201016575 四、指定代表圖： (一） 本案指定代表圖為：第（1)圖。 (二） 本代表圖之元件符號簡單說明： 1〜搬運機（電子元件搬運裝置）； 5〜測試頭； 6〜測試用主機裝置； 7〜規線； 8〜空間部分； i〇〜ic元件（電子元件）測試裴置。 五、本案若有化學式時， 〇 請揭示最能顯示發明特徵的化學式 六、發明說明： 【發明所屬之技術領域】 本發明係關於用於在特 w疋/皿度下測試IC元养笙啻工 元件的電子元件搬運裝置。 TL件等電子 【先前技術】 在1C元件的製诰w - f 程中，必須要使用測試最後製造出 采的電子兀件的測試裝 i翬攄▲ 罝。在該測試裝置中’由稱之為搬 運機的電子7L件搬運裝 ’將複數I c元件收納於測試托盤 搬運，並使各1C元件的伙 座之捸蛀被工帝 卜部端子和設置於測試頭上的測試 厘之連接端子電氣接魅 ’讓測試用主機（測試器）執行測 201016575 2如上述般測試IC元件’將其至少區分為良品或不良品 的類別。 後f上逃測試，多半對IC元件施以高溫或低溫的溫度應力 施。因此，在上述搬運機中，在測試頭的上部設有測 \至藉由氣體將測試室内控制在既定的設定溫度，同時 測試。另外，在搬運機設置用以事先使導入測試室内 ,、I c元件變為既定溫度的恆溫槽（均熱室）、以及使從 測試室排ψ + τ„ 出之1C元件回到室溫的除熱槽（除均熱室，排出 ，室）。 ^如第12圖所示，在恆溫槽101及除熱槽103的内部， 又有垂直搬運裝置110及溫度調節用送風裝置90,在垂直 ^ 上支撐了複數個承截了複數的1C元件2的 測試托盤tst。溫度調節用送風裝置9Q具有風扇92及熱 尿裝置94，藉由風扇92吸入十亙溫槽101或除熱槽103的 殼體内的空氣，透過熱源裝置94使得吐出到殼體内部的 • 溫風或冷風對流’藉此對1C元件2施加溫度。 【發明内容】 發明欲解決的課題 ,仁疋，在如上述的構成中，因為不只是對1C元件2執 行溫度施加，也對恆溫槽101、除熱槽103本身執行溫度 施加，所以加熱或冷卻的效率恨差。另外，如上述一般僅 2用空讀流的溫度施加方法中，使IC元件2到達所欲的 溫度所需的溫度施加時間彼長’難以提高測試效率（生產 3 201016575 率）。 件搬：Γ明係有鐘於上述的實況，其目的在於提供電子元 产施加8#置其縮短在值溫槽或除熱槽中對電子元件的溫 又施加時間’並能狗實現生產率的提升。 解決課題之手段 述㈣’第…本發明提供_種電子元件搬 *係為具備將承載於托盤中的測試前的電子元件 =成既定溫度的恆溫槽的電子元件搬運裝置，其特徵在 在該值溫槽中靠近承载於該乾盤中的電子元件之處， 設有熱源裝置（發明1 )。 :據上述發明(發3月υ’藉由設置在電子元件旁邊的 …源裝置，能夠有效地對電子元件進行溫度施加，因此， =在怪溫槽中對電子元件的溫度施加時間，並能夠實現 生產率的提升。 在上述發明（發明G中，該熱源裝置可以具有熱傳導 其藉由熱傳導將溫度施加於該電子元件(發明2)，也 可以具有㈣部，其藉由輻射熱將溫度施加於該電子元件 (發明3)，也可以具有喷嘴，其用已調節溫度之氣艘喷吹 對該電子元件（發明4)。 另外，在上述發明(發明。中，該熱源裝置可以從該 電子…牛的表面側(封裝本體侧），將溫度施加於該電子元 件(發明5)，也可以從該電子元件的背面側(外部端子側）， 將溫度施加於該電子元件(發8月6)，也可以從該電子元件 的表面及背面兩側，將溫度施加於該電子元件(發明”。 201016575 — 纟上述發明（發％ υ中，該恆溫槽係ϋ持複數個該托 盤；該熱源裝置可以設置於靠近承載於剛導入該怪溫槽的 托盤上的電子元件之處(發日月8)，也可以設置於靠近承載 於從該怪溫槽排出前的托盤上的電子元件之處（發明9)， 也可以設置於靠近承載於剛導入該慑溫槽的托盤上的電子 7L件之處’並設置於靠近承載於從該恆溫槽排出前的托盤 上的電子元件之處（發明10)。 在上述發明（發8月D中，在該恒溫槽内設有調節該恨 • 溫槽内部整體的溫度之第2熱源裝置較佳（發明⑴。 第一，本發明提供一種電子元件搬運裝置，其係為且 備將承載於托盤中的測試後的電子元件回到常溫的除熱槽 的電子7L件搬運裝置，其特徵在於，在該除熱槽中靠近承 載於該托盤中的電子元件之處，設有熱源裝置(發明⑵。 依據上述發明（發明12)，藉由設置在電子元件旁邊的 熱源裝置，能夠有效地對電子元件進行溫度施加，因此， 參縮短在除熱槽中對電子元件的溫度施加時間，並能夠實現 生產率的提升。 在上述發明（發明12)中，該熱源裝置可以具有熱傳導 部，其藉由熱傳導將溫度施加於該電子元件（發明13)，也 可以具有輻射部，其藉由輻射熱將溫度施加於該電子元件 (發明14)，也可以具有喷嘴，其用已調節溫度之氣體喷吹 對該電子元件（發明15)。 另外，在上述發明（發明】2)中，該熱源裝置可以從該 電子元件的表面侧，將溫度施加於該電子元件（發明16)， 201016575 也可以從該電子元件的背面側，將溫度施加於該電子元件 (發明1 7)，也可以從該電子元件的表面及背面兩側，將溫 度施加於該電子元件（發明18)。 在上述發明（發明12)中，該除熱槽係固持複數個該把 盤；該熱源裝置可以設置於靠近承載於剛導入該除熱槽的 托盤上的電子元件之處（發明19)，也可以設置於靠近承載 於從該除熱槽排出前的托盤上的電子元件之處（發明2〇)， 也可以設置於靠近承載於剛導入該除熱槽的托盤上的電子 件之處，並設置於靠近承載於從該除熱槽排出前的粍盤 上的電子元件之處（發明21)。 在上述發明（發明12)中，在該除熱槽内設有調節該除 熱槽内部整體的溫度之第2熱源裝置較佳（發明22)。 ’、 發明之效果 在本發明中，能夠縮短在恆溫槽或除熱槽中對電子元 件的溫度施加時間，並能夠實現生產率的提升。 【實施方式】 下文配合圖式’說明本發明之實施型熊。 首先，說明具有本實施型態之電子元件搬運裝置（以_ 稱之為「搬運裝置」）的1C元件測試裝置的整體構成。y 第】圖所示，以件測試裝置1G具有搬運⑴、測試” 及測試用主機裝置6。搬運機丨執行下列動作·依序將, 該要測試的元件（電子元件之-例）搬運到設於測試頭 的測試座，測試完畢的IC元件依據測試結果分類儲存到· 201016575 定的托盤。 設於測試頭5的測試座，藉由纜線7和測試用主機裝 置6電氣連結，以可裝卸的方式裝在測試座上的ic元件， 透過缦線7而和測試用主機裝置6連接，藉由測試用主機 裝置6傳出的測試用電氣信號進行測試。 在搬運们的下部，主要内建了控制搬運機以㈣ 裝置’但在其-部份設有空間部分8,測試頭5以可^ 交換的方式配置於此空間部分8，可以透過形成於搬 的貫通孔而將IC元件裝在測試頭5的測試座上。 該搬運機1係為’用以將作為應測試電子元件的Ic _ 件在商於常溫的愚溫度狀離（古由 中測詁的肚里 间/皿）或低溫度狀態（低溫） 中測忒的裝置，搬運機i，如 槽101、測試室102及W 圖所不’具有由忮溫 Μ至102及除熱槽1〇3構成之反應室1〇 圖所示之測試頭5的上部，插第 此執行Κ：元件的測試。 的内部’並在 測二圖顯示用於理解本實施型態之搬運機1中 糊1C兀件之處理方法的 於上下方向之元件顯示為平面…實際上"並排配置 體的)構造主要來見第2及4 刀。因此，其機械之(立 土要參見第2&4圖說明之。 如第2及3圖所示，太香+Λ_ 成：元# 實施型態的搬運機1由下列構 成70件收納部200,其收納將|㈣ 幻構 完畢的IG元件錢料；載 ^的1G元件或將測試 傳送之被測試H：元件送〜試將從元件收納部咖 部100;卸載部_，將在測_ 包含測試頭的剛試 肝在以部100執行測試後之測試完 201016575 畢的ic元件取出並分類。在搬運機1中，係將ic元件收 納於測試托盤TST中搬運。 複數個裝到搬運機1之前的ic元件，收納在客端托盤 内，在此狀態下’供應給如第2及3圖所示之搬運機1的 元件收納部200，繼之，將IC元件從客端托盤移到在搬運 機1中搬運的測試托盤TST。在搬運機1的内部，如第3 圖所示’ 1C元件係於承載於測試托盤tst的狀態下移動， 並被施以岗溫或低溫的溫度應力，測試（檢查）其是否適當 地動作’依據該測試結果而將其分類的裝置。以下針對搬 運機1的各部分詳述之。 第一’針對元件收納部2 0 0的相關部分說明之。 如第2圖所示’元件收納部2〇〇包含：測試前元件倉 儲201 ’用以收納測試前ic元件；測試畢元件倉儲2〇2， 用以收納對應於測試結果而被分類之IC元件。這些測試前 元件倉儲201及測試畢元件倉儲2〇2,具有使疊放的客端 托盤升降的升降器204。 第2圖所示之測試前元件倉儲2〇1中，固持了疊放的 收納了將要進行測試的IC元件（測試前IC元件）的客端牦 盤。另外’在測試畢元件倉儲202中，固持了疊放的收納 了測試完畢已分類的IC元件（測試畢I c元件）的客端托盤。 第2 ’說明和載入部3 0 0相關的部分。 如第2圖所示’載入部300中的裝置基板1〇5上，配 置二對的窗部對306, 306以使得供應用的客端托盤面向裝 置基板105的上面。在各個窗部3〇6的下侧，設有用以使 201016575 客端托盤升降的托盤組升降器（圖未顯示）。另外，如第2 圖所示，元件收納部200和裝置基板！ 05之間設有可以在 X軸方向往返移動的托盤移送臂2〇5。 測試前元件倉儲201的升降器204，使得儲存在測試 則元件倉儲201中的客端托盤上升。托盤移送臂gw，從 已上升的升降器204接收客端托盤，在χ轴方向移動並將 該客端托盤轉交給特定的托盤組升降器。托盤組升降器， 使接收到的客端托盤上升，使其面臨載入部300的窗部 306。 繼之，在該載入部300中，收納於客端托盤的被測試 1C元件，藉由χ—γ搬運裝置3〇4而先移到對準器 (precise〇3〇5’在此修正IC元件的相互位置關係之後， 再將被移送到對準器305的被測試1C元件再次藉由Χ_γ搬 運裝置304而轉置於停放於載人部3㈣測試托盤tst上。 如第2圖所示’將被測試1(：元件從客端㈣移置到測201016575 IV. Designated representative map: (1) The representative representative of the case is: (1). (2) The symbol of the symbol of this representative diagram is briefly described: 1~porter (electronic component handling device); 5~test head; 6~testing host device; 7~regular line; 8~space part; i〇~ic element (Electronic component) test device. 5. If there is a chemical formula in this case, please disclose the chemical formula which best shows the characteristics of the invention. 6. Description of the invention: [Technical field of the invention] The present invention relates to the test of IC element raising under special w疋/dishness Electronic component handling device for the component. Electronics such as TL parts [Prior Art] In the manufacturing process of the 1C component, it is necessary to use the test device i翚摅▲ 测试 which is used to test the electronic components. In the test apparatus, a plurality of IC components are stored in a test tray by an electronic 7L transporting device called a transporter, and the components of each 1C component are placed on the test terminal and set in the test. Test on the head PCT connection terminal electrical connection 'Let the test host (tester) perform test 201016575 2 Test the IC component as described above' to distinguish it at least as a good or defective category. After the f-float test, most of the IC components are subjected to high temperature or low temperature stress. Therefore, in the above-described transporter, a test is provided on the upper portion of the test head to control the test chamber at a predetermined set temperature by gas, and to test at the same time. In addition, the transporter is provided with a thermostatic chamber (soaking chamber) for introducing the Ic element into a predetermined temperature in advance, and the 1C element discharged from the test chamber is returned to the room temperature. In addition to the heat sink (except for the soaking chamber, discharge, chamber). As shown in Fig. 12, inside the constant temperature bath 101 and the heat removal tank 103, there are vertical conveying device 110 and air conditioning device 90 for