撐配置在所述收容部中的電子部件的多個端子之間,所述保持單元能夠將所述電子部件支撐於所述托盤支撐部件上,以使所述電子部件不會從所述收容部脫離;以及 開放單元,能夠對所述保持單元加壓以使所述電子部件能夠從所述收容部脫離, 所述開放單元包括: 開放單元主體,能夠通過接近所述測試托盤來對所述保持單元加壓;以及 緩衝支撐部件,由所述開放單元主體支撐, 由彈性材料形成, 所述托盤支撐部件中形成有開放孔,當電子部件被安置在所述托盤支撐部件中時,所述電子部件的端子中的至少一部分能夠貫通所述開放孔。Further, a test processor can be provided, including: A test tray, the test tray includes a tray frame, a tray support member and a holding unit, the tray frame is formed with an accommodating portion capable of arranging electronic components, and the tray supporting member is used to support the electronic components arranged in the accommodating portion Between a plurality of terminals of a component, the holding unit can support the electronic component on the tray support member so that the electronic component is not detached from the accommodating portion; and an opening unit capable of pressurizing the holding unit so that the electronic component can be detached from the accommodating portion, The open unit includes: an open unit body, enabling the holding unit to be pressurized by accessing the test tray; and a buffer support member, supported by the open cell body, formed of an elastic material, An open hole is formed in the tray support member, and at least a part of the terminals of the electronic component can pass through the open hole when the electronic component is placed in the tray support member.
進一步地,可以提供一種測試處理器,當所述電子部件朝向所述托盤支撐部件下落或向安置在所述托盤支撐部件上的電子部件施加預定壓力時,所述緩衝支撐部件與所述托盤支撐部件的底面緊貼,以吸收施加在所述托盤支撐部件及所述電子部件上的衝擊,並支撐通過所述開放孔露出的電子部件。Further, it is possible to provide a test processor that supports the buffer support member with the tray when the electronic component falls toward the tray support member or when a predetermined pressure is applied to the electronic component placed on the tray support member. The bottom surfaces of the components are in close contact to absorb shocks applied to the tray support components and the electronic components, and to support the electronic components exposed through the open holes.
進一步地,可以提供一種測試處理器控制方法,包括: 移動步驟,裝載裝置在把持電子部件的同時移動至托盤框架的收容部上方; 上升步驟,升高所述開放單元主體,以使由開放單元主體支撐的緩衝支撐部件與支撐在所述托盤框架下側的托盤支撐部件的底面緊貼; 把持解除步驟,所述裝載裝置解除對所述電子部件的把持,以使電子部件朝向所述收容部下落; 衝擊吸收步驟,所述緩衝支撐部件支撐通過在所述托盤支撐部件中形成的開放孔露出的所述電子部件,從而當所述電子部件朝向所述托盤支撐部件下落時吸收施加到所述電子部件上的衝擊;以及 下降步驟,使所述開放單元主體下降,以使所述緩衝支撐部件從所述托盤支撐部件的底面間隔開, 在所述下降步驟中, 當所述開放單元主體下降時,所述電子部件的多個端子中的至少一部分插入到所述開放孔中。Further, a test processor control method can be provided, comprising: In the moving step, the loading device moves to the top of the accommodating part of the tray frame while holding the electronic components; The lifting step is to lift the open unit body, so that the buffer support member supported by the open unit body is in close contact with the bottom surface of the tray support member supported on the lower side of the tray frame; a holding release step, in which the loading device releases the holding of the electronic component, so that the electronic component falls toward the accommodating portion; a shock absorbing step, the buffer support member supports the electronic parts exposed through the opening holes formed in the tray support member so as to absorb the electronic parts applied to the electronic parts when the electronic parts drop toward the tray support member impact on; and a descending step of descending the opening unit main body so that the buffer support member is spaced apart from the bottom surface of the tray support member, In the descending step, When the open unit main body is lowered, at least a part of the plurality of terminals of the electronic component is inserted into the open hole.
進一步地,可以提供一種測試處理器控制方法,包括: 移動步驟,卸載裝置為了把持托盤框架的收容部內的電子部件,移動至所述收容部上方;上升步驟,升高所述開放單元主體,以使由開放單元主體支撐的緩衝支撐部件與支撐在所述托盤框架下側的托盤支撐部件的底面緊貼; 把持步驟,所述卸載裝置把持由所述托盤支撐部件支撐的電子部件; 衝擊吸收步驟,所述緩衝支撐部件支撐通過在所述托盤支撐部件中形成的開放孔露出的所述電子部件,從而在所述把持步驟中對所述電子部件施加預定壓力時吸收施加到所述電子部件上的衝擊;以及 下降步驟,使所述開放單元主體下降,以使所述緩衝支撐部件從所述托盤支撐部件的底面間隔開, 在所述上升步驟中, 當所述開放單元主體上升時,所述電子部件的端子中的至少一部分在插入於所述開放孔中的同時上升。Further, a test processor control method can be provided, comprising: In the moving step, the unloading device moves to the top of the accommodating part in order to hold the electronic components in the accommodating part of the tray frame; The bottom surface of the tray support member on the lower side of the tray frame is in close contact; a holding step, wherein the unloading device holds the electronic component supported by the tray support member; a shock absorbing step, wherein the buffer support member supports the electronic parts exposed through the opening holes formed in the tray support member, so as to absorb the applied pressure to the electronic parts when a predetermined pressure is applied to the electronic parts in the holding step shock on electronic components; and a descending step of descending the opening unit main body so that the buffer support member is spaced apart from the bottom surface of the tray support member, In the rising step, When the open unit main body is raised, at least a part of the terminals of the electronic component is raised while being inserted into the open hole.
進一步地,可以提供一種測試處理器控制方法,還包括開放步驟,開放保持單元以由所述托盤支撐部件支撐所述電子部件或使所述電子部件從所述托盤支撐部件脫離, 在所述上升步驟中,將所述開放單元主體上升到預定位置,以使所述開放單元主體對所述保持單元加壓。Further, a test processor control method may be provided, further comprising an opening step of opening a holding unit to support the electronic component by the tray support member or to disengage the electronic component from the tray support member, In the raising step, the opening unit main body is raised to a predetermined position so that the opening unit main body pressurizes the holding unit.
根據本發明的實施例,具有在移送以測試電子部件的過程及測試過程期間最小化施加到電子部件中的衝擊,並且防止電子部件的端子損壞的效果。According to the embodiments of the present invention, there are effects of minimizing the impact applied to the electronic components during the process of transferring to test the electronic components and during the testing process, and preventing the terminals of the electronic components from being damaged.
具體實施方式detailed description
在下文中,將參考附圖詳細說明用於實現本發明精神的具體實施例。Hereinafter, specific embodiments for implementing the spirit of the present invention will be described in detail with reference to the accompanying drawings.
另外,在說明本發明時,當判斷為相關的公知構成或功能的具體說明可能使本發明的主旨不清楚時,將省略其詳細說明。In addition, when describing the present invention, when it is judged that the specific description of the related well-known configuration or function may make the gist of the present invention unclear, the detailed description will be omitted.
另外,當提到某一構成要素“連接”、“支撐”、“結合”到另一個構成要素時,應理解,可以直接連接、支撐、結合到另一構成要素,但是另一構成要素可以存在於中間。In addition, when it is mentioned that a certain component is "connected", "supported", "coupled" to another component, it should be understood that it may be directly connected, supported, or coupled to another component, but another component may exist in the middle.
