WO2008050443A1 - Plateau client et appareil de test de composant électronique - Google Patents

Plateau client et appareil de test de composant électronique Download PDF

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Publication number
WO2008050443A1
WO2008050443A1 PCT/JP2006/321491 JP2006321491W WO2008050443A1 WO 2008050443 A1 WO2008050443 A1 WO 2008050443A1 JP 2006321491 W JP2006321491 W JP 2006321491W WO 2008050443 A1 WO2008050443 A1 WO 2008050443A1
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WO
WIPO (PCT)
Prior art keywords
tray
test
customer tray
electronic device
under test
Prior art date
Application number
PCT/JP2006/321491
Other languages
English (en)
Japanese (ja)
Inventor
Akihiko Ito
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to PCT/JP2006/321491 priority Critical patent/WO2008050443A1/fr
Priority to TW096134819A priority patent/TW200824032A/zh
Publication of WO2008050443A1 publication Critical patent/WO2008050443A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays

Definitions

  • the present invention accommodates pre-tested or tested IC devices in an electronic component testing apparatus for testing electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices).
  • the present invention relates to a customer tray that is carried in or out in a state of being carried out, and an electronic component testing apparatus using the customer tray.
  • a handler In an electronic component test apparatus called a handler, a large number of IC devices housed in a tray are transported into a nodola, and each IC device is brought into electrical contact with a test head to perform an electronic component test. Have the device body (hereinafter referred to as a tester) perform the test. When the test is completed, each IC device is ejected from the test head and placed on the tray according to the test result, so that it is sorted into categories such as non-defective products and defective products.
  • a tray (hereinafter referred to as a test tray) that is circulated and conveyed in a handler from a tray (hereinafter referred to as a customer tray) for accommodating a pre-tested or tested IC device.
  • a tray hereinafter referred to as a customer tray
  • tests IC devices by reloading the IC devices and placing the IC devices in electrical contact with the sockets of the test head while mounted on the test tray.
  • the conventional technique is to perform the test by transporting the customer tray itself to the test head and pressing the IC device against the socket while being accommodated in the customer tray. It is known (see, for example, Patent Document 1). [0006] However, while the customer tray is made of, for example, a synthetic resin material, a thermal stress of 55 to + 150 ° C is applied to the IC device during the test. The customer tray was thermally expanded, and the IC device input / output terminals and the contact pins of the socket could not be properly contacted during the test, making it difficult to test the IC device while it was mounted on the customer tray. .
  • the customer tray is designed only for the transportation of the IC device, and originally high machining accuracy is not required. For this reason, the IC device cannot be accurately positioned with respect to the socket during the test, and the IC device input / output terminals may not be in proper contact with the socket contact pins. As it was, it was difficult to test IC devices.
  • Patent Document 1 Japanese Utility Model Publication No. 7-8785
  • An object of the present invention is to provide a customer tray capable of testing an electronic device under test while being mounted on a customer tray, and an electronic component testing apparatus using the customer tray.
  • an electronic component testing apparatus for testing an electronic device under test is carried in a state in which the electronic device under test before or after being tested is accommodated.
  • a customer tray to be unloaded which is capable of accommodating the electronic device under test, a tray main body holding the accommodating means, and allowing the relative movement of the accommodating means with respect to the tray main body.
  • the customer tray is provided with a floating means, and the accommodating means for accommodating the electronic device under test is movable relative to the tray body.
  • the apparatus further comprises a fixing means for fixing the relative movement of the accommodating means with respect to the tray body (see claim 2).
  • the customer tray is used in addition to a test process such as an appearance inspection process and a shipping process. In order to use the customer tray even in an apparatus provided in each process, each customer tray is used on the customer tray. The position of the test electronic component must be fixed.
  • the customer tray can be used as usual in processes other than the test process by making it possible to fix the relative movement of the storage means by the fixing means.
  • the housing means is detachable from the tray body (see claim 3).
  • the accommodating means in the customer tray, can be detachably attached to the tray body.
  • the customer tray can be made compatible with the product type change by changing only the accommodating means. This eliminates the need to prepare an entire customer tray for each type of electronic component under test, thereby reducing the cost of the customer tray.
  • an electronic device under test is pressed against a contact portion of a test head, and an input / output terminal of the electronic device under test is electrically connected to a contact bin of the contact portion.
