KR20210145657A - Test handler and method for controlling the same - Google Patents

Abstract

The invention relates to a test handler and a control method thereof. Specifically, according to an embodiment of the present invention, provided is a test handler, which includes: a pocket frame having a plurality of pocket spaces for accommodating electronic components; and a plurality of impact absorbing members disposed in the plurality of pocket spaces for mounting the electronic components; a plurality of impact absorbing members disposed in the plurality of pocket spaces to seat the electronic component, wherein the shock absorbing member is formed of an elastic material to absorb an impact applied on the electronic component when the electronic component falls toward the impact absorbing member, so that the electronic component is mounted on the impact absorbing member. In the pocket frame, a plurality of wall portions are formed to protrude upward so as to surround the impact absorbing member. Accordingly, it is possible to prevent terminals of the electronic component from being damaged.

Description

TEST HANDLER AND METHOD FOR CONTROLLING THE SAME

The present invention relates to a test handler and a method for controlling the same.

Recently, as the technology field related to electronic components such as semiconductor devices develops, the demand for electronic components is increasing. In particular, an electronic component having a small size and improved function is required. Accordingly, since the size of the electronic component is reduced but the number of terminals of one electronic component is increased, the number of terminals per unit area of the electronic component is increased. In the case of such an electronic component, even with the same impact, the impact applied to one terminal is greater than that of an electronic component having a small number of terminals per unit area. Accordingly, the electronic component becomes more vulnerable to impacts applied to the electronic component in the process of testing the electronic component.

On the other hand, when an electronic component is manufactured through a predetermined manufacturing process, it is tested by a test handler and a tester, and is classified by grade according to the test result. In such a test process, electronic components move a predetermined path while being loaded on a test tray, and a test is performed. However, electronic components manufactured through a predetermined manufacturing process are loaded and supplied on a customer tray, and in order to test this, they are transferred from the customer tray through various tables including a buffer table to the test tray. In addition, the electronic components pass through the opening unit to be seated on the test tray. In this way, in order for electronic components to be tested, they are loaded from a customer tray, passed through a table and an open unit, and then gripped and released a plurality of times by a loading/unloading device until unloaded to a test tray.

In this case, when the loading/unloading device grips or releases the electronic components, a predetermined impact is applied to the electronic components. In particular, in the process of vacuum adsorbing the electronic component in order to grip the electronic component, the electronic component may be damaged by a predetermined pressing force applied to the electronic component. For example, the terminal portion of the electronic component may be deformed when the electronic component is pressed for vacuum adsorption, and the electronic component itself may be bent. As another example, an electronic component having a special purpose may be manufactured in a bent form from the beginning according to the purpose, and the terminals of these electronic components have a stronger impact than the terminals arranged in the outermost part of the terminals can receive As such, in the bent electronic component, the edge portion is more vulnerable to impact than the inner side, and more damage may be applied.

In addition, when the rigidity of the test tray is greater than that of the electronic component, the electronic component is damaged when the electronic component is mounted on the test tray or the like. As such, when the electronic component is transported for testing or tested, a predetermined amount of damage is continuously accumulated, and when the number of terminals per unit area of the electronic component increases, the impact accumulated in one terminal becomes larger. Accumulation of such impact becomes a factor of deterioration of the performance of electronic components.

Therefore, there is a need to minimize the impact applied to the electronic components during transport or testing to test the electronic components, and to prevent the terminals of the electronic components from being damaged.

Embodiments of the present invention were invented in view of the above background, and minimize the impact applied to the electronic component during the transferring process and the testing process for testing the electronic component, and prevent damage to the terminal of the electronic component We want to provide a test handler that can do this.

According to an aspect of the present invention, a pocket frame having a plurality of pocket spaces for accommodating electronic components; and a plurality of shock absorbing members disposed in the plurality of pocket spaces so that the electronic component is seated, wherein the shock absorbing member faces the electronic component toward the shock absorbing member so that the electronic component is seated on the shock absorbing member A test handler may be provided that is formed of an elastic material to absorb an impact applied to the electronic component when the component falls, and that the pocket frame has a plurality of wall portions protruding upward to surround the shock-absorbing member.

In addition, the shock absorbing member includes a first shock absorbing member and a second shock absorbing member disposed above the first shock absorbing member, wherein the second shock absorbing member is greater than the first shock absorbing member A test handler may be provided, which has a small surface friction coefficient, and wherein the first shock absorbing member has a higher elastic force than that of the second shock absorbing member.

In addition, the plurality of the wall parts are arranged to be spaced apart from the shock absorbing member by a predetermined distance in a horizontal direction to provide a space between the wall part and the shock absorbing member, and when the electronic component is seated on the shock absorbing member, the A portion of the electronic component is disposed in the spaced space, the pocket frame has a pocket opening hole penetrating the pocket frame, and the shock absorption member has a buffer opening penetrating the shock absorption member to correspond to the pocket opening hole. A hole-formed, test handler may be provided.

In addition, the shock absorbing member includes a first shock absorbing member and a second shock absorbing member disposed above the first shock absorbing member, wherein the buffer opening hole corresponds to the pocket opening hole. A first buffer opening hole formed in the first shock absorbing member, and a second buffer opening hole formed in the second shock absorbing member to correspond to the first buffer opening hole, the test handler may be provided.

In addition, the body portion; a pocket frame detachably coupled to the body and having a pocket space in which the electronic component can be disposed; and a shock absorbing member interposed between the pocket frame and the body portion on which the electronic component can be seated, wherein the shock absorbing member includes the shock absorbing member for seating the electronic component on the shock absorbing member A test handler may be provided, which is formed of an elastic material to absorb an impact applied to the electronic component when the electronic component falls toward the .

In addition, the pocket frame is formed with a pocket groove in which any part of the shock absorbing member can be accommodated, the body part is formed with a body groove in which another part of the shock absorbing member can be accommodated, and the shock absorbing member A test handler may be provided in which one side is accommodated in the pocket groove portion and the other side is received in the body groove portion so that the pocket frame and the body portion are fixedly supported.

In addition, the body portion; a pocket frame detachably coupled to the body and having a pocket space in which the electronic component can be disposed; and a support member interposed between the pocket frame and the body portion on which the electronic component can be mounted, wherein when the electronic component is seated on the support member, some of the terminals of the electronic component are disposed on the support member. A test handler may be provided in which the first open hole that can pass through and another part of the terminals of the electronic component pass through, and a plurality of second open holes provided along the periphery of the first open hole are formed.

In addition, a protrusion for supporting the support member is formed on the body portion to protrude from one surface of the body portion, and a pocket groove portion into which the support member can be inserted is formed in the pocket frame, and the support member includes the pocket frame When the body portion and the body portion are coupled, the support member and at least a portion of the protrusion portion are inserted into the pocket groove portion to be fixedly supported on the pocket frame, and a test handler may be provided.

In addition, a first fixing element is provided on the pocket frame, a second fixing element for engaging with the first fixing element is formed on the body portion, and the support member has a second fixing element corresponding to the second fixing element. and a support fixing hole for engaging with any one of the first fixing element and the second fixing element is formed, and any one of the first fixing element and the second fixing element is provided with the first fixing element and a test handler provided to fix the support member to the body portion by engaging the other one of the second fixing elements and the support fixing hole.

The test tray may further include: a test tray including a tray frame in which an accommodating part on which an electronic component can be mounted is formed, and a holding unit capable of supporting the electronic component in the accommodating part so that the electronic component does not deviate from the accommodating part; and an opening unit capable of pressing the holding unit so that the electronic component can be separated from the accommodating part, wherein the opening unit has an open unit body capable of pressing the holding unit by accessing the test tray. ; And is supported by the open unit body, when the open unit body presses the holding unit, at least a portion comprising a buffer support member that can be disposed inside the receiving portion, the buffer disposed inside the receiving portion The support member is formed of an elastic material to absorb an impact applied to the electronic component when the electronic component falls toward the cushioning support member in order for the electronic component to be seated on the buffer support member, and the tray frame includes, When the opening unit is spaced apart from the holding unit, a tray support portion capable of supporting the electronic component disposed in the accommodation portion is provided, and the upper surface of the buffer support member has the buffer support member on the inside of the accommodation portion. When disposed, a test handler located above the upper end of the tray support may be provided.