本說明書中使用的術語僅用於說明特定的實施例,而無意於限制本發明。除非上下文另外明確指出,否則單數表述包括複數表述。The terms used in this specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.
另外,可以使用包括第一、第二等序數的術語來說明各種構成要素,但是相應的構成要素不受這些術語的限制。這些術語僅用於將一構成要素與另一構成要素區分開的目的。In addition, various constituent elements may be described using terms including ordinal numbers such as first, second, etc., but the corresponding constituent elements are not limited by these terms. These terms are only used for the purpose of distinguishing one constituent element from another constituent element.
如說明書中所使用的“包括”的含義將具體化特定特性、區域、整數、步驟、動作、元素和/或成分,不排除其他特定特性、區域、整數、步驟、動作、元素、成分和/或群的存在或附加。The meaning of "comprising", as used in the specification, will specify particular characteristics, regions, integers, steps, acts, elements and/or components and does not exclude other specified characteristics, regions, integers, steps, acts, elements, components and/or or the presence or addition of a group.
另外,在本說明書中,基於附圖說明上部、上表面等的表述,只要改變相應物件的方向,則可以以不同方式表述。In addition, in this specification, the expressions of the upper part, the upper surface, etc. are described based on the drawings, and may be expressed in different ways as long as the directions of the corresponding objects are changed.
在下文中,將參考附圖說明根據本發明一實施例的測試處理器1的具體構成。Hereinafter, the specific structure of the
在下文中,參照圖1,根據本發明一實施例的測試處理器1可以對通過製造工程製造的電子部件進行測試,根據測試結果按照等級進行分類,並裝載在客戶托盤T1、T2中。另外,測試處理器1可以可分離式結合於測試器(未圖示)。這種測試處理器1可以包括裝載裝置10、測試托盤20、腔體30、卸載裝置40、堆垛機模組50及控制部60。Hereinafter, referring to FIG. 1 , a
裝載裝置10可以將裝載在第一客戶托盤T1中的電子部件裝載到測試托盤20中。在此,放置在第一客戶托盤T1上的電子部件是被測試之前的電子部件。在下文中將說明裝載裝置10的具體構成。The
測試托盤20具有可以安置需測試的電子部件的空間,並且可以沿預定路徑循環以測試電子部件。另外,測試托盤20可以安置已經完成測試的電子部件。The
腔體30可以包括浸濕腔體31、測試腔體32及非浸濕腔體33。The
浸濕腔體31可以根據測試條件預熱或預冷從裝載位置LP移送的裝載在測試托盤20上的電子部件。The wetted
測試腔體32可以提供空間,在該空間中對在浸濕腔體31中預熱或預冷並移送到測試腔體32內部的電子部件進行測試。The
非浸濕腔體33可以在測試腔體32的內部被加熱或冷卻,以將完成測試的電子部件同化到卸載所需的溫度。The
卸載裝置40可以按照測試等級對裝載在從非浸濕腔體33移送的測試托盤20中的電子部件進行分類,並且將其卸載到第二客戶托盤T2。在此,放置在第二客戶托盤T2上的電子部件是已完成測試的電子部件。The
堆垛機模組50可以存儲裝載有電子部件的第一客戶托盤T1及第二客戶托盤T2。The
控制器60可以控制裝載裝置10及卸載裝置40的驅動。這種控制部60可以通過包括微處理器的運算裝置,感測器等的測量裝置及記憶體來實現,該實現方式對於本領域技術人員而言是顯而易見的,因此省略進一步的詳細說明。The
另一方面,在本說明書中,已將第一客戶托盤T1和第二客戶托盤T2區分說明為裝載測試之前/之後的電子元件,但這僅是幫助理解說明書的示例,在實際工程中,第一客戶托盤T1和第二客戶托盤T2可以在經過裝載及卸載過程期間混合,並且可以具有相同的形狀及結構。On the other hand, in this specification, the first customer tray T1 and the second customer tray T2 have been differentiated and explained as electronic components before/after the loading test, but this is only an example to help understand the specification, in actual engineering, the first A customer tray T1 and a second customer tray T2 may be mixed during the loading and unloading process and may have the same shape and structure.
在下文中,將參照圖2及圖3說明根據本發明第一實施例的裝載裝置10的詳細構成。裝載裝置10可以包括工作台100及手部200。Hereinafter, the detailed configuration of the
工作台100可以提供,裝載於第一客戶托盤T1上的多個電子部件在裝載於測試托盤20上之前,或者裝載於測試托盤20上的多個電子部件在裝載於第二客戶托盤T1上之前,臨時安置的空間。這種工作台100可以配置在顧客托盤T1、T2與測試托盤20之間。另外,工作台100可以包括袋狀框架110及衝擊吸收部件120。The table 100 may provide that the plurality of electronic components loaded on the first customer tray T1 are loaded on the
袋狀框架110可以提供安置電子部件的空間。這種袋狀框架110中可以形成有安置部111及壁部112,並且可以形成有袋狀空間P作為安置電子部件的空間。The
在安置部111上可以配置衝擊吸收部件120,所述衝擊吸收部件120中可以安置電子部件。這種安置部111可以形成在袋狀框架110的一面上。另外,可以在安置部111中形成貫通袋狀框架110的袋狀開放孔111a。A
壁部112可以引導電子部件的移動,使得朝向衝擊吸收部件120下降的電子部件可以被安置在衝擊吸收部件120上。可以提供多個這種壁部112,並且多個壁部112可以向上凸出形成以包圍衝擊吸收部件120。另外,多個壁部112可朝向衝擊吸收部件120具有預定傾斜。The
袋狀空間P可以是電子部件配置在袋狀框架110內側的空間,並且可以指由多個壁部112及衝擊吸收部件120包圍的空間。可以形成多個這種袋狀空間P,並且可以在多個袋狀空間P中配置多個電子部件。The pocket-shaped space P may be a space in which electronic components are arranged inside the pocket-shaped
當電子部件被配置在袋狀空間P中時,衝擊吸收部件120可以提供安置電子部件的部分。另外,可以使衝擊吸收部件120吸收施加到電子部件中的衝擊。例如,當電子部件朝向衝擊吸收部件120下落時,衝擊吸收部件120可以吸收施加到電子部件中的衝擊。這種衝擊吸收部件120可以包括具有有利於衝擊吸收的彈性材質的材料,例如,可以包括矽Si。可以設置多個這種衝擊吸收部件120,並且多個衝擊吸收部件120可以配置在多個袋狀空間P中。When the electronic components are arranged in the pocket space P, the