  • An electronic component test apparatus for testing the electronic device under test in contact with the electronic device wherein the electronic device under test is placed in any one of the customer trays while the electronic device under test is contained in the electronic device under test.
  • An electronic component test apparatus is provided, wherein the electronic component test device is pressed against a contact portion to electrically contact an input / output terminal of the electronic device under test with a contact pin of the contact portion (see claim 4).
  • the customer tray further includes guide means for the accommodating means to be guided to the contact portion, and at least when the electronic device under test is pressed against the contact portion.
  • the receiving means is released from being fixed by the fixing means, can be moved relative to the tray body by the floating means, and is guided to the contact portion by the guide means. It is preferred to do so (see claim 5).
  • a loader in which the customer tray in which the electronic device to be tested before testing is accommodated is mounted on a conveyance frame capable of mounting one or more of the customer trays.
  • An application unit that applies a thermal stress at a predetermined temperature to the electronic device under test in a state where the electronic device under test is accommodated in the customer tray mounted on the conveyance frame, and the customer tray on the conveyance frame. In a state where the electronic component to be tested is pressed against the contact portion of the test head, the electronic component to be tested is placed on the customer tray mounted on the transport frame. In the accommodated state, the removing section for removing thermal stress from the electronic device under test and the customer tray containing the electronic device under test after the test And an unloader section that is removed from the conveyance frame. (See claim 6).
  • the application unit, the test unit, and the removal unit are provided on the rear side of the loader unit and the unloader unit. It is preferable to have the characteristics (see claim 7).
  • an empty customer tray that does not contain the electronic device under test is placed on the customer tray that contains the electronic device under test. It is preferable to transport the customer tray that contains the electronic device under test in a state (see claim 8).
  • the test tray is provided with a latch mechanism or the like for preventing the electronic device under test from popping out.
  • the customer tray is not provided with means for preventing the pop-out. Therefore, in the present invention, the electronic device under test is accommodated on the customer tray accommodating the electronic device under test, and the electronic device under test is accommodated with an empty customer tray covered. By transporting the customer tray within the electronic component test equipment, the customer tray force can also prevent the electronic device under test from popping out.
  • the customer tray is transported while the customer tray is reversed, and the electronic components to be tested housed in the customer tray are transferred to the contact portion of the test head. It is preferable that it is pressed against (see claim 9).
  • the customer tray is transported with the customer tray inverted, and the electronic component under test By performing this test, it is no longer necessary to form an opening in the customer tray for the input / output terminals to face the back of the customer tray. Therefore, the electronic device under test can be prevented from dropping through this opening.
  • the total number of electronic components to be tested contained in one or two or more customer trays is the number of simultaneous measurements in the test head of the electronic component testing apparatus. It is preferable that they coincide or are an integral multiple of the number of simultaneous measurements (see claim 10). As a result, the test efficiency of the electronic component test apparatus can be improved.
  • FIG. 1 is a perspective view showing an entire electronic component testing apparatus according to a first embodiment of the present invention.
  • FIG. 2 is a plan view showing the entirety of the electronic device test apparatus according to the first embodiment of the present invention.
  • FIG. 3 is a perspective view showing a customer tray in the first embodiment of the present invention.
  • FIG. 4A is a cross-sectional view taken along the line IV-IV in FIG. 3, and shows a state in which the floating operation of the housing member is fixed.
  • FIG. 4B is a cross-sectional view taken along the line IV-IV in FIG. 3, and shows a state in which the housing member can float.
  • FIG. 5 is a plan view showing a housing member used in the customer tray shown in FIG. 3.
  • Fig. 6 is a plan view showing an accommodating member of a customer tray in the second embodiment of the present invention.
  • FIG. 7 is an enlarged cross-sectional view of a customer tray in a third embodiment of the present invention.
  • FIG. 8 is a perspective view showing a conveyance frame used in the electronic component testing apparatus according to the first embodiment of the present invention.
  • FIG. 9A is an enlarged cross-sectional view showing a state in which the housing member of the customer tray and the guide pin of the test head are in contact with each other when the IC device is tested in the first embodiment of the present invention.