The test tray may further include: a test tray including a tray frame in which an accommodating part on which an electronic component can be mounted is formed, and a holding unit capable of supporting the electronic component in the accommodating part so that the electronic component does not deviate from the accommodating part; and an opening unit capable of pressing the holding unit so that the electronic component can be separated from the accommodating part, wherein the opening unit has an open unit body capable of pressing the holding unit by accessing the test tray. ; And is supported by the open unit body, when the open unit body presses the holding unit, at least a portion comprising a buffer support member that can be disposed inside the receiving portion, the buffer disposed inside the receiving portion The support member is formed of an elastic material to absorb an impact applied to the electronic component when a predetermined pressure is applied to the electronic component seated on the buffer support member, and in the tray frame, the opening unit is separated from the holding unit. When spaced apart, a tray support portion capable of supporting the electronic component disposed in the accommodation portion is provided, and the upper surface of the buffer support member is, when the buffer support member is disposed inside the accommodation portion, the tray support portion A test handler, located above the top, may be provided.

In addition, a tray frame in which an accommodating portion in which an electronic component can be disposed is formed, a tray support member for supporting between a plurality of terminals of the electronic component disposed in the accommodating portion, and the electronic component to prevent the electronic component from being separated from the accommodating portion a test tray including a holding unit capable of supporting a component on the tray support member; and an opening unit capable of pressing the holding unit so that the electronic component can be separated from the accommodating part, wherein the opening unit has an open unit body capable of pressing the holding unit by accessing the test tray. ; and a buffer support member supported by the open unit body and formed of an elastic material, wherein at least a portion of the terminals of the electronic component can pass through the tray support member when the electronic component is seated on the tray support member A test handler in which an open hole is formed may be provided.

In addition, the buffer support member, when the electronic component falls toward the tray support member or when a predetermined pressure is applied to the electronic component seated on the tray support member, the impact applied to the tray support member and the electronic component A test handler may be provided that is closely attached to the bottom surface of the tray support member to absorb , and supports the electronic component exposed through the open hole.

In addition, the loading device moving step of moving onto the receiving portion of the tray frame while holding the electronic component; a lifting step of raising the opening unit body so that the buffer support member supported on the opening unit body is in close contact with the bottom surface of the tray support member supported on the lower side of the tray frame; a grip release step in which the loading device releases the grip of the electronic component so that the electronic component falls toward the accommodating part; When the electronic component falls toward the tray support member, the shock absorbing step in which the buffer support member supports the electronic component exposed through the open hole formed in the tray support member to absorb the impact applied to the electronic component ; and a lowering step of lowering the opening unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member, and in the lowering step, when the open unit body descends, at least one of a plurality of terminals of the electronic component A test handler control method may be provided, in which a part is inserted into the open hole.

In addition, the moving step of the unloading device moving on the receiving portion in order to grip the electronic components in the receiving portion of the tray frame; a lifting step of raising the opening unit body so that the buffer support member supported on the opening unit body is in close contact with the bottom surface of the tray support member supported on the lower side of the tray frame; a holding step of the unloading device holding the electronic component supported by the tray support member; When a predetermined pressure is applied to the electronic component in the gripping step, the shock absorption support member supports the electronic component exposed through an open hole formed in the tray support member to absorb the impact applied to the electronic component. step; and a lowering step of lowering the open unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member, and in the raising step, when the open unit body rises, at least some of the terminals of the electronic component are A test handler control method may be provided, which rises while being inserted into the open hole.

In addition, the method further includes an opening step of opening the holding unit so that the electronic component can be supported on the tray support member or separated from the tray support member, wherein the lifting step includes the opening unit body to press the holding unit. A test handler control method for raising the open unit body to a predetermined position may be provided.

According to embodiments of the present invention, there is an effect of minimizing the impact applied to the electronic component during the transferring process and the testing process for testing the electronic component, and preventing the terminal of the electronic component from being damaged.

1 is a perspective view conceptually illustrating a test handler according to an embodiment of the present invention.
2 is a perspective view of a table according to a first embodiment of the present invention;
FIG. 3 is a cross-sectional view taken along line A-A' of FIG. 2 .
4 is a cross-sectional view taken along line A-A' of the table according to the second embodiment of the present invention.
5 is a perspective view of a table according to a third embodiment of the present invention;
6 is a cross-sectional view taken along line B-B' of FIG. 5 .
7 is a cross-sectional view taken along line B-B' of the table according to the fourth embodiment of the present invention.
8 is a perspective view of a table according to a fifth embodiment of the present invention.
9 is an exploded perspective view of the table of FIG.
10 is a bottom perspective view of the pocket frame of FIG.
11 is a perspective view of a table according to a sixth embodiment of the present invention.
12 is an exploded perspective view of the table of FIG. 11 ;
13 is a bottom perspective view and a partially enlarged view of the pocket frame of FIG. 12 .
14 is an enlarged view of C of FIG. 12 .
Fig. 15 is a perspective view of the support member of Fig. 12;
16 is a perspective view conceptually illustrating a test handler according to a seventh embodiment of the present invention.
17 is a perspective view of the test tray and opening unit of FIG. 16 ;
18 is an enlarged perspective view of a part of the test tray and the opening unit of FIG. 16 .
19 is a cross-sectional view taken along line D-D' of FIG. 18 .
20 is a cross-sectional view illustrating a state in which the holding unit is placed in a released state in FIG. 18 .
21 is a longitudinal cross-sectional view of a test tray and an opening unit according to an eighth embodiment of the present invention.
22 is a view showing a state in which the opening unit of FIG. 21 is raised and the holding unit is placed in the released state.
23 is an enlarged view of part E of FIG. 22 .
24 is a view showing a state in which the opening unit of FIG. 22 is lowered and the holding unit is placed in the escape prevention state.
FIG. 25 is an enlarged view of F of FIG. 24 .
26 is a flowchart sequentially illustrating a test handler control method according to an eighth embodiment of the present invention.

Hereinafter, specific embodiments for implementing the spirit of the present invention will be described in detail with reference to the drawings.

In addition, in the description of the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

In addition, when it is said that a component is 'connected', 'supported', or 'coupled' to another component, it may be directly connected, supported, or coupled to the other component, but it is understood that other components may exist in the middle. it should be

The terminology used herein is only used to describe specific embodiments and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise.

Also, terms including an ordinal number such as 1st, 2nd, etc. may be used to describe various components, but the components are not limited by these terms. These terms are used only for the purpose of distinguishing one component from another.

The meaning of "comprising," as used herein, specifies a particular characteristic, region, integer, step, operation, element and/or component, and other specific characteristic, region, integer, step, operation, element, component, and/or group. It does not exclude the existence or addition of

In addition, in this specification, the expression of the upper part, the upper surface, etc. is described with reference to the drawings in the drawings, and it is clarified in advance that it may be expressed differently if the direction of the corresponding object is changed.

Hereinafter, a detailed configuration of the test handler 1 according to an embodiment of the present invention will be described with reference to the drawings.

Hereinafter, referring to FIG. 1 , a test handler 1 according to an embodiment of the present invention tests electronic components manufactured through a manufacturing process, classifies them by grade according to the test results, and places them on customer trays T1 and T2. can be loaded Also, the test handler 1 may be detachably coupled to a tester (not shown). The test handler 1 may include a loading device 10 , a test tray 20 , a chamber 30 , an unloading device 40 , a stacker module 50 , and a control unit 60 .

The loading device 10 may load the electronic components loaded on the first customer tray T1 into the test tray 20 . Here, the electronic component placed on the first customer tray T1 is an electronic component before being tested. A detailed configuration of the loading device 10 will be described later.

The test tray 20 has a space in which the electronic component to be tested can be seated, and can circulate along a predetermined path to test the electronic component. Also, in the test tray 20 , an electronic component for which a test has been completed may be seated.

The chamber 30 may include a soak chamber 31 , a test chamber 32 , and a de-soak chamber 33 .

The soak chamber 31 may preheat or precool the electronic components loaded on the test tray 20 transferred from the loading position LP according to test conditions.

The test chamber 32 may provide a space in which an electronic component transferred to the inside of the test chamber 32 after being preheated or precooled in the soak chamber 31 is tested.