temperature adjustment. ^ The test tray tst supporting a plurality of 1C elements 2 is supported. The air conditioning device 9Q has a fan 92 and a hot urine device 94, and the fan 92 sucks into the tenth warming tank 101 or the heat removing tank 103. The air in the casing passes through the heat source device 94 to convect the warm air or the cold air convection into the casing. Thus, the temperature is applied to the 1C element 2. [Explanation] The problem to be solved by the invention, in the above, In the configuration, since the temperature application is performed not only on the 1C element 2 but also on the thermostatic bath 101 and the heat removal tank 103 itself, the efficiency of heating or cooling is inferior. In addition, as described above, only 2 empty read streams are used. In the temperature application method, the IC element is made 2 The temperature required to reach the desired temperature is applied for a long time 'It is difficult to improve the test efficiency (production 3 201016575 rate). Piece move: The Ming Ming Department has the above-mentioned live, the purpose is to provide the electronic product application 8# This shortens the application of time to the temperature of the electronic component in the value temperature tank or the heat removal tank, and can improve the productivity of the dog. The means for solving the problem (4) 'The first invention provides the electronic component to be equipped with The pre-test electronic component carried in the tray = the electronic component carrying device of the thermostat having a predetermined temperature, characterized in that a heat source device is provided in the value temperature bath near the electronic component carried in the dry disk ( Invention 1): According to the above invention (March 3', by means of a source device provided beside the electronic component, temperature can be effectively applied to the electronic component, and therefore, the temperature of the electronic component is applied in the strange temperature bath Time, and can achieve an increase in productivity. In the above invention (Invention G, the heat source device may have heat conduction, which applies temperature to the electronic component by heat conduction (Invention 2), In the case of the fourth component, which applies temperature to the electronic component by the radiant heat (Invention 3), it is also possible to have a nozzle which blows the electronic component with an air vessel of a regulated temperature (Invention 4). (Invention, the heat source device may apply temperature to the electronic component (Invention 5) from the surface side (package body side) of the electron, or may be from the back side (external terminal side) of the electronic component, Applying temperature to the electronic component (August 6), temperature can also be applied to the electronic component (invention) from both the front and back sides of the electronic component. 201016575 - The above invention (in % υ, The thermostatic bath system holds a plurality of the trays; the heat source device can be disposed near the electronic components carried on the tray just introduced into the strange temperature trough (send day and month 8), or can be placed close to the load from the strange Where the electronic components on the tray before the warming is discharged (Invention 9) may also be placed close to the electronic 7L piece carried on the tray just introduced into the temperature warming tank' and placed close to the bearing from the thermostatic bath Before discharge Where the electronic components on the tray are (Invention 10). In the above invention (August D, it is preferable to provide a second heat source device for adjusting the temperature inside the hatchery tank in the constant temperature bath (Invention (1). First, the present invention provides an electronic component transport device, The electronic 7L device carrying device for returning the tested electronic component carried in the tray to the normal temperature heat removal tank is characterized in that the electronic component carried in the tray is adjacent to the heat removal tank. Wherein, there is a heat source device (Invention (2). According to the above invention (Invention 12), by applying a heat source device beside the electronic component, temperature application of the electronic component can be effectively performed, and therefore, the electrons in the heat removal tank are shortened. The temperature of the component is applied for a time, and productivity can be improved. In the above invention (Invention 12), the heat source device may have a heat conducting portion that applies temperature to the electronic component by heat conduction (Invention 13), or may have radiation a portion that applies temperature to the electronic component by radiant heat (Invention 14), and may also have a nozzle that blows the electronic component with a gas having a regulated temperature ( According to a second aspect of the invention, the heat source device can apply temperature to the electronic component from the surface side of the electronic component (Invention 16), and 201016575 can also be from the back side of the electronic component. Temperature is applied to the electronic component (Invention 17), and temperature may be applied to the electronic component from both the front and back sides of the electronic component (Invention 18). In the above invention (Invention 12), the removal The heat sink retains a plurality of the trays; the heat source device may be disposed adjacent to the electronic components carried on the tray just introduced into the heat removal tank (Invention 19), or may be disposed adjacent to the heat removal tanks The electronic component on the tray before the discharge (invention 2) may be disposed near the electronic component carried on the tray just introduced into the heat removal tank, and disposed adjacent to the discharge from the heat removal tank. In the above-described invention (Invention 12), in the heat removal tank, a second heat source device for adjusting the temperature of the entire inside of the heat removal tank is preferably provided (inventive twenty two). ', In the present invention, it is possible to shorten the application time of the temperature of the electronic