  • FIG. 9B shows a test of an IC device in the first embodiment of the present invention. It is an expanded sectional view showing a state.
  • FIG. 10 is a perspective view showing a cassette used for transporting a customer tray between the electronic component test apparatus and the dedicated classification apparatus in the first embodiment of the present invention.
  • FIG. 11 is a plan view showing a dedicated classification apparatus used in the first embodiment of the present invention.
  • FIG. 12 is an enlarged cross-sectional view showing a customer tray that is being transported in the electronic component test apparatus in the fourth embodiment of the present invention.
  • FIG. 13 is a plan view showing a test unit of an electronic device test apparatus according to a fourth embodiment of the present invention.
  • FIG. 14 is an enlarged cross-sectional view showing a state in which an IC device is being tested in a fourth embodiment of the present invention.
  • FIG. 1 and FIG. 2 are a perspective view and a plan view showing the entire electronic component testing apparatus according to the first embodiment of the present invention.
  • a tester (not shown) sends a test signal to the IC device via the test head 7 in a state where a high-temperature or low-temperature temperature stress is applied to the IC device. It is a device for testing (inspecting) whether an IC device operates properly by inputting and outputting. The IC device test using this electronic component test equipment is performed without using the test tray, with the IC device still housed in the customer tray 8A.
  • the handler 1 includes a loader unit 200, an application unit 300, a test unit 400, a heat removal unit 500, and an unloader unit 600.
  • the loader unit 200 stores two customer trays 8A supplied to the handler 1 in a stacked state in the transport frame 9, and loads the transport frame 9 into the application unit 300.
  • the customer tray 8A is transported in the nodola 1 while being housed in the transport frame 9 until it is housed in the transport frame 9 by the loader unit 200 and then reaches the unloader unit 600.
  • each customer tray 9 is moved above the test head 7, and the IC device is tested while the IC device is accommodated in the customer tray 9.
  • the strike is completed, it is carried out to the heat removal unit 500.
  • the IC device force is also removed from the unloader unit 600 after the thermal stress is removed while the IC device is housed in the customer tray 8A.
  • the customer tray 8A is removed from the transport frame 9, and the force stapler tray 8A is unloaded from the existing tray 600A and stacked on the stack of customer trays 8A. .
  • the customer tray that contains the IC device that has been tested in this way is transported to a dedicated classification device 1000 (see Fig. 11) separate from handler 1 by an automatic transport device such as an operator or ADV.
  • the dedicated device 1000 classifies IC devices into categories according to test results.
  • FIG. 3 is a perspective view showing the customer tray in the first embodiment of the present invention
  • FIGS. 4A and 4B are sectional views taken along line IV-IV in FIG. 3
  • FIG. 4A is a floating view of the housing member.
  • FIG. 4B is a view showing a state in which the operation is fixed
  • FIG. 4B is a view showing a state in which the accommodation member can float
  • FIG. 5 is a plan view showing the accommodation member used in the customer tray shown in FIG.
  • the customer tray 8A in the present embodiment includes, for example, a flat tray body 81A having a synthetic resin material force, and a large number of accommodating members 82A for holding an IC device.
  • the tray body 81A is provided with a number of holding portions 811 such as through-hole caps.
  • the holding portion 811 is arranged on the tray body 81 A in 7 rows and 8 columns!
  • Each holding portion 811 is inserted with a storage member 82A.
  • a total of 56 storage members 82A are provided in one customer tray 8A.
  • the side surface of the tray main body 81A is attached with a barcode 817 storing the test results of each IC device accommodated in the customer tray 8A.
  • the number of IC devices that can be accommodated in the customer tray 8D is not particularly limited to the present invention, and coincides with the number of simultaneous measurements in the test head 7, or the number of simultaneous measurements is adjusted. If the total number of IC devices that can be accommodated in multiple customer trays 8D matches the number of simultaneous measurements or is an integral multiple of the number of simultaneous measurements, The test efficiency of the child component testing apparatus can be improved.
  • the holding portion 811 of the tray body 81A has a tapered portion 812 that extends outwardly in a tapered shape, and has a step-like shape in the substantially central portion.
  • a step portion 813 is provided, and a large-diameter portion 814 having a larger inner diameter is provided below the step portion 813.
  • the housing member 82A has a concave portion 821 for housing the IC device in a substantially central portion.
  • An opening 822 is formed at the bottom of the recess 821 so that the input / output terminal HB of the IC device can face the back side of the customer tray 8A.
  • only one recess 821 is formed in one housing member 82A.
  • the present invention is not particularly limited to this, and one housing member 82A has two or more recesses 821. You may prepare.