另外,衝擊吸收部件120可以包括具有優異潤滑性的材料。例如,衝擊吸收部件120的上表面可以由具有優異潤滑性的材料(即,具有低摩擦阻力的材料)製成,以使衝擊吸收部件120與電子部件之間的摩擦力最小化。以此方式,當衝擊吸收部件120的上表面包括低摩擦阻力的材料,從而電子部件被安置在衝擊吸收部件120上時,可以防止電子部件從衝擊吸收部件120滑動脫離或發生安置不良。作為另一示例,衝擊吸收部件120的表面可以形成為沒有凹凸的平坦表面,以防止發生電子部件的安置不良。In addition, the
衝擊吸收部件120配置在安置部111上,並且可以固定支撐在安置部111上。例如,衝擊吸收部件120可以通過黏合劑(未圖示)黏附到安置部111的上表面。另外,衝擊吸收構件120可以具有預定的厚度,並且在衝擊吸收部件120中可以形成沿厚度方向(例如,圖3中的上下方向)貫通衝擊吸收部件120的緩衝開放孔120a。這種緩衝開放孔120a可以形成在衝擊吸收部件120中以對應於袋狀開放孔111a。因此,袋狀開放孔111a與緩衝開放孔120a可以彼此連通。另外,當電子部件被安置在衝擊吸收部件120上時,緩衝開放孔120a可以防止在電子部件與衝擊吸收部件120之間形成空氣層,使得電子部件與衝擊吸收部件120間隔開。The
手部200可以把持安置在客戶托盤T1上的多個電子部件並移送到工作台100,並且可以安置在衝擊吸收部件120上。另外,手部200可以把持安置在工作台100上的多個電子部件,並移送到測試托盤20。另外,手部200可以從衝擊吸收部件120的上側解除對電子部件的把持從而使其下落。The
例如,手部200可以通過預定的真空壓來把持電子部件。另一方面,當手部200把持電子部件時,由於手部200施加的壓力可能會對電子部件施加衝擊,但是這種衝擊可以通過衝擊吸收部件120來最小化。換句話說,當手部200把持電子部件時,施加到電子部件上的衝擊可以通過衝擊吸收部件120的彈性力被衝擊吸收部件120吸收。以此方式,具有由衝擊吸收部件120施加到電子部件的衝擊被最小化的效果。For example, the
作為另一示例,由於安置部111的剛性大於電子部件的剛性,因此當手部200將電子部件安置在袋狀空間P中時,若電子部件下落並立即安置在安置部111上,則衝擊將可以施加到電子部件。然而,當手部200解除電子部件的把持時,電子部件被安置在具有彈性力的衝擊吸收部件120上,從而使施加到電子部件的衝擊最小化。另外,具有如下效果:通過在衝擊吸收部件120的上表面上包括具有低摩擦阻力的材料,即使電子部件被安置在衝擊吸收部件120的上表面上,也不會從衝擊吸收部件120脫離,並且可以安置在所定位置上。As another example, since the rigidity of the
另一方面,也可以在卸載裝置40中設置手部200,設置在卸載裝置40中的手部200可以將安置在測試托盤20上的電子部件移送到第二客戶托盤T2。另外,可以將設置在裝載裝置10中的手部200命名為第一手部200,將設置在卸載裝置40中的手部200命名為第二手部200。On the other hand, the
另一方面,除了這些構成之外,根據本發明的第二實施例,衝擊吸收部件120可以包括第一衝擊吸收部件121及第二衝擊吸收部件122。在下文中,將進一步參照圖4說明本發明的第二實施例。在說明第二實施例時,主要說明與上述實施例相比的差異點,相同的說明和附圖標記引用上述實施例。On the other hand, in addition to these configurations, according to the second embodiment of the present invention, the
參照圖4,衝擊吸收部件120可以包括第一衝擊吸收部件121及第二衝擊吸收部件122,緩衝開放孔120a可以包括第一緩衝開放孔121a及第二緩衝開放孔122a。4 , the
第一衝擊吸收部件121可以設置在安置部111上並且可以由彈性材料形成。這種第一衝擊吸收部件121的彈性力可以高於第二衝擊吸收部件122的彈性力。另外,第一衝擊吸收部件121可以具有形成在第一衝擊吸收部件121以對應於袋狀開放孔111a的第一緩衝開放孔121a。The first
第二衝擊吸收部件122可以設置在第一衝擊吸收部件121上,並且可以提供安置有電子部件的部分。另外,第二衝擊吸收部件122中可以形成有沿厚度方向(例如,圖4中的上下方向)貫通第二衝擊吸收部件122的第二緩衝開放孔122a。這種第二衝擊吸收部件122可以具有預定的彈性力,並且具有小於第一衝擊吸收部件121的摩擦阻力。例如,第二衝擊吸收部件122可以包括由於低摩擦阻力而具有高潤滑性的工程塑料(engineering plastic)。在更詳細的示例中,第二衝擊吸收部件122可以包括尼龍(nylon)、聚苯醚(mPPO)、聚碳酸酯(PC)、聚縮醛(Acetal)及聚對苯二甲酸丁二醇酯(PBT)中的至少一種。The second
以此方式,由於第二衝擊吸收部件122具有低摩擦阻力,因此當電子部件被安置在第二衝擊吸收部件122上時,電子部件具有不會從第二衝擊吸收部件122脫離而被安置在第二衝擊吸收部件122上的效果。In this way, since the second
另外,具有如下效果:由於第二衝擊吸收部件122及第一衝擊吸收部件121具有彈性力,因此當電子部件被安置在第二衝擊吸收部件122上時,由於第一衝擊吸收部件121的彈性,第二衝擊吸收部件121與電子部件之間的衝擊會被第一衝擊吸收部件121吸收。In addition, since the second
因此,當電子部件被安置在第二衝擊吸收部件122上時,具有施加到電子部件上的衝擊被最小化的效果。Therefore, when the electronic parts are placed on the second
另一方面,除了這種構成之外,根據本發明的第三實施例,壁部112可以與衝擊吸收部件120間隔設置。在下文中,將進一步參照圖5及圖6說明本發明的第三實施例。在說明第三實施例時,主要說明與上述實施例相比的差異點,相同的說明和附圖標記引用上述實施例。On the other hand, in addition to this configuration, according to the third embodiment of the present invention, the
參照圖5及圖6,工作台100可以包括袋狀框架110及衝擊吸收部件120。Referring to FIGS. 5 and 6 , the
可以在袋狀框架110中形成貫通袋狀空間P的袋狀開放孔111a。A bag-shaped
壁部112可以設置為多個,多個壁部112可以向上凸出形成以包圍衝擊吸收部件120。The
另外,多個壁部112可以在水平方向上與衝擊吸收部件120間隔設置。換句話說,多個壁部112可以從衝擊吸收部件120面對壁部112的一面間隔開預定距離。以此方式,可以通過將多個壁部112從衝擊吸收部件120間隔設置來在壁部112與衝擊吸收部件120之間提供間隔空間S。In addition, the plurality of
電子部件的端子部分可以設置在間隔空間S中。例如,多個端子可以配置在電子部件的邊緣處。另外,當電子部件被安置在衝擊吸收部件120上時,電子部件的邊緣可以被配置在間隔空間S中而不被安置在衝擊吸收部件120上。在這種情況下,由於電子部件的端子未接觸衝擊吸收部件120,因此可以保護其免受因與衝擊吸收部件120接觸而產生的衝擊。The terminal portion of the electronic component may be arranged in the interval S. For example, a plurality of terminals may be arranged at the edge of the electronic component. In addition, when the electronic component is placed on the
另外,衝擊吸收部件120中可以形成有以與袋狀開放孔111a相對應的方式貫通衝擊吸收部件120的緩衝開放孔120a。In addition, the