component in the thermostatic bath or the heat removal tank, and to improve the productivity. [Embodiment] Hereinafter, the embodiment of the present invention will be described with reference to the drawings. The overall configuration of the 1C component testing device having the electronic component conveying device (referred to as "transporting device" in the present embodiment) will be described. In the first drawing, the component testing device 1G has transportation (1) and testing. And the test host device 6. The transporter performs the following operations: sequentially, the component to be tested (electronic component-example) is transported to the test socket provided in the test head, and the tested IC component is stored according to the test result. To the test tray of 201016575. The test socket provided in the test head 5 is electrically connected by the cable 7 and the test host device 6, and the ic component mounted on the test socket in a detachable manner is transmitted through the twisted wire 7 The test host device 6 is connected and tested by the test electrical signal transmitted from the test host device 6. In the lower part of the transporter, the control transporter is mainly built with (4) the device', but the space portion 8 is provided in the portion thereof, and the test head 5 is disposed in the space portion 8 in an interchangeable manner, and can be formed by moving The through hole is used to mount the IC component on the test socket of the test head 5. The carrier 1 is used to measure the Ic _ piece as the electronic component to be tested in a temperature-like temperature at a normal temperature (in the case of an ancient sputum in the belly) or in a low temperature state (low temperature). The apparatus, the transporter i, such as the tank 101, the test chamber 102, and the W, does not have an upper portion of the test head 5 shown in the reaction chamber 1 shown by the enthalpy temperature to 102 and the heat removal tank 1 〇 3 Insert this execution Κ: component test. The inside of the second figure shows that the components in the up and down direction of the processing method for understanding the paste 1C member of the carrier 1 of the present embodiment are shown as planes...the actual "side-by-side configuration of the body is mainly constructed. See the 2nd and 4th knives. Therefore, the machine (see Fig. 2 & Fig. 4 for illustration). As shown in Figs. 2 and 3, the scented Λ+Λ_成:元# implementation type carrier 1 consists of the following 70 accommodating parts 200 The IG component money material that has been arbitrarily stored in the (4) phantom structure; the 1G component that carries the test or the H-component that transmits the test is sent to the test component from the component storage unit 100; the unloading section _, will be measured _ The test piece containing the test head is taken out and classified according to the ic element after the test of the test performed at the section 100. The ic element is stored in the test tray TST in the transporter 1. The plurality of loads are loaded into the transporter. The ic element before 1 is stored in the guest tray, and is supplied to the component storage unit 200 of the transporter 1 shown in FIGS. 2 and 3 in this state, and then the IC component is moved from the guest tray to The test tray TST conveyed in the transporter 1. Inside the transporter 1, as shown in Fig. 3, the 1C component is moved in a state of being carried on the test tray tst, and is subjected to a temperature stress of a hot or cold temperature. , test (check) whether it is properly acted 'classified according to the test result The following is a detailed description of each part of the transporter 1. The first 'described on the relevant part of the component storage unit 2000. As shown in Fig. 2, the 'component storage unit 2' contains: the pre-test component storage 201 'Used to store the pre-test ic component; test the component warehousing 2〇2 to accommodate the IC components classified according to the test results. These pre-test component warehousing 201 and test-complete component warehousing 2〇2 have stacking The lift tray 204 of the passenger tray lifter. In the pre-test component storage 2〇1 shown in Fig. 2, the stacked customer trays containing the IC components (pre-test IC components) to be tested are held. In addition, in the test component storage 202, the stacked customer trays containing the tested IC components (tested Ic components) are stacked. The second 'description and loading section 3 0 0 related parts As shown in Fig. 2, on the device substrate 1〇5 in the loading unit 300, two pairs of window portions 306 and 306 are disposed such that the supply client tray faces the upper surface of the device substrate 105. 3下6 on the underside, set to make 201016575 guests A tray group lifter (not shown) for lifting the end tray. Further, as shown in Fig. 2, a tray transfer arm 2〇5 that can reciprocate in the X-axis direction is provided between the component storage unit 200 and the device substrate ! 05 The elevator 204 of the pre-test component storage 201 causes the guest tray stored in the test component storage 201 to rise. The pallet transfer arm gw receives the passenger pallet from the raised elevator 204 and moves in the direction of the x-axis. The passenger tray is handed over to a particular tray set lifter. The tray set lifter raises the received guest tray to face the window portion 306 of the loading portion 300. Then, in the loading unit 300, the tested 1C component accommodated in the guest tray is first moved to the aligner by the χ-γ carrier 3〇4 (precise〇3〇5' is here to correct the IC After the mutual positional relationship of the components, the tested 1C component transferred to the aligner 305 is again placed on the manned portion 3 (four) test tray tst by the Χ_γ handling device 304. As shown in Fig. 2' Will be tested 1 (: component is removed from the client (four) to the test