  • Guide holes 824 for fitting guide pins 72 provided in the test head 7 are provided on both sides of the recess 821 so as to penetrate the accommodating member 82A.
  • the lower opening of the guide hole 824 has a tapered surface 825 that expands in a tapered manner toward the outside so as to be guided by the housing member 82A force S socket 70 !.
  • a tapered portion 823 that is constricted in a tapered shape by being directed inward is provided at the upper portion so as to face the tapered portion 812 of the tray body 81A.
  • a projecting portion 826 projecting in the direction is provided at the lower portion. As shown in FIG. 5, the projecting portion 826 has a substantially L-shaped notch 827 formed at the base thereof, and can be elastically deformed in the direction of the arrow shown in FIG.
  • the housing member 82A can be detached from the customer tray 8A.
  • the customer tray 8A can be made compatible with the type change by changing only the housing member 82A in the customer tray 8A.
  • the taper 823 and the protrusion 826 in the housing member 82A are excluded!
  • the outer diameters of these parts are the taper 812 and the large diameter in the holding part 811 of the tray body 81A. It is smaller than the inner diameter of the portion excluding the portion 814. Due to this inner diameter difference, the accommodating member 82A can move relative to the tray body 81A.
  • the customer tray 8A in the present embodiment has a fixed relative movement of the housing member 82A with respect to the tray body 81A in a normal state (a state where no load is applied to the housing member 82A).
  • a normal state a state where no load is applied to the housing member 82A.
  • the accommodating member 82A when the accommodating member 82A is lowered by its own weight, as shown in FIG. 4A, the tapered portion 812 of the tray body 81A and the tapered portion 823 of the accommodating member 82A are in close contact with each other.
  • the relative movement of the housing member 82A is fixed with respect to the tray body 81A.
  • the accommodating member 82A rises with respect to the tray main body 81A due to contact with the guide pin 72 of the test head 7, etc., as shown in FIG. 4B, the taper portion 812 of the tray main body 81A The accommodating member 82A is separated from the tapered portion 823, and the accommodating member 82A can move relative to the tray main body 81A along the main surface direction of the customer tray 8A.
  • the upper limit of the upward movement of the housing member 82A is regulated by the protrusion 826 of the housing member 82A coming into contact with the step 814 of the holding portion 811.
  • customer tray housing member may be configured as follows.
  • FIG. 6 is a plan view showing a customer tray housing member according to the second embodiment of the present invention.
  • a plate panel member 828 is interposed between the holding portion 811 of the tray main body 81B and the outer peripheral surface of the accommodating member 82B.
  • the plate panel member 828 is provided on all sides of the housing member 82B.
  • each plate panel member 828 presses the accommodating member 82B, and the relative movement of the accommodating member 82B with respect to the tray body 81B is fixed. Then, when the guide pin 72 provided on the test head 7 is inserted into the guide hole 824, the accommodating member 82B acts against the tray main body 81B against the elastic force of the plate panel member 828. The housing member 82B is guided by the guide pins.
  • FIG. 7 is an enlarged cross-sectional view of a customer tray in the third embodiment of the present invention.
  • the housing member 82C instead of the tapered portions 812, 823 and the plate panel member 828, the housing member 82C is provided with a shaft 829 that protrudes downward and is applied to the shaft 829.
  • a fitting hole 815 is formed in the tray body 81c so as to oppose to the tray body 81c.
  • an enlarged-diameter part 816 is formed that is expanded outward in a tapered shape.
  • the accommodating member 82C rises with respect to the tray main body 81C due to contact with the guide pin 72 of the test head 7 or the like, the shaft 829 has a diameter-enlarged portion 816 of the guide hole 815, although not particularly illustrated. Therefore, the accommodating member 82C can move relative to the tray body 81C along the main surface direction of the customer tray 8C.
  • FIG. 8 is a perspective view showing a conveyance frame used in the electronic component testing apparatus according to the first embodiment of the present invention.
  • the loader unit 200 includes a tray moving device 210 that moves the customer tray 8 A supplied to the drum 1 in a stacked state to the transport frame 9.
  • the conveyance frame 9 has two tray accommodating portions 91 that can accommodate customer trays 82B, and one conveyance frame 9 accommodates two customer trays 8A. It is becoming possible.
  • the tray accommodating portion 91 penetrates the conveyance frame 9 and has a protrusion 92 protruding inward at the lower portion thereof.
  • the customer tray 8A accommodated in the tray accommodating portion 91 is held by the protrusion 92, and the input / output terminal HB of the IC device accommodated in the customer tray 8A can face the back side of the tray transport frame 9. It has become.