另一方面,電子部件的端子不僅可以形成在電子部件的整個前表面上,而且可以集中形成在電子部件的邊緣處。當這種電子部件彎曲具有預定的曲率時,載荷在中心部被減輕,且載荷被集中施加到邊緣處的端子上。但是,根據本發明的第三實施例,由於在壁部112與衝擊吸收部件120之間形成有間隔空間S,因此形成於電子部件的邊緣部分的端子可以被放置在間隔空間S中。據此,具有保護形成在電子部件的邊緣部分的端子免受因與衝擊吸收部件120接觸而產生的衝擊的效果。On the other hand, the terminals of the electronic part may be formed not only on the entire front surface of the electronic part, but also concentratedly formed at the edge of the electronic part. When such an electronic component is bent with a predetermined curvature, the load is relieved at the center portion, and the load is concentratedly applied to the terminals at the edges. However, according to the third embodiment of the present invention, since the space S is formed between the
另一方面,除了這種構成之外,根據本發明的第四實施例,壁部112可以與第一衝擊吸收部件121及第二衝擊吸收部件122間隔設置。在下文中,將進一步參照圖7說明本發明的第四實施例。在說明第四實施例時,主要說明與上述實施例相比的差異點,相同的說明及附圖標記引用上述實施例。On the other hand, in addition to this configuration, according to the fourth embodiment of the present invention, the
參照圖7,工作台100可以包括袋狀框架110及衝擊吸收部件120。Referring to FIG. 7 , the
衝擊吸收部件120可以包括第一衝擊吸收部件121及第二衝擊吸收部件122,緩衝開放孔120a可以包括第一緩衝開放孔121a及第二緩衝開放孔122a。The
第一衝擊吸收部件121可以設置在安置部111上並且可以由彈性材料形成。這種第一衝擊吸收部件件121的彈性力可以高於第二衝擊吸收部件122的彈性力。另外,第一衝擊吸收部件121可以具有形成在第一衝擊吸收部件121中以對應於袋狀開放孔111a的第一緩衝開放孔121a。The first
第二衝擊吸收部件122可以設置在第一衝擊吸收部件121上,並且可以固定支撐在第一衝擊吸收部件121上。例如,第二衝擊吸收部件122可以通過黏合劑(未圖示)黏附至第一衝擊吸收部件121的上表面。這種第二衝擊吸收部件122可以具有預定的厚度,並且在第二衝擊吸收部件122中形成有沿厚度方向(例如,圖7的上下方向)貫通第二衝擊吸收部件122的第二緩衝開放孔122a。The second
第二緩衝器開放孔122a可以以對應於第一緩衝器開放孔121a的方式形成在第二衝擊吸收部件122中。因此,第二緩衝開放孔122a與第一緩衝開放孔121a可以彼此連通。另外,第二緩衝開放孔122a可以防止當電子部件被安置在第二衝擊吸收部件122上時,在電子部件與第二衝擊吸收部件122之間形成空氣層,從而電子部件與第二衝擊吸收部件122間隔開。The second
壁部112可以設置為多個,多個壁部112可以向上凸出形成以包圍第一衝擊吸收部件121及第二衝擊吸收部件122。A plurality of
另外,多個壁部112可以在水平方向上與衝擊吸收部件120間隔設置。換句話說,多個壁部112可以從衝擊吸收部件120面對壁部112的一面間隔開預定距離。以此方式,可以通過將多個壁部112與第一衝擊吸收部件121及第二衝擊吸收部件122間隔設置而在壁部112與第一衝擊吸收部件121及第二衝擊吸收部件122之間形成間隔空間S。In addition, the plurality of
電子部件的端子部分可以設置在間隔空間S中。例如,多個端子可以配置在電子部件的邊緣處。另外,當電子部件被安置在第二衝擊吸收部件1220上時,電子部件的邊緣可以被配置在間隔空間S中而不被安置在第二衝擊吸收部件122上。在這種情況下,由於電子部件的端子未接觸第二衝擊吸收部件122,因此可以保護其免受因與第二衝擊吸收部件122接觸而產生的衝擊。The terminal portion of the electronic component may be arranged in the interval S. For example, a plurality of terminals may be arranged at the edge of the electronic component. In addition, when the electronic component is placed on the second shock absorbing member 1220 , the edge of the electronic component may be placed in the separation space S without being placed on the second
以此方式,通過形成間隔空間S,具有保護電子部件的端子免受因與第二衝擊吸收部件122接觸而產生的衝擊的效果。In this way, by forming the separation space S, there is an effect of protecting the terminal of the electronic component from a shock caused by contact with the second
另外,當電子部件被安置在第二衝擊吸收部件122上時,由於第一衝擊吸收部件121的彈性,具有第二衝擊吸收部件122與電子部件之間的衝擊被第一衝擊吸收部件121吸收的效果。In addition, when the electronic component is placed on the second
因此,當電子部件被安置在第二衝擊吸收部件122上時,具有施加到電子部件上的衝擊可以被最小化的效果。Therefore, when the electronic parts are placed on the second
另一方面,除了這種構成之外,根據本發明的第五實施例,工作台100還可以包括主體部140。在下文中,將進一步參照圖8至圖10說明本發明的第五實施例。在說明第五實施例時,主要說明與上述實施例相比的差異點,相同的說明和附圖標記引用上述實施例。On the other hand, in addition to this configuration, according to the fifth embodiment of the present invention, the table 100 may further include the
參照圖8,工作台100可以提供空間,在該空間中,裝載在客戶托盤T1中的多個電子部件在被裝載到測試托盤20中之前被臨時安置。這種工作台100可以包括袋狀框架110、緩衝部件120及主體部140。Referring to FIG. 8 , the
參照圖9,袋狀框架110可以提供用於安置電子部件的空間。另外,袋狀框架110可分離式結合於主體部140。可以設置多個這種袋狀框架110,並且多個袋狀框架110可以由主體部140支撐。另外,可以在多個袋狀框架110中形成多個袋狀空間P。壁部112、袋狀槽部113、矯正孔114可以形成在袋狀框架110中。Referring to FIG. 9, the
壁部112可以設置為多個,多個壁部112可以向上凸出形成以包圍緩衝部件120。另外,多個壁部112可以與緩衝部件120一起形成袋狀空間P,該口袋空間P為電子部件配置在袋狀空間P內側的空間。可以形成多個這種袋狀空間P。The
參照圖10,袋狀槽部113可以提供收容有一部分緩衝部件120的部分。這種袋狀槽部113可以為從袋狀框架110引入形成的部分,可以防止收容在袋狀槽部113中的緩衝部件120脫離。Referring to FIG. 10 , the pocket-shaped
當袋狀框架110與主體部140結合時,矯正孔114可以與主體部140的矯正銷143接合以矯正彼此之間的位置。例如,可以通過將矯正銷143插入到矯正孔114中來矯正袋狀框架110與主體部140相對於彼此的位置。這種矯正孔114可以形成為多個。When the bag-shaped
當電子部件被放置在袋狀空間P中時,緩衝部件120可以提供安置電子部件的部分。另外,可以設置緩衝部件120以吸收施加到電子部件中的衝擊。例如,緩衝部件120可以為在一個方向上延伸形成的墊(pad)形狀,並且可以包括矽(Si)。可以設置多個這種緩衝部件120,多個緩衝部件120可以由主體部140支撐。When the electronic parts are placed in the pocket space P, the