The dissoak chamber 33 may be heated or cooled inside the test chamber 32 to assimilate the electronic component that has been tested to a temperature required for unloading.

The unloading device 40 may classify the electronic components loaded on the test tray 20 transferred from the desoak chamber 33 by test grade and unload them into the second customer tray T2 . Here, the electronic component placed on the second customer tray T2 is an electronic component that has been tested.

The stacker module 50 may store the first customer tray T1 and the second customer tray T2 on which electronic components are loaded.

The controller 60 may control driving of the loading device 10 and the unloading device 40 . The control unit 60 may be implemented by an arithmetic device including a microprocessor, a measuring device such as a sensor, and a memory, and the implementation method is obvious to those skilled in the art, so a further detailed description will be omitted.

On the other hand, in the present specification, the first customer tray (T1) and the second customer tray (T2) have been described separately as loading the electronic components before and after being tested, but this is only an example to help the understanding of the specification, In the process, the first customer tray T1 and the second customer tray T2 may be mixed during the loading and unloading process, and may have the same shape and structure.

Hereinafter, a detailed configuration of the loading device 10 according to the first embodiment of the present invention will be described with reference to FIGS. 2 and 3 . The loading device 10 may include a table 100 and a hand 200 .

The table 100 shows a plurality of electronic components loaded on the first customer tray T1 before being loaded onto the test tray 20 or a plurality of electronic components loaded on the test tray 20 on the second customer tray T2. It can provide a space for temporary seating before being loaded into the furnace. The table 100 may be disposed between the customer trays T1 and T2 and the test tray 20 . In addition, the table 100 may include a pocket frame 110 and a shock absorbing member 120 .

The pocket frame 110 may provide a space in which the electronic component is seated. A seating portion 111 and a wall portion 112 may be formed in the pocket frame 110 , and a pocket space P that is a space in which an electronic component is mounted may be formed.

A shock absorbing member 120 on which an electronic component can be mounted is disposed on the seating part 111 . The seating portion 111 may be formed on one surface of the pocket frame 110 . Also, a pocket opening hole 111a penetrating through the pocket frame 110 may be formed in the seating portion 111 .

The wall part 112 may guide the movement of the electronic component so that the electronic component descending toward the shock absorbing member 120 can be seated on the shock absorbing member 120 . A plurality of such wall portions 112 may be provided, and the plurality of wall portions 112 may protrude upward to surround the shock absorbing member 120 . Also, the plurality of wall portions 112 may have a predetermined inclination toward the shock absorbing member 120 .

The pocket space P may be a space in which electronic components are disposed inside the pocket frame 110 , and may mean a space surrounded by the plurality of wall parts 112 and the shock absorbing member 120 . A plurality of such pocket spaces P may be formed, and a plurality of electronic components may be disposed in the plurality of pocket spaces P.

The shock absorbing member 120 may provide a portion where the electronic component is seated when the electronic component is disposed in the pocket space (P). In addition, the shock absorbing member 120 may be provided to absorb the shock applied to the electronic component. For example, the shock absorbing member 120 may absorb a shock applied to the electronic component when the electronic component falls toward the shock absorbing member 120 . The shock absorbing member 120 may include a material having an elastic material advantageous for shock absorption, and may include, for example, silicon (Si). A plurality of such shock absorbing members 120 may be provided, and the plurality of shock absorbing members 120 may be disposed in a plurality of pocket spaces (P).

In addition, the shock absorbing member 120 may include a material having excellent lubricity. For example, since the upper surface of the shock absorbing member 120 is provided with a material having excellent lubricity, that is, a material having low frictional resistance, frictional force between the shock absorbing member 120 and the electronic component may be minimized. As such, since the upper surface of the shock absorbing member 120 contains a material having low frictional resistance, when the electronic component is seated on the shock absorbing member 120 , the electronic component slides away from the shock absorbing member 120 or there is a problem in seating failure. can be prevented from occurring. As another example, the surface of the shock absorbing member 120 may be formed of a flat surface without irregularities in order to prevent an electronic component from being improperly seated.

The shock absorbing member 120 is disposed on the seating part 111 and may be fixedly supported by the seating part 111 . For example, the shock absorbing member 120 may be adhered to the upper surface of the seating part 111 through an adhesive (not shown). In addition, the shock absorbing member 120 may have a predetermined thickness, and the shock absorbing member 120 has a buffered opening penetrating the shock absorbing member 120 along the thickness direction (eg, the vertical direction in FIG. 3 ). A hole 120a may be formed. The buffer opening hole 120a may be formed in the shock absorbing member 120 to correspond to the pocket opening hole 111a. Accordingly, the pocket opening hole 111a and the buffer opening hole 120a may communicate with each other. In addition, when the electronic component is seated on the shock absorbing member 120 , the buffer opening hole 120a is formed with an air layer between the electronic component and the shock absorbing member 120 so that the electronic component is spaced apart from the shock absorbing member 120 . can prevent

The hand 200 may grip a plurality of electronic components seated on the customer tray T1 , and may transfer them to the table 100 , and may be seated on the shock absorbing member 120 . In addition, the hand 200 may grip a plurality of electronic components seated on the table 100 and transfer them to the test tray 20 . In addition, the hand 200 may be dropped by releasing the electronic component from the upper side of the shock absorbing member 120 .

For example, the hand 200 may hold the electronic component through a predetermined vacuum pressure. Meanwhile, when the hand 200 grips the electronic component, an impact may be applied to the electronic component by the pressure applied by the hand 200 , but the impact may be minimized by the shock absorbing member 120 . In other words, when the hand 200 grips the electronic component, the impact applied to the electronic component may be absorbed by the shock-absorbing member 120 by the elastic force of the shock-absorbing member 120 . As such, the impact applied to the electronic component by the shock absorbing member 120 has an effect of being minimized.

As another example, since the rigidity of the seating part 111 is greater than the rigidity of the electronic component, when the hand 200 seats the electronic component in the pocket space P, the electronic component falls directly onto the seating part 111 . When it is seated, an impact may be applied to the electronic component. However, when the hand 200 releases the grip of the electronic component, the electronic component is seated on the shock absorbing member 120 having elastic force, so that the impact applied to the electronic component can be minimized. In addition, since the upper surface of the shock absorbing member 120 includes a material having a low frictional resistance, even if the electronic component is seated on the upper surface of the shock absorbing member 120 , it is seated in a fixed position without departing from the shock absorbing member 120 . can have an effect.

Meanwhile, the hand 200 may also be provided in the unloading device 40 , and the hand 200 provided in the unloading device 40 transfers the electronic components seated on the test tray 20 to the second customer tray T2 . ) can be transferred to In addition, the hand 200 provided in the loading device 10 may be referred to as a first hand 200 , and the hand 200 provided in the unloading apparatus 40 may be referred to as a second hand 200 . can

Meanwhile, in addition to this configuration, according to the second embodiment of the present invention, the shock absorbing member 120 may include a first shock absorbing member 121 and a second shock absorbing member 122 . Hereinafter, a second embodiment of the present invention will be described with further reference to FIG. 4 . In the description of the second embodiment, differences in comparison with the above-described embodiment will be mainly described, and the same description and reference numerals refer to the above-described embodiment.

Referring to FIG. 4 , the shock absorbing member 120 may include a first shock absorbing member 121 and a second shock absorbing member 122 , and the buffer opening hole 120a is the first buffer opening hole 121a . ) and may include a second buffer opening hole (122a).

The first shock absorbing member 121 may be disposed on the seating portion 111 and may be formed of an elastic material. The first shock absorbing member 121 may have a higher elastic force than the second shock absorbing member 122 . In addition, a first buffer opening hole 121a formed in the first shock absorbing member 121 to correspond to the pocket opening hole 111a may be formed in the first shock absorbing member 121 .