  • three or more tray accommodating portions 91 may be formed in the conveyance frame 9 so that one conveyance frame 9 can accommodate three or more customer trays 82B. Further, a hook (not shown) for holding the customer tray 8A accommodated in the tray accommodating portion 91 may be provided on the upper surface of the transport frame 9.
  • the tray moving device 210 is arranged on the device substrate of the handler 1 in the Y-axis direction.
  • the Y-axis rail 211 installed in this way, the movable arm 212 that can reciprocate along the vertical axis rail 211, and the movable arm 212 supported by the movable arm 212, and can be moved up and down by an actuator (not shown)
  • Two gripping heads 213 are provided. Each gripping head 213 has an open / close-type gripping claw downward for gripping the customer tray 8 ⁇ , although not particularly shown.
  • This tray moving device 210 is configured such that after the gripping head 213 grips and raises the customer tray 8 ⁇ located at the uppermost stage of the laminate including the customer tray 8 ⁇ supplied with the pre-process force to the handler 1,
  • the movable arm 212 moves on the axial rail 211 and places the customer tray 8 ⁇ in the tray accommodating portion 91 of the transport frame 9. When two customer trays 8 mm are placed, the conveyance frame 9 is carried into the application unit 200.
  • the application unit 300 has a thermostatic chamber that applies a target high or low temperature stress to the IC device housed in the customer tray 8 mm. Inside the thermostatic chamber, FIG. 1 and FIG. There is a vertical conveyor that is conceptually shown in!
  • the vertical transfer device can hold a plurality of transfer frames 9 containing the customer tray 8mm, and can sequentially move the transfer frames 9 in the axial direction. .
  • the transfer frame 9 stands by in the application unit 300 while being held by the vertical transfer device, so that a high or low temperature stress of about 55 to + 150 ° C is applied to the IC. Applied to the device.
  • a predetermined thermal stress is applied to the IC device by the application unit 300, the transport frame 9 is carried into the test unit 400.
  • FIG. 9A is an enlarged cross-sectional view showing a state in which the customer tray housing member and the guide pin of the test head are in contact with each other when the IC device is tested in the first embodiment of the present invention
  • FIG. 9B is the IC in the first embodiment of the present invention. It is an expanded sectional view which shows the state which is testing the device.
  • the test unit 400 presses the IC device accommodated in the customer tray 8A against the socket 70 of the test head 7 to input / output the IC device.
  • the upper portion of the test head 7 is inserted into the inside of the test chamber through an opening (not shown) formed in the apparatus substrate, and the socket 70 is located inside the test chamber.
  • test unit 400 when the transport frame 9 is transported from the application unit 300 and each customer tray 8A is positioned above the test head 7, the transport frame 9 containing the customer tray 8A, and The pusher 410 provided above the test head 7 descends toward the test head 7, and first, as shown in FIG. 9A, guide pins 72 provided around the socket 70 on the test head 7 are provided. It abuts on each accommodating member 82A of the customer tray 8A. By this contact, the storage member 82A rises with respect to the tray body 81A, and the close contact between the taper portions 812 and 823 is released. Therefore, the storage member 82A is in contact with the tray body 81A and the main surface of the customer tray 8A. Relative movement is possible along the direction.
  • Guide pin 72 on the test head 7 side 72 force Guided along the taper surface 825 of the guide hole 824 of the housing member 82A, and the housing member 82A moves relative to the tray body 81A and moves into the guide hole 824.
  • the IC device is positioned relative to the socket 70.
  • the guide pin 412 of the pusher 410 is also fitted with the upward force into the guide hole 824 of the housing member 82A, and the pressing portion 411 is recessed in the housing member 82A. Enter 821 and press the IC device into socket 70.
  • the input / output terminal HB of the IC device is brought into electrical contact with the contact pin 71 of the socket 70, and the test of the IC device is executed by a tester (not shown) through the test head 7.
  • the IC device test results are given as a barcode on the side of the customer tray 8A.
  • the transfer frame 9 is delivered to the heat removal unit 500.
  • the IC device test results can be transferred as data from the handler 1 to the dedicated classification device 1000 in addition to attaching barcodes and IC chips to the customer tray 8A itself!
  • the heat removal unit 500 has a heat removal tank for removing the applied thermal stress from the tested IC device, and conceptually shown in FIGS. 1 and 2 inside the heat removal tank.
  • a vertical transfer device is provided.
  • the vertical transfer device may hold a plurality of transfer frames 9 containing the customer tray 8A. It is possible to move these transport frames 9 sequentially along the Z-axis direction.
  • this heat removal unit 500 when a high temperature is applied to the IC device by the application unit 300, the IC device is cooled to the room temperature by blowing air and then transferred to the unloader unit 600. On the other hand, when a low temperature is applied to the IC device by the application unit 300, the IC device is heated with warm air or a heater, etc., and returned to a temperature at which condensation does not occur, and then carried out to the unloader unit 600.