另外,當袋狀框架110與主體部140結合時,緩衝部件120可以夾入於袋狀框架110與主體部140之間。例如,緩衝部件120的一部分可以收容在主體部140的後述的主體槽部141中,緩衝部件120的另一部分可以收容在袋狀框架110的袋狀槽部113。以此方式,緩衝部件120被插入到袋狀槽部113和主體槽部141中,從而可以固定支撐在預定位置,而不會從袋狀框架110及主體部140脫離。In addition, when the bag-shaped
另一方面,緩衝部件120設置在主體槽部141上並且可以固定支撐在主體部140上。例如,緩衝部件120可以通過黏合劑(未圖示)黏附至主體槽部141的上表面。另外,緩衝部件120可以具有預定的厚度,並且可以在緩衝部件120中沿厚度方向形成貫通緩衝部件120的緩衝開放孔120a。這種緩衝開放孔120a可以形成在與後述的主體開放孔142相對應的位置。因此,緩衝開放孔120a與主體開放孔142可以彼此連通。另外,當電子部件通過緩衝開放孔120a安置在緩衝部件120上時,在電子部件與緩衝部件120之間形成空氣層,以防止電子部件從緩衝部件120間隔開。On the other hand, the
再次參照圖9,主體部140可以支撐多個袋狀框架110並且可以支撐多個緩衝部件120。主體槽部141、主體開放孔142、矯正銷143可以形成在主體部140中。Referring again to FIG. 9 , the
主體槽部141可以支撐緩衝部件120,並且可以提供收容一部分緩衝部件120的部分。換句話說,當緩衝部件120的一部分收容在主體槽部141中時,主體槽部141可以固定支撐緩衝部件120。The main
主體開放孔142可以貫通主體部140形成,並且可以形成在主體槽部141中。這種主體開放孔142可以與緩衝開放孔120a連通。The main
當袋狀框架110與主體部140結合時,矯正銷143可以與矯正孔114接合,從而矯正彼此之間的位置。例如,矯正銷143可以從主體部140突出形成,以插入到矯正孔114中。可以設置多個這種矯正銷143,並且可以與形成在多個袋狀框架110中的多個矯正孔114接合。When the bag-shaped
以此方式,具有如下效果:通過使矯正銷143與矯正孔114接合,可以矯正袋狀框架110與主體部140的相對位置,使得它們可以彼此結合。In this way, there is an effect that by engaging the correction pins 143 with the correction holes 114, the relative positions of the bag-shaped
另外,通過將緩衝部件120插入到袋狀槽部113及主體槽部141中,其不會從袋狀框架110或主體部140脫離並可以被固定支撐,當安置電子部件時,具有可以更穩定地吸收施加到電子部件上的衝擊的效果。In addition, by inserting the
另外,由於單獨提供主體部140和袋狀框架110,所以當將緩衝部件120設置在主體部140上時,具有可以更容易且快速地設置的效果。In addition, since the
另一方面,除了這種構成之外,根據本發明的第六實施方式,工作台100還可以包括支撐部件150。在下文中,將進一步參照圖11至圖15說明本發明的第六實施例。在說明第六實施例時,主要說明與上述實施例相比的差異點,相同的說明及附圖標記引用上述實施例。On the other hand, in addition to this configuration, according to the sixth embodiment of the present invention, the table 100 may further include the
參照圖11及圖12,工作台100可以包括袋狀框架110、主體部140及支撐部件150。11 and 12 , the
袋狀框架110中可以形成壁部112、袋狀槽部113、矯正孔114及固定銷115。A
參照圖13,袋狀槽部113可以提供插入有支撐部件150及後述的凸出部144的至少一部分的部分。這種袋狀槽部113可以是引入形成在袋狀框架110中的部分,並且可以防止插入到袋狀槽部113中的支撐部件150從袋狀框架110脫離。Referring to FIG. 13 , the pocket-shaped
固定銷115可以將支撐部件150固定在主體部140的凸出部144上。這種固定銷115可以貫通插入於後述的支撐固定孔153中,並可與後述的主體固定孔145接合。例如,當依次設置袋狀框架110、支撐部件150及主體部140時,固定銷115將依次插入到支撐固定孔153及主體固定孔145中以將支撐部件150固定到凸出部144上。可以設置多個這種固定銷115,並且多個固定銷115可以凸出形成。The fixing
參照圖12及圖14,可以在主體部140中形成主體開放孔142、矯正銷143、凸出部144及主體固定孔145。12 and 14 , a main
凸出部144可以支撐支撐部件150,並且可以提供安置支撐部件150的部分。這種凸出部144可以為從主體部140凸出形成預定高度的部分。另外,凸出部144可以與支撐部件150一起插入到袋狀槽部113中。The
主體固定孔145可以與固定銷115接合以固定支撐部件150。例如,主體固定孔145可以貫通主體部140形成以插入固定銷115。另外,主體固定孔145可以形成為多個,並且多個主體固定孔145可以形成在凸出部144上。上述的固定銷115及主體固定孔145可以分別命名為第一固定元件115及第二固定元件145,並可以變形實施為第一固定元件115具有孔形狀,第二固定元件145具有銷形狀。因此,第一固定元件115及第二固定元件145中的任一個與第一固定元件115及第二固定元件145中的另一個在支撐固定孔153上接合以將支撐部件150固定到主體部140上。The main
參照圖15,可以設置支撐部件150以支撐電子部件。例如,這種支撐部件150可以被設置為用於支撐電子部件的薄膜。另外,支撐部件150可以被支撐在凸出部144上並且可以被安置在凸出部144的上表面上。Referring to FIG. 15, a
當袋狀框架110與主體部140相結合時,這種支撐部件150可以夾入於袋狀框架110與主體部140之間。例如,支撐部件150可以插入到袋狀槽部113中以由袋狀框架110支撐。第一開放孔151、第二開放孔152及支撐固定孔153可以形成在支撐部件150中。Such a
當電子部件由支撐部件150支撐時,第一開放孔151中可以貫通電子部件的一部分端子。例如,形成在電子部件的中心部的端子可以貫通第一開放孔151。這種第一開放孔151沿支撐部件150的厚度方向貫通支撐部件150,並且可以形成在支撐部件150的中心部。When the electronic component is supported by the supporting
當電子部件由支撐部件150支撐時,第二開放孔152中可以貫通電子部件的一些端子。例如,形成在電子部件的邊緣處的端子可以貫通第二開放孔152。這種第二開放孔152沿第一開放孔151的週邊包圍第一開放孔151,並且沿支撐部件150的厚度方向貫通支撐部件150。另外,可以形成多個第二開放孔152。When the electronic component is supported by the supporting
另一方面,第一開放孔151及第二開放孔152對於支撐部件150的厚度方向的深度可以與支撐部件150的厚度t相同。另外,第一開放孔151及第二開放孔152可以以等於或深於電子部件的端子長度的方式形成在支撐部件150中,。On the other hand, the depth of the first
支撐固定孔153可以貫通支撐部件150形成以插入固定銷115。這種支撐固定孔153可以形成在與主體固定孔145相對應的位置。因此,插入到支撐固定孔153中的固定銷115可以插入到主體固定孔145中,支撐部件150可以固定支撐在凸出部144。A
以此方式,由於第一開放孔151及第二開放孔152形成在支撐部件150上,因此具有不管端子的數量為多少都可以將各種類型的電子部件安置在支撐部件150上的效果。In this way, since the first
另外,具有如下效果:支撐部件150被插入到固定銷115中且被插入到袋狀槽部113中而不脫離凸出部144。In addition, there is an effect that the