The second shock absorbing member 122 may be disposed on the first shock absorbing member 121 and may provide a portion on which the electronic component is mounted. In addition, the second shock absorbing member 122 may be formed with a second buffer opening hole 122a penetrating the second shock absorbing member 122 along the thickness direction (eg, the vertical direction in FIG. 4 ). . The second shock absorbing member 122 may have a predetermined elastic force and may have a smaller frictional resistance than that of the first shock absorbing member 121 . For example, the second shock absorbing member 122 may include engineering plastic having high lubricity due to low frictional resistance. As a more detailed example, the second shock absorbing member 122 may include at least one of nylon, polyphenylene oxide (mPPO), polycarbonate (PC), polyacetyl (Acetal), and polybutylene terephthalate (PBT). may include

As such, since the second shock-absorbing member 122 has a small frictional resistance, when the electronic component is seated on the second shock-absorbing member 122 , the electronic component does not separate from the second shock-absorbing member 122 . There is an effect of being seated on the second shock absorbing member 122 .

In addition, since the second shock absorbing member 122 and the first shock absorbing member 121 have elastic force, when the electronic component is seated on the second shock absorbing member 122 , the The impact between the second shock absorbing member 122 and the electronic component is absorbed by the first shock absorbing member 121 due to elasticity.

Accordingly, when the electronic component is seated on the second shock absorbing member 122 , the impact applied to the electronic component can be minimized.

Meanwhile, in addition to this configuration, according to the third embodiment of the present invention, the wall portion 112 may be disposed to be spaced apart from the shock absorbing member 120 . Hereinafter, a third embodiment of the present invention will be described with further reference to FIGS. 5 and 6 . In the description of the third embodiment, the difference compared with the above-described embodiment will be mainly described, and the same description and reference numerals refer to the above-described embodiment.

5 and 6 , the table 100 may include a pocket frame 110 and a shock absorbing member 120 .

A pocket opening hole 111a penetrating the pocket space P may be formed in the pocket frame 110 .

A plurality of wall portions 112 may be provided, and the plurality of wall portions 112 may protrude from the pocket frame 110 to surround the shock absorbing member 120 .

Also, the plurality of wall portions 112 may be disposed to be horizontally spaced apart from the shock absorbing member 120 . In other words, the plurality of wall portions 112 may be disposed to be spaced apart by a predetermined distance from one surface of the shock absorbing member 120 facing the wall portion 112 . As such, the plurality of wall portions 112 are spaced apart from the shock absorbing member 120 to provide a space S between the wall portion 112 and the shock absorbing member 120 .

A terminal portion of the electronic component may be disposed in the separation space (S). For example, a plurality of terminals may be disposed on the edge of the electronic component. Also, when the electronic component is seated on the shock absorbing member 120 , the edge of the electronic component may not be seated on the shock absorbing member 120 and may be disposed in the separation space S. In this case, since the terminal of the electronic component does not come into contact with the shock absorbing member 120 , it may be protected from an impact generated by the contact with the shock absorbing member 120 .

In addition, the shock absorbing member 120 may have a buffer opening hole 120a penetrating through the shock absorbing member 120 to correspond to the pocket opening hole 111a.

Meanwhile, the terminals of the electronic component may be formed intensively on the edge of the electronic component as well as when formed over the entire surface of the electronic component. When such an electronic component is bent to have a predetermined curvature, the load is relieved at the center and the load is intensively applied to the terminal at the edge. However, according to the third embodiment of the present invention, the separation space S is formed between the wall portion 112 and the shock absorbing member 120 so that the terminal formed at the edge of the electronic component can be placed in the separation space S. have. For this reason, there is an effect that the terminal formed on the edge of the electronic component can be protected from the impact generated by the contact with the shock absorbing member 120 .

Meanwhile, in addition to this configuration, according to the fourth embodiment of the present invention, the wall portion 112 may be disposed to be spaced apart from the first shock absorbing member 121 and the second shock absorbing member 122 . Hereinafter, a third embodiment of the present invention will be described with further reference to FIG. 7 . In the description of the third embodiment, the difference compared with the above-described embodiment will be mainly described, and the same description and reference numerals refer to the above-described embodiment.

Referring to FIG. 7 , the table 100 may include a pocket frame 110 and a shock absorbing member 120 .

The shock absorbing member 120 may include a first shock absorbing member 121 and a second shock absorbing member 122 , and the buffer opening hole 120a is a first buffer opening hole 121a and a second buffer opening opening. It may include a hole 122a.

The first shock absorbing member 121 may be disposed on the seating portion 111 and may be formed of an elastic material. The first shock absorbing member 121 may have a higher elastic force than the second shock absorbing member 122 . In addition, a first buffer opening hole 121a formed in the first shock absorbing member 121 to correspond to the pocket opening hole 111a may be formed in the first shock absorbing member 121 .

The second shock absorbing member 122 may be disposed on the first shock absorbing member 121 and may be fixedly supported by the first shock absorbing member 121 . For example, the second shock absorbing member 122 may be adhered to the upper surface of the first shock absorbing member 121 through an adhesive (not shown). The second shock absorbing member 122 may have a predetermined thickness, and the second shock absorbing member 122 has the second shock absorbing member 122 along the thickness direction (eg, the vertical direction in FIG. 7 ). A second buffer opening hole 122a passing through may be formed.

The second buffer opening hole 122a may be formed in the second shock absorbing member 122 to correspond to the first buffer opening hole 121a. Accordingly, the second buffer opening hole 122a and the first buffer opening hole 121a may communicate with each other. In addition, in the second buffer opening hole 122a, when the electronic component is seated on the second shock absorbing member 122, an air layer is formed between the electronic component and the second shock absorbing member 122, so that the electronic component is subjected to the second impact It is possible to prevent separation from the absorbent member 122 .

A plurality of wall parts 112 may be provided, and the plurality of wall parts 112 may protrude from the pocket frame 110 to surround the shock absorbing member 120 and the second shock absorbing member 122 .

Also, the plurality of wall portions 112 may be disposed to be horizontally spaced apart from the shock absorbing member 120 . In other words, the plurality of wall portions 112 may be disposed to be spaced apart by a predetermined distance from one surface of the shock absorbing member 120 facing the wall portion 112 . In this way, the plurality of wall parts 112 are spaced apart from the first shock absorbing member 121 and the second shock absorbing member 122, so that the wall 112 and the first shock absorbing member 121 and the second shock absorbing member ( A separation space (S) may be formed between the 122).

A terminal portion of the electronic component may be disposed in the separation space (S). For example, a plurality of terminals may be disposed on the edge of the electronic component. Also, when the electronic component is seated on the second shock absorbing member 122 , the edge of the electronic component may be disposed in the separation space S without being seated on the second shock absorbing member 122 . In this case, since the terminal of the electronic component does not come into contact with the second shock absorbing member 122 , it may be protected from an impact generated by the contact with the second shock absorbing member 122 .

As such, by forming the separation space S, the terminal of the electronic component has an effect that can be protected from the impact generated by the contact with the second shock absorbing member 122 .

In addition, when the electronic component is seated on the second shock-absorbing member 122 , an impact between the second shock-absorbing member 122 and the electronic component is generated by the elasticity of the first shock-absorbing member 121 . (121) has the effect of being absorbed.

Accordingly, when the electronic component is seated on the second shock absorbing member 122 , the impact applied to the electronic component can be minimized.

Meanwhile, in addition to this configuration, according to the fifth embodiment of the present invention, the table 100 may further include a body 140 . Hereinafter, a fifth embodiment of the present invention will be described with further reference to FIGS. 8 to 10 . In the description of the fifth embodiment, the differences compared with the above-described embodiment will be mainly described, and the same description and reference numerals refer to the above-described embodiment.

Referring to FIG. 8 , the table 100 may provide a space in which a plurality of electronic components loaded on the customer tray T1 are temporarily seated before being loaded onto the test tray 20 . The table 100 may include a pocket frame 110 , a buffer member 120 , and a body 140 .

Referring to FIG. 9 , the pocket frame 110 may provide a space in which an electronic component is mounted. In addition, the pocket frame 110 is detachably coupled to the body 140 . A plurality of such pocket frames 110 may be provided, and the plurality of pocket frames 110 may be supported by the body unit 140 . In addition, a plurality of pocket spaces (P) may be formed in the plurality of pocket frames (110). A wall portion 112 , a pocket groove portion 113 , and a correction hole 114 may be formed in the pocket frame 110 .