試托盤TSTWX-γ搬運裝置3〇4包括：在裝置基板1〇5上 叹置之2支軌道30卜可以沿著該軌道3〇1在測試托盤tst 和客端托盤之間往返移動(此方向為Y方向）之可動臂 Τ'由該可動臂302支持並可沿著可動臂3。2在X方向移 動之可動頭303。 X-Y搬運裝置304的可動通Ι-Ατ 動頭303上向下配置複數個吸 附墊307,該吸附墊3〇7 轧的间時移動，藉此而從 客端托盤將1C元件吸附起來， τςτ ,如 並將該IC π件移置到測試 在一個可動頭303上可以在X轴方向上並列 201016575 設置4個這種吸附墊3(π，一次最多可以將4個Ic元件移 置到測試托盤TST上。 第3 ’說明和測試部1 〇〇相關的部分。 上述的測試托盤TST在載入部30 0载入被測試I c元件 置入之後，被送入測試部1〇〇，各IC元件在承載於該測試 托盤TST的狀態下被測試。 如第2〜4圖所示，測試部100由下列構成：恆溫槽 . 1〇1，對疊放於測試托盤TST的被測試Ic元件施以所欲之 高溫或低溫的熱應力；測試室1〇2，在已對被測試Ic元件 瘳 施以熱應力的狀態下測試該1C元件；除熱槽1〇3，將施加 之熱應力從測試室1〇2測試後的IC元件宜除。關於恆溫槽 101内部的細節則如後述。 在測試室1 02的中央下部設有測試頭5，將測試托盤 TST運到該測試頭5上。然後，使收納於測試托盤了灯的 所有的1C元件都和測試頭5電氣接觸，以執行測試。 在除熱槽103中於恆溫槽1〇1施以高溫時，使Ic元件 冷部回到室溫，或者，於恆溫槽101施以低溫時，將IC元 © 件加熱直到回到不產生凝結水的溫度。 如第2圖所示，在恒溢槽101的上部，形成入口用開 口部’其係用以將測試托盤TST從裝置基板1〇5送入，在 除…槽103的上部，形成出口用開口部，其係用以將測試 托盤TST送出到裝置基板105。在裝置基板1〇5裝有測試 托盤搬運裝置1 08，用以將測試托盤TST從這些開口部搬 出運入。這些測試托盤搬運裝置1 08係由例如回轉滾輪等 10 201016575 構成。 如第4圖路- , 藉由上述測試托：搬：破測試1c元件的測試托盤TST， 口用開口部到入到=08’從恆溫槽101上部的入 J恆溫槽101的内部。繼之 , 裝置依序搬運到下士“内部繼之’由垂直搬運 排出H 彳’到達最下方之後’再從恆溫槽1〇1 排出，並導入測詁 U1 之後，承葡了 部’對該1。元件執行測試。 載了測試完畢的1C元件的測試托盤τ 室1〇2姑 什扪州忒托盤TST，從測試 ，並被導入到除熱槽103内部。繼 搬運裝置依序搬運 由垂直 幻達最下方之後，從除熱槽103 、口用開口部排出。從除熱槽103排出的測試托盤TST， 再由測試托盤搬運裝置108搬運到卸載部400。The test tray TSTWX-γ handling device 3〇4 includes: two rails 30 slid on the device substrate 1〇5, and can move back and forth between the test tray tst and the passenger tray along the track 3〇1 (this direction) The movable arm Τ of the Y-direction) is supported by the movable arm 302 and movable along the movable arm 3. 2 in the X direction. A plurality of adsorption pads 307 are disposed on the movable Ι-Α moving head 303 of the XY conveying device 304, and the adsorption pad 3 〇 7 is moved between the rolls, thereby adsorbing the 1C element from the passenger tray, τ ς τ , If the IC π piece is displaced to the test on a movable head 303, four such adsorption pads 3 can be arranged in the X-axis direction juxtaposed with 201016575 (π, up to four Ic components can be displaced to the test tray TST at a time. The third part describes the part related to the test unit 1. The test tray TST described above is loaded into the test unit 1 after the load unit 30 0 is loaded into the test I c element, and is sent to the test unit 1 . Tested in the state of being carried on the test tray TST. As shown in Figs. 2 to 4, the test portion 100 is composed of the following: a thermostatic chamber. 1〇1, which is applied to the tested Ic component stacked on the test tray TST. The desired high temperature or low temperature thermal stress; the test chamber 1〇2, the 1C element is tested under the condition that the tested Ic element is subjected to thermal stress; the thermal stress applied is removed from the heat sink 1〇3 The IC component after the chamber 1〇2 test should be removed. The details of the inside of the thermostat 101 are as follows. A test head 5 is disposed at a lower central portion of the test chamber 102, and the test tray TST is transported to the test head 5. Then, all the 1C components housed in the test tray are electrically contacted with the test head 5 to The test is performed. When the high temperature tank 1 is applied with a high temperature in the heat removal tank 103, the cold portion of the Ic element is returned to the room temperature, or when the temperature is applied to the constant temperature bath 101, the IC element is heated until the temperature is returned. The temperature at which the condensed water is not generated. As shown in Fig. 2, an inlet opening portion ' is formed in the upper portion of the constant overflow tank 101 for feeding the test tray TST from the device substrate 1〇5, in the groove 103 The upper portion is formed with an opening for discharging the test tray TST to the device substrate 105. The test substrate handling device 108 is mounted on the device substrate 1〇5 for transporting the test tray TST from the openings These test tray handling devices 108 are composed of, for example, a revolving roller 10 201016575. As shown in Fig. 4, by the above test: moving: breaking the test tray TST of the 1c component, the opening of the mouth is used =08' from the upper part of the thermostatic bath 101 into the J constant temperature The inside of the 101. In turn, the device is transported to the corporal in order, "the internals are followed by the vertical transport and discharged H 彳 ' to the lowest position, then discharged from the thermostat 1〇1, and then introduced into the test 诂U1, the Portuguese Department 'Test the component. The test tray containing the tested 1C component τ chamber 1〇2 扪 扪 忒 忒 tray TST, from the test, and was introduced into the heat removal tank 103. Following the handling device The conveyance is discharged from the heat removal tank 103 and the opening for the mouth, and the test tray TST discharged from the heat removal tank 103 is transported to the unloading unit 400 by the test tray conveyance device 108.
第4，說明卸載部400的相關部分D 在第2及3圖所示之卸載部4〇〇巾，也設置了和設於 載入部300之X-Y搬運裝置304構造相同的Χ_γ搬運裝置 4〇4,404’藉由此χ_γ搬運裝置4〇44〇4，將測試完畢的ic 元件從運出到卸載部400的測試托盤TST移到客端托盤上。 如第2圖所示，在卸載部4〇〇的裝置基板1〇5上配 置二對的窗部對406,406以使得運送到卸載部4〇〇的客端 托盤面向裝置基板105的上面。在各個窗部406的下侧， 設有用以使客端托盤升降的托盤組升降器（圖未顯示）。 把盤組升降器上載有分類並承載測試完畢1C元件之 分類用客端托盤（分類完畢托盤）並使其下降。第2圖所示 托盤移送臂205,從已下降的托盤組升降器接收分類完畢 托盤’在X轴方向移動並將分類完畢托盤轉交給特定的測 11 201016575 試畢元件倉储202的升降器2G4。如此，將分類完畢托盤 存放在測試畢元件倉儲202中。 在此，說明本實施型態中的恆溫槽1〇1的内部。 如第5(a)，（b)圖所示，在恆溫槽1〇1的内部設有垂直 搬運裝置U0’㈣了複數個被測試IG元件2的複數測試 托盤TST由該垂直搬運裝置支撐並待機，直到在測試室102 空出來為止。而且，在此待機中，將高溫或低溫的熱應力 施加於被測試1C元件2。另外’在各測試托盤TST中，裝 設了複數個截入器16，IC元件2收納於各嵌入㈣中。 本實施型態中，承載被測幻C元件2的測試托盤邮 從恆溫槽1〇1的上部之入口用開口部到入到怪溫槽⑻的 内部之後’藉由垂直搬運裝I 110依序搬運到下方，在到 達最下方之後’再從恆溫槽1〇1排出(參見第⑷。 在本實施型態的怪溫槽⑻巾，構餘溫槽m :閉的殼體8°的内部’設有溫度調節用送風裝置90。！ 度調節用送風裳置90具有風扇92及熱源裝置94(相當： "源裝置)，藉由風扇92吸入殼體㈣ 二氣，透過熱源裝置94使得吐 的 ^ & ®司吸體80内部的溫風或 冷風對流，藉此使得殼體8G的 1 (高溫或低溫)。 彳達特疋的溫度條件 ^度調節用送風裝置9G的熱源裝置Μ，在使殼體 、邛到達尚溫時，由加熱媒體流通之放執 電熱器等構成，藉此，溫度調節用送風襄置、9〇使=器或 的内部維持在室溫〜16〇。 吸80 左右的向溫。另外，在使殼體 201016575 80的内部到達低溫時，熱源裝置94由液態氮等的冷媒循 環之吸熱用熱交換器等構成，藉此，溫度調節用送風裝置 90使殼體80的内部維持在_6〇»c〜室溫左右的低溫。殼體 80的内部溫度係由例如溫度檢測器檢出，控制風扇的 風量及熱源裝置94的熱量等以使得殼體8〇的内部維持在 特定溫度。 另外，在本實施型態中的恆溫槽1〇1，除了上述溫度 調節用送風裝置90的熱源裝置94之外，還另外在承載於 最上方的測試托盤TST中的被測試I c元件2的附近設有熱 源裝置50。熱源裝置5〇具有：基板5卜裝設於基板51下 面侧的複數個塊狀的熱傳導部52,其可以藉由圖未顯示的 z軸驅動裝置而上下移動（參見第5(3)，（1})圖）。設置熱傳 導部52的數量係對應於承載於測試托盤TST中的被測試 IC元件2的數量。 本實施型態中的熱源裝置5〇，在使被測試κ元件2 為高溫時，具有加熱媒體流通之放熱用熱交換器或電熱器 等，在使被測試1C元件2為低溫時，具有液態氮等的冷媒 循環之吸熱用熱交換器，藉由這些機器將熱傳導部52加熱 或冷卻。這些機器可以設置在熱源裝置5〇的内部，也可以 設置在熱源裝置50的外部。 為了有效控制被測試IC元件2的溫度，在施加高溫的 情況下，熱源裝置50(熱傳導部52)的溫度，高於上述溫度 調節用送風裝置90的熱源裳置94較佳，在施加低溫的情 況下，熱源裝置50(熱傳導部52)的溫度，低於上述溫度調 13 201016575 節用送風裝置90的熱源裝置94較佳。 當新的測試托盤TST被導入恆溫槽1 〇1時，熱源裝置 50如第5(a)圖所示般位於上側，當該測試托盤tST被導入 恆溫槽101内並由垂直搬運裝置110支撐之後，熱源裝置 50如第5(b)圖所示般移到下側，使得已被加熱或冷卻之熱 傳導部52和承載於該測試托盤TST上的被測試Ic元件2 的表面接觸，藉由熱傳導而將被測試1C元件2加熱或冷 ‘ 卻。藉此，能夠在短時間内，將剛被導入恆溫槽丨〇1内的 被測試1C元件2升溫或降溫到所欲之溫度。 _ 承載了如上述般加熱或冷卻後的被測試Ic元件2的測 試托盤tst藉由垂直搬運裝置11〇而移動到下方時熱源 裝置50如第5(a)圖所示般移到上側。繼之，當新的測試 托盤TST被導入恆溫槽1〇1並由垂直搬運裝置支撐 時’再次如第5(b)圖所示般移到下側，藉由熱傳導部52 的熱傳導而將被測試IC元件2加熱或冷卻，重複執行此動Fourth, the relevant portion D of the unloading unit 400 is described in the unloading portion 4 of the second and third figures, and the Χ_γ conveying device 4 having the same structure as the XY conveying device 304 provided in the loading unit 300 is also provided. 4, 404', by means of the χ_γ handling device 4〇44〇4, the tested ic element is moved from the test tray TST shipped out to the unloading unit 400 to the passenger tray. As shown in Fig. 2, two pairs of window portions 406, 406 are disposed on the apparatus substrate 1A5 of the unloading portion 4A such that the passenger trays transported to the unloading portion 4A face the upper surface of the device substrate 105. On the lower side of each window portion 406, a tray group lifter (not shown) for lifting the passenger tray is provided. The disc set lifter is loaded with a classification and carries the sorted client tray (classified tray) of the tested 1C component and is lowered. The tray transfer arm 205 shown in Fig. 2 receives the sorted tray from the lowered tray group lifter's movement in the X-axis direction and transfers the sorted tray to a specific test 11 201016575 Tester 2G4 of the component storage 202 . Thus, the sorted trays are stored in the test component storage 202. Here, the inside of the constant temperature bath 1〇1 in the present embodiment will be described. As shown in Fig. 5(a) and (b), a vertical transport device U0' is provided inside the thermostatic bath 1〇1. (4) A plurality of test trays TST of a plurality of tested IG elements 2 are supported by the vertical transport device. Standby until the test room 102 is vacant. Further, in this standby, thermal stress of high temperature or low temperature is applied to the 1C element 2 to be tested. Further, in each of the test trays TST, a plurality of interceptors 16 are mounted, and the IC elements 2 are housed in the respective embedded (four). In this embodiment, the test tray carrying the detected C-component 2 is mailed from the upper opening of the constant temperature bath 1〇1 to the inside of the strange temperature tank (8). After transporting to the bottom, it is discharged from the constant temperature tank 1〇1 after reaching the bottom (see item (4). In this embodiment, the strange temperature tank (8) towel, the residual temperature tank m: the inside of the closed case 8°' The air conditioning device 90 for temperature adjustment is provided. The air conditioning device 90 for adjusting the degree has a fan 92 and a heat source device 94 (corresponding to: "source device), which is sucked into the casing (4) by the fan 92, and is spit through the heat source device 94. The tempering of the warm air or the cold air inside the suction body 80, thereby making the housing 8G 1 (high temperature or low temperature). The temperature condition of the 彳达特疋 is adjusted by the heat source device of the air supply device 9G, When the casing and the crucible are brought to a warm temperature, they are configured by a discharge electric heater or the like that is distributed by the heating medium, whereby the temperature adjustment air supply device and the interior of the heater or the heater are maintained at room temperature to 16 Torr. A temperature of about 80 degrees. In addition, when the interior of the housing 201016575 80 reaches a low temperature, heat The device 94 is configured by a heat-absorbing heat exchanger or the like in which a refrigerant such as liquid nitrogen is circulated, whereby the temperature-adjusting air blowing device 90 maintains the inside of the casing 80 at a low temperature of about -6 〇»c to room temperature. The internal temperature is detected by, for example, a temperature detector, and the air volume of the fan and the heat of the heat source device 94 are controlled to maintain the inside of the casing 8 at a specific temperature. In addition, the constant temperature tank 1 in the present embodiment In addition to the heat source device 94 of the above-described temperature-adjusting air blowing device 90, a heat source device 50 is additionally provided in the vicinity of the tested Ic element 2 carried in the uppermost test tray TST. The heat source device 5 has: a substrate A plurality of block-shaped heat conduction portions 52 mounted on the lower surface side of the substrate 51 can be moved up and down by a z-axis driving device not shown (see Fig. 5(3), (1})). The number of heat conduction portions 52 corresponds to the number of IC elements 2 to be tested carried in the test tray TST. The heat source device 5 in the present embodiment has a heating medium circulated when the κ element 2 to be tested is made high temperature. Exothermic heat exchanger or In the heat exchanger or the like, when the 1C element 2 to be tested is at a low temperature, the heat transfer heat exchanger having a circulation of liquid nitrogen or the like is circulated, and the heat conduction portion 52 is heated or cooled by these devices. These devices may be disposed in the heat source device 5〇. The inside of the heat source device 50 may be provided. In order to effectively control the temperature of the IC component 2 to be tested, the temperature of the heat source device 50 (heat conduction portion 52) is higher than the temperature adjustment air supply device when a high temperature is applied. The heat source 94 of 90 is preferably used. When the low temperature is applied, the temperature of the heat source unit 50 (the heat conducting portion 52) is lower than the temperature unit 13 of the air supply unit 90. When the new test tray TST is introduced into the constant temperature bath 1 〇1, the heat source unit 50 is located on the upper side as shown in Fig. 5(a), and after the test tray tST is introduced into the constant temperature bath 101 and supported by the vertical transport unit 110, The heat source device 50 is moved to the lower side as shown in FIG. 5(b) such that the heat-conducting portion 52 that has been heated or cooled is in contact with the surface of the tested Ic element 2 carried on the test tray TST by heat conduction. The 1C component 2 to be tested will be heated or cooled. Thereby, the 1C element 2 to be tested which has just been introduced into the bath 1 can be heated or cooled to a desired temperature in a short time. _ The test tray tst carrying the tested Ic element 2 heated or cooled as described above is moved to the lower side by the vertical transfer device 11 时, and the heat source device 50 is moved to the upper side as shown in Fig. 5(a). Then, when the new test tray TST is introduced into the constant temperature bath 1〇1 and supported by the vertical transport device, it is again moved to the lower side as shown in FIG. 5(b), and will be thermally conducted by the heat conduction portion 52. Test IC component 2 to heat or cool, repeat this action