另一方面,除了這種構成之外,根據本發明的第七實施例,裝載裝置10還可以包括開放單元300。在下文中,將進一步參照圖16至圖20說明本發明的第七實施例。在說明第七實施例時,主要說明與上述實施例相比的差異點,相同的說明及附圖標記引用上述實施例。On the other hand, in addition to this configuration, according to the seventh embodiment of the present invention, the
參照圖16及圖17,裝載裝置10還可以包括開放單元300。16 and 17 , the
開放單元300可以將測試托盤20的後述的保持單元22轉換成解除狀態或防止脫離狀態。這種開放單元300可以向遠離或接近測試托盤20的方向移動以裝載電子部件。另外,開放單元300可以包括驅動裝置(未圖示)諸如用於這種移動的液壓活塞。然而在本說明書中,表示為開放單元300接近或遠離測試托盤20,但這僅是示例,測試托盤20也可以接近或遠離開放單元300。這種開放單元300可以包括開放單元主體310、支撐件320及彈性單元330。The
開放單元主體310可以支撐支撐件320並開放測試托盤20的保持單元22。可以在這種開放單元主體310中形成凹部311,開放突起312,定位突起313及防黏突起314。The
凹部311可以形成在開放單元主體310的一側,這種一側可以是測試托盤20側的表面。支撐件320可以收容在這種凹部311中,並且可以設置凹槽311a用於收容彈性單元330。The
開放突起312可以操作保持單元22。這種開放單元300可以鄰近凹部311設置並且可以朝向測試托盤20凸出形成。另外,開放突起312可以形成在開放單元主體310上以對應於保持單元22。The
定位突起313可以引導測試托盤20與開放單元300之間的相對移動,使得開放突起312可以作用在保持單元22上。換句話說,可以通過定位突起313將開放突起312以更高的準確度引導至保持單元22。The positioning
當開放單元300接近測試托盤20時,防黏突起314可以防止開放單元300太靠近測試托盤20。因此,即使當開放突起312操作保持單元22時,也可以使開放單元300與測試托盤20保持預定間距。The
參照圖18,支撐件320可以由開放單元主體310支撐以在遠離開放單元主體310的方向上進退。例如,支撐件320可以在開放單元主體310的凹部311內沿遠離開放單元主體310的方向移動,並且可以沿接近開放單元主體310的方向移動。這種支撐件320可以在解除狀態下支撐收容在測試托盤20中的電子部件。這種支撐件320可以包括支撐體321及緩衝支撐部件322。18 , the
支撐體321可以支撐彈性單元330。為此,可以在支撐體321中形成彈性部件槽321a。The
緩衝支撐部件322可以提供安置有後述的容納部21a中的電子部件的部分。這種緩衝支撐部件322可以在保持器22a的解鎖狀態下插入於收容部21a中,電子部件可以由緩衝支撐部件322支撐。這種緩衝支撐部件322與電子部件接觸的面積可以寬於後述的托盤支撐部21b與電子部件接觸的面積,緩衝支撐部件322在解除狀態下位於托盤支撐部21b之間。另外,當緩衝支撐部件322設置在收容部21a的內側時,緩衝支撐部件322的上表面可以位於托盤支撐部21b的上端的上側。The
可以設置緩衝支撐部件322以吸收施加到電子部件上的衝擊。例如,如果手部200在收容部21a上解除對電子部件的把持,則當電子部件被安置在緩衝支撐部件322上時,緩衝支撐部件322可以吸收施加到電子部件上的衝擊。作為另一示例,當手部200把持設置在收容部21a中的電子部件時,如果將預定壓力施加到電子部件上,則緩衝支撐部件322可以吸收施加到電子部件上的衝擊。這種緩衝支撐部件322可以包括具有利於吸收衝擊的彈性材質的材料,例如可以包括矽樹脂(Si)。The
緩衝支撐部件322可以配置在支撐體321的上表面上,並且可以固定支撐在支撐體321上。例如,緩衝支撐部件322可以通過黏合劑(未圖示)黏附在支撐體321的上表面。而且,緩衝支撐部件322中可以形成有沿厚度方向(例如,圖19中的上下方向)貫通緩衝支撐部件322的緩衝支撐孔322a。這種緩衝支撐孔322a可以與形成在支撐體321中的孔連通。另外,當電子部件被安置在緩衝支撐部件322上時,在電子部件與緩衝支撐部件322之間形成空氣層,從而緩衝支撐孔322a可以防止電子部件與緩衝支撐部件間隔開。The
參照圖19,彈性單元330可以將支撐件320壓向測試托盤20。這種彈性單元330可以包括彈性部件331及脫離防止部332。Referring to FIG. 19 , the
彈性部件331可以將支撐件320壓向測試托盤20。例如,彈性部件331可以夾入於支撐體321與開放單元主體310之間。這種彈性部件331的一端可以收容在設置於支撐體321下部的彈性部件槽321a中,而另一端可以收容在開放單元主體310的凹部311中。當解除加壓時,這種彈性單元330將被測試托盤20加壓而在接近開放單元主體310的方向上移動的支撐件320通過恢復力移動至遠離開放單元主體310的方向。另外,測試托盤20向遠離開放單元300的方向移動預定距離期間,支撐件320被彈性部件331壓向測試托盤20,從而可以緊貼於測試托盤20,支撐件320可以支撐收容部21a內的電子部件。The
脫離防止部332可以防止支撐件320從開放單元主體310完全脫離。這種脫離防止部332的一端可以固定在開放單元主體310上,可以引導支撐件320沿遠離開放單元主體310的方向移動。另外,當支撐件320被彈性部件331加壓而向遠離開放單元主體310的方向移動時,脫離防止部332的另一端可以限制支撐件320的移動。The
但是,在本說明書中,已經描述了設置彈性單元330以將支撐件320壓向測試托盤20並防止支撐件320從開放單元主體310脫離,但是這僅是示例,彈性單元330可以省略。因此,支撐件320也可以固定支撐在開放單元主體310上。However, in this specification, it has been described that the
在下文中,將詳細說明測試托盤20。測試托盤20可以收容電子部件,收容在測試托盤20中的物件物體可以通過後述的保持單元22被防止脫離。電子部件可以被裝載或卸載於這種測試托盤20中。這種測試托盤20可以包括托盤框架21、保持單元22。Hereinafter, the
托盤框架21中可以形成有可以安置電子部件的收容部21a。這種收容部21a可以構造成通孔的形態,這種通孔可以形成為朝向一側變窄。例如,收容部21a可以形成為朝向開放單元300變窄。這種收容部21a的一側可以用作用於移動電子部件的入口。另一方面,托盤支撐部21b可以形成在托盤框架21上。這種托盤支撐部21b可以為從收容部21a凸出的突起。另外,托盤支撐部21b可以接觸並支撐安置在收容部21a中的電子部件。The
參照圖19及圖20,保持單元22可以選擇性地保持配置在收容部21a中的電子部件。因此,即使測試托盤20移動或旋轉,電子部件也可以被約束而不會從測試托盤20脫離。這種保持單元22可以通過開放單元300轉換為解除狀態及防止脫離狀態中的任何一種。在此,解除狀態是指通過開放單元300允許電子部件對於收容部21a的安置及脫離的狀態,防止脫離狀態是指防止對於收容部21a的電子部件的脫離的狀態。保持單元22可以包括保持器22a及保持器彈簧22b。19 and 20 , the holding
保持器22a可以選擇性地保持收容在收容部21a中的電子部件。這種保持器22a可以例如由鉸鏈連接而樞轉。換句話說,在不對保持器22a施加任何力的情況下,可以通過保持器彈簧22b的作用力使保持器22a以樞軸為中心朝向托盤支撐部21b的方向旋轉,從而可以通過保持器22a保持電子部件。另外,如果將電子部件安置在收容部21a中,則電子部件的一側可以由保持器22a支撐,而電子部件的另一側可以由托盤支撐部21b支撐。The
保持器彈簧22b可以向保持器22a提供恢復力。另一方面,在本說明書中,保持器彈簧22b被示出為是扭轉彈簧,但這僅是示例,也可以使用其他周知的彈簧。The
在下文中,將描述根據本發明第七實施例的測試處理器1的操作和效果。Hereinafter, operations and effects of the
手部200可以將裝載在客戶托盤T1、T2上的多個電子部件裝載到工作台100上。工作台100可以將多個電子部件移送到測試托盤20。另外,手部200可以將裝載在工作台100上的多個電子部件移動到測試托盤20的上側,並且可以在測試托盤20的上側解除把持。The
開放單元300可以朝向測試托盤20上升,使得測試托盤20的收容部21a處於解除狀態。此時,開放單元300的開放突起312旋轉保持器22a,從而收容部21a可以成為解除狀態。另外,當開放單元300與測試托盤20緊貼時,緩衝支撐部件322可以配置在收容部21a的內側。The