A plurality of wall portions 112 may be provided, and the plurality of wall portions 112 may protrude from the pocket frame 110 to surround the buffer member 120 . In addition, the plurality of wall portions 112 may form a pocket space P that is a space in which electronic components are disposed inside the pocket space P together with the cushioning member 120 . A plurality of such pocket spaces P may be formed.

Referring to FIG. 10 , the pocket groove 113 may provide a portion in which a portion of the cushioning member 120 is accommodated. The pocket groove portion 113 may be formed to be drawn in from the pocket frame 110 , and may prevent the buffer member 120 accommodated in the pocket groove portion 113 from being separated from the pocket frame 110 .

The calibration hole 114 may be engaged with the calibration pin 143 of the body portion 140 so that when the pocket frame 110 and the body portion 140 are coupled, the positions of each other are corrected. For example, the position of the pocket frame 110 and the body portion 140 with respect to each other may be corrected by inserting the correction pin 143 into the correction hole 114 . The correction hole 114 may be formed in plurality.

The buffer member 120 may provide a portion on which the electronic component is seated when the electronic component is disposed in the pocket space (P). In addition, the buffer member 120 may be provided to absorb an impact applied to the electronic component. For example, the buffer member 120 may have a pad shape extending in one direction and may include silicon (Si). A plurality of buffer members 120 may be provided, and the plurality of buffer members 120 may be supported by the body 140 .

In addition, the buffer member 120 may be interposed between the pocket frame 110 and the body portion 140 when the pocket frame 110 and the body portion 140 are coupled. For example, a portion of the buffer member 120 may be accommodated in a body groove portion 141 to be described later of the body portion 140 , and another portion of the buffer member 120 is a pocket groove portion 113 of the pocket frame 110 . ) can be accepted. As such, the buffer member 120 is inserted into the pocket groove portion 113 and the body groove portion 141 , so that it can be fixedly supported at a predetermined position without departing from the pocket frame 110 and the body portion 140 .

Meanwhile, the buffer member 120 is disposed on the body groove portion 141 and may be fixedly supported by the body portion 140 . For example, the buffer member 120 may be adhered to the upper surface of the body groove portion 141 through an adhesive (not shown). In addition, the buffer member 120 may have a predetermined thickness, and the buffer opening hole 120a passing through the buffer member 120 may be formed in the buffer member 120 along the thickness direction. The buffer opening hole 120a may be formed at a position corresponding to the body opening hole 142 to be described later. Accordingly, the buffer opening hole 120a and the body opening hole 142 may communicate with each other. In addition, when the electronic component is seated on the buffer member 120 by the buffer opening hole 120a, an air layer is formed between the electronic component and the buffer member 120 to prevent the electronic component from being spaced apart from the buffer member 120 can be

Referring back to FIG. 9 , the body 140 may support a plurality of pocket frames 110 , and may support a plurality of buffer members 120 . The body part 140 may have a body groove part 141 , a body opening hole 142 , and a correction pin 143 .

The body groove portion 141 may support the buffer member 120 , and may provide a portion in which a portion of the buffer member 120 is accommodated. In other words, a portion of the cushioning member 120 is accommodated in the body groove 141? At this time, the body groove portion 141 may be fixedly support the buffer member 120 .

The body opening hole 142 may be formed through the body portion 140 and may be formed in the body groove portion 141 . The body opening hole 142 may communicate with the buffer opening hole 120a.

When the correction pin 143 is coupled to the pocket frame 110 and the body portion 140, the position of the correction pin 143 may be engaged with the correction hole 114 so that the positions of each other are corrected. For example, the correction pin 143 may be formed to protrude from the body portion 140 so as to be inserted into the correction hole 114 . These correction pins 143 may be provided in plurality, and may be engaged with a plurality of correction holes 114 formed in a plurality of pocket frames 110 .

As such, by engaging the correction pin 143 and the correction hole 114, the relative positions of the pocket frame 110 and the body portion 140 are corrected, and thus, there is an effect that can be coupled to each other.

In addition, since the buffer member 120 is fitted into the pocket groove portion 113 and the body groove portion 141 , it may be fixedly supported without being separated from the pocket frame 110 or the body portion 140 , and the electronic component may be seated therein. In this case, there is an effect that can more stably absorb the impact applied to the electronic component.

In addition, since the body portion 140 and the pocket frame 110 are provided separately, when the cushioning member 120 is installed on the body portion 140, there is an effect that can be installed more easily and quickly.

Meanwhile, in addition to this configuration, according to the sixth embodiment of the present invention, the table 100 may further include a support member 150 . Hereinafter, a sixth embodiment of the present invention will be described with further reference to FIGS. 11 to 15 . In the description of the sixth embodiment, the difference compared with the above-described embodiment will be mainly described, and the same description and reference numerals refer to the above-described embodiment.

11 and 12 , the table 100 may include a pocket frame 110 , a body 140 , and a support member 150 .

A wall portion 112 , a pocket groove portion 113 , a correction hole 114 , and a fixing pin 115 may be formed in the pocket frame 110 .

Referring to FIG. 13 , the pocket groove 113 may provide a portion into which at least a portion of the support member 150 and the protrusion 144 to be described later is inserted. The pocket groove portion 113 may be formed to be drawn in from the pocket frame 110 , and may prevent the support member 150 inserted into the pocket groove portion 113 from being separated from the pocket frame 110 .

The fixing pin 115 may fix the support member 150 to the protrusion 144 of the body 140 . This fixing pin 115 may be inserted through a support fixing hole 153 to be described later, and may be engaged with a body fixing hole 145 to be described later. For example, when the pocket frame 110 , the support member 150 , and the body portion 140 are sequentially disposed, the fixing pins 115 are sequentially disposed in the support fixing hole 153 and the body fixing hole 145 . By being inserted, the support member 150 may be fixed to the protrusion 144 . A plurality of such fixing pins 115 may be provided, and the plurality of fixing pins 115 may be formed to protrude from the pocket frame 110 .

12 and 14 , a body opening hole 142 , a correction pin 143 , a protrusion 144 , and a body fixing hole 145 may be formed in the body portion 140 .

The protrusion 144 may support the support member 150 and may provide a portion on which the support member 150 is seated. The protrusion 144 may be formed to protrude from the body 140 at a predetermined height. In addition, the protrusion 144 may be fitted into the pocket groove 113 together with the support member 150 .

The body fixing hole 145 may be engaged with the fixing pin 115 to fix the support member 150 . For example, the body fixing hole 145 may be formed to penetrate the body 140 so that the fixing pin 115 can be inserted thereinto. In addition, a plurality of body fixing holes 145 may be formed, and the plurality of body fixing holes 145 may be formed in the protrusion 144 . The fixing pin 115 and the body fixing hole 145 in the above may be referred to as a first fixing element 115 and a second fixing element 145, respectively, and the first fixing element 115 has a hole shape. , the second fixing element 145 may be modified to have a pin shape. Accordingly, any one of the first fixing element 115 and the second fixing element 145 is engaged with the other one of the first fixing element 115 and the second fixing element 145 in the support fixing hole 153 . It may be provided to fix the support member 150 to the body 140 .

Referring to FIG. 15 , the support member 150 may be provided to support the electronic component. The support member 150 may be provided as, for example, a thin film for supporting an electronic component. In addition, the support member 150 may be supported by the protrusion 144 , and may be seated on an upper surface of the protrusion 144 .

The support member 150 may be interposed between the pocket frame 110 and the body 140 when the pocket frame 110 and the body 140 are coupled. For example, the support member 150 may be supported by the pocket frame 110 by being inserted into the pocket groove portion 113 . A first opening hole 151 , a second opening hole 152 , and a support fixing hole 153 may be formed in the support member 150 .

When the electronic component is supported by the support member 150 , the first open hole 151 may be configured such that some of the terminals of the electronic component pass through. For example, the terminal formed in the center of the electronic component may penetrate the first open hole 151 . The first opening hole 151 may pass through the support member 150 along the thickness direction of the support member 150 and be formed in the center of the support member 150 .

When the electronic component is supported by the support member 150 , the second opening hole 152 may be configured such that some of the terminals of the electronic component pass through. For example, the terminal formed on the edge of the electronic component may pass through the second opening hole 152 . The second opening hole 152 is formed to surround the first opening hole 151 along the circumference of the first opening hole 151 , and passes through the support member 150 along the thickness direction of the support member 150 . can be formed by Also, a plurality of second opening holes 152 may be formed.