移到下方的測試托盤TST中所承載的被測試ic元件 2,在離賴源裝置5G之後，藉由從溫度調節用送風裝置 9 〇的溫風或冷風而維持在所欲之溫度。 划上返，除了僅利 产 —"你I川造成 軋對流之溫度施加方法之外，還實施藉由熱源裝置 傳：之溫度施加方法’藉此’能夠縮短對被測試!。元 的溫度施加時間，並能夠縮短被測 叫中的滯留時間’藉此能夠達成測試效率(生產率》 14 201016575 -高0 以上之說明係關於f互溫槽1 〇 1，不過，也可以使除熱 槽103為如上述之恆溫槽101的同樣構成（參見第5圖）。 具體言之，在除熱槽103的内部設有垂直搬運裝置11〇, 承載了複數個測試完畢之IC元件2的複數測試托盤TST由 該垂直搬運裝置110支撐並搬運。承載於測試托盤tst的 測試完畢之IC元件2在此搬運中回到室溫（參見第4圖）。 在本實施型態中，承載了測試完畢之I c元件2的測試 ❿ 托盤TST，從除熱槽1〇3下部的入口用開口而被導入除熱 槽103内部之後，藉由垂直搬運裝置依序搬運到上方， 到達最上方之後，再從除熱槽1〇3排出。 在本實施型態之除熱槽103中，構成除熱槽1〇3的略 密閉的殼體80的内部，設有溫度調節用送風裝置9〇。溫 度調節用送風裝置90具有風扇92及熱源裝置94(相當於 2發明的第2熱源裝置），藉由風扇92吸入殼體8〇内部的 〇 上氣，透過熱源裝置94使得吐出到殼體80内部的溫風或 V風對机/循環，藉此使得殼體8 〇的内部到達特定的溫度 條件（商溫或低溫）。 —再者，在本實施型態之除熱槽1〇3中，除了上述溫度 調郎用送風裝置90的熱源裝置94之外，還另外在承載於 最上方的測試托盤TST中的測試完畢之Ic元件2的附近設 有熱源裝置5G。熱源裝置5G具有：基板51、裝設於基板 的複數個塊狀的熱傳導部52，其可以藉由圖未顯示的z 驅動裝置而上下移動（參見第5(a)，（b)圖）。 15 201016575 當測試托盤TST從除熱槽103排出時，熱源裝置5〇如 第5U)圖所示般位於上侧，從上方算起第2個測試托盤所 移到最上方之後，熱源裝置50如第5(b)圖所示般移到下 側，使得已被加熱或冷卻之熱傳導部52和承載於該測 盤m上的測試完畢之IC元件2的表面接觸，藉由熱傳導 而將被測試IC元件2加熱或冷卻。藉此，能夠使得將要從 除熱槽103排出的IC元件2確實升溫或降溫到室溫。 導入除熱槽103之後到移動到最上方之前 試托盤TST的測試完畢之；1C亓杜9拉丄 70畢之1C70件2，藉由從溫度調節用送 風裝置90的溫風或冷風而升溫或降溫到所欲之溫度。 ’如上述’除了僅㈣溫度調節用送風裝置㈣造成之空 =流之溫度施加方法之外，還實施藉由熱源裝置5。的熱 度施加方法’藉此，能夠縮短對測試完畢IC元件 2的溫度施加時間，並能鈞縱拓+田 亚能夠縮鈕測斌完畢1C元件2在除埶 槽1 〇 3中的滯留時間，藉此 、…、 猎此把夠達成測試效率（生產率）的 徒南0 ❹ 再者，上述說明的實施型離你 裁用以使得容易理 解本發明，並非記載用於限定本 ^ ^ ^ ^ ^因此，上述實施例 變更或均等物。術領域内所有的設計 :如，在上述實施型態中，藉由熱源裝置5。，從1 …的表面侧將IC元件2加熱 m,, 一 但疋並不以此為 2的、里可 如第6圖所示之熱源裝置50A，從1C元件 面側(外部端子側)將1C元件2加熱或冷卻。熱源裝 16 201016575 - 置50A，具有和上述熱源裝置50大致相同的構成，具備基 板51A、裝設於基板51A上面侧之複數的塊狀的熱傳導部 52 A，其可以藉由圖未顯示的z軸驅動裝置而上下移動。 熱源裝置50A，其構成上，設置在恆溫槽1〇1内最下 方之測試托盤TST的下側較佳。在此情況下，最下方的測 試托盤tst從恆溫槽101排出時，熱源裝置5〇A本來位於 下側，從下面算起第2個的測試托盤TST移到最下方之後 移到上側，使得已被加熱或冷卻之熱傳導部52a和承載於 ♦ «試托盤TST上的測試完畢Ic元件2的表面接觸，藉由 熱傳導而將測試完畢IC元件2加熱或冷卻。藉此，能夠在 短時間内，使得將要從恆溫槽1〇1排出的IC元件2確實升 溫或降溫到所欲之溫度。 導入恆溫槽101之後到移到最下方之前的測試托盤 TST中所承載的被測試】c元件2，藉由從溫度調節用送風 裝置90的，ja風或冷風而升溫或降溫到所欲之溫度。 φ 如上述，除了僅利用溫度調節用送風裝置90造成之空 氣對流之溫度施加方法之外，還實施藉由熱源裝置5〇a的 熱傳導之溫度施加方法，藉此，能夠縮短對被測試ic元件 2的溫度施加時間，並能夠縮短被測試1C元件2在恆溫槽 中的滞留時間，藉此能夠達成测試效率（生產率）的提 南。 ' 上述熱源裝置50A也適用於除熱槽1〇3。在此情況下， 熱源裝置5GA也是設置在除熱槽1G3内最下方的測試托盤 TST的下側較佳。 17 201016575 承載了測試完畢1C元件2的測試托盤TST被導入除熱 槽103時，熱源裝置50A位於下側，該測試托盤TST被導 入除熱槽103内並由垂直搬運裝置11〇支樓之後，熱源裝 置50A移到上側，使得已被加熱或冷卻之熱傳導部52和承 載於該測試托盤TST上的測試完畢1C元件2的表面接觸， 藉由熱傳導而將測試完畢1C元件2加熱或冷卻。藉此，能 夠在短時間内，將剛被導入除熱槽103内的1C元件2升溫 或降溫到所欲之溫度。The test ic element 2 carried in the lower test tray TST is maintained at a desired temperature by the warm air or the cold air from the temperature-adjusting air supply unit 9 after being separated from the source device 5G. In addition to the production--"quotation of the temperature of the convection current, the method of temperature application by the heat source device is used to enable the shortened pair to be tested!" The temperature of the element is applied, and the residence time in the test is shortened'. Thereby the test efficiency can be achieved. (Productivity) 14 201016575 - High 0 or more The description is about the f mutual temperature tank 1 〇1, but it can also be The heat sink 103 has the same configuration as the above-described constant temperature bath 101 (see Fig. 5). Specifically, a vertical transfer device 11 is provided inside the heat removal tank 103, and a plurality of tested IC components 2 are carried. The plurality of test trays TST are supported and transported by the vertical transport device 110. The tested IC component 2 carried on the test tray tst is returned to room temperature during the transport (see Fig. 4). In this embodiment, the load is carried. Test of the tested I c element 2 托盘 The tray TST is introduced into the heat removal tank 103 from the inlet opening in the lower portion of the heat removal tank 1〇3, and then sequentially transported to the upper side by the vertical conveyance device to reach the uppermost position. Then, it is discharged from the heat removal tank 1〇3. In the heat removal tank 103 of the present embodiment, the inside of the slightly sealed casing 80 constituting the heat removal tank 1〇3 is provided with a temperature adjustment air blower 9〇. Temperature adjustment air supply device 90 The fan 92 and the heat source device 94 (corresponding to the second heat source device of the second invention) are sucked into the air inside the casing 8 by the fan 92, and are radiated to the inside of the casing 80 by the heat source device 94. Wind-to-machine/circulation, whereby the interior of the casing 8 is brought to a specific temperature condition (commercial temperature or low temperature). - Again, in the heat removal tank 1〇3 of the present embodiment, in addition to the above temperature In addition to the heat source device 94 of the air blowing device 90, a heat source device 5G is additionally provided in the vicinity of the tested Ic element 2 carried in the uppermost test tray TST. The heat source device 5G has a substrate 51 and is mounted on the substrate. A plurality of block-shaped heat conducting portions 52, which can be moved up and down by a z-driving device not shown (see Fig. 5(a), (b)). 