當手部200從收容部21a的上側解除對電子部件的把持時,電子部件可以下降並安置在緩衝支撐部件322上。另外,當開放單元300下降時,安置在緩衝支撐部件322上的電子部件可以由托盤支撐部21b支撐。此時,保持器22a可以通過保持器彈簧22b旋轉到原始位置而處於防止脫離狀態。When the
以此方式,當手部200從收容部21a的上側解除對電子部件的把持時,緩衝支撐部件322具備彈性力,從而緩衝支撐部件322與電子部件之間的衝擊將被緩衝支撐部件322吸收。因此,具有使施加到電子部件上的衝擊最小化的效果。In this way, when the
另外,由於緩衝支撐部件322的一端部設置在托盤支撐部21b的上側而當電子部件下降時,可以安置在緩衝支撐部件322上,並且可以使施加到電子部件上的衝擊最小化。此後,當緩衝支撐部件322下降時,安置在緩衝支撐部件322上的電子部件將由托盤支撐部21b支撐,此時,電子部件可以由托盤支撐部21b支撐而不會受到衝擊。因此,具有防止施加到電子部件上的衝擊的效果。In addition, since one end portion of the
另一方面,除了這種構成之外,根據本發明的第八實施例,測試托盤20可以省略測試支撐部21b並包括托盤支撐部件23。在下文中,將進一步參照圖21至圖23說明本發明的第八實施例。在說明第八實施例時,主要說明與上述實施例相比的差異點,相同的說明及附圖標記引用上述實施例。On the other hand, in addition to this configuration, according to the eighth embodiment of the present invention, the
托盤支撐部件23可以支撐放置在收容部21a內側的電子部件2。例如,托盤支撐部件23可以支撐電子部件的多個端子2a之間。這種托盤支撐部件23可以在托盤框架21的下側由托盤框架21支撐。另外,可以在托盤支撐部件23中形成電子部件的端子可以貫通的多個開放孔23a。例如,當電子部件由托盤支撐部件23支撐時,電子部件的多個端子可以通過多個開放孔23a向下露出。The
保持單元22可以防止由托盤支撐部件23支撐的電子部件從托盤支撐部件23脫離。The holding
緩衝支撐部件322可以吸收施加到托盤支撐部件23及由托盤支撐部件23支撐的電子部件上的衝擊。例如,當電子部件朝向托盤支撐部件23下落時或當向電子部件施加預定壓力時,緩衝支撐部件322可以吸收施加到托盤支撐部件23上的衝擊。即,緩衝支撐部件322與托盤支撐部件23的底面緊貼,以吸收施加到托盤支撐部件23上的衝擊。而且,緩衝支撐部件322可以支撐通過開放孔23a露出的電子部件,從而當電子部件被安置在托盤支撐部件23上時吸收施加到電子部件上的衝擊。The
在下文中,將參照圖21至圖26說明根據本發明的第八實施例的測試處理器控制方法S10。Hereinafter, a test processor control method S10 according to an eighth embodiment of the present invention will be explained with reference to FIGS. 21 to 26 .
測試處理器控制方法S10可以通過將電子部件裝載或卸載於測試托盤20中來支持電子部件的測試。這種測試處理器控制方法S10可以包括移動步驟S100、上升步驟S200、開放步驟S300、把持解除步驟S400、把持步驟S500、衝擊吸收步驟S600及下降步驟S700。The test processor control method S10 may support testing of electronic components by loading or unloading the electronic components into the
在移動步驟S100中,把持電子部件的裝載裝置10可以移動到未安置電子部件的測試托盤20的收容部21a上。在這種情況下,電子部件可以位於收容部21a的上側。另外,在移動步驟S110中,卸載裝置40可以移動到收容部21a上以把持安置在已完成測試的測試托盤20的托盤支撐部件23上的電子部件。In the moving step S100, the
參照圖22,在上升步驟S200中,開放單元300可以上升以接近測試托盤20。另外,在上升步驟S200中,可以升高開放單元主體310,使得緩衝器支撐部件322與托盤支撐部件23的底面緊貼。另一方面,當在由托盤支撐部件23支撐電子部件的同時執行上升步驟S200時,電子部件不由托盤支撐部件23支撐,而是在由緩衝支撐部件322支撐的同時上升。Referring to FIG. 22 , in the ascending step S200 , the
在開放步驟S300中,可以開放保持單元22,使得電子部件可以被安置在托盤支撐部件23上。即,保持單元22可以處於解除狀態。例如,在開放步驟S300中,開放突起312可以對保持器22a加壓,使得保持器22a旋轉。In the opening step S300 , the holding
在把持解除步驟S400中,裝載裝置10可以解除對電子部件的把持,使得電子部件朝向收容部21a下落。當電子部件未被托盤支撐部件23支撐時,可以執行這種把持解除步驟S400。In the grip release step S400 , the
在把持步驟S500中,卸載裝置40可以把持由托盤支撐部件23支撐的電子部件。當電子部件由托盤支撐部件23支撐時,可以執行這種把持步驟S500。In the holding step S500 , the
參照圖23,在衝擊吸收步驟S500中,當電子部件朝向托盤支撐部件23下落時,可以吸收施加到電子部件上的衝擊。另外,在衝擊吸收步驟S500中,當將預定壓力施加到由托盤支撐部件23支撐的電子部件上時,可以吸收施加到電子部件上的衝擊。例如,在衝擊吸收步驟S500中,緩衝支撐部件322支撐通過形成在托盤支撐部件23中的開放孔23a露出的電子部件的端子,從而可以吸收施加到電子部件上的衝擊。 。Referring to FIG. 23, in the shock absorption step S500, when the electronic parts are dropped toward the
參照圖24及圖25,在下降步驟S600中,可以下降開放單元主體310,使得緩衝支撐部件322從托盤支撐部件23的底面間隔開。另外,如果在把持解除步驟S400之後執行下降步驟S600,則當開放單元主體310下降時,電子部件的多個端子中的至少一部分可以插入到開放孔23a中。24 and 25 , in the descending step S600 , the opening unit
如上已經將本發明的實施例描述為具體實施例,但這些僅是示例,本發明不限於此,應根據本說明書中公開的基本思想將其解釋為具有最廣泛的範圍。本領域技術人員可以組合/替代所公開的實施例以實施未示出的形狀的圖案,但這也不脫離本發明的範圍。另外,本領域技術人員可以基於本說明書容易地改變或修改所公開的實施例,並且清楚的是,這種改變或修改也屬於本發明的範圍。The embodiments of the present invention have been described above as specific embodiments, but these are only examples, the present invention is not limited thereto, and should be construed to have the broadest scope according to the basic idea disclosed in the present specification. Those skilled in the art may combine/substitute the disclosed embodiments to implement patterns of shapes not shown without departing from the scope of the present invention. In addition, those skilled in the art can easily change or modify the disclosed embodiments based on the present specification, and it is clear that such changes or modifications also belong to the scope of the present invention.