  • the unloader unit 600 moves the tray from the conveyance frame 9 carried out from the heat removal unit 500 to the customer tray 8A that is carried out from the handler 1 on the laminate including the customer tray 8A.
  • a device 610 is provided.
  • the tray moving device 610 has the same configuration as the tray moving device 210 of the loader unit 200, and is constructed on the device substrate of the handler 1 along the Y-axis direction.
  • two gripping heads 613 Although not specifically shown, each gripping head 613 has an openable gripping claw for gripping the customer tray 8A downward.
  • the tray moving device 610 moves the movable arm 612 on the Y-axis direction rail 611 after the customer head 8A accommodated in the transport frame 9 is gripped and lifted by the gripping head 613. Then, the customer tray 8A is moved onto the laminate composed of the customer tray 8A carried out from the handler 1.
  • FIG. 10 is a perspective view showing a cassette used for transporting a customer tray between the electronic component test apparatus and the classification dedicated apparatus in the first embodiment of the present invention
  • FIG. 11 is used in the first embodiment of the present invention. It is a top view which shows a classification exclusive apparatus.
  • the laminated body composed of the customer tray 8A carried out from the handler 1 is accommodated in a force set 85 as shown in FIG. 10, and the classification dedicated apparatus is used by an operator or an automatic conveying apparatus such as ADV. Carried to 1000.
  • the classification dedicated apparatus 1000 is a dedicated apparatus for classifying the IC devices based on the test results of the IC devices by the electronic component testing apparatus, and is accommodated in the cassette 85 and transported to the classification dedicated apparatus 1000. Each IC device on customer tray 8A can be transferred to customer trays 8A to 8A according to the test results.
  • the classification dedicated apparatus 1000 includes a Y-axis direction rail 1100 installed along the Y-axis direction on the apparatus substrate of the classification-specific apparatus 1000, and the Y-axis direction rail 110 0.
  • a movable arm 1200 capable of reciprocating along the Y-axis direction, a movable head 1300 supported so as to be movable along the X-axis direction on the movable arm 1200, and an actuator (not shown) supported by the movable head 1300.
  • suction heads 1400 that can be moved up and down by the
  • This dedicated classification device 1000 recognizes the test result of each IC device based on the barcode attached to the side surface of the customer tray 8A, and the IC on the customer tray 8A contained in the cassette 85.
  • the device is lifted with suction head 1400 sucked and held, movable head 1300 moves on movable arm 1200, and movable rail 1200 moves on Y-axis direction rail 1100. Place the IC device on 8A.
  • the leftmost customer tray 8A is a high-speed IC device
  • the second customer tray 8A from the left is a medium-speed IC device
  • the third customer tray 8A from the left Is a slow IC device
  • the leftmost customer tray 8A accommodates defective IC devices.
  • the number of categories of the sorting destination is not particularly limited to four, and may be five or more categories including defective products that need to be tested again.
  • the IC device classification process tends to be a bottleneck process, but in this embodiment, the IC device classification work is performed by the classification dedicated apparatus 1000 independent of the electronic component testing apparatus. Adjust the load of the classification process by increasing or decreasing the number of 1000 devices It is possible to
  • An inexpensive tray that does not have a floating mechanism, etc., may be used separately from the customer tray 8A transported inside.
  • the customer tray has a floating function that allows the accommodating member 82A to move relative to the test tray 81A, so that the thermal expansion of the customer tray 8A can be achieved at the time of contact. It is possible to absorb the error in the position of the IC device relative to the socket 70 due to the cache accuracy and to test the IC device while it is mounted on the customer tray 8A.
  • the relative movement of the accommodating member 82A can be fixed by the fixing mechanism including the taper portions 812 and 823, the customer can be used in the processes other than the test process as usual.
  • a tray can be used.
  • FIG. 12 is an enlarged cross-sectional view showing a customer tray that is being transported in the electronic component test apparatus in the fourth embodiment of the present invention
  • FIG. 13 is a test section of the electronic component test apparatus according to the fourth embodiment of the present invention
  • FIG. 14 is an enlarged cross-sectional view showing a state where an IC device is tested in the fourth embodiment of the present invention.
  • the electronic component testing apparatus according to the fourth embodiment of the present invention is different from the electronic component testing apparatus according to the first embodiment described above in the following three points.
  • the electronic component test apparatus includes (a) an empty customer tray 8E that does not contain an IC device (hereinafter simply referred to as an empty tray 8E) on a customer tray 8D that contains an IC device. (2) The point where the two customer trays 8D and 8E are overlapped and transported in the nodola, and (b) the customer tray 8D is inverted (that is, the input / output terminal HB is connected).