15 201016575 When the test tray TST is discharged from the heat removing tank 103 When the heat source device 5 is located on the upper side as shown in FIG. 5U), after the second test tray is moved to the uppermost position from above, the heat source device 50 is moved to the lower side as shown in FIG. 5(b). a side, such that the heat conducting portion 52 that has been heated or cooled is carried on the measuring plate m The surface of the tested IC component 2 is contacted, and the IC component 2 to be tested is heated or cooled by heat conduction. Thereby, the IC element 2 to be discharged from the heat removing tank 103 can be surely heated or cooled to room temperature. After the introduction of the heat removing tank 103 to the uppermost position, the test tray TST is completed; the 1C 亓 Du 9 pull 70 70 1C 70 piece 2 is heated by the warm air or the cold air of the temperature adjusting air blowing device 90 or Cool down to the desired temperature. As described above, the heat source device 5 is also implemented in addition to the air/flow temperature application method caused by only the (four) temperature adjustment air blowing device (4). The heat application method is adopted, whereby the temperature application time of the IC element 2 after the test is shortened, and the retention time of the 1C element 2 in the removal tank 1 〇 3 can be shortened by the extension of the field. By this,..., hunting this is enough to achieve test efficiency (productivity). ❹ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ Therefore, the above embodiments are modified or equivalent. All designs in the field of technology: for example, in the above embodiment, by means of the heat source device 5. The IC element 2 is heated m from the surface side of 1 ..., and the heat source device 50A which is not the same as 2, as shown in Fig. 6, will be from the 1C element side (external terminal side) The 1C element 2 is heated or cooled. The heat source package 16 201016575 - 50A has substantially the same configuration as the heat source device 50 described above, and includes a substrate 51A and a plurality of block-shaped heat conduction portions 52 A mounted on the upper surface side of the substrate 51A, which can be represented by a z (not shown) The shaft drives the device up and down. The heat source unit 50A is preferably configured to be disposed on the lower side of the lowermost test tray TST in the constant temperature bath 1〇1. In this case, when the lowermost test tray tst is discharged from the constant temperature bath 101, the heat source device 5A is originally located on the lower side, and the second test tray TST is moved to the lowermost position from the lower side and then moved to the upper side, so that The heated or cooled heat conducting portion 52a is brought into contact with the surface of the tested Ic element 2 carried on the test tray TST, and the tested IC element 2 is heated or cooled by heat conduction. Thereby, the IC element 2 to be discharged from the constant temperature bath 1〇1 can be surely warmed or lowered to a desired temperature in a short time. The tested c-element 2 carried in the test tray TST after the introduction of the constant temperature bath 101 to the lowermost position is heated or lowered to the desired temperature by the ja wind or cold air from the temperature-adjusting air supply unit 90. . φ As described above, in addition to the temperature application method of air convection by the air conditioning device 90 for temperature adjustment, a temperature application method by heat conduction of the heat source device 5a is also performed, whereby the tested i component can be shortened. The temperature of 2 is applied, and the residence time of the 1C element 2 to be tested in the constant temperature bath can be shortened, whereby the test efficiency (productivity) can be achieved. The above heat source device 50A is also applicable to the heat removal tank 1〇3. In this case, the heat source unit 5GA is also preferably disposed on the lower side of the lowermost test tray TST in the heat removal tank 1G3. 17 201016575 When the test tray TST carrying the tested 1C component 2 is introduced into the heat removal tank 103, the heat source device 50A is located on the lower side, and the test tray TST is introduced into the heat removal tank 103 and is supported by the vertical conveyance device 11 The heat source unit 50A is moved to the upper side so that the heat-conducting portion 52 which has been heated or cooled is brought into contact with the surface of the test 1C element 2 carried on the test tray TST, and the tested 1C element 2 is heated or cooled by heat conduction. Thereby, the 1C element 2 that has just been introduced into the heat removal tank 103 can be heated or cooled to a desired temperature in a short time.
承載了如上述般加熱或冷卻後的被測試IC元件2的測 試托盤TST藉由垂直搬運裝置no而移動到上方時，熱源 裝置5 0A移到下侧。繼之，當下一個測試托盤tst被導入 除熱槽103並由垂直搬運裝置110支撐時，再次移到上側， 藉由熱傳導部52的熱傳導而將IC元件2加熱或冷卻，重 複執行此動作。 移到上方的測試托盤TST中所承載的測試完畢丨c元件When the test tray TST carrying the IC element 2 to be tested which has been heated or cooled as described above is moved upward by the vertical conveyance device no, the heat source unit 50A is moved to the lower side. Then, when the next test tray tst is introduced into the heat removing tank 103 and supported by the vertical conveying device 110, it is moved to the upper side again, and the IC element 2 is heated or cooled by heat conduction of the heat conducting portion 52, and this operation is repeatedly performed. Move to the test tray 元件c component carried in the test tray TST above
2’在離開熱源裝置5〇A之後，藉由從溫度調節用送風裝置 90的溫風或冷風而維持在所欲之溫度。 如上述，除了僅利用溫度調節用送風裝置 氣對流之溫度施加方法之外，還實施藉由熱源裝置5〇a 熱傳導之溫度施加方法，藉此’能夠縮短對1C元件2的 度施加時間’並能夠縮短ic元件2在除熱槽m令的滞 時間’藉此能夠達成測試效率（生產率）的提高。 再者’在本發明中，在怪溫槽…及/或除熱槽_ 也可以組合使用上述熱源裝置50和熱源裝置5qa。例如 18 201016575 - 可以如第7圖所示，在最上方的測試托盤TST的上側設置 熱源裝置50,在最下方的測試托盤TST設置熱源裝置5〇a， 也可以如第8圖所示，在一個測試托盤TST的上側設置熱 源裝置50，在下側設置熱源裝置50A。在此情況的測試托 盤TST為最上方或最下方的測試托盤TST較佳。 上述實施型態中的熱源裝置50, 50A，具備藉由熱傳導 而將1C元件2加熱或冷卻的熱傳導部52 52A，但本發明 並不以此為限，例如，如第9圖所示之熱源裝置6〇，也可 • 以具備使用輻射熱來加入IC元件2的輻射部如第1〇圖 所不之熱源裝置70，可以具備喷出已經過溫度調節的空氣 (溫風或冷風）的喷嘴。已經過溫度調節的空氣，可以來自 溫度調節用送風裝置90(熱源裝置94)，也可以來自其他的 熱源（熱交換部）。 上述的熱源裝置60, 70，可以不和ic元件2接觸而對 1C元件2施加溫度，不需要像熱源裝置5〇5〇A那樣上下 φ 移動。