1:測試處理器 2:電子部件 2a:端子 10:裝載裝置 20:測試托盤 21:托盤框架 21a:容納部;收容部 21b:托盤支撐部 22:保持單元 22a:保持器 22b:保持器彈簧 23:托盤支撐部件 23a:開放孔 30:腔體 31:浸濕腔體 32:測試腔體 33:非浸濕腔體 40:卸載裝置 50:堆垛機模組 60:控制部 100:工作台 110:袋狀框架 111:安置部 111a:袋狀開放孔 112:壁部 113:袋狀槽部 114:矯正孔 115:固定銷 120:衝擊吸收部件;緩衝部件 120a:緩衝開放孔 121:第一衝擊吸收部件 121a:第一緩衝開放孔 122:第二衝擊吸收部件 122a:第二緩衝開放孔 140:主體部 141:主體槽部 142:主體開放孔 143:矯正銷 144:凸出部 145:主體固定孔 150:支撐部件 151:第一開放孔 152:第二開放孔 153:支撐固定孔 200:手部 300:開放單元 310:開放單元主體 311:凹部 311a:凹槽 312:開放突起 313:定位突起 314:防黏突起 320:支撐件 321:支撐體 321a:彈性部件槽 322:緩衝支撐部件 322a:緩衝支撐孔 330:支撐彈性單元 331:彈性部件 332:脫離防止部 LP:裝載位置 P:袋狀空間 S:間隔空間 S10:測試處理器控制方法 S100-S700:步驟 t:厚度 T1,T2:客戶托盤1: Test the processor 2: Electronic components 2a: Terminal 10: Loading device 20: Test tray 21: Tray frame 21a: accommodating part; accommodating part 21b: Tray support 22: Holding unit 22a: Retainer 22b: Retainer Spring 23: Tray support parts 23a: open pores 30: Cavity 31: Wet the cavity 32: Test cavity 33: Non-wetting cavity 40: Uninstaller 50: Stacker module 60: Control Department 100: Workbench 110: Bag frame 111: Placement Department 111a: bag-shaped open hole 112: Wall 113: Pocket groove 114: Correction hole 115: Fixed pin 120: Shock Absorbing Parts; Cushioning Parts 120a: Buffer open hole 121: The first shock absorbing part 121a: first buffer opening hole 122: Second shock absorbing part 122a: Second buffer opening hole 140: main body 141: main body groove 142: main body open hole 143: Correction pin 144: Projection 145: main body fixing hole 150: Support parts 151: First open hole 152: Second open hole 153: Support fixing hole 200: Hands 300: Open Unit 310: Open Unit Body 311: Recess 311a: Grooves 312: Open Protrusion 313: Positioning protrusions 314: Anti-stick protrusions 320: Supports 321: Support body 321a: Elastomeric slot 322: Buffer support parts 322a: Buffer support hole 330: Support elastic unit 331: elastic parts 332: Disengagement prevention part LP: Loading position P: pocket space S: Interval space S10: Test the processor control method S100-S700: Steps t: thickness T1,T2: Customer tray
圖1是概念性地示出根據本發明一實施例的測試處理器的立體圖; 圖2是根據本發明第一實施例的工作台的立體圖; 圖3是沿圖2的A-A'剖切的剖視圖; 圖4是根據本發明第二實施例的沿工作台的A-A’剖切的剖視圖; 圖5是根據本發明第三實施例的工作台的立體圖; 圖6是沿圖5的B-B'剖切的剖視圖; 圖7是將根據本發明第四實施例的工作台沿B-B’剖切的剖視圖; 圖8是根據本發明第五實施方式的工作台的立體圖; 圖9是圖8的工作台的分解立體圖; 圖10是圖9的袋狀框架的仰視立體圖; 圖11是根據本發明第六實施例的工作台的立體圖; 圖12是圖11的工作台的分解立體圖; 圖13是圖12的袋狀框架的仰視立體圖及局部放大圖; 圖14是圖12的C的放大圖; 圖15是圖12的支撐部件的立體圖; 圖16是概念性地示出根據本發明第七實施例的測試處理器的立體圖; 圖17是圖16的測試托盤及開放單元的立體圖; 圖18是圖16的測試托盤及開放單元的局部的放大立體圖; 圖19是沿圖18的D-D'剖切的剖視圖; 圖20是示出圖18中的保持單元處於解除狀態的樣式的剖視圖; 圖21是將根據本發明第八實施例的測試托盤及開放單元剖切的縱向剖視圖; 圖22是示出圖21的開放單元上升,保持單元處於解除狀態的樣式的圖; 圖23是圖22的E部分的放大圖; 圖24是示出圖22的開放單元下降,保持單元處於防止脫離狀態的樣式的圖; 圖25是圖24中F的放大圖; 圖26是依次示出根據本發明第八實施例的測試處理器控制方法的流程圖。1 is a perspective view conceptually illustrating a test processor according to an embodiment of the present invention; 2 is a perspective view of a workbench according to the first embodiment of the present invention; Fig. 3 is a sectional view taken along the line AA' of Fig. 2; 4 is a cross-sectional view taken along A-A' of a workbench according to a second embodiment of the present invention; 5 is a perspective view of a workbench according to a third embodiment of the present invention; 6 is a cross-sectional view taken along line BB' of FIG. 5; 7 is a cross-sectional view of a workbench according to a fourth embodiment of the present invention taken along B-B'; 8 is a perspective view of a workbench according to a fifth embodiment of the present invention; Figure 9 is an exploded perspective view of the workbench of Figure 8; Figure 10 is a bottom perspective view of the bag-shaped frame of Figure 9; 11 is a perspective view of a workbench according to a sixth embodiment of the present invention; Figure 12 is an exploded perspective view of the workbench of Figure 11; Figure 13 is a bottom perspective view and a partial enlarged view of the bag-shaped frame of Figure 12; Fig. 14 is an enlarged view of C of Fig. 12; Figure 15 is a perspective view of the support member of Figure 12; 16 is a perspective view conceptually showing a test processor according to a seventh embodiment of the present invention; Figure 17 is a perspective view of the test tray and open cell of Figure 16; FIG. 18 is an enlarged perspective view of a portion of the test tray and opening unit of FIG. 16; Fig. 19 is a sectional view taken along DD' of Fig. 18; Fig. 20 is a cross-sectional view showing a mode in which the holding unit in Fig. 18 is in a released state; 21 is a longitudinal cross-sectional view of the test tray and the opening unit according to the eighth embodiment of the present invention; FIG. 22 is a diagram showing a mode in which the opening unit of FIG. 21 is raised and the holding unit is in a released state; Figure 23 is an enlarged view of part E of Figure 22; Fig. 24 is a diagram showing a mode in which the opening unit of Fig. 22 is lowered and the holding unit is in a state of preventing detachment; Figure 25 is an enlarged view of F in Figure 24; FIG. 26 is a flowchart sequentially illustrating a test processor control method according to an eighth embodiment of the present invention.
1:測試處理器1: Test the processor
10:裝載裝置10: Loading device
20:測試托盤20: Test tray
30:腔體30: Cavity
31:浸濕腔體31: Wet the cavity
32:測試腔體32: Test cavity
33:非浸濕腔體33: Non-wetting cavity
40:卸載裝置40: Uninstaller
50:堆垛機模組50: Stacker module
60:控制部60: Control Department
100:工作台100: Workbench
200:手部200: Hands
T1,T2:客戶托盤T1,T2: Customer tray
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