Meanwhile, the depth of the first open hole 151 and the second open hole 152 in the thickness direction of the support member 150 may be the same as the thickness t of the support member 150 . In addition, the first open hole 151 and the second open hole 152 may be formed in the support member 150 to be equal to or deeper than the terminal length of the electronic component.

The support fixing hole 153 may be formed through the support member 150 so that the fixing pin 115 may be inserted thereinto. The support fixing hole 153 may be formed at a position corresponding to the body fixing hole 145 . Accordingly, the fixing pin 115 inserted into the support fixing hole 153 may be inserted into the body fixing hole 145 , and the support member 150 may be fixedly supported by the protrusion 144 .

As such, since the first open hole 151 and the second open hole 152 are formed in the support member 150 , various types of electronic components can be seated on the support member 150 regardless of the number of terminals. have.

In addition, the support member 150 is inserted into the fixing pin 115 , it is fitted into the pocket groove portion 113 , so that it does not separate from the protrusion portion 144 .

Meanwhile, in addition to this configuration, according to the seventh embodiment of the present invention, the loading device 10 may further include an opening unit 300 . Hereinafter, a seventh embodiment of the present invention will be described with further reference to FIGS. 11 to 15 . In the description of the seventh embodiment, the differences compared with the above-described embodiment will be mainly described, and the same description and reference numerals refer to the above-described embodiment.

16 and 17 , the loading device 10 may further include an opening unit 300 .

The opening unit 300 may convert the holding unit 22 to be described later of the test tray 20 into a release state or a separation prevention state. The opening unit 300 may move away from or approaching the test tray 20 for loading the electronic component. In addition, the opening unit 300 may include a driving device (not shown) such as a hydraulic piston for this movement. However, in the present specification, although it is indicated that the opening unit 300 approaches or moves away from the test tray 20 , this is only an example, and it is also possible for the test tray 20 to approach or move away from the opening unit 300 toward the opening unit 300 . . The opening unit 300 may include an opening unit body 310 , a support 320 , and an elastic unit 330 .

The opening unit body 310 may support the support 320 and open the holding unit 22 of the test tray 20 . A recess 311 , an opening protrusion 312 , a positioning protrusion 313 , and an adhesion preventing protrusion 314 may be formed in the open unit body 310 .

The recess 311 may be formed on one side of the open unit body 310 , and this one side may be a surface of the test tray 20 . The support 320 may be accommodated in the recess 311 , and a groove 311a in which the elastic unit 330 may be accommodated may be provided.

The opening protrusion 312 may operate the holding unit 22 . The opening unit 300 may be provided adjacent to the recess 311 , and may be formed to protrude toward the test tray 20 . In addition, the opening protrusion 312 may be formed on the opening unit body 310 to correspond to the holding unit 22 .

The positioning protrusion 313 may guide the relative movement between the test tray 20 and the opening unit 300 so that the opening protrusion 312 may act on the holding unit 22 . In other words, the opening protrusion 312 can be guided to the holding unit 22 with higher accuracy by the positioning protrusion 313 .

The adhesion preventing protrusion 314 may prevent the opening unit 300 from excessively adhering to the test tray 20 when the opening unit 300 approaches the test tray 20 . Accordingly, even when the opening protrusion 312 operates the holding unit 22 , it is possible to maintain a predetermined distance between the opening unit 300 and the test tray 20 .

Referring to FIG. 18 , the support 320 may be supported by the open unit body 310 so as to move forward and backward along a direction away from the open unit body 310 . For example, the support 320 may move in a direction away from the open unit body 310 within the recess 311 of the open unit body 310 , and may move in a direction closer to the open unit body 310 . can move The support 320 may support the electronic component accommodated in the test tray 20 in the released state. The support 320 may include a support body 321 and a buffer support member 322 .

The support body 321 may support the elastic unit 330 . For this, the elastic member groove 321a may be formed in the support body 321 .

The buffer support member 322 may provide a portion on which an electronic component disposed in the receiving portion 21a, which will be described later, is seated. The buffer support member 322 may be inserted into the receiving portion 21a in the released state of the holder 22a, and the electronic component may be supported by the buffer support member 322 . The area in which the buffer support member 322 contacts the electronic component may be formed to be wider than the area in which the tray support part 21b, which will be described later, contacts the electronic component, and the buffer support member 322 is the tray support part 21b in the released state. ) can be located between In addition, the upper surface of the buffer support member 322 may be located above the upper end of the tray support portion 21b when the buffer support member 322 is disposed inside the receiving portion 21a.

The buffer support member 322 may be provided to absorb an impact applied to the electronic component. For example, when the hand 200 holds the electronic component on the accommodating part 21a, the cushioning support member 322 provides an impact applied to the electronic component when the electronic component is seated on the cushioning support member 322. can be absorbed As another example, the buffer support member 322 can absorb the shock applied to the electronic component when a predetermined pressure is applied to the electronic component when the hand 200 holds the electronic component disposed in the receiving portion 21a. have. The buffer support member 322 may include a material having an elastic material advantageous for shock absorption, and may include silicon (Si) as an example.

The buffer support member 322 may be disposed on the upper surface of the support body 321 , and may be fixedly supported by the support body 321 . For example, the buffer support member 322 may be adhered to the upper surface of the support body 321 through an adhesive (not shown). In addition, the buffer support hole 322a passing through the buffer support member 322 may be formed in the buffer support member 322 in the thickness direction (eg, the vertical direction in FIG. 19 ). The buffer support hole 322a may communicate with a hole formed in the support body 321 . In addition, the buffer support hole (322a), when the electronic component is seated on the buffer support member 322, an air layer is formed between the electronic component and the buffer support member 322, the electronic component is spaced apart from the buffer support member (322) can prevent

Referring to FIG. 19 , the elastic unit 330 may press the support 320 toward the test tray 20 . The elastic unit 330 may include an elastic member 331 and a separation preventing unit 332 .

The elastic member 331 may press the support 320 toward the test tray 20 . E.g. The elastic member 331 may be interposed between the support body 321 and the opening unit body 310 . One end of the elastic member 331 may be accommodated in the elastic member groove 321a provided in the lower portion of the support body 321 , and the other end may be accommodated in the recess 311 of the open unit body 310 . This elastic unit 330 is pressed by the test tray 20 and moves in a direction closer to the opening unit body 310 in a direction away from the opening unit body 310 by restoring force when the pressure is released from the support 320 . can be moved to In addition, while the test tray 20 moves a predetermined distance in a direction away from the opening unit 300 , the support 320 is pressed toward the test tray 20 by the elastic member 331 to be in close contact with the test tray 20 . In this case, the support 320 may support the electronic component in the accommodating part 21a.

It is possible to prevent the separation preventing part 332 from completely separating the support 320 from the open unit body 310 . One end of the separation preventing part 332 may be fixed to the open unit body 310 , and the support 320 may guide movement in a direction away from the open unit body 310 . In addition, the other end of the separation preventing part 332 may limit the movement of the support 320 when the support 320 is pressed by the elastic member 331 to move away from the open unit body 310 .

However, in the present specification, the elastic unit 330 has been described as being provided to press the support 320 toward the test tray 20 and prevent the support 320 from being separated from the open unit body 310, but this It is merely an example and the elastic unit 330 may be omitted. Accordingly, it is also possible for the support 320 to be fixedly supported on the open unit body 310 .

Hereinafter, the test tray 20 will be described in detail. The test tray 20 may accommodate electronic components, and the object accommodated in the test tray 20 may be prevented from being separated by a holding unit 22 to be described later. Electronic components may be loaded or unloaded on the test tray 20 . The test tray 20 may include a tray frame 21 and a holding unit 22 .

The tray frame 21 may be provided with an accommodating portion 21a in which an electronic component can be mounted. The receiving portion 21a may be configured in the form of a through hole, and the through hole may be formed to become narrower toward one side. For example, the receiving portion 21a may be formed to become narrower toward the opening unit 300 side. One side of the accommodating part 21a may serve as an entrance for moving electronic components. On the other hand, the tray frame 21 may be formed with a tray support (21b). The tray support portion 21b may be a protrusion protruding from the receiving portion 21a. In addition, the tray support portion 21b may contact and support the electronic component seated on the accommodation portion 21a.