這些熱源裝置60,70,如第9及1〇圖所示，可以從2', after leaving the heat source device 5A, is maintained at a desired temperature by warm air or cold air from the temperature-adjusting air supply device 90. As described above, in addition to the temperature application method of the air convection by the air supply device for temperature adjustment, a temperature application method by heat conduction of the heat source device 5A is also performed, whereby 'the time for applying the degree to the 1C element 2 can be shortened' It is possible to shorten the lag time of the ic element 2 in the heat removal tank m, whereby the improvement of the test efficiency (productivity) can be achieved. Further, in the present invention, the heat source device 50 and the heat source device 5qa may be used in combination in the weir tank and/or the heat removal tank. For example, 18 201016575 - as shown in Fig. 7, the heat source device 50 may be disposed on the upper side of the uppermost test tray TST, and the heat source device 5a may be disposed on the lowermost test tray TST, as shown in Fig. 8, A heat source device 50 is disposed on the upper side of one test tray TST, and a heat source device 50A is disposed on the lower side. In this case, the test tray TST is preferably the uppermost or lowermost test tray TST. The heat source devices 50, 50A in the above embodiment have the heat conducting portion 52 52A for heating or cooling the 1C element 2 by heat conduction, but the invention is not limited thereto, for example, the heat source as shown in FIG. Alternatively, the heat source device 70 having the radiation portion added to the IC device 2 by using radiant heat, as shown in Fig. 1, may be provided with a nozzle that ejects temperature-adjusted air (warm air or cold air). The temperature-adjusted air may be supplied from the temperature-adjusting air blowing device 90 (heat source device 94) or may be derived from another heat source (heat exchange portion). The heat source devices 60, 70 described above can apply a temperature to the 1C element 2 without coming into contact with the ic element 2, and do not need to move up and down φ like the heat source device 5〇5〇A. These heat source devices 60, 70, as shown in Figures 9 and 1 can be
Ic兀件2的表面側施加溫度，也可以從Ic元件2的裡面 側施加溫度。 另外，也可以適當組合使用熱源裝置5〇, 5〇A和熱源裝 置60’ 70 Μ列如，如第Π圖所示，可以在—個測試托盤Tst 的上側設置熱源裝置50,在下側設置熱源裝置7〇，也可以 在最上面的測試托盤TST的上側設置熱源裝置5 〇，在最下 面的測試托盤TST的下側設置熱源裝置70。另外，也可以 使用熱源裝置60取代上述的熱源裝置7〇。再者，可以在 19 201016575 一個測試托盤TST的上側設置熱源裝置60或熱源裝置7〇， 在下侧設置熱源裝置50 A ’也可以在最上面的測試托盤TST 的上側設置熱源裝置60或熱源裝置γ〇，在最下面的測試 托盤TST的下側設置熱源裝置7〇。 另外’不論在哪一種情況下，從1C元件裡侧的溫度施 加’為了防止1C元件的外部端子的損傷等，使用不和ic 儿件的外部端子接觸的熱源裝置6〇, 70較佳。 再者’在本發明中，上述實施型態中溫度調節用送風 裝置90或熱源裝置94並非必須，若藉由熱源裝置 ❹ 50, 50A’60, 70將1C元件控制在所欲之溫度，則可以省略 溫度調節用送風裝置90及熱源裝置94。 產業上的利用可能性 本發明之電子元件搬運裴置，可以用於縮短電子元件 在板溫槽·除熱槽中的滯留時間，並可提高產率及測試效 率。 【圖式簡單說明】 第1圖顯示依據本發明實施型態之包含搬運機的1C元 件測試裝置的整體側面圖。 第2圖顯示第i圖所示之搬運機的斜視圖。 第3圖顯示ic元件之處理的說明圖。 第4圖顯示同搬運機的反應室内之測試托盤的搬運路 經的說明圖。 20 201016575 第5(a)，（b)圖顯示同搬運機中恆溫槽（除熱槽）内的斷 面圖。 第6圖顯示另一實施型態之熱源裝置的斷面圖。 第7圖顯示另一實施型態之熱源裝置的斷面圖。 第8圖顯示另一實施型態之熱源裝置的斷面圖。 第9圖顯示另一實施型態之熱源裝置的斷面圖。 第10圖顯示另一實施型態之熱源裝置的斷面圖。 B 第11圖顯示另一實施型態之熱源裝置的斷面圖。 第圖顯示過去的搬運機中怪溫槽.除熱槽内的斷面 圖。 【主要元件符號說明】 1〜搬運機（電子元件搬運裝置）； 元件（電子元件）； 5〜測試頭； % 6〜測試用主機裝置； 7〜纜線； 8〜空間部分； 1C元件（電子元件）測試裝置； W〜嵌入器； 50, 50A，60, 70〜熱源裝置； 52, 52A〜熱傳導部； 9〇〜溫度調節用送風裝置； 9 2 ~風扇； 21 201016575 94〜（第2)熱源裝置； 1 01〜恆溫槽； 102~測試室； 103〜除熱槽； 110〜垂直搬運裝置。The temperature is applied to the surface side of the Ic element 2, and the temperature can also be applied from the inner side of the Ic element 2. In addition, the heat source device 5〇, 5〇A, and the heat source device 60' 70 may be used in combination as appropriate. As shown in the figure, the heat source device 50 may be disposed on the upper side of the test tray Tst, and the heat source may be disposed on the lower side. In the device 7, the heat source device 5 may be disposed on the upper side of the uppermost test tray TST, and the heat source device 70 may be disposed on the lower side of the lowermost test tray TST. Alternatively, the heat source unit 60 may be used instead of the heat source unit 7 described above. Further, the heat source device 60 or the heat source device 7A may be disposed on the upper side of one test tray TST on 19 201016575, and the heat source device 50 A ' may be disposed on the lower side. The heat source device 60 or the heat source device γ may be disposed on the upper side of the uppermost test tray TST. That is, the heat source device 7 is disposed on the lower side of the lowermost test tray TST. Further, in either case, the temperature is applied from the inside of the 1C element. To prevent damage to the external terminal of the 1C element, it is preferable to use the heat source device 6A, 70 which is not in contact with the external terminal of the ic device. Further, in the present invention, the temperature adjusting air blowing device 90 or the heat source device 94 in the above embodiment is not essential, and if the heat source device ❹ 50, 50A'60, 70 controls the 1C element at a desired temperature, The air conditioning device 90 for temperature adjustment and the heat source device 94 can be omitted. Industrial Applicability The electronic component carrying device of the present invention can be used to shorten the residence time of electronic components in the plate temperature bath and the heat removal tank, and can improve productivity and test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side elevational view showing a 1C element test apparatus including a transporter according to an embodiment of the present invention. Fig. 2 is a perspective view showing the transporter shown in Fig. i. Fig. 3 is an explanatory view showing the processing of the ic element. Fig. 4 is an explanatory view showing the conveyance path of the test tray in the reaction chamber of the transporter. 20 201016575 Section 5(a), (b) shows a cross-sectional view of the thermostat (without the heat sink) in the same conveyor. Figure 6 is a cross-sectional view showing another embodiment of the heat source device. Figure 7 is a cross-sectional view showing another embodiment of the heat source device. Figure 8 is a cross-sectional view showing another embodiment of the heat source device. Figure 9 is a cross-sectional view showing another embodiment of the heat source device. Fig. 10 is a cross-sectional view showing another embodiment of the heat source unit. B Figure 11 shows a cross-sectional view of another embodiment of the heat source device. The figure shows the strange temperature tank in the past conveyor. The cross section in the heat sink. [Description of main component symbols] 1~Transporter (electronic component handling device); Component (electronic component); 5~Test head; %6~Testing host device; 7~Cable; 8~Space part; 1C component (Electronic Component) test device; W~embedder; 50, 50A, 60, 70~ heat source device; 52, 52A~ heat conduction portion; 9〇~ temperature adjustment air supply device; 9 2 ~ fan; 21 201016575 94~ (2nd) Heat source device; 1 01~ constant temperature bath; 102~ test chamber; 103~ heat removal tank; 110~ vertical handling device.
22twenty two