  • the electronic component test according to the first embodiment is the point that the IC device is transported in a posture facing upward), and (c) the customer tray 8D force empty tray 8E is removed and attached before and after the test in the test unit 400. Different from the device.
  • the description of the same configuration as the electronic component testing apparatus according to the first embodiment is omitted, and the electronic component testing apparatus according to the first embodiment is omitted. Only the differences will be described below.
  • the customer tray 8D supplies the pre-process force to the loader unit 200 of the handler 1 with the IC device input / output terminal HB facing upward.
  • an empty tray 8E that does not contain an IC device is placed on the customer tray 8D that accommodates an IC device in an inverted state. Supplied to the loader unit 200 of the handler 1.
  • the customer tray 8D is transported in the handler 1 with the IC device inverted and the empty tray 8E overlapped.
  • the customer tray 8D that houses the IC device and the empty customer tray (empty tray) 8E that can accommodate the IC device are trays of the same structure and shape.
  • the test unit in this embodiment removes the empty tray 8E from the top of the customer tray 8D in which the IC device immediately before the test is accommodated, as shown in FIG.
  • an attaching / detaching device 450 for re-mounting the empty tray 8E is provided on the customer tray 8D.
  • FIG. 13 Only one set of attachment / detachment device 450 is shown in FIG. 13, as shown in FIGS. 1 and 2, since two transfer frames 9 are simultaneously loaded into the test section, Two sets of attachment / detachment devices 450 are provided.
  • the attachment / detachment device 450 removes the customer tray 8D from above the empty tray 8E, and moves the empty tray 8E to the forwarding device 470, and the removal device
  • the feeding device 470 transports the empty tray 8E moved by 460 to the mounting device 480, and the mounting device 480 that covers the empty tray 8E transported by the forwarding device 470 on the customer tray 8D again. .
  • the removal device 460 includes a Y-axis direction rail 461 installed on the device board of the handler 1 along the Y-axis direction and the Y-axis direction rail 461 on the Y-axis direction. And a gripping head 463 that is provided at the tip of the movable arm 461 and that can be moved up and down by an unillustrated actuator.
  • the gripping head 463 has an openable and closing gripping claw 464 for gripping the customer tray 8D downward.
  • eight gripping claws 464 are provided in one gripping head 463, and two empty trays 8E can be moved by the removal device 460 at the same time.
  • the forwarding device 470 is composed of, for example, a belt conveyor, and the operation of the removal device 460.
  • the customer tray 8D can be moved from the area to the operating area of the mounting device 480.
  • the mounting device 480 includes a Y-axis direction rail 481 installed on the device board of the handler 1 along the Y-axis direction, and the Y-axis direction rail 481 extending in the Y-axis direction.
  • a movable arm 482 that can move back and forth along, and a gripping head 483 that is provided at the distal end of the movable arm 482 and that can be moved up and down by an unillustrated actuator, are provided.
  • the gripping head 483 has an open / close type gripping claw 484 for gripping the empty tray 8E facing downward.
  • eight gripping claws 484 are provided in one gripping head 483, and two empty trays 8E can be moved simultaneously by the mounting device 480.
  • the removal device 460 of the attachment / detachment device 450 removes the empty tray 8E from the top of the customer tray 8D, and moves the empty tray 8E to the forwarding device 470.
  • the customer tray 8D from which the empty tray 8E has been removed is moved onto the test head 7, and as shown in FIG. 14, the input / output terminal HB faces upward and is moved by a Z-axis drive mechanism (not shown).
  • the IC device is pressed against the socket 70 through the pusher 410, and the I / O terminal HB of the IC device is in electrical contact with the contact pin 71 of the socket, and the IC is tested by a tester (not shown) through the test head 7.
  • a device test is run.
  • the customer tray 8D is delivered from the top of the test head 7 to the heat removal unit 500 side while holding the tested IC device.
  • the forwarding device 470 moves the empty tray 8E along the X-axis direction.
  • the mounting device 480 receives the empty tray 8E from the forwarding device 470, and puts the empty tray 8E on the customer tray 8D again.
  • the customer tray 8D and the empty tray 8E are carried out to the heat removal unit 500 in an overlapped state.
  • the customer tray 8D containing the IC device since the customer tray 8D containing the IC device is transported with the empty tray 8E placed on the customer tray 8D, the IC device pops out during the transportation. Can be prevented.
  • the customer puts the IC device input / output terminal HB upward.
  • the tray 8D By transporting the tray 8D and executing the IC device test, it is not necessary to form an opening in the customer tray 8D to allow the input / output terminal HB of the IC device to face the back of the customer tray 8D. Therefore, it is possible to prevent the IC device from falling through this opening.