19 and 20 , the holding unit 22 may selectively hold the electronic component disposed in the accommodating part 21a. Accordingly, even when the test tray 20 is moved or rotated, the electronic component may be restrained without being separated from the test tray 20 . The holding unit 22 may be switched to any one of a release state and a departure prevention state by the opening unit 300 . Here, the release state means a state that allows the seating and detachment of the electronic component with respect to the receiving portion 21a by the opening unit 300, and the separation prevention state is for preventing the separation of the electronic component with respect to the receiving portion 21a. means state. The holding unit 22 may include a holder 22a and a holder spring 22b.

The holder 22a may selectively hold the electronic component accommodated in the accommodating part 21a. The holder 22a may be configured to pivot by being connected to, for example, a hinge. In other words, when no force is applied to the holder 22a, the holder 22a can rotate in the direction toward the tray support 21b about the pivot by the force applied by the holder spring 22b, and The part can be held by the holder 22a. In addition, if the electronic component is seated in the receiving unit 21a, one side of the electronic component may be supported by the holder 22a, and the other side of the electronic component may be supported by the tray supporting unit 21b.

The holder spring 22b may provide a restoring force to the holder 22a. Meanwhile, in the present specification, the holder spring 22b has been shown to be a torsion spring, but this is only an example, and other well-known springs may be used.

Hereinafter, the operation and effect of the test handler 1 according to the seventh embodiment of the present invention will be described.

The hand 200 may load a plurality of electronic components loaded on the customer trays T1 and T2 on the table 100 . The table 100 may transfer a plurality of electronic components toward the test tray 20 . In addition, the hand 200 may move the plurality of electronic components loaded on the table 100 to the upper side of the test tray 20 , and release the grip from the upper side of the test tray 20 .

The opening unit 300 may rise toward the test tray 20 so that the receiving portion 21a of the test tray 20 is in the released state. At this time, as the opening protrusion 312 of the opening unit 300 rotates the holder 22a, the receiving portion 21a may be in a released state. Also, when the opening unit 300 is in close contact with the test tray 20 , the buffer support member 322 may be disposed inside the receiving part 21a.

When the hand 200 releases the grip of the electronic component from the upper side of the accommodating part 21a, the electronic component may descend and be seated on the buffer support member 322 . In addition, when the opening unit 300 descends, the electronic component seated on the buffer support member 322 may be supported by the tray support portion 21b. At this time, the holder 22a may be in a separation prevention state by rotating to the original position by the holder spring 22b.

As such, when the hand 200 releases the grip of the electronic component from the upper side of the receiving portion 21a, the shock between the cushioning support member 322 and the electronic component is provided by the cushioning support member 322 having an elastic force. (322) can be absorbed. Accordingly, the impact applied to the electronic component is minimized.

In addition, since one end of the buffer support member 322 is disposed above the tray support portion 21b, when the electronic component descends, it can be seated on the buffer support member 322, and the impact applied to the electronic component can be minimized. have. Thereafter, when the buffer support member 322 descends, the electronic component seated on the buffer support member 322 is supported by the tray support unit 21b, and in this case, the electronic component may be supported by the tray support portion 21b without impact. Accordingly, there is an effect of preventing an impact applied to the electronic component.

Meanwhile, in addition to this configuration, according to the eighth embodiment of the present invention, the test tray 20 may include the tray support member 23 , in which the tray support part 21b is omitted. Hereinafter, an eighth embodiment of the present invention will be described with further reference to FIGS. 21 to 23 . In describing the eighth embodiment, the differences compared with the above-described embodiment will be mainly described, and the same description and reference numerals will refer to the above-described embodiment.

The tray support member 23 may support the electronic component 2 placed inside the accommodating part 21a. For example, the tray support member 23 may support between the plurality of terminals 2a of the electronic component. The tray support member 23 may be supported by the tray frame 21 from the lower side of the tray frame 21 . In addition, a plurality of open holes 23a through which terminals of electronic components may pass may be formed in the tray support member 23 . For example, when the electronic component is supported by the tray support member 23 , the plurality of terminals of the electronic component may be exposed downwardly through the plurality of open holes 23a.

The holding unit 22 may prevent the electronic component supported by the tray support member 23 from being separated from the tray support member 23 .

The buffer support member 322 may absorb the shock applied to the tray support member 23 and the electronic components supported by the tray support member 23 . For example, the buffer support member 322 may absorb the impact applied to the tray support member 23 when the electronic component falls toward the tray support member 23 or when a predetermined pressure is applied to the electronic component. That is, the buffer support member 322 is in close contact with the bottom surface of the tray support member 23 to absorb the impact applied to the tray support member (23). In addition, the buffer support member 322 may support the electronic component exposed through the open hole 23a to absorb the impact applied to the electronic component when the electronic component is seated on the tray support member 23 .

Hereinafter, a test handler control method S10 according to an eighth embodiment of the present invention will be described with reference to FIGS. 21 to 26 .

The test handler control method S10 may support testing of the electronic component by loading or unloading the electronic component into the test tray 20 . This test handler control method (S10) is a moving step (S100), a rising step (S200), an opening step (S300), a grip release step (S400), a gripping step (S500), a shock absorption step (S600) and a descending step ( S700) may be included.

In the moving step ( S100 ), the loading device 10 holding the electronic component may move onto the receiving part 21a of the test tray 20 on which the electronic component is not seated. In this case, the electronic component may be located above the accommodating part 21a. In addition, in the moving step ( S110 ), the unloading device 40 may move onto the receiving part 21a to hold the electronic component seated on the tray support member 23 of the test tray 20 , which has been tested.

Referring to FIG. 22 , in the lifting step S200 , the opening unit 300 may rise to access the test tray 20 . In addition, in the lifting step (S200), the opening unit body 310 may be raised so that the buffer support member 322 is in close contact with the bottom surface of the tray support member 23 . On the other hand, when the lifting step (S200) is performed while the electronic component is supported by the tray support member 23, the electronic component is not supported by the tray support member 23, but is raised while being supported by the buffer support member 322. can do.

In the opening step ( S300 ), the holding unit 22 may be opened so that the electronic component can be seated on the tray support member 23 . That is, the holding unit 22 can be placed in the unlocked state. For example, in the opening step ( S300 ), the opening protrusion 312 may press the holder 22a so that the holder 22a rotates.

In the grip release step S400 , the loading device 10 may release the electronic component so that the electronic component falls toward the receiving part 21a. This grip release step ( S400 ) may be performed when the electronic component is not supported by the tray support member 23 .

In the gripping step ( S500 ), the unloading device 40 may grip the electronic component supported by the tray support member 23 . This holding step (S500) may be performed when the electronic component is supported by the tray support member 23 .

Referring to FIG. 23 , in the shock absorbing step ( S500 ), when the electronic component falls toward the tray support member 23 , the shock applied to the electronic component may be absorbed. Further, in the shock absorption step (S500), when a predetermined pressure is applied to the electronic component supported by the tray support member 23, it is possible to absorb the impact applied to the electronic component. For example, in the shock absorption step ( S500 ), the shock applied to the electronic component is absorbed by the buffer support member 322 supporting the terminal of the electronic component exposed through the open hole 23a formed in the tray support member 23 . can do.

24 and 25 , in the lowering step S600 , the opening unit body 310 may be lowered so that the buffer support member 322 is spaced apart from the bottom surface of the tray support member 23 . In addition, if the lowering step S600 is performed after the grip release step S400, when the open unit body 310 is lowered, at least some of the plurality of terminals of the electronic component may be inserted into the open hole 23a. .

Although the embodiments of the present invention have been described as specific embodiments, these are merely examples, and the present invention is not limited thereto, and should be construed as having the widest scope according to the basic idea disclosed herein. A person skilled in the art may implement a pattern of a shape not indicated by combining/substituting the disclosed embodiments, but this also does not depart from the scope of the present invention. In addition, those skilled in the art can easily change or modify the disclosed embodiments based on the present specification, and it is clear that such changes or modifications also fall within the scope of the present invention.