Abstract

La présente invention concerne un plateau client (8A) ayant un corps de plateau (81A) et des éléments récepteurs (82A) capables de recevoir des dispositifs IC. Un grand nombre de sections de support (811) destinées à supporter les éléments récepteurs (82A) sont formées dans le corps de plateau (81A). Lorsqu'une section effilée (812) d'une section de support (811) et une section effilée (823) d'un élément récepteur (82A) ne sont pas en contact, l'élément récepteur (82A) peut se déplacer par rapport au corps de plateau (81A) et, lorsque les sections effilées (812, 823) sont en contact, l'élément récepteur (82A) est fixe par rapport au corps de plateau (81A).
PCT/JP2006/321491 2006-10-27 2006-10-27 Plateau client et appareil de test de composant électronique WO2008050443A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2006/321491 WO2008050443A1 (fr) 2006-10-27 2006-10-27 Plateau client et appareil de test de composant électronique
TW096134819A TW200824032A (en) 2006-10-27 2007-09-19 Customer tray and electronic component testing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/321491 WO2008050443A1 (fr) 2006-10-27 2006-10-27 Plateau client et appareil de test de composant électronique

Publications (1)

Publication Number Publication Date
WO2008050443A1 true WO2008050443A1 (fr) 2008-05-02

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Application Number Title Priority Date Filing Date
PCT/JP2006/321491 WO2008050443A1 (fr) 2006-10-27 2006-10-27 Plateau client et appareil de test de composant électronique

Country Status (2)

Country Link
TW (1) TW200824032A (fr)
WO (1) WO2008050443A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4765127B1 (ja) * 2010-07-30 2011-09-07 合同会社Ｐｌｅｓｏｎ トレーユニットおよび半導体デバイスの検査装置
JP2013137286A (ja) * 2011-12-28 2013-07-11 Advantest Corp 電子部品試験装置
WO2020111075A1 (fr) * 2018-11-27 2020-06-04 日本発條株式会社 Unité de sonde

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI418437B (zh) * 2011-02-08 2013-12-11 Cal Comp Optical Electronics Suzhou Co Ltd 拆裝設備
KR101968984B1 (ko) * 2012-03-16 2019-08-26 (주)테크윙 사이드도킹식 테스트핸들러
CN113720563A (zh) * 2020-05-25 2021-11-30 泰克元有限公司 测试处理器及其控制方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000111612A (ja) * 1998-10-01 2000-04-21 Advantest Corp トレイ収納用ホルダ
JP2001033519A (ja) * 1999-07-16 2001-02-09 Advantest Corp 電子部品試験装置用インサート
JP2001124825A (ja) * 1999-10-28 2001-05-11 Ando Electric Co Ltd オートハンドラ用ハンド

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000111612A (ja) * 1998-10-01 2000-04-21 Advantest Corp トレイ収納用ホルダ
JP2001033519A (ja) * 1999-07-16 2001-02-09 Advantest Corp 電子部品試験装置用インサート
JP2001124825A (ja) * 1999-10-28 2001-05-11 Ando Electric Co Ltd オートハンドラ用ハンド

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4765127B1 (ja) * 2010-07-30 2011-09-07 合同会社Ｐｌｅｓｏｎ トレーユニットおよび半導体デバイスの検査装置
WO2012014899A1 (fr) * 2010-07-30 2012-02-02 合同会社Pleson Unité en tiroir et appareil d'inspection de dispositifs semi-conducteurs
JP2013137286A (ja) * 2011-12-28 2013-07-11 Advantest Corp 電子部品試験装置
WO2020111075A1 (fr) * 2018-11-27 2020-06-04 日本発條株式会社 Unité de sonde
JP6774590B1 (ja) * 2018-11-27 2020-10-28 日本発條株式会社 プローブユニット

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