1: test handler 10: loading device
20: test tray 30: chamber
31: soak chamber 32: test chamber
33: dissoak chamber 40: unloading device
50: stacker module 100: table

Claims (16)

a pocket frame having a plurality of pocket spaces to accommodate electronic components; and
and a plurality of shock absorbing members disposed in the plurality of pocket spaces to seat the electronic component,
The shock absorbing member is formed of an elastic material to absorb a shock applied to the electronic component when the electronic component falls toward the shock absorbing member so that the electronic component is seated on the shock absorbing member,
In the pocket frame, a plurality of wall portions are formed to protrude upward to surround the shock absorbing member,
test handler. The method of claim 1,
The shock absorbing member,
a first shock absorbing member, and
and a second shock absorbing member disposed above the first shock absorbing member,
The second shock-absorbing member has a surface friction coefficient smaller than that of the first shock-absorbing member,
The first shock absorbing member has a higher elastic force than the second shock absorbing member,
test handler. The method of claim 1,
A plurality of the wall parts are arranged to be spaced apart from each other by a predetermined distance in a horizontal direction from the shock absorbing member so as to provide a spaced space between the wall part and the shock absorbing member,
When the electronic component is seated on the shock absorbing member, a portion of the electronic component is disposed in the separation space,
A pocket opening hole passing through the pocket frame is formed in the pocket frame,
The shock absorbing member is formed with a buffer opening hole penetrating the shock absorbing member to correspond to the pocket opening hole,
test handler. 4. The method of claim 3,
The shock absorbing member,
a first shock absorbing member, and
and a second shock absorbing member disposed above the first shock absorbing member,
The buffer opening hole is
a first buffer opening hole formed in the first shock absorbing member to correspond to the pocket opening hole, and
Comprising a second buffer opening hole formed in the second shock absorbing member to correspond to the first buffer opening hole,
test handler. body part;
a pocket frame detachably coupled to the body and having a pocket space in which electronic components can be disposed; and
and a shock absorbing member interposed between the pocket frame and the body portion on which the electronic component can be seated,
The shock absorbing member is formed of an elastic material to absorb a shock applied to the electronic component when the electronic component falls toward the shock absorbing member so that the electronic component is seated on the shock absorbing member.
test handler. 6. The method of claim 5,
A pocket groove portion in which any part of the shock absorbing member can be accommodated is formed in the pocket frame,
A body groove portion in which another part of the shock absorbing member can be accommodated is formed in the body portion,
The shock absorbing member, one side is accommodated in the pocket groove portion, the other side is accommodated in the body groove portion is fixed and supported in the pocket frame and the body portion,
test handler. body part;
a pocket frame detachably coupled to the body and having a pocket space in which electronic components can be disposed; and
and a support member interposed between the pocket frame and the body portion on which the electronic component can be seated;
When the electronic component is seated on the support member, a first opening hole through which some of the terminals of the electronic component may pass through the support member and another portion of the terminals of the electronic component may pass through, and the first opening A plurality of second open holes provided along the circumference of the hole are formed,
test handler. 8. The method of claim 7,
A protrusion for supporting the support member is formed on the body portion to protrude from one surface of the body portion,
A pocket groove into which the support member can be inserted is formed in the pocket frame,
The support member may be fixedly supported to the pocket frame by inserting at least a portion of the support member and the protrusion into the pocket groove when the pocket frame and the body portion are coupled.
test handler. 8. The method of claim 7,
The pocket frame is provided with a first fixing element,
A second fixing element for engaging with the first fixing element is formed on the body portion,
A support fixing hole is formed in the support member at a position corresponding to the second fixing element and for engaging any one of the first fixing element and the second fixing element;
Any one of the first fixing element and the second fixing element is provided to fix the support member to the body portion by engaging the other one of the first fixing element and the second fixing element and the support fixing hole felled,
test handler. a test tray comprising: a tray frame having a receiving portion on which an electronic component can be mounted; and
and an opening unit capable of pressing the holding unit so that the electronic component can be separated from the accommodating part;
The opening unit is
an open unit body capable of pressing the holding unit by accessing the test tray; and
It is supported on the open unit body, and when the open unit body presses the holding unit, at least a part of the buffer support member that can be disposed inside the receiving part,
The cushioning support member disposed inside the accommodating part is an elastic material to absorb the impact applied to the electronic component when the electronic component falls toward the cushioning support member in order for the electronic component to be seated on the cushioning support member. is formed with
When the opening unit is spaced apart from the holding unit, the tray frame is provided with a tray support capable of supporting the electronic component disposed in the receiving unit,
The upper surface of the buffer support member is located above the upper end of the tray support when the buffer support member is disposed on the inside of the receiving part,
test handler. a test tray comprising: a tray frame having a receiving portion on which an electronic component can be mounted; and
and an opening unit capable of pressing the holding unit so that the electronic component can be separated from the accommodating part;
The opening unit is
an open unit body capable of pressing the holding unit by accessing the test tray; and
It is supported on the open unit body, and when the open unit body presses the holding unit, at least a part of the buffer support member that can be disposed inside the receiving part,
The buffer support member disposed inside the receiving part is formed of an elastic material to absorb the impact applied to the electronic part when a predetermined pressure is applied to the electronic component seated on the buffer support member,
When the opening unit is spaced apart from the holding unit, the tray frame is provided with a tray support capable of supporting the electronic component disposed in the receiving unit,
The upper surface of the buffer support member is located above the upper end of the tray support when the buffer support member is disposed on the inside of the receiving part,
test handler. A tray frame in which an accommodating part in which an electronic component can be placed is formed, a tray support member for supporting between a plurality of terminals of the electronic component disposed in the accommodating part, and the electronic component so that the electronic component does not depart from the accommodating part a test tray including a holding unit capable of being supported by the tray support member; and
and an opening unit capable of pressing the holding unit so that the electronic component can be separated from the accommodating part;
The opening unit is
an open unit body capable of pressing the holding unit by accessing the test tray; and
It is supported on the open unit body and includes a cushioning support member formed of an elastic material,
In the tray support member,
When the electronic component is seated on the tray support member, an open hole through which at least a portion of the terminals of the electronic component can pass is formed
test handler. 13. The method of claim 12,
The buffer support member,
When the electronic component falls toward the tray support member or a predetermined pressure is applied to the electronic component seated on the tray support member, the tray support member to absorb the impact applied to the tray support member and the electronic component. Adhering to the bottom surface and supporting the electronic component exposed through the open hole,
test handler. A moving step of moving the loading device onto the receiving portion of the tray frame while holding the electronic component;
a lifting step of raising the opening unit body so that the buffer support member supported on the opening unit body is in close contact with the bottom surface of the tray support member supported on the lower side of the tray frame;
a grip release step in which the loading device releases the grip of the electronic component so that the electronic component falls toward the accommodating part;
When the electronic component falls toward the tray support member, the shock absorbing step of supporting the electronic component exposed through the open hole formed in the tray support member to absorb the impact applied to the electronic component by the cushioning support member ;
A lowering step of lowering the opening unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member,
In the descending step,
When the opening unit body descends, at least some of the plurality of terminals of the electronic component are inserted into the opening hole,
How to control the test handler. A moving step of moving the unloading device onto the receiving unit to grip the electronic components in the receiving unit of the tray frame;
a lifting step of raising the opening unit body so that the buffer support member supported on the opening unit body is in close contact with the bottom surface of the tray support member supported on the lower side of the tray frame;
a holding step of the unloading device holding the electronic component supported by the tray support member;
When a predetermined pressure is applied to the electronic component in the gripping step, the shock absorption support member supports the electronic component exposed through an open hole formed in the tray support member to absorb the impact applied to the electronic component. step;
A lowering step of lowering the opening unit body so that the buffer support member is spaced apart from the bottom surface of the tray support member,
In the rising step,
When the opening unit body rises, at least some of the terminals of the electronic component rise while being inserted into the opening hole,
How to control the test handler. 16. The method of claim 14 or 15,
An opening step of opening the holding unit so that the electronic component can be supported by the tray support member or separated from the tray support member;
The ascending step is
Elevating the opening unit body to a predetermined position so that the opening unit body presses the holding unit,
How to control the test handler.

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